TWI883995B - Pcie module and server - Google Patents

Abstract

The invention relates to a PCIE module and a server including a PCIE card, an assembly cage, a first assembly member, an assembly base and a second assembly member. The PCIE card includes a mounting portion. The assembly cage has a first opening and a first assembly position connecting to each other. The PCIE card is configured to enter and exit the first assembly position via the first opening. The first assembly member is disposed on a side of the assembly cage having the first opening. The assembly base has a second opening and a second assembly position connecting to each other. The assembly cage is configured to enter and exit the second assembly position via the second opening. The second assembly member is disposed on a side of the assembly base having the second opening. The second assembly member is detachably connected to the first assembly member. The mounting portion is configured to be clamped between the first assembly member and the second assembly member.

Description

PCIE modules and servers

The present invention relates to the technical field of computer equipment, and in particular to a PCIE module and a server.

The chassis of existing computer servers usually have a PCIE (Peripheral Component Interconnect Express) module. The PCIE module can provide a faster and more stable data transmission channel for the server to meet the server's high requirements for network performance. When a component in the PCIE module fails, it is usually necessary to use corresponding tools to disassemble and repair the PCIE module, which is cumbersome and inefficient.

Based on this, it is necessary to provide a PCIE module and a server to solve the problem of low efficiency when disassembling and assembling the PCIE module in the traditional technology.

The technical solution is as follows:

An embodiment provides a PCIE module, comprising:

A PCIE card, wherein the PCIE card is provided with a mounting portion;

An assembly frame, wherein the assembly frame is provided with a first opening and a first assembly position that are connected to each other, and the PCIE card is used to enter and exit the first assembly position through the first opening;

A first assembly part, the first assembly part is arranged on a side of the assembly frame where the first opening is formed;

An assembly seat, the assembly seat is provided with a second opening and a second assembly position in communication, the assembly frame is used to enter and exit the second assembly position through the second opening; and

The second assembly part is arranged on the side of the assembly seat where the second opening is provided, the second assembly part is detachably connected to the first assembly part, and the mounting portion is used to be sandwiched between the first assembly part and the second assembly part.

When the PCIE card needs to be installed in the PCIE module, the PCIE card is first inserted into the first assembly position through the first opening of the assembly frame, so that the installation part of the PCIE card is connected to the first assembly part provided on the assembly frame. Since the first assembly part is provided on the side of the assembly frame with the first opening, and the second assembly part is provided on the side of the assembly seat with the second opening, when the assembly frame with the PCIE card inserted into the second assembly position through the second opening of the assembly seat, the installation part on the PCIE card can be sandwiched between the first assembly part and the second assembly part. Finally, the first assembly part is connected to the assembly frame. The second assembly part is connected to the first assembly part, and the installation of the PCIE card can be completed; when the PCIE card needs to be disassembled, the first assembly part is disassembled from the second assembly part, and then the assembly frame is taken out from the second assembly position through the second opening, so that the installation part sandwiched between the first assembly part and the second assembly part is released, and finally the PCIE card installed in the first assembly position is taken out through the first opening, and the PCIE card can be disassembled, so as to inspect and repair the PCIE card; compared with the traditional technology, when the PCIE board is disassembled and assembled by using the above PCIE module, the disassembly and assembly process is more convenient and the disassembly and assembly efficiency is high.

In one embodiment, the first assembly part includes a first assembly part and a second assembly part, the first assembly part is bent and connected to the second assembly part, the first assembly part and the second assembly part are detachably connected, and the mounting part is used to be sandwiched between the second assembly part and the second assembly part.

In one embodiment, the first assembly part has a first assembly surface, the second assembly part has a second assembly surface, the first assembly surface and the second assembly surface are arranged at an angle, the second assembly part has a first assembly wall and a second assembly wall, the first assembly wall and the second assembly wall are arranged at an angle, the first assembly surface and the first assembly wall are detachably connected, and the mounting part is used to be clamped between the second assembly surface and the second assembly wall.

In one embodiment, the PCIE module further includes a first threaded component, the first assembly surface is provided with a first through hole, the first assembly wall is provided with a first screw hole, and the first threaded component is passed through the first through hole and screwed to the first screw hole.

In one embodiment, the PCIE module further includes a second threaded component, the mounting portion is provided with a second through hole, the second assembly wall is provided with a third through hole, the second assembly surface is provided with a second screw hole, and the second threaded component is passed through the second through hole and the third through hole and is screwed to the second screw hole.

In one of the embodiments, the PCIE card is further provided with a plug-in portion, the assembly frame is provided with a plug-in slot, the plug-in slot is located at one end of the first assembly position far away from the first opening, and the plug-in portion is used to be inserted into the plug-in slot.

In one embodiment, the PCIE module further includes an expansion card, the mounting frame is provided with a third mounting portion, and the expansion card is detachably disposed on the third mounting portion and is used to be electrically connected to the PCIE card.

In one embodiment, the PCIE module further includes a third threaded component, the third assembly position is located at an end of the first assembly position far away from the first opening, the third assembly portion is provided with a third screw hole, the expansion card is provided with a fourth through hole, and the third threaded component is passed through the fourth through hole and screwed to the third screw hole.

Another embodiment provides a server, which includes a chassis and the PCIE module as described above, wherein the chassis is provided with a connecting mounting port and a mounting cavity, and the assembly seat can enter and exit the mounting cavity through the mounting port.

In one embodiment, the outer edge of the mounting opening is provided with a first limiting groove, the second assembly member is provided with a first limiting protrusion, and the first limiting protrusion is used to abut against the bottom wall of the first limiting groove; or/and,

The server further includes an elastic member, one end of which is arranged on the chassis, the other end of which is provided with a second limiting protrusion, the assembly seat is provided with a second limiting groove, the cavity wall of the mounting cavity is provided with a connecting hole, and the second limiting protrusion is used to penetrate the connecting hole and position and cooperate with the second limiting groove.

In order to make the above-mentioned purposes, features and advantages of the present invention more clearly understandable, the specific implementation of the present invention is described in detail below in conjunction with the drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

In the description of the present invention, it is necessary to understand that if the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the directions or positional relationships indicated by these terms are based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention.

In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

In the present invention, unless otherwise clearly defined and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components, unless otherwise clearly defined. For those with ordinary knowledge in the field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

In the present invention, unless otherwise clearly specified and limited, if there is a description such as "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, "above", "above" and "above" a first feature of a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "below", "below" and "below" a first feature of a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the present invention are for illustrative purposes only and do not represent the only implementation method.

Referring to FIGS. 1 to 4 , an embodiment of the present invention provides a PCIE module. The PCIE module 10 includes a PCIE card 100, an assembly frame 200, a first assembly member 300, an assembly seat 400, and a second assembly member 500. The PCIE card 100 is provided with a mounting portion 110. The assembly frame 200 is provided with a first opening 210 and a first assembly position 220 that are connected to each other. The PCIE card 100 is used to enter and exit the first assembly position 220 through the first opening 210. The first assembly member 300 is provided with a first assembly seat 400, and a second assembly member 500 is provided with a second assembly seat 500. 00 is arranged on a side of the assembly frame 200 with a first opening 210; the assembly seat 400 is provided with a second opening 410 and a second assembly position 420 that are connected, and the assembly frame 200 is used to enter and exit the second assembly position 420 through the second opening 410; the second assembly component 500 is arranged on a side of the assembly seat 400 with a second opening 410, and the second assembly component 500 is detachably connected to the first assembly component 300, and the mounting portion 110 is used to be clamped between the first assembly component 300 and the second assembly component 500.

When the PCIE card 100 needs to be installed in the PCIE module 10, the PCIE card 100 is firstly inserted into the first assembly position 220 through the first opening 210 of the assembly frame 200, so that the installation part 110 of the PCIE card 100 is connected with the first assembly part 300 disposed on the assembly frame 200. Since the first assembly part 300 is disposed on the side of the assembly frame 200 with the first opening 210, and the second assembly part 500 is disposed on the side of the assembly seat 400 with the second opening 410, when the assembly frame 200 with the PCIE card 100 inserted into the second assembly position 420 through the second opening 410 of the assembly seat 400, the installation part 110 on the PCIE card 100 can be sandwiched between the first assembly part 300 and the second assembly part 500. The first assembly part 300 and the second assembly part 500 are connected to each other, and the installation of the PCIE card 100 is completed. When the PCIE card 100 needs to be disassembled, the first assembly part 300 and the second assembly part 500 are disassembled, and then the assembly frame 200 is taken out from the second assembly position 420 through the second opening 410, so that the installation part 110 sandwiched between the first assembly part 300 and the second assembly part 500 is released, and finally the PCIE card 100 installed in the first assembly position 220 is taken out through the first opening 210, and the PCIE card 100 can be disassembled, so as to inspect and repair the PCIE card 100. Compared with the traditional technology, when the PCIE module 10 is used to disassemble and assemble the PCIE board, the disassembly and assembly process is more convenient and the disassembly and assembly efficiency is high.

In addition, by first inserting the PCIE card 100 into the first assembly position 220 through the first opening 210 of the assembly frame 200, and then inserting the assembly frame 200 with the PCIE card 100 into the second assembly position 420 through the second opening 410 of the assembly seat 400, after the installation is completed, the assembly frame 200 and the assembly seat 400 can be assembled to form a protective cover, which can provide a certain protective effect on the internal PCIE card 100 to prevent other components from causing damage to the PCIE card 100.

Specifically, the PCIE card 100 may be a double-width PCIE card 100.

Please refer to Figures 1 to 4. In one embodiment, the first assembly part 300 includes a first assembly part 310 and a second assembly part 320. The first assembly part 310 is bent and connected to the second assembly part 320. The first assembly part 310 is detachably connected to the second assembly part 500. The mounting part 110 is used to be sandwiched between the second assembly part 320 and the second assembly part 500.

The first assembly part 310 is arranged correspondingly to the second assembly part 500 and can be detachably connected to the second assembly part 500. Since the first assembly part 310 and the second assembly part 320 are bent, when the first assembly part 310 and the second assembly part 500 are connected correspondingly, the mounting part 110 on the PCIE card 100 is sandwiched between the second assembly part 320 and the second assembly part 500, thereby realizing the assembly of the PCIE card 100. When the PCIE card 100 is to be disassembled, the first assembly part 310 and the second assembly part 500 are disassembled, and the second assembly part 320 and the second assembly part 500 are moved away from each other, so that the mounting part 110 of the PCIE card 100 is released, and then the PCIE card 100 is disassembled; such a configuration can optimize the disassembly and assembly steps of the PCIE card 100 without damaging the PCIE card 100, facilitate the staff to disassemble and maintain the PCIE card 100, and improve the disassembly and assembly efficiency.

Please refer to Figures 2 to 4. In one embodiment, the first assembly part 310 has a first assembly surface 311, the second assembly part 320 has a second assembly surface 321, the first assembly surface 311 and the second assembly surface 321 are arranged at an angle, the second assembly part 500 has a first assembly wall 510 and a second assembly wall 520, the first assembly wall 510 and the second assembly wall 520 are arranged at an angle, the first assembly surface 311 and the first assembly wall 510 are detachably connected, and the mounting part 110 is used to be clamped between the second assembly surface 321 and the second assembly wall 520.

The first mounting surface 311 is arranged corresponding to the first mounting wall 510 and can be detachably connected to the first mounting wall 510, and the second mounting surface 321 is arranged corresponding to the second mounting wall 520. Therefore, when the first mounting surface 311 is connected correspondingly to the first mounting wall 510, the mounting portion 110 of the PCIE card 100 is clamped between the second mounting surface 321 and the second mounting wall 520, thereby realizing the assembly of the PCIE card 100. When the PCIE card 100 needs to be disassembled, the first mounting surface 311 is detached from the first mounting surface 311. The first mounting wall 510 is disassembled, and the second mounting surface 321 and the second mounting wall 520 are separated from each other, so that the mounting portion 110 of the PCIE card 100 is released, and then the PCIE card 100 is disassembled; through the connection between the first mounting surface 311 and the first mounting wall 510, the mounting portion 110 of the PCIE card 100 is clamped between the second mounting surface 321 and the second mounting wall 520 to realize the assembly and disassembly of the PCIE card 100, the assembly effect is stable, and the disassembly process is convenient and the disassembly efficiency is high.

Referring to FIG. 2 to FIG. 4 , in one embodiment, the angle between the first mounting surface 311 and the second mounting surface 321 is a right angle, and the angle between the first mounting wall 510 and the second mounting wall 520 is also a right angle.

Please refer to Figures 1 to 4. In one embodiment, the PCIE module 10 further includes a first threaded component 610. The first mounting surface 311 is provided with a first through hole 3111. The first mounting wall 510 is provided with a first screw hole 511. The first threaded component 610 is passed through the first through hole 3111 and is screwed to the first screw hole 511.

The first threaded component 610 can pass through the first through hole 3111 of the first mounting surface 311, thereby being screwed to the first screw hole 511 of the first mounting wall 510 to achieve a detachable connection between the first mounting surface 311 and the first mounting wall 510; with such a configuration, the connection effect is reliable and the disassembly and assembly process is convenient, which is easy for users to operate.

Please refer to Figures 1 to 4. In one embodiment, the PCIE module 10 further includes a second threaded component 620, the mounting portion 110 is provided with a second through hole 111, the second mounting wall 520 is provided with a third through hole 521, and the second mounting surface 321 is provided with a second screw hole 3211. The second threaded component 620 is penetrated through the second through hole 111 and the third through hole 521 and is screwed to the second screw hole 3211.

The second threaded component 620 can pass through the second through hole 111 on the mounting portion 110 and the third through hole 521 on the second mounting wall 520, and then be screwed with the second screw hole 3211 on the second mounting surface 321, so that the mounting portion 110 of the PCIE card 100 is sandwiched between the second mounting surface 321 and the second mounting wall 520 to realize the assembly of the PCIE card 100; such a setting can make the assembly effect of the PCIE card 100 more reliable and the disassembly process more convenient.

Specifically, the second threaded component 620 adopts an M3 flat-head screw, and there are at least two M3 flat-head screws. The second through hole 111, the third through hole 521 and the second screw hole 3211 are each provided with at least two and are arranged one-to-one corresponding to the M3 flat-head screws. In order to ensure assembly reliability, at least two M3 flat-head screws can be arranged to pass through the second through hole 111 and the third through hole 521 and be threadedly connected with the second screw hole 3211.

Specifically, please refer to FIG. 2 and FIG. 3 . When the PCIE module 10 needs to be assembled, the PCIE card 100 is firstly inserted into the first assembly position 220 through the first opening 210 on the assembly frame 200, so that the mounting portion 110 of the PCIE card 100 is connected to the first assembly member 300 disposed on the assembly frame 200, and then the assembly frame 200 with the PCIE card 100 installed thereon is inserted into the second assembly position 420 through the second opening 410 on the assembly seat 400. At this time, the mounting portion 110 is sandwiched between the second assembly wall 520 and the second assembly surface 321. So that the staff can use the second threaded component 620 to pass through the second through hole 111 and the third through hole 521 and screw it with the second screw hole 3211. After completion, the first threaded component 610 is passed through the first through hole 3111 on the first assembly surface 311 and screwed with the first assembly wall 510 to further fix the PCIE card 100 on the mounting seat and the mounting frame to ensure assembly stability. It can be understood that in the above embodiment, the installation order of the first threaded component 610 and the second threaded component 620 can be interchanged, and the specific selection is based on the actual situation, and no specific limitation is made here.

Please refer to Figures 1 to 4. In one embodiment, the PCIE card 100 is further provided with a plug-in portion 120. The mounting frame 200 is provided with a plug-in slot 230. The plug-in slot 230 is located at one end of the first mounting position 220 away from the first opening 210. The plug-in portion 120 is used to be inserted into the plug-in slot 230.

When the PCIE card 100 enters the first assembly position 220 through the first opening 210, the plug-in portion 120 on the PCIE card 100 can penetrate the plug-in slot 230 located at one end of the first assembly position 220 away from the first opening 210, thereby positioning the PCIE card 100 installed on the first assembly position 220, preventing the PCIE card 100 from moving in the first assembly position 220, and further improving the assembly stability of the PCIE card 100.

Specifically, please refer to Figures 1 to 4. The plug-in slot 230 is a through slot, and the plug-in portion 120 can be inserted into the plug-in slot 230 and extend to the outside of the first assembly position 220 through the plug-in slot 230. In this way, the thickness of the side wall of the assembly frame 200 can be reduced as much as possible so that the plug-in portion 120 can be inserted into the plug-in slot 230. While ensuring the stability of the assembly, the overall weight of the assembly frame 200 can also be reduced to reduce the production cost.

Please refer to FIG. 2 to FIG. 4 . In one embodiment, the PCIE module 10 further includes an expansion card 700 . The mounting frame 200 is provided with a third mounting portion 240 . The expansion card 700 is detachably disposed on the third mounting portion 240 and is used to be electrically connected to the PCIE card 100 .

The expansion card 700 can be electrically connected to the PCIE card 100 to achieve flexible expansion of the PCIE module 10. The expansion card 700 is detachably arranged on the third assembly portion 240 on the assembly frame 200 to facilitate disassembly and operation and maintenance of the expansion card 700, thereby improving the efficiency of the user in operating, maintaining and repairing the PCIE module 10.

For explanation, the expansion card 700 may also be called an adapter card, a riser card, etc., and is used to electrically connect to the server's motherboard through the expansion card 700. The PCIE card 100 can be electrically connected to the server's motherboard through the expansion card 700 to achieve data transmission between the PCIE card 100 and the server motherboard.

Please refer to Figures 1 to 4. In one embodiment, the PCIE module 10 further includes a third threaded component 630. The third assembly portion 240 is located at an end of the first assembly position 220 far away from the first opening 210. The third assembly portion 240 is provided with a third screw hole 241. The expansion card 700 is provided with a fourth through hole 710. The third threaded component 630 is penetrated through the fourth through hole 710 and is screwed to the third screw hole 241.

The third threaded member 630 can pass through the fourth through hole 710 on the expansion card 700 and be threadedly connected to the third screw hole 241 of the third assembly portion 240, thereby realizing a detachable connection of the expansion card 700, with reliable connection effect and low connection cost.

Please refer to Figures 1 to 4. In one embodiment, the PCIE module 10 further includes a fourth threaded component 640. The mounting frame 200 is provided with a fifth through hole 250. The PCIE card 100 is provided with a fourth screw hole 130. The fourth threaded component 640 passes through the fifth through hole 250 and is screwed to the fourth screw hole 130.

Specifically, please refer to FIG. 2 to FIG. 4 , the fourth threaded component 640 includes at least two M3 countersunk screws, and the fifth through hole 250 and the fourth screw hole 130 are both provided with at least two M3 countersunk screws corresponding to each other to ensure assembly reliability.

Please refer to FIG. 1 to FIG. 4 , in one embodiment, the PCIE module 10 further includes a fifth threaded component 650 , a sixth through hole 260 is formed on the mounting frame 200 , a fifth screw hole 430 is formed on the mounting seat 400 , and the fifth threaded component 650 is screwed to the fifth screw hole 430 through the sixth through hole 260 .

Specifically, the fifth threaded component 650 includes at least two thumb screws, and the sixth through hole 260 and the fifth screw hole 430 are each provided with at least two thumb screws corresponding to each other to ensure assembly reliability.

Please refer to Figures 5 to 7. Another embodiment of the present invention provides a server, which includes a chassis 20 and the PCIE module 10 as described above. The chassis 20 is provided with a connecting mounting port 21 and a mounting cavity 22. The mounting seat 400 can enter and exit the mounting cavity 22 through the mounting port 21.

In the above-mentioned server, the PCIE module 10 can enter and exit the installation cavity 22 through the installation opening 21 on the chassis 20 to realize the disassembly and installation of the PCIE module 10. When the PCIE card 100 needs to be installed, the PCIE card 100 is firstly inserted into the first assembly position 220 through the first opening 210 of the assembly frame 200 so that the installation portion 110 of the PCIE card 100 is aligned with the first assembly member 3 disposed on the assembly frame 200. 00 is docked. Since the first assembly member 300 is arranged on the side of the assembly frame 200 with the first opening 210, and the second assembly member 500 is arranged on the side of the assembly seat 400 with the second opening 410, when the assembly frame 200 with the PCIE card 100 enters the second assembly position 420 through the second opening 410 of the assembly seat 400, the installation portion 110 on the PCIE card 100 is clamped. The first assembly part 300 is placed between the first assembly part 300 and the second assembly part 500, and finally the first assembly part 300 is connected to the second assembly part 500 to complete the installation of the PCIE card 100. When the PCIE card 100 needs to be disassembled, the first assembly part 300 and the second assembly part 500 are disassembled, and then the assembly frame 200 is taken out from the second assembly position 420 through the second opening 410, so that the installation part 110 sandwiched between the first assembly part 300 and the second assembly part 500 is released, and finally the PCIE card 100 installed in the first assembly position 220 is taken out through the first opening 210, so that the PCIE card 100 can be disassembled, so as to inspect and repair the PCIE card 100. Compared with the traditional technology, when the above-mentioned PCIE module 10 is used to disassemble and assemble the PCIE board, the disassembly and assembly process is more convenient and the disassembly and assembly efficiency is high.

Please refer to FIG. 5 and FIG. 6 . In one embodiment, the outer edge of the mounting opening 21 is provided with a first limiting groove 23 . The second assembly member 500 is provided with a first limiting protrusion 530 . The first limiting protrusion 530 is used to abut against the bottom wall of the first limiting groove 23 .

The first limiting groove 23 disposed on the outer edge of the mounting opening 21 can abut against the first limiting protrusion 530 on the second assembly part 500 of the PCIE module 10 to limit the movement of the PCIE module 10 toward the mounting cavity 22; such a setting can have a certain positioning effect on the PCIE module 10 during the installation process, simplifying the installation process.

Please refer to Figure 7, as an embodiment that can be implemented simultaneously with the above-mentioned embodiment, the server further includes an elastic member 30, one end of the elastic member 30 is arranged on the chassis 20, the other end of the elastic member 30 is provided with a second limiting protrusion 31, the assembly seat 400 is provided with a second limiting groove 440, the cavity wall of the installation cavity 22 is opened with a connecting hole 24, and the second limiting protrusion 31 is used to penetrate the connecting hole 24 and position and cooperate with the second limiting groove 440.

The second limiting protrusion 31 is passed through the connecting hole 24 and is located in the installation cavity 22 under the elastic action of the elastic member 30. When the user pushes the PCIE module 10 from the installation port 21 into the installation cavity 22 to the preset position, the second limiting protrusion 31 is positioned and matched with the second limiting groove 440 on the assembly seat 400 under the elastic action of the elastic member 30, thereby realizing the positioning of the PCIE module 10. Such a setting can make the PCIE module 10 less likely to shake in the installation cavity 22, thereby improving the assembly stability of the PCIE module 10.

In addition, in the above-mentioned embodiment, the PCIE module 10 can be used internally in servers of 1U and above to meet the needs of different application scenarios, thereby improving the adaptability and flexibility of the PCIE module 10 in different server architectures.

The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

The above embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it should not be understood as limiting the scope of the patent application. It should be pointed out that for those with ordinary knowledge in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the scope of the attached patent application.

10: PCIE module 100: PCIE card 110: installation part 111: second through hole 120: plug-in part 130: fourth screw hole 200: assembly frame 210: first opening 220: first assembly position 230: plug-in slot 240: third assembly part 241: third screw hole 250: fifth through hole 260: sixth through hole 300: first assembly part 310: first assembly part 311: first assembly surface 3111: first through hole 320: second assembly part 321: second assembly surface 3211: second screw hole 400: assembly seat 410: second opening 420: second assembly position 430: fifth screw hole 440: second limit slot 500: second assembly part 510: first assembly wall 511: first screw hole 520: second assembly wall 521: third through hole 530: first limit protrusion 610: first threaded component 620: second threaded component 630: third threaded component 640: fourth threaded component 650: fifth threaded component 700: expansion card 710: fourth through hole 20: chassis 21: mounting port 22: mounting cavity 23: first limit groove 24: connecting hole 30: elastic component 31: second limit protrusion

In order to more clearly explain the technical solution in the embodiment of the present invention, the following will briefly introduce the figures required for the description of the embodiment. Obviously, the figures described below are only some embodiments of the present invention. For those with ordinary knowledge in this field, other figures can be obtained based on these figures without creative labor. Figure 1 is a schematic diagram of the overall structure of the PCIE module in an embodiment of the present invention. Figure 2 is an exploded view of the PCIE module in an embodiment of the present invention. Figure 3 is an exploded view of the PCIE module in an embodiment of the present invention from another angle. Figure 4 is an exploded view of the PCIE module in an embodiment of the present invention from another angle. Figure 5 is a schematic diagram of the chassis structure of the server in an embodiment of the present invention. FIG6 is a partial enlarged view of point A in FIG5. FIG7 is a structural schematic diagram of the chassis of the server at another angle in an embodiment of the present invention.

10: PCIE module

100: PCIE card

120: Plug-in part

300: First assembly

400: Assembly seat

500: Second assembly

Claims (10)

A PCIE module, characterized in that it comprises: a PCIE card (100), the PCIE card (100) being provided with a mounting portion (110); an assembly frame (200), the assembly frame (200) being provided with a first opening (210) and a first assembly position (220) which are connected to each other, the PCIE card (100) being used to enter and exit the first assembly position (220) through the first opening (210); a first assembly component (300), the first assembly component (300) being provided on a side of the assembly frame (200) provided with the first opening (210); and an assembly seat (400), the first assembly component (300) being provided on a side of the assembly frame (200) provided with the first opening (210); and a mounting seat (400), the first assembly component (300) being provided on a side of the assembly frame (200) provided with the first opening (210). The assembly seat (400) is provided with a second opening (410) and a second assembly position (420) which are connected to each other, and the assembly frame (200) is used to enter and exit the second assembly position (420) through the second opening (410); and a second assembly component (500), the second assembly component (500) is arranged on a side of the assembly seat (400) where the second opening (410) is provided, the second assembly component (500) is detachably connected to the first assembly component (300), and the mounting portion (110) is used to be sandwiched between the first assembly component (300) and the second assembly component (500). A PCIE module as described in claim 1, wherein the first assembly part (300) includes a first assembly portion (310) and a second assembly portion (320), the first assembly portion (310) and the second assembly portion (320) are bent and connected, the first assembly portion (310) and the second assembly part (500) are detachably connected, and the mounting portion (110) is used to be clamped between the second assembly portion (320) and the second assembly part (500). A PCIE module as described in claim 2, wherein the first assembly part (310) has a first assembly surface (311), the second assembly part (320) has a second assembly surface (321), the first assembly surface (311) and the second assembly surface (321) are arranged at an angle, the second assembly part (500) has a first assembly wall (510) and a second assembly wall (520), the first assembly wall (510) and the second assembly wall (520) are arranged at an angle, the first assembly surface (311) and the first assembly wall (510) are detachably connected, and the mounting part (110) is used to be clamped between the second assembly surface (321) and the second assembly wall (520). A PCIE module as described in claim 3, wherein the PCIE module (10) further includes a first threaded component (610), the first mounting surface (311) is provided with a first through hole (3111), the first mounting wall (510) is provided with a first screw hole (511), and the first threaded component (610) is passed through the first through hole (3111) and is screwed to the first screw hole (511). A PCIE module as described in claim 3, wherein the PCIE module (10) further includes a second threaded component (620), the mounting portion (110) is provided with a second through hole (111), the second mounting wall (520) is provided with a third through hole (521), the second mounting surface (321) is provided with a second screw hole (3211), and the second threaded component (620) is passed through the second through hole (111) and the third through hole (521) and is screwed to the second screw hole (3211). A PCIE module as described in any one of claim items 1-5, wherein the PCIE card (100) is further provided with a plug-in portion (120), the assembly frame (200) is provided with a plug-in slot (230), the plug-in slot (230) is located at an end of the first assembly position (220) away from the first opening (210), and the plug-in portion (120) is used to be inserted into the plug-in slot (230). A PCIE module as described in any one of claim items 1-5, wherein the PCIE module (10) further includes an expansion card (700), the assembly frame (200) is provided with a third assembly part (240), and the expansion card (700) is detachably arranged on the third assembly part (240) and is used to be electrically connected to the PCIE card (100). A PCIE module as described in claim 7, wherein the PCIE module (10) further includes a third threaded component (630), the third assembly portion (240) is located at an end of the first assembly position (220) far away from the first opening (210), the third assembly portion (240) is provided with a third screw hole (241), the expansion card (700) is provided with a fourth through hole (710), and the third threaded component (630) is penetrated through the fourth through hole (710) and is threadedly connected to the third screw hole (241). A server, characterized in that the server comprises a chassis (20) and a PCIE module (10) as described in any one of claim items 1 to 8, wherein the chassis (20) is provided with a connecting mounting port (21) and a mounting cavity (22), and the assembly seat (400) can enter and exit the mounting cavity (22) through the mounting port (21). A server as described in claim 9, wherein the outer edge of the mounting opening (21) is provided with a first limiting groove (23), the second assembly part (500) is provided with a first limiting protrusion (530), and the first limiting protrusion (530) is used to abut against the bottom wall of the first limiting groove (23); or/and, the server further includes an elastic member (30), one end of the elastic member (30) is provided on the chassis (20), the other end of the elastic member (30) is provided with a second limiting protrusion (31), the assembly seat (400) is provided with a second limiting groove (440), the cavity wall of the mounting cavity (22) is provided with a connecting hole (24), and the second limiting protrusion (31) is used to penetrate the connecting hole (24) and be positioned and matched with the second limiting groove (440).

Images