TWI883179B - Method for joining adhesive sheet, apparatus for joining adhesive sheet, and manufacturing method of semiconductor products - Google Patents

Abstract

[Topic] The present invention provides an adhesive sheet attaching method, an adhesive sheet attaching device, and a method for manufacturing a semiconductor product, which can more reliably avoid damage to the semiconductor wafer and can attach an adhesive sheet with good precision to the annular protrusion forming surface of the semiconductor wafer having an annular protrusion. [Solution] The adhesive sheet attaching method of the present invention comprises: a attaching process, wherein a pressure higher than atmospheric pressure is applied to a sheet composite M formed by attaching an adhesive sheet DT to the annular protrusion forming surface of a wafer W having an annular protrusion Ka on the outer periphery of one side, thereby attaching the adhesive sheet DT to the annular protrusion forming surface of the wafer W. During the attachment process, a sufficiently large pushing force V1 can be applied to the adhesive sheet DT, thereby greatly improving the adhesion between the adhesive sheet DT and the wafer W. Therefore, even after a period of time, the adhesive sheet DT can be prevented from gradually peeling off from the wafer W.

Description

Adhesive sheet attaching method, adhesive sheet attaching device and semiconductor product manufacturing method

The present invention relates to an adhesive sheet attaching method, an adhesive sheet attaching device and a method for manufacturing a semiconductor product for attaching an adhesive sheet such as a tape-like adhesive material to a workpiece such as a semiconductor wafer (hereinafter referred to as "wafer") or a substrate.

After forming a circuit pattern on the surface of the wafer, the back side of the wafer is ground by a back grinding process, and then the wafer is divided into multiple chip components by a dicing process. In the back grinding process, there are cases where only the center part of the back side of the wafer is ground while retaining the outer periphery of the back side of the wafer, and a ring-shaped convex portion is formed on the outer periphery of the back side of the wafer in a manner that surrounds the back grinding area.

At this time, even if the central part of the wafer is thinned, it is still reinforced by the annular protrusion, so deformation can be avoided during operation. After the back grinding process, the wafer with the annular protrusion is placed in the center of the ring frame, and the supporting adhesive tape (dicing tape) is attached to the ring frame and the back of the wafer. By attaching the dicing tape, a mount frame is made and provided to the dicing process.

As an example of a method for attaching an adhesive sheet such as a dicing tape to a wafer having a step difference formed by an annular protrusion, the following method is proposed. That is, the adhesive sheet is clamped at the joint portion of a chamber composed of a pair of upper and lower housings. Then, the pressure in the chamber is reduced to generate a pressure difference between two spaces separated by the adhesive sheet, and the adhesive tape is bent concavely to attach the adhesive sheet to the back of the wafer. Then, after eliminating the pressure difference in the chamber, gas is supplied from the first pressing member to the inner corner of the adhesive sheet that is not completely attached to the inner corner of the annular protrusion and floats up, thereby performing a second attachment process (see Patent Document 1). [Prior art literature] [Patent literature]

Patent document 1: Japanese Patent Application Publication No. 2013-232582

[Problems to be solved by the invention]

However, the above-mentioned conventional art device has the following problems. That is, in the conventional art adhesive sheet attaching method, there occurs a problem that the adhesive sheet gradually peels off from the inner corner of the annular protrusion toward the center of the wafer as time passes after the adhesive sheet is attached. In addition, in the conventional art adhesive sheet attaching method, there also occurs a problem that when the adhesive sheet is attached to the wafer, damage such as cracks and defects occur on the wafer. The damage to the wafer occurs at a relatively high frequency in the thinned portion of the wafer, especially the inner corner of the annular protrusion.

The present invention is developed in view of the above-mentioned situation, and its main purpose is to provide an adhesive sheet attaching method, adhesive sheet attaching device and semiconductor product manufacturing method that can more reliably avoid damage to the annular protrusion forming surface of a semiconductor wafer having an annular protrusion, and can attach the adhesive sheet with good precision. [Means for solving the problem]

To solve the above problem, the inventors of the present case have studied and obtained the following conclusions. That is, in the conventional technology of using the first pressing member for the second bonding process, the force acting on the adhesive sheet is small. Therefore, it is difficult to fully improve the adhesion between the wafer and the adhesive sheet, so it is believed that the adhesive sheet is gradually peeled off from the wafer over time.

In addition, during the second bonding process, a relatively large pressure is applied to the inner corners of the annular protrusion of the wafer compared to the center of the wafer. It is believed that due to the uneven pressure, cracks or defects occur particularly frequently at the inner corners of the annular protrusion of the wafer where the relatively large pressure is applied.

Furthermore, the first pushing member is a columnar member formed of metal or resin and having a gas supply hole. Furthermore, in the known technical configuration, the bottom surface of the first pushing member is brought close to the wafer to supply gas. Since the first pushing member is brought close, there is a possibility that the first pushing member contacts the central portion of the wafer that is formed into a concave shape by thinning, thereby damaging the thin concave portion of the wafer. When the flatness of the bottom surface of the first pushing member is low, it is believed that even when the first pushing member is close to the inner corner of the annular convex portion of the wafer, the first pushing member will contact other portions of the wafer (e.g., the center portion), resulting in damage to the wafer.

In order to achieve the above-mentioned purpose, the present invention adopts the following structure. That is, the adhesive sheet attaching method of the present invention has the following process: the attaching process is to attach the adhesive sheet to the annular convex portion forming surface of the workpiece having an annular convex portion on the outer periphery of one side, and apply a pressure higher than the atmospheric pressure to the sheet composite body formed by attaching the adhesive sheet to the annular convex portion forming surface.

(Function and Effect) According to the above structure, during the attachment process, a pressure higher than atmospheric pressure is applied to the sheet composite, thereby attaching the adhesive sheet to the annular convex portion forming surface of the workpiece. At this time, a sufficiently large pushing force can be applied to the adhesive sheet, so that the close contact between the adhesive sheet attached to the workpiece and the annular convex portion forming surface of the workpiece can be further improved. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the workpiece after a period of time.

Furthermore, preferably, in the above invention, there is provided a housing process for housing the sheet composite in a chamber; and the aforementioned attaching process is after the aforementioned housing process, by increasing the pressure of the internal space of the aforementioned chamber, thereby attaching the aforementioned adhesive sheet to the aforementioned annular convex portion forming surface.

(Function and Effect) According to the above-mentioned structure, after the sheet complex is accommodated in the chamber, a pressure higher than atmospheric pressure is applied to the sheet complex by increasing the pressure of the internal space of the chamber. At this time, by pressurizing the internal space, the pushing force can be uniformly applied to the entire adhesive sheet. Therefore, it is possible to reliably avoid the unevenness of the force acting on the adhesive sheet, thereby more reliably improving the flatness of the adhesive sheet when the adhesive sheet is attached to the wafer. In addition, it is also possible to avoid the situation where the uneven force acting on the adhesive sheet causes the uneven force acting on the local part of the wafer, thereby causing damage to the wafer.

In addition, preferably, in the above invention, the chamber comprises an upper shell and a lower shell; the attaching process comprises the following processes: an upper and lower space forming process, in which the upper shell and the lower shell clamp the adhesive sheet, thereby dividing the internal space of the chamber into a lower space for arranging the workpiece with the annular protrusion forming surface facing upward, and an upper space opposite to the lower space with the adhesive sheet interposed therebetween; and a space pressurizing process, in which at least the upper space of the upper space and the lower space is pressurized, thereby attaching the adhesive sheet to the annular protrusion forming surface.

(Function and Effect) According to the above-mentioned structure, the upper shell and the lower shell are used to clamp the above-mentioned adhesive sheet, thereby dividing the internal space of the chamber into a lower space and an upper space. At this time, the adhesive sheet acts as a sealing material, so that gas leakage between the lower space and the upper space in the internal space of the chamber can be avoided. Therefore, by pressurizing at least the upper space, the pressure of the upper space acts on the adhesive sheet with good precision. Therefore, the close contact between the adhesive sheet attached to the workpiece and the annular convex portion forming surface of the workpiece can be further improved.

In addition, it is preferred that, in the above invention, the adhesive sheet has a predetermined shape corresponding to the annular protrusion forming surface of the workpiece and is held on a long conveying sheet; the chamber comprises an upper shell and a lower shell; the attaching process includes the following processes: an upper and lower space forming process, in which the conveying sheet is clamped by the upper shell and the lower shell to divide the internal space of the chamber into a lower space for arranging the workpiece with the annular protrusion forming surface facing upward, and an upper space opposite to the lower space via the adhesive sheet held on the conveying sheet; and a space pressurizing process, in which at least the upper space of the upper space and the lower space is pressurized to attach the adhesive sheet to the annular protrusion forming surface.

(Function and Effect) According to the above configuration, the adhesive sheet is pre-prepared with a predetermined shape corresponding to the annular convex portion forming surface of the workpiece. Therefore, the adhesive sheet can be appropriately attached to the annular convex portion forming surface corresponding to the position and shape of the annular convex portion forming surface of the workpiece. In addition, there is no need to cut the adhesive sheet into a suitable predetermined shape, so the process of attaching the adhesive sheet can be shortened.

In addition, the adhesive sheet is a long conveying sheet, and the upper shell and the lower shell clamp the conveying sheet to form a cavity. At this time, even if a material with high adhesive force is used as the adhesive sheet to make the workpiece and the adhesive sheet more tightly bonded, the two shells can clamp the conveying sheet without touching the adhesive sheet. Therefore, it is possible to avoid the situation where the adhesive sheet is adhered to the cavity and cannot be peeled off, thereby hindering the attachment process.

Furthermore, by keeping the adhesive sheet on the long conveying sheet, even if the adhesive sheet has been pre-formed into a predetermined shape, the adhesive sheet can be conveyed along the predetermined path with good accuracy by feeding the long conveying sheet along the predetermined path. That is, it is possible to avoid unnecessary costs caused by setting the adhesive sheet in a long shape and improve the conveying accuracy of the adhesive sheet.

In addition, preferably, in the above invention, there is a sheet-like elastic body arranged inside the aforementioned upper shell; the aforementioned sheet-like elastic body is arranged in a manner that the aforementioned adhesive sheet is clamped by the aforementioned upper shell and the aforementioned lower shell during the formation process of the aforementioned upper and lower spaces, thereby making the aforementioned sheet-like elastic body abut against the aforementioned adhesive sheet.

(Function and Effect) According to the above structure, the sheet-like elastic body is deformed into a convex shape with a more uniform curvature throughout the entire body by the pressure difference. Therefore, the adhesive sheet becomes easy to deform in accordance with the shape of the annular convex portion forming surface of the workpiece, so that the adhesion between the annular convex portion forming surface and the adhesive sheet can be improved. Therefore, the adhesive sheet can be attached to the annular convex portion forming surface with better accuracy.

In addition, it is preferred that the above invention has a heating process for heating the adhesive sheet by heating at least one of the lower space and the upper space; the attaching process is to apply a pressure higher than atmospheric pressure to the adhesive sheet in a heated state by the heating process, thereby attaching the adhesive sheet to the annular convex portion forming surface.

(Function and Effect) According to this structure, the adhesive sheet is heated by the heating process, so that the adhesive sheet becomes softer. That is, the adhesive sheet becomes easy to deform according to the shape of the annular convex portion forming surface of the workpiece, thereby improving the adhesion between the annular convex portion forming surface and the adhesive sheet.

In order to achieve the above-mentioned purpose, the present invention can also adopt the following structure. That is, the adhesive sheet attaching device of the present invention has: an attaching mechanism, which is a sheet composite body formed by attaching an adhesive sheet to the annular convex portion forming surface of a workpiece having an annular convex portion on the outer periphery of one side, and applies a pressure higher than atmospheric pressure to attach the aforementioned adhesive sheet to the aforementioned annular convex portion forming surface.

(Function and Effect) The attachment mechanism of the present invention applies a pressure higher than atmospheric pressure to the sheet composite, thereby attaching the adhesive sheet to the annular convex portion forming surface of the workpiece. At this time, a sufficiently large pushing force can be applied to the adhesive sheet, so that the adhesion between the adhesive sheet attached to the workpiece and the annular convex portion forming surface of the workpiece can be further improved. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the workpiece after a period of time.

In order to achieve the above-mentioned purpose, the present invention can also adopt the following structure. That is, the manufacturing method of the semiconductor product of the present invention is to manufacture a semiconductor product in which an adhesive sheet is attached to the annular convex portion forming surface of a workpiece having an annular convex portion on the periphery of one side. The manufacturing method of the semiconductor product is characterized by having: The attachment process is to apply a pressure higher than atmospheric pressure to a sheet composite formed by attaching the adhesive sheet to the annular convex portion forming surface of the workpiece, thereby attaching the adhesive sheet to the annular convex portion forming surface.

(Function and effect) According to the above-mentioned structure, a semiconductor product can be preferably manufactured in which an adhesive sheet is attached to the annular protrusion forming surface of a workpiece having an annular protrusion on the periphery of one side. That is, during the attachment process, a pressure higher than atmospheric pressure is applied to the sheet composite, thereby attaching the adhesive sheet to the annular protrusion forming surface of the workpiece. At this time, a sufficiently large pushing force can be applied to the adhesive sheet, so that the adhesion between the adhesive sheet in the sheet composite and the annular protrusion forming surface of the workpiece can be further improved through the attachment process. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the workpiece after a period of time. [Effect of the invention]

According to the adhesive sheet attaching method, adhesive sheet attaching device and semiconductor product manufacturing method of the present invention, the adhesive sheet is attached to the annular protrusion forming surface of the workpiece by applying a pressure higher than atmospheric pressure to the sheet composite. At this time, a sufficiently large pushing force can be applied to the adhesive sheet, so that the closeness between the adhesive sheet attached to the workpiece and the annular protrusion forming surface of the workpiece can be further improved. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the workpiece after a period of time. In addition, the large pushing force can be uniformly applied to the entire workpiece, so it is possible to avoid damage to the workpiece such as cracks or defects caused by uneven pushing force acting on the workpiece.

[Form used to implement the invention]

Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. In the adhesive sheet attaching device 1 of Embodiment 1, as the adhesive sheet, a supporting adhesive tape DT (dicing tape) is used, and as the workpiece to which the adhesive sheet is attached, a semiconductor wafer W (hereinafter referred to as "wafer W") and an annular frame f are used. That is, in the adhesive sheet attaching device 1 of Embodiment 1, the mounting frame MF is manufactured by attaching the adhesive tape DT to the wafer W and the annular frame f.

As shown in FIG. 1(a) to FIG. 1(c), the wafer W is subjected to back grinding in a state where a protective tape PT for circuit protection is attached to the surface on which the circuit pattern is formed. The back side of the wafer W is ground (back grinding) with the outer periphery retained at about 3 mm in the radial direction. That is, a wafer is used which is processed to form a flat recess He on the back side and an annular protrusion Ka along its periphery. For example, the depth d of the flat recess He ground is several hundred μm, and the wafer thickness J of the flat recess He is formed to be 30 μm to 50 μm. Therefore, the annular protrusion Ka formed on the outer periphery of the back side functions as an annular rib that improves the rigidity of the wafer W, thereby suppressing the bending and deformation of the wafer W during handling and other processing processes. In addition, the inner corner of the annular convex portion Ka is denoted by a symbol Kf. The inner corner Kf corresponds to the boundary between the annular convex portion Ka and the flat concave portion He. The back surface of the wafer W corresponds to the annular convex portion forming surface of the workpiece of the present invention.

The adhesive tape DT used in this embodiment has a long structure formed by laminating a non-adhesive base material Ta and an adhesive material Tb as shown in FIG2. A separator S is added to the adhesive material Tb. That is, the separator S is added to the adhesive surface of the adhesive tape DT, and the adhesive surface of the adhesive tape DT is exposed by peeling the separator S from the adhesive tape DT.

Examples of the material constituting the substrate Ta include polyolefin, polyethylene, ethylene-vinyl acetate copolymer, polyester, polyimide, polyurethane, vinyl chloride, polyethylene terephthalate, polybutylene terephthalate, polyethylene terenaphthalate, polyvinylidene chloride, polyethylene-methacrylic acid copolymer, polypropylene, methacrylic acid terephthalate, Terephthalate, polyamide-imide, elastomer, etc. In addition, a material combining a plurality of the above materials may be used for the substrate Ta. In addition, the substrate Ta may be a single layer or a structure formed by laminating a plurality of layers.

The adhesive material Tb is preferably made of a material that can ensure that the adhesive tape DT is adhered to the wafer W and the annular frame f and prevent the chip parts from flying during the subsequent dicing process. Examples of materials constituting the adhesive material Tb include acrylic acid ester copolymers, etc. Examples of the separation film S include long paper materials and plastics, etc. In addition, a bonding material or an adhesive material can be used instead of the adhesive material Tb.

<Description of the overall structure> Here, the overall structure of the adhesive sheet attaching device 1 of Example 1 is described. FIG. 3 is a top view showing the basic structure of the adhesive sheet attaching device 1 of Example 1. The adhesive sheet attaching device 1 is configured to have a rectangular portion 1a having a horizontal length, and a protruding portion 1b. The protruding portion 1b is configured to be connected to the central portion of the rectangular portion 1a and protrude upward. In addition, in the subsequent description, the long side direction of the rectangular portion 1a is referred to as the left-right direction (x direction), and the horizontal direction (y direction) orthogonal to this direction is referred to as the front-back direction.

On the right side of the rectangular portion 1a, a wafer transfer mechanism 3 is arranged. On the lower right side of the rectangular portion 1a, two containers 5 containing wafers W are placed side by side. Wafers W with protective tapes PT attached to their surfaces are stored in multiple stages with their surfaces facing downward. On the left end of the rectangular portion 1a, a frame recovery unit 6 is arranged for recovering the mounting frame MF shown in FIG. 8 on which the wafers W are mounted.

From the upper right side of the rectangular portion 1a, there are arranged in order an aligner 7, a lifting table 8, a holding table 9, and a frame supply unit 12. The protruding portion 1b is provided with a sticking unit 13 for sticking a supporting adhesive tape DT (dicing tape) to the back surface of the wafer W and the ring frame f.

As shown in FIG. 4 , the wafer transfer mechanism 3 includes a wafer transfer device 16 supported on the right side of a guide rail 15 in a manner capable of reciprocating left and right, and the guide rail 15 is horizontally erected on the upper part of the rectangular portion 2a. In addition, on the left side of the guide rail 15, a frame transfer device 17 supported on the guide rail 15 in a manner capable of moving left and right is provided.

The wafer transfer device 16 is configured to transfer the wafer W taken out from any one of the containers 5 to the left and right and to the front and back. The wafer transfer device 16 is equipped with a movable stage 18 for moving to the left and right and a movable stage 19 for moving to the front and back.

The horizontal movable table 18 is configured to be reciprocatingly movable in the horizontal direction along the guide rail 15. The forward and backward movable table 19 is configured to be reciprocatingly movable in the forward and backward direction along the guide rail 20 provided in the horizontal movable table 18.

In addition, a holding unit 21 for holding the wafer W is provided at the bottom of the forward and backward movable stage 19. The holding unit 21 is configured to be able to reciprocate in the vertical direction (z direction) along a longitudinally extending lifting rail 22. In addition, the holding unit 21 is capable of rotating around the z direction by a rotating shaft (not shown).

A horseshoe-shaped holding arm 23 is provided at the lower part of the holding unit 21. A plurality of slightly protruding adsorption pads are provided on the holding surface of the holding arm 23, and the wafer W is adsorbed and held by the adsorption pads. In addition, the holding arm 23 is connected to the air pressure device through a flow path formed inside it and a connecting flow path connected to the base end side of the flow path.

By utilizing the above movable structure, the wafer W held by suction can be moved forward and backward, left and right, and rotated about the z direction by the holding arm 23 .

The frame transport device 17 is equipped with a movable table 24 for moving left and right, a movable table 25 for moving forward and backward, a flexion-extension link mechanism 26 connected to the lower part of the movable table 24 for moving left and right, and an adsorption plate 27 installed at the lower end of the flexion-extension link mechanism 26. The adsorption plate 27 adsorbs and holds the wafer W. A plurality of adsorption pads 28 for adsorbing and holding the annular frame f are arranged around the adsorption plate 27. Therefore, the frame transport device 17 is capable of adsorbing and holding the annular frame f or the mounting frame MF mounted on the holding table 9 so as to be lifted and lowered and transported forward and backward and left and right. The adsorption pad 28 is configured to be able to slide and adjust in the horizontal direction corresponding to the size of the annular frame f.

The lifting table 8 is used to hold the wafer W, and for example, is a metal chuck table having the same shape or larger than the size of the wafer W. A preferred structure of the lifting table 8 is to hold the wafer W by adsorption using a suction device provided inside. As shown in FIG. 5 and the like, the lifting table 8 is connected to one end of a rod 52 that passes through a support table 51 that supports the lifting table 8. The other end of the rod 52 is connected to an actuator 53 having a motor or the like for driving. The lifting table 8 is able to move up and down by means of the rod 52 and the actuator 53.

As shown in FIG3 and FIG5 , the lifting platform 8 is configured to be able to reciprocate between an initial position and an attachment position along a track 54 provided in the front-rear direction. The initial position is located inside the rectangular portion 1a, which is the position of the lifting platform 8 indicated by a solid line in FIG3 . At the initial position, the wafer W is placed on the lifting platform 8 .

The attachment position is located inside the protruding portion 1b, which is the position indicated by the dotted line of the lifting platform 8 in Fig. 3. By moving the lifting platform 8 to the attachment position, the wafer W placed on the lifting platform 8 can contact the adhesive tape DT.

As shown in FIG. 5 and FIG. 6, the holding table 9 is a metal suction cup table having the same shape or larger size as the wafer W, and is connected to the pressurizing device 32 provided outside. The operation of the pressurizing device 32 is controlled by the control unit 33. In addition, the holding table 9 is provided with a suction device inside, and is configured to hold the wafer W by adsorption.

In the first embodiment, the holding table 9 has an annular protrusion 9a on the outer periphery and is formed hollow as a whole. The protrusion 9a is formed at a position roughly consistent with the configuration of the annular convex portion Ka of the wafer W in a plan view, and the annular convex portion Ka of the wafer W is supported by the protrusion 9a, so that the holding table 9 can hold the wafer W without contacting the thin flat concave portion He.

As shown in Fig. 5, the holding table 9 is housed in the lower case 29A constituting the chamber 29, and is connected to one end of a rod 35 passing through the lower case 29A. The other end of the rod 35 is drivably connected to an actuator 37 having a motor or the like. Therefore, the holding table 9 is capable of moving up and down inside the chamber 29.

The lower shell 29A has a frame holding portion 38 surrounding the lower shell 29A. The frame holding portion 38 is configured so that when the annular frame f is placed, the upper surface of the annular frame f is flush with the cylindrical top of the lower shell 29A. In addition, the cylindrical top of the lower shell 29A is preferably subjected to a release treatment.

In addition, as shown in FIG3 , the holding platform 9 is configured to be able to reciprocate between an initial position and an attachment position along a track 40 provided along the front-rear direction together with the lower housing 29A. The initial position is located inside the rectangular portion 1a, which is the position of the holding platform 9 indicated by a solid line in FIG3 . In this initial position, the annular frame f is placed on the holding platform 9.

The attachment position is located inside the protruding portion 1b, which is the position indicated by the dotted line of the holding table 9 in Fig. 3. By moving the holding table 9 to the attachment position, the attachment process of attaching the adhesive tape DT to the wafer W placed on the holding table 9 can be performed.

The frame supply unit 12 is a drawable storage cassette that stores a predetermined number of annular frames f in layers.

As shown in FIG5 , the attachment unit 13 is composed of a sheet supply section 71, a separation film recovery section 72, a sheet attachment section 73, and a sheet recovery section 74. The sheet supply section 71 is provided with a supply bobbin loaded with a raw material roll, and the raw material roll is wound with a supporting adhesive tape DT. In addition, the separation film S is peeled off by a peeling roller 75 during the process of supplying the adhesive tape DT from the supply bobbin of the sheet supply section 71 to the attachment position. In addition, the supply bobbin provided in the sheet supply section 71 is linked to an electromagnetic brake and is applied with an appropriate rotational resistance. Therefore, excessive tape is prevented from being released from the supply bobbin.

The separation film recovery unit 72 is provided with a recovery bobbin for taking up the separation film S peeled off from the adhesive tape DT. The recovery bobbin is configured to be driven and controlled to rotate forward and reverse by a motor.

The sheet attaching section 73 is composed of the chamber 29, a sheet attaching mechanism 81, a sheet cutting mechanism 82, and the like.

The chamber 29 is composed of a lower shell 29A and an upper shell 29B. The lower shell 29A is disposed around the holding platform 9 and reciprocates in the front-rear direction between the initial position and the sealing position together with the holding platform 9. The upper shell 29B is disposed on the protruding portion 1b and is configured to be able to rise and fall.

As shown in Fig. 6, the lower housing 29A and the upper housing 29B are connected to the pressurizing device 32 through the flow path 101. In addition, the flow path 101 on the upper housing 29B side is equipped with an electromagnetic valve 103. In addition, the two housings 29A and 29B are connected to the flow path 109 equipped with electromagnetic valves 105 and 107 for opening to the atmosphere.

In addition, the upper housing 29B is connected to a flow path 111, which has an electromagnetic valve 110 for adjusting the internal pressure of the pressure reduction by leakage. In addition, the opening and closing operations of the electromagnetic valves 103, 105, 107, 110 and the operation of the pressurizing device 32 are performed by the control unit 33.

That is, the pressurizing device 32 is configured to be able to independently adjust the air pressure of the space on the lower housing 29A side and the air pressure of the space on the upper housing 29B side.

The sheet attaching mechanism 81 includes a movable table 84, an attaching roller 85, and a nip roller 86. The movable table 84 moves horizontally along a guide rail 88 arranged in the left-right direction. The attaching roller 85 is supported by a bracket connected to the front end of the cylinder of the movable table 84. The nip roller 86 is arranged on the side of the sheet recovery section 74 and includes a feed roller 89 driven by a motor and a pinch roller 90 raised and lowered by the cylinder.

The sheet cutting mechanism 82 is provided on a lifting drive table 91 for lifting the upper housing 29B, and has a support shaft 92 extending in the z direction and a boss portion 93 rotating around the support shaft 92. The boss portion 93 has a plurality of support arms 94 extending in the radial direction. A disc-shaped cutter 95 for cutting the adhesive tape DT along the ring frame f is provided at the front end of at least one support arm 94 so as to be movable up and down. A push roller 96 is provided at the front end of the other support arms 94 so as to be movable up and down.

The sheet recovery section 74 is provided with a recovery bobbin for winding up the unnecessary adhesive tape DT peeled off after cutting. The recovery bobbin is configured to be driven and controlled to rotate forward and reverse by a motor (not shown).

As shown in FIG4 , the frame recovery unit 6 is equipped with a cassette 41 for collecting the mounting frame MF. The cassette 41 is provided with a longitudinal rail 45 connected and fixed to the device frame 43, and a lifting platform 49 that is raised and lowered along the longitudinal rail 45 by a screw feed method by a motor 47. Therefore, the frame recovery unit 6 is configured to place the mounting frame MF on the lifting platform 49 and lower it by a pinch feed method.

<Overview of Operation> Here, the basic operation of the adhesive sheet attaching device 1 of Embodiment 1 is described. FIG. 7 is a flow chart illustrating a series of processes for attaching the adhesive tape DT to the wafer W using the adhesive sheet attaching device 1.

Step S1 (supply of workpiece) When the attachment instruction is sent, the annular frame f is transferred from the frame supply unit 12 to the frame holding unit 38 of the lower shell 29A, and the wafer W is transferred from the container 5 to the lifting platform 8.

That is, the frame conveying device 17 absorbs the annular frame f from the frame supply portion 12 and transfers it to the frame holding portion 38. When the frame conveying device 17 releases the absorption of the annular frame f and rises, the annular frame f is aligned. For example, the alignment is performed by causing a plurality of support pins vertically arranged around the frame holding portion 38 to move synchronously toward the center. When the frame holding portion 38 holds the annular frame f, the lower shell 29A moves along the track 40 together with the holding table 9 from the initial position to the attachment position on the side of the sheet attaching mechanism 81.

The frame transport device 17 transports the annular frame f, while the wafer transport device 16 inserts the holding arm 23 between the wafers W stored in multiple stages in the container 5. The holding arm 23 holds the wafer W by suction and carries it out to the alignment machine 7. The alignment machine 7 uses the suction pad protruding from the center to suck the center of the wafer W. At the same time, the wafer transport device 16 releases the suction of the wafer W and retreats to the top. The alignment machine 7 holds the wafer W by the suction pad to rotate it, while performing alignment according to the notch, etc.

When the alignment is completed, the suction pad that absorbs the wafer W is protruded from the surface of the aligner 7. The wafer transfer device 16 moves to this position and absorbs and holds the wafer W. The suction pad is released and then lowered.

The wafer transfer device 16 moves to the top of the lifting platform 8, and places the wafer W on the lifting platform 8 with the surface with the protective tape PT attached facing downward. When the lifting platform 8 adsorbs and holds the wafer W, the lifting platform 8 moves along the track 54 from the initial position to the attachment position on the side of the sheet attachment mechanism 81. The state in which the lifting platform 8 and the holding platform 9 each move to the attachment position is shown in FIG. 9.

Step S2 (supply of adhesive sheet) When the workpiece is supplied by the wafer conveyor 16 or the like, the adhesive tape DT is supplied in the attaching unit 13. That is, a predetermined amount of adhesive tape DT is delivered from the sheet supply unit 71 while peeling off the separation film S. The overall long adhesive tape DT is guided to the top of the attaching position along a predetermined conveying path.

Step S3 (first bonding process) When the workpiece and adhesive tape DT are supplied, the first bonding process begins. That is, the control unit 33 drives the actuator 53 to raise the lifting platform 8. As the lifting platform 8 rises, as shown in FIG. 10, the back side of the wafer W contacts the adhesive tape DT, and the back side of the wafer W is covered by the adhesive tape DT.

Through this contact, the back side of the wafer W is adhered to the adhesive layer Tb, and the wafer W is held by the adhesive tape DT. Hereinafter, the wafer W and the adhesive tape DT are integrated as a whole and referred to as a sheet composite M. After the sheet composite M is formed, the adhesive tape DT is fed out by a predetermined amount, whereby the sheet composite M is conveyed toward the top of the holding table 9 as shown in FIG. 11 . While conveying the sheet composite M, the lifting table 8 is lowered and returned to its initial state. By forming the sheet composite M and conveying it to the holding table 9, the first bonding process of step S3 is completed.

Step S4 (Cavity formation) When the sheet composite M is transported to the top of the holding table 9, the attachment roller 85 descends. Then, as shown in FIG12, the adhesive tape DT is attached to the top of the annular frame f and the lower shell 29A while rolling over the adhesive tape DT.

When the adhesive tape DT is attached to the annular frame f, the attaching roller 85 is returned to the initial position and the upper housing 29B is lowered. As the upper housing 29B is lowered, as shown in FIG. 13 , the adhesive tape DT attached to the top of the lower housing 29A is clamped by the upper housing 29B and the lower housing 29A to form the chamber 29.

At this time, the adhesive tape DT functions as a sealing material, and the chamber 29 is divided into two spaces by the adhesive tape DT. That is, the chamber 29 is divided into a lower space H1 on the side of the lower shell 29A and an upper space H2 on the side of the upper shell 29B via the adhesive tape DT. The wafer W in the lower shell 29A is in close proximity with the adhesive tape DT with a predetermined clearance.

Step S5 (Second Attachment Process) After the chamber 29 is formed, the second attachment process is started. First, the control unit 33 controls the actuator 37 to lower the holding table 9 to the initial position. Then, the control unit 33 operates the pressurizing device 32 to supply gas to the lower space H1 and the upper space H2, and pressurizes the lower space H1 and the upper space H2 to a specific value while the solenoid valves 105, 107, and 110 shown in FIG. 6 are closed. As an example of a specific value, 0.3MPa to 0.5MPa can be cited. By performing the pressurizing operation of the pressurizing device 32, the air pressure of the lower space H1 and the air pressure of the upper space H2 both become higher than the atmospheric pressure.

By pressurizing the upper space H2, as shown in FIG. 14, a pushing force V1 is applied from the upper space H2 to the adhesive tape DT. In addition, since the entire upper space H2 is pressurized, the pushing force V1 is applied uniformly to the entire adhesive tape DT. In addition, by pressurizing the entire lower space H1, a pushing force V2 is applied uniformly from the lower space H1 to the lower surface of the wafer W (the surface side of the wafer W in this embodiment). That is, by the action of the pushing force V1 and the pushing force V2, the adhesive tape DT is gradually applied to the back side of the wafer W with good precision. As a result, the adhesion between the wafer W and the adhesive tape DT is improved, so it is possible to prevent the adhesive tape DT from being peeled off from the back side of the wafer W over time.

After the lower space H1 and the upper space H2 are pressurized to a pressure higher than the atmospheric pressure and the pushing force is applied between the adhesive tape DT and the wafer W for a predetermined time, the control unit 33 stops the pressurizing device 32. Then, the control unit 33 sets the electromagnetic valves 103, 105, 107, and 110 to be fully opened to open the lower space H1 and the upper space H2 to the atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29, and raises the holding table 9 so that the surface of the wafer W abuts against the wafer holding surface of the holding table 9. The second attachment process is equivalent to the attachment process of the present invention.

Step S6 (cutting of sheet) In addition, during the process of step S5 in the chamber 29, the sheet cutting mechanism 82 is operated to cut the adhesive tape DT. At this time, as shown in FIG. 15, the cutter 95 cuts the adhesive tape DT attached to the annular frame f into the shape of the annular frame f, and the pressing roller 96 follows the sheet cutting portion of the cutter 95 on the annular frame f while rolling and pressing.

At the point after the upper shell 29B is raised, the second attachment process of step S5 is completed, so the pressure roller 90 is raised to release the clamping of the adhesive tape DT. Then, as shown in FIG. 16 , the clamping roller 86 is moved to continuously reel in the unnecessary adhesive tape DT after being cut to the sheet recovery section 74 for recovery, and a predetermined amount of adhesive tape DT is delivered from the sheet supply section 71. Through each process up to step S6, the sheet complex M is integrated with the annular frame f. As a result, a mounting frame MF is formed in which the annular frame f and the wafer W are integrated through the adhesive tape DT.

When the unnecessary adhesive tape DT is rolled up and recovered, the nip roller 86 and the attaching roller 85 return to the initial position. Then, the holding table 9 moves from the attaching position to the initial position while holding the mounting frame MF.

Step S7 (recovery of mounting frame) When the holding table 9 returns to the initial position, as shown in FIG17 , the adsorption pad 28 provided in the frame conveying device 17 adsorbs and holds the mounting frame MF, so that the mounting frame MF is separated from the lower shell 29A. The frame conveying device 17 that adsorbs and holds the mounting frame MF conveys the mounting frame MF to the frame recovery unit 6. The conveyed mounting frame MF is loaded and stored in the cassette 41.

At this point, one round of action of attaching the adhesive tape DT to the wafer W is completed. Afterwards, the above process is repeated until the number of mounting frames MF reaches a predetermined number. As described above, the sheet composite M in which the adhesive tape DT is closely attached to the wafer W is manufactured by the adhesive sheet attaching device 1. The sheet composite M in which the adhesive tape DT is attached to the wafer W by the second attaching process is equivalent to the semiconductor product of the present invention.

<Effects of the structure of embodiment 1> According to the device of embodiment 1, after the adhesive tape DT is attached to the wafer W by the first attachment process, the second attachment process is performed, thereby attaching the adhesive tape DT in a manner that is more closely attached to the wafer W with better accuracy. In the second attachment process of the present invention, the pressure of the lower space H1 and the upper space H2 is pressurized in a manner that is greater than the atmospheric pressure, thereby attaching the adhesive tape DT to the back of the wafer W with better accuracy.

In the known technology, the pressure inside the chamber is reduced by using a vacuum device, and the adhesive tape is attached to the wafer by the pressure difference generated thereby. However, the pressure difference generated by reducing the pressure from the atmospheric pressure state is below the atmospheric pressure. That is, when the adhesive tape DT is attached to the wafer W by using the pressure difference, there is an upper limit to the force that the adhesive tape DT pushes against the back of the wafer W.

Therefore, in the state where the adhesive tape DT is brought into contact with the wafer W by the pressure difference generated by the decompression, the adhesion between the adhesive tape DT and the wafer W is low. In addition, in the structure of the conventional technology of using the first pushing member for the second attachment, the pushing force can only act on a limited part of the adhesive tape DT. In addition, the magnitude of the pushing force is also insufficient, so it is difficult to improve the adhesion between the adhesive tape DT and the wafer W.

In contrast, in the present invention, a pressurizing device 32 is used to pressurize the upper space H2 and the lower space H1 in the chamber 29 so that the air pressure becomes greater than the atmospheric pressure. That is, in the second bonding process, the pushing pressures V1 and V2 that are sufficiently greater than the pressure difference generated by decompression can act on the adhesive tape DT and the wafer W. In addition, the pushing pressures V1 and V2 are applied to the entire adhesive tape DT attached to the wafer W. Therefore, by performing the second bonding process, the adhesion between the adhesive tape DT and the wafer W can be greatly improved, so that even after a period of time has passed after a series of bonding processes are completed, the adhesive tape DT can be prevented from peeling off from the wafer W.

In addition, in the second attachment process, the magnitude of the pushing forces V1 and V2 can be adjusted to any value by appropriately controlling the pressurizing device 32. Therefore, even if various conditions such as the constituent material of the adhesive material Tb, the size of the wafer W, and the thickness of the annular protrusion Ka change, the adhesive tape DT can be reliably attached to the annular protrusion forming surface of the wafer W by appropriately adjusting the magnitude of the pushing forces V1 and V2. In addition, because the pushing forces V1 and V2 of appropriate magnitude act uniformly throughout the entire adhesive tape DT, it is possible to avoid the occurrence of damage to the wafer W due to excessive pushing force or uneven pushing force. [Example 2]

Hereinafter, the second embodiment of the present invention will be described with reference to the drawings. In the first embodiment, a configuration in which a long adhesive tape DT is attached to the back of a wafer W and an annular frame f and then cut into a predetermined shape corresponding to the shape of a workpiece (here, the shape of the wafer W or the annular frame f) is used as an example for description. In the second embodiment, a configuration in which an adhesive tape having a predetermined shape corresponding to the shape of a workpiece is attached to the workpiece is used as an example for description. In addition, the configuration identical to that of the adhesive sheet attaching device 1 of the first embodiment is limited to being marked with the same component symbols, and the different configuration parts are described in detail.

First, the structure of the adhesive tape DT of Example 2 will be described. Fig. 18(a) is a perspective view showing the back side of the transport sheet P and the adhesive tape DT, and Fig. 18(b) is a longitudinal sectional view of the transport sheet P and the adhesive tape DT.

The adhesive tape DT of the second embodiment is held on the long conveying sheet P as shown in FIG. 18( a). That is, the adhesive tape DT of a predetermined shape is attached to one side of the long conveying sheet P at a predetermined pitch. The adhesive tape DT is pre-cut into a predetermined shape corresponding to the shape of the formation surface (the back side in this embodiment) of the annular convex portion Ka of the wafer W. In the second embodiment, the adhesive tape DT is pre-cut into a circular shape.

As shown in FIG18( b ), the transport sheet P has a structure in which a non-adhesive base material Pa and an adhesive adhesive material Pb are laminated. Examples of materials constituting the base material Pa include polyolefins, polyethylene, etc. Examples of materials constituting the adhesive material Pb include acrylic copolymers, etc. The transport sheet P holds the adhesive tape DT by attaching the base material Ta of the adhesive tape DT to the adhesive material Pb of the transport sheet P. In the present embodiment, the shape of the adhesive tape DT is circular, but it can be changed appropriately according to the shape of the wafer W.

The adhesive sheet sticking device 1 of the second embodiment has the same basic structure as the device of the first embodiment shown in FIGS. 3 to 6. However, the sheet supply section 71 is loaded with a conveying sheet P which has been loaded with a plurality of adhesive tapes DT pre-formed into a predetermined shape. The sheet cutting mechanism 82 cuts the conveying sheet P stuck to the ring frame f. The sheet recovery section 74 is configured to recover the unnecessary conveying sheet P remaining around the mounting frame MF after the conveying sheet P is cut by the sheet cutting mechanism 82.

<Operation of Embodiment 2> Here, the operation of the adhesive sheet attaching device 1 of Embodiment 2 is described. FIG. 19 is a flow chart illustrating a series of processes for attaching the adhesive tape DT to the wafer W using the adhesive sheet attaching device 1 of Embodiment 2. The processes that are the same as the operations of the adhesive sheet attaching device 1 of Embodiment 1 are simplified, and the different processes are described in detail.

Step S1 (supply of workpiece) When the attachment instruction is sent, the wafer W and the annular frame f are supplied as in Example 1. That is, the annular frame f stored in the frame supply unit 12 is transferred to the frame holding unit 38 by the frame conveying device 17. When the frame holding unit 38 holds the annular frame f, the lower shell 29A moves along the track 40 with the holding table 9 from the initial position to the attachment position on the side of the sheet attachment mechanism 81.

Next, the wafer W stored in the container 5 is transferred to the lifting platform 8 via the alignment machine 7 by the wafer transfer device 16. When the lifting platform 8 adsorbs and holds the substrate 10, the lifting platform 8 moves along the track 54 from the initial position to the attachment position on the side of the sheet attachment mechanism 81. The state in which the lifting platform 8 and the holding platform 9 each move to the attachment position is shown in FIG.

Step S2 (supply of adhesive sheet) When the workpiece is supplied by the wafer conveying device 16 or the like, the adhesive tape DT is supplied in the attaching unit 13. That is, a predetermined amount of adhesive tape DT is delivered from the sheet supply unit 71 together with the conveying sheet P while peeling off the separation film S. The conveying sheet P, which is generally long, is guided toward the upper side of the attaching position along a predetermined conveying path. At this time, as shown in FIG. 21, the adhesive tape DT held on the conveying sheet P is positioned so as to be located above the wafer W placed on the lifting table 8.

Step S3 (first attachment process) When the workpiece and wafer W are supplied, the first attachment process is performed as in Example 1. That is, the control unit 33 drives the actuator 53 to raise the lifting platform 8. As the lifting platform 8 rises, as shown in FIG. 22, the back side of the wafer W contacts the adhesive tape DT, and the back side of the wafer W is covered by the adhesive tape DT.

By this contact, the back side of the wafer W is attached to the adhesive layer Tb, and the wafer W is held by the adhesive tape DT. Then, a sheet composite M is produced by integrating the wafer W and the adhesive tape DT. After the sheet composite M is produced, the adhesive tape DT is fed out by a predetermined amount, whereby the sheet composite M is conveyed to the top of the holding table 9 as shown in FIG. 23. While conveying the sheet composite M, the lifting table 8 is lowered and returned to the initial state.

Step S4 (Cavity formation) When the sheet composite M is transported to the top of the holding table 9, the cavity 29 is formed. That is, as shown in FIG24, the attachment roller 85 descends. Then, the conveying sheet P is attached to the top of the annular frame f and the lower shell 29A while rolling on the conveying sheet P. In conjunction with the movement of the attachment roller 85, a predetermined amount of adhesive tape DT is delivered from the sheet supply section 71 together with the conveying sheet P while peeling off the separation film S.

When the conveying sheet P is attached to the annular frame f, the attaching roller 85 is returned to the initial position and the upper housing 29B is lowered. As the upper housing 29B is lowered, as shown in FIG. 25 , the conveying sheet P attached to the top of the lower housing 29A is sandwiched by the upper housing 29B and the lower housing 29A to form a chamber 29. At this time, the conveying sheet P functions as a sealing material, and the chamber 29 is divided into a lower space H1 and an upper space H2 by the conveying sheet P.

Step S5 (Second Attachment Process) After the chamber 29 is formed, the second attachment process is executed as in Example 1. First, the control unit 33 causes the holding table 9 to descend, and causes the pressurizing device 32 to operate to supply gas to the lower space H1 and the upper space H2, and pressurize the lower space H1 and the upper space H2 to a specific value. The pressurizing device 32 performs the pressurizing operation, so that the air pressure of the lower space H1 and the air pressure of the upper space H2 become higher than the atmospheric pressure.

By pressurizing the upper space H2, as shown in FIG. 26, a push force V1 is uniformly applied from the upper space H2 to the adhesive tape DT. In addition, by pressurizing the entire lower space H1, a push force V2 is uniformly applied from the lower space H1 to the downward surface of the wafer W. That is, by the action of sufficiently large forces, namely, the push force V1 and the push force V2, the adhesive tape DT is gradually attached to the back surface of the wafer W with good precision, and the adhesion between the wafer W and the adhesive tape DT is improved.

After the lower space H1 and the upper space H2 are pressurized to a pressure higher than the atmospheric pressure and the pushing force is applied between the adhesive tape DT and the wafer W for a predetermined time, the control unit 33 stops the pressurizing device 32. Then, the control unit 33 sets the electromagnetic valves 103, 105, 107, and 110 to be fully opened to open the lower space H1 and the upper space H2 to the atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29, and raises the holding table 9 so that the surface of the wafer W abuts against the wafer holding surface of the holding table 9.

Step S6 (cutting of the conveying sheet) In addition, during the process of step S5 in the chamber 29, the sheet cutting mechanism 82 is operated. In the second embodiment, the sheet cutting mechanism 82 is different from the process of the first embodiment in that it cuts the conveying sheet P. That is, as shown in FIG. 27, the cutter 95 cuts the conveying sheet P attached to the annular frame f into the shape of the annular frame f, and the pressing roller 96 follows the sheet cutting portion of the cutter 95 on the annular frame f while rolling and pressing.

After the conveying sheet P is cut into a circular shape, the upper shell 29B is raised. At the time when the upper shell 29B is raised, the process of step S5 is completed, so the pressing roller 90 is raised to release the clamping of the adhesive tape DT. Then, as shown in FIG. 28, the clamping roller 86 is moved to continuously reel in the unnecessary conveying sheet P after the cut to the sheet recovery section 74 for recovery, and a predetermined amount of adhesive tape DT is sent out from the sheet supply section 71 together with the conveying sheet P.

Through each process up to step S6, the mounting frame MF is formed. In the mounting frame MF of the second embodiment, the ring frame f and the wafer W are integrated through the adhesive tape DT and the transport sheet P. When the unnecessary transport sheet P is rolled up and recovered, the clamping roller 86 and the attaching roller 85 return to the initial position. Then, the holding table 9 moves from the attaching position to the initial position while holding the mounting frame MF.

Step S7 (recovery of mounting frame) When the holding table 9 returns to the initial position, as shown in FIG. 29 , the adsorption pad 28 provided in the frame conveying device 17 adsorbs and holds the mounting frame MF, so that the mounting frame MF is separated from the lower shell 29A. The frame conveying device 17 adsorbing and holding the mounting frame MF conveys the mounting frame MF to the frame recovery unit 6. The conveyed mounting frame MF is loaded and stored in the cassette 41.

At this point, one round of action of attaching the adhesive tape DT to the wafer W is completed. Thereafter, the above process is repeated until the number of mounting frames MF reaches a predetermined number. By using the adhesive sheet attaching device 1 of Example 2, even when using the adhesive tape DT that has been pre-cut into a predetermined shape, the same effect as that of Example 1 can be obtained. That is, when attaching the adhesive tape DT to the annular protrusion forming surface of the wafer W having the annular protrusion, damage to the wafer W can be avoided and the adhesive tape DT can be attached to the wafer W with good precision.

In addition, the various aspects of the embodiments disclosed in this specification are examples only and are not intended to be limiting. The scope of the present invention is not limited to the above embodiments, but is as shown in the scope of the patent application, and includes all changes (variations) within the scope that are equivalent to the scope of the patent application. For example, the present invention can be implemented as follows.

(2) In step S5 of each embodiment, the pressurizing device 32 pressurizes the interior of both the lower space H1 and the upper space H2, but the present invention is not limited thereto. That is, the pressurizing device 32 may only pressurize the upper space H2 to a pressure higher than atmospheric pressure, so that the adhesive tape DT can be attached with better precision by the push pressure V1.

(3) In step S5 of each embodiment, the pressure inside the chamber 29 is made higher than the atmospheric pressure by using the pressurizing device 32, thereby generating a pushing pressure V1 to make the wafer W closely contact the adhesive tape DT. However, the process of step S5 is not limited to using the chamber 29 as long as it is a configuration that generates a pushing pressure greater than the atmospheric pressure between the adhesive tape DT and the wafer W.

As an example of a configuration in which the chamber 29 is omitted, as shown in FIG. 30 , the following configuration can be cited: a pressing plate 141 is disposed above the holding table 9, and the pressing plate 141 is lowered to press the sealing sheet S, thereby applying a pressing force V1.

The pressing member 141 has a flat bottom surface and is disposed above the adhesive tape DT. Therefore, by lowering the pressing member 141, the flat bottom surface of the pressing member 141 presses the adhesive tape DT, and the adhesive tape DT is deformed into a convex shape to contact the wafer W.

(4) In each embodiment, the structure of attaching the supporting adhesive tape DT to the wafer W is described as an example, but the adhesive sheet attached to the wafer W is not limited to this. As long as the structure of attaching a sheet-shaped adhesive material such as the circuit protection adhesive tape is used as an example, the structure of each embodiment can be applied.

(5) In each embodiment, as a workpiece to which the adhesive sheet is attached, a wafer W and an annular frame f are exemplified, but the workpiece is not limited to this. For example, the annular frame f can be omitted and the adhesive sheet can be attached only to the wafer W. In addition, the structure of this embodiment can be applied to various semiconductor components such as substrates and panels as workpieces. In addition, as for the shape of the workpiece, in addition to a circular shape, it can also be a rectangular shape, a polygonal shape, a roughly circular shape, etc.

(6) In each embodiment, the holding table 9 is moved up and down at a predetermined timing to attach the adhesive tape DT to the wafer W, but the up and down movement of the holding table 9 can be changed as appropriate. For example, the pressurization process in step S5 is not limited to being performed after the holding table 9 is lowered, and the pressurization process can also be performed while maintaining the raised state.

(7) In each embodiment, the frame holding part 38 is disposed outside the lower housing 29A, but the frame holding part 38 may be disposed inside the lower housing 29A. In this case, the process from step S4 onwards is performed with the ring frame f and the wafer W each housed inside the chamber 29.

(8) In Embodiment 2, the adhesive tape DT is pre-molded in a predetermined shape corresponding to the shape of the annular convex portion forming surface of the wafer W, but the present invention is not limited to this. That is, the sheet supply portion 71 can also be loaded with a long adhesive tape DT with a long conveying sheet P added thereto. The structure of the long adhesive tape DT with a long conveying sheet P added thereto is as shown in FIG. 31(a). At this time, the adhesive sheet attaching device 1 is provided with a sheet cutting device 201 upstream of the chamber 29, and the sheet cutting device 201 molds the long adhesive tape DT into a predetermined shape.

The sheet cutting device 201 is configured as shown in FIG31(b). The sheet cutting device 201 includes a support table 203, a cutter 205, and an adhesive sheet collecting unit 207. In addition, the adhesive tape DT and the conveying sheet P fed from the sheet supply unit 71 are turned over by a turning device (not shown) and supplied to the sheet cutting device 201 with the adhesive tape DT on the upper side of the conveying sheet P.

The support table 203 is configured to horizontally receive the long adhesive tape DT and the conveying sheet P at the lower side among the conveying sheets P fed from the sheet supply unit 71 along the direction L. The cutter 205 is disposed above the support table 203 and can be moved up and down by a movable table not shown. As an example of the cutter 205, a circular Thomson blade is used.

As the cutter 205 descends, the adhesive tape DT and the layer of the adhesive tape DT between the conveying sheet P are cut into the shape of a circular track K. The configuration in which the cutter 205 cuts the adhesive tape DT is not limited to this. As another example, a configuration in which the knife-shaped cutter 205 moves along a circular track to cut the adhesive tape DT into a circular shape can be cited.

The adhesive sheet recovery section 207 recovers the unnecessary adhesive tape DTn remaining around the adhesive tape DT cut into a circular shape. The unnecessary part of the adhesive tape DTn is immediately peeled off from the conveying sheet P after passing through the feed roller 208. The peeled adhesive tape DTn is guided to the recovery bobbin 210 by the guide roller 209. The recovery bobbin 201 reels and recovers the adhesive tape DTn peeled off from the conveying sheet P. Therefore, by the sheet cutting device 201, the adhesive tape DT formed into a circular shape by the cutter 205 remains on the conveying sheet P.

The adhesive tape DT cut into a circular shape is guided to the chamber 29 together with the conveying sheet P. The adhesive tape DT and the conveying sheet P are turned over again by a turning device (not shown) downstream of the sheet cutting device 201, and guided to the chamber 29 with the adhesive tape DT under the conveying sheet P.

(9) In each embodiment, as shown in Fig. 32(a), the chamber 29 may also include a sheet-like elastic body Ds. Hereinafter, this modification will be described by taking the structure of the second embodiment as an example.

The elastic body Ds is disposed inside the upper shell 29B and is configured to be in contact with the inner diameter of the upper shell 29B. In addition, the lower surface of the elastic body Ds is configured to be flush with the cylindrical bottom of the upper shell 29B. Therefore, when the lower shell 29A and the upper shell 29B sandwich the transport sheet P to form the chamber 29, the elastic body Ds abuts against the transport sheet P. Specifically, the elastic body Ds abuts against the transport sheet P on the side opposite to the side holding the adhesive tape DT (the upper surface side in the figure). By arranging the elastic body Ds in contact with the inner diameter of the lower shell 29A, the elastic body Ds is not caught when the cavity 29 is formed, thereby preventing the airtightness of the cavity 29 from being reduced by the elastic body Ds. Examples of the material constituting the elastic body Ds include rubber, elastic material, or gel-like polymer material.

By providing the elastic body Ds in the chamber 29, when the adhesive tape DT is deformed into a convex shape in step S4, the curvature of the adhesive tape DT can be made more uniform. Here, the effect of the structure having the elastic body Ds is described. For example, when the adhesive tape DT is made of a relatively hard material, as shown in FIG. 32(b), the curvature of the adhesive tape DT tends to become non-uniform.

That is, in the area P1 of the conveying sheet P where the adhesive tape DT is held, the curvature of the conveying sheet P caused by the pressing force V1 is small due to the presence of the adhesive tape DT. On the other hand, in the area P2 of the conveying sheet P where the adhesive tape DT is not held, the curvature of the conveying sheet P caused by the pressing force V1 is relatively large. That is, the area P2 is more easily deformed by the pressing force V1, thereby further reducing the curvature of the conveying sheet P in the area P1.

In addition, the curvature of the adhesive tape DT becomes larger on the side (periphery) near the area P2 in the adhesive tape DT, and becomes smaller in the center of the adhesive tape DT. As described above, the curvature of the adhesive tape DT and the transport sheet P caused by the push force V1 becomes non-uniform. As a result, the adhesive tape DT attached to the wafer W has a reduced adhesion to the wafer W.

On the other hand, when the elastic body Ds is provided, as shown in FIG32(c), the entire elastic body Ds is uniformly deformed into a convex shape by the pushing force V1. Therefore, the curvature of the conveying sheet P in the region P1 is improved, and the difference between the curvature and the curvature in the region P2 is reduced, so that the curvature of the conveying sheet P and the adhesive tape DT becomes uniform as a whole. That is, the adhesive tape DT becomes easy to deform in accordance with the shape of the annular convex portion forming surface of the wafer W, so that the adhesion between the adhesive tape DT and the wafer W can be further improved.

(10) In each embodiment, a structure for heating the adhesive tape DT may be further provided. As an example of a structure for heating the adhesive tape DT, the sheet attaching mechanism 81 is as shown in FIG. 33(a), and has a heating mechanism 120 inside the upper shell 29B. The heating mechanism 120 has a cylinder 121 and a heating member 123. The cylinder 121 is connected to the upper part of the heating member 123, and the heating member 123 can be raised and lowered inside the chamber 29 by the movement of the cylinder 121. In addition, the heating member 123 does not need to be a structure that can be raised and lowered as long as it can heat the adhesive tape DT.

A heater 125 for heating the adhesive tape DT is buried inside the heating member 123. The heating temperature by the heater 125 is adjusted so as to make the adhesive tape DT soft. An example of the heating temperature is about 50°C to 70°C. The shape of the bottom surface of the heating member 123 can be changed according to the shape of the wafer W. For example, the heating member 123 is formed in a cylindrical shape as a whole.

In addition, it is preferred to use the heating mechanism 120 to heat the upper space H2 before starting step S5. That is, the control unit 33 operates the heater 125 to heat the heating device 123 to a predetermined temperature. The heating device 123 heats the upper space H2 by heat conduction, thereby heating the adhesive tape DT.

The adhesive tape DT becomes soft by heating, so the deformability of the adhesive tape DT generated by the pushing force V1 is improved. That is, when the adhesive tape DT covers the wafer W, the followability of the adhesive tape DT to the wafer W can be further improved. In addition, as shown in FIG. 33( b ), the heating member 123 can be lowered in a manner close to or abutting the adhesive tape DT, so that the heating member 123 directly heats the adhesive tape DT.

(11) In the embodiment, the heating mechanism 120 is disposed on the side of the upper space H2 of the chamber 29 and is configured to heat the upper space H2, but the present invention is not limited thereto. That is, the heating mechanism 120 may also be configured to heat the lower space H1. For example, a heater 125 may be disposed inside the holding table 9, and the heater 125 may heat the lower space H1 to heat the adhesive tape DT. In addition, the heating mechanism 120 may also be configured to heat both the upper space H2 and the lower space H1.

(12) In each embodiment, the sheet composite M is produced by performing the first attaching process of step S3 in the adhesive sheet attaching device 1 as an example for explanation, but the present invention is not limited to a structure in which the sheet composite M is produced inside the adhesive sheet attaching device 1. That is, the following structure may be used: the sheet composite M formed by attaching the wafer W to the adhesive tape DT is produced in advance, and the adhesive tape DT is attached to the wafer W by applying a pressure higher than the atmospheric pressure to the sheet composite M using the adhesive sheet attaching device 1.

1: Adhesive sheet attaching device 3: Wafer transfer mechanism 5: Container 6: Frame recovery unit 7: Alignment machine 8: Lifting platform 9: Holding platform 12: Frame supply unit 13: Attachment unit 16: Wafer transfer device 17: Frame transfer device 23: Holding arm 27: Adsorption plate 28: Adsorption pad 32: Pressurization device 33: Control unit 38: Frame holding unit 71: Sheet supply unit 72: Separation film recovery unit 73: Sheet attaching unit 74: Sheet recovery unit 81: Sheet attaching mechanism 82: Sheet cutting mechanism 85: Attachment roller 86: Clamping roller 95: Cutter f: Ring frame DT: Adhesive tape P: Transport sheet M: Sheet composite MF: Mounting frame Ta: Base material Tb: Adhesive material Pa: Base material Pb: Adhesive material

FIG. 1 is a diagram showing the structure of a semiconductor wafer of Example 1; (a) is a partially cutaway perspective view of a semiconductor wafer, (b) is a perspective view of the back side of a semiconductor wafer, and (c) is a partial longitudinal section view of a semiconductor wafer. FIG. 2 is a longitudinal section view showing the structure of an adhesive sheet of Example 1. FIG. 3 is a top view of an adhesive sheet attaching device of Example 1. FIG. 4 is a front view of an adhesive sheet attaching device of Example 1. FIG. 5 is a front view of an attaching unit of Example 1. FIG. 6 is a longitudinal section view of a chamber of Example 1. FIG. 7 is a flow chart showing the operation of the adhesive sheet attaching device of Example 1. FIG. 8 is a perspective view of a mounting frame of Example 1. FIG. 9 is a diagram for explaining step S2 of Example 1. FIG. 10 is a diagram for explaining step S3 of Example 1. FIG. 11 is a diagram for explaining step S3 of Example 1. FIG. 12 is a diagram for explaining step S4 of Example 1. FIG. 13 is a diagram for explaining step S4 of Example 1. FIG. 14 is a diagram for explaining step S5 of Example 1. FIG. 15 is a diagram for explaining step S6 of Example 1. FIG. 16 is a diagram for explaining step S6 of Example 1. FIG. 17 is a diagram for explaining step S7 of Example 1. FIG. 18 is a diagram showing the structure of the adhesive sheet and the conveying sheet of Example 2; (a) is a three-dimensional diagram of the back side of the adhesive sheet and the conveying sheet, and (b) is a longitudinal cross-sectional diagram of the adhesive sheet and the conveying sheet. FIG. 19 is a flow chart showing the operation of the adhesive sheet attaching device of Example 2. FIG. 20 is a diagram illustrating step S1 of Example 2. FIG. 21 is a diagram illustrating step S2 of Example 2. FIG. 22 is a diagram illustrating step S3 of Example 2. FIG. 23 is a diagram illustrating step S3 of Example 2. FIG. 24 is a diagram illustrating step S4 of Example 2. FIG. 25 is a diagram illustrating step S4 of Example 2. FIG. 26 is a diagram illustrating step S5 of Example 2. FIG. 27 is a diagram illustrating step S6 of Example 2. FIG. 28 is a diagram illustrating step S6 of Example 2. FIG. 29 is a diagram illustrating step S7 of Example 2. FIG. 30 is a diagram illustrating the structure of a variant. FIG. 31 is a diagram illustrating the structure of a variant; (a) is a longitudinal sectional view showing the structure of the adhesive tape and the conveying sheet of the variant, and (b) is a longitudinal sectional view illustrating the structure of the sheet cutting device of the variant. FIG. 32 is a diagram illustrating a configuration of a modified example; (a) is a longitudinal cross-sectional view showing a configuration of an elastic body having a modified example, (b) is a diagram illustrating a problem that may occur in a configuration without an elastic body, and (c) is a diagram illustrating an advantage of a configuration having an elastic body. FIG. 33 is a diagram illustrating a configuration of a modified example; (a) is a longitudinal cross-sectional view showing a configuration of a heating mechanism having a modified example, and (b) is a longitudinal cross-sectional view illustrating an example of a process of heating an adhesive tape by a heating mechanism.

9: Holding table

29: Chamber

29A: Lower housing

35: Rod

37: Actuator

DT: Adhesive tape

f: Ring frame

H1: Lower space

H2: Upper space

He: flat concave part

Ka: annular convex part

Kf: Inner corner

V1: Pushing force

V2: Pushing force

W: Wafer

Claims (8)

A method for attaching an adhesive sheet is characterized by comprising: an attaching process, wherein an adhesive sheet is attached to a sheet composite body formed by attaching an annular protrusion forming surface of a workpiece having an annular protrusion on the outer periphery of one side, and a pressure higher than atmospheric pressure is applied in a direction from the adhesive sheet toward the workpiece, thereby attaching the adhesive sheet to the annular protrusion forming surface. The adhesive sheet attaching method of claim 1 includes a receiving process of the sheet composite being received in a chamber; the attaching process is to attach the adhesive sheet to the annular convex portion forming surface by increasing the pressure of the internal space of the chamber after the receiving process. As in claim 2, the adhesive sheet attaching method, wherein the chamber has an upper shell and a lower shell; the attaching process includes: an upper and lower space forming process, in which the upper shell and the lower shell are used to clamp the adhesive sheet, thereby dividing the internal space of the chamber into a lower space for arranging the workpiece with the annular protrusion forming surface facing upward, and an upper space opposite to the lower space through the adhesive sheet; and a space pressurizing process, in which at least the upper space of the upper space and the lower space is pressurized, thereby attaching the adhesive sheet to the annular protrusion forming surface. As in claim 2, the adhesive sheet attaching method, wherein the adhesive sheet has a predetermined shape corresponding to the annular convex portion forming surface of the workpiece, and is held on a long conveying sheet; the chamber has an upper shell and a lower shell; the attaching process comprises: an upper and lower space forming process, in which the upper shell and the lower shell are used to clamp the conveying sheet, thereby dividing the internal space of the chamber into a lower space for arranging the workpiece with the annular convex portion forming surface facing upward, and an upper space opposite to the lower space via the adhesive sheet held on the conveying sheet; and a space pressurizing process, in which at least the upper space of the upper space and the lower space is pressurized, thereby attaching the adhesive sheet to the annular convex portion forming surface. As in claim 3, the adhesive sheet attaching method comprises a sheet-like elastic body disposed inside the upper shell; the sheet-like elastic body is disposed in such a manner that the upper shell and the lower shell clamp the adhesive sheet during the formation of the upper and lower spaces, thereby making the sheet-like elastic body abut against the adhesive sheet. The adhesive sheet attaching method of any one of claims 3 to 5 includes a heating process for heating the adhesive sheet by heating at least one of the lower space and the upper space; the attaching process is to apply a pressure higher than atmospheric pressure to the adhesive sheet heated by the heating process, thereby attaching the adhesive sheet to the annular convex portion forming surface. An adhesive sheet attaching device is characterized by having: an attaching mechanism, a sheet composite body formed by attaching an adhesive sheet to the annular convex portion forming surface of a workpiece having an annular convex portion on the outer periphery of one side, and applying a pressure higher than atmospheric pressure in the direction from the adhesive sheet toward the workpiece, thereby attaching the adhesive sheet to the annular convex portion forming surface. A method for manufacturing a semiconductor product is to manufacture a semiconductor product in which an adhesive sheet is attached to the annular convex portion forming surface of a workpiece having an annular convex portion on the periphery of one side. The method for manufacturing the semiconductor product is characterized by comprising: a bonding process, in which a pressure higher than atmospheric pressure is applied from the adhesive sheet toward the workpiece to a sheet composite body formed by attaching the adhesive sheet to the annular convex portion forming surface of the workpiece, thereby attaching the adhesive sheet to the annular convex portion forming surface.