JP2017050388A - Protective tape sticking method and protective tape sticking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately attach a protective tape to a semiconductor wafer by utilizing a differential pressure in a chamber. SOLUTION: A protective tape larger than the inner diameter of the chamber is attached to one joint of a pair of first housings and a second housing constituting the chamber. With the protective tape sandwiched between the joints of the first housing and the second housing, a chamber is formed while the semiconductor wafers are close to each other on the adhesive surface of the protective tape, the pressure is reduced to a predetermined pressure, and the protective tape is pressed by the pressing member. And attach it to the central part of the semiconductor wafer. After that, the pressing of the protective tape by the pressing member is released, and the protective tape is radially attached from the center side to the outer periphery of the semiconductor wafer while lowering the air pressure in the space of the second housing than that of the space of the first housing. [Selection diagram] Fig. 6

Description

  The present invention relates to a protective tape attaching method and a protective tape attaching apparatus for attaching a protective tape to a circuit forming surface of a semiconductor wafer.

  A semiconductor wafer (hereinafter referred to as “wafer” as appropriate) has circuit patterns of a large number of elements formed on the surface thereof. For example, bumps and fine circuits are formed on the wafer surface. Therefore, a protective tape is affixed in order to prevent contamination and damage of the circuit surface during back grinding and transport.

  The method of applying the protective tape is performed so that a uniform tension is applied in the longitudinal direction and the width direction of the belt-shaped protective tape. That is, a protective tape is sandwiched between the upper and lower pair of chambers formed by the housing, and a differential pressure is generated in the two spaces partitioned by the protective tape. At this time, the protective tape is affixed while being elastically deformed toward the wafer arranged so as to face and face the protective tape.

  Thereafter, unevenness generated on the base material on the surface of the protective tape due to the influence of unevenness such as bumps on the wafer surface is pressed and flattened by a pressing plate provided in the chamber (see Patent Document 1).

JP 2014-49626 A

  In the conventional method, when a differential pressure is generated in the two spaces in the chamber, it is considered that the protective tape is recessed and curved in the direction of low atmospheric pressure, and the protective tape is radially attached from the center of the wafer. It was. However, after applying the protective tape, entrapment of bubbles was confirmed at the adhesive interface in the central region of the wafer.

  The bubbles cause a problem that the wafer expands due to friction during grinding of the back surface of the wafer and damages the wafer.

  The present invention has been made in view of such circumstances, and when a protective tape is applied to a semiconductor wafer using a differential pressure in a chamber, there is no entrainment of bubbles at the adhesive interface between the protective tape and the semiconductor wafer. Is mainly intended to provide a protective tape attaching method and a protective tape attaching apparatus for attaching the protective tape with high accuracy.

  Therefore, the present inventors have obtained the following knowledge by repeatedly conducting experiments and simulations in order to find out the cause of bubble entrainment at the bonding interface.

  First, as shown in FIG. 23, after the two spaces are simultaneously depressurized to the same pressure while the protective tape PT is sandwiched between the upper housing 100A and the lower housing 100B as in the prior art, the leak valve 101 provided on the upper housing 100A side is provided. To increase the pressure in the space. That is, the pressure on the lower housing 100B side is lower than the pressure on the upper housing 100A. At this time, the flow of gas flowing in is restricted by the pressing plate 103 provided in the chamber in order to flatten the base material, and after flowing along the inner wall of the upper housing 100A, between the pressing plate 103 and the protective tape PT. It turned out to flow into the center side. That is, since the protective tape PT is first attached to the outer peripheral side of the wafer W and then attached toward the center, the wafer W after the protective tape PT is attached has a central portion as shown in FIG. A space was formed in which bubbles were involved in the adhesive interface.

  In order to solve such a problem, the present invention has the following configuration.

That is, a protective tape attaching method for attaching a protective tape to a circuit forming surface of a semiconductor wafer,
A first pasting step of pasting the protective tape larger than the inner diameter of the chamber to one joint of the pair of first housing and second housing constituting the chamber;
A chamber is formed while a semiconductor wafer is placed in close proximity to the adhesive surface of the protective tape with the protective tape sandwiched between the joints of the first housing and the second housing, and the two spaces partitioned by the protective tape are decompressed. Depressurizing process,
A second pasting process in which the central portion of the protective tape is pressed with a pressing member to be stuck to the central portion of the semiconductor wafer;
Release process of releasing the pressing of the protective tape by the pressing member,
A third pasting step in which the protective tape is radially pasted from the center side of the semiconductor wafer toward the outer periphery while lowering the air pressure in the space of the second housing for storing and holding the semiconductor wafer lower than the space of the first housing;
It is provided with.

  (Operation / Effect) According to the above method, after the two spaces in the chamber are depressurized to, for example, vacuum, the center of the protective tape is pressed by the pressing member and attached to the center of the semiconductor wafer. At this time, since the protective tape is elastically deformed into a concave curved shape starting from the center of the semiconductor wafer, the protective tape is moved from the center side of the semiconductor wafer to the outer periphery as the pressure of the second housing is lowered. It will be pasted towards. Therefore, it is possible to attach the protective tape to the wafer with high accuracy without entrapment of bubbles at the central adhesive interface of the semiconductor wafer.

  In the second attaching process, the protective tape is preferably attached to the semiconductor wafer while being elastically deformed in the process of pressing a pressing member made of a hemispherical elastic body against the protective tape.

  According to this method, it becomes easy to elastically deform the protective tape into the concave curved shape. That is, during the third sticking process, it is possible to reliably prevent the protective tape from sticking to the outer periphery of the semiconductor wafer first.

  The present invention has the following configuration in order to solve such a problem.

That is, a protective tape attaching apparatus for attaching a protective tape to a circuit forming surface of a semiconductor wafer,
A holding table for holding the semiconductor wafer;
A chamber comprising a pair of housings for housing the holding table;
A tape supply section for supplying a protective tape larger than the inner diameter of the housing;
A first pasting mechanism for pasting a protective tape to one joint of the housing;
A second attaching mechanism for attaching the protective tape to the central portion of the semiconductor wafer by pressing the central portion of the protective tape in proximity to the semiconductor wafer placed on the holding table in the chamber with a pressing member;
A third pasting mechanism for creating a differential pressure in the two spaces in the chamber partitioned by the protective tape and pasting the protective tape radially toward the outer periphery of the semiconductor wafer;
A cutting mechanism for cutting the protective tape along the outer shape of the semiconductor wafer;
A peeling mechanism for peeling off the protective tape cut out in the shape of the semiconductor wafer;
A tape recovery unit for recovering the protective tape after peeling;
It is provided with.

  (Operation / Effect) According to the above configuration, the protective tape can be attached to the central portion of the semiconductor wafer by the pressing member provided in the chamber. That is, the protective tape can be applied from the central portion of the semiconductor wafer toward the outer periphery by generating a differential pressure in the chamber in a state where the protective tape is elastically deformed into the concave curve. Therefore, the above method can be suitably performed.

  In addition, it is preferable that the press member with which the 1st sticking mechanism was equipped is the hemispherical shape which consists of an elastic body.

  According to the protective tape application method and the protective tape application device of the present invention, air bubbles can be prevented from being caught at the adhesive interface between the protective tape and the semiconductor wafer, and the protective tape can be applied to the semiconductor wafer while applying a uniform tension. it can.

It is a front view which shows the whole protective tape sticking apparatus. It is a top view which shows the whole protective tape sticking apparatus. It is a front view which shows the structure around a rotation drive mechanism. It is a front view which shows the structure of a chamber. It is a longitudinal cross-sectional view which shows the structure of a chamber. It is a flowchart which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a top view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is a top view which shows operation | movement of an Example apparatus. It is a front view which shows operation | movement of an Example apparatus. It is an enlarged front view which shows the masking tape sticking operation | movement to a wafer center part. It is an enlarged front view which shows the masking tape sticking operation | movement to a wafer center part. It is an enlarged front view which shows the protective tape sticking operation | movement to a wafer outer periphery. It is an enlarged front view which shows the protective tape sticking operation | movement to a wafer outer periphery. It is a front view which shows the cutting | disconnection operation | movement of a protective tape. It is a front view which shows the cutting | disconnection operation | movement of a protective tape. It is a front view which shows operation | movement of an Example apparatus. It is a front view which shows the peeling operation | movement of an unnecessary tape. It is a front view which shows the peeling operation | movement of an unnecessary tape. It is a figure which shows the flow of the gas which flows in into the chamber of a prior art example. It is a longitudinal cross-sectional view of the wafer which affixed the protective tape by the prior art example.

  An embodiment of the present invention will be described below with reference to the drawings. In the present embodiment, a case where a protective tape for surface protection is applied to a circuit forming surface of a semiconductor wafer having convex portions such as bumps (hereinafter simply referred to as “wafer”) will be described as an example.

  FIG. 1 is a front view showing an overall configuration of a protective tape attaching device according to an embodiment of the present invention, and FIG. 2 is a plan view of the protective tape attaching device.

  The protective tape attaching device includes a wafer supply / recovery unit 1, a wafer transport mechanism 2, an alignment stage 3, a tape supply unit 4, a sticking unit 5, a tape cutting mechanism 6, a chamber 7 sticking unit 8, a peeling unit 9, and a tape collecting unit 10. Etc. are provided. Hereinafter, a specific configuration of each of the structural units and mechanisms will be described.

  Two cassettes C 1 and C 2 are placed in parallel on the wafer supply / recovery unit 1. In each cassette C, a plurality of wafers W are inserted and stored in multiple stages in a horizontal posture with the circuit formation surface (front surface) facing upward.

  The wafer transfer mechanism 2 includes two robot arms 11A and 11B. Both the robot arms 11A and 11B are configured to be able to move forward and backward horizontally, and can be turned and raised as a whole. The robot arms 11A and 11B are provided with a horseshoe-shaped vacuum suction type wafer holder at the tips of the robot arms 11A and 11B. The wafer holding unit is inserted into a gap between the wafers W stored in multiple stages in the cassette C, and holds the wafer W by suction from the back surface. The wafer W held by suction is pulled out of the cassette C and conveyed in the order of the alignment stage 3, the holding table 37, and the wafer supply / collection unit 1.

  The alignment stage 3 is configured to align the wafer W loaded and placed by the wafer transfer mechanism 2 based on notches and orientation flats formed on the outer periphery thereof.

  The tape supply unit 4, the pasting unit 5, the separator collecting unit 12, and the cutting unit 23 are mounted on the same vertical plate 14 as shown in FIG. The vertical plate 14 moves horizontally along the upper frame 16 via the movable table 15.

  In the tape supply unit 4, a roll-wrapped wide protective tape PT is loaded on the supply bobbin 17, and the protective tape PT with the separator s drawn from the supply bobbin 17 is wound around the guide roller 18 group. The protective tape PT from which the separator s has been peeled off is guided to the affixing unit 5. Further, the supply bobbin 17 is provided with an appropriate rotational resistance so that excessive tape feeding is not performed.

  The separator collection unit 12 is configured such that a collection bobbin 19 that takes up the separator s peeled from the protective tape PT is rotationally driven in the take-up direction.

  As shown in FIG. 3, the pasting unit 5 includes a peeling member 20, a lifting roller 21, and a pasting roller 22. The pasting unit 5 corresponds to the first pasting mechanism of the present invention.

  The peeling member 20 is a plate having an edge with a sharp tip. The separator s is folded back and the protective tape PT is peeled off by the peeling member 20 whose edge is inclined downward. That is, the protective tape PT protrudes forward from the peeling member 20.

  The elevating roller 21 holds the protective tape PT in a timely manner in cooperation with the peeling member 20.

  The affixing roller 22 presses the front end of the protective tape PT protruding from the front end of the peeling member 20 and affixes it to the joint portion 70 of the lower housings 33B and 33C described later.

  The cutting unit 23 includes a movable table 25 that moves along a frame 24 provided on the front side of the peeling member 20, and a cutter 26 at a lower portion of the movable table 25 via a cutter holder. That is, the cutting unit 23 cuts the protective tape PT in the width direction.

  As shown in FIGS. 1 and 2, the tape cutting mechanism 6 includes a cutter unit via a support arm 29 that extends in the radial direction at the lower end of the end of the arm that is cantilevered from a movable base 28 that can be moved up and down along the frame 27. 30. The cutter unit 30 is mounted with a cutter 31 with a cutting edge facing downward via a cutter holder. The cutter unit 30 can adjust the turning radius via the support arm 29.

  The chamber 7 is constituted by a pair of upper and lower housings having an inner diameter smaller than the width of the protective tape T. In the present embodiment, one upper housing 33A and two lower housings 33B and 33C are provided.

  As shown in FIG. 4, the lower housings 33 </ b> B and 33 </ b> C are connected and fixed to a rotation shaft 35 of a rotary drive machine 34 such as a motor, and are respectively provided at both ends of the turning arm 36. That is, for example, when one lower housing 33B forms the upper housing 33A and the chamber 7, the other lower housing 33C is configured to be positioned at the tape application position on the application unit 5 side. Further, the upper and lower surfaces of the lower housings 33B and 33C are subjected to mold release processing such as fluorine processing.

  A holding table 37 that can be raised and lowered is provided in the lower housings 33B and 33C. The holding table 37 is connected to a rod 38 that passes through the lower housings 33B and 33C. The other end of the rod 38 is drivingly connected to an actuator 39 made of a motor or the like. Accordingly, the holding table 37 moves up and down in the lower housings 33B and 33C. A heater 49 is embedded in the holding table 37.

  The upper housing 33A is provided in the elevating drive mechanism 40. The elevating drive mechanism 40 includes a movable frame 43 that can be moved up and down along a rail 42 that is vertically disposed on the back of a vertical wall 41, a movable frame 44 that is supported by the movable platform 43 so that the height can be adjusted, and the movable frame An arm 45 extending forward from 44 is provided. An upper housing 33 </ b> A is mounted on a support shaft 46 that extends downward from the tip of the arm 45.

  The movable base 43 is moved up and down by screw feed 47 by rotating the screw shaft 47 forward and backward by a motor 48.

  As shown in FIG. 5, the upper and lower housings 33 </ b> A to 33 </ b> C are connected to a vacuum device 51 through a flow path 50. An electromagnetic valve 52 is provided in the flow path 50 on the vacuum device 51 side. The flow path 50 includes an electromagnetic valve 53 in a flow path branched to the upper housing 33A toward the downstream side, and an electromagnetic valve 54 in a flow path branched to the lower housing 33B. Further, the flow path 50 includes a leak valve 55. The operation of opening and closing the electromagnetic valves 52, 53 and 54 and the leak valve 55 and the operation of the vacuum device 51 are performed by the control unit 60. The upper housing 33A and the lower housing 33B are provided with a vacuum gauge 56. The detection result of the vacuum gauge 56 is transmitted to the control unit 60.

  The affixing unit 8 includes a pressing member 61 in the upper housing 33A. The pressing member 61 has a substantially hemispherical shape made of an elastic body. A cylinder 62 is connected to the upper portion of the pressing member and moves up and down in the upper housing 33A. The pasting unit 8 corresponds to the second pasting mechanism of the present invention.

  As shown in FIGS. 1, 2, and 19, the peeling unit 9 includes a movable table 65 that moves horizontally along the guide rail 64, a fixed receiving piece 66 that moves up and down on the movable table 65, and the fixed receiving piece. 66 and a movable piece 68 that is opened and closed by a cylinder 67 is provided. That is, the peeling unit 9 grips and peels one end side of the unnecessary protective tape PT cut into the shape of the wafer W by the tape cutting mechanism 6 by the fixed receiving piece 66 and the movable piece 68.

  A recovery container 69 for recovering the protective tape PT peeled off by the peeling unit 9 is disposed in the tape collecting unit 10 at the peeling end end side of the peeling unit 9.

  Next, a single operation of attaching the protective tape PT to the wafer W by the above-described embodiment apparatus will be described with reference to the flowchart shown in FIG. 6 and FIGS.

  First, the wafer W is unloaded from the cassette C 1 by the robot arm 11 A and placed on the alignment stage 3. After alignment with the alignment stage 3, the wafer W is transferred to the holding table 37 at the tape application position by the robot arm 11A (step S1).

  As shown in FIG. 7, the holding table 37 receives the wafer W by pushing up a plurality of support pins 71 higher than the top portion 70 (joint portion) of the lower housing 33 </ b> B. The support pins 71 that have received the wafer W are lowered, and the wafer W is sucked and held by the holding surface of the holding table 37. At this time, the surface of the wafer W is at a position lower than the bonding portion 70 (step S2).

  As shown in FIG. 8, the pasting unit 5 is moved to the pasting start end. The protective tape PT is protruded from the peeling member 20 by a predetermined length while synchronizing the supply and winding of the protective tape PT. The affixing roller 22 is lowered and the end of the protective tape PT is affixed to the joint 70 of the lower housing 33B (step S3). Thereafter, the protective tape PT is attached to the entire surface of the joint 70 while moving the attaching unit 5. At this time, the surface of the wafer W and the adhesive surface of the protective tape PT are close to each other with a predetermined clearance. Step S3 corresponds to the first pasting process of the present invention.

  The pasting unit 5 stops at a position exceeding a predetermined distance from the joining portion 70 on the pasting end side. The cutting unit 23 operates, and the cutter 26 cuts the rear end side of the protective tape PT in the width direction as shown in FIGS. 9 and 10 (step S4). That is, the protective tape PT is cut into sheets. 8 and 9 and FIG. 15 to be described later are illustrated by rotating the lower housing 33B described on the left side by 90 degrees so that the tape attaching operation by the attaching unit 5 can be easily understood.

  As shown in FIGS. 11 and 12, the rotary drive 34 is operated to pivot the lower housing 33B below the upper housing 33A. At this time, the lower housing 33C attached to the other end side of the swivel arm 36 moves to the tape attaching position.

  As shown in FIG. 13, the upper housing 33A is lowered and the protective tape PT is sandwiched between the lower housing 33B to form the chamber 7 (step S5).

  The leak valve 55 is closed and the electromagnetic valve 52-54 is opened to operate the vacuum device 51 to start depressurization of both the upper housing 33A and the lower housing 33B (step S6). At this time, the opening degree of the electromagnetic valves 53 and 54 is adjusted so that the space between the housings 33A and 33B is depressurized at the same speed.

  Here, the pressure in both spaces is sequentially detected by the vacuum gauge 56 until the spaces in both housings 33A and 33B are depressurized to the same predetermined pressure (for example, in a vacuum state) (step S7). The controller 60 compares the detection result from the vacuum gauge 56 with a predetermined reference value of atmospheric pressure. Therefore, when the measured value reaches the reference value, the control unit 60 closes the electromagnetic valves 52-54 and stops the operation of the vacuum device 51 (step S8).

  The control unit 60 operates the pasting unit 8. That is, as shown in FIG. 14, the controller 60 lowers the pressing member 61 and presses the protective tape PT from the tip. At this time, the protective tape PT is affixed in a predetermined length radially from the center of the wafer W toward the outer periphery while being concavely curved along the surface of the hemispherical pressing member 61 (step S9). When the process of attaching the protective tape PT to the central portion of the wafer W is completed, the pressing member 61 returns to the upper standby position. Step S9 corresponds to the second pasting process of the present invention.

  Thereafter, the opening of the leak valve 55 is adjusted to increase the space of the upper housing 33A to a predetermined atmospheric pressure. At this time, as shown in FIG. 15, since the protective tape PT has already been elastically deformed into a concavely curved shape, the pressure in the space of the lower housing 33B is made lower than the pressure in the space of the upper housing 33A. As shown in FIGS. 16 and 17, the protective tape PT is drawn into the lower housing 33B from the central portion of the wafer W toward the outer periphery, and is radially attached to the wafer W disposed in proximity. (Step S10).

  In the process of attaching the protective tape PT to the wafer W, the actual measurement value by the vacuum gauge 56 is sent to the control unit 60. When the actual measured value of the pressure in the space of the upper housing 33A reaches a preset target value of the pressure (step S11), the control unit 60 protects the protective tape PT until a predetermined time elapses with the leak valve 55 closed. Is pressurized (step S12). Steps S10 to S11 correspond to the third pasting process of the present invention.

  The control unit 60 opens the electromagnetic valves 53 and 54 after a predetermined time has elapsed to make the air pressure in the upper housing 33A and the lower housing 33B the same (step S13). Also at this time, the pressure inside the upper housing 33A and the lower housing 33B is monitored by the vacuum gauge 56.

  When the atmospheric pressure in the upper housing 33A and the lower housing 33B becomes the same, the control unit 60 returns both spaces to atmospheric pressure while adjusting the opening degree of the leak valve 55. Thereafter, the upper housing 33A is raised and released to the atmosphere (step S14).

  While the protective tape PT is stuck on the wafer W in the chamber 7, the robot arm 11B carries it out of the cassette C2. After the wafer W is sucked and held by the holding table 37 in the lower housing 33C, as shown in FIG. 18, the protective tape PT is attached to the joint portion 70 of the lower housing 33C.

  When the sticking process of the protective tape PT to the wafer W in the chamber 7 formed by the upper and lower housings 33A and 33B and the sticking process of the protective tape PT to the lower housing 33C by the sticking unit 5 are completed, as shown in FIG. The revolving arm 36 is reversed. That is, one lower housing 33B is moved to the tape applying position on the attaching unit 5 side, and the other lower housing 33C is moved to the joining position below the upper housing 33A.

  As shown in FIG. 20, the tape cutting mechanism 6 is operated, the cutter unit 30 is lowered to a predetermined height, and the cutter 31 is pierced into the protective tape PT between the wafer W and the lower housing 33B. In this state, the protective tape PT is cut along the outer periphery of the wafer W (step S15). At this time, the surface of the protective tape PT is kept horizontal. When the cutting of the protective tape PT is completed, the cutter unit 30 moves up and returns to the standby position.

  The peeling unit 9 is moved to the peeling start position. As shown in FIG. 21, both end sides of the protective tape PT protruding from the lower housing 33 </ b> B are sandwiched between the fixed receiving piece 66 and the movable piece 68. As shown in FIG. 22, after moving a predetermined distance obliquely upward in that state, the unnecessary protective tape PT cut out in a wafer shape is peeled off while horizontally moving (step S14).

  When the peeling unit 9 reaches the tape recovery unit 10, the gripping of the protective tape PT is released and the protective tape PT is dropped into the recovery container 69.

  The wafer W to which the protective tape PT is attached is stored in the original position of the cassette C1 by the robot arm 11A.

  While the protective tape PT on the lower housing 33B side is cut and peeled off, the protective tape PT is attached to the wafer on the lower housing 33C side. This completes one round of the sticking operation of the protective tape T to the wafer W, and thereafter the same processing is repeated.

  According to the above-described embodiment apparatus, the protective tape PT is attached in advance to the central portion of the wafer W by the pressing member 61 in the vacuum chamber 7 and is elastically deformed into the concave curved shape. When the air pressure is increased by leaking, the protective tape PT is drawn radially toward the lower housing 33B from the central portion toward the outer periphery. Therefore, it is possible to prevent air bubbles from being caught in the adhesive interface between the wafer W and the protective tape PT.

  The present invention can also be implemented in the following forms.

  (1) In the above implementation apparatus, the pressing member 61 is not limited to a hemispherical shape, and may be any member that can be attached in advance by a predetermined length (diameter) of the central portion of the semiconductor wafer. For example, a plate and a cylinder smaller than the diameter of the wafer W may be used.

  (2) In the above implementation apparatus, a heater may be embedded in the pressing member 61, and the protective tape PT may be attached while being heated to a predetermined temperature.

  According to this configuration, the protective tape PT can be formed into a concave curved shape in a short time.

DESCRIPTION OF SYMBOLS 4 ... Tape supply part 5 ... Sticking unit 6 ... Tape cutting mechanism 7 ... Chamber 8 ... Sticking unit 9 ... Peeling unit 10 ... Tape collection | recovery part 20 ... Peeling member 22 ... Sticking roller 23 ... Cutting unit 33A ... Upper housing 33B, 33C ... Lower housing 37 ... Holding table 60 ... Control part PT ... Protective tape W ... Semiconductor wafer

Claims (4)

A protective tape attaching method for attaching a protective tape to a circuit forming surface of a semiconductor wafer,
A first pasting step of pasting the protective tape larger than the inner diameter of the chamber to one joint of the pair of first housing and second housing constituting the chamber;
A chamber is formed while a semiconductor wafer is placed in close proximity to the adhesive surface of the protective tape with the protective tape sandwiched between the joints of the first housing and the second housing, and the two spaces partitioned by the protective tape are decompressed. Depressurizing process,
A second pasting process in which the central portion of the protective tape is pressed with a pressing member to be stuck to the central portion of the semiconductor wafer;
Release process of releasing the pressing of the protective tape by the pressing member,
A third pasting step in which the protective tape is radially pasted from the center side of the semiconductor wafer toward the outer periphery while lowering the air pressure in the space of the second housing for storing and holding the semiconductor wafer lower than the space of the first housing;
A protective tape affixing method characterized by comprising: In the protective tape affixing method according to claim 1,
In the second pasting process, the protective tape is pasted on the semiconductor wafer while elastically deforming the pressing member made of a hemispherical elastic body. A protective tape attaching device for attaching a protective tape to a circuit forming surface of a semiconductor wafer,
A holding table for holding the semiconductor wafer;
A chamber comprising a pair of housings for housing the holding table;
A tape supply section for supplying a protective tape larger than the inner diameter of the housing;
A first pasting mechanism for pasting a protective tape to one joint of the housing;
A second attaching mechanism for attaching the protective tape to the central portion of the semiconductor wafer by pressing the central portion of the protective tape in proximity to the semiconductor wafer placed on the holding table in the chamber with a pressing member;
A third pasting mechanism for creating a differential pressure in the two spaces in the chamber partitioned by the protective tape and pasting the protective tape radially toward the outer periphery of the semiconductor wafer;
A cutting mechanism for cutting the protective tape along the outer shape of the semiconductor wafer;
A peeling mechanism for peeling off the protective tape cut out in the shape of the semiconductor wafer;
A tape recovery unit for recovering the protective tape after peeling;
A protective tape affixing device characterized by comprising: In the protective tape affixing device according to claim 3,
The pressing member provided in the first pasting mechanism has a hemispherical shape made of an elastic body.

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