TWI882126B - Display device - Google Patents

Abstract

A display device includes a plurality of pixels. Each of the pixels includes a plurality of primary bonding regions and at least one reserved bonding region. Each of the reserved bonding region is connected to the primary bonding regions. A number of the at least one of the reserved bonding region is less than a number of the primary bonding regions.

Description

Display device

The present disclosure relates to a display device.

Display devices have been widely used in electronic devices such as mobile phones, televisions, monitors, tablet computers, car displays, wearable devices, and desktop computers. With the rapid development of electronic products, the requirements for display quality on electronic products are getting higher and higher, making display devices continue to improve towards light, thin, short, small, frameless, larger or higher resolution display effects. In high-transmittance or high-resolution display devices, due to the continuous reduction in the size of the display device, there will be a problem of insufficient wiring space or reserved repair space.

The present disclosure is directed to a display device having good visual effect or display quality.

According to an embodiment of the present disclosure, a display device includes a plurality of pixels. Each of the plurality of pixels includes a plurality of main junction areas and at least one backup junction area. Each of the at least one backup junction area is connected to the plurality of main junction areas, and the number of the at least one backup junction area is less than the number of the plurality of main junction areas.

The present disclosure can be understood by referring to the following detailed description and the accompanying drawings. It should be noted that, in order to make it easier for readers to understand and for the simplicity of the drawings, the multiple drawings in the present disclosure only depict a portion of the electronic device, and the specific components in the drawings are not drawn according to the actual scale. In addition, the number and size of each component in the figure are only for illustration and are not used to limit the scope of the present disclosure.

Certain terms are used throughout the specification and the claims that follow to refer to specific components. It should be understood by those skilled in the art that electronic equipment manufacturers may refer to the same component by different names. This document is not intended to distinguish between components that have the same function but different names. In the following specification and claims, the words "include", "contain", "have" and the like are open-ended words, and therefore should be interpreted as "including but not limited to..." Therefore, when the terms "include", "contain" and/or "have" are used in the description of the present disclosure, they specify the existence of corresponding features, regions, steps, operations and/or components, but do not exclude the existence of one or more corresponding features, regions, steps, operations and/or components.

The directional terms mentioned herein, such as "up", "down", "front", "back", "left", "right", etc., are only with reference to the directions of the accompanying drawings. Therefore, the directional terms used are used to illustrate, but not to limit the present disclosure. In the accompanying drawings, each diagram depicts the general characteristics of the methods, structures and/or materials used in a particular embodiment. However, these diagrams should not be interpreted as defining or limiting the scope or nature covered by these embodiments. For example, for the sake of clarity, the relative size, thickness and position of each film layer, region and/or structure may be reduced or exaggerated.

It should be understood that when a component or a membrane layer is referred to as being "connected to" another component or a membrane layer, it can be directly connected to the other component or membrane layer, or there can be an intervening component or membrane layer between the two. When a component is referred to as being "directly connected to" another component or a membrane layer, there can be no intervening components or membrane layers between the two. The terms "approximately," "equal to," "equal," or "same," "substantially," or "approximately" are generally interpreted as being within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

A structure (or layer, component, substrate) described in the present disclosure is located on another structure (or layer, element, substrate), which may mean that the two structures are adjacent and directly connected, or it may mean that the two structures are adjacent but not directly connected. Indirect connection means that there is at least one intermediate structure (or intermediate layer, intermediate component, intermediate substrate, intermediate spacer) between the two structures, the lower surface of one structure is adjacent to or directly connected to the upper surface of the intermediate structure, and the upper surface of the other structure is adjacent to or directly connected to the lower surface of the intermediate structure. The intermediate structure can be a single-layer or multi-layer physical structure or a non-physical structure, without limitation. In the present disclosure, when a certain structure is disposed “on” another structure, it may mean that the certain structure is “directly” on the other structure, or it may mean that the certain structure is “indirectly” on the other structure, that is, at least one structure is interposed between the certain structure and the other structure.

The terms "first", "second", etc. in this disclosure may be used herein to describe various elements, components, regions, layers, and/or parts, but these elements, components, regions, and/or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, the "first element", "component", "region", "layer", or "part" discussed below is used to distinguish from the "second element", "component", "region", "layer", or "part", rather than to limit the order or specific elements, components, regions, layers, and/or parts.

The display device disclosed herein may include a sensing display device, a spliced display device or a transparent display device, but is not limited thereto. The display device may be a rollable, stretchable, bendable or flexible electronic device. The display device may, for example, include liquid crystal, light emitting diode (LED), quantum dot (QD), fluorescence, phosphor or other suitable materials and the materials may be arranged and combined in any way or other suitable display media, or a combination of the aforementioned; the light emitting diode may, for example, include an organic light emitting diode (OLED), a millimeter/sub-millimeter light emitting diode (mini LED), a micro LED or a quantum dot light emitting diode (QD, which may be, for example, QLED, QDLED), but is not limited thereto. It should be noted that the display device can be any combination of the above arrangements, but is not limited thereto. In addition, the appearance of the display device can be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The display device can have peripheral systems such as a drive system, a control system, a light source system, a shelf system, etc. The following will illustrate the content of this disclosure with a display device, but this disclosure is not limited thereto.

In the present disclosure, the various embodiments described below may be mixed and matched without departing from the spirit and scope of the present disclosure. For example, some features of one embodiment may be combined with some features of another embodiment to form another embodiment.

Reference will now be made in detail to exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and description to represent the same or like parts.

FIG. 1 is a top view schematic diagram of a pixel of a display device according to an embodiment of the present disclosure. For the sake of clarity and convenience of explanation, FIG. 1 omits some components. Referring to FIG. 1 , a display device 10 includes a plurality of pixels PX. Each pixel PX includes a plurality of main junction areas 210 and at least one backup junction area 220. In some embodiments, the display device 10 further includes an opening area 11 and a non-opening area 13 surrounding the opening area 11. The main junction area 210 and the backup junction area 220 overlap the non-opening area 13 correspondingly. The main junction area 210 is used to join a light-emitting diode, and the backup junction area 220 includes a light-emitting diode reserved space 320 for joining a light-emitting diode. In this embodiment, the backup junction area 220 is connected to the main junction area 210, and the number of the backup junction area 220 is less than the number of the main junction area 210. Under the above configuration, the pixel PX can reserve space for line layout to realize a repair design, or be applied as a pixel with a transparent display function. Therefore, the display device 10 can achieve good electrical quality, or have good visual effects or display quality.

Please continue to refer to Figure 1. The display device 10 includes a substrate 100. A plurality of pixels PX are disposed on the substrate 100. The substrate 100 may be a hard substrate or a flexible substrate. The material of the substrate 100 may include, for example, glass, quartz, ceramic, sapphire or plastic, but the present disclosure is not limited thereto. In some embodiments, when the substrate 100 is a flexible substrate, it may include a suitable flexible material, such as polycarbonate (PC), polyimide (PI), polypropylene (PP) or polyethylene terephthalate (PET), other suitable materials or a combination of the foregoing materials, but is not limited thereto. In addition, the transmittance of the substrate 100 is not limited, that is, the substrate 100 may be a translucent substrate, a semi-translucent substrate or an opaque substrate. In this embodiment, the display device 10 may be a display device using a transmissive display technology with high transmittance, but is not limited thereto.

In some embodiments, in the top-view direction (also referred to as the Z axis), the multiple pixels PX of the display device 10 can be arranged into multiple rows and multiple columns on the X axis and the Y axis so that the multiple pixels PX are arranged in an array. In this embodiment, the X axis and the Y axis are substantially perpendicular to each other, and the X axis and the Y axis are substantially perpendicular to the Z axis. In some embodiments, the display device 10 further includes a plurality of signal lines and a plurality of thin film transistors (not shown) disposed on the substrate 100. The multiple pixels PX can be electrically connected to the multiple signal lines and the multiple thin film transistors. For example, the multiple signal lines include, for example, scan lines, data lines, or other wires. Some of the signal lines can be electrically connected to thin film transistors (TFT). In the present embodiment, the thin film transistor may be electrically connected to the scan line SL or the data line DL. The thin film transistor may include, for example, a semiconductor channel layer, a gate (electrically connected to the scan line), and a source and a drain electrically connected to the semiconductor channel layer. The material of the semiconductor channel layer may include, for example, amorphous silicon, low temperature polysilicon (LTPS) or metal oxide, or a combination of the above materials, but the present disclosure is not limited thereto. In some embodiments, different thin film transistors may have the above different semiconductor materials. In addition, the thin film transistor may include a top gate transistor, a bottom gate transistor, a dual gate transistor, and a double gate transistor as needed, but is not limited thereto.

In this embodiment, the gate can be electrically connected to the scan line, and the source can be electrically connected to the data line. The material of the gate can include molybdenum (Mo), titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), nickel (Ni), chromium (Cr), cobalt (Co), zirconium (Zr), tungsten (W), aluminum (Al), copper (Cu), silver (Ag), other suitable metals, or alloys or combinations of the above materials, but not limited thereto. The source and drain materials may include transparent conductive materials or non-transparent conductive materials, such as indium tin oxide, indium zinc oxide, indium oxide, zinc oxide, tin oxide, metal materials (such as aluminum, molybdenum, copper, silver, etc.), other suitable materials or combinations thereof, but not limited thereto.

In this embodiment, the display device 10 may include multiple insulating layers (not shown) and multiple circuit layers disposed on or between the insulating layers. The insulating layer may be a single layer or a multi-layer structure and may include, for example, organic materials, inorganic materials, or a combination thereof, but is not limited thereto. The organic material may include polyethylene terephthalate (PET), polyethylene (PE), polyethersulfone (PES), polycarbonate (PC), polymethylmethacrylate (PMMA), polyimide (PI), photosensitive polyimide (PSPI) or a combination thereof, and the inorganic material may include silicon nitride, silicon oxide, silicon oxynitride or a combination thereof, but is not limited thereto.

In the present embodiment, the multi-layer circuit layer ML can be applied as the above-mentioned signal line, including scanning lines, data lines or other wires. The material of the multi-layer circuit layer ML may include a transparent conductive material or a non-transparent conductive material, such as indium tin oxide, indium zinc oxide, indium oxide, zinc oxide, tin oxide, metal materials (such as aluminum, molybdenum, copper, silver, etc.), other suitable materials or the above combinations, but not limited thereto. As shown in FIG. 1 , the multi-layer circuit layer ML may include a first circuit layer M1. The first circuit layer M1 may, for example, include a plurality of scanning lines SL, SL’, and portions of the plurality of scanning lines SL, SL’ extend approximately along the X-axis, but not limited thereto.

In this embodiment, the multi-layer circuit layer ML may further include a second circuit layer M2. On the Z axis, the second circuit layer M2 is disposed above the first circuit layer M1, and the second circuit layer M2 partially overlaps the first circuit layer M1. The second circuit layer M2 may, for example, include a plurality of data lines DL, DL', and the plurality of data lines DL, DL' partially extend substantially along the Y axis, but not limited thereto. From another perspective, the first circuit layer M1 and the second circuit layer M2 may be disposed alternately.

The multi-layer circuit layer ML may further include a third circuit layer M3 and a fourth circuit layer M4. On the Z axis, the third circuit layer M3 is disposed above the second circuit layer M2, and the fourth circuit layer M4 is disposed above the third circuit layer M3. The third circuit layer M3 partially overlaps the second circuit layer M2, and the fourth circuit layer M4 partially overlaps the third circuit layer M3. The third circuit layer M3, for example, includes a circuit line or a bridge line 130, and a portion thereof extends approximately along the X axis, and another portion thereof extends approximately along the Y axis. The fourth circuit layer M4, for example, includes a bonding pad 140 (pad) or a common circuit line 142, and a portion thereof extends approximately along the X axis, and another portion thereof extends approximately along the Y axis, but is not limited thereto. In this embodiment, a portion of the third circuit layer M3 can be electrically connected to a portion of the second circuit layer M2 through a through hole (not shown) on the insulating layer, and a portion of the fourth circuit layer M4 can be electrically connected to a portion of the third circuit layer M3 through a through hole (not shown) on another insulating layer. Under the above configuration, the fourth circuit layer M4 includes a plurality of bonding pads 140, a portion of the bonding pads 140 can be connected to a common circuit line 142 (which can be located in the fourth circuit layer M4), and another portion of the bonding pads 140 can be electrically connected to a data line DL of the second circuit layer M2 through a bridge line 130, but the present invention is not limited thereto.

In the present embodiment, the opening area 11 may be defined as an area substantially surrounded by two adjacent data lines DL and data lines DL' respectively of two adjacent pixels PX and pixel PX' (as shown in FIG. 1 ). For example, the opening area 11 may be an area that allows ambient light to penetrate. In other embodiments, the opening area 11 may be defined as an area surrounded by two adjacent data lines DL, DL' and two adjacent scanning lines SL, SL'. In other words, the opening area 11 substantially does not overlap the circuit layer ML (including the first circuit layer M1, the second circuit layer M2, the third circuit layer M3 or the fourth circuit layer M4). In some embodiments, the opening area 11 is, for example, an octagon, but is not limited thereto. In other embodiments, the opening area 11 may also be a triangle, a rectangle, a polygon, a star, a circle or an irregular shape, but the present disclosure is not limited thereto.

In this embodiment, the opening area 11 may be surrounded by the non-opening area 13. At least a portion of the circuit layer ML (including the first circuit layer M1, the second circuit layer M2, the third circuit layer M3 or the fourth circuit layer M4) may overlap the non-opening area 13. In other words, at least a portion of the scanning line SL, the data line DL, the bridge line 130, the bonding pad 140 or the common circuit line 142 may overlap the non-opening area 13, but is not limited thereto.

In some embodiments, the main junction area 210 and the backup junction area 220 of the pixel PX can be set corresponding to the non-opening area 13. In other words, the main junction area 210 and at least one backup junction area 220 overlap the non-opening area 13 correspondingly. For example, multiple main junction areas 210 can overlap the second circuit layer M2, the third circuit layer M3 or the fourth circuit layer M4. The backup junction area 220 can overlap the second circuit layer M2, the third circuit layer M3 or the fourth circuit layer M4. Each main junction area 210 includes two junction pads 140. Each backup junction area 220 includes two junction pads 140. In this embodiment, the junction pad 140 can be used as an electrode connected to a light-emitting diode. That is, each main junction area 210 can be used to join a blue LED 300B, a green LED 300G, or a red LED 300R, and in a top view direction, at least a portion of the main junction area 210 overlaps with the LED (for example, the blue LED 300B, the green LED 300G, or the red LED 300R). Each backup junction area 220 can be used to join a blue LED 300B, a green LED 300G, or a red LED 300R, but is not limited thereto. In this embodiment, the number of the backup junction areas 220 is less than the number of the main junction areas 210. For example, FIG. 1 shows that three main junction areas 210 can be arranged in sequence along the Y axis and overlapped on the non-opening area 13, and two backup junction areas 220 can be arranged along the Y axis following the main junction areas 210 and overlapped on the non-opening area 13, but the present disclosure is not limited to this. That is, the main junction areas 210 and the backup junction areas 220 are connected or arranged adjacent to each other. In other embodiments, the backup junction areas 220 can be arranged alternately with the main junction areas 210, or the backup junction areas 220 can be arranged at opposite ends of the main junction areas 210, but are not limited to this. In addition, it should be noted that the number of the main junction areas 210 and the number of the backup junction areas 220 shown in FIG. 1 are for illustration only and are not used to specifically limit the present disclosure. In other embodiments, the number of the main junction areas 210 may be two, four or more, and the number of the backup junction areas 220 may be one, three or more, but the present disclosure is not limited thereto.

In this embodiment, the definition of the pixel PX is, for example, the area between the center lines L and L' of the opening areas 11 and 11' on the opposite sides of the main junction area 210 and the backup junction area 220 on the X-axis in the non-opening area 13. For example, the opening area 11 on the left side of the main junction area 210 and the backup junction area 220 is separated into two halves of equal area by the center line L. The opening area 11' on the right side of the main junction area 210 and the backup junction area 220 is separated into two halves of equal area by the center line L'. The area between the center line L of the opening area 11 and the center line L' of the opening area 11' can be referred to as the pixel PX. That is, the pixel PX includes the main junction area 210 and the backup junction area 220 overlapping the non-opening area 13 and halves of two opening areas 11 and 11' on opposite sides thereof, but is not limited thereto.

In this embodiment, the display device 10 may further include a light shielding layer BM (not shown in FIG. 1 ). At least a portion of the light shielding layer BM corresponds to and overlaps the non-opening area 13. For example, the light shielding layer BM may be disposed on the substrate 100 and disposed below the circuit layer ML on the Z axis. That is, at least a portion of the first circuit layer M1, the second circuit layer M2, the third circuit layer M3, or the fourth circuit layer M4 is disposed above the light shielding layer BM and overlaps the light shielding layer BM. From another perspective, the light shielding layer BM does not overlap the opening area 11, but surrounds the opening area 11 corresponding to the non-opening area 13. Therefore, in some embodiments, when the multi-layer circuit layer cannot clearly present the data line and/or the scan line, the area surrounded by the light shielding layer BM can be defined as the opening area 11. In addition, the main bonding area 210 and the backup bonding area 220 can correspond to the overlapping light shielding layer BM. In this embodiment, the light shielding layer BM is, for example, a black matrix, and its material may include metal or a light-proof resin doped with a colorant, or other suitable materials or a combination of the above materials, but not limited to this. The above metal example may be chromium (Cr), but not limited to this. The above resin example may be epoxy resin or acrylic resin, or other suitable materials or a combination of the above materials, but not limited to this. Under the above configuration, the contrast of the display device 10 can be increased, and the display effect or display quality of the display device 10 can be improved.

It is worth noting that the circuit layer ML, the main junction area 210 and the backup junction area 220 of the display device 10 of an embodiment of the present disclosure can overlap the light shielding layer BM and be arranged in the non-opening area 13 outside the opening area 11, so that the pixel PX of the display device 10 can pass through the opening area 11 and have a high transmittance. Thereby, the pixel PX can be applied as a pixel with a penetrating display function. In this way, the display device 10 has a good visual effect or display quality. In addition, the main junction area 210 is used to join the light-emitting diode, and the backup junction area 220 includes a light-emitting diode reserved space 320 for joining a repair or backup light-emitting diode. Therefore, the pixel PX of the display device 10 can reserve space and have a design for realizing a repair pixel. In this way, the display device 10 has good electrical quality.

The steps and methods of pixel repair are explained below using the simplified schematic diagram and simplified circuit diagram shown in FIG. 2 and FIG. 3 .

FIG. 2 is a partial top view schematic diagram of a display device of another embodiment of the present disclosure. FIG. 3 is a schematic circuit diagram of the pixel shown in FIG. 2 . For the sake of clarity and convenience of explanation, FIG. 2 and FIG. 3 omit some components. Please refer to FIG. 2 , the display device 10A includes a pixel PX. In some embodiments, the display device 10A further includes an opening area 11 and a non-opening area 13 surrounding the opening area 11. The light shielding layer BM is arranged to overlap the non-opening area 13 and surround the opening area 11. The pixel PX includes a plurality of main junction areas 210, 210', 210'' and at least one backup junction area 220. The plurality of main junction areas 210, 210', 210'' are arranged along the Y axis and overlap the non-opening area 13. At least one backup junction area 220 is disposed correspondingly at one end of one of the main junction areas (eg, the main junction area 210) and overlaps the non-opening area 13. The main junction area (eg, the main junction area 210) and the backup junction area 220 are respectively used to join the light-emitting diode.

For example, the LED 300R is bonded to the main bonding area 210, the LED 300B is bonded to the main bonding area 210', and the LED 300G is bonded to the main bonding area 210''. That is, in the top view direction (Z-axis direction), at least part of the main bonding areas 210, 210', and 210'' overlap with the LEDs 300R, 300G, and 300R, respectively. In addition, the backup bonding area 220 is adjacent to the main bonding area 210'' where the LED 300G is disposed.

In this embodiment, the main bonding area 210 is connected to the backup bonding area 220. For example, referring to FIG. 2 and FIG. 3, the LED 300R, the LED 300G, and the LED 300B are connected to the backup bonding area 220 through wires or bridge lines, respectively. The display device 10A has pre-soldering points WP, WP', WP'' (FIG. 2 only shows one pre-soldering point WP) located between the backup bonding area 220 and the main bonding areas 210, 210', 210'' connected to the backup bonding area 220. For example, the main bonding area 210 and the LED 300R bonded thereto have a pre-soldering point WP between them and the backup bonding area 220. A pre-solder point WP’ is provided between the main joint area 210’ and the LED 300G joined thereto and the backup joint area 220. A pre-solder point WP’’ is provided between the main joint area 210’’ and the LED 300B joined thereto and the backup joint area 220. In addition, the display device 10A further includes pre-cut points CP, CP’, CP’’ located between the pre-solder points WP, WP’, WP’’ and the main joint areas 210, 210’, 210’’. For example, a pre-cut point CP is provided between the main joint area 210 and the LED 300R joined thereto and the pre-solder point WP. A pre-cut point CP’ is provided between the main joint area 210’ and the LED 300G joined thereto and the pre-solder point WP’. There is a pre-cutting point CP'' between the main bonding area 210'' and the LED 300B bonded thereto and the pre-soldering point WP''. Taking the LED 300R as an example, under the above-mentioned setting, when the LED 300R does not meet the inspection specifications (for example, including: dark spots, bright spots or appearance damage), a repair process of the display device 10A can be performed. The above-mentioned repair process includes: bonding the LED for repair (for example, a red LED) to the bonding pad of the LED reserved space 320 in the backup bonding area 220; then performing a laser cutting process on the wire or bridge line at the pre-cutting point CP; and then performing a laser welding process on the pre-soldering point WP. After the above-mentioned repair process is completed, after a voltage is provided to the display device 10A, the LED 300R connected to the main junction area 210 will not receive the voltage and will not emit light. The repair LED connected to the backup junction area 220 can receive the above-mentioned voltage and emit light. In this way, the display device 10A can complete the repair of the LED through the repair process, so the display device 10A can have good electrical quality. In addition, the display device 10A can have good visual effects or display quality.

It is worth noting that the number of backup junction areas 220 in the pixel PX of the display device 10A of an embodiment of the present disclosure is less than the number of main junction areas 210, 210', 210". For example, the number of main junction areas 210 shown in Figures 2 and 3 is three, respectively for the blue LED 300B, the green LED 300G and the red LED 300R. The number of backup junction areas 220 is one, that is, the backup junction area 220 can correspond to a repair LED (for example: a blue LED, a green LED, and a red LED disposed in the LED reserved space 320), but the above-mentioned quantity relationship is not intended to limit the present disclosure. Under the above arrangement, in the process of repairing the display device 10A, the LED for repair can be selectively arranged in the reserved space. In this way, the cost can be saved. In addition, since the reserved space can be reduced, the space for circuit arrangement can be increased, the requirements of high circuit density design can be met, or the penetration rate of the opening area 11 can be improved. In this way, the display device 10A can have good electrical quality, good visual effect or display quality.

Other embodiments are listed below for illustration. It must be noted that the following embodiments use the component numbers and some contents of the previous embodiments, wherein the same numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can refer to the previous embodiments, and the following embodiments will not be repeated.

FIG4 is a partial top view schematic diagram of a display device of another embodiment of the present disclosure. FIG5 is a schematic circuit diagram of the pixel shown in FIG4 . For the sake of clarity and convenience of illustration, FIG4 and FIG5 omit depicting certain components. The display device 10B of this embodiment is substantially similar to the display device 10A of FIG2 and FIG3 , and therefore the same and similar components in the two embodiments are not repeated here. The main difference between this embodiment and the display device 10A is that the display device 10B includes a pixel PX, an opening area 11, and a non-opening area 13 surrounding the opening area 11. The pixel PX includes three main joint areas 210, 210', 210'', and two backup joint areas 220, 220'. For example, the backup joint area 220 can be disposed adjacent to the main joint area 210, and the backup joint area 220' can be disposed adjacent to the main joint area 210'. The pre-solder point WP is disposed corresponding to the backup joint area 220. The pre-solder point WP is disposed corresponding to the backup joint area 220'. The LED reserved space 320 in the backup joint area 220 can be connected to a repair LED. The LED reserved space 320' in the backup joint area 220' can be connected to another repair LED, but the above-mentioned quantity relationship is not intended to limit the present disclosure. In the present embodiment, the number of backup joint areas 220, 220' is less than the number of main joint areas 210, 210', 210''. Since the reserved space can be reduced, the space for circuit arrangement can be increased, the requirement of high circuit density design can be met, or the penetration rate of the opening area 11 can be improved. In this way, the display device 10B can also be repaired to have good electrical quality, good visual effect or display quality.

The following is a simple description of the steps and methods of pixel repair using the circuit diagram shown in FIG5 .

Please refer to FIG. 5 , the LED 300R, the LED 300G, and the LED 300B are connected to the backup junction areas 220, 220′ respectively through wires or bridge lines. The display device 10B has pre-solder joints WP1, WP2, and WP3 between the backup junction area 220 or the backup junction area 220′ and the main junction areas 210, 210′, and 210″. For example, the main junction area 210 and the LED 300R connected thereto have a pre-solder joint WP1 between the backup junction area 220 or the backup junction area 220′. The main junction area 210′ and the LED 300G connected thereto have a pre-solder joint WP2 between the backup junction area 220 or the backup junction area 220′. A pre-soldering point WP3 is provided between the main joint area 210″ and the LED 300B joined thereto and the backup joint area 220 or the backup joint area 220′. In addition, the display device 10B further includes pre-cutting points CP1, CP2, and CP3 located between the pre-soldering points WP1, WP2, and WP3 and the main joint areas 210, 210′, and 210″. For example, a pre-cutting point CP1 is provided between the main joint area 210 and the LED 300R joined thereto and the pre-soldering point WP1 (in FIG. 4 , the pre-cutting point CP1 is provided adjacent to the main joint area 210). A pre-cutting point CP2 is provided between the main joint area 210′ and the LED 300G joined thereto and the pre-soldering point WP2 (in FIG. 4 , the pre-cutting point CP2 is provided adjacent to the main joint area 210′). A pre-cut point CP3 is provided between the main joint area 210″ and the LED 300B joined thereto and the pre-welding point WP3 (in FIG. 4 , the pre-cut point CP3 is provided adjacent to the main joint area 210″). Taking the LED 300R and the LED 300G as an example, under the above-mentioned setting, when the LED 300R and the LED 300G do not meet the inspection specifications (for example, including: dark spots, bright spots or appearance damage), the display device 10B can be repaired. The above-mentioned repair process includes: joining the repair LED (for example, a red-light-emitting LED) to the bonding pad of the LED reserved space 320 in the backup bonding area 220; then joining the repair LED (for example, a green-light-emitting LED) to the bonding pad of the LED reserved space 320' in the backup bonding area 220'; then performing a laser cutting process on the wire or bridge line at the pre-cut point CP1; then performing a laser cutting process on the wire or bridge line at the pre-cut point CP2; then performing a laser cutting process on the wire or bridge line at the pre-cut points CP5, CP7, and CP8; and then performing a laser welding process on the pre-soldering point WP1 and the pre-soldering point WP2. After the above repair process is completed, after a voltage is provided to the display device 10B, the LED 300R connected to the main junction area 210 and the LED 300G connected to the main junction area 210' will not receive the voltage and will not emit light. The repair LEDs connected to the backup junction area 220 and the backup junction area 220' can receive the above voltage and emit light.

In some embodiments, please refer to the arrangement of FIG. 5 , when the LED 300B does not meet the inspection specifications (for example, including: dark spots, bright spots or appearance damage), and still does not meet the inspection specifications after the first repair, the display device 10B can be subjected to a second repair process. For example, the LED for the first repair (for example, a blue-light-emitting LED) is bonded to the bonding pad of the LED reserved space 320 in the backup bonding area 220; then, a laser cutting process is performed on the wire or bridge line at the pre-cut point CP3; then, a laser welding process is performed on the pre-welding point WP3, and then a voltage is provided to the display device 10B to test the light-emitting quality of the LED for the first repair. If it still does not meet the inspection specifications, a second repair process is performed, and the second repair LED (e.g., a blue light emitting diode) is joined to the bonding pad of another LED reserved space 320' in another backup bonding area 220'; then the wire or bridge line is laser cut at the pre-cut points CP7, CP8, and CP9. After the above repair process is completed, a voltage is provided to the display device 10B again, and the LED 300B joined in the main bonding area 210'' will not receive the voltage and will not emit light, while the repair LED joined in the backup bonding area 220' can receive the above voltage and emit light.

In this way, the display device 10B can complete the repair of the LED through the repair process, so the display device 10B can have good electrical quality. In addition, the display device 10B can have good visual effects or display quality.

It should be noted here that the above-mentioned repair process is only illustrated by taking LED 300R and LED 300G as LEDs that do not meet the inspection specifications. The definition of not meeting the inspection specifications may include: the LED emits light exceeding the preset average brightness (i.e., too bright), emits light below the preset average brightness (i.e., too dark), or does not emit light (i.e., not bright). Alternatively, the LED may be damaged, resulting in a defective appearance. In addition, the size of the LED is larger than the preset average size or smaller than the preset average size and may also be deemed to be not meeting the inspection specifications, but the present embodiment is not limited to the above examples. In addition, LED 300R and LED 300B may also be LEDs that do not meet the inspection specifications. Alternatively, any one of the LED 300R, the LED 300G or the LED 300B is a LED that does not meet the inspection specifications, but the present disclosure is not limited thereto.

FIG6 is a partial top view schematic diagram of a display device of another embodiment of the present disclosure. For the sake of clarity and convenience of explanation, FIG6 omits depicting several components. The display device 10C of this embodiment is substantially similar to the display device 10B of FIG4 , and therefore the same and similar components in the two embodiments are not repeated here. The main difference between this embodiment and the display device 10B is that the display device 10C includes a pixel PX, an opening area 11, and a non-opening area 13 surrounding the opening area 11. The light-emitting diodes respectively joined to the main joining areas 210, 210', 210'' in the pixel PX are blue light-emitting diodes 300B. The display device 10C further includes a light conversion layer 340R or a light conversion layer 340G. The light conversion layer 340R overlaps the blue LED 300B in the main junction region 210. The light conversion layer 340G overlaps the blue LED 300B in the main junction region 210'.

For example, the light conversion layer 340R includes a quantum dot (QD) material that emits red light. The light conversion layer 340G includes a quantum dot material that emits green light. Under the above configuration, the blue light emitted by the blue light emitting diode 300B can be converted into red light by the light conversion layer 340R. Similarly, the blue light emitted by the blue light emitting diode 300B can be converted into green light by the light conversion layer 340G. In this way, the display device 10C can achieve the need to generate light of different colors by setting up a blue light emitting diode 300B and matching quantum dot materials of different colors. In addition, the display device 10C can also achieve excellent technical effects similar to the above-mentioned embodiments.

In summary, in the display device of an embodiment of the present disclosure, since the circuit layer, the main junction area and the backup junction area can overlap the light-shielding layer and be arranged in the non-opening area outside the opening area, the pixels of the display device can pass through the opening area to become pixels with a high-transmittance penetrating display function. In this way, the display device can be applied as a penetrating display device, or have good visual effects or display quality. In addition, the main junction area is connected to the backup junction area to connect the light-emitting diode for repair or backup through the backup junction area. Therefore, the pixels of the display device have a space reserved for setting the light-emitting diode, and have a design for realizing the repair pixel. In this way, the display device has good electrical quality. In addition, since the number of backup junction areas can be less than the number of main junction areas, the reserved space can be reduced to increase the layout of high-density circuits or improve the penetration rate of the opening area, and the LED for repair can be selectively set in the reserved space. In this way, the display device can save costs, increase the space for circuit setting, meet the needs of high circuit density design or improve the penetration rate of the opening area. In this way, the display device can have good electrical quality, good visual effect or display quality.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Although the present invention has been described in detail with reference to the above embodiments, ordinary technical personnel in this field should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

10A, 10B, 10C: Display device 11, 11’: Opening area 13: Non-opening area 100: Substrate 130: Bridge line 140: Bonding pad 142: Common circuit line 210, 210’, 210’’: Main bonding area 220, 220’: Backup bonding area 300B. 300G, 300R: LED 320, 320’: LED reserved space 340G, 340R: Light conversion layer BM: Shading layer CP, CP’, CP’’, CP1, CP2, CP3, CP4, CP5, CP6, CP7, CP8, CP9: Pre-cut point DL, DL’: Data line L, L’: Center line M1: First circuit layer M2: Second circuit layer M3: Third circuit layer M4: Fourth circuit layer ML: Circuit layer PX, PX’: Pixel SL, SL’: Scan line WP, WP’, WP’’, WP1, WP2, WP3: Pre-soldering point X, Y, Z: Axis

FIG. 1 is a schematic diagram of a pixel of a display device according to an embodiment of the present disclosure from above. FIG. 2 is a schematic diagram of a portion of a display device according to another embodiment of the present disclosure from above. FIG. 3 is a schematic circuit diagram of the pixel shown in FIG. 2. FIG. 4 is a schematic diagram of a portion of a display device according to another embodiment of the present disclosure from above. FIG. 5 is a schematic circuit diagram of the pixel shown in FIG. 4. FIG. 6 is a schematic diagram of a portion of a display device according to another embodiment of the present disclosure from above.

10A: Display device

11: Opening area

13: Non-opening area

210,210’,210”: Main junction area

220,220’: Backup junction area

300B.300G,300R: LED

320: Space reserved for LEDs

BM: Shading layer

CP, CP’, CP”: pre-cutting point

PX: Pixel

WP: Pre-weld point

X,Y,Z: axis

Claims (9)

A display device comprises: a substrate; a plurality of pixels, each of the plurality of pixels comprises: a plurality of main bonding areas; and at least one backup bonding area; a circuit layer, overlapping with the plurality of main bonding areas and the at least one backup bonding area, and arranged on the substrate, wherein the circuit layer comprises a plurality of bonding pads, wherein a part of the plurality of bonding pads corresponds to the plurality of main bonding areas, and another part of the plurality of bonding pads corresponds to the at least one backup bonding area; a light shielding layer, arranged on the substrate, overlapping the circuit layer; and an opening area, surrounded by the light shielding layer, and not overlapping with the plurality of bonding pads, wherein each of the at least one backup bonding area is connected to the plurality of main bonding areas, and the number of the at least one backup bonding area is less than the number of the plurality of main bonding areas. A display device as described in claim 1, wherein each of the plurality of main bonding areas and each of the at least one backup bonding area comprises two bonding pads respectively. A display device as described in claim 1, wherein the display device further comprises a plurality of pre-soldering points located between each of the at least one backup bonding area and each of the plurality of main bonding areas connecting each of the at least one backup bonding area. A display device as described in claim 1, wherein the display device further comprises a plurality of pre-cut points located between the plurality of pre-welding points and each of the plurality of main bonding areas. A display device as described in claim 1, wherein the plurality of main junction areas are used to respectively junction with a blue light-emitting diode, a green light-emitting diode or a red light-emitting diode. A display device as described in claim 1, wherein the at least one spare junction area is used to join a blue light-emitting diode, a green light-emitting diode or a red light-emitting diode. A display device as described in claim 1, wherein the display device further comprises at least one light conversion layer, wherein one of the plurality of main junction areas is used to join a blue light-emitting diode, and the at least one light conversion layer overlaps the blue light-emitting diode. A display device as described in claim 1, wherein the plurality of main joint areas and the at least one backup joint area overlap the light shielding layer. A display device as described in claim 1, wherein the material of the light-shielding layer includes a metal material.

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