TWI882116B - Parts packaging device and parts packaging method - Google Patents

Abstract

The present invention is a component packaging device for transferring and packaging components on a substrate, comprising: a conveying section that sends out a belt body to sequentially position the components directly above the transfer position and processes the sending portion of the winding belt body; an optical observation section that irradiates the components and the substrate with illumination light from a light source and divides the reflected light from the components and the substrate into two systems to simultaneously observe the components and the substrate to be transferred; a transfer section that has a light-transmitting pressing assembly that presses the components to be transferred from the other side of the belt body, and by moving the pressing assembly relative to the substrate, the components are pressed at the transfer position to transfer and package the components on the substrate; and a control section that comprehensively controls the conveying section, the optical observation section, and the transfer section. In this way, the components can be transferred with high precision to be packaged on the substrate.

Description

Parts packaging device and parts packaging method

The present invention relates to a component packaging technology, and in particular to a component packaging device and a component packaging method that can package tiny components connected to one side of a thin and long light-transmitting tape that can be rolled into a roll with a predetermined arrangement spacing on a substrate with high precision.

When the above-mentioned tiny parts (e.g., the dimensions of the outer shape are about tens to hundreds of μm) are packaged on the substrate with high precision by the so-called roll-to-roll method, it is necessary to improve the accuracy of aligning the position of the parts attached to one side of the tape with the position of the package on the substrate. When the size of the packaged parts is in the micron range, even if the tape is moved at a pre-set arrangement spacing, it is still possible that the parts cannot be positioned directly above the packaging position. This is because, for example, when the tape stretches in the conveying direction, its influence cannot be ignored.

Therefore, a method of using, for example, a camera to observe the position of the parts and moving the substrate to align them has been considered. However, in this case, if a component is used to press the parts from the other side of the belt, if the belt and the component are not light-transmissive, direct observation will be impossible.

On the other hand, a component packaging device has been disclosed that is not a roll-to-roll method, but uses a transparent component and a camera to observe the position of the component (see, for example, Japanese Patent Publication No. 2017-157682).

However, in the case of using a transparent glass plate as in the above-mentioned conventional component packaging device, a certain degree of strength (thickness) is required in order to press the components onto the substrate from the other side of the tape. Therefore, when observing with a microscope, for example, when the components arranged on one side of the tape and the substrate surface that will serve as the basis for packaging the components on the substrate are separated in the optical axis direction, if the focal depth is too shallow, the focusing range will become narrow, making it difficult to observe simultaneously. As a result, it will be difficult to transfer the components with high precision for packaging on the substrate.

Therefore, in view of the above-mentioned problems, the present invention aims to provide a component packaging device and a component packaging method that can transfer components (especially the above-mentioned micro components) connected to one side of a thin and long light-transmitting tape that can be rolled into a roll with a predetermined arrangement pitch with high precision to be packaged on a substrate.

To achieve the above-mentioned purpose, the first invention is a component packaging device, which is a component packaging device for transferring and packaging components on a substrate, and comprises: a conveying part, which is to send out a thin and long light-transmitting belt body that can be rolled into a roll shape, to sequentially position the components connected to one side of the belt body at a preset arrangement pitch just above the transfer position to be transferred to the substrate, and to roll up the sent-out part of the belt body into a roll shape; an optical observation part, which is to irradiate the illumination light from the light source on the transfer object The part and the substrate are connected to the belt, and the reflected light from the part and the substrate is divided into two systems to observe the part and the substrate of the transfer object at the same time; the transfer part has a light-transmitting pressing component that presses the part of the transfer object from the other side of the belt, and the pressing component and the substrate are moved relative to each other to press the part at the transfer position, so that the part is transferred and packaged on the substrate; and the control part controls the conveying part, the optical observation part and the transfer part in general.

According to the component packaging device of the first invention, by means of the above-mentioned structure, a device can be provided that can package components connected to one side of a thin and long light-transmitting tape that can be rolled into a roll with a predetermined arrangement pitch by high-precision transfer on a substrate.

The second invention is a component packaging method, which is a component packaging method for transferring and packaging components on a substrate, and implements the following steps: a conveying process is to send out a thin and long light-transmitting belt body that can be rolled into a roll, and sequentially position the components connected to one side of the belt body at a preset arrangement pitch just above the transfer position to be transferred to the substrate, and roll up the sent-out part of the belt body into a roll shape; The process of irradiating the part of the transfer object and the substrate with illumination light from a light source, and making the reflected light from the part and the substrate split into two systems to simultaneously observe the part of the transfer object and the substrate; the process of pressing the part at the transfer position by moving a light-transmitting pressing component that presses the part of the transfer object from the other side of the belt relative to the substrate; and the process of transferring and packaging the part on the substrate.

According to the component packaging method of the second invention, through the above process, the components connected to one side of a thin and long light-transmitting tape that can be rolled into a roll can be packaged on the substrate with high precision by transferring at a predetermined arrangement pitch.

1: With body

1a: Base assembly

2: Parts

3:Substrate

4:Transportation Department

6a: Press assembly

41: Delivery mechanism

42: Winding mechanism

43: Belt control unit

5: Optical observation unit

51: Object Lens

52: 1st imaging lens

53: Second imaging lens

54: 1st Photography Department

55: 2nd Photography Department

56: Imaging lens control unit

57: Light source for lighting

6: Press the assembly

61: Above

61a: Above

62: Below

63: Observation surface

7: Lighting Department

8: Transfer unit

81:XYZ pedestal

82: Adsorption table

83: Coating device

84:Pedestal Control Department

9: Control Department

9a: Processor

9b: Storage

9c: Memory

9d: Input device

9e: Communication interface

9f: Display device

9g: Bus

M1~M6: Mirror

T:Thickness

R: Radius of curvature

R _b : Radius of curvature

Rt: Radius of curvature

SW: Spherical wave

Figure 1 shows the main structure of the first embodiment of the component packaging device of the present invention.

FIG. 2 is a schematic diagram showing an embodiment of a belt body equipped with a plurality of parts shown in FIG. 1 .

Figure 3 is a detailed diagram of the component packaging device shown in Figure 1.

Figure 4 is an explanatory diagram showing an example of the construction of a pressing assembly.

Figure 5 is an illustration of the shape of the top of the pressing assembly.

Figure 6 is a photo taken to observe the top shape of the pressing component.

Figure 7 is an illustration of the shape of the bottom of the pressing assembly.

FIG8 is a block diagram showing an example of a hardware configuration of the control unit shown in FIG1.

FIG9 is a flow chart showing the first embodiment of the component packaging method of the present invention.

Figure 10 is a process diagram (1) used to illustrate the component packaging method of the first embodiment.

Figure 11 is a process diagram (2) used to illustrate the component packaging method of the first embodiment.

Figure 12 is the first schematic diagram for illustrating the simultaneous observation of observation planes with different focal positions.

Figure 13 is a photograph used to illustrate the simultaneous observation of observation planes with different focal positions.

Figure 14 is a second schematic diagram for illustrating the simultaneous observation of observation planes with different focal positions.

FIG. 15 is a diagram showing the main structure of the second embodiment of the component packaging device of the present invention.

FIG16 is a flow chart showing the second embodiment of the component packaging method of the present invention.

The following is an explanation of the embodiments of the present invention based on the attached drawings. Figure 1 is a diagram showing the main structure of the first embodiment of the component packaging device of the present invention.

[First implementation form]

The component packaging device shown in FIG1 is a device that can package micro-components 2 connected to one side of a thin and long transparent tape body 1 that can be rolled into a roll (hereinafter referred to as "the surface of the tape body 1") with a preset arrangement pitch on a substrate 3 with high precision. The dimensions of the micro-components 2 are, for example, tens to hundreds of μm as described above. In addition, the component packaging device is preset to package the components 2 on the substrate 3 according to a preset arrangement pattern using, for example, other transfer techniques, and is used after defective components found in the inspection stage have been removed.

That is, the component packaging device is used to repair defective parts that selectively transfer good components 2 to the substrate 3. In addition, the defective part refers to, for example, an unpackaged part after the defective part has been removed. In addition, the unpackaged part also includes the unpackaged part 2.

The parts packaging device is mainly composed of a conveying unit 4, an optical observation unit 5, an illumination unit 7, a transfer unit 8, and a control unit 9. In addition, the pressing assembly 6 shown in FIG. 1 is spatially separated but is included in the transfer unit 8.

The conveying unit 4 performs the following processing: by delivering the belt 1 in a roll-to-roll manner, for example, the parts 2 attached to the surface of the belt 1 with the same arrangement pitch are sequentially positioned just above the transfer position to be transferred to the substrate 3, and the delivered portion of the belt 1 is wound into a roll shape. The conveying unit 4 has a delivery mechanism 41, a winding mechanism 42, and a belt control unit 43 (see FIG. 3).

In order to position the parts 2 sequentially just above the transfer position set on the substrate 3, the delivery mechanism 41 will continuously or intermittently transport the belt 1 in a fixed direction. The winding mechanism 42 is used to wind up the belt 1 after the parts 2 are peeled off due to transfer. In addition, intermittent transportation means, for example, moving the belt 1 in a step-by-step manner in accordance with the arrangement pitch of the parts 2.

FIG2 is a schematic diagram showing an embodiment of a belt body 1 equipped with the component 2 shown in FIG1. (a) is a top view, and (b) is a cross-sectional view taken along the line A-A shown in (a). (c) is an enlarged cross-sectional view of the area surrounded by R1 shown in (b).

In addition, Figure 2(a) illustrates the state after a portion of the belt body 1 is cut. In Figure 2(b), the thickness of the component 2 is about tens of μm (for example, 20 μm) relative to the thickness of the belt body 1 (for example, about 0.7 mm), and the actual thickness of the belt body 1 is larger.

In addition, part 2 may be a specific part assembled in the manufacturing stage of a micro LED display such as a UV (Ultra Violet) excitation method. In the UV excitation method, a micro LED (Light Emitting Diode) chip that emits UV light is combined with an RGB phosphor composed of three primary colors of light (i.e., red (R), green (G), and cyan (B)) as a color conversion chip for a color conversion layer to achieve full-color display. The above-mentioned specific part includes a micro LED chip or a color conversion chip. In the first embodiment, a color conversion chip, for example, can be used as part 2 in FIG. 2(a).

The tape body 1 is a UV-curing adhesive tape whose adhesive force is reduced by UV irradiation. As shown in FIG. 2(c), it fixes and supports one end face (hereinafter referred to as "the first face") of a plurality of parts 2 by adhesion. The tape body 1 arranges the parts 2 on the tape body 1 in an independent state according to the same arrangement spacing P as a pre-set arrangement. The distance interval of the arrangement spacing P is set in order to be able to efficiently package the parts 2. That is, when the part 2 to be transferred is set at the transfer position of the substrate 3, other parts 2 will not contact the substrate 3. Therefore, if the tape body 1 constructed as described above is used, the parts 2 can be efficiently packaged. In addition, the wavelength of the ultraviolet light used for ultraviolet irradiation is preferably 365nm, which is generally used for ultraviolet curing.

Then, as shown in FIG. 2(c), the tape body 1 has a base component 1a and an adhesive layer 1b laminated on one surface of the base component 1a. The first surface of the component 2 is attached to the tape body 1 by adhesion through the adhesive layer 1b.

The base component 1a is composed of a UV-transmitting resin as a UV-curing adhesive tape. The adhesive layer 1b is a UV-curing adhesive layered on one surface of the base component 1a. In addition, the adhesive layer 1b does not absorb all UV rays, but allows UV rays to penetrate.

When the tape 1 fixes the part 2, it will fully fix the part 2. The adhesive can be hardened by irradiating ultraviolet light (hereinafter referred to as "ultraviolet light"), thereby reducing the adhesive force and making it easier to peel off. Therefore, it is better to use ultraviolet curing adhesive tape as the tape 1.

Furthermore, the tape 1 has light transmittance in the wavelength band from visible light to ultraviolet light. In addition, the tape 1 is not limited to ultraviolet curing adhesive tape, and can be a resin film with an adhesive coated on the surface, or various adhesive tapes. In order to transfer and package the component 2 on the substrate 3, the condition is that the adhesive force of adhering the first side of the component 2 to the tape 1 is smaller than the adhesive force of fixing the other end face of the component 2 (hereinafter referred to as the "second side") on the transfer position of the substrate 3.

FIG3 is a detailed structural diagram of the component packaging device shown in FIG1. FIG3 shows the structure of the conveying unit 4, the optical observation unit 5 and the transfer unit 8 shown in FIG1 in more detail. The belt control unit 43 of the conveying unit 4 receives instructions from the control unit 9 to control the delivery of the belt 1 in the delivery mechanism 41 and the winding of the belt 1 in the winding mechanism 42.

The optical observation section 5 irradiates the illumination light from the illumination light source 57 on the part 2 and substrate 3 of the transfer object, and divides the reflected light from the part 2 and substrate 3 into two systems to simultaneously observe the part 2 and substrate 3 of the transfer object. In addition, the optical observation section 5 provides an optical mechanism that irradiates the ultraviolet light emitted from the illumination section 7 toward the part 2 and substrate 3.

The optical observation unit 5 selectively uses autofocus processing to observe and focus on a specific subject, and performs autofocus processing on the substrate surface of the substrate 3 based on the reflected light from the substrate 3 guided by at least one of the two systems. The relevant details will be described later.

As shown in FIG3 , the optical observation unit 5 includes an object lens 51, a first imaging lens 52, a second imaging lens 53, a first photographing unit 54, a second photographing unit 55, an imaging lens control unit 56, an illumination light source 57, and mirrors M1 to M6. Mirrors M1 and M3 are semi-transparent mirrors, mirrors M2, M4, and M5 are reflective mirrors, and mirror M6 is a dichroic mirror that reflects ultraviolet light but allows visible light to pass through.

The object lens 51 focuses the illumination light emitted from the light source 57 on the component 2 and the substrate 3. Specifically, the object lens 51 focuses the light on the first surface of the component 2 facing the object lens 51, and focuses the light on the substrate surface of the substrate 3 facing the object lens 51. The mirror M1 has the function of a beam splitter and is disposed directly above the object lens 51, which splits the reflected light from the component 2 and the substrate 3 into two systems (the first light path and the second light path).

The first imaging lens 52 is disposed above the mirror M2, and uses the first light path formed by the mirror M1 to image the reflected light from the component 2. The first light path is included in the light path that allows the illumination light irradiated from the light source 57 to be focused on the component 2 through the object lens 51, and the reflected light from the component 2 passes through the mirrors M6 and M3 through the object lens 51, and then is reflected at 90 degrees at the mirror M1, and then reflected at 90 degrees at the mirror M2, and is guided to the light path of the first imaging lens 52.

The second imaging lens 53 is disposed above the mirror M1, and uses the second optical path formed by the mirror M1 to image the reflected light from the substrate 3. The second optical path is included in the optical path in which the illumination light irradiated from the light source 57 is focused on the substrate 3 by the object lens 51, and the reflected light from the substrate 3 passes through the mirrors M6 and M3 through the object lens 51, and then passes through the mirror M1 and is guided to the second imaging lens 53.

The first camera unit 54 is disposed above the first imaging lens 52, and will take the image of the component 2 formed through the first imaging lens 52 and convert it into information of the first image, and transmit the information to the control unit 9 for analysis. The second camera unit 55 is disposed above the second imaging lens 53, and will take the image of the substrate surface of the substrate 3 formed through the second imaging lens 53 and convert it into information of the second image, and transmit the information to the control unit 9 for analysis.

Before and after the second imaging lens 53 moves in the direction directly above the substrate 3, the imaging lens control unit 56 moves the second imaging lens 53 by contrast autofocus as an autofocus process so that each focal point of the substrate 3 is focused. Specifically, the imaging lens control unit 56 calculates the contrast of an image obtained by moving one side of the second imaging lens 53 in the optical axis direction using the second imaging lens 53 as a focusing lens, and positions the second imaging lens 53 in such a way that the lens position with the maximum contrast is used as the focusing point. In addition, in the first embodiment, in order to make the explanation easier to understand, when the part 2 of the transfer object is indirectly in contact with the pressing assembly 6 through the belt 1, the position of the first imaging lens 52 is fixed in advance as the focal position and the focus is focused because the degree of deviation in the vertical direction can be ignored. In addition, since the optical observation unit 5 selectively adopts automatic focus processing for observation, the imaging lens control unit 56 can be set to drive the first imaging lens 52 as a focus lens to implement contrast automatic focus.

The illumination light source 57 is used to illuminate the transfer part 2 and substrate 3 located directly below the object lens 51. The illumination light emitted from the light source 57 passes through the lens M5, M3, and M6 and then penetrates the object lens 51 to illuminate the part 2 and substrate 3 as specific subjects.

FIG4 is an explanatory diagram showing an example of the construction of the pressing assembly 6. The pressing assembly 6 has light transmittance in the wavelength band from visible light to ultraviolet light, and presses the part 2 of the transfer object from the other side of the belt body 1 (hereinafter referred to as the "inner side of the belt body 1") (refer to FIG3). Specifically, the pressing assembly 6 is preferably made of transparent quartz glass material. Then, the top 61 and the bottom 62 of the pressing assembly 6 are curved surfaces with different curvatures, respectively. That is, the curved surface of the top 61 of the pressing assembly 6 is set from an optical point of view. In addition, the curved surface of the bottom 62 is set from a mechanical engineering point of view. In addition, although the curved surface shape of the bottom 62 satisfies specific optical conditions separately, it is preferred from the point of view that it will not affect the optics. The details will be described later using Figure 7. Then, the pressing assembly 6, as shown in Figure 1, also has the function of bending the belt body 1 to support it and serve as a pressing jig.

Here, in FIG. 4 , the light (illumination light) that passes through the object lens 51 passes through the pressing component 6 and is focused again at the focal position of the observation surface 63 where the focus is focused by the action of the object lens 51 . Then, the reflected light reflected from the observation surface 63 will form a spherical wave SW, and will penetrate the pressing component 6 again and return to the objective lens 51 . In addition, although not shown in FIG. 4 , when the first surface of the component 2 is used as the observation surface 63 , the first imaging lens 52 will image the reflected light from the first surface of the component 2 that passes through the object lens 51 . In addition, although not shown in FIG. 4 , when the substrate surface of the substrate 3 is used as the observation surface 63 In this case, the second imaging lens 53 will image the reflected light from the substrate surface that has passed through the objective lens 51 .

When the reflected light of the pressing component 6 passes through the upper surface 61 of the pressing component 6 as a spherical wave SW, the shape of the upper surface 61 is set to be consistent with the curvature radius of the spherical wave SW. In detail, the curvature radius R of the upper surface 61 of the pressing component 6 is represented by the curvature radius Rt with the focal position (i.e., the curvature center C1) as the center. The curvature radius Rt is designed to be the same value as the curvature radius of the spherical wave SW when the spherical wave SW passes through the upper surface 61. This is to prevent the wavefront of the spherical wave SW generated by the focal position of the observation surface 63 from changing, that is, to suppress the generation of aberrations on the upper surface 61. When the observation surface 63 is in contact with the bottom 62 of the pressing component 6, the thickness T of the pressing component 6 will be consistent with the curvature radius Rt.

FIG. 5 is an explanatory diagram of the shape of the top 61 of the pressing component 6. (a) illustrates a case where the top 61 of the pressing component 6 has a curved surface. In this case, the wavefront of the spherical wave SW does not change as described above using FIG. 4. That is, since the light does not bend on the top 61, no aberration is generated. (b) illustrates a pressing component 6a in which the top 61a is flat, unlike the top 61 of the pressing component 6 shown in (a). When the top 61a is flat, the light bends on the top 61a and aberration is generated, so the resolution of the optical system is reduced and high-precision transfer is impeded.

FIG6 is a photograph for observing the shape of the top of the pressing component 6. In order to make the explanation easier to understand, the photograph observed under a microscope is used for explanation. FIG6(a) is a photograph of the test board after the numbers are hollowed out. The row of number 1 is a hole with a line width of 0.977μm, the row of number 2 is a hole with a line width of 0.870μm, and the row of number 3 is a hole with a line width of 0.775μm. The photograph shown in FIG6(a) is an example of the state after focusing.

Figure 6(b) shows an example of a photograph taken through a 3mm thick light-transmitting plate in the state of Figure 6(a). In this case, the resolution of the image is lower than that of the photograph taken in Figure 6(a).

In contrast, Figure 6(c) shows an example of a photograph observed through a translucent hemispherical body with a thickness of 2.5 mm and a radius of curvature of 2.5 mm. In addition, the observation magnification of the microscope is the microscope magnification × the refractive index of the hemispherical body. In this case, the resolution of the image is improved compared to the photograph of Figure 6(b). This is because the numerical aperture becomes larger due to the refractive index, thereby increasing the resolution.

From the photographs of Figure 6 (a) to (c), it can be seen that the shape of the upper surface 61 of the pressing component 6 is as shown in Figure 4. It is better to design the shape of the upper surface 61 so that when the reflected light passes through the upper surface 61 as a spherical wave SW, it will be consistent with the curvature radius of the spherical wave SW. With this design, as long as the pressing component 6 is combined with the existing object lens 51, there is no need to redesign or manufacture the object lens dedicated to the component packaging device, and a component packaging device that can perform high-precision transfer can be realized.

FIG. 7 is an explanatory diagram of the shape of the bottom 62 of the pressing assembly 6. The shape of the bottom 62 of the pressing assembly 6 (the whole is omitted) is preferably a plane from an optical point of view, but as long as the light path difference within the field of view (radius) s shown in FIG. 7 converges within the range of the focal depth d of the object lens 51, a curved surface is also acceptable. Regarding this point, the reason why the bottom 62 in FIG. 7 is not made flat but is deliberately curved when viewed from the front is as follows. That is, since the belt body 1 is transported in a roll-to-roll manner, it is preferably a curved (cylindrical) shape from a mechanical engineering point of view in conjunction with the curved belt body 1 shown in FIG. 1.

When the pressing component 6 is, for example, synthetic quartz, a refractive index of 1.458 and an Abbe number (Abbe Number) of 67.70, which indicates the degree of difference in the refractive index for each wavelength, are used.

To explain in detail, in FIG7 , regarding the shape of the bottom 62 of the pressing component 6, the condition is that the following relationship is established.

Formula (1): z = R _b (1-cosθ)

Formula (2): (n-1)z<d

Formula (3): tanθ = s / R _b

Here, regarding each parameter, z is the distance between the lower surface 62 of the curved surface shape of the pressing component 6 and the observation surface 63, _Rb is the radius of curvature of the lower surface when the center of curvature set corresponding to the shape of the lower surface 62 is set as C2, n is the refractive index of the material of the pressing component 6, d is the focal depth of the object lens 51, and s is the field of view (radius). z is equivalent to the light path length at the field of view s position. The light path length of the central part is nz because it is in the medium with a refractive index of n, and the difference in the light path length is nz-z=(n-1)z. In addition, the distance (z) between the lower surface 62 of the curved surface shape of the pressing component 6 and the observation surface 63 will become consistent when cosθ is 0 degrees.

Based on the above, the radius of curvature _Rb used to define the shape of the bottom 62 of the pressing assembly 6 preferably satisfies the above-mentioned relationship (1) to (3). That is, the conveying section 4 adopts a roll-to-roll method and the belt body 1 is configured into an arc shape through the pressing assembly 6 as shown in FIG1. If the bottom 62 of the pressing assembly 6 is a curved surface, when the pressing assembly 6 is used to press the belt body 1, the belt body 1 will not generate unnecessary stress and deformation at the edges on both sides of the bottom 62 due to the weight of the pressing assembly 6.

The irradiation unit 7 irradiates light of a wavelength (e.g., 365 nm) that has been preset for photoreaction toward the transfer position pre-coated with the photoreactive adhesive. The photoreactive adhesive is an ultraviolet curing adhesive that hardens by, for example, ultraviolet irradiation. As described above, the tape body 1 is an adhesive tape whose adhesive force decreases by ultraviolet irradiation. The irradiation unit 7 irradiates ultraviolet irradiation toward the transfer position at the time when the part 2 of the transfer object is transferred to the substrate 3. In addition, the above-mentioned time point refers to the most appropriate time for the irradiation unit 7 to irradiate light such as ultraviolet irradiation.

Referring to FIG. 3 , when the irradiation unit 7 emits ultraviolet rays, the ultraviolet rays will be reflected by the mirrors M5 and M6 and will penetrate the object lens 51 and be guided toward the transfer position. Specifically, the irradiation unit 7 will irradiate the first and second surfaces of the transfer object part 2 on the belt body 1 according to the light path of the ultraviolet rays to peel the first surface of the part 2 from the belt body 1 and then fix the second surface of the part 2 at the transfer position of the substrate 3. That is, the irradiation unit 7 hardens the adhesive of the adhesive layer 1b of the belt body 1 by irradiating ultraviolet rays, thereby reducing the adhesive force to peel the part 2 from the belt body 1.

On the other hand, the unsealed portion of the component 2 on the substrate 3 is pre-coated with a UV-curing adhesive, and the second surface of the component 2 is placed at the transfer position (unsealed portion) of the substrate 3 to make it contact with the adhesive. Then, the adhesive is cured by the UV irradiation. In this way, the component 2 is fixed to the substrate 3. That is, the UV rays emitted from the irradiation portion 7 penetrate the pressing assembly 6 and act on the adhesive layer 1b adhered to the first surface of the component 2. Furthermore, the structure is such that although a part of the UV rays will be absorbed by the component 2, it will still penetrate the component 2 and act on the UV-curing adhesive.

The transfer section 8 has a pressing assembly 6, and by aligning the component 2 and the substrate 3 under simultaneous observation and moving the pressing assembly 6 and the substrate 3 relative to each other, the component 2 is pressed at the transfer position by the pressing assembly 6, so that the component 2 is transferred and packaged on the substrate 3. In addition, the relative movement includes (1) fixing the pressing assembly 6 and moving the substrate 3, (2) moving the pressing assembly 6 and fixing the substrate 3, and (3) moving the pressing assembly 6 and the substrate 3. In the first embodiment, (1) is adopted. Here, in the case of (2) and (3), a lifting mechanism (not shown) is additionally provided in the component packaging device, which can raise and lower the pressing assembly 6 by the instruction of the control section 9. Moreover, transfer, from a higher level concept, means to place the part 2 to be transferred at the transfer position on the substrate 3 and then peel the part 2 off the tape 1.

Specifically, the transfer unit 8 first moves the substrate 3 in a vertically upward direction while being observed by the optical observation unit 5, and uses the pressing assembly 6 to press the component 2 at the transfer position of the substrate 3 from the inner surface of the belt 1. That is, pressing the component 2 at the transfer position means that the pressing assembly 6 presses the component 2 through the belt 1, thereby positioning the component 2 at the transfer position of the substrate 3. Then, the transfer unit 8 places the component 2 of the transfer object at the transfer position of the substrate 3 by irradiating ultraviolet rays, and then peels the component 2 from the belt 1 by irradiating ultraviolet rays, and encapsulates the component 2 on the substrate 3.

Regarding the detailed structure, the transfer unit 8 is shown in FIG3 and includes a pressing assembly 6, an XYZ stage 81, an adsorption stage 82, a coating device 83, and a stage control unit 84. The XYZ stage 81 has a mechanism that moves the substrate 3 in the three-axis direction. The adsorption stage 82 is disposed on the XYZ stage 81 and adsorbs and supports the substrate 3.

The coating device 83 pre-coats the UV curing adhesive on the unsealed part of the component 2 on the substrate 3. The coating device 83 is a high-precision dispenser that can apply the UV curing adhesive solvent to an area where each dimension of the outer shape is about tens to hundreds of μm. The stage control unit 84 moves the XYZ stage 81 by instructions from the control unit 9, so that the coating device 83 can apply the adhesive to the unsealed part of the component 2 by pinpoint.

The control unit 9 will comprehensively control the conveying unit 4, the optical observation unit 5, the illumination unit 7 and the transfer unit 8.

FIG8 is a block diagram showing an example of a hardware configuration of the control unit 9 shown in FIG1. The control unit 9 is a control computer, which has a processor 9a, a storage 9b, a memory 9c, an input device 9d, a communication interface 9e, a display device 9f, and a bus 9g. The processor 9a, the storage 9b, the memory 9c, the input device 9d, the communication interface 9e, and the display device 9f are connected to each other through the bus 9g. In addition, the control unit 9 is connected to the conveying unit 4, the optical observation unit 5, the illumination unit 7, and the transfer unit 8 through a communication loop in order to transmit a control signal indicating, for example, the content of an action to the conveying unit 4, the optical observation unit 5, the illumination unit 7, and the transfer unit 8.

The processor 9a implements the control of the control unit 9. In addition, the storage 9b is a storage device such as a HDD (Hard Disk Drive) or a flash memory, which stores programs or various information.

The memory 9c is a memory device such as RAM (Random Access Memory) and is installed with a program that will be implemented by, for example, the processor 9a. The input device 9d is an input element such as a keyboard or a touch panel. The communication interface 9e is a communication interface for information communication. The display device 9f is, for example, a liquid crystal display, which will display a function menu screen or output results for operation in response to the instructions of the processor 9a.

Furthermore, the control unit 9 realizes various functions through the cooperation of hardware such as the processor 9a, the storage 9b and the memory 9c and the program. The program includes a control program (parts packaging program) for realizing the part packaging method of the present invention.

Specifically, the control program, if explained with reference to FIG. 3, includes the following steps: a conveying step, in which the parts 2 attached to one side of the belt 1 at a preset arrangement pitch are sequentially positioned just above the transfer position to be transferred to the substrate 3 by feeding out the belt 1, and the fed portion of the belt 1 is rolled into a roll; a step in which the illumination light from the light source 57 is irradiated on the parts 2 and the substrate 3 of the transfer object, and the reflected light from the parts 2 and the substrate 3 is divided into two systems to simultaneously observe the parts 2 and the substrate 3 of the transfer object; and a step in which the parts 2 and the substrate 3 are aligned with each other under simultaneous observation. The step of pressing the part 2 to the transfer position by moving the light-transmitting pressing assembly 6 that presses the part 2 of the transfer object from the inner surface of the belt 1 relative to the substrate 3; the step of irradiating the transfer position pre-coated with a light-reactive (e.g., ultraviolet) adhesive with a wavelength pre-set for light reaction (e.g., ultraviolet) at the transfer position when the part 2 of the transfer object is transferred to the substrate 3; and the step of encapsulating the part 2 on the substrate 3 by transferring the part 2 of the transfer object to the transfer position and peeling the part 2 from the belt 1. The control unit 9 comprehensively controls the conveying unit 4, the optical observation unit 5, the irradiation unit 7, and the transfer unit 8 according to this control program.

Next, a component packaging method will be described in which the component packaging device constructed in the above manner is used to transfer and package the component 2 on the substrate 3.

FIG9 is a flowchart showing the first embodiment of the component packaging method of the present invention. FIG10 and FIG11 are process diagrams (1) and (2) for explaining the first embodiment of the component packaging method. First, after turning on the power of the component packaging device (not shown), the control unit 9 shown in FIG8 will receive an instruction input indicating the start of the operation of the component packaging method through the input device 9d. Afterwards, the control unit 9 will start the processing of the flowchart shown in FIG9 according to the control program used to implement the component packaging method.

In step S1, a process of applying a bonding agent to a transfer position where the component 2 is transferred to the substrate 3 is implemented. Specifically, the XYZ stage 81 shown in FIG3 is controlled by the stage control unit 84. First, the adsorption stage 82 adsorbing the substrate 3 is moved to position the unpackaged portion of the component 2 directly below the spray head (not shown) of the coating device 83. In addition, the transfer position refers to the unpackaged portion of the component 2. Specifically, the transfer position is a concave portion 31 of a concave shape representing the unpackaged portion of the component 2 shown in FIG10(a). The coating device 83 applies, for example, a UV curable bonding agent to the bottom surface of the concave portion 31.

In the first embodiment, the coordinate information of the unpackaged part of the component 2 in the substrate 3 is stored in the memory 9b of the control unit 9 in advance, and the XYZ stage 81 can be controlled by the stage control unit 84 to position the unpackaged part of the component 2 directly below the spray head of the coating device 83 according to the coordinate information.

Next, the coating device 83 sprays the adhesive solvent from the nozzle to coat the transfer position (recess 31) of the substrate 3. When there are multiple unpackaged parts of the component 2, the coating device 83 can coat the adhesive at the transfer position of the substrate 3 by repeating the process S1.

In step S2, the substrate 3 is moved so that the transfer position of the substrate 3 becomes under the object lens 51 (refer to FIG. 3). Specifically, the stage control unit 84 controls the XYZ stage 81 to move the adsorption stage 82 adsorbing the substrate 3, thereby moving the substrate 3 so that the transfer position of the transfer part 2 becomes under the object lens 51. FIG. 3 illustrates the state after the adsorption stage 82 adsorbing the substrate 3 moves. FIG. 10(a) specifically illustrates the state of moving the transfer position of the substrate 3 to under the object lens 51 shown in FIG. 3. In addition, the substrate 3 shown in FIG. 10 to FIG. 12 and FIG. 14 is a front view of a part of the substrate 3 enlarged.

In step S3, the second imaging lens 53 shown in FIG3 is driven to focus on the substrate surface. Specifically, the second camera 55 shown in FIG3 captures the image of the substrate surface of the substrate 3 formed through the second imaging lens 53 and converts it into information of the second image, and transmits the information to the control unit 9 for analysis. Then, the control unit 9 drives the second imaging lens 53 by the above-mentioned contrast autofocus to focus on the substrate surface. Then, the control unit 9 analyzes the second image to detect the transfer position of the substrate 3.

In step S4, the part 2 on the belt 1 is moved under the object lens 51. Specifically, in step S4, the part 2 arranged on the surface of the belt 1 with the arrangement pitch P is positioned directly above the transfer position 31 to be transferred to the substrate 3. Figure 10(b) is a schematic diagram specifically illustrating the state of moving the part 2 on the belt 1 under the object lens 51 shown in Figure 3. This state means that the part 2 is positioned directly above the transfer position. Then, the part 2 becomes the part 2 of the transfer object.

In step S5, the first camera 54 is used to detect the position of the part 2. Specifically, the first camera 54 shown in FIG. 3 captures the image of the part 2 formed through the first imaging lens 52 and converts it into information of the first image, and transmits the information to the control unit 9 for analysis. The control unit 9 analyzes the first image to detect the current position of the part 2 to be transferred.

In step S6, the transfer object part 2 and substrate 3 are observed simultaneously. FIG12 is the first schematic diagram for explaining the simultaneous observation of observation surfaces with different focal positions. In addition, the illustrations of mirrors M3 and M6 shown in FIG3 are omitted for the convenience of explanation. In step S6, the object lens 51 is made common, and the mirror M1 is used as a beam splitter on the upper part of the object lens 51 to divide it into two systems, and the first camera unit 54 observes the part 2 (the surface of the belt 1 and the boundary surface of the first surface of the part 2) as the first image, and the second camera unit 55 observes the substrate surface of the substrate 3 as the second image.

In this case, observing the component 2 means that the first camera unit 54 will take the image of the component 2 through the lenses M1 and M2 and the first imaging lens 52, and convert it into information of the first image, and transmit the information to the control unit 9 for analysis. In addition, observing the substrate 3 means that the second camera unit 55 will take the image of the substrate surface of the substrate 3 through the lens M1 and the second imaging lens 53, and convert it into information of the second image, and transmit the information to the control unit 9 for analysis. Therefore, the actual image analysis will be implemented in the control unit 9.

FIG13 is a photograph used to illustrate the simultaneous observation of observation surfaces with different focal positions. FIG13(a) shows an image of a surface 100 μm away from the pressing component 6 as a photograph. The photograph was taken by replacing the substrate 3 with the test plate shown in FIG6 to make the explanation easier to understand. In addition, this photograph is taken before the second imaging lens 53 is moved, and is taken when the second imaging lens 53 is in the standard position. Therefore, FIG13(a) will be an image in which the focal position is not focused.

FIG. 13(b) shows a photograph taken by moving the second imaging lens 53 to focus the image by the contrast auto focus. FIG. 12 is an example of the state of FIG. 13(b). In addition, the standard position may also be the position of the second imaging lens 53 shown in FIG. 14, for example.

As described in FIG. 4 for the upper surface 61 of the pressing component 6, the shape of the upper surface 61 is designed so that when the reflected light passes through the upper surface 61 as a spherical wave SW, it will be consistent with the curvature radius of the spherical wave SW, so compared with the planar shape of the upper surface 61a shown in FIG. 5(b), a higher resolution image can be obtained.

In addition, in FIG. 12 , regarding the part 2, since the focus is also focused by the first imaging lens 52 and the first camera 54 takes a picture, the control unit 9 can analyze the position of the part 2 and the transfer position of the substrate 3 according to the image of the part (first image) and the image of the substrate surface of the substrate 3 (second image) to determine the displacement. In this way, as described in the next step S7, the control unit 9 can issue an instruction to the XYZ stage 81 to move the substrate 3 by correcting the displacement while observing it.

In step S7, the position of the component 2 and the transfer position are aligned. Here, although the substrate 3 has been moved in step S4 so that the transfer position of the component 2 is under the object lens 51, when the conveying unit 4 stops the belt 1, the component 2 to be transferred may be displaced in the front-rear direction. The control unit 9 can, for example, analyze the overlapping area of the second surface of the component 2 observed with a space between them and the area of the transfer position under simultaneous observation to determine whether there is displacement. In step S7, when the component 2 and the substrate 3 are displaced under simultaneous observation, the control unit 9 will instruct the XYZ stage 81 to move the substrate 3 for alignment. That is, the control unit 9 will fine-tune the relative position of the component 2 and the substrate 3. Therefore, when no displacement occurs, the alignment between the position of part 2 and the transfer position will remain the same and directly transfer to the next step S8.

In step S8, the substrate 3 is lifted in the Z-axis direction (direction directly above the lead) to press the part 2 at the transfer position. Specifically, in step S8, the substrate 3 is moved in the optical axis direction, and the part 2 of the transfer object is pressed at the transfer position of the substrate 3 by the pressing assembly 6 from the inner surface of the belt 1. Figure 10(c) is a schematic diagram illustrating the process of pressing the part 2 of the transfer object at the transfer position of the substrate 3. In step S8, the part 2 is positioned at the transfer position by pressing and setting it at the transfer position.

FIG. 14 is a second schematic diagram for explaining the simultaneous observation of observation surfaces with different focal positions. The explanation of the symbols in the figure is the same as that in FIG. 12. In step S8, the second imaging lens 53 is moved in the optical axis direction by the above-mentioned contrast automatic focusing and linked to the rise of the substrate 3 in the Z-axis direction according to the analysis result of the control unit 9, so that the focal position is focused on the substrate surface of the substrate 3. The state shown in FIG. 14 is the time point when the transfer object part 2 is transferred to the substrate 3.

In step S9, ultraviolet rays are irradiated to fix the transfer target part 2 on the substrate 3. Figure 11(a) illustrates the state of irradiating UV (ultraviolet rays) at the time when the transfer target part 2 is transferred to the substrate 3.

In step S10, the irradiation of ultraviolet rays is stopped by closing the irradiation unit 7. Specifically, when the irradiation time of ultraviolet rays is measured and the preset irradiation time is reached, the control unit 9 determines that the adhesive force of the adhesive layer 1b of the belt 1 shown in FIG2(c) has decreased, and the adhesive in contact with the second surface of the component 2 shown in FIG11(a) has hardened and fixed at the transfer position of the substrate 3, and stops the irradiation of ultraviolet rays.

In step S11, the process of encapsulating the component 2 on the substrate 3 is implemented. Specifically, the control unit 9 issues an instruction to the stage control unit 84, and after the transfer target component 2 is placed at the transfer position, the substrate 3 is lowered to peel the transfer target component 2 from the tape 1 to encapsulate the component 2 on the substrate 3. Figure 11(b) illustrates the state where the transfer target component 2 is transferred and encapsulated on the substrate 3.

Furthermore, although not shown in the flowchart of FIG. 9 , after finishing the processing of step S11, the control unit 9 will confirm whether the preset number of parts 2 has been transferred and packaged on the substrate 3. If the preset number is not reached, in order to transfer and package the next part 2 on the substrate 3, it will return to step S2, and the processing of steps S2 to S11 will be repeated in the part packaging method of the present invention. FIG. 11 (c) is an example of the processing of moving the substrate 3 to make the transfer position become the object lens 51 shown in FIG. 3 for the next part 2 to be transferred, and moving the part 2 to the object lens 51.

On the other hand, if the preset quantity has been reached, the control unit 9 will end the processing of the flowchart shown in Figure 9.

Based on the above, according to the first embodiment, as shown in FIG3 , the object lens 51 is made common, and the mirror M1 disposed above the object lens 51 is used to separate the reflected light of the component 2 and the reflected light of the substrate 3 into two systems, and the component 2 and the substrate 3 are observed at the same time, thereby confirming the position of the component 2 and the position of the substrate 3, thereby facilitating alignment, and the component 2 can be transferred and packaged on the substrate 3 with high precision.

In addition, although the illuminating unit 7 of the component packaging device of the first embodiment irradiates ultraviolet rays, the present invention is not limited thereto. The illuminating unit 7 may correspond to the component 2 to be packaged on the substrate 3 and may be any one of (1) an ultraviolet irradiation device, (2) an infrared irradiation device, or (3) an irradiation device that selectively irradiates ultraviolet rays and infrared rays. For example, in the case where the component 2 is a micro-LED chip, the substrate 3 may be fixed with solder, and the adhesive on the side of the tape 1 may be a photo-reactive adhesive that exhibits thermal release properties due to infrared irradiation. In this case, the illuminating unit 7 may be an infrared irradiation device that irradiates light of an infrared wavelength that can detect its thermal release properties as a light source. Here, the infrared irradiation device irradiates, for example, an infrared laser with an oscillation wavelength of 915nm as light with an infrared wavelength.

Furthermore, when the component 2 is a micro LED chip, the adhesive on the side of the belt body 1 can also be a UV curing adhesive. Then, the irradiation unit 7 can be an irradiation device that selectively irradiates ultraviolet rays (e.g., 365nm) and infrared rays (e.g., 915nm). That is, the irradiation unit 7 can also have the above-mentioned ultraviolet irradiation device and the above-mentioned infrared irradiation device, and selectively irradiate ultraviolet rays and infrared rays through the control of the control unit 9. In addition, when selectively irradiating ultraviolet and infrared rays, the lens M6 shown in Figure 3 can be replaced with a semi-transparent lens (such as PMH-30C03-10-25/7 manufactured by SIGMA Optical Co., Ltd.) in the component packaging device to appropriately change the configuration of the lens.

In the component packaging method in this case, in the flowchart shown in FIG9 , in step S1, the alloy to be used for welding is set at the transfer position of the substrate 3. Then, steps S2 to S7 are implemented, and in step S8, the substrate 3 is raised in the Z-axis direction to set the component 2 (micro LED chip) at the transfer position. Then, before transferring to step S9, the alloy of the substrate 3 is melted by infrared irradiation from the illumination unit 7, and then cooled to fix the second surface of the component 2 to the substrate 3 with the alloy.

Next, in step S9, the irradiation unit 7 irradiates ultraviolet light toward the adhesive between the first surface of the component 2 and the tape 1. Then, in step S10, in step S11, the component 2 is separated from the tape 1 by lowering the substrate 3 to encapsulate the component 2 on the substrate 3.

From the above, it can be seen that according to the present invention, even if the component 2 is used as a micro LED chip, the component 2 can still be transferred and packaged on the substrate 3 with high precision.

[Second implementation form]

Next, the second embodiment of the present invention will be described. In addition, the same symbols are given to the components of the first embodiment, and the description is omitted or simplified, mainly to explain the differences.

FIG. 15 is a diagram showing the main structure of the second embodiment of the component packaging device of the present invention. Compared with the component packaging device shown in FIG. 1 , the component packaging device shown in FIG. 15 is characterized in that it does not have a lighting unit 7.

That is, the main structure of the component packaging device shown in FIG15 is equipped with a conveying unit 4, an optical observation unit 5, a transfer unit 8, and a control unit 9. In addition, the pressing assembly 6 shown in FIG15 is spatially separated as in FIG1, but is included in the transfer unit 8. In addition, the component packaging device is constructed by removing the illumination unit 7 and the mirror M5 in FIG3.

In the second embodiment, the belt body 1 is a resin film with an adhesive coated on the surface, and has light transmittance that allows visible light to pass through.

FIG. 16 is a flow chart showing the second embodiment of the component packaging method of the present invention. The second embodiment of the component packaging method changes the flow chart shown in FIG. 9 and a part of the control program. In step S20, for example, an adhesive that hardens after drying is pre-applied to the transfer position of the substrate 3. In addition, in order to make the explanation easier to understand, even if there are multiple unpackaged parts of the component 2, the adhesive can be applied only to the transfer position to be transferred each time.

Next, in steps S21 to S27, the same processing as steps S2 to S8 shown in the flowchart shown in FIG. 9 is performed. Next, in step S28, unlike the first embodiment, the component 2 is fixed to the substrate 3 without irradiating ultraviolet rays. Next, in step S29, the component 2 is packaged on the substrate 3. In addition, in order to package the component 2 on the substrate 3 by first attaching the component 2 to the substrate 3 and then peeling the component 2 from the tape 1, the condition is that the adhesion of the first side of the component 2 to the tape 1 must be less than the adhesion of the second side of the component 2 to the transfer position of the substrate 3.

Then, although not shown in the flow chart of FIG. 16 , when the number of transferred parts 2 does not reach the preset number, in order to transfer and package the next part 2 on the substrate 3, it will return to step S20, and the processing of steps S20 to S29 will be repeated again in the part packaging method of the second embodiment.

Therefore, the second embodiment can also transfer and package the component 2 on the substrate 3 with high precision, just like the first embodiment.

Although the preferred implementation form of the present invention has been described above, the present invention is not limited thereto. The present invention can be changed into various forms as long as it does not deviate from the scope of the technical idea shown in the scope of the patent application.

In addition, it should be noted that the implementation order of each process such as the actions in the device and method shown in the patent application scope, the specification and the drawings may be implemented in any order. For example, in the process of the flowchart shown in Figure 9, steps S2 and S3 can also be implemented after steps S4 and S5. In addition, in the process of the flowchart shown in Figure 16, steps S21 and S22 can also be implemented after steps S23 and S24.

1: With body

2: Parts

3:Substrate

4:Transportation Department

5: Optical observation unit

6: Press the assembly

7: Lighting Department

8: Transfer unit

9: Control Department

41: Delivery mechanism

42: Winding mechanism

Claims (7)

A parts packaging device is a parts packaging device for transferring and packaging parts on a substrate, comprising: a conveying section, which sequentially positions parts connected to one side of the belt at a preset arrangement pitch just above a transfer position to be transferred to the substrate by feeding out a thin and long light-transmitting belt that can be rolled into a roll, and the fed portion of the belt is rolled into a roll; an optical observation section, which irradiates the parts to be transferred and the substrate with illumination light from a light source, and makes the reflected light from the parts and the substrate diverge into two systems, so as to simultaneously The transfer part is a light-transmitting pressing component that presses the part of the transfer object from the other side of the belt, and the pressing component and the substrate are moved relative to each other to press the part at the transfer position, so as to transfer and package the part on the substrate; and the control part is a control part that comprehensively controls the conveying part, the optical observation part and the transfer part; the shape of the top of the pressing component is set to be consistent with the curvature radius of the spherical wave when the reflected light passes through the top of the pressing component as a spherical wave. A parts packaging device is a parts packaging device that transfers and packages parts on a substrate, and comprises: a conveying section, which sequentially positions parts connected to one side of the belt at a preset arrangement interval just above a transfer position to be transferred to the substrate by feeding out a thin and long light-transmitting belt that can be rolled into a roll, and the fed portion of the belt is rolled into a roll; an optical observation section, which irradiates the parts of the transfer object and the substrate with illumination light from a light source, and makes the reflected light from the parts and the substrate diverge into two systems, so as to simultaneously observe the parts of the transfer object and the substrate; a transfer section , which has a light-transmitting pressing assembly that presses the part of the transfer object from the other side of the belt, and by moving the pressing assembly relative to the substrate to press the part at the transfer position, the part is transferred and packaged on the substrate; and a control unit that comprehensively controls the conveying unit, the optical observation unit and the transfer unit; The optical observation unit selectively adopts an automatic focus process that focuses on a specific object for observation, and performs the aforementioned automatic focus process on the substrate surface of the substrate based on the reflected light from the substrate guided by at least one of the two systems. For example, in the component packaging device of item 2 of the patent application, the shape of the top surface of the pressing component is set to be consistent with the radius of curvature of the spherical wave when the reflected light passes through the top surface of the pressing component as a spherical wave. For example, the component packaging device of item 1 or 2 of the patent application scope is provided with a lighting unit, which irradiates the transfer position pre-coated with a photoreactive adhesive with light of a wavelength pre-set for photoreaction; the transfer unit attaches the transfer target component to the substrate by irradiating the light of the wavelength, and then peels the component from the tape body to package the component on the substrate. A component packaging method is a component packaging method for transferring and packaging components on a substrate, and the following steps are implemented: a conveying process is to send out a thin and long light-transmitting belt body that can be rolled into a roll, so that the components connected to one side of the belt body with a preset arrangement spacing are sequentially positioned just above the transfer position to be transferred to the substrate, and the sent-out part of the belt body is rolled into a roll shape; illuminating light from a light source is irradiated on the transfer object component and the substrate, and the light from the component The process of simultaneously observing the part and the substrate of the transfer object by dividing the reflected light of the part and the substrate into two systems; the process of pressing the part of the transfer object from the other side of the belt body, and the shape of the upper surface is set to be consistent with the curvature radius of the spherical wave when the reflected light passes through the upper surface of the pressing component as a spherical wave, and the part is pressed at the transfer position by the light-transmitting pressing component and the substrate; and the process of transferring and packaging the part on the substrate. A component packaging method is a component packaging method for transferring and packaging components on a substrate, and the following processes are implemented: a conveying process is to send out a thin and long light-transmitting belt body that can be rolled into a roll, so as to sequentially position the components connected to one side of the belt body with a preset arrangement pitch just above the transfer position to be transferred to the substrate, and to roll up the sent-out part of the belt body into a roll shape; irradiate the components and the substrate of the transfer object with illumination light from a light source, and make the reflected light from the components and the substrate split into two systems, so as to simultaneously observe the components and the substrate; The parts and substrate of the transfer object, and, selectively adopting the automatic focus processing that focuses on a specific object to be photographed for observation, and performing the aforementioned automatic focus processing and the aforementioned simultaneous observation on the substrate surface of the substrate according to the reflected light from the substrate guided by at least one of the two systems; the process of pressing the part of the transfer object at the transfer position by moving the light-transmitting pressing component that presses the part of the transfer object from the other side of the belt relative to the substrate; and the process of transferring and packaging the part on the substrate. For example, in the component packaging method of item 5 or 6 of the patent application scope, after the process of pressing the component to the transfer position, a process of irradiating the transfer position pre-coated with a photoreactive adhesive with light having a wavelength pre-set for photoreaction is further implemented.

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