TWI881935B - Display device and repairing method thereof - Google Patents

Abstract

A display device includes an array substrate, a reflective insulating layer and a light shielding layer. The array substrate has multiple pixel areas. Each pixel area includes a multiple sub-pixel units. Each sub-pixel unit includes a first pad and a light emitting element. The first pad is disposed on the array substrate. The light emitting element is disposed on the first pad to electrically connect to the first pad. The reflective insulating layer is disposed on the first pad and surrounds the light emitting element. In each pixel area, the reflective insulating layer has at least one recessed part, and the recessed part corresponds to one of the sub-pixel units. The light shielding layer is disposed on the reflective insulating layer and surrounds the light emitting element. In each pixel area, the light shielding layer has a filling part located in the recessed part, and the filling part corresponds to the aforementioned one of the sub-pixel units.

Description

Display device and repair method thereof

The present invention relates to a display device and a repairing method thereof.

Micro light-emitting diode (micro LED) display is a type of flat-panel display (FPD), which is composed of LEDs with a size ranging from 1 to 100 microns. Compared with liquid crystal display devices, micro LED display devices have higher contrast and faster response time, and consume less power. With the technological advancement of the optoelectronic industry, the size of optoelectronic components has gradually developed towards miniaturization. Therefore, micro LED display devices have become the mainstream trend in today's display device industry.

Generally speaking, the yield of micro-LEDs is still not perfect. After testing, a small number of sub-pixel failures are still found in the micro-LEDs that are placed on the array substrate and electrically connected to the electrodes. The existing repair method is to reserve a light shielding layer opening for the repair area next to the original sub-pixel, but the aforementioned method will expose too many pads, causing unnecessary reflected light and generating image interference.

The present invention provides a display device that can effectively determine the position of a repair area without increasing excessive reflectivity, thereby avoiding image interference caused by unnecessary reflected light and improving display quality.

The display device provided in at least one embodiment of the present invention comprises an array substrate, a reflective insulating layer and a light shielding layer. The array substrate has a plurality of pixel regions, each pixel region comprises a plurality of sub-pixel units, each sub-pixel unit comprises a first pad and a light-emitting element, the first pad is disposed on the array substrate, and the light-emitting element is disposed on the first pad to be electrically connected to the first pad. The reflective insulating layer is disposed on the first pads and surrounds the light-emitting elements, and in each pixel region, the reflective insulating layer has at least one recessed portion, and the recessed portion corresponds to one of the sub-pixel units. The light shielding layer is disposed on the reflective insulating layer and surrounds the light emitting elements. In each pixel region, the light shielding layer has a filling portion located in the recessed portion, and the filling portion corresponds to one of the aforementioned sub-pixel units.

In at least one embodiment of the present invention, the reflective insulating layer has a surrounding portion surrounding the recessed portion, the light shielding layer has a covering portion located on the surrounding portion, and the thickness of the filling portion is greater than the thickness of the covering portion.

In at least one embodiment of the present invention, the filling portion has an opening, and the opening exposes a portion of the recessed portion.

In at least one embodiment of the present invention, on a normal line of the array substrate, the recessed portion overlaps with the first pad.

In at least one embodiment of the present invention, on a normal line of the array substrate, the recessed portion and the first pad do not overlap.

In at least one embodiment of the present invention, each of the pixel regions has a device region and a transmission region, the plurality of sub-pixel units are located in the device region, and the reflective insulating layer and the light shielding layer are not disposed in the transmission region.

In at least one embodiment of the present invention, each of the sub-pixel units includes a second pad disposed on the array substrate, the light-emitting element is disposed on the second pad to be electrically connected to the second pad, and the reflective insulating layer is disposed on these second pads.

The display device repair method proposed in at least another embodiment of the present invention comprises the following steps. Detecting the display device. Detecting that the light-emitting element of one of the plurality of sub-pixel units has a defect. Using an optical device to determine the position of the filling portion corresponding to the aforementioned one of the plurality of sub-pixel units to locate a repair area. Removing the reflective insulating layer and the light-shielding layer in the repair area to expose a portion of the first pad. Installing a replacement light-emitting element on the aforementioned portion of the first pad to electrically connect the first pad.

In at least another embodiment of the present invention, the display device repair method further includes forming a backfill light shielding layer to cover the light emitting element of one of the plurality of sub-pixel units.

In at least another embodiment of the present invention, the display device repair method further includes removing the light emitting element of one of the plurality of sub-pixel units.

In the following text, in order to clearly present the technical features of the present invention, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions, etc.) in the drawings will be enlarged in unequal proportions, and the number of some elements will be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings and the dimensions and shapes presented by the elements, but should cover the dimensions, shapes, and deviations therefrom caused by actual processes and/or tolerances. For example, the flat surface shown in the drawings may have rough and/or nonlinear features, and the sharp corners shown in the drawings may be rounded. Therefore, the elements presented in the drawings of the present invention are mainly used for illustration, and are not intended to accurately depict the actual shape of the elements, nor are they used to limit the scope of the patent application of the present invention.

Secondly, the words "approximately", "approximately" or "substantially" used in the present invention not only cover the numerical values and numerical ranges clearly stated, but also cover the permissible deviation range that can be understood by a person of ordinary skill in the art to which the invention belongs, wherein the deviation range can be determined by the error generated during measurement, and the error is caused by the limitations of the measurement system or process conditions, for example. For example, two objects (such as the planes or traces of a substrate) are "substantially parallel" or "substantially perpendicular", wherein "substantially parallel" and "substantially perpendicular" respectively represent that the parallelism and perpendicularity between the two objects may include non-parallelism and non-perpendicularity caused by the permissible deviation range.

In addition, "approximately" may mean within one or more standard deviations of the above values, such as ±30%, ±20%, ±10% or ±5%. The words "approximately", "approximately" or "substantially" used in the present invention may select an acceptable deviation range or standard deviation based on the optical properties, etching properties, mechanical properties or other properties, and do not apply a single standard deviation to all properties such as the above optical properties, etching properties, mechanical properties and other properties.

The spatially relative terms used in the present invention, such as "below", "under", "above", "on", etc., are for the purpose of facilitating the description of the relative relationship between one element or feature and another element or feature, as shown in the figure. The true meaning of these spatially relative terms includes other orientations. For example, when the figure is flipped 180 degrees up and down, the relationship between one element and another element may change from "below" or "under" to "above" or "on". In addition, the spatially relative descriptions used in the present invention should also be interpreted in the same way.

It should be understood that, although the present invention may use terms such as "first", "second", and "third" to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in the present invention may include any one or more combinations of the related listed items depending on the actual situation.

Although a series of operations or steps are used in the present invention to illustrate the repair method, the order in which these operations or steps are shown should not be interpreted as a limitation of the present invention. For example, some operations or steps can be performed in different orders and/or simultaneously with other steps. In addition, each operation or step described herein can include a plurality of sub-steps or actions.

In addition, the present invention may be implemented or applied through other different specific embodiments, and the details of the present invention may also be combined, modified and changed in various embodiments based on different viewpoints and applications without departing from the concept of the present invention.

FIG. 1 is a schematic top view of a display device 10 according to at least one embodiment of the present invention. FIG. 2A is an enlarged schematic view of region A in FIG. 1 . FIG. 2B is a schematic cross-sectional view taken along line a-a′ in FIG. 2A . Referring to FIG. 1 , FIG. 2A and FIG. 2B , the display device 10 includes an array substrate 100, a reflective insulating layer 102 and a light shielding layer 104. The array substrate 100 has a plurality of pixel regions PX, each pixel region PX includes a plurality of sub-pixel units PU, each sub-pixel unit PU includes a first pad P1 and a light emitting element LE, the first pad P1 is disposed on the array substrate 100, and the light emitting element LE is disposed on the first pad P1 to be electrically connected to the first pad P1.

The reflective insulating layer 102 is disposed on the first pads P1 and surrounds the light emitting elements LE. In each pixel region PX, the reflective insulating layer 102 has at least one recess 102r, and the recess 102r corresponds to one of the sub-pixel units PU. The light shielding layer 104 is disposed on the reflective insulating layer 102 and surrounds the light emitting elements LE. In each pixel region PX, the light shielding layer 104 has a filling portion 104f located in the recess 102r, and the filling portion 104f corresponds to one of the aforementioned sub-pixel units PU.

Since the reflective insulating layer 102 and the light shielding layer 104 both surround the light emitting element LE and respectively have a recessed portion 102r and a filling portion 104f corresponding to one of the sub-pixel units PU, without exposing the first pad P1, the filling portion 104f located in the recessed portion 102r will present a darker color after the external light is reflected by the reflective insulating layer 102 and the light shielding layer 104 to locate the repair area. Therefore, the position of the repair area can be determined without increasing excessive reflectivity, thereby avoiding unnecessary reflected light from causing image interference, thereby improving display quality.

As shown in FIG. 2B , the reflective insulating layer 102 has a surrounding portion 102s surrounding the recessed portion 102r, the light shielding layer 104 has a covering portion 104c located on the surrounding portion 102s, and the thickness t1 of the filling portion 104f is greater than the thickness t2 of the covering portion 104c. With the aforementioned thickness design, after the external light is reflected by the reflective insulating layer 102 and the light shielding layer 104, the color presented by the filling portion 104f located in the recessed portion 102r can be effectively deepened, thereby improving the recognition rate and accuracy of determining the position of the repair area.

In some embodiments, the thickness of the recessed portion 102r may be smaller than the thickness of the surrounding portion 102s. With the aforementioned thickness design, after the external light is reflected by the reflective insulating layer 102 and the light shielding layer 104, the color of the filling portion 104f in the recessed portion 102r with a smaller thickness can be further deepened, which helps to improve the recognition rate and accuracy of the position of the repair area.

Please continue to refer to FIG. 1, FIG. 2A and FIG. 2B. Each sub-pixel unit PU includes a second pad P2 disposed on the array substrate 100, a light-emitting element LE is disposed on the second pad P2 to be electrically connected to the second pad P2, and a reflective insulating layer 102 is disposed on these second pads P2. In detail, the light-emitting element LE includes a first electrode E1 and a second electrode E2 (shown in FIG. 7B and FIG. 8B), and is electrically connected to the first pad P1 and the second pad P2 via the first electrode E1 and the second electrode E2, respectively. In addition, as shown in FIG. 2A and FIG. 2B , the recessed portion 102r overlaps with the first pad P1, and the recessed portion 102r may also overlap with the second pad P2 on the normal line of the array substrate 100. With the above-mentioned design, when the original light-emitting element has defects and a replacement light-emitting element needs to be provided, it can be ensured that the replacement light-emitting element forms an effective electrical connection with the first pad P1 and the second pad P2, thereby improving the repair yield.

As shown in FIG1 , FIG2A and FIG2B , the reflective insulating layer 102 surrounds and contacts the light emitting elements LE, and the reflective insulating layer 102 has a plurality of recessed portions 102r, and the recessed portions 102r correspond to the sub-pixel units PU, respectively. The light shielding layer 104 surrounds and contacts the light emitting elements LE, and the light shielding layer 104 has a filling portion 104f located in the recessed portion 102r, and the filling portion 104f corresponds to the sub-pixel units PU, respectively.

In some embodiments, the light emitting element LE may be a light emitting diode (LED), such as a micro LED (micro LED), whose size is about 1 to 100 micrometers. For example, the light emitting element LE may be a flip-chip micro LED, that is, the first electrode and the second electrode of the light emitting element LE are both located on the side of the light emitting element LE facing the array substrate 100, but the present invention is not limited thereto. In other embodiments, the light emitting element LE may be a vertical micro LED, that is, the first electrode and the second electrode of the light emitting element LE are respectively located on the side of the light emitting element LE facing the array substrate 100 and the side facing away from the array substrate 100.

As shown in FIG. 1 , each pixel region PX has a device region EA and a transmission region TA, the sub-pixel unit PU is located in the device region EA, and the reflective insulating layer 102 and the light shielding layer 104 are not disposed in the transmission region TA. Specifically, since the sub-pixel unit PU, the reflective insulating layer 102, and the light shielding layer 104 are all located in the device region EA, it is not easy for external light to pass through the device region EA, and since the sub-pixel unit PU, the reflective insulating layer 102, and the light shielding layer 104 are not disposed in the transmission region TA, external light can easily pass through the transmission region TA. Therefore, in this embodiment, the display device 10 can be used as a transparent display device, but the present invention is not limited thereto. In other embodiments, the pixel region PX of the display device 10 may not have a transparent region, that is, the display device 10 may be a non-transparent display device.

FIG3 is a schematic top view of a mask 102M of the reflective insulating layer 102 of at least one embodiment of the present invention. Referring to FIG3 , the mask 102M of the reflective insulating layer 102 includes an opening portion OP corresponding to the device area EA and a shielding portion SP corresponding to the through area TA, the light-emitting element LE, and the recessed portion 102r. In this embodiment, the reflective insulating layer 102 includes a negative photoresist, so the reflective insulating layer 102 corresponding to the opening portion OP will remain, and the reflective insulating layer 102 corresponding to the shielding portion SP will be completely or partially removed, thereby forming the reflective insulating layer 102 in the device area EA.

It is worth noting that, since the light-emitting elements LE may be offset during the mass transfer to the array substrate 100, the light-emitting elements LE may not always be located at the preset positions (e.g., the lower half of the sub-pixel unit PU) in the sub-pixel unit PU. Therefore, two shielding portions SP are designed at the positions of the mask 102M of the reflective insulating layer 102 corresponding to the sub-pixel unit PU, and in the subsequent exposure and photoresist removal processes, the reflective insulating layer 102 located at the positions of the two shielding portions SP corresponding to the positions where the light-emitting elements LE are not arranged will be partially removed to form a recessed portion 102r, and the reflective insulating layer 102 located at the positions of the two shielding portions SP corresponding to the positions where the light-emitting elements LE are arranged will be completely removed because the thickness formed on the light-emitting elements LE is too thin.

In some embodiments, the materials of the reflective insulating layer 102 and the light shielding layer 104 may include photoresist, etc. For example, the reflective insulating layer 102 may be a photoresist including scattering particles, the material of the scattering particles is, for example, titanium dioxide, and the reflectivity of the reflective insulating layer 102 is not less than 60%, and the light shielding layer 104 may be a dark photoresist, the optical density (OD) of the light shielding layer 104 is not less than 2, and the transmittance of the light shielding layer 104 is not more than 1%. The array substrate 100 may include components or circuits required by the display device 10, such as driving components, switch components, power lines, driving signal lines, timing signal lines, current compensation lines, detection signal lines, etc. The materials of the first pad P1 and the second pad P2 may include nickel-gold alloy, etc.

FIG4 is a schematic top view of a display device 10′ of at least one embodiment of the present invention. FIG5A is an enlarged schematic diagram of area B in FIG4 . FIG5B is a schematic cross-sectional view drawn along section line b-b′ in FIG5A . Please refer to FIG4 , FIG5A and FIG5B . Most of the component structures, materials, processes and relative position relationships of the embodiment of FIG4 and the embodiment of FIG1 are the same, so the same technical features are not described here in detail. The difference between the two embodiments is that the filling portion 104f of the light shielding layer 104 of the display device 10′ of FIG4 has an opening O, and the opening O exposes a portion of the recessed portion 102r of the reflective insulating layer 102.

With the above design, after the external light is reflected by the reflective insulating layer 102 and the light shielding layer 104, in addition to the filling portion 104f which can present a darker color, the recessed portion 102r exposed by the opening O of the filling portion 104f can present a light bright spot in the aforementioned filling portion 104f which presents a darker color, thereby forming an obvious contrast, thereby improving the recognition rate and accuracy of determining the position of the repair area.

As shown in FIG. 5A and FIG. 5B , on the normal line of the array substrate 100 , the opening O of the filling portion 104f overlaps with the first pad P1, and the opening O of the filling portion 104f may also overlap with the second pad P2. With the above-mentioned design, when the original light-emitting element has defects and a replacement light-emitting element needs to be provided, it can be ensured that the replacement light-emitting element forms an effective electrical connection with the first pad P1 and the second pad P2, thereby improving the repair yield. In addition, the orthographic projection range of the opening O of the filling portion 104f on the array substrate 100 is located within the orthographic projection range of the recessed portion 102r on the array substrate 100, which can avoid the opening O of the filling portion 104f being too large to generate unnecessary reflected light and generate image interference.

FIG6 is a top view schematic diagram of a mask 104M of the light shielding layer 104 of at least one embodiment of the present invention. Referring to FIG6 , the mask 104M of the light shielding layer 104 includes an opening portion OP corresponding to the device area EA and a shielding portion SP corresponding to the through area TA, the light emitting element LE, and the recessed portion 102r. In this embodiment, the light shielding layer 104 includes a negative photoresist, so the light shielding layer 104 corresponding to the opening portion OP will remain, and the light shielding layer 104 corresponding to the shielding portion SP will be removed, thereby forming the light shielding layer 104 in the device area EA.

It is worth noting that, since the light-emitting elements LE may be offset during the process of transferring a large number of them to the array substrate 100, the light-emitting elements LE may not always be located at the preset positions (e.g., the lower half of the sub-pixel unit PU) in the sub-pixel unit PU, and therefore two shielding portions SP are designed at the positions of the mask 104M of the light-shielding layer 104 corresponding to the sub-pixel unit PU, and in the subsequent exposure and photoresist removal processes, the light-shielding layer 104 located at the positions where the light-emitting elements LE are not arranged in the two shielding portions SP will be removed to form openings O, and the light-shielding layer 104 located at the positions where the light-emitting elements LE are arranged in the two shielding portions SP will be completely removed because the thickness formed on the light-emitting elements LE is too thin.

FIG. 7A is a partially enlarged schematic diagram of a display device of at least another embodiment of the present invention. FIG. 7B is a schematic cross-sectional diagram drawn along the section line c-c' in FIG. 7A. Please refer to FIG. 7A and FIG. 7B. Most of the device structures, materials, processes and relative position relationships of the embodiment of FIG. 7A and FIG. 7B are the same as those of the embodiment of FIG. 2A and FIG. 2B, so the same technical features are not described here. The difference between the two embodiments is that on the normal line of the array substrate 100, the recessed portion 102r of the display device of FIG. 7A and FIG. 7B does not overlap with the first pad P1.

FIG8A is a partially enlarged schematic diagram of a display device of at least another embodiment of the present invention. FIG8B is a cross-sectional schematic diagram drawn along the section line d-d' in FIG8A. Please refer to FIG8A and FIG8B. Most of the component structures, materials, processes and relative positional relationships of the embodiments of FIG8A and FIG8B are the same as those of the embodiments of FIG5A and FIG5B, so the same technical features are not repeated here. The difference between the two embodiments is that on the normal line of the array substrate 100, the recessed portion 102r of the display device of FIG8A and FIG8B does not overlap with the first pad P1, and the opening O of the filling portion 104f does not overlap with the first pad P1.

The designs of FIG. 7A, FIG. 7B, FIG. 8A and FIG. 8B can be applied to a display device including a small-sized light-emitting element, such as a light-emitting element of about 10 micrometers. Since the layout space of the sub-pixel unit of the small-sized light-emitting element is limited, by setting the recessed portion 102r outside the sub-pixel unit, the layout design of the original sub-pixel unit can be avoided from being affected.

In addition, as shown in FIG7A and FIG7B , the recessed portion 102r and the second pad P2 do not overlap on the normal line of the array substrate 100. As shown in FIG8A and FIG8B , the recessed portion 102r and the second pad P2 do not overlap on the normal line of the array substrate 100, and the opening O of the filling portion 104f and the second pad P2 do not overlap.

Fig. 9 to Fig. 13 are partial schematic diagrams of the repair method of the display device 10' of Fig. 4 at different repair stages. Specifically, Fig. 9 (A), Fig. 10 (A), Fig. 11 (A), Fig. 12 (A) and Fig. 13 (A) are respectively top view schematic diagrams of different repair stages, and Fig. 9 (B), Fig. 10 (B), Fig. 11 (B), Fig. 12 (B) and Fig. 13 (B) are respectively cross-sectional schematic diagrams of different repair stages, and the position of the section line is the same as the section line b-b' in Fig. 5A.

Referring to FIG. 9 (A) and FIG. 9 (B), the display device 10' shown in FIG. 4 is detected to detect that the light-emitting element LE of one of the plurality of sub-pixel units PU has a defect. Referring to FIG. 10 (A) and FIG. 10 (B), an optical device (not shown) is used to determine the position of the filling portion 104f corresponding to the aforementioned one of the plurality of sub-pixel units PU to locate the repair area RA, and the reflective insulating layer 102 and the light shielding layer 104 in the repair area RA are removed to expose a portion of the first pad P1. In some embodiments, the optical device may include a charge-coupled device (CCD).

Please refer to FIG. 11 (A) and FIG. 11 (B), the replacement light emitting element LE' is installed on the first pad P1 of the aforementioned portion to be electrically connected to the first pad P1, that is, the first electrode E1' of the replacement light emitting element LE' is electrically connected to the first pad P1. In addition, as shown in FIG. 10 (A) and FIG. 11 (A), the repair area RA further exposes a portion of the second pad P2, and the replacement light emitting element LE' is also located on the second pad P2 of the aforementioned portion to be electrically connected to the second pad P2.

Referring to FIG. 12 (A) and FIG. 12 (B), a backfill reflective insulating layer 102' is formed in the repair area RA, and the backfill reflective insulating layer 102' is disposed on the first pad P1 of the above-mentioned portion and surrounds the replacement light-emitting element LE'. In addition, as shown in FIG. 12 (A), the backfill reflective insulating layer 102' is also disposed on the second pad P2 of the above-mentioned portion.

Please refer to FIG. 13 (A) and FIG. 13 (B), a backfilled light shielding layer 104' is formed to cover the light emitting element LE of one of the above-mentioned multiple sub-pixel units PU. In detail, the backfilled light shielding layer 104' is formed on the light shielding layer 104 and the light emitting element LE of one of the above-mentioned multiple sub-pixel units PU to cover the light shielding layer 104 and the light emitting element LE of one of the above-mentioned multiple sub-pixel units PU, and the backfilled light shielding layer 104' is further formed on the backfilled reflective insulating layer 102' to surround the replacement light emitting element LE'.

FIG. 14 to FIG. 17 are partial schematic diagrams of the repair method of the display device 10' of FIG. 4 at different repair stages. In detail, FIG. 14 (A), FIG. 15 (A), FIG. 16 (A) and FIG. 17 (A) are respectively top view schematic diagrams of different repair stages, and FIG. 14 (B), FIG. 15 (B), FIG. 16 (B) and FIG. 17 (B) are respectively cross-sectional schematic diagrams of different repair stages, and the position of the section line is the same as the section line b-b' in FIG. 5A. In addition, the repair method of the display device 10' of FIG. 14 to FIG. 17 also includes detecting the display device 10' as shown in FIG. 9 and detecting that the light-emitting element LE of one of the plurality of sub-pixel units PU has a defect, so the same technical features will not be repeated here.

Please refer to Figures 14 (A) and 14 (B), use an optical device (not shown) to determine the position of the filling portion 104f corresponding to the above one of the multiple sub-pixel units PU to locate the repair area RA, remove the reflective insulating layer 102 and the shielding layer 104 in the repair area RA to expose a portion of the first pad P1, and remove the light-emitting element LE of the above one of the multiple sub-pixel units PU.

Please refer to FIG. 15 (A) and FIG. 15 (B), the replacement light emitting element LE' is installed on the first pad P1 of the aforementioned portion to be electrically connected to the first pad P1, that is, the first electrode E1' of the replacement light emitting element LE' is electrically connected to the first pad P1. In addition, as shown in FIG. 14 (A) and FIG. 15 (A), the repair area RA further exposes a portion of the second pad P2, and the replacement light emitting element LE' is also located on the second pad P2 of the aforementioned portion to be electrically connected to the second pad P2.

Referring to FIG. 16 (A) and FIG. 16 (B), a backfill reflective insulating layer 102' is formed in the repair area RA, and the backfill reflective insulating layer 102' is disposed on the first pad P1 of the above-mentioned portion and surrounds the alternative light-emitting element LE'. In addition, as shown in FIG. 16 (A), the backfill reflective insulating layer 102' is also disposed on the second pad P2 of the above-mentioned portion. Referring to FIG. 17 (A) and FIG. 17 (B), a backfill light-shielding layer 104' is formed on the backfill reflective insulating layer 102' to surround the alternative light-emitting element LE'.

It should be understood that although the repair methods of the display devices of Figures 9 to 13 and the repair methods of the display devices of Figures 14 to 17 use the display device 10' of Figure 4 as an example to illustrate the repair steps, the steps of repairing the display device 10 of Figure 1 as an example are substantially the same as the steps of repairing the display device 10' of Figure 4 as an example, and thus will not be elaborated upon here.

In summary, in the display device and the repair method thereof of at least one embodiment of the present invention, since the reflective insulating layer and the light-shielding layer both surround the light-emitting element and respectively have a recessed portion and a filling portion corresponding to one of the sub-pixel units, without exposing the pad, the repair area can be located by using the fact that after the external light is reflected by the reflective insulating layer and the light-shielding layer, the filling portion of the light-shielding layer located in the recessed portion of the reflective insulating layer will present a darker color. Therefore, the position of the repair area can be effectively determined without increasing the reflectivity too much, and unnecessary reflected light can be avoided to cause image interference, thereby improving the display quality .

Although the present invention has been disclosed as above by way of embodiments, they are not intended to limit the present invention. A person having ordinary knowledge in the technical field to which the present invention belongs may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the attached patent application.

10, 10': display device 100: array substrate 102: reflective insulating layer 102': backfilled reflective insulating layer 102M, 104M: mask 102s: surrounding part 102r: recessed part 104: light shielding layer 104': backfilled light shielding layer 104c: covering part 104f: filling part A, B: area a-a', b-b', c-c', d-d': section line E1, E1': first electrode E2: second electrode EA: element area LE: light emitting element LE': alternative light emitting element O: opening OP: opening part P1: first pad P2: second pad PU: Sub-pixel unit PX: Pixel area RA: Repair area SP: Shielding area t1, t2: Thickness TA: Transmission area

Fig. 1 is a schematic top view of a display device of at least one embodiment of the present invention. Fig. 2A is an enlarged schematic diagram of region A in Fig. 1. Fig. 2B is a schematic cross-sectional view drawn along section line a-a' in Fig. 2A. Fig. 3 is a schematic top view of a light mask of a reflective insulating layer of at least one embodiment of the present invention. Fig. 4 is a schematic top view of a display device of at least another embodiment of the present invention. Fig. 5A is an enlarged schematic diagram of region B in Fig. 4. Fig. 5B is a schematic cross-sectional view drawn along section line b-b' in Fig. 5A. Fig. 6 is a schematic top view of a light mask of a light-shielding layer of at least another embodiment of the present invention. Fig. 7A is a partially enlarged schematic diagram of a display device of at least another embodiment of the present invention. Fig. 7B is a schematic cross-sectional view drawn along section line c-c' in Fig. 7A. FIG8A is a partially enlarged schematic diagram of a display device according to at least another embodiment of the present invention. FIG8B is a schematic cross-sectional diagram drawn along the section line d-d' in FIG8A. FIG9 to FIG13 are partial schematic diagrams of a display device repair method according to at least another embodiment of the present invention at different repair stages. FIG14 to FIG17 are partial schematic diagrams of a display device repair method according to at least another embodiment of the present invention at different repair stages.

Domestic storage information (please note the order of storage institution, date, and number) None Overseas storage information (please note the order of storage country, institution, date, and number) None

100: Array substrate

102: Reflective insulation layer

102s: surrounding part

102r: Depression

104: Shading layer

104c: Covering part

104f: Filling section

E1: First electrode

LE: Light-emitting element

P1: First pad

t1, t2: thickness

Claims (10)

A display device comprises: an array substrate having a plurality of pixel regions, wherein each pixel region comprises a plurality of sub-pixel units, each sub-pixel unit comprises: a first pad disposed on the array substrate; and a light-emitting element disposed on the first pad to be electrically connected to the first pad; a reflective insulating layer disposed on the first pads and surrounding the light-emitting elements, wherein in each pixel region, the reflective insulating layer has at least one recessed portion, and the recessed portion corresponds to one of the sub-pixel units; and A light shielding layer is disposed on the reflective insulating layer and surrounds the light-emitting elements, wherein in each pixel area, the light shielding layer has a filling portion located in the recessed portion, and the filling portion corresponds to one of the sub-pixel units. A display device as described in claim 1, wherein the reflective insulating layer has a surrounding portion surrounding the recessed portion, the light shielding layer has a covering portion located on the surrounding portion, and the thickness of the filling portion is greater than the thickness of the covering portion. A display device as described in claim 1, wherein the filling portion has an opening that exposes a portion of the recessed portion. A display device as described in claim 1, wherein the recessed portion overlaps with the first pad on a normal line of the array substrate. A display device as described in claim 1, wherein on a normal line of the array substrate, the recessed portion and the first pad do not overlap. A display device as described in claim 1, wherein each pixel region has a device region and a transmission region, the sub-pixel units are located in the device region, and the reflective insulating layer and the light shielding layer are not disposed in the transmission region. The display device as described in claim 1, wherein each of the sub-pixel units comprises: A second pad disposed on the array substrate, wherein the light-emitting element is disposed on the second pad to be electrically connected to the second pad, and the reflective insulating layer is disposed on the second pads. A method for repairing a display device, comprising: Detecting the display device as described in claim 1; Detecting that the light-emitting element of one of the sub-pixel units has a defect; Using an optical device to determine the position of the filling portion corresponding to the one of the sub-pixel units to locate a repair area; Removing the reflective insulating layer and the light-shielding layer in the repair area to expose a portion of the first pad; and Installing a replacement light-emitting element on the portion of the first pad to electrically connect the first pad. The display device repair method as described in claim 8 further includes: Forming a backfill light shielding layer to cover the light-emitting element of one of the sub-pixel units. The display device repair method as described in claim 8 further includes: Removing the light-emitting element of one of the sub-pixel units.

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