TWI881679B - Methods for positioning objects in an object array, methods for detecting the brightness of light-emitting diode (led) chips, equipment for detecting the brightness of light-emitting diode (led) chips, computer program and computer-readable recording media storing program - Google Patents
Methods for positioning objects in an object array, methods for detecting the brightness of light-emitting diode (led) chips, equipment for detecting the brightness of light-emitting diode (led) chips, computer program and computer-readable recording media storing program Download PDFInfo
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- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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Abstract
Description
本申請係關於一種於一物件陣列定位物件之方法,具體而言,係關於一種透過檢測框於一物件陣列定位物件之方法。本申請亦關於一種檢測發光二極體(LED)晶片亮度之方法、檢測發光二極體(LED)晶片亮度之設備、電腦程式及內儲程式之電腦可讀取記錄媒體。 This application is related to a method for locating an object in an object array, and more specifically, to a method for locating an object in an object array through a detection frame. This application is also related to a method for detecting the brightness of a light emitting diode (LED) chip, a device for detecting the brightness of a light emitting diode (LED) chip, a computer program, and a computer-readable recording medium storing the program.
諸如電視機、電腦螢幕等的電子裝置中係包含由電子元件(例如:發光二極體(light-emitting diode,LED)、有機發光二極體(organic light-emitting diode,OLED))所組成之物件陣列。 Electronic devices such as televisions and computer monitors include an array of objects composed of electronic components (e.g., light-emitting diodes (LEDs) and organic light-emitting diodes (OLEDs)).
傳統上,於檢測該等電子元件時,係預設該等電子元件完美地以相同之間距彼此間隔排列,並以上述預設之固定間距設置檢測框,並進一步分析該檢測框內之電子元件所發出之訊號(例如:亮度)。然而,實際上電子元件並非完美地以相同之間距彼此間隔排列,該等電子元件在垂直及水平方向上皆具有大小不等的偏移,當一電子元件的偏移量較大,以至於至少部分未被檢測框所涵蓋時,將導致檢測結果失真。 Traditionally, when testing these electronic components, it is assumed that these electronic components are perfectly spaced at the same distance from each other, and the detection frame is set at the above-preset fixed distance, and the signal (for example: brightness) emitted by the electronic components in the detection frame is further analyzed. However, in reality, electronic components are not perfectly spaced at the same distance from each other. These electronic components have different sizes of offsets in the vertical and horizontal directions. When the offset of an electronic component is large, so that at least part of it is not covered by the detection frame, it will cause distortion of the detection result.
有鑑於上述問題。本發明係提供一種於一物件陣列定位物件之方法,藉此改善上述問題。 In view of the above problems, the present invention provides a method for positioning objects in an object array, thereby improving the above problems.
為達上述目的及其他目的,本發明係提供一種於一物件陣列定位物件之方法,其係包括:(a)於該物件陣列中,選定二相鄰之物件,其中該二相鄰之物件有一間距,該間距係至少可容納該二相鄰之物件;(b)以上述二相鄰物件之間距定義一檢測框;(c)計算得到該檢測框之一中心點;以及(d)移動該檢測框,直至該檢測框之中心點碰觸上述二相鄰物件中之一物件,以定位該被碰觸之物件。 To achieve the above-mentioned purpose and other purposes, the present invention provides a method for locating an object in an object array, which includes: (a) selecting two adjacent objects in the object array, wherein the two adjacent objects have a distance that can at least accommodate the two adjacent objects; (b) defining a detection frame with the distance between the two adjacent objects; (c) calculating a center point of the detection frame; and (d) moving the detection frame until the center point of the detection frame touches one of the two adjacent objects to locate the touched object.
上述之於一物件陣列定位物件之方法,其中可以該二相鄰物件之間距為一週邊,定義一正方形之檢測框。 In the above method for locating objects in an object array, a square detection frame can be defined with the distance between two adjacent objects as a perimeter.
上述之於一物件陣列定位物件之方法,其可更包括計算該被碰觸物件之一中心點。 The above method for locating an object in an object array may further include calculating a center point of the touched object.
上述之於一物件陣列定位物件之方法,其中該檢測框之中心點碰觸該二相鄰物件之一物件,可使得該檢測框之中心點與該被碰觸物件之中心點重疊。 The above method for locating an object in an object array, wherein the center point of the detection frame touches one of the two adjacent objects, can make the center point of the detection frame overlap with the center point of the touched object.
上述之於一物件陣列定位物件之方法,其中該物件陣列可為一發光二極體(LED)晶片陣列。 The above method for positioning an object in an object array, wherein the object array may be a light emitting diode (LED) chip array.
上述之於一物件陣列定位物件之方法,其中該物件陣列可為一影像。 The above method for locating an object in an object array, wherein the object array may be an image.
為達上述目的及其他目的,本發明亦提供一種檢測發光二極體(LED)晶片亮度之方法,包括:使用如上所述之於一物件陣列定位物件之方法定位該待檢測發光二極體晶片;以及計算該檢測框內該待檢測發光二極體晶片之亮度。 To achieve the above-mentioned purpose and other purposes, the present invention also provides a method for detecting the brightness of a light-emitting diode (LED) chip, comprising: positioning the light-emitting diode chip to be detected using the method of positioning an object in an object array as described above; and calculating the brightness of the light-emitting diode chip to be detected in the detection frame.
為達上述目的及其他目的,本發明亦提供一種檢測發光二極體(LED)晶片亮度之設備,其係包括:一承載平台,其係用以承載具有該待檢測發光二極體晶片之一基板;一影像擷取機構,設置於鄰近該承載平台,其係用以對該基板擷取一影像; 一控制單元,連接於該承載平台,其係用以點亮該待檢測發光二極體晶片;以及一處理單元,連接於該影像擷取機構,其係用以執行如請求項7所述之方法計算該檢測框內該待檢測發光二極體晶片之亮度。 To achieve the above-mentioned and other purposes, the present invention also provides a device for detecting the brightness of a light-emitting diode (LED) chip, which includes: a carrier platform, which is used to carry a substrate having the light-emitting diode chip to be detected; an image capture mechanism, which is arranged adjacent to the carrier platform, which is used to capture an image of the substrate; a control unit, which is connected to the carrier platform, which is used to light up the light-emitting diode chip to be detected; and a processing unit, which is connected to the image capture mechanism, which is used to execute the method described in claim 7 to calculate the brightness of the light-emitting diode chip to be detected in the detection frame.
上述之檢測發光二極體(LED)晶片亮度之設備,其中該影像擷取機構可為一攝影機。 The above-mentioned device for detecting the brightness of a light-emitting diode (LED) chip, wherein the image capture mechanism can be a camera.
上述之檢測發光二極體(LED)晶片亮度之設備,其中該基板可為一薄膜電晶體(TFT)基板。 The above-mentioned device for detecting the brightness of a light-emitting diode (LED) chip, wherein the substrate may be a thin film transistor (TFT) substrate.
為達上述目的及其他目的,本發明亦提供一種電腦程式,其係經由電腦載入並執行後,可完成上述之於一物件陣列定位物件之方法。 To achieve the above and other purposes, the present invention also provides a computer program, which, after being loaded and executed by a computer, can complete the above method of locating objects in an object array.
為達上述目的及其他目的,本發明亦提供一種內儲程式之電腦可讀取記錄媒體,經由電腦載入該程式並執行後,可完成上述之於一物件陣列定位物件之方法。 To achieve the above and other purposes, the present invention also provides a computer-readable recording medium storing a program. After the program is loaded and executed by a computer, the above-mentioned method of locating an object in an object array can be completed.
本發明之於一物件陣列定位物件之方法、檢測發光二極體(LED)晶片亮度之方法、檢測發光二極體(LED)晶片亮度之設備、電腦程式及內儲程式之電腦可讀取記錄媒體,藉由移動該檢測框,直至該檢測框之中心點碰觸上述二相鄰物件中之一物件,可使檢測框之位置貼近物件之實際位置,藉此精準地定義物件的位置。 The present invention provides a method for positioning an object in an object array, a method for detecting the brightness of a light emitting diode (LED) chip, an apparatus for detecting the brightness of a light emitting diode (LED) chip, a computer program, and a computer-readable recording medium storing the program. By moving the detection frame until the center point of the detection frame touches one of the two adjacent objects, the position of the detection frame can be brought close to the actual position of the object, thereby accurately defining the position of the object.
101:檢測框 101:Detection frame
102:檢測框 102: Detection frame
103:檢測框 103:Detection frame
104:檢測框 104: Detection frame
105:檢測框 105: Detection frame
111:物件 111: Objects
112:物件 112: Objects
113:物件 113: Objects
114:物件 114: Objects
115:物件 115: Objects
30:檢測發光二極體(LED)晶片亮度之設備 30: Equipment for detecting the brightness of light-emitting diode (LED) chips
31:承載平台 31: Carrying platform
311:待檢測發光二極體晶片 311: LED chip to be tested
312:基板 312: Substrate
32:影像擷取機構 32: Image capture mechanism
321:目標基板 321: Target substrate
33:控制單元 33: Control unit
34:處理單元 34: Processing unit
C1:檢測框之中心點 C1: Center point of the detection frame
C2:物件之中心點 C2: The center point of the object
D:週邊 D: Periphery
S101:步驟 S101: Step
S102:步驟 S102: Step
S103:步驟 S103: Step
S104:步驟 S104: Step
S201:步驟 S201: Step
S202:步驟 S202: Step
為了便於描述與清晰,圖式中各元件的尺寸被加以放大、省略或概要的描繪。同時,各元件之尺寸並不完全反映其真實尺寸。 For the convenience of description and clarity, the size of each component in the figure is enlarged, omitted or outlined. At the same time, the size of each component does not fully reflect its actual size.
〔圖1〕係為本發明實施例1之於一物件陣列定位物件之方法的流程圖;〔圖2〕係為本發明實施例1之於一物件陣列定位物件之方法的示意圖;〔圖3〕係為本發明實施例2之檢測發光二極體(LED)晶片亮度之方法的流程圖;以及〔圖4〕係為實施例3之檢測發光二極體(LED)晶片亮度之設備之示意圖。 [Figure 1] is a flow chart of a method for positioning an object in an array of objects according to Embodiment 1 of the present invention; [Figure 2] is a schematic diagram of a method for positioning an object in an array of objects according to Embodiment 1 of the present invention; [Figure 3] is a flow chart of a method for detecting the brightness of a light emitting diode (LED) chip according to Embodiment 2 of the present invention; and [Figure 4] is a schematic diagram of an apparatus for detecting the brightness of a light emitting diode (LED) chip according to Embodiment 3.
實施例1:於一物件陣列定位物件之方法 Embodiment 1: Method for locating objects in an object array
本實施例之於一物件陣列定位物件之方法的流程圖係如圖1所示。如圖1所示,本實施例之於一物件陣列定位物件之方法,其係包括:(a)於該物件陣列中,選定二相鄰之物件,其中該二相鄰之物件有一間距,該間距係至少可容納該二相鄰之物件S101;(b)以上述二相鄰物件之間距定義一檢測框S102;(c)計算得到該檢測框之一中心點S103;以及(d)移動該檢測框,直至該檢測框之中心點碰觸上述二相鄰物件中之一物件,以定位該被碰觸之物件S104。 The flow chart of the method for locating an object in an object array of the present embodiment is shown in FIG1. As shown in FIG1, the method for locating an object in an object array of the present embodiment includes: (a) selecting two adjacent objects in the object array, wherein the two adjacent objects have a distance that can at least accommodate the two adjacent objects S101; (b) defining a detection frame with the distance between the two adjacent objects S102; (c) calculating a center point of the detection frame S103; and (d) moving the detection frame until the center point of the detection frame touches one of the two adjacent objects to locate the touched object S104.
圖2係為實施例1之於一物件陣列定位物件之方法的示意圖。如圖2所示,物件111、112、113、114、115係組成一物件陣列,且物件111、112、113、114、115並非完美地以相同之間距排列在同一直線上,即物件111、112、113、114、115在垂直及水平方向上皆具有大小不等的偏移。本實施例中,步驟(a)係先選定物件111、112,並於步驟(b)中以物件111、112之間距定義一檢測框101。經步驟(c)計算所得到之檢測框之一中心點係如圖2之檢測框101中之十字虛線之交點所示。如圖2所示,於步驟(d)中檢測框101係移動至其
中心點碰觸物件111之位置,以定位物件111。實施例1係進一步重複上述步驟,直到檢測框102、103、104、105移動至其中心點碰觸物件112、113、114、115之位置,以定位物件112、113、114、115。
FIG. 2 is a schematic diagram of a method for locating an object in an object array according to Embodiment 1. As shown in FIG. 2 ,
由圖2可見,藉由移動該檢測框,直至該檢測框之中心點C1碰觸上述二相鄰物件中之一物件,可使檢測框之位置貼近物件之實際位置,藉此精準地定義物件的位置。 As can be seen from Figure 2, by moving the detection frame until the center point C1 of the detection frame touches one of the two adjacent objects, the position of the detection frame can be brought close to the actual position of the object, thereby accurately defining the position of the object.
本實施例中,係以二相鄰物件111、112之間距為一週邊D,定義一正方形之檢測框101,但本發明並不限於此,本發明所屬技術領域中具有通常知識者可依需要決定檢測框之形狀及大小。
In this embodiment, the distance between two
本實施例中,二相鄰物件111、112之間距的長度足以放置兩個物件。即間距的長度大於或等於兩個物件的邊長。
In this embodiment, the length of the distance between two
於一較佳實施態樣中,檢測框之面積係至少為物件面積之4倍,藉此可確保經步驟(d)後,檢測框可完整涵蓋其所定位之物件。一實施例中,檢測框之面積係至少為物件面積之3.4倍。 In a preferred embodiment, the area of the detection frame is at least 4 times the area of the object, thereby ensuring that after step (d), the detection frame can completely cover the object it locates. In one embodiment, the area of the detection frame is at least 3.4 times the area of the object.
於一較佳實施態樣中,可更包括計算該被碰觸物件之中心點C2(圖2中線條較粗的十字),藉此更為精準地定義物件的位置。一實施例中,間距是兩相鄰物件之中心點C2之間的距離。 In a preferred embodiment, the center point C2 of the touched object (the thicker cross in FIG. 2 ) may be further calculated to more accurately define the position of the object. In one embodiment, the spacing is the distance between the center points C2 of two adjacent objects.
於一較佳實施態樣中,可使得該檢測框之中心點與該被碰觸物件之中心點重疊,藉此更為精準地定義物件的位置。 In a preferred embodiment, the center point of the detection frame can be overlapped with the center point of the touched object, thereby more accurately defining the position of the object.
本實施例中,該物件陣列係為一發光二極體(LED)晶片陣列,但本發明並不限於此,本發明所屬技術領域中具有通常知識者可依需要決定所欲定位之物件陣列。 In this embodiment, the object array is a light emitting diode (LED) chip array, but the present invention is not limited thereto. A person with ordinary knowledge in the technical field to which the present invention belongs can determine the object array to be positioned as needed.
於一較佳實施態樣中,該物件陣列可為一影像,亦即係藉由一影像擷取單元擷取物件陣列之影像,並定位該影像中之物件。 In a preferred embodiment, the object array may be an image, that is, an image capture unit captures the image of the object array and locates the objects in the image.
如上所述,本實施例藉由移動該檢測框,直至該檢測框之中心點碰觸上述二相鄰物件中之一物件,可使檢測框之位置貼近物件之實際位置,藉此精準地定義物件的位置。 As described above, this embodiment moves the detection frame until the center point of the detection frame touches one of the two adjacent objects, so that the position of the detection frame can be brought close to the actual position of the object, thereby accurately defining the position of the object.
於一較佳實施態樣中,於初次執行步驟(a)時,係選定相鄰之一第一物件及一第二物件以定義一第一檢測框,且於初次執行步驟(d)後,進一步於該物件陣列中,選定一第三物件,該第三物件係與該第一物件及該第二物件中未在初次執行步驟(d)中被該第一檢測框之中心點碰觸之一物件相鄰。隨後,重複該步驟(b)-(d),定義一第二檢測框與一第三檢測框,以第二檢測框與第三檢測框分別定位該第一物件及該第二物件中未被碰觸之物件與該第三物件,其中該第一檢測框、該第二檢測框與該第三檢測框間具有二檢測框間距。隨後,依據該二檢測框間距計算得到一平均檢測框間距,並依據該平均檢測框間距與該第三檢測框之位置,計算得到一下一個檢測框之位置。隨後,設置一下一個檢測框於該下一個檢測框位置上。其中該二檢測框間距之尺寸係為不同的。 In a preferred embodiment, when step (a) is initially executed, a first object and a second object adjacent to each other are selected to define a first detection frame, and after step (d) is initially executed, a third object is further selected from the object array, the third object being adjacent to an object among the first object and the second object that is not touched by the center point of the first detection frame in the initial execution of step (d). Then, steps (b)-(d) are repeated to define a second detection frame and a third detection frame, and the second detection frame and the third detection frame are used to locate the first object and the untouched object among the second object, respectively, and the first detection frame, the second detection frame, and the third detection frame have two detection frame distances therebetween. Then, an average detection frame distance is calculated based on the two detection frame distances, and the position of the next detection frame is calculated based on the average detection frame distance and the position of the third detection frame. Then, the next detection frame is set at the position of the next detection frame. The sizes of the two detection frame distances are different.
上述之較佳實施態樣中,藉由計算平均檢測框間距以定位下一個檢測框之位置,可使下一個檢測框之位置與下一個物件的位置更為接近,可藉此減少步驟(d)中檢測框之中心點與物件碰觸所需的時間,以提升定位物件之效率。 In the above preferred implementation, by calculating the average detection frame spacing to locate the position of the next detection frame, the position of the next detection frame can be made closer to the position of the next object, thereby reducing the time required for the center point of the detection frame to touch the object in step (d), thereby improving the efficiency of locating the object.
實施例2:檢測發光二極體(LED)晶片亮度之方法 Example 2: Method for detecting the brightness of a light-emitting diode (LED) chip
本實施例之檢測發光二極體(LED)晶片亮度之方法的流程圖係如圖3所示。如圖3所示,本實施例之檢測發光二極體(LED)晶片亮度之方法,其係包括:使用如實施例1所述之於一物件陣列定位物件之方法定位該待檢測發光二極體晶片S201;以及計算該檢測框內該待檢測發光二極體晶片之亮度S202。一實施例中,發光二極體晶片之亮度是以影像中畫素的灰階來計算。例如以灰階值在50以上定義為發亮,在檢測框內有9個畫素的灰階值在50以上,發光二極體晶片之亮度為9。但本發明並不限於此,依據不同的產品狀態可以有不同灰階值的定義。 The flow chart of the method for detecting the brightness of the light emitting diode (LED) chip of this embodiment is shown in FIG3. As shown in FIG3, the method for detecting the brightness of the light emitting diode (LED) chip of this embodiment includes: positioning the light emitting diode chip to be detected using the method for positioning objects in an object array as described in Example 1 S201; and calculating the brightness of the light emitting diode chip to be detected in the detection frame S202. In one embodiment, the brightness of the light emitting diode chip is calculated based on the grayscale of the pixels in the image. For example, a grayscale value of 50 or more is defined as bright, and there are 9 pixels in the detection frame with grayscale values of 50 or more, and the brightness of the light emitting diode chip is 9. However, the present invention is not limited to this, and different grayscale values can be defined according to different product states.
本實施例之檢測發光二極體(LED)晶片亮度之方法藉由以如實施例1所示之方法使檢測框之位置貼近物件之實際位置,藉此精準地定義物件的位置,可有效地避免傳統上以預設之固定間距設置檢測框,造成當一電子元件的偏移量較大,以至於至少部分未被檢測框所涵蓋時,所導致之檢測結果失真的問題。 The method for detecting the brightness of a light emitting diode (LED) chip of this embodiment makes the position of the detection frame close to the actual position of the object by the method shown in Embodiment 1, thereby accurately defining the position of the object, which can effectively avoid the problem of distorted detection results caused by setting the detection frame with a preset fixed spacing in the traditional way when the offset of an electronic component is large and at least part of it is not covered by the detection frame.
實施例3:檢測發光二極體(LED)晶片亮度之設備 Example 3: Equipment for detecting the brightness of light-emitting diode (LED) chips
圖4係為實施例3之檢測發光二極體(LED)晶片亮度之設備之示意圖。如圖3所示,本實施例之檢測發光二極體(LED)晶片亮度之設備30,其係包括:一承載平台31,其係用以承載具有該待檢測發光二極體晶片311之一基板312;一影像擷取機構32,設置於鄰近該承載平台31,其係用以對該基板312擷取一影像;一控制單元33,連接於該承載平台31,其係用以點亮該待檢測發光二極體晶片311;以及一處理單元34,連接於該影像擷取機構32,其係用以執行如實施例2所述之方法計算該檢測框內該待檢測發光二極體晶片311之亮度。
FIG4 is a schematic diagram of an apparatus for detecting the brightness of a light emitting diode (LED) chip of Embodiment 3. As shown in FIG3, the
本實施例中,該控制單元係提供電流給待檢測發光二極體晶片以使待檢測發光二極體晶片工作發光。 In this embodiment, the control unit provides current to the LED chip to be tested so that the LED chip to be tested can work and emit light.
本實施例中,該影像擷取機構係一攝影機,但本發明並不限於此。 In this embodiment, the image capture mechanism is a camera, but the present invention is not limited to this.
本實施例中,該基板係一薄膜電晶體(TFT)基板,但本發明並不限於此。 In this embodiment, the substrate is a thin film transistor (TFT) substrate, but the present invention is not limited thereto.
如上所述,本實施例之檢測發光二極體(LED)晶片亮度之設備藉由執行如實施例2所述之方法計算該檢測框內該待檢測發光二極體晶片之亮度,可使檢測框之位置貼近物件之實際位置,藉此精準地定義物件的位置,進而有效地避免傳統上以預設之固定間距設置檢測框,造成當一電子元件的偏移量較大,以至於至少部分未被檢測框所涵蓋時,所導致之檢測結果失真的問題。 As described above, the device for detecting the brightness of a light emitting diode (LED) chip of this embodiment calculates the brightness of the light emitting diode chip to be detected in the detection frame by executing the method described in Embodiment 2, so that the position of the detection frame can be close to the actual position of the object, thereby accurately defining the position of the object, thereby effectively avoiding the problem of distorted detection results caused by setting the detection frame with a preset fixed spacing in the traditional way when the offset of an electronic component is large and at least part of it is not covered by the detection frame.
實施例4:電腦程式 Example 4: Computer program
本實施例之電腦程式,其係經由電腦載入並執行後,可完成如實施例1所述之於一物件陣列定位物件之方法。 The computer program of this embodiment, after being loaded and executed by a computer, can complete the method of locating objects in an object array as described in Embodiment 1.
當執行本實施例之電腦程式時,可使檢測框之位置貼近物件之實際位置,藉此精準地定義物件的位置。 When the computer program of this embodiment is executed, the position of the detection frame can be made close to the actual position of the object, thereby accurately defining the position of the object.
實施例5:內儲程式之電腦可讀取記錄媒體 Embodiment 5: Computer-readable recording medium storing programs
本實施例之內儲程式之電腦可讀取記錄媒體,經由電腦載入該程式並執行後,可完成如實施例1所述之於一物件陣列定位物件之方法。 The computer storing the program in this embodiment can read the recording medium. After the program is loaded and executed by the computer, the method of locating objects in an object array as described in Embodiment 1 can be completed.
當執行本實施例之內儲程式之電腦可讀取記錄媒體中所儲存之程式時,可使檢測框之位置貼近物件之實際位置,藉此精準地定義物件的位置。 When a computer executing the internal storage program of this embodiment can read the program stored in the recording medium, the position of the detection frame can be made close to the actual position of the object, thereby accurately defining the position of the object.
綜合上述,本發明之於一物件陣列定位物件之方法、檢測發光二極體(LED)晶片亮度之方法、檢測發光二極體(LED)晶片亮度之設備、電腦程式及內儲程式之電腦可讀取記錄媒體可使檢測框之位置貼近物件之實際位置,藉此精準地定義物件的位置。 In summary, the method for positioning an object in an object array, the method for detecting the brightness of a light emitting diode (LED) chip, the device for detecting the brightness of a light emitting diode (LED) chip, the computer program, and the computer-readable recording medium storing the program can make the position of the detection frame close to the actual position of the object, thereby accurately defining the position of the object.
此外,本發明之檢測發光二極體(LED)晶片亮度之方法及檢測發光二極體(LED)晶片亮度之設備可有效地避免傳統上以預設之固定間距設置檢測框,造成當一電子元件的偏移量較大,以至於至少部分未被檢測框所涵蓋時,所導致之檢測結果失真的問題。 In addition, the method and device for detecting the brightness of a light-emitting diode (LED) chip of the present invention can effectively avoid the problem of distorted detection results caused by setting the detection frame with a preset fixed spacing in the traditional way, when the offset of an electronic component is large and at least part of it is not covered by the detection frame.
S101:步驟 S101: Step
S102:步驟 S102: Step
S103:步驟 S103: Step
S104:步驟 S104: Step
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| CN109632814A (en) * | 2019-02-01 | 2019-04-16 | 东莞中科蓝海智能视觉科技有限公司 | Part defect detection method |
| US11023770B2 (en) * | 2019-09-23 | 2021-06-01 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Systems and methods for obtaining templates for tessellated images |
| TW202220078A (en) * | 2020-10-06 | 2022-05-16 | 日商東麗工程股份有限公司 | Appearance inspection device and method |
| CN116342461A (en) * | 2021-12-23 | 2023-06-27 | 技嘉科技股份有限公司 | Electronic component frame selection system and device and method thereof |
| TW202336690A (en) * | 2022-03-04 | 2023-09-16 | 國立中正大學 | Method for detecting object image using hyperspectral imaging by band selection |
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| CN109632814A (en) * | 2019-02-01 | 2019-04-16 | 东莞中科蓝海智能视觉科技有限公司 | Part defect detection method |
| US11023770B2 (en) * | 2019-09-23 | 2021-06-01 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Systems and methods for obtaining templates for tessellated images |
| TW202220078A (en) * | 2020-10-06 | 2022-05-16 | 日商東麗工程股份有限公司 | Appearance inspection device and method |
| CN116342461A (en) * | 2021-12-23 | 2023-06-27 | 技嘉科技股份有限公司 | Electronic component frame selection system and device and method thereof |
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