TWI881526B - Wafer inspection device - Google Patents

Abstract

A wafer inspection device is provided, including a turntable module, a probe module and a limiting module. The turntable module is configured to transport an object to be tested. The probe module corresponds to one side of the turntable module and is configured to contact the object to be tested, and the probe module is configured to provide an electrical energy to the object to be tested or receive a signal generated by the object to be tested. The limiting module is located on another side of the turntable module, and has a first opening. When the probe module contacts the object to be tested, the limiting module blocks the object to be tested so that the object to be tested is located in the turntable module. By means of the present disclosure, the wafer testing device can enhance the stability of the wafer when being tested and increase the diversity of wafer testing.

Description

Wafer inspection equipment

The present invention relates to a testing device, and more particularly to a chip testing device which can prevent a chip from falling off during testing and can simultaneously test multiple properties of the chip.

In the semiconductor manufacturing process, tiny particles or defects are often generated due to some unavoidable reasons. With the continuous reduction of component size and the continuous improvement of circuit density in the semiconductor manufacturing process, the impact of these extremely small defects or particles on the quality of integrated circuits is becoming more and more serious. Therefore, in order to maintain the stability of product quality, it is usually necessary to perform defect detection on the produced semiconductor components while carrying out various semiconductor processes. The root causes of these defects can be analyzed based on the detection results. Only then can the generation of defects be avoided or reduced by adjusting the process parameters to achieve the purpose of improving the yield and reliability of the semiconductor process.

However, the existing chip testing equipment requires additional complex clamping equipment to fix the tested chip when performing defect or performance testing on the chip. Moreover, if multiple tests are to be performed on the chip, the chip needs to be transported to different testing stations. Therefore, the existing chip testing equipment requires not only numerous related testing devices and auxiliary devices, but also complicated testing processes and increased testing costs.

Therefore, how to overcome the above-mentioned defects through the improvement of structural design has become one of the important issues that this industry wants to solve.

The technical problem to be solved by the present invention is to provide a chip detection device to address the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a chip detection device, which includes a turntable module, at least one probe module and a limit module. The turntable module is configured to transport at least one object to be tested. At least one probe module corresponds to one side of the turntable module, at least one of the probe modules is configured to contact at least one of the objects to be tested, and at least one of the probe modules is configured to provide electrical energy to at least one of the objects to be tested or receive a signal generated by at least one of the objects to be tested. The limit module is located on the other side of the turntable module, and the limit module has at least one first opening. When at least one of the probe modules contacts at least one of the objects to be tested, the limiting module shields at least one of the objects to be tested, so that at least one of the objects to be tested is located in the turntable module.

In one feasible or preferred embodiment, the turntable module has a plurality of transport slots, each of which is configured to accommodate the object to be tested.

In one feasible or preferred embodiment, the chip detection device further includes a plurality of the probe modules. The limit module has a plurality of the first openings, and each of the first openings corresponds to one of the probe modules. When the turntable module positions the plurality of objects to be tested at positions corresponding to the plurality of the probe modules and the plurality of first openings, and each of the probe modules contacts the corresponding object to be tested, each of the objects to be tested generates a light beam, and the light beam passes through the corresponding first opening and is projected to the outside of the limit module.

In one feasible or preferred embodiment, one surface of the limiting module is recessed inward to form at least one projection groove, and at least one projection groove is communicated with at least one first opening.

In one feasible or preferred embodiment, one of the surfaces of the limiting module is recessed inward to form at least one accommodating groove, and the at least one accommodating groove corresponds to the at least one projection groove and communicates with the at least one projection groove.

In one feasible or preferred embodiment, the position limiting module includes a carrier element and at least one light-transmitting element. The carrier element is located on the other side of the turntable module, and the carrier element has at least one first opening, at least one projection groove, and at least one receiving groove. The at least one light-transmitting element is disposed in at least one receiving groove.

In one feasible or preferred embodiment, the limit module further has a plurality of the second openings, each of the second openings is adjacent to one of the first openings. The limit module further has a plurality of projection slots, each of the projection slots includes a plurality of depressions, two adjacent depressions are connected, one of the depressions of each projection slot corresponds to one of the first openings, and the other depression of each projection slot corresponds to one of the second openings. The chip detection device further includes a cover module, which is adjacent to the limit module, and the cover module is configured to be able to flexibly cover or open the plurality of first openings and the plurality of second openings.

In one feasible or preferred embodiment, the covering module includes a substrate component and a plurality of screen components. The substrate component has a plurality of through openings penetrating the body. The plurality of screen components are located on the substrate component and shield the plurality of through openings. When the covering module is driven to move to a detection position, the substrate component shields one side of the limit module, and the plurality of screen components shield the plurality of first openings.

In one feasible or preferred embodiment, when the covering module is driven to move from the detection position to a return position, the substrate element is away from the limiting module.

In one feasible or preferred embodiment, one side edge of one side of the limiting module extends outward to form a stopper, and the stopper is adjacent to a center of the turntable module.

One of the beneficial effects of the present invention is that the chip inspection device provided by the present invention can be used to transport at least one object to be tested through a "turntable module configuration. At least one probe module corresponds to one side of the turntable module, at least one of the probe modules is configured to contact at least one of the objects to be tested, and at least one of the probe modules is configured to provide an electric energy to at least one of the objects to be tested or receive a signal generated by at least one of the objects to be tested. The limit module is located on the turntable module. The other side of the assembly, the limit module has at least one first opening. The cover module is adjacent to the limit module, and the cover module is configured to be used to flexibly cover or open at least one of the first openings. Wherein, when at least one of the probe modules contacts at least one of the objects to be tested, the limit module blocks at least one of the objects to be tested so that at least one of the objects to be tested is located in the turntable module. The technical solution is to enhance the stability of the chip when being tested and increase the diversity of chip detection.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only used for reference and description and are not used to limit the present invention.

The following is a specific embodiment to illustrate the implementation of the "chip detection device" disclosed in the present invention. Technical personnel in this field can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments. The details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical content of the present invention in detail, but the disclosed content is not used to limit the scope of protection of the present invention.

It should be understood that, although the terms "first", "second", "third", etc. may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this document may include any one or more combinations of the related listed items depending on the actual situation.

[First embodiment]

Please refer to Figures 1 to 7, which are respectively a three-dimensional schematic diagram of a chip detection device of the first embodiment of the present invention, an exploded schematic diagram of one viewing angle, an exploded schematic diagram of another viewing angle, a partial schematic diagram of a turntable module, a partial top view schematic diagram, a partial bottom view schematic diagram, and a partial cross-sectional schematic diagram. As shown in the above figures, the first embodiment of the present invention provides a chip detection device Z, which may include a turntable module 1, at least one probe module 2, and a limit module 3.

As shown in FIGS. 1 to 4 , the turntable module 1 of the present invention is configured to transport at least one object E to be tested. For example, the turntable module 1 of the present invention may be a conveying device having a turntable structure. The turntable module 1 may be located between the probe module 2 and the limit module 3. The turntable module 1 has a plurality of transport slots 10, each of which is configured to accommodate the object E to be tested; wherein the plurality of transport slots 10 are spaced apart on the side of the turntable module 1, and the transport slots 10 may have a fixing element with a clamping function or an adsorption function to fix the object E to be tested. wherein, the object E to be tested may be an electronic component, such as a chip, but is not limited thereto. When the present invention is actually applied, the object E to be tested may also be a non-electronic component. In addition, the turntable module 1 may also have a power element (not shown in the figure) and a base element (not shown in the figure). The power element may be a motor or other types of power elements. The base element may be located below the lower surface of the turntable module 1, and the base element may also have a through hole (not shown in the figure) penetrating the body, and the through hole corresponds to the probe module 2.

Next, as shown in FIGS. 1 to 4 and 7 , the probe module 2 of the present invention corresponds to one side of the turntable module 1. The probe module 2 can be configured to contact the object E to be tested, and the probe module 2 is configured to provide power to the object E to be tested or receive a signal generated by the object E to be tested. For example, the probe module 2 can be movably disposed at the bottom of the turntable module 1. The probe module 2 can be a probe structure and can include a driving element (not shown in the figure). The present invention can drive the probe module 2 to rise and contact the object E to be tested, and drive the probe module 2 to fall and stay away from the turntable module 1 or the object E to be tested by the driving element.

Next, as shown in FIGS. 1 to 3 , the position limiting module 3 of the present invention is located on the other side of the turntable module 1, and the position limiting module 3 may have at least one first opening 300. For example, one side of the position limiting module 3 may be recessed inward to form at least one projection groove 301, and at least one projection groove 301 is in communication with at least one first opening 300; wherein the projection groove 301 may be a radial recessed groove. Furthermore, one side of the position limiting module 3 may be recessed inward to form at least one receiving groove 302, and at least one receiving groove 302 may correspond to at least one projection groove 301 and be in communication with at least one projection groove 301. Therefore, the first opening 300, the projection groove 301, and the receiving groove 302 are in communication with each other.

Furthermore, as shown in FIGS. 1 to 3 and 5, the position limiting module 3 of the present invention may further include a carrier element 30 and at least one light-transmitting element 31. The carrier element 30 may be located on the other side of the turntable module 1, that is, located on the top of the turntable module 1; and the carrier element 30 may have at least one first opening 300, at least one projection groove 301 and at least one receiving groove 302. The at least one light-transmitting element 31 may be detachably disposed in the at least one receiving groove 302; wherein the light-transmitting element 31 may be transparent glass or a transparent plate.

Therefore, when at least one probe module 2 contacts at least one object E to be tested, the limiting module 3 can block at least one object E to be tested, so that at least one object E to be tested is located in the turntable module 1.

For example, as shown in FIGS. 1 to 7 , when the object E to be tested is tested by the wafer testing device Z of the present invention, the object E to be tested can first be transported by the turntable module 1 to the testing position corresponding to the first opening 300 of the carrier component 30. Then, the turntable module 1 will temporarily stop rotating, and the probe module 2 can move toward the object E to be tested and the turntable module 1 and contact the object E to be tested; at this time, since the carrier component 30 is located at the top of the turntable module 1 and approaches the upper surface of the turntable module 1, when the probe module 2 contacts the object E to be tested, the carrier component 30 can produce a blocking effect to prevent the object E to be tested from being pushed out by the probe module 2 and escaping from the transport slot 10.

Next, the object E to be tested can be subjected to a light emitting or light receiving detection procedure. When the object E to be tested is in the light emitting detection mode, the probe module 2 can provide electrical energy to the object E to be tested so that the object E to be tested generates a light beam. At this time, the tester or the detection equipment (such as the image capture module) can use the first opening 300 of the carrier component 30 to check whether the object E to be tested generates a light beam to determine whether the object E to be tested is a good product. Among them, the chip detection device Z of the present invention simulates the actual use of a mobile phone camera (such as generating a flash) by setting a light-transmitting element 31 on the receiving groove 302.

When the object E to be tested is in the light receiving detection mode, the probe module 2 can contact the object E to be tested; at this time, the object E to be tested can collect external light energy through the first opening 300 to generate a light signal. Next, the probe module 2 can receive the light signal generated by the object E to be tested. The tester or the detection equipment can determine whether the object E to be tested is a good product by determining whether the probe module 2 has received the light signal of the object E to be tested.

Thus, the wafer inspection device Z of the present invention can use the above-mentioned technical solution to set up a customized cover (i.e., the limit module 3), which can not only prevent the object E to be tested from escaping from the conveying slot 10 of the turntable module 1, but also provide the object E to be tested for light emission and light collection through the opening of the cover (i.e., the first opening 300). In addition, a transparent plate (i.e., a light-transmitting element 31) can be installed on the cover to simulate the actual use of a mobile phone camera.

Furthermore, the chip inspection device Z of the present invention may also include a plurality of probe modules 2. The limit module 3 may have a plurality of first openings 300, each of which corresponds to one of the probe modules 2. When the turntable module 1 positions the plurality of objects E to be tested at positions corresponding to the plurality of probe modules 2 and the plurality of first openings 300, and each probe module 2 contacts the corresponding object E to be tested, each object E to be tested generates a light beam, and the light beam passes through the corresponding first opening 300 and is projected to the outside of the limit module 3.

For example, as shown in FIGS. 1 to 7 , the chip detection device Z of the present invention can also perform a light emitting or light receiving detection procedure on multiple test objects E at the same time. Therefore, the chip detection device Z of the present invention can be provided with multiple probe modules 2, and multiple first openings 300 are spaced apart on the carrier element 30; wherein each first opening 300 has its own corresponding projection groove 301 and receiving groove 302 (in other words, the chip detection device Z of the present invention can also be provided with multiple light-transmitting elements 31).

Next, multiple transport slots 10 of the turntable module 1 are used to transport multiple objects E to be tested; and when the turntable module 1 transports a portion of the objects E to be tested to the detection positions corresponding to the multiple first openings 300 of the carrier component 30, the tester or the detection equipment (such as the image capture module) can check whether the object E to be tested generates a light beam through the first opening 300 of the carrier component 30, or the tester or the detection equipment can determine whether the object E to be tested is a good product by determining whether the probe module 2 has received the light signal of the object E to be tested.

However, the above example is only one possible embodiment and is not intended to limit the present invention.

[Second embodiment]

Please refer to Figures 8 to 13, which are respectively a partial schematic diagram, a three-dimensional schematic diagram, an exploded schematic diagram from one viewing angle, an exploded schematic diagram from another viewing angle, a schematic diagram of the use state, and a partial schematic diagram of the use state of the limiting module of the chip detection device of the second embodiment of the present invention, and please refer to Figures 1 to 7 together. As shown in the above figures, the chip detection device Z of this embodiment is roughly similar to the chip detection device Z of the above embodiment, so the arrangement or operation of the same components will not be repeated here. The difference between the chip detection device Z of this embodiment and the chip detection device Z of the above first embodiment is that in this embodiment, the limiting module 3 of the present invention also has a plurality of second openings 303, each of which is adjacent to one of the first openings 300. Among them, the limiting module 3 may also have multiple projection grooves 301, each projection groove 301 may include multiple recessed portions 301a, 301b, two adjacent recessed portions 301a, 301b are connected, one of the recessed portions 301a, 301b of each projection groove 301 corresponds to one of the first openings 300, and the other recessed portion 301a, 301b of each projection groove 301 corresponds to one of the second openings 303.

For example, as shown in FIGS. 8 to 10 , each projection slot 301 of the position limiting module 3 may also have a second opening 303, that is, each second opening 303 corresponds to one of the first openings 300, one of the projection slots 301 and one of the receiving slots 302. Each projection slot 301 may also include a plurality of sunken portions 301a, 301b, and the sunken portions 301a, 301b may be radial grooves that are the same or different from each other. In addition, one side edge of one side of the position limiting module 3 extends outward to form a stopper 304, and the stopper 304 is adjacent to a center 11 (also referred to as a central axis) of the turntable module 1; that is, the side edge of the position limiting module 3 adjacent to the center 11 of the turntable module 1 may extend outward to form the stopper 304.

Next, as shown in FIGS. 9 to 12 , the cover module 4 may include a substrate component 40 and a plurality of shield components 41 . The substrate component 40 has a plurality of through openings 400 penetrating the body. The plurality of shield components 41 are located on the substrate component 40 and shield the plurality of through openings 400 .

For example, the covering module 4 may be adjacent to the limiting module 3, and the limiting module 3 may be located between the turntable module 1 and the covering module 4. The covering module 4 may be configured to flexibly cover or open the first opening 300, the projection slot 301, the receiving slot 302, and the second opening 303. The substrate element 40 may be a plate structure, and the substrate element 40 has a plurality of through openings 400 arranged at intervals. Each shielding element 41 is detachably disposed on one side of the substrate element 40 facing away from the limiting module 3 and shields one of the through openings 400.

Therefore, in conjunction with Figures 8 to 13, the object E to be tested can be subjected to a gray card test or a light tube test by the chip detection device Z of the present invention. Furthermore, at least one object E to be tested can be first transported by the turntable module 1 to the detection position corresponding to the first opening 300 of the carrier component 30. Then, the turntable module 1 will temporarily stop rotating, and the probe module 2 can move toward the object E to be tested and the turntable module 1 and contact the object E to be tested; and the probe module 2 can perform at least one of the actions of providing electrical energy to the object E to be tested and receiving the optical signal generated by the object E to be tested; at this time, the cover module 4 is far away from the carrier component 30 and is in a return position.

Next, the covering module 4 can be driven and carried by a driving device (not shown in the figure) to move toward the carrier component 30, and cover one side of the limiting module 3 and multiple covering components 41 cover multiple first openings 300; at this time, the covering module 4 is located at a detection position, wherein the stop portion 304 of the limiting module 3 can also stop the covering module 4 from excessive displacement, providing a positioning function. Then, the probe module 2 can provide power to the object E to be tested, so that the light-emitting part (not marked in the figure) of the object E to be tested generates a light beam and projects it to the cover module 4 through the first opening 300; and the light-receiving part (not marked in the figure) of the object E to be tested can collect the light beam generated by the light-emitting part of the object E to be tested through the second opening 303 and generate a light signal accordingly, and the probe module 2 can receive the light signal of the object E to be tested. It is worth mentioning that in this test stage, the probe module 2 may not provide power to the object E to be tested, but only receive the light signal of the object E to be tested, but it is not limited to this.

When the detection is completed, the covering module 4 can be driven by the driving device and moved away from the limiting module 3 to move to the initial return position.

Thus, the chip testing device Z of the present invention can use the above-mentioned technical solution and the movable cover module 4 to perform performance testing on the object E to be tested in different situations (such as bright and dark environments).

However, the above example is only one possible embodiment and is not intended to limit the present invention.

[Beneficial Effects of Embodiments]

One of the beneficial effects of the present invention is that the chip inspection device Z provided by the present invention can be configured to transport at least one object to be tested E through the "turntable module 1. At least one probe module 2 corresponds to one side of the turntable module 1, and the at least one probe module 2 is configured to contact at least one object to be tested E, and the at least one probe module 2 is configured to provide an electric energy to the at least one object to be tested E or receive at least one object to be tested. A signal generated by the object E. The limit module 3 is located on the other side of the turntable module 1, and the limit module 3 has at least one first opening 300. When at least one probe module 2 contacts at least one object E to be tested, the limit module 3 blocks at least one object E to be tested, so that at least one object E to be tested is located in the turntable module 1. The technical solution is used to enhance the stability of the chip when it is tested and increase the diversity of chip detection.

Furthermore, the wafer inspection device Z of the present invention can use the above-mentioned technical solution to set a customized cover (i.e., the limit module 3), which can not only prevent the object E to be tested from escaping from the conveying slot 10 of the turntable module 1, but also provide the object E to be tested for light emission and light collection through the opening of the cover (i.e., the first opening 300). In addition, a transparent plate (i.e., a light-transmitting element 31) can be installed on the cover to simulate the actual use of a mobile phone camera.

Furthermore, the wafer testing device Z of the present invention can also utilize a movable cover module 4 to perform performance testing on the object E under test in different situations (eg, bright or dark environments).

The contents disclosed above are only preferred feasible embodiments of the present invention and are not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.

Z: Wafer detection device 1: Turntable module 10: Transport slot 11: Center 2: Probe module 3: Limit module 30: Carrier component 300: First opening 301: Projection slot 301a, 301b: Depression 302: Accommodation slot 303: Second opening 304: Stopper 31: Transparent component 4: Covering module 40: Substrate component 400: Through port 41: Screen component E: Object to be tested

FIG1 is a three-dimensional schematic diagram of a wafer inspection device according to a first embodiment of the present invention.

FIG. 2 is an exploded schematic diagram of a wafer inspection device according to the first embodiment of the present invention from one viewing angle.

FIG. 3 is an exploded schematic diagram of the wafer inspection device according to the first embodiment of the present invention from another viewing angle.

FIG. 4 is a partial schematic diagram of a turntable module of a chip inspection device according to the first embodiment of the present invention.

FIG. 5 is a partial top view schematically showing a wafer inspection device according to the first embodiment of the present invention.

FIG. 6 is a partial bottom view of the wafer inspection device according to the first embodiment of the present invention.

FIG. 7 is a partial cross-sectional schematic diagram of a wafer inspection device according to the first embodiment of the present invention.

FIG8 is a partial schematic diagram of a limit module of a chip detection device according to the second embodiment of the present invention.

FIG. 9 is a three-dimensional schematic diagram of a wafer inspection device according to a second embodiment of the present invention.

FIG. 10 is an exploded schematic diagram of a wafer inspection device according to a second embodiment of the present invention from one viewing angle.

FIG. 11 is an exploded schematic diagram of the wafer inspection device according to the second embodiment of the present invention from another viewing angle.

FIG. 12 is a schematic diagram of the wafer inspection device according to the second embodiment of the present invention in use.

FIG. 13 is a partial schematic diagram of the wafer inspection device according to the second embodiment of the present invention in use.

Z: Chip detection device

1: Turntable module

11: Center

2: Probe module

3: Limit module

301: Projection slot

302: Container

Claims (8)

A chip inspection device, comprising: A turntable module, which is configured to transport at least one object to be tested; At least one probe module, which corresponds to one side of the turntable module, at least one of the probe modules is configured to contact at least one of the objects to be tested, and at least one of the probe modules is configured to provide an electric energy to at least one of the objects to be tested or receive a signal generated by at least one of the objects to be tested; and A limit module, which is located on the other side of the turntable module, and the limit module has at least one first opening; Wherein, when at least one of the probe modules contacts at least one of the objects to be tested, the limit module blocks at least one of the objects to be tested, so that at least one of the objects to be tested is located in the turntable module; Wherein, the chip detection device further includes a plurality of the probe modules; wherein, the limit module has a plurality of the first openings, each of the first openings corresponding to one of the probe modules; wherein one surface of the limit module is inwardly recessed to form at least one projection groove, and at least one of the projection grooves is in communication with at least one of the first openings; The limiting module further has a plurality of second openings, each of which is adjacent to one of the first openings; the limiting module further has a plurality of projection slots, each of which includes a plurality of depressions, two adjacent depressions are connected, one of the depressions of each projection slot corresponds to one of the first openings, and the other depression of each projection slot corresponds to one of the second openings; the chip detection device further includes a covering module, which is adjacent to the limiting module, and the covering module is configured to be able to flexibly cover or open the plurality of first openings and the plurality of second openings. The chip inspection device as described in claim 1, wherein the turntable module has a plurality of transport slots, each of which is configured to accommodate the object to be inspected. A chip inspection device as described in claim 2, wherein, when the turntable module positions multiple objects to be tested at positions corresponding to multiple probe modules and multiple first openings, and each of the probe modules contacts the corresponding objects to be tested, each of the objects to be tested generates a light beam and the light beam is projected to the outside of the limit module through the corresponding first opening. A chip inspection device as described in claim 3, wherein one side of the limiting module is recessed inward to form at least one accommodating groove, and at least one of the accommodating grooves corresponds to at least one of the projection grooves and is in communication with at least one of the projection grooves. The chip detection device as described in claim 4, wherein the limit module includes: a carrier element, which is located on the other side of the turntable module, and the carrier element has at least one first opening, at least one projection groove and at least one receiving groove; and at least one light-transmitting element, which is disposed in at least one receiving groove. A chip detection device as described in claim 4, wherein the covering module comprises: a substrate element having a plurality of openings penetrating the body; and a plurality of shielding elements, which are located on the substrate element and shield the plurality of the openings; wherein, when the covering module is driven and displaced to a detection position, the substrate element shields one side of the limit module, and the plurality of shielding elements shield the plurality of the first openings. A chip inspection device as described in claim 6, wherein when the covering module is driven to move from the inspection position to a return position, the substrate element is away from the limiting module. As described in claim 3, a chip inspection device, wherein one side edge of one of the surfaces of the limiting module extends outward to form a stopper portion, and the stopper portion is adjacent to a center of the turntable module.

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