TWI752602B - Electronic component conveying method and device - Google Patents
Electronic component conveying method and device Download PDFInfo
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- TWI752602B TWI752602B TW109129008A TW109129008A TWI752602B TW I752602 B TWI752602 B TW I752602B TW 109129008 A TW109129008 A TW 109129008A TW 109129008 A TW109129008 A TW 109129008A TW I752602 B TWI752602 B TW I752602B
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Abstract
本發明提供一種電子元件搬送方法及裝置,包括:提供一轉盤,其周緣設有複數個容槽供電子元件容置其中;提供一機台台面,供該轉盤置放,並設有一朝所述容槽吹送氣體之氣溝;提供一蓋件,設於該轉盤的上方並覆蓋所述容槽;使該蓋件與該轉盤同步間歇性旋轉,並使所述容槽內之電子元件受由該氣溝所吹出的氣體作用,令所述電子元件在所述容槽內懸浮不與該機台台面接觸;藉此減少電子元件或機台台面間因磨擦而受損。The present invention provides a method and device for transporting electronic components, including: providing a turntable with a plurality of accommodating grooves on its periphery for accommodating electronic components; providing a machine table for placing the turntable, and a An air groove for blowing gas from a container; a cover is provided, which is arranged above the turntable and covers the container; the cover and the turntable are synchronously rotated intermittently, and the electronic components in the container are subject to The gas blown out of the air groove makes the electronic components suspended in the container and does not contact with the machine table surface, thereby reducing damage due to friction between the electronic components or the machine table surface.
Description
本發明係有關於一種搬送方法及裝置,尤指一種以轉盤搬送電子元件之電子元件搬送方法及裝置。The present invention relates to a conveying method and device, and more particularly, to an electronic component conveying method and device for conveying electronic components by a turntable.
按,一般例如被動元件或LED元件等電子元件在製造完成後,通常需要進行測試、分選及包裝的程序,這些用以進行測試、分選及包裝的設備,常以周緣設有複數個容槽之轉盤來搬送電子元件,該轉盤係貼靠於機台台面上作間歇性旋轉且所述電子元件係收容於所述容槽內被搬送;在該轉盤上作間歇性旋轉時,所述容槽內之電子元件將與該機台台面磨擦,不僅造成電子元件的受損,在使用一段時間後,該機台台面亦會有刮痕的產生。Generally speaking, after the manufacture of electronic components such as passive components or LED components, they usually need to undergo testing, sorting and packaging procedures. These equipment for testing, sorting and packaging are often equipped with multiple containers around the periphery. The turntable of the slot is used to transport electronic components. The turntable is intermittently rotated against the machine table, and the electronic components are accommodated in the container to be transported; when the turntable rotates intermittently, the The electronic components in the container will rub against the machine table, which will not only damage the electronic components, but also cause scratches on the machine table after a period of use.
為了減少上述的缺失,遂有如公告號第I563585號「電子元件搬運方法及裝置」所揭露的技術產生,其以第一負壓吸力與第二負壓吸力將電子元件吸靠在轉盤之容槽內緣並往轉盤上方的壓片貼靠,而減少電子元件之底部接觸機台台面所產生磨擦。In order to reduce the above-mentioned deficiencies, the technology disclosed in the Bulletin No. I563585 "Method and Device for Handling Electronic Components" was developed, which uses the first negative pressure suction force and the second negative pressure suction force to suck the electronic components against the grooves of the turntable. The inner edge is pressed against the pressing sheet above the turntable to reduce the friction caused by the contact between the bottom of the electronic component and the table top of the machine.
公告號第I563585號「電子元件搬運方法及裝置」所揭露的習知技術在搬運電子元件時,因為負壓吸力僅吸附電子元件面對容槽內緣之一側,導致電子元件未受吸附的另一側仍可能受重力影響而垂落至與機台台面接觸,尤其在搬送重量較重之電子元件時,更容易發生此等情事。In the conventional technology disclosed in Announcement No. I563585 "Method and Device for Handling Electronic Components", when handling electronic components, the negative pressure suction only attracts the side of the electronic components facing the inner edge of the container, resulting in the electronic components not being adsorbed. The other side may still be affected by gravity and fall into contact with the machine table, especially when handling electronic components with heavy weight, this is more likely to happen.
爰是,本發明的目的,在於提供一種可減少電子元件與機台台面接觸之電子元件搬送方法。In other words, an object of the present invention is to provide a method for conveying electronic components that can reduce the contact between the electronic components and the machine table.
本發明的另一目的,在於提供一種可減少電子元件與機台台面接觸之電子元件搬送裝置。Another object of the present invention is to provide an electronic component conveying device which can reduce the contact between the electronic component and the machine table.
本發明的又一目的,在於提供一種用以執行如所述電子元件搬送方法之裝置。Another object of the present invention is to provide a device for carrying out the electronic component conveying method.
依據本發明目的之電子元件搬送方法,包括:提供一轉盤,其周緣設有複數個容槽供電子元件容置其中;提供一機台台面,供該轉盤置放,並設有一朝所述容槽吹送氣體之氣溝;提供一蓋件,設於該轉盤的上方並覆蓋所述容槽;使該蓋件與該轉盤同步間歇性旋轉,並使所述容槽內之電子元件受由該氣溝所吹出的氣體作用,令所述電子元件在所述容槽內懸浮不與該機台台面接觸。The method for transporting electronic components according to the purpose of the present invention includes: providing a turntable with a plurality of accommodating grooves on its periphery for accommodating electronic components; providing a machine table for the turntable to be placed, and a A groove for blowing gas from a groove; a cover is provided above the turntable and covers the container; the cover and the turntable are synchronously rotated intermittently, and the electronic components in the container are subjected to the The effect of the gas blown out of the air groove makes the electronic components levitate in the container without contacting with the table top of the machine.
依據本發明另一目的之電子元件搬送裝置,包括:一機台台面,設有一氣溝;一轉盤,設於該機台台面上,該轉盤周緣設有複數個供電子元件容置之容槽,所述容槽對應設於該氣溝之上方;一蓋件,固設於該轉盤上並覆蓋所述容槽。According to another object of the present invention, the electronic component conveying device includes: a machine table top, which is provided with an air groove; a turntable, which is arranged on the machine table top, and a plurality of accommodating grooves for accommodating electronic components are arranged on the periphery of the turntable. , the accommodating groove is correspondingly arranged above the air groove; a cover is fixed on the turntable and covers the accommodating groove.
依據本發明又一目的之電子元件搬送裝置,包括:用以執行如所述電子元件搬送方法之裝置。According to another object of the present invention, an electronic component conveying device includes: a device for executing the electronic component conveying method.
本發明實施例之電子元件搬送方法及裝置,所述容槽內之電子元件在被搬送時,係於所述容槽內懸浮而不與該機台台面有所接觸,可減少電子元件或機台台面間因磨擦而受損。In the method and device for transporting electronic components according to the embodiments of the present invention, when the electronic components in the container are transported, they are suspended in the container without contacting the table surface of the machine, which can reduce the number of electronic components or machines. The countertops are damaged by friction.
請參閱圖1、2,本發明實施例之電子元件搬送方法可以如圖所示之搬送裝置為例作說明,該搬送裝置設有: 一機台台面A,設有一氣溝A1; 一轉盤B,設於該機台台面A上,該轉盤B周緣環列佈設有複數個供例如被動元件或LED元件等電子元件W容置之容槽B1,所述容槽B1對應設於該氣溝A1之上方; 一蓋件C,固設於該轉盤B上並覆蓋所述容槽B1。 Please refer to FIGS. 1 and 2 . The method for transporting electronic components according to the embodiment of the present invention can be described by taking the transport device shown in the figure as an example. The transport device is provided with: A machine table A is provided with an air groove A1; A turntable B is arranged on the table A of the machine table. The periphery of the turntable B is provided with a plurality of receptacles B1 for accommodating electronic components W such as passive components or LED components, and the receptacles B1 are correspondingly arranged in the Above the air groove A1; A cover C is fixed on the turntable B and covers the accommodating groove B1.
請參閱圖2、3,該轉盤B與該蓋件C皆呈圓盤狀並具有相同之外徑,該轉盤B可受驅動器(圖未示)驅動而連動該蓋件C同步相對該機台台面A進行逆時針方向的間歇性旋轉,所述容槽B1在承接自一入料槽道D送入的電子元件W後,以間歇性旋轉流路搬送電子元件W; 該機台台面A上設有一呈環狀之限制片E,其設於該轉盤B與該蓋件C周緣並圍擋於所述容槽B1外,以防止所述電子元件W在搬送過程中被離心力拋甩出所述容槽B1外;該限制片E設有一缺空無圍擋之入料區段E1供該入料槽道D與所述容槽B1接設;該限制片E另設有一缺空無圍擋之排料區段E2供電子元件W排出所述容槽B1;該轉盤B旋轉使所述容槽B1由該入料區段E1移動至該排料區段E2的旋轉角度大於180度; 該限制片E上方設有一呈環狀之頂蓋F,其內徑小於該蓋件C之外徑,使該頂蓋F有一部份蓋覆於該蓋件C之上方。 Please refer to FIGS. 2 and 3 , the turntable B and the cover C are both disc-shaped and have the same outer diameter. The turntable B can be driven by a driver (not shown) to link the cover C to the machine synchronously. The table A is rotated intermittently in the counterclockwise direction, and after receiving the electronic components W sent from a feeding channel D, the container B1 transports the electronic components W through the intermittent rotating flow path; The machine table A is provided with a ring-shaped restricting piece E, which is arranged on the periphery of the turntable B and the cover C and surrounds the container B1, so as to prevent the electronic components W from being transported during the conveying process. It is thrown out of the container B1 by centrifugal force; the restricting piece E is provided with a feeding section E1 with no space and no enclosure for the feeding channel D to be connected to the container B1; the restricting piece E is another There is a discharge section E2 with no space and no enclosure for the electronic components W to discharge the container B1; the rotation of the turntable B makes the container B1 move from the feed section E1 to the discharge section E2. The rotation angle is greater than 180 degrees; A ring-shaped top cover F is disposed above the restricting piece E, the inner diameter of which is smaller than the outer diameter of the cover C, so that a part of the top cover F covers the top of the cover C.
請參閱圖3,該氣溝A1由該機台台面A向下凹設呈具有缺空區段A11之圓環狀,並呈水平狀環設於該機台台面A上表面,該缺空區段A11對應該入料槽道D;該氣溝A1之外徑小於該轉盤B之外徑且該氣溝A1設於該容槽B1之外緣B11與該容槽B1之內緣B12之間;該氣溝A1在該機台台面A上凹設之區域的寬度小於所述電子元件W的長度與寬度,使所述電子元件W不至於掉落該氣溝A1中;該氣溝A1與該機台台面A上之複數個可通入正壓的第一氣孔A2相通,所述第一氣孔A2相隔固定間距佈設於該氣溝A1內。Please refer to FIG. 3 , the air groove A1 is concave downward from the machine table A to form a circular ring with a hollow section A11, and is horizontally arranged on the upper surface of the machine table A. The hollow section Section A11 corresponds to the feeding channel D; the outer diameter of the air channel A1 is smaller than the outer diameter of the turntable B and the air channel A1 is set between the outer edge B11 of the container B1 and the inner edge B12 of the container B1 ; The width of the recessed area of this air groove A1 on the machine table A is less than the length and width of the electronic component W, so that the electronic component W will not drop in the air groove A1; the air groove A1 and the A plurality of first air holes A2 on the machine table A that can pass through the positive pressure communicate with each other, and the first air holes A2 are arranged in the air groove A1 at a fixed distance.
請參閱圖3、4,該機台台面A上設有一可通入負壓之第二氣孔A3在需對所述電子元件W進行入料處;該轉盤B之下方設有複數個氣體導槽B13分別各對應各容槽B1,所述氣體導槽B13之一端經該內緣B12與該容槽B1相通,另一端在該轉盤B進行間歇性旋轉時會與該第二氣孔A3相通,當所述氣體導槽B13與該第二氣孔A3相通時,所述電子元件W將受負壓作用而朝該內緣B12方向位移,使電子元件W被吸入所述容槽B1內以進行入料;其中,所述電子元件W係穿經該缺空區段A11與該入料區段E1(圖2)進行入料。Please refer to FIGS. 3 and 4 , the machine table A is provided with a second air hole A3 through which negative pressure can be introduced, where the electronic components W need to be fed; a plurality of gas guide grooves are provided under the turntable B B13 respectively correspond to each chamber B1, one end of the gas guide groove B13 communicates with the chamber B1 through the inner edge B12, and the other end communicates with the second air hole A3 when the turntable B rotates intermittently. When the gas guide groove B13 communicates with the second air hole A3, the electronic component W will be displaced toward the inner edge B12 by the action of negative pressure, so that the electronic component W will be sucked into the container B1 for feeding ; Wherein, the electronic component W is fed through the empty section A11 and the feeding section E1 (FIG. 2).
請參閱圖3、5,該機台台面A上設有一可通入正壓之第三氣孔A4於需對所述電子元件W進行出料處,所述氣體導槽B13之一端在該轉盤B進行間歇性旋轉時會與該第三氣孔A4相通,當所述氣體導槽B13與該第三氣孔A4相通時,所述電子元件W將受正壓作用而朝該外緣B11方向位移,使所述電子元件W被吹出所述容槽B1外以進行出料;其中,所述電子元件W係穿經該排料區段E2(圖2)進行出料。Please refer to FIGS. 3 and 5 , the machine table A is provided with a third air hole A4 through which positive pressure can be passed at the place where the electronic component W needs to be discharged, and one end of the air guide groove B13 is on the turntable B During intermittent rotation, it will communicate with the third air hole A4. When the gas guide groove B13 communicates with the third air hole A4, the electronic component W will be displaced toward the outer edge B11 by the action of positive pressure, so that the The electronic components W are blown out of the container B1 for discharging; wherein, the electronic components W pass through the discharging section E2 ( FIG. 2 ) for discharging.
本發明實施例電子元件搬送方法及裝置在實施上,所述電子元件W被吸入所述容槽B1內後,使該蓋件C與該轉盤B同步間歇性旋轉搬送所述電子元件W離開該缺空區段A11至該氣溝A1之上方; 請參閱圖6,待所述容槽B1內之電子元件W位移至該氣溝A1上方後,因該氣溝A1在通入正壓後將充滿氣體A12,且所述氣體A12將由該氣溝A1溢散至所述容槽B1內,故所述氣體A12將朝所述容槽B1內吹送並推頂所述電子元件W之底部W1,以令所述容槽B1內之電子元件W於所述容槽B1內懸浮並貼靠於該蓋件C之底面C1,在不與該機台台面A接觸的狀態下被搬送。 In the implementation of the method and device for transporting electronic components according to the embodiments of the present invention, after the electronic components W are sucked into the container B1, the cover C and the turntable B are synchronously rotated and intermittently rotated to transport the electronic components W away from the container B1. The empty section A11 is above the air groove A1; Please refer to FIG. 6 , after the electronic component W in the container B1 is displaced above the air groove A1, the air groove A1 will be filled with the gas A12 after the positive pressure is applied, and the gas A12 will be discharged from the air groove A1 spills into the container B1, so the gas A12 will be blown into the container B1 and push the bottom W1 of the electronic component W, so that the electronic component W in the container B1 will be The container B1 floats in and abuts against the bottom surface C1 of the cover C, and is transported without contacting the table A of the machine.
本發明實施例之電子元件搬送方法及裝置,所述容槽B1內之電子元件W在被搬送時,係於所述容槽B1內懸浮而不與該機台台面A有所接觸,可減少電子元件W或機台台面A間因磨擦而受損。In the method and device for transporting electronic components according to the embodiment of the present invention, when the electronic components W in the container B1 are transported, they are suspended in the container B1 without contacting the machine table A, which can reduce The electronic components W or the machine table A are damaged due to friction.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。However, the above are only preferred embodiments of the present invention, and should not limit the scope of implementation of the present invention, that is, simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the description of the invention, All still fall within the scope of the patent of the present invention.
A:機台台面 A1:氣溝 A11:缺空區段 A12:氣體 A2:第一氣孔 A3:第二氣孔 A4:第三氣孔 B:轉盤 B1:容槽 B11:外緣 B12:內緣 B13:氣體導槽 C:蓋件 C1:底面 D:入料槽道 E:限制片 E1:入料區段 E2:排料區段 F:頂蓋 W:電子元件 W1:底部 A: Machine table A1: Air groove A11: Empty section A12: Gas A2: The first stomata A3: Second air hole A4: The third stomata B: Turntable B1: Container B11: Outer edge B12: inner edge B13: Gas channel C: Cover C1: Bottom D: Feeding channel E: Restricted film E1: Feeding section E2: discharge section F: top cover W: electronic components W1: Bottom
圖1係本發明實施例中搬送裝置之立體示意圖。 圖2係本發明實施例中搬送裝置之立體分解示意圖。 圖3係本發明實施例中搬送裝置省略蓋件與頂蓋之俯視示意圖。 圖4係本發明實施例中電子元件進行入料之示意圖。 圖5係本發明實施例中電子元件進行出料之示意圖。 圖6係本發明實施例中電子元件於容槽內懸浮之示意圖。 FIG. 1 is a three-dimensional schematic diagram of a conveying device in an embodiment of the present invention. FIG. 2 is a schematic exploded perspective view of the conveying device according to the embodiment of the present invention. 3 is a schematic top view of the conveying device omitting the cover and the top cover according to the embodiment of the present invention. FIG. 4 is a schematic diagram of feeding electronic components in an embodiment of the present invention. FIG. 5 is a schematic diagram of discharging of electronic components in an embodiment of the present invention. FIG. 6 is a schematic diagram of an electronic component suspended in a container according to an embodiment of the present invention.
A:機台台面 A: Machine table
A1:氣溝 A1: Air groove
A12:氣體 A12: Gas
B1:容槽 B1: Container
C:蓋件 C: Cover
C1:底面 C1: Bottom
W:電子元件 W: electronic components
W1:底部 W1: Bottom
Claims (9)
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| TW109129008A TWI752602B (en) | 2020-08-25 | 2020-08-25 | Electronic component conveying method and device |
| CN202110535100.4A CN114121753A (en) | 2020-08-25 | 2021-05-17 | Electronic component conveying method and device |
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| TWI881526B (en) * | 2023-11-07 | 2025-04-21 | 久元電子股份有限公司 | Wafer inspection device |
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| TWI881526B (en) * | 2023-11-07 | 2025-04-21 | 久元電子股份有限公司 | Wafer inspection device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202208264A (en) | 2022-03-01 |
| CN114121753A (en) | 2022-03-01 |
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