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TWI881237B - Exposure device - Google Patents

Exposure device Download PDF

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Publication number
TWI881237B
TWI881237B TW111128115A TW111128115A TWI881237B TW I881237 B TWI881237 B TW I881237B TW 111128115 A TW111128115 A TW 111128115A TW 111128115 A TW111128115 A TW 111128115A TW I881237 B TWI881237 B TW I881237B
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Prior art keywords
substrate
exposure
unit
long
peb
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TW111128115A
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Chinese (zh)
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TW202321825A (en
Inventor
緑川悟
馬田教廉
森正義
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日商鷗爾熙製作所股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/38Treatment before imagewise removal, e.g. prebaking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

[課題] 在曝光長條基板之後,可以不空出時間而進行加熱處理。 [解決手段] 一種曝光裝置,係為曝光長條基板的曝光裝置,包括捲對捲型的搬送部,其中在曝光單元與基板捲繞部之間設置加熱長條基板的加熱裝置,加熱裝置隨著長條基板的移動而移動以加熱長條基板。 [Topic] After exposing a long substrate, a heating treatment can be performed without taking time off. [Solution] An exposure device is an exposure device for exposing a long substrate, comprising a roll-to-roll conveying section, wherein a heating device for heating the long substrate is provided between an exposure unit and a substrate winding section, and the heating device moves with the movement of the long substrate to heat the long substrate.

Description

曝光裝置Exposure device

本發明關於一種曝光印刷電路板(PCB)等的長條基板的捲對捲型的直接曝光機,特別是關於對纏繞成捲筒狀的長條基板,為了在曝光後進行加熱處理,而包括移動的基板加熱裝置的曝光裝置。The present invention relates to a roll-to-roll direct exposure machine for exposing a long substrate such as a printed circuit board (PCB), and in particular to an exposure device including a movable substrate heating device for heating the long substrate wound into a roll after exposure.

已知一種直接曝光裝置,其曝光形成在長條基板的光阻層而無需遮罩。例如,如專利文獻1所公開,將纏繞成捲筒狀的長條基板吸附在曝光載台的同時並搬送,藉由從曝光單元投射的圖案化的紫外線而使長條基板表面的光阻感光。A direct exposure device is known that exposes a photoresist layer formed on a long substrate without a mask. For example, as disclosed in Patent Document 1, a long substrate wound into a roll is adsorbed on an exposure stage and transported, and the photoresist on the surface of the long substrate is exposed to light by patterned ultraviolet light projected from an exposure unit.

具體而言,藉由曝光載台吸附保持基板以及曝光載台的移動而掃描長條基板,曝光單元將來自光源(未示出)的照明光照射至數位微鏡裝置(Digital Micro-mirror Device, DMD)等的光調變元件陣列,並且同步於曝光載台的移動而將顯示於DMD的圖案切換,在基板的預定範圍(被保持於曝光載台的範圍)繪製(曝光)任意的電路圖案。曝光結束的基板以捲筒的形式捲繞。Specifically, the exposure stage absorbs and holds the substrate and moves the exposure stage to scan the long substrate. The exposure unit irradiates the illumination light from the light source (not shown) to the light modulation element array of the digital micro-mirror device (DMD), etc., and switches the pattern displayed on the DMD in synchronization with the movement of the exposure stage, and draws (exposes) any circuit pattern in the predetermined range of the substrate (the range held by the exposure stage). The substrate after exposure is wound in the form of a roll.

順便一提,一些用於半導體、印刷電路板等的光阻在曝光後需要加熱處理。稱為曝光後烘烤(Post Exposure Bake, PEB),例如在化學增幅型光阻,進行PEB是為了促進藉由曝光而開始的化學反應(去保護反應或交聯反應)。 [先前技術文獻] [專利文獻] By the way, some photoresists used in semiconductors, printed circuit boards, etc. need to be heated after exposure. This is called Post Exposure Bake (PEB). For example, in chemically amplified photoresists, PEB is performed to promote the chemical reaction (deprotection reaction or cross-linking reaction) initiated by exposure. [Prior Art Literature] [Patent Literature]

[專利文獻1] 日本專利特開2015-222370號公報 [專利文獻2] 日本專利特開昭60-089925號公報 [Patent document 1] Japanese Patent Publication No. 2015-222370 [Patent document 2] Japanese Patent Publication No. 60-089925

[發明所欲解決之問題][The problem the invention is trying to solve]

已知化學增幅型光阻的PEB是曝光後隨著時間的經過而反應變慢。但是,在習知的捲對捲型的直接曝光裝置(參考專利文獻1)中,由於基板是連續的,所以直到一卷的所有基板的曝光完成為止前無法將基板放入加熱裝置,特別是長條基板的前頭已曝光的部分,在曝光後必須放置長時間。It is known that the PEB of chemically amplified photoresist reacts slowly as time passes after exposure. However, in the known roll-to-roll direct exposure device (see Patent Document 1), since the substrates are continuous, the substrates cannot be placed in a heating device until the exposure of all the substrates in a roll is completed. In particular, the exposed front portion of the long substrate must be left for a long time after exposure.

此外,專利文獻2記載一種將接觸曝光裝置與加熱裝置成列構成的電子電路形成方法。又,電子電路構建所需的預烘烤、顯影、蝕刻等其他製程也成列構成。在專利文獻2中,加熱裝置121設置在從曝光部115到基板捲繞部129之間。In addition, Patent Document 2 describes a method for forming an electronic circuit in which a contact exposure device and a heating device are arranged in a row. In addition, other processes such as pre-baking, developing, and etching required for the construction of the electronic circuit are also arranged in a row. In Patent Document 2, the heating device 121 is arranged between the exposure unit 115 and the substrate winding unit 129.

然而,PEB需要正確地管理溫度與加熱時間,PEB不能用於直接曝光裝置。在掃描基板的同時進行曝光的這樣直接曝光裝置的特性上,藉由曝光載台的移動長條基板在加熱裝置內來回移動。因此,在加熱裝置內滯留的時間因製程而異,並且不能在一定條件下加熱。如在專利文獻2記載的構成,通過隧道內的那樣構成的加熱裝置中,在加熱裝置內滯留的時間因製程而變化,難以管理加熱溫度、加熱時間等。However, PEB requires accurate management of temperature and heating time, and PEB cannot be used in direct exposure devices. Due to the characteristics of direct exposure devices that perform exposure while scanning the substrate, the long substrate moves back and forth in the heating device by moving the exposure stage. Therefore, the retention time in the heating device varies depending on the process, and heating cannot be performed under certain conditions. In a heating device configured as described in Patent Document 2, the retention time in the heating device varies depending on the process, making it difficult to manage the heating temperature, heating time, etc.

因此,本發明目的在於提供一種曝光裝置,在將捲對捲型的長條基板掃描曝光的曝光裝置中,不空出曝光後的時間,並且,可以正確地調整溫度以及時間而進行PEB處理。 [解決問題之手段] Therefore, the present invention aims to provide an exposure device that scans and exposes a roll-to-roll long substrate without leaving any time after exposure, and can accurately adjust the temperature and time to perform PEB treatment. [Means for solving the problem]

本發明是一種曝光裝置,係為曝光長條基板的曝光裝置,包括捲對捲傳送型的搬送部, 其中在曝光單元與基板捲繞部之間設置有加熱長條基板的加熱裝置, 加熱裝置隨著長條基板的移動而移動以加熱長條基板。 [發明的效果] The present invention is an exposure device for exposing a long strip substrate, comprising a roll-to-roll conveying type conveying unit, wherein a heating device for heating the long strip substrate is provided between the exposure unit and the substrate winding unit, and the heating device moves with the movement of the long strip substrate to heat the long strip substrate. [Effect of the invention]

根據至少一個實施例,本發明可以藉由曝光單元曝光後不空出時間而進行加熱處理。又,與長條基板總是通過加熱裝置內的構成不同,加熱溫度以及加熱時間可以正確地調整。另外,這裡記載的效果不一定受到限定,並且可以是記載於本說明書的任一效果或與其不同的效果。According to at least one embodiment, the present invention can perform a heating process without leaving time after exposure by the exposure unit. Also, unlike the configuration in which the long substrate always passes through the heating device, the heating temperature and heating time can be adjusted correctly. In addition, the effects described here are not necessarily limited, and can be any effect described in this specification or an effect different therefrom.

以下,參考附圖說明本發明的實施方式等。另外,以下說明的實施方式等是本發明的較佳的具體例,本發明的內容並不限定於這些實施方式等。Hereinafter, the embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the embodiments described below are preferred specific examples of the present invention, and the content of the present invention is not limited to these embodiments.

參考圖1A以及圖1B說明根據本發明一實施例的曝光裝置。曝光裝置是所謂的捲對捲方式的曝光裝置,長條基板W是面向圖面從左側的上游側向右側的下游側搬送。1A and 1B illustrate an exposure apparatus according to an embodiment of the present invention. The exposure apparatus is a so-called roll-to-roll exposure apparatus, and a long substrate W is transported from the left upstream side to the right downstream side facing the image.

長條基板W例如是作為用於行動電話、移動裝置等的電子電路基板(印刷電路基板)的基板材料的感光性長條膜(表面塗佈感光體的合成樹脂製撓性膜),被捲繞在供給側基板捲筒1。塗佈光阻等感光材料的長條基板W形成為片狀的覆銅層板等,具有幾十米至幾百米的長度。以下,將長條基板W的圖中朝向上方的面稱為「表面」,將圖中朝向下方的面稱為「背面」。另外,將沿著搬送方向的方向以X表示,將與搬送方向垂直的長條基板W的寬度方向以Y表示,將與X以及Y兩者垂直的方向(鉛直方向)以Z表示。The strip substrate W is a photosensitive strip film (a flexible film made of synthetic resin with a photosensitive body coated on the surface) which is used as a substrate material for an electronic circuit substrate (printed circuit substrate) for a mobile phone, a mobile device, etc., for example, and is wound on a supply side substrate reel 1. The strip substrate W coated with a photosensitive material such as a photoresist is formed into a sheet-like copper-clad plate, etc., and has a length of tens to hundreds of meters. Hereinafter, the surface of the strip substrate W facing upward in the figure is referred to as the "surface", and the surface facing downward in the figure is referred to as the "back". In addition, the direction along the conveying direction is represented by X, the width direction of the strip substrate W perpendicular to the conveying direction is represented by Y, and the direction perpendicular to both X and Y (vertical direction) is represented by Z.

藉由基板投入部Y移動機構2投入而從供給側基板捲筒1送出的長條基板W通過由引導輥以及張力輥構成的供給側基板緩衝器(張力輥)3以及供給側制動輥13而供給到曝光部。曝光部具有曝光載台4、曝光載台XY移動機構5、對準相機6、以及曝光單元7。The long substrate W fed from the supply side substrate reel 1 by the substrate feeding part Y moving mechanism 2 is fed to the exposure part through the supply side substrate buffer (tension roller) 3 composed of a guide roller and a tension roller and the supply side brake roller 13. The exposure part has an exposure stage 4, an exposure stage XY moving mechanism 5, an alignment camera 6, and an exposure unit 7.

供給側基板捲筒1保持纏繞成捲筒狀的長條基板W,經由旋轉將長條基板W向下游側供給。捲繞側基板捲筒11經由旋轉而將從上游側供給的長條基板W捲繞成捲筒狀而保持它。供給側基板捲筒1以及捲繞側基板捲筒11藉由旋轉驅動裝置間歇地被旋轉驅動。The supply side substrate reel 1 holds the long substrate W wound into a roll shape and supplies the long substrate W to the downstream side by rotating. The winding side substrate reel 11 holds the long substrate W supplied from the upstream side by rotating and winding it into a roll shape. The supply side substrate reel 1 and the winding side substrate reel 11 are intermittently rotationally driven by a rotation drive device.

供給側基板緩衝器3隨著長條基板W的搬送而升降,經由對長條基板W施加張力而防止鬆弛或起皺,並且為了在曝光部的掃描曝光,具有作為用於使長條基板W在曝光部移動的緩衝器的功能。The supply side substrate buffer 3 is raised and lowered as the long substrate W is conveyed, and applies tension to the long substrate W to prevent sag or wrinkles, and functions as a buffer for moving the long substrate W in the exposure section for scanning exposure in the exposure section.

曝光單元7包括複數個曝光頭,並且規則地配置在與長條基板W鉛直上方分開預定距離的位置處。對各曝光頭配置光源以及照明光學系統(未示出),從光源放射出的光藉由分別對應的照明光學系統而被引導到對應的曝光頭。各曝光頭包括二維排列複數個微鏡的數位微鏡裝置(Digital Micro-mirror Device, DMD)以及將DMD的圖像在長條基板上成像的成像光學系統。DMD的微鏡選擇性地定位在將光引導到長條基板W上的第一姿勢以及將光引導到長條基板W外的第二姿勢中的任一種,並且各微鏡被獨立控制。The exposure unit 7 includes a plurality of exposure heads, and is regularly arranged at a position separated by a predetermined distance from directly above the long substrate W. A light source and an illumination optical system (not shown) are configured for each exposure head, and the light emitted from the light source is guided to the corresponding exposure head by the corresponding illumination optical system. Each exposure head includes a digital micro-mirror device (DMD) in which a plurality of micro-mirrors are arranged in two dimensions, and an imaging optical system for imaging the image of the DMD on the long substrate. The micro-mirrors of the DMD are selectively positioned in any one of a first posture for guiding light onto the long substrate W and a second posture for guiding light outside the long substrate W, and each micro-mirror is independently controlled.

曝光載台4具有工件夾持機構,吸附長條基板W的背面並且將其保持平坦。曝光載台4在曝光載台4接觸於長條基板W的背面的上端位置以及曝光載台4與長條基板W的背面分離的下端位置之間可升降。又,藉由曝光載台XY移動機構5進行掃描或步進重複動作。The exposure stage 4 has a workpiece clamping mechanism that absorbs the back side of the long substrate W and keeps it flat. The exposure stage 4 can be raised and lowered between an upper end position where the exposure stage 4 contacts the back side of the long substrate W and a lower end position where the exposure stage 4 is separated from the back side of the long substrate W. In addition, the exposure stage XY moving mechanism 5 performs scanning or stepping repetitive actions.

在一實施例中,在曝光時藉由複數個曝光頭對一列的帶狀區域曝光,除了藉由曝光載台4的X方向的移動而依序進行曝光之外,也可在各列上藉由Y方向的往復移動進行曝光。為了Y方向的曝光,曝光單元7以外的整體的構成以可以在+/-Y方向移動的方式完成。In one embodiment, during exposure, a plurality of exposure heads are used to expose a strip area of a row. In addition to sequentially performing exposure by moving the exposure stage 4 in the X direction, exposure can also be performed on each row by reciprocating movement in the Y direction. For exposure in the Y direction, the entire structure other than the exposure unit 7 is completed in a manner that can move in the +/-Y direction.

對準相機6設置在曝光單元7的上游側,藉由拍攝設置在長條基板W的對準標記而取得長條基板W的位置訊息。在X方向移動長條基板W的同時進行對準標記的拍攝。The alignment camera 6 is disposed on the upstream side of the exposure unit 7, and acquires position information of the long substrate W by photographing the alignment mark disposed on the long substrate W. The alignment mark is photographed while the long substrate W is moved in the X direction.

鄰接於曝光單元7的下游側(或曝光單元7的下游側附近)設置有加熱裝置,此加熱裝置加熱在曝光部曝光的長條基板W。加熱裝置具有PEB單元8以及PEB單元XY移動機構9。在曝光動作中,加熱裝置隨著基板的移動而移動,並將長條基板W的例如表面(曝光面)加熱。PEB單元8具有例如分別內置於加熱器的上部單元8H以及下部單元8S,並且將長條基板W夾在兩者之間加熱的構成。上部單元8H以及下部單元8S可沿XYZ方向移動。A heating device is provided adjacent to the downstream side of the exposure unit 7 (or near the downstream side of the exposure unit 7), and the heating device heats the long substrate W exposed in the exposure section. The heating device has a PEB unit 8 and a PEB unit XY moving mechanism 9. During the exposure operation, the heating device moves along with the movement of the substrate, and heats, for example, the surface (exposure surface) of the long substrate W. The PEB unit 8 has, for example, an upper unit 8H and a lower unit 8S, each of which is built into a heater, and the long substrate W is sandwiched between the two for heating. The upper unit 8H and the lower unit 8S can move in the XYZ direction.

當PEB單元8加熱長條基板W時,曝光載台4與PEB單元8相對位置不變地移動。個別設置的曝光載台XY移動機構5與PEB單元XY移動機構9同步動作。為了管理長條基板W的加熱時間,PEB單元8可以在與基板搬送方向不同的方向(Y方向)上後退。參考符號8’表示PEB單元8的後退位置。在PEB單元8不對長條基板W進行加熱動作時,PEB單元8位於後退位置8’。在此後退狀態下進行例如保溫以使PEB單元8不冷卻。When the PEB unit 8 heats the long substrate W, the exposure stage 4 and the PEB unit 8 move without changing their relative positions. The separately provided exposure stage XY moving mechanism 5 and the PEB unit XY moving mechanism 9 operate synchronously. In order to manage the heating time of the long substrate W, the PEB unit 8 can retreat in a direction (Y direction) different from the substrate conveying direction. Reference symbol 8' indicates the retreated position of the PEB unit 8. When the PEB unit 8 is not heating the long substrate W, the PEB unit 8 is located in the retreated position 8'. In this retreated state, for example, heat preservation is performed to prevent the PEB unit 8 from cooling down.

經PEB處理的長條基板W通過捲繞側制動輥14、捲繞側基板緩衝器(張力輥)12以及引導輥,而捲繞在捲繞側基板捲筒11。設置有基板捲繞部Y移動機構10。The long substrate W after the PEB process is wound around the winding side substrate reel 11 through the winding side brake roller 14, the winding side substrate buffer (tension roller) 12 and the guide roller. A substrate winding portion Y moving mechanism 10 is provided.

供給側制動輥13以及捲繞側制動輥14配置成各自的旋轉軸在水平方向大致一直線地並列。供給側制動輥13以及捲繞側制動輥14由包括夾著長條基板W對向配置的兩個輥的夾持輥構成。這兩個輥可分別藉由未示出的機構在上下方向(Z方向)移動,以夾持或釋放長條基板W。The supply side brake roller 13 and the winding side brake roller 14 are arranged so that their respective rotation axes are approximately aligned in a straight line in the horizontal direction. The supply side brake roller 13 and the winding side brake roller 14 are composed of clamping rollers including two rollers arranged opposite to each other for clamping the long substrate W. These two rollers can be moved in the up and down direction (Z direction) by a mechanism not shown to clamp or release the long substrate W.

供給側制動輥13以及捲繞側制動輥14可以經由夾持輥夾持長條基板W並且以夾持輥不旋轉的方式煞車而對長條基板W進行制動。另一方面,在釋放長條基板W的狀態下,為了不妨礙長條基板W的移動,將夾持輥與長條基板W的表背面分離。The supply side brake roller 13 and the winding side brake roller 14 can brake the strip substrate W by clamping the strip substrate W with the clamping roller and braking in a manner that the clamping roller does not rotate. On the other hand, in the state of releasing the strip substrate W, the clamping roller is separated from the front and back sides of the strip substrate W in order not to hinder the movement of the strip substrate W.

又,供給側制動輥13以及捲繞側制動輥14分別包括將輥旋轉驅動的旋轉驅動裝置(未示出)。旋轉驅動裝置在夾持長的基板W的狀態下,藉由以間歇地並且大致相同的旋轉驅動量旋轉驅動供給側制動輥13以及捲繞側制動輥14,橋接於供給側基板捲筒1與捲繞側基板捲筒11之間的長條基板W可以被搬送預定長度(逐幀)。作為旋轉驅動裝置,例如使用步進馬達,高精度地控制長條基板W的輸送量、加速度等。In addition, the supply side brake roller 13 and the winding side brake roller 14 each include a rotation drive device (not shown) for rotationally driving the roller. The rotation drive device rotates and drives the supply side brake roller 13 and the winding side brake roller 14 intermittently and substantially at the same rotation drive amount while clamping the long substrate W, so that the long substrate W bridged between the supply side substrate reel 1 and the winding side substrate reel 11 can be transported by a predetermined length (frame by frame). As the rotation drive device, for example, a stepping motor is used to control the conveying amount, acceleration, etc. of the long substrate W with high precision.

圖2是示出本發明的一實施方式的控制裝置的一例的方塊圖。曝光單元7由分別包括半導體雷射等的光源21、照明光學系統22、矩陣排列複數個微鏡的DMD 23、成像光學系統24等的複數個曝光頭構成,各曝光頭沿搬送方向限定曝光區域。光源21由光源控制器25驅動。FIG2 is a block diagram showing an example of a control device of an embodiment of the present invention. The exposure unit 7 is composed of a plurality of exposure heads including a light source 21 such as a semiconductor laser, an illumination optical system 22, a DMD 23 having a plurality of micromirrors arranged in a matrix, an imaging optical system 24, etc. Each exposure head defines an exposure area along the conveying direction. The light source 21 is driven by a light source controller 25.

各曝光頭的DMD 23基於對應於從曝光控制部26傳送的曝光區域位置的繪圖數據(網格數據)而定位微鏡的姿勢,由此將圖案光投射到長條基板W。藉由對應於長條基板W相對於曝光單元7的相對移動而切換微鏡的姿勢,對長條基板W的感光材料進行曝光(多重曝光等),由此形成圖案。控制器30控制曝光裝置的曝光動作整體。另外,也可以藉由使用光遮罩等的曝光部而構成。 The DMD 23 of each exposure head positions the micromirror based on the drawing data (grid data) corresponding to the exposure area position transmitted from the exposure control unit 26, thereby projecting the pattern light onto the long substrate W. By switching the micromirror's posture corresponding to the relative movement of the long substrate W relative to the exposure unit 7, the photosensitive material of the long substrate W is exposed (multiple exposure, etc.), thereby forming a pattern. The controller 30 controls the overall exposure action of the exposure device. In addition, it can also be constructed by using an exposure unit such as a light mask.

基板供給部31包括配置在曝光載台4的上游側的供給側基板捲筒1、基板投入部Y移動機構2、基板緩衝器3、供給側制動輥13、以及使供給側基板捲筒1繞軸旋轉的驅動機構(未示出)。驅動機構例如由步進馬達構成。供給側基板捲筒1藉由基板供給部31分別將長條基板W的未曝光部分以捲成捲筒狀的狀態下保持並固定,又,可以藉由繞軸旋轉而將長條基板W向下游側送出。 The substrate supply unit 31 includes a supply side substrate reel 1 arranged on the upstream side of the exposure stage 4, a substrate input unit Y moving mechanism 2, a substrate buffer 3, a supply side brake roller 13, and a driving mechanism (not shown) for rotating the supply side substrate reel 1 around an axis. The driving mechanism is composed of a stepping motor, for example. The supply side substrate reel 1 holds and fixes the unexposed portion of the long substrate W in a rolled state through the substrate supply unit 31, and can deliver the long substrate W to the downstream side by rotating around an axis.

基板捲繞部32包括配置在曝光載台4的下游側的基板捲繞部Y移動機構10、捲繞側基板滾筒11、捲繞側基板緩衝器12、捲繞側制動輥14、使捲繞側基板捲筒11旋轉的驅動機構(未示出)。捲繞側基板捲筒11將長條基板W的曝光完成部分以捲成捲筒狀的狀態下保持並固定,又,可以藉由繞軸旋轉而將長條基板W捲繞。基板供給部31以及基板捲繞部32由搬送控制部33控制。 The substrate winding section 32 includes a substrate winding section Y moving mechanism 10 arranged on the downstream side of the exposure stage 4, a winding side substrate roller 11, a winding side substrate buffer 12, a winding side brake roller 14, and a driving mechanism (not shown) for rotating the winding side substrate roller 11. The winding side substrate roller 11 holds and fixes the exposure-completed portion of the long substrate W in a rolled state, and can also wind the long substrate W by rotating around an axis. The substrate supply section 31 and the substrate winding section 32 are controlled by the transport control section 33.

曝光載台XY移動機構5是使曝光載台4移動的機構。PEB單元XY移動機構9是使PEB單元8移動的機構。這些曝光載台XY移動機構5以及PEB單元XY移動機構9由移動控制部34控制。 The exposure stage XY moving mechanism 5 is a mechanism for moving the exposure stage 4. The PEB unit XY moving mechanism 9 is a mechanism for moving the PEB unit 8. These exposure stage XY moving mechanism 5 and PEB unit XY moving mechanism 9 are controlled by the movement control unit 34.

接著,將參考圖3A以及隨後的附圖來說明關於根據本發明的一實施例的曝光搬送動作。另外,在圖中兩點鏈線的區域表示要曝光的一個區域的範圍(以下適當地稱為幀),用點塗滿的區域A、B、C分別示出在一次的曝光製程(步驟1到8為一次)曝光的幀。在本實施例中,將曝光的範圍以及與曝光並行加熱的範圍跳過一個。例如,當曝光幀A時,加熱幀C。也就是說,在兩次前加熱已曝光的幀。Next, the exposure transport operation according to an embodiment of the present invention will be described with reference to FIG. 3A and the subsequent drawings. In addition, the area of the two-dot chain in the figure represents the range of an area to be exposed (hereinafter appropriately referred to as a frame), and the areas A, B, and C filled with dots respectively represent the frames exposed in one exposure process (steps 1 to 8 are one time). In this embodiment, the range of exposure and the range of heating in parallel with exposure are skipped by one. For example, when frame A is exposed, frame C is heated. That is, the frame that has been exposed twice before is heated.

另外,也可以是對鄰接的幀進行曝光以及加熱而不跳過一個的構成。在這種情況下,因為曝光區域之間的間隙被加寬,基板材料或多或少被浪費。此外,曝光載台4與PEB單元8可以連續地鄰接而一體化。Alternatively, the exposure and heating of adjacent frames may be performed without skipping any. In this case, the gap between the exposure areas is widened, and the substrate material is more or less wasted. In addition, the exposure stage 4 and the PEB unit 8 may be continuously adjacent to each other and integrated.

圖3A以及圖3B是步驟1中一實施方式的俯視圖以及側視圖。步驟1是對準開始/PEB開始的處理。長條基板W在基板緩衝器3被緩衝,基板載台4將長條基板W的背面吸附而保持。各部的動作如下所述。 長條基板W:從動於曝光載台4 供給側基板捲筒1:停止 基板投入部Y移動機構2:停止 基板緩衝器3、12:從動於長條基板W 曝光載台4:移動(-X) 曝光載台XY移動機構5:移動(+X) 對準相機 6:攝影中 曝光單元7:停止 PEB單元8:與曝光載台4同步移動 PEB單元XY移動機構9:與曝光載台XY移動機構5同步移動 基板捲繞部Y移動機構10:停止 捲繞側基板捲筒11:停止 曝光載台4在+X方向被驅動,並且在吸附並保持長條基板W的狀況下通過對準相機6的下方。此時,隨著曝光載台4的移動,在供給側基板緩衝器3被緩衝的長條基板W被拉出,同時,在捲繞側基板緩衝器12長條基板W的U字形狀逐漸變深,而長條基板W被緩衝。 FIG. 3A and FIG. 3B are top and side views of an implementation method in step 1. Step 1 is an alignment start/PEB start process. The long substrate W is buffered by the substrate buffer 3, and the substrate carrier 4 adsorbs and holds the back side of the long substrate W. The actions of each part are as follows. Strip substrate W: driven by exposure stage 4 Supply side substrate reel 1: stopped Substrate input section Y moving mechanism 2: stopped Substrate buffers 3, 12: driven by strip substrate W Exposure stage 4: moving (-X) Exposure stage XY moving mechanism 5: moving (+X) Alignment camera 6: photographing Exposure unit 7: stopped PEB unit 8: moving synchronously with exposure stage 4 PEB unit XY moving mechanism 9: moving synchronously with exposure stage XY moving mechanism 5 Substrate winding section Y moving mechanism 10: stopped Wrapping side substrate reel 11: stopped Exposure stage 4 is driven in the +X direction and passes under alignment camera 6 while adsorbing and holding strip substrate W. At this time, as the exposure stage 4 moves, the long substrate W buffered by the supply side substrate buffer 3 is pulled out, and at the same time, the U-shape of the long substrate W gradually deepens in the winding side substrate buffer 12, and the long substrate W is buffered.

圖4A以及圖4B是步驟2中的一實施方式的俯視圖以及側視圖。步驟2是曝光開始/PEB中的處理。基於藉由對準標記的攝影而得到的長條基板W的位置訊息,而進行長條基板與曝光的圖案的對準。與幀A的曝光並行地完成幀C的PEB處理。各部的動作如下所述。 長條基板W:從動於曝光載台4 供給側基板捲筒1:停止 基板投入部Y移動機構2:停止 基板緩衝器3、12:從動於長條基板W 曝光載台4:移動(-X) 曝光載台XY移動機構5:移動(-X) 對準相機6:停止 曝光單元7:曝光中 PEB單元8:移動 (-X) PEB單元XY移動機構9:與曝光載台XY移動機構5同步移動 基板捲繞部Y移動機構10:停止 捲繞側基板捲筒 11:停止 FIG. 4A and FIG. 4B are top and side views of an implementation method in step 2. Step 2 is the process in exposure start/PEB. The strip substrate and the exposed pattern are aligned based on the position information of the strip substrate W obtained by photographing the alignment mark. The PEB process of frame C is completed in parallel with the exposure of frame A. The actions of each part are described as follows. Strip substrate W: driven by exposure stage 4 Supply side substrate reel 1: stopped Substrate input section Y moving mechanism 2: stopped Substrate buffer 3, 12: driven by strip substrate W Exposure stage 4: moving (-X) Exposure stage XY moving mechanism 5: moving (-X) Alignment camera 6: stopped Exposure unit 7: exposing PEB unit 8: moving (-X) PEB unit XY moving mechanism 9: moving synchronously with exposure stage XY moving mechanism 5 Substrate winding section Y moving mechanism 10: stopped Winding side substrate reel 11: stopped

圖5A以及圖5B是步驟3中的一實施方式的俯視圖以及側視圖。步驟3是一列曝光結束/Y方向步進移動/PEB中的處理。各部的動作如下所述。曝光單元7以外的構成在+Y方向移動。 長條基板W:停止 供給側基板捲筒:停止 基板投入部Y移動機構2:移動(+Y) 基板緩衝器3、12:停止 曝光載台4:移動(+Y) 曝光載台XY移動機構5:停止 對準相機6:停止 曝光單元7:停止 PEB單元8:移動 PEB單元XY移動機構9:移動(+Y) 基板捲繞部Y移動機構10:移動(+Y) 捲繞側基板捲筒11:停止 Figures 5A and 5B are top and side views of an implementation method in step 3. Step 3 is a series of exposure end/Y direction step movement/PEB processing. The actions of each part are as follows. The structure other than the exposure unit 7 moves in the +Y direction. Strip substrate W: Stop Supply side substrate reel: Stop Substrate input section Y moving mechanism 2: Move (+Y) Substrate buffer 3, 12: Stop Exposure stage 4: Move (+Y) Exposure stage XY moving mechanism 5: Stop Alignment camera 6: Stop Exposure unit 7: Stop PEB unit 8: Move PEB unit XY moving mechanism 9: Move (+Y) Substrate winding section Y moving mechanism 10: Move (+Y) Winding side substrate reel 11: Stop

圖6A以及圖6B是步驟4中一實施方式的俯視圖以及側視圖。步驟4是第二列曝光開始/PEB中的處理。各部的動作如下所述。 長條基板W:從動於曝光載台4 供給側基板捲筒1:停止 基板投入部Y移動機構2:停止 基板緩衝器3、12:從動於長條基板W 曝光載台4:移動(-X) 曝光載台XY移動機構5:移動(+X) 對準相機6:停止 曝光單元7:曝光中 PEB單元8:與曝光載台4同步移動 PEB單元XY移動機構9:與曝光載台XY移動機構5同步移動 基板捲繞部Y移動機構10:停止 捲繞側基板捲筒 11:停止 曝光單元7將在曝光載台4吸附保持的長條基板W的表面的感光材料層的電子電路圖案掃描曝光。 Figures 6A and 6B are top and side views of an implementation method in step 4. Step 4 is the processing in the second row exposure start/PEB. The actions of each part are described as follows. Strip substrate W: driven by exposure stage 4 Supply side substrate reel 1: stopped Substrate input section Y moving mechanism 2: stopped Substrate buffer 3, 12: driven by strip substrate W Exposure stage 4: moving (-X) Exposure stage XY moving mechanism 5: moving (+X) Alignment camera 6: stopped Exposure unit 7: exposing PEB unit 8: moving synchronously with exposure stage 4 PEB unit XY moving mechanism 9: moving synchronously with exposure stage XY moving mechanism 5 Substrate winding section Y moving mechanism 10: stopped Wrapping side substrate reel 11: stopped Exposure unit 7 scans and exposes the electronic circuit pattern of the photosensitive material layer on the surface of the strip substrate W adsorbed and held by the exposure stage 4.

圖7A以及圖7B是步驟5中一實施方式的俯視圖以及側視圖。步驟5是曝光完成/PEB完成/PEB加熱部後退開始的處理。各部的動作如下所述。 長條基板W:停止(煞車開啟) 供給側基板捲筒1:停止 基板投入部Y移動機構2:移動(-Y) 基板緩衝器3、12:停止 曝光載台4:移動(-Y,-Z) 曝光載台XY移動機構5:停止 對準相機6:停止 曝光單元7:停止 PEB單元8的上部單元8H:移動(+Y) PEB單元8的下部單元8S:運動(-Y,-Z) PEB單元XY移動機構9:停止 基板捲繞部Y移動機構10:移動(-Y) 捲繞側基板捲筒11:停止 Figure 7A and Figure 7B are top and side views of an implementation method in step 5. Step 5 is the process of exposure completion/PEB completion/PEB heating unit retreat. The actions of each unit are as follows. Strip substrate W: Stop (brake on) Supply side substrate reel 1: Stop Substrate input section Y moving mechanism 2: Move (-Y) Substrate buffer 3, 12: Stop Exposure stage 4: Move (-Y, -Z) Exposure stage XY moving mechanism 5: Stop Alignment camera 6: Stop Exposure unit 7: Stop Upper unit 8H of PEB unit 8: Move (+Y) Lower unit 8S of PEB unit 8: Move (-Y, -Z) PEB unit XY moving mechanism 9: Stop Substrate winding section Y moving mechanism 10: Move (-Y) Winding side substrate reel 11: Stop

圖8A以及圖8B是步驟6中一實施方式的俯視圖以及側視圖。步驟6是曝光載台返回開始/PEB載台返回開始的處理。供給側制動輥13以及捲繞側制動輥14將長條基板W夾持而固定長條基板W(煞車開啟)。各部的動作如下所述。 長條基板W:停止(煞車開啟) 供給側基板捲筒1:停止 基板投入部Y移動機構2:停止 基板緩衝器3、12:停止 曝光載台4:移動(-X) 曝光載台XY移動機構5:移動(-X) 對準相機6:停止 曝光單元7:停止 PEB單元8:與曝光載台4同步移動 PEB單元XY移動機構9:與曝光載台XY移動機構5同步移動 基板捲繞部Y移動機構10:停止 捲繞側基板捲筒11:停止 FIG8A and FIG8B are top and side views of an implementation method in step 6. Step 6 is the process of starting the return of the exposure stage/PEB stage. The supply side brake roller 13 and the winding side brake roller 14 clamp the long substrate W and fix the long substrate W (brake on). The actions of each part are as follows. Strip substrate W: Stop (brake on) Supply side substrate reel 1: Stop Substrate input section Y moving mechanism 2: Stop Substrate buffer 3, 12: Stop Exposure stage 4: Move (-X) Exposure stage XY moving mechanism 5: Move (-X) Alignment camera 6: Stop Exposure unit 7: Stop PEB unit 8: Move synchronously with exposure stage 4 PEB unit XY moving mechanism 9: Move synchronously with exposure stage XY moving mechanism 5 Substrate winding section Y moving mechanism 10: Stop Wrapping side substrate reel 11: Stop

圖9A以及圖9B是步驟7中一實施方式的俯視圖以及側視圖。步驟7是曝光載台上升開始/PEB載台上升開始的處理。各部的動作如下所述。 長條基板W:藉由供給側制動輥12以及捲繞側制動輥13移動(距離a) 供給側基板捲筒1:捲出 基板投入部Y移動機構2:停止 基板緩衝器3、12:捲回至投入側 曝光載台4:移動(+Z) 曝光載台XY移動機構5:停止 對準相機6:停止 曝光單元7:停止 PEB單元8的上部單元8H:移動(-Y) PEB單元8的下部單元8S:移動(+Z) PEB單元XY移動機構9:停止 基板捲繞部Y移動機構10:停止 捲繞側基板捲筒11:捲繞一幀 Figures 9A and 9B are top and side views of an implementation method in step 7. Step 7 is the process of starting the exposure stage rise/PEB stage rise. The actions of each part are as follows. Strip substrate W: Moved by the supply side brake roller 12 and the winding side brake roller 13 (distance a) Supply side substrate reel 1: Rolled out Substrate input part Y moving mechanism 2: Stopped Substrate buffer 3, 12: Rewound to the input side Exposure stage 4: Moved (+Z) Exposure stage XY moving mechanism 5: Stopped Alignment camera 6: Stopped Exposure unit 7: Stopped Upper unit 8H of PEB unit 8: Moved (-Y) Lower unit 8S of PEB unit 8: Moved (+Z) PEB unit XY moving mechanism 9: Stopped Substrate winding part Y moving mechanism 10: Stopped Winding side substrate reel 11: winding one frame

圖10A以及圖10B是步驟8中一實施方式的俯視圖以及側視圖。步驟8是曝光載台基板吸附/PEB加熱部下降開始的處理。各部的動作如下所述。 長條基板W:停止 供給側基板捲筒1:停止 基板投入部Y移動機構2:停止 基板緩衝器3、12:停止 曝光載台4:基板吸附 曝光載台XY移動機構5:停止 對準相機6:停止 曝光單元7:停止 PEB單元8的上部單元8H:移動(-Z) PEB單元8的下部單元8S:停止 PEB單元XY移動機構9:停止 基板捲繞部Y移動機構10:停止 捲繞側基板捲筒11:停止 在步驟8之後,處理返回到步驟1,並且以與上述處理同樣的方式進行下一幀的曝光與幀B的PEB處理。 Figures 10A and 10B are top and side views of an implementation method in step 8. Step 8 is the process starting from the exposure stage substrate adsorption/PEB heating part descending. The actions of each part are described as follows. Strip substrate W: stop Supply side substrate reel 1: stop Substrate input section Y moving mechanism 2: stop Substrate buffer 3, 12: stop Exposure stage 4: substrate adsorption Exposure stage XY moving mechanism 5: stop Alignment camera 6: stop Exposure unit 7: stop Upper unit 8H of PEB unit 8: move (-Z) Lower unit 8S of PEB unit 8: stop PEB unit XY moving mechanism 9: stop Substrate winding section Y moving mechanism 10: stop Winding side substrate reel 11: stop After step 8, the process returns to step 1, and the exposure of the next frame and the PEB process of frame B are performed in the same manner as the above process.

在本發明的一個實施方式中,當將某一幀A曝光中,可以並行地進行附近曝光完成的另一幀C的加熱處理(PEB)。因此,可以在曝光後不空出時間而進行加熱處理。又,與長條基板W通過加熱裝置的構成不同,可以正確地調整加熱條件(溫度以及時間)而進行PEB處理。In one embodiment of the present invention, while a certain frame A is being exposed, a heat treatment (PEB) can be performed on another frame C that has been exposed nearby. Therefore, the heat treatment can be performed without taking time off after exposure. In addition, unlike the configuration of a long substrate W passing through a heating device, the PEB treatment can be performed by correctly adjusting the heating conditions (temperature and time).

以上,雖然具體地說明關於本發明的一實施方式,但本發明不限於上述的一實施方式,可以基於本發明的技術思想進行各種變形。例如,曝光單元與PEB單元不限於藉由個別的移動機構移動,也可以藉由共通的移動機構移動。又,在上述實施方式中舉出的構成、方法、製程、形狀、材料、以及數值等僅僅是示例,可以應需求使用不同的構成、方法、製程、形狀、材料、以及數值等。Although one embodiment of the present invention is specifically described above, the present invention is not limited to the above embodiment, and various modifications can be made based on the technical concept of the present invention. For example, the exposure unit and the PEB unit are not limited to being moved by individual moving mechanisms, but can also be moved by a common moving mechanism. In addition, the configurations, methods, processes, shapes, materials, and numerical values listed in the above embodiments are only examples, and different configurations, methods, processes, shapes, materials, and numerical values can be used as needed.

1:供給側基板捲筒 2:基板投入部Y移動機構 3,12:基板緩衝器 4:曝光載台 5:曝光載台XY移動機構 6:對準相機 7:曝光單元 8:PEB單元 8’:後退位置 8H:上部單元 8S:下部單元 9:PEB單元XY移動機構 10:基板捲繞部Y移動機構 11:捲繞側基板捲筒 13:供給側制動輥 14:捲繞側制動輥 21:光源 22:照明光學系統 23:數位微鏡裝置/DMD 24:成像光學系統 25:光源控制器 26:曝光控制部 30:控制器 31:基板供給部 32:基板捲繞部 33:搬送控制部 34:移動控制部 A,B,C:區域/幀 a:移動距離 W:長條基板/撓性基板 1: Supply side substrate reel 2: Substrate input section Y moving mechanism 3,12: Substrate buffer 4: Exposure stage 5: Exposure stage XY moving mechanism 6: Alignment camera 7: Exposure unit 8: PEB unit 8’: Retracted position 8H: Upper unit 8S: Lower unit 9: PEB unit XY moving mechanism 10: Substrate winding section Y moving mechanism 11: Winding side substrate reel 13: Supply side brake roller 14: Winding side brake roller 21: Light source 22: Illumination optical system 23: Digital micromirror device/DMD 24: Imaging optical system 25: Light source controller 26: Exposure control unit 30: Controller 31: Substrate supply unit 32: Substrate winding unit 33: Transport control unit 34: Movement control unit A, B, C: Area/frame a: Movement distance W: Strip substrate/flexible substrate

圖1A以及圖1B是本發明的一實施例的俯視圖以及側視圖。 圖2是根據本發明的一實施例的控制裝置的一例的方塊圖。 圖3A以及圖3B是示出曝光裝置的步驟1的動作的俯視圖以及側視圖。 圖4A以及圖4B是示出曝光裝置的步驟2的動作的俯視圖以及側視圖。 圖5A以及圖5B是示出曝光裝置的步驟3的動作的俯視圖以及側視圖。 圖6A以及圖6B是示出曝光裝置的步驟4的動作的俯視圖以及側視圖。 圖7A以及圖7B是示出曝光裝置的步驟5的動作的俯視圖以及側視圖。 圖8A以及圖8B是示出曝光裝置的步驟6的動作的俯視圖以及側視圖。 圖9A以及圖9B是示出曝光裝置的步驟7的動作的俯視圖以及側視圖。 圖10A以及圖10B是示出曝光裝置的步驟8的動作的俯視圖以及側視圖。 Fig. 1A and Fig. 1B are a top view and a side view of an embodiment of the present invention. Fig. 2 is a block diagram of an example of a control device according to an embodiment of the present invention. Fig. 3A and Fig. 3B are a top view and a side view showing the action of step 1 of the exposure device. Fig. 4A and Fig. 4B are a top view and a side view showing the action of step 2 of the exposure device. Fig. 5A and Fig. 5B are a top view and a side view showing the action of step 3 of the exposure device. Fig. 6A and Fig. 6B are a top view and a side view showing the action of step 4 of the exposure device. Fig. 7A and Fig. 7B are a top view and a side view showing the action of step 5 of the exposure device. Fig. 8A and Fig. 8B are a top view and a side view showing the operation of step 6 of the exposure device. Fig. 9A and Fig. 9B are a top view and a side view showing the operation of step 7 of the exposure device. Fig. 10A and Fig. 10B are a top view and a side view showing the operation of step 8 of the exposure device.

1:供給側基板捲筒 1: Supply side substrate roll

2:基板投入部Y移動機構 2: Substrate input part Y moving mechanism

3,12:基板緩衝器 3,12: Substrate buffer

4:曝光載台 4: Exposure stage

5:曝光載台XY移動機構 5: Exposure stage XY moving mechanism

6:對準相機 6: Aim the camera

7:曝光單元 7: Exposure unit

8:PEB單元 8:PEB unit

8’:後退位置 8’: Backward position

8H:上部單元 8H: Upper unit

8S:下部單元 8S: Lower unit

9:PEB單元XY移動機構 9: PEB unit XY moving mechanism

10:基板捲繞部Y移動機構 10: Y moving mechanism of substrate winding part

11:捲繞側基板捲筒 11: Winding side substrate reel

13:供給側制動輥 13: Supply side brake roller

14:捲繞側制動輥 14: Winding side brake roller

W:長條基板/撓性基板 W: Strip substrate/flexible substrate

Claims (6)

一種曝光裝置,係為曝光長條基板的曝光裝置,包括捲對捲型的搬送部,其中:在曝光單元與基板捲繞部之間設置加熱前述長條基板的加熱裝置,前述加熱裝置隨著前述長條基板的移動而移動以加熱前述長條基板。 An exposure device is an exposure device for exposing a long strip substrate, comprising a roll-to-roll conveying section, wherein: a heating device for heating the long strip substrate is provided between the exposure unit and the substrate winding section, and the heating device moves with the movement of the long strip substrate to heat the long strip substrate. 如請求項1所述的曝光裝置,其中在前述加熱裝置加熱前述長條基板時,曝光載台與前述加熱裝置以保持相對位置的方式移動。 An exposure device as described in claim 1, wherein when the heating device heats the long substrate, the exposure stage and the heating device move in a manner maintaining relative positions. 如請求項1或請求項2所述的曝光裝置,其中前述曝光載台的移動部與前述加熱裝置的移動部是共通的。 An exposure device as described in claim 1 or claim 2, wherein the moving part of the exposure stage and the moving part of the heating device are common. 如請求項1所述的曝光裝置,其中前述曝光載台的移動部與前述加熱裝置的移動部是個別的,並且前述移動部是同步的。 An exposure device as described in claim 1, wherein the moving part of the exposure stage and the moving part of the heating device are separate, and the moving parts are synchronized. 如請求項1所述的曝光裝置,其中前述加熱裝置可往與前述長條基板的搬送方向不同的方向後退。 An exposure device as described in claim 1, wherein the heating device can retreat in a direction different from the conveying direction of the long substrate. 如請求項5所述的曝光裝置,其中在前述加熱裝置未加熱前述長條基板時,前述加熱裝置位於從前述長條基板後退的位置以保持餘熱。 An exposure device as described in claim 5, wherein when the heating device does not heat the long substrate, the heating device is located at a position retreated from the long substrate to maintain residual heat.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003209038A (en) * 2002-01-11 2003-07-25 Sanken Electric Co Ltd Semiconductor wafer processing equipment
TW202026775A (en) * 2012-09-14 2020-07-16 日商尼康股份有限公司 Substrate processing device and device manufacturing method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0136534B1 (en) 1983-09-06 1990-06-13 Energy Conversion Devices, Inc. Method of forming a large surface area integrated circuit
JP5494124B2 (en) * 2010-03-30 2014-05-14 大日本印刷株式会社 Pattern forming method, color filter manufacturing method, and pattern forming apparatus
WO2012147658A1 (en) * 2011-04-25 2012-11-01 株式会社ニコン Substrate processing device
KR102219169B1 (en) * 2013-07-08 2021-02-23 가부시키가이샤 니콘 Substrate processing apparatus, device manufacturing system, device manufacturing method, and pattern formation apparatus
JP5631464B1 (en) * 2013-08-30 2014-11-26 株式会社 ベアック Exposure equipment
JP6510768B2 (en) 2014-05-23 2019-05-08 株式会社オーク製作所 Exposure device
JP6554330B2 (en) * 2015-06-01 2019-07-31 株式会社オーク製作所 Maskless exposure apparatus and exposure method
EP3358611B1 (en) * 2015-09-29 2020-08-26 Nikon Corporation Production system
JP6773435B2 (en) * 2016-03-31 2020-10-21 株式会社オーク製作所 Exposure device
JP6837352B2 (en) * 2017-02-28 2021-03-03 芝浦機械株式会社 Transfer device and transfer method
JP7175149B2 (en) * 2018-09-27 2022-11-18 株式会社オーク製作所 Exposure device and exposure method
JP6658938B2 (en) * 2019-03-12 2020-03-04 株式会社ニコン Substrate processing equipment
JP7446687B2 (en) * 2020-07-22 2024-03-11 株式会社オーク製作所 direct exposure equipment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003209038A (en) * 2002-01-11 2003-07-25 Sanken Electric Co Ltd Semiconductor wafer processing equipment
TW202026775A (en) * 2012-09-14 2020-07-16 日商尼康股份有限公司 Substrate processing device and device manufacturing method

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