TWI741215B - Exposure device - Google Patents
Exposure device Download PDFInfo
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- TWI741215B TWI741215B TW107132014A TW107132014A TWI741215B TW I741215 B TWI741215 B TW I741215B TW 107132014 A TW107132014 A TW 107132014A TW 107132014 A TW107132014 A TW 107132014A TW I741215 B TWI741215 B TW I741215B
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- substrate
- exposure
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- 239000000758 substrate Substances 0.000 claims abstract description 225
- 238000004804 winding Methods 0.000 claims abstract description 87
- 230000007246 mechanism Effects 0.000 claims abstract description 38
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 17
- 241000270295 Serpentes Species 0.000 abstract description 3
- 230000032258 transport Effects 0.000 description 25
- 238000010586 diagram Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H20/00—Advancing webs
- B65H20/02—Advancing webs by friction roller
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Winding Of Webs (AREA)
Abstract
[課題] 在包括RtoR搬運系統(Roll to Roll carrier)之曝光裝置,一面抑制長條基板之蛇行一面進行曝光。 [解決手段] 在包括搬運長條基板W1、W2之RtoR搬運系統的曝光裝置10,設置:基板供給裝置20,係固持被設置於曝光工作台15之上游側的供給捲盤22A、22B;及基板捲繞裝置30,係固持被設置於下游側的捲繞捲盤32A、32B。在曝光動作時,曝光工作台15係藉工作台移動機構50在X方向移動,同時基板供給裝置20及基板捲繞裝置30藉搬運部移動機構60向X方向一起移動。[Problem] In the exposure device including the RtoR transport system (Roll to Roll carrier), exposure is performed while suppressing the snake of the long substrate. [Solution] In the exposure apparatus 10 including the RtoR transport system for transporting the long substrates W1 and W2, a substrate supply device 20 is provided to fasten the supply reels 22A and 22B installed on the upstream side of the exposure table 15; and The substrate winding device 30 fastens and holds the winding reels 32A and 32B provided on the downstream side. During the exposure operation, the exposure table 15 is moved in the X direction by the table moving mechanism 50, while the substrate supply device 20 and the substrate winding device 30 are moved together in the X direction by the conveying unit moving mechanism 60.
Description
本發明係有關於一種曝光裝置,該曝光裝置係藉輥對輥搬運系統(Roll to Roll carrier,以下稱為RtoR搬運系統)搬運軟性印刷基板等之長條基板(工件)。The present invention relates to an exposure device that transports long substrates (workpieces) such as flexible printed circuit boards by means of a roll to roll carrier (Roll to Roll carrier, hereinafter referred to as RtoR transport system).
在包括RtoR搬運系統之曝光裝置,分別在曝光工作台之上游側配置供給捲盤(供給捲筒),並在下游側配置捲繞捲盤(捲繞捲筒),在將印刷配線基板等之長條基板捲繞於供給捲盤、捲繞捲盤後,一面向上游側~下游側搬運一面進行曝光。In the exposure device including the RtoR transport system, the supply reel (supply reel) is arranged on the upstream side of the exposure table, and the winding reel (winding reel) is arranged on the downstream side. After the long substrate is wound on the supply reel and the winding reel, it is exposed while being conveyed from the upstream side to the downstream side.
具體而言,一面使吸附並支撐長條基板之背面的曝光工作台沿著長條基板搬運方向移動,一面藉設置於長條基板之上方的曝光頭投影與投影區域(曝光對象區域)之位置對應的圖案光。曝光工作台移動至曝光結束位置時,曝光工作台下降,向最初之曝光位置回位。藉由重複地進行相同的曝光動作,對長條基板整體形成圖案。 [先行專利文獻] [專利文獻]Specifically, the exposure table that sucks and supports the back of the long substrate is moved along the transport direction of the long substrate, and the position of the projection and projection area (exposure target area) by the exposure head set above the long substrate Corresponding pattern light. When the exposure table moves to the end of the exposure position, the exposure table goes down and returns to the initial exposure position. By repeatedly performing the same exposure operation, a pattern is formed on the entire long substrate. [Prior Patent Document] [Patent Document]
[專利文獻1]日本特開2015-222370號公報[Patent Document 1] Japanese Patent Application Publication No. 2015-222370
[發明所欲解決之課題][The problem to be solved by the invention]
以往之RtoR搬運系統係被固定於曝光裝置之基座(框體)。因此,長條基板係在曝光開始時從供給捲盤間歇地被拉出,並向下游側被送出。又,在曝光結束後伴隨曝光工作台向上游側回位,有發生長條基板之向上游側之倒捲的情況。由於這種基板之移動,而在長條基板發生蛇行,又發生曝光位置偏差、或長條基板之翹曲、皺紋或擦傷等的損害。尤其,在使複數條長條基板並行並同時進行曝光的情況,蛇行調整變成困難。The conventional RtoR transport system is fixed to the base (frame) of the exposure device. Therefore, the long substrate is intermittently drawn out from the supply reel at the start of exposure, and sent to the downstream side. In addition, when the exposure table is returned to the upstream side after the exposure is completed, the long substrate may be rolled up to the upstream side. Due to the movement of the substrate, snakes occur on the long substrate, and damages such as deviation of the exposure position, or warpage, wrinkles or scratches of the long substrate occur. In particular, when a plurality of long substrates are exposed in parallel and simultaneously, the meandering adjustment becomes difficult.
因此,要求構成可確實地抑制長條基板之蛇行的基板搬運系統。 [解決課題之手段]Therefore, it is required to construct a substrate transport system that can reliably suppress the snaking of long substrates. [Means to solve the problem]
本發明之曝光裝置係包括:曝光工作台,係支撐長條基板,並可沿著基板搬運線路進行往復移動;基板供給部,係被配置於曝光工作台的上游側,並設置供給捲盤;以及基板捲繞部,係被配置於曝光工作台的下游側,並設置捲繞捲盤。此處之「上游側」係支援曝光工作台之供給捲盤側,「下游側」係表示捲繞捲盤側。The exposure device of the present invention includes: an exposure workbench that supports a long substrate and can reciprocate along the substrate conveying line; the substrate supply part is arranged on the upstream side of the exposure workbench and is provided with a supply reel; And the substrate winding part is arranged on the downstream side of the exposure table, and a winding reel is provided. Here, "upstream side" refers to the supply reel side of the supporting exposure table, and "downstream side" refers to the winding reel side.
例如,可構成為基板供給部係包括上游側支撐輥,基板捲繞部設置下游側支撐輥。又,亦可由並列之複數條長條基板構成長條基板。曝光工作台係只要構成為例如一面吸附並固持長條基板一面移動,且可升降即可。For example, it may be configured that the substrate supply unit includes an upstream support roller, and the substrate winding unit is provided with a downstream support roller. In addition, a long substrate may be constituted by a plurality of parallel long substrates. The exposure table may be configured such that, for example, it can move while adsorbing and holding a long substrate, and can be raised and lowered.
在本發明,基板供給部與基板捲繞部係可沿著基板搬運線路移動。此處之「基板搬運線路」係表示基板之被送出的方向或其反方向,並對應於曝光工作台之移動方向。只要作成在曝光動作時,基板供給部與基板捲繞部配合曝光工作台之移動而移動即可。In the present invention, the substrate supply part and the substrate winding part are movable along the substrate conveying line. The "substrate conveying line" here means the direction in which the substrate is sent out or the opposite direction, and corresponds to the moving direction of the exposure table. As long as it is made that the substrate supply part and the substrate winding part move in accordance with the movement of the exposure table during the exposure operation.
作為曝光裝置,係可設置:工作台移動機構,係使曝光工作台沿著基板搬運線路進行往復移動;及搬運部移動機構,係使基板供給部與基板捲繞部沿著基板搬運線路進行往復移動。搬運部移動機構係例如可藉一台移動機構使基板供給部與基板捲繞部連動,即,成一體地移動。As the exposure device, it can be set up: a table moving mechanism, which makes the exposure table reciprocate along the substrate conveying line; and a conveying part moving mechanism, which makes the substrate supply part and the substrate winding part reciprocate along the substrate conveying line move. The conveyance part moving mechanism may be, for example, a moving mechanism that can link the substrate supply part and the substrate winding part, that is, move integrally.
亦可設置移動控制部,該移動控制部係以維持曝光工作台與基板供給部及基板捲繞部之相對之位置關係的方式控制基板供給部與基板捲繞部的移動。例如,設置感測器,該感測器係偵測基板供給部與基板捲繞部之至少一方和曝光工作台的距離間隔,移動控制部因應於所檢測出之距離間隔,控制曝光工作台與基板供給部及基板捲繞部的移動即可。It is also possible to provide a movement control part which controls the movement of the substrate supply part and the substrate winding part in such a way as to maintain the relative positional relationship between the exposure table, the substrate supply part and the substrate winding part. For example, a sensor is provided which detects the distance between at least one of the substrate supply part and the substrate winding part and the exposure table, and the movement control part controls the exposure table and the exposure table in response to the detected distance. The movement of the substrate supply part and the substrate winding part is sufficient.
本發明之其他的形態的曝光裝置係包括:曝光工作台,係支撐並列之複數條長條基板,並可沿著基板搬運線路進行往復移動;及複數對捲盤對,係分別相對向地被配置於曝光工作台之兩側,並搬運複數條長條基板;複數對捲盤對係與曝光工作台一起可沿著基板搬運線路進行往復移動。The exposure apparatus of other forms of the present invention includes: an exposure workbench, which supports a plurality of long substrates arranged side by side, and can reciprocate along the substrate conveying line; and a plurality of pairs of reels, which are respectively oppositely covered It is arranged on both sides of the exposure workbench and transports a plurality of long substrates; the multiple pairs of reels and the exposure workbench can reciprocate along the substrate transport line.
亦可複數對捲盤對在同一方向捲繞複數條長條基板,又,亦可構成為複數對捲盤對中至少一對捲盤對在與其他的長條基板相異的方向捲繞。A plurality of pairs of reels may be wound in the same direction with a plurality of long substrates, and at least one of the plurality of pairs of reels may be configured to be wound in a direction different from other long substrates.
本發明之其他的形態的曝光裝置係包括:曝光工作台,係支撐長條基板;一對捲盤,係分別被配置於曝光工作台之上游側與下游側;以及曝光部,係對長條基板進行曝光;曝光部係對曝光工作台及一對捲盤,可沿著基板搬運線路相對地移動。 [發明之效果]The exposure apparatus of another form of the present invention includes: an exposure worktable which supports a long substrate; a pair of reels which are respectively arranged on the upstream and downstream sides of the exposure worktable; and an exposure section which is a pair of long substrates. The substrate is exposed; the exposure part is a pair of exposure workbench and a pair of reels, which can move relatively along the substrate conveying line. [Effects of Invention]
若依據本發明,在包括RtoR搬運系統之曝光裝置,可一面抑制長條基板之蛇行一面進行曝光。According to the present invention, the exposure device including the RtoR transport system can perform exposure while restraining the snake from the long substrate.
在以下,參照圖面,說明本發明之實施形態。Hereinafter, the embodiments of the present invention will be described with reference to the drawings.
圖1係本實施形態之曝光裝置之示意的構成圖。圖2係在模式上表示曝光裝置之一部分的立體圖。圖3係曝光裝置之示意的方塊圖。Fig. 1 is a schematic configuration diagram of the exposure apparatus of this embodiment. Fig. 2 is a perspective view schematically showing a part of the exposure device. Fig. 3 is a schematic block diagram of the exposure apparatus.
曝光裝置10係包括一面搬運被捲繞成滾筒狀之長條基板W一面進行曝光動作之RtoR搬運系統的曝光裝置,並包括基板供給裝置20、基板捲繞裝置30、以及曝光部40。長條基板W係在此處是捲繞在對長條薄膜已形成銅薄膜層後塗佈(或黏貼)了光阻劑等的感光材料之長條薄膜狀的基板,而形成滾筒狀。如圖2所示,長條基板W係由寬度相同之2條(一對)基板W1、W2所構成。The
曝光工作台(工作台)15係吸附長條基板W之背面並平坦地固持,且在背面吸附位置及與背面分開的既定分開位置之間可在Z方向升降,並藉未圖示之升降機構升降。曝光工作台15係如後述所示,由工作台移動機構50所支撐,並可沿著X方向移動。此外,在以下,以“X”表示沿著長條基板W之搬運方向(搬運線路)M的方向,以“Y”表示對搬運方向M垂直的方向(基板寬度方向),而且,以“Z”表示對X、Y垂直的方向(鉛垂方向)。The exposure workbench (workbench) 15 sucks the back of the long substrate W and holds it flatly, and can be raised and lowered in the Z direction between the suction position on the back and a predetermined separation position separated from the back, and a lifting mechanism not shown in the figure Lift. The exposure table 15 is supported by the
曝光部40係被配置於從長條基板W1、W2在Z方向相距既定距離的位置,並經由未圖示之機架被固定於基座10B。如圖3所示,曝光部40係由複數個曝光頭所構成,該複數個曝光頭係各自包括半導體雷射光等之光源41、照明光學系統42、使複數個微反射鏡進行陣列排列之DMD(Digital Micro-mirror Device)43以及成像光學系統44等,對各曝光頭,規定沿著搬運方向M的曝光區域。光源41係藉光源控制部110所驅動。The
各曝光頭之DMD係根據與從曝光控制部120所傳來之曝光區域位置對應的繪圖資料(光域資料),將微反射鏡之姿勢定位,藉此,將圖案光投影至長條基板W1、W2。藉由因應於對曝光部40之長條基板W1、W2的相對移動來切換微反射鏡之姿勢,對長條基板W1、W2之感光材料進行曝光(多重曝光等),藉此,形成圖案。控制器100(參照圖3)係控制曝光裝置10之曝光動作整體。此外,亦可藉使用遮罩之曝光部構成。The DMD of each exposure head locates the posture of the micro-mirror according to the drawing data (light field data) corresponding to the position of the exposure area transmitted from the
基板供給裝置20係包括:供給捲盤22A、22B,係被配置於曝光工作台15的上游側;支撐輥24;以及驅動機構(未圖示),係分別使供給捲盤22A、22B進行軸轉動。驅動機構係由例如步進馬達等所構成。藉基板供給裝置20所懸臂支撐的供給捲盤22A、22B係分別以捲繞成滾筒狀之狀態保持並固定長條基板W1、W2的未曝光部分,又,藉由進行軸轉動,可向下游側送出長條基板W。此外,從曝光工作台15觀察,將供給捲盤22A、22B側當作“上游側”,並將捲繞捲盤32A、32B側當作“下游側”。The
基板捲繞裝置30係包括:捲繞捲盤32A、32B,係被配置於曝光工作台15的下游側;支撐輥34;以及驅動機構(未圖示),係分別使捲繞捲盤32A、32B進行軸轉動。捲繞捲盤32A、32B係分別在捲繞成滾筒狀之狀態保持並固定長條基板W1、W2的已曝光部分,又,藉由進行軸轉動,可捲繞長條基板W1、W2。藉基板供給裝置20、基板捲繞裝置30之長條基板W1、W2的捲繞處理等係由搬運控制部130(參照圖3)所控制。The
在供給捲盤22A、22B、捲繞捲盤32A、32B與曝光工作台15之間分別配置的支撐輥24、34係支撐長條基板W1、W2,並構成為在搬運長條基板W1、W2時進行軸轉動的張力調節輥。支撐輥24、34係以長條基板W1、W2在曝光面高度或比曝光面高度稍低之位置向下游側移動的方式調整其高度,並分別由基板供給裝置20、基板捲繞裝置30所懸臂支撐。在長條基板W1、W2,適當之張力作用於支撐輥24、34之區間T(參照圖1)的架設部分,長條基板W1、W2係在無皺紋或伸長之狀態被搬運下去。The
供給捲盤22A、22B及捲繞捲盤32A、32B係包括在安裝基板時固定長條基板W1、W2之滾筒狀的捲繞部分之周知的機構26A、26B及36A、36B。又,基板供給裝置20、基板捲繞裝置30之各個的驅動機構係分別使供給捲盤22A與捲繞捲盤32A、供給捲盤22B與捲繞捲盤32B進行同步轉動,而對長條基板W1、W2間歇地只搬運既定長度。The
工作台移動機構50係包括:移動構件52,係配備對曝光工作台15懸臂支撐的升降機構(未圖示);及一對導軌54A、54B與致動器55,係被設置於基座10B。一對導軌54A、54B係沿著X方向延伸,移動構件52係可沿著導軌54A、54B在X方向及其反方向移動。致動器55係由例如滾珠螺桿所構成。The
搬運部移動機構60係包括板狀之移動構件62、及被設置於基座10B之一對導軌64A、64B與致動器65。基板供給裝置20與基板捲繞裝置30係被搭載於移動構件62之上,並成一體地移動(連動)。一對導軌64A、64B係沿著X方向延伸,移動構件62係可沿著導軌64A、64B在X方向及其反方向移動。The transport
在基座10B所設置之移動控制部70係控制致動器55、65之驅動,而維持搬運系統(基板供給裝置20及基板捲繞裝置30)與曝光工作台15之相對的位置關係。即,以相對之距離間隔成為定值的方式對曝光工作台15與基板供給裝置20、基板捲繞裝置30之移動進行回授控制。The
為了測量曝光工作台15與基板供給裝置20(基板捲繞裝置30)之沿著搬運方向M之相對的距離間隔,將位置檢測用光感測器90配置於基板供給裝置20之與曝光工作台15相對向的側面(參照圖2)。位置檢測用光感測器90係內建LED等的光源,並照射曝光工作台15的側面。曝光工作台15的側面係以在光的照射位置位於基準位置與基準位置以外的位置之間發生光量差的方式所形成。移動控制部70係根據因應於檢測光量之相對的距離間隔與成為基準之相對的距離間隔之差,控制致動器55、65。
In order to measure the relative distance between the exposure table 15 and the substrate supply device 20 (substrate winding device 30) along the conveying direction M, a position
在曝光工作台15的支撐輥24側,設置檢測出長條基板W1、W2各自之端面位置的位置感測器80。位置感測器80係可由例如線感測器等之透過式光感測器所構成。基板供給裝置20與基板捲繞裝置30係分別包括控制供給捲盤22A、22B與捲繞捲盤32A、32B之軸向位置的機構(未圖示),並因應於所檢測出之端面位置,調整捲盤軸向位置,而可修正蛇行行駛。
On the
圖4係表示曝光開始時與曝光結束時之曝光工作台及搬運系統之位置的圖。 Fig. 4 is a diagram showing the positions of the exposure table and the conveying system at the beginning and the end of exposure.
曝光開始前,曝光工作台15係吸附並固持長條基板W1、W2,供給捲盤22A、22B與捲繞捲盤32A、32B係因為未被驅動,所以成為靜止狀態。伴隨曝光開始,曝光工作台15係沿著X方向以既定速度逐漸移動。在此時,基板供給裝置20及基板捲繞裝置30係配合曝光工作台15的移動而移動。
Before the exposure starts, the exposure table 15 sucks and holds the long substrates W1 and W2, and the
即,與曝光工作台15同步地開始移動,並以保持基板供給裝置20及基板捲繞裝置30與曝光工作台15之相對的位置關係的方式以與曝光工作台15相同的速度在X方向逐漸移動(並行)。因此,長條基板W1、W2係在曝光工作台15的移動前與曝光工作台15的移動中之間,向下游側未被送出,而對曝光工作台15靜止。在曝光工作台15的移動中,從曝光部40將與各曝光頭之曝光區域位置對應的圖案光投影。
That is, it starts to move in synchronization with the exposure table 15, and gradually moves in the X direction at the same speed as the exposure table 15 while maintaining the relative positional relationship between the
曝光工作台15與基板供給裝置20以及基板捲繞裝置30到達曝光結束位置時,曝光工作台15係解除長條基板W1、W2的吸附支撐,並下降。然後,供給捲盤22A、22B及捲繞捲盤32A、32B同步地轉動,而長條基板W1、W2係僅既定長度被捲繞於捲繞捲盤32A、32B。
When the exposure table 15 and the
對捲繞捲盤32A、32B側之捲繞結束時,曝光工作台15與基板供給裝置20以及基板捲繞裝置30同步地移動,而向曝光開始位置回位。在此期間,供給捲盤22A、22B與捲繞捲盤32A、32B係因為未被驅動,所以成為靜止狀態。藉由重複上述之曝光動作,對長條基板W1、W2整體逐漸地形成圖案。When the winding on the winding
依此方式,若依據本實施形態,在包括搬運長條基板W1、W2之RtoR搬運系統的曝光裝置10,設置:基板供給裝置20,係固持在曝光工作台15之上游側所設置的供給捲盤22A、22B;及基板捲繞裝置30,係固持在下游側所設置的捲繞捲盤32A、32B。在曝光動作時,曝光工作台15係藉工作台移動機構50在X方向移動,同時,基板供給裝置20及基板捲繞裝置30藉搬運部移動機構60向X方向一起移動。In this way, according to the present embodiment, in the
因為基板搬運系統(基板供給裝置20、基板捲繞裝置30)與曝光工作台15一起移動,所以在曝光工作台15之移動開始前及移動中不會向下游側送出長條基板W1、W2。因此,抑制如以往的搬運系統之曝光中的蛇行行駛,而由蛇行行駛所引起之曝光位置偏差、或基板之皺紋的產生、翹曲等不會發生。又,藉由構成這種基板搬運系統,不必設置張力輥等之機構,所以能以簡單的構成構築基板搬運系統。Since the substrate transport system (the
基板供給裝置20與基板捲繞裝置30係在曝光中僅在下游側之一方向送出長條基板W即可,不必倒捲。因此,可實現抑制了長條基板W之蛇行的圖案曝光。尤其,對搬運難調整蛇行之2條長條基板W的曝光裝置係適合。The
因為基板搬運系統移動,所以可將基板搬運長度(供給捲盤22A、22B與捲繞捲盤32A、32B之間的基板長度)構成短。藉由基板搬運長度變短,長條基板W1、W2之皺紋、伸長等難發生,而可高精度地形成圖案。尤其,可構成只是設置一支支撐輥24、34就可送出長條基板W1、W2的搬運系統。Since the substrate transfer system moves, the substrate transfer length (the substrate length between the
又,在曝光動作結束後,因為在曝光工作台15未吸附並支撐長條基板W1、W2之間向下游側送出並捲繞長條基板W1、W2,所以可圓滑地捲繞。在此時,因為基板搬運長度短,所以可實現在短時間的捲繞。In addition, after the exposure operation is completed, the long substrates W1 and W2 are fed and wound on the downstream side between the long substrates W1 and W2 that are not sucked and supported by the exposure table 15, so that the long substrates W1 and W2 can be wound smoothly. At this time, because the substrate transport length is short, winding in a short time can be achieved.
在本實施形態,曝光工作台15與基板搬運系統(基板供給裝置20、基板捲繞裝置30)係各自藉工作台移動機構50、搬運部移動機構60分別地驅動。就長條基板W1、W2而言,供給捲盤22A、22B之滾筒狀部分、捲繞捲盤32A、32B之滾筒狀部分的捲繞直徑係在長條基板W1、W2逐漸地被捲繞於基板捲繞裝置30的過程逐漸地變化,而重量平衡成為不固定。
In this embodiment, the exposure table 15 and the substrate transport system (the
可是,藉由設置與工作台移動機構50係相異的搬運部移動機構60,即使長條基板W1、W2之重量平衡有變化,亦防止對曝光工作台15之移動控制有影響。又,可在直接利用以往的工作台移動機構下構築搬運系統。
However, by providing the conveying
另一方面,基板供給裝置20與基板捲繞裝置30係一樣地被移動構件62所固定、支撐,並成一體地移動。因為基板供給裝置20與基板捲繞裝置30連動,所以在基板供給裝置20與基板捲繞裝置30之間在相對的位置關係不會發生變化,而維持與曝光工作台15之相對的位置關係成為容易。又,能以一個驅動系統集中搬運部移動機構60。
On the other hand, the
另一方面,移動控制部70以在曝光工作台15的移動中,保持曝光工作台15與基板供給裝置20及基板捲繞裝置30之相對的位置關係的方式對致動器55、65進行驅動控制。藉此,抑制因供給捲盤22A、22B、捲繞捲盤32A、32B接近曝光工作台15而發生長條基板W1、W2之伸長、翹曲等,又可防止曝光位置偏差。
On the other hand, the
此外,亦可作成移動控制部70係在距離間隔成為臨限值以上時控制移動速度、加速度。或者,亦可對供給捲盤22A、22B及/或捲繞捲盤32A、32B進行軸轉動控制,調整成適當的張力作用於長條基板W1、W2。
In addition, the
亦可不僅2條長條基板W1、W2,而且使更多之複數條長條基板並列並同時搬運,又,亦可以一條長條基板構成。關於基板供給裝置20與基板捲繞裝置30,係亦可作成在機械上不令連結,而以不同的移動機構令移動。又,亦可作成以相同的移動機構使曝光工作台15與基板供給裝置20、基板捲繞裝置30移動。Not only two long substrates W1 and W2, but also more long substrates can be arranged side by side and conveyed at the same time, and it can also be constituted by a single long substrate. Regarding the
在以上之實施形態,係將基板供給裝置20設置於曝光工作台15的上游側,將基板捲繞裝置30設置於曝光工作台15的下游側,並將供給捲盤22A、22B與捲繞捲盤32A、32B驅動成使長條基板W1、W2在同方向移動,但是亦可作成長條基板W1與W2彼此在反方向移動。In the above embodiment, the
即,可在曝光工作台15的兩側設置2對捲盤,將供給捲盤、捲繞捲盤設置成朝向X方向捲繞一方之捲盤對,另一方面,將供給捲盤、捲繞捲盤設置成朝向-X方向捲繞另一方之捲盤對。在此情況,使組合了基板供給裝置與基板捲繞裝置之功能的一對搬運裝置對曝光工作台移動。依此方式構成為長條基板W1與W2彼此在反方向移動時,可減輕在曝光工作台之上游側與下游側的長條基板之重量平衡的變化。That is, two pairs of reels can be installed on both sides of the exposure table 15, and the supply reel and the winding reel can be set to wind one of the reel pairs in the X direction. On the other hand, the supply reel and the winding The reel is set to wind the other reel pair in the -X direction. In this case, a pair of conveying devices that combine the functions of a substrate supply device and a substrate winding device are moved to the exposure table. In this way, when the long substrates W1 and W2 move in opposite directions to each other, the change in the weight balance of the long substrates on the upstream side and the downstream side of the exposure table can be reduced.
又,在以上之實施形態,係藉由曝光工作台15移動,實現長條基板W1、W2與曝光部40之相對移動而進行曝光,但是亦可作成將曝光工作台15固定於基座10B,曝光部40藉未圖示之移動裝置在基板搬運方向移動,藉此,進行相對移動。在此情況,以維持與曝光工作台15之相對之位置關係的方式將基板供給裝置20與基板捲繞裝置30固定於基座10B。Furthermore, in the above embodiment, the exposure table 15 is moved to realize the relative movement of the long substrates W1, W2 and the
10‧‧‧曝光裝置15‧‧‧曝光工作台20‧‧‧基板供給裝置22A、22B‧‧‧供給捲盤30‧‧‧基板捲繞裝置32A、32B‧‧‧捲繞捲盤40‧‧‧曝光部50‧‧‧工作台移動機構60‧‧‧搬運部移動機構70‧‧‧移動控制部80‧‧‧位置感測器90‧‧‧位置檢測用光感測器10‧‧‧
[圖1]係本實施形態之曝光裝置之示意的構成圖。 [圖2]係在模式上表示曝光裝置之一部分的立體圖。 [圖3]係曝光裝置之示意的方塊圖。 [圖4]係表示曝光開始時與曝光結束時之曝光工作台及搬運系統之位置的圖。[Fig. 1] is a schematic configuration diagram of the exposure apparatus of this embodiment. [Fig. 2] A perspective view schematically showing a part of the exposure device. [Fig. 3] A schematic block diagram of the exposure apparatus. [Figure 4] is a diagram showing the positions of the exposure table and the transport system at the start and end of exposure.
10‧‧‧曝光裝置 10‧‧‧Exposure device
10B‧‧‧基座 10B‧‧‧Base
15‧‧‧曝光工作台 15‧‧‧Exposure Workbench
20‧‧‧基板供給裝置 20‧‧‧Substrate supply device
22A、22B‧‧‧供給捲盤 22A、22B‧‧‧Supply reel
24‧‧‧支撐輥 24‧‧‧Support roller
30‧‧‧基板捲繞裝置 30‧‧‧Substrate winding device
32A、32B‧‧‧捲繞捲盤 32A、32B‧‧‧Winding reel
34‧‧‧支撐輥 34‧‧‧Support roller
40‧‧‧曝光部 40‧‧‧Exposure Department
50‧‧‧工作台移動機構 50‧‧‧Working table moving mechanism
54A、54B‧‧‧導軌 54A、54B‧‧‧Guide rail
55‧‧‧致動器 55‧‧‧Actuator
60‧‧‧搬運部移動機構 60‧‧‧Moving mechanism of transport department
62‧‧‧移動構件 62‧‧‧Mobile component
64A、64B‧‧‧導軌 64A、64B‧‧‧Guide
65‧‧‧致動器 65‧‧‧Actuator
90‧‧‧位置檢測用光感測器 90‧‧‧Light sensor for position detection
W、W1、W2‧‧‧長條基板 W, W1, W2‧‧‧Long substrate
M‧‧‧搬運方向 M‧‧‧Transporting direction
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| JP6510768B2 (en) * | 2014-05-23 | 2019-05-08 | 株式会社オーク製作所 | Exposure device |
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2017
- 2017-09-13 JP JP2017176123A patent/JP7041482B2/en active Active
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2018
- 2018-09-12 TW TW107132014A patent/TWI741215B/en active
- 2018-09-12 CN CN201811060520.6A patent/CN109491209A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW425496B (en) * | 1999-06-08 | 2001-03-11 | Ushio Electric Inc | Exposure device capable of aligning while moving mask |
| TW500981B (en) * | 2000-06-22 | 2002-09-01 | Ushio Electric Inc | Device for exposure of the peripheral area of a film circuit board |
| CN1680067A (en) * | 2004-04-08 | 2005-10-12 | 日立比亚机械股份有限公司 | Laser processing equipment for plate-shaped workpieces |
| TW200622511A (en) * | 2004-09-29 | 2006-07-01 | Fuji Photo Film Co Ltd | Image forming apparatus |
| TW201702758A (en) * | 2015-06-01 | 2017-01-16 | Orc Manufacturing Co Ltd | Maskless exposure device and exposure method capable of exposing a continuous elongated pattern precisely without producing disconnection or meandering of lines of a pattern on an elongated substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201921153A (en) | 2019-06-01 |
| CN109491209A (en) | 2019-03-19 |
| JP2019053140A (en) | 2019-04-04 |
| JP7041482B2 (en) | 2022-03-24 |
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