TWI880651B - Manufacturing method of copper foil substrate - Google Patents

Abstract

The present invention relates to a method for manufacturing a copper foil substrate, comprising: providing two copper foil sheets in a stacked state and providing an adhesive sheet between the two copper foil sheets, wherein the two copper foil sheets and the adhesive sheet form a base workpiece; placing and fixing at least one base workpiece in a pressing fixture comprising two clamping plates, wherein a tungsten disulfide coating is formed on the surface of the clamping plates; During the pressurization process of the pressing jig, the adhesive sheet contains colloid that overflows onto the surface of the clamping plate; the base workpiece is pressed and heated and baked, and after the base workpiece is finalized, the pressing jig is disassembled and taken out; the solidified residual glue on the clamping plate of the pressing jig is cleaned, and the cleaning procedure includes brushing with a nylon brush wheel, washing with water at room temperature, and blowing off water droplets at room temperature.

Description

Manufacturing method of copper foil substrate

The present invention provides a manufacturing method of a copper foil substrate, in particular, a clamping plate of a pressing fixture used in the production process of the copper foil substrate is spray-coated with a tungsten disulfide coating, which has anti-adhesion and easy-to-clean properties. Therefore, when cleaning the residual glue on the clamping plate, only a nylon brush wheel with a low cutting force is needed to brush away most of it. The small glue dots remaining can be removed by rinsing with water at room temperature, and the water drops remaining on the clamping plate can be dried by blowing with a blower at room temperature, so as to facilitate the repeated use of the clamping plate. The present invention reduces the operation of dissolving the colloid with a release liquid used in the prior art. In addition to having the advantages of environmental protection and reducing production costs, it is more conducive to the production of copper foil substrates with an automated process.

According to the rapid development of technology and information, various electronic products or equipment on the market are constantly being introduced. Printed circuit boards (PCBs) for electronic components are installed inside electronic products or equipment. Electronic components with different functions or effects are soldered to the electronic circuits formed by printed circuit boards, so that electronic products or equipment can operate normally. With the widespread use of circuit boards, related process equipment manufacturers have also invested more actively in research and development.

Generally, circuit boards can be divided into hard boards and soft boards according to their flexibility; they can be divided into single-sided boards, double-sided boards and multi-layer boards according to the number of manufacturing layers; if they are distinguished by material, they include paper-based copper foil substrates, composite substrates, glass fiber cloth copper foil substrates, soft or hard copper foil substrates, ceramic substrates, metal substrates, thermoplastic substrates, etc. In the manufacturing process of circuit boards, copper foil substrates (CCL) are an indispensable key basic material. They are made of insulating paper, glass fiber cloth or other fiber materials. The semi-cured adhesive sheet (PrePreg, also called adhesive sheet) obtained after resin impregnation is stacked with copper foil to form a laminated board under high temperature and high pressure. However, before processing, the adhesive sheet is rolled up in a continuous winding manner to form a material strip, and after processes such as slitting and slicing, the cut adhesive sheets can be stacked together and heated to a certain range, and then pressed and cured to form a substrate of the required thickness. The substrate is copper-coated on one or both sides and then pressed and cured to form a copper foil substrate.

The pressing plate of the above-mentioned pressing fixture for processing copper foil substrates is usually made of stainless steel. During the pressing process, the glue inside the semi-cured adhesive sheet overflows from the copper foil machine base and remains on the pressing plate. The remaining solidified glue on the pressing plate will contaminate the product and is not conducive to repeated use. Therefore, the pressing plate must be cleaned. The standard operation for cleaning the residual glue is: (1) using a high-cutting force brush wheel to brush off; (2) using high-temperature hot water for rinsing; (3) using a release fluid to dissolve the glue; (4) using high-temperature hot air to solidify the release fluid remaining on the pressing plate. However, the aforementioned brush grinding wheel causes great damage to the press plate and reduces its service life, and heating water to a high temperature consumes a lot of energy. Furthermore, the release fluid is a consumable material, which not only increases production costs but is also not environmentally friendly. The blower that provides high-temperature hot air consumes a lot of electricity and increases production costs. The above-mentioned shortcomings need to be studied and resolved by those in this industry.

Therefore, in view of the above problems, the inventor collected relevant information and designed a manufacturing method for this copper foil substrate after multiple evaluations and considerations.

The main purpose of the present invention is to provide a method for manufacturing a copper foil substrate, comprising: providing two copper foil sheets in a stacked state and providing an adhesive sheet between the two copper foil sheets, and the two copper foil sheets and the adhesive sheet form a base workpiece; placing at least one base workpiece in a pressing fixture including two clamping plates, and the surfaces of the clamping plates are formed with tungsten disulfide-plated The press jig forms a film, and during the pressurization process of the press jig, the colloid-rich adhesive sheet overflows onto the surface of the clamping plate; the base workpiece is pressed and heated and baked, and after the base workpiece is finalized, the press jig is disassembled and taken out; the solidified residual glue on the clamping plate of the press jig is cleaned, and the cleaning procedure includes brushing with a nylon brush wheel, washing with water at room temperature, and blowing off water droplets at room temperature. The clamping plate of the aforementioned pressing fixture is spray-coated with a tungsten disulfide film, which has anti-adhesion and easy-to-clean properties. Therefore, when cleaning the residual glue on the clamping plate, only a nylon brush wheel with low cutting force is needed to brush away most of it. The small glue spots left can be removed by rinsing with room temperature water, and the water droplets left on the clamping plate can be dried by blowing with a blower at room temperature, which is conducive to the repeated use of the clamping plate. The present invention reduces the process of dissolving the colloid with a release liquid as used in the prior art. In addition to having the advantages of environmental protection and reducing production costs, it is also conducive to the production of copper foil substrates with an automated process.

A secondary object of the present invention is that the clip is made of mirror-finished stainless steel material.

Another object of the present invention is that the adhesive sheet is made of insulating paper or glass fiber cloth impregnated with resin.

Another purpose of the present invention is that the base workpiece can be placed in the pressing fixture with at least one added layer workpiece for pressing and heating and baking. The added layer workpiece includes an adhesive sheet attached to the copper foil on any side of the base workpiece, and a copper foil attached to the other side of the adhesive sheet.

1: Basic processing parts

11: Copper foil

12: Adhesive sheet

2: Pressing fixture

21: Clamp

22: Tungsten disulfide coating

3: Add layers to processed parts

31: Adhesive sheet

32: Copper foil

A1: Provide two copper foils in a stacked state and an adhesive sheet between the two copper foils, and the two copper foils and the adhesive sheet form at least one base processing part

A2: The at least one base workpiece is placed and fixed in a pressing fixture comprising two clamping plates, and a tungsten disulfide coating is formed on the surface of at least one of the two clamping plates. During the pressurization process of the pressing fixture, the colloid-rich adhesive sheet overflows onto the surface of at least one of the two clamping plates.

A3: Press and heat the at least one basic workpiece, and after the at least one basic workpiece is finalized, disassemble the pressing jig and take it out.

A4: Clean the solidified residual glue on at least one of the two clamping plates of the pressing fixture. The cleaning process includes brushing with a nylon brush, washing with water at room temperature, and blowing off water droplets at room temperature.

[Figure 1] is a three-dimensional exploded view of the copper foil substrate placed in the pressing fixture of the present invention before pressing.

[Figure 2] is a side cross-sectional view of the present invention after the copper foil substrate is placed in the pressing fixture for pressing.

[Figure 3] is another three-dimensional exploded view of the copper foil substrate placed in the pressing fixture of the present invention before pressing.

[Figure 4] is another side cross-sectional view of the present invention after the copper foil substrate is placed in the pressing fixture for pressing.

[Figure 5] is a three-dimensional schematic diagram showing that the surface of the clamping plate of the press-fitting fixture of the present invention is plated.

[Figure 6] is a flow chart of the manufacturing method of the copper foil substrate of the present invention.

In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the present invention are described in detail in the following figure for the preferred embodiment of the present invention to facilitate a complete understanding.

As shown in Figures 1, 2, and 5, they are respectively a three-dimensional exploded view of the present invention before the copper foil substrate is placed in the pressing jig for pressing, a side cross-sectional view after pressing, and a three-dimensional schematic view of the clamping plate surface of the pressing jig being plated. It can be clearly seen from the figure that the first implementation structure of the present invention for manufacturing a copper foil substrate (CCL) includes: a base processing part 1 and a pressing jig 2, and its features are described in detail as follows: The base processing part 1 includes two copper foil sheets 11 (Copper) in a stacked state and an adhesive sheet 12 (PrePreg, PP) is provided between the two copper foil sheets 11.

The pressing fixture 2 includes two clamping plates 21 in which at least one base workpiece 1 is placed and fixed. A tungsten disulfide (WS ₂ ) coating 22 is formed on the surface of the clamping plates 21 .

As shown in Figures 3 and 4, they are another three-dimensional exploded view of the copper foil substrate placed in the pressing fixture of the present invention before pressing and another side cross-sectional view after pressing. It can be clearly seen from the figures that the second implementation structure of the present invention for manufacturing the copper foil substrate includes: a base processing piece 1, a pressing fixture 2 and a layer-added processing piece 3, and the difference between this embodiment and the first implementation structure is only in the second pressing fixture 2. In addition to placing the base workpiece 1 in the clamping plate 21, at least one additional layer workpiece 3 is provided above or below the base workpiece 1 to form a more multi-layer copper foil substrate, and the additional layer workpiece 3 includes an adhesive sheet 31 attached to the copper foil sheet 11 on either side of the base workpiece 1, and a copper foil sheet 32 attached to the other side of the adhesive sheet 31. The remaining components are the same as the first implementation structure.

Please refer to Figure 6, which is a flow chart of the manufacturing method of the copper foil substrate of the present invention, including the following steps:

Step A1: provide two copper foils 11 in a stacked state and provide an adhesive sheet 12 between the two copper foils 11, and the two copper foils 11 and the adhesive sheet 12 form at least one base workpiece 1.

Step A2: Place and fix the at least one base workpiece 1 in a pressing fixture 2 including two clamping plates 21, and a tungsten disulfide coating 22 is formed on the surface of at least one of the two clamping plates 21. During the pressurization process of the pressing fixture 2, the colloid-rich adhesive sheet 12 overflows to the surface of at least one of the two clamping plates.

Step A3: Press and heat the at least one basic workpiece 1, and after the at least one basic workpiece 1 is finalized, disassemble the pressing jig 2 and take it out.

Step A4: Clean the solidified residual glue on at least one of the two clamping plates 21 of the pressing fixture 2, and the cleaning process includes brushing with a nylon brush wheel, washing with water at room temperature, and blowing off water droplets at room temperature.

The clip plate 21 is made of mirror-finished stainless steel material; and the adhesive sheet 12 is made of insulating paper or glass fiber cloth impregnated with resin.

In the above step A2, the base workpiece and at least one added layer workpiece 3 can be placed in the pressing fixture 2 for pressing and heating and baking. The added layer workpiece 3 includes an adhesive sheet 31 attached to the copper foil 11 on any side of the base workpiece 1, and a copper foil 32 attached to the other side of the adhesive sheet 31.

The main feature of the present invention is that the clamping plate 21 of the pressing fixture 2 used in the production process of the copper foil substrate is sprayed with a tungsten disulfide coating 22, which has anti-sticking and easy-to-clean properties. Therefore, when cleaning the residual glue on the clamping plate 21, only a nylon brush wheel with low cutting force is needed to brush off most of it, and the small residual glue spots are rinsed with normal temperature water. The residual water droplets on the clamping plate 21 can be dried by blowing them at room temperature with a blower, which is convenient for the repeated use of the clamping plate 21. The present invention reduces the process of dissolving the colloid using a release liquid as in the prior art. In addition to the advantages of environmental protection and reduced production costs, it is also conducive to the production of copper foil substrates with an automated process.

The above is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the contents of the present invention's specification and drawings should be included in the patent scope of the present invention and should be stated.

In summary, the manufacturing method for copper foil substrates described above can achieve its efficacy and purpose when used. Therefore, this invention is truly an invention with excellent practicality. In order to meet the application requirements for invention patents, an application is filed in accordance with the law. I hope that the review committee will approve this case as soon as possible to protect the inventor's hard work in research and development. If the review committee of the Jun Bureau has any doubts, please feel free to write to instruct. The inventor will do his best to cooperate and will be grateful for the convenience.

A1: Provide two copper foils in a stacked state and an adhesive sheet between the two copper foils, and the two copper foils and the adhesive sheet form at least one base processing part

A2: The at least one base workpiece is placed and fixed in a pressing fixture comprising two clamping plates, and a tungsten disulfide coating is formed on the surface of at least one of the two clamping plates. During the pressurization process of the pressing fixture, the colloid-rich adhesive sheet overflows onto the surface of at least one of the two clamping plates.

A3: Press and heat the at least one basic workpiece, and after the at least one basic workpiece is finalized, disassemble the pressing jig and take it out.

A4: Clean the solidified residual glue on at least one of the two clamping plates of the pressing fixture. The cleaning process includes brushing with a nylon brush, washing with water at room temperature, and blowing off water droplets at room temperature.

Claims (4)

A method for manufacturing a copper foil substrate comprises the following steps: A1, providing two copper foil sheets in a stacked state and providing an adhesive sheet between the two copper foil sheets, wherein the two copper foil sheets and the adhesive sheet form at least one base workpiece; A2, placing and fixing the at least one base workpiece in a pressing fixture comprising two clamping plates, wherein at least one of the two clamping plates has a tungsten disulfide coating formed on its surface, and applying pressure to the pressing fixture; During the process, the adhesive sheet contains colloid that overflows onto the surface of at least one of the two clamping plates; A3, pressing and heating the at least one base workpiece, disassembling the pressing jig and taking it out after the at least one base workpiece is finalized; and A4, cleaning the solidified residual glue on at least one of the two clamping plates of the pressing jig, and the cleaning procedure includes brushing with a nylon brush wheel, washing with water at room temperature, and blowing off water droplets at room temperature. A method for manufacturing a copper foil substrate as described in claim 1, wherein the clamping plate is made of mirror-finished stainless steel material. A method for manufacturing a copper foil substrate as described in claim 1, wherein the adhesive sheet is formed by impregnating insulating paper or glass fiber cloth with resin. The manufacturing method of the copper foil substrate as described in claim 1, wherein in step A2, the base workpiece and at least one build-up workpiece can be placed in the pressing fixture for pressing and heating and baking, and the build-up workpiece includes an adhesive sheet attached to the copper foil on any side of the base workpiece, and a copper foil attached to the other side of the adhesive sheet.