TWI880101B - Mounting device and method for manufacturing semiconductor device - Google Patents

Abstract

The purpose of the present invention is to provide a technology that can improve the accuracy of the alignment of the mounting position. The mounting device includes: a frame that can be mounted on a mounting table; a beam that extends in a first direction in a manner that crosses the aforementioned frame, and its two ends are supported on the aforementioned frame so that they can move freely in the second direction; a mounting head that is supported by the aforementioned beam so that it can move freely in the aforementioned first direction; a reference member that is separated from the aforementioned beam, extends in the aforementioned first direction, and its two ends are supported; and a detection head that is provided on the aforementioned mounting head in a manner that it is opposite to the aforementioned reference member. The aforementioned detection head is configured to detect the positional relationship between it and the aforementioned reference member.

Description

Mounting device and method for manufacturing semiconductor device

The present invention relates to a mounting device, and can be applied to a mounting device having a beam, for example.

Conventionally, as a type of component mounting device, there is a substrate mounting machine that holds the component from the component supply unit to the top of the substrate relative to the fixed substrate, lowers the component, and mounts it on the component. This mounting machine must accurately reproduce the position of the "XY direction (in the horizontal plane) of the held component". In addition, in order to improve the productivity of mounting substrates, the speed of "conveying the component from the component supply unit to the top of the substrate and performing positioning in the XY direction" and the speed of "returning to the component supply unit after the component has been mounted" must be increased as much as possible.

In view of this, a part mounting machine as a mounting device has a structure having the following parts: an X-beam extending in the X-axis direction and fixed to a base; a Y-beam installed to be slidable relative to the X-beam and configured to extend in the Y-axis direction; and a mounting head installed to be slidable relative to the Y-beam. In this way, it becomes a device that can transport parts accurately and at high speed. [Prior technical literature] [Patent literature]

[Patent Document 1] Japanese Patent Application Publication No. 2019-145607

[Problem to be solved by the invention]

In the mounting device described above, the Y-beam on which the mounting head is slidably mounted may bend due to the weight or thermal deformation of the Y-beam and the mounting head, and thus the mounting position alignment accuracy may be deteriorated.

The purpose of the present invention is to provide a technology that can improve the accuracy of the installation position alignment. Other purposes and novel features can be clearly understood from the description and drawings of this case. [Means for solving the problem]

If the most representative example of the present invention is briefly described, it is as follows. That is, the mounting device comprises: a frame on which the mounting table can be mounted; a beam extending in a first direction in a manner that crosses the aforementioned frame, and supported on the aforementioned frame at both ends so as to be freely movable in a second direction; a mounting head supported by the aforementioned beam so as to be freely movable in the aforementioned first direction; a reference member separated from the aforementioned beam, extending in the aforementioned first direction and supported at both ends; and a detection head provided on the aforementioned mounting head in a manner opposite to the aforementioned reference member. The aforementioned detection head is configured to detect the positional relationship with the aforementioned reference member. [Effect of the invention]

According to the present invention, the installation position alignment accuracy can be improved.

The following drawings are used to explain the comparative examples, implementation forms, variants and implementation examples in detail. However, in the following description, the same components are marked the same, and the repeated description of the parts is sometimes omitted. In order to explain more clearly, the width, thickness, shape, etc. of each part are sometimes shown in a schematic manner in the drawings compared to the actual state, but this is only an example and is not used to limit the interpretation of the present invention.

First, the installation device of the comparative example is described using Figures 1 to 3. Figure 1 is a top view schematically showing the installation device of the comparative example. Figure 2 is a front view schematically showing the installation device of Figure 1. Figure 3 is a side view schematically showing the installation device of Figure 1.

The mounting device 100R of the comparative example is a device that transports the part 300 from the part supply unit (not shown in the figure) to the top of the workpiece 200, and mounts the transported part 300 on the workpiece 200. The mounting device 100 includes a frame 110, a mounting table 120 supported on the frame 110, an X-support table 131 provided on the frame 110, a Y-beam 140 supported on the X-support table 131, and a mounting head 150 supported by the Y-beam 140. In addition, the X-axis direction and the Y-axis direction are directions perpendicular to each other on a horizontal plane. In this comparative example, the extending direction of the Y-beam 140 is described as the Y-axis direction (first direction), and the direction perpendicular to the Y-axis direction is described as the X-axis direction (second direction). In addition, the Z-axis direction (third direction) is a vertical direction on the XY plane. The Y beam 140 is provided with a linear scale 161 extending along the Y-axis direction.

The mounting head 150 includes: a mounting head 151 having a holding means for holding the component 300 in a freely attachable and detachable manner; and a driving part 152 for driving the mounting head 150 in the Z-axis direction. The driving part 152 is mounted on the Y beam 140 so as to be freely reciprocating in the Y-axis direction. The detection head 162 is disposed on the upper part of the driving part 152 of the mounting head 150 opposite to the linear scale 161.

In the case of this comparative example, the mounting head 150 has three mounting heads 151, and each mounting head 151 has a holding means 151a having a nozzle for holding the component 300 by vacuum adsorption. In addition, the driving unit 152 can independently raise and lower the mounting heads 151 in the Z-axis direction. The mounting heads 151 have the functions of holding and conveying the component 300 and mounting the component 300 on the "workpiece 200 adsorbed and fixed to the mounting table 120".

The guide 132 provided on the X-support table 131 is a member for guiding the Y-beam 140 in the X-axis direction so that it can slide freely. In the case of this comparative example, two X-support tables 131 are arranged in parallel, and each X-support table 131 is fixed to the frame 110 in a state of extending in the X-axis direction. The X-support table 131 may also be formed integrally with the frame 110.

The slider 143 is mounted on the guide 132 so as to be freely movable in the X-axis direction. Then, each leg 142 of the Y-beam 140 is mounted on each slider 143 of the two guides 132. That is, the main beam 141 of the Y-beam 140 extends in the Y-axis direction in a manner that it crosses over the mounting table 120, and each leg 142 at both ends is mounted on the slider 143, and is supported so as to be freely movable in the X-axis direction by the guide 132 mounted on the X-support table 131. Since the bottom surface of the main beam 141 and the bottom surface of the leg 142 (the upper surface of the slider 143) are located on the same plane, the main beam 141 is set at a position not high from the X-support table 131.

The Y beam 140 is a rod-shaped member and is disposed to extend in the Y-axis direction. The shape of the XZ cross section of the Y beam 140 has a trapezoidal shape that is a combination of a quadrangle and a right triangle.

The Y beam 140 is a component used to guide the mounting head 150 to reciprocate in the Y-axis direction. Once the reciprocating mounting head 150 vibrates, the held part 300 may fall off. In addition, in order to transport the part 300 to the correct position, the bending must be suppressed as much as possible. Therefore, the Y beam 140 must have sufficient structural strength. In addition, the Y beam 140 is a component that linearly reciprocates along the X support table 131 together with the mounting head 150. The lighter the Y beam 140, the faster the part 300 can be transported.

Next, the problem of the installation device of the comparative example is explained using Figures 4 to 6. Figure 4 is a schematic front view used to explain the problem of the installation device of the comparative example. Figure 5 is a schematic side view used to explain the problem of the installation device of the comparative example. Figure 6 is a schematic top view used to explain the problem of the installation device of the comparative example.

As shown in Fig. 4, the main beam 141 is bent due to the weight of the main beam 141 and the mounting head 150 or the thermal expansion of the main beam 141 (first problem). As a result, the mounting head 150 tilts, which affects the mounting position (joining position) and the tilting of the parts (such as die).

5, the main beam 141 is twisted due to the weight of the main beam 141 and the mounting head 150 or the thermal expansion of the main beam 141 (second problem). As a result, the mounting head 150 tilts, affecting the mounting position (joining position) and the tilting of parts (such as die).

In addition, as shown in FIG6 , the main beam 141 is bent due to thermal expansion (third problem). As a result, the mounting head 150 tilts, affecting the mounting position (joining position) and the tilting of parts (such as die). Since the "linear scale 161 provided on the main beam 141" is also affected by the deformation, the "effect caused by the deformation of the main beam 141" cannot be captured by the detection head 162, and correction cannot be performed.

In the mounting device of the present invention, in order to solve at least one of the above-mentioned problems, a reference member (for example, a rod-shaped member) is prepared as a "reference for measuring the position of the mounting head". The material of the reference member is preferably not easily affected by heat, and is lightweight and highly rigid. In addition, the reference member is maintained at a position separated from the main beam in a state where it is not affected by the heat, weight, or deformation of the main beam. Then, a sensor for detecting the position of the mounting head is provided at the mounting head. The measurement object of the sensor is the reference member itself, or the measurement object of the sensor is arranged on the reference member.

In the following, representative embodiments and their variations are listed as examples. In the following descriptions of the embodiments and variations, the same symbols as those in the above comparative examples are used for the parts having "the same structure and function as the objects described in the above comparative examples". Then, the description of the relevant parts can be appropriately followed by the description in the above comparative examples within the scope of technical non-contradiction. In addition, all or part of the comparative examples, all or part of multiple embodiments, and all or part of multiple variations can be appropriately and integratedly used within the scope of technical non-contradiction.

<First embodiment> In the first embodiment, a displacement sensor is used as a sensor for detecting the "position of the mounting head", and the reference member itself is used as the measurement object of the sensor.

FIG. 7 to FIG. 9 illustrate the structure of the mounting device of the first embodiment. FIG. 7 is a top view schematically showing the mounting device of the first embodiment. FIG. 8 is a cross-sectional view of the A-A line shown in FIG. 7. FIG. 9 is a front view schematically showing the mounting device shown in FIG. 7. FIG. 35 is a diagram showing a method of fixing the reference rod to the supporting member. The mounting head 151 is omitted in FIG. 8 and FIG. 9.

The mounting device 100 of the first embodiment has the same structure as the mounting device 100R of the comparative example. However, the mounting device 100 of the first embodiment further includes: a reference rod 171 as a reference member; support members 172 and 173 for supporting the reference rod 171; and a detection head 174.

The reference rod 171 is located below the main beam 141 of the Y beam 140 and at a position separated from the main beam 141, and is set parallel to the main beam 141. The reference rod 171 is, for example, in the shape of a four-legged column, and is preferably formed of a material that is not easily affected by heat (small thermal expansion coefficient) and is lightweight and has high rigidity. The reference rod 171 can be formed of, for example, the following materials: ceramic, silicon carbide (SiC), carbon fiber reinforced plastic (CFRP), aluminum alloy ceramic, iron nickel alloy (invar alloy), quartz glass ( _SiO2 ), etc. The reference rod 171 is supported by a pair of supporting members 172 and 173.

The supporting members 172 and 173 are crank-shaped in front view and have: a first extension portion and a second extension portion extending along the Y-axis direction; and a third extension portion extending in the up-down direction and connecting the first extension portion and the second extension portion. The first extension portion is fixed between the leg 142 and the slider 143. The second extension portion is located below the first extension portion and supports the reference rod from below.

The reference rod 171 is deformed in the Y-axis direction of the frame 110 due to the expansion of the Y beam 140, etc. Then, the support members 172 and 173 sometimes move together with the deformation of the frame. In order not to be affected by the movement of the support members 172 and 173, the reference rod 171 is preferably supported by the support members 172 and 173. For example, one end of the reference rod 171 is fixed to the support member 172 as a reference, and the other end of the reference rod 171 is kept free on the support member 173.

Specifically, the end of the reference rod 171 in the dotted ellipse A of FIG9 is fixed in the linear direction (Y-axis direction) and the rotational direction (X-axis direction) by screws or the like, thereby forming a setting reference for the reference rod 171. The end of the reference rod 171 in the dotted ellipse B of FIG9 is provided with a key 171a on the reference rod 171 and a groove 173a on the support member 173 as shown in B1 and B2 of FIG9. In this article, B2 of FIG9 is a cross-sectional view taken along the C-C line shown in B1. Thus, the reference rod 171 is fixed in its rotational direction and can be moved in the linear direction. In this way, as long as "one end of the benchmark rod 171 is fixed, the rotation direction is restricted, and the other end is supported by a sliding mechanism", it will not be easily affected by the overall distortion. In the case where the accuracy of the structure and movement does not generate a load on the benchmark rod 171, since the fixation of the support member 172 using screws or the like is a simple structure, the cost is low. As shown in FIG35, the end of the benchmark rod 171 in the dotted ellipse A of FIG9 can also be fixed to the support member 172 using a fixing member 176 in order to be able to rotate in the XY plane. In this way, in the case where the support members 172 and 173 cannot remain parallel, it is not easy for force to act on the benchmark rod 171.

As shown in FIG8 , the detection head 174 is mounted on the lower part of the driving part 152 below the main beam part 141. The detection head 174 has a sensor (displacement sensor) for measuring the distance (d) between the detection head 174 and the reference rod 171. The mounting device 100 has a control device for monitoring and controlling the actions of each part. The control device controls the driving part that "drives the Y beam 140 in the X-axis direction" and the driving part that "drives the mounting head 150 in the Y-axis direction" according to the position measured by the detection head 174, thereby correcting the position of the mounting head 150. The details will be described later.

The following is an explanation of the displacement sensor. The displacement sensor is mounted on the mounting head, and the distance to the benchmark rod is measured in each direction. When the benchmark rod is located below the displacement sensor as in the present embodiment, the distance in the Z direction can be measured. When the benchmark rod is located on the side of the displacement sensor, the distance in the X direction or the Y direction can be measured. In the case where the benchmark rod is not deformed but the measured value has changed, it can be determined that "positioning error has occurred." As a displacement sensor, for example, an optical type (triangulation/coaxial confocal) can be used. The coaxial confocal method has the advantages of high accuracy and space saving. However, if the object is out of focus, it cannot be detected. However, if the object is within the focus distance, it can stably receive light even if it is tilted. In the case of triangulation, by using CMOS or CCD sensors as light receiving elements, it is not easily affected by the color spots or surface conditions of the object.

Next, the position correction of the mounting head 150 is described using Figures 10 and 11. Figure 10 is a front view showing the main beam portion shown in Figure 7 in a bent state. Figure 11 is a front view showing the mounting head shown in Figure 10 in a state where it is located on the right side.

As shown in FIG10 , once the main beam 141 is bent, the height of the mounting head 150 will change. The control device can correct the height of the mounting head 151 according to the bending amount of the main beam 141 by measuring the distance (d) between the detection head 174 provided on the mounting head 150 and the reference rod 171.

In addition, the control device calculates the deflection of the beam based on the height change of each position of the mounting head 150 in the Y-axis direction. In this article, the position of the mounting head 150 in the Y-axis direction is calculated based on "the data obtained by the detection head 162 provided in the mounting head 150 reading the linear scale 161 provided in the main beam part 141". Then, as shown in Figure 11, the control device calculates the tilt amount (θ) of the mounting head 150 and corrects the positioning error (△y) of the "target point of the workpiece 200".

(First variant) The mounting device of the first variant is described using Figures 12 and 13. Figure 12 is a cross-sectional view of the mounting device of the first variant corresponding to the cross-section of the "A-A line shown in Figure 7". Figure 13 is a cross-sectional view showing the "main beam portion is twisted" of the mounting device shown in Figure 12.

In the first embodiment, as shown in Fig. 5, when the main beam portion 141 is twisted, it is impossible to measure the position of the mounting head 150. Therefore, in the first modification, a detection head 175 having a displacement sensor is added.

The detection head 174 is provided on the mounting head 150 so as to be located at a position "separated in the Z direction from the upper surface of the reference rod 171". The detection head 175 is provided on the mounting head 150 so as to be located at a position "separated in the X direction from the side surface of the reference rod 171". The detection head 174 can measure the distance in the Z direction, and the detection head 175 can measure the distance in the X direction.

As shown in FIG. 13 , when the main beam 141 is twisted, the reference bar 171 approaches the probe head 175, and the reference bar 171 moves away from the probe head 174. That is, the distance between the probe head 175 and the reference bar 171 in the X direction becomes smaller, and the distance between the probe head 174 and the reference bar 171 in the Z direction becomes larger. Based on this phenomenon, the control device calculates the twist amount of the mounting head 150 and corrects the positioning error (△x) of the "target point of the workpiece 200".

<Second embodiment> In the second embodiment, a position reading sensor is used as a sensor for detecting the "position of the mounting head", and a linear scale provided on a reference member is used as a measurement object of the sensor.

Next, the mounting device of the second embodiment is described using Fig. 14 to Fig. 17. Fig. 14 is a top view schematically showing the mounting device of the second embodiment. Fig. 15 is a front view schematically showing the mounting device shown in Fig. 14. Fig. 16 is a cross-sectional view taken along the line A-A shown in Fig. 14. Fig. 17 is a cross-sectional view showing the mounting device shown in Fig. 16 in a state where the main beam portion is twisted. The mounting head 151 is omitted in Fig. 15 to Fig. 17.

The mounting device 100 of the second embodiment has the same structure as the mounting device 100 of the first embodiment. However, the mounting device 100 of the second embodiment has a reference bar 271 "having a linear scale 261 on its upper surface" instead of the reference bar 171, and has a probe head 274 "having a sensor that reads the same position as the probe head 162" instead of the probe head 174. In addition, the linear scale 161 and the probe head 162 of the first embodiment are not provided.

The structure of the benchmark rod 271 is the same as that of the benchmark rod 171 except that the benchmark rod 271 has a linear scale 261 on its side. Like the benchmark rod 171, the benchmark rod 271 is supported by a pair of supporting members 172 and 173 so as not to be affected by the movement of the supporting members 172 and 173.

The linear scale 261 is described with reference to Fig. 18. Fig. 18 is a diagram for describing the linear scale of the second embodiment.

The linear scale 261 is composed of a scale 261a having a pattern for reading the position in the Y-axis direction and a scale 261b having a pattern for reading the position in the X-axis direction. The scale 261a is arranged to extend along the Y-axis direction. The scale 261b is arranged to be adjacent to the X-axis direction and extend along the Y-axis direction.

The detection head 274 has sensors 274a and 274b for reading the scale 261a and a sensor 274c for reading the scale 261b. The sensor 274a is arranged so that its optical axis is perpendicular to the scale 261a. The sensor 274c is arranged so that its optical axis is perpendicular to the scale 261b. The position in the X-axis direction is read by the sensor 274a, and the position in the X-axis direction is read by the sensor 274c.

Sensor 274b is adjacent to the Y-axis direction of sensor 274a, and is configured with its optical axis tilted relative to scale 261a. Once the height of the detection head 274 changes, the intersection position of the optical axis of sensor 274b and scale 261a will also change, so the position in the Y-axis direction read by sensor 274b also changes. Therefore, the control device calculates the difference (dy) between "the position of scale 261a read by sensor 274b" and "the position of scale 261a read by sensor 274a". The difference (dy) changes according to the height of the detection head 274. Then, the control device calculates the change in the position in the Z direction (dz) according to the change in the difference (dy), and further calculates the position in the Z direction.

In this way, the posture of the mounting head 150 in three directions, namely, the X-axis direction, the Y-axis direction, and the Z-axis direction, can be detected by one detection head 274. Accordingly, as shown in FIG. 4 (FIG. 11), when the main beam 141 is bent, the positioning error (△y) in the Y-axis direction can be corrected according to the positions of the mounting head 150 in the Y-axis direction and the Z-axis direction. Furthermore, as shown in FIG. 6, when the main beam 141 is bent, the positioning error (△x) in the X-axis direction can be corrected according to the positions of the mounting head 150 in the X-axis direction and the Y-axis direction. Furthermore, as shown in FIG. 17 , when the main beam portion 141 is twisted, the positioning error (Δx) in the X-axis direction can be corrected based on the position (dx) in the X-axis direction and the position (d) in the Z-axis direction of the mounting head 150 .

(Second variant) The mounting device of the second variant is described with reference to FIGS. 19 and 20. FIG. 19 is a top view schematically showing the mounting device of the second variant. FIG. 20 is a top view showing the main beam portion shown in FIG. 19 in a bent state.

The mounting device 100 of the second variant has a reference rod 371; supporting members 372, 373 and a detection head 374 for supporting the reference rod 371, to replace the reference rod 271 of the second embodiment; supporting members 172, 173 and a detection head 274 for supporting the reference rod 271.

The reference rod 371 is provided at a position separated from the main beam portion 141 and on the side of the Y beam 140 and parallel to the main beam portion 141. The reference rod 371 has the same shape and is made of the same material as the reference rod 171. Like the reference rod 171, the reference rod 371 is supported by a pair of support members 372 and 373 so as not to be affected by the movement of the support members 372 and 373.

The supporting members 372 and 373 have the same structure as the supporting members 172 and 173. That is, the supporting members 372 and 373 are crank-shaped in a top view and have: a first extension portion and a second extension portion extending along the Y-axis direction; and a third extension portion extending in the X-direction and connecting the first extension portion and the second extension portion. The first extension portion is fixed to the leg portion 142. The second extension portion is located at a position further away from the main beam portion 141 in the X-direction than the first extension portion, and supports the reference rod 371 from the side.

The reference rod 371 has the same linear scale as the reference rod 271 at a position facing the probe head 374. The probe head 374 is provided at the same position as the probe head 162 of the first embodiment and has the same sensor as the probe head 274.

The probe head 374 disposed on the mounting head 150 reads a linear scale provided on the reference bar 371 disposed to be separated from the main beam 141 in the X direction, and measures the position of the mounting head 150. The reference bar 371 is not affected by the deformation of the main beam 141, and the positional relationship between the reference bar 371 and the sensor of the probe head 374 changes.

In this way, the posture of the mounting head 150 in three directions, namely, the X-axis direction, the Y-axis direction, and the Z-axis direction, can be detected by one detection head 374. Accordingly, as shown in FIG. 4 (FIG. 11), when the main beam 141 is bent, the positioning error in the Y-axis direction can be corrected according to the positions of the mounting head 150 in the Y-axis direction and the Z-axis direction. In addition, as shown in FIG. 20, when the main beam 141 is bent, the positioning error in the X-axis direction can be corrected according to the positions of the mounting head 150 in the X-axis direction and the Y-axis direction. Furthermore, as shown in FIG. 17 , when the main beam portion 141 is twisted, the positioning error in the X-axis direction can be corrected according to the positions of the mounting head portion 150 in the X-axis direction and the Z-axis direction.

<Third embodiment> In the third embodiment, a position reading sensor is used as a sensor for detecting the "position of the mounting head", and two reference members are used, and a linear scale provided on each reference member is used as a measurement object of the sensor.

The structure of the mounting device of the third embodiment is described with reference to Fig. 21 to Fig. 23. Fig. 21 is a top view schematically showing the mounting device of the third embodiment. Fig. 22 is a front view schematically showing the mounting device shown in Fig. 21. Fig. 23 is a cross-sectional view taken along the line A-A shown in Fig. 21. The mounting head 151 is omitted in Fig. 22 and Fig. 23.

The mounting device 100 of the third embodiment has the same structure as the mounting device 100 of the second embodiment. However, the mounting device 100 of the third embodiment has supporting members 472 and 473 instead of the supporting members 172 and 173, and further has a reference rod 471 and a detection head 474.

The structure of the benchmark rod 471 is the same as that of the benchmark rod 271. However, the benchmark rod 471 has a linear scale 261 on the lower side. Like the benchmark rod 171, the benchmark rods 271 and 471 are supported by a pair of support members 472 and 473 so as not to be affected by the movement of the support members 472 and 473.

The supporting members 472 and 473 have, in a front view, a first extension portion, a second extension portion, and a fourth extension portion extending along the Y-axis direction; and a third extension portion extending in the up-down direction and connecting the first extension portion, the second extension portion, and the fourth extension portion. The first extension portion is fixed between the foot 142 and the slider 143. The second extension portion is located below the first extension portion and supports the reference rod 271 from below. The fourth extension portion is located above the first extension portion and supports the reference rod 471 from below.

The detection head 474 is mounted on the upper part of the driving part 152 below the main beam part 141 and below the reference rod 471. The detection head 474 has the same structure as the detection head 274.

The probe head 274, 474 disposed on the mounting head 150 reads the linear scale provided on the reference rod 271, 471 disposed to be separated from the main beam portion 141 in the Z direction, and measures the position of the mounting head 150. The reference rod 271, 471 is not affected by the deformation of the main beam portion 141, and the positional relationship between the reference rod 271, 471 and the sensor of the probe head 274, 474 changes.

Next, the position correction of the mounting head 150 is described with reference to Fig. 24 and Fig. 25. Fig. 24 is a front view showing the main beam portion shown in Fig. 22 in a bent state. Fig. 25 is a cross-sectional view showing the main beam portion shown in Fig. 23 in a twisted state.

The detection heads 274 and 474 can detect the posture of the mounting head 150 in three directions, namely, the X-axis direction, the Y-axis direction, and the Z-axis direction. Accordingly, as shown in FIG. 24 , when the main beam portion 141 is bent, the positioning error (△y) in the Y-axis direction can be corrected based on the position (dy) in the Y-axis direction and the position (dz) in the Z-axis direction of the detection heads 274 and 474. Furthermore, as shown in FIG. 6 , when the main beam portion 141 is bent, the positioning error in the X-axis direction can be corrected based on the positions in the X-axis direction and the Y-axis direction of the detection heads 274 and 474. Furthermore, as shown in FIG. 25 , when the main beam portion 141 is twisted, the positioning error (Δx) in the X-axis direction can be corrected based on the position (dx) in the X-axis direction and the position (dz) in the Z-axis direction of the detection heads 274 and 474 .

(Third variant) The structure of the mounting device of the third variant is described using Fig. 26 and Fig. 27. Fig. 26 is a front view schematically showing the mounting device of the third variant. Fig. 27 is a cross-sectional view corresponding to the position of "A-A line shown in Fig. 21". The mounting head 151 is omitted in Fig. 26 and Fig. 27.

The mounting device 100 of the third modification has the same structure as the mounting device 100 of the third embodiment. However, the mounting device 100 of the third modification includes the support members 172 and 173 of the second embodiment instead of the support members 472 and 473 , and includes a reference rod 571 instead of the reference rod 471 .

The structure of the benchmark rod 571 is the same as that of the benchmark rod 271. However, the benchmark rod 571 has a linear scale 261 on the lower side. Like the benchmark rod 271, the benchmark rod 571 is supported by the upper sides of a pair of legs 142 so as not to be affected by the movement of the legs 142.

In this modification, the detection heads 274 and 474 arranged on the mounting head 150 read the linear scale provided on the "reference rods 271 and 471 arranged to be separated from the main beam portion 141 in the Z direction" and measure the position of the mounting head 150, as in the third embodiment. The reference rods 271 and 471 are not affected by the deformation of the main beam portion 141, and the positional relationship between the reference rods 271 and 471 and the sensors of the detection heads 274 and 474 does not change. In addition, the detection heads 274 and 474 can detect the posture of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction. Accordingly, in this modification, the positioning error (△x, △y) can be corrected, as in the third embodiment.

(Fourth variant) The structure of the mounting device of the fourth variant is described using Figures 28 and 29. Figure 28 is a front view schematically showing the mounting device of the fourth variant. Figure 29 is a cross-sectional view corresponding to the position of "A-A line shown in Figure 21". The mounting head 151 is omitted in Figures 28 and 29.

The mounting device 100 of the fourth modification has the same structure as the mounting device 100 of the third modification. However, the mounting device 100 of the fourth modification has a reference rod 671 instead of the support members 172 and 173 and the reference rod 271, and has a detection head 674 instead of the detection head 274.

The structure of the reference rod 671 is the same as that of the reference rod 571. However, like the reference rod 571, the reference rod 671 is supported by the lower sides of a pair of legs 142 so as not to be affected by the movement of the legs 142.

The detection head 674 is located below the main beam 141 and the reference rod 671 and is installed at the lower part of the driving part 152. The detection head 674 has the same structure as the detection head 274, but is installed to read the linear scale of the reference rod 671 located above.

In this modification, the detection heads 674 and 474 arranged on the mounting head 150 read the linear scale provided on the "reference rods 671 and 571 arranged to be separated from the main beam portion 141 in the Z direction" and measure the position of the mounting head 150, as in the third embodiment. The reference rods 671 and 571 are not affected by the deformation of the main beam portion 141, and the positional relationship between the reference rods 671 and 571 and the sensors of the detection heads 674 and 474 does not change. In addition, the detection heads 674 and 474 can detect the posture of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction. Accordingly, in this modification, as in the third embodiment, the positioning error (△x, △y) can be corrected.

(Fifth variant) The structure of the mounting device of the fifth variant is described using Figures 30 and 31. Figure 30 is a front view schematically showing the mounting device of the fifth variant. Figure 31 is a cross-sectional view corresponding to the position of "A-A line shown in Figure 21". The mounting head 151 is omitted in Figures 30 and 31.

The mounting device 100 of the fifth modification has the same structure as the mounting device 100 of the third modification. However, the mounting device 100 of the fifth modification has support members 772, 773 and a reference rod 771 to replace the support members 172, 173 and the reference rod 271, and has a detection head 774 to replace the detection head 274, and also has a reference rod 871 and a detection head 874 to replace the reference rod 571 and the detection head 474.

The structure of the benchmark rod 771 is the same as that of the benchmark rod 271. However, the benchmark rod 771 has a linear scale 261 on the side. Like the benchmark rod 271, the benchmark rod 771 is supported by a pair of supporting members 772 and 773 so as not to be affected by the movement of the supporting members 772 and 773.

The structure of the benchmark rod 871 is the same as that of the benchmark rod 571. However, the benchmark rod 871 has a linear scale 261 on the side. Like the benchmark rod 571, the benchmark rod 871 is supported by the upper sides of a pair of legs 142 so as not to be affected by the movement of the legs 142.

The support members 772 and 773 are similar to the support members 172 and 173, and are crank-shaped when viewed from the front, and have: a first extension portion and a second extension portion extending along the Y-axis direction; and a third extension portion extending in the up-down direction and connecting the first extension portion and the second extension portion. The first extension portion is fixed between the leg 142 and the slider 143. The second extension portion is located below the first extension portion and supports the reference rod from below. However, the third extension portion of this modification is shorter than the third extension portion of the support members 172 and 173.

The detection head 774 is installed at the lower part of the driving part 152 below the main beam part 141 and facing the side of the benchmark rod 771. The detection head 774 has the same structure as the detection head 274, but is installed to read the linear scale of the benchmark rod 771 set on the side.

The detection head 874 is mounted on the upper part of the driving part 152 above the main beam part 141 and facing the side of the benchmark rod 871. The detection head 874 has the same structure as the detection head 274, but is installed to read the linear scale of the benchmark rod 871 set on the side.

In this modification, the detection heads 774 and 874 arranged on the mounting head 150 read the linear scale provided on the "reference rods 771 and 871 arranged to be separated from the main beam portion 141 in the Z direction" and measure the position of the mounting head 150, as in the third embodiment. The reference rods 771 and 871 are not affected by the deformation of the main beam portion 141, and the positional relationship between the reference rods 771 and 871 and the sensors of the detection heads 774 and 874 does not change. In addition, the detection heads 774 and 874 can detect the posture of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction. Accordingly, in this modification, as in the third embodiment, the positioning error (△x, △y) can be corrected.

<Fourth Implementation Form> The fourth implementation form of the mounting device is described using Figures 32 to 34. Figure 32 is a top view schematically showing the mounting device of the fourth implementation form. Figure 33 is a front view schematically showing the mounting device shown in Figure 32. Figure 34 is a diagram showing the mounting head of the mounting device shown in Figure 8 in a tilted state. The mounting head 151 is omitted in Figures 32 to 34.

In the first embodiment, as shown in FIG. 34 , when the X-support table 131 is deformed due to thermal expansion or the like, the guide 132 is also deformed, and the beam 140, the mounting head 150, the reference bar 171, and the supporting members 172 and 173 moving in the X direction on the guide 132 are tilted. In this case, since the positional relationship between the detection head 174 disposed on the mounting head 150 and the reference bar 171 does not change, the rotation (tilting) of the mounting head 150 "with the Y axis as the rotation axis" cannot be grasped.

In view of this, the mounting device 100 of the fourth embodiment, as shown in FIG. 33 , further comprises: reference rods 971 , 972 ; fixing members 973 , 974 for fixing the reference rods 971 , 972 ; and detection heads 975 , 976 .

As shown in FIG. 32 , the reference rods 971 and 972 are arranged to extend in the X direction and are fixed to the frame 110 by fixing members 973 and 974. The reference rods 971 and 972 are parallel to the direction in which the guide 132 extends and are arranged at positions that do not interfere with the reference rod 171, the supporting members 172 and 173, and the mounting head 151. The reference rods 971 and 972 have the same structure as the reference rod 271 except for the linear scale provided on the upper surface thereof.

As shown in FIG. 33 , the detection heads 975 and 976 are provided on the support members 172 and 173 in a manner of being located “separated from the upper side of the reference rods 971 and 972”. The detection heads 975 and 976 are components obtained by removing the “sensor 274c for reading the scale 261b” from the detection head 274. However, the sensor 274b is adjacent to the X-axis direction of the sensor 274a and is arranged with the optical axis tilted relative to the scale 261a.

Once the height of the detection heads 975 and 976 changes, the intersection position of the optical axis of the sensor 274b and the scale 261a will also change, so the position in the X-axis direction read by the sensor 274b also changes. Therefore, the control device calculates the difference (dx) between "the position of the scale 261a read by the sensor 274b" and "the position of the scale 261a read by the sensor 274a". The difference (dx) changes according to the height of the detection head 274. Then, the control device calculates the change in the position in the Z direction (dz) according to the change in the difference (dx), and further calculates the position in the Z direction.

In this way, the posture of the reference rod 171 (mounting head 150) in two directions, the X-axis direction and the Z-axis direction, can be detected by the detection heads 975 and 976. Accordingly, as shown in FIG. 39 , when the mounting head 150 has tilted, the positioning error (△x) in the X-axis direction can be corrected based on the position (dx) in the X-axis direction and the position (d) in the Z-axis direction of the mounting head 150.

The reference rods 971 and 972 have the same structure as the reference rod 171 , and the detection heads 975 and 976 can also have the same structure as the detection head 174 .

The following describes an example of a flip chip bonder that applies the "Y-beam of the above-mentioned embodiment" to one example of a mounting device, but the present invention is not limited to this and can also be applied to a chip mounter (surface mounter) that mounts a "packaged semiconductor device" on a substrate and a chip bonder that bonds a semiconductor chip (die) to a substrate. The flip chip bonder is used, for example, in the manufacture of a package that "forms a rewiring layer in a large area exceeding the chip area", i.e., a fan-out wafer level package (FOWLP). [Example]

Fig. 36 is a schematic top view showing the flip chip bonder of the embodiment. Fig. 37 is a diagram for explaining the operation of the pick-up rotary head, the transfer head and the crimping head when viewed from the direction of arrow A in Fig. 36.

The flip chip bonder 10 generally comprises a die supply unit 1, a pickup unit 2, a transfer unit 8, an intermediate stage unit 3, a bonding unit 4, a conveying unit 5, a substrate supply unit 6K, a substrate unloading unit 6H, and a control device 7 for monitoring and controlling the aforementioned units.

First, the grain supply part 1 supplies the grain D for mounting on the substrate P. The grain supply part 1 has: a wafer holding table 12 for holding the divided wafer 11; a lifting unit 13, which is indicated by a dotted line in the figure and lifts the grain D from the wafer 11; and a wafer ring supply part 18. The grain supply part 1 moves in the XY direction by a driving means not shown in the figure, so that the picked-up grain D moves to the position of the lifting unit 13. The wafer ring supply part 18 has a wafer box that has wafer rings stored therein, and supplies wafer rings to the grain supply part 1 in sequence, and replaces new wafer rings. The grain supply part 1 moves the wafer ring to the pickup point in order to pick up the required grains from the wafer ring. The wafer ring is a fixture that can be used to fix the wafer and can be installed in the die supply unit 1.

The pickup unit 2 has a pickup turret 21 that picks up the crystal grain D and then reverses it; and various driving units not shown in the figure are used to raise, lower, rotate, reverse, and move the collet 22 in the X direction. With such a structure, the pickup turret 21 picks up the crystal grain, rotates the pickup turret 21 180 degrees, and reverses the bump of the crystal grain D to face downward, forming a posture of "transferring the crystal grain D to the transfer head 81".

The transfer unit 8 receives the reversed grain D from the pickup turret 21 and places it on the intermediate stage 31. The transfer unit 8 comprises: a transfer head 81 having a collet 82, which is the same as the pickup turret 21, and the collet 82 adsorbs and holds the grain D at the front end; and a Y drive unit 83, which drives the transfer head 81 to move in the Y direction.

The intermediate stage unit 3 comprises an intermediate stage 31 for temporarily placing the die D and a stage recognition camera 34. The intermediate stage 31 can be moved in the Y direction by a driving unit not shown in the figure.

The bonding section 4 picks up the crystal grain D from the intermediate stage 31 and bonds it to the conveyed substrate P. The bonding section 4 has: a press-fit head 41, which has a barrel clamp 42, which is the same as the pick-up rotary head 21, and the barrel clamp 42 adsorbs and holds the crystal grain D at the front end; a Y beam 43, which prompts the press-fit head 41 to move in the Y direction; a substrate recognition camera 44, which photographs the position recognition mark of the substrate P (not shown in the figure) and identifies the bonding position; and an X support table 45. With such a structure, the press-fit head 41 picks up the crystal grain D from the intermediate stage 31, and bonds the crystal grain D to the substrate P according to the photographed data of the substrate recognition camera 44.

The conveying section 5 is equipped with conveying rails 51 and 52 for moving the substrate P in the X direction. The conveying rails 51 and 52 are arranged in parallel. With such a structure, the substrate P is unloaded from the substrate supply section 6K and moved to the bonding position along the conveying rails 51 and 52. After bonding, it is moved to the substrate unloading section 6H, and then the substrate P is transferred to the substrate unloading section 6H. In the process of bonding the die D to the substrate P, the substrate supply section 6K unloads a new substrate P and waits on the conveying rails 51 and 52.

The control device 7 includes: a memory for storing a program (software) for monitoring the operation of each part of the flip chip bonder 10; and a central processing unit (CPU) for executing the program stored in the memory.

FIG38 is a schematic cross-sectional view showing the main parts of the die supply unit of FIG36. The die supply unit 1 has: an expansion ring 15 for holding the wafer ring 14; a support ring 17 for horizontally positioning a dicing tape 16 to which "a plurality of die D held by the wafer ring 14" has been pasted; and a lifting unit 13 for lifting the die D upward. In order to pick up a specific die D, the lifting unit 13 is moved in the up-down direction by a driving mechanism not shown in the figure, so that the die supply unit 1 moves in the horizontal direction.

The joint is described with reference to the comparative example and the second embodiment, and with reference to FIG. 2, FIG. 15, and FIG. 39. FIG. 39 is a schematic side view showing the main part of the joint 4. Some of the components are shown in perspective. The side view of FIG. 39 corresponds to the front view of FIG. 2 and FIG. 15. However, in FIG. 39, the supporting members 172, 173, the reference rod 271, and the detection head 274 are omitted.

The joining section 4 includes: a joining table BS (mounting table 120) supported on a frame 53 (frame 110); an X support table 451 (X support table 131) provided near the conveying rails 52, 53; a Y beam 43 (Y beam 140) supported on the X support table 451; a press joint head 41 (mounting head 151) supported by the Y beam 43; a driving section 46 (driving section 152) driving the press joint head 41 in the Y-axis direction and the Z-axis direction; and a driving section (not shown in the figure) driving the Y beam 43 in the X direction.

The crimping head 41 is a device having a "coil clamp 42 (holding means 151a) for freely attaching and detaching the die D (part 300)", and is mounted on the Y beam 43 so as to be freely reciprocating in the Y-axis direction.

In the present embodiment, a press-fit head 41 is provided, and the press-fit head 41 has a collet 42 that holds the crystal grain D by vacuum adsorption. In addition, a drive unit 46 can move the press-fit head 41 up and down in the Z-axis direction. The press-fit head 41 has the function of holding and conveying the crystal grain D picked up from the intermediate stage 31 and mounting the crystal grain D on the substrate P (workpiece 200) adsorbed and fixed to the bonding table BS.

The guide 132 provided on the X-support table 451 is a member for guiding the Y-beam 43 in the X-axis direction so that it can slide freely. In the present embodiment, two X-support tables 451 are arranged in parallel, and each X-support table 451 is fixed to the conveying rails 52 and 53 in a state of extending in the X-axis direction. The X-support table 451 may also be formed integrally with the conveying rails 52 and 53.

As shown in FIG. 36 and FIG. 39 , the slider 433 is mounted on the guide 452 so as to be freely movable in the X-axis direction. Then, both ends of the Y-beam 43 are mounted on the sliders 433 of the two guides 452, respectively. That is, the Y-beam 43 extends in the Y-axis direction in a manner of crossing over the bonding table BS, and both ends are mounted on the sliders 433, and supported by the guides 452 mounted on the X-support table 451 so as to be freely movable in the X-axis direction. Since the bottom surface of the Y-beam 43 and the upper surface of the slider 433 are located on the same plane, the Y-beam portion 43 is provided at a position not high from the X-support table 451.

The Y beam 43 of the embodiment is basically the same as the structure of the Y beam 140 of the second embodiment. However, the Y beam 43 extends more to the right side than the support table 451 on the right side in the figure. This is to enable the crimping head 41 to pick up the grain D from the intermediate table 31. When the crimping head 41 moves to the right side of the support table 451, the collet 42 is raised to make the guide 452 higher than the guide 452.

Next, a bonding method (a method for manufacturing a semiconductor device) implemented in the flip chip bonder of the embodiment will be described using FIG40. FIG40 is a flow chart showing a bonding method implemented by the flip chip bonder shown in FIG36.

The wafer ring 14 holding the dicing tape 16 attached with the die D separated from the wafer 11 is stored in a wafer box (not shown in the figure) and moved into the flip chip bonder 10. The control device 7 supplies the wafer ring 14 from the wafer box loaded with the wafer ring 14 to the die supply unit 1. In addition, a substrate P is prepared and moved into the flip chip bonder 10. The control device 7 uses the substrate supply unit 6K to mount the substrate P on the substrate transfer claw.

(Step S1: Picking up wafer die) The control device 7 moves the wafer holding table 12 so that the die D to be picked up is located directly above the lifting unit 13, and positions the "stripping target die" on the lifting unit 13 and the collet 22. The lifting unit 13 is moved so that the upper surface of the lifting unit 13 contacts the back of the dicing tape 16. At this time, the control device 7 adsorbs the dicing tape 16 on the upper surface of the moving lifting unit 13. The control device 7 vacuum-attracts the collet 22 while lowering it, landing it on the stripping target die D, and then adsorbing the die D. The control device 7 lifts the collet 22 to strip the die D from the dicing tape 16. In this way, the die D is picked up by the picking turret 21.

(Step S2: Move the pickup turret) The control device 7 causes the pickup turret 21 to move.

(Step S3: Reverse the pickup rotary head) The control device 7 rotates the pickup rotary head 21 180 degrees, so that the bump surface (surface) of the grain D is reversed to face downward, forming a posture of "transferring the grain D to the transfer head 81".

(Step S4: Delivery of transfer head) The control device 7 picks up the crystal grain D from the collet 82 of the pickup turret 21 by means of the collet 22 of the transfer head 81, and performs the delivery of the crystal grain D.

(Step S5: Reverse the pickup turret) The control device 7 reverses the pickup turret 21 so that the suction surface of the collet 22 faces downward.

(Step S6: Move the transfer head) Before or at the same time as executing step S5, the control device 7 moves the transfer head 81 to the intermediate stage 31.

(Step S7: Place on the intermediate stage) The control device 7 places the die D held on the transfer head 81 on the intermediate stage 31.

(Step S8: Move the transfer head) The control device 7 causes the transfer head 81 to move to the delivery position of the grain D.

(Step S9: Move the position of the intermediate table) After or at the same time as executing step S8, the control device 7 moves the intermediate table 31 to the delivery position between the intermediate table 31 and the crimping head 41.

(Step SA: Delivery of press-fit head) The control device 7 picks up the die D from the intermediate table 31 by means of the collet of the press-fit head 41 and performs the delivery of the die D.

(Step SB: Moving the position of the intermediate table) The control device 7 causes the intermediate table 31 to move to the delivery position between the intermediate table 31 and the transfer head 81.

(Step SC: Moving the crimping head) The control device 7 moves the crystal grain D held by the collet 42 of the crimping head 41 onto the substrate P. At this time, the control device 7 controls the driving part 46 and the driving part for driving the Y beam 43 according to the positional relationship with the "reference rod detected by the detection head" to correct the position of the crimping head 41.

(Step SD: Bonding) The control device 7 picks up the crystal grain D from the intermediate stage 31 using the collet 42 of the crimping head 41 and places it on the substrate P.

(Step SE: Moving the crimping head) The control device 7 causes the crimping head 41 to move to a delivery position between the crimping head 41 and the intermediate table 31.

After all the dies D are bonded to the substrate P, the control device 7 transports the substrate P to the substrate unloading unit 6H. The control device 7 removes the “substrate S with the dies D bonded thereto” from the substrate transport claws at the substrate unloading unit 6H. The substrate P is unloaded from the flip chip bonder 10 .

Although the invention proposed by the inventor of the present case has been specifically described above based on the implementation forms, variant examples and embodiments, the present invention is not limited to the above-mentioned implementation forms, variant examples and embodiments, and it is beyond doubt that various modifications are possible.

For example, although the example of using the Y-beam of the second embodiment is described in the embodiment, the present invention is not limited to this, and the Y-beam of the first embodiment, the third embodiment, any one of these variations, or a combination thereof may also be used.

In addition, in the embodiment, although the example in which the number of the crimping head (mounting head) is one is described, it is also possible to have a plurality of crimping heads as in the embodiment.

In addition, in the embodiment, although the example in which the number of the transfer part, the intermediate platform part and the bonding part is one each is described, they may also be plural in number.

In addition, in the embodiment, although the example of "providing a reversing mechanism on the pick-up rotary head, using a transfer head to receive the grain from the pick-up rotary head and placing it on the intermediate stage, and then moving the intermediate stage" is described, it can also be formed by "moving the pick-up rotary head that has picked up the grain and reversed", or it can also be formed by "placing the picked-up grain D on the platform unit on the front and back sides of the rotatable grain, and then moving the platform unit".

100: Mounting device 110: Frame 120: Mounting table 140: Y beam 150: Mounting head 171: Benchmark rod (benchmark member) 174: Detection head

[Figure 1] Figure 1 is a schematic top view of a mounting device of a comparative example. [Figure 2] Figure 2 is a schematic front view of the mounting device shown in Figure 1. [Figure 3] Figure 3 is a schematic side view of the mounting device shown in Figure 1. [Figure 4] Figure 4 is a schematic front view for illustrating the problem of the mounting device shown in Figure 1. [Figure 5] Figure 5 is a schematic side view for illustrating the problem of the mounting device shown in Figure 1. [Figure 6] Figure 6 is a schematic top view for illustrating the problem of the mounting device shown in Figure 1. [Figure 7] Figure 7 is a schematic top view of the mounting device of the first embodiment. [Figure 8] Figure 8 is a schematic side view of the cross section of the A-A line shown in Figure 7. [Figure 9] Figure 9 is a front view schematically showing the mounting device shown in Figure 7. [Figure 10] Figure 10 is a front view schematically showing the main beam portion shown in Figure 7 in a bent state. [Figure 11] Figure 11 is a front view schematically showing the mounting head portion shown in Figure 10 in a right-side position. [Figure 12] Figure 12 is a cross-sectional view of the mounting device of the first variant equivalent to the "cross-section of the A-A line shown in Figure 7". [Figure 13] Figure 13 is a cross-sectional view schematically showing the "main beam portion is twisted" state of the mounting device shown in Figure 12. [Figure 14] Figure 14 is a top view schematically showing the mounting device of the second embodiment. [Figure 15] Figure 15 is a front view schematically showing the mounting device shown in Figure 14. [Figure 16] Figure 16 is a cross-sectional view of the A-A line shown in Figure 14. [Figure 17] Figure 17 is a cross-sectional view showing the "main beam portion has been twisted" state of the mounting device shown in Figure 16. [Figure 18] Figure 18 is a diagram illustrating a linear scale of the second embodiment. [Figure 19] Figure 19 is a top view schematically showing the mounting device of the second variant. [Figure 20] Figure 20 is a top view showing the main beam portion shown in Figure 19 has been bent. [Figure 21] Figure 21 is a top view schematically showing the mounting device of the third embodiment. [Figure 22] Figure 22 is a front view schematically showing the mounting device shown in Figure 21. [Figure 23] Figure 23 is a cross-sectional view of the A-A line shown in Figure 21. [Figure 24] Figure 24 is a front view showing the state in which the main beam portion shown in Figure 22 has been bent. [Figure 25] Figure 25 is a cross-sectional view showing the "state in which the main beam portion has been twisted" shown in Figure 23. [Figure 26] Figure 26 is a front view schematically showing the mounting device of the third variant. [Figure 27] Figure 27 is a cross-sectional view at a position corresponding to "the A-A line shown in Figure 21". [Figure 28] Figure 28 is a front view schematically showing the mounting device of the fourth variant. [Figure 29] Figure 29 is a cross-sectional view at a position corresponding to "the A-A line shown in Figure 21". [Figure 30] Figure 30 is a front view schematically showing the mounting device of the fifth variant. [Figure 31] Figure 31 is a cross-sectional view at a position corresponding to "the A-A line shown in Figure 21". [Figure 32] Figure 32 is a schematic top view of the mounting device of the fourth embodiment. [Figure 33] Figure 33 is a schematic front view of the mounting device shown in Figure 32. [Figure 34] Figure 34 is a diagram showing a state where the mounting head and the like of the mounting device shown in Figure 8 have been tilted. [Figure 35] Figure 35 is a diagram showing a method for fixing a reference rod to a supporting member. [Figure 36] Figure 36 is a schematic top view of a flip-chip bonder of the embodiment. [Figure 37] Figure 37 is a diagram for explaining "the movement of the pickup flip head, transfer head, and bonding head when viewed from the direction of arrow A in Figure 36". [Figure 38] Figure 38 is a schematic cross-sectional view showing the main part of the die supply section of Figure 36. [Figure 39] Figure 39 is a schematic side view showing the main part of the bonding section of Figure 36. [Figure 40] Figure 40 is a flow chart showing the "bonding method implemented by the flip chip bonder shown in Figure 36".

100: Installation device

110:Framework

120: Installation table

131:X support platform

132: Guide

141: Main beam

142: Feet

143: Sliding parts

150: Install the head

152: Drive Department

161: Linear scale

162: Head detection

171: Benchmark rod (benchmark component)

171a:Key

172,173: Supporting components

173a: Groove

174: Detection head

200: Workpiece

Claims (16)

A mounting device comprises: a frame, which can be mounted on a mounting platform; a beam, which extends in a first direction in a manner that crosses the frame, and whose two ends are supported on the frame so as to be freely movable in a second direction; a mounting head, which is supported on the beam so as to be freely movable in the first direction; a reference member, which is separated from the beam, extends in the first direction, and whose two ends are supported; a detection head, which is provided on the mounting head in a manner that it is opposite to the reference member, and the detection head is configured to detect the positional relationship between the detection head and the reference member. The installation device as described in claim 1, wherein it further comprises a pair of supporting members for supporting the aforementioned reference member, one of the aforementioned supporting members fixes one end of the aforementioned reference member, and the other of the aforementioned supporting members is configured to support the other end of the aforementioned reference member so as to be movable. The mounting device as described in claim 1, wherein the detection head has: a displacement sensor located above the reference member and used to measure the distance between the detection head and the reference member. The mounting device as described in claim 3, wherein it further has a detection head, which has: a displacement sensor located on the side of the aforementioned reference member and used to measure the distance between the aforementioned reference member and the aforementioned reference member. The mounting device as described in claim 1, wherein the aforementioned reference member has a linear scale, and the aforementioned detection head has a sensor for reading the scale of the aforementioned linear scale. The mounting device as described in claim 5, wherein the reference member comprises: a first linear scale for detecting the position in the first direction, a second linear scale for detecting the position in the second direction, and the detection head comprises: a first sensor for reading the scale in a vertical direction relative to the first linear scale; a second sensor for reading the scale in a tilted direction relative to the first linear scale; and a third sensor for reading the scale in a vertical direction relative to the second linear scale. The mounting device as described in claim 5, wherein the aforementioned reference member is located below the aforementioned beam, and the aforementioned detection head is provided on the aforementioned mounting head in a manner opposite to the upper surface of the aforementioned reference member. The mounting device as recited in claim 5, wherein the reference member is located on the side opposite to the mounting head across the beam, and the detection head is disposed on the mounting head in a manner opposite to the side of the reference member. The mounting device as recited in claim 5 further comprises: A second reference member separated from the beam, extending in the first direction, and supported at both ends; A second detection head is disposed on the mounting head in a manner facing the second reference member. The mounting device as recited in claim 9, wherein the aforementioned reference member is located below the aforementioned beam, the aforementioned detection head is disposed on the aforementioned mounting head in a manner facing the upper surface of the aforementioned reference member, the aforementioned second reference member is located above the aforementioned beam, and the aforementioned second detection head is disposed on the aforementioned mounting head in a manner facing the lower surface of the aforementioned second reference member. The mounting device as recited in claim 9, wherein the aforementioned reference member is located below the aforementioned beam, the aforementioned detection head is disposed on the aforementioned mounting head in a manner facing the lower surface of the aforementioned reference member, the aforementioned second reference member is located above the aforementioned beam, and the aforementioned second detection head is disposed on the aforementioned mounting head in a manner facing the lower surface of the aforementioned second reference member. The mounting device as recited in claim 9, wherein the aforementioned reference member is located below the aforementioned beam, the aforementioned detection head is disposed on the aforementioned mounting head in a manner facing the side of the aforementioned reference member, the aforementioned second reference member is located above the aforementioned beam, and the aforementioned second detection head is disposed on the aforementioned mounting head in a manner facing the side of the aforementioned second reference member. The mounting device as recited in claim 1, further comprising: A pair of supporting members for supporting the aforementioned reference member; A second reference member extending in the aforementioned second direction and disposed on the aforementioned frame; A second detection head disposed on the aforementioned supporting member in a manner opposite to the aforementioned second reference member, The aforementioned second detection head is configured to detect the positional relationship with the aforementioned second reference member. The installation device as described in claim 2, wherein one of the aforementioned supporting members is configured to fix one end of the aforementioned reference member to be rotatable. A method for manufacturing a semiconductor device includes a loading step and a picking step, wherein the loading step is to load a substrate into a mounting device, wherein the mounting device includes: a frame for mounting a mounting table; a beam extending in a first direction in a manner that crosses over the frame, and supported on the frame at both ends so as to be freely movable in a second direction; a mounting head supported by the beam so as to be freely movable in the first direction; a reference member separated from the beam and extending in the first direction and supported at both ends; a detection head disposed on the mounting head in a manner opposite to the reference member, wherein the detection head is configured to detect a positional relationship with the reference member; and the picking step is to pick up a crystal grain from a wafer held by a wafer ring. The method for manufacturing a semiconductor device as described in claim 15 further comprises: a reversal step, in which the picked-up die is reversed; a loading step, in which the inverted die is picked up by the mounting head and loaded on the substrate.

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