KR20130117191A - Transfering device of processing unit - Google Patents

Abstract

The present invention relates to a work unit transfer apparatus of a semiconductor process that can improve the precision and reliability of the transfer process for transferring the work unit used in the semiconductor process to any position on the x-y plane. According to the work unit conveying apparatus according to the present invention, the position error that may be caused by the thermal expansion of the component by the heat generated in the drive unit of each transfer line and the position error of both ends of the specific transfer line connected across the parallel provided feed line Since the position error is minimized, it is possible to minimize problems such as twisting of the transfer line, which may be caused by the position error of each end during the transfer of the specific transfer line.

Description

Work unit feeder {TRANSFERING DEVICE OF PROCESSING UNIT}

The present invention relates to a work unit transfer device. In more detail, the present invention relates to a work unit transfer apparatus of a semiconductor process that can improve the precision and reliability of the transfer process for transferring the work unit used in the semiconductor process to any position on the x-y plane.

For semiconductor equipment, various work units may be used for each process. As an example of a semiconductor device, a bonding apparatus for bonding a semiconductor chip onto a substrate will be described as an example.

A bonding apparatus for bonding a semiconductor chip to a substrate or the like may include at least one bonding unit as an example of a work unit. The bonding units are respectively transported to predetermined positions of the bonding apparatus, and may pick up or bond semiconductor chips.

A work unit such as a bonding unit may be transported to a predetermined position on the x-y plane by a gantry type transfer device.

Therefore, by connecting both ends of the first transfer line, which is mounted to be transportable in its longitudinal direction, with a specific work unit vertically to a pair of parallel and fixed second transfer lines, the mover is parallel and fixed. By means of the transfer by the transfer line it is possible to transfer a specific work unit to any position on the xy plane.

The drive unit driven by the mounting unit on which the work unit of each transfer line is mounted and the electromagnet for driving the mover to which the transfer line is connected may generate heat in the driving process.

The driving unit or driving means of each transfer line may be a ball screw or an electromagnet, or the like, and when the process of transferring at high speed is repeated, heat may be generated in the parts constituting each transfer line. The thermal expansion may reduce the precision of the transfer position.

That is, the mover for mounting the first transfer line to the second transfer line is the portion where the heat generated in the transfer process by the second transfer line is most transmitted, and the problem of thermal expansion of the mover due to the generated heat is the first. It may cause position error on both ends of the transfer line.

Similarly, the work part mounted on the first transfer line may also cause the same problem because thermal expansion occurs due to heat generated during the transfer on the second transfer line.

According to the trend of miniaturization of the size of the semiconductor chip, the positional error of the mover caused by problems such as thermal expansion of the component causes the bonding position error and the bonding position error causes the bonding failure.

This problem requires the controller to accurately determine the position in the x-axis direction and the y-axis direction of the work unit in order to control each transfer line constituting the work unit transport apparatus.

That is, a sensing unit for accurately determining the position of the work unit and the work unit may be provided in the work unit or the mover. However, when the mover or the like causes thermal deformation such as thermal expansion, deviation of the position of the sensing unit may occur.

When the position of the sensing unit for determining the position is changed, it is impossible to accurately determine the position in the x-axis direction and the position in the y-axis direction of the work unit, and the position in the x-axis direction and the y-axis direction of such a work unit is impossible. By controlling the driving unit of each of the transfer line based on the driving of the driving unit based on the error information, the error of the transferred work unit can be further amplified.

The position information of the work unit used as the control information to change the position of the work unit will not be accurate, and it may be difficult to accurately transfer the work unit to the new position through the position information.

Therefore, there is a need for a method of minimizing such errors by minimizing such errors.

An object of the present invention is to provide a work unit transport apparatus for a semiconductor process that can improve the precision and reliability of a transport process for transporting a work unit used in a semiconductor process to an arbitrary position on an x-y plane.

In order to solve the above problems, a work unit provided with a work unit is mounted, a first transport line provided to transport the work unit, a mover is connected to both ends of the first transport line is mounted, the mover A pair of second transfer lines arranged in parallel with the first transfer line in a direction perpendicular to the transfer direction of the first transfer line, both ends of the first transfer line, and each second transfer Positioning means provided on the mover of the line, a linear scale provided along the longitudinal direction of the second conveying line for measuring the position of the conveying direction of the second conveying line of the work unit, and corresponding to the positioning means Is provided at a position to detect the position of the conveying direction of the second conveying line of the work unit with respect to the linear scale during conveyance of the mover. It provides a work unit transport apparatus comprising a; scale sensing unit provided in the pupil.

In this case, the positioning means and the scale detector may be located in the widthwise center region of the first transfer line.

In addition, the positioning means and the scale sensing unit may be provided near one end of the work unit in the width direction both ends of the first transfer line.

Both ends of the first transfer line may be mounted to the mover of the second transfer line via a bracket member.

Here, the positioning means may be a positioning hole provided in the bracket member and the mover of the second transfer line and a positioning pin inserted together in the positioning hole.

The positioning protrusion is provided at one end of the work unit in one of the width direction ends of the first transfer line, and the width of the positioning hole is greater than the width of the positioning protrusion to position the position within the positioning hole. You can set the position of the crystal projections.

In this case, the positioning means may be a positioning protrusion provided on one side and a positioning hole provided on the other side of the movable member of the bracket member and the second transfer line.

In addition, each of the second transfer lines may include a guide rail to which the mover is mounted to be transported and a driving unit to transfer the mover along the guide rail.

In addition, the driving unit of the second transfer line may include a plurality of magnets provided in a line provided on the upper surface of the stator along the electromagnet provided in the mover and the longitudinal direction of the guide rail.

Here, the second transfer line further includes a stator to which the guide rail is mounted, wherein the linear scale is provided on the side of the stator, and the scale sensing unit is provided at a height corresponding to the scale sensing unit. It may be provided on the lower side.

In this case, one end is mounted on the side of the scale and the other end is bent downward may be mounted on the other end of the extension member extending to the side of the stator.

In addition, the bracket member has a width corresponding to the width of the second transfer line, the positioning means may be provided in the widthwise center region of the bracket member.

In addition, a plurality of the first transfer lines may be provided in parallel, and may be independently transferred by the second transfer line.

Here, the work unit of the first transfer line may include at least one or more of the bonding unit and the vision unit constituting the bonding apparatus.

In this case, the position of the positioning means with respect to the linear scale provided in the second conveying line is measured by the scale detecting unit, so that the conveying direction position of the second conveying line of the work unit provided in the first conveying line. The control unit may further include determining.

In addition, the control unit reflects the measured position of the positioning means by the scale sensing unit and the distance deviation of the direction of the positioning means and the second transfer line of the work unit, the second of the work unit The position of the conveying direction of the conveying line can be determined.

Here, each of the second transfer line has a guide rail to which the mover is mounted so as to be transported, and a driving unit for transferring the work part and the mover along the guide rail, and the controller is provided at both ends of the first transfer line. The driving unit of the pair of movers may be controlled such that the position of the second transfer line of the pair of positioning means is the same.

In this case, a positioning projection is provided on the upper surface of the mover, a positioning hole into which the positioning projection is inserted is provided in the bracket, and the positioning projection inserted into the positioning hole is fastening member in at least two directions. It can be fastened by.

In addition, the fastening member may fix the positioning protrusions inserted into the respective positioning holes in a direction parallel to the conveying direction of the first conveying line and the second conveying line.

And, the first transfer line is a positioning pin which is inserted together in the positioning hole provided in the working portion and the first transfer line to mount the working portion at a predetermined position of the first transfer line, the first It is provided in the first conveying line along the conveying direction of the conveying line, the linear scale for measuring the position of the conveying direction of the first conveying line of the work unit, and is provided at a position corresponding to the positioning pin, It may include a scale detecting unit provided in the mover to detect the position of the transfer direction of the first transfer line of the work unit with respect to the linear scale during the transfer of the first transfer line of the negative.

Here, the positioning pin and the work unit may be disposed in a plane perpendicular to the conveying direction of the first conveying line.

In this case, by measuring the position of the positioning pin provided in the work unit with respect to the linear scale provided in the first transfer line through a scale sensing unit provided in the work unit, It may further include a control unit for determining the transport direction position.

In addition, the control unit may determine the measured position of the positioning pin provided on the work unit as the transport direction position of the second transfer line of the work unit by the scale sensing unit provided on the work unit.

According to the work unit transport apparatus according to the present invention, it is possible to minimize the position error that can be caused by the thermal expansion of the component by the heat generated in the drive of each transfer line.

In addition, according to the work unit transport apparatus according to the present invention, it is possible to minimize the position error that can be caused by the thermal expansion of the component by the heat generated in the drive unit of each transfer line, thereby minimizing product defects generated in the semiconductor process can do.

In addition, according to the working unit transport apparatus according to the present invention, since the position error of both ends of the specific transport line connected across the transport line provided in parallel is minimized, the position error of each end in the transport process of the specific transport line It is possible to minimize problems such as torsion of the transfer line which may be caused by.

In addition, according to the transfer unit of the work unit according to the present invention, it is possible to minimize the torsion, etc. that can occur in the transfer process of the transfer line, it is possible to minimize the problems such as failure or interruption of the semiconductor equipment.

1 illustrates a flip chip bonding apparatus to which a work unit conveying apparatus according to the present invention can be applied.
Figure 2 shows a plan view of the main parts of one embodiment of a work unit conveying apparatus according to the present invention.
3 shows a cross-sectional view of the main parts of one embodiment of a work unit conveying device according to the invention.
Figure 4 shows another embodiment of a work unit transfer device according to the present invention.
Figure 5 shows a plan view of another embodiment of a work unit transport apparatus according to the present invention.
6 shows a side view of the work unit conveying apparatus shown in FIG. 5.
Figure 7 shows a plan view of another embodiment of a work unit transport apparatus according to the present invention.
8 shows a side view of the work unit conveying apparatus shown in FIG. 7.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.

1 shows a flip chip bonding device 1 to which a work unit conveying device according to the invention can be applied.

The work unit transport apparatus according to the present invention is a device for transporting work units 1120 and 1130 performing a specific work. The work units 1120 and 1130 may be, for example, bonding units of a semiconductor chip bonding apparatus or vision units for various imaging inspections. In addition, the work units 1120 and 1130 may include a case where a plurality of work units are provided together (for example, a bonding unit and a vision unit) instead of a single work unit.

The work unit transport apparatus according to the present invention may be configured to transport the work units 1120 and 1130 to an arbitrary position on the x-y plane or the x-y-z space. In the flip chip bonding apparatus 1 illustrated in FIG. 1, the bonding unit 1120 and the vision unit 1130 may be transferred together by the transfer apparatus as the work units 1120 and 1130.

The flip chip bonding apparatus 1 forms a separate solder bump on a pad, which is an input / output terminal of a semiconductor chip, and then turns the semiconductor chip upside down, such as a carrier substrate or a circuit tape. The device directly bonds to a circuit pattern.

In the flip chip bonding apparatus 1 according to the present invention, a bonding surface on which a bump electrode (solder bump) is formed is formed by separating and picking up individual flip chips fc from each wafer w supplied from the wafer supply unit 100. The operation of flipping the individual chips so as to be turned on may be performed.

The wafer supply unit 100 may wait for work in a state in which a plurality of wafers w are stacked, and the wafers of the wafer supply unit 100 may be sequentially supplied to the flip chip supply unit 200.

The wafer supply unit 100 may include a guide unit 120 for guiding a wafer to the flip chip supply unit 200. The guide means 120 serves to guide the transfer of the wafer transferred by a separate driving means (not shown).

The flip chip supply unit 200 may separate the flip chip fc from the wafer w supplied from the wafer supply unit 100 and provide the flip chip fc to the work units 1120 and 1130 described later.

The flip chip supply unit 200 includes an ejector (not shown) for ejecting each flip chip from a wafer (w) and a flip chip (fc), which is priced and separated by the ejector, as the work unit. It may include a flip unit (210 (1), 210 (2)) to rotate to pick up.

The flip units 210 (1) and 210 (2) may have a picker structure capable of a pick-up operation by suction and a rotation operation of inverting the upper and lower surfaces of the chip. The rotation direction of the flip unit 210 or the like may be variously modified.

The wafer onloader 101 has a structure for supporting each wafer with the surface of the wafer exposed.

The wafer w composed of a plurality of flip chips fc may be in a state in which an adhesive tape is attached to a lower portion while being diced. Each flip chip fc may be in a state in which a bottom surface of a bump electrode (solder bump) or a chip provided with a contact point upward.

Therefore, the ejector (not shown) is provided under the wafer, each flip chip (fc) constituting the wafer (w) can be separated from the wafer (w) by the blow of the ejector, each separated The flip chip fc may be rotated by the flip units 210 (1) and 210 (2) positioned on the wafer so that the bottom surface of the chip provided with the bump electrodes (solder bumps) or the contacts faces downward.

The flip chips fc rotated by the flip units 210 (1) and 210 (2) may be picked up by the bonding unit 1120 as a work unit waiting thereon.

The flip chip bonding apparatus 1 shown in FIG. 1 includes bonding units 1120 (1) and 1120 (2) as a pair of work units, and also a pair of vision units 1130 (1) as work units. , 1130 (2) may be provided in a pair of working parts 1110 (1) and 1110 (2) together with the bonding unit.

This will be described later. Each work unit 1120, 1130 can be moved to an arbitrary position on the xy plane or xyz space by the transfer apparatus according to the present invention (the transfer in the z-axis direction can be implemented by lifting and lowering operation by a working part or a bonding unit). Can be transported. I'll put more details later.

Since the flip unit 210 picks up and rotates the chip, the bonding unit rotates so that the bonding surface faces downward and the upper surface of the chip faces upward, so that the bonding unit 1120 adsorbs the upper surface of the chip facing upward to bump electrodes ( It is possible to maintain the pick-up state such that the lower surface of the chip exposed with solder bumps) is directed downward.

The bonding unit 1120 picks up a bonding target flip chip from the flip chip supply unit 200 by a work unit transporting apparatus according to the present invention, and includes a flux immersion unit 400 and a flip chip bonding unit 500 described later. Can be transferred to.

The work units 1120 and 1130 may be driven to return to the flip chip supply unit 200 by the transfer unit after a pick up process, an immersion process, and a bonding process of a specific flip chip are performed along the transfer path of the transfer apparatus. .

Each work unit 1120, 1130 is mounted on a pair of first transfer lines 1100 (1, 1100 (2)) capable of transferring the work units 1120, 1130 in the y-axis direction. 1 Both ends of each of the transfer lines 1100 (1) and 1100 (2) have a pair of second to transfer the respective first transfer lines 1100 (1) and 1100 (2) in the x-axis direction. It may be mounted on the transfer line 1300 (1), 1300 (2).

In the flip chip bonding apparatus illustrated in FIG. 1, the work units 1120 and 1130 are illustrated as being mounted on a pair of first transfer units different from each other, but the number of first transfer units may increase or decrease. Can be.

That is, each of the first transfer lines 1100 (1) and 1100 (2) and the second transfer lines 1300 (1) and 1300 (2) have respective overlapped gantry structures. Work units 1110 (1) and 1110 (2) equipped with 1120 and 1130 may be configured to independently transport to any position on the xy plane if no physical interference occurs.

The transfer lines 1100 and 1300 transfer the bonding units 1120 (1 and 1120 (2)) that pick up the flip chips from the flip chip supply unit 200 to the flux immersion unit 400. Flux immersion unit 400 (1, 400 (2)) shown in Figure 1 may also be provided with a pair corresponding to the number of work units.

The flux immersion parts 400 (1) and 400 (2) may provide a flux for bonding by immersing the lower surface of the flip chip.

The flux immersing portions 400 (1) and 400 (2) may include flux receivers 410 (1) and 410 (2) in which flux is accommodated and flux blades 420 for flattening the surface of the flux after flux immersion of the flip chip. (1), 420 (2)), and the like.

The bonding units 1120 (1) and 1120 (2) are transferred to the flux receiver 410 by the transfer lines 1100 and 1300 while picking up flip chips, and then the bonding units 1120 (1), 1120 (2)) may descend to perform the immersion process.

The bonding units 1120 (1) and 1120 (2) may include the flip chip supply unit 200, the flux immersion unit 400, chip vision units 910 (1) and 910 (2) and flips described below. At least one of the chip bonding units 500 may be configured to be liftable in the z-axis direction.

That is, in the embodiment shown in Figure 1, lifting the work unit 1120, 1130 in the z-axis direction is provided with a lifting function in the work unit itself, or the work unit 1110 equipped with the work unit 1120, 1130 (1), 1120 (2) may be implemented in a way that the lifting function is provided.

1, the bonding units 1120 (1) and 1120 (2) are immersed on the bottom surface of the flip chip when transferred to the flux immersion unit 400 by the transfer lines 1100 and 1300. Can have a structure that can be elevated so that each operation can be performed.

The bonding units 1120 (1) and 1120 (2) on which the flip chip on which the flux immersion is completed are adsorbed may be transferred in the direction of the flip chip bonding unit 500 to be described later by the transfer lines 1100 and 1300.

The flip chip is picked up, rotated, and picked up by the flip chip supply unit 200, and the bottom chip is immersed in the flux immersing unit 400. That is, even though each process is precisely controlled, since the physical position is continuously changed, the flip chip may be in a distorted or pushed-out state.

Since these physical errors cannot be completely prevented, it is necessary to correct or eliminate these errors in the bonding process. This is because bump electrodes (solder bumps) or contacts on the bottom surface of the flip chip are minute in size, and thus, even if the flip chip is slightly changed, accurate bonding cannot be guaranteed.

Accordingly, the flip chip bonding apparatus 1 according to the present invention may include a vision unit for photographing the flip chip or the substrate to which the flip chip is bonded. The vision unit may include vision units 910 and 1130 for at least one image pickup.

In the embodiment illustrated in FIG. 1, the vision unit faces the bottom surface of the flip chip immersed in the flux immersion unit 400 in addition to the vision units 1130 (1) and 1130 (2) as work units transferred by a transfer line. It may include a pair of chip vision units (910 (1), 910 (2)) disposed in the upward direction for imaging.

In the embodiment shown in FIG. 1, the chip vision units 910 (1) and 910 (2) are bonded to the bonding units 1120 (1) and 1120 (2) to capture the bottom surface of the immersed flip chip. The flip chip may be disposed on a path through the flux immersion unit 400.

As shown in FIG. 1, the chip vision units 910 (1) and 910 (2) are upward-looking to capture a lower surface of the flip chip immersed in the flux immersion unit 400. Can be deployed.

In addition, the chip vision units 910 (1) and 910 (2) may image at least two or more points of the lower surface of the flip chip being transferred. It is also possible to grasp the position of each flip chip from the image by one-point imaging (one-shot imaging), but imaging two or more regions can extract more accurate images. In this case, in order to grasp the degree of twisting (or rotation) together with the amount of displacement in the specific direction of the flip chip, it is necessary to image two or more areas.

In the chip vision units 910 (1) and 910 (2), the flip chip immersed in the flux is transferred to the flip chip bonding unit 500.

The flip chip bonding unit 500 may include a bonding table that fixes and mounts a bonding target substrate bs transferred from a substrate onloader (not shown) along the guide 113.

The bonding target substrate bs transferred to the bonding table is a preliminary alignment process by the alignment vision unit 12 provided in the separate preliminary alignment unit 114, that is, the substrate circuit pattern, that is, the transfer of each bonding position. Inspection can be performed.

The bonding target substrate bs transferred from the substrate onloader (not shown) along the guide 113 is transferred in the x-axis direction as shown in FIG. 1, and the alignment vision unit 12 has a gantry structure. It can be conveyed by the transfer line (11, 13) of the transfer to a predetermined position on the xy plane, the position information of the transfer target bonding substrate is collected in advance by the imaging method as a reference data of the bonding process in the bonding table Can be used.

Each of the substrates bs should be accurately seated in the bonding region sp of the bonding table, but the substrate is separated from the bonding region sp in the transfer process or the substrate is twisted in the bonding region sp. The substrate may leave the bonding region sp.

When each substrate leaves the respective bonding region sp, the accuracy of the bonding process of the flip chip immersed in the flux cannot be guaranteed, and a poor electrical connection may occur.

As described above, in order to reflect the positional deviation of the flip chip, which may be caused in the pick-up process or the immersion process of the flip chip, in the bonding process, the chip vision units 910 (1) and 910 (2) are provided with flips. Similarly to imaging the bottom surface of the chip and collecting the position information of the flip chip, the flip chip bonding apparatus 1 according to the present invention is transported by a transfer line to accurately determine the seating position of the substrate to be bonded (bs). As examples of the unit, the above-described vision units 1130 (1) and 1130 (2) can be used.

The vision units 1130 (1) and 1130 (2) are directed downward to photograph a substrate seated in a bonding area sp of the bonding table in order to bond flip chips immersed in the flux immersion unit 400. (down-looking) can be deployed.

The vision units 1130 (1) and 1130 (2) as the work unit are transferred by the transfer lines 1100 and 1300 to check the alignment of the bonding target substrates bs which are seated on the bonding table. In the bonding process, the positional error of the substrate may be reflected.

Accordingly, the chip vision units 910 (1) and 910 (2) capture an image for determining a position error of the flip chip to be bonded by capturing the bottom surface of the flip chip, and the vision unit 1130 (1). 1130 (2) may capture an image for determining the position of the substrate, that is, the bonding position of the chip, in the mounting state of the substrate mounted on the bonding area sp of the bonding table, respectively.

Like the chip vision units 910 (1) and 910 (2), the vision units 1130 (1) and 1130 (2) may also be placed in the mounting state of the substrate mounted on the bonding area sp of the bonding table. In order to accurately determine the bonding position of the chip on the substrate, at least two or more regions of each bonding region sp of the substrate may be captured.

In addition, the vision units 1130 (1) and 1130 (2) may be used for image capturing to determine that a defect has occurred in the bonding process by capturing a substrate on which bonding is completed, in addition to photographing a substrate to be bonded. In this case, it is possible to determine whether a defect occurs by determining the position of the chip with respect to the substrate.

Control unit of the flip chip bonding apparatus 1 according to the present invention based on the image captured by the chip vision unit (910 (1), 910 (2)) and the vision unit (1130 (1), 1130 (2)) May precisely control the positions of the work units 1120 and 1130 or the bonding table.

In addition, an error such as twisting (rotation) of the chip or the substrate configures the bonding head to be rotatable and rotates the bonding units 1320 (1) and 1320 (2) so that the bonding direction (θ direction) of the chip is corrected. It can be removed by the method.

As described above, the vision units 1130 (1) and 1130 (2) may be mounted on the transfer lines 1100 and 1300 as work units and transferred to any position on the x-y plane.

As such, the flip chip bonding apparatus 1 according to the present invention may transfer the bonding unit or the vision unit to an arbitrary position on the xy plane by a transfer line having a gantry structure, and to a work unit such as a bonding head unit. With the z-axis lifting function, the work unit can be moved to any position in the xyz space. Such a structure of the transfer line may cause a problem such as a position error due to thermal expansion or a twist of the transfer line according to the position error as described above, and the following work can solve the problems described above with reference to FIG. The unit transfer apparatus will be described in detail.

2 shows a plan view of the main parts of one embodiment of the work unit transport device 2 according to the invention, and FIG. 3 shows a cross-sectional view of the main parts of one embodiment of the work unit transport device 2 according to the invention. do.

The work unit transport apparatus according to the present invention is equipped with a work unit equipped with a work unit, and movable both ends of the first transport line 1100 and the first transport line 1100 provided to transport the work unit, respectively. A pair of chairs 1310 are mounted and arranged in parallel in a direction perpendicular to the first transport line in order to transport the mover 1310 in a direction perpendicular to the transport direction of the first transport line 1100. Positioning means provided at the second transfer line 1300 of the first transfer line 1300, at both ends of the first transfer line 1100, and at the mover 1310 of each second transfer line 1300, and the second transfer line of the work unit. In order to measure the position in the conveying direction of the 1300, a linear scale 1380 provided along the longitudinal direction of the second conveying line 1300 and a position corresponding to the positioning means, The operation on the linear scale at the time of transfer 1310). It may include a scale detecting unit 1390 is provided on the movable element in order to detect a second transfer position of the transfer line of the unit.

The first transfer line 1100 is provided to transfer the work unit 1120 in a predetermined direction (direction parallel to the y-axis, the transfer direction of the first transfer line). The work unit 1100 may be any one of a unit for performing a specific process in a semiconductor manufacturing process. As described above, the work unit may be a bonding unit and / or a vision unit.

The work unit conveying apparatus 2 according to the present invention is a pair for conveying the first conveying line 1100 in a predetermined direction (direction parallel to the x-axis or perpendicular to the conveying direction of the first conveying line). The second parallel transfer line 1300 may be provided.

The second transfer line 1300 is provided at a position in which the pair is fixed in parallel (only one second transfer line is shown in relation to the ground), and both ends 1100e of the first transfer line 1100 are mounted, respectively. The first transfer line may be transported in a direction parallel to the x-axis.

Thus, the work unit can be transported to any position on the x-y plane.

In detail, the second transfer line 1300 may include a mover 1310 to which both ends 1100e of the first transfer line 1100 are connected, and a guide rail to which the mover 1310 may be transported. 1320, a stator 1370 on which the guide rails 1320 are mounted, and a driving unit for transferring the mover 1310 along the guide rails 1320, and may be provided in parallel with each other.

The driving unit of the second transfer line includes a plurality of magnets provided in a row provided on the upper surface of the stator 1370 along the length direction of the electromagnet 1340 and the guide rail 1320 provided in the mover 1310 ( 1350). A separate magnetic plate 1360 may be further provided below the plurality of magnets 1350.

By selectively operating the electromagnet constituting the drive unit provided in the mover 1310, it is possible to transfer the mover in the longitudinal direction of the transfer line.

Of course, in addition to the driving unit by the magnetic force, the driving unit may employ a ball screw and a ball screw nut.

In particular, the heat generated during the operation of the electromagnet can thermally expand or thermally deform the mover 1310, such thermal deformation or thermal expansion causes an error when measuring the position of the work unit, It may cause a defect of the semiconductor process. The method for minimizing the error will be described later.

As shown in FIG. 2, the second transfer line 1300 includes a mover 1310 to which one end 1100e1 of the first transfer line 1100 is connected, and the mover 1310 includes the mover 1310. The first transfer line 1100 may be driven in a direction parallel to the x-axis by being driven by a driving unit provided in the second transfer line.

One end 1100e1 of the first transfer line 1100 and the mover 1310 of the second transfer line may be directly connected to each other. As illustrated in FIGS. 2 and 3, a separate bracket member 1200 is provided. It can be mounted by mediation.

That is, a method of fastening one end 1100e1 of the first transfer line 1100 to the bracket member 1200 and mounting the bracket member 1200 to the mover 1310 of the second transfer line 1300. As a result, the first transfer line 1100 may be mounted on the second transfer line 1300.

In the semiconductor process, for example, the bonding process, etc., because the size of the chip is miniaturized, it requires a high degree of precision in the transfer of the bonding unit.

That is, the gantry-type transfer line is configured to be orthogonal to each other, and even if a work unit such as a bonding unit can be transferred to an arbitrary position on the x-y plane, the transfer position must be accurately determined and controlled.

2 and 3 are provided in the second transfer line 1300 along the second transfer line 1300 and the second transfer line of the work unit 1120. Linear scale 1380 for measuring the position of the feed direction (direction parallel to the x-axis) of the 1300, and the second transfer line of the work unit 1120 with respect to the linear scale during the transfer of the mover 1310 It may further include a scale detector 1390 provided in the mover 1310 to detect the position of the transport direction of the (1300).

The scale detector 1390 is preferably provided at a position corresponding to the positioning means. The reason is described later.

The mover 1310 serves as a movable body mounted to the second transfer line 1300 along the transfer direction thereof, and each end 1110e of the first transfer line 1100 is provided as a pair. It may be mounted on the mover 1310 side of the second transfer line (1300).

The mover 1310 may be mounted to the guide rail 1320 to be transportable, and the mover 1310 may be mounted to the guide rail 1320 via the sliding member 1330.

The guide rail 1320 constitutes a lower portion of the second transfer line 1300 and may be mounted to the stator 1370 as a support member for supporting components to be mounted or mounted.

Therefore, the linear scale provided to determine the position of the x-axis direction (the transfer direction of the second transfer line) of the work unit may be provided on the side of the fixed stator 1370 constituting the second transfer line. The scale detecting unit 1390 for detecting the position of the mover 1310 with respect to the linear scale 1380 is provided on the mover 1310 side which is transferred along the transfer direction by the second transfer line. Can be.

As shown in FIG. 3, the linear scale is provided on the side of the stator 1370, and the scale sensing unit 1390 corresponds to the movable member 1310 corresponding to the widthwise center region of the bracket member 1200. It may be provided at the lower side of the side).

In addition, the positioning means of the work unit transport apparatus according to the present invention shown in Figures 2 and 3 is the positioning provided on the movable member 1310 of the bracket member 1200 and the second transfer line 1300 It may be a positioning pin (p) is inserted into the hole and the positioning hole (not shown).

 As described above, as shown in FIGS. 2 and 3, the positioning holes and the positioning pins p are preferably provided at positions corresponding to the scale sensing unit 1390. The positioning pin p is a thermal expansion amount of the mover, etc. when the positioning pin is fastened around the positioning pin in addition to the positioning function for accurately mounting the first transfer line 1100 to the second transfer line 1300. It can be used as the lowest point or reference position of.

2 and 3, when the fastening position of the mover 1310 and the bracket member 1200 is determined by the insertion of the positioning pin p, the positioning pin p is in the vicinity of the positioning pin p. It can be fixed and fastened to a position determined by a plurality of fastening members (b) provided in.

When the position of the first conveying line 1100 and the second conveying line 1300 is determined by the positioning pin p and the fastening member b, and then fixed to be mounted, the heat is generated by the driving unit. Even if the mover or the like is thermally expanded, the thermal expansion rate near the positioning pin p is the lowest, or the thermal expansion rate is at least near the positioning pin p so that the expansion amount is symmetric about the positioning pin p. Can be seen

The reason that the thermal expansion coefficient near the positioning pin p is the lowest is that the thermal expansion rate of the region physically constrained by the positioning pin or the fastening member is relatively higher than that of other regions not fastened by the fastening member or the like. Because it will be low.

Therefore, the work unit transport apparatus according to the present invention eliminates the occurrence of an error due to the expansion of the connection portion 1310 due to the heat generated from the driving portion and / or a position error due to the difference in thermal expansion rate or thermal conductivity of the connection portion and the bracket member. In order to minimize, the mounting position of the scale detector 1390 may be determined as a position corresponding to the positioning means, that is, the positioning pin.

As shown in FIG. 2, the positioning pin p and the scale detector 1390 may be disposed in a straight line such that the center thereof penetrates by a straight line parallel to the y axis. That is, it may be disposed at a position having the same coordinate value in the x-axis direction.

In summary, the positioning pins (p) are inserted into the positioning holes after the positioning holes are provided at predetermined positions of the respective transfer lines to confirm the correct mounting position when the two transfer lines to be mounted or fastened are mounted. The position between the two transfer lines can be easily determined, and the scale detection unit is provided at a position corresponding to the positioning pin (p), thereby minimizing the position error due to thermal expansion due to heat generated from the driving unit.

In addition, the first and second transfer lines 1100 and 1300 used in the present invention are driven by a linear motor, and the linear motor includes a stator 1370 and a mover 1310. The stator 1370 includes a magnet 1350, The permanent magnet is provided with an electromagnet 1340 in the mover 1310, and when a current is supplied to the electromagnet 1340, a thrust is generated between the electromagnet 1340 and the plurality of magnets 1350, respectively. The mover 1310 may be transferred to a designated position.

The position control method of the linear motor composed of the stator 1370 and the mover 1310 will be described in detail. In order to stop the mover from the start position on the stator 1370 to the target position, the mover 1310 is first moved. ) And a scale detector 1390 capable of detecting the current position of the mover 1310 on the stator 1370 reads the scale on the linear scale 1380 and transmits the detection signal to the controller in real time. The mover 1310 is decelerated by the detection signal at the break point in front of the target position, that is, based on the current position of the mover 1310 detected by the linear scale 1380. Stop at the target position. Accordingly, the position of the first transfer line 1100 connected to the mover 1310 is determined, and the position of the work unit 1120 installed in the first transfer line 1100 is determined.

As described above, since the positioning pin p becomes the thermal expansion reference position of the mover 1310, the scale detecting unit 1390 is installed at a position spaced apart from the positioning pin p in the x-axis direction. Even if the mover 1310 stops at the designated position according to the detection signal of the detector 1390, the work unit 1120 does not move to the designated position due to a position value at which one side expansion amount of the mover 1310 is not reflected. Was generated.

In addition, as mentioned above, since the present invention includes the positioning pin p and the scale sensing unit 1390 in a straight line, the position detection signal of the mover 1310 of the scale sensing unit 1390 is determined by the positioning pin p. ) And the same as the position of the first transfer line 1100, the following description of detecting the position of the positioning pin (p) further detects the position of the first transfer line (1100) It can be interpreted in the same sense as detecting the x-axis position of the work unit 1120 installed in the line 1100.

2 and 3, the mover 1310 of the first transfer line 1100 and the second transfer line 1300 may be coupled through a bracket member 1200. The positioning holes are provided in the bracket member 1200 and the mover 1310 to which the first transfer line is fastened, respectively, and are located in the positioning holes formed in the bracket member 1200 and the mover 1310. By inserting a decision pin (p) it can be mounted to the first transfer line 1100 in the set position of the second transfer line (1300).

When the fastening position of the first transfer line 1100 and the second transfer line 1300 is determined for the positioning pin and the positioning hole, the first transfer line 1100 and the first transfer line 1100 may be connected to each other by a fastening member (b). The second transfer line 1300 may be fixed and fastened.

As described above, the positioning pin p may have the lowest thermal expansion potential, and may have a uniform thermal expansion rate at the periphery thereof. In addition, the positioning pin p is not used only when assembling or fastening the first transfer line 1100 and the second transfer line 1300, and the linear scale 1380 and the scale detector 1390 are not used. It can be used as a reference position to determine the relative position of each transfer line by.

That is, since the position deviation of the positioning pin p and the distance deviation dx in the x-axis direction of the work unit will be constant, when the positioning pin p measures the position on the linear scale 1380, It is possible to determine the position of the x-axis direction (position of the conveying direction of the second conveying line) of the work unit.

When the positioning pin (p) is determined as the reference position of the transfer direction of the second transfer line 1300, and the scale sensing unit is installed at a position corresponding to the transfer direction of the second transfer line of the positioning pin (p) Positioning pins (p) and a scale sensing unit which is used as a reference position for measuring the transfer direction position of the second transfer line 1300 of the work unit 1120 by thermal deformation of the mover 1310 ( Since the distance error between the 1390 may be eliminated or minimized, the measurement error of the position of the work unit 1120 by the scale detector 1390 may also be minimized.

Therefore, the control unit of the work unit transfer device according to the present invention is to adjust the position of the positioning pin (p) relative to the linear scale 1380 provided in the second transfer line 1300 to the scale detection unit 1390. By measuring through, it is possible to determine the position of the conveying direction of the second conveying line 1300 of the work unit 1120 provided in the first conveying line, specifically, the control unit by the scale detecting unit 1390 The position measured in the feed direction of the second transfer line of the positioning pin p and the distance deviation dx of the positioning pin p and the transfer direction 1300 of the second transfer line 1300 of the work unit 1120. ), The position of the conveying direction of the second conveying line of the work unit 1120 can be determined.

In addition, since the position of the positioning pin (p) may be the position of the transfer direction of each transfer line of the work unit for grasping the position of the work unit, it can be used as a detection signal for the control of the controller, When the control unit controls the drive unit of each transfer line to change the position of the work unit, it can determine the reference position as the position of the detected positioning pin.

That is, the position on the x-y plane of the positioning pin p may control each driving unit so that the positioning pin p may be transferred to a new position when the driving unit is driven by the control unit.

As described above, the positioning pin is located near the lowest thermal expansion rate due to thermal expansion. In addition, if the scale detection unit is provided at a position corresponding to the positioning pin, the position of the positioning pin can be measured without error in the region with the smallest thermal expansion.

The position of the positioning pin p or the positioning hole may be a widthwise center region of the first transfer line 1100. Alternatively, when the widthwise center of the bracket coincides with the widthwise center of the first transfer line 1100, the position of the positioning pin p or the positioning hole may be a widthwise center area of the bracket. .

As shown in FIG. 2, when the width of the scale detecting unit 1390 is larger than the diameter of the positioning pin p, the center of the positioning pin p and the center of the scale detecting unit 1390 are shown. The scale sensing unit can be mounted to be disposed on the same straight line as the y axis.

Therefore, when the positioning pin is employed and its position is set to the widthwise center region of the first transfer line 1100 (or bracket), the position on the linear scale sensed by the scale detecting unit 1390. Will be the position of the positioning pin (p), and the position in the direction of the second transfer line of the work unit 1120 reflects the distance deviation (dx) from the positioning pin to minimize the error due to thermal deformation. Can be judged.

Accordingly, the control unit of the work unit transport apparatus according to the present invention is a pair of the movable member 1310 so that the transport direction position of the second transport line of the pair of positioning pins provided on both ends of the first transport line are the same. When controlling the driving unit of), the twisting phenomenon of the transfer line, which may occur together with the position measurement error problem of the work unit due to thermal deformation, may also be caused by the position error of each mover. It can also be minimized.

As shown in FIG. 3, the linear scale 1380 is configured to allow the scale detector 1390 to easily detect the position of the linear scale 1380 when the mover 1310 is transferred. It may be provided at a height corresponding to the sensing unit 1390.

Here, one end of the scale sensing unit 1390 is mounted on the side of the mover 1310 so that the linear scale 1380 may be mounted at a height corresponding to the scale sensing unit 1390. It may be bent at a height corresponding to each other by a method of being bent and mounted at the other end of the extension member 1395 extending to the side of the stator 1370.

Therefore, the linear scale 1390 is provided on the side of the stator 1370 of the second transfer line 1300 in a fixed position, and the scale detector 1390 provided below the side of the mover 1310 is a linear scale. The position of the work unit 1120 provided in the first transfer line may be detected by detecting the transfer position.

Figure 4 shows another embodiment of a work unit transfer device according to the present invention.

The description with reference to Figs. 1 to 3 will be omitted. The work unit transport apparatus according to the present invention illustrated in FIG. 4 is provided with a linear scale on the first transport line 1100 on which the work unit is mounted, unlike the work unit transport apparatus illustrated in FIGS. 2 and 3. An example in which a scale sensing unit is provided in a work unit is illustrated.

The first transfer line is similar to the second transfer line, in order to mount the work unit 1110 at a predetermined position of the first transfer line 1100, and the work unit 1110 and the first transfer line ( Positioning pins (p2) inserted together in the positioning holes provided in the 1100, provided in the first transfer line 1100 along the transfer direction of the first transfer line 1100, the work unit 1110 A linear scale 1180 for measuring the position in the transport direction of the first transport line 1100 of the first transport line 1100 and a position corresponding to the positioning pin p2, and the first transport line of the work unit 1110 ( Scale detection provided in the work unit 1100 to detect a transfer direction position of the first transfer line 1100 of the work unit 1100 with respect to the linear scale 1100 in the transfer direction of the 1100. A portion 1190 may be included.

That is, the positioning pin p2 is provided on the first transfer line 1100 together with the second transfer line 1300, and the respective scale sensing units 1190 and 1390 are provided on the respective positioning pins p1 and p2. At a position corresponding to the transfer part of the work part and the mover of each transfer line, or the reference position of each transfer line as the control information for driving each work part and the mover. Can be set to the position of each positioning pin.

In addition, the work unit transport apparatus shown in FIG. 4 has a positioning pin to determine a mounting position of the first transport line 1100 of the work unit, similarly to the work unit transport apparatus illustrated in FIGS. 2 and 3. Can be used.

The positioning pin (p2) provided in the first transfer line 1100 is the working part 1110 is provided on the side of the first transfer line 1100, the fastening position of the work part 1110 It may be provided to accurately determine, and like the second conveying line 1300 is provided in the first conveying line along the conveying direction of the first conveying line, the position of the conveying direction of the first conveying line of the work unit The scale detecting unit 1190 may be provided at a position corresponding to the linear scale 1180 for measuring and the y-axis direction (the feeding direction of the first transfer line) of the positioning pin p2.

That is, the positioning pin p2 is located above the second transfer line 1300 shown in FIGS. 2 and 3.

Similar to the toothing pins p and p1, in addition to the means for determining the mounting position for mounting the work portion 1110 to the first transfer line 1100, the y-axis direction (first feed) of the work portion 1110). Can be used as a reference position for determining the position of the line).

Therefore, in order to use the positioning pin p2 of the second transfer line 1300 as a reference position of the work unit 1110 transferred along the first transfer line, a scale sensing unit provided in the work unit Reference numeral 1190 may coincide with the position of the positioning pin p2 in the y-axis direction (the feed direction of the first feed line).

In addition, the work unit 1120 provided in the work part 1110 is the same straight line in the x-axis direction (direction perpendicular to the feed direction of the first feed line) with the positioning pin p2 and the scale sensing means. The centers of the phases may be arranged in a line (or in a vertical plane).

The position of the positioning pin p2 provided in the work unit 1110 with respect to the linear scale provided in the first transfer line 1100 is determined by the scale detecting unit 1190 provided in the work unit 1110. By measuring through, it is possible to determine the position of the conveying direction of the first conveying line of the work unit.

Therefore, when the positioning pin p2 is used as the reference position in the y-axis direction, the position of the work unit 1120 is measured when the position of the positioning pin in the y-axis direction (feeding direction of the first transfer line) is measured. Can be determined without compensation of the distance deviation.

In addition, the position error of the work unit 1120 due to thermal expansion of the first transfer line 1100 may be prevented. That is, when the stator of the first transfer line 1100 thermally expands to one side of the transfer direction on the basis of the positioning pin p2, the work unit 1120 may shift the position even when the mover 1310 is transferred to the designated position. This can prevent the problem that can not be transferred to the designated position.

That is, the position of the reference point in the y-axis direction by the positioning pin p2 may be used as the position information of the work unit without compensation of the distance deviation. As described above, when the positioning pin and the scale sensing unit are set to the corresponding positions as the reference points of the position determination or control of the operation unit in each transfer line, the heat deformation of the moving body caused by the heat generated by the drive unit of the transfer line Nevertheless, it is possible to minimize the error of the position information in the x-axis direction or y-axis direction of the work unit.

Figure 5 shows a plan view of another embodiment of a work unit transfer device according to the invention, Figure 6 shows a side view of the work unit transfer device shown in FIG. Descriptions duplicated with those described with reference to FIGS. 1 through 4 will be omitted.

As described in the description with reference to FIGS. 2 to 4, when the positioning pin and the positioning hole are employed and fastened using a fastening member such as a bolt around the fastening member, the positioning pin may be formed by a strong physical fastening force. Thermal expansion in the vicinity can be minimized compared to the surrounding area.

In addition, it may be assumed that the thermal expansion coefficient of each region of the movable element 1310 or the like has a propensity that is proportional to the distance of the positioning pin. In other words, it can be assumed that the positioning pin is a reference point of thermal expansion.

In the embodiment shown in Fig. 2 or 4, the positioning pins (p, p1, p2) are of course provided at a position corresponding to the scale sensing unit 1390, the positioning pin (p) is the movable Since it is disposed at the center of the width direction of the first transfer line 1100 connected to the ruler 1310, the area of the right side of the positioning pins (p, p1, p2) of the movable element 1310 is expanded to some extent by the thermal expansion of the drive unit This may cause an error in the position of the transfer direction of the second transfer line of the work unit.

That is, the position of the positioning pin is disposed in the center of the width direction of the bracket member 1200 and the first transfer line 1100, but is expanded in the direction of the right end of the first transfer line 1100 from the positioning pin Since there is room for expansion, by reducing the room for expansion, the error related to the position of the conveying direction of the second conveying line of the work unit can be minimized.

The positioning means and the scale detector may be provided near one end of the work unit in one of the width direction ends of the first transfer line.

Therefore, the embodiment shown in FIG. 5 is provided with the positioning pin p3 near the right side (the work unit direction) end (border) of the first transfer line 1100 (width direction of the first transfer line) Eccentric position toward the work unit) to minimize the thermal expansion of the movable element 1310 and the first transfer line 1100 in the right direction of the positioning pin (p3).

That is, assuming that the coefficient of thermal expansion in the vicinity of the positioning pin p3 is minimum, the position thereof may be disposed as close to the work unit as possible to reduce the possibility of position error due to thermal expansion of the movable element 1310. .

5 and 6, the width of the bracket member 1200 may be configured to be larger than the work unit transport apparatus shown in Figures 2 to 4 for the connection of a stable transfer line, Figure 2 to Like the work unit transfer device shown in FIG. 4, the vicinity of the positioning pin p3 may be fastened by a plurality of fastening members b1.

In addition, one end of the first transfer line 1100 connected to the mover 1310 via the bracket member 1200 may be fastened to the bracket member 1200 by an auxiliary fastening member b2. .

In addition, the protrusion 1201 may be formed on one side of the bracket member 1200 so that the protrusion 1201 may be coupled to one end of the first transfer line 1100 in the working unit direction.

The auxiliary fastening member b2 is the first conveying line 1100 and the bracket member in a direction parallel to the conveying direction of the second conveying line in the direction of the first conveying line 1100 in the direction of the work unit 1120. Fasteners (1200).

As described above, the portion to which the fastening force is applied by the fastening member can be suppressed as much as possible, so that the movement of the movable member or the bracket member 1200 in the direction opposite to the fastening direction by the auxiliary fastening member b2 is prevented. Thermal expansion can be minimized.

Therefore, the fastening by the auxiliary fastening member (b2) has an effect of further reducing the error in the transfer direction of the positioning pin (p3) and the second transfer line (1300) of the scale sensor (1390).

7 shows a plan view of another embodiment of a work unit transport device according to the invention, and FIG. 8 shows a side view of the work unit transport device shown in FIG. Descriptions duplicated with those described with reference to FIGS. 1 through 6 will be omitted.

Unlike the above-described embodiment, in the embodiment shown in Figs. 7 and 8, the positioning means is a positioning protrusion provided on one side of the movable member of the bracket member and the second transfer line and the position provided on the other side It may be a crystal hole.

The above-described embodiments are applied to the bracket member 1200 connecting the first transfer line 1100 and the second transfer line 1300 and the mover 1310 as a moving object to be transferred by the second transfer line 1300. Although the positioning hole is provided and the positioning function is provided by inserting the positioning pins inserted into the respective positioning holes together, the movable member of the bracket member 1200 and the second transfer line 1300 ( 1310) may be used a method having a positioning projection provided on one side and a positioning hole provided on the other side.

7 and 8, the positioning protrusion 1311 is provided above the mover 1310 of the second transfer line 1300, and the positioning hole 1211 is the bracket member. It may be provided at (1200).

7 and 8, the scale detecting unit 1390, the positioning projection 1311 as the positioning means and the positioning hole 1211 are mutually x-axis. 5 and 6, the position of the positioning means is also provided near the right side of the first transfer line 1100 (the work unit direction). Thus, the possibility of error due to thermal expansion can be minimized.

The width of the positioning hole 1211 provided in the bracket member 1200 is set to be larger than the width of the positioning protrusion 1311 provided above the mover 1310 of the second transfer line 1300. The positioning protrusion inserted into the positioning hole may be fastened and fixed by a fastening member in at least two directions.

The width of the positioning hole 1211 is set to be larger than the width of the positioning protrusion 1311 provided on the mover 1310 of the second transfer line 1300, so that the position of the positioning hole 1211 is increased. In the position of the positioning projection 1311 can be set and fixed.

Specifically, the fastening member may fix the positioning projections inserted into the respective positioning holes in a direction parallel to the conveying direction of the first conveying line and the second conveying line in order to secure the fastening state.

Each of the fastening members b3 and b4 may be divided into a setting fastening member b4 for setting an alignment or the like and a fixing setting member b3 for fixing the set state. In this case, the setting fastening member b4 may include at least one or more washers w1 and w2 for precision setting.

In the vicinity of the positioning hole 1211 and the positioning protrusion 1311 constituting the positioning means, as in the above-described embodiments, the fastening member b1 is used in the z-axis direction as in the above-described embodiments. The fastening force can be enhanced to minimize the thermal expansion rate in the vicinity of the positioning means.

Accordingly, when the positioning projection 1311 is inserted into the positioning hole 1211 and the setting fastening member b4 is fastened and set, the fixing hole 1311 is fixed through the fixing setting member b3. The positioning protrusion 1311 is fastened and fixed to the 1211 to minimize the thermal expansion rate near the positioning protrusion.

In addition, the embodiment shown in Figure 7 and 8 also the auxiliary fastening member (b2) in the direction parallel to the conveying direction of the second conveying line toward the first conveying line 1100 in the work unit 1120 direction The first conveying line 1100 and the bracket member 1200 may be fastened to further reduce an error in the direction of conveyance of the second conveying line of the positioning protrusion 1311 and the scale detecting unit 1390. have.

In addition, the protrusion 1113 provided at the lower portion of the second transfer line 1300 may be a reference position for fastening the stator 1370 and the movable element 1310, and the movable part 113 may be moved around the protrusion 1113. Thermal expansion of the width direction (y-axis direction) of the 1310 is achieved. Accordingly, if one side of the positioning protrusion 1113 of FIG. 8 is installed at a position corresponding to the same line of the protrusion 1113, the influence of thermal expansion in the y direction of the mover 1310 may be minimized.

While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. . It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.

1: Flip Chip Bonding Device
2: work unit feeder
1100: first transfer line
1110: working part
1120, 1130: work unit
1300: second transfer line
1310: mover
1380: linear scale
1390: scale detection unit

Claims (24)

A first transport line equipped with a work unit provided with a work unit and provided to transport the work unit;
As long as the mover is mounted to both ends of the first transfer line, and arranged in parallel to the first transfer line in order to transfer the mover in a direction perpendicular to the transfer direction of the first transfer line. A second transfer line of the pair;
Positioning means provided at both ends of the first transfer line and the movers of the respective second transfer lines;
A linear scale provided along the longitudinal direction of the second transfer line to measure a transfer direction position of the second transfer line of the work unit; And
A scale detector provided at a position corresponding to the positioning means and provided to the mover to sense a transfer direction position of a second transfer line of the work unit with respect to the linear scale during transfer of the mover; Work unit feeder. The method of claim 1,
And said positioning means and said scale detector are located in a widthwise center region of said first transfer line. The method of claim 1,
And the positioning means and the scale detecting unit are provided at one end of the working unit in one of the width direction ends of the first transfer line. The method according to claim 2 or 3,
Both ends of the first transfer line is a work unit transport apparatus, characterized in that mounted to the mover of the second transfer line via a bracket member. 5. The method of claim 4,
And the positioning means is a positioning hole provided in the bracket member and the mover of the second transfer line and a positioning pin inserted together in the positioning hole. 5. The method of claim 4,
Forming a protrusion on one side of the bracket member work unit conveying apparatus, characterized in that the fastening by the fastening member and one end in the working unit direction of the first transfer line. 5. The method of claim 4,
And the positioning means is a positioning protrusion provided on one side of the bracket member and the mover of the second transfer line and a positioning hole provided on the other side. The method of claim 7, wherein
The positioning projection is provided at one end of the work unit in the width direction end of the first transfer line, the width of the positioning hole is configured to be larger than the width of the positioning projection to the positioning projection within the positioning hole Working unit transport apparatus, characterized in that the position can be set. The method of claim 1,
The second conveying line is a work unit conveying apparatus, characterized in that each of the guide rail to which the mover is mounted to be transported and a drive unit for transporting the mover along the guide rail. 10. The method of claim 9,
The second transfer line further includes a stator on which the guide rail is mounted, wherein the linear scale is provided on the side of the stator, and the scale sensing unit is provided at a height corresponding to the scale sensing unit. Working unit transport apparatus, characterized in that provided in. The method of claim 10,
And a driving unit of the second transfer line includes an electromagnet provided in the mover and a plurality of magnets arranged in a line provided on an upper surface of the stator along a length direction of the guide rail. The method of claim 10,
And the scale detecting unit is mounted at the other end of the extension member which is mounted on one side of the side of the mover and the other end is bent downward to extend to the side of the stator. 5. The method of claim 4,
And the bracket member has a width corresponding to the width of the second transfer line, and the positioning means is provided in the widthwise center region of the bracket member. The method of claim 1,
A plurality of the first transfer line is provided in parallel, the work unit transfer apparatus, characterized in that the transfer is independently by each of the second transfer line. The method of claim 1,
The work unit transport apparatus of the first transfer line comprises at least one or more of a bonding unit and a vision unit constituting a bonding device. The method of claim 1,
The position of the positioning means with respect to the linear scale provided in the second conveying line is measured by the scale detecting unit to determine the conveying direction position of the second conveying line of the work unit provided in the first conveying line. Work unit transfer apparatus further comprising a control unit. 17. The method of claim 16,
The control unit reflects the measured position of the positioning means by the scale detecting unit and the distance deviation in the feeding direction of the positioning means and the second transfer line of the work unit, so that the second transfer line of the work unit Working unit transport apparatus, characterized in that for determining the position of the transport direction. 17. The method of claim 16,
Each of the second transfer lines includes a guide rail to which the mover is mounted to be transported, and a driving unit to transfer the work unit and the mover along the guide rail, and the control unit is provided at both ends of the first transfer line. And a driving unit of the pair of movers so that the position of the pair of positioning means in the second transfer line is the same. The method of claim 7, wherein
A positioning protrusion is provided on the upper surface of the mover, a positioning hole into which the positioning protrusion is inserted into the bracket member is provided, and the positioning protrusion inserted into the positioning hole is provided by a fastening member in at least two directions. Working unit transport apparatus, characterized in that fastened. 20. The method of claim 19,
The fastening member is a work unit transport apparatus, characterized in that for fastening and fixing the positioning projections inserted into each of the positioning holes in a direction parallel to the conveying direction of the first conveying line and the second conveying line. The method of claim 1,
The first transfer line is
A positioning pin inserted together in a positioning hole provided in the working portion and the first transfer line to mount the working portion at a predetermined position of the first transfer line;
A linear scale provided in the first conveying line along a conveying direction of the first conveying line, for measuring a position of the conveying direction of the first conveying line of the work unit; And
The work part is provided at a position corresponding to the positioning pin to sense the transport direction position of the first transport line of the work unit with respect to the linear scale when transporting the transport direction of the first transport line of the work part. Scale unit provided in the; work unit transport apparatus comprising a. The method of claim 21,
And said positioning pin and said working unit are arranged in a plane perpendicular to the conveying direction of said first conveying line. The method of claim 21,
The position of the positioning pin of the working unit with respect to the linear scale provided in the first conveying line is measured by the scale detecting unit provided in the working unit, so that the position of the conveying direction of the first conveying line of the working unit is measured. The control unit for determining the work unit transfer apparatus further comprises. 24. The method of claim 23,
The control unit may determine the measured position of the positioning pin provided in the work unit as the transport direction position of the second transfer line of the work unit by the scale sensing unit provided in the work unit. Conveying device.

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