TWI880001B - Grinding method - Google Patents

Abstract

[Topic] Grinding the workpiece to a uniform thickness. [Solution] The workpiece is ground to a uniform thickness by performing the following steps: an axial feed grinding step, in which the first grinding stone is brought close to the holding surface to perform axial feed grinding on the workpiece held on the holding surface, when the lower surface of the first grinding stone passes through the center of the upper surface of the carrier, and the lower surface of the second grinding stone is positioned at a predetermined distance lower than the upper surface of the workpiece, and the second grinding stone and the holding assembly are moved in a relative approaching deep feed direction, and the lower surface and side surface of the second grinding stone are used to perform deep feed grinding on the workpiece.

Description

Grinding method

The present invention relates to a grinding method.

As disclosed in Patent Document 1, a grinding device for grinding a quadrilateral plate-like workpiece held on a holding surface using a grinding stone is provided, wherein the grinding stone is positioned so that the annular grinding stone passes through the center of the plate-like workpiece and rotates about the center of the grinding stone, and the grinding stone is moved in a direction approaching the plate-like workpiece to grind the plate-like workpiece rotating about the center of the plate-like workpiece.

In the grinding process of a plate-like workpiece, the following situation will be repeated: the contact area of the lower surface of the grinding stone with the plate-like workpiece becomes larger or smaller. In addition, the load applied to the plate-like workpiece and the grinding stone will be greater in the portion with a larger contact area with the plate-like workpiece than in the portion with a smaller contact area. Therefore, the plate-like workpiece will sink and the amount of grinding will decrease. As a result, the following problem will arise: the thickness of the plate-like workpiece in contact with the grinding stone will become thicker in the portion with a larger contact area than in the portion with a smaller contact area. Prior art literature Patent literature

Patent document 1: Japanese Patent Application Publication No. 2015-205358

Invention Problems to be Solved

Therefore, a grinding device that uses a holding surface to hold a plate-shaped workpiece at four corners and grinds it with a grinding stone has the following problem: forming the plate-shaped workpiece after grinding into a uniform thickness. Means for solving the problem

The present invention is a method for grinding a workpiece using a grinding device. The grinding device comprises: a holding assembly that can hold the workpiece on a holding surface and rotate with the center of the holding surface as an axis; a grinding assembly that installs a first grinding stone in an annular shape and a second grinding stone in an annular shape with a diameter concentric with the first grinding stone at the front end of a spindle; an advance and retreat mechanism that selectively allows the first grinding stone or the second grinding stone to approach the holding surface; a horizontal moving assembly that moves the holding assembly and the grinding assembly in a horizontal direction relative to each other; and a vertical moving assembly that moves the holding assembly and the grinding assembly in a direction perpendicular to the holding surface relative to each other. The method for grinding the workpiece is composed of the following steps: An axial feed grinding step, in which the lower surface of either the first grinding stone or the second grinding stone passes through the center of the holding surface, and the grinding stone is moved toward the holding surface to perform axial feed grinding on the workpiece held on the holding surface; and In the creep-feed grinding step, the grinding stone of another type not used in the axial feed grinding step is positioned closer to the horizontal outer side than the upper side of the holding surface, and the lower surface of the grinding stone is positioned a predetermined distance lower than the upper surface of the workpiece, and the grinding stone and the holding assembly are moved in the relative horizontal direction, i.e., the creep-feed direction, and the workpiece is creep-feed ground with the lower surface and side surface of the grinding stone. It is desirable that the workpiece in the above-mentioned grinding method is polygonal, and the holding surface is shaped along the shape of the workpiece. It is desirable that the above-mentioned grinding method is: the axial feed grinding step uses the first grinding stone, and the deep feed slow feed grinding step uses the second grinding stone having a larger diameter than the first grinding stone. It is desirable that the above-mentioned grinding method is: the holding assembly is provided with a plurality of holding surfaces on the upper surface, and in the axial feed grinding step, the grinding stone is positioned so as to pass through the center of the upper surface, and the upper surface is rotated about the center of the upper surface to grind the workpiece held on each of the holding surfaces. It is expected that the above-mentioned grinding method is: arranging and configuring a plurality of the holding surfaces in a horizontal direction orthogonal to the depth feed direction, and in the depth feed grinding step, the holding surfaces are fixed in a state of being arranged in a horizontal direction orthogonal to the depth feed direction so as not to rotate, and the grinding stone arranged closer to the outside than the upper surface of the holding assembly is approached relative to the holding assembly in the depth feed direction, and the lower surface and side surface of the grinding stone are used to grind a plurality of workpieces. It is expected that in the above-mentioned grinding method, the holding surface is a rectangle having a long side and a short side, and the long side is extended in the depth feed direction and the plurality of the holding surfaces are arranged in a horizontal direction orthogonal to the depth feed direction. Effect of the invention

In the grinding device of the present invention, a quadrilateral workpiece can be ground to a uniform thickness by performing deep feed grinding after axial feed grinding. In particular, when the workpiece is a rectangular plate-shaped workpiece, the workpiece can be processed to a uniform thickness by extending the long side of the plate-shaped workpiece in the deep feed direction and approaching the second grinding stone from the short side during deep feed grinding.

The form used to implement the invention

1 Grinding device The grinding device 1 shown in FIG. 1 is a grinding device for grinding a workpiece 14 using a grinding assembly 3. The workpiece 14 is, for example, a thin plate in a rectangular shape. The grinding device 1 has a base 10 extending in the Y-axis direction and a support 11 vertically provided on the +Y direction side of the base 10.

A vertical moving assembly 4 that supports the grinding assembly 3 in a liftable manner is disposed on the side surface of the support 11 on the -Y direction side. The vertical moving assembly 4 includes: a ball screw 40 having a rotation axis 45 in the Z-axis direction, a pair of guide rails 41 disposed parallel to the ball screw 40, a Z-axis motor 42 that rotates the ball screw 40 about the rotation axis 45, a lifting plate 43 whose inner nut is screwed to the ball screw 40 and whose side is slidably connected to the guide rail 41, and a support 44 connected to the lifting plate 43 and supporting the grinding assembly 3.

When the ball screw 40 is driven by the Z-axis motor 42 and the ball screw 40 rotates about the rotation axis 45, the lifting plate 43 is guided by the guide rail 41 to move up and down in the Z-axis direction, and the grinding assembly 3 held in the support 44 is moved in the Z-axis direction. By using the vertical moving assembly 4 to move the grinding assembly 3 up and down in the Z-axis direction, the holding assembly 2 and the grinding assembly 3 can be moved relative to each other in a direction perpendicular to the holding surface 211.

The grinding assembly 3 includes: a spindle 30 having a rotating shaft 35 in the Z-axis direction, a housing 39 that supports the spindle 30 so that it can rotate, and a spindle motor 38 that drives the spindle 30 to rotate with the rotating shaft 35 as an axis. As shown in FIG. 2 , a cylinder 63 is connected to the spindle 30. The cylinder 63 includes a large diameter portion 630 and a small diameter portion 631 formed at the lower end of the large diameter portion 630. A first mounting seat 331 is connected to the lower end of the small diameter portion 631. In addition, a rod 620 and a disc piston 621 connected to the upper end of the rod 620 are accommodated inside the large diameter portion 630, and a second mounting seat 332 is connected to the lower end of the rod 620. In addition, a guide portion 449 is provided between the lower surface of the large diameter portion 630 and the first mounting seat 331 to connect the two, and a through hole penetrating the guide portion 449 is formed in the second mounting seat 332. The first grinding wheel 31 is mounted on the first mounting seat 331. Also, the second grinding wheel 32 is mounted on the second mounting seat 332.

As shown in FIG. 1 , the first grinding wheel 31 has a first wheel base 311 and a plurality of first grinding stones 310 arranged in a substantially rectangular shape in a ring shape on the lower surface of the first wheel base 311. The second grinding wheel 32 has a second wheel base 321 and a plurality of second grinding stones 320 arranged in a substantially rectangular shape in a ring shape on the lower surface of the second wheel base 321. The ring formed by the plurality of second grinding stones 320 has a diameter as large as the ring formed around the plurality of first grinding stones 310. In addition, the ring formed by the second grinding stone 320 is a ring concentric with the first grinding stone 310. The particle size of the first grinding stone 310 and the particle size of the second grinding stone 320 may be the same or different. The first grinding wheel 31 and the second grinding wheel 32 are rotated by rotating the spindle 30 using the spindle motor 38.

The rod 620 and the disc piston 621 shown in FIG. 2 constitute an upper and lower assembly 62, and the upper and lower assembly 62 can move up and down in the Z-axis direction in the space inside the large diameter portion 630. The disc piston 621 is connected to the air supply source 60, and a switching control unit 61 is provided between the disc piston 621 and the air supply source 60. The switching control unit 61 is, for example, a control valve, and has the following function: switching the air supplied from the air supply source 60 to be ejected from the top of the disc piston 621 or from the bottom of the disc piston 621.

For example, when the air supplied from the air supply source 60 is switched to be ejected from the bottom of the disc piston 621 in the +Z direction using the switching control unit 61, the disc piston 621 is given potential energy in the +Z direction by the air, and the disc piston 621, the rod 620, and the second mounting seat 332 are guided by the guide portion 449 and rise in the +Z direction as a whole. As a result, the second mounting seat 332 gradually rises in the +Z direction, and the first grinding stone 310 is closer to the holding surface 211 than the second grinding stone 320. Furthermore, when the switching control unit 61 is used to switch the air supplied from the air supply source 60 to be ejected from the top of the disc piston 621 in the -Z direction, the disc piston 621 is given potential energy in the -Z direction by the air, and the disc piston 621, the rod 620, and the second mounting seat 332 are guided by the guide portion 449 and integrally descend in the -Z direction. As a result, the second mounting seat 332 gradually descends in the -Z direction, and the second grinding stone 320 is closer to the holding surface 211 than the first grinding stone 310. In this way, the air supply source 60, the switching control unit 61, and the upper and lower components 62 constitute the advance and retreat mechanism 6, which controls the height position relationship between the first grinding stone 310 and the second grinding stone 320 to selectively bring the first grinding stone 310 or the second grinding stone 320 close to the holding surface 211.

As shown in FIG. 1 , a holding assembly 2 is provided on the base 10. The holding assembly 2 may be, for example, a work clamp for holding the workpiece 14. The holding assembly 2 has a disc-shaped carrier 21 and a frame 22 for supporting the carrier 21. A plurality of (four in FIG. 1 ) holding surfaces 211 for holding, for example, the workpiece 14 are provided on the upper surface 210 of the carrier 21. The holding surface 211 is formed in a rectangular shape, for example, with a long side 212 extending in the Y-axis direction and a short side 213 extending in the X-axis direction, and is arranged and configured in the X-axis direction on the upper surface 210 of the carrier 21.

Each holding surface 211 is connected to a suction source (not shown). For example, by using the suction source to exert suction force when the workpiece 14 is placed on the holding surface 211, the generated suction force can be transmitted to the holding surface 211 to attract the workpiece 14 placed on the holding surface 211. In this way, the workpiece 14 can be attracted and held on the holding surface 211.

An inner base 100 is provided inside the base 10. A horizontal moving assembly 5 for moving the holding assembly 2 in the horizontal direction is provided on the inner base 100. The horizontal moving assembly 5 comprises: a ball screw 50 having a rotation axis 55 in the Y-axis direction, a pair of guide rails 51 provided parallel to the ball screw 50, a Y-axis motor 52 connected to the ball screw 50 and rotating the ball screw 50 about the rotation axis 55, and a movable plate 53 having a nut at the bottom screwed to the ball screw 50 and moving in the Y-axis direction along the guide rails 51. When the ball screw 50 is driven by the Y-axis motor 52 and rotates around the rotation shaft 55, the movable plate 53 is guided by the guide rail 51 and moves horizontally in the Y-axis direction.

A rotating assembly 26 for rotating the holding assembly 2 is provided on the upper surface 530 of the movable plate 53, and a ring-shaped base 23 is provided around the rotating assembly 26. For example, three (two are shown in FIG. 1 ) through holes 230 are formed at evenly spaced positions on the same circumference of the base 23, and three (two are shown in FIG. 1 ) supporting columns 24 for supporting the base 23 are vertically provided on the upper surface 530 of the movable plate 53. Each through hole 230 is penetrated by its own supporting column 24, and the supporting column 24 is fixed to the upper surface 530 of the movable plate 53. Each support column 24 has a telescopic mechanism, for example, not shown in the figure, and the following situation is achieved: the inclination of the holding assembly 2 can be adjusted by appropriately raising and lowering each support column 24 in the Z-axis direction.

When the movable plate 53 moves in the Y-axis direction, the rotating assembly 26 supported by the movable plate 53, the base 23, and the holding assembly 2 and the movable plate 53 move horizontally in the Y-axis direction as a whole. The holding assembly 2 can be moved horizontally in the Y-axis direction by using the horizontal moving assembly 5, so that the holding assembly 2 and the grinding assembly 3 can be moved horizontally relative to each other.

The rotating assembly 26 includes, for example, a motor (not shown). By operating the motor, the holding assembly 2 can be rotated about the axis in the Z-axis direction passing through the center 2000 thereof.

A cover 27 and bellows 28 are provided around the holding assembly 2, and the bellows 28 is retractably connected to the cover 27. For example, when the holding assembly 2 moves in the Y-axis direction, the cover 27 and the holding assembly 2 move together in the Y-axis direction and the bellows 28 retracts.

2 Grinding method (Axial feed grinding step) A method for grinding the workpiece 14 using the grinding device 1 is described. First, the switching control unit 61 of the advance and retreat mechanism 6 is activated in advance, and air is supplied from the air supply source 60, and air is ejected from the bottom of the circular plate piston 621 in the +Z direction to raise the second mounting seat 332. As a result, the second grinding stone 320 moves in the +Z direction relative to the first grinding stone 310, and the first grinding stone 310 is closer to the holding surface 211 than the second grinding stone 320.

Then, the workpiece 14 is placed on each of the plurality of holding surfaces 211 of the holding assembly 2, and the suction source is activated. Thus, the generated suction force is transmitted to the holding surface 211, and the workpiece 14 is sucked and held on the holding surface 211.

Furthermore, the holding unit 2 is rotated by the rotating unit 26 to rotate the workpiece 14 held on the holding surface 211 , and the first grinding stone 310 and the second grinding stone 320 are rotated by the spindle motor 38 in advance.

Next, the holding assembly 2 is moved in the +Y direction using the horizontal moving assembly 5 , and the workpiece 14 is positioned at a position where the lower surface 312 of the first grinding stone 310 passes through the center 2000 of the upper surface 210 of the stage 21 , as shown in FIG. 3 .

While the workpiece 14 held on the holding surface 211 is rotating about the center 2000 and the first grinding stone 310 is rotating about the rotation axis 35, the grinding unit 3 is lowered in the -Z direction using the vertical movement unit 4. When the first grinding stone 310 is gradually brought close to the holding surface 211 by being lowered in the -Z direction, the lower surface 312 of the first grinding stone 310 contacts the upper surface 140 of the workpiece 14. When the lower surface 312 of the first grinding stone 310 contacts the upper surface 140 of the workpiece 14, the first grinding stone 310 is further lowered in the -Z direction, thereby performing axial feed grinding on the workpiece 14. 4 and 5 show the following situation: the workpiece 14 held on the holding surface 211 is in contact with the first grinding stone 310 while rotating about the center 2000 of the upper surface 210 as an axis.

In the axial feed grinding of the workpiece 14, for example, a height gauge not shown is positioned on a circumferential track 219 formed by a measuring surface 218 flush with the holding surface 211 on the upper surface 210 of the stage 21, and the upper surface 140 of the workpiece 14 is aligned, and the height of the holding surface 211 and the height of the upper surface 140 of the workpiece 14 are measured, and the difference between the two heights is calculated, thereby measuring the thickness of the workpiece 14. The axial feed grinding is terminated after the workpiece 14 is ground to a predetermined thickness.

(Advanced slow-feed grinding step) After the axial feed grinding is performed as described above, the grinding assembly 3 is raised in the +Z direction using the vertical moving assembly 4 shown in FIG. 1, so that the first grinding stone 310 is separated from the workpiece 14. Then, the holding assembly 2 is moved in the -Y direction using the horizontal moving assembly 5, so that the first grinding stone 310 and the second grinding stone 320 are retreated from the upper side of the holding surface 211 to the outside in the horizontal direction.

Thereafter, the second grinding stone 320 is lowered relative to the first grinding stone 310 using the advancing and retreating mechanism 6 , so that the second grinding stone 320 is closer to the holding surface 211 than the first grinding stone 310 .

Next, the grinding unit 3 is lowered in the −Z direction using the vertical moving unit 4 to position the second grinding stone 320 at a height position where the lower surface 322 of the second grinding stone 320 is lower than the upper surface 140 of the workpiece 14 by a predetermined distance.

Furthermore, by rotating the holding assembly 2 by an appropriate angle using the rotating assembly 26, a state in which four holding surfaces 211 are arranged in the X-axis direction is set as shown in FIG6, and in this state, the rotation of the holding assembly 2 by the rotating assembly 26 is stopped to prevent the holding assembly 2 from rotating. In this way, the four holding surfaces 211 are fixed in a state in which they are arranged in the X-axis direction.

Then, the holding assembly 2 is moved in the +Y direction using the horizontal moving assembly 5. As a result, the second grinding stone 320 disposed on the outer side of the upper surface 210 of the stage 21 and the holding assembly 2 move in the relative horizontal direction, that is, the deep feed direction (Y-axis direction), and the second grinding stone 320 and the workpiece 14 held on the holding surface 211 gradually approach each other in the Y-axis direction.

When the second grinding stone 320 and the workpiece 14 held on the holding surface 211 gradually approach each other in the Y-axis direction, as shown in FIG7 , the side surface 323 and the lower surface 322 of the second grinding stone 320 contact the upper surface 140 of the workpiece 14 to perform deep slow feed grinding on the workpiece 14. As shown in FIG8 , when the holding assembly 2 moves in the +Y direction to a horizontal position where the entire surface of the four workpieces 14 held on the holding surface 211 has been ground, the deep slow feed grinding is terminated.

In the grinding device 1, the quadrilateral workpiece 14 can be ground to a uniform thickness by performing deep feed grinding after axial feed grinding. In particular, when the workpiece 14 is a rectangular plate-like workpiece, the workpiece 14 can be processed to a uniform thickness by approaching the second grinding stone 320 from the short side 213 during deep feed grinding.

Furthermore, in the above-mentioned grinding method, after the axial feed grinding of the workpiece 14 is performed using the second grinding stone 320 , the deep feed grinding of the workpiece 14 may be performed using the first grinding stone 310 .

Furthermore, the upper surface 210 of the stage 21 may not be a rectangular holding surface 211 arranged in the same direction. For example, each holding surface 211 may be a rectangle, and the directions may not be aligned in one direction, or the sizes of the rectangles may be different. In addition, the shape of each holding surface 211 may be a polygon other than a rectangle, or may be a circle or an ellipse.

The grinding device 1 may also be a device having a second holding assembly 8 as shown in FIG. 9 to replace the holding assembly 2. As shown in FIG. 9, the second holding assembly 8 has a disk-shaped suction portion 80 and a frame 81 supporting the suction portion 80. The upper surface of the suction portion 80 is a holding surface 800 for holding the disk-shaped second workpiece 15, and the upper surface 810 of the frame 81 is formed flush with the holding surface 800. In addition, the suction portion 80 is connected to a suction source not shown. For example, by activating the suction source when the second workpiece 15 is placed on the holding surface 800, the generated suction force can be transmitted to the holding surface 800, and the second workpiece 15 can be sucked and held on the holding surface 800.

When grinding the second workpiece 15 held in the second holding assembly 8, the first advance and retreat mechanism 6 is used to make the first grinding stone 310 closer to the holding surface 800 than the second grinding stone 320, and the second workpiece 15 is held on the holding surface 800 of the second holding assembly 8. In addition, the first grinding stone 310 and the second grinding stone 320 are rotated by the spindle motor 38, and the second workpiece 15 held in the second holding assembly 8 is rotated by the rotating assembly 26. In addition, the second holding assembly 8 is moved in the +Y direction by the horizontal moving assembly 5, and the horizontal position relationship between the second holding assembly 8 and the grinding assembly 3 is adjusted so that the lower surface 312 of the first grinding stone 310 passes through the center 8000 of the holding surface 800. Then, the grinding assembly 3 is lowered in the -Z direction using the vertical moving assembly 4 so that the first grinding stone 310 approaches the holding surface 800, and the lower surface 312 of the first grinding stone 310 contacts the second workpiece 15 held on the holding surface 800. In this way, the second workpiece 15 is axially fed and ground.

After the axial feed grinding is completed, the grinding assembly 3 is raised in the +Z direction by using the vertical moving assembly 4, so that the first grinding stone 310 and the second grinding stone 320 are moved away in the +Z direction relative to the second workpiece 15. In addition, the second workpiece 15 held by the second holding assembly 8 is moved in the -Y direction by using the horizontal moving assembly 5, so that the second workpiece 15 is moved away in the -Y direction relative to the first grinding stone 310 and the second grinding stone 320. In this way, the lower surface 322 of the second grinding stone 320 can be positioned closer to the horizontal outer side than the upper side of the holding surface 800.

Thereafter, the second grinding stone 320 is brought closer to the holding surface 800 than the first grinding stone 310 by using the advance/retract mechanism 6, and the grinding assembly 3 is moved further toward the -Z direction by using the vertical moving assembly 4, thereby adjusting the height position of the second grinding stone 320 so that the lower surface 322 of the second grinding stone 320 becomes a predetermined distance lower than the upper surface 150 of the second workpiece 15.

Then, the second workpiece 15 held by the second holding assembly 8 is moved in the +Y direction by the horizontal moving assembly 5, so that the second grinding stone 320 and the second holding assembly 8 are relatively close to each other in the deep feed direction. Thereby, the lower surface 322 and the side surface 323 of the second grinding stone 320 contact the upper surface 150 of the second workpiece 15, and the second workpiece 15 is deep feed ground.

Even if the second workpiece 15 is in the shape of a disk, the second workpiece 15 can be ground to a uniform thickness by selecting the second holding assembly 8 having a holding surface 800 that is suitable for the shape of the second workpiece 15 and performing axial feed grinding and deep feed grinding.

Furthermore, in the above-mentioned grinding method, after the axial feed grinding of the second workpiece 15 is performed using the second grinding stone 320 , the deep feed grinding of the second workpiece 15 may be performed using the first grinding stone 310 .

Furthermore, even in the case where a plurality of quadrilateral chips are formed on the upper surface 150 of the second workpiece 15 and the chips are sealed with resin, the chips can be exposed by performing axial feed grinding on the resin and then deep feed grinding, thereby forming grinding marks in the same direction on the exposed surface of the chip.

1: Grinding device 2: Holding assembly 10: Base 11: Pillar 14: Workpiece 15: Second workpiece 100: Inner base 140: Upper surface of workpiece 150: Upper surface of second workpiece 21: Carrier 210: Upper surface of carrier 211,800: Holding surface 212: Long side 213: Short side 218: Measuring surface 219: Measuring track 22,81: Frame 220,810: Upper surface of frame 23: Base 230: Through hole 24: Support column 26: Rotating assembly 27: Cover 28: Bellows 2000,8000: Center 3: Grinding assembly 30: Spindle 31: 1st grinding wheel 310: 1st grinding stone 311: 1st wheel base 312: Lower surface 313: Side surface 32: 2nd grinding wheel 320: 2nd grinding stone 321: 2nd wheel base 322: Lower surface 323: Side surface 331: 1st mounting seat 332: 2nd mounting seat 35,45,55: Rotary shaft 38: Spindle motor 39: Housing 4: Vertical movement assembly 40,50: Ball screw 41,51: Guide rail 42: Z-axis motor 43: Lifting plate 44: Support 449: Guide part 5: Horizontal moving assembly 52: Y-axis motor 53: Movable plate 530: Upper surface of movable plate 6: Advance and retraction mechanism 60: Air supply source 61: Switching control unit 62: Upper and lower assembly 620: Rod 621: Circular piston 63: Cylinder 630: Large diameter part 631: Small diameter part 8: Second holding assembly 80: Suction part X, +X, -X, +Y, -Y, Z, +Z, -Z: Direction

FIG. 1 is a perspective view showing the entire grinding device. FIG. 2 is a cross-sectional view showing a grinding assembly and a holding assembly. FIG. 3 is a plan view showing the positional relationship between the holding assembly and the grinding assembly during axial feed grinding. FIG. 4 is a plan view showing the positional relationship between the holding assembly and the grinding assembly during axial feed grinding. FIG. 5 is a plan view showing the positional relationship between the holding assembly and the grinding assembly during axial feed grinding. FIG. 6 is a plan view showing the positional relationship between the holding assembly and the grinding assembly during deep slow feed grinding. FIG. 7 is a plan view showing the positional relationship between the holding assembly and the grinding assembly during deep slow feed grinding. FIG. 8 is a plan view showing the positional relationship between the holding assembly and the grinding assembly during deep slow feed grinding. Figure 9 is a three-dimensional diagram showing the entire grinding device.

1: Grinding device

10: Base

11: Pillar

14: Object to be processed

100: Internal base

140: Upper surface of the workpiece

2: Keep components

21: Carrier

210: Upper surface of the carrier

211: Keep the face

212: Long side

213: Short side

22: Frame

220: Upper surface of the frame

23: Base

230:Through hole

24: Support column

26: Rotating assembly

27: Cover

28: Snake Belly

2000: Center

3: Grinding components

30: Main axis

31: 1st grinding wheel

310: First grinding stone

311: 1st round base

312: Lower surface

313: Side

32: 2nd grinding wheel

320: Second grinding stone

321: 2nd round base

322: Lower surface

323: Side

332: 2nd mounting seat

35,45,55: Rotation axis

38: Spindle motor

39: Shell

4: Vertical movement assembly

40,50: Ball screw

41,51:Guide rails

42: Z-axis motor

43: Lifting plate

44:Supporter

5: Horizontal movement component

52:Y-axis motor

53: Movable plate

530: Upper surface of movable plate

6: Advance and retreat mechanism

60: Air supply source

61: Switching control unit

+X,-X,+Y,-Y,+Z,-Z: Direction

Claims (3)

A grinding method is to use a grinding device to grind a workpiece, the grinding device having: a holding assembly that can hold the workpiece on a holding surface and rotate around the center of the holding surface; a grinding assembly that installs a first grinding stone in an annular shape and a second grinding stone in an annular shape with a diameter concentric with the first grinding stone at the front end of a spindle; an advance and retreat mechanism that selectively allows the first grinding stone or the second grinding stone to approach the holding surface; a horizontal moving assembly that moves the holding assembly and the grinding assembly in a horizontal direction relative to each other; and a vertical moving assembly that moves the holding assembly and the grinding assembly in a direction perpendicular to the holding surface relative to each other. The grinding method is composed of the following steps: An axial feed grinding step, in which the lower surface of either the first grinding stone or the second grinding stone passes through the center of the holding surface, and the grinding stone is moved downward close to the holding surface, thereby axially feeding and grinding the workpiece held on the holding surface; and The deep feed slow feed grinding step is to position the other grinding stone not used in the axial feed grinding step closer to the horizontal outer side than the upper side of the holding surface, and to position the lower surface of the grinding stone a predetermined distance lower than the upper surface of the workpiece, and to make the grinding stone and the holding assembly approach each other in the relative horizontal movement direction, i.e., the deep feed slow feed direction, and to perform deep feed slow feed grinding on the workpiece with the lower surface and side surface of the grinding stone, wherein the workpiece is a polygon, and the holding surface is a shape along the shape of the workpiece, the holding assembly is provided with a plurality of the holding surfaces on the upper surface, the axial feed grinding step is to position the grinding stone so that it passes through the center of the upper surface, and to rotate the upper surface with the center of the upper surface as the axis, The plurality of holding surfaces are arranged and configured in a horizontal direction orthogonal to the depth feed direction. The depth feed grinding step allows the holding surfaces to be fixed in a state of being arranged in a horizontal direction orthogonal to the depth feed direction so as not to rotate, and allows the grinding stone arranged on the outer side of the holding assembly in the horizontal direction to approach the holding assembly relative to the depth feed direction, and grinds the plurality of workpieces with the lower surface and side surface of the grinding stone. A grinding method as claimed in claim 1, wherein the retaining surface is a rectangle having a long side and a short side, the long side extends in the depth feed direction and a plurality of the retaining surfaces are arranged in a horizontal direction orthogonal to the depth feed direction. A grinding method is to use a grinding device to grind a workpiece, the grinding device having: a holding assembly that can hold the workpiece on a holding surface and rotate around the center of the holding surface; a grinding assembly that installs a first grinding stone in an annular shape and a second grinding stone in an annular shape with a diameter concentric with the first grinding stone at the front end of a spindle; an advance and retreat mechanism that selectively allows the first grinding stone or the second grinding stone to approach the holding surface; a horizontal moving assembly that moves the holding assembly and the grinding assembly in a horizontal direction relative to each other; and a vertical moving assembly that moves the holding assembly and the grinding assembly in a direction perpendicular to the holding surface relative to each other. The grinding method is composed of the following steps: An axial feed grinding step, in which the lower surface of either the first grinding stone or the second grinding stone passes through the center of the holding surface, and the grinding stone is moved downward close to the holding surface, thereby axially feeding and grinding the workpiece held on the holding surface; and In the deep feed slow feed grinding step, the grinding stone not used in the axial feed grinding step is positioned closer to the horizontal outer side than the upper side of the holding surface, and the lower surface of the grinding stone is positioned a predetermined distance lower than the upper surface of the workpiece, and the grinding stone and the holding assembly are moved in the relative horizontal direction, i.e., the deep feed slow feed direction, and the workpiece is deep fed slow feed ground with the lower surface and side surface of the grinding stone, wherein the workpiece is a polygon, and the holding surface is a shape along the shape of the workpiece, the first grinding stone is used in the axial feed grinding step, the second grinding stone having a larger diameter than the first grinding stone is used in the deep feed slow feed grinding step, The holding surface is a rectangle having a long side and a short side, the long side extending in the depth buffering direction and a plurality of the holding surfaces are arranged in a horizontal direction orthogonal to the depth buffering direction.