TWI879479B - Electronic device - Google Patents

Abstract

An electronic device including a first body, a second body pivoted to the first body, a foot pad, a heat conductive stand, a heat source and a heat dissipation module is provided. The foot pad and the heat conductive stand are disposed at a bottom of the first body, and the heat conductive stand is inserted into the foot pad. The heat source is located in the first body. The heat dissipation module is disposed in the first body and includes a heat pipe, fins and a fan. The heat pipe has an evaporating end thermally coupled to the heat source and a condensing end opposite to the evaporating end. The fins are thermally coupled to the condensation end and the heat conductive stand is thermally coupled to the fins. The fan is disposed as corresponding to the condensing end and the fins.

Description

Electronic devices

The present invention relates to an electronic device, and in particular to an electronic device including a heat dissipation design.

Laptops have become an indispensable tool for modern people due to their portability and excellent computing performance. Generally speaking, laptops are equipped with a heat dissipation module, and the common heat dissipation module is composed of a fan, a heat pipe and a heat sink. With the increase in computing volume and computing power, the laptop will generate a lot of heat during operation, but the common heat dissipation module is not easy to quickly discharge a lot of heat to the outside, thus affecting the working performance of the laptop.

The present invention provides an electronic device with excellent heat dissipation efficiency.

The present invention proposes an electronic device, including a first body, a second body pivotally connected to the first body, a foot pad, a heat conductive bracket, a heat source and a heat dissipation module. The foot pad and the heat conductive bracket are arranged at the bottom of the first body, and the heat conductive bracket is plugged into the foot pad. The heat source is located in the first body. The heat dissipation module is arranged in the first body, and includes a heat pipe, a heat sink fin and a fan. The heat pipe has an evaporation end thermally coupled to the heat source and a condensation end opposite to the evaporation end. The heat sink fin is thermally coupled to the condensation end, and the heat conductive bracket is thermally coupled to the heat sink fin. The fan is arranged corresponding to the condensation end and the heat sink fin.

Based on the above, in the electronic device of the present invention, the heat generated by the heat source inside the first body can be discharged to the outside through the first heat dissipation mechanism and conducted outward through the second heat dissipation mechanism, thereby preventing the working performance from being reduced due to excessive temperature inside the first body. Therefore, the electronic device of the present invention has excellent heat dissipation efficiency.

In order to make the above features and advantages of the present invention more clearly understood, embodiments are specifically cited below and described in detail with reference to the accompanying drawings.

FIG. 1A is a partial schematic diagram of an electronic device according to an embodiment of the present invention. FIG. 1B is a partial side schematic diagram of an electronic device according to an embodiment of the present invention. Referring to FIG. 1A and FIG. 1B, in this embodiment, the electronic device 100 may be a notebook computer, and includes a first body 110, a second body 120 pivotally connected to the first body 110, a foot pad 130, a heat conductive bracket 140, and a heat dissipation module 150. A central processing unit, a graphics processing unit, a memory, or other electronic components are provided inside the first body 110, and the central processing unit, the graphics processing unit, the memory, or other electronic components serve as a heat source 101. In addition, the second body 120 is a display, which serves as an interface for providing images.

Specifically, the foot pad 130 and the heat conductive bracket 140 are disposed at the bottom 111 of the first body 110, and the heat conductive bracket 140 is plugged into the foot pad 130. Either the foot pad 130 or the heat conductive bracket 140 can support the first body 110, or the foot pad 130 and the heat conductive bracket 140 can support the first body 110 together, so that there is a gap between the bottom 111 of the first body 110 and the working plane (such as a desktop), so as to facilitate airflow to flow between the bottom 111 of the first body 110 and the working plane (such as a desktop). In addition, under the support of either the foot pad 130 or the thermally conductive bracket 140, or under the support of both the foot pad 130 and the thermally conductive bracket 140, the first body 110 can be tilted relative to a working plane (such as a desktop) to improve operating comfort.

As shown in FIG. 1B , the heat dissipation module 150 includes a heat pipe 151, a heat dissipation fin 152, and a fan 153, wherein the heat pipe 151 has an evaporation end 151a thermally coupled to the heat source 101 and a condensation end 151b opposite to the evaporation end 151a, and the heat dissipation fin 152 is thermally coupled to the condensation end 151b. On the other hand, the fan 153 is disposed corresponding to the condensation end 151b and the heat dissipation fin 152, wherein the heat dissipation fin 152 is located above the foot pad 130, and at least a portion of the foot pad 130 falls within the orthographic projection range of the heat dissipation fin 152.

As shown in FIG. 1A and FIG. 1B , the heat conductive bracket 140 includes a heat coupling portion 141 and a heat conductive supporting portion 142 connected to the heat coupling portion 141, wherein the heat conductive supporting portion 141 is inserted into the foot pad 130 and is thermally coupled to the heat sink fin 152. In addition, the heat conductive supporting portion 142 is located at the bottom 111 and is used to support the first body 110.

As shown in FIG. 1B , the electronic device 100 further includes a first thermal interface material layer 160a and a second thermal interface material layer 160b, and the first thermal interface material layer 160a and the second thermal interface material layer 160b are respectively disposed on the inner surface and the outer surface of the bottom 111. Specifically, the first thermal interface material layer 160a is disposed in the first body 110 and is located between the heat sink fin 152 and the bottom 111. In addition, the second thermal interface material layer 160b is disposed in the foot pad 130 and is located between the thermal coupling portion 141 of the thermally conductive bracket 140 and the bottom 111.

Two opposite surfaces of the first thermal interface material layer 160a contact the heat sink fin 152 and the inner surface of the bottom 111, respectively, and two opposite surfaces of the second thermal interface material layer 160b contact the outer surface of the bottom 111 and the thermal coupling portion 141 of the thermally conductive bracket 140, respectively. The casing of the first body 110 can be made of metal, alloy, thermally conductive plastic or other thermally conductive materials, and the heat sink fin 152 can be thermally coupled to the thermally conductive bracket 140 through the first thermal interface material layer 160a, the bottom 111 and the second thermal interface material layer 160b.

In this embodiment, the heat pipe 151, the heat dissipation fin 152 and the fan 153 serve as a first heat dissipation mechanism, and the heat pipe 151, the heat dissipation fin 152 and the heat conductive bracket 140 serve as a second heat dissipation mechanism. The heat generated by the heat source 101 inside the first body 110 can be discharged to the outside through the first heat dissipation mechanism and conducted to the outside through the second heat dissipation mechanism, thereby preventing the working performance from being reduced due to excessive temperature inside the first body 110. Therefore, the electronic device 100 has excellent heat dissipation efficiency.

In detail, the heat generated by the heat source 101 can be transferred from the heat pipe 151 to the heat sink fin 152, and then the airflow caused by the fan 153 can exchange heat with the heat sink fin 152 to discharge the heat outward. On the other hand, the heat generated by the heat source 101 can be transferred from the heat pipe 151 to the heat sink fin 152, and then from the heat sink fin 152 to the thermal coupling portion 141 of the heat conductive bracket 140, and then from the thermal coupling portion 141 to the heat conductive support portion 142 to conduct the heat outward. Since the heat conductive support portion 142 is located at the bottom 111 of the first body 110, the airflow flowing between the bottom 111 of the first body 110 and the working plane (such as a desktop) can exchange heat with the heat conductive support portion 142 to carry away the heat.

In one example, the heat conductive support 140 may be a solid structure and made of metal or alloy. In another example, the heat conductive support 140 may be a heat pipe, wherein the heat coupling portion 141 may serve as an evaporation end, and the heat conductive support portion 142 may serve as a condensation end.

As shown in FIG. 1A and FIG. 1B , in this embodiment, the bottom 111 of the first body 110 has an air inlet 111a, and the rear side 112 of the first body 110 has an air outlet 112a. Specifically, the heat sink 152 is located between the fan 153 and the air outlet 112a, and between the air inlet 111a and the air outlet 112a. The fan 153 can introduce cold air from the outside into the first body 110 through the air inlet 111a, and blow it toward the heat sink 152. After the cold air exchanges heat with the heat sink 152, hot air is formed, and is discharged to the outside through the air outlet 112a. On the other hand, the heat conductive bracket 140 is located between the air inlet 111a and the air outlet 112a. Specifically, outside the first body 110 , the cold air flowing toward the air inlet 111 a may flow through the heat conductive support portion 142 and perform heat exchange with the heat conductive support portion 142 to remove the heat.

FIG. 2 is a partial side view schematic diagram of an electronic device of another embodiment of the present invention. Referring to FIG. 2 , the electronic device 100A of this embodiment is substantially the same in design as the electronic device 100 of the previous embodiment, and the main difference between the two is that in this embodiment, the heat sink fin 1521 passes through the bottom 111 and is inserted into the foot pad 130. On the other hand, a thermal interface material layer 160c is provided between the heat sink fin 1521 and the thermal coupling portion 141 of the thermally conductive bracket 140, and the heat sink fin 1521 is thermally coupled to the thermal coupling portion 141 of the thermally conductive bracket 140 through the thermal interface material layer 160c. By shortening the heat transfer path between the heat sink fin 1521 and the thermally conductive bracket 140, the thermal resistance is reduced.

FIG3 is a partial side view schematic diagram of an electronic device of another embodiment of the present invention. Referring to FIG3 , the electronic device 100B of this embodiment is substantially the same in design as the electronic device 100A of the previous embodiment, and the main difference between the two is that in this embodiment, the foot pad 1301 has an internal space 1302 and an air outlet 1303 connected to the internal space 1302, and the thermal coupling portion 141 of the thermally conductive bracket 140 is inserted into the internal space 1302. On the other hand, the bottom 111 has an air inlet 111b connected to the internal space 1302. The cold air introduced into the first body 110 by the fan 153 can flow into the internal space 1302 through the air inlet 111b to form hot air after heat exchange with the thermal coupling portion 141 and be discharged to the outside through the air outlet 1303.

FIG4 is a partial side view schematic diagram of an electronic device of another embodiment of the present invention. Referring to FIG4 , the electronic device 100C of this embodiment is substantially the same in design as the electronic device 100 of the previous embodiment, and the main difference between the two is that in this embodiment, the electronic device 100C further includes a heat storage element 170, wherein the heat storage element 170 is thermally coupled to the heat conductive support portion 142 and is located at the bottom 111 of the first body 110.

In detail, the heat storage element 170 has a heat storage medium inside, and the heat storage medium can be a refrigerant with a low boiling point or an electronic engineering fluid. In the high power consumption operation mode, the heat storage element 170 receives heat from the heat conductive support 142, and the temperature inside the heat storage element 170 rises to above the boiling point of the heat storage medium, so that the heat storage medium evaporates from a liquid medium to a gaseous medium to store a large amount of heat. After switching from the high power consumption mode to the low power consumption operation mode, the temperature inside the heat storage element 170 can drop below the boiling point of the heat storage medium, so that the heat storage medium condenses from a gaseous medium back to a liquid medium to release heat to the outside. Specifically, the heat storage element 170 serves as part of the second heat dissipation mechanism and helps to improve the heat dissipation efficiency of the second heat dissipation mechanism.

FIG5 is a partial side view schematic diagram of an electronic device of another embodiment of the present invention. Referring to FIG5 , the electronic device 100D of this embodiment is substantially the same in design as the electronic device 100C of the previous embodiment, and the main difference between the two is that in this embodiment, the electronic device 100D further includes an external fan 180, wherein the external fan 180 is disposed at the bottom 111 of the first body 110 corresponding to the heat storage element 170. Specifically, the external fan 180 can blow cold air toward the heat storage element 170 and the heat conductive support portion 142 to perform heat exchange with the heat storage element 170 and the heat conductive support portion 142. Specifically, the heat storage element 170 and the external fan 180 serve as part of the second heat dissipation mechanism and help to improve the heat dissipation efficiency of the second heat dissipation mechanism.

In summary, in the electronic device of the present invention, the first heat dissipation mechanism is at least composed of a heat pipe, a heat dissipation fin and a fan, and the second heat dissipation mechanism is at least composed of a heat pipe, a heat dissipation fin and a heat conductive bracket. Specifically, the heat generated by the heat source inside the first body can be discharged to the outside through the first heat dissipation mechanism and conducted to the outside through the second heat dissipation mechanism, thereby preventing the working performance from being reduced due to excessive temperature inside the first body. Therefore, the electronic device of the present invention has excellent heat dissipation efficiency.

Although the present invention has been disclosed as above by the embodiments, they are not intended to limit the present invention. Any person with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be defined by the scope of the attached patent application.

100, 100A~100D: Electronic devices

101: Heat Source

110: First Body

111: Bottom

111a, 111b: Air inlet

112: Back

112a: Air outlet

120: Second Body

130, 1301: Foot pad

1302:Inner Space

1303:Air outlet

140: Thermally conductive bracket

141: thermal coupling portion

142: Thermal support

150: Heat dissipation module

151:Heat pipe

151a: Evaporation end

151b: Condensation end

152, 1521: Heat sink fins

153: Fan

160a: first thermal interface material layer

160b: second thermal interface material layer

160c: Thermal interface material layer

170: Heat storage element

180: External fan

FIG. 1A is a partial schematic diagram of an electronic device of an embodiment of the present invention. FIG. 1B is a partial side schematic diagram of an electronic device of an embodiment of the present invention. FIG. 2 is a partial side schematic diagram of an electronic device of another embodiment of the present invention. FIG. 3 is a partial side schematic diagram of an electronic device of another embodiment of the present invention. FIG. 4 is a partial side schematic diagram of an electronic device of another embodiment of the present invention. FIG. 5 is a partial side schematic diagram of an electronic device of another embodiment of the present invention.

100: Electronic devices

110: First Body

111: Bottom

111a: Air inlet

112: Back side

112a: Air outlet

120: Second body

130: Foot pad

140: Thermal conductive bracket

142: Thermal support part

Claims (8)

An electronic device includes: a first body; a second body pivotally connected to the first body; a foot pad disposed at the bottom of the first body; a heat conductive bracket disposed at the bottom and plugged into the foot pad; a heat source located in the first body; and a heat dissipation module disposed in the first body and including: a heat pipe having an evaporation end thermally coupled to the heat source and a condensation end opposite to the evaporation end; a heat dissipation fin thermally coupled to the condensation end, and the heat conductive bracket thermally coupled to the heat dissipation fin, wherein the bottom of the first body has an air inlet, and the rear side of the first body has an air outlet, the heat dissipation fin is located between the fan and the air outlet, and the heat conductive bracket is located between the air inlet and the air outlet; and a fan is disposed corresponding to the condensation end and the heat dissipation fin. The electronic device as described in claim 1 further comprises: a first thermal interface material layer disposed in the first body and between the heat sink fin and the bottom; and a second thermal interface material layer disposed in the foot pad and between the thermally conductive bracket and the bottom, the heat sink fin being thermally coupled to the thermally conductive bracket through the first thermal interface material layer, the bottom and the second thermal interface material layer. The electronic device as described in claim 1, wherein the heat sink fin passes through the bottom and is inserted into the foot pad, and the electronic device further comprises: a thermal interface material layer disposed in the foot pad and between the heat sink fin and the thermally conductive bracket, and the heat sink fin is thermally coupled to the thermally conductive bracket through the thermal interface material layer. An electronic device as described in claim 1, wherein the foot pad has an internal space and an air outlet connected to the internal space, and the thermally conductive bracket is inserted into the internal space, and the bottom has an air inlet connected to the internal space. An electronic device as described in claim 1, wherein the thermally conductive bracket is a heat pipe. An electronic device as described in claim 1, wherein the thermally conductive bracket includes a thermal coupling portion and a thermally conductive supporting portion connected to the thermal coupling, the thermal coupling portion is plugged into the foot pad, and the thermally conductive supporting portion is located at the bottom. The electronic device as described in claim 6 further includes: a heat storage element, thermally coupled to the heat conductive support portion and located at the bottom. The electronic device as described in claim 7 further includes: an external fan, arranged at the bottom corresponding to the heat storage element.

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