TWI878083B - Manufacturing method of heat sink - Google Patents

Abstract

A method for manufacturing a heat spreader includes a printing step, a curing step, and an assembly step. The printing step includes: printing a printing material on a first metal plate through a pattern screen to form a printed pattern on the surface of the first metal plate, wherein the printing material includes a curable resin; the curing step includes: applying a curing method to the first metal plate with the printed pattern, and the printed pattern after curing includes at least one chamber support structure; the assembly step includes: laying at least one mesh sheet on the at least one chamber support structure, combining the first metal plate with the periphery of the second metal plate, and evacuating the space between the first metal plate and the second metal plate, thereby forming the heat spreader.

Description

Manufacturing method of heat exchange plate

The present invention relates to a heat dissipation device, in particular to a manufacturing method of a heat spreader and the heat spreader.

A vapor chamber is a sheet structure comprising an upper plate and a lower plate, with a vacuum chamber and a mesh structure between the upper and lower plates. The vacuum chamber is filled with a small amount of liquid. When the lower plate contacts a hot spot, the small amount of liquid in the vacuum chamber takes away a large amount of heat and quickly evaporates into gas, and condenses into droplets at a farther end. The liquid is then collected back to the location where the lower plate contacts the hot spot through the mesh structure to complete the heat dissipation cycle.

With the continuous development of technology, the demand for heat spreaders in various products is increasing day by day. As various electronic products begin to develop in the direction of light weight and thin size, the requirements for the size of heat spreaders are also increasing accordingly. With the demand for lightweight, heat spreaders are becoming thinner and thinner, and the distance between the upper plate and the lower plate is becoming narrower. The size of the vacuum chamber is compressed to a considerable extent. In the past, the liquid in the heat spreader was heated and turned into vapor. After the vapor is released, it can diffuse into the entire vacuum chamber. After the liquid in the vapor chamber is heated and turned into vapor, the vapor cannot diffuse effectively into the entire vacuum chamber because the vacuum chamber is too narrow and is affected by the back pressure. The vapor far from the hot spot is very thin, which means that only the entire thin heat sink is working near the hot spot, while the other parts cannot dissipate heat effectively, which will greatly reduce the heat dissipation efficiency.

Therefore, it can be seen that how to make the heat sink have good heat dissipation efficiency and at the same time be able to be mass-produced at low cost is a problem that all manufacturers need to solve urgently.

In view of this, the purpose of the present invention is to provide a method for manufacturing a vapor chamber, which can produce a vapor chamber with low cost and good heat dissipation efficiency.

In order to achieve the above-mentioned object, the present invention provides a method for manufacturing a vapor chamber, comprising a printing step, a curing step and an assembling step, wherein the printing step comprises: printing a printing material on a surface of a first metal plate through a pattern screen, so that the printing material forms a printing pattern on the surface of the first metal plate, wherein the printing material comprises a curable resin; the curing step comprises: applying a curing means to the first metal plate having the printing pattern, so that the printing pattern is cured, and the cured printing pattern comprises at least one chamber support The heat spreader is a heat spreader having a heat dissipation plate and a heat dissipation plate. ...

In order to achieve the above-mentioned purpose, the present invention provides another method for manufacturing a heat spreader, comprising a printing step, a curing step and an assembly step, wherein the printing step comprises: printing a printing material on a surface of a first metal plate through a pattern screen, so that the printing material forms a printing pattern on the surface of the metal plate, and the printing pattern includes a first cavity wall pattern, a second cavity wall pattern, an output channel pattern and a return channel pattern; wherein the printing material includes a curable resin; the curing step comprises: applying a curing means to the first metal plate having the printing pattern, so that the printing pattern is cured to form a partition structure, and the partition structure includes a first cavity wall structure, a second cavity wall structure, an output channel structure and A return channel structure; the assembly step includes: laying a first mesh in the area surrounded by the first cavity wall structure; laying a second mesh in the area surrounded by the second cavity wall structure; stacking a second metal plate on the first metal plate, with a surface of the second metal plate facing the surface of the first metal plate, and the first mesh and the second mesh are located between the surface of the first metal plate and the surface of the second metal plate; and combining the first metal plate and the second metal plate at their periphery, and evacuating the space between the first metal plate and the second metal plate so that the partition structure presses against the surface of the second metal plate, thereby forming the heat spreader; wherein, in the assembly step, the at least one mesh is attached with a cooling liquid.

The effect of the present invention is that the printing material in the manufacturing method of the heat spreader is a curable resin. The resin, which is initially in a fluid state, can be shaped into a printed pattern on the heat spreader, and then after curing, it can produce a supporting structure and a partition structure. The curable resin has the characteristics of high plasticity and low cost, which is conducive to the mass production of heat spreaders.

In order to more clearly explain the invention, a preferred embodiment is given and described in detail with drawings. Please refer to FIG1, which shows a manufacturing method of a heat spreader and a heat spreader of a first preferred embodiment of the invention. A heat spreader needs to be manufactured through a printing step S1, a curing step S2 and an assembly step S3. The manufacturing method of the heat spreader and the structure of the heat spreader are described together with FIGS. 2 to 8 below.

Please refer to FIG. 2 to FIG. 4 and FIG. 7, the manufacturing method of the heat spreader, a first metal plate 10 and a second metal plate 30 are selected as the printed substrate, the thickness of the first metal plate 10 is a distance D1, the distance D1 is between 0.03mm~0.1mm, the thickness of the second metal plate 30 is a distance D2, the distance D2 is between 0.03mm~0.1mm, in this embodiment, the distance D1 of the first metal plate 10 is 0.05mm, and the distance D2 of the second metal plate 30 is 0.05mm, wherein the first metal plate 10 and the second metal plate 30 are copper plates, but not limited thereto, and can also be stainless steel plates or other metal plates.

A first pattern screen O1, a second pattern screen O2 and a third pattern screen O3 are selected as screens for printing. Referring to FIG. 2, the first pattern screen O1 includes a first cavity wall mesh area O11, a second cavity wall mesh area O12, an output channel mesh area O13 and a return channel mesh area O14. Referring to FIG. 3, the second pattern screen O2 is a pattern screen for printing at least one chamber support structure on the first metal plate 10, and the second pattern screen O2 includes a second chamber support structure mesh area O21 (i.e., at least one chamber support structure mesh area). Referring to FIG. 4, the third pattern screen O3 includes a first chamber support structure mesh area O31.

A printing material is selected as the material used for printing. The printing material includes a curable resin, preferably a resin curable at a temperature below 150 degrees Celsius. In this embodiment, epoxy resin is used. The printing material can be adjusted to the corresponding components according to the purpose. In this embodiment, the printing material includes epoxy resin, which can be a single-component epoxy resin or a two-component epoxy resin. The single-component epoxy resin includes epoxy resin, a diluent, silicon dioxide and an additive carbon black. The single-component epoxy resin is different from the two-component epoxy resin. It will not cure immediately, but will harden after baking. Therefore, heating can be used as a curing means. Silicon dioxide can make the hardened one-component epoxy more resilient, carbon black is used for filling and discoloration; and the diluent is used to reduce the viscosity of the one-component epoxy. The diluent is, for example, benzene, xylene, etc., but not limited to this. The two-component epoxy is placed at room temperature to complete the crosslinking reaction and solidify. Therefore, a waiting time at room temperature can be used as a means of solidification. Whether it is a one-component or two-component epoxy, the cured epoxy has good thermal conductivity and is suitable for use as heat conduction in a vapor chamber.

Please refer to Figures 2 and 7. The printing step S1 includes: printing the printing material on a surface of the first metal plate 10 through the first pattern screen O1, and the printing material passes through the first cavity wall mesh area O11, the second cavity wall mesh area O12, the output channel mesh area O13 and the return channel mesh area O14 respectively, so that the printing material forms a first printing pattern P1 on the surface of the first metal plate 10. The first printing pattern P1 includes a first cavity wall pattern P11, a second cavity wall pattern P12, an output channel pattern P13 and a return channel pattern P14.

The curing step S2 includes: applying a curing means such as heating to the first metal plate 10 having the first printed pattern P1, which can be placed in an oven for heating. The heating temperature and the required time will vary depending on the usage amount and material size. Generally speaking, the heating temperature is controlled below 150 degrees Celsius to prevent the first metal plate 10 or the second metal plate 30 from being oxidized or deformed. In this embodiment, the heating temperature can be, for example, 120 degrees Celsius and the heating time can be, for example, 1 hour, so that the first printed pattern P1 is cured to form a partition structure 20, and the first cavity wall pattern P11 is cured. The first cavity wall structure 21 is formed by curing the second cavity wall pattern P12 to form a second cavity wall structure 22; the output channel pattern P13 is cured to form an output channel structure 23; the return channel pattern P14 is cured to form a return channel structure 24. The partition structure 20 includes the first cavity wall structure 21, the second cavity wall structure 22, the output channel structure 23 and the return channel structure 24. The thickness of the partition structure 20 is a distance D3, and the distance D3 is between 0.1 mm and 0.15 mm. In this embodiment, the distance D3 is 0.1 mm. The above-mentioned heating temperature and heating time are just examples. In practice, they can be adjusted accordingly according to the characteristics of the printing material used.

Please refer to Figures 3 and 7. The printing step S1 includes: printing the printing material on the surface of the first metal plate 10 through the second pattern screen O2, allowing the printing material to pass through the second chamber support structure mesh area O21, so that the printing material forms a second printing pattern P2 in the area surrounded by the second cavity wall structure 22 on the surface of the first metal plate 10, and the second printing pattern P2 includes a second cavity support pattern P21.

The curing step S2 includes: heating the first metal plate 10 having the second printed pattern P2 to cure the second printed pattern P2, and curing the second chamber support pattern P21 to form a second chamber support structure 70, wherein the second chamber support structure 70 constitutes at least one chamber support structure, and the thickness of the second chamber support structure 70 is a spacing D7, and the spacing D7 is between 0.05 mm and 0.1 mm. In the present embodiment, the spacing D7 is 0.05 mm, wherein the thickness of the second printed pattern P2 is less than the thickness of the first printed pattern P1; the thickness of the second chamber support structure 70 is less than the thickness of the partition structure 20.

Please refer to Figures 4 and 7. The printing step S1 includes: printing the printing material on a surface of the second metal plate 30 through the third pattern screen O3 so that the printing material passes through the first chamber support structure mesh area O31, so that the printing material forms a third printing pattern P3 on the surface of the second metal plate 30, and the third printing pattern P3 includes a first chamber support pattern P31.

The curing step S2 includes: heating the second metal plate 30 having the third printed pattern P3 to cure the third printed pattern P3, and curing the first chamber support pattern P31 to form a first chamber support structure 60, the thickness of the first chamber support structure 60 is a distance D6, and the distance D6 is between 0.05mm and 0.1mm. In this embodiment, the distance D6 is 0.05mm, wherein the thickness of the third printed pattern P3 is less than the thickness of the first printed pattern P1; the thickness of the first chamber support structure 60 is less than the thickness of the partition structure 20.

In the printing step S1 and the curing step S2, the printing sequence of the first metal plate 10 and the second metal plate 30 is not limited to the above description. In addition, the heating sequence of the first metal plate 10 and the second metal plate 30 is also not limited to the above description.

Please refer to Figures 5 to 7. The manufacturing method of the heat spreader includes selecting a first mesh 40 and a second mesh 50 as the mesh structure in the heat spreader, the thickness of the first mesh 40 is a spacing D4, and the spacing D4 is between 0.03mm and 0.06mm. The thickness of the second mesh 50 is a spacing D5, and the spacing D5 is between 0.03mm and 0.06mm. In this embodiment, the first mesh 40 and the second mesh 50 are both copper meshes, the thickness of the first mesh 40 is 0.045mm, and the thickness of the second mesh 50 is 0.045mm.

The assembly step S3 includes: laying the first mesh 40 in the area surrounded by the first cavity wall structure 21 of the first metal plate 10, in this embodiment, the first mesh 40 is attached with a cooling liquid L, wherein the cooling liquid L can be a mixture of one or more of water, alcohol, acetic acid and acetone; laying the second mesh 50 in the area surrounded by the second cavity wall structure 22, and the second mesh 50 is located above the second cavity support structure 70; then the first metal plate 10 is combined with the periphery of the second metal plate 30, and the first cavity support structure 60 of the second metal plate 30 corresponds to the first cavity support structure 60 of the second metal plate 30. The area enclosed by the first cavity wall structure 21 of a metal plate 10 is evacuated to a vacuum or low pressure during the peripheral bonding process, so that the partition structure 20 presses against the surface of the second metal plate 30, wherein the bonding method can be gluing, welding, locking, etc., and the welding can be laser welding, solid state welding or rolling welding, etc., thereby forming a heat spreader 100, the thickness of the heat spreader 100 is a distance D, and the distance D is less than 0.35 mm, preferably, the distance D is less than 0.2 mm, and more preferably, the distance D is 0.16 mm.

In one embodiment, in the assembly step S3, the first mesh 40 laid on the first metal plate 10 may not be attached with the cooling liquid L first, but the cooling liquid L is injected between the first metal plate 10 and the second metal plate 30 during the vacuum process so that the cooling liquid L is attached to the first mesh 40.

The heat spreader 100 of the first preferred embodiment can be obtained by the first preferred embodiment of the manufacturing method of the heat spreader described above. The structure of the heat spreader 100 is described below.

Please refer to Figures 5 to 7, the heat spreader 100 includes the first metal plate 10, the partition structure 20, the second metal plate 30, the first mesh 40, the second mesh 50, the first chamber support structure 60 and the second chamber support structure 70, the first metal plate 10 has a surface, the second metal plate 30 has a surface, the periphery of the second metal plate 30 is combined with the periphery of the first metal plate 10, and the surface of the second metal plate 30 faces the surface of the first metal plate 10, the partition structure 20 is located between the surface of the first metal plate 10 and the surface of the second metal plate 30, in this embodiment, the partition structure 20 is arranged on the surface of the first metal plate 10, and the partition structure 20 is against the surface of the second metal plate 30.

The partition structure 20 includes the first cavity wall structure 21, the second cavity wall structure 22, the output channel structure 23 and the return channel structure 24. The area surrounded by the first cavity wall structure 21 is defined as the first cavity 211. The first cavity 211 has a first outlet 212 and a first inlet 213. The first outlet 212 is connected to the output channel structure 23, and the first inlet 213 is connected to the return channel structure 24. The first mesh 40 is attached to the cooling liquid L and is laid on the first cavity 211. 1, the first mesh sheet 40 is aligned with the first inlet portion 213; the first chamber support structure 60 is arranged on the surface of the second metal plate 30 and is located in the first chamber 211, the first chamber support structure 60 is against the side of the first mesh sheet 40 facing the second metal plate 30, wherein the thickness of the first chamber support structure 60 is less than the thickness of the partition structure 20, and the first chamber support structure 60 is a plurality of first convex columns 61, and there are gaps between the first convex columns 61 for the vapor of the coolant L to flow.

The area surrounded by the second cavity wall structure 22 is defined as a second cavity 221. The second cavity 221 has a second inlet 222 and a second outlet 223. The second inlet 222 is connected to the output channel structure 23, and the second outlet 223 is connected to the reflux channel structure 24. The second mesh 50 is laid on the second cavity 221, and the second mesh 50 is aligned with the second outlet 223. The second cavity supports the The structure 70 is arranged on the surface of the first metal plate 10 and is located in the second chamber 221. The second chamber supporting structure 70 is against the side of the second mesh 50 facing the first metal plate 10, wherein the thickness of the second chamber supporting structure 70 is less than the thickness of the partition structure 20. The second chamber supporting structure 70 is a plurality of second protrusions 71, and there are gaps between the second protrusions 71 for the vapor of the cooling liquid L to flow.

One end of the output channel structure 23 is connected to the first outlet 212 of the first chamber 211, and the other end is connected to the second inlet 222 of the second chamber 221. The output channel structure 23 includes a converging section 231, an accelerating section 232, and a plurality of supporting columns 233. One end of the converging section 231 is connected to the first outlet 212 of the first chamber 211, and the other end is connected to one end of the accelerating section 232. The width of the acceleration section 232 gradually narrows from the direction away from the first outlet portion 212; the width of the acceleration section 232 is smaller than the width of the confluence section 231, and the other end of the acceleration section 232 is connected to the second inlet portion 222 of the second chamber 221, wherein the support columns 233 are arranged in the confluence section 231 and the acceleration section 232, and there are pores between the support columns 233 for the vapor of the cooling liquid L to flow.

The reflux channel structure 24 has an outer wall 241, an inner wall 242 and a plurality of channel walls 243. The outer wall 241 is disposed at the outer edge of the first metal plate 10, the inner wall 242 is disposed inside the first metal plate 10, the channel walls 243 are disposed between the outer wall 241 and the inner wall 242, and a plurality of capillary channels 244 are disposed between the outer wall 241, the channel walls 243 and the inner wall 242. An inlet end of each of the capillary channels 244 is connected to the second chamber 22. 1, one outlet end of each of the capillary channels 244 is connected to the first inlet 213 of the first chamber 211, and the inlets and outlets of the capillary channels 244 are aligned with the first mesh sheet 40 and the second mesh sheet 50, which can greatly enhance the effectiveness of the capillary action, wherein the length of the outer wall 241 is greater than the length of any channel wall 243, and the length of any channel wall 243 is greater than the inner wall 242, and the lengths of the channel walls 243 gradually become shorter from the direction away from the outer wall 241 to the inside.

Please refer to FIG. 8 . When the heat spreader 100 is in use, the first metal plate 10 is in contact with a heat source H at a position corresponding to the first chamber 211 . The heat source H is, for example, an integrated circuit element. When the first chamber 211 is heated by the heat source H contacting the first metal plate 10, the cooling liquid L attached to the first mesh 40 is heated and evaporated into steam. The steam diffuses between the first protrusions 61. Most of the diffused steam flows into the first outlet portion 212 with a larger opening (rather than into the capillary channel 244 with a very narrow opening). After entering the output channel structure 23, the steam flows from the converging section 231 into the accelerating section 232. As the channel width gradually narrows, the speed of the steam also increases, thereby quickly passing through the output channel structure 23, passing through the second inlet 222 and being injected into the output channel structure 23. In the second chamber 221, the steam diffuses to the entire second chamber 221 through the pores of the second protrusions 71, and the steam condenses when it contacts the second mesh 50. The condensed droplets are attracted by the capillary action of the reflux channel structure 24, flow into the second outlet 223 and enter the capillary channels 244, and the inlets and outlets of the capillary channels 244 are close to the edge of the first mesh 40 and the edge of the second mesh 50. After the droplets flow back to the first chamber 211 along the capillary channels 244, they diffuse from the edge of the first mesh 40 to the entire first mesh 40, thereby completing the heat dissipation cycle. In this embodiment, since the first mesh 40 is against the surface of the first metal plate 10, the heat energy generated by the heat source H can be directly transferred from the first metal plate 10 to the first mesh 40, thereby accelerating the efficiency of evaporation of the cooling liquid L. The conventional thin heat spreader 100 is limited by the narrow thickness of the chamber, and it is difficult to diffuse to the entire chamber. The farther away from the hot spot, the thinner the steam is, which will result in only part of the chamber working to dissipate heat, and the other parts of the chamber are not included in the entire heat dissipation cycle. In addition to the first chamber 211, the heat spreader 100 of the present invention further adds a second chamber 221 and an output channel structure 23 and a return channel structure 24. The gaps between the support columns 233 in the output channel structure 23 are The thickness of the pores between the first protrusions 61 is greater than that of the first chamber 211, so that the vapor can flow into the output channel structure 23 from the first chamber 211 more easily, and the vapor can be transferred from the first chamber 211 to the second chamber 221 through the output channel structure 23. The second chamber 221 can make full use of the entire space to cooperate in heat dissipation, so that the vapor can stay away from the heat source H, and the condensed droplets can be guided back to the first chamber 211 through the reflux channel structure 24.

Please refer to Figures 9 to 11, which are a method for manufacturing a heat spreader according to a second preferred embodiment of the present invention. The second preferred embodiment is different from the first preferred embodiment in that only the first pattern screen O1 and a second pattern screen O2' are required, and the third pattern screen O3 is not required. The printing process of the first pattern screen O1 is the same as that described above and is not repeated here. The printing process of the second pattern screen O2' is described below.

The printing step S1 includes: printing the printing material on the surface of the first metal plate 10 through the second pattern screen O2’, and the printing material passes through a first chamber support structure mesh area O21’ and a second chamber support structure mesh area O22’ respectively, so that the printing material forms a second printing pattern P2’ in the area enclosed by the first cavity wall structure 21 and the area enclosed by the second cavity wall structure 22 on the surface of the first metal plate 10, and the second printing pattern P2’ includes the first cavity support pattern P21’ and the second cavity support pattern P22’.

The curing step S2 includes: heating the first metal plate 10 having the second printed pattern P2’ to cure the second printed pattern P2’, curing the first chamber support pattern P21’ to form the first chamber support structure 60, and curing the second chamber support pattern P22’ to form the second chamber support structure 70.

The assembly step S3 includes: laying the first mesh 40 in the area surrounded by the first cavity wall structure 21 of the first metal plate 10, the first mesh 40 is located above the first cavity support structure 60, and the first mesh 40 is attached to the cooling liquid L; then laying the second mesh 50 in the area surrounded by the second cavity wall structure 22, the second mesh 50 is located above the second cavity support structure 70; then using gluing, welding, locking, etc., the first metal plate 10 and the second metal plate 30 are combined at their periphery, and the space between the first metal plate 10 and the second metal plate 30 is evacuated to a vacuum, so that the partition structure 20 presses against the surface of the second metal plate 30, thereby forming a heat spreader 101. The second embodiment uses only two screens, which is simpler than the first embodiment and can be manufactured more quickly.

By using the second preferred embodiment of the manufacturing method of the heat spreader described above, the heat spreader 101 of the second preferred embodiment can be obtained. The structure of the heat spreader 101 is described below.

Please refer to Figures 9 to 11. The second preferred embodiment is different from the first preferred embodiment in that the first chamber support structure 60 is disposed on the surface of the first metal plate 10 and is located in the first chamber 211, and the first chamber support structure 60 is against the side of the first mesh 40 facing the first metal plate 10.

Please refer to FIG. 12 , which is a method for manufacturing a heat spreader according to a third preferred embodiment of the present invention. The third preferred embodiment is different from the first preferred embodiment in that only the first pattern screen O1 needs to be printed, and the second pattern screen O2 and the third pattern screen O3 are not required. The printing process of the first pattern screen O1 is described below.

The printing step S1 includes: printing the printing material on the surface of the first metal plate 10 through the first pattern screen O1, so that the printing material forms the first printing pattern P1 on the surface of the first metal plate 10.

The curing step S2 includes: heating the first metal plate 10 having the first printing pattern P1 to cure the first printing pattern P1 to form a partition structure 20, wherein the partition structure 20 includes the first cavity wall structure 21, the second cavity wall structure 22, the output channel structure 23 and the reflux channel structure 24.

The assembly step S3 includes: laying the first mesh 40 in the area surrounded by the first cavity wall structure 21 of the first metal plate 10, and the first mesh 40 is attached with the cooling liquid L; laying the second mesh 50 in the area surrounded by the second cavity wall structure 22; then combining the first metal plate 10 with the periphery of the second metal plate 30, and evacuating the space between the first metal plate 10 and the second metal plate 30 to a vacuum, so that the partition structure 20 presses against the surface of the second metal plate 30, thereby forming a heat spreader 102. In the third embodiment, only one pattern screen is used, and the process is simpler than that of the first embodiment, and the manufacturing process can also be faster.

The heat spreader 102 of the third preferred embodiment can be obtained by the third preferred embodiment of the manufacturing method of the heat spreader. The structure of the heat spreader 102 is described below.

Please refer to Figure 12. The heat spreader 102 of the third preferred embodiment of the present invention is different from the first preferred embodiment in that the heat spreader 102 does not have the first chamber support structure 60 and the second chamber support structure 70. In this embodiment, the first mesh 40 and the second mesh 50 have the functions of both the mesh structure and the support structure.

Please refer to Figure 13, which is a method for manufacturing a heat spreader according to a fourth preferred embodiment of the present invention. The fourth preferred embodiment is different from the first preferred embodiment in that the first metal plate 10 further includes a first hollow area 11, and the second metal plate 30 further includes a second hollow area 31. During assembly, the periphery of the first metal plate 10 is combined with the periphery of the second metal plate 30, and the periphery of the second hollow area 31 and the periphery of the first hollow area 11 need to be correspondingly combined to form a hollow area 80.

The heat spreader 103 of the fourth preferred embodiment can be obtained by the fourth preferred embodiment of the manufacturing method of the heat spreader. The structure of the heat spreader 103 is described below.

Please refer to Figure 13, which is a fourth preferred embodiment of the heat spreader 103 of the present invention. The difference from the first preferred embodiment is that the first metal plate 10 further includes a first hollow area 11, and the first hollow area 11 is surrounded by the first cavity wall structure 21, the second cavity wall structure 22, the output channel structure 23 and the return channel structure 24. The second metal plate 30 further includes a second hollow area 31, and the second hollow area 31 corresponds to the first hollow area 11. The periphery of the second hollow area 31 and the periphery of the first hollow area 11 are combined to form a hollow area 80. Since the present embodiment lacks the hollow area 80, the heat spreader 100 can become lighter, thereby achieving a lightweight effect.

Please refer to Figures 14 and 15, which are the heat spreader 104 of the fifth preferred embodiment of the present invention. A pattern screen O4 is selected as the screen used for printing. The pattern screen O4 includes a chamber support structure mesh area O41. The printing step S1 includes printing the printing material on the surface of the first metal plate 10 through the pattern screen O4. The printing material passes through the chamber support structure mesh area O41, so that the printing material forms a printing pattern P4 on the surface of the first metal plate 10. The printing pattern P4 has a protruding thickness, for example, between 0.05mm and 0.1mm.

The curing step S2 includes: placing the first metal plate 10 having the printed pattern P4 in an oven for heating to cure the printed pattern P4, and the printed pattern P4 after curing includes a cavity support structure 90, and the cavity support structure 90 has a protruding thickness, for example, between 0.05 mm and 0.1 mm.

The assembly step S3 includes: laying a mesh M on the chamber support structure 90, and then stacking a second metal plate 30 on the first metal plate 10, with one surface of the second metal plate 30 facing the surface of the first metal plate 10, and the mesh M is located between the surface of the first metal plate 10 and the surface of the second metal plate 30, combining the first metal plate 10 and the second metal plate 30 at their peripheries, and evacuating the space between the first metal plate 10 and the second metal plate 30, thereby forming the heat spreader 104.

In this embodiment, in the assembly step S3, the cooling liquid L attached to the mesh M is injected between the first metal plate 10 and the second metal plate 30 during the exhaust process, so that the cooling liquid L is attached to the mesh M. In one embodiment, the mesh M with the cooling liquid L attached can also be laid on the chamber support structure 90 first.

Please refer to FIG. 16 and FIG. 17 , the heat spreader 105 of the sixth preferred embodiment of the present invention is substantially the same as the second embodiment, except that the output channel structure 23 'is of equal width, and the return channel structure 24 'is a plurality of convex pillars. A first pattern screen O5 and a second pattern screen O6 are selected as screens for printing, and the first pattern screen O5 includes a first cavity wall mesh area O51, a second cavity wall mesh area O52, an output channel mesh area O53, and a return channel mesh area O54. The second pattern screen O6 includes a first chamber support structure mesh area O61 and a second chamber support structure mesh area O62.

The printing step S1 includes printing the printing material on the surface of the first metal plate 10 through the first pattern screen O5, and the printing material passes through a first cavity wall mesh area O51, a second cavity wall mesh area O52, an output channel mesh area O53, and a return channel mesh area O54, so that the printing material forms a printing pattern P5 on the surface of the first metal plate 10. The printing pattern P5 has a protruding thickness, for example, between 0.1mm and 0.15mm.

The curing step S2 includes: placing the first metal plate 10 having the printed pattern P5 in an oven for heating to cure the printed pattern P5, and the printed pattern P5 after curing includes a first cavity wall structure 21', a second cavity wall structure 22', an output channel structure 23', and a return channel structure 24', and the thickness of the aforementioned structures is, for example, between 0.1mm and 0.15mm.

Next, the printing step S1 is performed, and the printing material is printed on the surface of the first metal plate 10 through the second pattern screen O6. The printing material passes through the first chamber support structure mesh area O61 and the second chamber support structure mesh area O62, so that the printing material is on the first chamber support structure 60' and the second chamber support structure 70' of the first metal plate 10, so that the printing material forms a printing pattern P6 on the surface of the first metal plate 10. The first chamber support structure 60' and the second chamber support structure 70' have a protruding thickness, for example, between 0.05mm and 0.1mm.

Then, the assembly step is performed to form the heat spreader 105 .

It is also noted that in the above-mentioned embodiments, the printing material may also be a UV curable resin, which includes a resin and a photosensitizer. The UV curable resin changes from a fluid state to a solid state after being irradiated with UV rays. In the curing step S2, UV irradiation may be used as a curing means, that is, a UV lamp is used to emit UV rays to irradiate various printed patterns on the first metal plate 10 and/or the second metal plate 30, so that the printed patterns are cured to form corresponding structures, thereby curing can be performed at room temperature without heating.

The above description is only the preferred embodiment of the present invention. Any equivalent changes made by applying the present invention specification and the scope of patent application should be included in the patent scope of the present invention.

100,101,102,103,104,105: heat spreader 10: first metal plate 11: first hollow area 20: partition structure 21,21’: first cavity wall structure 211: first cavity 212: first outlet 213: first inlet 22,22’: second cavity wall structure 221: second cavity 222: second inlet 223: second outlet 23,23’: output channel structure 231: confluence section 232: acceleration section 233: support column 24,24’: return channel structure 241: outer wall 242: inner wall 243: channel wall 244: capillary channel 30: Second metal plate 31: Second hollow area 40: First mesh 50: Second mesh 60,60’: First chamber support structure 61: First convex column 70,70’: Second chamber support structure 71: Second convex column 80: Hollow area 90: Chamber support structure L: Cooling liquid S1: Printing step S2: Curing step S3: Assembly step O1: First pattern screen O11,O51: First cavity wall mesh area O12,O52: Second cavity wall mesh area O13,O53: Output channel mesh area O14,O54: Reflow channel mesh area O2,O2’: Second pattern screen O21, O22’, O62: Second chamber support structure mesh area O3: Third pattern screen O31, O21’, O61: First chamber support structure mesh area O4: Pattern screen O41: Chamber support structure mesh area O5: First pattern screen O6: Second pattern screen P1: First printed pattern P11: First chamber wall pattern P12: Second chamber wall pattern P13: Output channel pattern P14: Reflow channel pattern P2, P2’: Second printed pattern P21, P22’: Second chamber support pattern P3: Third printed pattern P31, P21’: First chamber support pattern P4, P5, P6: Printed pattern M: Mesh H: Heat source D,D1,D2,D3,D4,D5,D6,D7: Spacing

FIG. 1 is a flow chart of the manufacturing method of the heat spreader of the first preferred embodiment of the present invention. FIG. 2 is a schematic diagram of the manufacturing method of the heat spreader of the first preferred embodiment of the present invention, revealing a first pattern screen and a first metal plate printed and cured by the first pattern screen. FIG. 3 is a schematic diagram of the manufacturing method of the heat spreader of the first preferred embodiment of the present invention, revealing a second pattern screen and a first metal plate printed and cured by the second pattern screen. FIG. 4 is a schematic diagram of the manufacturing method of the heat spreader of the first preferred embodiment of the present invention, revealing a third pattern screen and a second metal plate printed and cured by the third pattern screen. FIG5 is a schematic diagram of the manufacturing method of the heat spreader of the first preferred embodiment of the present invention, revealing that a first mesh and a second mesh are respectively placed in a first chamber and a second chamber, and the second metal plate is assembled with the first metal plate. FIG6 is a schematic diagram of the manufacturing method of the heat spreader of the first preferred embodiment of the present invention, revealing that the periphery of the second metal plate and the periphery of the first metal plate are welded. FIG7 is a cross-sectional structure of various parts of the heat spreader of the first preferred embodiment of the present invention, wherein (a) is a cross-sectional schematic diagram of the first chamber, (b) is a cross-sectional schematic diagram of an output channel structure, (c) is a cross-sectional schematic diagram of the second chamber, and (d) is a cross-sectional schematic diagram of a reflux channel structure. FIG8 is a schematic diagram of the flow direction inside the heat spreader of the first preferred embodiment of the present invention. FIG. 9 is a schematic diagram of the manufacturing method of the heat spreader of the second preferred embodiment of the present invention, revealing a second pattern screen and a first metal plate printed and cured by the second pattern screen. FIG. 10 is a schematic diagram of the manufacturing method of the heat spreader of the second preferred embodiment of the present invention, revealing that the first mesh and the second mesh are respectively placed in the first chamber and the second chamber, and the second metal plate is assembled with the first metal plate. FIG. 11 is a schematic diagram of the heat spreader of the second preferred embodiment of the present invention, revealing a cross-sectional schematic diagram of the first chamber. FIG. 12 is a schematic diagram of the manufacturing method of the heat spreader of the third preferred embodiment of the present invention, revealing that the first mesh and the second mesh are respectively placed in the first chamber and the second chamber, and the second metal plate is assembled with the first metal plate. FIG. 13 is a schematic diagram of a method for manufacturing a heat spreader in the fourth preferred embodiment of the present invention, revealing that the heat spreader has a hollow area. FIG. 14 is a schematic diagram of a method for manufacturing a heat spreader in the fifth preferred embodiment of the present invention, revealing a pattern screen and a first metal plate printed and cured by the pattern screen. FIG. 15 is a schematic diagram of a method for manufacturing a heat spreader in the fifth preferred embodiment of the present invention, revealing that a mesh sheet is laid on a chamber support structure, and the second metal plate is assembled with the first metal plate. FIG. 16 is a schematic diagram of a method for manufacturing a heat spreader in the sixth preferred embodiment of the present invention, revealing a first pattern screen and a second pattern screen, the first pattern screen and the first metal plate printed and cured by the first pattern screen. FIG17 is a schematic diagram of a manufacturing method of a heat spreader in the sixth preferred embodiment of the present invention, showing the assembly of the second metal plate and the first metal plate.

S1: Printing step

S2: Curing step

S3: Assembly step

Claims (10)

A method for manufacturing a heat spreader comprises the following steps: A printing step, comprising: Printing a printing material on a surface of a first metal plate through a pattern screen, so that the printing material forms a printing pattern on the surface of the first metal plate, wherein the printing material comprises a curable resin; A curing step, comprising: Applying a curing means to the first metal plate having the printing pattern to cure the printing pattern, and the cured printing pattern comprises at least one chamber support structure; An assembly step, comprising: Laying at least one mesh on the at least one chamber support structure; Stacking a second metal plate on the first metal plate, with a surface of the second metal plate facing the surface of the first metal plate, and the at least one mesh being located between the surface of the first metal plate and the surface of the second metal plate; and The periphery of the first metal plate and the second metal plate are combined, and the space between the first metal plate and the second metal plate is evacuated, thereby forming the heat spreader; Wherein, in the assembly step, the at least one mesh sheet is attached with a cooling liquid. The manufacturing method of the heat spreader as described in claim 1, wherein the printing step includes printing the printing material on the surface of the first metal plate through a first pattern screen, so that the printing material forms a first printing pattern on the surface of the first metal plate; the first printing pattern includes a first cavity wall pattern, a second cavity wall pattern, an output channel pattern and a return channel pattern; wherein in the curing step, the first metal plate having the first printing pattern is subjected to the curing means, so that the first printing pattern is cured to form a A partition structure, the partition structure includes a first cavity wall structure, a second cavity wall structure, an output channel structure and a return channel structure; wherein the pattern screen is a second pattern screen; in the printing step, the printing material is printed on the surface of the first metal plate through the second pattern screen, so that the printing material forms a second printing pattern in the area surrounded by the second cavity wall structure on the surface of the first metal plate, the second printing pattern includes a second cavity support pattern, and the second printing pattern constitutes the printing pattern; The curing step includes: applying the curing means to the first metal plate having the second printed pattern to cure the second printed pattern, and the second chamber support pattern is cured to form a second chamber support structure, and the second chamber support structure constitutes the at least one chamber support structure; In the assembling step, the at least one mesh sheet includes a first mesh sheet and a second mesh sheet, the first mesh sheet is laid in the area surrounded by the first chamber wall structure, the second mesh sheet is laid in the area surrounded by the second chamber wall structure, and the second mesh sheet is stacked on the chamber support structure. A method for manufacturing a heat spreader as described in claim 2, wherein the thickness of the chamber support structure is less than the thickness of the partition structure. The manufacturing method of the heat spreader as described in claim 2, wherein the printing step includes: printing a third printing material on the surface of the second metal plate through a third pattern screen, so that the printing material forms a third printing pattern on the surface of the second metal plate, and the third printing pattern includes a first chamber support pattern; wherein the curing step includes: applying the curing means to the second metal plate having the third printing pattern, so that the third printing pattern is cured, and the first chamber support pattern is cured to form a first chamber support structure; wherein in the assembly step, the first chamber support structure of the second metal plate corresponds to the area surrounded by the first chamber wall structure of the first metal plate. A method for manufacturing a heat spreader as described in claim 4, wherein the thickness of the first chamber support structure is less than the thickness of the partition structure. The manufacturing method of the heat spreader as described in claim 1, wherein the printing step includes printing the printing material on the surface of the first metal plate through a first pattern screen, so that the printing material forms a first printing pattern on the surface of the first metal plate; the first printing pattern includes a first cavity wall pattern, a second cavity wall pattern, an output channel pattern and a return channel pattern; wherein in the curing step, the first metal plate having the first printing pattern is subjected to the curing means, so that the first printing pattern is cured to form a separation structure, and the separation structure includes a first cavity wall structure, a second cavity wall pattern, an output channel pattern and a return channel pattern. Two cavity wall structures, an output channel structure and a return channel structure; wherein the pattern screen is a second pattern screen; in the printing step, the printing material is printed on the surface of the first metal plate through the second pattern screen, so that the printing material forms a second printing pattern on the surface of the first metal plate, and the second printing pattern includes a first cavity support pattern and a second cavity support pattern, the first cavity support pattern is located in the area surrounded by the first cavity wall structure, the second cavity support pattern is located in the area surrounded by the second cavity wall structure, and the second printing pattern constitutes the printing pattern; The curing step includes: applying the curing means to the first metal plate having the second printed pattern to cure the second printed pattern, wherein the at least one chamber support structure includes a first chamber support structure and a second chamber support structure, and the first chamber support pattern is cured to form the first chamber support structure, and the second chamber support pattern is cured to form the second chamber support structure; In the assembling step, the at least one mesh includes a first mesh and a second mesh, the first mesh is laid in the area surrounded by the first cavity wall structure and the first mesh is overlapped on the first cavity support structure, and the second mesh is laid in the area surrounded by the second cavity wall structure and the second mesh is overlapped on the second cavity support structure. A method for manufacturing a heat spreader as described in claim 6, wherein the thickness of the first chamber support structure and the thickness of the second chamber support structure are less than the thickness of the partition structure. A method for manufacturing a heat spreader as described in claim 1, wherein the first metal plate includes a first hollow area, and the second metal plate includes a second hollow area, and wherein in the assembly step, the periphery of the second hollow area is combined with the periphery of the first hollow area to form a hollow area. A method for manufacturing a heat spreader as described in claim 1, wherein the curable resin of the printing material is an epoxy resin or an ultraviolet curing resin. A method for manufacturing a heat spreader comprises the following steps: A printing step, comprising: Printing a printing material on a surface of a first metal plate through a pattern screen, so that the printing material forms a printing pattern on the surface of the metal plate, the printing pattern comprising a first cavity wall pattern, a second cavity wall pattern, an output channel pattern and a return channel pattern; wherein the printing material comprises a curable resin; A curing step, comprising: Applying a curing means to the first metal plate having the printing pattern, so that the printing pattern is cured to form a partition structure, the partition structure comprising a first cavity wall structure, a second cavity wall structure, an output channel structure and a return channel structure; An assembling step, comprising: Laying a first mesh in the area surrounded by the first cavity wall structure; laying a second mesh in the area surrounded by the second cavity wall structure; Laying a second metal plate on the first metal plate, with one surface of the second metal plate facing the surface of the first metal plate, and the first mesh and the second mesh are located between the surface of the first metal plate and the surface of the second metal plate; and Combining the periphery of the first metal plate and the second metal plate, and evacuating the space between the first metal plate and the second metal plate, so that the partition structure presses against the surface of the second metal plate, thereby forming the heat spreader; Wherein, in the assembly step, the at least one mesh is attached with a cooling liquid.