TWI877801B - Galvanic plating apparatus and method for galvanically plating a component carrier structure - Google Patents

Abstract

A galvanic plating apparatus (100) and a method for galvanically plating a component carrier structure(102), the galvanic plating apparatus (100) comprises an anode (104) split into a plurality of separate anode parts (106), each config-ured for providing a separate current density to an assigned section (120) of the component carrier structure (102), for providing a spatially dependent current density profile over an extension of the component carrier structure (102) to be galvanically plated.

Description

Electroplating apparatus and method for electroplating a component carrier structure

The present invention relates to an electroplating device and an electroplating method for electroplating a component carrier structure.

Against the background of increasing product functionality of component carriers equipped with one or more electronic components, the increasing miniaturization of electronic components and the increasing number of electronic components mounted on component carriers (e.g. printed circuit boards), increasingly powerful array-like components or packages with a plurality of electronic components are being used, which have a plurality of contacts or connections with increasingly smaller spacings between these contacts. Removing the heat generated by such electronic components and the component carriers themselves during operation is becoming an increasingly serious problem. At the same time, the component carrier should be mechanically robust and electrically reliable in order to be able to operate even under adverse conditions. When electroplating electrically conductive structures of component carriers, a well-defined thickness or thickness distribution may be desired but is difficult to obtain.

The object of the present invention is to allow the manufacture of component carriers with a well-defined thickness or thickness distribution with respect to electrically conductive structures. To achieve the above object, an electroplating apparatus and an electroplating method for electroplating component carrier structures according to exemplary embodiments of the present invention are provided. According to an exemplary embodiment of the present invention, a plating device for electroplating a component carrier structure is provided, wherein the plating device includes: an anode, which is divided into a plurality of separate anode parts, each anode part being configured to provide a separate current density (especially a separate controllable current density, separate from and independent of the current density of one or more other anode parts) to a designated section of the component carrier structure, so as to provide a spatially related current density distribution over an extension of the component carrier structure to be electroplated. According to an exemplary embodiment of the present invention, a method for electroplating a component carrier structure is provided, wherein the method comprises: dividing an anode into a plurality of separate anode portions, and providing a separate current density to a specified section of the component carrier structure through each anode portion, so as to provide a spatially related current density distribution over an extension of the component carrier structure to be electroplated. In the context of the present application, the term "component carrier" may specifically refer to any support structure capable of directly or indirectly accommodating one or more components thereon and/or therein to provide mechanical support and/or electrical connectivity. In other words, the component carrier may be configured as a mechanical and/or electronic carrier for components. Specifically, the component carrier can be one of a printed circuit board, an organic interposer and an IC (integrated circuit) substrate. The component carrier can also be a hybrid board combining different component carriers of the above-mentioned types of component carriers. In the context of the present application, the term "component carrier structure" can specifically refer to a physical structure including one or more component carriers or preforms thereof. For example, the component carrier structure can be the component carrier itself. It is also possible that the component carrier structure includes multiple component carriers, such as an array of component carriers or a panel including component carriers. In addition, it is also possible that the component carrier structure is a structure obtained during the manufacture of the component carrier, such as a panel or array of preforms including multiple component carriers that can still be connected as a whole. In the context of the present application, the term "electroplating" may specifically denote electroplating of a metal, in particular copper, using an aqueous solution (which may also be denoted as an electrolyte) containing the metal to be deposited as ions (e.g. in the form of a dissolved metal salt). During electroplating, an electric field may be applied between an anode and an at least partially electrically conductive workpiece in the form of a component carrier structure, which may serve as a cathode or may be electrically connected to a cathode. As a result, positively charged metal ions may be forced to move to the cathodic component carrier structure, where they give up their charge and deposit themselves as metal on the surface of the component carrier structure. Thus, the ions will be strongly forced by the electric field and the applied potential to pick up the negatively charged electrons provided by the cathode. During electroplating, a direct current (DC) can be applied between the anode and the cathode. This allows electroplating to be completed in a fast and efficient manner. However, electroplating can also be performed by applying a pulsed current (especially a current distribution with alternating pulses of positive and negative signs), wherein a short phase of the pulse with a negative sign can cause temporary metal removal instead of metal deposition, for example to compensate for overplating. When a pulsed current distribution is used, the uniformity of the thickness of the metal (especially copper) deposited on the surface of the component carrier structure can be improved. Exemplary embodiments of the present invention may use either direct current plating and pulsed plating of the component carrier structure. Thus, the electro-deposited metal structure on the component carrier structure may be formed by plating or electroplating. One or more plating stages may be performed to adjust the thickness of the electro-deposited metal layer, and in particular to selectively form multiple sub-layers of the electro-deposited metal layer. In the context of the present application, the term "anode" may specifically refer to an electrode immersed in a plating bath during electroplating. The anode may be an electrode to which a first (e.g., positive) voltage or current is applied (at least during the main part of the plating process). In contrast, a cathode may refer to another electrode used during electroplating and electrically connected to a component carrier structure to be plated during the electroplating process. A cathode may be an electrode to which a second (e.g., negative) voltage or current is applied (at least in the main part of the plating process). An anode may be defined as an electrode at which an oxidation reaction occurs. Correspondingly, a cathode may be defined as an electrode at which a reduction reaction occurs. In the context of the present application, the term "anodous portion configured to provide a separate current density" may specifically refer to electrically separated portions of a common electroplated anode, which portions may be configured so that separate currents with different current densities may be applied to different anode portions in the anode portion. The current density may represent the amount of charge flowing through a selected cross-sectional area at a time. The current density may be measured in amperes per square meter. Specifically, different anode parts may have electrically separated supply lines to a current source or rectifier, so that different current density values and different absolute current values may be selected and applied to each anode part. For example, a control unit may be provided for correspondingly controlling the current source and the anode parts. In the context of the present application, the term "providing a spatially correlated current density distribution over an extension of the component carrier structure" may specifically mean that the component carrier structure is spatially arranged relative to the anode portion and has a distance from the anode portion, so that different portions of the component carrier structure that are spatially aligned with the corresponding anode portion experience different plating current values so as to be plated with different plating efficiencies. There may be no direct physical contact between the anode portion and the component carrier structure to avoid electrical short circuits. For example, the above-mentioned spatial relationship between the parts of the component carrier structure and the anode parts can be adjusted during the movement of the component carrier structure along the electroplating line or when the component carrier structure is stationary (temporarily or permanently) at a certain position of the electroplating line. For example, in the case where the specification of the component carrier manufactured based on the component carrier structure requires different metal densities in different parts of the component carrier, applying the same current density to the entire component carrier structure may result in non-uniformity of copper thickness distribution. Therefore, a more uniform copper thickness distribution over the component carrier structure can be achieved by selecting different current densities for different anode parts. According to an exemplary embodiment of the present invention, an anode divided into a plurality of separate anode portions can be used to electroplate a component carrier structure. Each of the anode portions can be electrically connected to a current source so as to be controllable, thereby providing a separate current density, which can be selected differently for different anode portions and is independent of the current density of other anode portions. Each anode portion can be spatially assigned to a corresponding portion or section of the component carrier structure to be plated, so that a separate current density can be applied to each portion of the component carrier structure during electroplating. Since the component carrier structure can be used as a cathode or can be electrically connected to a cathode during the electroplating process, the efficiency of the electrometal deposition on different sections of the component carrier structure can be adjusted differently due to the different current densities of the anode parts. Therefore, inherent, design-related and/or artificially caused inhomogeneities of the copper deposition efficiency in different sections of the component carrier structure can be at least partially balanced or equalized by corresponding current density distributions provided by the separately powered anode parts. Descriptively speaking, inhomogeneities in the metal deposition efficiency of different sections of the component carrier structure can be at least partially compensated by an inverse inhomogeneity of the metal deposition efficiency set by the anode parts providing the correspondingly adjusted spatially related current density distributions. By providing a spatially correlated current density distribution over the extension of the component carrier structure to be electroplated, the copper thickness distribution over the extension of the component carrier structure can be made more uniform or at least more precisely definable. Advantageously, this can allow over-plating and under-plating of individual sections of the component carrier structure to be avoided. As a result, the yield of manufactured component carriers can be increased by reducing electroplating-related defects and the reliability of the obtained component carriers can be improved. Another advantageous technical effect of the exemplary embodiment is that dedicated sections or sections can have a different roughness compared to other sections or sections. For example, certain areas may be smooth and shiny, while other areas may be dull. Advantageously, this can be used for further manufacturing stages (in particular stages involving bonding). In the following, other exemplary embodiments of the electroplating apparatus and method will be described. In one embodiment, the electroplating apparatus includes a control unit, which is configured to individually control the current density applied to each anode portion in the anode portion. For example, such a control unit can be configured to execute an algorithm to limit the time correlation and/or spatial correlation of the current applied to each anode portion during the plating process. The corresponding control unit can thereby balance the metal thickness non-uniformity caused by undesirable phenomena in the case where the entire anode provides the same current density. In one embodiment, the control unit is configured to control the anode to adjust the spatially related current density distribution so that different sections of the component carrier structure are electroplated with different plating parameters. Specifically, the plating current and thus the plating efficiency can be controlled to be higher in a section of the component carrier structure that exhibits an inherently higher plating efficiency and is therefore subjected to a lower plating current, compared to another section of the anode portion of the component carrier structure that exhibits an inherently lower plating efficiency. In one embodiment, the control unit is configured to control the anode to adjust the spatially related current density distribution based on the temperature and/or pH value in the plating bath. For example, the temperature and/or pH value in the plating bath can be detected by corresponding sensors. Since the electrochemical reaction may strongly depend on the temperature and pH in the electrolytic bath, one or more pH and/or temperature sensors can be foreseen. Specifically, the potential and/or current can be adjusted according to the sensed pH value and/or the sensed temperature parameter. In one embodiment, the control unit is configured to dynamically control the current density applied to each anode portion, in particular to control the current density applied to each anode portion in a time-dependent manner. Advantageously, the spatially related current density distribution can be dynamically adjusted. Therefore, the control unit can control the anode portions so that their individually adjusted current densities vary with time. For example, in the case where the component carrier structure moves along the coating line and thereby passes by the stationary anode, the current density of each individual anode portion can be adjusted over time so that at each point in time, the currently designated section of the component carrier structure is subjected to a correspondingly adjusted current density of the currently designated anode portion. It is also possible that after the first part of the electroplating process, an uneven thickness distribution of the coating metal over the extension of the component carrier structure is determined, for example detected and/or modeled. In this case, the spatially related current density distribution resulting from the anode portions and their individual current densities can be selectively modified to at least partially compensate for the determined inhomogeneities. In one embodiment, the control unit is configured to control the anodic portion and additionally to control at least one subtractive process for removing metal from the component carrier structure (in that case, a portion of the component carrier may also be a portion of the anode). Such a subtractive process may be a process for removing portions of metal from the component carrier structure. For example, such a subtractive process may be etching or mechanical grinding. It is also possible that such a subtractive process forms part of an electroplating process with a reverse current, for example in pulse plating. In the case of an inhomogeneous metal distribution, there may be sections of the component carrier structure with a higher deposition rate (e.g. sections with a smaller target metal area according to the specification). In order to at least partially compensate for this phenomenon, a negative current can be temporarily applied through the anodic portions of the anodic portions that are spatially assigned to the segments of the component carrier structure, which can lead to temporary metal removal in these segments. By taking this measure, local overplating can be suppressed. In one embodiment, the control unit is configured to control the anodic portions and additionally control at least one additive process for applying metal to the component carrier structure, thereby providing a predefined, in particular uniform, metal distribution on the component carrier structure. In the case of an inhomogeneous metal distribution, there may be segments of the component carrier structure with a lower deposition rate (e.g., segments with more target metal area according to the specification). In order to at least partially balance these phenomena, an additional additive process can be performed to locally thicken the metal in such a section of the component carrier structure. For example, such an additional additive process can be a further electroplating stage that is selectively performed only on such a section of the component carrier structure. It is also possible to add metal to certain sections of the component carrier structure in a spatially related manner by electroless deposition, sputtering, chemical deposition of metal, etc. By taking such measures, local under-plating can be avoided. In one embodiment, the control unit is configured to control the current density applied to each anode part, so that a metal pattern is formed on the component carrier structure according to a predefined target specification. For example, the design of a component carrier to be manufactured (e.g., a printed circuit board) can be stored in a design file, which includes data defining the target specifications for multiple parameters of the manufacturing process. The design file may also include information about the shape and position of the metal pattern of the component carrier and the target thickness. The control unit can access information indicating the predefined design (e.g., the design file mentioned above can be accessed), and the electroplating process can be performed, and in particular, the separated anode parts and their respective current densities can be controlled. In an embodiment with a constant current plating mode, the current density can be fixed, and the applied potential can be variable. However, it is also possible that the potential is fixed in an embodiment, while the current density is variable (this can be represented as a constant potential plating mode). In one embodiment, the control unit is configured to control the current density applied to each anode portion so as to form a metal pattern with uniform thickness on the component carrier structure. This may also include the process of filling cavities and/or through-holes. Therefore, the control goal of the control unit may be to achieve a metal pattern of the same thickness over the entire component carrier structure. In order to achieve this control goal, the inherent spatially related metal plating efficiency in different sections of the component carrier structure may be taken into account. Specifically, this may include taking into account the phenomenon that the actually obtained metal thickness may depend on the ratio of the metallized surface area to the entire surface area of a specific section of the component carrier structure according to a predefined specification. Typically, a higher metal thickness is obtained in areas with a lower ratio and vice versa. The control unit can calculate and apply a spatially related current density distribution of the anode parts to compensate for this phenomenon, that is, providing a higher current density distribution in a higher ratio section of the component carrier structure. In one embodiment, the control unit is configured to apply different potentials to different anode parts. Therefore, different anode parts may have different voltages relative to the cathode formed by the component carrier structure. In one embodiment, different anode parts have different local sections. By providing different anode parts with different local sections, additional design parameters are provided for producing spatially related metal deposition efficiency distributions. In one embodiment, the electroplating apparatus comprises a plurality of electroplating cells through which the component carrier structure is sequentially conveyed during electroplating, wherein at least one of the electroplating cells comprises an anode, in particular each of the electroplating cells comprises an anode which is divided into a plurality of separate anode portions. For example, the component carrier structure to be electroplated may be sequentially moved through the plurality of electroplating cells. For example, electroplating may be started after imaging the component carrier structure with a dry film corresponding to the metal pattern formed by electrodeposition. Thereafter, one or more electroplating stages, for example copper plating, may be carried out in one electroplating tank or in a plurality of electroplating tanks arranged in series. Thereafter, it is possible to form a surface treatment, for example by plating a thin layer of tin on the electroplated copper. One, some or all of the electroplating tanks may be equipped with separate anodes providing a spatially relevant current density distribution. This may promote uniform metal deposition in each individual electroplating tank. In addition, this can also advantageously allow a subsequent electroplating cell to adjust the current density distribution of its split anode to compensate for the uneven metal deposition of the previous electroplating cell. Before the component carrier structure is treated in one or more electroplating cells, the component carrier structure can be subjected to pre-treatment, such as cleaning and/or micro-etching. After the component carrier structure is treated in one or more electroplating cells, the component carrier structure can be subjected to post-treatment, such as rinsing and/or drying. In one embodiment, at least some of the anode portions are V or chevron shaped. Therefore, a V or chevron shaped pattern can be generated by the anode portion. An example of this design is shown in Figure 4. This V or ∧-shaped design of the anode portion of a separate anode or a plurality of separate anodes arranged serially has proven to be very suitable for triggering uniform metal deposition. By means of this V or ∧-shaped shape, it has been shown that the boundary portions between different sections of the panel-type component carrier structure can be appropriately influenced. In one embodiment, at least some of the anode portions have at least one sawtooth edge. Again, reference is made to FIG. 4 , which shows this sawtooth edge. The saw-shaped edge may be formed by a series of connected straight edge portions with an alternating sequence of inwardly tapering edge portions and outwardly tapering edge portions. For example, the inwardly tapering angle or the outwardly tapering angle of such edge portions measured relative to a linear edge (e.g. extending in a conveying direction of the component carrier structure) may be less than 30°, in particular less than 20°. In an embodiment, the anode divided into anode portions has an overall rectangular shape. Even when the individual anode parts are provided with V- or ∧-shaped edges and/or saw-shaped edges, the anode as a whole (i.e. formed by the anode parts as components) can also have a rectangular shape. The rectangular shape can correspond to the rectangular shape of the component carrier structure (in particular a panel) that is subjected to electroplating using the anode. This may help to form a uniform coating metal thickness over the extension of the component carrier structure. In one embodiment, the anode is divided into a plurality of individual anode parts in the conveying direction and/or transversely to the conveying direction, along which the component carrier structure is to be conveyed during electroplating. For example, one or more component carrier structures (e.g., four panel-type component carrier structures) can be mounted on one or more support structures and can be conveyed through one or more electroplating tanks. The support structure can create an electrical connection of at least one component carrier structure to a power source or a rectifier. When mounted on the support structure, at least one component carrier structure can then act as a cathode during the plating process. When conveyed through one or more electroplating tanks, the component carrier structure can pass through anode portions arranged along the conveying direction of the component carrier structure and/or anode portions arranged perpendicular to the conveying direction. Thus, the generation of a spatially correlated current density distribution can be accomplished along and/or transversely to the conveying direction. This may allow for further refinement of the electroplating process and in particular its ability to produce a metal structure of uniform thickness over the entire extension of the component carrier structure. In one embodiment, the electroplating apparatus comprises: a cathode electrically coupled to the component carrier structure to be electroplated; and at least one current source configured to apply an electric current with a selectable current density distribution between the anode and the cathode. The cathode may be electrically coupled to an electrically conductive structure of the component carrier structure so that the component carrier structure may also serve as a cathode during the electroplating process. If metal is removed from the component carrier structure by means of a reverse current flow (see the subtractive process described above), the component carrier structure may temporarily serve as an anode. Optionally, the component carrier may include an electrical decoupling portion, an anode portion and a cathode portion within the component carrier structure to prevent short circuits when current is applied. In one embodiment, the number of anodes and the number of cathodes may be different. Therefore, there may be different numbers of cathodes and anodes. Alternatively, there may be the same number of cathodes and anodes. In one embodiment, the electroplating apparatus includes a conveying mechanism for conveying the component carrier structure along the anodes, in particular, conveying the component carrier structure along at least a portion of the continuously arranged anode portions. Such a conveying mechanism can also drive a supporting structure (such as one or more flying rods), on which a component carrier structure or multiple component carrier structures can be mounted during the electroplating process. For example, the conveying mechanism can be configured to provide motive force to the supporting structure or the component carrier structure. In one embodiment, the conveying mechanism is configured to convey the component carrier structure in a horizontal orientation along at least some of the anode parts, in particular, to convey the component carrier structure in a direction parallel to the orientation of the anode parts. Preferably, the plate-like component carrier structure (such as a panel) can be horizontally oriented in the electroplating device during the electroplating process. The separated anode part can then be arranged above or below and parallel to the horizontally oriented component carrier structure. Alternatively, electroplating can also be performed in an electroplating apparatus using the separated anode part and the vertically oriented component carrier structure during the electroplating process. In one embodiment, the control unit is configured to control the anode or the method includes controlling the anode to provide a more uniform thickness distribution of the plating metal on the component carrier structure compared to a spatially independent current density over an extension of the component carrier structure. Thus, the current distribution over the extension of the anode can be selected to be a spatially related distribution according to a control scheme that reduces the unevenness of the thickness distribution of the electroplated metal over the component carrier structure. Alternatively, the control unit can be configured to control the anode or the method includes controlling the anode to provide a metal structure with different heights in the vertical direction (for example, at a dedicated position in the component carrier structure). For example, it may be desired that one section on the panel should have twice the thickness of the copper to be plated compared to a different section. This can also be adjusted by a split anode configuration. Although the subject matter of exemplary embodiments may be to produce a copper structure with a low copper thickness distribution or no copper thickness distribution, there may also be applications where it is desirable to intentionally produce different copper thickness distributions, i.e., to produce different metal thicknesses in different regions of a component carrier structure. In one embodiment, the control unit is configured to or the method includes determining information indicative of a metal distribution over a component carrier structure to be electroplated, and adjusting or re-adjusting a spatially related current density distribution over an extension of the component carrier structure to reduce thickness variations of the metal distribution over the component carrier structure. In an alternative to the aforementioned embodiment, the metal distribution on the component carrier structure to be expected when performing the electroplating process can be theoretically modeled or calculated before the electroplating process is actually performed using an electroplating device with a separated anode part. This theoretical modeling or calculation can also take into account the specifications of the component carrier manufactured based on the processed component carrier structure. The specifications can in particular include information about the metal pattern on the surface of the component carrier structure to be formed by the electroplating process. In the context of this theoretical determination of the expected metal distribution, expert rules and/or empirical data can also be taken into account. For example, it may be believed that areas of the component carrier structure to be plated to form a higher density metal structure may exhibit lower plated metal thicknesses than areas of the component carrier structure to be plated to form a lower density metal structure may exhibit higher plated metal thicknesses. When such theoretical determination indicates that a non-uniform plated metal thickness distribution is expected, the spatially related current density distribution of the split anode portion may be adjusted to achieve a more balanced thickness distribution. For example, an anode portion facing a portion of a component carrier structure having a higher density of metal structures may be subjected to a higher current density than other anode portions facing a portion of a component carrier structure having a lower density of metal structures. In another alternative to the aforementioned embodiment, a physical measurement of the thickness distribution of the electro-deposited metal may be performed after part of the electroplating process. For example, such a measurement may be performed as an optical measurement and/or as an electrical measurement and/or in the form of a visual inspection by an operator. Thereafter, the spatially related current density distribution of the separated anode portions may be readjusted to balance the thickness distribution measured in a subsequent part of the electroplating process. In one embodiment, the component carrier structure comprises a panel, an array or a component carrier, in particular a printed circuit board. The component carrier may comprise a stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The at least one electrically conductive layer structure may be connected to an electrode, in particular a cathode or an anode. In one embodiment, the component carrier structure or the stack of component carriers comprises at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate of the mentioned electrically insulating layer structure(s) and electrically conductive layer structure(s), in particular a laminate formed by applying mechanical pressure and/or heat energy. The mentioned stacking piece can provide a plate-like component carrier that can provide a large mounting surface for additional components and still be very thin and compact. In one embodiment, the component carrier structure or the component carrier is formed as a plate. This contributes to a compact design, wherein the component carrier still provides a large base for mounting components thereon. In addition, bare chips, in particular as an example of embedded electronic components, can be conveniently embedded into thin plates such as printed circuit boards due to their small thickness. In one embodiment, the component carrier obtained from the component carrier structure is configured to include one of a printed circuit board, a substrate (in particular an IC substrate) and an intermediate layer. In the context of the present application, the term "printed circuit board" (PCB) may specifically denote a plate-like component carrier formed by pressing together several electrically conductive layer structures and several electrically insulating layer structures, for example, by applying pressure and/or by supplying thermal energy. As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may include resin and/or glass fiber, so-called prepreg or FR4 material. The various electrically conductive layer structures can be connected to each other in a desired manner by forming holes through the laminate, for example by laser drilling or mechanical drilling, and by partially or completely filling these holes with electrically conductive material, in particular copper, thereby forming vias or any other through-hole connections. The filled holes connect the entire stack (i.e., through-hole connections extending through multiple layers or the entire stack), or the filled holes connect at least two electrically conductive layers, i.e., so-called vias. Similarly, optical interconnects can be formed through the various layers of the stack to accommodate electro-optical circuit boards (EOCBs). In addition to one or more components that can be embedded in the printed circuit board, the printed circuit board is generally configured to accommodate one or more components on one surface or two opposite surfaces of the plate-shaped printed circuit board. The one or more components can be connected to the corresponding main surface by welding. The dielectric portion of the PCB can include a resin with reinforcing fibers (such as glass fibers). In the context of this application, the term "substrate" can specifically represent a small component carrier. The substrate can be a relatively small component carrier relative to the PCB, and one or more components can be mounted on the substrate and can serve as a connecting medium between one chip or more chips and another PCB. For example, the substrate can have substantially the same size as the component to be mounted thereon (especially an electronic component) (for example, in the case of a chip level package (CSP)). In another embodiment, the substrate can be significantly larger than the specified component (for example, in a flip chip ball grid array FCBGA configuration). More specifically, a substrate can be understood as a carrier for electrical connections or electrical grids, and a component carrier for lateral and/or vertically arranged connectors that are comparable to a printed circuit board (PCB) but have a relatively high density. The lateral connectors are, for example, electrical conduction paths, while the vertical connectors can be, for example, drill holes. These lateral and/or vertical connectors are arranged in the substrate and can be used to provide electrical, thermal and/or mechanical connections between accommodated components or non-accommodated components (such as bare chips), in particular IC chips, and a printed circuit board or an intermediate printed circuit board. Therefore, the term "substrate" also includes "IC substrate". The dielectric part of the substrate may include a resin with reinforcing particles (such as reinforcing spherical members, in particular glass ball accommodation). The substrate or the intermediate layer may include or be composed of a layer of at least one of the following: glass; silicon (Si) and/or a photosensitive or dry-etchable organic material such as an epoxy stack material (such as an epoxy stack film); or a polymer compound such as polyimide or polybenzoxazole (which may or may not include photosensitive and/or heat-sensitive molecules). In one embodiment, the at least one electrically insulating layer structure comprises at least one of the following: a resin or a polymer, such as an epoxy resin, a cyanate resin, a benzocyclobutene resin or a bismaleimide-triazine resin; a polyphenylene derivative (e.g., based on polyphenylene ether, PPE), a polyimide (PI), a polyamide (PA), a liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE) and/or a combination thereof. Reinforcement structures such as meshes, fibers, spheres or other types of filler particles, such as glass (multilayer glass), may also be used to form a composite. Semi-cured resins combined with reinforcing agents, such as fibers impregnated with the above resins, are called prepregs. These prepregs are often named after their performance, such as FR4 or FR5, which describes their flame retardant performance. Although prepregs, especially FR4, are generally preferred for rigid PCBs, other materials, especially epoxy-based laminate materials (e.g., laminate films) or photosensitive dielectric materials may also be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate ester resins may be preferred. In addition to these polymers, low temperature co-fired ceramics (LTCC) or other low, very low or ultra-low DK materials may be used as electrical insulating structures in component carriers. In one embodiment, the at least one electrically conductive layer structure comprises at least one of the following: copper, aluminum, nickel, silver, gold, palladium, tungsten, magnesium, carbon, (particularly doped) silicon, titanium and platinum. Although copper is generally preferred, other materials or coated variations thereof, particularly coated with superconducting materials or conductive polymers, such as graphene or poly (3,4-ethylenedioxythiophene) (PEDOT), respectively, are also possible. At least one component may be embedded in the stack and/or surface mounted on the stack. The component and/or the at least one further component may be selected from at least one of the following: a non-conductive inlay, a conductive inlay (e.g. a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g. a heat pipe), a light-conducting element (e.g. an optical waveguide or a light-conductor connector), an electronic component or a combination thereof. The inlay may be, for example, a metal block with or without a coating of insulating material (IMS-inlay), which may be embedded or surface mounted for the purpose of promoting heat dissipation. Suitable materials are defined according to the thermal conductivity of the material, which should be at least 2 W/mK. Such materials are typically based on, but not limited to, metals, metal oxides and/or ceramics, such as, for example, copper, aluminum oxide (Al ₂ O ₃ ) or aluminum nitride (AlN). Other geometric shapes with increased surface area are also often used to increase heat exchange capabilities. In addition, the components can be active electronic components (having at least one realized pn junction), passive electronic components such as resistors, inductors or capacitors, electronic chips, storage devices (e.g., DRAM or other data memory), filters, integrated circuits (e.g., field programmable gate arrays (FPGAs), programmable array logic (PALs), general purpose array logic (GALs), and complex programmable logic devices (CPLDs)), signal processing components, power management components (e.g., field effect transistors (FETs), metal oxide semiconductor field effect transistors (MOSFETs), complementary metal oxide semiconductors (CMOSs), junction field effect transistors (JFETs), or insulated gate field effect transistors (IGFETs), all of which are based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga ₂ O ₃ ) indium gallium arsenide (InGaAs), indium phosphide (InP), and/or any other suitable inorganic compound), optoelectronic interface elements, light emitting diodes, optocouplers, voltage converters (e.g., DC/DC converters or AC/DC converters), cryptographic components, transmitters and/or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips and energy harvesting units. However, other components may also be embedded in the component carrier. For example, a magnetic element may be used as a component. Such a magnetic element may be a permanent magnetic element (e.g., a ferromagnetic element, an antiferromagnetic element, a multiferroic element or a ferrimagnetic element, such as a ferrite core) or may be a paramagnetic element. However, the component can also be an IC substrate, an intermediate layer or other component carrier, for example in a board-in-board configuration. The component can be surface-mounted on the component carrier and/or can be embedded in the interior of the component carrier. In addition, other components can also be used as components, in particular components that generate and emit electromagnetic radiation and/or are sensitive to electromagnetic radiation propagated from the environment. In one embodiment, the component carrier obtained from the component carrier structure is a laminated component carrier. In this embodiment, the component carrier is a composite of a multi-layer structure that is stacked and connected together by applying pressure and/or heat. After the internal layer structure of the component carrier is processed, one main surface or two opposite main surfaces of the processed layer structure can be covered symmetrically or asymmetrically with one or more additional electrically insulating layer structures and/or electrically conductive layer structures (in particular, by lamination). In other words, the stacking can be continued until the desired number of layers is obtained. After the formation of the stack having the electrically insulating layer structure and the electrically conductive layer structure is completed, the obtained layer structure or component carrier can be surface treated. In particular, in terms of surface treatment, an electrically insulating solder resist can be applied to one main surface or two opposite main surfaces of the layer stack or component carrier. For example, such a solder resist may be formed over the entire major surface and the layer of the solder resist may be subsequently patterned to expose one or more electrically conductive surface portions, which will be used to electrically couple the component carrier to the electronic peripheral. The surface portions of the component carrier that remain covered with the solder resist, particularly the surface portions containing copper, may be effectively protected from oxidation or corrosion. In terms of surface treatment, a surface treatment may also be selectively applied to the exposed electrically conductive surface portions of the component carrier. Such a surface treatment may be electrically conductive covering material on exposed electrically conductive layer structures (e.g., pads, conductive traces, etc., particularly comprising or consisting of copper) on the surface of the component carrier. If such an exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (especially copper) will be oxidized, thereby making the reliability of the component carrier low. In addition, the surface treatment portion can be formed as, for example, a joint between a surface mounted component and a component carrier. The surface treatment portion has the function of protecting the exposed electrically conductive layer structure (especially the copper circuit), and the surface treatment portion can achieve a joint process with one or more components, for example, by welding. Examples of suitable materials for the surface treatment portion are organic solderability preservative (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), electroless nickel electroless palladium immersion gold (ENEPIG), gold (especially hard gold), chemical tin (chemical and electroplating), nickel gold, nickel palladium, etc. Nickel-free materials for the surface treatment may also be used, in particular for high-speed applications. Examples are ISIG (immersion silver immersion gold) and EPAG (electroless palladium autocatalytic gold). The above-defined aspects and further aspects of the invention will become apparent from the examples of embodiment described hereinafter and will be elucidated with reference to these examples of embodiment.

The illustrations in the drawings are schematic. In different figures, similar or identical elements are provided with the same element numbers. Before describing the exemplary embodiments in more detail with reference to the drawings, some basic concepts will be summarized, on the basis of which the exemplary embodiments of the invention are developed. Traditionally, the uniformity of the copper thickness of plated component carrier structures (such as PCB panels) may be insufficient. This may lead to defects and therefore to low yield. In particular for high-density applications (e.g. applications with 35µm/35µm trace widths and a required copper thickness of, for example, 26µm), the yield is very limited. During a conventional plating process, only the entire panel can be influenced in terms of plating control. According to an exemplary embodiment of the invention, an electroplating process for depositing metal (preferably copper) on selected electrically conductive surface portions of a component carrier structure (such as a panel for forming a printed circuit board) is performed using an anode (i.e., a plating electrode to which a voltage or current with a positive sign is applied at least temporarily), which is spatially and electrically divided into a plurality of separate (especially electrically decoupled) anode parts. Different anode parts can be controlled individually in order to provide different current density values for different designated sections of the component carrier structure to be electroplated. By taking this measure, the component carrier structure can be subjected to a spatially correlated current density distribution. Subjecting different portions of a component carrier structure in a plating bath to regions of different currents can result in a spatially varying efficiency distribution of electroplated metal deposition. Thus, in situations where artifacts (e.g., of the plating process) may result in unintentional spatial variations in the thickness distribution of the plated metal on the component carrier structure, a corresponding reverse current density distribution can at least partially compensate for the thickness differences on different regions of the component carrier structure. Thus, a split anode configuration with individually selectable current density values in different spatial regions of the anode can result in a well-defined or more uniform thickness distribution of the metal on the component carrier structure. Specifically, the copper thickness distribution on the core layer of the component carrier structure can be made more uniform. More specifically, a coating structure can be provided that performs current density adjustment of separated anode parts to improve copper thickness uniformity. Advantageously, such a coating structure can be particularly applied to horizontally coated lines to improve copper thickness uniformity. Advantageously, during coating, the anode current distribution can be divided to obtain a uniform copper deposition. In particular, the current distribution can be readjusted to improve the previously insufficient copper thickness uniformity. According to an exemplary embodiment of the present invention, the coated anode can be divided into different anode parts to control the secondary field to improve the copper thickness uniformity by redistributing the current density. By properly controlling such divided anodes in horizontally plated wires, a refinement of the copper thickness output can be obtained. Specifically, for the manufacture of component carriers with high density integration (HDI) metal structures in horizontally plated wires, the use of anode parts that can be individually controlled in terms of current supply to form spatially related current density distributions has proven to be efficient. Advantageously, exemplary embodiments of the present invention can achieve partial current output of individual separated anode parts to adjust copper thickness. Specifically, this can allow addressing specific sections or critical sections of the component carrier structure where the copper thickness may need to be readjusted. According to an exemplary embodiment of the present invention, partial sections of a component carrier structure (such as a panel) can be controlled by adjusting the current density of each separate anode portion. This can allow the copper thickness of specific sections to be adjusted individually. This can allow matching even demanding fine line trace width requirements. Descriptively speaking, exemplary embodiments of the present invention can divide the component carrier structure into different sections, where a separate anode method with spatially related current density distribution can allow the copper thickness output of partial sections of the component carrier structure to be influenced individually. From the perspective of a copper etching process or a copper addition process, the copper thickness can be reduced or increased, and the copper thickness can be characterized by its uniformity due to the structure of the equipment. For example, the subtractive process may have three copper thickness reduction processes and three copper thickness increase processes. In addition, a pattern may be generated by etching the final copper thickness. The copper thickness reduction process may result in copper thickness deviations. Other deviations may come from the copper thickness increase process. According to an exemplary embodiment of the present invention, current density adjustment of different anode portions of a horizontally plated wire for copper deposition may be performed to improve the overall thickness uniformity over a processed component carrier structure (such as a panel). During the plating process, the copper thickness distribution over the panel may often lack sufficient uniformity, for example due to the effects of previous processes (for example, surface copper may be etched away for cleaning and roughening purposes, but the copper thickness distribution is thereby deteriorated). By dividing the anode into multiple individually controllable anode parts that can be applied with different current values to produce a spatial current density distribution, the divided current can allow the construction of a copper layer with a spatially balanced copper thickness. By using a split anode method to produce a spatially correlated current density distribution over an extension of a component carrier structure immersed in a plating bath, defects in easily manufactured component carriers can be reduced and yield can be improved. In short, the anode current distribution can be spatially divided to balance the variations in the deposited copper. By taking this measure, the plating process can be enhanced to improve the copper thickness distribution, particularly for HDI processes. Figure 1 illustrates a plating device 100 for electroplating a component carrier structure 102 according to an exemplary embodiment of the present invention. The illustrated plating device 100 can be configured to electroplating copper on the electrically conductive surface of the component carrier structure 102. For example, the latter can be a plate-like panel (e.g., having dimensions of 21.25 x 24.3 square inches) for manufacturing a printed circuit board (PCB) type component carrier. The electroplating apparatus 100 shown is embodied as a horizontally coated line, and is particularly suitable for the split anodic method described below. However, the exemplary embodiment can also be implemented in a vertically coated line. The electroplating apparatus 100 shown includes a coating tank 110, which is filled with an aqueous coating solution 152 including a copper source such as a dissolved copper salt. The aqueous coating solution 152 is an electrolyte. The component carrier structure 102 to be copper-coated can be mounted (for example, alone or together with one or more other component carrier structures, not shown) on a support structure (not shown) such as an electrical clamp. When mounted on such a support structure, the component carrier structure 102 can be conveyed in a horizontal direction along the electroplating device 100. In addition, the electroplating device 100 can include a current source 116 for providing a current during the copper plating process. In the embodiment shown, the current provided by the current source 116 can be a direct current (DC). In another embodiment, a pulsed current can also be provided. The negative electrode of the current source 116 can be electrically connected to an electrically conductive structure (e.g., a seed layer) of the component carrier structure 102 directly or through an electrically conductive support structure. By taking this measure, the component carrier structure 102 can act as a cathode 114 during the plating process. The positive electrode of current source 116 can be electrically connected to the anode 104 that is also immersed in the plating solution 152. As shown in the figure, the anode 104 is divided into a plurality of separate anode parts 106. Different anode parts 106 can have different local sections or can have the same local sections. Each separate anode part 106 is configured to provide a separate current density to a specified (e.g., directly facing) section 120 in the space of the component carrier structure 102. More specifically, different current densities can be applied to different anode parts 106. This can be achieved by providing a separate selectable current density from current source 116 for each separate anode part 106 through control unit 108. By applying individually adjustable current density values to each respective one of the anodic portions 106 , a spatially relevant current density distribution may be produced over the extended portion of the component carrier structure 102 during the electroplating process. By way of example only, the current density applied to the anode portion 106' (e.g., located on the left side of Figure 1) may be different from another current density applied to the anode portion 106" (e.g., located on the right side of Figure 1). In contrast, the current provided to the cathode 114 may be the same for all sections 120 of the component carrier structure 102. For example, a potential difference may be applied between the anode 104 and the cathode 114. The resulting current may be the result of a balanced reaction of the potentials applied in different manners. When a common potential or voltage is applied at the cathode 114, different current densities may be generated by the different voltages applied at the anode portions 106' and 106". The potential difference between the cathode 114 and the anode portion 106' causes a first current density, while the potential difference between the cathode 114 and the anode portion 106" causes another second current density. As a result, the current flow in the electrolyte 152 in the region 154 between the anode portion 106' and the designated section 120' of the component carrier structure 102 can be different from the current flow in the electrolyte 152 in the region 156 between the anode portion 106" and the designated section 120" of the component carrier structure 102. Therefore, the efficiency of copper electrodeposition on the section 120' can be adjusted to be different from the efficiency of copper electrodeposition on the section 120". The uniformity of the copper thickness in the regions 120' and 120" can be improved by appropriately adjusting the current density in the anode portions 106' and 106" to partially or completely compensate for the artifacts in the case where, due to the undesirable artifacts, the intrinsic efficiency of the electro-deposition of copper in the segments 120' and 120" is different (e.g., due to the different integration densities in the segments 120', 120"), which may result in undesirably different copper thicknesses in the segments 120', 120". For this purpose, the control unit 108 can be configured to individually control the current density applied to each anode portion 106 to enhance the uniformity of the deposited metal thickness over the entire extension of the component carrier structure 102. Thus, the control unit 108 can be configured to individually control the current density applied to each anode portion 106 to enhance the uniformity of the deposited metal thickness over the entire extension of the component carrier structure 102. 108 can be configured to control the current density applied to each anode portion 106, thereby forming a metal pattern having a substantially uniform thickness on the component carrier structure 102. Specifically, the separated anode portions 106 of the anode 104 can be controlled to have a substantially uniform thickness on the component carrier structure 102, compared to the spatially independent current density over the extended portion of the component carrier structure 102. More specifically, the control unit 108 can be configured to control the anode 104 to adjust the spatially related current density distribution so that different sections 120 of the component carrier structure 102 can be electroplated with different coating parameters, in particular different coating efficiencies or metal deposition rates. Advantageously, the control unit 108 can be configured to control the anode 104 to adjust the spatially related current density distribution so that different sections 120 of the component carrier structure 102 can be electroplated with different coating parameters, in particular different coating efficiencies or metal deposition rates. 08 can also be configured to dynamically control the change in the current density applied to each anode portion 106 over time. Therefore, the spatial current density distribution over the anode 104 can be changed over time. For example, when a significant copper thickness non-uniformity is determined over an extended portion of the component carrier structure 102, the current distribution can be modified to at least partially balance the non-uniformity. For example, the determination may be performed by visual inspection by an operator and/or by machine-based measurements (e.g., by an optical camera and/or by measuring the conductivity of the deposited metal in the different regions 120). By adjusting or varying the current density distribution not only spatially but also over time, the control of the coating process may be further refined. When dynamically controlling the individual anode portions 106 When a current density value of is obtained, the control unit 108 can be configured to determine information indicative of the metal distribution on the component carrier structure 102 to be electroplated. The control unit 108 can then be configured to adjust or readjust the spatially related current density distribution on the extension of the component carrier structure 102 to reduce the thickness variation of the metal distribution on the entire component carrier structure 102. The determination of the information can be accomplished by an operator as described above and/or by machine-based measurements as described above. If the result of the determination is defective, the control unit 108 can take countermeasures to reduce or even eliminate the defect. The countermeasures can include corresponding adjustments to the current density distribution between the anode 104 and the component carrier structure 102. The adjustment can be performed by correspondingly adjusting or re-adjusting the current supply to the respective anodic portion 106. In an embodiment, the control unit 108 can be configured to control the anodic portion 106 and additionally control at least one subtractive process (such as an etching or grinding process) for removing metal from the component carrier structure 102 to control the metal distribution (especially the metal thickness) on the component carrier structure 102. Additionally or alternatively, the control unit 108 can be configured to control the anodic portion 106 and at least one additive process (such as sputtering) for applying metal to the component carrier structure 102. The mentioned subtractive processes and/or additive processes can be performed before and/or after the illustrated electroplating process. By also considering the adjustment of the additive metal supply process and/or the subtractive metal removal process in combination with the electroplating process, it is possible to further enhance the uniformity of the distribution of the metal on the component carrier structure 102. In a preferred embodiment, the control unit 108 is configured to control the current density applied to each anode portion 106, so that a metal pattern is formed on the component carrier structure 102 according to a predefined target specification, in particular in accordance with the tolerance allowed by such a predefined target specification. Such a predefined target specification can define the content of a component carrier (e.g., a printed circuit board) manufactured based on the processed component carrier structure 102. For example, such a target specification can define the horizontal and/or vertical metal wiring structure and/or the horizontal and/or vertical metal interconnection structure of the component carrier structure 102 to be formed by the electroplating device 100. For example, the target specification can also indicate the expected metal thickness or metal thickness range of the mentioned metal structure. The control unit 108 can access such a target specification from a database 160, for example, a target specification in the form of a data set or a design file. The database 160 can, for example, be embodied as a large-capacity storage device such as a hard disk. Adjustment of the plating process can be completed by the control unit 108, in particular in controlling the separated anode part 106, to achieve compliance with the predefined target specification. For example, when it is determined (by visual inspection and/or by performing machine-based measurements, as mentioned above) that the currently coated metal structure on the component carrier structure 102 does not meet specifications across the entire component carrier structure 102 or at one or more individual sections 120, the spatially related current density distribution of the separated anode portion 106 can be readjusted to meet specifications. This can include spatially related metal thickening (e.g., by increasing the current density) or metal thinning (e.g., by temporarily applying a reverse current to trigger electrical metal removal) in a spatially defined manner. In addition to or instead of providing control data by the database 160, the control unit 108 (which may be, for example, a processor, a plurality of processors, or a portion of a processor) may receive data and/or instructions from an input/output unit 162. Through the input/output unit 162, a user may input data and/or instructions to the electroplating apparatus 100. The input/output unit 162 may also present the results of the operating parameters to the user, for example on a display. FIG. 2 illustrates an electroplating apparatus 100 for electroplating two component carrier structures 102 according to another exemplary embodiment of the present invention. The electroplating device 100 according to FIG. 2 comprises a plurality of electroplating tanks 110 through which component carrier structures 102 are sequentially conveyed during electroplating. As shown, each electroplating tank 110 comprises an anode 104, which is divided into a plurality of individual anode parts 106. The separation of each anode 104 can be performed along the conveying direction 112 and/or perpendicular to the conveying direction 112, i.e., can be separated in the horizontal direction and/or in the vertical direction. The component carrier structures 102 are conveyed one by one along the electroplating tanks 110. In order to convey the component carrier structure 102, a conveying mechanism 118 is provided, which is used to support and convey the component carrier structure 102 along the continuously arranged anode portion 106 of the anode 104. As shown in the figure, the conveying mechanism 118 conveys the component carrier structure 102 in a horizontal orientation along the anode portion 106 of the anode 104, more specifically, along a direction parallel to the orientation of the anode portion 106. The component carrier structure 102 can be supplied to the electroplating tank 110 at the loader section 166. After electroplating in the continuous electroplating tank 110, the component carrier structure 102 can be removed from the electroplating apparatus 100 at the unloader section 167. When being supplied to two consecutively arranged electroplating cells 110, the component carrier structure 102 may have defective regions 164 in which the local copper thickness is too large or too small (e.g. due to defects in the previous additive and/or subtractive processing of the component carrier structure 102). Such inappropriate copper thickness in the defective regions 164 of the respective component carrier structure 102 may be compensated by selecting the current density distribution of the anode portion 106 so that the defective regions 164 may be selectively over-coated or under-coated. This may be done so that after passing through the electroplating cells 110, a defect-free coated component carrier structure 102 may be obtained. In the embodiment shown, in particular the uppermost anode portions 106 can be subjected to modified current densities, since these uppermost anode portions 106 will have a significant impact on the plating characteristics of the defective regions 164. Each copper plating groove 110 can have its own anode 104 of V or Λ-shaped structure. Adjustment of the current density of the individual anode portions 106 allows fine-tuning of the copper thickness distribution on the component carrier structure 102. Figure 3 illustrates different views of the separated anodes 104 of the electroplating apparatus 100 according to an exemplary embodiment of the present invention. With the illustrated configuration, the copper thickness distribution of the electroplated component carrier structure 102 can be significantly improved or uniformed. In the embodiment shown, an anode structure including a mesh is shown. Very advantageously, due to the illustrated structure of the horizontal plating line, the current density distributed to each anode part 106 can be dynamically and continuously adjusted. In the embodiment shown, the corresponding anode 104 is divided into four anode parts 106. The V or ∧-shaped structure can allow effective dynamic adjustment. Figure 4 illustrates the design of a separated anode 104 of an electroplating device 100 according to an exemplary embodiment of the present invention. According to Figure 4, the anode part 106 is V or ∧-shaped and has a sawtooth edge 168. However, the illustrated anode 104 divided into anode portions 106 has an overall rectangular shape or outline, as shown by the outer edge 170. The illustrated V or ∧-shaped design of the anode portions 106 of the continuously arranged separated anodes 104 effectively promotes uniform metal deposition when properly powered by the respective current densities. The illustrated V or ∧-shaped shape can therefore reliably prevent significant copper thickness variations over the surface of the panel-type component carrier structure 102. The saw-shaped edge 168 is formed by an alternating arrangement of inwardly tapering edge portions 174 and outwardly tapering edge portions 176. For example, the inward or outward tapering angle β of the inwardly tapering edge portion 174 or the outwardly tapering edge portion 176 relative to the linear edge 179 extending in the conveying direction 112 can be less than 20°. By graphical analogy, we can return to the real structure of the copper trough and show the analogy of the effective area of the anode. The current density adjustment factor can be calculated by dividing the current value by the area of the anode portion 106. Figures 5A, 5B and 5C and Figures 6A, 6B and 6C illustrate information about the thickness distribution of the coating layer of the component carrier structure 102 formed by the electroplating device 100 according to an exemplary embodiment of the present invention. The various sections 120 of the illustrated component carrier structure 102 may display different copper thickness values, particularly areas 182 having too much copper thickness and areas 184 having too little copper thickness. FIGS. 5A-5C and 6A-6C illustrate properties on the top side 188 and bottom side 186 of the component carrier structure 102. Data for the sections 120 in columns are plotted with reference numerals 190, and data for the sections 120 in rows are plotted with reference numerals 192 (for the top side 188, see reference numerals 194, and for the bottom side 186, see reference numerals 196). Summary information is plotted in section 198. Compared to Figures 5A-5C, Figures 6A-6C show improvements in reducing the systematic deviation of the copper thickness, especially on the top side. This improvement can be achieved by appropriately re-adjusting the current density on the anode portion 106 of the separated anode 104. After optimizing the coating process, the front side of the component carrier structure 102 shows positive results related to the copper thickness distribution. The optimization can include dynamic and continuous adjustment of the current density applied to the separated anode 104 based on the equipment characteristics. Specifically, the anode 104 can be divided into multiple (for example, four) anode portions 106, preferably these anode portions 106 have a V or ∧-shaped structure. This can effectively affect the sub-panel section related to the uniformity of copper thickness. The defects of the component carrier structure 102 after plating can be effectively suppressed. Figures 7 and 8 illustrate a separated anode 104 of an electroplating device 100 according to other exemplary embodiments of the present invention. As in Figure 2, the anode 104 illustrated in Figures 7 and 8 is divided into a plurality of separate anode parts 106, but the division method is different from that in Figure 2. In Figures 7 and 8, all joints between adjacent anode parts 106 are inclined downward from left to right. As shown in the various figures, many different geometric shapes of separate anode parts 106 are possible. It should be noted that the term "comprising" does not exclude other elements or steps, and "a" or "an" does not exclude a plurality. It is also possible to combine elements described in conjunction with different embodiments. It should also be noted that the reference numerals in the claims should not be interpreted as limiting the scope of the claims. The implementation of the invention is not limited to the preferred embodiments shown in the figures and described above. On the contrary, even in the case of fundamentally different embodiments, multiple variations using the solutions shown and according to the principles of the invention are possible.

100: electroplating equipment 102: component carrier structure 104: anode 106, 106', 106": anode part 108: control unit 110: plating tank, electroplating tank 112: transmission direction 114: cathode 116: current source 118: transmission mechanism 120, 120', 120": designated section 152: aqueous plating solution, electrolyte 154: area between the anode part 106' and the designated section 120' of the component carrier structure 102 156: area between the anode part 106" and the designated section 120" of the component carrier structure 102 160: Database 162: Input/output unit 164: Defect area 167: Unloader section 168: Sawtooth edge 170: External edge 174: Inwardly tapering edge section 176: Outwardly tapering edge section 179: Linear edge 182: Area with too much copper thickness 184: Area with too little copper thickness 186: Bottom side of component carrier structure 188: Top side of component carrier structure 190: Data of section 120 in columns 192: Data of section 120 in rows 194: Data of top side 188 196: Data of bottom side 186 198: Summary information

[FIG. 1] shows an electroplating apparatus for electroplating a component carrier structure according to an exemplary embodiment of the present invention. [FIG. 2] shows an electroplating apparatus for electroplating a component carrier structure according to another exemplary embodiment of the present invention. [FIG. 3] shows different views of a separate anode of an electroplating apparatus according to an exemplary embodiment of the present invention. [FIG. 4] shows a design of a separate anode of an electroplating apparatus according to an exemplary embodiment of the present invention. [FIG. 5A] to [FIG. 5C] and [FIG. 6A] to [FIG. 6C] show information on the thickness distribution of a coating layer of a component carrier structure formed by an electroplating apparatus according to an exemplary embodiment of the present invention. [Figure 7] and [Figure 8] illustrate separate anodes of electroplating equipment according to other exemplary embodiments of the present invention.

100:Electroplating equipment

102: Component carrier structure

104: Yang pole

106,106’,106”: Anode part

108: Control unit

110: Plating tank, electroplating tank

112: Transmission direction

114: cathode

116: Current source

120,120’,120”: designated section

152: Aqueous coating solution, electrolyte

154: The area between the anode portion 106' and the designated section 120' of the component carrier structure 102

156: The area between the anode portion 106" and the designated section 120" of the component carrier structure 102

160:Database

162: Input/output unit

Claims (27)

An electroplating apparatus (100) for electroplating a component carrier structure (102), wherein the electroplating apparatus (100) comprises: an anode (104), the anode (104) being divided into a plurality of separate anode portions (106), each anode portion (106) being configured to: provide a separate current density to a specified section (120) of the component carrier structure (102) for providing a spatially related current density distribution over an extension of the component carrier structure (102) to be electroplated; and A plurality of electroplating tanks (110) through which the component carrier structure (102) is sequentially conveyed during electroplating, wherein each of the electroplating tanks (110) includes the anode (104), the anode (104) being divided into a plurality of separate anode portions (106), and adjustment of the current density of each anode portion (106) allows fine tuning of the metal thickness distribution on the component carrier structure (102). The electroplating device (100) of claim 1, wherein the electroplating device (100) includes a control unit (108), and the control unit (108) is configured to individually control the current density applied to each anode part (106) in the anode part (106). The electroplating device (100) of claim 2, wherein the electroplating device (100) comprises at least one of the following features: wherein the control unit (108) is configured to: control the anode (104) to adjust the spatially related current density distribution so that the designated sections (120) of the component carrier structure (102) can be electroplated with different plating parameters respectively; wherein the control unit (108) is configured to: control the anode (104) to adjust the spatially related current density distribution based on the temperature and/or pH value in the plating bath. The electroplating apparatus (100) of claim 3, wherein the control unit (108) is configured to control the anode (104) to adjust the spatially related current density distribution based on the temperature and/or pH value sensed by at least one temperature sensor and/or pH sensor. The electroplating device (100) of any one of claims 2 to 4, wherein the control unit (108) is configured to dynamically control the current density applied to each of the anode parts (106). The electroplating device (100) of claim 2, wherein the control unit (108) is configured to: control the anode portion (106); and additionally control at least one subtractive process for removing metal from the component carrier structure (102) and/or additionally control at least one additive process for applying metal to the component carrier structure (102), thereby providing a predetermined metal distribution. The electroplating apparatus (100) of claim 6, wherein the control unit (108) is configured to additionally control at least one additive process for applying metal to the component carrier structure (102), thereby providing the predetermined metal distribution as a uniform metal distribution on the component carrier structure (102). The electroplating device (100) of claim 2, wherein the control unit (108) is configured to: control the current density applied to each anode part (106) in the anode part (106), thereby forming a metal pattern on the component carrier structure (102) according to a predetermined target specification. The electroplating device (100) of claim 2, wherein the electroplating device (100) includes at least one of the following features: wherein the control unit (108) is configured to: control the current density applied to each of the anode parts (106) so as to form a metal pattern with uniform thickness on the component carrier structure (102); wherein the control unit (108) is configured to: control the current density applied to each of the anode parts (106) so as to form a metal structure with different heights in the vertical direction. The electroplating device (100) of claim 9, wherein the control unit (108) is configured to: control the current density applied to each anode part (106) in the anode part (106), thereby forming a metal structure with different heights in the vertical direction according to a predetermined height distribution. The electroplating device (100) of claim 2, wherein the control unit (108) is configured to apply different potentials to different anode parts (106). An electroplating device (100) as claimed in claim 1, wherein different anode parts (106) have different local sections. The electroplating device (100) of claim 1, wherein at least some of the anode portions (106) are V-shaped or Λ-shaped. The electroplating device (100) of claim 1, wherein at least some of the anode portions (106) have at least one saw-shaped edge (168). The electroplating device (100) of claim 1, wherein the anode (104) divided into the anode part (106) has an overall rectangular shape. A plating apparatus (100) as claimed in claim 1, wherein the anode (104) is divided into the plurality of separate anode parts (106) in a transport direction (112) and/or transversely to the transport direction (112), and the component carrier structure (102) will be transported along the transport direction (112) during the plating. The electroplating device (100) of claim 1, wherein the electroplating device (100) comprises: a cathode (114) to be electrically coupled to the component carrier structure (102) to be electroplated; and at least one current source (116) configured to distribute an applied current between the anode (104) and the cathode (114) at a selectable current density. As in claim 1, wherein the number of anodes (104) and the number of cathodes (114) are different. The electroplating apparatus (100) of claim 1, wherein the electroplating apparatus (100) comprises a conveying mechanism (118), wherein the conveying mechanism (118) is used to convey the component carrier structure (102) along the anode (104). The electroplating apparatus (100) of claim 19, wherein the conveying mechanism (118) is used to convey the component carrier structure (102) along the anode (104) along at least a portion of the continuously arranged anode portion (106). The electroplating apparatus (100) of claim 19, wherein the conveying mechanism (118) is configured to convey the component carrier structure (102) in a horizontal orientation along at least some of the anode portions (106). The electroplating apparatus (100) of claim 21, wherein the conveying mechanism (118) is configured to convey the component carrier structure (102) in a horizontal orientation along at least some of the anode portions (106) so as to convey the component carrier structure (102) in a direction parallel to the orientation of the anode portions (106). A method for electroplating a component carrier structure (102), wherein the method comprises: dividing an anode (104) into a plurality of separate anode portions (106); providing a separate current density to a designated section (120) of the component carrier structure (102) through each anode portion (106) for providing a spatially related current density distribution over an extension of the component carrier structure (102) to be electroplated; and sequentially conveying the component carrier structure (102) Through a plurality of electroplating cells (110), each of which includes the anode (104), the anode (104) is divided into a plurality of individual anode sections (106), and current density adjustment of each anode section (106) allows fine tuning of the metal thickness distribution on the component carrier structure (102). A method as claimed in claim 23, wherein the method includes: controlling the anode (104) to provide a more uniform thickness distribution of the coated metal on the component carrier structure (102) compared to the spatially independent current density over the extension of the component carrier structure (102). A method as claimed in claim 23 or 24, wherein the method comprises: determining information indicative of a metal distribution on the component carrier structure (102) to be electroplated; and adjusting or re-adjusting the spatially related current density distribution on an extension of the component carrier structure (102) to reduce a thickness variation of the metal distribution on the component carrier structure (102). A method as claimed in claim 23, wherein the component carrier structure (102) includes a panel, an array or a component carrier. A method as claimed in claim 26, wherein the component carrier is a printed circuit board.