TWI877891B - Thermal deformation improvement stiffner probe card - Google Patents

Abstract

The present invention relates to a rigid probe card for improving thermal deformation. The probe card is coupled to the upper surface of a printed circuit board to prevent thermal deformation of the printed circuit board, so that the probe test head can accurately detect semiconductor chips without deformation, and the manufacturing time of the probe card is shortened. The present invention includes a printed circuit board (5), the printed circuit board (5) has a through hole in the center of its interior, and has a plurality of receiving grooves (3) with a certain spacing on one side of the edge of the upper surface; a reinforcing element (7) is detachably installed and fixed on the upper surface of the printed circuit board (5) so that the printed circuit board (5) will not be thermally deformed; the central bottom surface of the reinforcing element (7) protrudes downward, including a through hole set in the center of the interior to fix a probe test head (9).

Description

Rigid probe card to improve thermal deformation

The present invention relates to a probe card, more specifically, to a rigid probe card coupled to the upper surface of a printed circuit board to improve thermal deformation, so as to prevent thermal deformation of the printed circuit board, so that the probe can accurately detect semiconductor chips without deformation, and also reduce the number of process steps through the integrated molding of a reinforcement platform and a reinforcement auxiliary ring, thereby shortening the manufacturing time of the probe card.

Generally speaking, a series of production processes for semiconductor components include the process of manufacturing semiconductor wafers, the process of manufacturing multiple unit semiconductor chips from the semiconductor wafers, the process of electrical inspection of semiconductor chips (Electrical Die Sorting test) to determine whether the semiconductor chips are defective, the process of semiconductor packaging of good products, and the process of final testing of packaged semiconductor chips. In the process of judging whether the semiconductor chips are electrically good or bad, the inspection device is used to connect electrical signals to the semiconductor chips on the wafer to confirm whether they are defective.

This inspection device is equipped with a tester that generates electrical signals and a probe card connected with multiple probes, which are used to transmit electrical signals from the tester to electrodes formed on semiconductor chips on semiconductor wafers. The probe card transmits electrical signals generated by the tester to the wafer through the probes in contact with the wafer, or transmits electrical signals from the wafer to the tester.

The probe card has been filed with the Korean Patent Office for multiple patent applications. Referring to FIG. 1 and FIG. 2, the patent application scope of the patent application No. 10-2008-7018416 (invention name: probe card) filed on December 25, 2006 is as follows: A probe card that electrically connects a plurality of inspection objects to a circuit structure that generates inspection signals, and The device is capable of simultaneously inputting/outputting the inspection signal for a part or all of the plurality of inspection objects, and is characterized in that it includes: a plurality of probes, the plurality of probes are made of conductive material, contact the inspection object and perform one or more of inputting or outputting electrical signals; a substrate, the substrate having a wiring pattern corresponding to the circuit structure; a plurality of input wires, one end of the plurality of input wires being connected to any one of the plurality of probes to perform the inspection signal; The inspection object is electrically connected to the substrate at one end and the inspection object is electrically connected to the substrate at the other end; a plurality of output wires are electrically connected to any one of the plurality of probes at one end and the inspection object is electrically connected to the substrate at one end; a plurality of output wires are electrically connected to any one of the plurality of probes at one end and the inspection object is output; a protective plate is formed by the conductors. The substrate is composed of electrical materials and is disposed in an area between a connection portion for connecting the output wire to a connection portion of an inspection object on one side of two adjacent inspection objects and a connection portion for connecting the input wire to a connection portion of an inspection object on the other side; wherein the substrate has an input terminal group and an output terminal group for the multiple inspection objects, and the input terminal group and the output terminal group for the same inspection object are formed separately in different areas of the substrate.

As mentioned above, research and development on probe cards is ongoing.

On the other hand, FIG. 3 is a main cross-sectional view of another known implementation of the probe card.

The printed circuit board of the probe card in Figure 3 will deform due to high temperature. When the printed circuit board is thermally deformed, the probe will also deform, resulting in a serious problem that the probe cannot accurately detect the semiconductor chip.

Specifically, in the probe card of Figure 3, the auxiliary ring must be placed on one side of the center bottom of the reinforcing plate, and then the auxiliary ring must be screwed to the center bottom of the reinforcing plate.

Due to the increase in the number of processes, the production time of the probe card becomes longer.

Therefore, the present invention is an improvement based on the above-mentioned existing technology to solve various problems. The purpose of the present invention is to provide a rigid probe card coupled to the upper surface of a printed circuit board to improve thermal deformation, so as to prevent thermal deformation of the printed circuit board, so that the probe can accurately detect the semiconductor chip without deformation, and also reduce the number of processes through the integrated molding of the reinforcement platform and the reinforcement auxiliary ring, thereby shortening the manufacturing time of the probe card.

However, the purpose of the present invention is not limited to the above-mentioned purpose, and a person having ordinary knowledge in the technical field to which the present invention belongs can clearly understand other purposes not mentioned from the following description.

In order to achieve the above-mentioned purpose, the rigid probe card for improving thermal deformation of the present invention has a printed circuit board (5) having a through hole in the center of the interior and a receiving groove (3) with equal spacing on one side of the edge of the upper surface; The reinforcing element (7) is detachably mounted and fixed on the upper surface of the printed circuit board (5) to prevent the printed circuit board (5) from thermal deformation; the central bottom of the reinforcing element (7) protrudes downward and includes a probe test head (9) having a through hole in the center of the interior for fixing the probe.

As described above, the purpose of the present invention is to provide a rigid probe card coupled to the upper surface of a printed circuit board to improve thermal deformation, so as to prevent thermal deformation of the printed circuit board, so that the probe can accurately detect semiconductor chips without deformation, and also reduce the number of process steps through the integrated molding of the reinforcement platform and the reinforcement auxiliary ring, thereby shortening the manufacturing time of the probe card.

1: Rigid probe card to improve thermal deformation

3: Receiving tank

5: Printed circuit board

7: Reinforcement components

9: Probe test head

11: Reinforcement ring

13: Reinforcement wing

15: Strengthening the station

17: Reinforcement auxiliary ring

19: First epoxy resin fixing part

21: Ceramic pillars

23: Second epoxy resin fixing part

Figure 1 is a schematic diagram of a simple learning probe card.

Figure 2 is an enlarged view of the main part of the probe card in Figure 1.

FIG3 is a main cross-sectional view of another known implementation of the probe card.

Figure 4 is a schematic diagram of the rigid probe card for improving thermal deformation of the present invention.

Figure 5 is a bottom view of the rigid probe card with improved thermal deformation in Figure 4.

Figure 6 is an exploded view of the main parts of the rigid probe card for improving thermal deformation in Figure 4.

Figure 7 is a main cross-sectional view of the rigid probe card with improved thermal deformation in Figure 4.

A preferred embodiment of a rigid probe card with improved thermal deformation according to the present invention is described below.

When describing the present invention below, if it is judged that the specific description of the related commonly known functions or configurations may unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

FIG. 4 is a schematic diagram of the rigid probe card with improved thermal deformation of the present invention; FIG. 5 is a bottom view of the rigid probe card with improved thermal deformation of FIG. 4; FIG. 6 is an exploded view of the main parts of the rigid probe card with improved thermal deformation of FIG. 4; and FIG. 7 is a main cross-sectional view of the rigid probe card with improved thermal deformation of FIG. 4.

As shown in Figures 4 to 7, the rigid probe card 1 for improving thermal deformation of the present invention includes: a printed circuit board 5 having a through hole in the center of the interior and a plurality of receiving grooves 3 at a certain interval on one side of the edge of the upper surface; a reinforcing element 7 detachably mounted and fixed on the upper surface of the printed circuit board 5 so that the printed circuit board 5 will not be thermally deformed; and the central bottom surface of the reinforcing element 7 protrudes downward, including a through hole set in the center of the interior to fix the probe test head 9.

Furthermore, the reinforcing element 7 includes a reinforcing ring 11, which is located on one side of the upper surface of the printed circuit board 5 to support the printed circuit board 5; a plurality of reinforcing fins 13, which are installed at equal intervals on the lower outer surface of the reinforcing ring 11 and protrude outward from the lower outer surface of the reinforcing ring 11, thereby being installed and fixed in the receiving groove 3 of the printed circuit board 5, so that the printed circuit board 5 will not be thermally deformed; a reinforcing platform 15, which passes through the center of the reinforcing ring 11 and is located on the inner surface of the reinforcing ring 11. The reinforcing ring 11 has a certain width between one side and the other side of the inner surface of the reinforcing ring 11, and a through hole is set in the inner center to support the printed circuit board 5; and a reinforcing auxiliary ring 17, which protrudes downward from the central bottom surface of the reinforcing platform 15 and is inserted into the through hole of the printed circuit board 5, and has a through hole in the inner center, where the through hole of the reinforcing platform 15 and the through hole of the reinforcing auxiliary ring 17 are connected together, especially the reinforcing ring 11, the reinforcing wing 13 and the reinforcing platform 15 are integrally formed. The reinforcing platform 15 and the reinforcing auxiliary ring 17 are integrally formed.

The probe test head 9 mentioned above includes a first epoxy resin fixing portion 19 fixed along the bottom of the reinforcing auxiliary ring 17; a ceramic support 21 fixed along the bottom of the first epoxy resin fixing portion 19; and a second epoxy resin fixing portion 23 fixed along the bottom of the ceramic support 21 for fixing the probe.

The manufacturing process and current usage of the rigid probe card 1 for improving thermal deformation described above are described as follows.

First, place the printed circuit board 5 having a through hole in the center and a receiving groove 3 at a certain distance on one side of the edge of the upper surface.

The reinforcing element 7 includes a reinforcing ring 11, a reinforcing wing 13, a reinforcing platform 15 and a reinforcing auxiliary ring 17, all of which are located on the upper surface of the printed circuit board 5. At this time, the reinforcing element 7 of the reinforcing wing 13 is inserted into the receiving groove 3 of the printed circuit board 5.

Here, let's take a look at the manufacturing process of the reinforcing element 7. After the reinforcing ring 11 is placed, the reinforcing fin 13 is installed so that it protrudes outward from the lower part of the outer surface of the reinforcing ring 11.

Then, between the inner side of the reinforcement ring 11 and the inner side of the reinforcement ring 11, a reinforcement platform 15 is installed at the center of the inner side.

Then, a reinforcement auxiliary ring 17 is installed, protruding from the central base of the reinforcement platform 15 to the lower side, and a through hole is provided in the inner center.

The through hole of the reinforcing platform 15 is connected to the through hole of the reinforcing auxiliary ring 17, and in particular, the reinforcing ring 11 is integrally formed with the reinforcing wing 13 and the reinforcing platform 15. The reinforcing platform 15 is integrally formed with the reinforcing auxiliary ring 17.

Since the reinforcing ring 11, the reinforcing wing 13, the reinforcing platform 15 and the reinforcing auxiliary ring 17 are integrally formed, the number of processes is reduced and the production time of the probe card is shortened.

Furthermore, after the screws are prepared, the reinforcing wing 13 is fixed to the receiving groove 3 with the screws so that the reinforcing wing 13 does not deviate from the receiving groove 3.

When the reinforcing fin 13 is fixed to the receiving tank 3 as described above, thermal deformation of the printed circuit board 5 is prevented by heating.

Furthermore, the probe test head 9 for fixing the probe test head is fixed by having a through hole at the center of the inner side so as to protrude downward to the bottom of the reinforcing auxiliary ring 17 of the reinforcing element 7.

Here, let's look at the manufacturing process of the probe test head 9. After the first epoxy resin fixing part 19 is installed along the bottom of the reinforcing auxiliary ring 17, the ceramic support 21 is installed along the bottom of the first epoxy resin fixing part 19.

Then, install the second epoxy resin fixing part 23 along the bottom of the ceramic support 21.

Therefore, the purpose of the present invention is to provide a rigid probe card coupled to the upper surface of a printed circuit board to improve thermal deformation, so as to prevent thermal deformation of the printed circuit board, so that the probe can accurately detect semiconductor chips without deformation, and also reduce the number of process steps through the integrated molding of the reinforcement platform and the reinforcement auxiliary ring, thereby shortening the manufacturing time of the probe card.

The detailed description of the present invention is merely illustrative of the present invention and is only used for the purpose of explaining the present invention, and is not intended to limit the meaning or scope of the present invention described in the patent scope.

Therefore, after being understood by those with ordinary knowledge in the technical field to which the present invention belongs, various modifications and other equivalent embodiments can be made. Therefore, the true technical protection scope of the present invention should be determined by the technical conception of the patent application scope.

1: Rigid probe card to improve thermal deformation 5: Printed circuit board 7: Reinforcement components

Claims (2)

A rigid probe card for improving thermal deformation comprises a printed circuit board (5) having a through hole in the center of the interior thereof and a plurality of receiving grooves (3) at a certain interval on one side of the edge of the upper surface; and a reinforcing element (7) detachably mounted and fixed on the upper surface of the printed circuit board (5) so that the printed circuit board (5) will not be thermally deformed; the central bottom surface of the reinforcing element (7) protrudes downward, including a through hole provided in the center of the interior to fix a probe test head (9); wherein the reinforcing element (7) comprises: a reinforcing ring (11) located on one side of the upper surface of the printed circuit board (5) for supporting the printed circuit board (5); A plurality of reinforcing fins (13) are installed at equal intervals on the lower outer surface of the reinforcing ring (11) and protrude outward from the lower outer surface of the reinforcing ring (11), thereby being installed and fixed in the receiving groove (3) of the printed circuit board (5) so that the printed circuit board (5) will not be thermally deformed; A reinforcing platform (15) passes through the center of the reinforcing ring (11) and is located between one side of the inner surface of the reinforcing ring (11) and the other side of the inner surface of the reinforcing ring (11). It has a certain width and a through hole is set in the center of the inner surface to support the printed circuit board (5); And a reinforcement auxiliary ring (17), which protrudes downward from the central bottom surface of the reinforcement platform (15) and is inserted into the through hole of the printed circuit board (5), and has a through hole in the inner center. The rigid probe card with improved thermal deformation as described in claim 1, wherein the reinforcing ring (11) is integrally formed with the reinforcing wing (13) and the reinforcing platform (15), and the reinforcing platform (15) is integrally formed with the reinforcing auxiliary ring (17).