TWI877758B - Chamber structure and cleaning method for cleaning waste in a polishing pad groove - Google Patents

Abstract

The present application discloses a chamber structure and a cleaning method for cleaning waste in a grinding pad groove. The interior of the chamber structure is provided with a cleaning chamber and a vacuum adsorption chamber which are independently arranged. The outer wall of the chamber structure is provided with a cleaning chamber interface connected to the cleaning chamber and a vacuum adsorption interface connected to the vacuum adsorption chamber. The cleaning chamber interface is used to connect a cleaning device to allow a cleaning medium to enter the cleaning chamber. The vacuum adsorption interface is used to connect a vacuum adsorption device so that the cleaning medium with waste entering the vacuum adsorption chamber is sucked out. A lower concave cavity is also provided at the bottom of the chamber structure. The bottom opening of the lower concave cavity is used to be sealed with the upper surface of the grinding pad. The interior of the chamber structure is also provided with a cleaning hole connecting the lower concave cavity and the cleaning chamber, and a vacuum adsorption hole connecting the lower concave cavity and the vacuum adsorption cavity. The waste in the grooves on the upper surface of the polishing pad can be decomposed, cleaned and adsorbed out of the upper surface of the polishing pad.

Description

Chamber structure and cleaning method for cleaning waste in a polishing pad groove

This application relates to the field of wafer grinding equipment technology, and more specifically to a chamber structure and cleaning method for cleaning waste in a grinding pad groove.

In the substrate polishing process, the main process steps are: first, the polishing head adsorbs the substrate and places the substrate on the polishing pad, and then the polishing head applies downward pressure to the substrate. At the same time, the polishing liquid is supplied to the polishing pad through the conveying system. The polishing pad and the polishing head rotate in the same direction but on different axes. The polishing liquid reaches the bottom of the substrate as the polishing pad rotates. Due to the relative movement of the polishing pad and the substrate, the particles in the polishing liquid can polish the substrate.

After grinding, defects may appear on the substrate surface. Among the defects on the substrate surface, mechanical damage is one of the more common types of substrate surface defects and is also a more serious type of substrate surface defect. These defects are generally generated during the chemical mechanical polishing step or slicing step of the substrate.

One of the main reasons for mechanical damage to the substrate surface during chemical mechanical polishing is scratches from waste in the polishing pad grooves. Because the polishing fluid is a viscous liquid, crystals are easily formed in the polishing pad grooves during a long mechanical polishing process. The width of the polishing pad grooves is relatively small (about 0.7mm), making it difficult to effectively clean the crystallized waste in the polishing pad grooves.

In the conventional technology, the process of the grinding pad is adjusted by a dresser. The main functions of the dresser are: 1. To achieve uniform distribution of the grinding fluid on the grinding pad; 2. To adjust the roughness of the surface of the grinding pad by the dresser; 3. To scrub the grinding pad by the dresser to remove the crystal waste residues in the grooves on the surface of the grinding pad.

Specifically, the bottom surface of the hard disc of the dresser has bumps, and the dresser performs reciprocating circular motion on the grinding pad. The hard disc with bumps repeatedly scrapes the surface of the grinding pad to trim the surface roughness of the grinding pad and clean the waste and particles on the surface of the grinding pad.

However, since the bumps on the hard disc of the dresser cannot completely fit the shape of the grooves of the grinding pad, the crystal waste attached to the grooves of the grinding pad cannot be fully cleaned. In addition, since the surface of the grinding pad is a porous rough surface and the downward pressure on the particle waste during the reciprocating circular motion of the dresser will also cause the particle waste on the surface of the grinding pad to be pressed into the porous gaps on the surface of the grinding pad, making it difficult to clean.

In view of the defect that the waste in the groove of the polishing pad in the prior art cannot be effectively cleaned, it is necessary to design a new chamber structure for cleaning the waste in the groove of the polishing pad.

Therefore, the technical problem to be solved by this application is to overcome the defect that the waste in the grinding pad groove in the prior art cannot be effectively cleaned, thereby providing a chamber structure and cleaning method for cleaning the waste in the grinding pad groove.

To solve the above technical problems, the technical solution of this application is as follows:

A chamber structure for cleaning waste in a grinding pad groove, wherein the chamber structure is provided with a cleaning chamber and a vacuum adsorption chamber independently arranged therein, and the outer wall of the chamber structure is provided with a cleaning chamber interface connected to the cleaning chamber and a vacuum adsorption interface connected to the vacuum adsorption chamber, wherein the cleaning chamber interface is used to connect a cleaning device to allow a cleaning medium to enter the cleaning chamber, and the vacuum adsorption interface is used to connect a vacuum adsorption device so that the medium in the vacuum adsorption chamber is sucked outward, and a lower concave chamber is also provided at the bottom of the chamber structure, and the bottom opening of the lower concave chamber is used to be sealed by the upper surface of the grinding pad; and a cleaning hole connecting the lower concave chamber and the cleaning chamber, and a vacuum adsorption hole connecting the lower concave chamber and the vacuum adsorption chamber are also provided inside the chamber structure.

Furthermore, the pressure between the side wall of the chamber structure and the upper surface of the polishing pad is 0.1psi-0.2psi.

Furthermore, the height of the cleaning chamber is not less than 11 mm, and the top wall of the lower concave chamber corresponding to the cleaning chamber is not less than 4 mm away from the upper surface of the polishing pad.

Furthermore, the height of the vacuum adsorption chamber is 10mm-15mm, and the distance between the top wall of the lower concave chamber and the vacuum adsorption chamber and the upper surface of the polishing pad is 1.5mm-2.2mm.

Furthermore, the pressure value of the vacuum adsorption chamber is -15psi--5psi.

Furthermore, the vacuum adsorption chamber includes a first vacuum adsorption chamber and a second vacuum adsorption chamber, and the first vacuum adsorption chamber and the second vacuum adsorption chamber are respectively located at two opposite sides of the cleaning chamber.

Furthermore, the vacuum adsorption interface corresponding to the first vacuum adsorption chamber is opened on the outer wall of the chamber structure, the vacuum adsorption interface corresponding to the second vacuum adsorption chamber is opened on the top wall of the chamber structure, and the cleaning chamber interface is also opened on the top wall of the chamber structure.

Furthermore, the chamber structure is divided into two independent sub-chamber structures, each of which is provided with the cleaning chamber, the cleaning chamber interface, the cleaning hole connecting the lower concave chamber and the cleaning chamber, the vacuum adsorption chamber, the vacuum adsorption interface, and the vacuum adsorption hole connecting the lower concave chamber and the vacuum adsorption chamber.

Furthermore, the end wall of the chamber structure near the center of the upper surface of the polishing pad is extended laterally to form a baffle, and the baffle is used to guide the ultra-clean water used to clean the upper surface of the polishing pad outside the chamber structure to flow along the longitudinal side wall of the chamber structure to the outer edge of the polishing pad.

Furthermore, the cleaning hole is a long hole facing the groove on the upper surface of the polishing pad, the size of the long hole is 5mm×2mm, and the vacuum adsorption hole is a round hole with a diameter of 5mm-6mm.

This application technical solution has the following advantages:

1. The chamber structure provided in this application is used to clean the waste in the groove of the grinding pad. After the cleaning medium connected to the cleaning interface is flushed out from the cleaning hole, it is flushed towards the waste in the groove. The fluidity characteristics of the cleaning medium enable the cleaning medium to flush the groove without dead angles, thereby impacting and decomposing the waste in the groove on the upper surface of the grinding pad and peeling it off from the inner wall of the groove. The cleaning medium with waste flows on the upper surface of the grinding pad corresponding to the lower concave cavity, and then is adsorbed by the vacuum adsorption hole and enters the vacuum adsorption cavity and finally enters the vacuum adsorption device, thereby realizing effective cleaning of the waste in the groove.

2. The chamber structure provided in this application is used to clean the waste in the groove of the polishing pad. The pressure between the side wall of the chamber structure and the upper surface of the polishing pad is 0.1psi-0.2psi, which can ensure the normal rotation of the polishing pad and form a relatively closed sealed environment between the chamber structure and the polishing pad to ensure that the cleaning medium containing waste can be quickly vacuumed and cleaned.

3. The chamber structure provided in this application is used to clean waste in the groove of the polishing pad. The end wall of the chamber structure near the center of the polishing pad extends laterally to form a baffle. When the upper surface of the polishing pad is rinsed with super-clean water outside the chamber structure and on the side where the chamber structure is located, the super-clean water flows to the side wall of the chamber structure, and after being blocked and guided by the baffle, it flows along the side wall of the chamber structure to the outer edge of the polishing pad, preventing excessive super-clean water from entering the central area of the polishing pad or the area near the polishing head, causing the polishing liquid in the area to be diluted, resulting in low substrate polishing efficiency and failure to meet the substrate manufacturing requirements of other processes.

4. The chamber structure provided in this application for cleaning waste in the groove of the grinding pad is divided into two independent sub-chamber structures, which can reduce the length of the vacuum adsorption chamber so that the cleaning medium with waste can flow in a smaller range, which is convenient for vacuum adsorption holes to adsorb and clean.

A method for cleaning waste in a grinding pad groove comprises the following steps: placing the aforementioned chamber structure for cleaning waste in the grinding pad groove on the grinding pad; using a cleaning medium connected to the chamber structure to perform physical and chemical cleaning on the upper surface of the grinding pad; using a vacuum adsorption device connected to the chamber structure to discharge waste on the upper surface of the grinding pad.

This application technical solution has the following advantages:

1. The method for cleaning waste in the groove of the polishing pad in this application has the advantages of the aforementioned chamber structure for cleaning waste in the groove of the polishing pad.

1: Chamber structure

1a: Inner chamber structure

1b: External sub-chamber structure

2: Grinding pad upper surface

3: Grinding head

4: Dresser

5: Grinding liquid titration module

6: Ultra-clean water cleaning module

7: Pressure regulating valve

8: Filtering program

11: Cleaning chamber

12: Vacuum adsorption chamber

12a: The first vacuum adsorption chamber

12b: Second vacuum adsorption chamber

13: Lower concave cavity

14: Baffle

111: Cleaning chamber interface

112: Cleaning hole

121: Vacuum adsorption interface

122: Vacuum adsorption hole

In order to more clearly explain the specific implementation or technical solution of this application, the following will briefly introduce the drawings required for the specific implementation or technical description. Obviously, the drawings described below are some implementations of this application. For those with ordinary knowledge in this field, all other embodiments obtained based on these drawings are within the scope of protection of this application without creative labor.

Figure 1 is a schematic diagram of the position of the chamber structure of the present application in the substrate chemical mechanical polishing system; Figure 2 is a schematic diagram of the positional relationship between the chamber structure of the present application and the grinding pad titration module; Figure 3 is a schematic diagram of the positional relationship between the chamber structure of the present application and the ultra-clean water cleaning module on the grinding pad and the grinding head; Figure 4 is a schematic diagram of the positional relationship of the chamber structure of the present application on the clockwise rotating grinding pad; Figure 5 is a three-dimensional schematic diagram of the chamber structure of the present application; Figure 6 is a partial three-dimensional schematic diagram of the chamber structure of the present application; Figure 7 is a planar schematic diagram of the chamber structure of the present application; Figure 8 is a schematic diagram of the adsorption principle of the vacuum adsorption device connected to the chamber structure in the present application.

The following will clearly and completely describe the technical solution of this application in conjunction with the attached drawings. Obviously, the described embodiments are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by people with ordinary knowledge in this field without creative labor are within the scope of protection of this application.

In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the attached drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of this application. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between two components. For those with general knowledge in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

In addition, the technical features involved in the different implementations of this application described below can be combined with each other as long as they do not conflict with each other.

Example 1

As shown in Figures 1 to 8, this embodiment provides a chamber structure for cleaning waste in the groove of the polishing pad, which is used to clean the waste in the groove of the upper surface 2 of the polishing pad. The positional relationship between the chamber structure 1 and the upper surface 2 of the polishing pad, the polishing head 3, the dresser 4, the polishing liquid droplet module 5, and the ultra-clean water cleaning module 6 in the substrate chemical mechanical polishing system is shown in Figures 1 to 3. During the process of cleaning the waste in the groove of the polishing pad, the polishing pad rotates, and the chamber structure 1 does not move.

The size of the chamber structure 1 matches the size of the substrate. In this embodiment, the external dimensions of the chamber structure 1 are 270×40×19 mm. The interior of the chamber structure 1 is provided with a cleaning chamber 11 and a vacuum adsorption chamber 12 which are independently arranged.

The length of the cleaning chamber 11 is 266mm, the width is 9mm, and the height of the cleaning chamber 11 is not less than 11mm. A plurality of cleaning holes 112 are opened at the bottom of the cleaning chamber 11, and the cleaning holes 112 are connected to the cleaning chamber 11. The cleaning holes 112 are long holes, and the cleaning holes 112 are arranged in a row and are arranged at equal intervals. The length of the cleaning holes 112 is 5mm, the width is 2mm, the distance between the bottom surface of the cleaning chamber 11 and the upper surface 2 of the grinding pad is not less than 4mm, and each cleaning hole 112 corresponds to one or two grooves on the upper surface 2 of the grinding pad (not shown), so as to effectively impact and decompose the waste in the groove.

The vacuum adsorption chamber 12 includes a first vacuum adsorption chamber 12a and a second vacuum adsorption chamber 12b located at two opposite sides of the cleaning chamber 11. The first vacuum adsorption chamber 12a faces the ultra-clean water cleaning module 6. The first vacuum adsorption chamber 12a and the second vacuum adsorption chamber 12b have the same size, with a length of 266mm, a width of 12mm, a height of 10mm-15mm, preferably 13mm, and a distance of 2mm between the bottom surface of the vacuum adsorption chamber 12 and the upper surface 2 of the grinding pad. The first vacuum adsorption chamber 12a and the second vacuum adsorption chamber 12b are both provided with the same number of vacuum adsorption holes 122 at the bottom, and the vacuum adsorption holes 122 are connected to the vacuum adsorption chamber 12. The number of vacuum adsorption holes 122 corresponding to the first vacuum adsorption chamber 12a and the second vacuum adsorption chamber 12b is 32, and the 32 vacuum adsorption holes are arranged in a row with equal spacing. The vacuum adsorption holes 122 are circular holes, and the diameter of the circular vacuum adsorption holes 122 is 5mm-6mm, so as to effectively adsorb the waste decomposed by the cleaning medium from the groove on the upper surface 2 of the polishing pad.

The outer wall of the chamber structure 1 is provided with a cleaning chamber interface 111 connected to the cleaning chamber 11 and a vacuum adsorption interface 121 connected to the vacuum adsorption chamber 12.

The cleaning chamber interface 111 is used to connect a cleaning device (not shown) to allow the cleaning medium to enter the cleaning chamber 11. The vacuum adsorption interface 121 is used to connect a vacuum adsorption device (not shown) so that the cleaning medium with waste in the vacuum adsorption chamber 12 can be sucked out. In this embodiment, the vacuum adsorption device is a liquid vacuum generator, which has an anti-corrosion effect, and the body material of the vacuum generator is polytetrafluoroethylene. The adsorption principle diagram of the vacuum adsorption device connected to the vacuum adsorption interface 121 is shown in FIG8 . In the design of the vacuum adsorption pipeline, the pressure is adjusted by using a pressure regulating valve 7 to meet the pressure requirements of the vacuum adsorption, and a screening program 8 is added to the vacuum adsorption pipeline to filter large particles in the waste to prevent the waste from adhering to the inside of the pipeline and causing the pipeline and device to be blocked.

The vacuum adsorption interface 121 corresponding to the first vacuum adsorption chamber 12a is opened on the side wall of the chamber structure 1. The reason for this design is that, firstly, the chamber structure 1 is used in conjunction with the polishing liquid droplet module 5, and the upper part of the polishing liquid droplet module 5 is provided with a connecting rod mechanism (not shown). The connecting rod mechanism needs to be swung when adjusting the placement position of the polishing liquid droplet module 5 on the polishing pad. If the vacuum adsorption interface 121 of the first vacuum adsorption chamber 12a is set on the top wall of the chamber structure 1, it is easy to produce a connection with the connecting rod mechanism. Mechanical interference and collision; secondly, the chamber structure 1 is connected with the grinding liquid titration module 5. In order to avoid the chamber structure 1 being too large, which will cause the total weight of the chamber structure 1 and the grinding liquid titration module 5 to be relatively large, thereby affecting the rotation of the grinding pad, the size of the chamber structure 1 should be smaller. Then, when the size of the chamber structure 1 needs to be smaller, it is naturally not easy to arrange more vacuum adsorption interfaces 121 on the top wall of the chamber structure 1, so as to avoid increasing the difficulty of setting the vacuum adsorption interfaces 121 and interference between them. In this embodiment, there are two vacuum adsorption interfaces 121 corresponding to the second vacuum adsorption chamber 12b and they are opened on the top wall of the chamber structure 1. Of course, the number of vacuum adsorption interfaces 121 corresponding to the second vacuum adsorption chamber 12b can also be other values, which can be set as needed. There are four cleaning chamber interfaces 111, which are arranged in a row and spaced apart. The cleaning chamber interfaces 111 are also opened on the top wall of the chamber structure 1.

The bottom of the chamber structure 1 is also provided with a concave cavity 13, the top wall of which is formed by connecting the bottom walls of the cleaning chamber 11 and the vacuum adsorption chamber 12, and the bottom opening of the concave cavity 13 is used to be sealed by the upper surface 2 of the grinding pad, and the pressure between the side wall of the chamber structure 1 and the upper surface 2 of the grinding pad is 0.1psi-0.2psi, so that the normal rotation of the grinding pad can be guaranteed, and a relatively closed sealing environment can be formed between the chamber structure and the grinding pad to ensure that the cleaning medium with waste can be quickly vacuum adsorbed and cleaned.

The chamber structure 1 is also provided with a cleaning hole 112 connecting the lower concave chamber 13 and the cleaning chamber 11, and a vacuum adsorption hole 122 connecting the lower concave chamber 13 and the vacuum adsorption chamber 12. The pressure range of the pressurized cleaning medium of the cleaning chamber 11 connected from the cleaning chamber interface 111 is set to 5psi-21psi to ensure that the cleaning medium can effectively impact and decompose the crystallized waste. The pressure value in the vacuum adsorption chamber 12 is -15psi--5psi to ensure that the cleaning medium with the waste after impact decomposition is fully adsorbed and cleaned.

In addition, in the present embodiment, from the perspective of FIG. 7 , the chamber structure 1 is divided into two independent sub-chamber structures 1, namely the inner sub-chamber structure 1a and the outer sub-chamber structure 1b. Each sub-chamber structure is provided with a cleaning chamber 11, a cleaning chamber interface 111, a cleaning hole 112 connecting the lower concave chamber 13 and the cleaning chamber 11, a vacuum adsorption chamber 12, a vacuum adsorption interface 121, and a vacuum adsorption hole 122 connecting the lower concave chamber 13 and the vacuum adsorption chamber 12. In this way, the lengths of the first vacuum adsorption chamber 12a and the second vacuum adsorption chamber 12b are shortened, which can reduce the flow range of the cleaning medium and facilitate the vacuum adsorption hole 122 to adsorb and clean the cleaning medium containing decomposed waste. In this embodiment, there are four vacuum adsorption interfaces 121 corresponding to the first vacuum adsorption chamber 12a. Of course, other values can be used as needed. In addition, in the middle part of the first vacuum adsorption chamber 12a, the distance between the two adjacent vacuum adsorption interfaces 121 on both sides of the partition plate separating the chamber structure 1 is relatively small. The reason for this design is that the polishing liquid participates in the polishing more times in this area, and the waste formed on the polishing pad is also relatively large. By reducing the distance between the two adjacent vacuum adsorption interfaces 121 in this area, the sufficient adsorption and cleaning of the more waste in this area can be enhanced.

Furthermore, in this embodiment, the end wall of the chamber structure 1 near the center of the upper surface 2 of the polishing pad is extended laterally to form a baffle 14, and the baffle 14 is used to guide the ultra-clean water for cleaning the upper surface 2 of the polishing pad outside the chamber structure 1 to flow along the longitudinal side wall of the chamber structure 1 to the outer edge of the polishing pad, so as to prevent more ultra-clean water from entering the central area of the polishing pad or the area near the polishing head 3, causing the polishing liquid in the area to be diluted, resulting in low substrate polishing efficiency and failure to meet the substrate manufacturing requirements of other processes.

The working process of the chamber structure 1 in this embodiment is introduced below:

As shown in FIG. 4 , when the polishing pad needs to be cleaned, the polishing pad starts to rotate clockwise; the cleaning chamber interface 111 is connected and the cleaning device is started, and the pressurized cleaning medium is rushed to the groove on the upper surface 2 of the polishing pad from the cleaning device, the cleaning chamber interface 111, the cleaning chamber 11 and the cleaning hole 112, and the waste in the groove is physically impacted to decompose and peel off from the inner wall of the groove, and the waste flows on the upper surface 2 of the polishing pad with the cleaning medium. In this embodiment, the cleaning medium is ultra-clean water. Of course, deionized water, activator and gas can also be used. The cleaning medium with wastes flowing on the upper surface 2 of the polishing pad is sucked out of the chamber structure 1 through the vacuum adsorption hole 122, the vacuum adsorption chamber 12 and the vacuum adsorption device. The first vacuum adsorption chamber 12a and the second vacuum adsorption chamber 12b are respectively provided on both sides of the chamber 11, each of which has a vacuum adsorption hole 122, and the first vacuum adsorption chamber 12a has more vacuum adsorption interfaces 121 than the second vacuum adsorption chamber 12b. The first vacuum adsorption chamber 12a can firstly perform a better pre-adsorption cleaning of the cleaning medium with waste, and then the second vacuum adsorption chamber 12b can perform a secondary adsorption cleaning of the cleaning medium with waste. In addition, since the chamber structure 1 is longitudinally arranged It is divided into two independent sub-chambers, each of which is provided with a cleaning chamber 11, a cleaning chamber interface 111, a cleaning hole 112 connecting the lower concave chamber 13 and the cleaning chamber 11, a vacuum adsorption chamber 12, a vacuum adsorption interface 121, and a vacuum adsorption hole 122 connecting the lower concave chamber 13 and the vacuum adsorption chamber 12. In this way, the lengths of the first vacuum adsorption chamber 12a and the second vacuum adsorption chamber 12b are shortened, and the cleaning medium with waste flows in a relatively small range, which is convenient for the vacuum adsorption hole 122 to fully and effectively adsorb and clean it.

In addition, in this embodiment, in the rotation direction of the polishing pad, since the chamber structure 1 is arranged in front of the super-clean water cleaning module 6, when the upper surface 2 of the polishing pad is washed with super-clean water, the super-clean water flows to the side wall of the chamber structure 1, and is blocked and guided by the baffle 14, and then flows along the side wall of the chamber structure 1 to the outer edge of the polishing pad, thereby preventing excessive super-clean water from entering the central area of the polishing pad or the area near the polishing head 3.

In summary, in this embodiment, the cleaning medium connected from the cleaning interface flushes out from the cleaning hole and flushes toward the waste in the groove. The fluidity characteristics of the cleaning medium enable the cleaning medium to flush the groove without dead angles, thereby impacting and decomposing the waste in the groove on the upper surface of the polishing pad and peeling it off from the inner wall of the groove. The cleaning medium with waste flows on the upper surface of the polishing pad corresponding to the lower concave cavity, and then is adsorbed by the vacuum adsorption hole and enters the vacuum adsorption cavity and finally enters the vacuum adsorption device, thereby achieving effective cleaning of the waste in the groove.

Example 2

This embodiment provides a method for cleaning waste in a grinding pad groove, comprising the following steps: placing the aforementioned chamber structure for cleaning waste in a grinding pad groove on the grinding pad; using a cleaning medium connected to the chamber structure 1 to physically or physicochemically clean the upper surface 2 of the grinding pad; using a vacuum adsorption device connected to the chamber structure 1 to discharge the particle waste on the upper surface 2 of the grinding pad.

Obviously, the above embodiments are only examples for clear explanation, and are not limitations on the implementation methods. For those with general knowledge in this field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of this application creation.

11: Cleaning chamber

12: Vacuum adsorption chamber

12a: The first vacuum adsorption chamber

12b: Second vacuum adsorption chamber

13: Lower concave cavity

111: Cleaning chamber interface

121: Vacuum adsorption interface

Claims (11)

A chamber structure (1) for cleaning waste in a grinding pad groove, wherein the chamber structure (1) is provided with a cleaning chamber (11) and a vacuum adsorption chamber (12) which are independently arranged, and the outer wall of the chamber structure (1) is provided with a cleaning chamber interface (111) connected to the cleaning chamber (11) and a vacuum adsorption interface (121) connected to the vacuum adsorption chamber (12), the cleaning chamber interface (111) is used to connect a cleaning device to allow a cleaning medium to enter the cleaning chamber (11), and the vacuum adsorption interface (121) is used to connect a cleaning device to a cleaning medium to enter the cleaning chamber (11). 1) is used to connect a vacuum adsorption device so that the cleaning medium containing waste entering the vacuum adsorption chamber (12) can be sucked out. The bottom of the chamber structure (1) is also provided with a lower concave chamber (13), and the bottom opening of the lower concave chamber (13) is used to be sealed by the upper surface (2) of the grinding pad; the interior of the chamber structure (1) is also provided with a cleaning hole (112) connecting the lower concave chamber (13) and the cleaning chamber (11), and a vacuum adsorption hole (122) connecting the lower concave chamber (13) and the vacuum adsorption chamber (12). A chamber structure for cleaning waste in a polishing pad groove as claimed in claim 1, wherein the pressure between the side wall of the chamber structure (1) and the upper surface (2) of the polishing pad is 0.1psi-0.2psi. A chamber structure for cleaning waste in a grinding pad groove as claimed in claim 1, wherein the height of the cleaning chamber (11) is not less than 11 mm, and the distance between the top wall of the lower concave chamber (13) and the cleaning chamber (11) corresponding to the top wall is not less than 4 mm from the upper surface (2) of the grinding pad. A chamber structure for cleaning waste in a grinding pad groove as claimed in claim 1, wherein the height of the vacuum adsorption chamber (12) is 10 mm-15 mm, and the distance between the top wall of the lower concave chamber (13) and the vacuum adsorption chamber (12) corresponding to the top wall is 1.5 mm-2.2 mm from the upper surface (2) of the grinding pad. A chamber structure for cleaning waste in a grinding pad groove as claimed in claim 4, wherein the pressure value of the vacuum adsorption chamber (12) is -15psi to -5psi. A chamber structure for cleaning waste in a grinding pad groove as claimed in claim 1, wherein the vacuum adsorption chamber (12) includes a first vacuum adsorption chamber (12a) and a second vacuum adsorption chamber (12b), and the first vacuum adsorption chamber (12a) and the second vacuum adsorption chamber (12b) are respectively located at two opposite sides of the cleaning chamber (11). A chamber structure for cleaning waste in a grinding pad groove as described in claim 6, wherein the vacuum adsorption interface (121) corresponding to the first vacuum adsorption chamber (12a) is opened on the outer wall of the chamber structure (1), the vacuum adsorption interface (121) corresponding to the second vacuum adsorption chamber (12b) is opened on the top wall of the chamber structure (1), and the cleaning chamber interface (111) is also opened on the top wall of the chamber structure (1). A chamber structure for cleaning waste in a grinding pad groove as claimed in any one of claims 1 to 7, wherein the chamber structure (1) is divided into two independent sub-chamber structures (1), each of the sub-chamber structures (1) is provided with the cleaning chamber (11), the cleaning chamber interface (111), the cleaning hole (112) connecting the lower concave chamber (13) and the cleaning chamber (11), the vacuum adsorption chamber (12), the vacuum adsorption interface (121), and the vacuum adsorption hole (122) connecting the lower concave chamber (13) and the vacuum adsorption chamber (12). A chamber structure for cleaning waste in a grinding pad groove as in claim 8, wherein the end wall of the chamber structure (1) near the center of the upper surface (2) of the grinding pad is extended laterally to form a baffle, and the baffle is used to guide the ultra-clean water for cleaning the upper surface (2) of the grinding pad outside the chamber structure (1) to flow along the longitudinal side wall of the chamber structure (1) to the outer edge of the grinding pad. As in claim 8, a chamber structure for cleaning waste in a grinding pad groove, wherein the cleaning hole is a long hole facing the groove on the upper surface (2) of the grinding pad, the size of the long hole is 5mm×2mm, and the vacuum adsorption hole (122) is a circular hole with a diameter of 5mm-6mm. A method for cleaning waste in a grinding pad groove comprises the following steps: Placing a chamber structure for cleaning waste in a grinding pad groove as described in any one of claims 1 to 10 on the grinding pad; Using a cleaning medium connected to the chamber structure (1) to physically or physicochemically clean the upper surface (2) of the grinding pad; Using a vacuum adsorption device connected to the chamber structure (1) to discharge waste from the upper surface (2) of the grinding pad.