CN116000816A - Chamber structure suitable for cleaning waste in groove of polishing pad and cleaning method - Google Patents

Abstract

The application discloses a chamber structure and cleaning method suitable for cleaning waste in the groove of the grinding pad. The interior of the chamber structure is provided with a cleaning chamber and a vacuum adsorption chamber which are independently arranged, and the outer wall of the chamber structure is provided with a The cleaning chamber interface connected with the cleaning chamber and the vacuum adsorption interface connected with the vacuum adsorption chamber, the cleaning chamber interface is suitable for connecting the cleaning device for the cleaning medium to enter the cleaning chamber, and the vacuum adsorption interface is suitable for connecting the vacuum adsorption device for entering the vacuum adsorption chamber The cleaning medium with waste is sucked out, the bottom of the chamber structure is also provided with a concave cavity, the bottom opening of the concave cavity is suitable for being sealed by the upper surface of the polishing pad; the interior of the chamber structure is also provided with a connected concave cavity The cleaning hole of the cavity and the cleaning cavity, and the vacuum suction hole connecting the lower concave cavity and the vacuum suction cavity. The waste in the groove on the upper surface of the grinding pad can be decomposed and cleaned and adsorbed from the upper surface of the grinding pad.

Description

Chamber structure and cleaning method suitable for cleaning waste in grinding pad groove

technical field

The present application relates to the technical field of wafer grinding and processing equipment, in particular to a chamber structure and cleaning method suitable for cleaning waste in a grinding pad groove.

Background technique

In the process of substrate polishing, the main process steps are: firstly, the grinding head absorbs the substrate and places the substrate on the polishing pad, and then exerts downward pressure on the substrate through the grinding head. At the same time, the polishing liquid is supplied to the polishing pad through the conveying system. The grinding pad and the grinding head rotate in the same direction but not on the same axis, and the grinding liquid reaches the bottom of the substrate with the rotation of the grinding pad. Due to the relative movement of the grinding pad and the substrate, the particles in the grinding liquid can grind and polish the substrate.

After grinding, there may be defects on the surface of the substrate, and among the surface defects of the substrate, mechanical damage is one of the more common types of surface defects of the substrate, and it is also a relatively serious surface defect of the substrate. A chemical mechanical polishing step or a dicing step for the substrate.

One of the main causes of mechanical damage to the substrate surface during chemical mechanical polishing is scratches by waste in the groove of the polishing pad. Because the abrasive liquid is a viscous liquid, it is easy to form crystals in the groove of the polishing pad during the long-term mechanical polishing process, and the width of the groove of the polishing pad is small (about 0.7mm), which is not easy to damage the polishing pad. The crystalline waste in the ditch is effectively cleaned.

In the prior art, the process adjustment of the polishing pad is performed by a dresser. Among them, the main functions of the dresser are: 1. to realize the uniform distribution of the abrasive liquid on the grinding pad; 2. to adjust the roughness of the surface of the grinding pad through the dresser; Crystal waste remains in the trench.

Specifically, the bottom surface of the hard disk of the dresser has convex points, and the dresser performs reciprocating circular motion on the polishing pad, and the hard disk with convex points scratches the surface of the polishing pad repeatedly so as to improve the surface roughness of the polishing pad. Make corrections and clean up any debris and particulates that have settled on the surface of the abrasive pad.

However, since the bumps on the hard disc of the dresser cannot fully fit the shape of the groove of the polishing pad, the crystallization waste attached to the groove of the polishing pad cannot be fully cleaned, and because the surface of the polishing pad is porous The rough surface of the pad and the downward pressure on the granular waste during the reciprocating circular motion of the dresser will also cause the granular waste on the surface of the polishing pad to be pressed into the porous gaps on the surface of the polishing pad, which is not easy to be cleaned.

In view of the defect that the waste in the groove of the polishing pad cannot be effectively cleaned in the prior art, it is necessary to design a new chamber structure suitable for cleaning the waste in the groove of the polishing pad.

application content

Therefore, the technical problem to be solved in this application is to overcome the defect that the waste in the grinding pad groove in the prior art cannot be cleaned effectively, thereby providing a chamber structure and cleaning method suitable for cleaning the waste in the grinding pad groove. method.

In order to solve the problems of the technologies described above, the technical scheme of the present application is as follows:

A chamber structure suitable for cleaning the waste in the groove of the grinding pad, the inside of the chamber structure is provided with a cleaning chamber and a vacuum adsorption chamber independently arranged, and the outer wall of the chamber structure is provided with the cleaning chamber. The cleaning cavity interface connected with the vacuum adsorption cavity and the vacuum adsorption interface connected with the vacuum adsorption cavity, the cleaning cavity interface is suitable for connecting the cleaning device for the cleaning medium to enter the cleaning cavity, and the vacuum adsorption interface is suitable for connecting the vacuum adsorption device so that the medium in the vacuum adsorption chamber is sucked out, and the bottom of the chamber structure is also provided with a concave cavity, and the bottom opening of the concave cavity is suitable for being sealed by the upper surface of the polishing pad; the cavity structure There are also cleaning holes connecting the lower concave cavity and the cleaning cavity and vacuum suction holes connecting the lower concave cavity and the vacuum suction cavity inside.

Further, the pressure between the side wall of the chamber structure and the upper surface of the polishing pad is 0.1psi-0.2psi.

Further, the height of the cleaning chamber is not less than 11mm, and the distance between the top wall of the concave cavity and the cleaning chamber is not less than 4mm from the upper surface of the polishing pad.

Further, the height of the vacuum adsorption chamber is 10mm-15mm, and the distance between the top wall of the lower concave chamber and the vacuum adsorption chamber is 1.5mm-2.2mm from the upper surface of the polishing pad.

Further, the pressure value of the vacuum adsorption chamber is -15psi--5psi.

Further, the vacuum adsorption chamber includes a first vacuum adsorption chamber and a second vacuum adsorption chamber, and the first vacuum adsorption chamber and the second vacuum adsorption chamber are respectively located on two opposite sides of the cleaning chamber.

Further, the vacuum adsorption interface corresponding to the first vacuum adsorption chamber is opened on the outer wall of the chamber structure, and the vacuum adsorption interface corresponding to the second vacuum adsorption chamber is opened on the chamber structure The cleaning chamber interface is also opened on the top wall of the chamber structure.

Further, the chamber structure is divided into two mutually independent sub-chamber structures, and each of the sub-chamber structures is provided with the cleaning chamber, the cleaning chamber interface, the lower concave cavity and the The cleaning hole of the cleaning chamber, the vacuum suction chamber, the vacuum suction interface, and the vacuum suction hole connecting the lower cavity and the vacuum suction chamber.

Further, the end wall of the chamber structure close to the center of the upper surface of the polishing pad is laterally extended to form a baffle, and the baffle is suitable for guiding the ultra-clean water for cleaning the upper surface of the polishing pad outside the chamber structure Flow along the lengthwise side walls of the chamber structure to the outer edge of the polishing pad.

Further, the cleaning hole is a long hole facing the groove on the upper surface of the polishing pad, the size of the long hole is 5mm×2mm, and the vacuum adsorption hole is a round hole with a diameter of 5mm-6mm.

The technical solution of the present application has the following advantages:

1. The chamber structure provided by this application is suitable for cleaning the waste in the groove of the grinding pad. After the cleaning medium connected to the self-cleaning interface is flushed out from the cleaning hole, it rushes to the waste in the groove. The fluidity of the cleaning medium is Features, so that the cleaning medium can flush the groove without dead ends, and then impact and decompose the waste in the groove on the upper surface of the polishing pad and peel off the inner wall of the groove, and the cleaning medium with waste flows in the corresponding lower cavity The upper surface of the grinding pad is then absorbed by the vacuum adsorption hole and then enters the vacuum adsorption chamber and finally enters the vacuum adsorption device, so as to realize the effective cleaning of the waste in the groove.

2. The chamber structure provided by this application is suitable for cleaning waste in the groove of the polishing pad. The pressure between the side wall of the chamber structure and the upper surface of the polishing pad is 0.1psi-0.2psi, which can ensure the normal rotation of the polishing pad , and can ensure that a relatively airtight sealing environment is formed between the chamber structure and the polishing pad, so as to ensure that the cleaning medium with waste can be quickly cleaned by vacuum adsorption.

3. The chamber structure provided by the application is suitable for cleaning the waste in the groove of the polishing pad. The end wall of the chamber structure near the center of the polishing pad extends laterally to form a baffle, and the ultra-clean water is used outside the chamber structure and When flushing the upper surface of the polishing pad on the side where the chamber structure is located, the ultra-clean water flows to the side wall of the chamber structure, and after being blocked and guided by the baffle plate, flows along the side wall of the chamber structure to the outer edge of the polishing pad to prevent excessive ultra-clean water. Clean water enters the central area of the polishing pad or the area close to the polishing head, resulting in the dilution of the polishing liquid in this area, resulting in low substrate polishing efficiency, which cannot meet the substrate manufacturing requirements of other processes.

4. The chamber structure suitable for cleaning the waste in the groove of the grinding pad provided by this application, the chamber structure is divided into two mutually independent sub-chamber structures, which can reduce the length of the vacuum adsorption chamber so that the waste with waste The cleaning medium of the object flows in a small range, which is convenient for the vacuum adsorption hole to absorb and clean.

A method for cleaning waste in a grinding pad groove, comprising the following steps:

Place the aforementioned chamber structure suitable for cleaning waste in the groove of the grinding pad on the grinding pad;

The upper surface of the polishing pad is physically and chemically cleaned by using the cleaning medium connected to the chamber structure;

The waste on the upper surface of the polishing pad is discharged by using a vacuum adsorption device connected to the chamber structure.

The technical solution of the present application has the following advantages:

1. The method for cleaning the waste in the groove of the grinding pad in the present application has the advantages of the aforementioned chamber structure suitable for cleaning the waste in the groove of the grinding pad.

Description of drawings

In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the accompanying drawings that need to be used in the description of the specific embodiments or prior art. Obviously, the accompanying drawings in the following description The drawings are some implementations of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

1 is a schematic diagram of the position of the chamber structure of the present application in the substrate chemical mechanical polishing system;

Fig. 2 is the position relationship diagram between the chamber structure of the present application and the grinding pad titration module;

Fig. 3 is the chamber structure of the present application and the ultra-clean water cleaning module on the grinding pad and the positional relationship diagram of the grinding head;

Fig. 4 is the position relationship diagram of the chamber structure of the present application on the grinding pad rotating clockwise;

Fig. 5 is the three-dimensional schematic diagram of the chamber structure of the present application;

FIG. 6 is a partial perspective view of the chamber structure of the present application;

Fig. 7 is a schematic plan view of the chamber structure of the present application;

Fig. 8 is an adsorption principle diagram of the vacuum adsorption device connected with the chamber structure in the present application.

Explanation of reference signs:

1. Chamber structure; 1a, inner subchamber; 1b, outer subchamber; 11, cleaning chamber; 111, cleaning chamber interface; 112, cleaning hole; 12, vacuum adsorption chamber; 12a, first vacuum adsorption chamber; 12b, second vacuum adsorption cavity; 121, vacuum adsorption interface; 122, vacuum adsorption hole; 13, lower concave cavity; 14, baffle plate; 2, upper surface of grinding pad; 3, grinding head; 4, dresser; 5, grinding Liquid titration module; 6. Ultra-clean water cleaning module; 7. Pressure regulating valve; 8. Filter.

Detailed ways

The technical solutions of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a specific orientation construction and operation, therefore should not be construed as limiting the application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and should not be construed as indicating or implying relative importance.

In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations.

In addition, the technical features involved in the different embodiments of the present application described below may be combined as long as they do not constitute a conflict with each other.

Example 1

As shown in FIG. 1 to FIG. 8 , this embodiment provides a chamber structure suitable for cleaning the waste in the groove of the polishing pad, for cleaning the waste in the groove of the upper surface 2 of the polishing pad. The positional relationship between the chamber structure 1 and the upper surface of the polishing pad 2, the polishing head 3, the dresser 4, the polishing liquid titration module 5, and the ultra-clean water cleaning module 6 in the substrate chemical mechanical polishing system is shown in Figures 1 to 3 , during the process of cleaning the waste in the groove of the grinding pad, the grinding pad rotates, and the chamber structure 1 does not move.

The size of the chamber structure 1 matches the size of the substrate. In this embodiment, the appearance size of the chamber structure 1 is 270*40*19 mm. The inside of the chamber structure 1 is provided with a cleaning chamber 11 and a vacuum adsorption chamber 12 which are independently arranged.

The cleaning chamber 11 has a length of 266 mm, a width of 9 mm, and a height of the cleaning chamber 11 not less than 11 mm. Several cleaning holes 112 are opened at the bottom of the cleaning chamber 11 , and the cleaning holes 112 communicate with the cleaning chamber 11 . The cleaning holes 112 are long holes, and the cleaning holes 112 are arranged in a row and arranged at equal intervals. The cleaning hole 112 has a length of 5 mm and a width of 2 mm. The distance between the bottom surface of the cleaning chamber 11 and the upper surface 2 of the polishing pad is not less than 4 mm, and each cleaning hole 112 corresponds to one to two grooves (not shown) on the upper surface 2 of the polishing pad. , to effectively decompose the waste in the trench by impact.

The vacuum suction chamber 12 includes a first vacuum suction chamber 12 a and a second vacuum suction chamber 12 b located on two opposite sides of the cleaning chamber 11 . The first vacuum adsorption chamber 12a faces the ultra-clean water cleaning module 6, the first vacuum adsorption chamber 12a and the second vacuum adsorption chamber 12b have the same size, the length is 266mm, the width is 12mm, and the height is 10mm-15mm, preferably 13mm. The distance between the bottom surface of the vacuum suction chamber 12 and the upper surface 2 of the polishing pad is 2 mm. The bottoms of the first vacuum adsorption chamber 12 a and the second vacuum adsorption chamber 12 b are provided with the same number of vacuum adsorption holes 122 , and the vacuum adsorption holes 122 communicate with the vacuum adsorption chamber 12 . The number of vacuum adsorption holes 122 corresponding to the first vacuum adsorption chamber 12a and the second vacuum adsorption chamber 12b is 32, and the 32 vacuum adsorption holes are arranged in a row at equal intervals, the vacuum adsorption holes 122 are circular holes, and the circular vacuum The diameter of the adsorption hole 122 is 5mm-6mm, so as to effectively absorb the waste decomposed by the impact of the cleaning medium from the groove on the upper surface of the polishing pad 2 .

The outer wall of the chamber structure 1 is provided with a cleaning chamber interface 111 communicating with the cleaning chamber 11 and a vacuum adsorption interface 121 communicating with the vacuum adsorption chamber 12 .

The cleaning chamber interface 111 is suitable for connecting with a cleaning device (not shown) for the cleaning medium to enter the cleaning chamber 11 . The vacuum suction interface 121 is suitable for connecting with a vacuum suction device (not shown) so that the cleaning medium with waste in the vacuum suction chamber 12 is sucked out. In this embodiment, the vacuum adsorption device is a liquid vacuum generator, which has anti-corrosion effect, and the material of the vacuum generator body is polytetrafluoroethylene. The adsorption schematic diagram of the vacuum adsorption device connected to the vacuum adsorption interface 121 is shown in Fig. A filter 8 is added in the road to filter the large particles in the waste to prevent the waste from adhering to the inside of the pipeline and causing blockage of the pipeline and devices.

The vacuum adsorption interface 121 corresponding to the first vacuum adsorption chamber 12a is opened on the side wall of the chamber structure 1. The reason for this design is that the chamber structure 1 is used in conjunction with the grinding liquid titration module 5, and the grinding liquid titration The upper part of the module 5 is provided with a link mechanism (not shown), and the link mechanism needs to swing when adjusting the placement position of the grinding liquid titration module 5 on the grinding pad. If the vacuum adsorption interface 121 of the first vacuum adsorption chamber 12a is arranged on If the top wall of the chamber structure 1 is easy to produce mechanical interference and collision with the linkage mechanism; secondly, the chamber structure 1 is connected with the grinding liquid titration module 5, in order to avoid the chamber structure 1 being too large, resulting in the chamber structure 1 and the overall weight of the grinding liquid titration module 5 are relatively large, which in turn affects the rotation of the grinding pad. The size of the chamber structure 1 should be smaller. Then, when the size of the chamber structure 1 is required to be smaller, the Naturally, the top wall of the structure 1 is not easy to arrange more vacuum adsorption interfaces 121 , so as to avoid increasing the difficulty of setting up the vacuum adsorption interfaces 121 and interfering with each other. In this embodiment, there are two vacuum adsorption ports 121 corresponding to the second vacuum adsorption chamber 12b and they are provided on the top wall of the chamber structure 1. Of course, the number of vacuum adsorption ports 121 corresponding to the second vacuum adsorption chamber 12b also It can be other values, and it can be set as required. There are four cleaning chamber interfaces 111 arranged at intervals in a row. The cleaning chamber interfaces 111 are also set on the top wall of the chamber structure 1 .

The bottom of the chamber structure 1 is also provided with a lower concave cavity 13, the top wall of the lower concave cavity 13 is formed by connecting the cleaning chamber 11 and the bottom wall of the vacuum suction chamber 12, and the bottom opening of the lower concave cavity 13 is suitable for being polished. Sealing, and the pressure between the side wall of the chamber structure 1 and the upper surface 2 of the polishing pad is 0.1psi-0.2psi. A relatively airtight sealed environment is formed between them to ensure that the cleaning medium with waste can be quickly cleaned by vacuum adsorption.

The interior of the chamber structure 1 is further provided with a cleaning hole 112 connecting the lower cavity 13 and the cleaning cavity 11 , and a vacuum suction hole 122 connecting the lower cavity 13 and the vacuum suction cavity 12 . The pressure range of the pressurized cleaning medium in the cleaning chamber 11 connected from the cleaning chamber interface 111 is set at 5psi-21psi to ensure that the cleaning medium can effectively impact and decompose the crystallization waste. The pressure value in the vacuum adsorption chamber 12 is -15psi--5psi, so as to ensure that the cleaning medium with impacted and decomposed waste is fully adsorbed and cleaned.

In addition, in this embodiment, from the perspective of FIG. 7 , the chamber structure 1 is divided into two mutually independent subchamber structures 1, namely the inner subchamber structure 1a and the outer The chamber structure is equipped with a cleaning chamber 11, a cleaning chamber interface 111, a cleaning hole 112 connecting the lower concave chamber 13 and the cleaning chamber 11, a vacuum adsorption chamber 12, a vacuum adsorption interface 121, and connecting the lower concave chamber 13 and the vacuum adsorption chamber 12. vacuum suction hole 122, so that the lengths of the first vacuum suction chamber 12a and the second vacuum suction chamber 12b become shorter, which can reduce the flow range of the cleaning medium, and facilitate the vacuum suction hole 122 to decompose waste The cleaning medium of the object is used for adsorption cleaning. In this embodiment, there are four vacuum adsorption interfaces 121 corresponding to the first vacuum adsorption chamber 12a, and of course other values can also be set as required, and, in the middle part of the first vacuum adsorption chamber 12a, separate chambers The distance between two adjacent vacuum adsorption interfaces 121 on both sides of the partition plate of structure 1 is relatively small. The reason for this design is that the grinding liquid participates in the grinding times in this area more, and the waste formed on the grinding pad is less. More, by reducing the distance between two adjacent vacuum suction interfaces 121 in this area, the sufficient adsorption and cleaning of more waste in this area can be strengthened.

Furthermore, in this embodiment, the end wall of the chamber structure 1 near the center of the polishing pad upper surface 2 extends laterally to form a baffle 14, and the baffle 14 is suitable for guiding the ultra-cleaning process for cleaning the polishing pad upper surface 2 outside the chamber structure 1. The clean water flows along the longitudinal side wall of the chamber structure 1 to the outer edge of the polishing pad, so as to prevent more ultra-clean water from entering the central area of the polishing pad or the area close to the grinding head 3, causing the grinding liquid in this area to be diluted, As a result, the substrate polishing efficiency is low, and the substrate manufacturing requirements of other processes cannot be met.

The working process of the chamber structure 1 in the present embodiment is introduced below:

As shown in Figure 4, when the grinding pad needs to be cleaned, the grinding pad starts to rotate clockwise;

The cleaning chamber interface 111 is connected and the cleaning device is started, and the pressure cleaning medium rushes to the groove on the upper surface 2 of the polishing pad from the cleaning device, the cleaning chamber interface 111, the cleaning chamber 11 and the cleaning hole 112, and physically impacts the waste in the groove. Decompose the material and peel off from the inner wall of the groove, and the waste flows on the upper surface 2 of the polishing pad with the cleaning medium. In this embodiment, the cleaning medium is ultra-clean water. Of course, deionized water, activator and gaseous water can also be used. Fluid, in which, when using a pressure activator to clean, it is cleaned by physical and chemical methods, and the use of active agents is not limited to neutralizers, surfactants, corrosion inhibitors;

At the same time, the vacuum adsorption interface 121 is connected and the vacuum adsorption device is started, so that the vacuum adsorption chamber 12 is under negative pressure, and the negative pressure ranges from -15psi to -5psi, so as to ensure the cleaning of wastes flowing on the upper surface 2 of the polishing pad. The medium is sucked out of the chamber structure 1 through the vacuum adsorption hole 122, the vacuum adsorption chamber 12 and the vacuum adsorption device. Since the first vacuum adsorption chamber 12a and the second vacuum adsorption chamber 12b are respectively arranged on both sides of the cleaning chamber 11, each has a Vacuum adsorption holes 122, and the first vacuum adsorption chamber 12a has more than the number of vacuum adsorption interfaces 121 corresponding to the second vacuum adsorption chamber 12b, the first vacuum adsorption chamber 12a can carry out better advance for the cleaning medium with waste Then, the second vacuum adsorption chamber 12b carries out secondary adsorption and cleaning to the cleaning medium with waste. In addition, since the chamber structure 1 is divided into two independent sub-chambers in the longitudinal direction, each sub-chamber The chambers are equipped with a cleaning chamber 11, a cleaning chamber interface 111, a cleaning hole 112 connecting the lower concave chamber 13 and the cleaning chamber 11, a vacuum adsorption chamber 12, a vacuum adsorption interface 121, and a vacuum connecting the lower concave chamber 13 and the vacuum adsorption chamber 12. Adsorption holes 122, in this way, the lengths of the first vacuum adsorption chamber 12a and the second vacuum adsorption chamber 12b are all shortened, and the cleaning medium with waste flows in a relatively small range, which is convenient for the vacuum adsorption hole 122 to fully clean it. Effective adsorption cleaning.

In addition, in the present embodiment, on the rotational direction of grinding pad, because chamber structure 1 is arranged at the front of ultra-clean water cleaning module 6, when washing grinding pad upper surface 2 with ultra-clean water, ultra-clean water flows to chamber structure 1, and after being blocked and guided by the baffle plate 14, it flows along the side wall of the chamber structure 1 to the outer edge of the polishing pad, preventing too much ultra-clean water from entering the central area of the polishing pad or the area near the grinding head 3.

To sum up, in this embodiment, after the cleaning medium connected to the self-cleaning interface is flushed out from the cleaning hole, it rushes to the waste in the groove. The fluidity of the cleaning medium allows the cleaning medium to clean the groove without dead ends. Flushing is performed, and then the waste in the groove on the upper surface of the polishing pad is impacted and decomposed and peeled off from the inner wall of the groove. The cleaning medium with waste flows on the upper surface of the polishing pad corresponding to the lower cavity, and is then absorbed by the vacuum adsorption hole. Enter the vacuum adsorption chamber and finally enter the vacuum adsorption device, so as to realize the effective cleaning of the waste in the trench.

Example 2

This embodiment provides a method for cleaning waste in the groove of the polishing pad, comprising the following steps:

Place the aforementioned chamber structure suitable for cleaning waste in the groove of the grinding pad on the grinding pad;

Using the cleaning medium connected to the chamber structure 1 to carry out physical or physicochemical cleaning on the upper surface 2 of the polishing pad;

The particulate waste on the upper surface 2 of the polishing pad is removed using a vacuum suction device connected to the chamber structure 1 .

Apparently, the above-mentioned embodiments are only examples for clear description, rather than limiting the implementation. For those of ordinary skill in the art, other changes or changes in different forms can be made on the basis of the above description. It is not necessary and impossible to exhaustively list all the implementation manners here. However, the obvious changes or changes derived therefrom are still within the protection scope of the invention of the present application.

Claims (11)

1. A cavity structure suitable for cleaning waste in a groove of a grinding pad, which is characterized in that a cleaning cavity (11) and a vacuum adsorption cavity (12) which are mutually independent are arranged in the cavity structure (1), a cleaning cavity interface (111) communicated with the cleaning cavity (11) and a vacuum adsorption interface (121) communicated with the vacuum adsorption cavity (12) are arranged on the outer wall of the cavity structure (1), the cleaning cavity interface (111) is suitable for being connected with a cleaning device for allowing a cleaning medium to enter the cleaning cavity (11), the vacuum adsorption interface (121) is suitable for being connected with the vacuum adsorption device so as to suck the cleaning medium with waste entering the vacuum adsorption cavity (12) outwards, a lower concave cavity (13) is further arranged at the bottom of the cavity structure (1), and the bottom opening of the lower concave cavity (13) is suitable for being sealed by the upper surface (2) of the grinding pad; the interior of the chamber structure (1) is also provided with a cleaning hole (112) communicated with the lower concave cavity (13) and the cleaning cavity (11), and a vacuum adsorption hole (122) communicated with the lower concave cavity (13) and the vacuum adsorption cavity (12).

2. Chamber structure adapted to clean waste in a polishing pad groove according to claim 1, characterized in that the pressure between the side wall of the chamber structure (1) and the polishing pad upper surface (2) is 0.1-0.2 psi.

3. Chamber structure suitable for cleaning waste in grooves of polishing pad according to claim 1, characterized in that the height of the cleaning chamber (11) is not less than 11mm and the distance of the top wall of the lower cavity (13) corresponding to the cleaning chamber (11) from the upper surface (2) of the polishing pad is not less than 4mm.

4. The chamber structure adapted for cleaning waste in grooves of polishing pad according to claim 1, wherein the height of the vacuum suction chamber (12) is 10mm-15mm, and the top wall of the lower cavity (13) corresponding to the vacuum suction chamber (12) is 1.5mm-2.2mm from the upper surface (2) of the polishing pad.

5. The chamber structure adapted to clean waste in a polishing pad trench as set forth in claim 4, wherein said vacuum suction chamber (12) has a pressure value of-15 psi to-5 psi.

6. The chamber structure adapted for cleaning waste in grooves of a polishing pad according to claim 1, wherein the vacuum adsorption chamber (12) comprises a first vacuum adsorption chamber (12 a) and a second vacuum adsorption chamber (12 b), the first vacuum adsorption chamber (12 a) and the second vacuum adsorption chamber (12 b) being located at opposite sides of the cleaning chamber (11), respectively.

7. The chamber structure suitable for cleaning waste in grooves of a polishing pad according to claim 6, wherein the vacuum adsorption interface (121) corresponding to the first vacuum adsorption chamber (12 a) is opened on an outer side wall of the chamber structure (1), the vacuum adsorption interface (121) corresponding to the second vacuum adsorption chamber (12 b) is opened on a top wall of the chamber structure (1), and the cleaning chamber interface (111) is also opened on the top wall of the chamber structure (1).

8. Chamber structure suitable for cleaning waste in grooves of polishing pad according to any of claims 1-7, characterized in that the chamber structure (1) is divided into two mutually independent sub-chamber structures (1), each of which sub-chamber structures (1) is provided with the cleaning chamber (11), the cleaning chamber interface (111), the cleaning holes (112) communicating the lower cavity (13) and the cleaning chamber (11), the vacuum adsorption chamber (12), the vacuum adsorption interface (121), the vacuum adsorption holes (122) communicating the lower cavity (13) and the vacuum adsorption chamber (12).

9. Chamber structure adapted to clean waste in grooves of a polishing pad according to claim 8, characterized in that the chamber structure (1) is laterally extended with a baffle near the end wall of the center of the upper surface (2) of the polishing pad, said baffle being adapted to guide ultra clean water cleaning the upper surface (2) of the polishing pad outside the chamber structure (1) to flow along the longitudinal side walls of the chamber structure (1) towards the outer edge of the polishing pad.

10. The chamber structure of claim 8, wherein the cleaning holes are elongated holes and are opposite to the grooves of the upper surface (2) of the polishing pad, the elongated holes are 5mm x 2mm in size, and the vacuum suction holes (122) are round holes with a diameter of 5mm-6mm.

11. A method for cleaning waste in a groove of a polishing pad, comprising the steps of:

placing a chamber structure according to any one of claims 1-10 on a polishing pad adapted to clean waste in grooves of the polishing pad;

the upper surface (2) of the grinding pad is cleaned physically or physically and chemically by adopting a cleaning medium communicated with the cavity structure (1);

and discharging the waste on the upper surface (2) of the polishing pad by adopting a vacuum adsorption device communicated with the cavity structure (1).

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