TWI877032B - Server and server liquid cooling system - Google Patents

Abstract

The invention relates to a server and a server liquid cooling system. The server includes a chassis, a high-power device, a low-power device and a cold plate module. The chassis is has a first liquid cooling chamber, a first liquid inlet, and a first liquid outlet in fluid communication with the first liquid inlet. The cold plate module is located in the first liquid cooling chamber, and corresponds to the high-power device. The cold plate module has a second liquid cooling chamber, a second liquid inlet and a second liquid outlet in fluid communication with the second liquid cooling chamber. The second liquid inlet is in fluid communication with the first liquid inlet, and the second liquid outlet is in fluid communication with the first liquid cooling chamber. Firstly, the cold plate liquid cooling is used to dissipate heat for the high-power device, and then a single-phase immersion liquid cooling method is used to dissipate the low-power device. Accordingly, a heat dissipation requirement of the high-power device and the low-power device can be met, and the heat dissipation effect of the high-power device can also be improved. Since the cold plate module has the second liquid outlet, the cold plate module becomes an open structure. Accordingly, a liquid leakage or an insufficient pressure resistance of the cold plate module may not be caused.

Description

Servers and server liquid cooling systems

The present invention relates to the field of server technology, and in particular to a server and a server liquid cooling system.

When the server is working, it will generate a lot of heat. If the heat accumulates too much, it will affect the performance of the server. In order to avoid affecting the performance of the server, the server needs to be cooled.

There are many common ways to dissipate heat for servers, including but not limited to cold plate liquid cooling and single-phase immersion liquid cooling. For cold plate liquid cooling, the heat dissipation effect of local high-power consumption components is good, but the other components cannot be cooled through liquid cooling, and the cold plate liquid cooling method has the risk of leakage and burning. For single-phase immersion liquid cooling, the cooling liquid is dispersed, and the heat dissipation effect of local high-power consumption components is poor.

Based on this, it is necessary to provide a server and a server liquid cooling system that can meet the heat dissipation requirements of high-power consumption devices and low-power consumption devices, which is beneficial to improving the heat dissipation effect of high-power consumption devices without considering the problems of liquid leakage and pressure resistance of the cold plate module.

In a first aspect, the present invention provides a server, comprising:

A chassis, wherein the chassis is provided with a first liquid cooling cavity, a first liquid inlet hole and a first liquid outlet hole, wherein the first liquid cooling cavity is in communication with the first liquid inlet hole and the first liquid outlet hole;

A high power consumption device and a low power consumption device, wherein the high power consumption device and the low power consumption device are arranged in the first liquid cooling chamber; and

A cold plate module, wherein the cold plate module is arranged in the first liquid cooling cavity, the cold plate module is arranged corresponding to the high power consumption device, the cold plate module is provided with a second liquid cooling cavity, a second liquid inlet hole and a second liquid outlet hole, the second liquid cooling cavity is connected with the second liquid inlet hole and the second liquid outlet hole, the second liquid inlet hole is connected with the first liquid inlet hole, and the second liquid outlet hole is connected with the first liquid cooling cavity.

In one embodiment, the high power consumption device includes a first high power consumption device and a second high power consumption device, the power consumption of the first high power consumption device is greater than the power consumption of the second high power consumption device; the cold plate module is thermally connected to the first high power consumption device, and the second liquid outlet is toward the second high power consumption device; the cooling liquid flows into the second liquid cooling cavity through the first liquid inlet and the second liquid inlet to perform heat exchange with the first high power consumption device, the cooling liquid after heat exchange flows to the second high power consumption device through the second liquid outlet to perform heat exchange with the second high power consumption device, the cooling liquid after heat exchange flows into the first liquid cooling cavity through the second liquid outlet to perform heat exchange with the low power consumption device, and the cooling liquid after heat exchange flows out through the first liquid outlet.

In one of the embodiments, the cold plate module includes a first liquid cooling part and a second liquid cooling part connected to the first liquid cooling part, the first liquid cooling part is arranged on the first high power consumption device, and the first liquid cooling part is extended along the first direction; the second liquid cooling part is arranged at the end of the first liquid cooling part along the first direction, and the second liquid cooling part is extended along the second direction, and the end of the second liquid cooling part along the second direction protrudes from the side of the first liquid cooling part along the first direction, the first liquid cooling part and the second liquid cooling part are surrounded by a receiving space, and the second high power consumption device is arranged in the receiving space; wherein, the first direction intersects with the second direction.

In one embodiment, the second liquid inlet hole is arranged at an end of the first liquid cooling part away from the second liquid cooling part, and the second liquid outlet hole is arranged at a side of the second liquid cooling part facing the second high power consumption device.

In one embodiment, the first high power consumption device is a central processing unit, and the second high power consumption device is a storage module.

In one embodiment, the cold plate module includes a base plate and a shell having an opening, the base plate covers the opening, the base plate and the shell are arranged to form the second liquid cooling cavity, a side of the base plate facing away from the shell is in contact with the high power consumption device, and the second liquid inlet hole and the second liquid outlet hole are arranged in the shell.

In one embodiment, the cold plate module further includes a heat sink fin, which is disposed in the second liquid cooling cavity and on the bottom plate.

In one embodiment, there are multiple heat sink fins, the multiple heat sink fins extend along a first direction, and the multiple heat sink fins are spaced apart along a second direction; wherein the first direction is the height direction of the chassis, and the second direction is the length direction of the chassis.

In one embodiment, the chassis has a first side and a second side, and the first side and the second side are respectively located on two sides of the chassis along a first direction.

In one embodiment, the first liquid inlet hole and the first liquid outlet hole are arranged on the first side; or, the first liquid inlet hole and the first liquid outlet hole are arranged on the second side; the first liquid inlet hole is located above the first liquid outlet hole along the first direction; or, the first liquid inlet hole is located below the first liquid outlet hole along the first direction.

In one embodiment, the low power consumption device is disposed between a side of the high power consumption device facing the first side and the first side; or, the low power consumption device is disposed between a side of the high power consumption device facing the second side and the second side.

In one embodiment, the high power consumption device is arranged at the lower part of the chassis along the first direction, and the low power consumption device is arranged at the upper part of the chassis along the first direction.

In one of the embodiments, there are at least two high power consumption devices, and all of the high power consumption devices are arranged along a first direction; or, all of the high power consumption devices are arranged along a second direction; there are at least two cold plate modules, and all of the cold plate modules are arranged correspondingly along the first direction; or, all of the cold plate modules are arranged along the second direction, and all of the cold plate modules correspond one-to-one to all of the high power consumption devices.

In one embodiment, the server further includes a first cold tube and a second cold tube, one end of the first cold tube is connected to the first liquid inlet hole, the other end of the first cold tube is connected to the second cold tube, and the end of the second cold tube facing away from the first cold tube is connected to the second liquid inlet hole.

In a second aspect, the present invention provides a server liquid cooling system, comprising:

the above-mentioned servers; and,

The cold liquid distribution device is provided with a liquid inlet and a liquid outlet, the liquid inlet is connected with the liquid outlet, and the liquid inlet and the liquid outlet are both connected with the cold plate module.

In the above-mentioned server and server liquid cooling system, when the server is working, high-power consumption devices will generate a large amount of heat. When the heat accumulated by the high-power consumption devices is too much, it will affect the performance of the server. Therefore, the server of this embodiment also includes a cold plate module, and the cold plate module is set corresponding to the high-power consumption device, and the heat generated by the high-power consumption device is directly transferred to the cold plate module. Under the action of the cold liquid distribution device, the cooling liquid flows into the second liquid cooling cavity through the first liquid inlet hole and the second liquid inlet hole, and the cooling liquid exchanges heat with the cold plate module in the second liquid cooling cavity to reduce the temperature of the cold plate module, thereby reducing the temperature of the high-power consumption device. The cooling liquid after heat exchange flows to the high-power consumption device through the second liquid outlet hole to dissipate heat from the high-power consumption device. Then, under the action of gravity, the cooling liquid flows downward and accumulates in the first liquid cooling chamber to form a certain height, so as to immerse the low-power devices and achieve heat dissipation of the low-power devices. Finally, the cooling liquid flows from the first liquid outlet and the liquid inlet into the cooling liquid distribution device for cooling, and the cooled cooling liquid flows to the cold plate module through the liquid outlet and the second liquid inlet. In this way, the heat dissipation of high-power devices and low-power devices is achieved. In this way, the cold plate liquid cooling method is first used to dissipate the heat of high-power devices, and then the single-phase immersion liquid cooling method is used to dissipate the heat of low-power devices. This can meet the heat dissipation requirements of high-power devices and low-power devices, and at the same time, it is also beneficial to improve the heat dissipation effect of high-power devices. Since the cold plate module is provided with a second liquid outlet, the cold plate module is an open structure, so there is no need to consider the problems of liquid leakage and pressure resistance of the cold plate module.

In order to make the above-mentioned purposes, features and advantages of the present invention more clearly understandable, the specific implementation of the present invention is described in detail below in conjunction with the drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

Referring to FIG. 5 , FIG. 6 and FIG. 7 , a server liquid cooling system provided by an embodiment of the present invention includes a server 10 and a cold liquid distribution device 20 (Commercial Display Units, CDU). The cold liquid distribution device 20 is provided with a liquid inlet 21 and a liquid outlet 22 , the liquid inlet 21 is connected to the liquid outlet 22 , and the liquid inlet 21 and the liquid outlet 22 are both connected to the server 10 .

Furthermore, the cooling liquid distribution device 20 is provided with a circulation pump, and the cooling liquid circulates between the server 10 and the cooling liquid distribution device 20 under the driving of the circulation pump.

In one embodiment, referring to FIG. 5 , FIG. 6 and FIG. 7 , the server 10 includes a chassis 11, a high power consumption device 12 and a low power consumption device 13. The chassis 11 is provided with a first liquid cooling chamber 111, a first liquid inlet hole 112 and a first liquid outlet hole 113. The first liquid cooling chamber 111 contains cooling liquid. The high power consumption device 12 and the low power consumption device 13 are both arranged in the first liquid cooling chamber 111. The first liquid cooling chamber 111 is connected with the first liquid inlet hole 112 and the first liquid outlet hole 113. The first liquid inlet hole 112 is used to be connected with the liquid outlet 22 of the cold liquid distribution device 20, and the first liquid outlet hole 113 is used to be connected with the liquid inlet 21 of the cold liquid distribution device 20.

It should be noted that, according to the power consumption, the devices in the server 10 are divided into high power consumption devices 12 and low power consumption devices 13.

Optionally, the high power consumption device 12 is a central processing unit (CPU) or a dual-inline-memory module (DIMM) disposed on a mainboard. Of course, in other embodiments, the high power consumption device 12 and the low power consumption device 13 may also be other devices, and are not limited thereto.

Further, referring to FIG. 5 , FIG. 6 and FIG. 7 , the server 10 further includes a cold plate module 14. The cold plate module 14 is disposed in the first liquid cooling chamber 111, and the cold plate module 14 is disposed corresponding to the high power consumption device 12. Referring to FIG. 1 and FIG. 3 , the cold plate module 14 is provided with a second liquid cooling chamber 1411, a second liquid inlet hole 1412 and a second liquid outlet hole 1413, the second liquid cooling chamber 1411 is connected to the second liquid inlet hole 1412 and the second liquid outlet hole 1413, the second liquid inlet hole 1412 is connected to the first liquid inlet hole 112, and the second liquid outlet hole 1413 is connected to the first liquid cooling chamber 111.

Specifically, referring to FIG. 5 , the server liquid cooling system further includes a first cooling pipe 15 and a second cooling pipe 16. One end of the first cooling pipe 15 is connected to the first liquid inlet hole 112, the first cooling pipe 15 is connected to the second cooling pipe 16, and the end of the second cooling pipe 16 away from the first cooling pipe 15 is connected to the second liquid inlet hole 1412. In this way, the first liquid inlet hole 112 and the second liquid inlet hole 1412 are connected.

When the server 10 is working, the high power consumption device 12 will generate a large amount of heat. When the high power consumption device 12 accumulates too much heat, it will affect the performance of the server 10. Therefore, the server 10 of this embodiment also includes a cold plate module 14. The cold plate module 14 is set corresponding to the high power consumption device 12, and the heat generated by the high power consumption device 12 is directly transferred to the cold plate module 14. Under the action of the cold liquid distribution device 20, the coolant flows into the second liquid cooling chamber 1411 through the first liquid inlet hole 112 and the second liquid inlet hole 1412. The coolant exchanges heat with the cold plate module 14 in the second liquid cooling chamber 1411 to reduce the temperature of the cold plate module 14, thereby reducing the temperature of the high power consumption device 12. The coolant after heat exchange flows to the high power consumption device 12 through the second liquid outlet hole 1413 to dissipate heat from the high power consumption device 12. Then, under the action of gravity, the cooling liquid flows downward and accumulates in the first liquid cooling chamber 111 to form a certain height, so as to immerse the low-power consumption device 13 and realize heat dissipation of the low-power consumption device 13. Finally, the cooling liquid flows into the cooling liquid distribution device 20 from the first liquid outlet 113 and the liquid inlet 21 for cooling, and the cooled cooling liquid flows to the cold plate module 14 through the liquid outlet 22 and the second liquid inlet 1412. In this cycle, heat dissipation of the high-power consumption device 12 and the low-power consumption device 13 is realized.

In this embodiment, a cold plate liquid cooling method is first used to dissipate heat for high power consumption devices 12, and then a single-phase immersion liquid cooling method is used to dissipate heat for low power consumption devices 13, which can meet the heat dissipation requirements of high power consumption devices 12 and low power consumption devices 13 at the same time, and is also conducive to improving the heat dissipation effect of high power consumption devices 12. Since the cold plate module 14 is provided with a second liquid outlet 1413, the cold plate module 14 is an open structure, so there is no need to consider the problems of liquid leakage and pressure resistance of the cold plate module 14.

In one embodiment, the cooling liquid is non-conductive. Optionally, the cooling liquid is mineral oil or modified silicone oil. Using modified silicone oil as the cooling medium can reduce costs. Since the cooling liquid is non-conductive, this can solve the problem of motherboard damage caused by leakage in the traditional cold plate liquid cooling method.

In one embodiment, referring to FIG. 5 , the high power consumption device 12 includes a first high power consumption device 121 and a second high power consumption device 122 , and the power consumption of the first high power consumption device 121 is greater than the power consumption of the second high power consumption device 122 .

Optionally, the first high power consumption device 121 is a central processing unit, and the second high power consumption device 122 is a storage module. Of course, in other embodiments, the first high power consumption device 121 and the second high power consumption device 122 may also be other devices, and are not limited thereto.

In one embodiment, referring to FIG. 5 , FIG. 6 and FIG. 7 , the cold plate module 14 is disposed on the first high power consumption device 121, and the cold plate module 14 is thermally connected to the first high power consumption device 121. The second liquid outlet 1413 faces the second high power consumption device 122. When the server 10 is working, the first high power consumption device 121 and the second high power consumption device 122 will generate heat, and the first high power consumption device 121 will directly transfer the generated heat to the cold plate module 14. Under the action of the cold liquid distribution device 20, the coolant flows into the second liquid cooling chamber 1411 through the first liquid inlet hole 112 and the second liquid inlet hole 1412, and the coolant exchanges heat with the cold plate module 14 in the second liquid cooling chamber 1411 to reduce the temperature of the cold plate module 14, thereby reducing the temperature of the first high power consumption device 121, and realizing the heat dissipation of the first high power consumption device 121. After the heat exchange, the cooling liquid in the second liquid cooling chamber 1411 can flow to the second high power consumption device 122 through the second liquid outlet 1413 to reduce the temperature of the second high power consumption device 122 and achieve heat dissipation of the second high power consumption device 122.

Since the power consumption of the first high power consumption device 121 is greater than that of the second high power consumption device 122, that is, the heat generated by the first high power consumption device 121 is greater than that generated by the second high power consumption device 122, the cooling liquid first flows into the cold plate module 14 to reduce the temperature of the first high power consumption device 121, and prevent the first high power consumption device 121 from affecting the performance of the server 10 due to excessive heat accumulation. After heat exchange, the cooling liquid in the second liquid cooling chamber 1411 flows out through the second liquid outlet 1413. The cooling liquid flowing out through the second liquid outlet 1413 is concentrated, with a large flow rate and a relatively low temperature. Therefore, the cooling liquid flowing out through the second liquid outlet 1413 is concentrated to dissipate heat for the second high power consumption device 122, which is beneficial to improving the heat dissipation effect of the second high power consumption device 122. In this way, by properly utilizing the temperature and flow rate of the cooling liquid, the heat dissipation effect of the first high power consumption component 121 and the second high power consumption component 122 can be improved.

Optionally, referring to Figures 5, 6 and 7, the cold plate module 14 covers the surface of the first high power consumption device 121, and the size of the cold plate module 14 is greater than or equal to the size of the first high power consumption device 121, so that the heat conduction area between the cold plate module 14 and the first high power consumption device 121 can be increased, thereby improving the heat dissipation effect of the first high power consumption device 121.

Furthermore, a thermal conductive interface material is provided between the cold plate module 14 and the first high power consumption device 121. Optionally, the thermal conductive interface material is silicone grease, silicone glue, etc., but is not limited thereto. By providing the thermal conductive interface material between the cold plate module 14 and the first high power consumption device 121, the thermal conductive interface material can fill the micro gap generated when the cold plate module 14 and the first high power consumption device 121 are in contact, reduce the thermal conductive contact thermal resistance, and improve the heat dissipation effect of the first high power consumption device 121.

In one embodiment, referring to Fig. 1, the cold plate module 14 includes a first liquid cooling portion 144. The first liquid cooling portion 144 is extended along a first direction and is disposed on the first high power consumption device 121. S1 is used to represent the first direction.

Furthermore, referring to FIG. 1 , the cold plate module 14 further includes a second liquid cooling part 145, and the second liquid cooling part 145 is connected to the first liquid cooling part 144. The second liquid cooling part 145 is disposed at the end of the first liquid cooling part 144 along the first direction, and the second liquid cooling part 145 is extended along the second direction. The end of the second liquid cooling part 145 along the second direction protrudes from the side of the first liquid cooling part 144 along the first direction, and the first liquid cooling part 144 and the second liquid cooling part 145 are surrounded to form a receiving space 143, and the second high power consumption device 122 is disposed in the receiving space 143. Among them, S2 is used to represent the second direction. By reasonably utilizing the internal space of the chassis 11, that is, the second high power consumption device 122 is disposed in the receiving space 143, the structure of the server 10 is made compact.

Specifically, referring to FIG. 1 , the second liquid inlet hole 1412 is provided in the first liquid cooling part 144. Optionally, the second liquid inlet hole 1412 is provided at one end of the first liquid cooling part 144 away from the second liquid cooling part 145. Since the second liquid inlet hole 1412 is provided in the first liquid cooling part 144, the cooling liquid first accumulates in the first liquid cooling part 144 to form a certain height, so as to fully contact the first high power consumption device 121 through the first liquid cooling part 144, thereby improving the heat dissipation effect of the first high power consumption device 121. When the height of the cooling liquid reaches the height position where the second liquid outlet hole 1413 is located, the cooling liquid flows from the second liquid outlet hole 1413 to the second high power consumption device 122. Such a configuration can meet the heat dissipation requirements of the first high power consumption device 121 and the second high power consumption device 122, and is also conducive to improving the heat dissipation effect of the first high power consumption device 121.

1 and 5, the second liquid outlet 1413 is disposed on a side of the second liquid cooling portion 145 facing the second high power consumption device 122. Thus, the cooling liquid flowing out of the second liquid outlet 1413 is concentrated on the second high power consumption device 122 for heat dissipation, which is beneficial to improve the heat dissipation effect of the second high power consumption device 122.

In one embodiment, the length of the second liquid outlet 1413 along the second direction is greater than or equal to the length of the second high power consumption device 122 along the second direction. This arrangement ensures that the flow rate of the cooling liquid flowing out through the second liquid outlet 1413 is sufficient to dissipate heat of the second high power consumption device 122. In one embodiment, referring to FIG. 5 , the chassis 11 has a first side 114 and a second side 115, and the first side 114 and the second side 115 are respectively located on both sides of the chassis 11 along the first direction.

Further, referring to FIG. 1 , the first liquid cooling part 144 and the second liquid cooling part 145 are connected to form a T-shape. Specifically, referring to FIG. 1 and FIG. 5 , the two ends of the second liquid cooling part 145 along the second direction protrude from the two sides of the first liquid cooling part 144 along the first direction, respectively, and the second high power consumption device 122 is arranged in the receiving space 143 surrounded by the side of the first liquid cooling part 144 facing the first side 114 and the second liquid cooling part 145, and the second high power consumption device 122 is arranged in the receiving space 143 formed by the side of the first liquid cooling part 144 facing the second side 115 and the second liquid cooling part 145. The second liquid outlet 1413 facing the second high power consumption device 122 is arranged at both ends of the second liquid cooling part 145. In this configuration, one cold plate module 14 can simultaneously dissipate heat for at least one first high power consumption device 121 and at least two second high power consumption devices 122, thereby improving the heat dissipation efficiency.

In one embodiment, referring to FIG. 1 , FIG. 2 and FIG. 3 , the cold plate module 14 includes a bottom plate 142 and a shell 141 having an opening. Optionally, the bottom plate 142 and the shell 141 are both T-shaped. The bottom plate 142 covers the opening of the shell 141, and the bottom plate 142 and the shell 141 are arranged to form a second liquid cooling chamber 1411. The side of the bottom plate 142 facing away from the shell 141 is in contact with the first high power consumption device 121, and the second liquid inlet hole 1412 and the second liquid outlet hole 1413 are arranged in the shell 141. Of course, in other embodiments, the bottom plate 142 and the shell 141 can be formed as one piece.

Further, referring to FIG. 1 , the size of the bottom plate 142 is larger than the cross-sectional size of the housing 141. This arrangement facilitates welding the housing 141 to the bottom plate 142. Of course, in other embodiments, the size of the bottom plate 142 may also be equal to the cross-sectional size of the housing 141.

In one embodiment, referring to FIG. 3 and FIG. 4 , the cold plate module 14 further includes a heat sink 1421, and the heat sink 1421 is disposed in the second liquid cooling chamber 1411. Optionally, the heat sink 1421 is disposed in the first liquid cooling portion 144, so that the heat generated by the first high power consumption device 121 can be directly transferred to the heat sink 1421 for better heat dissipation. Of course, the heat sink 1421 can also be disposed according to the heat distribution of the core of the central processing unit, and is not limited thereto.

When the server 10 is working, the heat generated by the high power consumption device 12 is transferred to the heat sink 1421. Under the action of the cold liquid distribution device 20, the coolant flows into the second liquid cooling chamber 1411 through the first liquid inlet hole 112 and the second liquid inlet hole 1412 and contacts the heat sink 1421 to remove the heat on the heat sink 1421, thereby quickly reducing the temperature of the cold plate module 14. By providing the heat sink 1421, the contact area between the coolant and the cold plate module 14 can be increased, thereby improving the heat dissipation effect of the cold plate module 14. In addition, by providing the heat sink 1421 in the second liquid cooling chamber 1411, while improving the heat dissipation effect, it can also prevent the cold plate module 14 from interfering with other devices in the first liquid cooling chamber 111.

Specifically, there are multiple heat sink fins 1421, which extend along the first direction and are spaced apart along the second direction. In this way, the cooling liquid flows in the flow channel between two adjacent cooling fins 1421, avoiding the cooling fins 1421 blocking the flow of the cooling liquid, thereby ensuring the flow speed of the cooling liquid and the heat dissipation effect.

It should be noted that the thickness of the heat sink fin 1421 and the distance between two adjacent heat sink fins 1421 can be set according to the power consumption and heat dissipation requirements of the high power consumption device 12, and no specific limitation is made here. If the power consumption of the high power consumption device 12 is large and the heat dissipation requirements are high, the thickness of the heat sink fin 1421 can be reduced, and the distance between two adjacent heat sink fins 1421 can be reduced.

Optionally, the height of the heat sink fin 1421 is 3 mm to 5 mm. It is understandable that the height of the heat sink fin 1421 should not be too high or too low. If the heat sink fin 1421 is too high, the cooling liquid will cause the heat sink fin 1421 to bend during the process of flushing the heat sink fin 1421; if the heat sink fin 1421 is too low, the heat dissipation effect of the cold plate module 14 is poor.

In one embodiment, referring to Figures 5 and 6, the high power consumption device 12 is disposed at the lower portion of the chassis 11 along the first direction, and the low power consumption device 13 is disposed at the upper portion of the chassis 11 along the first direction.

Of course, in other embodiments, the low power consumption device 13 is disposed between a side of the high power consumption device 12 facing the first side 114 and the first side 114 ; or, the low power consumption device 13 is disposed between a side of the high power consumption device 12 facing the second side 115 and the second side 115 .

In one embodiment, at least two high power consumption devices 12 are provided, at least two cold plate modules 14 are provided, and all cold plate modules 14 correspond to all high power consumption devices 12 one by one. Optionally, all high power consumption devices 12 are arranged along the first direction, and all cold plate modules 14 are arranged along the first direction. Optionally, all high power consumption devices 12 are arranged along the second direction, and all cold plate modules 14 are arranged along the second direction.

In one embodiment, the first liquid inlet 112 and the first liquid outlet 113 are disposed on the first side 114; or, the first liquid inlet 112 and the first liquid outlet 113 are disposed on the second side 115. Optionally, the first liquid inlet 112 is disposed below the first liquid outlet 113 along the first direction. Alternatively, referring to FIG. 6 , the first liquid inlet 112 is disposed above the first liquid outlet 113 along the first direction.

In the description of the present invention, it is necessary to understand that if the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the directions or positional relationships indicated by these terms are based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention.

In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

In the present invention, unless otherwise clearly defined and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection between two components or an interaction relationship between two components, unless otherwise clearly defined. For those with ordinary knowledge in the field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

In the present invention, unless otherwise clearly specified and limited, if there is a description such as "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, "above", "above" and "above" a first feature in a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "below", "below" and "below" a first feature in a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the present invention are for illustrative purposes only and do not represent the only implementation method.

The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it should not be understood as limiting the scope of the patent application. It should be pointed out that for those with ordinary knowledge in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the scope of the attached patent application.

10: Server 11: Chassis 111: First liquid cooling chamber 112: First liquid inlet 113: First liquid outlet 114: First side 115: Second side 12: High power consumption device 121: First high power consumption device 122: Second high power consumption device 13: Low power consumption device 14: Cold plate module 141: Shell 1411: Second liquid cooling chamber 1412: Second liquid inlet 1413: Second liquid outlet 142: Bottom plate 1421: Heat sink 143: Accommodation space 144: First liquid cooling section 145: Second liquid cooling section 15: First cooling pipe 16: Second cooling pipe 20: Cooling liquid distribution device 21: Liquid inlet 22: Liquid outlet S1: First direction S2: Second direction

FIG. 1 is a schematic diagram of the structure of a cold plate module of an embodiment of the present invention. FIG. 2 is a schematic diagram of the structure of the housing shown in FIG. 1. FIG. 3 is a schematic diagram of the structure of the housing shown in FIG. 2 from another viewing angle. FIG. 4 is a schematic diagram of the structure of the base plate shown in FIG. 1. FIG. 5 is a schematic diagram of the structure of a server liquid cooling system of a first embodiment of the present invention. FIG. 6 is a schematic diagram of the structure of a server liquid cooling system of a second embodiment of the present invention. FIG. 7 is a schematic diagram of the structure of a server liquid cooling system of a third embodiment of the present invention.

14: Cold plate module

141: Shell

1412: Second liquid inlet hole

1413: Second liquid outlet

142: Base plate

143: Containment Space

144: First liquid cooling unit

145: Second liquid cooling unit

Claims (13)

A server (10) is characterized in that it comprises: a chassis (11), the chassis (11) being provided with a first liquid cooling chamber (111), a first liquid inlet hole (112) and a first liquid outlet hole (113), the first liquid cooling chamber (111) being connected to the first liquid inlet hole (112) and the first liquid outlet hole (113); a high power consumption device (12) and a low power consumption device (13), the high power consumption device (12) and the low power consumption device (13) being arranged in the first liquid cooling chamber (111), the high power consumption device (12) comprising a first high power consumption device (121) and a second high power consumption device (122), the power consumption of the first high power consumption device (121) being greater than the power consumption of the second high power consumption device (122); and , a cold plate module (14), wherein the cold plate module (14) is arranged in the first liquid cooling cavity (111), the cold plate module (14) is arranged corresponding to the high power consumption device (12), and is thermally connected to the first high power consumption device (121), the cold plate module (14) comprises a first liquid cooling part (144) and a second liquid cooling part (145) connected to the first liquid cooling part (144), the first liquid cooling part (144) is arranged on the first high power consumption device (121), and the first liquid cooling part (144) is extended along a first direction; the second liquid cooling part (145) is arranged at an end of the first liquid cooling part (144) along the first direction, and the second liquid cooling part (145) is extended along a second direction, and the second liquid cooling part (145) The end portion along the second direction protrudes from the side portion of the first liquid cooling portion (144) along the first direction, the first liquid cooling portion (144) and the second liquid cooling portion (145) are surrounded to form a receiving space (143), the second high power consumption device (122) is arranged in the receiving space (143), the first direction intersects with the second direction, the cold plate module (14) is provided with a second liquid cooling cavity (1411), a second liquid inlet hole (1412) and a second liquid outlet hole (1413), the second liquid cooling cavity (1411) is connected with the second liquid inlet hole (1412) and the second liquid outlet hole (1413), the second liquid inlet hole (1412) is connected with the first liquid inlet hole (112), the second liquid outlet hole (113) is connected with the second liquid outlet hole (114) and the second liquid cooling cavity (1411) is connected with the second liquid inlet hole (1412) and the second liquid outlet hole (113) 413) is connected to the first liquid cooling chamber (111); the second liquid outlet hole (1413) faces the second high power consumption device (122); the cooling liquid flows into the second liquid cooling chamber (1411) through the first liquid inlet hole (112) and the second liquid inlet hole (1412) to perform heat exchange with the first high power consumption device (121); the cooling liquid after heat exchange flows to the second high power consumption device (122) through the second liquid outlet hole (1413) to perform heat exchange with the second high power consumption device (122); the cooling liquid after heat exchange flows into the first liquid cooling chamber (111) through the second liquid outlet hole (1413) to perform heat exchange with the low power consumption device (13); and the cooling liquid after heat exchange flows out through the first liquid outlet hole (113). A server (10) as described in claim 1, wherein the second liquid inlet hole (1412) is arranged at an end of the first liquid cooling part (144) away from the second liquid cooling part (145), and the second liquid outlet hole (1413) is arranged at a side of the second liquid cooling part (145) facing the second high power consumption device (122). A server (10) as described in claim 1, wherein the first high power consumption device (121) is a central processing unit, and the second high power consumption device (122) is a storage module. A server (10) as described in claim 1, wherein the cold plate module (14) includes a base plate (142) and a shell (141) having an opening, the base plate (142) covers the opening, the base plate (142) and the shell (141) are arranged to form the second liquid cooling cavity (1411), the side of the base plate (142) facing away from the shell (141) is in contact with the high power consumption device (12), and the second liquid inlet hole (1412) and the second liquid outlet hole (1413) are arranged in the shell (141). A server (10) as described in claim 4, wherein the cold plate module (14) further comprises a heat sink fin (1421), wherein the heat sink fin (1421) is disposed in the second liquid cooling cavity (1411), and wherein the heat sink fin (1421) is disposed on the base plate (142). A server (10) as described in claim 5, wherein a plurality of heat sink fins (1421) are provided, the plurality of heat sink fins (1421) extend along a first direction, and the plurality of heat sink fins (1421) are spaced apart along a second direction. A server (10) as described in any one of claims 1 to 6, wherein the server further comprises a first cold tube (15) and a second cold tube (16), one end of the first cold tube (15) being connected to the first liquid inlet hole (112), the other end of the first cold tube (15) being connected to the second cold tube (16), and the end of the second cold tube (16) facing away from the first cold tube (15) being connected to the second liquid inlet hole (1412). A server (10) as described in any one of claims 1 to 6, wherein the chassis (11) has a first side (114) and a second side (115), and the first side (114) and the second side (115) are respectively located on two sides of the chassis (11) along a first direction. A server (10) as described in claim 8, wherein the first liquid inlet hole (112) and the first liquid outlet hole (113) are arranged on the first side (114); or, the first liquid inlet hole (112) and the first liquid outlet hole (113) are arranged on the second side (115); the first liquid inlet hole (112) is located above the first liquid outlet hole (113) along the first direction; or, the first liquid inlet hole (112) is located below the first liquid outlet hole (113) along the first direction. A server (10) as described in claim 8, wherein the low power consumption device (13) is arranged between a side of the high power consumption device (12) facing the first side (114) and the first side (114); or, the low power consumption device (13) is arranged between a side of the high power consumption device (12) facing the second side (115) and the second side (115). A server (10) as described in any one of claims 1 to 6, wherein the high power consumption device (12) is arranged at the lower part of the chassis (11) along the first direction, and the low power consumption device (13) is arranged at the upper part of the chassis (11) along the first direction. A server (10) as described in any one of claims 1 to 6, wherein there are at least two high power consumption devices (12), and all of the high power consumption devices (12) are arranged along a first direction; or, all of the high power consumption devices (12) are arranged along a second direction; there are at least two cold plate modules (14), and all of the cold plate modules (14) are arranged correspondingly along the first direction; or, all of the cold plate modules (14) are arranged along the second direction, and all of the cold plate modules (14) correspond one-to-one to all of the high power consumption devices (12). A server (10) liquid cooling system, characterized in that it comprises: a server (10) as described in any one of claims 1 to 12; and a cold liquid distribution device (20), wherein the cold liquid distribution device (20) is provided with a liquid inlet (21) and a liquid outlet (22), wherein the liquid inlet (21) is connected to the liquid outlet (22), and the liquid inlet (21) and the liquid outlet (22) are both connected to a cold plate module (14).

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