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TWI876071B - Display method and substrate processing device - Google Patents

Display method and substrate processing device Download PDF

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TWI876071B
TWI876071B TW110124572A TW110124572A TWI876071B TW I876071 B TWI876071 B TW I876071B TW 110124572 A TW110124572 A TW 110124572A TW 110124572 A TW110124572 A TW 110124572A TW I876071 B TWI876071 B TW I876071B
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measured values
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sampling
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TW202217543A (en
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松治志
Hibiki Imai
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日商東京威力科創股份有限公司
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    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00General purpose image data processing
    • G06T1/20Processor architectures; Processor configuration, e.g. pipelining
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
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    • G05B23/0208Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the configuration of the monitoring system
    • G05B23/0216Human interface functionality, e.g. monitoring system providing help to the user in the selection of tests or in its configuration
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00Testing or monitoring of control systems or parts thereof
    • G05B23/02Electric testing or monitoring
    • G05B23/0205Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0221Preprocessing measurements, e.g. data collection rate adjustment; Standardization of measurements; Time series or signal analysis, e.g. frequency analysis or wavelets; Trustworthiness of measurements; Indexes therefor; Measurements using easily measured parameters to estimate parameters difficult to measure; Virtual sensor creation; De-noising; Sensor fusion; Unconventional preprocessing inherently present in specific fault detection methods like PCA-based methods
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
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    • G06F11/3058Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/14Digital output to display device ; Cooperation and interconnection of the display device with other functional units
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/14Digital output to display device ; Cooperation and interconnection of the display device with other functional units
    • G06F3/1407General aspects irrespective of display type, e.g. determination of decimal point position, display with fixed or driving decimal point, suppression of non-significant zeros
    • G06T11/26
    • H10P72/0421

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Abstract

[課題] 提供減輕用來圖形化的處理的負荷。 [解決手段] 提供一種顯示方法,係顯示表示關於基板處理的資訊的複數參數,具有:取得以預先設定週期取樣的複數前述參數的測定值、及關於前述測定值的取樣時間的資訊的工程;基於關於前述測定值的取樣時間的資訊,抽出以取樣的順序在複數前述參數的測定值產生時間變化的測定值、或抽出產生前述時間變化的測定值及在其跟前取樣的測定值的工程;將抽出的複數前述參數的測定值與關於前述測定值的取樣時間的資訊綁定並記憶於記憶體部的工程;基於記憶於記憶體部的關於前述測定值的取樣時間的資訊,將複數前述參數的測定值描繪成圖形的描繪部;顯示描繪的前述圖形的工程。 [Topic] Provide a way to reduce the load of graphics processing. [Solution] A display method is provided for displaying a plurality of parameters representing information about substrate processing, comprising: a process of obtaining measured values of a plurality of the aforementioned parameters sampled at a preset period and information about the sampling time of the aforementioned measured values; a process of extracting measured values that produce time changes in the measured values of the plurality of the aforementioned parameters in a sampling order based on the information about the sampling time of the aforementioned measured values, or extracting measured values that produce the aforementioned time changes and measured values sampled before the measured values; a process of binding the extracted measured values of the plurality of the aforementioned parameters with the information about the sampling time of the aforementioned measured values and storing them in a memory unit; a drawing unit that depicts the measured values of the plurality of the aforementioned parameters as a graph based on the information about the sampling time of the aforementioned measured values stored in the memory unit; and a process of displaying the depicted graph.

Description

顯示方法及基板處理裝置Display method and substrate processing device

本揭示係有關於顯示方法及基板處理裝置。 This disclosure relates to a display method and a substrate processing device.

例如,專利文獻1提案了將藉由資料收集部收集到的資料暫時保存於資料緩衝器,以預定的週期從資料緩衝器叫出資料描繪圖形、及將此時的週期因應CPU的使用率進行設定。 For example, Patent Document 1 proposes temporarily storing the data collected by the data collection unit in a data buffer, calling out the data from the data buffer at a predetermined cycle to draw a graph, and setting the cycle at this time according to the CPU usage rate.

例如,專利文獻2提案了在進行外部連接使用邏輯分析儀時,為了解消記錄LSI內部的狀態值時的記憶體容量不足等,在輸出連續的相同狀態值時,將該相同狀態值進行壓縮處理,使相同資料重複次數計數值及值不同的資料個數計數值重疊並記錄。 For example, Patent Document 2 proposes that when a logic analyzer is used for external connection, in order to eliminate the insufficient memory capacity when recording the state value inside the LSI, when outputting continuous identical state values, the identical state values are compressed so that the count value of the number of times the identical data is repeated and the count value of the number of data with different values are overlapped and recorded.

[先前技術文獻] [Prior Art Literature] [專利文獻] [Patent Literature]

[專利文獻1] 特開2010-224974號公報 [Patent Document 1] Patent Publication No. 2010-224974

[專利文獻2] 特開2006-90727號公報 [Patent Document 2] Patent Publication No. 2006-90727

本揭示提供能夠減輕用來圖形化的處理的負荷的技術。 This disclosure provides a technique that can reduce the load of graphics processing.

根據本揭示的一態樣,提供一種顯示方法,係顯示表示關於基板處理的資訊的複數參數,具有:取得以預先設定週期取樣的複數前述參數的測定值、及關於前述測定值的取樣時間的資訊的工程;基於關於前述測定值的取樣時間的資訊,抽出以取樣的順序在複數前述參數的測定值產生時間變化的測定值、或抽出產生前述時間變化的測定值及在其跟前取樣的測定值的工程;將抽出的複數前述參數的測定值與關於前述測定值的取樣時間的資訊綁定並記憶於記憶體部的工程;基於記憶於記憶體部的關於前述測定值的取樣時間的資訊,將複數前述參數的測定值描繪成圖形的描繪部;顯示描繪的前述圖形的工程。 According to one aspect of the present disclosure, a display method is provided for displaying a plurality of parameters representing information about substrate processing, comprising: obtaining measured values of the plurality of parameters sampled at a preset period and information about the sampling time of the measured values; extracting measured values that have time variations in the measured values of the plurality of parameters in the sampling order based on the information about the sampling time of the measured values; Or a process of extracting the measured values that produce the aforementioned time variation and the measured values sampled before the measured values; a process of binding the extracted measured values of the aforementioned multiple parameters with the information about the sampling time of the aforementioned measured values and storing them in a memory unit; a drawing unit that draws the measured values of the aforementioned multiple parameters into a graph based on the information about the sampling time of the aforementioned measured values stored in the memory unit; a process of displaying the drawn graph.

根據一側面,能夠減輕用來圖形化的處理的負荷的技術。 On the one hand, it is a technology that can reduce the load of graphics processing.

1:腔室 1: Chamber

2:電漿 2: Plasma

3:上部電極 3: Upper electrode

4:下部電極 4: Lower electrode

5:靜電夾盤 5: Electrostatic chuck

6:RF電源 6:RF power supply

7:RF電源 7:RF power supply

8:氣體供應部 8: Gas supply department

9:排氣裝置 9: Exhaust device

10:基板處理裝置 10: Substrate processing device

20:控制部 20: Control Department

21:取得部 21: Acquisition Department

22:記憶部 22: Memory Department

23:製程執行部 23: Process Execution Department

24:資料處理部 24: Data Processing Department

25:描繪部 25: Drawing Department

26:描繪要求部 26:Description requirements section

27:顯示部 27: Display unit

ST:載置台 ST: loading platform

G:基板 G: Substrate

[圖1]表示一實施形態的基板處理裝置的一例的剖面示意圖。 [Figure 1] is a schematic cross-sectional view showing an example of a substrate processing device in an embodiment.

[圖2]表示一實施形態的控制部的功能構造的一例的圖。 [Figure 2] is a diagram showing an example of the functional structure of a control unit of an implementation form.

[圖3]表示一實施形態的資料檔案儲存部的一例的圖。 [Figure 3] is a diagram showing an example of a data file storage unit in an implementation form.

[圖4]表示一實施形態的控制部的硬體構造的一例的圖。 [Figure 4] is a diagram showing an example of the hardware structure of a control unit of an implementation form.

[圖5]表示一實施形態的測定值的收集處理的流程的一例的圖。 [Figure 5] is a diagram showing an example of the flow of collecting and processing measured values in one implementation form.

[圖6]表示從前的測定值的圖形化處理的流程的一例的圖。 [Figure 6] A diagram showing an example of the flow of conventional graphical processing of measured values.

[圖7]用來說明從前的測定值的圖形化處理及圖形顯示的圖。 [Figure 7] A diagram used to explain the graphical processing and graphical display of previous measurement values.

[圖8]表示一實施形態的測定值的圖形化處理的流程的一例的圖。 [Figure 8] is a diagram showing an example of the flow of graphical processing of measured values in one implementation form.

[圖9]用來說明一實施形態的測定值的圖形化處理及圖形顯示的圖。 [Figure 9] A diagram for illustrating graphical processing and graphical display of measured values in one embodiment.

以下,參照圖式說明關於用來實施本揭示的形態。在各圖式中,有於相同構成部分附加相同符號,將重複的說明省略的情形。 Below, the form used to implement the present disclosure is described with reference to the drawings. In each drawing, the same symbols are attached to the same components, and repeated descriptions are omitted.

[基板處理裝置] [Substrate processing equipment]

首先,使用圖1說明關於一實施形態的基板處理裝置10。圖1為表示一實施形態的基板處理裝置10的一例的剖面示意圖。圖1表示藉由電容耦合電漿處理基板的處理裝置。 First, a substrate processing device 10 of an embodiment will be described using FIG. 1 . FIG. 1 is a schematic cross-sectional view showing an example of a substrate processing device 10 of an embodiment. FIG. 1 shows a processing device for processing a substrate by capacitively coupled plasma.

基板處理裝置10具有腔室1,腔室1內提供進行蝕刻處理及成膜處理的處理空間。基板處理裝置10中,在腔室1內的上部電極3與載置台ST之間的處理空間形成電漿,藉由電漿的作用處理基板G。載置台ST具有下部電極4及靜電夾盤5。載置台ST具有加熱器也可以下部電極4上保持有基板G。RF電源6與RF電源7耦合至下部電極4,能使用不同的RF頻率。上部電極3連接至接地電位。其他例中,RF電源6與RF電源7耦合至不同的電極也可以。於腔室1,經由氣體供應線11連接氣體供應部8,對處理空間供應處理氣體。於氣體供應線11連接流量控制器MFC。處理氣體藉由流量控制器MFC進行流量控制,對腔室1以預先設定的流量供應。腔室1的底部連接排氣裝置9,將腔室1內部排氣。 The substrate processing device 10 has a chamber 1, and a processing space for etching processing and film forming processing is provided in the chamber 1. In the substrate processing device 10, plasma is formed in the processing space between the upper electrode 3 and the stage ST in the chamber 1, and the substrate G is processed by the action of the plasma. The stage ST has a lower electrode 4 and an electrostatic chuck 5. The stage ST has a heater and the substrate G can be held on the lower electrode 4. The RF power supply 6 and the RF power supply 7 are coupled to the lower electrode 4, and different RF frequencies can be used. The upper electrode 3 is connected to the ground potential. In other examples, the RF power supply 6 and the RF power supply 7 can also be coupled to different electrodes. In the chamber 1, the gas supply part 8 is connected via the gas supply line 11 to supply the processing gas to the processing space. The gas supply line 11 is connected to the flow controller MFC. The process gas is flow-controlled by the flow controller MFC and supplied to the chamber 1 at a preset flow rate. The bottom of the chamber 1 is connected to the exhaust device 9 to exhaust the inside of the chamber 1.

基板處理裝置10,具有包含處理器及各種記憶區域的控制部20,控制基板處理裝置10的各要素對基板G施予蝕刻等電漿處理。 The substrate processing device 10 has a control unit 20 including a processor and various memory areas, and controls various elements of the substrate processing device 10 to perform plasma processing such as etching on the substrate G.

在腔室1安裝壓力計CM。壓力計CM在處理基板G的期間,測定腔室1內的壓力。壓力計CM測定到的壓力測定值,發送至控制部20。 A pressure gauge CM is installed in the chamber 1. The pressure gauge CM measures the pressure in the chamber 1 while the substrate G is being processed. The pressure value measured by the pressure gauge CM is sent to the control unit 20.

流量控制器MFC在處理基板G的期間,控制在處理氣體中包含的各氣體的流量同時進行測定。流量控制器MFC測定到的氣體流量測定值,發送至控制部20。 The flow controller MFC controls and measures the flow rates of the gases contained in the processing gas while processing the substrate G. The gas flow rate measurement values measured by the flow controller MFC are sent to the control unit 20.

在載置台ST安裝溫度計T。溫度計T在處理基板G的期間,測定載置台ST的溫度。溫度計T測定到的溫度測定值,發送至控制部20。 A thermometer T is installed on the stage ST. The thermometer T measures the temperature of the stage ST during the processing of the substrate G. The temperature measurement value measured by the thermometer T is sent to the control unit 20.

壓力計CM、溫度計T、流量控制器MFC為測定處理基板G的期間的基板G的狀態、製程的狀態或腔室1的狀態等關於基板處理的資訊的機器的一例。此外,壓力測定值、溫度測定值、氣流量測定值為表示基板G的狀態、製程的狀態或腔室1的狀態的複數參數的一例,表示關於基板處理的資訊的複數參數的測定值不限於此。 The pressure gauge CM, the thermometer T, and the flow controller MFC are examples of machines for measuring information about substrate processing, such as the state of the substrate G, the state of the process, or the state of the chamber 1 during the processing of the substrate G. In addition, the pressure measurement value, the temperature measurement value, and the gas flow measurement value are examples of multiple parameters representing the state of the substrate G, the state of the process, or the state of the chamber 1, and the measurement values of multiple parameters representing information about substrate processing are not limited to these.

控制部20,將表示基板處理裝置10執行的基板處理的複數參數圖形化,執行顯示於控制部20具有的顯示器36(圖3參照)或能與控制部20通信的其他電腦的顯示方法。 The control unit 20 graphically represents multiple parameters of the substrate processing performed by the substrate processing device 10, and executes a display method for displaying them on a display 36 (see FIG. 3 ) possessed by the control unit 20 or other computers capable of communicating with the control unit 20.

[控制部的功能構造] [Functional structure of the control unit]

接著,關於控制部20的功能構造的一例,參照圖2進行說明。圖2表示一實施形態的控制部20的功能構造的一例的圖。控制部20具有取得部21、記憶部22、製程執行部23、資料處理部24、描繪部25、描繪要求部26及顯示部27。 Next, an example of the functional structure of the control unit 20 is described with reference to FIG2. FIG2 is a diagram showing an example of the functional structure of the control unit 20 of an implementation form. The control unit 20 has an acquisition unit 21, a storage unit 22, a process execution unit 23, a data processing unit 24, a drawing unit 25, a drawing request unit 26, and a display unit 27.

取得部21取得以預先設定週期取樣的複數參 數的測定值、及關於前述測定值的取樣時間的資訊。關於測定值的取樣時間的資訊,可以是測定值的取樣編號、也可以是取樣時間本身。在本實施形態中,與取得取樣編號的情形為例進行說明。 The acquisition unit 21 acquires the measured values of multiple parameters sampled at a preset period, and information about the sampling time of the measured values. The information about the sampling time of the measured values can be the sampling number of the measured values or the sampling time itself. In this embodiment, the case of acquiring the sampling number is used as an example for explanation.

取樣編號在每個週期以升序附加編號。藉此,藉由將在每個週期測定到的測定值與取樣編號綁定並記憶於記憶部22,能夠算出測定值的取樣時間。例如,週期設為T、取樣編號設為n(n為1個以上的整數)時,將取樣開始的時點作為起點的各測定值的取樣時間t藉由式(1)算出。 The sampling number is numbered in ascending order in each cycle. Thus, by binding the measured value measured in each cycle with the sampling number and storing it in the memory unit 22, the sampling time of the measured value can be calculated. For example, when the cycle is set to T and the sampling number is set to n (n is an integer greater than 1), the sampling time t of each measured value starting from the time when sampling starts is calculated by formula (1).

t=T×(n-1)...(1) t=T×(n-1). . . (1)

例如,週期T為100msec,在每個週期取樣全參數的全資料時,各測定值的取樣時間成為t=100(msec)×(n-1),基於取樣編號n,能夠算出取樣時間t。例如,n=11的情形,成為從取樣開始經過1秒(100msec×10)後被取樣的資料。 For example, if the cycle T is 100msec, and all data of all parameters are sampled in each cycle, the sampling time of each measured value becomes t=100(msec)×(n-1), and the sampling time t can be calculated based on the sampling number n. For example, in the case of n=11, the data is sampled 1 second (100msec×10) after the sampling starts.

又,將n設為0以上的整數、將取樣開始的時點設為n=0時,取樣時間t能夠藉由式(1’)算出。 Furthermore, when n is set to an integer greater than 0 and the sampling start time is set to n=0, the sampling time t can be calculated by formula (1').

t=T×n...(1’) t=T×n. . . (1’)

資料處理部24基於式(1)或式(1’),將各測定值的取樣時間,藉由基於取樣編號n的整數與週期T的積算出。 The data processing unit 24 calculates the sampling time of each measured value based on the product of the integer based on the sampling number n and the cycle T based on formula (1) or formula (1').

此外,僅著目於取樣間的相對時間的情形,即便是將n設為1個以上的整數、將取樣開始的時點設為 n=1的情形,雖能適用上述式(1’),但該情形中,對應各個n的取樣時間的數值本身不再單獨具有意義。 In addition, if we only focus on the relative time between samples, even if n is set to an integer greater than 1 and the sampling start time is set to n=1, the above formula (1') can be applied. However, in this case, the numerical value of the sampling time corresponding to each n no longer has a separate meaning.

將取得到的複數參數的測定值,在每個參數與關於測定值的取樣時間有關的資訊綁定並儲存於記憶體部22的資料儲存部28。在資料儲存部28,記憶複數監視資料檔案128a、128b。 The measured values of the obtained multiple parameters are bound to the information related to the sampling time of each parameter and stored in the data storage unit 28 of the memory unit 22. In the data storage unit 28, multiple monitoring data files 128a and 128b are stored.

圖3為表示一實施形態的記憶於資料儲存部28的測定值的一例的圖。例如,在儲存於資料儲存部28的監視資料檔案128a中,記憶有取樣編號1(n=1)的全參數(壓力測定值、氣流量測定值、溫度測定值...)。於監視資料檔案128b中,記憶有取樣編號2(n=2)的全參數。於監視資料檔案128c中,記憶有取樣編號3(n=3)的全參數。 FIG3 is a diagram showing an example of measured values stored in the data storage unit 28 in an implementation form. For example, in the monitoring data file 128a stored in the data storage unit 28, all parameters (pressure measurement value, air flow measurement value, temperature measurement value, etc.) of the sampling number 1 (n=1) are stored. In the monitoring data file 128b, all parameters of the sampling number 2 (n=2) are stored. In the monitoring data file 128c, all parameters of the sampling number 3 (n=3) are stored.

如此監視資料檔案128a、128b...,在每個取樣編號設置,關於複數參數,將各參數的測定值綁定至取樣編號並記憶。圖3中,僅示出3個參數,但參數之數不限於3個,是2個以上也可以。此外,也將監視資料檔案128a、128b...總稱為監視資料檔案128。 In this way, monitoring data files 128a, 128b... are set for each sampling number, and for multiple parameters, the measured values of each parameter are bound to the sampling number and stored. In FIG3, only three parameters are shown, but the number of parameters is not limited to three, and two or more parameters are also possible. In addition, monitoring data files 128a, 128b... are collectively referred to as monitoring data files 128.

製程執行部23對基板G執行所期望的處理。資料處理部24,基於在每個測定值綁定的取樣編號,進行用來複數參數的測定值的圖形化的資料處理(圖形化處理的一部分)。具體上,資料處理部24,將複數參數的每個參數的測定值依取樣編號的順序進行探索,抽出產生時間變化的測定值。但是,資料處理部24,將複數參數的每個參數的測定值依取樣編號的順序進行探索,抽出產生時間 變化的測定值與其跟前的測定值也可以。如同以上藉由訂定的預定的規則抽出的測定值,記憶於記憶部22的暫時記憶區域即記憶體部29。於記憶體部29,與抽出的測定值綁定記憶關於前述測定值的取樣時間的資訊。 The process execution unit 23 executes the desired processing on the substrate G. The data processing unit 24 performs data processing (a part of the graphical processing) for graphically displaying the measured values of the plurality of parameters based on the sampling number bound to each measured value. Specifically, the data processing unit 24 searches the measured values of each parameter of the plurality of parameters in the order of the sampling number and extracts the measured values that have produced time variations. However, the data processing unit 24 may search the measured values of each parameter of the plurality of parameters in the order of the sampling number and extract the measured values that have produced time variations and the measured values immediately before the measured values. The measured values extracted by the predetermined rules as described above are stored in the temporary storage area of the storage unit 22, i.e., the memory unit 29. In the memory unit 29, information about the sampling time of the extracted measured value is stored and bound to the measured value.

描繪部25,基於從記憶於記憶體部29的取樣編號算出的取樣時間,將對應的測定值在每個參數描繪成圖形。顯示部27,顯示描繪複數參數的測定值的時間變化的圖形。 The drawing unit 25 draws the corresponding measured value for each parameter in a graph based on the sampling time calculated from the sampling number stored in the memory unit 29. The display unit 27 displays a graph that draws the time variation of the measured values of multiple parameters.

本實施形態中,控制部20將取樣的測定值的全部先蓄積於監視資料檔案128。接著,將從圖形的描繪時儲存於監視資料檔案128的複數參數的測定值基於上述預定的規則抽出的複數參數的測定值與關於該抽出的測定值的取樣時間的資訊綁定並記憶於記憶體部29。 In this embodiment, the control unit 20 first stores all the sampled measured values in the monitoring data file 128. Then, the measured values of the multiple parameters stored in the monitoring data file 128 when the graphics are drawn are extracted based on the above-mentioned predetermined rules and the information about the sampling time of the extracted measured values is bound and stored in the memory unit 29.

不過,測定值的記憶方法不限此,例如,從取樣的測定值將資料處理部24抽出的測定值直接記憶於記憶體部29也可以。此時,能夠省略將取樣的測定值的全部先記憶於監視資料檔案128的處理。藉此,能夠減輕處理的負荷,同時能夠減輕記憶取樣的測定值的記憶體的使用量。 However, the method of storing the measured values is not limited to this. For example, the measured values extracted by the data processing unit 24 from the sampled measured values can be directly stored in the memory unit 29. In this case, the process of first storing all the sampled measured values in the monitoring data file 128 can be omitted. In this way, the processing load can be reduced, and the amount of memory used to store the sampled measured values can be reduced.

資料處理部24,因應圖形的描繪要求,從取樣的測定值基於上述預定的規則進行複數參數的測定值的抽出,描繪部25,將因應其抽出的複數參數的測定值的時間變化描繪成圖形也可以。描繪要求部26,因應圖形的描繪要求為可的畫面(描繪要求畫面)的顯示,輸出指示開始 抽出測定值的工程的指示信號也可以。描繪要求部26,因應對描繪要求畫面的圖形的描繪要求的操作,輸出指示開始描繪處理(圖形化處理的一部分)的指示信號也可以。 The data processing unit 24 may extract the measured values of multiple parameters from the sampled measured values based on the above-mentioned predetermined rules in response to the drawing request of the graphics, and the drawing unit 25 may draw the time changes of the measured values of the multiple parameters extracted in response to the drawing request. The drawing request unit 26 may output an instruction signal for instructing the start of the process of extracting the measured values in response to the display of the screen (drawing request screen) where the drawing request of the graphics is possible. The drawing request unit 26 may output an instruction signal for instructing the start of the drawing process (a part of the graphics process) in response to the operation of the drawing request of the graphics on the drawing request screen.

[控制部的硬體構造] [Hardware structure of the control unit]

接著,關於控制部20的硬體構造的一例,參照圖4進行說明。圖4為表示一實施形態的控制部20的硬體構造的一例的圖。控制部20具有介面31、補助記憶裝置32、主記憶體33、CPU34、鍵盤35及顯示器36。 Next, an example of the hardware structure of the control unit 20 is described with reference to FIG4. FIG4 is a diagram showing an example of the hardware structure of the control unit 20 in an embodiment. The control unit 20 has an interface 31, an auxiliary memory device 32, a main memory 33, a CPU 34, a keyboard 35, and a display 36.

介面31為與壓力計CM等的測定部的介面。藉此,控制部20,經由介面31取得以預先設定的週期取樣的複數參數的測定值。 The interface 31 is an interface with a measuring unit such as a pressure gauge CM. Thus, the control unit 20 obtains the measured values of multiple parameters sampled at a preset period through the interface 31.

補助記憶裝置32,為將取樣的複數參數的測定值與該測定值的取樣編號綁定並儲存的非揮發性的記憶裝置。主記憶體33,為從取樣的複數參數的測定值將基於上述預定的規則抽出的測定值與該測定值的取樣編號綁定並暫時保持的揮發性的半導體記憶體。 The auxiliary memory device 32 is a non-volatile memory device that binds and stores the measured values of the sampled multiple parameters with the sampling numbers of the measured values. The main memory 33 is a volatile semiconductor memory that binds and temporarily stores the measured values extracted from the sampled multiple parameters based on the above-mentioned predetermined rules with the sampling numbers of the measured values.

CPU34,基於記憶於補助記憶裝置32及主記憶體33的測定值及該測定值的取樣編號執行圖形化處理(資料處理及描繪處理等)。 CPU 34 performs graphic processing (data processing and drawing processing, etc.) based on the measured values stored in the auxiliary memory device 32 and the main memory 33 and the sampling numbers of the measured values.

鍵盤35為輸入裝置的一例,輸入預定的操作。顯示器36為顯示裝置的一例,顯示圖形化的複數參數的測定值的時間變化。取代鍵盤35將觸控面板作為輸入裝置也可以。 The keyboard 35 is an example of an input device, and inputs a predetermined operation. The display 36 is an example of a display device, and displays the time changes of the measured values of multiple parameters in a graphical form. Instead of the keyboard 35, a touch panel may be used as an input device.

圖2描繪了著目於控制部20的功能的方塊圖,例如,製程執行部23、資料處理部24、描繪部25的功能,能藉由使CPU34執行的基板處理、資料處理、描繪處理實現。 FIG2 depicts a block diagram focusing on the functions of the control unit 20. For example, the functions of the process execution unit 23, the data processing unit 24, and the drawing unit 25 can be realized by enabling the CPU 34 to perform substrate processing, data processing, and drawing processing.

記憶部22的功能,能藉由補助記憶裝置32及主記憶體33實現。顯示部27的功能,能藉由顯示器36實現。取得部21的功能,能藉由介面31實現。描繪要求部26的功能,能藉由鍵盤35實現。 The function of the memory unit 22 can be realized by the auxiliary memory device 32 and the main memory 33. The function of the display unit 27 can be realized by the display 36. The function of the acquisition unit 21 can be realized by the interface 31. The function of the drawing request unit 26 can be realized by the keyboard 35.

[測定值的收集處理] [Collection and processing of measured values]

接著,有關控制部20執行的測定值的收集處理,參照圖5進行說明。圖5為表示一實施形態的測定值的收集處理的流程的一例的圖。 Next, the collection and processing of the measured values executed by the control unit 20 will be described with reference to FIG5. FIG5 is a diagram showing an example of the flow of the collection and processing of the measured values in one embodiment.

本收集處理,為在製程執行部23執行基板處理的期間,例如在每100msec週期取得複數參數的全部測定值,記憶於監視資料檔案128的處理。 This collection process is to obtain all measured values of multiple parameters during the process execution unit 23 executing substrate processing, for example, every 100msec cycle, and store them in the monitoring data file 128.

開始基板處理後,取得部21,以預先設定的週期將複數參數的測定值取樣,取得複數參數的取樣編號與測定值(步驟S1)。接著,取得部21,將取得的每個參數的取樣編號與測定值記憶於資料儲存部28的監視資料檔案128(步驟S2)。 After the substrate processing starts, the acquisition unit 21 samples the measured values of multiple parameters at a preset period to obtain the sampling numbers and measured values of the multiple parameters (step S1). Then, the acquisition unit 21 stores the sample number and measured value of each parameter obtained in the monitoring data file 128 of the data storage unit 28 (step S2).

接著,取得部21,判定製程(基板處理)是否結束(步驟S3)。到製程結束為止,重複執行步驟S1~S3,將取樣的每個參數的取樣編號與測定值蓄積於監視資料檔 案128。製程結束後,判定接下來的製程是否開始(步驟S4),到接下來的製程開始為止等待。開始接下來的製程時,執行接下來的製程的期間,取得部21,再取得取樣的複數參數的取樣編號與測定值並蓄積於監視資料檔案128。 Next, the acquisition unit 21 determines whether the process (substrate processing) is completed (step S3). Until the process is completed, steps S1 to S3 are repeatedly executed, and the sampling number and measured value of each parameter sampled are accumulated in the monitoring data file 128. After the process is completed, it is determined whether the next process is started (step S4), and waits until the next process starts. When the next process starts, during the execution of the next process, the acquisition unit 21 acquires the sampling numbers and measured values of the sampled multiple parameters and accumulates them in the monitoring data file 128.

[從前的圖形化] [Former Graphics]

接著,關於從前的測定值的圖形化處理,參照圖6及圖7進行說明。圖6為表示從前的測定值的圖形化處理的流程的一例的圖。圖7為用來說明從前的測定值的圖形化處理及圖形顯示的圖。此外,從前的圖形化處理中,在監視資料檔案128依取樣的順序蓄積測定值,測定值的取樣時間不使用取樣編號取得時,不將取樣編號綁定測定值並記憶也可以。 Next, the graphical processing of the previous measured values is explained with reference to FIG6 and FIG7. FIG6 is a diagram showing an example of the flow of the graphical processing of the previous measured values. FIG7 is a diagram for explaining the graphical processing and graphical display of the previous measured values. In addition, in the previous graphical processing, when the monitoring data file 128 accumulates the measured values in the order of sampling and the sampling time of the measured values is not obtained using the sampling number, it is also possible not to bind the sampling number to the measured value and store it.

圖6的從前的圖形化處理中,首先,判定是否遷移至描繪要求畫面(步驟S11)。如此顯示描繪要求畫面時,判定遷移至描繪要求畫面,將儲存於監視資料檔案128的複數參數的測定值在記憶體部29以該形式記憶(步驟S12)。 In the previous graphical processing of FIG. 6, first, it is determined whether to migrate to the drawing request screen (step S11). When the drawing request screen is displayed in this way, it is determined to migrate to the drawing request screen, and the measured values of the multiple parameters stored in the monitoring data file 128 are stored in the memory unit 29 in this form (step S12).

例如,如圖7所示,在顯示器36顯示描繪要求畫面136後,將儲存於圖7(a)所示的監視資料檔案128的各參數(A:壓力測定值、B:氣流量測定值、C:溫度測定值)在記憶體部29以該形式記憶。也就是說,記憶於記憶體部29的資料,與儲存於監視資料檔案128的各參數的 測定值相同。 For example, as shown in FIG7, after the display 36 displays the drawing request screen 136, the parameters (A: pressure measurement value, B: air flow measurement value, C: temperature measurement value) stored in the monitoring data file 128 shown in FIG7 (a) are stored in the memory unit 29 in this form. That is, the data stored in the memory unit 29 is the same as the measurement value of each parameter stored in the monitoring data file 128.

接著,判定是否有描繪要求(步驟S13)。例如操作者未按壓圖7所示的描繪要求畫面136的「Yes」的按鍵136a(步驟S13「No」),經過預先設定的時間時(步驟S14),結束本處理。預定時間經過前若按壓描繪要求畫面136的「Yes」的按鍵136a,則判定有描繪要求。此外,不設步驟S14,以到按壓按鍵136a為止持續等待狀態的方式,在步驟S13為「No」的時回到步驟S13之前也可以。 Next, determine whether there is a drawing request (step S13). For example, if the operator does not press the "Yes" button 136a of the drawing request screen 136 shown in Figure 7 (step S13 "No"), this process ends after a preset time (step S14). If the "Yes" button 136a of the drawing request screen 136 is pressed before the preset time, it is determined that there is a drawing request. In addition, step S14 is not provided, and the waiting state is continued until the button 136a is pressed. When step S13 is "No", it is also possible to return to the state before step S13.

此時,因應描繪要求,將在記憶體部29內記憶的複數參數的各參數的測定值,以記憶的順序標記並圖形化(步驟S15),顯示複數參數的圖形(步驟S16),結束處理。藉此,如圖7(b)所示,將在記憶體部29記憶的複數參數的測定值的時間變化作為圖形顯示,能夠確認基板處理狀態。 At this time, in response to the drawing request, the measured values of each parameter of the multiple parameters stored in the memory unit 29 are marked and graphed in the order of storage (step S15), and the graph of the multiple parameters is displayed (step S16), and the processing is terminated. In this way, as shown in Figure 7 (b), the time change of the measured values of the multiple parameters stored in the memory unit 29 is displayed as a graph, and the substrate processing status can be confirmed.

在從前的圖形化處理中,在記憶體部29記憶的測定值,與在監視資料檔案128儲存的各參數的測定值相同,將取樣的測定值的全部標記成圖形。因此,依取樣的順序標記,圖形化處理的負荷高,圖形化花費時間。特別是近年來參數之數膨大,圖形化處理的負荷變得更高。 In the previous graphics processing, the measured values stored in the memory unit 29 are the same as the measured values of each parameter stored in the monitoring data file 128, and all the sampled measured values are marked as graphics. Therefore, the graphics processing load is high and the graphics takes time because the order of sampling is marked. In particular, the number of parameters has increased in recent years, and the graphics processing load has become even higher.

又,從前的圖形化處理中,因為使在監視資料檔案128內蓄積的複數參數的測定值維持原狀記憶於記憶體部29,記憶體的使用量大。特別是近年來參數之數膨大,記憶體的使用量變得更高。記憶體,因為不只是圖形的描繪也使用於其他處理,因圖形化處理而記憶體的使用 量變大則也會對其他處理造成影響。 In addition, in the previous graphic processing, the measured values of multiple parameters stored in the monitoring data file 128 were stored in the memory unit 29 as they were, so the memory usage was large. In particular, the number of parameters has increased in recent years, and the memory usage has become even higher. Memory is not only used for drawing graphics but also for other processing. If the memory usage due to graphic processing increases, it will also affect other processing.

如同以上,為了圖形化使用的CPU34及主記憶體33的消耗變多。又,因為在圖形化處理持續CPU34的負荷高的狀況,到畫面顯示圖形為止花費的時間也變長,導致服務的降低。 As mentioned above, the CPU 34 and main memory 33 used for graphics processing consume more memory. Also, because the CPU 34 load is high during graphics processing, the time it takes to display the graphics on the screen also increases, resulting in reduced service.

在此,本實施形態的圖形化處理中,降低為了顯示複數參數的圖形使用的CPU34及主記憶體33的消耗,縮短了到在畫面顯示圖形為止的時間。此外,表示本實施形態的顯示方法的圖形化處理,包含圖5所示的收集處理、及圖8所示的圖形化處理(資料處理、描繪處理等)。 Here, in the graphics processing of this embodiment, the consumption of CPU 34 and main memory 33 used to display graphics of multiple parameters is reduced, and the time until the graphics are displayed on the screen is shortened. In addition, the graphics processing of the display method of this embodiment includes the collection processing shown in Figure 5 and the graphics processing (data processing, drawing processing, etc.) shown in Figure 8.

[本實施形態的圖形化] [Graphicization of this implementation form]

接著,關於本實施形態的測定值的圖形化處理,參照圖8及圖9進行說明。圖8為表示一實施形態的測定值的圖形化處理的流程的一例的圖。圖9為用來說明一實施形態的測定值的圖形化處理及圖形顯示的圖。 Next, the graphical processing of the measured values of this embodiment will be described with reference to FIG8 and FIG9. FIG8 is a diagram showing an example of the flow of the graphical processing of the measured values of an embodiment. FIG9 is a diagram for explaining the graphical processing and graphical display of the measured values of an embodiment.

本處理,首先,判定描繪要求部26是否遷移至描繪要求畫面(步驟S21)。描繪要求部26,判定遷移至描繪要求畫面,資料處理部24,就在監視資料檔案128儲存的複數參數在每個參數基於上述預定的規則抽出測定值的變化點。資料處理部24,將抽出的變化點的測定值與取樣編號綁定並記憶於記憶體部29(步驟S22)。但是,資料處理部24,將抽出的變化點的測定值及在前述測定值的跟 前取樣的測定值與取樣編號綁定並記憶於記憶體部29也可以。 In this process, first, it is determined whether the drawing request unit 26 has been moved to the drawing request screen (step S21). The drawing request unit 26 determines that it has been moved to the drawing request screen, and the data processing unit 24 extracts the change point of the measured value for each parameter based on the above-mentioned predetermined rule from the multiple parameters stored in the monitoring data file 128. The data processing unit 24 binds the measured value of the extracted change point with the sampling number and stores it in the memory unit 29 (step S22). However, the data processing unit 24 may bind the measured value of the extracted change point and the measured value sampled before the aforementioned measured value with the sampling number and store them in the memory unit 29.

例如,如圖9所示,在顯示器36顯示描繪要求畫面136後,描繪要求部26輸出指示開始抽出測定值的處理的指示信號。資料處理部24,接收指示開始抽出測定值的處理的指示信號後,從圖9(a)所示的監視資料檔案128中儲存的各參數(A:壓力測定值、B:氣流量測定值、C:溫度測定值...)抽出測定值的變化點。接著,資料處理部24,將抽出的變化點的測定值與取樣編號綁定並記憶於記憶體部29。此外,以複數週期構成的取樣期間的最初的測定值與最後的測定值無條件記憶於記憶體部29。藉此,例如,A的壓力測定值中,抽出取樣編號為1、3、6的變化點。接著,將抽出的變化點的測定值「7」、「10」、「11」與取樣編號「1」、「3」、「6」綁定並記憶於記憶體部29。此外,本實施形態中,關於抽出的變化點跟前的取樣編號「2」、「5」的測定值「7」、「10」也與取樣編號「2」、「5」綁定並記憶於記憶體部29。關於B的氣流量測定值及C的溫度測定值也同樣進行測定值的抽出。 For example, as shown in FIG9 , after the display 36 displays the drawing request screen 136 , the drawing request unit 26 outputs an instruction signal for instructing the start of the process of extracting the measured value. After receiving the instruction signal for instructing the start of the process of extracting the measured value, the data processing unit 24 extracts the change point of the measured value from each parameter (A: pressure measured value, B: air flow measured value, C: temperature measured value, etc.) stored in the monitoring data file 128 shown in FIG9 (a). Then, the data processing unit 24 binds the measured value of the extracted change point to the sampling number and stores it in the memory unit 29. In addition, the first measured value and the last measured value of the sampling period composed of multiple cycles are unconditionally stored in the memory unit 29. Thus, for example, from the pressure measurement value of A, the change points with sampling numbers 1, 3, and 6 are extracted. Then, the measurement values "7", "10", and "11" of the extracted change points are bound to the sampling numbers "1", "3", and "6" and stored in the memory unit 29. In addition, in this embodiment, the measurement values "7" and "10" of the sampling numbers "2" and "5" before the extracted change points are also bound to the sampling numbers "2" and "5" and stored in the memory unit 29. The measurement values of the airflow measurement value of B and the temperature measurement value of C are also extracted in the same manner.

其結果,如圖9(b)所示,取樣編號「4」的壓力測定值及溫度測定值被實質丟棄,未記憶於記憶體部29。因此,記憶於記憶體部29的資料,比儲存於監視資料檔案128的各參數的測定值還少,能夠降低記憶體部29的使用量。 As a result, as shown in FIG9(b), the pressure measurement value and temperature measurement value of the sampling number "4" are substantially discarded and not stored in the memory unit 29. Therefore, the data stored in the memory unit 29 is less than the measurement values of each parameter stored in the monitoring data file 128, which can reduce the usage of the memory unit 29.

接著,描繪要求部26,判定是否有描繪要求(步驟S23)。例如操作者未按壓圖9所示的描繪要求畫面136的「Yes」的按鍵136a(步驟S23「No」),經過預先設定的時間時(步驟S24),結束本處理。預定時間經過前若按壓描繪要求畫面136的「Yes」的按鍵136a,描繪要求部26則判定有描繪要求,輸出指示開始抽出的測定值的描繪處理的指示信號。此外,不設步驟S24,以到按壓按鍵136a為止持續等待狀態的方式,在步驟S23為「No」的時回到步驟S23之前也可以。 Next, the drawing request unit 26 determines whether there is a drawing request (step S23). For example, if the operator does not press the "Yes" button 136a of the drawing request screen 136 shown in Figure 9 (step S23 "No"), this process ends after a preset time (step S24). If the "Yes" button 136a of the drawing request screen 136 is pressed before the preset time, the drawing request unit 26 determines that there is a drawing request and outputs an instruction signal indicating the start of the drawing process of the extracted measured value. In addition, step S24 is not provided, and the waiting state is continued until the button 136a is pressed. When step S23 is "No", it is also possible to return to the state before step S23.

描繪部25,接收到指示開始描繪處理的指示信號後,將資料處理部24抽出的測定值,因應基於式(1)或式(1’)從取樣編號算出的取樣時間標記、並圖形化(步驟S25)。顯示部27,顯示複數參數的測定值的圖形(步驟S26),結束處理。因應從例如綁定於圖9(b)的記憶體部29內的測定值的取樣編號算出的取樣時間在每個參數標記測定值,將各參數的測定值的時間變化圖形化並顯示。藉此,如圖9(c)所示,將在記憶體部29記憶的複數參數的測定值作為圖形顯示,能夠確認基板處理狀態。圖9(c)所示的圖形,成為與圖7(c)所示的從前例的圖形相同的表示。 After receiving the instruction signal for instructing the start of the drawing process, the drawing unit 25 marks the measured value extracted by the data processing unit 24 according to the sampling time calculated from the sampling number based on the formula (1) or the formula (1'), and graphically displays it (step S25). The display unit 27 displays the graph of the measured values of the plurality of parameters (step S26), and the processing ends. The measured value is marked for each parameter according to the sampling time calculated from the sampling number of the measured value in the memory unit 29, for example, bound to FIG9(b), and the time change of the measured value of each parameter is graphically displayed. In this way, as shown in FIG9(c), the measured values of the plurality of parameters stored in the memory unit 29 are displayed as a graph, and the substrate processing status can be confirmed. The graph shown in FIG9(c) becomes the same representation as the graph of the previous example shown in FIG7(c).

如同以上說明那樣,本實施形態的測定值的圖形化處理中,將在監視資料檔案128蓄積的各參數的測定值的變化點抽出,將變化點的測定值記憶於記憶體部29。或將在監視資料檔案128蓄積的各參數的測定值的變化點抽出,將變化點的測定值及在其跟前取樣的測定值記 憶於記憶體部29。 As described above, in the graphical processing of the measured values of this embodiment, the change point of the measured values of each parameter accumulated in the monitoring data file 128 is extracted, and the measured value of the change point is stored in the memory unit 29. Alternatively, the change point of the measured value of each parameter accumulated in the monitoring data file 128 is extracted, and the measured value of the change point and the measured value sampled before it are stored in the memory unit 29.

藉此,在測定值未變化的期間,該期間的測定值能夠作為於圖形化不需要的資料而不記憶於記憶體部29並丟棄。也就是說,取樣的測定值為相同值持續的期間,因為在圖形上作為水平的直線顯示,變化點的測定值以外的測定值或變化點的測定值及其跟前的測定值以外的測定值成為圖形化不需要的資料。在此,本實施形態中,因為不將判定成不需要的資料的測定值記憶於記憶體部29,減少了用以圖形化的測定值。藉此,能夠降低用以圖形化的記憶體使用量。 Thus, during the period when the measured value does not change, the measured value of that period can be treated as data not needed for graphics and not stored in the memory unit 29 and discarded. That is, during the period when the sampled measured value continues to be the same value, because it is displayed as a horizontal straight line on the graph, the measured value other than the measured value of the change point or the measured value of the change point and the measured value before it become data not needed for graphics. Here, in this embodiment, because the measured value determined as unnecessary data is not stored in the memory unit 29, the measured value used for graphics is reduced. Thus, the memory usage for graphics can be reduced.

又,與從前相比因為在記憶體部29記憶的測定值減少,描繪成圖形的測定值的點數減少,能夠降低進行用以圖形化的處理的CPU34的負荷,能夠縮短描繪圖形並顯示的時間。又,為了算出取樣測定值的時間,綁定於測定值將取樣編號記憶於記憶體部29。藉此,例如,能夠算出在記憶體部29記憶的測定部的取樣時間,能夠將測定值因應取樣時間標記,將測定值的時間變化圖形化。 Furthermore, since the number of measured values stored in the memory unit 29 is reduced compared to the past, the number of points of the measured values drawn into a graph is reduced, and the load of the CPU 34 for processing for graphics can be reduced, and the time for drawing and displaying the graph can be shortened. In addition, in order to calculate the time of sampling the measured value, the sampling number is bound to the measured value and stored in the memory unit 29. By this, for example, the sampling time of the measuring unit stored in the memory unit 29 can be calculated, and the measured value can be marked according to the sampling time, and the time change of the measured value can be graphed.

此外,變化點的測定值的跟前的測定值記憶也可以、不記憶也可以。與變化點的測定值一同將其跟前的測定值記憶於記憶體部29時,藉由將標記的鄰接的測定值彼此以直線連結的圖形化規則圖形化也可以。 In addition, the measured value before the measured value of the change point may be stored or not stored. When the measured value before the change point is stored in the memory unit 29 together with the measured value of the change point, it may be graphically represented by a graphical rule that connects the marked adjacent measured values with straight lines.

僅將變化點的測定值記憶於記憶體部29的情形,不將標記的鄰接的測定值彼此以直線連結,而從到下個變化點的測定值為止跟前的變化點的測定值拉出水平直 線,使用在下個變化點的測定值測定值階段增減的圖形化規則也可以。但是,圖形化規則不限於此,能夠使用其他規則。 In the case where only the measured value of the change point is stored in the memory unit 29, the measured values of the adjacent marks are not connected with straight lines, but a horizontal straight line is drawn from the measured value of the previous change point to the measured value of the next change point, and a graphical rule of increasing and decreasing the measured value at the next change point is used. However, the graphical rule is not limited to this, and other rules can be used.

根據以上說明的本實施形態的顯示方法,能夠將在記憶體部29記憶的測定值壓縮。藉此,在測定值的圖形化中能夠減少標記的點數,能夠減輕用以圖形化的處理的負荷,能夠縮短到圖形化為止的時間。 According to the display method of the present embodiment described above, the measured values stored in the memory unit 29 can be compressed. In this way, the number of points to be marked in the graphical representation of the measured values can be reduced, the processing load for the graphical representation can be reduced, and the time until the graphical representation can be shortened.

又,因為使在監視資料檔案128內蓄積的複數參數的測定值壓縮並記憶於記憶體部29,能夠減少記憶體的使用量。 Furthermore, since the measured values of multiple parameters stored in the monitoring data file 128 are compressed and stored in the memory unit 29, the memory usage can be reduced.

此外,本實施形態中,在監視資料檔案128,記憶全參數的被取樣的全測定值,在記憶體部29記憶變化點抽出後的各參數的測定值。但是,將變化點抽出後的各參數的測定值記憶於監視資料檔案128,接收指示開始抽出測定值的工程的指示信號後,將在監視資料檔案128記憶的變化點抽出後的各參數的測定值圖形化並顯示也可以。或藉由在記憶體部29記憶的測定值將監視資料檔案128的資料更新也可以。藉此,能夠將取樣的測定值壓縮記憶,降低儲存監視資料檔案128的資料儲存部28的使用量。 In the present embodiment, the sampled total measured values of all parameters are stored in the monitoring data file 128, and the measured values of each parameter after the change point is extracted are stored in the memory unit 29. However, the measured values of each parameter after the change point is extracted are stored in the monitoring data file 128, and after receiving an instruction signal for instructing the start of the process of extracting the measured values, the measured values of each parameter after the change point is extracted stored in the monitoring data file 128 may be graphically displayed. Alternatively, the data in the monitoring data file 128 may be updated using the measured values stored in the memory unit 29. In this way, the sampled measured values can be compressed and stored in memory, thereby reducing the usage of the data storage unit 28 for storing the monitoring data file 128.

應考慮本次揭示的本實施形態的顯示方法及基板處理裝置,於所有的點都是例示並非限制。實施形態,在不脫離申請專利範圍及其主旨的情況下,也能夠以各種形態進行變形及改良。上述複數實施形態記載的事 項,在不矛盾的範圍內也能夠取得其他構造,又在不矛盾的範圍內也能夠組合。 It should be considered that the display method and substrate processing device of the present embodiment disclosed this time are illustrative and non-limiting in all aspects. The embodiment can be deformed and improved in various forms without departing from the scope of the patent application and its main purpose. The matters recorded in the above multiple embodiments can also obtain other structures within the scope of non-contradiction, and can also be combined within the scope of non-contradiction.

本揭示的基板處理裝置無論是Atomic Layer Deposition(ALD)裝置、Capacitively Coupled Plasma(CCP)、Inductively Coupled Plasma(ICP)、Radial Line Slot Antenna(RLSA)、Electron Cyclotron Resonance Plasma(ECR)、Helicon Wave Plasma(HWP)的任何態樣的裝置都能適用。 The substrate processing device disclosed herein can be applied to any type of device, including Atomic Layer Deposition (ALD) device, Capacitively Coupled Plasma (CCP), Inductively Coupled Plasma (ICP), Radial Line Slot Antenna (RLSA), Electron Cyclotron Resonance Plasma (ECR), and Helicon Wave Plasma (HWP).

又,作為基板處理裝置的一例舉電漿處理裝置進行說明,但基板處理裝置,為在基板施予預定處理(例如,成膜處理、蝕刻處理等)的裝置即可,不限於電漿處理裝置。 Furthermore, a plasma processing device is used as an example of a substrate processing device for explanation, but a substrate processing device is any device that performs a predetermined process (e.g., film forming process, etching process, etc.) on a substrate and is not limited to a plasma processing device.

Claims (6)

一種顯示方法,係顯示表示關於基板處理的資訊的複數參數,具有:藉由取得部,取得以預先設定週期取樣的複數前述參數的測定值、及關於前述測定值的取樣時間的資訊的工程;藉由資料處理部,基於關於前述測定值的取樣時間的資訊,抽出以取樣的順序在複數前述參數的測定值產生時間變化的測定值、或抽出產生前述時間變化的測定值及在其跟前取樣的測定值的工程;藉由記憶部,將抽出的複數前述參數的測定值與關於前述測定值的取樣時間的資訊綁定並記憶於記憶體部的工程;藉由描繪部,基於記憶於記憶體部的關於前述測定值的取樣時間的資訊,將複數前述參數的測定值描繪成圖形的工程;藉由顯示部,顯示描繪的前述圖形的工程。 A display method for displaying a plurality of parameters representing information on substrate processing comprises: obtaining, by an acquisition unit, measured values of the plurality of parameters sampled at a preset period and information on the sampling time of the measured values; extracting, by a data processing unit, measured values that have a temporal change in the measured values of the plurality of parameters in the sampling order, or extracting the temporal change in the measured values of the plurality of parameters based on the information on the sampling time of the measured values; The process of extracting the measured values of the plurality of parameters and the measured values sampled before the measured values; the process of binding the extracted measured values of the plurality of parameters and the information about the sampling time of the measured values in the memory unit and storing them in the memory unit; the process of describing the measured values of the plurality of parameters into a graph based on the information about the sampling time of the measured values stored in the memory unit by the description unit; the process of displaying the described graph by the display unit. 如請求項1記載的顯示方法,其中,取得到的關於前述測定值的取樣時間的資訊,為取得到的前述測定值的取樣編號;描繪成前述圖形的工程,將前述測定值的取樣時間,藉由基於前述取樣編號的整數與前述週期的積算出,對應前述測定值的取樣時間將複數前述參數的測定值描繪成圖形。 The display method as recited in claim 1, wherein the information obtained about the sampling time of the aforementioned measured value is the sampling number of the aforementioned measured value obtained; the process of drawing the aforementioned graph calculates the sampling time of the aforementioned measured value by the integral of the aforementioned sampling number and the aforementioned period, and draws the measured values of the plurality of aforementioned parameters into a graph corresponding to the sampling time of the aforementioned measured value. 如請求項1記載的顯示方法,其中,藉由資料儲存部,將取得到的複數前述參數的測定值與關於前述測定值的取樣時間有關的資訊綁定並記憶於資料檔案的工程;記憶於前述記憶體部的工程,將從儲存於前述資料檔案的複數前述參數的測定值抽出的複數前述參數的測定值與關於前述測定值的取樣時間的資訊綁定並記憶於前述記憶體部。 The display method described in claim 1, wherein the process of binding the obtained measured values of the plurality of parameters and the information related to the sampling time of the measured values to the data file by the data storage unit and storing them in the data file; the process of storing in the memory unit, binding the measured values of the plurality of parameters extracted from the measured values of the plurality of parameters stored in the data file and the information related to the sampling time of the measured values to the memory unit and storing them in the memory unit. 如請求項3記載的顯示方法,其中,取得前述測定值的工程,在前述基板處理的期間,以前述週期將複數前述參數的測定值取樣,將表示前述取樣的順序的取樣編號綁定並記憶於前述資料檔案。 The display method described in claim 3, wherein the process of obtaining the aforementioned measured values samples the measured values of the plurality of aforementioned parameters at the aforementioned cycle during the aforementioned substrate processing, and binds the sampling numbers representing the sequence of the aforementioned sampling to the aforementioned data file and stores them. 如請求項1至4中任一項記載的顯示方法,具有:藉由前述顯示部,顯示前述圖形的描繪要求為可的畫面的工程;藉由描繪要求部,因應前述圖形的描繪要求為可的畫面的顯示,輸出指示開始抽出前述測定值的工程的指示信號的工程。 The display method described in any one of claim items 1 to 4 comprises: a process of displaying a screen showing that the drawing request of the aforementioned graphic is acceptable by the aforementioned display unit; a process of outputting an instruction signal for instructing the process of extracting the aforementioned measured value in response to the display of the screen showing that the drawing request of the aforementioned graphic is acceptable by the drawing request unit. 一種執行基板處理的基板處理裝置,具有:取得以預先設定週期取樣的複數參數的測定值、及關於前述測定值的取樣時間的資訊的取得部;基於關於前述測定值的取樣時間的資訊,抽出以取樣的順序在複數前述參數的測定值產生時間變化的測定值、 或抽出產生前述時間變化的測定值及其跟前取樣的測定值的資料處理部;將抽出的複數前述參數的測定值與關於前述測定值的取樣時間的資訊綁定並記憶於記憶體部的記憶部;基於記憶於記憶體部的關於前述測定值的取樣時間的資訊,將複數前述參數的測定值描繪成圖形的描繪部;顯示描繪的前述圖形的顯示部。 A substrate processing device for performing substrate processing comprises: an acquisition unit for acquiring measured values of a plurality of parameters sampled at a preset period and information about the sampling time of the measured values; a data processing unit for extracting measured values that produce time changes in the measured values of the plurality of parameters in the sampling order based on the information about the sampling time of the measured values, or extracting the measured values that produce the time changes and the measured values sampled before; a storage unit for binding the extracted measured values of the plurality of parameters with the information about the sampling time of the measured values and storing them in a storage unit; a drawing unit for drawing the measured values of the plurality of parameters into a graph based on the information about the sampling time of the measured values stored in the storage unit; and a display unit for displaying the drawn graph.
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