TWI875217B - Circuit board, functional module and electronic device - Google Patents

Abstract

A circuit board, a functional module and an electronic device are provided. The electronic device includes a circuit board, a functional part, a supporting assembly, a first thermal pad and a screw. The circuit board includes a substrate and a stud. The functional part is arranged on the substrate. The support assembly carrying the functional part includes a base plate and a plurality of elastic elements, wherein the elastic elements are arranged between the base plate and the substrate. The first thermal pad is arranged between the base plate and the functional part. The screw passing through the first thermal pad and the base plate screws into the studs.

Description

Circuit boards, functional modules and electronic devices

The present invention relates to a circuit board, a functional component module and an electronic device, and in particular to a circuit board, a functional component module and an electronic device with universality.

In the prior art, a base plate is usually used in a heat sink of a solid state disk (SSD) module to enhance the heat conduction effect, and a thermal conductive adhesive is usually used to increase the physical contact area between the base plate and the SSD module to achieve a good heat conduction effect.

However, not only is the overall size limited by the product (such as solid state drive module) selection, but when the solid state drive module product is designed to be double-sided (front + back) mounted, the thickness of the thermal conductive adhesive and/or the base plate must be adjusted to achieve good contact and thus achieve the expected heat conduction effect. At the same time, when the solid state drive module product design is changed to a single-sided (front) mounted product, the thickness of the thermal conductive adhesive or the base plate must be adjusted.

Therefore, the above-mentioned prior art has the following problems:

1. The design of the heat dissipation base plate is easily restricted by the design of the solid-state drive module product. Different solid-state drive modules must use base plates and thermal conductive adhesives of different thicknesses.

2. When replacing the SSD module, you must confirm whether the thickness of the base plate and thermal conductive adhesive used has a good contact area. If the size does not match and the contact area is poor, you need to replace the base plate and thermal conductive adhesive with a suitable one, which not only increases the risk of disassembly and replacement of parts, but also easily causes the risk of damage caused by disassembly screws during the disassembly process.

The present invention provides a circuit board which can adapt to the thickness and weight of different functional component modules arranged thereon.

The present invention provides a functional component module capable of adjusting the distance between the functional component module and a circuit board.

The present invention provides a universal electronic device.

The circuit board of the present invention comprises a substrate, a supporting assembly and a locking piece. A stud is arranged on the substrate; the supporting assembly is suitable for carrying a functional component, wherein the supporting assembly comprises a bottom plate and a plurality of elastic elements, and the elastic elements are arranged between the bottom plate and the substrate; the locking piece passes through the bottom plate and locks into the stud, wherein the elastic elements provide supporting force to the bottom plate.

In one embodiment, the elastic element is a gasket or foam.

In one embodiment, each elastic element includes a nut and a spring, wherein the nut is fixed to the bottom plate, and one end of the spring is fixed to the nut, and the spring is located between the bottom plate and the base plate.

The functional component module of the present invention comprises a functional component, a supporting assembly and a heat sink. The supporting assembly carries the functional component and comprises a bottom plate and a plurality of elastic elements, wherein the elastic elements are arranged on a side of the bottom plate relatively far from the functional component; the heat sink is arranged between the bottom plate and the functional component.

In one embodiment, the elastic element is a gasket or foam.

In one embodiment, each elastic element includes a nut and a spring, wherein the nut is fixed to the base plate, and one end of the spring is fixed to the nut, and the spring is located on a side of the base plate that is relatively far away from the functional component.

In one embodiment, a plurality of electronic components are disposed on a single side of the functional component or a plurality of electronic components are disposed on two opposite sides of the functional component.

An electronic device of the present invention includes a circuit board, a functional component, a supporting assembly, a first heat sink and a locking piece. The circuit board includes a substrate and a stud; the functional component is arranged on the substrate; the supporting assembly carries the functional component and includes a bottom plate and a plurality of elastic elements, wherein the elastic elements are arranged between the bottom plate and the substrate; the first heat sink is arranged between the bottom plate and the functional component; the locking piece passes through the first heat sink and the bottom plate and is locked into the stud.

In one embodiment, the elastic element is a gasket or foam.

In one embodiment, each elastic element includes a nut and a spring, wherein the nut is fixed to the bottom plate, and one end of the spring is fixed to the nut, and the spring is located between the bottom plate and the base plate.

In one embodiment, a plurality of electronic components are disposed on a single side of the functional component or a plurality of electronic components are disposed on two opposite sides of the functional component.

In one embodiment, the electronic device further includes a heat dissipation element disposed on a side of the functional component that is relatively far from the bottom plate.

In one embodiment, the electronic device further includes a second heat sink disposed between the functional component and the heat dissipation element.

Based on the above, by setting up the supporting assembly, the circuit board can adapt to the functional parts with different thicknesses and weights arranged thereon, and the distance between the functional parts and the circuit board can be adjusted steplessly, thereby making the electronic device convenient for functional parts with different thicknesses and weights.

Fig. 1A is an exploded schematic diagram of an electronic device, and Fig. 1B is a partial enlarged diagram of Fig. 1A. Fig. 2A is an exploded schematic diagram of the support assembly in Fig. 1, Fig. 2B is a schematic diagram of Fig. 2A from another viewing angle, and Fig. 2C is an assembled schematic diagram of the support assembly in Fig. 2B.

1A and 1B , the electronic device 100 of this embodiment may be a computer or a server, and the electronic device 100 at least includes a circuit board 110, a functional component 120, a support assembly 130, a first heat sink 140, and a locking member 150. The circuit board 110 includes a substrate 112 and a stud 114, wherein the stud 114 is disposed on the substrate 112. The functional component 120 and the supporting assembly 130 are both disposed on the substrate 112, wherein the supporting assembly 130 includes a bottom plate 132 and a plurality of elastic elements 134, wherein the bottom plate 132 is used to support the functional component 120, and the elastic elements 134 are disposed between the bottom plate 132 and the substrate 112, wherein the elastic elements 134 are used to support the bottom plate 132 and the functional component 120 supported on the bottom plate 132. The first heat sink 140 is disposed between the bottom plate 132 and the functional component 120, and is used to increase the contact area between the bottom plate 132 and the functional component 120, thereby enhancing the heat conduction effect. The locking member 150 passes through the first heat sink 140 and the bottom plate 132 and is locked into the stud 114 disposed on the base plate 112 to preliminarily fix the bottom plate 132 relative to the base plate 112 .

Please refer to Figures 2A, 2B and 2C at the same time. In this embodiment, each elastic element 134 includes a nut 135 and a spring 136, wherein the nut 135 is riveted into the bottom plate 132 from the bottom plate 132 toward the top surface 132a of the functional component 120, and the end of the nut 135 protrudes from the bottom surface 132b of the bottom plate 132, and one end of the spring 136 is fixed to the end of the nut 135 protruding from the bottom surface 132b of the bottom plate 132, so that the spring 136 is located between the bottom plate 132 and the substrate 112, and the other end of the spring 136 is suitable for abutting the substrate 112, as shown in Figure 1B.

Please continue to refer to FIG. 1A and FIG. 1B. As mentioned above, the functional component 120 of the present embodiment is a solid state hard disk module, but it is not limited thereto. Specifically, the functional component 120 can be one of two specifications of solid state hard disk modules, one of which is a solid state hard disk module with multiple electronic components on a single side (i.e., single-sided component); and the other is a solid state hard disk module with multiple electronic components on two opposite sides (i.e., double-sided component). The user selects a solid state hard disk module of appropriate specifications to install on the support assembly 130 according to actual needs.

In addition, the electronic device 100 further includes a heat dissipation element 160 disposed on a side of the functional component 120 that is relatively far from the bottom plate 132. The heat dissipation element 160 may be a combination of a heat dissipation plate and a heat dissipation fin. In other embodiments, the heat dissipation element 160 may also be a heat dissipation plate, a heat dissipation fin or a fan, or a combination of any two or more of the heat dissipation plate, the heat dissipation fin and the fan. The actual heat dissipation element 160 is selected and disposed according to the requirements.

In addition, the electronic device 100 further includes a second heat sink 170 disposed between the functional component 120 and the heat dissipation element 160. The use of the second heat sink 170 can enhance the heat dissipation effect between the functional component 120 and the heat dissipation element 160.

The first heat sink 140 and the second heat sink 170 can be thermal pads or heat sinks, which can be selected according to the needs.

FIG3 is a schematic diagram of the assembly of the electronic device of FIG1A. Please refer to FIG1A, FIG1B and FIG3 simultaneously. After the functional component 120, the support component 130, the first heat sink 140, etc. are assembled on the circuit board 110 to form the electronic device 100, the support component 130 can play a role to achieve the following advantages.

Specifically, the first heat sink 140 disposed between the base plate 132 and the functional component 120 can increase the contact area between the base plate 132 and the functional component 120, and the second heat sink 170 disposed between the functional component 120 and the heat dissipation element 160 can increase the contact area between the functional component 120 and the heat dissipation element 160, thereby enhancing the overall thermal conduction effect of the electronic device 100 and effectively improving the heat dissipation efficiency.

In addition, after the heat dissipation element 160 is assembled on the top of the functional component 120 , the weight of the heat dissipation element 160 and the functional component 120 together exert a downward force on the supporting assembly 130 .

In the prior art, when a heat sink is assembled on top of a functional component, the weight of the heat sink causes the circuit board to bend, which in turn causes solder cracks on the electronic components on the circuit board, and the electronic components on the circuit board cannot continue to operate effectively.

In contrast, in this embodiment, although the functional component 120 and the heat sink 160 assembled above the functional component 120 exert downward force, the stud 114 provides an upward supporting force for the bottom plate 132, and the spring 136 in the elastic component 134 also provides an upward elastic restoring force to push the bottom plate 132, thereby offsetting the downward pressure exerted on the upper part of the circuit board 110 by the weight of the functional component 120 and the heat sink 160. In this way, the circuit board 110 can be effectively prevented from bending and solder cracking.

Furthermore, in this embodiment, the functional component 120 is designed to be assembled on the bottom plate 132 in a quick-release manner, so the functional component 120 can be simply and quickly replaced according to needs, which can reduce the risk of damage caused by disassembling screws during the disassembly process compared to the known technology.

Furthermore, the provision of the elastic element 134 allows the distance between the base plate 132 and the circuit board 110 to be adjusted according to the thickness and weight of the functional component 120 carried thereon, so that the electronic device 100 of this embodiment can be used for functional components 120 of different specifications.

Specifically, the functional component 120 is selected from a solid state drive module with a single-sided component specification and a solid state drive module with a double-sided component specification, wherein the thickness of the solid state drive module with a double-sided component specification is thicker than that of the solid state drive module with a single-sided component specification; and the thickness difference between the solid state drive module with a double-sided component specification and the solid state drive module with a single-sided component specification can be eliminated by the compression degree of the spring 136.

Specifically, compared to the double-sided SSD module being assembled on the bottom plate 132 and the spring 136 being in a relatively compressed state, the single-sided SSD module being assembled on the bottom plate 132 is in a relatively relaxed state, wherein the deformation distance of the spring 136 from the relaxed state to the compressed state is approximately 1 mm. Incidentally, when the bottom plate 132 is fixed to the stud 114 using the locking device 150, the bottom plate 132 will retain a movable distance relative to the base plate 112 along the assembly direction to facilitate the deformation and pushing of the spring 136.

FIG. 4A and FIG. 4B are schematic diagrams of different implementations of the elastic element. As shown in FIG. 4A , the elastic element 134 ′ may also be a gasket; as shown in FIG. 4B , the elastic element 134 ″ may also be a foam. The spring 136 has the advantage of better elastic restoring force than the gasket and the foam, while the gasket and the foam have the advantage of being more flexible in setting position than the spring 136, and the setting position of the gasket and the foam can be selected by the user.

Specifically, when the elastic element 134 is a combination of a nut 135 and a spring 136, the support assembly 130 needs to be assembled on the circuit board 110 in advance to facilitate the subsequent assembly of the functional component 120 on the bottom plate 132 of the support assembly 130. Alternatively, the support assembly 130 can also be assembled with the functional component 120 in advance to form a functional component 120 module to facilitate the subsequent assembly of the functional component 120 module on the circuit board 110.

When the elastic element 134 is a gasket and foam, the gasket and foam do not need to be attached to the functional part 120 or the circuit board 110 in advance, and the end user can decide the location of the gasket and foam according to usage habits or needs. Therefore, compared with the case of using a combination of a nut 135 and a spring 136 as the elastic element 134, it is more convenient to use.

In summary, in the circuit board, functional component module and electronic device 100 of the present invention, the supporting component not only provides a good supporting effect, but also enables the circuit board to adapt to the functional components with different thicknesses and weights arranged thereon, so as to infinitely adjust the distance between the functional components and the circuit board, thereby making the electronic device convenient for use with functional components with different thicknesses and weights.

In addition, the use of the heat sink can increase the contact area between the base plate and the functional parts and/or the functional parts and the heat dissipation element, effectively improving the overall heat conduction efficiency of the electronic device.

In addition, the functional parts and the base plate are assembled or disassembled using a quick release method, which can achieve the purpose of simplifying and quickly replacing the functional parts and reduce the risk of damage caused by disassembling screws during the disassembly process.

100: Electronic devices

110: Circuit board

112: Substrate

114: Stud

120: Functional parts

130: Support assembly

132: Bottom plate

132a: Top

132b: Bottom

134, 134’, 134”: elastic element

135: Nut

136: Spring

140: First heat sink

150: Lock Firmware

160: Heat dissipation element

170: Second heat sink

FIG. 1A is a schematic diagram of an electronic device in a disassembled form. FIG. 1B is a partially enlarged view of FIG. 1A. FIG. 2A is a schematic diagram of a disassembled form of the support assembly in FIG. 1. FIG. 2B is a schematic diagram of another viewing angle of FIG. 2A. FIG. 2C is a schematic diagram of an assembled form of the support assembly of FIG. 2B. FIG. 3 is a schematic diagram of an assembled form of the electronic device of FIG. 1A. FIG. 4A and FIG. 4B are schematic diagrams of different implementations of the elastic element.

100: Electronic devices

110: Circuit board

112: Substrate

114: Stud

120: Functional parts

130: Support assembly

132: Base plate

134: Elastic element

135: Nut

136: Spring

140: First heat sink

150: Lock firmware

160: Heat dissipation element

170: Second heat sink

Claims (13)

A circuit board includes: a substrate on which a stud is disposed; a support assembly suitable for carrying a functional component, including a bottom plate and a plurality of elastic elements, wherein the elastic elements are disposed between the bottom plate and the substrate; and a locking member correspondingly passing through the bottom plate and locking into the stud, wherein the elastic elements are located between the stud and the edge of the bottom plate, and the elastic elements provide support force to the bottom plate. A circuit board as described in claim 1, wherein the elastic elements are gaskets or foams. A circuit board as described in claim 1, wherein each of the elastic elements includes a nut and a spring, wherein the nut is fixed to the base plate, and one end of the spring is fixed to the nut, and the spring is located between the base plate and the substrate. A functional component module is suitable for assembly on a circuit board, wherein the circuit board includes a stud, and the functional component module includes: a functional component; a support assembly, which supports the functional component, including a base plate and a plurality of elastic elements, wherein the elastic elements are arranged on a side of the base plate relatively far from the functional component; and a heat sink, which is arranged between the base plate and the functional component, wherein the elastic elements are located between the stud and the edge of the base plate. A functional component module as described in claim 4, wherein the elastic elements are gaskets or foams. As described in claim 4, the functional component module, wherein each of the elastic elements includes a nut and a spring, wherein the nut is fixed to the base plate, and one end of the spring is fixed to the nut, and the spring is located on a side of the base plate relatively far from the functional component. A functional component module as described in claim 4, wherein a single side of the functional component is provided with a plurality of electronic components or two opposite sides of the functional component are provided with a plurality of electronic components respectively. An electronic device includes: a circuit board including a substrate and a stud; a functional component disposed on the substrate; a support assembly carrying the functional component, including a bottom plate and a plurality of elastic elements, wherein the elastic elements are disposed between the bottom plate and the substrate and between the stud and the edge of the bottom plate; a first heat sink disposed between the bottom plate and the functional component; and a locking member correspondingly passing through the first heat sink and the bottom plate and locking into the stud. An electronic device as described in claim 8, wherein the elastic elements are gaskets or foams. An electronic device as described in claim 8, wherein each of the elastic elements includes a nut and a spring, wherein the nut is fixed to the base plate, and one end of the spring is fixed to the nut, and the spring is located between the base plate and the substrate. An electronic device as described in claim 8, wherein a single side of the functional part is provided with a plurality of electronic components or two opposite sides of the functional part are provided with a plurality of electronic components respectively. The electronic device as described in claim 8 further includes a heat dissipation element disposed on a side of the functional component that is relatively far from the base plate. The electronic device as described in claim 12 further includes a second heat sink disposed between the functional component and the heat dissipation element.