TWI873069B - Fan Type Suction Cup - Google Patents

Abstract

The present invention is a fan-type suction cup, which includes a connecting portion, the connecting portion having a top surface and a bottom surface; an adsorption portion, the connecting portion having an adsorption surface and a peripheral surface, the adsorption surface is formed with a central hole and a plurality of flow channels, the central hole penetrates the adsorption surface, each flow channel is connected to the central hole, and the adsorption portion is connected to the top surface of the connecting portion; at least one blade is arranged on the peripheral surface of the adsorption portion, and a blade surface of the blade and the adsorption surface are formed between the blade surface and the adsorption surface. An angle; when the present invention is mounted on a rotating shaft, the adsorption portion adsorbs a wafer to rotate, and sprays the cleaning liquid to perform the cleaning operation, the synchronous rotation of the blades can drive the surrounding airflow to change the flow field around the wafer, and the cleaning liquid that may flow into the back of the wafer or the acid mist emitted by the cleaning liquid is blown around and suppressed outside the wafer, which has the effect of reducing the acid gas residue on the wafer and preventing the acid gas from entering the back of the wafer.

Description

Fan Type Suction Cup

The present invention relates to a wafer adsorption device, in particular to a fan-type suction cup.

In the prior art semiconductor manufacturing process, one of the steps is to clean the wafer. During cleaning, the wafer must first be positioned on a suction device, and the suction force is used to adsorb the wafer thereon. The suction device is rotated to drive the wafer to rotate, and a cleaning liquid is sprayed on the surface of the wafer to perform the cleaning operation during the rotation of the wafer.

However, during the cleaning process, part of the cleaning solution may flow to the back of the wafer when the wafer rotates, or the acidic gas emitted by the cleaning solution may remain on the back of the wafer, which will cause contamination to the wafer. Therefore, the above problems and shortcomings need to be improved.

In view of the shortcomings of the prior art, the present invention provides a fan-type suction cup, which, by providing blades at the suction portion, can drive the surrounding airflow to change the flow field when the present invention rotates, so that the airflow is pushed outward.

In order to achieve the above-mentioned invention purpose, the technical means adopted by the present invention is to design a fan-type suction cup, which includes: A connecting part, which has a top surface and a bottom surface; An adsorption part, which has an adsorption surface and a peripheral surface, the periphery of the adsorption surface is connected to the peripheral surface, the adsorption surface is formed with a central hole and a plurality of flow channels, the central hole penetrates the adsorption surface, each of the flow channels is connected to the central hole, and the adsorption part is connected to the top surface of the connecting part; At least one blade, which is arranged on the peripheral surface of the adsorption part, the blade protrudes from the adsorption part and forms a blade surface, an angle is formed between the blade surface and the adsorption surface, and the blade can drive the surrounding airflow to change the surrounding flow field after rotation.

Furthermore, in the fan-type suction cup, the blade is a quadrilateral blade, one side of which is fixed to the peripheral surface, and the other adjacent side is connected to the top surface of the connecting portion.

Furthermore, in the fan-type suction cup, the top surface of the connecting portion outside the circumferential surface is a cone surface.

Furthermore, the fan-shaped suction cup has an angle of 90 degrees.

The advantage of the present invention is that it is installed on a rotating shaft and a wafer is adsorbed by the adsorption part. When the rotating shaft rotates and the wafer is cleaned with a cleaning liquid, the synchronous rotation of the blades can change the flow field around the wafer. Specifically, it forms an airflow that pushes from the inside to the outside, and the cleaning liquid that may flow into the back of the wafer or the acid mist emitted by the cleaning liquid is blown to the surroundings and pressed outside the wafer, which has the effect of reducing the acid gas residue on the wafer and preventing the acid gas from entering the back of the wafer; when the rotating shaft stops rotating, the inclined top surface of the connecting part helps to guide the cleaning liquid remaining thereon outward and downward to avoid the cleaning liquid remaining on the top surface.

The following is a combination of drawings and preferred embodiments of the present invention to further illustrate the technical means adopted by the present invention to achieve the intended purpose of the invention.

Please refer to FIG. 1 , the fan-type suction cup of the present invention comprises a connecting portion 10 , a suction portion 20 and at least one blade 30 .

Please refer to Figures 1 to 3. The connecting portion 10 has a top surface 11 and a bottom surface 12. The top surface 11 and the bottom surface 12 are two side surfaces that are opposite to each other. The connecting portion 10 of this embodiment is a cylinder, and its bottom surface 12 has a connecting structure for connecting a rotating device (not shown in the figure). This is a connecting structure of the prior art and will not be described in detail, but it is not limited to this. The form of the connecting portion 10 can be changed according to user needs.

The adsorption portion 20 is disposed on the top surface 11 of the connecting portion 10. The adsorption portion 20 has an adsorption surface 21 and a circumferential surface 22. The periphery of the adsorption surface 21 is connected to the circumferential surface 22. The adsorption surface 21 is formed with a center hole 211 and a plurality of flow channels 212. The center hole 211 penetrates the adsorption surface 21 and the top surface 11 of the connecting portion 10. Each flow channel 212 includes a concentric circle and a radial flow channel 212 and is connected to the center hole 211, but is not limited to this. In this embodiment, the top surface 11 of the connecting portion 10 outside the circumferential surface 22 is viewed from the side as an inclined surface sloping downward toward the outside, and is a cone as a whole, but is not limited to this and can also be a plane.

The blade 30 is disposed on the circumferential surface 22 of the adsorption portion 20. Specifically, the blade 30 is a quadrilateral sheet, one side of which is fixed to the circumferential surface 22 of the adsorption portion 20, and the other adjacent side is fixed to the top surface 11 of the connecting portion 10. A blade surface 31 is formed between the four side surfaces. Please refer to FIG. 3. The blade 30 of this embodiment has a certain thickness, but it is not limited to this. It can also be a thin sheet structure. There is an angle θ between the blade surface 31 of the blade 30 and the adsorption surface 21. The angle θ is 90 degrees, so the blade surface 31 and the adsorption surface 21 are perpendicular to each other, but it is not limited to this. It is only necessary to form an angle θ between the blade surface 31 of the blade 30 and the adsorption surface 21, and the form and number of the blades 30 can be changed according to user needs.

When the present invention is used, please refer to FIG. 1 to FIG. 4. For example, the present invention is installed on a rotating shaft 40. The connecting portion 10 is fixed to the top of the rotating shaft 40. The center hole 211 at the bottom of the adsorption portion 20 is connected to an exhaust device (not shown in the figure). A wafer 50 is placed on the adsorption surface 21 of the adsorption portion 20 and an exhaust action is performed to adsorb and fix the wafer 50 on the adsorption surface 21. When the rotating shaft 40 rotates, the wafer 50 is fixed on the adsorption surface 21. When the wafer 50 is cleaned with the cleaning liquid, the synchronous rotation of the blades 30 can drive the surrounding airflow to change the flow field around the wafer 50. Specifically, an airflow is formed to push from the inside to the outside, and the cleaning liquid that may flow into the back of the wafer 50 or the acid mist emitted by the cleaning liquid is blown around and suppressed outside the wafer 50, which has the effect of reducing the acid gas residue on the wafer 50 and preventing the acid gas from entering the back of the wafer 50.

In the above process, when the rotating shaft 40 stops rotating, the inclined top surface 11 of the connecting portion 10 helps to guide the cleaning liquid remaining thereon outward and downward, thereby preventing the cleaning liquid from remaining on the top surface 11.

The above is only the best embodiment of the present invention and does not constitute any form of limitation on the present invention. Although the present invention has been disclosed as the best embodiment as above, it is not used to limit the present invention. Any person with ordinary knowledge in the relevant technical field can make some changes or modifications to the technical contents disclosed above as equivalent embodiments within the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

10: Connecting part 11: Top surface 12: Bottom surface 20: Adsorption part 21: Adsorption surface 211: Center hole 212: Flow channel 22: Circumferential surface 30: Blade 31: Blade surface θ: Angle 40: Rotation axis 50: Wafer

Figure 1 is a three-dimensional external view of the present invention. Figure 2 is a side view of the present invention. Figure 3 is another side view of the present invention. Figure 4 is a schematic diagram of the use of the present invention.

10: Connection part

11: Top

12: Bottom

20: Adsorption part

21: Adsorption surface

211: Center hole

212: Runner

22: Circumferential surface

30: Leaves

31: Leaf surface

Claims (4)

A fan-type suction cup comprises: A connecting portion having a top surface and a bottom surface; An adsorption portion having an adsorption surface and a peripheral surface, the periphery of the adsorption surface is connected to the peripheral surface, the adsorption surface is formed with a central hole and a plurality of flow channels, the central hole penetrates the adsorption surface, each of the flow channels is connected to the central hole, and the adsorption portion is connected to the top surface of the connecting portion; At least one blade is arranged on the peripheral surface of the adsorption portion, the blade protrudes from the adsorption portion and forms a blade surface, an angle is formed between the blade surface and the adsorption surface, and the blade can drive the surrounding airflow to change the surrounding flow field after rotating. As described in claim 1, the fan-type suction cup, wherein the blade is a quadrilateral sheet, one side of which is fixed to the circumferential surface, and the other adjacent side is connected to the top surface of the connecting portion. The fan-type suction cup as described in claim 1 or 2, wherein the top surface of the connecting portion located outside the circumferential surface is a cone surface. A fan-type suction cup as described in claim 3, wherein the angle is 90 degrees.

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