TWI872541B - Coating equipment - Google Patents

Abstract

The present invention provides a technology for reducing the effect of shielding the electric field caused by the beam member of the paddle, or a technology for removing the air bubbles attached to the holes of the ion resistance body. The coating device 1000 is provided with a paddle 70, which is arranged between the anode 11 and the substrate Wf, and is constructed in a manner of stirring the coating liquid Ps by reciprocating in a first direction and a second direction in a direction parallel to the substrate. The paddle has a plurality of beam components 71 extending in a direction perpendicular to the reciprocating direction of the paddle. The reciprocating movement of the paddle in the first direction and the second direction includes the paddle reciprocating in a first reciprocating pattern. In the first reciprocating pattern, the paddle moves in the second direction with a stroke different from that when moving in the first direction, so that the positions of the plurality of beam components when the paddle changes the moving direction from the second direction to the first direction are different; and the positions of the plurality of beam components when the paddle changes the moving direction from the first direction to the second direction are different.

Description

Coating equipment

The present invention relates to a coating device.

In the past, a coating device that can perform coating treatment on a substrate is known (for example, refer to Patent Document 1). This coating device comprises: a coating tank that stores a coating liquid, an anode is arranged inside the coating liquid, and a substrate is arranged inside the coating liquid in a manner opposite to the anode; and a stirring paddle that is arranged between the anode and the substrate and stirs the coating liquid by moving back and forth in a first direction and a second direction opposite to the first direction in a direction parallel to the substrate.

In addition, in the past, a paddle having a plurality of beam members extending in a direction perpendicular to the reciprocating direction of the paddle has been known (for example, refer to Patent Document 1). [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2021-130848

(Invent the problem you want to solve)

In the above-mentioned conventional plating tank, the stroke of the impeller is fixed when the impeller moves back and forth. At this time, when the impeller changes the moving direction from the second direction to the first direction, and when the impeller changes the moving direction from the first direction to the second direction, the beam member of the impeller stops at the same position. At this time, the average retention time of the beam member of the impeller during the plating process cannot be uniform, and the shielding degree of the electric field between the anode and the substrate may be different depending on the position of the impeller. As a result, the plating quality of the substrate may be deteriorated.

Alternatively, in conventional plating equipment, bubbles contained in the plating liquid in the plating tank may be attached in large quantities to the holes of the ion resistor disposed between the anode and the substrate. When the substrate is subjected to plating treatment in this state, the bubbles may cause the plating quality of the substrate to deteriorate.

The present invention is made in view of the above situation, and one of the purposes is to provide a technology that can reduce the effect of shielding the electric field caused by the beam member of the paddle, or a technology that can remove the bubbles attached to the holes of the ion resistance body. (Means for solving the problem) (Situation 1)

In order to achieve the above-mentioned purpose, a coating device of one aspect of the present invention comprises: a coating tank, which stores a coating liquid, and an anode is arranged inside the coating liquid, and a substrate is arranged inside the coating liquid in a manner opposite to the anode; and a stirring paddle, which is arranged between the anode and the substrate, and stirs the coating liquid by moving back and forth in a first direction parallel to the substrate and in a second direction opposite to the first direction; the stirring paddle has a plurality of beam components, which are arranged between the stirring paddle and the substrate. The paddle extends in a direction perpendicular to the reciprocating direction, the reciprocating movement of the paddle in the first direction and the second direction includes the paddle reciprocating in a first reciprocating pattern, in which the paddle moves in the second direction with a stroke different from that in the first direction, so that the positions of the plurality of beam components are changed when the paddle changes its moving direction from the second direction to the first direction; and the positions of the plurality of beam components are different when the paddle changes its moving direction from the first direction to the second direction.

When this mode is adopted, when the propeller changes its moving direction from the second direction to the first direction, and when the propeller changes its moving direction from the first direction to the second direction, the propeller beam member can be prevented from being located at the same position. In this way, the effect of the propeller beam member causing the shielding electric field can be reduced. As a result, the coating quality of the substrate can be improved. (Mode 2)

In the above-mentioned form 1, the above-mentioned paddle moves back and forth in the above-mentioned first direction and the above-mentioned second direction, including the above-mentioned paddle moving back and forth multiple times in the above-mentioned first reciprocating form and then moving back and forth in the second reciprocating form, in the above-mentioned first reciprocating form, the stroke of the above-mentioned paddle when moving in the above-mentioned second direction is shorter than the stroke of the above-mentioned paddle when moving in the above-mentioned first direction, and in the above-mentioned second reciprocating form, the above-mentioned paddle moves in the above-mentioned second direction with a stroke longer than the stroke when moving in the above-mentioned first direction, so that the positions of the above-mentioned multiple beam components when the above-mentioned paddle changes the moving direction from the above-mentioned second direction to the above-mentioned first direction are different; and the positions of the above-mentioned multiple beam components when the moving direction is changed from the above-mentioned first direction to the above-mentioned second direction are different. (Form 3)

In the above-mentioned form 1, the above-mentioned paddle moves back and forth in the above-mentioned first direction and the above-mentioned second direction, including the above-mentioned paddle moving back and forth multiple times in the above-mentioned first reciprocating form and then moving back and forth in the second reciprocating form, in the above-mentioned first reciprocating form, the stroke of the above-mentioned paddle when moving in the above-mentioned second direction is longer than the stroke of the above-mentioned paddle when moving in the above-mentioned first direction, and in the above-mentioned second reciprocating form, the above-mentioned paddle moves in the above-mentioned second direction with a stroke shorter than the stroke when moving in the above-mentioned first direction, so that the positions of the above-mentioned multiple beam components when the above-mentioned paddle changes the moving direction from the above-mentioned second direction to the above-mentioned first direction are different; and the positions of the above-mentioned multiple beam components when the moving direction is changed from the above-mentioned first direction to the above-mentioned second direction are different. (Form 4)

In any of the above-mentioned forms 1 to 3, the aforementioned substrate may be arranged above the aforementioned anode, and an ion resistor having a plurality of holes may be arranged inside the aforementioned coating liquid, above the aforementioned anode and below the aforementioned paddle. (Form 5)

In the above-mentioned aspect 4, the paddle moves back and forth in the first direction and the second direction, which may also include the paddle moving a plurality of times at different speeds in the first direction, or the paddle moving a plurality of times at different speeds in the second direction.

When this mode is adopted, bubbles attached to the holes of the ion resistor can be effectively removed. This can improve the plating quality of the substrate. (Mode 6)

In the above-mentioned aspect 4, the paddle reciprocates in the first direction and the second direction, which may also include the paddle moving in the first direction at a first speed and then moving in the second direction at a second speed different from the first speed.

When this mode is adopted, bubbles attached to the holes of the ion resistor can be effectively removed. This can improve the coating quality of the substrate. (Mode 7)

In order to achieve the above-mentioned purpose, a coating device of one aspect of the present invention comprises: a coating tank, which stores a coating liquid, and an anode is arranged inside the coating liquid, and a substrate is arranged inside the coating liquid in a manner opposite to the anode; and a stirrer, which is arranged between the anode and the substrate, and moves back and forth in a first direction and a second direction opposite to the first direction in a direction parallel to the substrate. The substrate is arranged above the anode, inside the coating liquid, and an ion resistance body having a plurality of holes is arranged above the anode and below the paddle. The paddle moves back and forth in the first direction and the second direction, including the paddle moving at a first speed in the first direction and then moving at a second speed in the second direction that is different from the first speed.

When this mode is adopted, bubbles attached to the holes of the ion resistor can be effectively removed, thereby improving the plating quality of the substrate.

The following is a description of the embodiments of the present invention with reference to the drawings. In addition, the drawings are schematic diagrams for easy understanding of the features of the components, and the size ratios of the components may not be the same as the actual ones. In addition, in some drawings, the orthogonal coordinates of X-Y-Z are shown for reference. In the orthogonal coordinates, the Z direction is equivalent to the top, and the -Z direction is equivalent to the bottom (the direction of gravity).

FIG. 1 is a perspective view showing the overall structure of the coating device 1000 of the present embodiment. FIG. 2 is a top view showing the overall structure of the coating device 1000 of the present embodiment. As shown in FIG. 1 and FIG. 2 , the coating device 1000 includes: a loading port 100, a transfer robot 110, an aligner 120, a pre-wetting module 200, a pre-preg module 300, a coating module 400, a cleaning module 500, a spin rinse dryer 600, a transfer device 700, and a control module 800.

The loading port 100 is a module for transferring substrates contained in a cassette such as a FOUP (not shown) into the coating device 1000, or transferring substrates from the coating device 1000 to the cassette. In the present embodiment, four loading ports 100 are arranged in a horizontal direction, but the number and arrangement of the loading ports 100 are arbitrary. The transport robot 110 is a robot for transferring substrates, and is configured to transfer substrates between the loading port 100, the aligner 120, the pre-wetting module 200, and the spin dryer 600. When transferring substrates between the transport robot 110 and the transport device 700, the transfer of substrates can be performed through a temporary table (not shown).

The aligner 120 is a module used to align the position of the orientation plane or notch of the substrate in a predetermined direction. In the present embodiment, two aligners 120 are arranged in a horizontal direction, but the number and arrangement of the aligners 120 are arbitrary. The prewet module 200 wets the coated surface of the substrate before the coating process with a treatment liquid such as pure water or degassed water, thereby replacing the air inside the pattern formed on the surface of the substrate with the treatment liquid. The prewet module 200 is configured to perform a prewet treatment by replacing the treatment liquid inside the pattern with the coating liquid during coating, so as to facilitate the supply of the coating liquid to the inside of the pattern. In the present embodiment, two prewet modules 200 are arranged in an up-down direction, but the number and arrangement of the prewet modules 200 are arbitrary.

The prepreg module 300 is configured to perform a prepreg treatment, for example, to remove a high-resistance oxide film existing on the surface of the seed layer of the substrate to be plated before the plating treatment by etching with a treatment solution such as sulfuric acid or hydrochloric acid to clean or activate the surface of the plated substrate. In the present embodiment, two prepreg modules 300 are arranged in a vertical direction, but the number and arrangement of the prepreg modules 300 are arbitrary. The plating module 400 performs a plating treatment on the substrate. In the present embodiment, there are two sets of 12 plating modules 400, in which three are arranged in a vertical direction and four are arranged in a horizontal direction, and a total of 24 plating modules 400 are provided, but the number and arrangement of the plating modules 400 are arbitrary.

The cleaning module 500 is configured to perform a cleaning process on the substrate to remove the coating liquid and the like remaining on the substrate after the coating process. In the present embodiment, two cleaning modules 500 are arranged in an up-down direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin dryer 600 is a module for drying the substrate after the cleaning process by high-speed rotation. In the present embodiment, two spin dryers 600 are arranged in an up-down direction, but the number and arrangement of the spin dryers 600 are arbitrary. The conveying device 700 is a device for conveying substrates between a plurality of modules in the coating device 1000. The control module 800 is composed of a plurality of modules for controlling the coating device 1000, and can be composed of a general computer or a dedicated computer having an input/output interface with an operator, for example.

The following describes an example of a continuous coating process performed by the coating device 1000. First, the substrate contained in the cassette is moved to the loading port 100. Then, the transport robot 110 takes out the substrate from the cassette of the loading port 100 and transports the substrate to the aligner 120. The aligner 120 aligns the position of the orientation plane or notch of the substrate in a predetermined direction. The transport robot 110 receives and delivers the substrate whose direction is aligned by the aligner 120 to the transport device 700.

The prewetting module 200 performs a prewetting process on the substrate. The conveying device 700 conveys the substrate received by the conveying robot 110 to the prewetting module 200. The conveying device 700 conveys the substrate that has been prewetting to the prepreg module 300. The prepreg module 300 performs a prepreg process on the substrate. The conveying device 700 conveys the substrate that has been prewetting to the coating module 400. The coating module 400 performs a coating process on the substrate.

The transport device 700 transports the substrate that has been subjected to the coating process to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transport device 700 transports the substrate that has been subjected to the cleaning process to the spin dryer 600. The spin dryer 600 performs a drying process on the substrate. The transport robot 110 receives the substrate from the spin dryer 600 and transports the substrate that has been subjected to the drying process to the cassette of the loading port 100. Finally, the cassette containing the substrate is unloaded from the loading port 100.

In addition, the structure of the coating device 1000 illustrated in FIG. 1 and FIG. 2 is merely an example, and the structure of the coating device 1000 is not limited to the structure of FIG. 1 and FIG. 2 .

Next, the coating module 400 will be described. In addition, since the plurality of coating modules 400 included in the coating apparatus 1000 of the present embodiment have the same structure, one coating module 400 will be described.

Fig. 3 is a schematic diagram showing the structure of the coating module 400 in the coating apparatus 1000 of the present embodiment. Specifically, Fig. 3 schematically shows the coating module 400 before the substrate Wf is immersed in the coating liquid Ps. Fig. 4 is a schematic diagram showing the state where the substrate Wf is immersed in the coating liquid Ps.

An example of the coating apparatus 1000 illustrated in FIG3 and FIG4 is a cup-type coating apparatus. However, the coating apparatus 1000 is not limited to this configuration. For example, the coating apparatus 1000 of this embodiment may also be a coating apparatus of a type in which the surface direction of the substrate Wf is immersed in the coating liquid Ps in the vertical direction (that is, a vertical coating apparatus).

The coating module 400 of the coating device 1000 illustrated in Figures 3 and 4 includes a coating tank 10, an overflow tank 20, a substrate holder 30, and a stirrer 70. In addition, the coating module 400 may also include a rotating mechanism 40, a tilting mechanism 45, and a lifting mechanism 50 as illustrated in Figure 3.

The coating tank 10 of the present embodiment is formed by a bottomed container having an opening at the top. Specifically, the coating tank 10 has a bottom wall 10a and an outer peripheral wall 10b extending upward from the outer periphery of the bottom wall 10a, and the upper part of the outer peripheral wall 10b is open. In addition, the shape of the outer peripheral wall 10b of the coating tank 10 is not particularly limited, but an example of the outer peripheral wall 10b of the present embodiment is a cylindrical shape. The coating liquid Ps is stored inside the coating tank 10.

The plating solution Ps can be any solution containing ions of the metal element constituting the plating film, and its specific example is not particularly limited. In this embodiment, one example of the plating treatment is copper plating treatment, and one example of the plating solution Ps is copper sulfate solution. In addition, the plating solution Ps may also contain a specified additive.

An anode 11 is arranged inside the plating liquid Ps of the plating tank 10. In addition, at least when the substrate Wf is subjected to plating treatment, the substrate Wf is also arranged inside the plating liquid Ps of the plating tank 10 in a manner opposite to the anode 11. The specific type of the anode 11 is not particularly limited, and it may be an insoluble anode or a soluble anode. An example of the anode 11 of the present embodiment is to use an insoluble anode. The specific type of the insoluble anode is not particularly limited, and platinum or iridium oxide, etc., may be used.

The ion resistor 12 may be disposed inside the plating liquid Ps of the plating tank 10, above the anode 11, and below the substrate Wf (specifically, further below the stirring paddle 70 in this embodiment). Specifically, as shown in FIG. 4 (an enlarged view of the B1 portion), the ion resistor 12 is formed by a porous plate member having a plurality of holes 12a (fine holes). The holes 12a are provided so as to connect the bottom and top of the ion resistor 12.

As shown in FIG. 3 , the region in which a plurality of holes 12a are formed in the ion resistor 12 is referred to as a "hole forming region PA". The hole forming region PA of this embodiment has a circular shape when viewed from above. In addition, the area of the hole forming region PA of this embodiment is the same as the area of the coated surface Wfa of the substrate Wf, or is larger than the area of the coated surface Wfa. However, the present invention is not limited to this configuration, and the area of the hole forming region PA may be smaller than the area of the coated surface Wfa of the substrate Wf.

The ion resistor 12 is provided to make the electric field formed between the anode 11 and the substrate Wf uniform. As in this embodiment, by disposing the ion resistor 12 in the plating tank 10, the thickness of the plating film (plating layer) formed on the substrate Wf can be easily made uniform.

As shown in FIG. 3 and FIG. 4 , a film 16 may be arranged inside the plating tank 10 at a position above the anode 11 and below the ion resistor 12. At this time, the inside of the plating tank 10 is divided into an anode chamber 17a below the film 16 and a cathode chamber 17b above the film 16 by the film 16. The anode 11 is arranged in the anode chamber 17a, and the ion resistor 12 and the substrate Wf are arranged in the cathode chamber 17b. The film 16 is configured to allow ion species including metal ions contained in the plating solution Ps to pass through the film 16 and to inhibit non-ionic plating additives contained in the plating solution Ps from passing through the film 16. For example, an ion exchange membrane can be used as such a film 16.

The coating tank 10 is provided with a supply port for supplying the coating liquid Ps in the coating tank 10. Specifically, the coating tank 10 of this embodiment has an outer peripheral wall 10b provided with a first supply port 13a for supplying the coating liquid Ps in the anode chamber 17a and a second supply port 13b for supplying the coating liquid Ps in the cathode chamber 17b.

In addition, the coating tank 10 is provided with a first discharge port 14a for discharging the coating liquid Ps in the anode chamber 17a to the outside of the coating tank 10. The coating liquid Ps discharged from the first discharge port 14a is pumped by a pump (not shown) and supplied to the anode chamber 17a again from the first supply port 13a.

The overflow tank 20 is formed by a bottomed container disposed outside the coating tank 10. The overflow tank 20 is provided to temporarily store the coating liquid Ps exceeding the upper end of the outer peripheral wall 10b of the coating tank 10 (i.e., the coating liquid Ps overflowing from the coating tank 10). After the coating liquid Ps stored in the overflow tank 20 is discharged from the second discharge port 14b, it is pumped by a pump (not shown) and supplied to the cathode chamber 17b again from the second supply port 13b.

The substrate holder 30 holds the substrate Wf as a cathode in such a manner that the coated surface Wfa of the substrate Wf faces the anode 11. In the present embodiment, the coated surface Wfa of the substrate Wf is specifically provided on the surface (bottom surface) facing the lower side of the substrate Wf.

3 , the substrate holder 30 may also include a ring 31 provided so as to protrude downward from the outer periphery of the plated surface Wfa of the substrate Wf. Specifically, the ring 31 of the present embodiment has a ring shape when viewed from below.

The substrate holder 30 is connected to the rotating mechanism 40. The rotating mechanism 40 is a mechanism for rotating the substrate holder 30. "R1" illustrated in FIG. 3 is an example of the rotation direction of the substrate holder 30. The rotating mechanism 40 can use a known rotating motor. The tilting mechanism 45 is a mechanism for tilting the rotating mechanism 40 and the substrate holder 30. The lifting mechanism 50 is supported by a support shaft 51 extending in the up-down direction. The lifting mechanism 50 is a mechanism for lifting and lowering the substrate holder 30, the rotating mechanism 40, and the tilting mechanism 45 in the up-down direction. The lifting mechanism 50 can use a known lifting mechanism such as a direct-acting actuator.

The control module 800 is equipped with a microcomputer, which includes a processor 801 and a memory device 802 as a non-transitory memory medium. The control module 800 controls the operation of the coating module 400 by operating the processor 801 according to the instructions of the program stored in the memory device 802 .

Fig. 5 is a schematic top view of the stirrer 70. Referring to Fig. 3, Fig. 4 and Fig. 5, the stirrer 70 is disposed between the anode 11 and the substrate Wf inside the coating tank 10. Specifically, the stirrer 70 of this embodiment is disposed between the ion resistor 12 disposed above the anode 11 and the substrate Wf.

5 , the impeller 70 is driven by the driving device 77. The operation of the driving device 77 is controlled by the control module 800. The impeller 70 is driven to stir the coating liquid Ps in the coating tank 10.

The driving device 77 of this embodiment receives the instruction of the control module 800, and makes the impeller 70 move alternately in the direction parallel to the substrate Wf (or the anode 11) "first direction (one example of this embodiment is the X direction)" and the "second direction (one example of this embodiment is the -X direction)" opposite to the first direction. That is, the impeller 70 of this embodiment moves back and forth in the first direction and the second direction.

In addition, the drive device 77 of the present embodiment is configured to change the stroke of the impeller 70 when it moves in the first direction and the stroke when it moves in the second direction. The mechanical structure of the drive device 77 itself is not particularly limited, and a known drive device (for example, Japanese Patent Publication No. 2019-151874, etc.) can be used. When giving a specific example, the drive device 77 of the present embodiment is configured to have a linear motor 77a connected to the impeller 70, and the impeller 70 is moved back and forth by the linear motor 77a (that is, an example of the drive device 77 of the present embodiment is a linear motor type drive device).

In one example, the impeller 70 of the present embodiment moves at a constant speed (mm/sec, or rpm) in the first direction and the second direction. In another example, the impeller 70 of the present embodiment moves at the same speed in the first direction and the second direction. In addition, when the unit of the speed of the impeller 70 when it moves back and forth is expressed in rpm, for example, the speed of the impeller 70 is N (rpm), which means that the impeller 70 moves back and forth once N times in 1 minute.

As shown in FIG. 5 , the paddle 70 of this embodiment has a plurality of beam members 71 extending in a direction (Y-axis direction) perpendicular to the first direction (and the second direction). A gap is provided between adjacent beam members 71. One end of the plurality of beam members 71 is connected to the first connection member 72a, and the other end is connected to the second connection member 72b. When the paddle 70 is driven, the paddle 70, specifically the beam member 71, stirs the coating liquid Ps. That is, the beam member 71 has a function as a "stirring portion".

In addition, the paddle width (the length of the paddle 70 in the X direction in FIG. 5 ) which is the length of the paddle 70 in the reciprocating direction of the present embodiment is smaller than the maximum value of the distance between the outer edge of the plated surface Wfa of the substrate Wf in the first direction and the outer edge in the second direction, “substrate width D1 (symbol example shown in FIG. 3 )”, but the present invention is not limited to this configuration. The paddle width of the paddle 70 may be equal to the substrate width D1 or may be larger than the substrate width D1.

In addition, the paddle width of the paddle 70 of the present embodiment is set to a size that does not collide with the inner surface of the outer peripheral wall 10b of the coating groove 10 when the paddle 70 reciprocates in the first reciprocating pattern and the second reciprocating pattern described later.

When the paddle 70 is viewed from above, the moving area MA of the paddle 70 (i.e., the range of the paddle 70's reciprocating movement) when stirring the coating liquid Ps is preferably configured to cover the entire hole forming area PA of the ion resistor 12. When this configuration is adopted, the coating liquid Ps above the hole forming area PA of the ion resistor 12 can be effectively stirred by the paddle 70.

In addition, the paddle 70 may be disposed inside the coating tank 10 at least when the coating liquid Ps is stirred, and need not be disposed inside the coating tank 10 all the time. For example, when the paddle 70 is stopped from being driven and the coating liquid Ps is not stirred by the paddle 70, the paddle 70 may be disposed outside the coating tank 10.

FIG6 is a flow chart for explaining a series of actions from supplying the coating liquid to starting the coating process in the present embodiment. First, the coating liquid Ps is supplied to the coating tank 10 (step S10). Specifically, the coating liquid Ps is supplied to the coating tank 10 in such a manner that the anode 11 and the ion resistor 12 are immersed in the coating liquid Ps. More specifically, the present embodiment supplies the coating liquid Ps to the coating tank 10 from the first supply port 13a and the second supply port 13b.

Next, the substrate Wf is immersed in the coating liquid Ps (step S20 ). Specifically, in this embodiment, the substrate holder 30 is lowered by the lifting mechanism 50 , so that at least the coating surface Wfa of the substrate Wf is immersed in the coating liquid Ps.

Next, the driving device 77 starts driving the paddle 70, and the paddle 70 starts stirring the coating liquid Ps (step S30).

The plating liquid Ps can be stirred by the stirring paddle 70 to improve the homogeneity of the plating liquid Ps. In addition, the plating liquid Ps can be stirred by the stirring paddle 70 to achieve the following effects.

Specifically, bubbles Bu are generated in the coating liquid Ps of the coating tank 10. For example, when the coating liquid Ps is supplied to the coating tank 10, when air flows into the coating tank 10 together with the coating liquid Ps, the air may become bubbles Bu.

As described above, when bubbles Bu are generated in the coating liquid Ps in the coating tank 10, the bubbles Bu will adhere to the holes 12a of the ion resistor 12 (see FIG. 4 ). If the coating liquid Ps is not stirred by the stirrer 70, a large amount of bubbles Bu may adhere to the holes 12a. In this state, when the substrate Wf is subjected to coating treatment, the coating quality of the substrate Wf may be deteriorated due to the bubbles Bu.

In contrast, when the present embodiment is adopted, the stirring of the coating liquid Ps by the stirring paddle 70 can promote the upward movement of the bubbles Bu attached to the holes 12a of the ion resistor 12. Thus, the bubbles Bu attached to the holes 12a can be sucked upward and removed from the holes 12a. As a result, the degradation of the coating quality of the substrate Wf due to the bubbles Bu attached to the holes 12a can be suppressed.

Referring to FIG. 6 , after step S30, a current is passed between the anode 11 and the substrate Wf by an energizing device (not shown), and the substrate Wf is started to be plated (step S40). Thus, a coating film is formed on the plated surface Wfa of the substrate Wf. Specifically, in this embodiment, even when the substrate Wf is plated in step S40, the plating liquid Ps is still stirred by the stirring paddle 70 in step S30 (that is, the plating liquid Ps is stirred and a plating film is formed on the plated surface Wfa).

In addition, the period when the plating liquid Ps is stirred by the stirring paddle 70 is not limited to the above period. For example, the plating liquid Ps may be stirred by the stirring paddle 70 even in the period between step S10 and step S20 (i.e., after the plating liquid Ps is supplied to the plating tank 10 and before the substrate Wf is immersed in the plating liquid Ps).

Fig. 7 is an example of a flow chart for explaining the detailed operation of the impeller 70. Specifically, Fig. 7 shows the detailed operation of the impeller 70 in step S30 of Fig. 6. The detailed operation of the impeller 70 is explained mainly with reference to Fig. 5 and Fig. 7 as follows.

First, referring to FIG. 5 , the arrangement pitch of each beam member 71 in the first direction is set to “d (mm)”, the width of each beam member 71 in the first direction is set to “W (mm)”, and the number of reciprocating movements of the paddle 70 is set to “n (times)”. In addition, the number of reciprocating movements is counted as “1 time” when the paddle 70 moves in the first direction and then moves in the second direction.

7 , first, the paddle 70 is driven by the driving device 77 receiving an instruction from the control module 800 to reciprocate in a “first reciprocating pattern” described below (step S31 ).

In the first reciprocating pattern, the paddle 70 moves in the second direction with a stroke different from that when it moves in the first direction, so that the position of the beam member 71 when the paddle 70 changes its moving direction from the second direction to the first direction (i.e., the starting position (i.e., the "starting point") when the paddle 70 moves back and forth once); and the position of the beam member 71 when the paddle 70 changes its moving direction from the first direction to the second direction (i.e., the turning position (i.e., the "end point") when the paddle 70 moves back and forth once) are different. In this way, the average retention time of the beam member 71 in the coating process can be made uniform.

One example is that in this embodiment, in the first reciprocating pattern, the stroke of the impeller 70 when moving in the second direction is shorter than the stroke of the impeller 70 when moving in the first direction. Specifically, one example of the first reciprocating pattern is that the impeller 70 of this embodiment moves in the first direction with a stroke of "A (mm)" more than once, and then moves in the second direction with a stroke of "A-W (mm)".

That is, in the first reciprocating pattern, the paddle 70 moves "A (mm)" in the first direction and then moves "A-W (mm)" in the second direction. Thus, in the first reciprocating pattern, the distance the paddle 70 moves in the second direction is shorter by "W (mm)" than the distance the paddle 70 moves in the first direction. As a result, in the first reciprocating pattern, the position where the paddle 70 starts to reciprocate deviates by "W (mm)" in the first direction for each reciprocating movement.

However, step S31 is not limited to the above-mentioned structure. For example, in step S31, the stroke in the second direction may be shorter than "A (mm)" and larger than "A-W (mm)".

Next, the control module 800 determines whether the paddle 70 has moved back and forth multiple times (step S32). This example is the control module 800 of this embodiment determining whether the relationship "W×n＞d" is satisfied. That is, in step S32, the control module 800 determines whether the value of the width (W) of the beam member 71 multiplied by the number of times (n) the paddle 70 moves back and forth is greater than the arrangement pitch (d) of the beam member 71.

Normally, the reciprocating movement of the paddle 70 in the first reciprocating pattern in step S31 is performed until a Yes decision is made in step S32.

When the determination in step S32 is Yes (i.e., the relationship "W×n>d" is satisfied), the driving device 77 receiving the instruction of the control module 800 is driven, and the paddle 70 reciprocates in the "second reciprocating pattern" described below (step S33). That is, the paddle 70 of this embodiment reciprocates a plurality of times in the first reciprocating pattern, and then reciprocates in the second reciprocating pattern.

In the second reciprocating pattern, the paddle 70 moves in the second direction with a longer stroke than when it moves in the first direction, so that the position (starting point) of the beam member 71 when the paddle 70 changes its moving direction from the second direction to the first direction and the position (end point) of the beam member 71 when the paddle 70 changes its moving direction from the first direction to the second direction are different. In this way, the average retention time of the beam member 71 in the coating process is made uniform.

Specifically, an example of the second reciprocating pattern is that the paddle 70 of the present embodiment moves with a stroke of "A-W (mm)" in the first direction more than once, and then moves with a stroke of "A (mm)" in the second direction.

That is, in the second reciprocating pattern, the paddle 70 moves "A-W (mm)" in the first direction and then moves "A (mm)" in the second direction. That is, in the second reciprocating pattern, the distance the paddle 70 moves in the first direction is shorter by "W (mm)" than the distance the paddle 70 moves in the second direction. As a result, in the second reciprocating pattern, the position where the paddle 70 starts to reciprocate deviates by "W (mm)" in the second direction for each reciprocating movement.

However, step S33 is not limited to the above-mentioned structure. For example, in step S33, the stroke in the first direction may be shorter than "A (mm)" and larger than "A-W (mm)".

The time period for completing the reciprocating movement of the paddle 70 in the second reciprocating pattern is not particularly limited, but an example of the control module 800 of the present embodiment is that when the paddle 70 starts to reciprocate in the second reciprocating pattern and the number of reciprocating movements of the paddle 70 reaches "n (times) (this is the same value as n in step S32)", the reciprocating movement of the paddle 70 in the second reciprocating pattern is completed.

When the paddle 70 completes the reciprocating movement in the second reciprocating pattern, the control module 800 may execute the flowchart of FIG. 7 again from step S31 (that is, the flowchart of FIG. 7 may be repeatedly executed). In addition, when the control module 800 receives a drive stop request for forcibly stopping the drive of the paddle 70 at any time in the flowchart of FIG. 7 , the execution of the flowchart of FIG. 7 may be forcibly terminated to stop the drive of the paddle 70.

When the present embodiment described above is adopted, since the reciprocating movement pattern of the impeller 70 includes the first reciprocating pattern, when the impeller 70 changes its movement direction from the first direction to the second direction, and when the impeller 70 changes its movement direction from the second direction to the first direction (that is, when the speed of the impeller 70 during the reciprocating movement becomes zero), the beam member 71 of the impeller 70 can be prevented from being located at the same position. In this way, the influence of the beam member 71 of the impeller 70 causing the shielding electric field can be reduced. As a result, the coating quality of the substrate Wf can be improved. Specifically, for example, the uniformity of the film thickness of the coating film formed on the substrate Wf can be improved.

Furthermore, when this embodiment is adopted, since the reciprocating motion pattern of the paddle 70 further includes the second reciprocating pattern, the influence of the shielding electric field caused by the beam member 71 of the paddle 70 can be further reduced. As a result, the coating quality of the substrate Wf can be further improved.

In addition, the configuration of this embodiment is not limited to the above configuration. For example, in the second reciprocating mode, the stroke of the paddle 70 during reciprocating movement may be constant. Specifically, in this case, in the second reciprocating mode, the paddle 70 may also move in the first direction and the second direction with a stroke of A (mm). Even in this case, if the reciprocating movement of the paddle 70 includes the above first reciprocating mode, the effect of shielding the electric field caused by the beam member 71 of the paddle 70 can still be reduced.

In addition, in the first reciprocating pattern, the stroke of the paddle 70 when it moves in the second direction may be longer than that when it moves in the first direction. For example, at this time, in the first reciprocating pattern, the paddle 70 may also move in the first direction with a stroke of "A-W (mm)", and then move in the second direction with a stroke of "A (mm)". Then, at this time, in the second reciprocating pattern, the stroke of the paddle 70 when it moves in the second direction should be shorter than that when it moves in the first direction. For example, at this time, in the second reciprocating pattern, the paddle 70 only needs to move in the first direction with a stroke of "A (mm)", and then move in the second direction with a stroke of "A-W (mm)". (Variation 1)

Fig. 8 (A) and Fig. 8 (B) are schematic diagrams for explaining the coating device 1000 of the variation 1 of the embodiment. Specifically, Fig. 8 (A) and Fig. 8 (B) are schematic enlarged cross-sectional views showing the peripheral structure of the ion resistance body 12 of the coating device 1000 of the variation. In addition, in Fig. 8 (A) and Fig. 8 (B), the paddle 70 is illustrated with one beam member 71 thereof.

The present variation differs from the aforementioned implementation in that in at least one of the first reciprocating pattern and the second reciprocating pattern, when the paddle 70 moves multiple times in the first direction, or when the paddle 70 moves multiple times in the second direction, the paddle 70 moves at different speeds.

The specific example is that in the present variation, in both the first reciprocating pattern and the second reciprocating pattern, when the paddle 70 moves multiple times in the first direction, or when the paddle 70 moves multiple times in the second direction, the paddle 70 moves at different speeds.

This example is a case where the paddle 70 moves at different speeds when it moves multiple times in the "first direction" as shown in FIG8 (A) and FIG8 (B). Specifically, as shown in FIG8 (A), the first reciprocating pattern and the second reciprocating pattern of this variation include: the paddle 70 moves in the first direction at a "first speed V1 (mm/sec, or rpm); and as shown in FIG8 (B), the paddle 70 moves in the first direction at a "second speed V2 (mm/sec, or rpm)" that is faster than the first speed V1.

Specifically, in the present variation, the driving device 77 receiving the instruction of the control module 800 moves the paddle 70 in the first direction multiple times in the first reciprocating mode and the second reciprocating mode. Among the multiple movements in the first direction, a portion of the movements moves the paddle 70 at the first speed V1, and the remaining movements moves the paddle 70 at the second speed V2.

In addition, in the above case, when the driving device 77 moves the paddle 70 in the second direction, it is only necessary to move the paddle 70 at one speed (ie, a constant speed) selected from the first speed V1 and the second speed V2.

Alternatively, this variation may also be configured such that the paddle 70 moves multiple times at different speeds in the "second direction". Specifically, at least one of the first reciprocating pattern and the second reciprocating pattern includes: the paddle 70 moves in the second direction at a first speed V1; and the paddle 70 moves in the second direction at a second speed V2.

When this variation is adopted, the bubbles Bu attached to the holes 12a of the ion resistor 12 can be effectively removed by moving the stirrer 70 multiple times at different speeds in the first direction or multiple times at different speeds in the second direction. In this way, the deterioration of the coating quality of the wafer W due to the bubbles Bu attached to the holes 12a of the ion resistor 12 can be suppressed (that is, the coating quality of the substrate Wf can be improved).

Specifically, when this variation is adopted, as shown in FIG. 8(A), when the paddle 70 moves at a relatively low speed, relatively large bubbles Bu attached to the holes 12a of the ion resistance body 12 are sucked upward and can be effectively removed from the holes 12a.

On the other hand, as shown in FIG. 8 (B), when the paddle 70 moves at a relatively high speed, relatively small-sized bubbles Bu attached to the holes 12a of the ion resistance body 12 (i.e., bubbles Bu of a size that are not drawn when the paddle 70 moves at a low speed) can be effectively removed from the holes 12a.

Specifically, at this time, by moving the impeller 70 at the second speed V2, a vortex Sw of the coating liquid Ps can be effectively formed between the beam member 71 of the impeller 70 and the upper surface of the ion resistor 12. By the vortex Sw, even if the size of the bubble Bu attached to the hole 12a is small, the bubble Bu can be effectively sucked up and removed from the ion resistor 12. In this way, when this variation is adopted, the bubble Bu of different sizes attached to the hole 12a of the ion resistor 12 can be effectively removed.

In addition, the specific value of the first speed V1 is not particularly limited, and for example, a speed that can remove the air bubbles Bu whose size (maximum outer size) exceeds the reference value from the hole 12a of the ion resistor 12 can be used. The first speed V1 can be appropriately determined by experiments, etc. In addition, the specific value of the second speed V2 can be any speed faster than the first speed V1, and is not particularly limited. For example, a speed that can remove the air bubbles Bu whose size does not reach the reference value from the hole 12a can be used. The second speed V2 can also be appropriately determined by experiments, etc.

In addition, as an example of an appropriate ratio between the first speed V1 and the second speed V2, the second speed V2 can be a speed of about 1.5 times or more of the first speed V1. (Variation 2)

Fig. 9 (A) and Fig. 9 (B) are schematic diagrams of a coating device 1000 for explaining a second variation of the embodiment. Specifically, Fig. 9 (A) and Fig. 9 (B) are schematic enlarged cross-sectional views showing the peripheral structure of the ion resistance body 12 of the coating device 1000 of this variation. In addition, in Fig. 9 (A) and Fig. 9 (B), the paddle 70 is illustrated with one beam member 71 thereof.

The present variation differs from the aforementioned implementation form and variation 1 in that in at least one of the first reciprocating pattern and the second reciprocating pattern, the paddle 70 moves in the first direction at a "first speed V1" (see FIG. 9 (A)), and then moves in the second direction at a "second speed V2" different from the first speed (see FIG. 9 (B)).

That is, the driving device 77 of this variation, which receives the instruction of the control module 800, repeatedly moves the paddle 70 in the first direction at the first speed V1 and then moves it in the second direction at the second speed V2 in at least one of the first reciprocating mode and the second reciprocating mode.

In addition, in this modification, an example of the second speed V2 is a speed faster than the first speed V1. However, the present invention is not limited to this configuration, and the second speed V2 may also be a speed slower than the first speed V1.

When this modification is adopted, the impeller 70 can move at the first speed V1 and the second speed V2 when the impeller 70 reciprocates once. This can effectively remove the bubbles Bu attached to the holes 12a of the ion resistor 12. As a result, the coating quality of the substrate Wf can be improved.

Specifically, when the paddle 70 moves back and forth once, when the paddle 70 moves at a relatively low speed (Fig. 9 (A)), the relatively large-sized bubbles Bu attached to the hole 12a of the ion resistance body 12 can be sucked up and effectively removed from the hole 12a. In addition, when the paddle 70 moves at a relatively high speed (Fig. 9 (B)), the relatively small-sized bubbles Bu attached to the hole 12a of the ion resistance body 12 can be sucked up and effectively removed from the hole 12a. (Other variations)

In addition, in the above-mentioned Modification 1 and Modification 2, the stroke of the impeller 70 when it moves back and forth may also be constant. That is, in this case, the impeller 70 may also move by A (mm) in the first direction and the second direction respectively when it moves back and forth. When this structure is adopted, although it is difficult to achieve the unique effects of the above-mentioned embodiment, the unique effects of Modification 1 and Modification 2 (the effect of removing the bubbles Bu attached to the holes 12a of the ion resistor 12 and improving the plating quality of the substrate Wf) can be achieved.

The embodiments and variations of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments and variations, and various modifications and changes can be made within the scope of the gist of the present invention.

10: coating groove 10a: bottom wall 10b: outer peripheral wall 11: anode 12: ion resistance body 12a: hole 13a: first supply port 13b: second supply port 14a: first discharge port 14b: second discharge port 16: membrane 17a: anode chamber 17b: cathode chamber 20: overflow tank 30: substrate holder 31: ring 40: rotation mechanism 45: tilting mechanism 50: lifting mechanism 51: support shaft 70: paddle 71: beam member 72a: first connecting member 72b: second connecting member 77: driving device 77a: linear motor 400: coating module 800: control module 801: processor 802: memory device 1000: coating device Bu: bubble D1: substrate width d: arrangement pitch MA: moving area PA: hole forming area Ps: coating liquid Sw: vortex V1: first speed V2: second speed W: width Wf: substrate Wfa: coated surface

FIG. 1 is a perspective view showing the overall structure of the coating device of the embodiment. FIG. 2 is a top view showing the overall structure of the coating device of the embodiment. FIG. 3 is a schematic diagram showing the structure of the coating module in the coating device of the embodiment. FIG. 4 is a schematic diagram showing the state of immersing the substrate in the coating liquid of the embodiment. FIG. 5 is a schematic top view of the stirring paddle of the embodiment. FIG. 6 is a flow chart for explaining a series of actions from supplying the coating liquid to starting the coating process of the embodiment. FIG. 7 is an example of a flow chart for explaining the detailed actions of the stirring paddle of the embodiment. Figures 8 (A) and 8 (B) are schematic diagrams of a coating device for illustrating variation 1 of the implementation form. Figures 9 (A) and 9 (B) are schematic diagrams of a coating device for illustrating variation 2 of the implementation form.

70: paddle 71: beam member 72a: first connecting member 72b: second connecting member 77: driving device 77a: linear motor d: arrangement spacing W: width

Claims (9)

A coating device comprises: a coating tank storing a coating liquid, an anode disposed inside the coating liquid, and a substrate disposed inside the coating liquid in a manner opposite to the anode; and a stirring paddle disposed between the anode and the substrate and stirring the coating liquid by reciprocating in a first direction parallel to the substrate and in a second direction opposite to the first direction; the stirring paddle has a plurality of beam members extending in a direction perpendicular to the reciprocating direction of the stirring paddle. The paddle reciprocates in the first direction and the second direction, including the paddle reciprocating in a first reciprocating pattern, in which the paddle moves in the second direction with a stroke different from a stroke in the first direction by a predetermined value, so that the positions of the plurality of beam components are changed when the paddle changes its moving direction from the second direction to the first direction; and the positions of the plurality of beam components are different when the paddle changes its moving direction from the first direction to the second direction. A coating device as claimed in claim 1, wherein the paddle moves back and forth in the first direction and the second direction, including the paddle moving back and forth multiple times in the first reciprocating pattern and then moving back and forth in the second reciprocating pattern, wherein in the first reciprocating pattern, the stroke of the paddle when moving in the second direction is shorter than the stroke of the paddle when moving in the first direction by the specified value, and in the second reciprocating pattern, the paddle moves in the second direction with a stroke longer than the stroke when moving in the first direction by the specified value, so that the positions of the plurality of beam components when the paddle changes its moving direction from the second direction to the first direction are different; and the positions of the plurality of beam components when the paddle changes its moving direction from the first direction to the second direction are different. The coating device of claim 1, wherein the paddle moves back and forth in the first direction and the second direction, including the paddle moving back and forth multiple times in the first reciprocating pattern and then moving back and forth in the second reciprocating pattern, in the first reciprocating pattern, the stroke of the paddle when moving in the second direction is longer than the stroke of the paddle when moving in the first direction by the specified value, in the second reciprocating pattern, the paddle moves in the second direction with a stroke shorter than the stroke when moving in the first direction by the specified value, so that the positions of the plurality of beam components when the paddle changes its moving direction from the second direction to the first direction are different; and the positions of the plurality of beam components when the paddle changes its moving direction from the first direction to the second direction are different. The coating device of claim 1, wherein the substrate is arranged above the anode, and an ion resistor having a plurality of holes is arranged inside the coating liquid, above the anode and below the paddle. As in claim 4, the coating device, wherein the paddle moves back and forth in the first direction and the second direction, includes: the paddle moves multiple times at different speeds in the first direction; or the paddle moves multiple times at different speeds in the second direction. The coating device of claim 4, wherein the paddle moves back and forth in the first direction and the second direction, including the paddle moving in the first direction at a first speed and then moving in the second direction at a second speed different from the first speed. A coating device comprises: a coating tank storing a coating liquid, an anode arranged inside the coating liquid, and a substrate arranged inside the coating liquid in a manner opposite to the anode; and a stirring paddle arranged between the anode and the substrate and stirring the coating liquid by reciprocating in a direction parallel to the substrate, in a first direction and in a second direction opposite to the first direction; the substrate is arranged above the anode, inside the coating liquid, above the anode and below the stirring paddle; An ion resistance body with a plurality of holes, wherein the impeller moves back and forth in the first direction and the second direction, including the impeller moving at a first speed in the first direction and then moving at a second speed faster than the first speed in the second direction, wherein the impeller moves at the first speed to extract bubbles of a predetermined size attached to the holes of the ion resistance body and remove them from the holes, and the impeller moves at the second speed to extract bubbles of a size smaller than the predetermined size attached to the holes of the ion resistance body and remove them from the holes. As in claim 2, the coating device, wherein in the aforementioned second reciprocating pattern, after the aforementioned paddle performs reciprocating movement the same number of times as the aforementioned paddle performed reciprocating movement in the aforementioned first reciprocating pattern, the reciprocating movement of the aforementioned paddle based on the aforementioned second reciprocating pattern is terminated. As in claim 3, the coating device, wherein in the aforementioned second reciprocating pattern, after the aforementioned paddle performs reciprocating movement the same number of times as the reciprocating movement of the aforementioned paddle in the aforementioned first reciprocating pattern, the reciprocating movement of the aforementioned paddle based on the aforementioned second reciprocating pattern is terminated.