TWI871470B - Substrate detection device, substrate detection method and substrate processing unit - Google Patents

Abstract

The present invention relates to a substrate detection device, which can detect substrates and easily obtain substrate information even in the case where the shape of a storage container is not standardized or the shape of the substrate is a square substrate. The substrate detection device comprises: a loading portion, which is a storage container for storing a plurality of substrates arranged in an up-down direction; a sensor holding portion, which is lifted relative to the loading portion; a lifting drive portion, which causes the loading portion and the sensor holding portion to be lifted relative to each other; a plurality of sensors, which are separately arranged on the sensor holding portion in a direction intersecting the up-down direction, and respectively detect different parts of the end of the substrate accommodated in the storage container; and a control portion, which drives the lifting drive portion to lift the loading portion and the sensor holding portion relative to each other, and obtains substrate information in the storage container based on the detection results of the plurality of sensors on the end of the substrate.

Description

Substrate detection device, substrate detection method and substrate processing unit

The present invention relates to a substrate detection device, a substrate detection method and a substrate processing unit.

A substrate detection device has been proposed, which detects substrates arranged in a vertical direction in a storage container and obtains information about the substrates in the storage container (for example, see Patent Document 1). The substrate detection device of Patent Document 1 detects a circular substrate contained in a storage container. The detection device uses a sensor composed of a light projecting part and a light receiving part to clamp a part of the circular substrate in the horizontal direction to detect the substrate.

[Prior Art Literature] [Patent Literature]

Patent document 1: Japanese Patent Publication No. 2009-200444

Since the substrate detection device of Patent Document 1 has a structure for detecting a circular substrate, when the substrate is a rectangular square substrate, it is necessary to widen the interval between the light projecting part and the light receiving part. For example, in order to detect a square substrate contained in a storage container, a space for inserting the light projecting part and the light receiving part is required in the storage container, resulting in a larger storage container. In addition, if the storage container is not standardized, it is possible to use a storage container without a space for inserting the light projecting part and the light receiving part, resulting in a situation where the substrate information of the square substrate contained in the storage container cannot be obtained.

The purpose of the present invention is to provide a substrate detection device and a substrate detection method, and further to provide a substrate processing unit equipped with the substrate detection device. The substrate detection device can detect the substrate even in the case where the shape of the storage container is not standardized or the shape of the substrate is a square substrate, and can easily obtain substrate information.

In the scheme of the present invention, a substrate detection device is provided, which comprises: a loading part, which is a storage container for loading a plurality of substrates arranged in a vertical direction; a sensor holding part, which is lifted relative to the loading part; a lifting driving part, which makes the loading part and the sensor holding part lift relative to each other; a plurality of sensors, which are separately arranged on the sensor holding part in a direction intersecting the vertical direction, and respectively detect different parts of the end of the substrate accommodated in the storage container; and a control part, which drives the lifting driving part. The lifting drive unit makes the loading unit and the sensor holding unit rise and fall relative to each other, and obtains the substrate information in the storage container according to the detection results of the end of the substrate by multiple sensors; the sensor holding unit has: a quadrangular frame, a holding member for maintaining the horizontal or approximately horizontal position of multiple sensors, and a pair of guided members hanging from the frame; the pair of guided members are respectively guided to be able to rise and fall; the holding member is held in the frame by being fixed by the pair of guided members.

In addition, in the scheme of the present invention, a substrate detection device is provided, which comprises: a loading part, which is a storage container for loading a plurality of substrates arranged and stored in the vertical direction; a sensor holding part, which is lifted relative to the loading part; a lifting drive part, which causes the loading part and the sensor holding part to be lifted relative to each other; a plurality of sensors, which are separately arranged on the sensor holding part in a direction intersecting the vertical direction, and respectively detect different parts of the end of the substrate contained in the storage container; and a control part, which drives the lifting drive part, causes the loading part and the sensor holding part to be lifted relative to each other, and obtains the substrate information in the storage container according to the detection results of the end of the substrate by the plurality of sensors.

In the scheme of the present invention, a substrate detection method is provided, which detects a plurality of substrates arranged and stored in a storage container placed on a placing portion in a vertical direction, wherein the substrate detection method comprises: a step of relatively raising and lowering the placing portion and a sensor holding portion which is separated and arranged from a plurality of sensors held by a sensor holding portion in a direction intersecting the vertical direction; a step of respectively detecting different portions of the end of the substrate contained in the storage container by the plurality of sensors; and a step of detecting the substrate by the plurality of sensors. And the process of obtaining the substrate information in the storage container according to the detection results of the ends of the substrate by the aforementioned multiple sensors; wherein the aforementioned sensor holding part has: a quadrangular frame, a holding member for maintaining the horizontal or substantially horizontal positions of the aforementioned multiple sensors, and a pair of guided members hanging from the aforementioned frame; the aforementioned pair of guided members are respectively guided to be able to rise and fall; the aforementioned holding member is held in the aforementioned frame by being fixed by the aforementioned pair of guided members.

In addition, in the scheme of the present invention, a substrate detection method is provided, which is a method for detecting a plurality of substrates arranged and stored in a storage container placed on a placing part in a vertical direction, and includes: a step of relatively lifting and lowering the placing part and a sensor holding part separated and arranged with a plurality of sensors in a direction intersecting the vertical direction; a step of respectively detecting different parts of the end of the substrate stored in the storage container by a plurality of sensors; and a step of obtaining substrate information in the storage container based on the detection results of the end of the substrate by the plurality of sensors.

In addition, in the scheme of the present invention, a substrate processing unit is provided, which has the above-mentioned substrate detection device, a substrate processing device for processing the substrate, and a conveying device for conveying the substrate between the substrate detection device and the substrate processing device.

According to the present invention, even in the case where the shape of the storage container is not standardized or the shape of the substrate is a square substrate, the substrate can be detected, thereby easily obtaining the substrate information of the substrate contained in the storage container.

1: Substrate detection device

2: Storage container

3: Loading section

4: Sensor holding part

5: Guidance Department

42:Maintaining components

C: Control Department

M: Lifting drive unit

R,R1,R2,R3,R4: Storage area

Se1, Se2: Sensor

W,W1,W2,W3: Substrate

U: Substrate processing unit

[Figure 1] is a front view showing an example of a substrate detection device according to an embodiment.

[Figure 2] is a side view of the substrate detection device shown in Figure 1.

[Figure 3] is a three-dimensional diagram of the main parts of the substrate detection device shown in Figure 1.

[Figure 4] is a three-dimensional diagram showing a state where part of the main part of the substrate detection device is raised.

[Figure 5] is a diagram showing an example of detecting the end of a substrate.

[Figure 6] is a diagram showing an example of substrate information data generated based on the inspection results of the substrate.

[Figure 7] is a diagram showing an example of a substrate detection method according to an implementation method.

[Figure 8] is a flow chart showing an example of a substrate detection method according to an implementation method.

[Figure 9] is a diagram showing an example of detecting the backlash of a substrate.

[Figure 10] is a diagram showing another example of substrate information data generated based on the inspection results of the substrate.

[Figure 11] is a flowchart showing another example of a substrate detection method according to an implementation method.

[Figure 12] is a diagram showing an example of detecting the tilt of a substrate.

[Figure 13] is a diagram showing another example of substrate information data generated based on the inspection results of the substrate.

[Figure 14] is a diagram showing an example of a substrate processing unit of an embodiment.

Hereinafter, the embodiment of the present invention will be described with reference to the attached drawings. However, the present invention is not limited to the attached drawings. In addition, in order to facilitate the understanding of each structure of the embodiment, a part is enlarged or emphasized or a part is simplified to represent, which is sometimes different from the actual structure or shape, scale, etc. In each attached drawing, the XYZ orthogonal coordinate system is sometimes used to illustrate the direction in the figure. In the XYZ orthogonal coordinate system, the vertical direction is set as the Z direction, and the horizontal direction is set as the X direction and the Y direction. In addition, in each direction, the direction indicated by the arrow is called the + direction, the + side (for example, the +X direction, the +X side), and the direction opposite to the direction indicated by the arrow is called the - direction, the - side (for example, the -X direction, the -X side).

<Substrate inspection device>

The substrate detection device 1 of the embodiment is described. FIG. 1 is a front view showing an example of the substrate detection device 1 of the embodiment. FIG. 2 is a side view of the substrate detection device 1 shown in FIG. 1 . As shown in FIG. 1 and FIG. 2 , the substrate detection device 1 has a loading part 3, a sensor holding part 4, a lifting drive part M, a plurality of sensors Se1, Se2, and a control part C.

The loading section 3 is a loading table for loading the storage container 2 containing the substrate W (square substrate). The loading section 3 has, for example, a top plate 31 that is a quadrilateral plate when viewed from above, a support 32 that supports the top plate 31 on a setting surface G such as a floor (hereinafter referred to as "setting surface G"), and a plate-shaped member 33 that is provided on the front side (-Y side) of the loading section 3 to cover a portion of the front side. The storage container 2 is loaded on the upper surface of the top plate 31. In addition, a positioning member (for example, a positioning pin, etc.) for positioning the storage container 2 when the storage container 2 is loaded may also be provided on the top plate 31. In addition, the top plate 31 is not limited to a plate-shaped member, and may also be a frame-shaped member composed of rod-shaped members.

The support 32 is provided by, for example, using a rod-shaped member, hanging down from the four corners of the lower surface of the top plate 31. The plate-shaped member 33 may also be provided to cover the entire front surface of the mounting portion 3. The plate-shaped member 33 is fixed to, for example, the top plate 31 or a portion of the support 32. A guide member 34 is provided on the back side of the plate-shaped member 33 to guide the guided member 43 of the sensor holding portion 4 described below. The mounting portion 3 has a strength capable of maintaining the mounting state of the storage container 2 when the storage container 2 is mounted.

The storage container 2 has: a bottom 21 that is a quadrilateral plate when viewed from above, an upper portion 23 that is a quadrilateral plate when viewed from above, a plurality of supports 22 that support the upper portion 23 on the bottom 21, a plurality of substrate supports 24 that support the substrate W, and a quadrilateral substrate storage port 25 for taking and placing the substrate W. The bottom 21 and the upper portion 23 are not limited to being plate-shaped, and may be, for example, a frame-shaped structure composed of rod-shaped components. The supports 22 are, for example, rod-shaped components, and a plurality of them are provided extending upward (+Z side) from each side of the bottom 21. In addition, the supports 22 are not limited to being rod-shaped, and may be plate-shaped. The supports 22 may also be in a form that covers the back side and the left and right side surfaces of the storage container 2.

The substrate support 24 is provided to extend in the horizontal direction from the support body 22 toward the inner side of the storage container 2. The plurality of substrate support parts 24 are configured to be consistent at each height in the front view and the side view. That is, the plurality of substrate support parts 24 are arranged in the X direction and the Y direction at each height. The substrate support part 24 contacts the back side (lower surface side) of the end of the substrate W and supports the substrate W. The substrate support part 24 can support the substrate W in the horizontal direction or the substantially horizontal direction by arranging in the X direction and the Y direction at each height.

The substrate W is supported by the substrate support 24 at each height and is arranged in the vertical direction (Z direction) in the storage container 2 to be stored. In addition, the number of storage blocks of substrates W in the storage container 2 can be set arbitrarily. The size of the storage container 2 is set according to the size, shape, and number of blocks of the substrates W to be stored. In addition, the size of the storage container 2 is sometimes standardized. The storage container 2 has a plurality of storage areas R (storage areas, narrow grooves) divided by the substrate support 24. One substrate W is stored in one storage area R. One storage area R is defined by the interval between two substrate support parts 24 arranged vertically (or the interval between the upper part 23 and the uppermost substrate support part 24) and the interval between the opposing support bodies 22.

The storage area R is set to a vertical dimension that allows a fork or the like provided by the transport device to pick up and place the substrate W. In this embodiment, the lowest storage area R is referred to as the storage area R1, and the storage areas R2, R3, R4, etc. are sequentially shown upward from the storage area R. In addition, in this embodiment, when a plurality of storage areas R1, R2, R3, R4, etc. are collectively referred to, they are sometimes referred to as the storage area R.

The substrate storage opening 25 opens in a rectangular shape on the front side of the storage container 2. The size of the substrate storage opening 25 is appropriately set according to the size and shape of the substrate W to be stored. In addition, the storage container 2 shown in the figure is in a form in which the substrate storage opening 25 is always open, but it can also be a form in which, for example, a cover or a shutter is provided for opening and closing the substrate storage opening 25 of the storage container 2. In addition, when using a storage container 2 equipped with a cover or a shutter, the substrate detection device 1 can also have an opening and closing device for opening and closing the cover or the shutter of the storage container 2.

FIG3 is a perspective view of the main part of the substrate detection device 1 shown in FIG1, and FIG4 is a perspective view of a part of the main part of the substrate detection device 1 shown in FIG1 rising. As shown in FIG3 and FIG4, the substrate detection device 1 has a sensor holding part 4 and a guide part 5. The sensor holding part 4 holds two (plural) sensors Se1 and Se2, and is guided by the guide part 5 to be raised and lowered by driving the lifting drive part M (see FIG1 and FIG2). The sensor holding part 4 has a frame 41, a holding member 42, a pair of guided members 43, and a shaft 44.

The guide part 5 is fixed to a setting surface G such as a floor (see FIG. 1 or FIG. 2) and is provided to hold the sensor holding part 4 in a manner that can be raised or lowered. The guide part 5 has an L-shaped plate-like body, which is fixed to the setting surface G and extends upward (in the +Z direction). The portion extending upward from the guide part 5 is plate-like, and the shaft 44 is supported in a manner that can be raised or lowered by a guide mechanism not shown in the figure on the -Y side thereof. In addition, a back plate is provided on the +Y side of the guide part 5 to increase the rigidity of the guide part 5. The guide part 5 guides the shaft 44, and supports the frame 41, the holding member 42, and the guided member 43 via the shaft 44. That is, the guide part 5 supports the sensor holding part 4 in a manner that can be raised or lowered relative to the setting surface G.

The frame 41 of the sensor holding part 4 is formed into a quadrilateral shape (rectangular shape) by a plate-shaped frame upper part 41A, a plate-shaped frame lower part 41B, and rod-shaped components 41C and 41D connecting the two ends of the frame upper part 41A and the two ends of the corresponding frame lower part 41B. By forming the frame 41 into a quadrilateral shape by a plurality of components, the rigidity of the sensor holding part 4 can be improved.

The holding member 42 holds the two sensors Se1 and Se2 in a horizontal direction or a substantially horizontal direction (hereinafter referred to as "horizontal direction, etc."). The holding member 42 is a plate extending in the horizontal direction and has a fixing member (such as a bracket, etc.) not shown in the figure for fixing the sensors Se1 and Se2 respectively. The central portion of the holding member 42 is mounted on the upper portion of the shaft 44. The holding member 42 is mounted on a pair of guided members 43 at each end in the horizontal direction, etc.

The guided member 43 holds the holding member 42. The guided member 43 is a square rod-shaped member, and a pair of the guided members 43 are suspended from the lower surface of the upper part 41A of the frame. The pair of guided members 43 are separated and set in the X direction. The holding member 42 is held in the horizontal direction by being fixed to the pair of guided members 43. The pair of guided members 43 are guided by the guide members 34 (see Figure 1) respectively and can be raised and lowered. By guiding the pair of guided members 43 by the guide members 34, the sensor holding part 4 can be raised and lowered with high precision.

The shaft 44 is a plate-shaped member extending in the vertical direction, arranged along the -Y side surface of the guide portion 5, and can be raised and lowered by being guided by the unillustrated guide mechanism of the guide portion 5. A holding member 42 is fixed to the upper part of the shaft 44. As the guide mechanism of the guide portion 5, for example, the following structure can be cited: that is, a pair of grooves in the vertical direction are respectively provided on both side surfaces of the shaft 44 in the Y direction, and a convex portion embedded in the pair of grooves is provided on the guide portion 5. By raising and lowering the shaft 44, the frame 41 and the holding member 42 are also raised and lowered. The shaft 44 is raised and lowered by the driving force of the lifting drive portion M (see Figure 1 or Figure 2). That is, the sensor holding portion 4 is raised and lowered by the driving force of the lifting drive portion M .

The lifting drive unit M is driven according to the instruction of the control unit C, and for example, a pinion gear mechanism or a ball screw mechanism using an electric motor can be used. By using a servo motor as the motor, the control unit C can obtain the lifting amount (or height position) of the shaft 44 according to the drive signal of the servo motor. In addition, the lifting drive unit M can also have an encoder for obtaining the lifting amount (height position) of the shaft 44 relative to the guide unit 5. In this case, the control unit C can obtain the lifting amount (or height position) of the shaft 44 according to the output of the encoder. In addition, the motor of the lifting drive unit M can be set on the guide unit 5 or on the shaft 44. In addition, the lifting drive unit M can also use a hydraulic device such as a hydraulic cylinder.

Sensors Se1 and Se2 detect different parts of the end of the substrate W accommodated in the storage container 2. Sensors Se1 and Se2 are arranged equally in the horizontal direction and fixed to the holding member 42 by a fixing member not shown. In addition, as long as the sensors Se1 and Se2 are arranged in a direction intersecting the up and down direction, the arrangement direction is not limited to the horizontal direction, etc., and can also be equally inclined from the horizontal direction. The two sensors Se1 and Se2 are separated and fixed at a distance d3 (see Figure 12) in the X direction. The distance d3 is shorter than the length of the substrate W in the X direction. In addition, the two sensors Se1 and Se2 are arranged to be closer to the inner side than the substrate support part 24 when viewed from the Y direction (see Figure 12). Through this configuration, it is possible to avoid the situation where the sensors Se1 and Se2 detect the substrate support part 24.

The sensors Se1 and Se2 are fixed to the holding member 42 to maintain the state of being arranged in the horizontal direction. In addition, since the sensor holding part 4 has a quadrilateral frame 41, the rigidity is improved, and even if the sensor holding part 4 is raised or lowered, the positional relationship between the sensors Se1 and Se2 is not easily changed. In this embodiment, a method of using two sensors Se1 and Se2 is shown, but a method of using more than three sensors may also be used. When using more than three sensors, for example, a method of arranging a plurality of sensors in a row in the horizontal direction, or a method of arranging two sensors in the horizontal direction, and the remaining sensors are arranged in a direction deviating from the horizontal direction, etc.

Sensors Se1 and Se2 are, for example, optical reflective sensors, and length measuring sensors can be used. FIG5 is a diagram showing an example of a situation where the sensor Se1 detects the end P of the substrate W. As shown in FIG5, the sensor Se1 has a light projecting unit Se1A and a light receiving unit Se1B. In the sensor Se1, the substrate W is detected by receiving the reflected light emitted from the light projecting unit Se1A and irradiated on the end P of the substrate W by the light receiving unit Se1B. In addition, by using a length measuring sensor as the sensor Se1, the distance in the Y direction from the reference position (for example, the position of the sensor Se1) to the end P of the substrate W can be measured. In addition, the sensor Se2 has the same structure as the sensor Se1, and the description of the above-mentioned sensor Se1 can be directly applied.

Sensors Se1 and Se2 are lifted and lowered together with the sensor holding part 4 by driving the lifting driving part M to lift and lower the sensor holding part 4 as shown in FIG. 4. Sensors Se1 and Se2 are lifted and lowered on the substrate storage port 25 side of the storage container 2 by lifting and lowering the sensor holding part 4. That is, by lifting and lowering the sensors Se1 and Se2 on the substrate storage port 25 side (front side) of the storage container 2, the sensors Se1 and Se2 are lifted and lowered relative to each storage area R of the storage container 2, and the substrates W stored in each storage area R can be detected sequentially by the sensors Se1 and Se2. In addition, the sensors Se1 and Se2 can detect the substrate W when they are lifted relative to the storage container 2 (loading part 3), and can also detect the substrate W when they are lowered relative to the storage container 2.

In addition, by using sensors Se1 and Se2 (e.g., length measuring sensors) with smaller spot diameters of the detection light emitted by the light projecting unit Se1A, the end P of the substrate W can be detected even if the substrate W is a thin substrate (e.g., a thickness of about 0.1 to 2 mm). In addition, by reducing the spot diameter of the detection light, the thickness of the substrate W can be measured. For example, the thickness of the substrate W can be detected based on the difference between the height of the sensor Se1 when the light with a smaller spot diameter is irradiated on the lower end of the substrate W and the height of the sensor Se1 when the light deviates from the upper end of the substrate W.

The outputs of sensors Se1 and Se2 are input to the control unit C. In addition, it is not limited to using optical reflective sensors as sensors Se1 and Se2. For example, any sensor that can detect the end P of the substrate W (such as a capacitive sensor, etc.) can also be used. In addition, multiple sensors Se1 and Se2 are not limited to using the same type of sensors, and different sensors can also be used.

In this embodiment, the structure in which the sensor holding part 4 is lifted relative to the placing part 3 by the driving force of the lifting driving part M is used as an example for explanation, but it is not limited to this structure. Any structure that causes the placing part 3 and the sensor holding part 4 to be lifted relative to each other can be applied. For example, the sensor holding part 4 (sensors Se1, Se2) can be fixed in the up-down direction, and the placing part 3 (storage container 2) can be lifted relative to the sensor holding part 4, or both the sensor holding part 4 and the placing part 3 can be lifted. In the case of the structure in which the placing part 3 is lifted, the substrate detection device 1 can also have a lifting device for the placing part 3.

The control unit C coordinates and controls the substrate detection device 1. The control unit C controls the sensors Se1, Se2 and the lifting drive unit M. The control unit C drives the sensor holding unit 4 to rise and fall relative to the loading unit 3 by driving the lifting drive unit M. In addition, the control unit C drives the sensors Se1 and Se2 synchronously with the lifting and falling of the sensor holding unit 4. The control unit C obtains the driving amount (or driving signal) of the lifting drive unit M, and obtains the substrate information of the substrate W from the signal output by the sensors Se1 and Se2. That is, while the storage container 2 and the sensors Se1 and Se2 are lifted and lowered (rising or falling) in the up and down directions, the substrates W stored in each storage area R are detected by the sensors Se1 and Se2.

The control unit C is provided with a memory unit E. The control unit C causes the memory unit E to store the acquired substrate information. In addition, the control unit C refers to the driving amount of the lifting drive unit M when the sensors Se1 and Se2 detect the end P of the substrate W, and compares it with the standard position when the substrate W is previously stored in each storage area R. For example, the standard position is managed according to the height of the substrate W from the setting surface G when the substrate W is stored in each storage area R1, R2, R3, R4, ... Rn (when the substrate W is placed on the substrate support 24). For example, in the case of the storage area R1, the standard position is a height H1R. Similarly, in the case of the storage areas R2, R3, R4, ..., Rn, the standard positions are heights H2R, H3R, H4R, ..., HnR. Illustration of the heights H2R, H3R, H4R, ..., HnR is omitted. These heights H1R to HnR are measured in advance and stored in the memory unit E. In addition, the standard position is measured based on the substrate W without deformation such as warping.

The control unit C calculates the height of the sensors Se1 and Se2 based on the driving amount of the lifting drive unit M when the sensors Se1 and Se2 detect the end P of the substrate W, and compares the height with the height H1R of the standard position of each storage area R. The height of the sensors Se1 and Se2 is an example of the relative position of the mounting unit 3 and the sensor holding unit 4. If the difference between the height of the sensors Se1 and Se2 and the height H1R is within the error range (pre-set allowable range), the control unit C determines that there is a substrate W in the storage area R. The control unit C repeatedly performs such determination while the sensors Se1 and Se2 rise from the storage area R1 to the uppermost storage area (and descend from the uppermost storage area to the storage area R1). The control unit C obtains information on the presence or absence of substrates W in each storage area R as substrate information.

FIG6 is a diagram showing an example of substrate information data generated by the control unit C based on the detection result of the substrate W. As shown in FIG6, as the substrate information stored in the memory unit E, the columns in the right column store data showing the storage area R, and the columns in the left column store data showing whether there is a substrate W in each storage area R. For example, the substrate information in the example shown in FIG1 and FIG2 shows that the substrate W is "yes" in the storage areas R1, R3 and R4, and the substrate is "no" in the storage area R2. The substrate information is not only the presence or absence of the substrate W, but also the back warp of the substrate W, the inclination of the substrate W, etc. can be added. In addition, the description of the back warp of the substrate W and the inclination of the substrate W will be described below.

<Substrate detection method>

Next, the substrate detection method of the embodiment is described. FIG. 7 is a diagram showing an example of the substrate detection method of the embodiment. The substrate detection method of the embodiment can use the substrate detection device 1 described above, for example. The substrate detection method of the embodiment is a method for detecting a plurality of substrates W arranged in the vertical direction and stored in a storage container 2 placed on a placing portion 3, and includes: raising and lowering the placing portion 3 and a sensor holding portion 4 equipped with sensors Se1 and Se2 relative to each other; detecting different parts of the end P of the substrate W stored in the storage container 2 by sensors Se1 and Se2 respectively; and obtaining substrate information in the storage container 2 based on the detection results of the end P of the substrate W obtained by sensors Se1 and Se2.

The control unit C drives the lifting drive unit M to raise the sensor holding unit 4. As the sensor holding unit 4 rises, the sensors Se1 and Se2 held by the sensor holding unit 4 also rise. In addition, the sensors Se1 and Se2 are located below the top plate 31 of the placement unit 3 as the initial position. In addition, the control unit C drives the lifting drive unit M and drives the sensors Se1 and Se2. The sensors Se1 and Se2 emit detection light from their respective light-emitting units Se1A and the like according to the instructions from the control unit C. In addition, in FIG. 7, the description of the sensor Se2 is omitted.

When the sensor Se1 reaches the height H1, the light emitted from the light projecting part Se1A is reflected at the end of the substrate W and enters the light receiving part Se1B. The sensor Se1 sends a signal indicating the light received by the light receiving part Se1B to the control part C. If the control part C receives the light received signal from the sensor Se1, it calculates the height H1 of the sensor Se1 according to the driving amount of the lifting drive part M at the time of receiving the signal. The control part C determines which storage area R the height H1 corresponds to. The control part C, for example, refers to the height H1R of the standard position of each storage area R stored in the memory part E (see Figure 5) to determine which storage area R corresponds to. Then, the control part C determines that the substrate W exists in the specific storage area R.

As the sensor Se1 rises, the control unit C repeats such actions. FIG7 shows that there is a substrate W1 in the storage area R1 corresponding to the height H1, there is no substrate W in the storage area R2 corresponding to the height H2, there is a substrate W2 in the storage area R3 corresponding to the height H3, and there is a substrate W3 in the storage area R4 corresponding to the height H4. The control unit C generates substrate information (mapping data) related to the presence or absence of the substrate W in the storage container 2 as shown in FIG5 for the storage areas R1 to R4 corresponding to the heights H1 to H4, respectively. That is, the control unit C obtains the position of the substrate W in the storage container 2 based on the detection results of the sensors Se1 and Se2. The control unit C stores the generated substrate information in the memory unit E. In addition, the control unit C can also provide the substrate information stored in the memory unit E to other substrate processing devices, or a transport device for transporting the substrate W, etc.

In the present embodiment, two sensors Se1 and Se2 are used to detect different parts at the end of the substrate W. Therefore, by using the two sensors Se1 and Se2, the substrate W can be reliably detected. In addition, by detecting with the two sensors Se1 and Se2, the redundancy of the detection result can be ensured. In addition, it is also possible to use one of the two sensors Se1 and Se2 for main detection and the other for sub-detection. In addition, as described above, when the spot diameter of the detection light emitted by the light projection unit Se1A is small, the control unit C can also calculate the thickness of the substrate W and append the result to the substrate information. In addition, when the sensors Se1 and Se2 are length measuring sensors, the control unit C can also obtain information related to the Y-direction position of each substrate W from the sensors Se1 and Se2, and add the Y-direction position of the substrate W to the substrate information.

In addition, in this embodiment, the detection results obtained by sensors Se1 and Se2 can be used to detect the back-curling of substrate W. FIG. 8 is a flowchart showing an example of a substrate detection method of the embodiment. FIG. 9 is a diagram showing an example of detecting the back-curling of substrate W. FIG. 8 includes the substrate detection method of the above-mentioned embodiment, and the case of detecting the back-curling of substrate W is described. First, as described above, control unit C drives lifting drive unit M and drives sensors Se1 and Se2. Then, control unit C determines whether sensors Se1 and Se2 detect substrate W (step S1).

In step S1, the control unit C receives information indicating that the light receiving unit Se1B of the sensors Se1 and Se2 receives light, and determines whether the substrate W is detected based on the information. The control unit C obtains the driving amount of the lifting drive unit M and recognizes the height of the sensors Se1 and Se2. Therefore, if the substrate W is not detected in step S1 (step S1 is no), the control unit C sets the absence of the substrate W in the storage area R corresponding to the height of the sensors Se1 and Se2 as the substrate information (step S2). Then, the control unit C determines whether the sensors Se1 and Se2 have reached the top (step S3).

When sensors Se1 and Se2 reach the top (step S3 is yes), the control unit C ends a series of processing. In addition, when sensors Se1 and Se2 do not reach the top (step S3 is no), the control unit C returns to step S1 to determine whether sensors Se1 and Se2 detect substrate W.

When sensors Se1 and Se2 detect substrate W in step S1 (step S1 is yes), control unit C sets the presence of substrate W in storage area R corresponding to the height of sensors Se1 and Se2 as substrate information (step S4). Control unit C stores information indicating that there is substrate W in a specific storage area R (for example, storage area R1) in memory unit E. Next, control unit C compares the height H of sensors Se1 and Se2 when substrate W is detected with the standard position stored in memory unit E. For example, when there is substrate W in storage area R1, control unit C compares the height H1 of sensors Se1 and Se2 with the height H1R of the standard position.

The control unit C determines whether the deviation between the height H of the sensors Se1 and Se2 and the height H1R of the standard position is within the allowable range (step S5). The allowable range is set in advance by the operator and stored in the memory unit E. As shown in FIG9, when the substrate W1 accommodated in the storage area R1 is warped, the end Q of the substrate W deviates upward by a distance d1 from the position when it is not warped. The sensors Se1 and Se2 detect the end Q deviated upward. The height H1 sometimes deviates from the height H1R of the standard position by a distance d1. In step S5, the control unit C determines whether the deviated distance d1 is within the allowable range. In addition, although sensor Se1 is shown in FIG9 , sensor Se2 also outputs the signal of light received at height H1 to control unit C in the same manner.

If the deviation exceeds the allowable range (No in step S6), the control unit C sets information indicating that the substrate W stored in the specific storage area R is warped as the substrate information (step S7). If the deviation is within the allowable range (Yes in step S6), the control unit C sets information indicating that the substrate W stored in the specific storage area R is not warped as the substrate information (step S8). The control unit C stores the information indicating that the substrate W is warped or the information indicating that the substrate W is not warped in the memory unit E. After the control unit C is set to have a backflip on the substrate W in step S7, or is set to have no backflip on the substrate W in step S8, it determines in step S3 whether the sensors Se1 and Se2 have reached the top. If they have reached the top, a series of processes are terminated. If they have not reached the top, it returns to step S1 and executes each process.

FIG. 10 is a diagram showing another example of substrate information data generated based on the detection result of the substrate W. FIG. 10 includes information set by the above-mentioned step S7 or step S8 (information related to the back-curling of the substrate W). In addition, the substrate information data shown in FIG. 10 is data obtained by adding information related to the back-curling of the substrate W to the substrate information data shown in FIG. 6. As shown in FIG. 10, the control unit C adds information related to whether the substrate W is back-curled in addition to the presence or absence of the substrate W to the storage areas R1, R2, R3, R4, ... respectively.

In the data of substrate information shown in FIG. 10 , information showing that the substrate W1 stored in the storage area R1 is warped is added. In addition, information showing that the substrate W2 stored in the storage area R3 is not warped is added. In addition, information showing that the substrate W3 stored in the storage area R4 is not warped is added. In addition, since the substrate W is not stored in the storage area R2, the information related to the warping of the substrate W is not shown.

In this way, by adding information related to the back-flipping of the substrate W as substrate information, it is possible to manage the details of the substrates W stored in each storage area R. Therefore, for example, by providing the substrate information to the transport device of the substrate W through the control unit C, the transport device can recognize that the substrate W to be transported has back-flipped, and as a result, it can execute transport suspension or selection of a different transport method, etc.

In addition, in this embodiment, the tilt of the substrate W can be detected using the detection results obtained by the sensors Se1 and Se2. FIG. 11 is a flowchart showing another example of the substrate detection method of the embodiment. FIG. 12 is a diagram showing an example of detecting the tilt of the substrate W. In addition, in the flowchart shown in FIG. 11, the same figure mark is given to the same processing as the flowchart shown in FIG. 8, and its description is omitted or simplified. As shown in FIG. 8, after the control unit C is set to have a substrate W in the storage area R through step S4, it determines whether the height H of the substrate W detected by the sensors Se1 and Se2 is different (step S9). That is, the control unit C determines whether the height H of the substrate W detected by the sensor Se1 is different from the height H of the substrate W detected by the sensor Se2.

FIG12 shows an example of a situation where the substrate W2 is stored at an angle. As shown in FIG12, the end of the -X side of the substrate W2 is supported by the substrate support portion 24 of the storage area R2, and the end of the +X side is supported by the substrate support portion 24 of the storage area R3, and the substrate W2 is tilted (angle θ). Since the sensors Se1 and Se2 are raised in a state of being kept at a distance d3 in the X direction, the sensor Se2 first detects the substrate W2, and then when the sensors Se1 and Se2 rise a distance d2, the sensor Se1 detects the substrate W2. The sensors Se1 and Se2 output the detection results to the control unit C at different timings.

The control unit C calculates the height H21 when the sensor Se1 detects the substrate W2 based on the driving amount of the lifting drive unit M, and calculates the height H22 when the sensor Se2 detects the substrate W2. In step S9, the control unit C compares the calculated height H21 with the height H22 and determines whether they are different. When the substrate W2 is tilted as shown in FIG. 12, the control unit C determines that the height H21 is different from the height H22. When the height H21 is different from the height H22 (step S9 is yes), the control unit C determines whether the deviation between the height H21 and the height H22 is within the allowable range (step S10). In addition, when the height H21 and the height H22 are not different (step S9 is No), the control unit C executes the processing after step S3.

In step S10, the control unit C determines whether the deviation (distance d2) between the height H21 and the height H22 is within the allowable range stored in the memory unit E. The allowable range is, for example, pre-stored in the memory unit E by an operator or the like, and is set based on the error range when the substrate W is properly placed in one storage area R. The control unit C determines whether the deviation between one of the heights H21 and H22 (the standard position of the substrate W obtained in advance) and the other is within the allowable range. In addition, in step S10, the control unit C may also determine whether the tilt angle θ of the substrate W2 is within the allowable range instead of determining whether the deviation between the heights H21 and H22 is within the allowable range. The method for calculating the tilt angle θ of the substrate W2 is described below.

When the height deviation exceeds the allowable range (No in step S10), the control unit C sets information indicating that the substrate W stored in the specific storage area R is tilted as substrate information (step S11). In addition, when the height deviation is within the allowable range (Yes in step S10), the control unit C sets information indicating that the substrate W stored in the specific storage area R is not tilted as substrate information (step S12). The control unit C stores the information indicating that the substrate W is tilted or the information indicating that the substrate W is not tilted in the memory unit E. After the control unit C sets the substrate W to be tilted in step S11 or sets the substrate W to be not tilted in step S12, it determines whether the sensors Se1 and Se2 have reached the top through step S3. If they have reached the top, a series of processes are terminated. If they have not reached the top, it returns to step S1 to perform each process.

FIG. 13 is a diagram showing another example of substrate information data generated based on the detection result of substrate W. FIG. 13 includes information set by the above-mentioned step S11 or step S12 (information related to the inclination of substrate W). In addition, the substrate information data shown in FIG. 13 is data obtained by adding information related to the inclination of substrate W to the substrate information data shown in FIG. 6. As shown in FIG. 13, the control unit C adds information related to whether the substrate W is inclined in addition to the presence or absence of substrate W to the storage areas R1, R2, R3, R4, ..., respectively. In addition, as shown in FIG. 12, since substrate W2 is stored obliquely across storage areas R2 and R3, the substrate information data shown in FIG. 13 shows information indicating that there is a substrate W in each of storage areas R2 and R3.

In the data of substrate information shown in FIG. 13, information indicating that the substrate W1 stored in the storage area R1 is not tilted is added. In addition, information indicating that the substrate W2 stored in the storage area R2 is tilted is added. In addition, information indicating that the substrate W2 stored in the storage area R3 is tilted is added. In addition, information indicating that the substrate W3 stored in the storage area R4 is not tilted is added. In addition, since the same substrate W2 is in the storage areas R2 and R3, information indicating that the substrate W2 is tilted in either of the storage areas R2 and R3 can also be set as substrate information.

In this way, by adding information related to the tilt of the substrate W as substrate information, the details of the substrates W stored in each storage area R can be managed. Therefore, for example, by providing the substrate information to the transport device of the substrate W through the control unit C, the transport device can recognize that the substrate W to be transported is tilted, and as a result, it can stop the transport or select a different transport method.

In addition, the substrate information is not limited to the information set to indicate whether the substrate W is tilted. For example, in addition to the information indicating whether the substrate W is tilted, information indicating the angle θ of the tilt of the substrate W may be set, or information indicating the angle θ of the tilt of the substrate W may be set instead of the information indicating whether the substrate W is tilted. As shown in FIG12 , the interval between the sensors Se1 and Se2 in the X direction is the distance d3. Since the sensors Se1 and Se2 are fixed by the holding member 42 as described above, the distance d3 does not change. In addition, the height when the sensor Se1 detects the substrate W2 is the height H21, and the height when the sensor Se2 detects the substrate W2 is the height H22. The difference between the height H21 and the height H22 is the distance d2. The control unit C calculates the angle θ according to the following formula using the distance d2 and the distance d3.

tanθ=d2/d3

As described above, the control unit C may also set the calculated angle θ as substrate information in addition to the information indicating whether the substrate W is tilted, or may set the calculated angle θ as substrate information instead of the information indicating whether the substrate W is tilted.

<Substrate processing unit>

FIG. 14 is a diagram showing an example of a substrate processing unit U of an embodiment. As shown in FIG. 14 , the substrate processing unit U of the present embodiment includes a plurality of substrate processing devices for processing substrates W. The substrate processing unit U has, as a substrate processing device, cassette stations CS1 and CS2, flip devices FP1 and FP2, a dry cleaning device DU, a stripping device ST, a laser irradiation device LA, an alkaline cleaning device LC, a cleaning device CC, and conveying devices TR1 and TR2. The substrate W processed by the substrate processing unit U is formed by, for example, bonding electronic components to a support such as a glass plate via an adhesive layer and a separation layer.

In the substrate processing unit U, the cassette carriers CS1 and CS2, the flip devices FP1 and FP2, and the drying and cleaning device DU are sequentially arranged from the +Y side toward the -X direction. In the substrate processing unit U, the stripping device ST, the laser irradiation device LA, the conveying device TR2, the alkaline cleaning device LC, and the cleaning device CC are sequentially arranged from the -Y side toward the -X direction. The cassette carrier CS1 and the like on the +Y side are separated from the stripping device ST and the like on the -Y side by a gap in the Y direction, and the conveying device TR1 is arranged in the gap.

The cassette stage CS1 is provided with the substrate detection device 1 of the present embodiment. The cassette stage CS1 is used to drive the substrate W from the storage container 2 into the substrate processing unit U. The cassette stage CS2 is provided with a loading table capable of loading the storage container 2, and is used to load the substrate W processed by the substrate processing unit U into the storage container 2. In addition, the cassette stage CS2 may also be provided with the substrate detection device 1 like the cassette stage CS1.

The flipping devices FP1 and FP2 flip the substrate W respectively. The flipping devices FP1 and FP2 flip the substrate W in order to irradiate the substrate W with laser light by the laser irradiation device LA. In addition, by using two flipping devices FP1 and FP2, the flipping process of the substrate W can be efficiently performed. In addition, the flipping devices FP1 and FP2 may be any one of them. The flipping devices FP1 and FP2 may also include an alignment device for positioning the substrate W. The laser irradiation device LA irradiates the substrate W with laser light. The laser irradiation device LA irradiates the substrate W with laser light, for example, from the support body side of the substrate W to modify the separation layer of the substrate W. The substrate W with the modified separation layer becomes a state in which the support body and the electronic components can be separated. That is, the substrate W becomes capable of peeling electronic components etc. from the supporting body.

The stripping device ST strips the support body from the substrate W. For example, the stripping device ST fixes the substrate W in a degraded state of the separation layer on a fixing table, and lifts the support body by adsorption by the adsorption device, thereby stripping the support body from the substrate W. The alkali cleaning device LC cleans the substrate W by an alkali cleaning agent. The alkali cleaning agent can use a known alkali cleaning agent. Examples of the alkali cleaning agent include potassium hydroxide, sodium hydroxide, potassium carbonate, sodium carbonate, sodium bicarbonate, sodium silicate, linear alkylamine, branched alkylamine, cyclic amine, and quaternary ammonium hydroxide compound. In addition, examples of additives contained in the alkaline cleaning agent include non-ionic surfactants, chelating agents, and anionic surfactants. The alkaline cleaning device LC dissolves and removes the adhesive layer attached to the substrate W from which the support body is peeled off. In addition, the peeling device ST may also have a support body transport device for recovering the support body peeled off from the substrate W.

The cleaning device CC uses a cleaning cup to clean the substrate W. The cleaning device CC, for example, supplies liquid to the substrate W to remove the adhesive layer and the separation layer attached to the substrate W from which the support body is peeled. Examples of the liquid used for cleaning include hydrocarbon organic solvents, nitrogen-containing organic solvents, ether solvents, ester solvents, water (pure water), etc. The dry cleaning device DU performs dry cleaning on the substrate W. In addition, a plasma cleaning device that can remove the adhesive layer and the separation layer attached to the substrate W can be used instead of the cleaning device CC and the alkaline cleaning device LC. The dry cleaning device DU, for example, supplies dry air, nitrogen, and other gases to the substrate W to remove the liquid attached to the substrate W. The dry cleaning device DU, for example, dries the substrate W.

The transport devices TR1 and TR2 transport the substrate W between the devices. The transport devices TR1 and TR2 are, for example, transport robots equipped with arms capable of holding the substrate W. As shown in FIG. 14 , the transport device TR1 can move in the X direction. The transport device TR2 can move in the X direction like the transport device TR1, or can be fixedly arranged between the laser irradiation device LA and the alkaline cleaning device LC. The transport devices TR1 and TR2 can be operated simultaneously, or either one can be operated.

Next, an example of transporting the substrate W through the transport device TR1 in the substrate processing unit U is described. The transport device TR1 drives the substrate W out of the storage container 2 of the cassette stage CS1 (substrate detection device 1). Then, the transport device TR1 transports the driven substrate W to the flip device FP1 or the flip device FP2. Then, the transport device TR1 transports the substrate W flipped by the flip device FP1 and the like to the laser irradiation device LA. Then, the transport device TR1 transports the substrate W irradiated with laser by the laser irradiation device LA to the stripping device ST. Then, the transport device TR1 transports the substrate W after the support body is stripped by the stripping device ST to the alkaline cleaning device LC. Then, the transport device TR1 transports the substrate W after alkaline cleaning to the cleaning device CC. Then, the transport device TR1 transports the cleaned substrate W to the drying and cleaning device DU. The transport device TR1 stores the dried substrate W in the storage container 2 of the loading platform CS2.

In addition, it is not limited to transporting the substrate W through one transport device TR1. The substrate W may also be transported through two transport devices TR1 and TR2. For example, the substrate W may be transported through the transport device TR2 in a specific device room, and the substrate W may be transported through the transport device TR1 outside the specific device room. In addition, the transport device TR1 may be used as a main device, and the transport device TR2 may be used as a secondary (or auxiliary) device. In addition, the substrate processing unit U may be a structure having one transport device TR1, or a structure having three transport devices TR1 (TR2).

The above is an explanation of the implementation method, but the present invention is not limited to the above explanation, and various changes can be made within the scope of the main purpose of the present invention. For example, although the detection method of the back-curling of the substrate W and the detection method of the tilt of the substrate W are described separately, it is also possible to detect both the back-curling and the tilt of the substrate W. In this case, the presence or absence of the substrate W, the back-curling of the substrate W, and the tilt of the substrate W can also be set as substrate information for each storage area R. In addition, the position of the substrate W in the Y direction and the thickness of the substrate W can also be added as substrate information.

In addition, in the above-mentioned embodiment, the sensor holding part 4 is described as being composed of a frame 41, a holding member 42, a guided member 43, and a shaft 44, but the invention is not limited to this scheme. For example, the sensor holding part 4 may be composed of a holding member 42 and a shaft 44.

1: Substrate inspection device

2: Storage container

3: Loading part

4: Sensor holding part

5: Guidance Department

21: Quadrilateral plate-shaped bottom

22: Support body

23: The upper part of the quadrilateral plate

24: Substrate support

25: Baseboard storage port

31: Top plate

32: Pillar

33: Plate-shaped components

34:Guide

41A: Plate-shaped upper frame

41B: Plate-shaped lower frame

41C, 41D: Rod-shaped components

42:Maintaining components

43: Guided component

44: Axis

C: Control Department

E: Memory

G: Setting surface

M: Lifting drive unit

R,R1,R2,R3,R4: Storage area

Se1, Se2: Sensor

W,W1,W2,W3: Substrate

Claims (8)

A substrate detection device comprises: a loading portion, which is a storage container for loading a plurality of substrates arranged in a vertical direction; a sensor holding portion, which is lifted relative to the loading portion; a lifting drive portion, which causes the loading portion and the sensor holding portion to be lifted relative to each other; a plurality of sensors, which are separately arranged on the sensor holding portion in a direction intersecting the vertical direction, and respectively detect different parts of the end of the substrate accommodated in the storage container; and a control portion, which drives the lifting drive portion to cause the loading portion to be lifted relative to the sensor holding portion. The sensor holding part rises and falls relative to the sensor holding part, and obtains the substrate information in the storage container according to the detection results of the multiple sensors on the ends of the substrate; the sensor holding part comprises: a quadrangular frame, a holding member for maintaining the horizontal or substantially horizontal positions of the multiple sensors, and a pair of guided members hanging from the frame; the pair of guided members are respectively guided to be able to rise and fall; the holding member is held in the frame by being fixed by the pair of guided members. As in claim 1, the substrate detection device, wherein the plurality of sensors are separately arranged in the sensor holding portion along a horizontal direction or a substantially horizontal direction. A substrate detection device as claimed in claim 1 or 2, wherein the sensor is an optical reflective sensor. A substrate detection device as claimed in claim 1 or 2, wherein the control unit obtains the position of the substrate in the storage container based on the relative position of the placement unit and the sensor holding unit and the detection result of the sensor. The substrate detection device of claim 4, wherein the control unit obtains one or both of the warp of the substrate and the tilt of the substrate according to the deviation between the position of the substrate in the storage container and the pre-obtained standard position of the substrate. A substrate detection device as claimed in claim 1 or 2, wherein the aforementioned substrate is a square substrate. A substrate detection method is provided for detecting a plurality of substrates arranged and stored in a storage container placed on a placing portion in a vertical direction, wherein the method comprises: a step of relatively lifting and lowering the placing portion and a sensor holding portion which is separated and arranged from a plurality of sensors held by a sensor holding portion in a direction intersecting the vertical direction; a step of respectively detecting different portions of the end of the substrates stored in the storage container by the plurality of sensors; and a step of detecting the substrates according to the plurality of sensors. The process of obtaining the substrate information in the storage container by using a sensor to detect the end of the substrate; wherein the sensor holding part comprises: a quadrangular frame, a holding member for holding the horizontal or substantially horizontal position of the plurality of sensors, and a pair of guided members hanging from the frame; the pair of guided members are guided to be able to rise and fall respectively; the holding member is held in the frame by being fixed by the pair of guided members. A substrate processing unit, comprising: a substrate detection device as described in any one of claims 1 to 6; a substrate processing device for processing the substrate; and a transport device for transporting the substrate between the substrate detection device and the substrate processing device.

Images