TWI870702B - Pick-up device and electronic component mounting device - Google Patents

Abstract

The present invention provides a pickup device for picking up electronic components and an electronic component mounting device capable of suppressing the influence of generated particles. The picking device of the implementation method includes: a picking chuck for holding and picking up electronic parts; an arm, one end of which is provided with the picking chuck and has a space inside; and a reversing drive part, which has a supporting part and a rotating shaft, and the picking chuck is reversed by rotating the supporting part using the rotating shaft, the supporting part supports the picking chuck, the rotating shaft protrudes from the internal space of the arm through a through hole provided in the arm and is connected to the supporting part, and the picking device is provided with an air suction hole, the air suction hole is connected to the space inside the arm including the rotating shaft and the external space of the arm, and negative pressure is supplied to the position facing the rotating shaft.

Description

Pick-up device and electronic component mounting device

The present invention relates to a pickup device and an installation device for electronic components.

There are two methods for mounting electronic components such as logic, memory, image sensors, etc., which are semiconductor chips, on a substrate: the face-up method and the face-down method. The surface (functional surface) on which a microcircuit is formed in an electronic component is called the front face. The method of mounting the electronic component with the front side facing upward (opposite to the substrate side) is the face-up method. For example, when an electronic component is mounted on a lead frame, etc., and wiring is performed between the electrode and the frame using a wire, it is mounted based on the face-up method.

The method of mounting electronic components with the front side facing downward (substrate side) is called face-down method. For example, in the case of flip chip connection, which is performed by providing bump electrodes on the surface of the semiconductor layer and pressing the bump electrodes against the wiring of the substrate to fix and electrically connect, it is mounted based on the face-down method.

When mounting such electronic components on a substrate, a semiconductor chip (electronic component) is produced by cutting a wafer having semiconductor elements formed thereon into individual pieces. The electronic components are attached to a wafer sheet which is an adhesive sheet. Then, the following operation is performed: the electronic components are picked up one by one from the wafer sheet and transferred to the substrate for mounting. [Prior art literature] [Patent literature]

[Patent Document 1] Japanese Patent Publication No. 2010-129913

[Problem to be solved by the invention] In a mounting device that picks up electronic components one by one from a wafer sheet and transfers them to a substrate for mounting, in a pickup device that picks up electronic components, a pickup chuck that holds the electronic components by suction is positioned to face the electronic components to be picked up, and is moved toward the electronic components, contacts the electronic components and holds them by suction to move them away from the wafer sheet, thereby picking up the electronic components. Thereafter, the picked up electronic components are handed over to a mounting tool, which mounts the electronic components on the substrate. Therefore, the pickup chuck that holds the picked up electronic components moves to a position where the electronic components are handed over to the mounting tool. Dust (hereinafter referred to as particles) is generated from various operating mechanisms of the pickup device that picks up such electronic components and delivers them to the mounting tool.

In particular, in order to perform front-down installation, a reversing mechanism for reversing the functional surface is usually added to the pickup device, so the possibility of particle generation becomes higher. For example, when picking up electronic components from a wafer sheet, particles are generated due to the operation of the reversing mechanism. If such particles adhere to the electronic components before installation, such as the picked-up electronic components or the electronic components attached to the wafer sheet, it will cause adverse effects such as poor installation or poor connection.

The embodiment of the present invention is proposed to solve the above-mentioned problem, and its purpose is to provide a pickup device and an electronic component mounting device that can pick up while suppressing the influence of generated particles.

[Technical means for solving the problem] The pickup device of the embodiment of the present invention includes: a pickup chuck for holding and picking up electronic parts; an arm having the pickup chuck at one end and having a space inside; and a reversing drive part having a support part and a rotating shaft, and reversing the pickup chuck by rotating the support part using the rotating shaft, the support part supports the pickup chuck, the rotating shaft protrudes from the internal space of the arm through a through hole provided in the arm and is connected to the support part, and the pickup device is provided with an air suction hole, the air suction hole is connected to the space inside the arm including the rotating shaft and the external space of the arm, and negative pressure is supplied to the position facing the rotating shaft.

Another embodiment of the present invention provides a picking device including: a picking chuck for holding and picking up electronic components; an arm having the picking chuck disposed at one end and having a space inside; and a reversing drive portion having a supporting portion and a rotating shaft, and reversing the picking chuck by rotating the supporting portion using the rotating shaft, wherein the supporting portion supports the picking chuck, and the rotating shaft protrudes from the internal space of the arm through a through hole disposed in the arm and is connected to the supporting portion, and a pneumatic circuit is disposed in the picking device, and the pneumatic circuit supplies negative pressure to the internal space of the arm.

The electronic component mounting device of the implementation method of the present invention includes: the picking device; a supply part that supplies the electronic components to the picking device; a mounting mechanism that mounts the electronic components on the substrate at the mounting position by a mounting head that holds the electronic components handed over from the picking device; and a substrate supporting mechanism that supports the substrate on which the electronic components are mounted.

[Effect of the invention] The implementation method of the present invention can provide a pickup device for picking up electronic parts and an electronic parts mounting device that can suppress the influence of generated particles.

Hereinafter, the embodiment of the present invention will be described with reference to the accompanying drawings. As shown in FIG. 1 and FIG. 2, the present embodiment is a mounting device 1 for mounting an electronic component C on a substrate S. FIG. 1 is a front view showing a schematic structure of the mounting device 1. FIG. 2 is a plan view showing the electronic component C and the substrate S. In addition, the accompanying drawings are schematic drawings, and the size (hereinafter also referred to as the size), shape, and ratio of the size of each part to each other may be different from the actual.

[Electronic components] First, the electronic components C to be mounted in this embodiment include, for example, semiconductor chips including semiconductor elements such as integrated circuits (ICs) or large-scale integrated circuits (LSIs).

As shown in FIG2 , this embodiment uses a rectangular semiconductor chip as the electronic component C. Each semiconductor chip is a bare chip that is singulated by dicing a semiconductor wafer into small pieces. The bare chip has bumps or bumpless electrodes on the exposed semiconductor, and is mounted by flip-chip connection that is bonded to pads on a substrate S.

A plurality of marks m for positioning are provided on the electronic component C. In the present embodiment, two marks m are provided at each of a pair of diagonal corners of the rectangular electronic component C. The marks m are provided on the surface of the electronic component C where the electrodes are formed, that is, on the front surface. The present embodiment is an example of a device for front-down installation in which the front side is installed toward the substrate S.

[Substrate] In this embodiment, as shown in FIG. 2, the substrate S on which the electronic component C described above is mounted is a plate-shaped member such as a resin having printed wiring or the like, or a silicon substrate having a circuit pattern or the like. The substrate S is provided with a mounting area B, which is an area for mounting the electronic component C, and a plurality of marks M for positioning are provided on the outer side of the mounting area B. In this embodiment, two marks M are provided at positions on the outer side of the mounting area B and at positions corresponding to the marks m of the electronic component C.

[Mounting device] The mounting device 1 of the present embodiment is a mounting device 1 capable of achieving high-precision mounting, for example, mounting accuracy of less than ±0.2 μm, and as shown in FIG. 1 and FIG. 3 (A) and FIG. 3 (B), it includes: a substrate support mechanism 2, a mounting mechanism 3, a first imaging unit 4, a second imaging unit 5, a supply unit 6, a pickup device 7, and a control device 8. FIG. 3 (A) is a plan view of the mounting device 1, and FIG. 3 (B) is a plan view showing a mark M through a mounting head 31 described later.

In addition, in the following description, the axis that the mounting mechanism 3 moves in order to mount the electronic component C on the substrate S is set as the Z axis, and the two axes that are orthogonal to each other in the plane orthogonal to it are set as the X axis and the Y axis. In this embodiment, the Z axis is vertical, the direction that follows gravity is called the bottom, the direction that resists gravity is called the top, and the position on the Z axis is called the height. In addition, the X axis and the Y axis are on the horizontal plane, and when viewed from the front side of Figure 1, the X axis is the left-right direction, and the Y axis is the depth direction. However, the present invention is not limited to the above-mentioned setting direction. Regardless of the setting direction, based on the substrate S or the substrate support mechanism 2, the side on which the electronic component C is mounted is called the upper side, and the opposite side is called the lower side.

The substrate support mechanism 2 is a mechanism for supporting the substrate S on which the electronic component C is mounted, and is a so-called substrate stage. The mounting mechanism 3 is a mechanism for mounting the electronic component C on the substrate S. The mounting mechanism 3 has a mounting head 31. The mounting head 31 has a through portion, and the through portion enables the mark M of the substrate S facing the electronic component C to be recognized through the through portion while the electronic component C is held.

The first photographing unit 4 is arranged below the substrate supporting mechanism 2 at the mounting position OA where the mounting head 31 mounts the electronic component C on the substrate S, and photographs the mark m of the electronic component C held by the mounting head 31 from a position facing the electronic component C, that is, from below, when the substrate S is retracted from the mounting position OA by the substrate supporting mechanism 2. The mounting position OA is a position where the electronic component C is mounted on the substrate S, and is indicated by a line drawn along the Z axis passing through a point (e.g., a center point) on the XY coordinates in the region of the electronic component C to be mounted. As described later, the mounting position OA coincides with the optical axes of the cameras of the first photographing unit 4 and the second photographing unit 5. The second photographing unit 5 is arranged at the mounting position OA above the mounting head 31, and photographs the mark M on the substrate S through the transparent portion of the mounting head 31 (hereinafter referred to as "photographing beyond the mounting head 31"). Based on the image photographed in this way, the mark m and the mark M can be detected, that is, the mark m and the mark M can be identified.

In addition, the substrate support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained from the images of the mark m and the mark M captured by the first imaging unit 4 and the second imaging unit 5. Each part of the mounting device 1 as described above is mounted on a support table 11 installed on the installation surface. The top surface of the support table 11 is a horizontal surface.

The supply section 6 supplies the electronic component C. The pickup device 7 picks up the electronic component C from the supply section 6 and transfers it to the mounting position OA. The pickup device 7 has a pickup chuck 72 and a transfer mechanism 74. The pickup chuck 72 picks up the electronic component C from the supply section 6, reverses it, and hands it over to the mounting head 31. The transfer mechanism 74 moves the pickup chuck 72 to a space formed by the substrate support mechanism 2 retreating the substrate S from the mounting position OA, and positions it at the mounting position OA.

The control device 8 controls the operation of the installation device 1. The control device 8 includes, for example, an electronic circuit or a computer running with a prescribed program. That is, the control device 8 reads programs and data from a storage device by a processing device such as a programmable logic controller (PLC) or a central processing unit (CPU) to execute the control of the installation device 1.

The following is a detailed description of each part of the mounting device 1. (Substrate support mechanism) As shown in FIG. 1 and FIG. 3 (A), the substrate support mechanism 2 is arranged on the support table 11, and has a stage 21 and a drive mechanism 22. The stage 21 is a plate-shaped component on which the substrate S is placed. The drive mechanism 22 is, for example, a double-axis moving mechanism having a guide rail 22a in the X-axis direction and a guide rail 22b in the Y-axis direction, and using a motor (not shown) as a drive source, and using a belt or a ball screw to move the stage 21 in a horizontal plane. The drive mechanism 22 functions as a positioning mechanism for positioning the substrate S. In addition, although not shown in the figure, the drive mechanism 22 includes a θ drive mechanism that causes the stage 21 to rotate and move in a horizontal plane.

The driving mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along a guide rail 22b. A through hole 23a is formed in the moving plate 23 so that the first imaging unit 4 can image the electronic component C.

In addition, although not shown, a loader/unloader for supplying/storing the substrate S to/on the stage 21 is provided at one end (specifically, the right end in the figure) of the moving end of the stage 21 of the substrate supporting mechanism 2 in the X-axis direction. Therefore, the substrate supporting mechanism 2 receives the supply of the substrate S from the loader or delivers the substrate S to the unloader in a state where the stage 21 is moved to the moving end.

(Mounting mechanism) The mounting mechanism 3 has a mounting head 31 and a driving mechanism 32. The mounting head 31 is roughly in the shape of a rectangular parallelepiped, and has a hollow portion 31a as a transmission portion and a holding portion 31b. The hollow portion 31a is a cylindrical through hole formed with the Z-axis direction as an axis. The holding portion 31b is a plate-like component that can transmit light used for shooting, and is installed in a manner to block the opening of the hollow portion 31a toward the substrate S side. For example, a transparent glass plate is used as the holding portion 31b. The holding portion 31b is a so-called mounting tool that holds the electronic component C.

As shown in FIG. 3B , an adsorption area D for adsorbing and holding the electronic component C is provided in the center of the holding portion 31b. Although not shown, an adsorption hole is formed in the adsorption area D. A flow path for connecting the adsorption hole to a negative pressure source is formed inside the holding portion 31b, and a negative pressure is generated in the adsorption hole, thereby enabling the electronic component C to be adsorbed and held. The area around the adsorption area D of the holding portion 31b becomes a transparent area T that allows the mark M of the substrate S to pass through and be photographed even when the electronic component C is adsorbed. That is, the mounting head 31 has a transparent portion so that the mark M of the substrate S can be photographed by the second photographing unit 5. In addition, the holding surface (adsorption surface) of the holding portion 31b that holds the electronic component C is referred to as the lower end surface.

The driving mechanism 32 includes a moving body 33, a moving body 34, and a moving body 35, and is a mechanism for driving the mounting head 31. The moving body 33 is configured to be movable along a guide rail 33a in the Y-axis direction provided on the support table 11. The moving body 34 is configured to be movable along a guide rail 34a in the X-axis direction provided on the top surface of the moving body 33. The moving body 35 is configured to be movable along a guide rail 35a in the Z-axis direction provided on the front surface of the moving body 34. The moving body 35 is formed into a roughly concave shape when viewed from above. These moving bodies 33, 34, and 35 are driven by a ball screw, a linear motor, a cylinder, or the like using a motor as a driving source.

The mounting head 31 is provided at the lower part of the moving body 35 that moves in the Z-axis direction. Therefore, the moving body 35 performs an action for mounting the electronic component C held by the holding portion 31b that holds the mounting head 31 on the substrate S. In addition, the moving body 35 provided with the mounting head 31 moves in the X-axis direction and the Y-axis direction by the movement of the moving bodies 33 and 34. Therefore, the drive mechanism 32 functions as a positioning mechanism for positioning the electronic component C held by the mounting head 31. In addition, although not shown in the figure, the drive mechanism 32 includes a θ drive mechanism that causes the mounting head 31 to rotate and move in a horizontal plane.

Furthermore, in the present embodiment, from the viewpoint of preventing movement errors, it is preferred to set the movement amount of the drive mechanism 32 in the X-axis direction, the Y-axis direction, and the Z-axis direction to be extremely short. For example, the movement amount of the moving body 33 and the moving body 34 in the X-axis direction and the Y-axis direction are set to several mm to several dozen mm, respectively. In addition, the movement amount of the moving body 35 in the Z-axis direction is also set to several mm to several dozen mm. That is, the mounting head 31 receives the electronic component C and photographs the mark m of the received electronic component C at a height position where the lower end face of the holding portion 31b is at a facing interval (separation distance in the vertical direction) of several mm, for example, 1 mm to 2 mm, relative to the upper surface of the substrate S placed on the stage 21. Therefore, the moving amount of the movable body 35 in the Z-axis direction only needs to ensure a moving amount that allows the electronic component C held by the holding portion 31b to be pressed with a predetermined pressure and mounted on the substrate S from at least the height position.

(First photographing unit) The first photographing unit 4 has a camera, a lens, a lens barrel, a light source, etc., which are fixed in a receiving hole 11a provided on the support platform 11. The first photographing unit 4 is configured so that the optical axis of the camera can be photographed in the direction of the mark m of the electronic component C held by the mounting head 31. Specifically, it is configured in a manner that the optical axis becomes a vertical direction. The first photographing unit 4 is fixed relative to the mounting position OA of the electronic component C. In this embodiment, the first photographing unit 4 is located at the lower side of the substrate support mechanism 2, that is, in the receiving hole 11a of the support platform 11, so as to be configured upward so that the optical axis of the camera is consistent with the mounting position OA. The first photographing unit 4 is fixed to the support stand 11 in a size and positional relationship such that the two marks m will not deviate from the photographing field of view even if the electronic component C moves to the maximum extent for positioning. That is, the photographing field of the first photographing unit 4 is set in consideration of the range within which the two marks m of the electronic component C can move to the maximum extent for positioning while the optical axis is aligned and fixed with the mounting position OA.

Here, the term "immobile" means that the first imaging unit 4 (the same applies to the second imaging unit 5 described later) does not move when performing imaging of the mark m and the mark M. For example, the imaging unit 4 and the imaging unit 5 include a driving device for the X-axis and Y-axis directions (horizontal directions) and a driving device for the Z-axis direction (vertical direction), and the imaging unit 4 and the imaging unit 5 are adjusted in the horizontal direction and in the vertical direction as a preparation for the operation of the device by these driving devices, and the imaging unit 4 and the imaging unit 5 do not move during the subsequent operation of the device. Such a structure is included in immobile.

(Second camera unit) The second camera unit 5 has a camera, a lens, a lens barrel, a light source, etc., and is supported and fixed by a frame (not shown) above the support platform 11, more specifically, above the mounting head 31. The second camera unit 5 is configured so that the optical axis of the camera can be photographed in the direction of the mark M around the mounting area B of the substrate S through the holding portion 31b of the mounting head 31. That is, in the present embodiment, the second camera unit 5 is configured downwardly at a position directly above the mounting head 31 so that the optical axis of the camera is aligned with the mounting position OA. Similar to the first camera unit 4, the second camera unit 5 is fixed relative to the mounting position OA of the electronic component C. That is, the photographing field of view of the second photographing unit 5 is set in consideration of the maximum range of movement of the two marks marked on the mounting area B of the substrate S for positioning. Therefore, the size of the transparent part of the mounting head 31 is set in accordance with the photographing field of view of the second photographing unit 5.

(Supply section) The supply section 6 has a support mechanism 61 and a drive mechanism 62. The support mechanism 61 is a device for supporting the chip sheet WS to which the electronic component C is attached. The drive mechanism 62 moves the support mechanism 61 along the X-axis direction and the Y-axis direction. In the supply section 6, the surface (area) on which the electronic component C is mounted is called the mounting surface F. In the present embodiment, the electronic component C is a component obtained by cutting a chip attached to the chip sheet WS and then dividing it into individual pieces. Therefore, the surface of the chip sheet WS to which the electronic component C is attached (the surface of the chip) is the mounting surface F. The chip sheet WS is attached to a chip ring not shown in the figure. The support mechanism 61 has a ring holder (ring holder) 61a for assembling the chip ring. That is, the surface of the support mechanism 61 that supports the wafer sheet WS can also be referred to as the mounting surface F.

Although not shown, a loader/unloader for supplying/storing a wafer ring to the ring support 61a is provided at one end of the moving end in the Y-axis direction of the support mechanism 61 (specifically, the moving end on the front side of the drawing). When the support mechanism 61 moves to the moving end, it receives the supply of the wafer ring from the loader or delivers the wafer ring to the unloader.

Although not shown, the support mechanism 61 includes an expansion mechanism that creates a gap between the electronic components C by extending the wafer sheet WS, and an upward push mechanism that separates the electronic components C by clamping the extended wafer sheet WS and pushing up the electronic components C alone. Furthermore, the support mechanism 61 includes a θ drive mechanism that rotates the ring support 61a in a horizontal plane. In addition, the upward push mechanism is fixedly arranged on the support table 11, and the electronic components C are received from the supply unit 6 by the pickup device 7, that is, picked up, at this position (pickup position).

The drive mechanism 62 moves the support mechanism 61 in a predetermined direction. For example, the drive mechanism 62 is a mechanism that has a guide rail 62a in the X-axis direction and a guide rail 62b in the Y-axis direction, and uses a motor (not shown) as a drive source to move the support mechanism 61 in the X-axis and Y-axis directions in a horizontal plane using a belt or a ball screw. The drive mechanism 62 functions as a positioning mechanism that positions the electronic component C relative to the pickup chuck 72. In addition, the drive mechanism 62 is arranged at a position lower than the height position L of the mounting surface F (refer to FIG. 6 (A) to FIG. 6 (D)).

(Pick-up device) The pick-up device 7 includes an arm 71, a pick-up chuck 72, a reverse drive 73, and a transfer mechanism 74. As shown in FIG. 3 (A) and FIG. 4 (A), the arm 71 has an extension 711, a tube 712, and a base 713. The extension 711 is a member formed in an L-shape by a rectangular parallelepiped member extending in a straight line in the Y-axis direction and a rectangular parallelepiped member extending in a straight line in the X-axis direction toward the mounting mechanism 3. As shown in FIG. 4 (A), the extension 711 is a hollow member having a space inside and is in the shape of a square tube. A first through hole 711a and a second through hole 711b facing the first through hole 711a are provided at the front end of the extension 711. A shaft 730 is provided in a manner that penetrates the first through hole 711a and the second through hole 711b, and the shaft 730 has a rotating shaft 730a that rotates the pickup chuck 72. That is, the rotating shaft 730a exists in the inner space of the extension portion 711. The shaft 730 will be described below.

As shown in FIG. 4 (A) and FIG. 6 (A) to FIG. 6 (D), the tube 712 is a hollow member that allows gas to flow inside. The tube 712 is inserted into the space formed inside the extension portion 711 and is built into the arm portion 71. The so-called built-in means that it is covered by the outer packaging of the arm portion 71 and is not exposed to the outside. The tube 712 forms a ventilation path that is bent in an L shape along the extension portion 711.

The base portion 713 is a plate-like body parallel to the X-axis direction and is fixed to the other end of the extension portion 711 (see FIG. 3 (A)). A not-shown air pressure circuit is connected to the base portion 713 side of the tube 712, and a suction force can be exerted on the extension portion 711 side of the tube 712 through negative pressure.

In addition, the inner space of the extension part 711 is divided into a space including the rotation shaft 730a and a space on the side of the base part 713 by a partition wall 711c. A connecting hole 711d is provided in the partition wall 711c to connect the two spaces, and negative pressure can be supplied from the connecting hole 711d to the space including the rotation shaft 730a. For example, the end of the tube 712 is connected to the connecting hole 711d, and negative pressure is supplied to the space including the rotation shaft 730a through the connecting hole 711d, so that the suction force can be exerted.

The pickup chuck 72 is a component for holding and picking up the electronic component C. The pickup chuck 72 has a suction hole connected to a not-shown air pressure circuit, and sucks the electronic component C at the front end by negative pressure, and releases the electronic component C by releasing the negative pressure or positive pressure. The pickup chuck 72 is provided at the front end of the arm 71.

In this embodiment, a reversing drive unit 73 described later is provided at one end of the extension unit 711 facing the mounting mechanism 3, and the pickup chuck 72 is reversibly provided on the reversing drive unit 73. That is, as shown in FIG. 5 (A) and FIG. 5 (B), the pickup chuck 72 is provided so as to be rotatable between the lower side in the Z-axis direction (the direction of the electronic component C toward the wafer sheet WS) and the upper side in the Z-axis direction (the direction toward the mounting head 31) by the reversing drive unit 73.

As shown in FIG. 4 (A) and FIG. 5 (A) and FIG. 5 (B), the reverse drive portion 73 has a shaft portion 730, a drive source 731, and a support portion 732. The shaft portion 730 includes a rotation shaft 730a extending in the Z-axis direction and a support 730b. The rotation shaft 730a is a component having a space inside and is cylindrical. One end of the rotation shaft 730a protrudes from the internal space of the extension portion 711 through the first through hole 711a and is connected to the support portion 732 described later.

The support 730b is a rod-shaped member that passes through the second through hole 711b provided in the extension portion 711. The other end of the rotation shaft 730a is connected to the drive source 731 described later via the support 730b. A ball bearing is arranged between the second through hole 711b and the support 730b, and the power of the drive source 731 is transmitted to the support 730b, and the rotation shaft 730a rotates, thereby rotating the support portion 732. The axis center O of the rotation shaft 730a is the rotation center of the rotation shaft 730a, and is roughly consistent with the rotation center of the support 730b.

As shown in FIG. 4 (B) and FIG. 4 (C), a first opening portion 730c and a second opening portion 730d are provided on the rotating shaft 730a. The first opening portion 730c is provided on the circumferential surface of the rotating shaft 730a and is open to the inner space of the extension portion 711. The first opening portion 730c is provided to face the base portion 713 side and is an opening obtained by cutting off the circumferential surface with the central angle θ with the axis center O of the rotating shaft 730a as the center. The central angle θ is preferably set to be greater than 180°. Therefore, as described later, when the connecting tube 735a and the cable 734c are inserted into the first opening portion 730c, even if the rotating shaft 730a rotates (reverses) 180°, interference with the connecting tube 735a and the cable 734c can be avoided. In addition, the first opening 730c has a rectangular cross-section when viewed from a direction (X-axis direction) perpendicular to the axial direction (Z-axis direction) of the rotation shaft 730a. The second opening 730d is provided at one end of the rotation shaft 730a, communicates with the first opening 730c, and faces the external space of the extension portion 711.

The driving source 731 is a motor that rotates the rotating shaft 730a via the support 730b, and is provided at one end of the extension portion 711.

The support portion 732 supports the pick-up chuck 72. The support portion 732 has a rotating body 733, a buffer portion 734, and a disassembly portion 735. The rotating body 733 is an L-shaped plate-like component connected to the rotating shaft 730a. The rotating body 733 has a surface parallel to the XZ plane and a surface parallel to the YZ plane. In the surface of the rotating body 733 parallel to the XZ plane, an air intake hole 733a is provided at a position of the second opening portion 730d facing the rotating shaft 730a. The air intake hole 733a is connected to the inside of the rotating shaft 730a through the second opening portion 730d.

As described above, the inner space of the rotating shaft 730a is connected to the inner space of the extension part 711 via the first opening part 730c. In addition, the inner space of the extension part 711 is connected to the suction hole 733a via the first opening part 730c and the second opening part 730d of the rotating shaft 730a. Therefore, the inner space of the extension part 711 and the inner space of the rotating shaft 730a are sucked through the air pressure circuit connected to the tube 712, and the surrounding air can be sucked from the suction hole 733a connected to these spaces. That is, the suction hole 733a is set at the position of the second opening part 730d of the supporting part 732 facing the rotating shaft 730a so that the surrounding air can be sucked by negative pressure. In other words, the air suction hole 733a is connected to the space inside the arm 71 including the rotation shaft 730a and the space outside the arm 71, and negative pressure is supplied to the position facing the rotation shaft 730a (refer to FIG. 4 (A) and FIG. 5 (A), FIG. 5 (B)). In addition, by sucking the internal space of the extension portion 711, the surrounding air can also be sucked from the gap formed between the first through hole 711a and the rotation shaft 730a. That is, the first through hole 711a also functions as an air suction hole, and therefore the air suction hole also includes the first through hole 711a.

The buffer portion 734 applies an appropriate load and absorbs excessive load when the front end of the pickup chuck 72 contacts the electronic component C. The buffer portion 734 has a bracket 734a and a buffer component 734b. The bracket 734a is an L-shaped plate-like component mounted on a surface of the rotating body 733 parallel to the YZ plane. The buffer component 734b only needs to have a buffering function of applying and absorbing load to the pickup chuck 72, and only needs to supply power through a supply line (piping or wiring) connected to the control device 8. For example, when a voice coil motor is used as the buffer member 734b, the cable 734c for supplying electricity as power is connected to the control device 8, inserted into the extension portion 711 from the side of the base portion 713, passed through the extension portion 711, and pulled out from the suction hole 733a through the first opening portion 730c and the second opening portion 730d of the rotating shaft 730a, and connected to the buffer member 734b.

The disassembly portion 735 is a component that is mounted on the drive shaft of the buffer component 734b and is used to disassemble the pickup chuck 72. The disassembly portion 735 of the present embodiment is configured to enable the pickup chuck 72 to be disassembled and assembled by means of a magnet. In addition, the disassembly portion 735 is connected to a pneumatic circuit via a connecting tube 735a, and the pneumatic circuit supplies negative pressure or positive pressure to the suction hole of the pickup chuck 72 as described above. The connecting tube 735a is inserted into the extension portion 711 from the side of the base portion 713, passes through the extension portion 711, is drawn out from the suction hole 733a via the first opening portion 730c and the second opening portion 730d of the rotating shaft 730a, and is connected to the pickup chuck 72 via the disassembly portion 735.

The connecting tube 735a or the cable 734c is inserted from the side of the base portion 713 into the extension portion 711, and passes through the opening 711e provided in the partition wall 711c, thereby connecting to the pickup chuck 72. The diameter of the opening 711e is preferably set to a degree that the opening 711e is substantially filled by inserting the connecting tube 735a or the cable 734c. Thus, it is possible to suppress particles generated in the space including the rotation shaft 730a from passing through the partition wall 711c from the gap of the opening 711e and diffusing to other spaces.

As shown in (A) of Figure 3, the transfer mechanism 74 moves the pickup chuck 72 between the supply portion 6 and the mounting position OA by driving the arm portion 71. The transfer mechanism 74 has a sliding portion SL disposed at a position that does not overlap with the loading surface F when viewed from above. In other words, the sliding portion SL of the transfer mechanism 74 is disposed outside the moving range of the support mechanism 61. The transfer mechanism 74 drives the arm portion 71 as the sliding portion SL slides. The sliding portion SL mentioned here refers to a structural portion in which components move while contacting each other. Such a sliding portion SL becomes a source of particle generation. As shown in (A) to (D) of Figure 6, the sliding portion SL of this embodiment includes a first sliding portion 742b and a second sliding portion 744b described later. The first sliding portion 742b and the second sliding portion 744b are disposed at a position lower than the height position L of the mounting surface F (below).

As shown in FIG. 6 (A) to FIG. 6 (D), the transfer mechanism 74 includes a fixed body 741, a first drive unit 742, a moving body 743, and a second drive unit 744. The fixed body 741 is a rectangular parallelepiped member fixed to the support table 11 (see FIG. 3 (A)) and extending in the X-axis direction. The position of the fixed body 741 is fixed relative to the mounting position OA.

The first drive unit 742 drives the arm unit 71 in the X-axis direction. The first drive unit 742 includes a first drive source 742a and a first slide unit 742b. The first drive source 742a is a linear motor extending in the X-axis direction and is disposed along the upper surface (surface parallel to the XY plane) of the fixed body 741. The first slide unit 742b is a linear guide extending in the X-axis direction and is disposed on the front surface (surface parallel to the XZ plane) of the fixed body 741. In addition, regarding the linear motor, since the mover moves without contacting the stator, the first drive source 742a does not have a slide unit SL.

The moving body 743 is a rectangular block, and is provided with a mover of the first driving source 742a and a sliding member of the first sliding portion 742b, so as to be able to slide and move in the X-axis direction along with the operation of the first driving source 742a.

The second drive unit 744 drives the arm 71 in the Z-axis direction. The second drive unit 744 has a second drive source 744a and a second slide unit 744b. The second drive source 744a is a linear motor extending in the Z-axis direction and is provided on the moving body 743. The second slide unit 744b is a linear guide rail extending in the Z-axis direction and is provided on the moving body 743.

The base portion 713 of the arm portion 71 is provided with a mover having a second drive source 744a and a slider having a second sliding portion 744b, so as to be able to slide and move in the Z-axis direction. In this way, the sliding portion SL of the present embodiment has a first sliding portion 742b and a second sliding portion 744b that slide and move in a straight line along two orthogonal axes. Moreover, the first sliding portion 742b and the second sliding portion 744b are arranged on the two side surfaces facing the front and back surfaces of the common moving body 743 in a positional relationship that overlaps in the height direction. That is, the positions of the two orthogonal axes become close positions. In addition, it is preferred that the distance between the two side surfaces of the moving body 743 is short, that is, the moving body 743 is thin.

(Relationship between the facing distance between the substrate and the mounting head on the carrier and the size of the pickup chuck) In this embodiment, as shown in FIG1, in order to move the pickup chuck 72 to the mounting position OA, the substrate S needs to be retreated, and the facing distance between the substrate S and the mounting head 31 located at the mounting position OA is set. In other words, in order to move the pickup chuck 72 to the mounting position OA, the substrate S needs to be retreated, so the height position of the mounting head 31 when receiving the electronic component C at the mounting position OA is set close to the height position of the upper surface of the substrate S supported by the substrate support mechanism 2. More specifically, the distance h between the height position of the upper surface of the substrate S placed on the stage 21 of the substrate support mechanism 2 at the mounting position OA and the lower end surface of the mounting head 31 when receiving the electronic component C is shorter than the height dimension H of the pickup chuck 72 at the front end of the arm 71 (h＜H). Here, as described above, the distance from the lower end surface of the holding portion 31b to the height position of the upper surface of the substrate S is, for example, several mm.

(Arm size) As shown in Fig. 1, Fig. 3 (A), and Fig. 5 (A), the width w of the member extending in a straight line in the Y-axis direction and the width d of the member extending in a straight line in the X-axis direction of the extension portion 711 of the arm 71 are both longer than the thickness t in the Z-axis direction (w>t, d>t). As a result, the expansion of the height direction of the arm 71 can be suppressed, while ensuring the rigidity of the relatively long arm 71, so that the position of the electronic component C transferred by the pickup chuck 72 is stable. By suppressing the expansion of the height direction of the arm 71, it is unnecessary to raise the receiving position of the mounting head 31.

(Control device) The control device 8 controls the positioning mechanism based on the mark m and mark M photographed by the first photographing unit 4 and the second photographing unit 5 to position the substrate S and the electronic component C. That is, in the control device 8, the position of the mark m of the electronic component C on the XY coordinates and the position of the mark M of the substrate S on the XY coordinates in the design are stored in the storage device as respective reference positions corresponding to the position where the electronic component C should be accurately installed.

The reference position may not be a designed position, but may be the position of the mark m and the mark M when the electronic component C is mounted on the substrate S in advance and is accurately mounted. The control device 8 obtains the offset between the mark m photographed by the first imaging unit 4 and the mark M photographed by the second imaging unit 5 and the reference position, and controls the positioning mechanism (drive mechanism 22 and drive mechanism 32) so that the electronic component C and the substrate S move in the direction and movement amount in which the offset is corrected.

In addition, the control device 8 controls the transfer mechanism 74 of the picking device 7 and the drive mechanism 62 of the supply unit 6 based on the map information indicating the position coordinates of the electronic component C on the wafer sheet WS, thereby positioning the electronic component C to be picked up at the picking position in sequence. In addition, the picking up mentioned here refers to the separation and reception of the electronic component C from the component on which the electronic component C is carried, such as the wafer sheet WS. Furthermore, the control device 8 controls the following operations: suction from the suction hole 733a, holding of the electronic component C by the picking chuck 72, reversal of the picking chuck 72 by the reversing drive unit 73, movement of the picking chuck 72 to the mounting head 31 by the transfer mechanism 74, and delivery of the electronic component C to the mounting head 31.

[Action] The action of the present embodiment described above is explained with reference to the explanatory diagrams of FIG. 3 (A) to FIG. 8 (C) and the flowcharts of FIG. 9 and FIG. 10. In addition, in the initial state, the substrate S is handed over from the loader to the stage 21 of the substrate support mechanism 2, but retreats from the position facing the mounting head 31, that is, the mounting position OA, together with the stage 21.

[Transfer of electronic components] The transfer operation of the electronic component C is explained with reference to the explanatory diagrams of FIG. 3 (A) to FIG. 7 (E) and the flow chart of FIG. 9. The ring support 61a of the support mechanism 61 in the supply unit 6 is equipped with a wafer ring to which a wafer sheet WS is attached by an automatic loader (see FIG. 3 (A) and FIG. 3 (B)). The electronic component C divided into individual pieces by dicing is attached to the wafer sheet WS. In addition, in FIG. 6 (A) to FIG. 6 (D), the illustration is omitted except for the electronic component C to be picked up. In addition, after the operation starts, as shown by the white arrows in Figure 5 (A), Figure 5 (B) and Figure 6 (A) to Figure 6 (D), the negative pressure acts in the tube 712 through the air pressure circuit, thereby sucking the surrounding air from the air intake hole 733a.

First, as shown in FIG6 (A) and FIG3 (A), the support mechanism 61 moves in the X-axis and Y-axis directions to position the electronic component C to be mounted at the pickup position. In addition, by moving the arm 71 in the X-axis direction, the pickup chuck 72 is positioned directly above the electronic component C to be mounted, that is, at the pickup position (step S101).

At this time, the wafer sheet WS is moved in the X-axis and Y-axis directions by the driving mechanism 62 of the supply unit 6. The arm 71 is moved in the X-axis direction by operating the first driving source 742a of the first driving unit 742 to move the moving body 743 along the first sliding unit 742b.

As shown in FIG. 6 (B), the push-up mechanism (not shown) pushes up the electronic component C to be mounted. Then, the pick-up chuck 72 picks up the electronic component C (step S102). That is, the arm 71 and the buffer 734 move in a direction approaching the wafer sheet WS, and after the pick-up chuck 72 adsorbs and holds the electronic component C, it moves in a direction away from the wafer sheet WS, thereby separating the electronic component C from the wafer sheet WS.

The arm 71 is moved in the following manner: the second drive source 744a of the second drive unit 744 is operated, so that the base 713 moves along the second sliding portion 744b. Then, as shown in FIG. 5 (A), FIG. 5 (B), FIG. 6 (C), and FIG. 6 (D), the reversing drive unit 73 rotates the pickup chuck 72 180°, thereby reversing the electronic component C (step S103). At this time, the particles generated by the sliding between the components caused by the rotation are sucked by the suction hole 733a, thereby reducing the adhesion to the electronic component C.

Next, as shown in FIG. 7 (A) and FIG. 7 (B), the arm 71 is moved in the X-axis direction, so that the pickup chuck 72 is positioned at the mounting position OA (step S104). That is, the electronic component C held by the pickup chuck 72 reaches a position in the mounting mechanism 3 that is opposite to the holding portion 31b of the mounting head 31. At this time, the movement of the arm 71 in the X-axis direction is performed in the following manner: the first drive source 742a of the first drive portion 742 is operated, and the moving body 743 is moved along the first sliding portion 742b from the pickup position to the mounting position OA. In addition, at this time, the mounting head 31 is on standby at a height position where the facing interval between the lower end surface of the holding portion 31b and the upper surface of the substrate S is a few mm. In addition, the height position is maintained until the positioning of the electronic component C and the substrate S described later is completed and before the mounting head 31 is driven toward the substrate S.

As shown in FIG. 7 (C), the arm 71 moves toward the direction approaching the holding portion 31b, thereby pressing the electronic component C against the holding portion 31b. As shown in FIG. 7 (D), the holding portion 31b of the mounting head 31 absorbs and holds the electronic component C by negative pressure, thereby receiving the electronic component C (step S105). At the same time, the pickup chuck 72 releases the negative pressure, and the arm 71 moves away from the holding portion 31b, thereby releasing the electronic component C. At this time, the movement of the arm 71 is performed in the following manner: the second drive source 744a of the second drive portion 744 is operated, and the base portion 713 moves along the second sliding portion 744b.

Furthermore, as shown in FIG. 7 (E), the arm 71 moves toward the supply unit 6, thereby the pick-up chuck 72 retreats from directly below the holding unit 31b. The movement of the arm 71 at this time is performed in the following manner: the first drive source 742a of the first drive unit 742 is operated, and the moving body 743 moves along the first sliding portion 742b in the X-axis direction. In addition, the electronic component C is transferred to the holding unit 31b by the pick-up device 7 at the mounting position OA, so during the transfer, the stage 21 is kept in a retreated state to avoid interference with the transfer mechanism 74.

[Installation of electronic components] Next, the installation operation of the electronic component C is described with reference to the explanatory diagrams of FIG. 8 (A) to FIG. 8 (C) and the flowchart of FIG. 10. Here, as shown in FIG. 8 (A), the holding portion 31b of the mounting head 31 holding the electronic component C as described above is located directly below the second imaging unit 5. The first imaging unit 4 photographs the mark m of the electronic component C held by the mounting head 31 (step S201). The control device 8 obtains the positional offset between the position of the mark m photographed by the first imaging unit 4 and the reference position, and positions the electronic component C by operating the drive mechanism 32 to eliminate the offset (step S202).

Next, as shown in FIG8(B), the substrate support mechanism 2 moves the stage 21 so that the mounting area B of the substrate S (the mounting area B where the electronic component C is mounted at this time) reaches a position facing the electronic component C held by the mounting head 31, that is, the center of the mounting area B reaches the mounting position OA (step S203). Furthermore, as shown in FIG3(B), the second camera 5 passes over the mounting head 31 and captures the mark M of the substrate S visible in the transparent area T around the electronic component C (step S204).

The control device 8 obtains the positional deviation between the position of the mark M photographed by the second photographing unit 5 and the reference position, and positions the substrate S by operating the drive mechanism 22 to eliminate the deviation (step S205). Furthermore, as shown in FIG8 (C), the mounting head 31 is driven toward the substrate S by the drive mechanism 32, and the electronic component C held by the mounting head 31 is mounted on the substrate S (step S206).

In this way, by repeating the transfer of the electronic component C from the wafer sheet WS, the delivery of the electronic component C to the mounting head 31, the positioning and mounting of the electronic component C and the substrate S, the electronic component C is sequentially mounted in each mounting area B of the substrate S. The substrate S with a predetermined number of electronic components C mounted thereon is transported by the substrate support mechanism 2 and stored in the unloader.

[Effects] (1) The pickup device 7 of this embodiment includes: a pickup chuck 72 for holding and picking up the electronic component C; an arm 71, one end of which is provided with the pickup chuck 72 and has a space inside; and a reversing drive 73, which has a support portion 732 and a rotating shaft 730a, and the pickup chuck 72 is reversed by rotating the support portion 732 using the rotating shaft 730a, wherein the support portion 732 supports the pickup chuck 72, and the reversing drive 73 has a support portion 732 and a rotating shaft 730a. The rotating shaft 730a protrudes from the inner space of the arm 71 through the through hole (first through hole 711a) provided in the arm 71 and is connected to the support part 732, and the pickup device 7 is provided with an air suction hole 733a, which is connected to the space inside the arm 71 including the rotating shaft 730a and the outer space of the arm 71, and supplies negative pressure to the position facing the rotating shaft 730a.

In addition, the mounting device 1 for the electronic component C of the present embodiment includes: a supply portion 6, which supplies the electronic component C to the picking device 7; a mounting mechanism 3, which mounts the electronic component C on the substrate S at the mounting position OA by a mounting head 31 that holds the electronic component C handed over from the picking device 7; and a substrate supporting mechanism 2, which supports the substrate S on which the electronic component C is mounted.

Therefore, when the pickup chuck 72 is reversed, particles generated by sliding between components can be sucked from the suction hole 733a, and the particles adhering to the electronic component C held by the pickup chuck 72 can be reduced. In addition, the particles falling on the electronic component C attached to the wafer sheet WS can be reduced. That is, the particles adhering to the electronic component C before mounting can be suppressed. Thus, the electronic component C can be picked up while suppressing the influence of the generated particles.

(2) In the picking device 7 of the embodiment, the rotating shaft 730a is a hollow component having a space inside, and has a first opening portion 730c and a second opening portion 730d. The first opening portion 730c faces the internal space of the arm portion 71, and the second opening portion 730d is connected to the first opening portion 730c and faces the external space of the arm portion 71. The suction hole 733a is provided in the support portion 732 at a position facing the second opening portion 730d.

Therefore, the inner space of the arm 71 is connected to the outer space through the first opening 730c and the second opening 730d of the rotating shaft 730a, and the inner space of the arm 71 is sucked, thereby generating negative pressure in the inner space of the rotating shaft 730a and the suction hole 733a. Therefore, when the pickup chuck 72 is reversed, particles are sucked from the position of the rotating shaft 730a of the supporting portion 732 facing the sliding between components, thereby reducing the particles adhering to the surrounding components.

(3) In the pickup device 7 of the present embodiment, the through hole (first through hole 711a) functions as the air suction hole 733a. In the above embodiment, the air suction hole 733a includes the through hole (first through hole 711a) through which the rotation shaft 730a protrudes from the inner space of the arm 71. Therefore, particles near the first through hole 711a through which the rotation shaft 730a protrudes from the inner space of the arm 71 are also sucked into the inside of the arm 71, so that particles generated by the rotation can also be retained to prevent them from leaking out of the arm 71 to the outside.

(4) The pickup device 7 of the present embodiment includes a tube 712, which is built into the arm 71 and supplies negative pressure to the space including the rotation shaft 730a. Therefore, when the pickup chuck 72 is reversed, particles generated in the space including the rotation shaft 730a, particularly in the space where sliding between components occurs, are sucked by the tube 712. In addition, since the tube 712 is built into the arm 71, even if particles are generated from the tube 712 and its interior that are deformed as the arm 71 moves, they can be retained inside the arm 71. Since the particles will not leak out of the arm 71 to the outside, the adhesion of particles to surrounding components can be reduced.

(5) The pickup device 7 of the present embodiment includes a partition wall 711c, which partitions the internal space of the arm 71 into a space including the rotation shaft 730a, and a through hole 711d is provided in the partition wall 711c for sucking the space including the rotation shaft 730a by negative pressure. Therefore, when the pickup chuck 72 is reversed, in particular, the space including the rotation shaft 730a is separated by the partition wall 711c to leave the particles generated in the space and suck them from the through hole 711d. As a result, compared with the case where the entire internal space of the arm portion 71 is sucked, the exhaust volume can be reduced, so particles can be sucked even with a small suction force.

(6) The pickup device 7 of the present embodiment includes a tube 712, which is built into the arm 71 and supplies negative pressure to the space including the rotating shaft 730a, and the tube 712 is connected to the connecting hole 711d of the partition wall 711c. Therefore, when the pickup chuck 72 is reversed, in particular, the space including the rotating shaft 730a is separated by the partition wall 711c to separate the sliding space between the components, and the particles generated in the space can be left behind. Furthermore, the particles remaining in the separated space are sucked by the tube 712. As a result, compared with the case where the entire internal space of the arm 71 is sucked, the exhaust capacity can be reduced, so that particles can be sucked even with a small suction force. In addition, since the tube 712 is placed inside the arm 71, even if particles are generated from the tube 712 and its interior which are deformed as the arm 71 moves, they can remain inside the arm 71. Since the particles will not leak out from the arm 71, the adhesion of particles to surrounding components can be reduced.

(7) In the pickup device 7 of the present embodiment, the connecting tube 735a for supplying negative pressure or positive pressure to the pickup chuck 72 passes through the first opening 730c and the second opening 730d, is drawn out from the suction hole 733a, and is connected to the pickup chuck 72. That is, the connecting tube 735a passes through the inside of the rotating shaft 730a and the suction hole 733a where negative pressure is generated, and is connected to the pickup chuck 72. Therefore, when the pickup chuck 72 is reversed or the arm 71 is moved, particles generated by the sliding of the connecting tube 735a and the suction hole 733a are sucked into the internal space of the arm 71, which can reduce the adhesion of particles to surrounding components.

(8) The pickup chuck 72 of the pickup device 7 of the present embodiment is connected to the buffer member 734b, and the wiring or piping (cable 734c) for supplying power to the buffer member 734b passes through the first opening 730c and the second opening 730d, is drawn out from the air intake hole 733a, and is connected to the buffer member 734b. That is, the cable 734c passes through the inside of the rotating shaft 730a and the air intake hole 733a where negative pressure is generated, and is connected to the buffer member 734b. Therefore, when the pickup chuck 72 is reversed or the arm 71 is moved, the particles generated by the sliding of the cable 734c and the suction hole 733a are sucked into the inner space of the arm 71, which can reduce the adhesion of particles to surrounding components.

(9) In the pickup device 7 of the present embodiment, the first opening 730c of the rotating shaft 730a is an opening obtained by cutting off a circumferential surface with a central angle of 180° or more with the axis center of the rotating shaft 730a as the center. Therefore, when the rotating shaft 730a rotates (reverses) 180°, the connecting tube 735a or the cable 734c passing through the first opening 730c and the second opening 730d of the rotating shaft 730a does not contact the rotating shaft 730a at the periphery of the first opening 730c, and does not cause unnecessary sliding. As a result, it is possible to prevent further generation of particles.

(10) comprises: a pick-up chuck 72 for holding and picking up the electronic component C; an arm 71, one end of which is provided with the pick-up chuck 72 and has a space inside; and a reversing drive portion 73, which has a supporting portion 732 and a rotating shaft 730a, and the pick-up chuck 72 is reversed by rotating the supporting portion 732 using the rotating shaft 730a, the supporting portion 732 supports the pick-up chuck, the rotating shaft 730a protrudes from the internal space of the arm 71 through a through hole provided in the arm 71 and is connected to the supporting portion 732, and a pneumatic circuit is provided, and the pneumatic circuit supplies negative pressure to the internal space of the arm 71.

Therefore, by making the internal pressure of the arm 71 lower than the external pressure (negative pressure), the particles generated inside the arm 71 can be retained inside the arm 71. As a result, even if the arm 71 has gaps such as seams or through holes of the rotation shaft 730a, the particles can be prevented from diffusing to the outside, and the particles can be reduced from adhering to the surrounding components.

(11) includes: a sliding portion SL (742b, 744b) arranged at a position that does not overlap with a mounting surface F on which an electronic component C to be picked up is placed when viewed from above; and a transfer mechanism 74 that drives the arm portion 71 as the sliding portion SL slides, thereby transferring the pickup chuck 72.

In this way, since the sliding portion SL is located at a position that does not overlap with the mounting surface F for the electronic component C when viewed from above, when the arm portion 71 moves with the sliding of the sliding portion SL, particles generated from the sliding portion SL are unlikely to fall onto the mounting surface F, thereby suppressing poor bonding caused by particles adhering to the electronic component C.

(12) The sliding portion SL is provided at a position lower than the height position of the mounting surface F. Therefore, particles generated from the sliding portion SL fall below the mounting surface F and hardly reach the mounting surface F, thereby further suppressing bonding defects.

(13) The sliding portion SL includes a first sliding portion 742b and a second sliding portion 744b which are arranged on opposite side surfaces of the common moving body 743 and slide in a linear manner along two orthogonal axes.

Therefore, the two axes of the first sliding portion 742b and the second sliding portion 744b are arranged at adjacent positions via a common component, which can prevent the position deviation of the pickup chuck 72 from expanding due to the shaking of the first sliding portion 742b and the second sliding portion 744b. Therefore, by setting the sliding portion SL at a position that does not overlap with the mounting surface F when viewed from above, even if the arm portion 71 is long, the electronic component C can be accurately positioned and transferred.

(14) The pickup device 7 includes: a pickup chuck 72 that picks up the electronic component C from the supply unit 6, reverses it, and delivers it to the mounting head 31; and a transfer mechanism 74 that moves the pickup chuck 72 to a space formed by the substrate support mechanism 2 when the substrate S (carrier 21) is retracted from the mounting position OA.

Therefore, the mounting head 31 does not need to move to receive the electronic component C from the transfer mechanism 74, and the position of the electronic component C at the mounting position OA can be fixedly maintained. In addition, the electronic component C can be received at a height position close to the height position of the upper surface of the substrate S, and high mounting accuracy can be obtained. In this way, since the movement amount of the mounting head 31 can be reduced, the amount of particles generated at the mounting position OA can also be reduced.

(15) In order to move the pickup chuck 72 to the mounting position OA, the substrate S needs to be retracted, thereby setting the interval between the substrate S positioned at the mounting position OA and the mounting head 31. Therefore, the position of the mounting head 31 when receiving the electronic component C can be set to a position close to the substrate S when mounting. As a result, after the mounting head 31 receives the electronic component C, the distance that the mounting head 31 moves for mounting can be very short, and the positional deviation caused by the movement of the mounting head 31 can be prevented, thereby improving the mounting accuracy.

(16) The mounting head 31 has a transparent portion, which enables the mark M of the substrate S to be identified through the transparent portion while the electronic component C is held, and the mounting device 1 includes: a first photographing unit 4, which is arranged at a lower side than the substrate supporting mechanism 2 at the mounting position OA, and photographs the mark m of the electronic component C held by the mounting head 31 when the substrate S is retracted from the mounting position OA; a second photographing unit 5, which is arranged at an upper side than the mounting head 31 at the mounting position OA, and photographs the mark M of the substrate S through the transparent portion; and a positioning mechanism, which positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained based on the images of the mark m and the mark M photographed by the first photographing unit 4 and the second photographing unit 5.

According to this implementation method, when the substrate S is retracted from the mounting position OA, the electronic component C held by the mounting head 31 is photographed by the first photographing unit 4 arranged at the mounting position OA at a lower side than the substrate supporting mechanism 2, and the substrate S supported by the substrate supporting mechanism 2 is photographed through the transparent portion of the mounting head 31 by the second photographing unit 5 arranged at the mounting position OA at an upper side than the mounting head 31. Therefore, the mark m of the electronic component C and the mark M of the substrate S can be photographed while being as close to the electronic component C and the substrate S as possible.

Therefore, the movement amount of the electronic component C (mounting head 31) and the substrate S (substrate support mechanism 2) when photographing the mark m and the mark M, and the relative movement amount of the electronic component C (mounting head 31) and the substrate S (substrate support mechanism 2) after photographing the mark m and the mark M can be shortened as much as possible. Therefore, the increase of the error caused by moving the mounting head 31 or the substrate support mechanism 2 for a long distance can be suppressed. In addition, the longer the movement distance of the mechanism, the more particles are generated, but in this embodiment, since the movement distance can be suppressed, it is possible to prevent the cleanliness from being reduced due to particles and the occurrence of poor bonding.

Here, when the mark M is photographed not through the mounting head 31 but by a camera installed adjacent to the mounting head 31, it is actually impossible to achieve the high required accuracy using a high-magnification camera. That is, the area of the substrate S for marking the mark M is only a few millimeters larger than the area for mounting the electronic component C, and the diameter of the mounting head 31 is only a few millimeters larger than the diameter of the area for marking the mark M. Therefore, even if the camera barrel is arranged adjacent to the mounting head 31, multiple marks M will not enter the field of view of the camera, and multiple marks M cannot be photographed simultaneously by the camera.

Therefore, in order to photograph the multiple (two) marks M on the substrate S, it is necessary to move the camera (mounting head 31) by a distance greater than the separation distance of the two marks M. The mounting head 31 is moved, and an error occurs during the movement. That is, after recognizing the mark m of the electronic component C and performing position alignment, the camera must be moved together with the mounting head 31 in order to recognize the mark M of the substrate S. Even if the camera returns to the original position, the position of the electronic component C may be offset.

To address this problem, if the mark M of the substrate S is first identified and aligned, the position of the electronic component C cannot be identified when the substrate S is located at the position to be installed. Therefore, the substrate S must be moved after positioning, resulting in a positional offset of the substrate S.

Furthermore, it is also possible to prepare a template with a mark corresponding to the mark M of the substrate S at a position different from the position to be installed, and perform positioning based on the relative position of the mark of the template and the mark M of the substrate S. However, in this case, each time the electronic component C is installed, the mounting head 31 and the camera must be moved in order to recognize the mark of the template. Therefore, the time required to recognize the mark of the template and the time required for positioning are extra, so productivity is reduced. In addition, the movement distance of the mechanism increases, so the amount of particles generated also increases.

In this embodiment, after the marks m and M are photographed, the moving distances of the electronic components C and the substrate S can be suppressed, so that any of positional deviation, reduction in productivity, and the amount of particle generation can be suppressed.

(17) The transparent portion has a transparent plate-like member. Therefore, in a narrow area corresponding to the size of the tiny electronic component C, it is possible to hold the electronic component C and secure the transparent shooting of the mark M on the substrate S.

(18) The first imaging unit 4 and the second imaging unit 5 are fixedly arranged relative to the mounting position OA. Therefore, the imaging area of the first imaging unit 4 and the imaging area of the second imaging unit 5 do not shift, and the generation of particles due to movement can be prevented.

[Variations] (1) The opening 711e of the extension 711 in the arm 71 may be a common component with the through hole 711d for supplying negative pressure, i.e., performing suction, or may be a different component. When the opening 711e and the through hole 711d are made common, for example, as shown in FIG. 11 , the connecting tube 735a or the cable 734c is inserted into the tube 712, passes through the tube 712 and comes out of the through hole 711d, and is then drawn out from the suction hole 733a and connected to the pickup chuck 72. In this way, if the connecting tube 735a or the cable 734c passes through the tube 712, when the pickup chuck 72 is reversed or the arm 71 moves, the particles generated by the sliding of the connecting tube 735a, the air suction hole 733a and the tube 712 will remain inside the tube 712. Therefore, even if the arm 71 has a seam, the particles can be prevented from diffusing to the outside of the arm 71, and the particles can be reduced from adhering to the surrounding components.

(2) The tube 712 may not be provided. In the above case, the inner space of the extension portion 711 is replaced by the tube 712, and negative pressure is supplied to the inner space of the extension portion 711 through the air pressure circuit provided on the side of the base portion 713, so that the suction force can be exerted. For example, the air pressure circuit provided on the side of the base portion 713 supplies negative pressure from the space on the side of the base portion 713 through the connecting hole 711d to the space including the rotation shaft 730a, so that the suction force can be exerted.

(3) A fluid cylinder may be used as the buffer member 734b. In this case, it is sufficient to connect a pipe for supplying a fluid (gas or liquid) serving as power to the buffer member 734b. Alternatively, an elastic member such as a spring or rubber may be used as the buffer member 734b. In this case, a supply line corresponding to the cable 734c for supplying power may be omitted.

(4) The position of the air intake hole 733a only needs to be the position of the rotation axis facing the support part 732 (rotating body 733). Therefore, it is not necessary to make the rotation axis and the center of the air intake hole 733a concentric, and it can be near the rotation axis. Even if the support part 732 rotates, as long as the air intake hole 733a, the connecting tube 735a, and the cable 734c rotate without changing the relative position while maintaining contact with the air intake hole 733a, the generation of particles caused by sliding in the contact part can be suppressed.

(5) The pickup chuck 72 may also be arranged to be rotatable in a direction parallel to the XY plane, that is, in a direction (θ direction) parallel to the top surface of the electronic component C (the surface of the wafer sheet WS). In the above case, the cable for supplying power to the motor for rotating the pickup chuck 72 in the θ direction is configured to pass through the tube 712 and be drawn out from the air intake hole 733a, and connected to the motor. Thus, when the pickup chuck 72 is reversed or the arm 71 is moved, particles generated by the sliding of the cable, the air intake hole 733a, and the tube 712 will not leak out to the outside of the arm 71, and thus will not affect the surroundings.

(6) The supply unit 6 is not limited to a device for supplying electronic components C attached to the wafer sheet WS. For example, it may be a device for supplying electronic components C arranged on a tray. In addition, the structure of the transfer mechanism 74 only needs to be able to pick up and transfer electronic components C individually from the supply unit 6. Therefore, it may be a structure in which the arm 71 moves in the X-axis and Y-axis directions, or it may be a structure in which the support mechanism 61 moves in the X-axis and Y-axis directions.

(7) In the transfer mechanism 74, the driving portion of the drive arm portion 71 is not limited to a mechanism using a linear motor as a driving source. It may also be a mechanism using a ball screw or a belt using an axially rotating motor as a driving source. In the case of such a mechanism, a sliding portion SL is included, and therefore it is preferably disposed at a position that does not overlap with the support surface F when viewed from above. Furthermore, it is preferred to dispose the sliding portion SL at a position lower than the height position of the support surface F. In addition, when there are multiple sliding portions SL, a portion of the sliding portions SL may not be disposed at a position that does not overlap with the support surface F when viewed from above. In addition, a portion of the sliding portion SL may not be disposed at a position lower than the height position of the support surface F. In this case, it is preferred to provide a shielding object such as an outer package, a wall, or other structural parts between the sliding part SL and the mounting surface F. In addition, it is preferred to extend the distance between the sliding part SL and the mounting surface F.

(8) The mounting head 31 only needs to be configured so that the second imaging unit 5 can image the mark M on the substrate S. Therefore, even if the transparent portion of the mounting head 31 is not formed of a transparent material, a through hole may be formed at a location corresponding to the mark M. More specifically, the holding portion 31b may be formed of an opaque component and a through hole may be formed at a location corresponding to the mark M, or the hollow portion 31a may not exist, and the holding portion 31b may be formed of an opaque component and a through hole may be formed at a location corresponding to the mark M of the mounting head 31 and the holding portion 31b. That is, such a through hole is also the transparent portion of the mounting head 31.

(9) The first camera unit 4 and the second camera unit 5 may be configured to be movable relative to the position (mounting position OA) where the electronic component C is to be mounted. That is, when it is not possible to photograph a plurality of marks m of the electronic component C or a plurality of marks M of the substrate S in batches, the first camera unit 4 and the second camera unit 5 may be configured to move between the marks m or between the marks M for photographing. That is, a moving device for moving between the marks M may be provided in the first camera unit 4, or a moving device for moving between the marks M may be provided in the second camera unit 5. In the above case, the moving distance is short and stays within the size range of the mounting area B of the electronic component C or the substrate S, so that the generation of errors or particles can be suppressed.

(10) Although the position of the mark m of the electronic component C and the position of the mark M of the mounting area B of the substrate S are aligned with the reference position, the present invention is not limited to this, and the position of the mounting area B may be aligned with the position of the electronic component C, or the position of the electronic component C may be aligned with the position of the mounting area B. In short, as long as the position of the mounting area B of the substrate S and the position of the electronic component C can be aligned.

(11) The substrate S may be delivered to the stage 21 of the substrate support mechanism 2 at the mounting position OA. In this case, after the substrate S is supplied to the stage 21 and before the mark m of the electronic component C is imaged by the first imaging unit 4, the substrate S may be retracted from the mounting position OA.

[Other embodiments] The embodiments and variations of the present invention are described above, but the embodiments and variations of the present invention are provided as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. These embodiments and their variations are included in the scope and spirit of the invention, and are included in the invention described in the claims.

1: Mounting device 2: Substrate support mechanism 3: Mounting mechanism 4: First shooting section 5: Second shooting section 6: Supply section 7: Pick-up device 8: Control device 11: Support platform 11a: Receiving hole 21: Carrier 22: Driving mechanism 22a, 22b, 33a, 34a, 35a, 62a, 62b: Guide rail 23: Moving plate 23a: Through hole 31: Mounting head 31a: Hollow section 31b: Holding section 32: Driving mechanism 33, 34, 35: Moving body 61: Support mechanism 61a: Ring bracket 62: Driving mechanism 71: arm part 711: extension part 711a: first through hole 711b: second through hole 711c: partition wall 711d: connecting hole 711e: opening 712: tube 713: base part 72: pick-up chuck 73: reverse drive part 730: shaft part 730a: rotation shaft 730b: support 730c: first opening part 730d: second opening part 731: drive source 732: support part 733: rotating body 733a: suction hole 734: buffer part 734a: bracket 734b: buffer member 734c: Cable 735: Disassembly section 735a: Connection tube 74: Transfer mechanism 741: Fixed body 742: First drive section 742a: First drive source 742b: First slide section 743: Moving body 744: Second drive section 744a: Second drive source 744b: Second slide section B: Mounting area C: Electronic components d, w: Width D: Adsorption area F: Loading surface h: Interval H: Dimension L: Height position of the loading surface m, M: Mark OA: Mounting position O: Axis center S: Substrate SL: Slide section S101~S105, S201~S206: Steps t: Thickness T: Transmitted area X, Y, Z: Coordinate axes WS: Wafer sheet θ: Center angle

FIG. 1 is a front view showing a schematic structure of a mounting device according to an embodiment. FIG. 2 is a plan view showing an electronic component and a substrate. FIG. 3 (A) is a plan view of the mounting device, and FIG. 3 (B) is an enlarged plan view of the mounting portion. FIG. 4 (A) is a partial cross-sectional plan view showing an arm and a reversing drive portion, FIG. 4 (B) is a three-dimensional view of a rotating shaft, and FIG. 4 (C) is a cross-sectional view of a rotating shaft. FIG. 5 (A) and FIG. 5 (B) are enlarged views showing the reversing action of the electronic component, the left side is a front view, and the right side is a plan view. FIG. 6 (A) to FIG. 6 (D) are explanatory views showing the picking action of the electronic component. FIG. 7 (A) to FIG. 7 (E) are explanatory views showing the handover action of the electronic component. FIG8 (A) to FIG8 (C) are explanatory diagrams showing the installation action of the installation device. FIG9 is a flow chart showing the process of picking up and delivering electronic components. FIG10 is a flow chart showing the installation process of electronic components. FIG11 is a partial cross-sectional plan view showing a modified example of the arm.

71: Arms

711: Extension

711a: first through hole

711b: Second through hole

711c: Isolation wall

711d: Connecting hole

711e: Open mouth

712: tube

72: Pick up the chuck

73: Reverse drive unit

730: shaft

730a: Rotation axis

730b: Pillar

730c: first opening

730d: Second opening

731: Driving source

732: Support part

733: Rotating body

733a: Air intake hole

734: Buffer Department

734a: Bracket

734b: Buffer component

734c: Cable

735a:Connecting pipe

C: Electronic parts

Claims (12)

A pickup device includes: a pickup chuck for holding and picking up electronic parts; an arm having the pickup chuck at one end and having a space inside; and a reversing drive having a support part and a rotating shaft, and reversing the pickup chuck by rotating the support part using the rotating shaft, the support part supports the pickup chuck, the rotating shaft protrudes from the internal space of the arm through a through hole provided in the arm and is connected to the support part, and the pickup device is provided with an air suction hole, the air suction hole is connected to the space inside the arm including the rotating shaft and the external space of the arm, and negative pressure is supplied to the position facing the rotating shaft. The picking device as described in claim 1, wherein the rotating shaft is a hollow component having a space inside, having a first opening and a second opening, the first opening facing the inner space of the arm, the second opening communicating with the first opening and facing the outer space of the arm, and the air suction hole is arranged in the support part at a position facing the second opening. A pickup device as described in claim 1 or 2, wherein the through hole functions as the suction hole. The picking device as described in claim 1 or 2 includes a tube which is placed inside the arm and supplies negative pressure to the space including the rotating shaft. The pickup device as described in claim 1 or 2 includes a partition wall, which divides the internal space of the arm into a space including the rotating shaft, and a connecting hole for supplying negative pressure to the space including the rotating shaft is provided in the partition wall. The pickup device as described in claim 3 includes a separation wall, which separates the internal space of the arm into a space including the rotating shaft, and a connecting hole for supplying negative pressure to the space including the rotating shaft is provided in the separation wall. The pickup device as described in claim 5 includes a tube, which is placed inside the arm and supplies negative pressure to the space including the rotating shaft, and the tube is connected to the connecting hole. A pickup device as described in claim 2, wherein a connecting pipe for supplying negative pressure or positive pressure to the pickup chuck passes through the first opening and the second opening, is drawn out from the air suction hole and connected to the pickup chuck. As described in claim 2, the picking device, wherein the picking clamp is connected to the buffer member, and the cable for supplying power to the buffer member passes through the first opening and the second opening, is drawn out from the air suction hole and connected to the buffer member. A picking device as described in claim 8 or 9, wherein the first opening is an opening obtained by cutting off a circumferential surface with a central angle of more than 180° with the axis center of the rotating shaft as the center. A pickup device includes: a pickup chuck for holding and picking up electronic parts; an arm having the pickup chuck at one end and having a space inside; and a reversing drive having a support part and a rotating shaft, and reversing the pickup chuck by rotating the support part using the rotating shaft, the support part supports the pickup chuck, the rotating shaft protrudes from the internal space of the arm through a through hole provided in the arm and is connected to the support part, and the pickup device is provided with an air pressure circuit, and the air pressure circuit supplies negative pressure to the internal space of the arm. An electronic component mounting device, comprising: a pickup device as described in any one of claims 1 to 11; a supply unit that supplies the electronic component to the pickup device; a mounting mechanism that mounts the electronic component on a substrate at a mounting position by a mounting head that holds the electronic component delivered from the pickup device; and a substrate support mechanism that supports the substrate on which the electronic component is mounted.