TWI870004B - Improving the non-contact light probe for measuring back-drilled hole profile depth - Google Patents

Abstract

A non-contact optical probe for measuring the depth of a back-drilled hole profile comprises: a fixing device, which is equipped with at least one plate, a reflection fixture is provided below the plate, the plate includes at least one first drill hole, the fixing device is connected to a first moving module; at least one optical probe body is provided above the fixing device; and a computer is electrically connected to the optical probe body and the first moving module, the computer starts the The optical probe body emits a light beam smaller than the radius of the first drill hole, and the light beam irradiates the plate. At the same time, the computer controls the first power source to drive the fixing device to move, so that the first drill hole passes under the optical probe body. The first drill hole is continuously irradiated by the light beam. The computer records the light beam entering and leaving the first drill hole and the plurality of first reflection points of the reflection fixture, and generates a first drill hole depth plane map according to each first reflection point.

Description

Improving the non-contact light probe for measuring back-drilled hole profile depth

The present invention relates to a circuit board back drilling hole detection device, in particular to a non-contact optical probe capable of measuring the thickness, drilling depth and eccentricity of a PCB board and measuring the contour depth of a back drilling hole.

The existing manufacturing method of circuit boards uses the copper surface of the circuit board as a reference to unify the depth of the drill when performing back drilling operations. It does not take into account the impact of the thickness difference between circuit boards or the poor thickness uniformity on the processing accuracy of the back drilling depth. Therefore, when the thickness difference between circuit boards is large or the thickness uniformity is poor, the processing accuracy of the back drilling depth will increase with the depth of the back drilling hole, and eccentricity and tilt may also occur.

The conventional back-drilling inspection method is a destructive inspection method, which randomly samples the circuit board and then inspects whether each back-drilled hole meets the requirements. However, the destructive inspection is time-consuming and can only be observed from a specific angle, which is the biggest disadvantage of the conventional inspection method. Therefore, there is still a need for improvement.

In view of this, the inventor has accumulated many years of research and practical experience in related fields and uses the present invention to improve the deficiencies of the above-mentioned prior art.

The main purpose of the present invention is to provide a non-contact optical probe for measuring the profile depth of a back drill hole, which comprises: a fixing device connected to a first moving module, the first moving module comprising a first power source, the fixing device is provided with a reflection fixture, the top surface of the reflection fixture is provided with at least one plate body, the plate body comprising at least one first drill hole; at least one optical probe body, which is arranged above the fixing device; and a computer, which is electrically connected to the optical probe body and the first moving module, the computer comprising an input The output unit is used to activate the optical probe body with the computer to emit a light beam, the diameter of the light beam is smaller than the radius of the first drill hole, and the light beam irradiates the plate body. At the same time, the computer controls the first power source to drive the fixing device to move, so that the first drill hole passes under the optical probe body. The first drill hole is continuously irradiated by the light beam. The computer records the light beam entering, leaving, and plural first reflection points of the first drill hole and the reflection fixture, and generates a first drill hole depth plane map according to each of the first reflection points, and the output unit outputs the first drill hole depth plane map.

The plate body further has at least one second drill hole, and there is a predetermined distance between the second drill hole and the first drill hole. When the first drill hole passes under the optical probe body, the computer controls the first power source to drive the fixing device to move, so that the second drill hole passes under the optical probe body. The second drill hole is continuously irradiated by the light beam. The computer records a plurality of second reflection points from the light beam entering to leaving the second drill hole and the reflection fixture, and generates a second drill hole depth plane map according to each second reflection point, and the output unit outputs the second drill hole depth plane map.

The plate body includes at least one first through hole and at least one second through hole, the first drilled hole and the second drilled hole are respectively drilled in the first through hole and the second through hole, so that the first drilled hole and the second drilled hole overlap with the first through hole and the second through hole respectively, and the diameters of the first drilled hole and the second drilled hole are respectively larger than the first through hole and the second through hole; the depth of the first drilled hole is equal to the depth of the second through hole. The thickness of the plate, the depth of the first drill hole and the second drill hole, the eccentricity between the first drill hole and the first through hole, and the eccentricity between the second drill hole and the second through hole are checked by the plan view and the second drill hole depth plan view; the eccentricity is the distance between the center of the first through hole and the center of the first drill hole, and the distance between the center of the second through hole and the center of the second drill hole.

The first reflection points and the second reflection points are the positions where the light beam irradiates the surface of the plate, is blocked inside the first drill hole and the second drill hole, and reflects the light beam back to the optical probe body. The computer records and calculates the position and distance of the first reflection points and the position and distance of the second reflection points, and connects the first reflection points and the second reflection points to form the first drill hole depth plane diagram and the second drill hole depth plane diagram.

The computer further includes an input unit, and the coordinates of the first drilling hole and the second drilling hole and the moving route of the first moving module are input by the input unit.

The coordinates are the center of the first drill hole and the center of the second drill hole. When the first moving module moves the plate, the moving route is the diameter of the first drill hole and the second drill hole, so that the first drill hole and the second drill hole pass under the optical probe body.

A non-contact optical probe for measuring the depth of a back-drilled hole profile comprises: a fixing device, the top surface of which is provided with at least one plate, a reflection fixture is provided below the plate, and the plate includes at least one first drill hole; at least one optical probe body, which is detachably arranged on a second moving module, the second moving module includes a second power source, and the second moving module is located above the fixing device; and a computer, which is electrically connected to the optical probe body and the first moving module, and the computer includes an output unit, with the The computer activates the optical probe body to emit a light beam, the diameter of which is smaller than the radius of the first drill hole. The light beam irradiates the plate body, and the computer controls the second power source to drive the optical probe body to move, so that the optical probe body passes over the first drill hole. The first drill hole is continuously irradiated by the light beam. The computer records the light beam entering, leaving, and plural first reflection points of the first drill hole and the reflection fixture, and generates a first drill hole depth plane map according to each of the first reflection points, and the output unit outputs the first drill hole depth plane map.

The plate body further has at least one second drill hole, and there is a predetermined distance between the second drill hole and the first drill hole. When the optical probe body passes over the first drill hole, the computer controls the second power source to drive the optical probe body to move, so that the optical probe body passes over the second drill hole. The second drill hole is continuously irradiated by the light beam. The computer records the light beam entering, leaving, and plural second reflection points of the second drill hole and the reflection fixture, and generates a second drill hole depth plane map according to each second reflection point, and the output unit outputs the second drill hole depth plane map.

The plate body includes at least one first through hole and at least one second through hole, the first drilled hole and the second drilled hole are respectively drilled in the first through hole and the second through hole, so that the first drilled hole and the second drilled hole overlap with the first through hole and the second through hole respectively, and the diameters of the first drilled hole and the second drilled hole are respectively larger than the first through hole and the second through hole; the depth of the first drilled hole is equal to the depth of the second through hole. The thickness of the plate, the depth of the first drill hole and the second drill hole, the eccentricity between the first drill hole and the first through hole, and the eccentricity between the second drill hole and the second through hole are checked by the plan view and the second drill hole depth plan view; the eccentricity is the distance between the center of the first through hole and the center of the first drill hole, and the distance between the center of the second through hole and the center of the second drill hole.

The first reflection points and the second reflection points are the positions where the light beam irradiates the surface of the plate, is blocked inside the first drill hole and the second drill hole, and reflects the light beam back to the optical probe body. The computer records and calculates the position and distance of the first reflection points and the position and distance of the second reflection points, and connects the first reflection points and the second reflection points to form the first drill hole depth plane diagram and the second drill hole depth plane diagram.

The computer further includes an input unit, and the coordinates of the first drilling hole and the second drilling hole and the moving route of the second moving module are input by the input unit.

The coordinates are the center of the first drill hole and the center of the second drill hole. When the second moving module moves the optical probe body, the moving route is the diameter of the first drill hole and the second drill hole, so that the optical probe body passes over the first drill hole and the second drill hole.

To facilitate the description of the content and the effects that can be achieved by the present invention, please refer to the first to third figures, which are the first embodiment of the present invention for improving the non-contact light probe for measuring the profile depth of the back drill hole, including:

A fixing device 10 is connected to a first moving module 11, the first moving module includes a first power source 12, the fixing device 10 is provided with a reflection fixture 101, the top surface of the reflection fixture 101 is provided with a mounting clamp for at least one plate A, the plate A includes at least one first drill hole A1, wherein the plate has a predetermined thickness.

At least one optical probe body 20 is disposed above the fixing device 10 .

Please refer to the first and third figures, a computer 30 is electrically connected to the optical probe body 20 and the first power source 12 of the first moving module 11, and the computer 30 includes an output unit 31, and the output unit 31 includes a display and a printer.

Referring to the fourth and fifth figures, the use of the present invention is to activate the optical probe body 20 with the computer 30 to emit a light beam 21, the diameter of the light beam 21 is smaller than the radius of the first drilling hole A1 (but not limited to this), the light beam 21 irradiates the plate A, and at the same time the computer 30 controls the first power source 12 to drive the fixing device 10 to move, so that the first drilling hole A1 passes through the optical probe body. 20, please refer to Figures 5 to 7, the first drill hole A1 is continuously irradiated by the light beam 21, the computer 30 records the light beam 21 entering and leaving the first drill hole A1 and the plurality of first reflection points 211 of the reflection fixture 101, and generates a first drill hole depth plane map 40 according to each of the first reflection points 211, and the output unit 31 outputs the first drill hole depth plane map 40.

Please refer to the second and eighth figures, the plate A further has at least one second drill hole A2, and there is a predetermined distance between the second drill hole A2 and the first drill hole A1. When the first drill hole A1 passes under the optical probe body 20, the computer 30 controls the first power source 12 to drive the fixing device 10 to move, so that the second drill hole A2 passes under the optical probe body 20. The second drill hole A2 is continuously irradiated by the light beam 21. The computer 30 records the plurality of second reflection points 212 from the light beam 21 entering to leaving the second drill hole A2 and the reflection fixture 101, and generates a second drill hole depth plane map 50 according to each second reflection point 212, and the second drill hole depth plane map 50 is output by the output unit 31.

In short, the present invention can quickly detect multiple drill holes through the setting of the computer 30, and after the detection, each plate A is still in a complete state, which overcomes the disadvantage of the conventional technology that requires destructive detection.

Please refer to the second figure. For details, please refer to the plate body A including at least one first through hole B1 and at least one second through hole B2. The first drilled hole A1 and the second drilled hole A2 are drilled in the first through hole B1 and the second through hole B2, respectively, so that the first drilled hole A1 and the second drilled hole A2 overlap with the first through hole B1 and the second through hole B2, respectively, and the diameters of the first drilled hole A1 and the second drilled hole A2 are respectively larger than the first through hole B1 and the second through hole B2.

Please refer to Figures 5 to 8. Each of the first reflection points 211 and each of the second reflection points 212 are positions where the light beam irradiates the surface of the plate A, the inside of the first drill hole A1 and the inside of the second drill hole A2 are blocked and reflected back to the light probe body 20. The computer 30 records and calculates the position and distance of each of the first reflection points 211 and the position and distance of each of the second reflection points 212, and connects each of the first reflection points 211 and each of the second reflection points 212 to form the first drill hole depth plane diagram 40 and the second drill hole depth plane diagram 50.

Please refer to Figures 7 and 8. The thickness of the plate A, the depth of the first drill hole A1 and the second drill hole A2, the eccentricity between the first drill hole A1 and the first through hole B1, and the eccentricity between the second drill hole A2 and the second through hole B2 are inspected by the first drill hole depth plan view 40 and the second drill hole depth plan view 50. The eccentricity is the distance between the center of the first through hole B1 and the center of the first drill hole A1, and the distance between the center of the second through hole B2 and the center of the second drill hole A2.

The cause of eccentricity is that the drill needle does not correspond to the center of the through hole during drilling, or the drill needle deviates during drilling. In practice, eccentricity is almost impossible to identify with the naked eye. Therefore, the present invention can easily analyze the first drill hole A1 and the second drill hole A2 through the first drill hole depth plane diagram 40 and the second drill hole depth plane diagram 50.

Therefore, in the second and ninth figures of the present invention, the second drill hole A2 and the second through hole B2 are intentionally drawn into an eccentric shape, thereby demonstrating the function of the present invention to detect eccentricity.

Please refer to Figure 10. Since the plate A has the predetermined thickness, if the reflection fixture 101 is not used, the light beam 21 cannot be detected, resulting in the first drilling depth plane diagram 40 and the second drilling depth plane diagram 50 output by the computer 30 being unable to fully present the graphics of the first through hole B1 and the second through hole B2. Therefore, it is necessary to use the reflection fixture 101 to reflect the light beam 21.

Please refer to FIG. 3 and FIG. 11 , the computer 30 further includes an input unit 32 , and the coordinates of the first drilling hole A1 and the second drilling hole A2 and the moving route of the first moving module 11 are inputted by the input unit 32 .

The coordinates are the center of the first drill hole A1 and the center of the second drill hole A2. When the first moving module 11 moves the plate A, the moving route is the diameter of the first drill hole A1 and the second drill hole A2, so that the first drill hole A1 and the second drill hole A2 pass under the optical probe body 20.

Please refer to FIG. 12 , which is a second embodiment of the present invention. Since the main structure of this embodiment is the same as the above-mentioned embodiment, the same parts will not be described in detail and will be described first.

In the present embodiment, the optical probe body 20 is detachably mounted on a second moving module 22. The second moving module 22 is electrically connected to the computer 30 and includes a second power source 221. The second moving module 22 is located above the fixing device 10. Therefore, when the computer 30 inputs the coordinates and moving routes of the first drilling hole A1 and the second drilling hole A2, the optical probe body 20 is driven by the second power source 221 to move, while the fixing device 10 remains stationary. In this way, the light beam 21 can pass through the first drilling hole A1 and the second drilling hole A2, and the computer 30 outputs the first drilling hole depth plan view 40 and each of the second drilling hole depth plan views 50.

However, the above is only a preferred embodiment of the present invention and should not be used to limit the scope of the present invention. Any changes and modifications that are obviously possible for people skilled in the art should be considered as not deviating from the essential content of the present invention.

10: Fixing device 101: Reflection fixture 11: First moving module 12: First power source 20: Light probe body 21: Light beam 211: First reflection point 212: Second reflection point 22: Second moving module 221: Second power source 30: Computer 31: Output unit 32: Input unit 40: First drilling depth plan 50: Second drilling depth plan A: Plate A1: First drilling hole A2: Second drilling hole B1: First through hole B2: Second through hole

The first figure is a schematic diagram of the structure of the present invention. The second figure is a side view of the plate of the present invention. The third figure is a schematic diagram of the computer architecture of the present invention. The fourth figure is a schematic diagram of the use status of the present invention. The fifth figure is a schematic diagram of the first drill hole being irradiated by a light beam, which is a continuation of the fourth figure. The sixth figure is a schematic diagram of the computer operation of the present invention. The seventh figure is a depth plan view of the first drill hole and the second drill hole of the present invention. The eighth figure is an enlarged depth plan view of the first drill hole, which is a continuation of the sixth figure. The ninth figure is a schematic diagram of the second drill hole being irradiated by a light beam, which is a continuation of the fourth figure. The tenth figure is a depth plan view of the first drill hole and the second drill hole of the present invention without using a reflection fixture. The eleventh figure is a schematic diagram of the computer setting movement route of the present invention. The twelfth figure is a structural schematic diagram of another embodiment of the present invention.

without

10:Fixed device

101: Reflection fixture

21: Beam

211: First reflection point

A: Board

A1: First drilling hole

B1: First through hole

Claims (6)

A non-contact optical probe for measuring the depth of a back-drilled hole profile comprises: a fixing device connected to a first moving module, the first moving module comprising a first power source, the fixing device being provided with a reflection fixture, the top surface of the reflection fixture being provided with at least one plate body, the plate body comprising at least one first drill hole, a second drill hole, a first through hole and at least one second through hole, the second drill hole and the first drill hole having a predetermined distance therebetween, the first drill hole and the second drill hole being respectively drilled in the first through hole and the second through hole, so that the first drill hole and the second drill hole The first through hole and the second through hole are overlapped with each other, and the diameters of the first drill hole and the second drill hole are respectively larger than the first through hole and the second through hole; at least one optical probe body is arranged above the fixing device; and a computer is electrically connected to the optical probe body and the first moving module, and the computer includes an output unit, and the computer is used to activate the optical probe body to emit a light beam, the diameter of which is smaller than the radius of the first drill hole, and the light beam irradiates the plate body, and at the same time, the computer controls the first power source to drive the fixing device to move, so that the first drill hole passes through the optical probe body. The first drill hole is continuously irradiated by the light beam below the optical probe body, the computer records the light beam entering, leaving, and a plurality of first reflection points of the first drill hole and the reflection fixture, and generates a first drill hole depth plane diagram according to each of the first reflection points, and the output unit outputs the first drill hole depth plane diagram; after the first drill hole passes below the optical probe body, the computer controls the first power source to drive the fixing device to move, so that the second drill hole passes below the optical probe body, the second drill hole is continuously irradiated by the light beam, and the computer records the light beam entering, leaving, and a plurality of first reflection points of the first drill hole and the reflection fixture, and generates a first drill hole depth plane diagram according to each of the first reflection points, and the output unit outputs the first drill hole depth plane diagram; after the first drill hole passes below the optical probe body, the computer controls the first power source to drive the fixing device to move, so that the second drill hole passes below the optical probe body, the second drill hole is continuously irradiated by the light beam, and the computer records the light beam entering, leaving, and a plurality of first reflection points of the first drill hole and the reflection fixture, and generates a first drill hole depth plane diagram according to each of the first reflection points, and the output unit outputs the first drill hole depth plane diagram; The plurality of second reflection points of the projection fixture are detected, and a second drilling depth plane diagram is generated according to each of the second reflection points, and the second drilling depth plane diagram is output by the output unit; the thickness of the plate, the depth of the first drilling hole and the second drilling hole, the eccentricity between the first drilling hole and the first through hole, and the eccentricity between the second drilling hole and the second through hole are inspected by the first drilling depth plane diagram and the second drilling depth plane diagram; the eccentricity is the distance between the center of the first through hole and the center of the first drilling hole, and the distance between the center of the second through hole and the center of the second drilling hole. As described in claim 1, the non-contact optical probe for measuring the back-drilling hole profile depth is provided, wherein each of the first reflection points and each of the second reflection points are the positions where the light beam irradiates the surface of the plate, the interior of the first drill hole and the interior of the second drill hole are blocked and the light beam is reflected back to the optical probe body, the computer records and calculates the position and distance of each of the first reflection points and the position and distance of each of the second reflection points, and connects each of the first reflection points and each of the second reflection points to form the first drill hole depth plane diagram and the second drill hole depth plane diagram. As described in claim 1, the non-contact optical probe for measuring the back drill hole profile depth is provided, wherein the computer further includes an input unit, and the coordinates of the first drill hole and the second drill hole and the moving path of the first moving module are inputted by the input unit. As described in claim 3, the non-contact optical probe for measuring the depth of the back drill hole profile is lifted, wherein the coordinates are the center of the first drill hole and the center of the second drill hole, and when the first moving module moves the plate, the moving route is the diameter of the first drill hole and the second drill hole, so that the first drill hole and the second drill hole pass under the optical probe body. A non-contact optical probe for measuring the profile depth of a back drill hole comprises: a fixing device, which is provided with a reflection fixture, the top surface of the reflection fixture is provided with at least one plate body, the plate body includes at least one first drill hole, at least one second drill hole, at least one first through hole and at least one second through hole, and the second drill hole and the first drill hole have a predetermined distance; the first drill hole and the second drill hole are respectively drilled in the first through hole and the second through hole. a second through hole, so that the first drill hole and the second drill hole overlap with the first through hole and the second through hole respectively, and the diameters of the first drill hole and the second drill hole are respectively larger than the first through hole and the second through hole; at least one optical probe body, which is detachably arranged on a second moving module, the second moving module includes a second power source, and the second moving module is located above the fixing device; and a computer, which is connected to the optical probe body and the first

The two moving modules are electrically connected, and the computer includes an output unit. The computer is used to activate the optical probe body to emit a light beam, the diameter of which is smaller than the radius of the first drill hole. The light beam irradiates the plate body, and the computer controls the second power source to drive the optical probe body to move, so that the optical probe body passes over the first drill hole. The first drill hole is continuously irradiated by the light beam. The computer records the light beam entering and leaving the first drill hole and the plurality of first reflection points of the reflection fixture, and generates a first drill hole depth plane map according to each of the first reflection points, and the output unit outputs the first drill hole depth plane map. When the optical probe body passes over the first drill hole, the computer controls the second power source to drive the optical probe body to move, so that The optical probe body passes over the second drill hole, and the second drill hole is continuously irradiated by the light beam. The computer records the light beam entering and leaving the second drill hole and the plurality of second reflection points of the reflection fixture, and generates a second drill hole depth plane map according to each of the second reflection points, and the output unit outputs the second drill hole depth plane map; the thickness of the plate, the depth of the first drill hole and the second drill hole, the eccentricity between the first drill hole and the first through hole, and the eccentricity between the second drill hole and the second through hole are inspected by the first drill hole depth plane map and the second drill hole depth plane map; the eccentricity is the distance between the center of the first through hole and the center of the first drill hole, and the distance between the center of the second through hole and the center of the second drill hole. As described in claim 5, the non-contact optical probe for measuring the depth of the back-drilled hole profile, wherein each of the first reflection points and each of the second reflection points are positions where the light beam irradiates the surface of the plate, the interior of the first drill hole and the interior of the second drill hole are blocked and the light beam is reflected back to the optical probe body, the computer records and calculates the position and distance of each of the first reflection points and the position and distance of each of the second reflection points, and connects each of the first reflection points and each of the second reflection points to form the The computer further includes an input unit, which inputs the coordinates of the first drill hole and the second drill hole and the moving path of the second moving module; the coordinates are the center of the first drill hole and the center of the second drill hole, and when the second moving module moves the optical probe body, the moving path is the diameter of the first drill hole and the second drill hole, so that the optical probe body passes over the first drill hole and the second drill hole.

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