TWI868725B - Non-volatile memory and program method thereof - Google Patents
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Description
本發明是有關於一種非揮發性記憶體以及程式化方法。 The present invention relates to a non-volatile memory and a programming method.
近年來,移動式的電子設備,例如平板電腦、筆記型電腦、智能手機以及固態驅動器,開始採用反及式(NAND)快閃記憶體作為其主要數據儲存媒介。因此,低成本以及高密度的反及式快閃記憶體的需求一直在快速增長。為了克服快閃記憶胞尺寸縮小的問題,各種類型的三維堆疊式電荷捕捉層的快閃記憶胞被提出。 In recent years, mobile electronic devices, such as tablets, laptops, smartphones, and solid-state drives, have begun to use NAND flash memory as their main data storage medium. Therefore, the demand for low-cost and high-density NAND flash memory has been growing rapidly. In order to overcome the problem of flash memory cell size reduction, various types of flash memory cells with three-dimensional stacked charge trapping layers have been proposed.
然而,隨著記憶胞中的間距減小,記憶胞間的電荷的橫向移動造成的資料保留度嚴重的降低。而在記憶胞中設置更多的層次也會導致更高的電阻並引起過驅動問題。 However, as the spacing in the memory cell decreases, the lateral movement of charge between the memory cells causes a serious degradation in data retention. And setting more layers in the memory cell will also lead to higher resistance and cause overdrive problems.
本發明提供一種非揮發性記憶體以及程式化方法。 The present invention provides a non-volatile memory and a programming method.
本發明的程式化方法包括:針對第N條字元線的多個第 一記憶胞進行讀取動作,並判斷第一記憶胞的等效臨界電壓是否大於預設閾值來產生判斷結果,其中N為大於1的正整數;以及,當針對第N+1條字元線的多個第二記憶胞進行程式化動作時,根據判斷結果以決定是否調整多個程式化驗證電壓中的至少一選中程式化驗證電壓一偏移值。 The programming method of the present invention includes: performing a reading operation on a plurality of first memory cells of the Nth word line, and determining whether the equivalent critical voltage of the first memory cell is greater than a preset threshold value to generate a determination result, wherein N is a positive integer greater than 1; and, when performing a programming operation on a plurality of second memory cells of the N+1th word line, determining whether to adjust at least one selected programming verification voltage among a plurality of programming verification voltages by an offset value according to the determination result.
本發明的非揮發性記憶體包括記憶胞陣列以及控制器。記憶胞陣列具有多個記憶胞串,各記憶胞串耦接多條字元線。控制器耦接該憶胞陣列,用以:針對第N條字元線的多個第一記憶胞進行讀取動作,並判斷第一記憶胞的等效臨界電壓是否大於預設閾值來產生判斷結果,其中N為大於1的正整數;以及,當針對第N+1條字元線的多個第二記憶胞進行程式化動作時,根據判斷結果以決定是否調整多個程式化驗證電壓中的至少一選中程式化驗證電壓一偏移值。 The non-volatile memory of the present invention includes a memory cell array and a controller. The memory cell array has a plurality of memory cell strings, each of which is coupled to a plurality of word lines. The controller is coupled to the memory cell array to: perform a read operation on a plurality of first memory cells of the Nth word line, and determine whether the equivalent critical voltage of the first memory cell is greater than a preset threshold value to generate a determination result, wherein N is a positive integer greater than 1; and, when performing a programming operation on a plurality of second memory cells of the N+1th word line, determine whether to adjust at least one selected programming verification voltage among a plurality of programming verification voltages by an offset value according to the determination result.
基於上述,本發明的非揮發性記憶體,在進行目前字元線的記憶胞的程式化動作時,可讀取前一字元線的記憶胞的臨界電壓的狀態。再根據前一字元線的記憶胞的等效臨界電壓來決定是否針對目前字元線的記憶胞的程式化動作中的程式化驗證電壓進行調整。透過上述的程式化驗證電壓的調整動作,可改善非揮發性記憶體在程式化動作中所產生的過驅動(over drive)現象。並且,當記憶胞中的儲存資料發生衰減時,可使記憶胞的臨界電壓分布更為集中,有效改善其資料保存度(data retention)。 Based on the above, the non-volatile memory of the present invention can read the critical voltage state of the memory cell of the previous word line when performing the programming operation of the memory cell of the current word line. Then, it is determined whether to adjust the programming verification voltage in the programming operation of the memory cell of the current word line according to the equivalent critical voltage of the memory cell of the previous word line. Through the above-mentioned adjustment operation of the programming verification voltage, the overdrive phenomenon generated by the non-volatile memory during the programming operation can be improved. Furthermore, when the stored data in the memory cell decays, the critical voltage distribution of the memory cell can be made more concentrated, effectively improving its data retention.
310~370、360’、370’、460’、470’:記憶胞 310~370, 360’, 370’, 460’, 470’: memory cells
510、520:曲線 510, 520: curve
600:非揮發性記憶體 600: Non-volatile memory
610:記憶胞陣列 610: Memory cell array
620:控制器 620: Controller
630:感測放大器 630: Sense amplifier
700:記憶胞串 700: memory cell string
A、B、C、D、E、F、G、PV:程式化驗證電壓 A, B, C, D, E, F, G, PV: programmed verification voltage
CH:柱狀通道結構 CH: Columnar channel structure
CL:通道層 CL: Channel layer
CTL:電荷捕捉層 CTL: Charge Trapping Layer
D1、D2:方向 D1, D2: Direction
DC:介電核心 DC: Dielectric Core
DV:偏移電壓 DV: offset voltage
F’、G’、PVL:調整後程式化驗證電壓 F’, G’, PVL: Programming verification voltage after adjustment
ID0:程式化驗證電流 ID0: programmed verification current
ID1:調整後程式化驗證電流 ID1: Programming verification current after adjustment
S110、S120、S210~S252:步驟 S110, S120, S210~S252: Steps
SC1、SC2:參考電流 SC1, SC2: reference current
VPASSR:通過電壓 VPASSR: Pass voltage
WL1~WLm、WLn+1、WLn:字元線 WL1~WLm, WLn+1, WLn: character line
圖1繪示本發明一實施例的非揮發性記憶體的程式化方法的流程圖。 FIG1 is a flow chart showing a method for programming a non-volatile memory according to an embodiment of the present invention.
圖2繪示本發明另一實施例的非揮發性記憶體的程式化方法的流程圖。 FIG2 is a flow chart showing a method for programming a non-volatile memory according to another embodiment of the present invention.
圖3繪示本發明一實施例的非揮發性記憶體的程式化動作的示意圖。 FIG3 is a schematic diagram showing the programming action of the non-volatile memory of an embodiment of the present invention.
圖4A以及圖4B繪示本發明實施例的分揮發性記憶體在程式化動作後,記憶胞的分布狀態的示意圖。 Figures 4A and 4B are schematic diagrams showing the distribution of memory cells in the volatile memory of the embodiment of the present invention after programming.
圖5繪示本發明實施例中,非揮發性記憶體執行程式化驗證電壓的調整動作的示意圖。 FIG5 is a schematic diagram showing the adjustment action of the non-volatile memory program verification voltage in an embodiment of the present invention.
圖6繪示本發明一實施例的非揮發性記憶體的示意圖。 FIG6 is a schematic diagram of a non-volatile memory according to an embodiment of the present invention.
圖7繪示本發明實施例的非揮發性記憶體中的記憶胞串的示意圖。 FIG7 is a schematic diagram of a memory cell string in a non-volatile memory according to an embodiment of the present invention.
請參照圖1,圖1繪示本發明一實施例的非揮發性記憶體的程式化方法的流程圖。在步驟S110中,針對已完成程式化動作的第N條字元線的多個記憶胞進行讀取動作,並判斷第N條字元線的多個記憶胞的等效臨界電壓是否大於一預設閾值來產生判斷結果。其中,第N條字元線的多個記憶胞可已分別被程式化以對 應不同的邏輯值。在針對第N+1條字元線進行程式或動作時,則可針對第N條字元線的多個記憶胞進行讀取動作,並藉此獲得第N條字元線的多個記憶胞的等效臨界電壓。其中N為大於1的正整數。 Please refer to FIG. 1, which shows a flow chart of a programming method for a non-volatile memory according to an embodiment of the present invention. In step S110, a read operation is performed on a plurality of memory cells of the Nth word line that have completed the programming operation, and a judgment result is generated by judging whether the equivalent critical voltage of the plurality of memory cells of the Nth word line is greater than a preset threshold. The plurality of memory cells of the Nth word line may have been programmed to correspond to different logical values. When a program or operation is performed on the N+1th word line, a read operation may be performed on the plurality of memory cells of the Nth word line, and the equivalent critical voltage of the plurality of memory cells of the Nth word line is obtained. Where N is a positive integer greater than 1.
在細節上,非揮發性記憶體的控制器可對應上述的預設閾值來設定一參考電流。並且,控制器可針對第N條字元線上的多個記憶胞進行讀取動作,並藉以獲得讀取電流。非揮發性記憶體的感測放大器則可根據比較參考電流以及讀取電流來產生比較結果。如此一來,控制器可根據比較結果來判斷出第N條字元線上的等效臨界電壓的狀態。 In detail, the controller of the non-volatile memory can set a reference current corresponding to the above-mentioned preset threshold. In addition, the controller can read multiple memory cells on the Nth word line to obtain the read current. The sense amplifier of the non-volatile memory can generate a comparison result based on the comparison of the reference current and the read current. In this way, the controller can determine the state of the equivalent critical voltage on the Nth word line based on the comparison result.
具體來說明,當上述的比較結果指示讀取電流小於參考電流時,表示第N條字元線上的多個記憶胞的等效臨界電壓大於預設閥值。也就是說,第N條字元線上的多個記憶胞具有對高的等效臨界電壓(為高臨界電壓狀態)。相對的,當上述的比較結果指示讀取電流不小於參考電流時,表示第N條字元線上的多個記憶胞的等效臨界電壓不大於預設閥值。也就是說,第N條字元線上的多個記憶胞具有對低的等效臨界電壓(為低臨界電壓狀態)。 Specifically, when the above comparison result indicates that the read current is less than the reference current, it means that the equivalent critical voltage of multiple memory cells on the Nth word line is greater than the preset threshold value. In other words, multiple memory cells on the Nth word line have an equivalent critical voltage for high (in a high critical voltage state). Conversely, when the above comparison result indicates that the read current is not less than the reference current, it means that the equivalent critical voltage of multiple memory cells on the Nth word line is not greater than the preset threshold value. In other words, multiple memory cells on the Nth word line have an equivalent critical voltage for low (in a low critical voltage state).
在步驟S120中,在當針對第N+1條字元線的多個記憶胞進行程式化動作時,可根據步驟S110中所產生的判斷結果來決定是否調整多個程式化驗證電壓中的至少一選中程式化驗證電壓一個偏移值[S252]。在細節上,當針對第N+1條字元線的多個記憶胞進行程式化動作時,可設定分別對應多個邏輯值的多個程式化 驗證電壓。並且,當步驟S110中所獲得的比較結果指示第N條字元線的記憶胞的等效臨界電壓大於預設閾值時,非揮發性記憶體的控制器可設定程式化驗證電壓中的一個或是多個,以作為選中程式化驗證電壓,並使對應第N+1條字元線的至少一選中程式化驗證電壓被調降一個偏移值。 In step S120, when programming is performed on a plurality of memory cells of the N+1th word line, it is possible to determine whether to adjust an offset value of at least one selected programming verification voltage among a plurality of programming verification voltages according to the judgment result generated in step S110 [S252]. In detail, when programming is performed on a plurality of memory cells of the N+1th word line, a plurality of programming verification voltages corresponding to a plurality of logic values may be set. Furthermore, when the comparison result obtained in step S110 indicates that the equivalent critical voltage of the memory cell of the Nth word line is greater than the preset threshold, the controller of the non-volatile memory can set one or more of the programming verification voltages as the selected programming verification voltage, and at least one selected programming verification voltage corresponding to the N+1th word line is reduced by an offset value.
接著,控制器可根據調整後的程式化驗證電壓來針對第N+1條字元線的記憶胞進行程式化動作以及程式化驗證動作。 Then, the controller can perform programming and programming verification actions on the memory cells of the N+1th word line according to the adjusted programming verification voltage.
相對的,若步驟S110中所獲得的比較結果指示第N條字元線的記憶胞的等效臨界電壓不大於預設閾值時,非揮發性記憶體的控制器則不針對所設定的所有的程式化驗證電壓進行調整,並針對第N+1條字元線的記憶胞進行程式化動作以及程式化驗證動作。 In contrast, if the comparison result obtained in step S110 indicates that the equivalent critical voltage of the memory cell of the Nth word line is not greater than the preset threshold, the controller of the non-volatile memory does not adjust all the set programming verification voltages, and performs programming and programming verification actions on the memory cell of the N+1th word line.
在本實施例中,非揮發記憶體的程式化動作,可根據先前字元線的記憶胞的臨界電壓狀態,來調降目前字元線的記憶胞的程式化驗證動作的程式化驗證電壓。如此一來,未被選中字元線上的記憶胞發生驅動電流不足的現象可以被避免。並且,透過對應相鄰字元線記憶胞的臨界電壓的狀態所設定的程式化驗證電壓,也可有效改善其資料保存度,提升儲存資料的正確性。 In this embodiment, the programming action of the non-volatile memory can reduce the programming verification voltage of the programming verification action of the memory cells of the current word line according to the critical voltage state of the memory cells of the previous word line. In this way, the phenomenon of insufficient driving current of the memory cells on the unselected word line can be avoided. In addition, the programming verification voltage set by the critical voltage state of the memory cells of the corresponding adjacent word line can also effectively improve its data retention and enhance the accuracy of the stored data.
以下請參照圖2,圖2繪示本發明另一實施例的非揮發性記憶體的程式化方法的流程圖。在本實施例中,非揮發性記憶體可以為反及式快閃記憶體。在步驟S210中,啟動針對第N+1條的字元線WLn+1的程式化動作。以下請同步參照圖3繪示的本發明
一實施例的非揮發性記憶體的程式化動作的示意圖。其中,在第N+1條的字元線WLn+1的程式化動作中,分別對應多個邏輯值的多個程式化驗證電壓A、B、C、D、E、F、G被設定,其中程式化驗證電壓A<B<C<D<E<F<G。在步驟S220中,先針對第N+1條的字元線WLn+1的部分記憶胞執行程式化驗證動作,並判斷記憶胞310、320、330、340是否分別通過程式化驗證電壓A、B、C、D。若記憶胞310、320、330、340分別通過程式化驗證電壓A、B、C、D的程式化驗證動作,則可執行步驟S230。相對的,若記憶胞310、320、330、340未通過程式化驗證電壓A、B、C、D,則可重新執行記憶胞310、320、330、340的程式化動作以及程式化驗證動作。
Please refer to FIG. 2 below, which is a flow chart of a programming method for a non-volatile memory according to another embodiment of the present invention. In this embodiment, the non-volatile memory may be an anti-integrated flash memory. In step S210, a programming action for the N+1th word
在步驟S230中,則可針對第N條的字元線WLn的記憶胞進行讀取動作,並藉以判斷第N條的字元線WLn的記憶胞的等效臨界電壓。關於第N條的字元線WLn的記憶胞的等效臨界電壓,可透過針對字元線WLn的所有記憶胞進行讀取動作以獲得讀取電流,並使讀取電流與預先設定的參考電流進行比較來判斷出第N條的字元線WLn是為高臨界電壓狀態或是低臨界電壓狀態。 In step S230, a read operation can be performed on the memory cells of the Nth word line WLn to determine the equivalent critical voltage of the memory cells of the Nth word line WLn. Regarding the equivalent critical voltage of the memory cells of the Nth word line WLn, a read operation can be performed on all memory cells of the word line WLn to obtain a read current, and the read current can be compared with a preset reference current to determine whether the Nth word line WLn is in a high critical voltage state or a low critical voltage state.
在步驟S240中,則判斷字元線WLn的等效臨界電壓是否為高臨界電壓狀態。在當字元線WLn是為高臨界電壓狀態時,則執行步驟S252。相對的,在當字元線WLn是為低臨界電壓狀態時,則執行步驟S251。 In step S240, it is determined whether the equivalent critical voltage of the word line WLn is in a high critical voltage state. When the word line WLn is in a high critical voltage state, step S252 is executed. Conversely, when the word line WLn is in a low critical voltage state, step S251 is executed.
在步驟S251中,控制器可維持程式化驗證電壓E、F、G
的值不改變。在步驟S252中,控制器則選擇程式化驗證電壓F、G以作為選中程式化驗證電壓,並針對程式化驗證電壓F、G進行調整,透過調降程式化驗證電壓F、G一個偏移值DV來分別產生調整後程式化驗證電壓F’、G’。接著,控制器可根據程式化驗證電壓E來進行記憶胞350的程式化動作以及程式化驗證動作,根據調整後程式化驗證電壓F’來進行記憶胞360’的程式化動作以及程式化驗證動作,並根據調整後程式化驗證電壓G’來進行記憶胞370’的程式化動作以及程式化驗證動作。
In step S251, the controller can maintain the values of the programming verification voltages E, F, and G unchanged. In step S252, the controller selects the programming verification voltages F and G as the selected programming verification voltages, and adjusts the programming verification voltages F and G by reducing the programming verification voltages F and G by an offset value DV to generate adjusted programming verification voltages F' and G' respectively. Then, the controller can perform programming and verification actions of
值得注意的,透過針對程式化驗證電壓的調整動作,記憶胞360’的臨界電壓的電壓值,相較於針對未調整的程式化驗證電壓F所進行的程式化動作後,記憶胞360的臨界電壓的電壓值為低。
It is worth noting that, through the adjustment operation for the programming verification voltage, the voltage value of the critical voltage of the memory cell 360' is lower than the voltage value of the critical voltage of the
在此請注意,基於非揮發性記憶體中的快取空間的尺寸的限制,在步驟S220中先使字元線WLn+1中的部分記憶胞(例如記憶胞310、320、330以及340)完成程式化驗證動作。為了執行字元線WLn的記憶胞的等效臨界電壓的讀取動作,需要有一定尺寸的快取空間。因此,透過步驟S220中先使字元線WLn+1中的部分記憶胞完成程式化驗證動作,可釋放出足夠尺寸的快取空間,以提供執行字元線WLn的記憶胞的等效臨界電壓的讀取動作。
Please note that due to the limitation of the size of the cache space in the non-volatile memory, in step S220, some memory cells in word line WLn+1 (e.g.,
因此,步驟S220中,先行完成程式化驗證動作的字元線WLn+1中的部分記憶胞的數量,可對應非揮發性記憶體中的快取空間的尺寸的大小來設定。具體來說,當非揮發性記憶體中的快 取空間的尺寸足夠大時,步驟S220中控制器可在對應程式化驗證電壓A的程式化驗證動作完成後,即執行步驟S230。或者,步驟S220中控制器可在對應程式化驗證電壓A、B的程式化驗證動作完成後,或在對應程式化驗證電壓A、B、C的程式化驗證動作完成後,才執行步驟S230。當非揮發性記憶體中的快取空間的尺寸不足夠大時,步驟S220中,控制器也可在對應程式化驗證電壓A、B、C、D、E的程式化動作完成後,才執行步驟S230。 Therefore, in step S220, the number of partial memory cells in word line WLn+1 that complete the programming verification action first can be set to correspond to the size of the cache space in the non-volatile memory. Specifically, when the size of the cache space in the non-volatile memory is large enough, the controller in step S220 can execute step S230 after the programming verification action corresponding to programming verification voltage A is completed. Alternatively, in step S220, the controller can execute step S230 after the programming verification action corresponding to programming verification voltages A and B is completed, or after the programming verification action corresponding to programming verification voltages A, B, and C is completed. When the size of the cache space in the non-volatile memory is not large enough, in step S220, the controller may also execute step S230 only after the programming actions corresponding to the programming verification voltages A, B, C, D, and E are completed.
此外,在步驟S252中,選擇調整的程式化驗證電壓的數量是可以改變的。設計者可以僅選擇最高的程式化驗證電壓G以進行調整,或者可以選擇程式化驗證電壓G、F以進行調整,或者也可以選擇更多的程式化驗證電壓G、F、E(或者更多)以進行調整,沒有一定的限制。設計者可根據,程式化驗證電壓A~G的分布範圍以即可調整的空間來決定程式化驗證電壓的調整數量。 In addition, in step S252, the number of programming verification voltages selected for adjustment can be changed. The designer can select only the highest programming verification voltage G for adjustment, or can select programming verification voltages G and F for adjustment, or can select more programming verification voltages G, F, E (or more) for adjustment, without any restrictions. The designer can determine the number of programming verification voltage adjustments based on the distribution range of programming verification voltages A~G and the adjustable space.
關於偏移電壓DV的大小,可根據非揮發性記憶體中,記憶胞因相鄰字元線的記憶胞中的電荷的吸引所造成的資料衰減度來進行設定。上述的資料衰減度可透過針對實際的非揮發性記憶體來進行測試來獲得。 The size of the offset voltage DV can be set according to the data attenuation caused by the charge attraction in the memory cell of the adjacent word line in the non-volatile memory. The above data attenuation can be obtained by testing the actual non-volatile memory.
在此請注意,當第N條字元線WLn的記憶胞為高臨界電壓狀態時,表示字元線WLn的記憶胞對第N+1條字元線WLn+1的記憶胞所能產生的影響較低。在這樣的條件下,本發明實施例中的非揮發性記憶體控制器先行調低第N+1條字元線WLn+1的記憶胞,在程式化動作中的部分的程式化驗證電壓。在當其餘字元
線中的記憶胞因受鄰近字元線的記憶胞的影響而產生資料衰減現象時,則恰好可與第N+1條字元線WLn+1中,調整後的記憶胞的分布範圍相重疊,有效改善資料保存度的問題。
Please note that when the memory cells of the Nth word line WLn are in a high critical voltage state, the memory cells of the word line WLn have a lower impact on the memory cells of the N+1th word
以下請參照圖4A以及圖4B,圖4A以及圖4B繪示本發明實施例的分揮發性記憶體在程式化動作後,記憶胞的分布狀態的示意圖。由圖4A可以清楚發現,透過分別調降程式化驗證電壓F、G為F’、G’,可以使記憶胞460’以及470’的臨界電壓的分布往低電壓的方向移動,並使記憶胞470’的最大臨界電壓與通過電壓VPASSR的間距被增大。也就是說,透過本發明的程式化動作,可降低字元線WLn+1中的記憶胞所形成的記憶胞串的等效電阻值,並可改善程式化動作中記憶胞的過驅動動作。
Please refer to FIG. 4A and FIG. 4B below, which are schematic diagrams showing the distribution state of the memory cells of the volatile memory of the embodiment of the present invention after the programming action. It can be clearly seen from FIG. 4A that by respectively reducing the programming verification voltages F and G to F' and G', the distribution of the critical voltages of the memory cells 460' and 470' can be moved toward the low voltage direction, and the distance between the maximum critical voltage of the memory cell 470' and the pass voltage VPASSR can be increased. In other words, through the programming action of the present invention, the equivalent resistance value of the memory cell string formed by the memory cells in the word
在圖4B中,在發生資料衰減後,調整後的記憶胞460’、470’的臨界電壓分布範圍,恰可與發生衰減後的記憶胞的臨界電壓分布範圍相重疊,並形成具有相對高凝聚度的記憶胞460、470的臨界電壓分布範圍。有效提升非揮發性記憶體的資料保存度。
In FIG. 4B , after data attenuation occurs, the critical voltage distribution range of the adjusted memory cells 460' and 470' can overlap with the critical voltage distribution range of the memory cells after attenuation occurs, and form a critical voltage distribution range of the
附帶一提的,在圖3、圖4A以及圖4B中的曲線,其縱軸皆為記憶胞的數量。 By the way, the vertical axes of the curves in Figure 3, Figure 4A, and Figure 4B are all the number of memory cells.
以下請參照圖5,圖5繪示本發明實施例中,非揮發性記憶體執行程式化驗證電壓的調整動作的示意圖。在圖5中,在記憶胞執行程式化動作的過程中,電流ID-電壓VG關係曲線可根據例如由曲線510往曲線520的方向來進行移動。
Please refer to FIG. 5 below, which is a schematic diagram of the adjustment action of the non-volatile memory execution programming verification voltage in an embodiment of the present invention. In FIG. 5, during the process of the memory cell executing the programming action, the current ID-voltage VG relationship curve can move according to the direction of, for example,
當要針對記憶胞的程式化驗證動作的程式化驗證電壓進 行調整時,可能要針對記憶胞的字元線電壓進行調整。如此一來,會因為需重新針對字元線進行放電以及重新充電的動作而耗費多餘的時間。 When adjusting the programming verification voltage for the programming verification action of the memory cell, it may be necessary to adjust the word line voltage of the memory cell. In this case, it will take extra time because of the need to discharge and recharge the word line again.
基於上述,根據本發明實施例,當程式化驗證電壓PV須調整為調整後程式化驗證電壓PVL時(其中調整後程式化驗證電壓PVL與原始的程式化驗證電壓PV具有一偏移值DV),控制器可使記憶胞的字元線電壓維持為程式化驗證電壓PV,並使記憶胞的電流與參考電流SC1進行比較以執行程式化驗證動作,此時記憶胞的特性曲線為曲線510,參考電流SC1可對應曲線510以及程式化驗證電壓PV來進行設定。
Based on the above, according to the embodiment of the present invention, when the programming verification voltage PV needs to be adjusted to the adjusted programming verification voltage PVL (wherein the adjusted programming verification voltage PVL and the original programming verification voltage PV have an offset value DV), the controller can maintain the word line voltage of the memory cell at the programming verification voltage PV, and compare the current of the memory cell with the reference current SC1 to perform the programming verification action. At this time, the characteristic curve of the memory cell is
在這樣的條件下,上述的程式化驗證動作可等效於根據調整後程式化驗證電壓PVL以及參考電流SC2所進行的程式化驗證動作。其中,參考電流SC2根據曲線520以及程式化驗證電壓PV來決定。也就是說,在本實施例中,在不調整記憶胞的字元線電壓的情況下,可有效完成調整後程式化驗證電壓PVL的程式化驗證動作,並提升程式化驗證動作的工作速率。
Under such conditions, the above-mentioned programming verification action can be equivalent to the programming verification action performed according to the adjusted programming verification voltage PVL and the reference current SC2. Among them, the reference current SC2 is determined according to the
以下請參照圖6,圖6繪示本發明一實施例的非揮發性記憶體的示意圖。非揮發性記憶體600包括記憶胞陣列610、控制器620以及感測放大器630。記憶胞陣列610可具有多個記憶胞串,各記憶胞串耦接多條字元線。記憶胞串可以為反及式快閃(NAND flash)記憶胞串。控制器620耦接記憶胞陣列610。控制器620可用以執行前述實施例的程式化動作的各個步驟。感測放大器630
耦接至記憶胞陣列610,可用以執行記憶胞陣列610的資料讀取以及程式化驗證動作。
Please refer to FIG. 6 below, which is a schematic diagram of a non-volatile memory of an embodiment of the present invention. The
控制器620可以為具運算能力的處理器。或者,控制器620可以是透過硬體描述語言(Hardware Description Language,HDL)或是其他任意本領域具通常知識者所熟知的數位電路的設計方式來進行設計,並透過現場可程式邏輯門陣列(Field Programmable Gate Array,FPGA)、複雜可程式邏輯裝置(Complex Programmable Logic Device,CPLD)或是特殊應用積體電路(Application-specific Integrated Circuit,ASIC)的方式來實現的硬體電路。
The
感測放大器630則可應用本領域通常知識者所熟知的感測放大電路(sense amplifying circuit)來實施,沒有一定的限制。
The
以下請參照圖7,圖7繪示本發明實施例的非揮發性記憶體中的記憶胞串的示意圖。記憶胞串700包括介電核心DC、通道層(channel layer)CL、電荷捕捉層(charge capturing layer)CTL以及多個金屬層所形成的字元線WL0~WLm。通道層CL例如由多晶矽材質所構成,用以環繞介電核心DC,電荷捕捉層CTL則環繞通道層CL。介電核心DC、通道層CL以及電荷捕捉層CTL沿方向D1延伸,並形成柱狀通道結構CH。字元線WL0~WLm則沿方向D2延伸並分別耦接至柱狀通道結構CH的多個部位以形成多個記憶胞。相同柱狀通道結構CH中的記憶胞則可形成一記憶胞串。
Please refer to FIG. 7 below, which is a schematic diagram of a memory cell string in a non-volatile memory according to an embodiment of the present invention. The
綜上所述,本發明的非揮發性記憶體在執行目前字元線的程式化動作時,可透過讀取先前的字元線的記憶胞以獲得先前的字元線的記憶胞的等效臨界電壓狀態,並根據先前的字元線的記憶胞的等效臨界電壓狀態來調整目前字元線的程式化動作中部份的程式化驗證電壓。藉此,可改善非揮發性記憶體的過驅動狀態以及資料保存度,提升非揮發性記憶體的整體表現。 In summary, when the non-volatile memory of the present invention performs the programming action of the current word line, it can obtain the equivalent critical voltage state of the memory cells of the previous word line by reading the memory cells of the previous word line, and adjust the programming verification voltage of part of the programming action of the current word line according to the equivalent critical voltage state of the memory cells of the previous word line. In this way, the over-drive state and data retention of the non-volatile memory can be improved, and the overall performance of the non-volatile memory can be enhanced.
S110、S120:步驟S110, S120: Steps
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| TWI336080B (en) * | 2006-06-19 | 2011-01-11 | Sandisk Corp | Method and systems for programming differently sized margins and sensing with compensations at select states for improved read operations in non-volatile memory |
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| TWI302310B (en) * | 2004-04-06 | 2008-10-21 | Sandisk Corp | Variable programming of non-volatile memory |
| TWI336080B (en) * | 2006-06-19 | 2011-01-11 | Sandisk Corp | Method and systems for programming differently sized margins and sensing with compensations at select states for improved read operations in non-volatile memory |
| TWI738375B (en) * | 2007-09-14 | 2021-09-01 | 日商東芝記憶體股份有限公司 | A non-volatile semiconductor memory device |
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