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TWI868159B - Rotary dryer - Google Patents

Rotary dryer Download PDF

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Publication number
TWI868159B
TWI868159B TW109120364A TW109120364A TWI868159B TW I868159 B TWI868159 B TW I868159B TW 109120364 A TW109120364 A TW 109120364A TW 109120364 A TW109120364 A TW 109120364A TW I868159 B TWI868159 B TW I868159B
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Taiwan
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workpiece
suction
rotary
adsorption surface
pad
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TW109120364A
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Chinese (zh)
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TW202107552A (en
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井出悟
高岡和宏
山本寬
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日商岡本工作機械製作所股份有限公司
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    • H10P72/0408
    • H10P72/7618
    • H10P72/7624
    • H10P72/78

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  • Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

提供旋轉乾燥裝置,改善工件的吸附並減少吸附面的殘留水,能實現乾燥工序的短時間化和裝置結構的簡化。其包括:旋轉的旋轉台(10);旋轉台墊(11),設置於旋轉台(10),具有保持工件的吸附面(12);真空吸引機構,通過從吸附面(12)吸引流體,將工件吸附於吸附面(12)。吸附面(12)形成有:吸引口(15),與真空吸引機構相連,供真空吸引機構所吸引的流體流動;供流體流動的吸引槽(13),向工件的方向開口並與吸引口(15)相連。在工件吸附於吸附面(12)時,將工件的位於吸附面(12)附近的部分上附著的水分經由吸引槽(13)和吸引口(15)吸引除去。由此,能短時間內高效執行殘留水少的乾燥工序。 A rotary drying device is provided to improve the adsorption of a workpiece and reduce the residual water on the adsorption surface, thereby shortening the drying process and simplifying the device structure. The device comprises: a rotating turntable (10); a turntable pad (11) disposed on the turntable (10) and having an adsorption surface (12) for holding the workpiece; and a vacuum suction mechanism for adsorbing the workpiece on the adsorption surface (12) by sucking a fluid from the adsorption surface (12). The adsorption surface (12) is formed with: a suction port (15) connected to the vacuum suction mechanism for allowing the fluid sucked by the vacuum suction mechanism to flow; and a suction groove (13) for the fluid to flow, which opens in the direction of the workpiece and is connected to the suction port (15). When the workpiece is adsorbed on the adsorption surface (12), the water attached to the portion of the workpiece located near the adsorption surface (12) is removed by suction through the suction groove (13) and the suction port (15). This allows the drying process to be performed efficiently in a short time with little residual water.

Description

旋轉乾燥裝置 Rotary dryer

本發明涉及一種旋轉乾燥裝置,該旋轉乾燥裝置通過利用離心力使附著於工件的水分等飛散並除去而使工件乾燥。 The present invention relates to a rotary drying device that dries a workpiece by utilizing centrifugal force to disperse and remove moisture and the like adhering to the workpiece.

以往已知一種由旋轉台保持半導體晶片等工件並使工件旋轉的旋轉乾燥裝置。在這種旋轉乾燥裝置中,承載在旋轉台的保持面上的工件被該保持面真空吸附保持。此後,利用旋轉台的旋轉而使工件旋轉。並且,通過利用離心力使附著於工件表面的清洗水等飛散並除去而使工件乾燥。 In the past, a rotary drying device that holds a workpiece such as a semiconductor wafer on a rotary table and rotates the workpiece is known. In this rotary drying device, the workpiece carried on the holding surface of the rotary table is held by vacuum adsorption on the holding surface. Thereafter, the workpiece is rotated by the rotation of the rotary table. In addition, the cleaning water attached to the surface of the workpiece is scattered and removed by centrifugal force to dry the workpiece.

例如,在日本專利公開公報特開2015-207744號中公開了一種旋轉裝置,其具備保持晶片的旋轉台。同一文獻公開的旋轉裝置的旋轉台具有圓盤狀的旋轉板。晶片保持在該旋轉板的上表面側。 For example, Japanese Patent Publication No. 2015-207744 discloses a rotating device having a rotating table for holding a wafer. The rotating table of the rotating device disclosed in the same document has a disc-shaped rotating plate. The wafer is held on the upper surface side of the rotating plate.

旋轉軸的上端側連接於旋轉板的下表面側。另一方面,旋轉軸的下端側與電機連結。利用借助旋轉軸從電機傳遞來的旋轉力,旋轉板在保持晶片的狀態下旋轉。 The upper end of the rotating shaft is connected to the lower surface of the rotating plate. On the other hand, the lower end of the rotating shaft is connected to the motor. The rotating plate rotates while holding the chip using the rotational force transmitted from the motor via the rotating shaft.

此外,例如在日本專利公開公報特開2010-123858號中公開了一種具有旋轉台的旋轉式清洗裝置,該旋轉台包括圓板狀的吸附部,該圓板狀的吸附部由在內部具有無數氣孔的多孔質材料構成。旋轉台的吸附部的上表面構成為吸附保持工件的保持 面。 In addition, for example, Japanese Patent Publication No. 2010-123858 discloses a rotary cleaning device having a rotary table, which includes a disc-shaped adsorption portion, and the disc-shaped adsorption portion is composed of a porous material having countless pores inside. The upper surface of the adsorption portion of the rotary table is configured as a holding surface for adsorbing and holding the workpiece.

同一文獻中公開的旋轉式清洗裝置具備:空氣噴嘴,向保持於旋轉台的工件噴出乾燥用空氣;以及空氣供給機構,向該空氣噴嘴供給乾燥空氣。 The rotary cleaning device disclosed in the same document is equipped with: an air nozzle for spraying drying air to the workpiece held on the rotary table; and an air supply mechanism for supplying drying air to the air nozzle.

使保持於保持面的工件離開該保持面時,從空氣供給機構送出的空氣經過吸附部內並從保持面向工件噴出。工件因該向上噴出的空氣而受到從保持面向上噴起的作用,從旋轉台離開。 When the workpiece held on the holding surface leaves the holding surface, the air sent from the air supply mechanism passes through the adsorption part and is ejected from the holding surface toward the workpiece. The workpiece is ejected upward from the holding surface by the upward ejected air and leaves the rotary table.

但是,在上述現有技術的旋轉乾燥裝置中,在減少殘留於工件的位於吸附面附近的部分的水分來提高乾燥效率的方面,有待改進。 However, in the above-mentioned prior art rotary drying device, there is room for improvement in reducing the moisture remaining in the portion of the workpiece near the adsorption surface to improve the drying efficiency.

具體地說,在現有技術的旋轉台中,具有在保持工件的吸附面上容易產生殘留水的問題。如果在吸附面殘留有水分,則在利用工件的旋轉使水飛散的乾燥工序結束之後,使工件離開旋轉台的吸附面時,殘留於吸附面的水分飛散,水分再次附著於乾燥工序中被乾燥的工件。 Specifically, in the conventional rotary table, there is a problem that residual water is easily generated on the adsorption surface that holds the workpiece. If there is residual water on the adsorption surface, after the drying process that uses the rotation of the workpiece to disperse the water is completed, when the workpiece is removed from the adsorption surface of the rotary table, the water remaining on the adsorption surface is dispersed and the water is again attached to the workpiece that was dried in the drying process.

此外,在現有技術的真空吸附機構中,以在旋轉台的旋轉中工件不離開的方式,在接近真空的狀態下牢固地保持工件。由此,即使真空吸附機構停止而停止抽真空,在吸附面也殘存有真空部,因此成為晶片被吸附於吸附面的狀態。由此,在乾燥工序後,不容易實施使工件離開旋轉台的工序。 In addition, in the vacuum adsorption mechanism of the prior art, the workpiece is firmly held in a state close to vacuum so that the workpiece does not leave during the rotation of the turntable. Therefore, even if the vacuum adsorption mechanism stops and the vacuum is stopped, a vacuum portion remains on the adsorption surface, so the chip is adsorbed on the adsorption surface. Therefore, it is not easy to implement the process of making the workpiece leave the turntable after the drying process.

在現有技術的真空吸附機構中,為了在乾燥工序後 使被吸附的工件離開,如日本專利公開公報特開2010-123858號所公開的那樣,需要向旋轉台的吸附面供給空氣的空氣供給機構。即,空氣供給裝置具有工件吸附用的用於吸引空氣的吸附回路以及工件離開用的用於供給空氣的提升回路。因此,空氣供給裝置的結構複雜。 In the prior art vacuum adsorption mechanism, in order to remove the adsorbed workpiece after the drying process, an air supply mechanism is required to supply air to the adsorption surface of the rotary table as disclosed in Japanese Patent Publication No. 2010-123858. That is, the air supply device has an adsorption circuit for sucking air for adsorbing the workpiece and a lifting circuit for supplying air for removing the workpiece. Therefore, the structure of the air supply device is complicated.

此外,如日本專利公開公報特開2010-123858號所公開的那樣,在向吸附保持工件的吸附面噴出離開用的空氣的方法中也存在如下問題:殘留在空氣配管內等的水分在乾燥工序後再次噴射並附著於工件面。 In addition, as disclosed in Japanese Patent Publication No. 2010-123858, there is also a problem in the method of spraying air for separation onto the adsorption surface of the adsorbed workpiece: the moisture remaining in the air piping is sprayed again after the drying process and adheres to the workpiece surface.

此外,也可以考慮在由旋轉台吸附保持工件之前,向工件的吸附面側噴射空氣而將水分吹散的方法。但是,在這種方法中,需要用於噴射空氣的空氣供給裝置。此外,在噴射空氣的工序後,進行由保持面吸附工件並使工件旋轉的工序。因此,乾燥工序需要較長時間。 In addition, a method of spraying air to the adsorption surface of the workpiece to blow away the moisture before the workpiece is adsorbed and held by the rotating table can also be considered. However, in this method, an air supply device for spraying air is required. In addition, after the air spraying process, the workpiece is adsorbed by the holding surface and rotated. Therefore, the drying process takes a long time.

本發明是鑒於上述情況而完成的。本發明的一個目的在於提供以下的旋轉乾燥裝置。在該旋轉乾燥裝置中,通過改善工件的吸附並減少吸附面的殘留水,能夠實現乾燥工序的短時間化和裝置結構的簡化。 The present invention is completed in view of the above situation. One purpose of the present invention is to provide the following rotary drying device. In the rotary drying device, by improving the adsorption of the workpiece and reducing the residual water on the adsorption surface, the drying process can be shortened and the device structure can be simplified.

本發明的一種方式的旋轉乾燥裝置包括:旋轉的旋轉台;旋轉台墊,設置於所述旋轉台,具有保持工件的吸附面;以及真空吸引機構,通過從所述吸附面吸引流體,將所述工件吸 附於所述吸附面,在所述吸附面形成有:吸引口,與所述真空吸引機構相連,供所述真空吸引機構所吸引的所述流體流動;以及供所述流體流動的吸引槽,向所述工件的方向開口並與所述吸引口相連。 A rotary drying device of one embodiment of the present invention comprises: a rotating turntable; a turntable pad, which is arranged on the turntable and has an adsorption surface for holding a workpiece; and a vacuum suction mechanism, which adsorbs the workpiece to the adsorption surface by adsorbing a fluid from the adsorption surface, and the adsorption surface is provided with: a suction port, which is connected to the vacuum suction mechanism and allows the fluid attracted by the vacuum suction mechanism to flow; and a suction groove for the fluid to flow, which opens in the direction of the workpiece and is connected to the suction port.

按照本發明的一種方式的旋轉乾燥裝置(本旋轉乾燥裝置),在設置於旋轉的旋轉台的旋轉台墊的保持工件的吸附面形成有:吸引口,與真空吸引機構相連,供真空吸引機構所吸引的流體流動;以及供流體流動的吸引槽,向工件的方向開口並與吸引口相連。 According to a rotary drying device (the present rotary drying device) of one embodiment of the present invention, the adsorption surface for holding the workpiece of the rotary table pad provided on the rotating rotary table is formed with: a suction port connected to the vacuum suction mechanism for allowing the fluid sucked by the vacuum suction mechanism to flow; and a suction groove for allowing the fluid to flow, opening in the direction of the workpiece and connected to the suction port.

按照這種結構,在利用真空吸引機構將工件吸附於吸附面時,能夠經由吸引槽和吸引口,將工件的位於吸附面附近的部分上附著的水分吸引除去。因此,在進行使工件旋轉而利用離心力使水分等飛散並除去的乾燥工序時,能夠在保持工件的吸附面的附近減少殘留於工件的水分。因此,能夠在短時間內高效地執行乾燥工序。 According to this structure, when the workpiece is adsorbed on the adsorption surface by the vacuum suction mechanism, the moisture attached to the part of the workpiece near the adsorption surface can be removed by suction through the suction groove and the suction port. Therefore, when the workpiece is rotated to use centrifugal force to disperse and remove moisture, the moisture remaining in the workpiece near the adsorption surface can be reduced. Therefore, the drying process can be performed efficiently in a short time.

具體地說,按照本旋轉乾燥裝置,在將工件吸附於旋轉台墊之前,不需要執行用於從工件的位於吸附面附近的部分吹散水分的空氣噴射工序等。因此,不需要用於該工序的空氣供給裝置。此外,由於不需要空氣噴射工序等,所以能夠縮短乾燥工序所需的時間。 Specifically, according to the present rotary drying device, before the workpiece is adsorbed on the rotary table, there is no need to perform an air spraying process for blowing away moisture from the portion of the workpiece located near the adsorption surface. Therefore, an air supply device for this process is not required. In addition, since the air spraying process is not required, the time required for the drying process can be shortened.

此外,殘留於工件的水分減少,因此在使工件旋轉進行乾燥並從旋轉台墊離開後,不需要再次向工件噴出乾燥用的空 氣。因此,不需要用於進行這種空氣噴出的空氣供給裝置,並且能夠縮短乾燥工序所需的時間。 In addition, the amount of moisture remaining in the workpiece is reduced, so after the workpiece is rotated for drying and removed from the rotary table, it is not necessary to spray air for drying onto the workpiece again. Therefore, an air supply device for such air spraying is not required, and the time required for the drying process can be shortened.

此外,按照本旋轉乾燥裝置,優選的是,在所述吸附面形成有直線狀的吸引凹部,所述吸引凹部向所述工件的方向開口,且兩端從所述旋轉台墊的旋轉中心附近向旋轉半徑方向延伸,所述吸引口形成於所述吸引凹部,所述吸引槽在與所述吸引凹部交叉的方向上延伸,並與所述吸引凹部相連。由此,能夠將工件適當地吸附保持於旋轉台墊的吸附面。此外,能夠高效地吸引除去吸附面所保持的工件的位於吸附面附近的部分附著的水分。 In addition, according to the present rotary drying device, it is preferred that a linear suction recess is formed on the adsorption surface, the suction recess opens toward the workpiece, and both ends extend from the vicinity of the rotation center of the rotary pad toward the rotation radius, the suction port is formed in the suction recess, and the suction groove extends in a direction intersecting the suction recess and is connected to the suction recess. Thus, the workpiece can be properly adsorbed and held on the adsorption surface of the rotary pad. In addition, the moisture attached to the part of the workpiece held by the adsorption surface near the adsorption surface can be efficiently removed by suction.

此外,按照本旋轉乾燥裝置,優選的是,所述吸引槽的一端從所述旋轉台墊的周向邊緣向外側開口,所述吸引凹部的兩端部不從所述旋轉台墊的周向邊緣向外側開口。按照這種結構,能夠從在旋轉台墊的周向邊緣開口的吸引槽的一端吸引空氣。此外,利用該空氣流,能夠高效地使附著於工件的水分向開設了吸引槽的另一端的吸引凹部噴射流動。並且,能夠經由形成於吸引凹部的吸引口,將經由吸引槽與空氣一起噴射流動的水分吸引除去。 In addition, according to the rotary drying device, it is preferred that one end of the suction groove opens outward from the circumferential edge of the rotary pad, and both ends of the suction recess do not open outward from the circumferential edge of the rotary pad. According to this structure, air can be sucked from one end of the suction groove opened at the circumferential edge of the rotary pad. In addition, by using this air flow, the moisture attached to the workpiece can be efficiently sprayed and flowed toward the suction recess at the other end where the suction groove is opened. And, the moisture sprayed and flowed through the suction groove together with the air can be sucked and removed through the suction port formed in the suction recess.

此外,吸引槽的一端從旋轉台墊的周向邊緣向外側開口。因此,通過在基於旋轉的乾燥工序完成後停止真空吸引機構的吸引,從而吸引槽內和吸引凹部內的壓力與旋轉台墊外部的壓力實質上相等。由此,旋轉台墊吸附工件的力實質上消失。因此,能夠容易地使工件離開旋轉台墊。由此,能夠縮短乾燥工序 後的離開工序所需的時間。此外,不需要設置用於使工件離開旋轉台墊的供給空氣的提升回路。由此,能夠提高乾燥工序的效率,並且能夠提高旋轉乾燥裝置的生產性。 In addition, one end of the suction groove opens outward from the circumferential edge of the rotating pad. Therefore, by stopping the suction of the vacuum suction mechanism after the rotation-based drying process is completed, the pressure in the suction groove and the suction recess is substantially equal to the pressure outside the rotating pad. As a result, the force of the rotating pad to adsorb the workpiece is substantially eliminated. Therefore, the workpiece can be easily separated from the rotating pad. As a result, the time required for the separation process after the drying process can be shortened. In addition, there is no need to set up a lifting circuit for supplying air for separating the workpiece from the rotating pad. As a result, the efficiency of the drying process can be improved, and the productivity of the rotary drying device can be improved.

此外,按照本旋轉乾燥裝置,優選的是,所述吸引口形成為比所述旋轉台墊的旋轉中心更靠旋轉半徑方向外側。由此,能夠利用真空吸引機構產生的吸引空氣,使由旋轉產生的離心力難以除去的附著於旋轉中心附近的水分流動到吸引口,來吸引除去。由此,提高了乾燥效率,因此能夠縮短乾燥工序所需的時間。 In addition, according to the present rotary drying device, it is preferred that the suction port is formed to be closer to the outside of the rotation radius direction than the rotation center of the rotary pad. Thus, the suction air generated by the vacuum suction mechanism can be used to make the moisture attached to the vicinity of the rotation center, which is difficult to remove due to the centrifugal force generated by the rotation, flow to the suction port for suction and removal. Thus, the drying efficiency is improved, and the time required for the drying process can be shortened.

1:旋轉乾燥裝置 1: Rotary drying device

10:旋轉台 10: Rotating table

11:旋轉台墊 11: Rotating table pad

12:吸附面 12: Adsorption surface

13:吸引槽 13: Attraction slot

14:吸引凹部 14: Suction concave part

15:吸引口 15: Suction port

16:吸引路徑 16: Attraction path

17:嵌合凹部 17: Fitting recess

18:吸引路徑 18: Attraction path

19:軸 19: Axis

20:排水盒 20: Drain box

21:排水口 21: Drainage outlet

22:壁部 22: Wall

23:上邊緣部 23: Upper edge

24:旋轉接頭 24: Swivel joint

25:軸 25: Axis

26:聯軸器 26: Coupling

28:電機 28: Motor

29:電機軸 29: Motor shaft

30:真空泵 30: Vacuum pump

31:空氣配管 31: Air piping

32:空氣供給裝置 32: Air supply device

33:空氣噴嘴 33: Air nozzle

35:支承台 35: Support platform

圖1是表示本發明實施方式的旋轉乾燥裝置的概略結構的主視圖。 FIG1 is a front view showing the schematic structure of a rotary drying device according to an embodiment of the present invention.

圖2是本發明實施方式的旋轉乾燥裝置的旋轉台墊的俯視圖。 Figure 2 is a top view of the rotary table of the rotary drying device according to the embodiment of the present invention.

圖3是表示本發明實施方式的旋轉乾燥裝置的旋轉台墊附近的放大主視圖。 FIG3 is an enlarged front view of the vicinity of the rotary table of the rotary drying device showing an embodiment of the present invention.

下面,基於附圖對本發明實施方式的旋轉乾燥裝置進行詳細說明。圖1是表示本發明實施方式的旋轉乾燥裝置1的概略結構的主視圖。 Below, the rotary drying device of the embodiment of the present invention is described in detail based on the attached drawings. Figure 1 is a front view showing the schematic structure of the rotary drying device 1 of the embodiment of the present invention.

參照圖1,旋轉乾燥裝置1例如是如下裝置:通過使半導體晶片等工件W旋轉,從而利用離心力使附著於工件W的清洗用的純水等飛散並從工件W除去,由此使工件W乾燥。工 件W是圓板狀或四方形板狀的加工對象材料。工件W例如可以是近年來正在推進大型化的WLP(Wafer Level Package晶片級封裝)、使WLP進一步大型化的大型安裝基板亦即PLP(Panel Level Package面板級封裝)、封裝基板、其他層疊基板、半導體基板和電容器等元件用的基板。 Referring to FIG. 1 , the rotary drying device 1 is, for example, a device that rotates a workpiece W such as a semiconductor wafer, thereby utilizing centrifugal force to scatter and remove the pure water or the like for cleaning attached to the workpiece W, thereby drying the workpiece W. The workpiece W is a circular plate-shaped or square plate-shaped processing target material. The workpiece W may be, for example, a WLP (Wafer Level Package) that has been advancing in size in recent years, a large-scale mounting substrate that further enlarges the WLP, namely a PLP (Panel Level Package), a packaging substrate, other stacked substrates, a semiconductor substrate, and a substrate for components such as capacitors.

旋轉乾燥裝置1具有:旋轉的旋轉台10;設置在旋轉台10的上表面的旋轉台墊11;作為用於吸附工件W的真空吸引機構的真空泵30;以及作為使旋轉台10旋轉的驅動源的電機28。 The rotary drying device 1 has: a rotating rotary table 10; a rotary table pad 11 provided on the upper surface of the rotary table 10; a vacuum pump 30 as a vacuum suction mechanism for adsorbing the workpiece W; and a motor 28 as a driving source for rotating the rotary table 10.

旋轉台10是支承從上方放置的工件W的部件。旋轉台10具有俯視呈大致圓形的形態。旋轉台10以其圓形的中心為軸,與被吸附的工件W一起在大致水平方向上旋轉。 The rotating table 10 is a component that supports the workpiece W placed from above. The rotating table 10 has a roughly circular shape when viewed from above. The rotating table 10 rotates in a roughly horizontal direction with the adsorbed workpiece W, with the center of its circular shape as the axis.

作為旋轉台10的旋轉主軸的軸19借助旋轉接頭24,以能夠從軸25傳遞來旋轉動力的方式連結於軸25。軸25借助聯軸器26,以能夠從軸29傳遞來旋轉動力的方式連結於電機28的電機軸29。即,旋轉台10以電機28為驅動源進行旋轉。 The shaft 19, which is the main axis of rotation of the rotary table 10, is connected to the shaft 25 by means of a rotary joint 24 so that rotational power can be transmitted from the shaft 25. The shaft 25 is connected to the motor shaft 29 of the motor 28 by means of a coupling 26 so that rotational power can be transmitted from the shaft 29. That is, the rotary table 10 rotates with the motor 28 as the driving source.

設置在旋轉台10的上表面的旋轉台墊11例如主要由樹脂材料形成,具有俯視呈大致圓形的形態。該樹脂材料可以列舉ABS樹脂(丙烯腈-丁二烯-苯乙烯共聚物樹脂)、聚氯乙烯樹脂、PET(聚對苯二甲酸乙二酯)和聚四氟乙烯等。 The turntable pad 11 provided on the upper surface of the turntable 10 is mainly formed of a resin material, for example, and has a roughly circular shape when viewed from above. Examples of the resin material include ABS resin (acrylonitrile-butadiene-styrene copolymer resin), polyvinyl chloride resin, PET (polyethylene terephthalate), and polytetrafluoroethylene.

旋轉台墊11是吸附保持工件W的部件,與工件W一起旋轉。具體地說,旋轉台墊11的上表面為保持工件W的吸 附面12。 The rotating table pad 11 is a component that absorbs and holds the workpiece W, and rotates together with the workpiece W. Specifically, the upper surface of the rotating table pad 11 is an adsorption surface 12 that holds the workpiece W.

旋轉接頭24將軸25和作為旋轉台10的旋轉主軸的軸19支撐為旋轉自如。旋轉接頭24是如下接頭:形成有使從工件W側流出的流體、即空氣和附著於工件W的水分等從旋轉台墊11流向真空泵30側的路徑。 The rotary joint 24 supports the shaft 25 and the shaft 19 which is the main shaft of the rotary table 10 so that they can rotate freely. The rotary joint 24 is a joint that forms a path for the fluid flowing out from the workpiece W side, that is, air and moisture attached to the workpiece W, to flow from the rotary table pad 11 to the vacuum pump 30 side.

在旋轉接頭24的流體口連接有成為供流體流動的路徑的空氣配管31。空氣配管31與真空泵30連接。空氣配管31也可以設置未圖示的氣液分離裝置,所述氣液分離裝置用於使從工件W吸引的水分與空氣分離。 An air pipe 31 serving as a path for fluid flow is connected to the fluid port of the rotary joint 24. The air pipe 31 is connected to a vacuum pump 30. The air pipe 31 may also be provided with a gas-liquid separation device (not shown) for separating moisture sucked from the workpiece W from air.

電機28是使旋轉台10旋轉的驅動源。如上所述,作為電機28的輸出軸的電機軸29借助聯軸器26、軸25和旋轉接頭24的動作軸,與作為旋轉台10的旋轉主軸的軸19連結。 The motor 28 is a driving source for rotating the turntable 10. As described above, the motor shaft 29, which is the output shaft of the motor 28, is connected to the shaft 19, which is the main rotation shaft of the turntable 10, via the coupling 26, the shaft 25, and the operating shaft of the rotary joint 24.

在此,由電機28驅動的旋轉台10的轉速例如為60~3000r.p.m.,優選為1500~2500r.p.m.。利用這種高速旋轉,能夠執行短時間內的高效的乾燥工序。 Here, the rotation speed of the rotary table 10 driven by the motor 28 is, for example, 60 to 3000 r.p.m., preferably 1500 to 2500 r.p.m. By utilizing this high-speed rotation, an efficient drying process can be performed in a short time.

旋轉接頭24和電機28固定並支承於支承台35。在支承台35的上部、且在旋轉台10的下方設置有排水盒20,所述排水盒20接收來自工件W的水分並使水分流動。排水盒20是接收從工件W飛散的水分的大致杯狀的部件。 The rotary joint 24 and the motor 28 are fixed and supported on the support table 35. A drainage box 20 is provided on the upper part of the support table 35 and below the rotary table 10. The drainage box 20 receives water from the workpiece W and makes the water flow. The drainage box 20 is a roughly cup-shaped component that receives water scattered from the workpiece W.

在排水盒20的周向邊緣部形成有壁部22。壁部22接收利用離心力而從旋轉的工件W飛散的水分。壁部22具有大致圓筒狀的形態。在壁部22的上端附近形成有向旋轉中心方向 延伸的大致環狀圓板形的上邊緣部23。在排水盒20的底部形成有用於排出從工件W飛散的水分的排水口21。在排水口21連接有未圖示的排水管。收集到排水盒20的水分經由該排水管向未圖示的排水容器等排出。 A wall portion 22 is formed on the peripheral edge of the drainage box 20. The wall portion 22 receives water scattered from the rotating workpiece W by centrifugal force. The wall portion 22 has a substantially cylindrical shape. A substantially annular disc-shaped upper edge portion 23 extending toward the center of rotation is formed near the upper end of the wall portion 22. A drainage port 21 for draining water scattered from the workpiece W is formed at the bottom of the drainage box 20. A drainage pipe (not shown) is connected to the drainage port 21. The water collected in the drainage box 20 is discharged to a drainage container (not shown) through the drainage pipe.

此外,旋轉乾燥裝置1可以包括空氣供給裝置32和空氣噴嘴33,該空氣供給裝置32供給乾燥用的空氣。空氣噴嘴33向工件W的上表面吹出來自空氣供給裝置32的空氣。由此,能夠實現乾燥工序的進一步的高效化。 In addition, the rotary drying device 1 may include an air supply device 32 and an air nozzle 33, wherein the air supply device 32 supplies air for drying. The air nozzle 33 blows the air from the air supply device 32 toward the upper surface of the workpiece W. Thus, the drying process can be further improved in efficiency.

圖2是旋轉台墊11的俯視圖,是從上方觀察吸附面12的圖。 FIG2 is a top view of the rotating pad 11, which is a view of the adsorption surface 12 viewed from above.

如圖2所示,在旋轉台墊11的吸附面12形成有大致直線狀的吸引凹部14、吸引槽13和吸引口15。吸引凹部14在旋轉台墊11的徑向延伸。吸引槽13在與吸引凹部14交叉的方向(水平方向)上延伸。吸引口15形成於吸引凹部14。吸引口15與作為真空吸引機構的真空泵30(參照圖1)相連。 As shown in FIG2 , a substantially linear suction recess 14, a suction groove 13, and a suction port 15 are formed on the adsorption surface 12 of the rotating pad 11. The suction recess 14 extends in the radial direction of the rotating pad 11. The suction groove 13 extends in a direction (horizontal direction) intersecting the suction recess 14. The suction port 15 is formed in the suction recess 14. The suction port 15 is connected to a vacuum pump 30 (see FIG1 ) as a vacuum suction mechanism.

吸引凹部14是朝向吸附面12的上方、即工件W的方向開口的凹部。吸引凹部14的兩端從旋轉台墊11的旋轉中心附近朝向旋轉半徑方向大致直線狀延伸。吸引凹部14的兩端部不從旋轉台墊11的周向邊緣向外側開口。吸引凹部14的凹部形狀沒有特別限定。吸引凹部14例如可以具有斷面大致V形的槽形狀。在吸附工件W時,吸引凹部14成為供真空泵30所吸引的流體、即空氣和附著於工件W的水分等流動的流道。 The suction recess 14 is a recess that opens toward the top of the adsorption surface 12, that is, toward the workpiece W. Both ends of the suction recess 14 extend approximately straight from the vicinity of the rotation center of the rotary pad 11 toward the rotation radius direction. Both ends of the suction recess 14 do not open outward from the circumferential edge of the rotary pad 11. The shape of the recess of the suction recess 14 is not particularly limited. The suction recess 14 can have, for example, a groove shape with a roughly V-shaped cross section. When adsorbing the workpiece W, the suction recess 14 becomes a flow channel for the fluid sucked by the vacuum pump 30, that is, air and moisture attached to the workpiece W, etc. to flow.

吸引槽13是朝向吸附面12的上方、即工件W的方向開口的凹部。吸引槽13在與吸引凹部14交叉的方向上大致直線狀延伸。吸引槽13的一端從旋轉台墊11的周向邊緣向外側開口。吸引槽13的另一端在吸引凹部14開口。即,吸引槽13形成為使流體能夠從旋轉台墊11的外部向吸引凹部14的內部流通。 The suction groove 13 is a recessed portion that opens toward the upper side of the suction surface 12, that is, toward the direction of the workpiece W. The suction groove 13 extends approximately in a straight line in a direction intersecting the suction recess 14. One end of the suction groove 13 opens outward from the circumferential edge of the rotary pad 11. The other end of the suction groove 13 opens in the suction recess 14. That is, the suction groove 13 is formed so that the fluid can flow from the outside of the rotary pad 11 to the inside of the suction recess 14.

在旋轉台墊11形成有多條吸引槽13。具體地說,在經過旋轉台墊11的旋轉中心附近且大致直線狀延伸的吸引凹部14的兩側,大致平行地形成多條吸引槽13。所述多條吸引槽13的一端在旋轉台墊11的外周開口,而另一端與吸引凹部14相連。在吸附工件W時,吸引槽13成為供真空泵30所吸引的流體、即空氣和附著於工件W的水分等流動的流道。 A plurality of suction grooves 13 are formed on the rotating pad 11. Specifically, a plurality of suction grooves 13 are formed approximately parallel to both sides of a suction recess 14 extending approximately in a straight line through the vicinity of the rotation center of the rotating pad 11. One end of the plurality of suction grooves 13 opens at the outer periphery of the rotating pad 11, and the other end is connected to the suction recess 14. When the workpiece W is adsorbed, the suction groove 13 becomes a flow channel for the fluid sucked by the vacuum pump 30, that is, air and moisture attached to the workpiece W, etc. to flow.

吸引口15形成在吸引凹部14的底面。具體地說,吸引口15形成在吸引凹部14的底面中的、從旋轉台墊11的旋轉中心朝向旋轉半徑方向外側偏移的兩個部位。 The suction port 15 is formed on the bottom surface of the suction recess 14. Specifically, the suction port 15 is formed at two locations on the bottom surface of the suction recess 14 that are offset from the rotation center of the rotating pad 11 toward the outer side in the rotation radius direction.

吸引口15與真空泵30相連。在吸附工件W時,吸引口15成為供真空泵30所吸引的流體、即空氣和附著於工件W的水分等流動的流道。 The suction port 15 is connected to the vacuum pump 30. When the workpiece W is adsorbed, the suction port 15 becomes a flow channel for the fluid sucked by the vacuum pump 30, that is, air and moisture attached to the workpiece W, etc. to flow.

即,附著於工件W的清洗用的純水等被流經吸引槽13和吸引凹部14的吸附用的空氣吹散,並且與該吸附用的空氣一起從吸引槽13經由吸引凹部14和吸引口15流動而被除去。 That is, the pure water for cleaning and the like attached to the workpiece W is blown away by the adsorption air flowing through the suction groove 13 and the suction recess 14, and is removed together with the adsorption air flowing from the suction groove 13 through the suction recess 14 and the suction port 15.

圖3是表示旋轉乾燥裝置1的旋轉台墊11附近的放大主視圖。圖3表示了旋轉台10的斷面的概略形狀。 FIG3 is an enlarged front view showing the vicinity of the rotary table pad 11 of the rotary drying device 1. FIG3 shows the schematic shape of the cross section of the rotary table 10.

如圖3所示,在旋轉台10的上表面形成有供旋轉台墊11嵌合的嵌合凹部17。嵌合凹部17具有與旋轉台10的主體的圓形同心的俯視呈大致圓形的形態。旋轉台墊11的底面側嵌入旋轉台10的嵌合凹部17,並由未圖示的螺栓等固定。 As shown in FIG3 , a fitting recess 17 for fitting the turntable pad 11 is formed on the upper surface of the turntable 10. The fitting recess 17 has a substantially circular shape in a top view that is concentric with the circular shape of the main body of the turntable 10. The bottom surface side of the turntable pad 11 is fitted into the fitting recess 17 of the turntable 10 and fixed by bolts, etc., which are not shown.

如上所述,在旋轉台墊11的吸附面12形成有多條吸引槽13。吸引槽13的斷面形狀為大致V形。吸引槽13的深度比吸引凹部14的深度淺,具體地說,例如為0.01~1mm,優選為0.05~0.5mm。由此,通過將吸引槽13形成為具有適宜的形狀和深度,從而吸附面12能夠利用真空泵30對流體的吸引來吸附工件W,並將工件W以能夠承受旋轉的強度進行保持。 As described above, a plurality of suction grooves 13 are formed on the suction surface 12 of the rotary table 11. The cross-sectional shape of the suction groove 13 is roughly V-shaped. The depth of the suction groove 13 is shallower than the depth of the suction recess 14, specifically, for example, 0.01~1mm, preferably 0.05~0.5mm. Thus, by forming the suction groove 13 to have an appropriate shape and depth, the suction surface 12 can use the suction of the vacuum pump 30 to suck the workpiece W, and hold the workpiece W with a strength that can withstand rotation.

具體地說,即使在旋轉台墊11的外部的空氣從吸引槽13流入的情況下,旋轉台墊11的吸附面12也能夠保持足夠的真空度。因此,在這種情況下,工件W實質上不會因離心力而脫離吸附面12。 Specifically, even when air from outside the rotary pad 11 flows in from the suction groove 13, the suction surface 12 of the rotary pad 11 can maintain a sufficient degree of vacuum. Therefore, in this case, the workpiece W will not substantially separate from the suction surface 12 due to centrifugal force.

此外,通過將吸引槽13形成為具有適宜的形狀,能夠使流道斷面面積為適宜的大小。由此,能夠使流經吸引槽13的空氣的速度為適當的速度。其結果,能夠利用流經吸引槽13的空氣良好地吹走附著於工件W的水分。 In addition, by forming the suction groove 13 into an appropriate shape, the cross-sectional area of the flow channel can be made into an appropriate size. As a result, the speed of the air flowing through the suction groove 13 can be made into an appropriate speed. As a result, the water attached to the workpiece W can be blown away well by the air flowing through the suction groove 13.

如上所述,在旋轉台墊11的吸附面12的旋轉中心附近形成有吸引凹部14,所述吸引凹部14為大致直線狀延伸的凹部。在吸引凹部14形成有成為流體的流道的吸引口15。具體地說,吸引口15形成為從吸引凹部14貫穿至旋轉台墊11的下 表面。 As described above, a suction recess 14 is formed near the rotation center of the adsorption surface 12 of the rotating pad 11, and the suction recess 14 is a recess extending in a substantially straight line. A suction port 15 serving as a flow path for the fluid is formed in the suction recess 14. Specifically, the suction port 15 is formed to penetrate from the suction recess 14 to the lower surface of the rotating pad 11.

在旋轉台墊11的下表面形成有吸引路徑16,所述吸引路徑16是成為流體的流道的凹部。吸引路徑16是經過旋轉台墊11的旋轉中心附近的大致直線狀的凹部。吸引路徑16的兩端附近與吸引口15相連。並且,在旋轉台墊11與旋轉台10的嵌合凹部17嵌合的狀態下,吸引路徑16形成與吸引路徑18相連的流體的流道,所述吸引路徑18形成在旋轉台10的旋轉中心附近。 A suction path 16 is formed on the lower surface of the rotating table pad 11, and the suction path 16 is a concave portion that becomes a flow path for the fluid. The suction path 16 is a substantially straight-line concave portion that passes through the vicinity of the rotation center of the rotating table pad 11. The suction path 16 is connected to the suction port 15 near both ends. In addition, when the rotating table pad 11 is engaged with the engagement concave portion 17 of the rotating table 10, the suction path 16 forms a flow path for the fluid connected to the suction path 18, which is formed near the rotation center of the rotating table 10.

參照圖1至圖3,根據上述結構,在吸附工件W時,形成從旋轉台墊11的外部與真空泵30相連的流體的流道。該流道包括吸引槽13、吸引凹部14、吸引口15、吸引路徑16、吸引路徑18、旋轉接頭24和空氣配管31。 Referring to Figures 1 to 3, according to the above structure, when the workpiece W is adsorbed, a flow path of the fluid connected to the vacuum pump 30 is formed from the outside of the rotary table 11. The flow path includes a suction groove 13, a suction recess 14, a suction port 15, a suction path 16, a suction path 18, a rotary joint 24 and an air pipe 31.

在乾燥工序中,通過使工件W旋轉而利用離心力使吸附於工件W的水分等飛散並從工件W除去。在進行這樣的乾燥工序時,通過使真空泵30運轉,從而能夠由旋轉台墊11的吸附面12吸附保持工件W。 In the drying process, the workpiece W is rotated to use centrifugal force to disperse the water adsorbed on the workpiece W and remove it from the workpiece W. When performing such a drying process, the vacuum pump 30 is operated so that the adsorption surface 12 of the rotating table 11 can adsorb and hold the workpiece W.

吸引槽13的一端在旋轉台墊11的外周開口。因此,即使在吸附保持工件W的狀態下,從旋轉台墊11的外周經由吸引槽13、吸引凹部14和吸引口15而被真空泵30吸引的空氣的流動也持續。 One end of the suction groove 13 opens at the outer periphery of the rotary pad 11. Therefore, even in the state of adsorbing and holding the workpiece W, the flow of air sucked by the vacuum pump 30 from the outer periphery of the rotary pad 11 through the suction groove 13, the suction recess 14 and the suction port 15 continues.

利用上述的空氣的流動,在保持有工件W的吸附面12的附近,附著於工件W的水分與空氣一起流動並被吸引。即,在由吸附面12吸附工件W時,能夠經由吸引槽13、吸引凹部14 和吸引口15,將工件W的位於吸附面12附近的部分上附著的水分吸引除去。由此,能夠在短時間內高效地執行殘留水少的乾燥工序。 By utilizing the above-mentioned air flow, moisture attached to the workpiece W flows with the air near the adsorption surface 12 holding the workpiece W and is sucked. That is, when the workpiece W is adsorbed by the adsorption surface 12, the moisture attached to the portion of the workpiece W near the adsorption surface 12 can be sucked and removed through the suction groove 13, the suction recess 14 and the suction port 15. Thus, a drying process with little residual water can be efficiently performed in a short time.

例如,實施了使用旋轉乾燥裝置1的乾燥工序的試驗。在該試驗中,工件W使用了直徑300mm、厚度約800μm的矽晶片。在該實驗中,首先向工件W的正反面噴射了純水。此後,通過將工件W保持於吸附面12以及使旋轉台10以旋轉速度2500r.p.m.旋轉,執行了乾燥工序。由此,以乾燥時間30~45秒得到了實質上完全沒有問題的良好的乾燥結果。此外,在乾燥工序後,通過使真空泵30停止,從而也能夠以實質上沒有問題的方式容易地進行使工件W離開吸附面12的工件W離開工序。 For example, a drying process test using the rotary drying device 1 was conducted. In this test, a silicon wafer with a diameter of 300 mm and a thickness of about 800 μm was used as the workpiece W. In this experiment, pure water was first sprayed on the front and back surfaces of the workpiece W. Thereafter, the drying process was performed by holding the workpiece W on the adsorption surface 12 and rotating the rotary table 10 at a rotation speed of 2500 r.p.m. As a result, a good drying result with substantially no problems was obtained with a drying time of 30 to 45 seconds. In addition, after the drying process, by stopping the vacuum pump 30, the workpiece W leaving process of leaving the adsorption surface 12 can also be easily performed in a substantially problem-free manner.

此外,例如實施了使用假想為PLP基板的500mm×500mm的丙烯酸板作為工件W的試驗。在該實驗中,首先向工件W的正反面噴射了純水。此後,通過將工件W保持於吸附面12以及使旋轉台10以旋轉速度500~2000r.p.m.旋轉,執行了乾燥工序。由此,能夠以乾燥時間90~120秒得到了良好的乾燥結果。此外,在乾燥工序後,通過使真空泵30停止,從而也能夠容易地執行工件W離開工序。 In addition, for example, an experiment was conducted using a 500mm×500mm acrylic plate assumed to be a PLP substrate as the workpiece W. In this experiment, pure water was first sprayed on the front and back surfaces of the workpiece W. Thereafter, the drying process was performed by holding the workpiece W on the adsorption surface 12 and rotating the rotary table 10 at a rotation speed of 500~2000r.p.m. As a result, a good drying result can be obtained with a drying time of 90~120 seconds. In addition, after the drying process, the vacuum pump 30 was stopped, so that the workpiece W can be easily removed.

由此,按照旋轉乾燥裝置1,能夠在短時間內高效地執行乾燥工序。並且,在將工件W吸附於旋轉台墊11之前,不需要執行在現有技術中所需要的從工件W的位於吸附面12附近的部分吹散水分的空氣噴射工序等。因此,不需要用於該工序的 空氣供給裝置。此外,由於不需要空氣噴射工序,所以能夠縮短乾燥工序所需的時間。 Thus, according to the rotary drying device 1, the drying process can be efficiently performed in a short time. In addition, before the workpiece W is adsorbed on the rotary table 11, there is no need to perform the air spraying process required in the prior art to blow away the moisture from the part of the workpiece W near the adsorption surface 12. Therefore, an air supply device for this process is not required. In addition, since the air spraying process is not required, the time required for the drying process can be shortened.

此外,即使在基於旋轉的乾燥工序中,吸附面12中的吸引空氣的流動也持續,所以殘留於工件W的水分減少。因此,在使工件W旋轉進行乾燥並從旋轉台墊11離開後,不需要再次向工件W噴出乾燥用的空氣。由此,不需要用於在工件W離開後進行空氣噴出乾燥的空氣供給裝置,並且能夠縮短乾燥工序所需的時間。 Furthermore, even in the drying process based on rotation, the flow of the suction air in the adsorption surface 12 continues, so the moisture remaining in the workpiece W is reduced. Therefore, after the workpiece W is rotated for drying and leaves the rotating table 11, it is not necessary to spray the drying air to the workpiece W again. As a result, an air supply device for performing air spray drying after the workpiece W leaves is not required, and the time required for the drying process can be shortened.

此外,吸引槽13的一端從旋轉台墊11的周向邊緣向外側開口。因此,通過在基於旋轉的乾燥工序完成後停止真空泵30的吸引,從而吸引槽13內和吸引凹部14內的壓力與旋轉台墊11外部的壓力實質上相等。 In addition, one end of the suction groove 13 opens outward from the circumferential edge of the rotary pad 11. Therefore, by stopping the suction of the vacuum pump 30 after the rotation-based drying process is completed, the pressure inside the suction groove 13 and the suction recess 14 is substantially equal to the pressure outside the rotary pad 11.

由此,旋轉台墊11吸附工件W的力實質上消失。因此,能夠容易地使工件W離開旋轉台墊11。由此,能夠縮短乾燥工序後的離開工序所需的時間。 As a result, the force of the rotary table pad 11 to adsorb the workpiece W is substantially eliminated. Therefore, the workpiece W can be easily separated from the rotary table pad 11. As a result, the time required for the separation process after the drying process can be shortened.

此外,不需要設置用於使工件W離開旋轉台墊11的供給空氣的提升回路。即,作為真空回路僅設置進行真空泵30的吸引的一個回路即可。由此,按照本實施方式,得到了乾燥工序的效率高、結構簡化、生產性優異的旋轉乾燥裝置1。 In addition, there is no need to set up a lifting circuit for supplying air to make the workpiece W leave the rotary table 11. That is, as a vacuum circuit, only one circuit for suction by the vacuum pump 30 is provided. Therefore, according to this embodiment, a rotary drying device 1 with high efficiency of the drying process, simplified structure, and excellent productivity is obtained.

此外,按照旋轉乾燥裝置1,吸引口15形成為比旋轉台墊11的旋轉中心更靠旋轉半徑方向外側。由此,能夠利用真空泵30產生的吸引空氣,使由旋轉產生的離心力難以除去的附 著於旋轉中心附近的水分流動到吸引口15,來吸引除去。由此,提高了乾燥效率,因此能夠縮短乾燥工序所需的時間。 In addition, according to the rotary drying device 1, the suction port 15 is formed to be closer to the outside of the rotation radius direction than the rotation center of the rotary pad 11. Therefore, the suction air generated by the vacuum pump 30 can be used to make the water attached to the vicinity of the rotation center, which is difficult to remove due to the centrifugal force generated by the rotation, flow to the suction port 15, and be sucked and removed. As a result, the drying efficiency is improved, and the time required for the drying process can be shortened.

另外,本發明的方式並不限定於上述實施方式。本發明的方式除了上述實施方式以外,能夠在不脫離本發明的要旨的範圍內進行各種變更來實施。 In addition, the method of the present invention is not limited to the above-mentioned implementation method. In addition to the above-mentioned implementation method, the method of the present invention can be implemented by various changes within the scope of the gist of the present invention.

此外,本發明的旋轉乾燥裝置可以是以下的第一旋轉乾燥裝置。第一旋轉乾燥裝置的特徵在於包括:旋轉的旋轉台;旋轉台墊,設置於所述旋轉台,具有保持工件的吸附面;以及真空吸引機構,從所述吸附面吸引流體,將所述工件吸附於所述吸附面,在所述吸附面形成有:吸引口,與所述真空吸引機構相連,供所述真空吸引機構所吸引的所述流體流動;以及供所述流體流動的吸引槽,向所述工件方向開口並與所述吸引口相連,在將所述工件吸附於所述吸附面時,將所述工件的位於所述吸附面附近的部分上附著的水分經由所述吸引槽和所述吸引口吸引除去。 In addition, the rotary drying device of the present invention can be the following first rotary drying device. The first rotary drying device is characterized in that it includes: a rotating turntable; a turntable pad, which is arranged on the turntable and has an adsorption surface for holding the workpiece; and a vacuum suction mechanism, which sucks fluid from the adsorption surface and adsorbs the workpiece on the adsorption surface, and the adsorption surface is formed with: a suction port, which is connected to the vacuum suction mechanism and allows the fluid sucked by the vacuum suction mechanism to flow; and a suction groove for the fluid to flow, which opens in the direction of the workpiece and is connected to the suction port, and when the workpiece is adsorbed on the adsorption surface, the moisture attached to the part of the workpiece near the adsorption surface is removed by suction through the suction groove and the suction port.

10:旋轉台 10: Rotating table

11:旋轉台墊 11: Rotating table pad

12:吸附面 12: Adsorption surface

13:吸引槽 13: Attraction slot

14:吸引凹部 14: Suction concave part

15:吸引口 15: Suction port

Claims (4)

一種旋轉乾燥裝置,其包括:旋轉的旋轉台;旋轉台墊,設置於所述旋轉台,具有保持工件的吸附面;以及真空吸引機構,通過從所述吸附面吸引流體,將所述工件吸附於所述吸附面,在所述吸附面形成有:吸引口,與所述真空吸引機構相連,供所述真空吸引機構所吸引的所述流體流動;以及供所述流體流動的吸引槽,向所述工件的方向開口並與所述吸引口相連,所述吸引槽的一端從所述旋轉台墊的周向邊緣向外側開口。 A rotary drying device comprises: a rotating rotary table; a rotary table pad, arranged on the rotary table, having an adsorption surface for holding a workpiece; and a vacuum suction mechanism, which adsorbs the workpiece to the adsorption surface by adsorbing a fluid from the adsorption surface, wherein the adsorption surface is provided with: a suction port connected to the vacuum suction mechanism, through which the fluid attracted by the vacuum suction mechanism flows; and a suction groove for the fluid to flow, which opens in the direction of the workpiece and is connected to the suction port, and one end of the suction groove opens outward from the circumferential edge of the rotary table pad. 如請求項1所述的旋轉乾燥裝置,其中在所述吸附面形成有直線狀的吸引凹部,所述吸引凹部向所述工件的方向開口,且兩端從所述旋轉台墊的旋轉中心附近向旋轉半徑方向延伸,所述吸引口形成於所述吸引凹部,所述吸引槽在與所述吸引凹部交叉的方向上延伸,並與所述吸引凹部相連。 A rotary drying device as described in claim 1, wherein a linear suction recess is formed on the adsorption surface, the suction recess opens in the direction of the workpiece, and both ends extend from the vicinity of the rotation center of the rotary pad in the direction of the rotation radius, the suction port is formed in the suction recess, and the suction groove extends in a direction intersecting the suction recess and is connected to the suction recess. 如請求項2所述的旋轉乾燥裝置,其中所述吸引凹部的兩端部不從所述旋轉台墊的周向邊緣向外側開口。 A rotary drying device as described in claim 2, wherein both ends of the suction recess do not open outward from the circumferential edge of the rotary pad. 如請求項1至3中任意一項所述的旋轉乾燥裝置,其中所述吸引口形成為比所述旋轉台墊的旋轉中心更靠旋轉半徑方向外側。 A rotary drying device as described in any one of claims 1 to 3, wherein the suction port is formed to be further outward in the direction of the rotation radius than the rotation center of the rotary pad.
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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113634556A (en) * 2021-08-10 2021-11-12 叶建蓉 A kind of silicon wafer surface liquid removal cleaning equipment
CN113945072B (en) * 2021-10-18 2022-11-29 北京烁科精微电子装备有限公司 Drying system and drying method
CN114152051B (en) * 2021-11-04 2022-11-01 深圳市中医院 Vertical medical slide draining rack
CN114602913A (en) * 2022-04-08 2022-06-10 上海德采包装机械股份有限公司 High-speed automatic bottle washing and drying machine

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244231A (en) * 2000-02-25 2001-09-07 Ses Co Ltd Horizontal shaft substrate rotary drying device
JP2003133279A (en) * 2001-10-26 2003-05-09 Kokusan:Kk Wafer hoisting and lowering apparatus in rotary drying apparatus
JP2004319930A (en) * 2003-04-21 2004-11-11 Okamoto Machine Tool Works Ltd Cleaning/drying device for substrate
US20180161737A1 (en) * 2014-12-02 2018-06-14 Sigma-Technology Inc. Cleaning method and cleaning device using micro/nano-bubbles

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59183735U (en) * 1983-05-23 1984-12-07 株式会社 デイスコ Adsorption fixing device
US4559718A (en) * 1983-08-02 1985-12-24 Oki Electric Industry Co., Ltd. Method and apparatus for drying semiconductor wafers
JPH11307502A (en) * 1998-04-22 1999-11-05 Kaijo Corp Apparatus for single-wafer processing type spin cleaning and drying of semiconductor wafer
JP4043455B2 (en) * 2004-05-28 2008-02-06 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
JP2010153585A (en) * 2008-12-25 2010-07-08 Ebara Corp Tool and method for holding substrate
WO2014109018A1 (en) * 2013-01-09 2014-07-17 信越エンジニアリング株式会社 Workpiece adhesive chuck device and workpiece attachment machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244231A (en) * 2000-02-25 2001-09-07 Ses Co Ltd Horizontal shaft substrate rotary drying device
JP2003133279A (en) * 2001-10-26 2003-05-09 Kokusan:Kk Wafer hoisting and lowering apparatus in rotary drying apparatus
JP2004319930A (en) * 2003-04-21 2004-11-11 Okamoto Machine Tool Works Ltd Cleaning/drying device for substrate
US20180161737A1 (en) * 2014-12-02 2018-06-14 Sigma-Technology Inc. Cleaning method and cleaning device using micro/nano-bubbles

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