JP2018170443A - Spinner cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a spinner cleaning device capable of handling a plurality of semiconductor wafers at the same time and reliably adsorbing / releasing even if all the plurality of semiconductor wafers are not aligned. SOLUTION: A rotating table main body 19 and a plurality of rotating table main bodies 19 are provided on a concentric circle with a predetermined phase angle at substantially equal intervals, and each of them can individually suck and hold a semiconductor wafer W. The rotating chuck table 13 having 20a to 20e, the negative pressure generation source 22, and the suction holding portions 20a to 20e are provided corresponding to each, and the negative pressure generated by the negative pressure generation source 22 is provided. A plurality of suction ports 18A to 18E individually applied to the suction holding portions 20a to 20e, and a nozzle 23a for injecting a cleaning fluid toward the semiconductor wafer W sucked and held on the suction holding portions 20a to 20e. A spinner cleaning device including the cleaning fluid supply means 23 provided. [Selection diagram] Fig. 3

Description

  The present invention relates to a spinner cleaning apparatus, and more particularly to a spinner cleaning apparatus used after grinding a semiconductor wafer.

  Conventionally, in a semiconductor manufacturing process, after grinding a semiconductor wafer, the semiconductor wafer is cleaned with a spinner cleaning apparatus and dried.

  As a conventional spinner cleaning apparatus, a rotating chuck table having a planar suction holding part for sucking and holding a semiconductor wafer, and an upper surface of the semiconductor wafer sucked and held on the suction holding part of the chuck table are directed to. A cleaning fluid supply means for injecting a cleaning fluid, and a drying that blows the cleaning fluid remaining on the semiconductor wafer by blowing drying air toward the upper surface of the semiconductor wafer sucked and held on the suction holding unit after cleaning. In general, a spinner cleaning apparatus having an air supply means is used (see, for example, Patent Document 1).

  Also, the spinner cleaning apparatus disclosed in Patent Document 1 includes one suction holding body that rotates by sucking and holding the central region of one semiconductor wafer by a suction holding surface portion, and the semiconductor wafer is centered on the suction holding body. A central region (substantially the center) is arranged to rotate.

JP 2003-273055 A Japanese Patent No. 4727859

  The spinner cleaning apparatus disclosed in Patent Document 1 has a problem in that workability is poor because the central region of one semiconductor wafer is sucked and held on the suction holding surface portion of one suction holder.

  The suction holder rotates around the central region of the semiconductor wafer. For this reason, the cleaning fluid remaining on the outer peripheral side is easily removed from the semiconductor wafer due to the centrifugal force at the time of rotation, but remains in the central region (substantially the center) of the semiconductor wafer because it does not receive the centrifugal force. Easy to do. For this reason, the drying process by the next drying air supply means has to be sufficient, and there is a problem that it takes a long working time.

  Therefore, a technical problem to be solved arises in order to provide a spinner cleaning apparatus having a structure capable of simultaneously handling a plurality of semiconductor wafers and facilitating cleaning and drying processing. The present invention aims to solve this problem.

  The present invention has been proposed to achieve the above object, and the invention according to claim 1 is a spinner cleaning apparatus for cleaning a semiconductor wafer, comprising: a rotating table main body; and the table main body; A plurality of chucks are provided on the concentric circles with a predetermined phase angle at substantially equal intervals, each having a suction holding part capable of sucking and holding the semiconductor wafer individually, a negative pressure generating source, and the suction holding part A plurality of suction ports that are respectively provided correspondingly and that individually apply negative pressure generated by the negative pressure generation source to the suction holding unit, and are held by suction on the suction holding unit. There is provided a spinner cleaning apparatus comprising cleaning fluid supply means having a nozzle for ejecting a cleaning fluid toward the semiconductor wafer.

  According to this configuration, the semiconductor wafers are respectively arranged on the plurality of suction holding units provided on one rotating table main body, and are held by suction, and the plurality of semiconductor wafers held by suction are cleaned. Can be done simultaneously. In addition, since it has a plurality of suction ports that can individually apply a negative pressure to each suction holding portion of the chuck table, for example, a semiconductor wafer is placed in all of the suction holding portions to perform cleaning, etc. Even if this process is not performed, it is possible to perform suction / release by placing the semiconductor wafer only on the suction holding unit that requires it. Furthermore, at the time of adsorption / release, adsorption / release can be performed by applying the minimum pressure required for each adsorption port to each of the plurality of adsorption ports. Defects can be prevented.

  According to a second aspect of the present invention, in the configuration of the first aspect, a port control unit that applies an independent negative pressure to each of the suction holding portions between the negative pressure generation source and the plurality of suction ports. Provided is a spinner cleaning apparatus.

  According to this configuration, for example, when the negative pressure supplied from the negative pressure generation source to the suction port is turned on / off by the port control means, only the on / off port control means can be sucked / released independently. . This makes it possible to make a wide range of production plans, such as placing a semiconductor wafer on all of the multiple suction holders for cleaning, or placing a semiconductor wafer only on a specific suction holder for cleaning. become. In addition, since the negative pressure can be adjusted for each suction port according to individual differences, it is possible to prevent the semiconductor wafer from being subjected to stress more than necessary.

  According to a third aspect of the present invention, in the configuration according to the second aspect, the port control means adjusts a negative pressure applied to each of the suction holding units and an air pressure applied to each of the suction holding units at the time of release. A spinner cleaning device is provided which is possible.

  According to this configuration, the release air pressure supplied from the negative pressure generation source to the suction port can be adjusted by the port control means, for example. Therefore, the air pressure for release can be adjusted for each suction port according to individual differences. Thereby, it is possible to prevent more than necessary stress applied to the semiconductor wafer.

  According to a fourth aspect of the present invention, in the configuration according to the first, second, or third aspect, the nozzle includes a nozzle that injects drying air toward the semiconductor wafer sucked and held on the suction holding portion. Provided is a spinner apparatus provided with a drying air supply means.

  According to this configuration, after the cleaning process, the drying air is sprayed from the nozzle toward the semiconductor wafer, and the cleaning fluid remaining on the semiconductor wafer is blown off and dried.

  According to a fifth aspect of the present invention, in the configuration of the first, second, third, or fourth aspect, the cover includes a cover that prevents the cleaning fluid sprayed from the nozzle of the cleaning fluid supply unit from being scattered. Provides a spinner apparatus comprising a cylindrical side cover disposed so as to cover an outer peripheral side portion of the chuck table and an upper cover which covers an upper surface opening of the side cover so as to be opened and closed.

  According to this configuration, the upper part and the side part of the chuck table are completely covered with the side cover and the upper cover, so that the cleaning fluid can be prevented from being scattered during the cleaning of the semiconductor wafer.

  According to a sixth aspect of the present invention, in the configuration according to the first, second, third, fourth, or fifth aspect, the semiconductor wafer is placed on the suction holding portion and the centrifugal force generated when the chuck table rotates and the semiconductor wafer A spinner device is provided which adsorbs and holds the orientation flat so that the orientation flats do not face each other at right angles.

  According to this configuration, since the semiconductor wafer is disposed on the suction holding portion so that the centrifugal force generated when the chuck table rotates and the orientation flat of the semiconductor wafer do not face each other at right angles, the cleaning fluid on the semiconductor wafer is also included. The cleaning fluid on the chuck table can be cut well. That is, when a plurality of semiconductor wafers are placed on the chuck table with the orientation flat facing the center, that is, when the orientation flat is placed at a right angle to the centrifugal force of the chuck table, the chuck table rotates. When the cleaning fluid is moved toward the outer periphery, the cleaning fluid in the stepped portion between the orientation flat and the adsorption holding part strikes at a right angle to the side of the orientation flat and loses the place of flow, and remains in the stepped portion. Easy to cut. However, if the orientation flat is arranged facing the outer periphery without facing the center, the stepped portion is inclined with respect to the direction of the centrifugal force and is disposed facing the outer periphery of the chuck table. The cleaning fluid that hits the side surface of the orientation flat is caused to flow toward the outer peripheral side of the chuck table along the side surface of the orientation flat. As a result, the cleaning fluid on the chuck table can be satisfactorily cut off, including the cleaning fluid at the level difference between the orientation flat and the suction holding portion.

  According to the invention, the semiconductor wafers are respectively disposed on and sucked and held in a plurality of sucking and holding parts provided on one rotating table main body, and a cleaning process or the like of the plurality of semiconductor wafers held and sucked is performed. Since it can be performed simultaneously, workability can be improved.

  In addition, since a plurality of independent suction ports that individually apply negative pressure to each suction holding part of the chuck table are provided, a semiconductor wafer is arranged only in a specific suction holding part among the plurality of suction holding parts. The suction / release operation can be performed in the state of being held. As a result, semiconductor wafers can be placed on all of the multiple suction holders for cleaning, or semiconductor wafers can be placed only on specific suction holders for cleaning. It can be carried out.

  Furthermore, since the work can be performed with a minimum pressure applied to each suction port at the time of suction / release, cracking and chipping can be prevented without applying more stress than necessary to the semiconductor wafer.

1 is an overall configuration perspective view of a spinner cleaning apparatus shown as an embodiment of the present invention. It is a side view of the spinner washing | cleaning apparatus shown in FIG. It is the top view seen from the AA arrow direction of FIG. It is a perspective view which shows the arrangement structure on the chuck table in the spinner washing | cleaning apparatus shown in FIG. It is a top view of the spinner washing | cleaning apparatus shown as other embodiment of this invention. FIG. 6 is a side view of the spinner cleaning apparatus shown in FIG. 5.

  The present invention provides a spinner cleaning apparatus that can handle a plurality of semiconductor wafers at the same time and can reliably perform adsorption / release even if all of the plurality of semiconductor wafers are not prepared. In order to achieve the object, a spinner cleaning apparatus for cleaning a semiconductor wafer, a rotating chuck table having a plurality of suction holding portions for holding each semiconductor wafer by suction, a negative pressure generation source, A plurality of suction ports that are respectively provided corresponding to the suction holding units, and that individually apply the negative pressure generated by the negative pressure generation source to the suction holding unit, and suction on the suction holding unit This is realized by comprising a cleaning fluid supply means having a nozzle for ejecting the cleaning fluid toward the held semiconductor wafer.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same reference numerals are given to the same elements throughout the description of the embodiments. In the following description, expressions indicating directions such as up and down and left and right are not absolute, and are appropriate when each part of the spinner cleaning device of the present invention is depicted. Should change and be interpreted according to the change of posture.

  1 to 3 show a spinner cleaning apparatus 10 according to the present invention. FIG. 1 is a perspective view of the overall configuration, FIG. 2 is a side view thereof, and FIG. 3 is a view from the direction of arrows AA in FIG. FIG. The spinner cleaning apparatus 10 has a function of cleaning and drying the semiconductor wafer W that has been ground or the like.

  The spinner cleaning apparatus 10 shown in FIGS. 1 to 3 includes a rotating body 12 that is rotatably supported by the apparatus body 11, a chuck table 13 that rotates integrally with the rotating body 12, and a body that rotates integrally with the rotating body 12. A rotating pulley 14, a rotary joint 15 disposed coaxially with the rotating main body 12 below the pulley 14, a cleaning fluid supply means 23, a drying air supply means 24, and a scattering prevention cover 25. Is provided. Further, between the chuck table 13 and the rotary joint 15, five suction ports 18A, 18B, 18C, 18D, which pass through the inside of the rotary body 12 and the rotary joint 15 and are independent of each other, 18E is provided. 1, 3, and 4, reference numeral 31 denotes a screw 31 that fixes the chuck table 13 to the rotary body 12.

  The apparatus main body 11 is movable in the vertical direction while maintaining the level. The rotation main body 12 is rotatably supported by the apparatus main body 11 via a bearing (not shown).

  The pulley 14 is fixed to the rotary main body 12 on the lower end side of the rotary main body 12. The pulley 14 is connected to the motor 16 through a transmission belt 17 and a pulley (not shown) that are attached to the output shaft of the motor 16 fixed to the lower surface of the apparatus main body 11 so as to be integrally rotatable with the output shaft. Has been. When the motor 16 is rotationally driven, the pulley 14 receives the rotation of the motor 16 via the transmission belt 17 and rotates integrally with the rotary body 12.

  The rotary joint 15 includes an inner case (not shown) that rotates integrally with the rotary main body 12, an outer case that covers the outer peripheral surface of the inner case, is concentric with the inner case, and is fixed to the inner case so as not to rotate. A case 15a is provided. Further, as shown in FIG. 2, intake ports 18 a to 18 e of the suction ports 18 </ b> A to 18 </ b> E are provided side by side in the vertical direction on the outer peripheral surface of the outer case 15 a. Each intake port 18 a to 18 e is connected to a negative pressure generation source (vacuum source) 22 via a port control unit 21.

  The rotary joint 15 communicates with the suction ports 18A to 18E on the rotating inner case side and the intake ports 18a to 18e on the fixed outer case 15a side, and the internal structure is already known ( For example, see Patent Document 2). Therefore, in the illustrated embodiment, the intake port 18a and the suction port 18A, the suction port 18b and the suction port 18B, the suction port 18c and the suction port 18C, the suction port 18d and the suction port 18D, and the suction port 18e and the suction port 18E, respectively. Even if the inner case rotates with respect to the outer case 15a, the air in the suction ports 18A to 18E can be extracted from the intake ports 18a to 18e on the outer case 15a side. Yes.

  FIG. 4 schematically shows the operation of only the chuck table 13 in a state where the semiconductor wafer W is not placed. The chuck table 13 includes a table main body portion 19 formed in a disk shape and five suction holding portions 20 provided on the upper surface side of the table main body portion 19.

  The table main body 19 is fixed to the upper end of the rotary main body 12 and is disposed so as to be rotatable in a horizontal plane integrally with the rotation of the rotary main body 12.

  The adsorption holding part 20 is formed in a disk shape with a ceramic porous material, and is embedded in a recess (not shown) of the table body part 19 (reference numerals 20a, 20b, 20c, 20d, 20e). (Suction suction holding part having five planar shapes) is provided. In the illustrated embodiment, the five suction holding portions 20 (20a to 20e) have a predetermined phase angle concentric with the rotation center of the table body 19 (72 degrees in this embodiment). Are arranged at equal intervals. In addition, the diameter of each suction holding unit 20 is approximately the same as the diameter of the semiconductor wafer W. In addition, one end of each of the five independent suction ports 18A to 18E is connected to the five suction holding portions 20 in a one-to-one relationship. That is, one end of the suction port 18A is connected to the suction holding unit 20a, one end of the suction port 18B is connected to the suction holding unit 20b, one end of the suction port 18C is connected to the suction holding unit 20c, and one end of the suction port 18D is connected to the suction holding unit 20d. Further, one end of the suction port 18E is independently connected to the suction holding part 20e.

  Each of the suction holding units 20a to 20e has the suction ports 18A to 18A through the port control means 21 by the negative pressure generation source 22 that is a vacuum source in a state where the semiconductor wafer W is placed on each of the suction holding units 20a to 20e. When the air in 18E is removed, a negative pressure is created on each of the suction holding units 20a to 20e, and the semiconductor wafer W can be sucked and held on the suction holding units 20a to 20e, respectively. On the other hand, when air is blown into the suction ports 18A to 18E at the time of release, the suction holding of the semiconductor wafer W can be released.

  The port control means 21 draws out air in the suction ports 18A to 18E from the negative pressure generation source 22, and generates negative pressure in the suction ports 18A to 18E, that is, negative pressure supplied to the suction ports 18A to 18E. On / off and the function of adjusting the magnitude of the negative pressure and the function of adjusting the magnitude of blowing air at the time of release. This adjustment of the negative pressure and the air size is performed according to individual differences between the suction ports 18A to 18E so as not to apply more stress than necessary to the semiconductor wafer W. In addition, by doing so, the semiconductor wafer W can be prevented from being cracked or broken.

  The cleaning fluid supply means 23 and the drying air supply means 24 are arranged on the outside of the chuck table 13 and adjacent to the chuck table 13 via a support shaft 30 having one end attached to the rotary main body 12. It is arrange | positioned so that rotation is possible. Further, the cleaning fluid supply means 23 ejects the cleaning fluid onto the semiconductor wafer W held by suction on the suction holders 20a to 20e, and has a nozzle 23a having a jet port directed downward (semiconductor wafer W side). The drying air supply means 24 injects air for drying onto the semiconductor wafer W that is sucked and held on the suction holding portions 20a to 20e, and is a jet directed toward the lower side (semiconductor wafer W side). It has a nozzle 24a having an outlet.

  Each of the cleaning fluid supply means 23 and the drying air supply means 24 can reciprocate in a fan shape from one end side, that is, from the outside of the chuck table 13 through the center of the chuck table 13 with the support shaft 30 as a fulcrum. . Therefore, when the cleaning fluid supply means 23 reciprocally turns, if the cleaning fluid is ejected from the nozzle 23a of the cleaning fluid supply means 23 toward the semiconductor wafer W, the semiconductor adsorbed and held on the adsorption holding portions 20a to 20e. The cleaning fluid hits the wafer W, and the upper surface of the semiconductor wafer W can be cleaned. In addition, after cleaning, when the wafer 24 is reciprocally swung while spraying drying air from the nozzle 24a of the drying air supply means 24 toward the semiconductor wafer W, the semiconductor wafer W held by suction on the suction holding portions 20a to 20e. The semiconductor wafer W can be dried by blowing away the cleaning fluid remaining on the substrate with the air.

  The scattering prevention cover 25 includes a side cover 25a and an upper cover 25b. The side cover 25 a is a cylindrical cover that is disposed so as to cover the outer peripheral side portion of the chuck table 13 and has an open top surface, and the lower end side is fixed to the apparatus main body 11. The cleaning fluid supply means 23 and the drying air supply means 24 are also arranged in the side cover 25a, and both can reciprocate in the side cover 25a. Further, the height of the side cover 25a, that is, the upper end of the side cover 25a is slightly lower (lower side) than the upper surface of the chuck table 13 (the surface on which the suction holding unit 20 is provided), and holds the semiconductor wafer W by suction. It is set so as not to hinder the work of carrying and unloading on the unit 20.

  The upper cover 25b is a cap-like cover having an upper surface closed and a lower surface facing the side cover 25a opened. Further, the inner diameter of the upper cover 25b is slightly larger than the outer diameter of the side cover 25a, and is arranged to be movable up and down substantially above the side cover 25a. Then, the upper cover 25b is lowered when the spinner cleaning apparatus 10 performs cleaning and drying of the semiconductor wafer W, and the upper end of the side cover 25a is caused to enter the upper cover 25b from the lower surface opening of the upper cover 25b. The upper surface opening of the part cover 25a is closed.

  Therefore, when the upper cover 25b closes the upper surface opening of the side cover 25a, the inside of the cover 25 for preventing scattering becomes like a substantially sealed space, and the chuck table 13 and the cleaning fluid supply are provided in this sealed space. Means 23 and air supply means 24 for drying are arranged, and cleaning and drying are performed in this sealed space, so that the cleaning fluid and the like can be prevented from scattering around.

  Next, the operation of the spinner cleaning apparatus 10 configured as described above will be described. First, the upper cover 25b is disposed at the raised position, and the upper surface opening of the side cover 25a is opened. Further, in a state where the upper surface opening of the side cover 25a is open, the ground semiconductor wafer W is sent to the spinner cleaning device 10 by a transfer device (not shown), and the suction holding portions 20a to 20 of the chuck table 13 are transferred. 20e is arranged on each. 1 and 3 show a state in which the ground semiconductor wafers W are disposed on the suction holding portions 20a to 20e, respectively. Here, all the semiconductor wafers W are set such that the orientation flats 26 are arranged on the outer peripheral side of the chuck table 13 as shown in the figure.

  Next, the negative pressure generation source 22 is driven, and the air in the suction ports 18A to 18E is sucked through the port control means 21, and negative pressure is generated on the suction holding portions 20a to 20e by sucking the air. The semiconductor wafer W is sucked and held on the suction holding portions 20a to 20e. In this case, the port control means 21 adjusts the magnitude of the negative pressure according to the individual difference between the suction ports 18A to 18E.

  Subsequently, the upper cover 25b is lowered and the scattering prevention cover 25 is closed. When the scattering prevention cover 25 is closed, the motor 16 is driven to rotate the chuck table 13 together with the rotating main body 12 in a horizontal plane. Simultaneously with this rotation, the cleaning fluid supply means 23 is moved from the outside of the chuck table 13 to the chuck table 13 while spraying the cleaning fluid from the nozzle 23 a of the cleaning fluid supply means 23 toward the semiconductor wafer W on the chuck table 13. A reciprocating swivel movement is made in a fan shape through the center. Reference numeral 27 in FIG. 3 indicates a turning movement locus of the cleaning fluid supply means 23. The cleaning fluid is sprayed and the rotational centrifugal force of the chuck table 13 removes contaminants and the like adhering to each semiconductor wafer W, thereby completing the cleaning.

  When cleaning is completed, in the state where the chuck table 13 is rotating, instead of the cleaning fluid supply means 23, drying air is sprayed onto the chuck table 13 from the nozzle 24 a of the drying air supply means 24. The drying air supply means 24 is reciprocally swung in a fan shape from the outside of the chuck table 13 through the center of the chuck table 13. Reference numeral 28 in FIG. 3 indicates a turning movement locus of the drying air supply means 24. By blowing the drying air and the rotational centrifugal force of the chuck table 13, the cleaning fluid remaining on the semiconductor wafer W is blown off and dried.

  In this drying process, in the illustrated embodiment, the orientation flat 26 is arranged on the outer peripheral side of the chuck table 13 in each semiconductor wafer W, and the centrifugal force generated when the chuck table 13 rotates and the orientation flat 26 do not face each other at a right angle. As a result, the cleaning fluid at the level difference between the orientation flat 26 and the suction holding portions 20 a to 20 e also flows toward the outer peripheral side of the chuck table 13.

  That is, when the plurality of semiconductor wafers W are arranged on the chuck table 13 with the orientation flat 26 facing the center, that is, when the orientation flat 26 is arranged at right angles to the centrifugal force of the chuck table 13, the chuck When the table 13 rotates and the cleaning fluid is brought closer to the outer peripheral side, the cleaning fluid in the stepped portion between the orientation flat 26 and the suction holding portions 20a to 20e hits the side surface of the orientation flat 26 at a right angle from the right and flows. Losing the destination, it tends to remain in the stepped portion, and the cut becomes worse. However, when the orientation flat 26 is arranged not toward the center but toward the outer peripheral side, the stepped portion is inclined with respect to the direction of the centrifugal force and is disposed toward the outer peripheral side of the chuck table 13. Therefore, the cleaning fluid that has hit the side surface of the orientation flat 26 is caused to flow toward the outer peripheral side of the chuck table 13 along the side surface of the orientation flat 26. Thereby, the cleaning fluid on the chuck table 13 can be satisfactorily cut off, including the cleaning fluid at the level difference between the orientation flat 26 and the suction holding portions 20a to 20e.

  When the drying process by the drying air supply means 24 is completed, the driving of the motor 16 is stopped and the rotation of the chuck table 13 is also stopped. Next, the suction of air to the suction ports 18A to 18E by the negative pressure vacuum source 22 is released, and air is blown into the suction ports 18A to 18E from the port control means 21 side, and the suction holding of the semiconductor wafer W is released. . That is, the semiconductor wafer W is released.

  Next, the upper cover 25b is moved to the raised position, and the scattering prevention cover 25 is opened. Then, each semiconductor wafer W that has been cleaned and dried is sucked and held by a transfer device (not shown) and transferred to the next step. This completes a series of cleaning and drying processes.

  In the above description, the case where the semiconductor wafer W is arranged on all the five suction holding portions 20a to 20e on the chuck table 13 and the cleaning and drying operations are performed is described. However, depending on the production plan or the like, the semiconductor wafer W is not placed on all of the five suction holding portions 20a to 20e, and the semiconductor wafer W is placed on, for example, three suction holding portions 20a, 20c, and 20d and cleaned. And drying process. In this case, the port control means 21 closes the intake ports 18b and 18e and opens the three intake ports 18a, 18c and 18d for processing. In this way, the suction holding units 20b and 20e are disconnected from the negative pressure generation source 22, and only the suction holding units 20a, 20c and 20d are connected to the negative pressure generation source 22 for processing. That is, the suction ports 18A to 18E for applying a negative pressure to the suction holding portions 20a to 20e of the chuck table 13 are independent from each other, so that the semiconductor wafers W are arranged in all the suction holding portions 20a to 20e. Thus, without performing processing such as cleaning and drying, it is possible to perform suction / release by placing the semiconductor wafer W only on the necessary suction holding portions 20a to 20e.

  In the above embodiment, the case where the five suction holding portions 20a to 20e are provided on the chuck table 13 has been described. However, the number is not limited to five, and two or more. It's okay.

  Further, in the case of the above embodiment, the case where the intake ports 18A to 18E are independent from each other has been described as the best embodiment, but the intake ports 18A to 18E are not independent, for example, FIG. 5 and FIG. The spinner cleaning apparatus 100 having the structure as shown in FIG.

  The spinner cleaning apparatus 100 shown in FIGS. 5 and 6 has a plurality of (five in the illustrated example) suction holding units 102 each having a planar shape for holding each semiconductor wafer (not shown) on a rotating chuck table 101. In addition, the cleaning fluid supply means 103 and the drying air supply means 104 are disposed outside the chuck table 101 adjacent to the chuck table 101.

  In the case of the illustrated example, the five suction holding portions 102 having a planar shape are arranged at equal intervals with a predetermined phase angle (72 degrees in the present embodiment) concentrically with the rotation center of the chuck table 101. ing.

  In this spinner cleaning apparatus 100, there is one suction port 105 that connects between the suction holding unit 102 of the chuck table 101 and a negative pressure generation source (vacuum source) (not shown). The branched suction port 105a is branched, and each of the five branched suction ports 105a is connected to the corresponding suction holding portion 102.

  Then, when each semiconductor wafer is arranged on each suction holding unit 102 and then the air in the intake port 105 is sucked by a negative pressure generation source to generate a negative pressure in each suction holding unit 102, each suction holding unit 102 Each of the semiconductor wafers arranged on 102 is sucked (sucked and held) by each suction holding unit 102. In addition, while rotating the chuck table 101 while sucking and holding the semiconductor wafer, the cleaning fluid supply means 103 passes from the outside of the chuck table 101 through the center of the chuck table 101 while spraying the cleaning fluid toward the semiconductor wafer. The semiconductor wafer can be cleaned by reciprocating in a fan shape.

  Further, after cleaning, while the chuck table 101 is rotating, the drying air supply means 104 is moved from the outside of the chuck table 101 to the center of the chuck table 101 while spraying drying air toward the semiconductor wafer W. When the fan is reciprocated in a fan shape, the cleaning fluid remaining on the semiconductor wafer can be blown off with air to dry the semiconductor wafer. Further, after the cleaning and drying processes are completed, if the negative pressure on each suction holding unit 102 by the negative pressure generation source is removed, the suction of each suction holding unit 102 to the semiconductor wafer is released and the semiconductor wafer can be released. it can.

  Therefore, in the spinner cleaning apparatus 100 shown in FIGS. 5 and 6, the semiconductor wafers are arranged on the plurality of suction holding portions 102 provided on one rotating chuck table 101 and are held by suction, and these suction holdings are performed. A plurality of semiconductor wafers thus cleaned can be simultaneously cleaned. Thereby, workability can be improved.

  It should be noted that the present invention can be variously modified without departing from the spirit of the present invention, and the present invention naturally extends to the modified ones.

DESCRIPTION OF SYMBOLS 10 Spinner washing | cleaning apparatus 11 Apparatus main body 12 Rotating main body part 13 Chuck table 14 Pulley 15 Rotary joint 15a External case 16 Motor 17 Transmission belt 18A-18E Suction port 18a-18e Intake port 19 Table main body part 20 (20a-20e) Suction holding part 21 Port control means 22 Negative pressure generation source (vacuum source)
23 Cleaning fluid supply means 23a Nozzle 24 Drying air supply means 24a Nozzle 25 Splash prevention cover 25a Side cover 25b Top cover 26 Orientation flat 27 Swirling movement locus 28 of the cleaning fluid supply means 23 Swirling movement of the drying air supply means 24 Trajectory 30 Support shaft 31 Screw W Semiconductor wafer 100 Spinner cleaning apparatus 101 Chuck table 102 Suction holding unit 103 Cleaning fluid supply means 104 Drying air supply means 105 Suction port 105a Branch suction port

Claims (6)

A spinner cleaning apparatus for cleaning a semiconductor wafer,
A chuck table comprising: a rotating table main body; and a plurality of suction holding portions that are provided at substantially equal intervals with a predetermined phase angle on a concentric circle with the table main body, each of which is capable of individually holding the semiconductor wafer. ,
A negative pressure source;
A plurality of suction ports that are provided corresponding to the suction holding units, respectively, and that individually apply the negative pressure generated by the negative pressure generation source to the suction holding unit;
Cleaning fluid supply means having a nozzle for ejecting cleaning fluid toward the semiconductor wafer held by suction on the suction holding unit;
A spinner cleaning apparatus comprising:   The spinner cleaning apparatus according to claim 1, further comprising a port control unit that applies an independent negative pressure to each of the suction holding units between the negative pressure generation source and the plurality of suction ports.   3. The spinner cleaning device according to claim 2, wherein the port control unit is capable of adjusting a negative pressure applied to each of the suction holding units and an air pressure applied to each of the suction holding units at the time of release. .   The air supply means for a drying provided with the nozzle which injects the air for drying toward the said semiconductor wafer adsorbed-held on the said adsorption-holding part is provided, The air supply means for a drying is provided, The Claim 1, 2, or 3 characterized by the above-mentioned. Spinner cleaning device. A cover for preventing scattering of the cleaning fluid sprayed from the nozzle of the cleaning fluid supply means;
The cover includes a cylindrical side cover disposed so as to cover an outer peripheral side portion of the chuck table, and an upper cover that covers an upper surface opening of the side cover so as to be opened and closed.
The spinner cleaning apparatus according to claim 1, 2, 3 or 4. 4. The semiconductor wafer is sucked and held on the suction holding portion so that a centrifugal force generated when the chuck table rotates and an orientation flat of the semiconductor wafer do not face each other at a right angle. The spinner cleaning apparatus according to 4 or 5.