TWI867929B - Electronic chip, display device and information processing device with uplink signal generating function - Google Patents
Electronic chip, display device and information processing device with uplink signal generating function Download PDFInfo
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Abstract
本發明揭示一種具上行信號產生功能之電子晶片,用於電性連接一觸控模組;其特徵在於,該電子晶片被配置以執行以下功能:當所述觸控模組由手部按壓時,將一上行信號驅動至非手部覆蓋的複數欄(Column)公共電極,且將餘下的公共電極接地,藉此方式消除手部衍生的疊加至所述上行信號的雜訊並同時達到提高該上行信號的強度之效果,使得觸控筆即使在用戶以其手部按壓螢幕的情況下還是能夠對上行信號作出正常識別。The present invention discloses an electronic chip with an uplink signal generating function, which is used for electrically connecting a touch module; its characteristic is that the electronic chip is configured to perform the following functions: when the touch module is pressed by a hand, an uplink signal is driven to the common electrodes of a plurality of columns not covered by the hand, and the remaining common electrodes are grounded, thereby eliminating the noise derived from the hand superimposed on the uplink signal and at the same time achieving the effect of increasing the strength of the uplink signal, so that the touch pen can still normally recognize the uplink signal even when the user presses the screen with his hand.
Description
本發明為TDDI晶片或觸控晶片之相關技術領域,尤指一種具上行信號產生功能之電子晶片,其整合在一具有觸控功能的電子裝置(如平板電腦)之中,且被配置用以使得該電子裝置能夠傳送高品質、高強度的上行信號至一觸控筆。 The present invention relates to the technical field of TDDI chips or touch chips, and in particular to an electronic chip with an uplink signal generating function, which is integrated into an electronic device with a touch function (such as a tablet computer) and is configured to enable the electronic device to transmit high-quality, high-strength uplink signals to a touch pen.
圖1為一平板電腦與一觸控筆的立體圖。如圖1所示,近年來,除了以手指觸摸控制具觸控功能與大尺寸螢幕的電子裝置(如:平板電腦1a),用戶還會購買一觸控筆2a用於觸控操作該平板電腦1a。正常工作時,該平板電腦1a內的一TDDI晶片或一觸控晶片週期性地傳送一上行(uplink)訊號至該觸控筆2a,且該觸控筆2a週期性地回傳一下行(downlink)訊號。 FIG1 is a three-dimensional diagram of a tablet computer and a touch pen. As shown in FIG1, in recent years, in addition to controlling electronic devices with touch functions and large-size screens (such as tablet computers 1a) by finger touch, users also purchase a touch pen 2a for touch operation of the tablet computer 1a. During normal operation, a TDDI chip or a touch chip in the tablet computer 1a periodically transmits an uplink signal to the touch pen 2a, and the touch pen 2a periodically returns a downlink signal.
目前,具內嵌式(in-cell)觸控面板之觸控模組因具有較好的厚度表面故而成為主流應用。圖2為一具內嵌式觸控面板之觸控模組的示意性側剖視圖。如圖2所示,該觸控模組3a包括:一LED背光板31a、一底部極化膜片32a、一TFT基板33a、一底部電極層34a、一LCD面板35a、一彩色濾光板36a、一頂部電極層37a、以及一玻璃蓋板38a,其中,該LCD面板35a與該彩色濾光板36a組成一介電層,從而與該底部電極層34a以及該頂部電極層37a一同構成一內嵌式觸控面板。 At present, touch modules with in-cell touch panels have become mainstream applications because of their better thickness and surface. Figure 2 is a schematic side sectional view of a touch module with an in-cell touch panel. As shown in Figure 2, the touch module 3a includes: an LED backlight panel 31a, a bottom polarization film 32a, a TFT substrate 33a, a bottom electrode layer 34a, an LCD panel 35a, a color filter plate 36a, a top electrode layer 37a, and a glass cover plate 38a, wherein the LCD panel 35a and the color filter plate 36a form a dielectric layer, thereby forming an in-cell touch panel together with the bottom electrode layer 34a and the top electrode layer 37a.
熟悉觸控模組之設計與製造的電子工程師應知道,該TFT基板33a具有複數個畫素電路,且該底部電極層34a包括複數個公共電極對應耦接至該複數個畫素電路。圖3為複數個畫素電路與複數個公共電極的上視圖。如圖2與圖3所示,該底部電極層34a設置在該TFT基板33a之上,且包括K個公共電極341a,使得L個所述畫素電路331a共用一個公共電極341a,其中K、L皆為正整數。更詳細地說明,以橫向為行(Line)且直向為欄(Column),同一欄的多個所述畫素電路331a係耦接至同一條源極線33Sa,且同一行的多個所述畫素電路331a係耦接至同一條閘極線33Ga。 Electronic engineers familiar with the design and manufacture of touch modules should know that the TFT substrate 33a has a plurality of pixel circuits, and the bottom electrode layer 34a includes a plurality of common electrodes correspondingly coupled to the plurality of pixel circuits. FIG. 3 is a top view of the plurality of pixel circuits and the plurality of common electrodes. As shown in FIG. 2 and FIG. 3, the bottom electrode layer 34a is disposed on the TFT substrate 33a and includes K common electrodes 341a, so that L pixel circuits 331a share one common electrode 341a, where K and L are both positive integers. To explain in more detail, with the horizontal direction being a row (Line) and the vertical direction being a column (Column), multiple pixel circuits 331a in the same column are coupled to the same source line 33Sa, and multiple pixel circuits 331a in the same row are coupled to the same gate line 33Ga.
在目前的應用中,通常是以複數個所述公共電極341a作為該內嵌式觸控面板的複數個信號接收(RX)電極,且以該頂部電極層37a的複數個頂部電極作為該內嵌式觸控面板的複數個信號傳送(TX)電極。並且,如圖2與圖3所示,各所述公共電極341a耦接一條直向的第一金屬線34Ma,使TDDI晶片對各所述公共電極341a作出欄(Column)方向的控制。具體地,TDDI晶片係透過多個所述公共電極341a傳送上行訊號至該觸控筆2a,且同樣透過多個所述公共電極341a自該觸控筆2a接收下行訊號。補充說明的是,實際應用中還可以令各所述公共電極341a耦接一條橫向的第二金屬線(未圖示),使TDDI晶片對各所述公共電極341a作出行(Line)方向的控制。 In current applications, a plurality of the common electrodes 341a are usually used as a plurality of signal receiving (RX) electrodes of the embedded touch panel, and a plurality of top electrodes of the top electrode layer 37a are used as a plurality of signal transmitting (TX) electrodes of the embedded touch panel. Furthermore, as shown in FIG. 2 and FIG. 3 , each of the common electrodes 341a is coupled to a vertical first metal line 34Ma, so that the TDDI chip controls each of the common electrodes 341a in a column direction. Specifically, the TDDI chip transmits an uplink signal to the touch pen 2a through the plurality of the common electrodes 341a, and also receives a downlink signal from the touch pen 2a through the plurality of the common electrodes 341a. It should be noted that in actual application, each common electrode 341a can be coupled to a second horizontal metal line (not shown) so that the TDDI chip can control each common electrode 341a in the line direction.
實務經驗顯示,受限於TDDI晶片的積體電路製程,能夠施加在信號接收(RX)電極的電壓通常不超過5.5V,亦即上行訊號的電壓準位不會超過5.5V。另一方面,使用平板電腦時,用戶通常以右手握持該觸控筆2a,並以左手按壓在該平板電腦的螢幕之上;在此情況下,因上行訊號的電壓準位不超過5.5V,致使由用戶左手衍生的雜訊會嚴重影響上行信號的質量,致使該 觸控筆2a無法正常識別其通過信號接收電極所接收的上行信號。綜上所述,應考慮對現有的TDDI晶片通過信號接收電極所發送的上行信號進行強度提升,使該觸控筆2a即使在用戶左手(或右手)按壓螢幕的情況下還是能夠正常識別其接收的上行信號。 Practical experience shows that, due to the limitation of the integrated circuit process of the TDDI chip, the voltage that can be applied to the signal receiving (RX) electrode usually does not exceed 5.5V, that is, the voltage level of the uplink signal does not exceed 5.5V. On the other hand, when using a tablet computer, the user usually holds the stylus 2a with the right hand and presses the tablet computer screen with the left hand; in this case, because the voltage level of the uplink signal does not exceed 5.5V, the noise generated by the user's left hand will seriously affect the quality of the uplink signal, causing the stylus 2a to be unable to normally identify the uplink signal received by the signal receiving electrode. In summary, it is necessary to consider increasing the strength of the uplink signal sent by the existing TDDI chip through the signal receiving electrode, so that the stylus 2a can still normally identify the uplink signal it receives even when the user presses the screen with his left hand (or right hand).
由上述說明可知,本領域亟需一種新式的具上行信號產生功能之電子晶片。 From the above description, it can be seen that this field urgently needs a new type of electronic chip with uplink signal generation function.
本發明之主要目的在於提供一種具上行信號產生功能之電子晶片,其可為一觸控晶片或一TDDI晶片,且用於電性連接一觸控模組。依據本發明,該電子晶片被配置以執行以下功能:當所述觸控模組由手部按壓時,將一上行信號驅動至非手部覆蓋的複數欄(Column)公共電極,且將餘下的公共電極接地,藉此方式消除手部衍生的疊加至所述上行信號的雜訊並同時達到提高該上行信號的強度之效果,使得觸控筆即使在用戶以其手部按壓螢幕的情況下還是能夠對上行信號作出正常識別。 The main purpose of the present invention is to provide an electronic chip with an uplink signal generating function, which can be a touch chip or a TDDI chip, and is used to electrically connect a touch module. According to the present invention, the electronic chip is configured to perform the following functions: when the touch module is pressed by a hand, an uplink signal is driven to the common electrodes of a plurality of columns not covered by the hand, and the remaining common electrodes are grounded, thereby eliminating the noise derived from the hand superimposed on the uplink signal and at the same time achieving the effect of increasing the strength of the uplink signal, so that the touch pen can still normally identify the uplink signal even when the user presses the screen with his hand.
為達成上述目的,本發明提出一種具上行信號產生功能之電子晶片,其係用於電性連接一觸控模組以執行一觸控筆之觸控偵測程序,其特徵在於該觸控偵測程序係依是否存在一手部按壓事件而定,且其包括:當在該觸控模組上未偵測到該手部按壓事件且未偵測到該觸控筆之筆尖觸點時,該電子晶片將一上行(uplink)信號傳送至該觸控模組的各欄(Column)公共電極,同時對該觸控模組的各條源極線作一第一電性處理;以及 當在該觸控模組上偵測到該手部按壓事件及該觸控筆之筆尖觸點時,該電子晶片將一上行(uplink)信號傳送至以該筆尖觸點所在之一欄所述公共電極為中心之一帶狀感測區,該帶狀感測區包含奇數欄所述公共電極,並將該帶狀感測區以外的各欄所述公共電極接地,同時對該觸控模組的各條源極線作一第二電性處理。 To achieve the above-mentioned purpose, the present invention provides an electronic chip with an uplink signal generating function, which is used to electrically connect a touch module to execute a touch detection procedure of a touch pen. The touch detection procedure is characterized in that the touch detection procedure depends on whether a hand pressing event exists, and includes: when the hand pressing event is not detected on the touch module and the pen tip of the touch pen is not detected, the electronic chip transmits an uplink signal to the common electrode of each column of the touch module, At the same time, a first electrical processing is performed on each source line of the touch module; and When the hand pressing event and the pen tip touch point of the touch pen are detected on the touch module, the electronic chip transmits an uplink signal to a strip sensing area centered on the common electrode of a column where the pen tip touch point is located, the strip sensing area includes the common electrodes of the odd columns, and the common electrodes of each column outside the strip sensing area are grounded, and at the same time, a second electrical processing is performed on each source line of the touch module.
在一實施例中,當該帶狀感測區與該手部按壓事件所覆蓋的多欄所述公共電極重疊時,該電子晶片將該手部按壓事件所覆蓋的多行(Line)所述公共電極接地。 In one embodiment, when the strip sensing area overlaps with the multiple columns of common electrodes covered by the hand pressing event, the electronic chip grounds the multiple rows of common electrodes covered by the hand pressing event.
在一實施例中,該電性處理係將該上行信號驅動至所述源極線或將所述源極線切換至高阻抗狀態(Hi-Z)。 In one embodiment, the electrical processing is to drive the upstream signal to the source line or switch the source line to a high impedance state (Hi-Z).
為達成上述目的,本發明提出所述具上行信號產生功能之電子晶片之另一實施例,其係用於電性連接一觸控模組;其特徵在於,所述電子晶片被配置以包括以下功能:執行一第一信號驅動操作:在所述觸控模組未由一手部按壓且未有一觸控筆被使用於觸控該觸控模組的情況下,將一上行(uplink)信號驅動至該觸控模組所包含的N/P欄(Column)公共電極,同時對該觸控模組所包含的N條源極線作一第一電性處理;其中,P、N、N/P皆為正整數;執行一第二信號驅動操作:在該觸控模組由所述手部按壓且由所述觸控筆觸控操作的情況下,若所述手部的按壓範圍涵蓋第j欄至第j+q欄的所述公共電極且所述觸控筆的一筆尖所落在的所述公共電極非屬第j欄至第j+q欄,將該上行信號驅動至該筆尖所落在的所述公共電極之所屬第r欄以及第r欄至第r -s欄和第r欄至第r+s欄的所述公共電極,並將餘下的所述公共電極接地;其中,jN/P,且q、r、s為正整數;以及執行一第三信號驅動操作:在該觸控模組由所述手部按壓且由所述觸控筆觸控操作的情況下,若所述手部的按壓範圍涵蓋第j欄至第j+q欄的所述公共電極且所述觸控筆的該筆尖所落在第j欄至第j+q欄之中的一個所述公共電極,將該上行信號驅動至該筆尖所落在的所述公共電極之所屬第r欄以及第r欄至第r-s欄和第r欄至第r+s欄的所述公共電極,將由所述手部的按壓範圍所涵蓋複數行(Line)所述公共電極接地,並將餘下的所述公共電極接地。 To achieve the above-mentioned purpose, the present invention proposes another embodiment of the electronic chip with the uplink signal generating function, which is used to electrically connect a touch module; its characteristic is that the electronic chip is configured to include the following functions: executing a first signal driving operation: when the touch module is not pressed by a hand and a touch pen is not used to touch the touch module, an uplink signal is driven to the common electrode of the N/P column included in the touch module, and at the same time, the touch module is electrically connected to the touch module. The N source lines included in the group are subjected to a first electrical processing; wherein P, N, and N/P are all positive integers; a second signal driving operation is performed: when the touch module is pressed by the hand and the touch pen is used for touch operation, if the pressing range of the hand covers the common electrodes of the jth column to the j+qth column and the common electrode where the tip of the touch pen lands does not belong to the jth column to the j+qth column, the uplink signal is driven to the rth column to which the common electrode where the tip of the touch pen lands belongs and the common electrodes of the rth column to the r-s column and the rth column to the r+s column, and the remaining common electrodes are grounded; wherein, j N/P, and q, r, s are positive integers; and executing a third signal driving operation: when the touch module is pressed by the hand and touched by the touch pen, if the pressing range of the hand covers the common electrodes of the jth column to the j+qth column and the tip of the touch pen falls on one of the common electrodes in the jth column to the j+qth column, the uplink signal is driven to the rth column to which the common electrode where the tip falls belongs, as well as the common electrodes of the rth column to the rsth column and the rth column to the r+sth column, the common electrodes of the multiple rows (Line) covered by the pressing range of the hand are grounded, and the remaining common electrodes are grounded.
在一實施例中,該電子晶片為選自於由觸控晶片與觸控和顯示驅動整合(Touch and Display Driver Integration,TDDI)晶片所組成群組之中的任一者。 In one embodiment, the electronic chip is selected from any one of the group consisting of a touch chip and a touch and display driver integration (TDDI) chip.
在一實施例中,所述第一電性處理係將該上行信號驅動至所述源極線或將所述源極線切換至高阻抗狀態(Hi-Z)。 In one embodiment, the first electrical processing is to drive the upstream signal to the source line or switch the source line to a high impedance state (Hi-Z).
在可行的實施例中,該電子晶片係被配置以更包括以下功能: In a feasible embodiment, the electronic chip is configured to further include the following functions:
行一第四信號驅動操作:在該觸控模組由所述手部按壓且未有所述觸控筆與所述公共電極進行信號耦合的情況下,將該N/P欄(Column)公共電極分成包含複數個奇數子區塊與複數個偶數子區塊的Y個子區塊,使得每個所述子區塊含有N/(P×Y)個所述公共電極以及N/Y條所述源極線,並於第n個顯示幀將該上行信號驅動至屬於所述奇數子區塊的所述公共電極以及將屬於所述偶數子區塊的所述公共電極接地,且於第n+1個顯示幀將該上行信號驅動至屬於所述偶數子區塊的所述公共電極以及將屬於所述奇數子區塊的所述公共電極接地;Y、n為正整數。 A fourth signal driving operation is performed: when the touch module is pressed by the hand and the touch pen is not coupled to the common electrode, the N/P column common electrode is divided into Y sub-blocks including a plurality of odd sub-blocks and a plurality of even sub-blocks, so that each sub-block contains N/(P×Y) common electrodes and N/Y strips. The source line drives the uplink signal to the common electrode belonging to the odd sub-block and grounds the common electrode belonging to the even sub-block in the nth display frame, and drives the uplink signal to the common electrode belonging to the even sub-block and grounds the common electrode belonging to the odd sub-block in the n+1th display frame; Y and n are positive integers.
在一實施例中,執行所述第四信號驅動操作之時,該電子晶片在第n個顯示幀同時對屬於所述奇數子區塊的所述源極線進行所述第一電性處理以及將屬於所述偶數子區塊的所述源極線執行一第二電性處理,且於第n+1個顯示幀對屬於所述偶數子區塊的所述所述源極線進行所述第一電性處理以及將屬於所述奇數子區塊的所述源極線執行所述第二電性處理。 In one embodiment, when executing the fourth signal driving operation, the electronic chip performs the first electrical processing on the source lines belonging to the odd sub-blocks and performs a second electrical processing on the source lines belonging to the even sub-blocks at the nth display frame, and performs the first electrical processing on the source lines belonging to the even sub-blocks and performs the second electrical processing on the source lines belonging to the odd sub-blocks at the n+1th display frame.
在一實施例中,所述第二電性處理係將所述源極線接地或將所述源極線切換至高阻抗狀態(Hi-Z)。 In one embodiment, the second electrical processing is to ground the source line or switch the source line to a high impedance state (Hi-Z).
在一實施例中,執行所述第二信號驅動操作之時,該電子晶片同時對第r欄、第r欄至第r-s欄以及第r欄至第r+s欄的所述源極線進行所述第一電性處理,並對餘下的所述源極線進行所述第二電性處理。 In one embodiment, when executing the second signal driving operation, the electronic chip simultaneously performs the first electrical processing on the source lines of the rth column, the rth column to the r-sth column, and the rth column to the r+sth column, and performs the second electrical processing on the remaining source lines.
在一實施例中,執行所述第三信號驅動操作之時,該電子晶片同時對第r欄、第r欄至第r-s欄以及第r欄至第r+s欄的所述源極線進行所述第一電性處理,並將餘下的所述源極線進行所述第二電性處理。 In one embodiment, when executing the third signal driving operation, the electronic chip simultaneously performs the first electrical processing on the source lines of the rth column, the rth column to the r-sth column, and the rth column to the r+sth column, and performs the second electrical processing on the remaining source lines.
並且,本發明還一種顯示裝置的一實施例,其包括一觸控模組以及電性連接該觸控模組的一具上行信號產生功能之電子晶片;其特徵在於,所述電子晶片被配置包括以下功能:執行一第一信號驅動操作:在所述觸控模組未由一手部按壓且未有一觸控筆被使用於觸控該觸控模組的情況下,將一上行(uplink)信號驅動至該觸控模組所包含的N/P欄(Column)公共電極,同時對該觸控模組所包含的N條源極線作一第一電性處理;其中,P、N、N/P皆為正整數;執行一第二信號驅動操作:在該觸控模組由所述手部按壓且由所述觸控筆觸控操作的情況下,若所述手部的按壓範圍涵蓋第j欄至第j+q欄的所述公共 電極且所述觸控筆的一筆尖所落在的所述公共電極非屬第j欄至第j+q欄,將該上行信號驅動至該筆尖所落在的所述公共電極之所屬第r欄以及第r欄至第r-s欄和第r欄至第r+s欄的所述公共電極,並將餘下的所述公共電極接地;其中,jN/P,且q、r、s為正整數;以及執行一第三信號驅動操作:在該觸控模組由所述手部按壓且由所述觸控筆觸控操作的情況下,若所述手部的按壓範圍涵蓋第j欄至第j+q欄的所述公共電極且所述觸控筆的該筆尖所落在第j欄至第j+q欄之中的一個所述公共電極,將該上行信號驅動至該筆尖所落在的所述公共電極之所屬第r欄以及第r欄至第r-s欄和第r欄至第r+s欄的所述公共電極,將由所述手部的按壓範圍所涵蓋複數行(Line)所述公共電極接地,並將餘下的所述公共電極接地。 Furthermore, the present invention also provides an embodiment of a display device, which includes a touch module and an electronic chip electrically connected to the touch module and having an uplink signal generating function; the electronic chip is configured to include the following functions: performing a first signal driving operation: when the touch module is not pressed by a hand and a touch pen is not used to touch the touch module, an uplink signal is driven to the common electrode of the N/P columns included in the touch module, and a first electrical treatment is performed on the N source lines included in the touch module; wherein P, N, and N/P are all positive integers; executing a second signal driving operation: when the touch module is pressed by the hand and touched by the touch pen, if the pressing range of the hand covers the common electrodes of the jth column to the j+qth column and the common electrode where the tip of the touch pen lands does not belong to the jth column to the j+qth column, the uplink signal is driven to the common electrodes of the rth column to which the common electrode where the tip of the touch pen lands belongs and the common electrodes of the rth column to the rsth column and the rth column to the r+sth column, and the remaining common electrodes are grounded; wherein, j N/P, and q, r, s are positive integers; and executing a third signal driving operation: when the touch module is pressed by the hand and touched by the touch pen, if the pressing range of the hand covers the common electrodes of the jth column to the j+qth column and the tip of the touch pen falls on one of the common electrodes in the jth column to the j+qth column, the uplink signal is driven to the rth column to which the common electrode where the tip falls belongs and the common electrodes of the rth column to the rsth column and the rth column to the r+sth column, the common electrodes of the multiple rows (Line) covered by the pressing range of the hand are grounded, and the remaining common electrodes are grounded.
在一實施例中,該電子晶片為選自於由觸控晶片與觸控和顯示驅動整合(Touch and Display Driver Integration,TDDI)晶片所組成群組之中的任一者。 In one embodiment, the electronic chip is any one selected from the group consisting of a touch chip and a touch and display driver integration (TDDI) chip.
在一實施例中,所述電性處理係將該上行信號驅動至所述源極線或將所述源極線切換至高阻抗狀態(Hi-Z)。 In one embodiment, the electrical processing is to drive the upstream signal to the source line or switch the source line to a high impedance state (Hi-Z).
在可行的實施例中,該電子晶片係被配置以更包括以下功能: In a feasible embodiment, the electronic chip is configured to further include the following functions:
行一第四信號驅動操作:在該觸控模組由所述手部按壓且未有所述觸控筆與所述公共電極進行信號耦合的情況下,將該N/P欄(Column)公共電極分成包含複數個奇數子區塊與複數個偶數子區塊的Y個子區塊,使得每個所述子區塊含有N/(P×Y)個所述公共電極以及N/Y條所述源極線,並於第n個顯示幀將該上行信號驅動至屬於所述奇數子區塊的所述公共電極以及將屬於所述偶數子區塊的所述公共電極接地,且於第n+1個顯示幀將該上行信號驅動至屬於 所述偶數子區塊的所述公共電極以及將屬於所述奇數子區塊的所述公共電極接地;Y、n為正整數。 A fourth signal driving operation is performed: when the touch module is pressed by the hand and the touch pen is not coupled to the common electrode, the N/P column common electrode is divided into Y sub-blocks including a plurality of odd sub-blocks and a plurality of even sub-blocks, so that each sub-block contains N/(P×Y) common electrodes and N/Y strips. The source line drives the uplink signal to the common electrode belonging to the odd sub-block and grounds the common electrode belonging to the even sub-block in the nth display frame, and drives the uplink signal to the common electrode belonging to the even sub-block and grounds the common electrode belonging to the odd sub-block in the n+1th display frame; Y and n are positive integers.
在一實施例中,執行所述第四信號驅動操作之時,該電子晶片在第n個顯示幀同時對屬於所述奇數子區塊的所述源極線進行所述第一電性處理以及將屬於所述偶數子區塊的所述源極線執行一第二電性處理,且於第n+1個顯示幀對屬於所述偶數子區塊的所述所述源極線進行所述第一電性處理以及將屬於所述奇數子區塊的所述源極線執行所述第二電性處理。 In one embodiment, when executing the fourth signal driving operation, the electronic chip performs the first electrical processing on the source lines belonging to the odd sub-blocks and performs a second electrical processing on the source lines belonging to the even sub-blocks at the nth display frame, and performs the first electrical processing on the source lines belonging to the even sub-blocks and performs the second electrical processing on the source lines belonging to the odd sub-blocks at the n+1th display frame.
在一實施例中,所述第二電性處理係將所述源極線接地或將所述源極線切換至高阻抗狀態(Hi-Z)。 In one embodiment, the second electrical processing is to ground the source line or switch the source line to a high impedance state (Hi-Z).
在一實施例中,執行所述第二信號驅動操作之時,該電子晶片同時對第r欄、第r欄至第r-s欄以及第r欄至第r+s欄的所述源極線進行所述第一電性處理,並對餘下的所述源極線進行所述第二電性處理。 In one embodiment, when executing the second signal driving operation, the electronic chip simultaneously performs the first electrical processing on the source lines of the rth column, the rth column to the r-sth column, and the rth column to the r+sth column, and performs the second electrical processing on the remaining source lines.
在一實施例中,執行所述第三信號驅動操作之時,該電子晶片同時對第r欄、第r欄至第r-s欄以及第r欄至第r+s欄的所述源極線進行所述第一電性處理,並將餘下的所述源極線進行所述第二電性處理。 In one embodiment, when executing the third signal driving operation, the electronic chip simultaneously performs the first electrical processing on the source lines of the rth column, the rth column to the r-sth column, and the rth column to the r+sth column, and performs the second electrical processing on the remaining source lines.
進一步地,本發明還提出一種資訊處理裝置的一實施例,其特徵在於,具有至少一個顯示器,且該顯示器包括一觸控模組以及至少一個如前所述本發明之電子晶片。 Furthermore, the present invention also proposes an embodiment of an information processing device, which is characterized in that it has at least one display, and the display includes a touch module and at least one electronic chip of the present invention as described above.
在可行的實施例中,該資訊處理裝置為選自於由多媒體資訊顯示裝置(KIOSK)、頭戴式顯示裝置、智慧型電視、智慧型手機、智慧型手錶、平板電腦、一體式電腦、筆記型電腦、車載娛樂裝置、數位相機、和視訊式門口機所組成群組之中的一種電子裝置。 In a feasible embodiment, the information processing device is an electronic device selected from the group consisting of a multimedia information display device (KIOSK), a head-mounted display device, a smart TV, a smart phone, a smart watch, a tablet computer, an all-in-one computer, a notebook computer, an in-vehicle entertainment device, a digital camera, and a video door machine.
1a:平板電腦 1a: Tablet computer
2a:觸控筆 2a: Touch pen
3a:觸控模組 3a: Touch module
31a:LED背光板 31a:LED backlight panel
32a:底部極化膜片 32a: Bottom polarized diaphragm
33a:TFT基板 33a: TFT substrate
331a:畫素電路 331a: Pixel circuit
33Sa:源極線 33Sa: Source line
33Ga:閘極線 33Ga: Gate line
34a:底部電極層 34a: Bottom electrode layer
341a:公共電極 341a: Common electrode
34Ma:第一金屬線 34Ma: The first metal wire
35a:LCD面板 35a: LCD panel
36a:彩色濾光板 36a: Color filter
37a:頂部電極層 37a: Top electrode layer
38a:玻璃蓋板 38a: Glass cover
1:資訊處理裝置 1: Information processing device
11:觸控模組 11: Touch module
111:LED背光板 111:LED backlight panel
112:底部極化膜片 112: Bottom polarized diaphragm
113:TFT基板 113: TFT substrate
1131:畫素電路 1131: Pixel circuit
113S:源極線 113S: Source line
113G:閘極線 113G: Gate line
114:底部電極層 114: Bottom electrode layer
1141:公共電極 1141: Common electrode
114M:第一金屬線 114M: First metal wire
115:LCD面板 115: LCD panel
116:彩色濾光板 116: Color filter
117:頂部電極層 117: Top electrode layer
118:玻璃蓋板 118: Glass cover
12:電子晶片 12: Electronic chips
2:觸控筆 2: Stylus
圖1為一平板電腦與一觸控筆的立體圖;圖2為一觸控模組的示意性側剖視圖;圖3為複數個畫素電路與複數個公共電極的上視圖;圖4為應用本發明之一種提高上行信號強度之方法的一具觸控功能的資訊處理裝置的簡易示圖;圖5為圖4所示之觸控模組的示意性側剖視圖;圖6為複數個畫素電路與複數個公共電極的上視圖;圖7為複數個公共電極與TFT基板的第一上視圖;圖8A為複數個公共電極與TFT基板的第二上視圖;圖8B為複數個公共電極與TFT基板的第三上視圖;圖9為複數個公共電極與TFT基板的第四上視圖;以及圖10為複數個公共電極與TFT基板的第五上視圖。 FIG. 1 is a three-dimensional diagram of a tablet computer and a touch pen; FIG. 2 is a schematic side sectional view of a touch module; FIG. 3 is a top view of a plurality of pixel circuits and a plurality of common electrodes; FIG. 4 is a simplified diagram of an information processing device with a touch function to which a method for improving the strength of an uplink signal of the present invention is applied; FIG. 5 is a schematic side sectional view of the touch module shown in FIG. 4; FIG. 6 is a schematic side sectional view of a plurality of pixel circuits and a plurality of common electrodes; FIG. 7 is a first top view of a plurality of common electrodes and a TFT substrate; FIG. 8A is a second top view of a plurality of common electrodes and a TFT substrate; FIG. 8B is a third top view of a plurality of common electrodes and a TFT substrate; FIG. 9 is a fourth top view of a plurality of common electrodes and a TFT substrate; and FIG. 10 is a fifth top view of a plurality of common electrodes and a TFT substrate.
為使 貴審查委員能進一步瞭解本發明之結構、特徵、目的、與其優點,茲附以圖式及較佳具體實施例之詳細說明如後。 In order to enable the review committee to further understand the structure, features, purpose, and advantages of the present invention, the detailed description of the drawings and preferred specific embodiments is attached as follows.
圖4為應用本發明之一種提高上行信號強度之方法的一具觸控功能的資訊處理裝置的簡易示圖。如圖4所示,該資訊處理裝置1含有一觸控模組11與一電子晶片12,並且,圖5為圖4所示之觸控模組11的示意性側剖視圖。如 圖4與圖5所示,所述觸控模組11包括:一LED背光板111、一底部極化膜片112、一TFT基板113、一底部電極層114、一LCD面板115、一彩色濾光板116、一頂部電極層117、以及一玻璃蓋板118,其中,該LCD面板115與該彩色濾光板116組成一介電層,從而與該底部電極層114以及該頂部電極層117一同構成一內嵌式觸控面板。 Fig. 4 is a simplified diagram of an information processing device with a touch function to which a method for improving uplink signal strength of the present invention is applied. As shown in Fig. 4, the information processing device 1 includes a touch module 11 and an electronic chip 12, and Fig. 5 is a schematic side sectional view of the touch module 11 shown in Fig. 4. As shown in Figures 4 and 5, the touch module 11 includes: an LED backlight panel 111, a bottom polarization film 112, a TFT substrate 113, a bottom electrode layer 114, an LCD panel 115, a color filter 116, a top electrode layer 117, and a glass cover 118, wherein the LCD panel 115 and the color filter 116 form a dielectric layer, thereby forming an embedded touch panel together with the bottom electrode layer 114 and the top electrode layer 117.
更詳細地說明,該TFT基板113具有複數個畫素電路,且該底部電極層114包括複數個公共電極對應耦接至該複數個畫素電路。圖6為複數個畫素電路與複數個公共電極的上視圖。如圖5與圖6所示,該底部電極層114設置在該TFT基板113之上,且包括N/P欄(Column)公共電極1141,使得L個所述畫素電路1131共用一個公共電極1141,其中N、P、L皆為正整數。更詳細地說明,以橫向為行(Line)且直向為欄(Column),同一欄的多個所述畫素電路1131係耦接至同一條源極線113S,且同一行的多個所述畫素電路1131係耦接至同一條閘極線113G。 In more detail, the TFT substrate 113 has a plurality of pixel circuits, and the bottom electrode layer 114 includes a plurality of common electrodes correspondingly coupled to the plurality of pixel circuits. FIG. 6 is a top view of the plurality of pixel circuits and the plurality of common electrodes. As shown in FIG. 5 and FIG. 6, the bottom electrode layer 114 is disposed on the TFT substrate 113 and includes N/P columns of common electrodes 1141, so that L of the pixel circuits 1131 share one common electrode 1141, where N, P, and L are all positive integers. To explain in more detail, with the horizontal direction being a row (Line) and the vertical direction being a column (Column), the multiple pixel circuits 1131 in the same column are coupled to the same source line 113S, and the multiple pixel circuits 1131 in the same row are coupled to the same gate line 113G.
在該觸控模組11之中,是以N/P欄所述公共電極1141作為所述內嵌式觸控面板的N/P欄信號接收(RX)電極,且以該頂部電極層117的N/P欄(Column)頂部電極作為所述內嵌式觸控面板的N/P欄信號傳送(TX)電極。並且,如圖5與圖6所示,各所述公共電極1141耦接一條第一金屬線114M,使該電子晶片12對各所述公共電極1141作出欄(Column)方向的控制。具體地,該電子晶片12係透過多個所述公共電極1141傳送一上行訊號至用戶手持的一觸控筆,且同樣透過多個所述公共電極1141自該觸控筆接收一下行訊號。補充說明的是,實際應用中還可以令各所述公共電極1141耦接一條橫向的第二金 屬線(未圖示),使該電子晶片12對各所述公共電極1141作出行(Line)方向的控制。 In the touch module 11, the common electrode 1141 of the N/P column is used as the N/P column signal receiving (RX) electrode of the embedded touch panel, and the top electrode of the N/P column of the top electrode layer 117 is used as the N/P column signal transmitting (TX) electrode of the embedded touch panel. In addition, as shown in FIG. 5 and FIG. 6, each of the common electrodes 1141 is coupled to a first metal wire 114M, so that the electronic chip 12 controls each of the common electrodes 1141 in the column direction. Specifically, the electronic chip 12 transmits an uplink signal to a stylus held by the user through the plurality of common electrodes 1141, and also receives a downlink signal from the stylus through the plurality of common electrodes 1141. It should be noted that in actual application, each common electrode 1141 may be coupled to a second horizontal metal line (not shown) so that the electronic chip 12 controls each common electrode 1141 in the line direction.
在可行的實施例中,該電子晶片12可以是但不限於觸控晶片或觸控和顯示驅動整合(Touch and Display Driver Integration,TDDI)晶片,且該資訊處理裝置1可以是但不限於多媒體資訊顯示裝置(KIOSK)、頭戴式顯示裝置、智慧型電視、智慧型手機、智慧型手錶、平板電腦、一體式電腦、筆記型電腦、車載娛樂裝置、數位相機、或視訊式門口機。 In a feasible embodiment, the electronic chip 12 may be, but is not limited to, a touch chip or a Touch and Display Driver Integration (TDDI) chip, and the information processing device 1 may be, but is not limited to, a multimedia information chip. Display device (KIOSK), head-mounted display device, smart TV, smart phone, smart watch, tablet computer, all-in-one computer, notebook computer, car entertainment device, digital camera, or video door station.
應知道,具內嵌式觸控面板之觸控模組11的開發設計是為了降低該資訊處理裝置1的厚度。然而,對於相對低階的電子產品1(即,資訊處理裝置1)的厚度並無太高的要求,在此情況下,可以使用常規的觸控面板疊置(on-cell)在一液晶顯示模組之上,其中該液晶顯示模組可由圖5所示之LED背光板111、底部極化膜片112、TFT基板113、底部電極層114、LCD面板115、彩色濾光板116組成,且該玻璃蓋板118覆於該常規的觸控面板之上。 It should be known that the development and design of the touch module 11 with an embedded touch panel is to reduce the thickness of the information processing device 1. However, there is no high requirement for the thickness of a relatively low-end electronic product 1 (i.e., the information processing device 1). In this case, a conventional touch panel can be stacked (on-cell) on a liquid crystal display module, wherein the liquid crystal display module can be composed of an LED backlight panel 111, a bottom polarization film 112, a TFT substrate 113, a bottom electrode layer 114, an LCD panel 115, and a color filter 116 as shown in FIG. 5, and the glass cover 118 covers the conventional touch panel.
如圖4、圖5、與圖6所示,該電子晶片12電性連接該觸控模組11,且該電子晶片12的技術特徵在於被配置執行以下功能:當所述觸控模組11由手部按壓時,將一上行(uplink)信號驅動至非手部覆蓋的複數欄(Column)公共電極1141,且將餘下的公共電極1141接地,藉此方式消除手部衍生的疊加至所述上行信號的雜訊並同時達到提高該上行信號的強度之效果,使得一觸控筆2即使在用戶以其手部按壓所述觸控模組11的情況下還是能夠對上行信號作出正常識別。 As shown in FIG. 4, FIG. 5, and FIG. 6, the electronic chip 12 is electrically connected to the touch module 11, and the technical feature of the electronic chip 12 is that it is configured to perform the following functions: when the touch module 11 is pressed by the hand, an uplink signal is driven to the common electrodes 1141 of the plurality of columns not covered by the hand, and the remaining common electrodes 1141 are grounded, thereby eliminating the noise derived from the hand superimposed on the uplink signal and at the same time achieving the effect of increasing the strength of the uplink signal, so that a touch pen 2 can still normally identify the uplink signal even when the user presses the touch module 11 with his hand.
進一步地,圖7、圖8A、圖8B、圖9、與圖10為複數個公共電極1141與TFT基板113的第一至第五上視圖。如圖4、圖6與圖7所示,在所述觸控模 組11未由一手部按壓且未有一觸控筆2被使用於觸控該觸控模組11的情況下(即,無手無筆),該電子晶片(如:TDDI)12係執行一第一信號驅動操作,從而將一上行信號驅動至該觸控模組11所包含的N/P欄(Column)公共電極1141,同時對該觸控模組11所包含的N條源極線113S作一第一電性處理;其中,P、N皆為正整數。在一實施例中,當所述公共電極1141打碼時(即,被驅動上行信號),可以將對應的所述源極線113S也進行打碼。在另一實施例中,當所述公共電極1141打碼時,將所述源極線113S浮接(Floating)以使其切換至高阻抗狀態(Hi-Z)可以使驅動於所述公共電極1141之中的上行信號具有相對較高的信號強度,換句話說,所述第一電性處理係將該上行信號驅動至所述源極線或將所述源極線切換至高阻抗狀態(Hi-Z)。 Further, FIG. 7, FIG. 8A, FIG. 8B, FIG. 9, and FIG. 10 are first to fifth top views of a plurality of common electrodes 1141 and a TFT substrate 113. As shown in FIG. 4, FIG. 6, and FIG. 7, when the touch module 11 is not pressed by a hand and a touch pen 2 is not used to touch the touch module 11 (i.e., no hand and no pen), the electronic chip (such as TDDI) 12 performs a first signal driving operation, thereby driving an uplink signal to the N/P column common electrodes 1141 included in the touch module 11, and at the same time performs a first electrical processing on the N source lines 113S included in the touch module 11; wherein P and N are both positive integers. In one embodiment, when the common electrode 1141 is coded (i.e., driven with an uplink signal), the corresponding source line 113S may also be coded. In another embodiment, when the common electrode 1141 is coded, the source line 113S is floated to switch it to a high impedance state (Hi-Z) so that the uplink signal driven in the common electrode 1141 has a relatively high signal strength. In other words, the first electrical processing is to drive the uplink signal to the source line or switch the source line to a high impedance state (Hi-Z).
如圖4、圖6、圖8A與圖8B所示,在該觸控模組11由手部按壓且由該觸控筆2觸控操作的情況下,若手部的按壓範圍涵蓋第j欄至第j+q欄的所述公共電極1141且該觸控筆2的一筆尖所落在的所述公共電極1141非屬第j欄至第j+q欄(即,手筆不同Column),該電子晶片12係將該上行信號驅動至該筆尖所落在的所述公共電極1141之所屬第r欄以及第r欄至第r-s欄和第r欄至第r+s欄的所述公共電極,並將餘下的所述公共電極接地;其中,jN/P,且q、r、s為正整數。在一實施例中,執行所述第二信號驅動操作之時,該電子晶片12同時對第r欄、第r欄至第r-s欄以及第r欄至第r+s欄的所述源極線113S進行所述第一電性處理(即,打碼或切換至Hi-Z),並將餘下的所述源極線113S接地。 As shown in FIG. 4, FIG. 6, FIG. 8A and FIG. 8B, when the touch module 11 is pressed by the hand and the touch pen 2 is operated, if the pressing range of the hand covers the common electrodes 1141 of the jth column to the j+qth column and the common electrode 1141 where the tip of the touch pen 2 lands does not belong to the jth column to the j+qth column (i.e., the hand is on a different column), the electronic chip 12 drives the uplink signal to the rth column to which the common electrode 1141 where the tip of the touch pen 2 lands belongs and the common electrodes of the rth column to the rsth column and the rth column to the r+sth column, and the remaining common electrodes are grounded; wherein, the jth column is the common electrode 1141 of the touch pen 2. N/P, and q, r, s are positive integers. In one embodiment, when the second signal driving operation is performed, the electronic chip 12 simultaneously performs the first electrical processing (i.e., coding or switching to Hi-Z) on the source lines 113S of the rth column, the rth column to the rsth column, and the rth column to the r+sth column, and grounds the remaining source lines 113S.
進一步地,如圖4、圖6與圖9所示,在該觸控模組11由手部按壓且由該觸控筆2觸控操作的情況下,若手部的按壓範圍涵蓋第j欄至第j+q欄的所 述公共電極1141且該觸控筆2的筆尖所落在第j欄至第j+q欄之中的一個所述公共電極1141(即,手筆同Column),該電子晶片12係將該上行信號驅動至該筆尖所落在的所述公共電極1141之所屬第r欄以及第r欄至第r-s欄和第r欄至第r+s欄的所述公共電極1141,並將餘下的所述公共電極接地。同時,該電子晶片12還將由手部的按壓範圍所涵蓋複數行(Line)所述公共電極1141接地。同樣地,執行所述第三信號驅動操作之時,該電子晶片12亦可同時對第r欄、第r欄至第r-s欄以及第r欄至第r+s欄的所述源極線113S進行所述第一電性處理(即,打碼或切換至Hi-Z),並將餘下的所述源極線113S接地。 Further, as shown in FIG. 4 , FIG. 6 and FIG. 9 , when the touch module 11 is pressed by a hand and the touch pen 2 is operated, if the pressing range of the hand covers the common electrodes 1141 of the jth column to the j+qth column and the tip of the touch pen 2 falls on one of the common electrodes 1141 of the jth column to the j+qth column (i.e., the hand and the pen are in the same column), the electronic chip 12 drives the uplink signal to the common electrodes 1141 of the rth column to which the common electrode 1141 falls and the common electrodes 1141 of the rth column to the r-s column and the rth column to the r+s column, and the remaining common electrodes are grounded. At the same time, the electronic chip 12 also grounds the common electrodes 1141 of the multiple lines covered by the pressing range of the hand. Similarly, when executing the third signal driving operation, the electronic chip 12 can also simultaneously perform the first electrical processing (i.e., coding or switching to Hi-Z) on the source lines 113S of the rth column, the rth column to the r-sth column, and the rth column to the r+sth column, and ground the remaining source lines 113S.
另一方面,如圖4、圖6與圖10所示,在該觸控模組11由手部按壓且未有觸控筆2與所述公共電極1141進行信號耦合的情況下(即,有手無筆),將該N/P欄(Column)公共電極分成包含複數個奇數子區塊與複數個偶數子區塊的Y個子區塊,使得每個所述子區塊含有N/(P×Y)個所述公共電極以及N/Y條所述源極線,並於第n個顯示幀將該上行信號驅動至屬於所述奇數子區塊的所述公共電極以及將屬於所述偶數子區塊的所述公共電極接地,且於第n+1個顯示幀將該上行信號驅動至屬於所述偶數子區塊的所述公共電極以及將屬於所述奇數子區塊的所述公共電極接地;Y、n為正整數。舉例而言,將該N/P欄公共電極1141分成8個子區塊a、b、c、e、f、g、h,其中,a、c、e、g為奇數子區塊,且b、d、f、h為偶數子區塊。之後,於第n個顯示幀將該上行信號驅動至屬於奇數子區塊a、c、e、g之中的公共電極1141並同時將屬於偶數子區塊b、d、f、h之中的公共電極1141接地。接著,於第n+1個顯示幀將該上行信號驅動至屬於偶數子區塊b、d、f、h之中的公共電極1141以及並同時將屬於奇數子區塊a、c、e、g之中的公共電極1141接地。 On the other hand, as shown in FIG. 4, FIG. 6 and FIG. 10, when the touch module 11 is pressed by a hand and there is no touch pen 2 and the common electrode 1141 for signal coupling (i.e., there is a hand but no pen), the N/P column (Column) common electrode is divided into Y sub-blocks including a plurality of odd sub-blocks and a plurality of even sub-blocks, so that each of the sub-blocks contains N/(P×Y) of the The common electrode 1141 of the N/P column is connected to the common electrode of the odd sub-block and the common electrode of the even sub-block is grounded in the nth display frame, and the common electrode of the even sub-block is grounded in the n+1th display frame; Y and n are positive integers. For example, the N/P column common electrode 1141 is divided into 8 sub-blocks a, b, c, e, f, g, h, where a, c, e, g are odd sub-blocks, and b, d, f, h are even sub-blocks. Afterwards, in the nth display frame, the uplink signal is driven to the common electrode 1141 belonging to the odd sub-blocks a, c, e, g and the common electrode 1141 belonging to the even sub-blocks b, d, f, h is grounded. Then, in the n+1th display frame, the uplink signal is driven to the common electrode 1141 belonging to the even sub-blocks b, d, f, h and the common electrode 1141 belonging to the odd sub-blocks a, c, e, g is grounded.
同樣地,執行所述第四信號驅動操作之時,該電子晶片在第n個顯示幀同時對屬於所述奇數子區塊的所述源極線進行所述第一電性處理以及將屬於所述偶數子區塊的所述源極線執行一第二電性處理,且於第n+1個顯示幀對屬於所述偶數子區塊的所述所述源極線進行所述第一電性處理以及將屬於所述奇數子區塊的所述源極線執行所述第二電性處理。其中,所述第二電性處理係將所述源極線接地或將所述源極線切換至高阻抗狀態(Hi-Z)。 Similarly, when executing the fourth signal driving operation, the electronic chip performs the first electrical processing on the source line belonging to the odd sub-block and performs a second electrical processing on the source line belonging to the even sub-block at the nth display frame, and performs the first electrical processing on the source line belonging to the even sub-block and performs the second electrical processing on the source line belonging to the odd sub-block at the n+1th display frame. The second electrical processing is to ground the source line or switch the source line to a high impedance state (Hi-Z).
由上述可知,本發明揭露了一種具上行信號產生功能之電子晶片,其係用於電性連接一觸控模組以執行一觸控筆之觸控偵測程序,其特徵在於該觸控偵測程序係依是否存在一手部按壓事件而定,且其包括:當在該觸控模組上未偵測到該手部按壓事件且未偵測到該觸控筆之筆尖觸點時,該電子晶片將一上行(uplink)信號傳送至該觸控模組的各欄(Column)公共電極,同時對該觸控模組的各條源極線作一第一電性處理;以及當在該觸控模組上偵測到該手部按壓事件及該觸控筆之筆尖觸點時,該電子晶片將一上行(uplink)信號傳送至以該筆尖觸點所在之一欄所述公共電極為中心之一帶狀感測區,該帶狀感測區包含奇數欄所述公共電極,並將該帶狀感測區以外的各欄所述公共電極接地。 As can be seen from the above, the present invention discloses an electronic chip with an uplink signal generating function, which is used to electrically connect a touch module to execute a touch detection procedure of a touch pen. The touch detection procedure is characterized in that the touch detection procedure depends on whether there is a hand pressing event, and includes: when the hand pressing event is not detected on the touch module and the pen tip of the touch pen is not detected, the electronic chip transmits an uplink signal to each column (C olumn) common electrode, and at the same time, a first electrical processing is performed on each source line of the touch module; and when the hand pressing event and the pen tip touch point of the touch pen are detected on the touch module, the electronic chip transmits an uplink signal to a strip-shaped sensing area centered on the common electrode of a column where the pen tip touch point is located, the strip-shaped sensing area includes the common electrodes of the odd-numbered columns, and the common electrodes of each column outside the strip-shaped sensing area are grounded.
另外,當該帶狀感測區與該手部按壓事件所覆蓋的多欄所述公共電極重疊時,該電子晶片將該手部按壓事件所覆蓋的多行(Line)所述公共電極接地;且該第一電性處理係將該上行信號驅動至所述源極線或將所述源極線切換至高阻抗狀態(Hi-Z)。 In addition, when the strip sensing area overlaps with the multiple columns of the common electrodes covered by the hand pressing event, the electronic chip grounds the multiple lines of the common electrodes covered by the hand pressing event; and the first electrical processing is to drive the uplink signal to the source line or switch the source line to a high impedance state (Hi-Z).
如此,上述已完整且清楚地說明本發明之一種提高上行信號強度之方法;並且,經由上述可得知本發明具有下列優點: Thus, the above has completely and clearly described a method of improving uplink signal strength of the present invention; and, from the above, it can be known that the present invention has the following advantages:
(1)本發明揭示一種提高上行信號強度之方法,其係由與一觸控模組電性連接的一電子晶片執行。依據本發明之提高上行信號強度之方法,當所述觸控模組由手部按壓時,該電子晶片將一上行信號驅動至非手部覆蓋的複數欄(Column)公共電極,且將餘下的公共電極接地,藉此方式消除手部衍生的疊加至所述上行信號的雜訊並同時達到提高該上行信號的強度之效果,使得觸控筆即使在用戶以其手部按壓螢幕的情況下還是能夠對上行信號作出正常識別。 (1) The present invention discloses a method for increasing the strength of an uplink signal, which is performed by an electronic chip electrically connected to a touch module. According to the method for increasing the strength of an uplink signal of the present invention, when the touch module is pressed by a hand, the electronic chip drives an uplink signal to the common electrodes of a plurality of columns not covered by the hand, and connects the remaining common electrodes to the ground, thereby eliminating the noise derived from the hand superimposed on the uplink signal and achieving the effect of increasing the strength of the uplink signal at the same time, so that the touch pen can still normally identify the uplink signal even when the user presses the screen with his hand.
(2)本發明還揭示一種電子晶片,其整合在含有一觸控模組的一資訊處理裝置之中,其特徵在於,該電子晶片被配置以執行前述本發明之一種提高上行信號強度之方法,從而增強通過該觸控模組的所包含的N/P欄(Column)公共電極傳送至一觸控筆的一上行信號之強度。 (2) The present invention also discloses an electronic chip integrated into an information processing device containing a touch module, wherein the electronic chip is configured to execute a method of improving the strength of an uplink signal of the present invention, thereby enhancing the strength of an uplink signal transmitted to a touch pen through the common electrode of the N/P columns contained in the touch module.
(3)進一步地,本發明還揭示一種資訊處理裝置,其特徵在於,具有至少一個顯示器,且該顯示器包括一觸控模組以及至少一個如前所述本發明之電子晶片。 (3) Furthermore, the present invention also discloses an information processing device, which is characterized in that it has at least one display, and the display includes a touch module and at least one electronic chip of the present invention as described above.
必須加以強調的是,前述本案所揭示者乃為較佳實施例,舉凡局部之變更或修飾而源於本案之技術思想而為熟習該項技藝之人所易於推知者,俱不脫本案之專利權範疇。 It must be emphasized that the above-mentioned case is a preferred embodiment. Any partial changes or modifications that are derived from the technical ideas of this case and are easily inferred by people familiar with the art do not deviate from the scope of the patent rights of this case.
綜上所陳,本案無論目的、手段與功效,皆顯示其迥異於習知技術,且其首先發明合於實用,確實符合發明之專利要件,懇請 貴審查委員明察,並早日賜予專利俾嘉惠社會,是為至禱。 In summary, this case shows that it is very different from the known technology in terms of purpose, means and effect, and it is the first invention that is practical and indeed meets the patent requirements for invention. We sincerely ask the review committee to examine it carefully and grant a patent as soon as possible to benefit the society. This is our utmost prayer.
113:TFT基板 113: TFT substrate
1141:公共電極 1141: Common electrode
12:電子晶片 12: Electronic chips
2:觸控筆 2: Stylus
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| TW202526594A (en) | 2025-07-01 |
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