TWI867761B - Coating device and coating liquid discharge method - Google Patents

Abstract

The present invention suppresses poor coating caused by bubbles generated by the anode and simplifies the structure for supplying the coating liquid. The coating module 400 includes: a coating tank 410 for accommodating the coating liquid; an anode 430 disposed in the coating tank 410; a substrate holder 440 configured to hold the substrate Wf with the coated surface Wf-a facing downward; a membrane 420 separating an anode region 424 where the anode 430 is disposed and a cathode region 422 where the substrate Wf is disposed during the coating process, and having an inclined surface 423a facing the anode 430; and a supply port 410. 12, used to supply the coating liquid to the anode area 424; and the gas-liquid piping 470, having: a first end 472, opening near the upper end of the inclined surface 423a of the film 420; and a second end 474, opening above the coated surface of the substrate during the coating process, the gas-liquid piping is configured to supply the coating liquid supplied from the supply port 412 to the anode area 424 to the cathode area 422 via the second end 474.

Description

Coating device and coating liquid discharge method

This application is about a plating device and a plating liquid discharge method.

A cup-type electrolytic plating device is known as an example of a plating device. The cup-type electrolytic plating device immerses a substrate (such as a semiconductor wafer) held in a substrate holder in a plating liquid with the surface to be plated facing downward, and applies a voltage between the substrate (cathode) and the anode to deposit a conductive film on the surface of the substrate.

Patent document 1 discloses a cup-type coating device. This coating device is configured to suppress coating defects caused by bubbles by providing a tilted membrane between the anode and the cathode to capture and discharge bubbles generated from the anode.

[Prior Art Literature]

[Patent Literature]

[Patent document 1] U.S. Patent No. 6126798

The coating device disclosed in Patent Document 1 takes into account the suppression of poor coating caused by bubbles adhering to the coated surface of the substrate, but does not take into account the simplification of the coating liquid supply structure to the coating tank.

That is, the coating device disclosed in Patent Document 1 has pipes for supplying coating liquid to the anode region and the cathode region respectively, so the number of pipes increases, resulting in a complicated structure of the coating device.

Therefore, one of the purposes of this application is to suppress poor coating caused by bubbles generated from the anode and to simplify the structure of supplying the coating liquid.

According to one embodiment, a coating device is disclosed, comprising: a coating tank for containing a coating liquid; an anode disposed in the coating tank; a substrate holder configured to hold a substrate with a coated surface facing downward; a membrane separating an anode region where the anode is disposed and a cathode region where the substrate is disposed during the coating process, the membrane having an inclined surface facing the anode; a supply port for to supply the coating liquid to the anode region; and a gas-liquid piping having: a first end opening near the upper end of the inclined surface of the film; and a second end opening above the coated surface of the substrate during the coating process, the gas-liquid piping being configured to supply the coating liquid supplied from the supply port to the anode region to the cathode region via the second end.

100: Loading port

110: Transport robot

120: Alignment device

200: Pre-wetting module

300: Prepreg module

400: Coating module

410: Plated groove

411: Bottom wall

412: Supply port

412-1, 414-1: Supply piping

412-2, 414-2: Exhaust piping

413: Side wall

413-1: First side wall

413-2: Second side wall

414: Common piping

416: Liquid storage tank

417: Pump

418: Supply valve

419:Discharge valve

420: Membrane

421: Central component

422:Cathode region

423: Tilt film

423a: Inclined surface

423b: End

424: Anode area

425: Check valve

426: Valve box

426a: Flow path

426b: Valve seat

427: Floating valve body/valve body

430: Yang pole

440: Substrate holder

442: Sealing ring holder

443: Lifting mechanism

444: Back panel

446:Frame

447: Rotating mechanism

448: Axis

450: Resistor

460: Paddle

462: Driving mechanism

470: Gas and liquid piping

472: First end

474: Second end

500: Washing module

600: Spin dryer

700: Transport device

800: Control module

1000: Coating device

BA: Bubble accumulation area

OF: coating liquid surface

Wf: Substrate

Wf-a: coated

S101~109: Steps

α, β: region

Figure 1 shows an oblique view of the overall structure of a coating device in an implementation form.

Figure 2 shows a plan view of the overall structure of a coating device in an implementation form.

FIG3 schematically shows a longitudinal cross-sectional view of the structure of a coating module in an implementation form.

FIG4 schematically shows a longitudinal section of the structure of a check valve in an implementation form.

Figure 5 schematically shows a longitudinal section of the structure of a gas-liquid piping system in one embodiment.

FIG6 is a flow chart of a plating treatment method including a plating liquid discharge method in an embodiment.

Below, the implementation form of the present invention is described with reference to the drawings. In the drawings described below, the same or equivalent structural elements are given the same symbols and repeated descriptions are omitted.

<Overall structure of the coating device>

FIG1 is an oblique view of the overall structure of the coating device of this embodiment. FIG2 is a plan view of the overall structure of the coating device of this embodiment. As shown in FIG1 and FIG2, the coating device 1000 has: a loading port 100, a conveying robot 110, an aligner 120, a pre-wetting module 200, a pre-preg module 300, a coating module 400, a cleaning module 500, a spin dryer 600, a conveying device 700, and a control module 800.

The loading port 100 is a module for loading substrates contained in a cassette such as a FOUP not shown in the coating device 1000, and unloading the substrates from the coating device 1000 to the cassette. In this embodiment, four loading ports 100 are arranged in parallel in the horizontal direction, but the number and arrangement of the loading ports 100 are arbitrary. The transport robot 110 is a robot for transporting substrates, and is configured to transfer substrates between the loading port 100, the aligner 120, the pre-wetting module 200, and the spin dryer 600. The transport robot 110 and the transport device 700 can transfer substrates through a temporary table not shown in the figure when transferring substrates between the transport robot 110 and the transport device 700.

The aligner 120 is a module used to match the position of the orientation plane or notch of the substrate with a specific direction. In this embodiment, two aligners 120 are arranged in parallel in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary. The prewet module 200 replaces the air inside the pattern formed on the surface of the substrate with the treatment liquid in a manner that the coated surface of the substrate before the coating process is wetted with a treatment liquid such as pure water or degassed water. The prewet module 200 is configured to perform the prewet process, which is a method of replacing the treatment liquid inside the pattern with the coating liquid during coating, so that the coating liquid is easily supplied to the inside of the pattern. In this embodiment, two prewet modules 200 are arranged in parallel in the vertical direction, but the number and arrangement of the prewet modules 200 are arbitrary.

The prepreg module 300 is configured to perform a prepreg treatment, which is to etch away the high-resistance oxide film existing on the surface of the seed layer formed on the plated surface of the substrate before the plating treatment, such as with a treatment liquid such as sulfuric acid or hydrochloric acid, and clean or activate the surface of the plated substrate. In this embodiment, two prepreg modules 300 are arranged in parallel in the vertical direction, but the number and arrangement of the prepreg modules 300 are arbitrary. The plating module 400 performs a plating treatment on the substrate. In this embodiment, there are two groups of 12 plating modules 400, with 3 in the vertical direction and 4 in the horizontal direction arranged in parallel, and a total of 24 plating modules 400 are provided, but the number and arrangement of the plating modules 400 are arbitrary.

The cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove the coating liquid and the like remaining on the substrate after the coating process. In the present embodiment, two cleaning modules 500 are arranged side by side in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin dryer 600 is a module used to rotate and dry the substrate after the cleaning process at high speed. In the present embodiment, two spin dryers 600 are arranged side by side in the vertical direction, but the number and arrangement of the spin dryers 600 are arbitrary. The conveying device 700 is a device used to convey substrates between a plurality of modules in the coating device 1000. The control module 800 is configured to control a plurality of modules of the coating device 1000, and can be composed of, for example, a general computer or a dedicated computer having an input/output interface between it and the operator.

An example of a series of coating processes performed by the coating device 1000 is described. First, the substrate contained in the cassette is moved into the loading port 100. Then, the transport robot 110 takes out the substrate from the cassette of the loading port 100 and transports the substrate to the aligner 120. The aligner 120 matches the orientation plane or notch of the substrate with a specific direction. The transport robot 110 delivers the substrate in the matching direction in the aligner 120 to the pre-wetting module 200.

The pre-wetting module 200 performs a pre-wetting treatment on the substrate. The conveying device 700 conveys the substrate that has been pre-wetted to the pre-preg module 300. The pre-preg module 300 performs a pre-preg treatment on the substrate. The conveying device 700 conveys the substrate that has been pre-preg to the coating module 400. The coating module 400 coats the substrate.

The transport device 700 transports the substrate that has been subjected to the coating process to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transport device 700 transports the substrate that has been subjected to the cleaning process to the spin dryer 600. The spin dryer 600 performs a drying process on the substrate. The transport robot 110 receives the substrate from the spin dryer 600 and transports the substrate that has been subjected to the drying process to the cassette of the loading port 100. Finally, the cassette containing the substrate is unloaded from the loading port 100.

<Structure of the coating module>

Next, the structure of the coating module 400 is described. Since the 24 coating modules 400 in this embodiment have the same structure, only one coating module 400 is described. FIG3 schematically shows a longitudinal cross-sectional view of the structure of a coating module of one embodiment.

As shown in FIG. 3 , the coating module 400 has a coating tank 410 for containing the coating liquid. The coating tank 410 is configured to have: a bottom wall 411 in a circular plate shape; and a cylindrical side wall 413, which surrounds the peripheral portion of the bottom wall 411 and is open on the upper surface. The side wall 413 is configured to have: a first cylindrical side wall 413-1 connected to the peripheral portion of the bottom wall 411 and having a first thickness; and a second cylindrical side wall 413-2, which is arranged on the upper portion of the first side wall 413-1 and has a second thickness thinner than the first thickness.

The plating module 400 has an anode 430 disposed at the bottom of the plating groove 410. The anode 430 can be a soluble anode or an insoluble anode. The plating module 400 has a film 420 that separates the inside of the plating groove 410 in the vertical direction. The film 420 is a film that separates the anode area 424 where the anode 430 is disposed and the cathode area 422 where the substrate Wf is disposed during the plating process. In the cathode area 422, a resistor 450 is disposed facing the film 420. The resistor 450 is a component used to uniformly process the plating on the plating surface Wf-a of the substrate Wf, and is composed of a plate-shaped component with many holes formed therein.

The coating module 400 has: a substrate holder 440 for holding a substrate Wf (e.g., a disc-shaped substrate) with the coated surface Wf-a facing downward. The substrate holder 440 has a power supply contact for supplying power to the substrate Wf from a clerk not shown in the figure. The substrate holder 440 has: a sealing ring holder 442 for supporting the outer edge of the coated surface Wf-a of the substrate Wf; and a frame 446 for holding the sealing ring holder 442 on the substrate holder body not shown in the figure. In addition, the substrate holder 440 has: a back plate 444 for pressing the back side of the coated surface Wf-a of the substrate Wf; and a shaft 448 mounted on the back side of the substrate pressing surface of the back plate 444.

The coating module 400 is equipped with: a lifting mechanism 443 for lifting and lowering the substrate holder 440; and a rotating mechanism 447 for rotating the substrate holder 440 so that the substrate Wf rotates around the imaginary axis of the axis 448 (the imaginary rotation axis extending perpendicular to the center of the coated surface Wf-a). The lifting mechanism 443 and the rotating mechanism 447 can be realized by a known mechanism such as a motor. The coating module 400 is configured to immerse the substrate Wf in the coating liquid of the cathode area 422 by using the lifting mechanism 443, apply a voltage between the anode 430 and the substrate Wf, and perform a coating process on the coated surface Wf-a of the substrate Wf.

In addition, the coating module 400 has: a paddle 460, which is arranged between the anode 430 and the substrate Wf, specifically, between the resistor 450 and the substrate Wf. The paddle 460 is arranged facing the coating surface Wf-a of the substrate Wf. The coating module 400 has: a driving mechanism 462, which is used to move the paddle 460 back and forth along the coating surface Wf-a of the substrate Wf. The driving mechanism 462 can be realized by a known mechanism such as a motor. The coating module 400 can stir the coating liquid by moving the paddle 460 back and forth to improve the uniformity of the coating formed on the coating surface.

The coating module 400 has: a supply port 412 for supplying coating liquid to the anode area 424. The supply port 412 is formed in the center of the bottom wall 411 of the coating tank 410. The coating module 400 has: a common pipe 414 connected to the supply port 412; and a supply pipe 412-1 and a discharge pipe 412-2 branching from the common pipe 414. The supply pipe 412-1 is connected to: a liquid storage tank 416 for storing coating liquid; a pump 417 for pumping the coating liquid accumulated in the liquid storage tank 416; and a supply valve 418 for opening and closing the supply pipe 412-1.

The coating module 400 can supply the coating liquid to the coating tank 410 by opening the supply valve 418, closing the discharge valve 419, and starting the pump 417. On the other hand, the coating module 400 can discharge the coating liquid from the coating tank 410 by stopping the pump 417, closing the supply valve 418, and opening the discharge valve 419.

<Membrane>

The membrane 420 plays the role of capturing bubbles generated from the anode 430. In order to discharge the captured bubbles to the outside of the coating module 400, the membrane 420 has an inclined shape. Specifically, the membrane 420 is formed into an inverted cone, which has: a central part 421, which is arranged at the radial center of the coating groove 410; and an inclined membrane 423, which extends radially and obliquely upward from the central part 421. Thereby, the membrane 420 has an inclined surface 423a facing the anode 430 on the bottom surface of the inclined membrane 423. In addition, in this specification, an inclined surface refers to a surface inclined relative to a horizontal plane. In addition, the membrane 420 is not limited to an inverted cone shape, as long as it has an inclined surface 423a facing the anode 430. The inclined film 423 may be a film made of a material that can capture bubbles generated from the anode 430.

According to the coating module 400 of this embodiment, since the film 420 has the inclined surface 423a, the bubbles captured by the film 420 can be moved in an upward direction along the inclined surface 423a. As a result, the bubbles captured by the film 420 can be moved toward the upper end of the inclined surface 423a.

<Check valve>

The coating module 400 has: a check valve 425, which is arranged on the central part 421 of the membrane 420. FIG. 4 schematically shows a longitudinal section of the structure of the check valve. FIG. 4 is an enlarged representation of the area α of FIG. 3, and the check valve 425 shows the "closed" state (left side) and the "open" state (right side).

As shown in FIG. 4 , the check valve 425 has: a valve box 426, forming a flow path 426a connecting the anode area 424 and the cathode area 422; a valve seat 426b, provided in the flow path 426a; and a floating valve body 427, arranged below the valve seat 426b of the flow path 426a, formed to be able to abut against the valve seat 426b. The valve body 427 is formed of a material having a specific gravity less than 1.

When the coating process starts, the coating liquid is supplied from the supply port 412 to the anode region 424. When the liquid level rises to the valve body 427, the valve body 427 rises to abut against the valve seat 426b. As a result, since the check valve 425 is closed, the coating liquid and bubbles are not supplied from the anode region 424 to the cathode region 422 through the flow path 426a. On the other hand, when the coating liquid is discharged after the coating process, the liquid level of the coating liquid in the anode region 424 drops to the valve body 427, the valve body 427 drops, and leaves the valve seat 426b. Thus, since the check valve 425 is opened, the plating liquid flows from the cathode region 422 to the anode region 424 through the flow path 426a.

<Gas and liquid piping>

As shown in FIG3 , the coating module 400 is provided with: a gas-liquid piping 470 for discharging bubbles captured by the film 420 and supplying the coating liquid to the cathode region 422. In addition, in the present embodiment, although the coating module 400 is illustrated as having two gas-liquid piping 470 opposite to each other sandwiching the center of the coating tank 410, it is not limited thereto. The coating module 400 may also have one gas-liquid piping 470, or may have three or more gas-liquid piping 470 arranged at equal or unequal intervals along the circumference of the coating tank 410.

FIG5 schematically shows a longitudinal section of a gas-liquid piping structure of an embodiment. FIG5 is an enlarged representation of region β of FIG3, and appropriate components are omitted for description. Since the two gas-liquid pipings 470 have the same structure except for the different configuration positions, only one gas-liquid piping 470 is described in FIG5. As shown in FIG5, the gas-liquid piping 470 has: a first end portion 472, which opens near the upper end of the inclined surface 423a of the membrane 420 in the anode region 424.

In this embodiment, a bubble accumulation area BA is formed near the upper end of the inclined surface 423a, and the bubble accumulation area BA collects the bubbles captured by the film 420. That is, the end 423b on the opposite side of the central part 421 of the inclined film 423 is connected to the peripheral portion of the bottom surface of the resistor 450 at a predetermined distance from the inner surface of the first side wall 413-1. Thereby, an annular flow path surrounded by the end 423b of the inclined film 423, the peripheral portion of the bottom surface of the resistor 450, and the inner surface of the first side wall 413-1 is formed. Since the annular flow path is formed by these three surfaces, a fixed amount of bubbles can be collected in the bubble accumulation area BA. The first end 472 opens on the bottom surface of the resistor 450 toward the bubble accumulation area BA.

Furthermore, the gas-liquid piping 470 has a second end portion 474 which is located above the coating surface Wf-a of the substrate Wf during the coating process and opens on the inner side of the coating groove 410. The gas-liquid piping 470 extends upward from the first end portion 472 through the inside of the resistor 450, then extends radially outward through the inside of the resistor 450 and the first side wall 413-1, and then extends upward on the inner side of the second side wall 413-2 to reach the second end portion 474. The bubbles accumulated in the bubble accumulation area BA are discharged from the second end portion 474 through the gas-liquid piping 470. Since the second end portion 474 opens above the coated surface Wf-a, the bubbles discharged from the second end portion 474 can be prevented from adhering to the coated surface Wf-a.

The gas-liquid piping 470 is not only configured to discharge air bubbles, but also configured to supply the coating liquid supplied from the supply port 412 to the anode region 424 to the cathode region 422 via the second end portion 474. That is, when the coating liquid supplied from the supply port 412 fills the anode region 424 and the coating liquid is pumped from the pump 417 to the anode region 424, the coating liquid flows from the first end portion 472 to the gas-liquid piping 470. This is because the coating liquid of the membrane 420 has a large flow resistance, while the coating liquid of the first end portion 472 has a small flow resistance. Furthermore, when the coating liquid is pumped from the pump 417 to the anode area 424, the coating liquid flowing through the gas-liquid piping 470 is supplied to the cathode area 422 via the second end 474. Thus, the cathode area 422 is filled with the coating liquid.

In this embodiment, the second end 474 of the gas-liquid piping 470 opens below the coating liquid surface OF contained in the coating tank 410 during the coating process. That is, the coating module 400 is configured to allow the coating liquid supplied to the cathode area 422 to overflow from the second side wall 413-2 while the coating process is being performed. Therefore, the coating liquid surface OF is at a height position corresponding to the upper end of the second side wall 413-2. By making the second end 474 open below the coating liquid surface OF, the additive contained in the coating liquid supplied from the second end 474 can help the coating process.

However, the present invention is not limited thereto, and the second end 474 of the gas-liquid piping 470 may also be opened above the coating liquid surface OF contained in the coating tank 410 during the coating process. That is, in this specification, "opening on the inner side of the coating tank 410" means that when the coating module 400 is viewed from above, the second end 474 is located on the inner side of the second side wall 413-2 of the coating tank 410. Therefore, the second end 474 may be opened in an area below the upper end of the second side wall 413-2 (the coating liquid surface OF), or may be opened in an area above the upper end of the second side wall 413-2 (the coating liquid surface OF). In any case, as long as the second end 474 opens on the inner side of the coating groove 410, the coating liquid flowing from the second end 474 is supplied to the cathode area 422.

According to the coating module 400 of this embodiment, poor coating caused by bubbles generated from the anode can be suppressed, and the structure of coating liquid supply can be simplified. That is, because the bubbles generated from the anode 430 can be captured by the membrane 420 and discharged to the upper side of the coated surface of the substrate through the gas-liquid piping 470, poor coating caused by bubbles adhering to the coated surface can be suppressed. In addition, because the coating liquid can be supplied from the anode area 424 to the cathode area 422 through the gas-liquid piping 470, it is not necessary to provide supply piping in the anode area 424 and the cathode area 422 respectively, and the structure of coating liquid supply can be simplified.

Furthermore, according to the coating liquid module 400 of this embodiment, since the coating liquid is transferred from the cathode area 422 to the anode area 424 via the check valve 425 and can be discharged from the discharge pipe 414-2, it is not necessary to provide discharge pipes in the anode area 424 and the cathode area 422 respectively, and the structure for discharging the coating liquid can be simplified. Furthermore, according to the coating liquid module 400 of this embodiment, since the coating liquid is discharged by dropping from the cathode area 422 to the anode area 424 via the check valve 425, more byproducts (sludge) attached to the surface of the anode 430 can be washed away.

<Coating treatment method>

FIG6 is a flow chart of a coating treatment method including a coating liquid discharge method in an embodiment. The following coating treatment method starts with the coating liquid not being accumulated in the coating tank 410, and the supply valve 418 and the discharge valve 419 being closed.

The coating treatment method first opens the supply valve 418 and starts the pump 417 (S101). Thereby, the supply pipe 414-1 is opened, and the coating liquid accumulated in the liquid storage tank 416 is supplied to the anode area 424 from the supply port 412.

Then, the coating treatment method is to supply the coating liquid to the anode area 424, so that the coating liquid level of the anode area 424 rises to close the check valve 425 (S102). Specifically, when the coating liquid level of the anode area 424 rises to the valve body 427, the valve body 427 rises to abut against the valve seat 426b when the coating liquid level rises, and the flow path 426a is closed to perform S102.

Next, the coating treatment method is to perform a step (S103) of supplying the coating liquid to the cathode area 422 from the gas-liquid piping 470 by closing the check valve 425 to increase the flow resistance of the entire membrane 420 including the flow path 426a.

The coating treatment method performs a step (S104) of capturing bubbles generated from the anode 430 with the film 420, and discharging the captured bubbles above the coated surface Wf-a of the substrate Wf through the gas-liquid piping 470. Specifically, the bubbles captured by the film 420 move upward along the inclined surface 423a, and are concentrated in the bubble accumulation area BA near the upper end of the inclined surface 423a, and are discharged above the coated surface Wf-a of the substrate Wf through the gas-liquid piping 470.

Since the coating tank 410 is filled with the coating liquid, the coating treatment method performs the coating treatment by applying a voltage between the substrate Wf (cathode) and the anode (step S105). After the coating treatment is completed, the coating treatment method performs the step of stopping the pump 417 and closing the supply valve 418 (S106).

Next, the coating treatment method performs a step of discharging the coating liquid by opening the discharge valve 419 and opening the discharge pipe 414-2 (S107).

Next, the coating treatment method performs a step (S108) of opening the check valve 425 of the membrane 420 separating the anode region 424 and the cathode region 422 by discharging the coating liquid from the anode region 424 to lower the coating liquid level of the anode region 424. Specifically, S108 is performed by opening the flow path 426a when the coating liquid level of the anode region 424 drops to the valve body 427, and the valve body 427 drops to leave the valve seat 426b while the coating liquid level drops.

Next, the coating treatment method performs a step (S109) of opening the check valve 425 to deliver the coating liquid in the cathode region 422 to the anode region 424 through the flow path 426a and discharging it from the discharge pipe 414-2.

According to the coating method of this embodiment, bubbles generated from the anode 430 can be captured and discharged on the coated surface of the substrate, so that poor coating caused by bubbles adhering to the coated surface can be suppressed. In addition, according to the coating method of this embodiment, the coating liquid can be supplied from the anode area 424 to the cathode area 422 via the gas-liquid piping 470, so there is no need to provide supply piping in the anode area 424 and the cathode area 422, respectively, and the structure related to the supply of the coating liquid can be simplified. Furthermore, according to the coating treatment method of this embodiment, since the coating liquid can be sent from the cathode area 422 to the anode area 424 via the check valve 425, it is not necessary to provide discharge piping in the anode area 424 and the cathode area 422, respectively, and the structure for discharging the coating liquid can be simplified. Furthermore, according to the coating treatment method of this embodiment, since the coating liquid can be dropped from the cathode area 422 to the anode area 424 via the check valve 425, more byproducts (sludge) attached to the surface of the anode 430 can be washed away.

Although some embodiments of the present invention are described above, the embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified and improved without departing from its gist, and the present invention also includes its equivalents. In addition, within the scope of solving at least part of the above problems or achieving at least part of the effects, the various structural elements described in the patent application and the specification may be arbitrarily combined or omitted.

The present application discloses a coating device as an implementation form, comprising: a coating tank for containing a coating liquid; an anode disposed in the coating tank; a substrate holder configured to hold a substrate with a coated surface facing downward; a membrane separating an anode region where the anode is disposed and a cathode region where the substrate is disposed during the coating process, the membrane having an inclined surface facing the anode; a supply port, Used to supply the coating liquid to the aforementioned anode area; and a gas-liquid piping, having: a first end opening near the upper end of the aforementioned inclined surface of the aforementioned film; and a second end opening above the coated surface of the substrate during the coating process, the aforementioned gas-liquid piping is configured to supply the coating liquid supplied from the aforementioned supply port to the aforementioned anode area to the aforementioned cathode area via the aforementioned second end.

Furthermore, the present application discloses a coating device as an implementation form, wherein the second end of the gas-liquid pipe is configured to open below the coating liquid surface contained in the coating tank.

Furthermore, the present application discloses a coating device as an implementation form, wherein the aforementioned film has: a central part, arranged at the radial center of the aforementioned coating groove; and an inclined film, extending radially upward from the aforementioned central part.

Furthermore, the present application discloses a coating device as an implementation form, wherein a check valve is arranged on the aforementioned central part of the aforementioned membrane, and the check valve is configured to allow the coating liquid to flow only from the aforementioned cathode region to the aforementioned anode region.

Furthermore, the present application discloses a coating device as an implementation form, wherein the aforementioned check valve has: a valve box, forming a flow path connecting the aforementioned anode area and the aforementioned cathode area; a valve seat, disposed in the aforementioned flow path; and a floating valve body, disposed below the aforementioned valve seat in the aforementioned flow path, formed to be able to abut against the aforementioned valve seat.

Furthermore, the present application discloses a coating liquid discharge method as an implementation form, which is a method for discharging the coating liquid contained in the coating tank of the cup-type coating device, and the steps include: opening the discharge pipe connected to the anode area of the coating tank to discharge the coating liquid from the anode area; discharging the coating liquid from the anode area to lower the coating liquid level in the anode area, thereby opening the check valve, which is arranged on the membrane separating the anode area and the cathode area; and by opening the check valve, sending the coating liquid in the cathode area to the anode area and discharging it from the discharge pipe.

400: Coating module

410: Plated groove

411: Bottom wall

412: Supply port

413: Side wall

413-1: First side wall

413-2: Second side wall

414: Common piping

414-1: Supply piping

414-2: Exhaust piping

416: Liquid storage tank

417: Pump

418: Supply valve

419:Discharge valve

420: Membrane

421: Central component

422:Cathode region

423: Tilt film

423a: Inclined surface

424: Anode area

430: Yang pole

440: Substrate holder

442: Sealing ring holder

443: Lifting mechanism

444: Back panel

446:Frame

447: Rotating mechanism

448: Axis

450: Resistor

460: Paddle

462: Driving mechanism

470: Gas and liquid piping

OF: coating liquid surface

Wf: Substrate

Wf-a: coated

α, β: region

Claims (6)

A coating device comprises: a coating tank for containing a coating liquid; an anode disposed in the coating tank; a substrate holder configured to hold a substrate with a coated surface facing downward; a membrane separating an anode region where the anode is disposed and a cathode region where the substrate is disposed during coating, the membrane having an inclined surface facing the anode; and a supply port for supplying a coating liquid. liquid to the aforementioned anode region; and a gas-liquid piping having: a first end opening near the upper end of the aforementioned inclined surface of the aforementioned film; and a second end opening above the coated surface of the substrate during the coating process, the aforementioned gas-liquid piping being configured to supply the coating liquid supplied from the aforementioned supply port to the aforementioned anode region to the aforementioned cathode region via the aforementioned second end. The coating device as described in claim 1, wherein the second end of the gas-liquid pipe is configured to open below the surface of the coating liquid contained in the coating tank. The coating device as described in claim 2, wherein the aforementioned film has: a central part, arranged at the radial center of the aforementioned coating groove; and an inclined film, extending radially upward from the aforementioned central part. The coating device as described in claim 3, wherein a check valve is arranged in the central part of the membrane, and the check valve is configured to allow the coating liquid to flow only from the cathode region to the anode region. The coating device as described in claim 4, wherein the check valve comprises: a valve box forming a flow path connecting the anode region and the cathode region; a valve seat provided in the flow path; and a floating valve body arranged below the valve seat in the flow path and formed to be able to abut against the valve seat. A coating liquid discharge method is a method for discharging the coating liquid contained in a coating tank of a cup-type coating device, and the steps include: opening a discharge pipe connected to the anode area of the coating tank to discharge the coating liquid from the anode area; discharging the coating liquid from the anode area to lower the coating liquid level in the anode area, thereby opening a check valve, the check valve being arranged on a membrane separating the anode area and the cathode area; and sending the coating liquid in the cathode area to the anode area by opening the check valve, and discharging it from the discharge pipe.