TWI866009B - Expansion card assembly - Google Patents
Expansion card assembly Download PDFInfo
- Publication number
- TWI866009B TWI866009B TW111150572A TW111150572A TWI866009B TW I866009 B TWI866009 B TW I866009B TW 111150572 A TW111150572 A TW 111150572A TW 111150572 A TW111150572 A TW 111150572A TW I866009 B TWI866009 B TW I866009B
- Authority
- TW
- Taiwan
- Prior art keywords
- connector
- circuit board
- edge
- board
- expansion card
- Prior art date
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
Images
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
本發明是有關於一種擴充卡組件。 The present invention relates to an expansion card assembly.
在PCI-E協會規範中,PCI-E擴充卡的背面僅能放置高度2.67公厘以內的元件,使得PCI-E擴充卡的背面難以配置元件,而影響擴充性。要如何能夠在上述限制下提升擴充卡的擴充性是本領域研究的方向。 According to the PCI-E Association specification, only components with a height of less than 2.67 mm can be placed on the back of a PCI-E expansion card, making it difficult to configure components on the back of a PCI-E expansion card, thus affecting the expandability. How to improve the expandability of expansion cards under the above restrictions is the research direction of this field.
本發明提供一種擴充卡組件,其可在具有板緣連接器的電路板具有背面高度限制下提升擴充性。 The present invention provides an expansion card assembly that can improve the expandability of a circuit board with an edge connector under the back height restriction.
本發明的一種擴充卡組件,包括一第一電路板及一第二電路板。第一電路板包括位於一第一板緣的一板緣連接器、相對的一第一面與一第二面、位於第一面的一第一連接器及凹陷於一第二板緣的一凹口,其中第一連接器位於凹口旁。第二電路板包括相對的一第三面與一第四面、位於第四面的一第二連接器與至少一第三連接器,其中第二電路板平行地配置於第一電路板,第 一電路板與第二電路板局部重疊,第二連接器可插拔地設置於第一連接器,且第二電路板對應於凹口,而使位於第四面的至少一第三連接器外露於凹口。 The expansion card assembly of the present invention includes a first circuit board and a second circuit board. The first circuit board includes a board edge connector located at a first board edge, a first surface and a second surface opposite to each other, a first connector located at the first surface, and a notch recessed in a second board edge, wherein the first connector is located next to the notch. The second circuit board includes a third surface and a fourth surface opposite to each other, a second connector located at the fourth surface, and at least one third connector, wherein the second circuit board is arranged parallel to the first circuit board, the first circuit board and the second circuit board are partially overlapped, the second connector is pluggable and arranged on the first connector, and the second circuit board corresponds to the notch, so that at least one third connector located on the fourth surface is exposed in the notch.
在本發明的一實施例中,上述的凹口還凹陷於一第三板緣,第二板緣與第三板緣的其中一者連接於第一板緣,另一者相對於第一板緣,而使第一電路板呈L型。 In one embodiment of the present invention, the above-mentioned notch is also recessed in a third board edge, one of the second board edge and the third board edge is connected to the first board edge, and the other is opposite to the first board edge, so that the first circuit board is L-shaped.
在本發明的一實施例中,上述的第一電路板還包括位於第一面的一處理晶片,板緣連接器與第一連接器電性連接於處理晶片。 In one embodiment of the present invention, the first circuit board further includes a processing chip located on the first surface, and the edge connector and the first connector are electrically connected to the processing chip.
在本發明的一實施例中,上述的擴充卡組件更包括一固定支架,固定於第一電路板的一第四板緣。 In one embodiment of the present invention, the expansion card assembly further includes a fixing bracket fixed to a fourth board edge of the first circuit board.
在本發明的一實施例中,上述的第二電路板包括位於第三面的至少一第四連接器。 In one embodiment of the present invention, the second circuit board includes at least one fourth connector located on the third surface.
在本發明的一實施例中,上述的擴充卡組件更包括多個第三電路板,分別插設於至少一第三連接器與至少一第四連接器。 In one embodiment of the present invention, the expansion card assembly further includes a plurality of third circuit boards, which are respectively inserted into at least one third connector and at least one fourth connector.
在本發明的一實施例中,上述的板緣連接器為一PCI-E介面的金手指,第三連接器與第四連接器的每一者為M.2連接器。 In one embodiment of the present invention, the above-mentioned board edge connector is a gold finger of a PCI-E interface, and each of the third connector and the fourth connector is an M.2 connector.
在本發明的一實施例中,上述的位於第四面的第三連接器未凸出於第二面。 In one embodiment of the present invention, the third connector located on the fourth surface does not protrude from the second surface.
在本發明的一實施例中,上述的第二面上高度2.67公厘處為一限高範圍,位於第四面的第三連接器不超出於限高範圍。 In one embodiment of the present invention, the height of 2.67 mm on the second surface is a height limit range, and the third connector located on the fourth surface does not exceed the height limit range.
在本發明的一實施例中,上述的擴充卡組件更包括多個 鎖固件,設置於靠近凹口處,以將第二電路板鎖固至第一電路板。 In one embodiment of the present invention, the expansion card assembly further includes a plurality of locking members disposed near the notch to lock the second circuit board to the first circuit board.
基於上述,本發明的擴充卡組件的第一電路板可透過板緣連接器對接至主機板。若第一電路板的第一面稱為前面,第二面則稱為背面。第一電路板包括位於第一面的第一連接器,第二電路板的第二連接器可插拔地設置於第一電路板的第一連接器。也就是說,第二電路板位於第一電路板的第一面(前面)旁。此外,第二電路板對應於第一電路板的凹口,而使第二電路板的第三連接器外露於凹口。由於外露於凹口的第三連接器是位於第二電路板上,第二電路板與第一電路板的第二面(背面)之間的距離為第三連接器爭取可設置的空間。因此,第三連接器能滿足第一電路板的第二面上的高度限制,且可供擴充卡插設,以增添擴充功能。 Based on the above, the first circuit board of the expansion card assembly of the present invention can be connected to the motherboard through the board edge connector. If the first side of the first circuit board is called the front side, the second side is called the back side. The first circuit board includes a first connector located on the first side, and the second connector of the second circuit board is pluggable and arranged on the first connector of the first circuit board. In other words, the second circuit board is located next to the first side (front side) of the first circuit board. In addition, the second circuit board corresponds to the notch of the first circuit board, and the third connector of the second circuit board is exposed in the notch. Since the third connector exposed in the notch is located on the second circuit board, the distance between the second circuit board and the second side (back side) of the first circuit board is to compete for the space that can be set for the third connector. Therefore, the third connector can meet the height limit on the second side of the first circuit board, and can be plugged in by the expansion card to add expansion functions.
C:凹口 C: Notch
H:高度 H: Height
100:擴充卡組件 100: Expansion card assembly
110:第一電路板 110: First circuit board
111:第一板緣 111: The first edge of the board
112:第二板緣 112: Second board edge
113:第三板緣 113: The third edge of the board
114:第四板緣 114: The fourth edge
115:第一面 115: First page
116:第二面 116: Second side
117:板緣連接器 117: Board edge connector
118:第一連接器 118: First connector
119:處理晶片 119: Processing chip
120:第二電路板 120: Second circuit board
121:第三面 121: The third side
122:第四面 122: The fourth side
123:第二連接器 123: Second connector
124:第三連接器 124: Third connector
125:第四連接器 125: Fourth connector
130:第三電路板 130: The third circuit board
140:固定支架 140:Fixed bracket
150:鎖固件 150: Lock firmware
160:散熱鰭片 160: Heat sink fins
圖1至圖3是依照本發明的一實施例的一種擴充卡組件的不同視角示意圖。 Figures 1 to 3 are schematic diagrams of an expansion card assembly from different perspectives according to an embodiment of the present invention.
圖4及圖5是圖1的擴充卡組件的第一電路板及第二電路板的不同視角的爆炸示意圖。 Figures 4 and 5 are exploded schematic diagrams of the first circuit board and the second circuit board of the expansion card assembly of Figure 1 from different viewing angles.
圖6是圖1的擴充卡組件的側視示意圖。 FIG6 is a side view schematic diagram of the expansion card assembly of FIG1.
圖1至圖3是依照本發明的一實施例的一種擴充卡組件 的不同視角示意圖。圖4及圖5是圖1的擴充卡組件的第一電路板及第二電路板的不同視角的爆炸示意圖。圖6是圖1的擴充卡組件的側視示意圖。 Figures 1 to 3 are schematic diagrams of an expansion card assembly according to an embodiment of the present invention at different viewing angles. Figures 4 and 5 are exploded schematic diagrams of the first circuit board and the second circuit board of the expansion card assembly of Figure 1 at different viewing angles. Figure 6 is a side view schematic diagram of the expansion card assembly of Figure 1.
請參閱圖1至圖6,本實施例的擴充卡組件100包括一第一電路板110,第一電路板110包括一板緣連接器117。在本實施例中,板緣連接器117以一PCI-E介面的金手指為例,而可插設於主機板上的PCI-E插槽。由於PCI-E協會規範,插接於PCI-E插槽的第一電路板110的背面(第二面116)僅能放置高度H為2.67公厘以內的元件。也就是說,不能有元件突出於第一電路板110的背面(第二面116)的高度H(圖6)超過2.67公厘。
Please refer to Figures 1 to 6. The
本實施例的擴充卡組件100透過下面的設計,可在滿足上述高度H限制的條件之下,提升擴充性。下面將對此進行說明。
The
第一電路板110包括一第一板緣111、一第二板緣112、一第三板緣113及一第四板緣114、相對的一第一面115與第二面116(圖4)、位於第一面115的一第一連接器118(圖4)及至少凹陷於一第二板緣112的一凹口C(圖4)。板緣連接器117位於第一板緣111。
The
如圖4所示,第一板緣111相對於第二板緣112,第三板緣113相對於第四板緣114且位於第一板緣111與第二板緣112之間。第三板緣113與第四板緣114連接於第一板緣111。凹口C還凹陷於一第三板緣113,而使第一電路板110呈L型。第一連接器118位於凹口C旁。
As shown in FIG. 4 , the
本實施例的擴充卡組件100還包括一第二電路板120。如圖4與圖5所示,第二電路板120包括相對的一第三面121(圖4)與一第四面122(圖5)、位於第四面122的一第二連接器123與至少一第三連接器124、位於第三面121的至少一第四連接器125。如圖2與圖3所示,擴充卡組件100更包括多個第三電路板130,分別插設於至少一第三連接器124與至少一第四連接器125
The
在本實施例中,第三連接器124與第四連接器125的每一者為M.2連接器,第三電路板130為M.2擴充卡,但第三連接器124、第四連接器125與第三電路板130的種類不以此為限制。
In this embodiment, each of the
如圖6所示,第二電路板120平行地配置於第一電路板110,第一電路板110與第二電路板120局部重疊。第二電路板120的第二連接器123可插拔地設置於第一電路板110的第一連接器118。由圖3可見,第二電路板120對應於凹口C,而使位於第四面122的至少一第三連接器124外露於凹口C。
As shown in FIG6 , the
由於PCI-E協會規範,插設在PCI-E插槽上的電路板(也就是具有板緣連接器117的第一電路板110)的背面僅能放置高度2.67公厘以內的元件。也就是說,第一電路板110的第二面116上高度H(圖6)2.67公厘處為一限高範圍,位於第四面122的第三連接器124不超出於限高範圍,即可符合規範。
According to the PCI-E Association specification, the back of the circuit board (i.e., the
在本實施例中,如圖6所示,位於第四面122的第三連接器124沒有向下凸出於第一電路板110的第二面116。在其他實施例中,位於第四面122的第三連接器124也可以向下凸出於第
二面116。只要位於第四面122的第三連接器124凸出於第二面116的高度小於等於高度H(2.67公厘)即可。
In this embodiment, as shown in FIG. 6 , the
相較於習知的PCI-E擴充卡僅能在正面配置兩張M.2擴充卡。本實施例的擴充卡組件100可在第二電路板120上設有四張M.2擴充卡,而具有更佳的擴充性。
Compared to the conventional PCI-E expansion card which can only be equipped with two M.2 expansion cards on the front, the
此外,擴充卡組件100更包括多個鎖固件150,設置於靠近凹口C處,以將第二電路板120鎖固至第一電路板110。因此,第二電路板120可穩固地固定於第一電路板110。由圖6可見,其中一個鎖固件150凸出於第二面116,但凸出於第二面116的高度小於等於高度H(2.67公厘),而可符合規範。
In addition, the
另外,第一電路板110還包括位於第一面115的一處理晶片119(圖6),板緣連接器117與第一連接器118電性連接於處理晶片119。由於處理晶片119運作時會產熱,處理晶片119設置在第一面115上,以有更多空間設有散熱鰭片160。此外,在本實施例中,處理晶片119例如是RAID晶片,可使插設在第二電路板120上的四個第三電路板130(包括有儲存單元)組成硬碟陣列。
In addition, the
由於第一電路板110具有板緣連接器117及處理晶片119,PCI-E訊號可直接在第一電路板110上進行處理之後,再傳遞至第二電路板120。相比於把插設在PCI-E插槽的板緣連接器與處理晶片分別設在不同的電路板,本實施例的設計可對訊號進行最佳化的處理,而有良好的表現。
Since the
另外,請回到圖1,擴充卡組件100更包括一固定支架
140,固定於第一電路板110的第四板緣114。固定支架140可將第一電路板110鎖固於機殼。由於固定支架140是設置在具有可插在PCI-E插槽的第一電路板110,固定支架140可沿用習知的設計,而可節省成本。
In addition, please return to FIG. 1 , the
要說明的是,本實施例的擴充卡組件100不限於PCI-E介面的擴充卡組件,也可應用於其他具有空間或高度H限制的擴充卡組件中。
It should be noted that the
綜上所述,本發明的擴充卡組件的第一電路板可透過板緣連接器對接至主機板。若第一電路板的第一面稱為前面,第二面則稱為背面。第一電路板包括位於第一面的第一連接器,第二電路板的第二連接器可插拔地設置於第一電路板的第一連接器。也就是說,第二電路板位於第一電路板的第一面(前面)旁。此外,第二電路板對應於第一電路板的凹口,而使第二電路板的第三連接器外露於凹口。由於外露於凹口的第三連接器是位於第二電路板上,第二電路板與第一電路板的第二面(背面)之間的距離為第三連接器爭取可設置的空間。因此,第三連接器能滿足第一電路板的第二面上的高度限制,且可供擴充卡插設,以增添擴充功能。 In summary, the first circuit board of the expansion card assembly of the present invention can be connected to the mainboard through the board edge connector. If the first side of the first circuit board is called the front side, the second side is called the back side. The first circuit board includes a first connector located on the first side, and the second connector of the second circuit board is pluggable and arranged on the first connector of the first circuit board. In other words, the second circuit board is located next to the first side (front side) of the first circuit board. In addition, the second circuit board corresponds to the recess of the first circuit board, and the third connector of the second circuit board is exposed in the recess. Since the third connector exposed in the recess is located on the second circuit board, the distance between the second circuit board and the second side (back side) of the first circuit board is to compete for the space for the third connector to be set. Therefore, the third connector can meet the height limit on the second surface of the first circuit board and can be inserted with an expansion card to add expansion functions.
100:擴充卡組件 100: Expansion card assembly
110:第一電路板 110: First circuit board
111:第一板緣 111: The first edge of the board
112:第二板緣 112: Second board edge
113:第三板緣 113: The third edge of the board
114:第四板緣 114: The fourth edge
115:第一面 115: First page
117:板緣連接器 117: Board edge connector
120:第二電路板 120: Second circuit board
121:第三面 121: The third side
125:第四連接器 125: Fourth connector
130:第三電路板 130: The third circuit board
140:固定支架 140:Fixed bracket
150:鎖固件 150: Lock firmware
160:散熱鰭片 160: Heat sink fins
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111150572A TWI866009B (en) | 2022-12-29 | 2022-12-29 | Expansion card assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111150572A TWI866009B (en) | 2022-12-29 | 2022-12-29 | Expansion card assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202428103A TW202428103A (en) | 2024-07-01 |
| TWI866009B true TWI866009B (en) | 2024-12-11 |
Family
ID=92928641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111150572A TWI866009B (en) | 2022-12-29 | 2022-12-29 | Expansion card assembly |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI866009B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103595939A (en) * | 2012-08-16 | 2014-02-19 | 鸿富锦精密工业(深圳)有限公司 | Electronic apparatus |
| TWM472871U (en) * | 2013-11-08 | 2014-02-21 | Giga Byte Tech Co Ltd | Stacked expansion card assembly |
| TW202103016A (en) * | 2019-07-05 | 2021-01-16 | 英業達股份有限公司 | Network interface card |
| US10956353B1 (en) * | 2018-02-26 | 2021-03-23 | Amazon Technologies, Inc. | Connector configurations for printed circuit boards |
| TW202126144A (en) * | 2019-12-20 | 2021-07-01 | 宜鼎國際股份有限公司 | Stacked structure of circuit boards |
-
2022
- 2022-12-29 TW TW111150572A patent/TWI866009B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103595939A (en) * | 2012-08-16 | 2014-02-19 | 鸿富锦精密工业(深圳)有限公司 | Electronic apparatus |
| TWM472871U (en) * | 2013-11-08 | 2014-02-21 | Giga Byte Tech Co Ltd | Stacked expansion card assembly |
| US10956353B1 (en) * | 2018-02-26 | 2021-03-23 | Amazon Technologies, Inc. | Connector configurations for printed circuit boards |
| TW202103016A (en) * | 2019-07-05 | 2021-01-16 | 英業達股份有限公司 | Network interface card |
| TW202126144A (en) * | 2019-12-20 | 2021-07-01 | 宜鼎國際股份有限公司 | Stacked structure of circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202428103A (en) | 2024-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10403329B2 (en) | Memory card | |
| US6884085B1 (en) | Raised Serial Advanced Technology Attachment (SATA) connector for high-density mounting on a printed circuit board (PCB) | |
| US8456858B2 (en) | Serial advanced technology attachment dual in-line memory module assembly | |
| US8559189B2 (en) | Riser card for power supply | |
| US20120268884A1 (en) | Server backplate and server having same | |
| US8854833B2 (en) | Serial advanced technology attachment dual in-line memory module | |
| US10193249B2 (en) | Connector component and retention mechanism for M.2 form factor module | |
| US20070217160A1 (en) | Memory Module Including a Cooling Element, Method for Producing the Memory Module Including a Cooling Element, and Data Processing Device Comprising a Memory Module Including a Cooling Element | |
| TWI586033B (en) | Input output connector,method of fabricating the same,input output interconnect and electronic system | |
| US8305748B2 (en) | Blade server module | |
| CN101853989A (en) | Conductive shrapnel | |
| CN105206995A (en) | Communication module | |
| TWI866009B (en) | Expansion card assembly | |
| US7645144B2 (en) | Interface card and butterfly interface transfer structure | |
| TWM475008U (en) | Electronic equipment and plug-and-play device thereof | |
| CN118276641A (en) | Expansion card assembly | |
| US20190281721A1 (en) | Electronic device | |
| CN222531898U (en) | PCB assembly of dual connection modules | |
| US10492290B2 (en) | Circuit board pad mounting orientation system | |
| JP5052492B2 (en) | Industrial information processing equipment | |
| US20250294666A1 (en) | Expansion card module | |
| US12537321B2 (en) | Connector for an electronic device having a grid of connection points | |
| CN105896211A (en) | Universal Serial Bus (USB) Port And Plug Systems | |
| US7321490B2 (en) | Connecting apparatus of notebook computer display card | |
| CN110392517B (en) | Electronic device and electromagnetic shielding device |