TWI865900B - Electronic device and manufacturing method of electronic device - Google Patents

Abstract

An electronic device including a first substrate and a first light blocking element is provided. The first substrate includes a plurality of subpixels. Each subpixels includes a first main pad, a first redundant pad and a first light emitting unit. The first light emitting unit is disposed on the first main pad. The first light blocking element overlaps the first redundant pad in a vertical direction of the substrate. A manufacturing method of an electronic device is also provided.

Description

Electronic device and method for manufacturing the same

The present invention relates to an electronic device and a method for manufacturing the electronic device.

In the process of manufacturing electronic devices, the metal layer and the substrate used to form the components of the electronic device have different physical properties (such as thermal expansion coefficient) due to the different materials included, so that when it undergoes a subsequent sputtering process or a high-temperature process, the substrate will be warped, which, for example, may easily cause abnormal signal transmission in the electronic device and reduce the reliability of the electronic device. The above problem is more obvious when the thickness of the metal layer is thicker. Although increasing the thickness of the substrate can reduce the warping phenomenon, the subsequent processing process of thinning the thickened substrate is still required, thereby increasing the process cost.

According to an embodiment of the present disclosure, an electronic device includes a first substrate, and the first substrate includes a plurality of sub-pixels and a first shading unit. One of the plurality of sub-pixels includes a first main pad, a first spare pad, and a first light-emitting unit. The first light-emitting unit is disposed on the first main pad. The first shading unit and the first spare pad overlap in a top view direction of the substrate.

According to an embodiment of the present disclosure, a method for manufacturing an electronic device includes the following steps. First, a first substrate is provided, and the first substrate includes a plurality of sub-pixels. One of the plurality of sub-pixels includes a first main pad and a first spare pad. Then, a plurality of first light-emitting units are transferred to the first main pads of the plurality of sub-pixels. Next, the plurality of first light-emitting units are detected. Then, at least one second light-emitting unit is transferred to a portion of the first spare pad. Thereafter, a plurality of first shading units are set so that the plurality of first shading units overlap with another portion of the first spare pads in a top-view direction of the first substrate.

The present disclosure can be understood by referring to the following detailed description and the accompanying drawings. It should be noted that in order to facilitate the reader's understanding and the simplicity of the drawings, the multiple drawings in the present disclosure only depict a portion of the electronic device, and the specific components in the drawings are not drawn according to the actual scale. In addition, the number and size of each component in the figure are only for illustration and are not used to limit the scope of the present disclosure.

A structure (or layer, component, substrate) described in the present disclosure is located on another structure (or layer, component, substrate), which may mean that the two structures are adjacent and directly connected, or it may mean that the two structures are adjacent but not directly connected. Indirect connection means that there is at least one intermediate structure (or intermediate layer, intermediate component) between the two structures, the lower surface of one structure is adjacent to or directly connected to the upper surface of the intermediate structure, and the upper surface of the other structure is adjacent to or directly connected to the lower surface of the intermediate structure. The intermediate structure can be a single-layer or multi-layer physical structure or a non-physical structure, without limitation. In the present disclosure, when a certain structure is disposed “on” another structure, it may mean that the certain structure is “directly” on the other structure, or it may mean that the certain structure is “indirectly” on the other structure, that is, at least one structure is interposed between the certain structure and the other structure.

The electrical connection or coupling described in the present disclosure may refer to direct connection or indirect connection. In the case of direct connection, the endpoints of the components on the two circuits are directly connected or connected to each other by a conductive segment, and in the case of indirect connection, there is a combination of one of the components such as switches, diodes, capacitors, inductors or other non-conductive segments and at least one conductive segment or resistor, or a combination of at least two of the above and at least one conductive segment or resistor between the endpoints of the components on the two circuits.

In the present disclosure, the thickness, length and width can be measured selectively by optical microscope and/or scanning electron microscope (SEM), but not limited thereto. In addition, any two values or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

The terms "approximately," "substantially," or "substantially" are generally interpreted as being within a range of 20% of a given value, or within a range of 10%, 5%, 3%, 2%, 1% or 0.5% of a given value.

Reference will now be made in detail to exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and description to represent the same or like parts.

It should be noted that the following embodiments can replace, reorganize, and mix the features of several different embodiments to complete other embodiments without departing from the spirit of the present disclosure. The features of each embodiment can be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

In the present disclosure, the electronic device may include a display device, a touch display device, a light emitting device, an antenna device, a sensing device, a splicing device, or any suitable type of electronic device, but is not limited thereto.

The electronic device may include a light-emitting diode (LED), such as an organic light-emitting diode (OLED), a micro-LED (micro-LED, mini-LED), a quantum dot (QDs) material, a quantum dot light-emitting diode (QLED, QDLED), a fluorescence material, a phosphor material, other suitable materials or a combination thereof, but not limited thereto.

In addition, the electronic device can be a color display device or a monochrome display device, and the shape of the electronic device can be a rectangle, a circle, a polygon, a shape with curved edges, or other suitable shapes. In the present disclosure, the electronic device is exemplified as a rectangle and a color electronic device, but is not limited thereto.

Figures 1A to 1E are top views of a partial manufacturing process of an electronic device according to an embodiment of the present disclosure, and Figure 2 is a cross-sectional view of the first embodiment according to the section line A-A' of Figure 1E. In addition, this flow chart is only an example and is not used to limit the manufacturing steps of the electronic device.

Please refer to FIG. 1A to FIG. 1E and FIG. 2 , this embodiment provides a method for manufacturing an electronic device 10 a .

First, please refer to FIG. 1A , and provide a substrate 100, wherein the substrate 100 includes a plurality of sub-pixels SP, and a plurality of sub-pixels SP can form a pixel P. In some embodiments, the substrate 100 can be a circuit substrate. The above-mentioned circuit substrate can, for example, include a substrate and active components, passive components, signal lines or other suitable electronic components disposed on the substrate, wherein the material of the substrate can, for example, be glass, plastic or a combination thereof, and the signal line can, for example, be a combination of a scanning line, a data line and a power line, but the present disclosure is not limited thereto. The plurality of sub-pixels SP of the substrate 100 can, for example, be arranged in an array, in a staggered arrangement (such as a pentile arrangement) or in other ways, and the present disclosure is not limited thereto. In the present embodiment, one of the plurality of sub-pixels SP includes a main pad MP and a spare pad RP. The main pad MP and the spare pad RP include, for example, metal, metal oxide or other suitable conductive materials to be electrically connected to the substrate 100 (circuit substrate) respectively. The main pad MP may include, for example, two pad patterns MP1 and MP2 separated from each other, and the spare pad RP may also include, for example, two pad patterns RP1 and RP2 separated from each other. In some embodiments, the pad pattern MP1 and the pad pattern MP2 are arranged along the first direction d1, and the pad pattern RP1 and the pad pattern RP2 are also arranged along the first direction d1. In addition, in some embodiments, the main pad MP and the spare pad RP in a sub-pixel SP are arranged along the first direction d1, but the present disclosure is not limited thereto.

Next, please refer to FIG. 1B , and transfer a plurality of light emitting units LE1 to the main pads MP of a plurality of sub-pixels SP. In some embodiments, a plurality of light emitting units LE1 may be disposed on the main pads MP by mass transfer, but the present disclosure is not limited thereto. A plurality of light emitting units LE1 are, for example, arranged along a second direction d2, wherein the second direction d2 is orthogonal to the first direction d1, but the present disclosure is not limited thereto. The light emitting unit LE1 may, for example, emit various suitable color lights (e.g., blue light) or UV light, but the present disclosure is not limited thereto. In some embodiments, the light emitting unit LE1 may include a self-luminous material. For example, in the present embodiment, the light emitting unit LE1 may be a light emitting diode (LED), such as an organic light emitting diode (LED), a micro LED, a sub-millimeter light emitting diode (mini LED) or a quantum dot (QD, such as QLED, QDLED), fluorescence, phosphor or other suitable materials and the materials may be arranged and combined arbitrarily, but the present disclosure is not limited thereto.

In some embodiments, one sub-pixel SP includes one light-emitting unit LE1, wherein three sub-pixels SP can form one pixel P, and the light-emitting units LE1 included in the three sub-pixels SP can each emit light of a different color, such as red light, green light, and blue light, but the present disclosure is not limited thereto. In other embodiments, the number of sub-pixels SP and/or light-emitting units LE1 included in each pixel P and the corresponding light-emitting colors can be adjusted according to the actual design required.

Next, please refer to FIG. 1C to inspect the plurality of light-emitting units LE1. In some embodiments, the light-emitting units LE1 in the sub-pixel SP may be visually inspected and/or electrically inspected to detect whether there are bad spots in the sub-pixel SP. For example, the plurality of light-emitting units LE1 may be visually inspected by, for example, automated optical inspection (AOI) to observe whether the light-emitting units LE1 have appearance defects such as damage, scratches, and displacement; or, the plurality of light-emitting units LE1 may be electrically inspected by, for example, an open/short test (O/S test) to make the light-emitting units LE1 emit light to confirm the quality of the light emitted. In the present embodiment, when it is detected that the light emitting unit LE1 in at least one sub-pixel SP has a defect, it can be identified as a defective light emitting unit LE1'. It is worth noting that the sub-pixel SP includes a sub-pixel SP1 and a sub-pixel SP2. In the present embodiment, the sub-pixel SP1 is defined as including a light emitting unit LE1 that can operate normally, and the sub-pixel SP2 is defined as including a defective light emitting unit LE1'.

Then, please refer to FIG. 1D , transfer at least one light emitting unit LE2 to a portion of the spare pads RP. In some embodiments, when it is detected that the light emitting unit LE1 in at least one sub-pixel SP is defective, the light emitting unit LE2 may also be disposed on the spare pads RP in the sub-pixels SP by, but not limited to, mass transfer to repair it, wherein the light emitting unit LE2 and the defective light emitting unit LE1' are adjacent to each other in the first direction d1. It is worth noting that the defective light emitting unit LE1' may be, for example, a light emission defect of the light emitting unit itself; or a defect of the main pad MP itself; or a defect of poor electrical connection between the light emitting unit LE1 and the main pad MP, and the present disclosure is not limited thereto.

Afterwards, please refer to FIG. 1E , and set a plurality of shading units B1 so that the plurality of shading units B1 overlap with another part of the spare pad RP in the top-view direction n of the substrate 100. In detail, after at least one light-emitting unit LE2 is transferred to a part of the spare pad RP, a plurality of shading units B1 are set on the spare pad RP where the light-emitting unit LE2 is not set. In some embodiments, the shading unit B1 is in contact with the spare pad RP. In this embodiment, the method of setting a plurality of shading units B1 is to utilize but not limited to automatic optical detection and inkjet process. For example, an automatic optical detection device (not shown) may be used to first take a photo of the substrate 100 or execute a suitable optical detection program to obtain one or more images, and then the images may be identified and marked or classified to obtain the position of the spare pad RP where the light-emitting unit LE2 is not provided. Then, an inkjet printing device (not shown) is used to perform an inkjet process on the substrate 100 to set a shading unit B1 at the position of the spare pad RP where the light-emitting unit LE2 is not provided, wherein the shading unit B1, for example, covers the spare pad RP. In some embodiments, the surface of the shading unit B1 formed by performing the inkjet process (the surface away from the substrate 100) has, for example, an arc shape, but the present disclosure is not limited thereto. The shading unit B1 is, for example, a black shading layer, and the material of the shading unit B1 may be, for example, a photocurable material, a thermosetting material, or a combination thereof. In the present embodiment, the material of the shading unit B1 includes, but is not limited to, matte black ink, so that it appears matte black when viewed by a user, thereby reducing the light reflected by the spare pad RP where the light-emitting unit LE2 is not provided, so that the electronic device 10a has a high environmental contrast. It is worth noting that after a plurality of shading units B1 are provided, automatic optical detection can be used to perform an appearance inspection on the light-emitting unit LE2 and/or, for example, an open circuit and short circuit test can be used to perform an electrical inspection on the light-emitting unit LE2, but the present disclosure is not limited thereto.

In some embodiments, the light emitting unit LE1 may, for example, have a first electrode E1, a second electrode E2, and an epitaxial layer ES, as shown in FIG. 2 . The surface LE1_S of the epitaxial layer ES away from the substrate 100 may, for example, define a light emitting surface of the light emitting unit LE1, and the first electrode E1 and the second electrode E2 may, for example, be disposed on a surface opposite to the surface LE1_S of the epitaxial layer ES, so as to be electrically connected to the pad pattern MP1 and the pad pattern MP2 of the main pad MP, respectively. In the present embodiment, the light emitting unit LE1 includes a flip-chip micro light emitting diode, but the present disclosure is not limited thereto. In other embodiments, the light emitting unit LE1 may include a vertical micro light emitting diode or a horizontal micro light emitting diode. The light emitting unit LE2 may be the same as or similar to the light emitting unit LE1, and will not be described in detail herein.

In some embodiments, a pixel definition layer PDL is disposed on the substrate 100, as shown in FIG2. The pixel definition layer PDL, for example, defines a plurality of openings OP1 for disposing the light-emitting unit LE1 and a plurality of openings OP2 for the pad pattern RP1 and the pad pattern RP2, and the light shielding layer B1 may cover and/or contact the pad pattern RP1 and the pad pattern RP2. The material of the pixel definition layer PDL may, for example, include an organic material, but the present disclosure is not limited thereto. In some embodiments, the material of the pixel definition layer PDL may have a photosensitive property, thereby being formed by a patterning process. In addition, in some embodiments, the pixel definition layer PDL may, for example, be hydrophobic.

In some embodiments, a filling layer FL is disposed on the substrate 100, as shown in FIG. 2 . The filling layer FL is, for example, disposed in the opening OP1 defined by the pixel definition layer PDL, and is, for example, disposed adjacent to or around the light emitting unit LE1. The filling layer FL may, for example, be used to fix or protect the light emitting unit LE1. In some embodiments, the maximum distance between the upper surface of the filling layer FL (the surface away from the substrate 100) and the substrate 100 in the top-view direction n may, for example, be smaller than the maximum distance between the surface LE1_S of the light emitting unit LE1 (the surface away from the substrate 100) and the substrate 100 in the top-view direction n, as shown in FIG. 2 , but the present disclosure is not limited thereto. In other embodiments, the maximum distance between the filling layer FL and the substrate 100 may be, for example, greater than or equal to the maximum distance between the surface LE1_S of the light-emitting unit LE1 and the substrate 100. In some embodiments, the filling layer FL may include a transparent material, a non-transparent material, or a combination thereof, and has a light-shielding property. For example, the material of the filling layer FL may include epoxy, acrylic, other suitable materials, or a combination thereof.

It is worth noting that although the manufacturing method of the electronic device 10a of this embodiment is described by taking the above method as an example, the manufacturing method of the electronic device 10a disclosed in this disclosure is not limited to this method, and some of the above steps can be deleted or other steps can be added according to needs. In addition, the order of the above steps can be adjusted according to needs.

FIG3 is a partial top view schematic diagram of an electronic device according to an embodiment of the present disclosure. It should be noted that the embodiment of FIG3 may use the component numbers and part of the content of the embodiment of FIG1E, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted.

Please refer to FIG. 3 . The main difference between the electronic device 10b of the present embodiment and the aforementioned electronic device 10a is that the electronic device 10b further includes at least one shading unit B2. Specifically, in addition to providing a plurality of shading units B1, at least one shading unit B2 may be provided so that the shading unit B2 overlaps with the defective light-emitting unit LE1′ in the top-view direction n of the substrate 100, thereby reducing the light that may be reflected by the defective light-emitting unit LE1′, so that the electronic device 10b has a high environmental contrast. The materials and the forming methods of the shading unit B2 and the shading unit B1 may be the same or similar, and will not be described in detail here.

Fig. 4 is a cross-sectional diagram of the second embodiment according to the section line A-A' of Fig. 1E. It should be noted that the embodiment of Fig. 4 can use the component numbers and part of the content of the embodiment of Fig. 2, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted.

Please refer to FIG. 4 . The main difference between the electronic device 10c of this embodiment and the aforementioned electronic device 10a is that the light shielding unit B1′ is a combination of at least two of the red filter layer, the green filter layer, and the blue filter layer. Specifically, the light shielding unit B1′ can be formed by a stacked structure of at least two of the red filter layer, the green filter layer, and the blue filter layer, so that the light shielding unit B1′ can also achieve the effect achieved by the aforementioned light shielding unit B1, that is, the electronic device 10c of this embodiment also has a display screen with high environmental contrast, high light extraction efficiency, and/or a wide color gamut. It is worth noting that although FIG. 4 shows that the shading unit B1′ is formed by a three-layer stacked structure of a red filter layer B11′, a green filter layer B12′, and a blue filter layer B13′, and the red filter layer B11′ is in contact with the pad pattern RP1 and the pad pattern RP2, the present disclosure is not limited to this.

Fig. 5 is a cross-sectional view of the third embodiment according to the section line A-A' of Fig. 1E. It should be noted that the embodiment of Fig. 5 can use the component numbers and part of the content of the embodiment of Fig. 2, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted.

Please refer to FIG. 5 . The main difference between the electronic device 10d of the present embodiment and the aforementioned electronic device 10a is that the electronic device 10d includes a color filter layer CF1. Specifically, the color filter layer CF1 is disposed on the surface LE1_S (the light emitting surface of the light emitting unit LE1) of the light emitting unit LE1, and at least partially overlaps with the light emitting unit LE1 in the top view direction n of the substrate 100, thereby adjusting or converting the color of the light emitted by the light emitting unit LE1. The color filter layer CF1 may include, for example, a red filter layer, a green filter layer, a blue filter layer, or other filter layers of suitable colors, but the present disclosure is not limited thereto. For example, the light emitting unit LE1 can emit blue light, and the color filter layer CF1 is a green filter layer, but the present disclosure is not limited thereto.

Fig. 6 is a cross-sectional schematic diagram of the fourth embodiment according to the section line A-A' of Fig. 1E. It should be noted that the embodiment of Fig. 6 can use the component numbers and part of the content of the embodiment of Fig. 5, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted.

6 , the main difference between the electronic device 10e of the present embodiment and the aforementioned electronic device 10d is that the electronic device 10e includes a color filter layer CF2, and the color filter layer CF2 is disposed between the spare pad RP and the light shielding unit B1. Specifically, before performing the aforementioned step of disposing a plurality of light shielding units B1, the color filter layer CF2 can be formed in the same process as the aforementioned color filter layer CF1, so that the color filter layer CF2 is disposed in the opening OP2 defined by the pixel definition layer PDL, and therefore, the color filter layer CF2 can, for example, at least partially cover and/or contact the spare pad RP located in the opening OP2. After the plurality of light shielding units B1 are formed, the light shielding unit B1 disposed in the opening OP2 overlaps with the color filter layer CF2 in the top-view direction n of the substrate 100 , for example.

Fig. 7 is a cross-sectional view of the fifth embodiment according to the section line A-A' of Fig. 1E. It should be noted that the embodiment of Fig. 7 can use the component numbers and part of the content of the embodiment of Fig. 2, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted.

Please refer to FIG. 7 . The main difference between the electronic device 10f of the present embodiment and the aforementioned electronic device 10a is that the electronic device 10f further includes an opposing substrate 200. Specifically, the present embodiment provides an opposing substrate 200, wherein the opposing substrate 200 is disposed opposite to the substrate 100. In some embodiments, a light-shielding pattern layer BM and color filter layers CF1 and CF2 are disposed on the surface of the opposing substrate 200 facing the substrate 100. The light-shielding pattern layer BM is, for example, adjacent to or surrounding the color filter layers CF1 and CF2. In some embodiments, the light-shielding pattern layer BM has a plurality of openings BM_OP1 and BM_OP2 to form a grid structure, but the present disclosure is not limited thereto. The material of the light shielding pattern layer BM may include, for example, black resin, black photoresist, metal or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the color filter layer CF1 and the color filter layer CF2 are respectively disposed in the openings BM_OP1 and BM_OP2 of the light shielding pattern layer BM. In some embodiments, the openings BM_OP1 and BM_OP2 of the light shielding pattern layer BM at least partially overlap with the openings OP1 and OP2 defined by the pixel definition layer PDL in the top view direction n of the substrate 100. In addition, in the present embodiment, an adhesive layer AL is further disposed between the substrate 100 and the counter substrate 200. The material of the adhesive layer AL may include an optical clear resin (OCR) or an optical clear adhesive (OCA), such as an acrylic resin, a silicone resin, an epoxy resin or other suitable materials or a combination of the above materials, but the present disclosure is not limited thereto. In some embodiments, the adhesive layer AL may have a water and oxygen barrier property, a protective property or other properties in addition to the function of making the substrate 100 and the counter substrate 200 adhere to each other, but the present disclosure is not limited thereto.

Fig. 8 is a cross-sectional view of the sixth embodiment according to the section line A-A' of Fig. 1E. It should be noted that the embodiment of Fig. 8 can use the component numbers and part of the content of the embodiment of Fig. 7, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted.

Referring to FIG. 8 , the main difference between the electronic device 10g of the present embodiment and the aforementioned electronic device 10f is that the electronic device 10g further includes a wavelength conversion layer WT1, a wavelength conversion layer WT2, and a barrier layer BANK. Similar to the light-shielding pattern layer BM, the barrier layer BANK has a plurality of openings, such as an opening BK_OP1 and an opening BK_OP2. The openings BK_OP1 and BK_OP2 of the barrier layer BANK may correspond to the openings BM_OP1 and BM_OP2 of the light-shielding pattern layer BM, respectively. The wavelength conversion layer WT1 is, for example, disposed between the color filter layer CF1 and the light-emitting unit LE1. In detail, in the present embodiment, the wavelength conversion layer WT1 is disposed in the opening BK_OP1 of the baffle layer BANK, the color filter layer CF1 is disposed between the wavelength conversion layer WT1 and the opposite substrate 200, and in the top-view direction n of the substrate 100, the wavelength conversion layer WT1 may overlap with the color filter layer CF1. In some embodiments, the material of the wavelength conversion layer WT1 may include quantum dot materials, phosphorescent materials, fluorescent materials, other suitable wavelength conversion materials, or a combination thereof. In other words, the wavelength conversion layer WT1 may convert the light emitted by the light-emitting unit LE1 into light having another wavelength. In some embodiments, the wavelength range converted by the wavelength conversion layer WT may roughly correspond to the color of the color filter layer CF1. For example, in the top-view direction n of the substrate 100, the red wavelength conversion layer and the red filter layer can overlap, the green wavelength conversion layer and the green filter layer can overlap, and the blue wavelength conversion layer and the blue filter layer can overlap, but the present disclosure is not limited thereto. The wavelength conversion layer WT2 is, for example, disposed in the opening BK_OP2 of the baffle layer BANK, and the color filter layer CF2 is disposed between the wavelength conversion layer WT2 and the opposite substrate 200, and in the top-view direction n of the substrate 100, the wavelength conversion layer WT2 can overlap with the color filter layer CF2. The wavelength conversion layer WT2 can, for example, be the same as or similar to the wavelength conversion layer WT1, and will not be described in detail here. It is worth mentioning that in other embodiments, the wavelength conversion layer WT2 may not be provided.

Fig. 9 is a cross-sectional view of the seventh embodiment according to the section line A-A' of Fig. 1E. It should be noted that the embodiment of Fig. 9 can use the component numbers and part of the content of the embodiment of Fig. 7, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted.

Referring to FIG. 9 , the main difference between the electronic device 10h of this embodiment and the aforementioned electronic device 10f is that the light shielding unit B1 is disposed on the opposite substrate 200. Specifically, the light shielding unit B1 is disposed, for example, between the adhesive layer AL and the opposite substrate 200, and overlaps at least with the spare pad RP on which no light-emitting unit is disposed in the top view direction n of the substrate 100. As shown in FIG. 9 , the light shielding unit B1 may be in partial contact with the color filter layer CF2 and/or the light shielding pattern layer BM, but the present disclosure is not limited thereto.

FIG10 is a schematic cross-sectional view of the first embodiment according to the section line B-B' of FIG3.

10 , the electronic device 10i of this embodiment shows that the defective light emitting unit LE1′ in the sub-pixel SP2 is disposed on the main pad MP, and the light emitting unit LE2 that can function normally is disposed on the spare pad RP. As described in the above embodiments, when it is detected that the light emitting unit LE1 in at least one sub-pixel SP is defective, the light emitting unit LE2 can be transferred to the sub-pixels SP, wherein the light emitting unit LE2 is adjacent to the defective light emitting unit LE1′ in the first direction d1. In this embodiment, the color filter layer CF1 and the color filter layer CF2 may be formed on the surface LE1'_S of the defective light emitting unit LE1' and the surface LE2_S of the light emitting unit LE2, respectively, and the light shielding unit B2 covers and/or contacts the color filter layer CF1 and overlaps with the defective light emitting unit LE1' in the top-view direction n of the substrate 100. From another perspective, the color filter layer CF1 is disposed between the light shielding unit B2 and the defective light emitting unit LE1'.

Fig. 11 is a cross-sectional schematic diagram of the second embodiment according to the section line B-B' of Fig. 3. It should be noted that the embodiment of Fig. 11 can use the component numbers and part of the contents of the embodiments of Fig. 7 and Fig. 10, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted.

Referring to FIG. 11 , the main difference between the electronic device 10j of this embodiment and the aforementioned electronic device 10i is that the electronic device 10j further includes an opposing substrate 200, and the color filter layers CF1, CF2 and the light shielding unit B2 are disposed on the opposing substrate 200. Specifically, the present embodiment provides an opposing substrate 200, wherein the opposing substrate 200 is disposed opposite to the substrate 100. In some embodiments, a light shielding pattern layer BM and the color filter layers CF1, CF2 are disposed on the surface of the opposing substrate 200 facing the substrate 100. The light shielding unit B2 is, for example, disposed between the counter substrate 200 and the defective light emitting unit LE1', and the light shielding unit B2 contacts the color filter layer CF1 and overlaps with the defective light emitting unit LE1' in the top view direction n of the substrate 100. In addition, in this embodiment, an adhesive layer AL is also disposed between the substrate 100 and the counter substrate 200.

Fig. 12 is a cross-sectional schematic diagram of the third embodiment according to the section line B-B' of Fig. 3. It should be noted that the embodiment of Fig. 12 can use the component numbers and part of the content of the embodiment of Fig. 11, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical content is omitted.

12 , the main difference between the electronic device 10k of this embodiment and the aforementioned electronic device 10j is that the shading unit B2 is disposed on the substrate 100. Specifically, the shading unit B2 contacts the surface LE1′_S of the defective light emitting unit LE1′ and overlaps with the defective light emitting unit LE1′ in the top view direction n of the substrate 100.

FIG. 13 is a schematic top view of an electronic device according to an embodiment of the present disclosure.

Please refer to FIG. 13 , which shows that the electronic device 20 includes a pixel group PG, wherein the pixel group PG includes a plurality of pixels P arranged in an array, but the arrangement of the pixels P is not limited to the arrangement shown in FIG. 13 . In this embodiment, the light-emitting units in the majority of the pixels P in the pixel group PG (for example, greater than or equal to 90% of the total number of pixels P) can operate normally (light-emitting unit LE1). In addition, in this embodiment, at least one light-emitting unit in the pixels P in a minority of the pixels P in the pixel group PG (for example, less than or equal to 10% of the total number of pixels P) is detected to be defective (defective light-emitting unit LE1′), so light-emitting units LE2 are provided in these pixels P to replace the defective light-emitting units LE1′, and the light-emitting units LE1 and the light-emitting units LE2 in these pixels P are arranged in a staggered manner in the second direction d2.

According to the above, the electronic device of some embodiments of the present disclosure includes a shading unit B1 overlapping with the spare pad and/or a shading unit B2 overlapping with the defective light-emitting unit LE1' in the top-view direction of the substrate, so that the light reflected by the spare pad and/or the defective light-emitting unit LE1' can be reduced, so that the electronic device has a high environmental contrast. In other embodiments of the present disclosure, the material of the shading unit can be selected or added with a material with high reflectivity and/or low transmittance, so that the electronic device can have a high light extraction efficiency and/or a display screen with a wide color gamut. In some other embodiments of the present disclosure, the shading unit can overlap with the defective light-emitting unit in the top-view direction of the substrate to achieve the above-mentioned effects.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them; although the present disclosure is described in detail with reference to the above embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions described in the above embodiments, or replace part or all of the technical features therein with equivalent ones; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present disclosure. The features of the embodiments can be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h, 10i, 10j, 10k, 20: electronic device 100: substrate 200: opposite substrate A-A’, B-B’: section line AL: adhesive layer B1, B1’, B2: light-shielding unit B11’: red filter layer B12’: green filter layer B13’: blue filter layer BANK: barrier layer BK_OP1, BK_OP2, BM_OP1, BM_OP2, OP1, OP2: opening BM: light-shielding pattern layer CF1, CF2, CF3: color filter layer d1: first direction d2: second direction E1: first electrode E2: second electrode ES: epitaxial layer FL: filling layer LE1, LE2: light-emitting unit LE1’: light-emitting unit with defects LE1_S, LE1’_S, LE2_S: surface MP: main pad MP1, MP2, RP1, RP2: pad pattern n: top view direction P: pixel PDL: pixel definition layer PG: pixel group RP: spare pad SP, SP1, SP2: sub-pixel WT1, WT2: wavelength conversion layer

The accompanying drawings are included to further understand the present disclosure, and the accompanying drawings are incorporated into and constitute a part of the present disclosure. The accompanying drawings illustrate embodiments of the present disclosure and are used together with the description to explain the principles of the present disclosure. Figures 1A to 1E are schematic top views of a partial manufacturing process of an electronic device of an embodiment of the present disclosure. Figure 2 is a schematic cross-sectional view of a first embodiment according to the section line A-A’ of Figure 1E. Figure 3 is a schematic top view of a portion of an electronic device of an embodiment of the present disclosure. Figure 4 is a schematic cross-sectional view of a second embodiment according to the section line A-A’ of Figure 1E. Figure 5 is a schematic cross-sectional view of a third embodiment according to the section line A-A’ of Figure 1E. Figure 6 is a schematic cross-sectional view of a fourth embodiment according to the section line A-A’ of Figure 1E. FIG. 7 is a schematic cross-sectional view of the fifth embodiment according to the section line A-A’ of FIG. 1E. FIG. 8 is a schematic cross-sectional view of the sixth embodiment according to the section line A-A’ of FIG. 1E. FIG. 9 is a schematic cross-sectional view of the seventh embodiment according to the section line A-A’ of FIG. 1E. FIG. 10 is a schematic cross-sectional view of the first embodiment according to the section line B-B’ of FIG. 3. FIG. 11 is a schematic cross-sectional view of the second embodiment according to the section line B-B’ of FIG. 3. FIG. 12 is a schematic cross-sectional view of the third embodiment according to the section line B-B’ of FIG. 3. FIG. 13 is a schematic top view of an electronic device according to an embodiment of the present disclosure.

100: Substrate

A-A’: section line

B1: Shading unit

d1: first direction

d2: second direction

E1: First electrode

E2: Second electrode

ES: epitaxial layer

FL: Filling layer

LE1: Light-emitting unit

LE1_S: Surface

MP1, MP2, RP1, RP2: pad pattern

n: Looking down

OP1, OP2: Opening

PDL: Pixel Definition Layer

Claims (19)

An electronic device includes: a first substrate including a plurality of sub-pixels, one of the plurality of sub-pixels includes: a first main pad; a first spare pad; and a first light-emitting unit disposed on the first main pad; and a first light-shielding unit overlapping the first spare pad and the first light-emitting unit with a defect in a top-view direction of the first substrate, and the first light-shielding unit covers the first light-emitting unit with a defect in the top-view direction of the first substrate. An electronic device as described in claim 1, wherein the first light shielding unit is disposed on the first substrate. An electronic device as described in claim 1, wherein the first shading unit is in contact with the first spare pad. An electronic device as described in claim 1, wherein the first light shielding unit is a black light shielding layer. An electronic device as described in claim 1, wherein the first light shielding unit is a combination of at least two of a red filter layer, a green filter layer, and a blue filter layer. The electronic device as described in claim 1 further includes a second substrate, which is arranged opposite to the first substrate. An electronic device as described in claim 6, wherein the second substrate includes a color filter layer. The electronic device as described in claim 7 further includes a wavelength conversion layer, wherein the wavelength conversion layer is located between the color filter layer and the first light-emitting unit. An electronic device as described in claim 6, wherein the first light shielding unit is disposed on the second substrate. An electronic device as described in claim 7, wherein the color filter layer is disposed between the first backup pad and the first shading unit. An electronic device as described in claim 1, wherein another one of the plurality of sub-pixels includes: a second main pad; a second spare pad; a second light-emitting unit disposed on the second spare pad; and a third light-emitting unit disposed on the second main pad, and the third light-emitting unit has a defect. The electronic device as described in claim 11 further includes a second light shielding unit, and the second light shielding unit overlaps with the third light emitting unit in the top view direction of the first substrate. A method for manufacturing an electronic device includes: providing a first substrate, the first substrate including a plurality of sub-pixels, and one of the plurality of sub-pixels includes: a first main pad; and a first spare pad; transferring a plurality of first light-emitting units to the first main pad of the plurality of sub-pixels; detecting the plurality of first light-emitting units; transferring at least one second light-emitting unit to a portion of the first spare pad of the plurality of sub-pixels; and arranging a plurality of first light-shielding units, so that a portion of the plurality of first light-shielding units overlaps with another portion of the first spare pads of the plurality of sub-pixels in a top-view direction of the first substrate, and another portion of the plurality of first light-shielding units covers the first light-emitting unit with defects in the top-view direction of the first substrate. A method for manufacturing an electronic device as described in claim 13, wherein the portion of the plurality of first light shielding units is disposed on the first substrate. The manufacturing method of the electronic device as described in claim 13 further includes providing a second substrate, the second substrate is arranged opposite to the first substrate, and the part of the plurality of first shading units is arranged on the second substrate. A method for manufacturing an electronic device as described in claim 13, wherein the second light-emitting unit is adjacent to the first light-emitting unit having a defect. The manufacturing method of the electronic device as described in claim 13 further includes providing a second substrate, the second substrate is arranged opposite to the first substrate, and the other part of the plurality of first shading units is arranged on the second substrate. The manufacturing method of the electronic device as described in claim 13 further includes providing a second substrate, the second substrate is arranged opposite to the first substrate, and the other part of the plurality of first light shielding units is arranged between the second substrate and the first light emitting unit having defects. The manufacturing method of the electronic device as described in claim 13 further includes providing a color filter layer, and the color filter layer is arranged between the other part of the plurality of first light-shielding units and the first light-emitting unit with defects.

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