TWI865613B - Electronic parts and electronic equipment - Google Patents
Electronic parts and electronic equipment Download PDFInfo
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- TWI865613B TWI865613B TW109133198A TW109133198A TWI865613B TW I865613 B TWI865613 B TW I865613B TW 109133198 A TW109133198 A TW 109133198A TW 109133198 A TW109133198 A TW 109133198A TW I865613 B TWI865613 B TW I865613B
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- 239000000463 material Substances 0.000 claims description 4
- 230000013011 mating Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 9
- 238000005476 soldering Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 3
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 3
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
本發明提供一種電子零件與電子機器,其可降低組裝成本,並且減輕對於連接部的負荷。電子零件包括:電子零件本體;端子,自電子零件本體朝規定方向延伸,具有止脫部;以及螺旋彈簧,以電接觸的方式外嵌於端子、且由止脫部止脫,螺旋彈簧以經壓縮的狀態電接觸印刷基板。例如,螺旋彈簧包括具有導電性的被膜。The present invention provides an electronic component and an electronic device, which can reduce assembly costs and reduce the load on the connection part. The electronic component includes: an electronic component body; a terminal extending from the electronic component body in a predetermined direction and having a stopper; and a coil spring, which is externally embedded in the terminal in an electrically contacting manner and is stopped by the stopper, and the coil spring is in electrically contact with the printed circuit board in a compressed state. For example, the coil spring includes a conductive coating.
Description
本發明是有關於一種電子零件與電子機器。The present invention relates to an electronic component and an electronic machine.
以往,已知為了將電子零件的端子與印刷基板連接而進行焊接。Conventionally, soldering is known to connect terminals of electronic components to a printed circuit board.
於由焊錫機器人來進行焊接的情況下,設備成本增加。另外,於由作業者來進行焊接的情況下,焊接作業費工夫。根據以上所述,存在組裝成本增加的問題。When soldering is performed by a soldering robot, the equipment cost increases. Also, when soldering is performed by a worker, the soldering work is laborious. As a result, there is a problem of increased assembly cost.
另外,於專利文獻1中揭示有一種電子機器,其包括相互相向配置的兩個接點構件、及配置於兩個接點構件間的螺旋彈簧,螺旋彈簧的兩端部藉由導電性黏著材料而熔接於兩個接點構件。 [現有技術文獻] [專利文獻]In addition, Patent Document 1 discloses an electronic device including two contact members disposed opposite to each other and a coil spring disposed between the two contact members, wherein both ends of the coil spring are welded to the two contact members by a conductive adhesive material. [Prior Art Document] [Patent Document]
[專利文獻1]日本專利特開2000-243167號公報[Patent Document 1] Japanese Patent Publication No. 2000-243167
[發明所欲解決之課題][The problem that the invention wants to solve]
另外,於所述專利文獻1中記載的電子機器中,當藉由導電性黏著材料來將螺旋彈簧的端部熔接於接點構件時,於利用例如治具將螺旋彈簧保持於規定的位置後進行熔接,因此與焊接作業同樣地,作業費工夫。藉此,存在組裝成本增加的問題。In the electronic device described in Patent Document 1, when the end of the coil spring is welded to the contact member by means of a conductive adhesive, the welding is performed after the coil spring is held at a predetermined position by means of a jig, for example. Therefore, the operation is laborious like welding, which results in an increase in assembly cost.
另外,例如於對電子零件施加了衝擊等的情況下,存在對利用焊接的連接部、或利用導電性黏著材料來熔接的連接部施加負荷的問題。In addition, for example, when an impact is applied to an electronic component, there is a problem that a load is applied to a connection portion by soldering or a connection portion welded by a conductive adhesive.
本發明的目的是提供一種可降低組裝成本,並且減輕對於連接部的負荷的電子零件與電子機器。 [解決課題之手段]The purpose of the present invention is to provide an electronic component and an electronic device that can reduce assembly costs and reduce the load on the connection part. [Means for solving the problem]
為了達成所述目的,本發明中的電子零件包括: 電子零件本體; 端子,自所述電子零件本體朝規定方向延伸,具有止脫部;以及 螺旋彈簧,以電接觸的方式外嵌於所述端子、且由所述止脫部止脫, 所述螺旋彈簧以經壓縮的狀態電接觸印刷基板。In order to achieve the above-mentioned purpose, the electronic component of the present invention includes: an electronic component body; a terminal extending from the electronic component body in a specified direction and having a stopper; and a coil spring externally embedded in the terminal in an electrically contacting manner and stopped by the stopper, the coil spring electrically contacts the printed circuit board in a compressed state.
本發明中的電子機器包括: 所述電子零件;以及 外殼,收容所述電子零件, 所述印刷基板具有將所述規定方向作為深度方向的嵌合孔,以所述端子嵌合於所述嵌合孔的方式安裝於所述外殼。 [發明的效果]The electronic device of the present invention comprises: the electronic component; and a housing for housing the electronic component, the printed circuit board having a fitting hole with the predetermined direction as the depth direction, and being mounted on the housing in such a manner that the terminal fits into the fitting hole. [Effect of the invention]
根據本發明的電子零件,可降低組裝成本,並且減輕對於連接部的負荷。According to the electronic component of the present invention, the assembly cost can be reduced and the load on the connection part can be alleviated.
以下,一面參照圖式,一面對本發明的實施方式進行說明。 圖1是概略性地表示本發明的實施方式中的電子機器的一部分的圖。圖2是圖1的A-A線剖面圖。於圖1中描繪X軸、Y軸、及Z軸。於圖1中,將上下方向稱為X方向或長尺寸方向,將上方向稱為「+X方向」,將下方向稱為「-X方向」。另外,於圖1中,將左右方向稱為Y方向,將右方向稱為「+Y方向」,將左方向稱為「-Y方向」。另外,於圖1中,將與紙面正交的縱深方向稱為Z方向或短尺寸方向,將近前方向稱為「+Z方向」,將裏側方向稱為「-Z方向」。Hereinafter, the implementation method of the present invention will be described with reference to the drawings. FIG. 1 is a diagram schematically showing a portion of an electronic device in an implementation method of the present invention. FIG. 2 is a cross-sectional view of the A-A line of FIG. 1 . The X-axis, Y-axis, and Z-axis are depicted in FIG. 1 . In FIG. 1 , the up-down direction is referred to as the X-direction or the long dimension direction, the upper direction is referred to as the "+X direction", and the lower direction is referred to as the "-X direction". In addition, in FIG. 1 , the left-right direction is referred to as the Y-direction, the right direction is referred to as the "+Y direction", and the left direction is referred to as the "-Y direction". In addition, in FIG. 1 , the depth direction perpendicular to the paper surface is referred to as the Z-direction or the short dimension direction, the near-front direction is referred to as the "+Z direction", and the inside direction is referred to as the "-Z direction".
圖1及圖2中表示電子機器100的一部分。電子機器100包括:電子零件1、外殼2、以及印刷基板3。再者,於本實施方式中,電子零件1是輸出與輸入軸的旋轉的機械位移量對應的電壓的電位計、或將輸入軸的旋轉的機械位移量轉換成數位量的旋轉編碼器。FIG1 and FIG2 show a part of an electronic device 100. The electronic device 100 includes an electronic component 1, a housing 2, and a printed circuit board 3. In this embodiment, the electronic component 1 is a potentiometer that outputs a voltage corresponding to the mechanical displacement of the rotation of the input shaft, or a rotary encoder that converts the mechanical displacement of the rotation of the input shaft into a digital quantity.
電子零件1包括:電子零件本體12、端子14、以及螺旋彈簧16。再者,於圖1及圖2中,省略表示電子零件本體12的內部。The electronic component 1 includes an electronic component body 12, a terminal 14, and a coil spring 16. In addition, in FIG1 and FIG2, the interior of the electronic component body 12 is omitted.
電子零件本體12具有朝+Y方向延伸的軸承部13(對應於本發明的「被卡合部」)。於軸承部13可旋轉地支持輸入軸15。The electronic component body 12 has a bearing portion 13 (corresponding to the “engaged portion” of the present invention) extending in the +Y direction. The bearing portion 13 rotatably supports the input shaft 15 .
如圖2所示,三根端子14以於Z方向上排列的方式配置。端子14自電子零件本體12朝-X方向延伸。As shown in Fig. 2, three terminals 14 are arranged in a row in the Z direction. The terminals 14 extend from the electronic component body 12 in the -X direction.
圖3是端子14的部分放大圖。如圖1~圖3所示,端子14例如為將X方向作為長尺寸方向,將Y方向作為板厚方向,將Z方向作為短尺寸方向的平型端子。端子14具有基端部14a(+X方向端部)與前端部14b(-X方向端部)。於短尺寸方向(Z方向)的寬度中,基端部14a比前端部14b更寬。基端部14a具有止脫部17。於圖3中強調表示止脫部17。另外,如圖3所示,基端部14a具有於基端部14a之中Z方向的寬度最寬的+X方向端14c。FIG3 is a partially enlarged view of the terminal 14. As shown in FIG1 to FIG3, the terminal 14 is, for example, a flat terminal with the X direction as the long dimension, the Y direction as the plate thickness direction, and the Z direction as the short dimension direction. The terminal 14 has a base end 14a (+X direction end) and a
止脫部17具有自基端部14a的+Z方向側邊緣朝+Z方向突出的凸部18。另外,止脫部17具有自基端部14a的-Z方向側邊緣朝-Z方向突出的凸部19。於圖3中表示凸部18、凸部19間的距離L。The
凸部18的-X側邊緣18a相對於+Z方向朝+X方向傾斜。凸部18的+X側邊緣18b自基端部14a的+Z方向側邊緣朝+Z方向延伸。凸部19的-X側邊緣19a相對於-Z方向朝+X方向傾斜。凸部19的+X側邊緣19b自基端部14a的-Z方向側邊緣朝-Z方向延伸。The -X side edge 18a of the convex portion 18 is inclined toward the +X direction relative to the +Z direction. The +
圖4是表示外嵌於端子14的螺旋彈簧16的圖。螺旋彈簧16具有導電性。具體而言,螺旋彈簧16藉由具有導電性的材料(彈簧線)來成形。此處,作為具有導電性的材料,例如包含不鏽鋼、鋼琴線、磷青銅及該些的合金等。螺旋彈簧16的內徑比端子14的基端部14a的短尺寸方向(Z方向)寬度更大,比凸部18、凸部19間的距離L(參照圖3)更小。螺旋彈簧16以電接觸的方式外嵌於端子14。螺旋彈簧16由止脫部17止脫。具體而言,螺旋彈簧16的+X方向端部16a卡止於凸部18、凸部19。+X方向端部16a是螺旋彈簧16的固定端。FIG. 4 is a diagram showing a coil spring 16 externally fitted to a terminal 14. The coil spring 16 is electrically conductive. Specifically, the coil spring 16 is formed by a material (spring wire) having electrical conductivity. Here, the electrically conductive material includes, for example, stainless steel, piano wire, phosphor bronze, and alloys thereof. The inner diameter of the coil spring 16 is larger than the width of the base end portion 14a of the terminal 14 in the short dimension direction (Z direction), and smaller than the distance L between the protrusions 18 and 19 (see FIG. 3 ). The coil spring 16 is externally fitted to the terminal 14 in electrical contact. The coil spring 16 is stopped by the
如圖4所示,螺旋彈簧16的自由長度比螺旋彈簧16經壓縮的情況(參照圖2)的長度更長。於螺旋彈簧16由止脫部17止脫的情況下,螺旋彈簧16的-X方向端部16b朝端子14的前端部14b的位置延伸。-X方向端部16b是螺旋彈簧16的自由端。As shown in FIG4 , the free length of the coil spring 16 is longer than the length of the coil spring 16 when it is compressed (see FIG2 ). When the coil spring 16 is stopped by the
圖1及圖2中表示電子機器100的一部分。如圖1及圖2所示,外殼2具有底壁部22及周壁部24。外殼2具有朝下方向(-X方向)打開的開口部26。Fig. 1 and Fig. 2 show a part of the electronic device 100. As shown in Fig. 1 and Fig. 2, the housing 2 has a bottom wall portion 22 and a peripheral wall portion 24. The housing 2 has an opening portion 26 that opens in the downward direction (-X direction).
底壁部22於相對於上下方向(X方向)正交的平面中具有規定的區域。周壁部24自底壁部22的周緣朝下方向(-X方向)延伸。周壁部24的-X方向端邊緣是開口部26的周緣。周壁部24具有卡合槽25。卡合槽25是將X方向作為深度方向的槽。卡合槽25的槽口朝下方向(-X方向)打開。卡合槽25的槽寬對應於軸承部13的外徑。The bottom wall portion 22 has a predetermined area in a plane orthogonal to the up-down direction (X direction). The peripheral wall portion 24 extends downward (-X direction) from the periphery of the bottom wall portion 22. The -X direction end edge of the peripheral wall portion 24 is the periphery of the opening portion 26. The peripheral wall portion 24 has a snap-fit groove 25. The snap-fit groove 25 is a groove with the X direction as the depth direction. The slot opening of the snap-fit groove 25 is open in the downward direction (-X direction). The slot width of the snap-fit groove 25 corresponds to the outer diameter of the bearing portion 13.
印刷基板3於上下方向(X方向)上與外殼2相向配置。印刷基板3藉由多個螺釘(未圖示)來安裝於外殼2的周壁部24。於印刷基板3設置螺釘的下孔(未圖示)。下孔配置於與設置於外殼2的周壁部24的多個螺紋槽(未圖示)的位置分別對應的位置。印刷基板3以使上表面32朝向+X方向(上方向),堵塞開口部26的方式安裝。The printed circuit board 3 is disposed opposite to the housing 2 in the vertical direction (X direction). The printed circuit board 3 is mounted on the peripheral wall portion 24 of the housing 2 by a plurality of screws (not shown). The printed circuit board 3 is provided with lower holes (not shown) for the screws. The lower holes are arranged at positions corresponding to the positions of a plurality of thread grooves (not shown) provided on the peripheral wall portion 24 of the housing 2. The printed circuit board 3 is mounted in such a manner that the upper surface 32 faces the +X direction (upward direction) and the opening portion 26 is blocked.
如圖1及圖2所示,印刷基板3具有嵌合孔34。嵌合孔34配置於與端子14對應的位置。嵌合孔34是將X方向作為深度方向的圓孔。嵌合孔34例如為自印刷基板3的上表面32朝下表面33貫穿的貫穿孔。As shown in FIG. 1 and FIG. 2 , the printed circuit board 3 has a fitting hole 34 . The fitting hole 34 is arranged at a position corresponding to the terminal 14 . The fitting hole 34 is a circular hole with the X direction as the depth direction. The fitting hole 34 is, for example, a through hole penetrating from the upper surface 32 to the lower surface 33 of the printed circuit board 3 .
於印刷基板3的上表面32中,在嵌合孔34的周緣部佈線有導體(未圖示)。嵌合孔34的內徑比端子14的前端部14b的短尺寸方向(Z方向)的寬度更大。再者,如圖1所示,嵌合孔34的內徑比端子14的前端部14b的板厚更大。In the upper surface 32 of the printed circuit board 3, a conductor (not shown) is wired around the fitting hole 34. The inner diameter of the fitting hole 34 is larger than the width of the
繼而,參照圖3及圖4對將螺旋彈簧16外嵌於電子零件1的端子14的情況進行說明。Next, the case where the coil spring 16 is externally fitted to the terminal 14 of the electronic component 1 will be described with reference to FIGS. 3 and 4 .
將螺旋彈簧16的+X方向端部16a外嵌於端子14的前端部14b。進而,使+X方向端部16a朝+X方向移動,直至超過凸部18的-X側邊緣18a(傾斜邊緣)及凸部19的-X側邊緣19a(傾斜邊緣)為止。當+X方向端部16a沿著傾斜邊緣移動時,+X方向端部16a的內徑抗拒復原力而擴大。當+X方向端部16a超過了傾斜邊緣時,+X方向端部16a的內徑因復原力而縮小。其結果,+X方向端部16a的內徑變得比凸部18、凸部19間的距離L小,因此+X方向端部16a卡止於凸部18的+X側邊緣18b及凸部19的+X側邊緣19b。藉此,螺旋彈簧16由凸部18、凸部19止脫。The +X direction end 16a of the coil spring 16 is externally fitted to the
繼而,參照圖1及圖2對將電子零件1、外殼2及印刷基板3組裝的情況進行說明。Next, the assembly of the electronic component 1, the housing 2, and the printed circuit board 3 will be described with reference to FIGS. 1 and 2.
將電子零件1收容於外殼2中。具體而言,將電子零件1的軸承部13卡合於外殼2的卡合槽25。藉此,電子零件1相對於外殼2得到定位。螺旋彈簧16由凸部18、凸部19止脫,因此例如即便使電子零件1的端子14朝向下方向(-X方向),螺旋彈簧16亦不會下落。藉此,將螺旋彈簧16保持成外嵌於端子14的狀態。於螺旋彈簧16已外嵌於端子14的狀態下,螺旋彈簧16的+X方向端部16a電接觸+X方向端14c。再者,螺旋彈簧16於已外嵌於端子14的狀態下,只要電接觸端子14的任一部位即可。The electronic component 1 is accommodated in the housing 2. Specifically, the bearing portion 13 of the electronic component 1 is engaged with the engagement groove 25 of the housing 2. Thus, the electronic component 1 is positioned relative to the housing 2. The coil spring 16 is stopped by the
繼而,將印刷基板3組裝於外殼2。具體而言,使印刷基板3的嵌合孔34的位置與端子14的前端部14b的位置相互於X方向上對準。以端子14的前端部14b嵌合於嵌合孔34的方式,使外殼2與印刷基板3於X方向上相互接近。端子14的前端部14b鬆弛地嵌合於嵌合孔34。藉此,於端子14的前端部14b已嵌合於嵌合孔34的狀態下,印刷基板3可相對於外殼2於Y方向及Z方向上進行位置調整。即便於在端子14的前端部14b與嵌合孔34之間存在稍微的位置偏離的情況下,藉由相對於外殼2對印刷基板3進行位置調整,亦可使印刷基板3側的下孔與外殼2側的螺紋槽對位,因此可將印刷基板3螺固於外殼2的周壁部24。Next, the printed circuit board 3 is assembled to the housing 2. Specifically, the position of the fitting hole 34 of the printed circuit board 3 and the position of the
於將印刷基板3組裝於外殼2的情況下,螺旋彈簧16的-X方向端部16b(自由端)電接觸嵌合孔34的周緣部。螺旋彈簧16接觸嵌合孔34的周緣部,藉此螺旋彈簧16抗拒復原力而彎曲。藉此,螺旋彈簧16以經壓縮的狀態配置於印刷基板3與電子零件本體12之間。再者,螺旋彈簧16的彈簧負載以螺旋彈簧16與印刷基板3穩定地連接的方式設定。When the printed circuit board 3 is assembled to the housing 2, the -
所述實施方式中的電子零件1包括:電子零件本體12;端子14,自電子零件本體12朝X方向延伸,具有止脫部17;以及螺旋彈簧16,以電接觸的方式外嵌於端子14、且由止脫部17止脫,螺旋彈簧16以經壓縮的狀態電接觸印刷基板3。The electronic component 1 in the embodiment includes: an electronic component body 12; a terminal 14 extending from the electronic component body 12 in the X direction and having a
根據所述結構,螺旋彈簧16以電接觸的方式外嵌於端子14,進而,螺旋彈簧16電接觸印刷基板3,因此不需要用於將端子14連接於印刷基板3的焊接作業或熔接作業。藉此,可降低組裝成本。另外,螺旋彈簧16由止脫部止脫,保持成外嵌於端子14的狀態,因此可一體地處理電子零件本體12與螺旋彈簧16,就該點而言,亦可降低組裝成本。According to the above structure, the coil spring 16 is externally embedded in the terminal 14 in an electrically contacting manner, and further, the coil spring 16 is electrically in contact with the printed circuit board 3, so there is no need for soldering or welding operations for connecting the terminal 14 to the printed circuit board 3. This can reduce assembly costs. In addition, the coil spring 16 is retained by the retaining portion and is maintained in a state of being externally embedded in the terminal 14, so the electronic component body 12 and the coil spring 16 can be handled as a whole, and in this respect, assembly costs can also be reduced.
另外,無需於印刷基板3設置焊盤,因此可提昇佈線的自由。另外,連接部藉由螺旋彈簧16與印刷基板3接觸來構成,因此於對電子零件施加了衝擊等的情況下,藉由螺旋彈簧16抗拒復原力而彎曲、或螺旋彈簧16與印刷基板3抗拒摩擦阻力而相對地移動,可吸收衝擊,因此可減輕對於連接部的負荷。In addition, since there is no need to provide a pad on the printed circuit board 3, the freedom of wiring can be improved. In addition, since the connection portion is formed by the coil spring 16 contacting the printed circuit board 3, when an impact is applied to the electronic component, the impact can be absorbed by the coil spring 16 resisting the restoring force and bending, or the coil spring 16 and the printed circuit board 3 resisting the friction resistance and moving relative to each other, thereby reducing the load on the connection portion.
另外,於所述實施方式中,電子機器100包括收容電子零件1的外殼2,印刷基板3具有將X方向作為深度方向的嵌合孔34,以端子14嵌合於嵌合孔34的方式安裝於外殼2。於將印刷基板3安裝於外殼2的情況下,端子14嵌合於嵌合孔34,藉此嵌合孔34成為印刷基板3的定位用的孔,因此就該點而言,可容易地組裝印刷基板3。In addition, in the embodiment described above, the electronic device 100 includes a housing 2 for accommodating the electronic component 1, and the printed circuit board 3 has a fitting hole 34 with the X direction as the depth direction, and is mounted on the housing 2 in such a manner that the terminal 14 fits into the fitting hole 34. When the printed circuit board 3 is mounted on the housing 2, the terminal 14 fits into the fitting hole 34, whereby the fitting hole 34 becomes a hole for positioning the printed circuit board 3, and thus in this respect, the printed circuit board 3 can be easily assembled.
另外,螺旋彈簧16外嵌於端子14,藉此螺旋彈簧16於YZ平面上的移動受到限制,因此可防止於Z方向上鄰接的螺旋彈簧16彼此相互接觸。In addition, the coil spring 16 is externally fitted to the terminal 14, whereby the movement of the coil spring 16 in the YZ plane is restricted, thereby preventing the coil springs 16 adjacent to each other in the Z direction from contacting each other.
另外,於所述實施方式中,將端子14鬆弛地嵌合於嵌合孔34。藉此,於端子14的前端部14b已嵌合於嵌合孔34的狀態下,印刷基板3可相對於外殼2於Y方向及Z方向上進行位置調整,因此外殼2與印刷基板3的對位變得容易。就該點而言,可降低組裝成本。In addition, in the above-described embodiment, the terminal 14 is loosely fitted into the fitting hole 34. Thus, when the
此外,所述實施方式均只不過是表示實施本發明時的具體化的一例者,本發明的技術範圍不由該些實施方式限定地進行解釋。即,本發明可不脫離其主旨、或其主要的特徵,以各種形式來實施。In addition, the above-mentioned embodiments are merely examples of specific implementations of the present invention, and the technical scope of the present invention is not limited to these embodiments. That is, the present invention can be implemented in various forms without departing from its gist or its main features.
<變形例1> 參照圖5對本實施方式的變形例1進行說明。於變形例1的說明中,主要對與所述實施方式不同的結構進行說明,對相同的結構附加相同的符號並省略其說明。<Variant 1> Variant 1 of the present embodiment will be described with reference to FIG. 5. In the description of variant 1, the structure different from the above-mentioned embodiment will be mainly described, and the same structure will be assigned the same reference numeral and its description will be omitted.
於所述實施方式中,嵌合孔34是自印刷基板3的上表面32朝下表面33貫穿的貫穿孔(參照圖2)。In the above-described embodiment, the fitting hole 34 is a through hole penetrating from the upper surface 32 to the lower surface 33 of the printed circuit board 3 (see FIG. 2 ).
相對於此,於變形例1中,如圖5所示,嵌合孔34是由金屬扣眼35堵塞的貫穿孔。於將印刷基板3組裝於外殼2的情況下,螺旋彈簧16的-X方向端部16b(自由端)電接觸金屬扣眼35。螺旋彈簧16接觸金屬扣眼35,藉此螺旋彈簧16抗拒復原力而彎曲。藉此,螺旋彈簧16以經壓縮的狀態配置於印刷基板3與電子零件本體12(參照圖2)之間。In contrast, in Modification 1, as shown in FIG. 5 , the fitting hole 34 is a through hole blocked by a metal eyelet 35. When the printed circuit board 3 is assembled to the housing 2, the -
再者,於所述實施方式中,止脫部17為凸部18、凸部19(參照圖4),但本發明並不限定於此,例如亦可為凹部。具體而言,凹部自端子14的基端部14a的+Z方向側邊緣朝-Z方向凹入,另外,自基端部14a的-Z方向側邊緣朝+Z方向凹入。於止脫部17為凹部的情況下,使螺旋彈簧16的+X方向端部16a的內徑比基端部14a的短尺寸方向(Z方向)寬度更小。於將螺旋彈簧16嵌入基端部14a的情況下,抗拒復原力而擴大螺旋彈簧16的+X方向端部16a的內徑,於已使螺旋彈簧16的+X方向端部16a移動至凹部的位置的情況下,藉由復原力來卡止於凹部。Furthermore, in the above-described embodiment, the
另外,於所述實施方式中,螺旋彈簧16藉由具有導電性的材料來成形,但本發明並不限定於此,例如,亦可包括具有導電性的被膜。藉由對螺旋彈簧16的原材料例如實施電鍍處理來設置被膜。再者,螺旋彈簧16的原材料與導電性被膜只要是使螺旋彈簧16與印刷基板3穩定地電連接者即可。In the above-described embodiment, the coil spring 16 is formed of a conductive material, but the present invention is not limited thereto, and may include a conductive film, for example. The film is provided by, for example, performing electroplating on the raw material of the coil spring 16. Furthermore, the raw material of the coil spring 16 and the conductive film may be used as long as the coil spring 16 and the printed circuit board 3 are stably electrically connected.
<變形例2> 參照圖6及圖7對本實施方式的變形例2進行說明。圖6是概略性地表示變形例2中的電子機器的一部分的圖。圖7是圖6的部分放大剖面圖。於變形例2的說明中,主要對與所述實施方式不同的結構進行說明,對相同的結構附加相同的符號並省略其說明。<Variant 2> Variant 2 of the present embodiment is described with reference to Fig. 6 and Fig. 7. Fig. 6 is a diagram schematically showing a portion of an electronic device in variant 2. Fig. 7 is a partially enlarged cross-sectional view of Fig. 6. In the description of variant 2, the structure different from the above-mentioned embodiment is mainly described, and the same structure is assigned the same symbol and its description is omitted.
於所述實施方式中,印刷基板3以端子14嵌合於嵌合孔34的方式安裝於外殼2(參照圖1)。In the above-described embodiment, the printed circuit board 3 is mounted on the housing 2 in such a manner that the terminals 14 are engaged with the engagement holes 34 (see FIG. 1 ).
相對於此,於變形例2中,如圖6及圖7所示,螺旋彈簧16的-X方向端部16b具有朝-X方向延伸的延伸部16c。換言之,螺旋彈簧16具有延伸部16c、及比延伸部16c更靠上側的外嵌於端子14的線圈部16d。印刷基板3以延伸部16c嵌合於嵌合孔34的方式安裝於外殼2。嵌合孔34包含具有導電性的被膜。即,延伸部16c嵌合於嵌合孔34,端子14未嵌合於嵌合孔34。In contrast, in the second modification, as shown in FIG. 6 and FIG. 7 , the -
延伸部16c具有作為螺旋彈簧16的材料的彈簧線呈U字狀地折回的折回部16e。The extending portion 16c has a folded portion 16e where a spring wire, which is a material of the coil spring 16, is folded back in a U-shape.
於延伸部16c已嵌合於嵌合孔34的狀態下,折回部16e的彈簧線以於嵌合孔34的徑向上相互相向的方式配置。如圖7所示,折回部16e的彈簧線抵接於嵌合孔34的周壁、或接近嵌合孔34的周壁。When the extension portion 16c is fitted in the fitting hole 34, the spring wires of the folded portion 16e are arranged to face each other in the radial direction of the fitting hole 34. As shown in FIG. 7 , the spring wires of the folded portion 16e abut against the peripheral wall of the fitting hole 34 or the peripheral wall close to the fitting hole 34.
例如,於因電子機器100的下落、或施加至電子機器100的振動等,而導致電子零件1相對於印刷基板3受到了+Y方向的衝擊力的情況下,由於線圈部16d外嵌於端子14,因此螺旋彈簧16與端子14一同朝+Y方向移動。另一方面,由於折回部16e的彈簧線抵接於嵌合孔34的周壁或接近嵌合孔34的周壁,因此折回部16e不朝+Y方向移動,而自嵌合孔34的周壁受到-Y方向的反作用力。藉此,螺旋彈簧16自線圈部16d至折回部16e進行變形,藉由進行變形來緩和衝擊。For example, when the electronic component 1 receives an impact force in the +Y direction relative to the printed circuit board 3 due to the electronic device 100 falling or the vibration applied to the electronic device 100, the coil spring 16 moves in the +Y direction together with the terminal 14 because the coil portion 16d is externally fitted to the terminal 14. On the other hand, since the spring wire of the folded portion 16e abuts against the peripheral wall of the fitting hole 34 or the peripheral wall close to the fitting hole 34, the folded portion 16e does not move in the +Y direction, but receives a reaction force in the -Y direction from the peripheral wall of the fitting hole 34. As a result, the coil spring 16 is deformed from the coil portion 16d to the folded portion 16e, and the impact is mitigated by the deformation.
於變形例2中的電子機器100中,印刷基板3具有將X方向作為深度方向的嵌合孔34,以螺旋彈簧16的折回部16e嵌合於嵌合孔34的方式安裝於外殼2。藉此,螺旋彈簧16具有於電子零件1相對於印刷基板3受到了+Y方向的衝擊力的情況下,藉由進行變形來緩和衝擊的緩衝功能。另外,即便於螺旋彈簧16進行了變形的情況下,由於維持折回部16e嵌合於嵌合孔34的狀態,因此限制線圈部16d的+Y方向的移動。另外,由於端子14未嵌合於嵌合孔34,因此於衝擊時端子14不抵接於嵌合孔34的周壁。藉此,可防止端子14的損傷。In the electronic device 100 in the second modification, the printed circuit board 3 has a fitting hole 34 with the X direction as the depth direction, and is mounted on the housing 2 in such a manner that the folded portion 16e of the coil spring 16 is fitted into the fitting hole 34. Thus, when the electronic component 1 is subjected to an impact force in the +Y direction with respect to the printed circuit board 3, the coil spring 16 has a buffering function of buffering the impact by deforming. In addition, even when the coil spring 16 is deformed, the folded portion 16e is kept fitted into the fitting hole 34, thereby restricting the movement of the coil portion 16d in the +Y direction. In addition, since the terminal 14 is not fitted into the fitting hole 34, the terminal 14 does not abut against the peripheral wall of the fitting hole 34 at the time of impact. Thereby, damage to the terminal 14 can be prevented.
<變形例3> 參照圖8及圖9對本實施方式的變形例3進行說明。圖8是概略性地表示變形例3中的電子機器的一部分的圖。圖9是圖8的B-B線剖面圖。於變形例3的說明中,主要對與所述實施方式不同的結構進行說明,對相同的結構附加相同的符號並省略其說明。<Variant 3> Variant 3 of the present embodiment is described with reference to Fig. 8 and Fig. 9. Fig. 8 is a diagram schematically showing a portion of an electronic device in variant 3. Fig. 9 is a cross-sectional view taken along line B-B of Fig. 8. In the description of variant 3, the structure different from the above-mentioned embodiment is mainly described, and the same structure is given the same symbol and its description is omitted.
作為所述實施方式中的電子機器100的組裝程序,首先將電子零件1與外殼2組裝。其次,將外殼2與印刷基板3組裝。As the assembly procedure of the electronic device 100 in the above-described embodiment, first, the electronic component 1 is assembled with the housing 2. Next, the housing 2 is assembled with the printed circuit board 3.
相對於此,作為變形例3中的電子機器100的組裝程序,首先將電子零件1與印刷基板3組裝(局部裝配(subassembly))。其次,將局部裝配品組裝於外殼2。In contrast, in the assembly process of the electronic device 100 in the third modification, the electronic component 1 and the printed circuit board 3 are first assembled (subassembly). Next, the subassembly is assembled to the housing 2 .
以下,對使變形例3中的電子機器100的組裝程序變成可能的結構進行說明。Next, a configuration that enables the assembly process of the electronic device 100 in the third modification will be described.
如圖9所示,電子零件本體12具有兩個鉤部12a。鉤部12a配置於電子零件本體12的下表面(-X方向端面)的左端部及右端部。鉤部12a配置於三個端子14的左右方向(Z方向)兩側。As shown in Fig. 9, the electronic component body 12 has two hooks 12a. The hooks 12a are arranged at the left and right ends of the lower surface (-X direction end surface) of the electronic component body 12. The hooks 12a are arranged on both sides of the three terminals 14 in the left-right direction (Z direction).
鉤部12a具有自電子零件本體12的下表面朝-X方向延伸的軸部12b、及配置於軸部12b的-X方向端的突起部12c。左側(+Z方向)的鉤部12a的突起部12c具有相對於-X方向朝左方向(+Z方向)傾斜的傾斜面12d。右側(-Z方向)的鉤部12a的突起部12c具有相對於-X方向朝右方向(-Z方向)傾斜的傾斜面12d。左右的突起部12c間的間距P1設定得比左右的被卡止孔36(後述)間的間距P2短。The hook portion 12a has a shaft portion 12b extending from the lower surface of the electronic component body 12 in the -X direction, and a protrusion 12c arranged at the -X direction end of the shaft portion 12b. The protrusion 12c of the hook portion 12a on the left side (+Z direction) has an inclined surface 12d inclined toward the left direction (+Z direction) relative to the -X direction. The protrusion 12c of the hook portion 12a on the right side (-Z direction) has an inclined surface 12d inclined toward the right direction (-Z direction) relative to the -X direction. The distance P1 between the left and right protrusions 12c is set shorter than the distance P2 between the left and right latching holes 36 (described later).
如圖9所示,印刷基板3具有左右兩個被卡止孔36(被卡止部)。被卡止孔36具有突起部12c可穿過的大小。As shown in Fig. 9, the printed circuit board 3 has two left and right latched holes 36 (latched portions). The latched holes 36 have a size that allows the protrusion 12c to pass through.
於將電子零件1與印刷基板3組裝的情況下,使左側的突起部12c與左側的被卡止孔36對應,使右側的突起部12c與右側的被卡止孔36對應。繼而,使電子零件1抗拒螺旋彈簧16的復原力,相對於印刷基板3朝下方向(-X方向)進行相對移動。藉此,左側的突起部12c的傾斜面12d抵接於左側的被卡止孔36的上側孔緣,另外,右側的突起部12c的傾斜面12d抵接於右側的被卡止孔36的上側孔緣,左側的鉤部12a的軸部12b抗拒復原力朝左方向彎曲,另外,右側的鉤部12a的軸部12b抗拒復原力朝右方向彎曲。藉此,左右的突起部12c間的間距P1擴大,變成與左右的被卡止孔36間的間距P2相等。其結果,左側的突起部12c穿過左側的被卡止孔36,右側的突起部12c穿過右側的被卡止孔36。When the electronic component 1 is assembled with the printed circuit board 3, the left protrusion 12c is aligned with the left latch hole 36, and the right protrusion 12c is aligned with the right latch hole 36. Then, the electronic component 1 is moved relative to the printed circuit board 3 in the downward direction (-X direction) against the restoring force of the coil spring 16. As a result, the inclined surface 12d of the left protrusion 12c abuts against the upper hole edge of the left engaged hole 36, and the inclined surface 12d of the right protrusion 12c abuts against the upper hole edge of the right engaged hole 36, and the shaft 12b of the left hook 12a bends to the left against the restoring force, and the shaft 12b of the right hook 12a bends to the right against the restoring force. As a result, the distance P1 between the left and right protrusions 12c is enlarged and becomes equal to the distance P2 between the left and right engaged holes 36. As a result, the left protrusion 12 c passes through the left engaged hole 36 , and the right protrusion 12 c passes through the right engaged hole 36 .
於左右的突起部12c穿過了左右的被卡止孔36的情況下,左右的鉤部12a的軸部12b復原,左右的突起部12c間的間距P1再次變得比左右的被卡止孔36間的間距P2短。藉此,左側的突起部12c卡止於左側的被卡止孔36的下側孔緣,右側的突起部12c卡止於右側的被卡止孔36的下側孔緣。藉此,電子零件1的相對於印刷基板3的上方向(+X方向)的移動受到限制。另外,電子零件1的相對於印刷基板3的下方向(-X方向)的移動由螺旋彈簧16的復原力限制。其結果,可將電子零件1與印刷基板3組裝(局部裝配)。When the left and right protrusions 12c pass through the left and right latching holes 36, the shafts 12b of the left and right hooks 12a return to their original positions, and the distance P1 between the left and right protrusions 12c becomes shorter than the distance P2 between the left and right latching holes 36 again. As a result, the left protrusion 12c is latched to the lower edge of the left latching hole 36, and the right protrusion 12c is latched to the lower edge of the right latching hole 36. As a result, the movement of the electronic component 1 in the upward direction (+X direction) relative to the printed circuit board 3 is restricted. In addition, the movement of the electronic component 1 in the downward direction (-X direction) relative to the printed circuit board 3 is restricted by the restoring force of the coil spring 16. As a result, the electronic component 1 can be assembled (partially assembled) with the printed circuit board 3.
於變形例3中的電子機器100中,印刷基板3具有被卡止孔36,電子零件本體12具有以將電子零件本體12安裝於印刷基板3的方式卡止於被卡止孔36的鉤部12a,將印刷基板3及已安裝於印刷基板3的電子零件本體12安裝於外殼2。藉此,可將電子零件1安裝於印刷基板3後,組裝於外殼2。In the electronic device 100 in the third modification, the printed circuit board 3 has a locking hole 36, the electronic component body 12 has a hook portion 12a that is locked in the locking hole 36 in a manner that the electronic component body 12 is mounted on the printed circuit board 3, and the printed circuit board 3 and the electronic component body 12 mounted on the printed circuit board 3 are mounted on the housing 2. Thus, the electronic component 1 can be mounted on the printed circuit board 3 and then assembled on the housing 2.
本申請案是基於已於2019年9月27日申請的日本專利申請案(日本專利特願2019-177100)、及已於2020年1月7日申請的日本專利申請案(日本專利特願2020-000861)者,其內容可作為參照而被編入本申請案中。 [產業上的可利用性]This application is based on the Japanese patent application filed on September 27, 2019 (Japanese Patent Application No. 2019-177100) and the Japanese patent application filed on January 7, 2020 (Japanese Patent Application No. 2020-000861), and the contents thereof are incorporated into this application as a reference. [Industrial Applicability]
本發明適宜地用於包括被要求降低組裝成本,並且減輕對於連接部的負荷的電子零件的電子機器。The present invention is suitably used for electronic equipment including electronic parts which are required to reduce assembly cost and alleviate the load on connecting portions.
1:電子零件
2:外殼
3:印刷基板
12:電子零件本體
12a:鉤部
12b:軸部
12c:突起部
12d:傾斜面
13:軸承部
14:端子
14a:基端部
14b:前端部
14c:+X方向端
15:輸入軸
16:螺旋彈簧
16a:+X方向端部
16b:-X方向端部
16c:延伸部
16d:線圈部
16e:折回部
17:止脫部
18、19:凸部
18a、19a:-X側邊緣
18b、19b:+X側邊緣
22:底壁部
24:周壁部
25:卡合槽
26:開口部
32:上表面
33:下表面
34:嵌合孔
35:金屬扣眼
36:被卡止孔
100:電子機器
L:距離
P1、P2:間距
+X、+Y、+Z:方向
A-A、B-B:線1: Electronic parts
2: Housing
3: Printed circuit board
12: Electronic parts body
12a: Hook
12b: Shaft
12c: Protrusion
12d: Inclined surface
13: Bearing
14: Terminal
14a:
圖1是概略性地表示本發明的實施方式中的電子機器的一部分的圖。 圖2是圖1的A-A線剖面圖。 圖3是端子的部分放大圖。 圖4是表示外嵌於端子的螺旋彈簧的圖。 圖5是表示於變形例1中,以經壓縮的狀態接觸印刷基板的螺旋彈簧的圖。 圖6是概略性地表示變形例2中的電子機器的一部分的圖。 圖7是圖6的部分放大圖。 圖8是概略性地表示變形例3中的電子機器的一部分的圖。 圖9是圖8的B-B線剖面圖。FIG. 1 is a diagram schematically showing a portion of an electronic device in an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1 . FIG. 3 is a partially enlarged view of a terminal. FIG. 4 is a diagram showing a coil spring externally embedded in a terminal. FIG. 5 is a diagram showing a coil spring in contact with a printed circuit board in a compressed state in variant 1. FIG. 6 is a diagram schematically showing a portion of an electronic device in variant 2. FIG. 7 is a partially enlarged view of FIG. 6 . FIG. 8 is a diagram schematically showing a portion of an electronic device in variant 3. FIG. 9 is a cross-sectional view taken along line B-B of FIG. 8 .
14:端子 14: Terminals
14a:基端部 14a: Base end
14b:前端部 14b: Front end
14c:+X方向端 14c: +X direction end
16:螺旋彈簧 16: Coil spring
16a:+X方向端部 16a: +X direction end
16b:-X方向端部 16b: -X direction end
17:止脫部 17: Stop the fall
18、19:凸部 18, 19: convex part
+X、+Y、+Z:方向 +X, +Y, +Z: Direction
Claims (3)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019177100 | 2019-09-27 | ||
| JP2019-177100 | 2019-09-27 | ||
| JP2020000861A JP7438758B2 (en) | 2019-09-27 | 2020-01-07 | Electronics |
| JP2020-000861 | 2020-01-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202113889A TW202113889A (en) | 2021-04-01 |
| TWI865613B true TWI865613B (en) | 2024-12-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109133198A TWI865613B (en) | 2019-09-27 | 2020-09-25 | Electronic parts and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7438758B2 (en) |
| TW (1) | TWI865613B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119054031A (en) * | 2022-04-25 | 2024-11-29 | 东京Cosmos电机株式会社 | Electronic component, terminal structure of electronic component, and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5388998A (en) * | 1993-03-16 | 1995-02-14 | Hewlett-Packard Company | Method and system for producing electrically interconnected circuits |
| JP2000151064A (en) * | 1998-11-06 | 2000-05-30 | Itabashi Giken Kk | Mounting mechanism of microcomponents on printed board |
| CN101377982A (en) * | 2007-08-31 | 2009-03-04 | 阿尔卑斯电气株式会社 | Button switch device |
| US7677901B1 (en) * | 2008-12-26 | 2010-03-16 | Yamaichi Electronics Co., Ltd. | Electric connecting apparatus for semiconductor devices and contact used therefor |
| US7878834B2 (en) * | 2008-04-17 | 2011-02-01 | Neil Sherman | Connector for mating a contact pin with a device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH048621Y2 (en) * | 1985-04-17 | 1992-03-04 | ||
| JPH01119170U (en) * | 1988-02-08 | 1989-08-11 | ||
| JP2000174459A (en) | 1998-12-09 | 2000-06-23 | Nec Data Terminal Ltd | Connection terminal mounting structure |
-
2020
- 2020-01-07 JP JP2020000861A patent/JP7438758B2/en active Active
- 2020-09-25 TW TW109133198A patent/TWI865613B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5388998A (en) * | 1993-03-16 | 1995-02-14 | Hewlett-Packard Company | Method and system for producing electrically interconnected circuits |
| JP2000151064A (en) * | 1998-11-06 | 2000-05-30 | Itabashi Giken Kk | Mounting mechanism of microcomponents on printed board |
| CN101377982A (en) * | 2007-08-31 | 2009-03-04 | 阿尔卑斯电气株式会社 | Button switch device |
| US7878834B2 (en) * | 2008-04-17 | 2011-02-01 | Neil Sherman | Connector for mating a contact pin with a device |
| US7677901B1 (en) * | 2008-12-26 | 2010-03-16 | Yamaichi Electronics Co., Ltd. | Electric connecting apparatus for semiconductor devices and contact used therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021057328A (en) | 2021-04-08 |
| JP7438758B2 (en) | 2024-02-27 |
| TW202113889A (en) | 2021-04-01 |
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