JP2000151064A - Mounting mechanism of microcomponents on printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a mounting mechanism of microcomponents on a printed board which allows the microcomponents to be replaced one by one in the event of troubles because the microcomponents can be mounted on the board without soldering, and never causes damage due to heat to the printed board. SOLUTION: A socket pin 2 having a socket 2a and a pin is formed, a microcomponent 1 is inserted and fixed in the socket 2a of the socket pin 2, a coil spring 3 is wound around the pin of the socket pin 2, a fixing case for fixing the microcomponent 1 forms a fixing part for fixing a pair of sockets 2a, a housing for housing the coil spring 3 is formed, the coil spring 3 forms several turns tightly around the base of the pin without space and several turns floatingly with a space around the top end, and the top end of the spring 3 being compressed is flush with the lower side of the fixing case.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mechanism for mounting a very small number of components, such as a large number of resistance elements, on a printed circuit board. The present invention relates to a mechanism for mounting an extremely small number of components on a printed circuit board that is not required.

[0002]

2. Description of the Related Art Conventionally, when mounting a very small part such as a resistance element, a relay, a diode, a transistor, etc. on a printed circuit board, a socket pin is fitted on both sides of the very small part and the pin portion of the socket pin on one side is penetrated. Insert the cup-shaped storage part with a hole through the engaging case
The protruding pins are penetrated through through holes in the printed circuit board, soldered to the back side, and connected to the printed circuit.

[0003]

However, if any trouble occurs in the very small parts mounted on the printed circuit board, the soldering is removed and removed, so that the damage due to heat is spread to the adjacent very small parts, or the printed circuit board itself is damaged. In addition to this, not only was an expensive printed circuit board wasted, but also the work time up to now was often wasted.

[0004]

Means for Solving the Problems In view of the above-mentioned problems, as a result of diligent study, a socket pin having a socket portion and a pin portion is formed, and a very small number of components are inserted and fixed into the socket portion of the socket pin, and the socket is fixed. An engaging case for winding a coil spring around a pin portion of a pin and engaging a minimum number of parts forms an engaging portion for engaging a pair of socket portions, and forms a coil spring accommodating portion for accommodating a coil spring. The coil spring is wound around the base end of the pin portion a plurality of times at no interval and in a non-moving state, and is wound in a free state in the tip direction with a plurality of intervals and in a floating state. Is a state in which the front end is flush with the lower side of the engagement case in a compressed state.

[0005]

According to the present invention, a fine coil spring is wound a plurality of times around a base end of a pin portion at a non-interval and non-moving state around a pin portion of a socket pin in which a minimum number of components are inserted and fixed. In the direction of the tip of the pin portion, the pin is wound in a free state with a plurality of intervals in the free state and wound in a floating state, and the tip of the coil spring is flush with the lower side of the engagement case in the compressed state. Only by penetrating the part into the through hole of the printed circuit board, height can be taken for mounting the fewest parts, and the printed circuit formed in the peripheral area of the through hole, the pin part and the lower side of the coil spring are brought into contact to establish electrical connection. It is what you do.

Accordingly, an object of the present invention is to mount a very small number of components on a printed circuit board without soldering, so that even if a trouble occurs in a very small number of components, it is possible to replace the individual components individually, The present invention provides a mechanism for mounting a minimum number of components on a printed circuit board without damaging the printed circuit board.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a mechanism for mounting a very small number of components on a printed circuit board according to the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a plan view for explaining a coil spring in a free state of a mechanism for mounting a very small number of components on a printed circuit board according to the present invention. FIG. FIG. 3 is a plan view for explaining a coil spring of the present invention, and FIG. 3 is a plan view showing a state where the coil spring is engaged with an engaging case of a mechanism for mounting a minimum number of components on a printed circuit board of the present invention. FIG. 4 is a plan view showing a state in which a minimal component mounting mechanism on the board is mounted on a printed circuit board.

The present invention relates to a mechanism for mounting a very small number of components 1 such as a large number of resistive elements on a printed circuit board P. More specifically, the present invention relates to a method for soldering a printed circuit K of a printed circuit board P to a very small number of components. The present invention relates to a mechanism for mounting the minimal parts 1 on the printed circuit board P, which is unnecessary, in which a large number of conductive socket pins 2 having socket portions 2a and pin portions 2b are formed, and the socket portions 2a of the respective socket pins 2 are formed. The fixing case 4 for inserting and fixing both ends of the minimal component 1 to each other, winding the coil spring 3 around the outer periphery of the pin portion 2b on one side of the socket pin 2, and securing the large number of minimal components 1 A recessed engaging portion 4a for engaging the pair of socket portions 2a is formed, and the engaging portion 4a is formed.
A coil spring receiving portion 4b for housing the coil spring 3 therein is formed below the coil spring 3a, and the coil spring 3 is wound around the base end of the pin portion 2b a plurality of times at no interval and in a floating state. With pin 2b
The coil spring 3 is wound in a free state with a plurality of intervals in a free state and wound in a floating state, and the coil spring 3 is compressed so that the front end 3a is flush with the lower side 4c of the engagement case 4. is there.

That is, the mounting mechanism of the minimal parts 1 on the printed circuit board P according to the present invention relates to a mechanism for attaching the minimal parts 1 such as a large number of resistance elements, relays, diodes, transistors and the like to the printed circuit board P. Is one that eliminates soldering and does not damage by heat, and further improves workability.

A socket pin 2 for inserting and fixing both ends of the minimal part 1 is made of conductive metal and includes a cup-shaped socket portion 2a and a rod-shaped pin portion 2b.
To insert and fix both ends of the minimal part 1, and a multiple thereof is required according to the number of the minimal parts 1,
The insertion fixing means may be a conventional means such as press-fitting.

The outer periphery of the pin portion 2b of the socket pin 2 on one side is made of nickel such as conductive beryllium copper or the like.
A coil spring 3 having both conductivity and elasticity formed by surface treatment with a metal such as aluminum is wound. The coil spring 3 is a base end side of the pin portion 2b of the socket pin 2, that is, At the bottom of the socket portion 2a, it is wound with no gap and no movement even in a free state, that is, it is wound with the same diameter as the outer diameter of the pin portion 2b or a slightly smaller diameter. In the illustrated embodiment, the winding is performed about 4 to 5 times, and further, the winding is performed in a free state in the tip direction with a plurality of intervals and in a floating state. Yes, that is, 4 to 5 in the state of sequentially swelling outward in the tip direction
4 to 5 in a state of successively narrowing in the distal direction.
The diameter of the coil spring 3 is fine, and is determined by the size k of the minimum number of components to be mounted.

Next, an engaging case 4 for engaging a large number of the minimal parts 1 and a pair of socket pins 2 is formed of a band-shaped synthetic resin, and has a concave shape having an opening for engaging each individual product. A large number of engaging portions 4a are continuously provided in two upper and lower stages, that is, one set of the socket portions 2a of the socket pins 2 into which the minimal components 1 are fitted are attached to the upper and lower two-stage engaging portions 4a. It is to let.

Further, a coil spring accommodating portion 4b is formed on the lower side of the upper and lower two-stage engaging portions 4a of the engaging case 4, respectively.
Is formed so that the outer periphery of the coil spring 3 that is swollen and wound does not come into contact with the engagement case 4. 3c.

That is, in the present invention, the coil spring 3 is wound around the pin portion 2b of the socket pin 2 on one side, and the coil spring 3 is wound a plurality of times on the base end side of the pin portion 2b of the socket pin 2 at no intervals and in a non-moving state. In addition to being wound, the pin portion 2b is wound in a free state with a plurality of intervals in the tip direction of the pin portion 2b and in a floating state. Is wound four to five times in a state of successively bulging outward, and is further wound four to five times in a state of successively tapering downward. is there.

As shown in FIG. 4, the mounting mechanism of the minimal parts 1 of the present invention is such that when the pin portion 2b of the socket pin 2 is inserted into the through hole S of the printed circuit board P with the engaging case 4, the coil is pressed by pressure. The spring 3 is in a compressed state, and the adjacent portions of the wound coil spring 3 are in contact with each other, and the coil spring 3 is not compressed even if it is further pressed, so that the engagement case 4 is not compressed. This is in a state of being housed in the coil spring housing part 4b formed on the lower side.

[0017]

According to the above-described structure, the present invention allows a finer coil spring to be wound around the pin portion of the socket pin in which the minimum number of components are inserted and fixed, and the coil spring is wound a plurality of times around the base end of the pin portion. It is wound in a free state in the tip direction of the pin portion with a plurality of turns in the free direction and wound in the free state, and the coil spring is compressed and the tip is the lower side of the engagement case. By flushing with the printed circuit board, it is possible to mount the minimum number of components by simply penetrating the pin portion of the socket pin into the through hole of the printed circuit board and to take the height, and furthermore, the printed circuit formed around the through hole. The pin and the lower side of the coil spring are in contact with each other to make electrical connection. If it is necessary to replace the minimum number of mounted parts, replace only the relevant parts. Can, and soldering without thermal damage does not require, which improves workability of mounting and to achieve the very meaningful effect.

[Brief description of the drawings]

FIG. 1 is a plan view for explaining a coil spring in a free state of a mechanism for mounting a minimum number of components on a printed circuit board according to the present invention.

FIG. 2 is a plan view for explaining a coil spring in a compressed state of a mechanism for mounting a very small number of components on a printed circuit board according to the present invention.

FIG. 3 is a plan view of a printed circuit board according to the present invention in a state where it is engaged with an engaging case of a mechanism for mounting very few components.

FIG. 4 is a plan view showing a state in which a minimal component mounting mechanism of the printed circuit board according to the present invention is mounted on the printed circuit board.

[Explanation of symbols]

 P Printed circuit board S Through hole K Print print 1 Minimal parts 2 Socket pin 2a Socket part 2b Pin part 3 Coil spring 3a Tip 4 Engagement case 4a Engagement part 4b Coil spring accommodation part 4c Lower side P Printed circuit board S Through hole K Print print

Claims (1)

[Claims] 1. A mechanism for mounting a very small number of components, such as a plurality of resistance elements, on a printed circuit board, wherein a plurality of conductive socket pins having a socket portion and a pin portion are formed, and the socket of the pair of socket pins is provided. The end cases of the minimal parts are respectively inserted and fixed to the parts, and a coil spring is wound around the outer periphery of the pin part on one side of the socket pin, and the engaging case for engaging the large number of minimal parts is each of the minimal parts. A pair of socket portions having both ends inserted therethrough are respectively formed with concave-shaped engaging portions for engaging, and a coil spring accommodating portion for accommodating the coil spring is formed below the engaging portions, respectively. The coil spring is wound around the base end side of the pin portion a plurality of times at no interval and in a non-moving state, and is wound in a free state in the distal direction with a plurality of times at an interval and in a floating state, Serial coil spring very small part of the attachment mechanism in the printed circuit board, characterized in that the tip in a compressed state has a lower flush the-engaging casing.