TWI864863B - Double-side vacuum film lamination apparatus and double-side vacuum film lamination method - Google Patents

Abstract

A double-side vacuum film lamination apparatus includes an upper chamber, a lower chamber, an upper laminator, a lower laminator and a substrate carrier mechanism. The lower chamber is disposed corresponding to the upper chamber. The upper laminator is movably disposed on the upper chamber, and the lower laminator is movably disposed on the lower chamber. The substrate carrier mechanism is disposed between the upper laminator and the lower laminator. The upper chamber and the lower chamber are movable with respect to the substrate carrier mechanism so as to be in close contact with the substrate carrier mechanism.

Description

Double-sided vacuum lamination device and double-sided vacuum lamination method

The present invention relates to lamination technology, in particular to a double-sided vacuum lamination device and a double-sided vacuum lamination method.

In the semiconductor or electronic component industry, it is necessary to attach film materials (including Mylar) to the substrate as a building layer or adhesive for subsequent processes. Generally speaking, the film material is first picked up and then transported to the film attachment work area corresponding to the substrate through a transmission mechanism, and then the film material is pushed to complete the operation of pressing the film material to the substrate surface.

The double-sided lamination process of laminating the opposite surfaces of the substrate is widely used in related technical fields. In the existing double-sided lamination process, the laminator first presses the film material onto one surface of the substrate, then the substrate is removed from the laminator and turned over at another workstation by manual operation or mechanical automation, and then the turned-over substrate is transported to the laminator again and the film material is pressed onto the other surface. However, due to the requirements for improving the film material properties and process yield, the existing laminators and double-sided lamination processes have been unable to meet the needs of the industry.

In view of the above problems, the present invention provides a double-sided vacuum lamination device and a double-sided vacuum lamination method, which helps to improve the problem of poor production yield of the existing double-sided lamination process.

The double-sided vacuum lamination device disclosed in the present invention comprises an upper cavity, a lower cavity, an upper lamination component, a lower lamination component and a substrate supporting mechanism. The lower cavity is arranged corresponding to the upper cavity. The upper lamination component can be movably arranged in the upper cavity. The lower lamination component can be movably arranged in the lower cavity. The substrate supporting mechanism is arranged between the upper lamination component and the lower lamination component, and the upper cavity and the lower cavity can move relative to the substrate supporting mechanism to be tightly fitted with the substrate supporting mechanism.

The double-sided vacuum lamination method disclosed in the present invention includes: picking up an upper film material with an upper lamination component and picking up a lower film material with a lower lamination component; providing a substrate supporting mechanism carrying a substrate between the upper lamination component and the lower lamination component; forming a vacuum environment for accommodating the upper lamination component, the lower lamination component and the substrate supporting mechanism; and respectively pressing the upper film material and the lower film material onto two opposite surfaces of the substrate.

According to the double-sided vacuum lamination device and double-sided vacuum lamination method disclosed in the present invention, the substrate is transported between two lamination parts by moving the substrate support mechanism. The upper cavity and the lower cavity can move relative to the substrate support mechanism to fit closely with the substrate support mechanism, and then perform lamination. During the lamination process, since the film material will first contact the substrate to be pressed inside the cavity, and the film material will be placed on the substrate for lamination after the vacuum degree of the cavity has reached a suitable condition, the adhesion between the film material and the substrate can be reduced to improve the yield.

The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

1: Double-sided vacuum lamination device

10: Film cutting module

110: Membrane carrier

111: Upper surface

112: Lower surface

120: Film mounting wheel

130: Membrane conveyor wheel

140: Waste film recovery wheel

150: Film cutting knife

20: Laminating module

200: Cavity

210: Upper cavity

220: Lower cavity

230: Upper pressure film

231: Pressure plate

232: Take the membrane part

240: Lower pressure film

241: Pressure plate

242: Take the membrane part

250: Substrate supporting mechanism

251:Frame

2511:Inner side

252:Driver

253: Baseboard support

30: Pickup module

310: Mechanical working arm

320: Suction nozzle

100: Substrate

101: Upper surface

102: Lower surface

F: Film material

F1: Film material

F2: Film material

H: Horizontal direction

R1: Film supply area

R2: Film pressing area

R3: Investment area

S1~S8: Steps

Figure 1 is a schematic diagram of a double-sided vacuum lamination device according to the first embodiment of the present invention.

Figure 2 is a schematic diagram of the substrate supporting mechanism of the double-sided vacuum lamination device in Figure 1.

Figure 3 is a flow chart of a double-sided vacuum lamination method according to an embodiment of the present invention.

Figures 4 to 9 are schematic diagrams of using the double-sided vacuum lamination device of Figure 1 to perform the double-sided vacuum lamination method of Figure 3.

The detailed features and advantages of the present invention are described in detail in the following implementation methods, and the content is sufficient for anyone familiar with the relevant technology to understand the technical content of the present invention and implement it accordingly. Moreover, according to the content disclosed in this specification, the scope of the patent application and the drawings, anyone familiar with the relevant technology can easily understand the present invention. The following embodiments are to further illustrate the viewpoints of the present invention in detail, but they do not limit the scope of the present invention by any viewpoint.

Please refer to Figures 1 and 2, wherein Figure 1 is a schematic diagram of a double-sided vacuum lamination device according to the first embodiment of the present invention, and Figure 2 is a schematic diagram of a substrate supporting mechanism of the double-sided vacuum lamination device of Figure 1. In this embodiment, the double-sided vacuum lamination device 1 may include a film cutting module 10, a lamination module 20, and a pickup module 30. In this embodiment, the film cutting module 10, the pickup module 30, and the lamination module 20 are integrated into a single device (double-sided vacuum lamination device 1), but in other embodiments, the film cutting module and/or the pickup module may be independently configured in different devices relative to the lamination module.

The film cutting module 10 may include a film support seat 110, a film mounting wheel 120, a film conveying wheel 130, a waste film recovery wheel 140 and a film cutting knife 150. The film mounting wheel 120 is disposed on one side of the film support seat 110, and is used to support the film material F wound into a cylindrical shape. The waste film recovery wheel 140 is disposed on the other side of the film support seat 110. The film conveying wheel 130 is disposed on at least one side of the film support seat 110, and is used to change the conveying direction of the film material so that the film material F can move in a direction parallel to the surface of the film support seat 110. The film cutting knife 150 is disposed corresponding to the film support seat 110, and the film cutting knife 150 can be connected to a driving source (such as a motor, not shown). The film material F can be held on opposite sides of the film support 110, and the film cutting knife 150 can move relative to the film support 110 to cut the film material F. In this embodiment, a plurality of rollers are used to transport the film material F, but the present invention is not limited thereto. In other embodiments, the film material can be held on the film support by manual operation.

The laminating module 20 may include an upper cavity 210, a lower cavity 220, an upper laminating component 230, a lower laminating component 240, and a substrate supporting mechanism 250. The lower cavity 220 is disposed corresponding to the upper cavity 210, and the upper cavity 210 and the lower cavity 220 can each move relative to each other by a driving source (such as a motor cylinder, not shown).

The upper pressure film member 230 is movably disposed on the upper chamber 210. Specifically, the upper pressure film member 230 may include a pressure plate 231 movably disposed on the upper chamber 210 and a film removal portion 232 disposed on the pressure plate 231. The pressure plate 231 is located on a side of the upper chamber 210 facing the lower chamber 220, and the pressure plate 231 can be moved relative to the upper chamber 210 to approach the lower chamber 220 by a driving source (such as a motor cylinder, not shown). The film removal portion 232 is, for example but not limited to, one of a negative pressure suction cup, an electrostatic suction cup (E-chuck) and a silicone pad. The film material held on one side of the film support seat 110 can be picked up by the film taking portion 232. This will be further explained later.

The lower pressure film member 240 is movably disposed in the lower cavity 220. Specifically, the lower pressure film member 240 may include a pressure plate 241 movably disposed in the lower cavity 220 and a film removal portion 242 disposed on the pressure plate 241. The pressure plate 241 is located on a side of the lower cavity 220 facing the upper cavity 210, and the pressure plate 241 can be moved relative to the lower cavity 220 to approach the upper cavity 210 by a driving source (such as a motor cylinder, not shown). The film removal portion 242 may include at least one of a negative pressure suction cup, an electrostatic suction cup, and a silicone pad. The film material held on the other side of the film support seat 110 can be picked up by the film taking portion 242, which will be further explained later.

The substrate supporting mechanism 250 is movably disposed between the upper pressure film 230 and the lower pressure film 240, and the upper cavity 210 and the lower cavity 220 can move relative to the substrate supporting mechanism 250 to fit closely with the substrate supporting mechanism 250. As shown in FIG2 , the substrate supporting mechanism 250 can include a frame 251, a driving member 252, and a substrate supporting member 253. The driving member 252 is, for example but not limited to, a cylinder or a stepping motor, which is disposed in the frame 251 and connected to the substrate supporting member 253, so that the substrate supporting member 253 is movable relative to the frame 251, that is, the driving member 252 can drive the substrate supporting member 253 to move relative to the frame 251. By moving the driving member 252, the substrate support member 253 can be located inside the frame 251 or protrude from the inner side surface 2511 of the frame 251 and be exposed to the outside. The frame 251 can be annular, such as but not limited to a square ring or a circular ring.

In this embodiment, the upper cavity 210 and the lower cavity 220 can move relative to the substrate supporting mechanism 250 to be closely fitted with the substrate supporting mechanism 250. Specifically, the substrate supporting mechanism 250 can be placed between the upper cavity 210 and the lower cavity 220. At this time, the upper cavity 210 can move toward the lower cavity 220 to be closely fitted with one side of the frame 251, and the lower cavity 220 can move toward the upper cavity 210 to be closely fitted with the other side of the frame 251. In this way, the gas can be exhausted through the gas channel (not shown) formed in the upper cavity 210 or the lower cavity 220, and a negative pressure vacuum atmosphere can be provided between the upper cavity 210 and the lower cavity 220, so that the upper cavity 210 and the lower cavity 220 are both airtightly joined with the frame 251 of the substrate supporting mechanism 250, which will be further described later. The close fit between the upper cavity 210 or the lower cavity 220 and the substrate supporting mechanism 250 is, for example but not limited to, making the upper cavity 210 or the lower cavity 220 continuously press against the frame 251 of the substrate supporting mechanism 250, or making the upper cavity 210 or the lower cavity 220 and the frame 251 snap-fit and fixed.

The pick-up module 30 may include a mechanical working arm 310 and a suction nozzle 320 located on the mechanical working arm 310. The mechanical working arm 310 may be moved to a material area (not shown) where substrates are stored. The pick-up module 30 picks up the substrate through the suction nozzle 320, and then transports the picked-up substrate to the double-sided vacuum lamination device 1 through the mechanical working arm 310. The substrate carrying mechanism 250 may receive the substrate picked up by the pick-up module 30, which will be further described later. The specific form of the pick-up module 30 is not intended to limit the present invention. In other embodiments, the pick-up module may include a fixture, a tray, or a linear slide rail.

An embodiment of the present invention discloses a double-sided vacuum lamination method, and the double-sided vacuum lamination method can be performed using the double-sided vacuum lamination device of FIG. 1. Please refer to FIG. 3 to FIG. 9, wherein FIG. 3 is a flow chart of the double-sided vacuum lamination method according to an embodiment of the present invention, and FIG. 4 to FIG. 9 are schematic diagrams of using the lamination system of FIG. 1 to perform the double-sided vacuum lamination method of FIG. 3.

The double-sided vacuum lamination method disclosed in this embodiment includes steps S1 to S8 performed in sequence, which press the film material onto the upper and lower surfaces of a substrate (such as a silicon wafer). In other embodiments, the film material and the substrate may be a resin film and a multi-layer circuit board, respectively.

In step S1, a film support 110 is provided with film materials held on opposite sides. Specifically, the film conveying wheels 130 of the film cutting module 10 convey the strip-shaped film material F to the opposite sides of the film support 110, and the film material F is held on the film support 110. In more detail, one film conveying wheel 130 conveys one film material F to the top of the film support 110, and another film conveying wheel 130 conveys another film material F to the bottom of the film support 110. The film material F conveyed to the top of the film support 110 is held on the upper surface 111 of the film support 110, for example, by negative pressure adsorption, and the film material F conveyed to the bottom of the film support 110 is held on the lower surface 112 of the film support 110, for example, by negative pressure adsorption. The film cutting knife 150 cuts the two film materials F into upper film material F1 and lower film material F2 that match the substrate.

In order to conveniently explain how to perform the double-sided vacuum lamination method of FIG. 3 with the double-sided vacuum lamination device 1, the double-sided vacuum lamination device 1 can be defined into three working areas, namely the film supply area R1, the lamination area R2 and the film injection area R3, as shown in FIG. 4. The film cutting knife 150 of the film cutting module 10 is often located in the film supply area R1, the upper cavity 210, the lower cavity 220, the upper film pressing member 230 and the lower film pressing member 240 of the lamination module 20 can be often located in the lamination area R2, and the pickup module 30 can be often located in the film injection area R3.

In step S2, the film support 110 is provided between the upper film pressing member 230 and the lower film pressing member 240. As shown in Figures 4 and 5, the film support 110 holding the upper film material F1 and the lower film material F2 is moved from the film supply area R1 to the film pressing area R2, and the upper film material F1 and the lower film material F2 are placed between the upper film pressing member 230 and the lower film pressing member 240 of the film pressing module 20. The method of moving the film support 110 is, for example but not limited to, manual transportation or mechanical automatic transportation. In addition, in this embodiment, the film mounting wheel 120, the film conveying wheel 130 and the waste film recovery wheel 140 are fixed relative to the film support seat 110, so when the film support seat 110 is moved to the film pressing area R2, the film mounting wheel 120, the film conveying wheel 130 and the waste film recovery wheel 140 will also be brought to the film pressing area R2, but the present invention is not limited to this. In other embodiments, the film support seat is an independently movable element, so when the film support seat is moved, the film mounting wheel, the film conveying wheel and the waste film recovery wheel will not be driven to move together.

In step S3, the upper film material F1 is picked up by the upper film pressing member 230 and the lower film material F2 is picked up by the lower film pressing member 240. As shown in FIG5 , the upper film pressing member 230 descends close to the film support seat 110, and the film taking part 232 of the upper film pressing member 230 picks up the upper film material F1. The lower film pressing member 240 ascends close to the film support seat 110, and the film taking part 242 of the lower film pressing member 240 picks up the lower film material F2. When the film taking parts 232 and 242 include negative pressure suction cups or electrostatic suction cups, the picking up may be that the film taking parts 232 and 242 suck up the upper film material F1 and the lower film material F2, respectively. When the film taking parts 232 and 242 include silicone pads, the picking up can be that the film taking parts 232 and 242 respectively stick the upper film material F1 and the lower film material F2.

In step S4, the film support 110 is removed from between the upper film pressing member 230 and the lower film pressing member 240. As shown in Figures 5 and 6, after the film taking portion 232 of the upper film pressing member 230 picks up the upper film material F1 and the film taking portion 242 of the lower film pressing member 240 picks up the lower film material F2, the upper film pressing member 230 and the lower film pressing member 240 return to their original positions, and the film support 110 is moved back from the film pressing area R2 to the film supply area R1. Optionally, the film support 110 can be provided with film material again by executing step S1.

In step S5, the substrate supporting mechanism 250 carrying the substrate is provided between the upper pressure film member 230 and the lower pressure film member 240. As shown in FIG5 and FIG6, in the film-casting area R3, the pick-up module 30 has already picked up the substrate 100 from the material area (not shown separately). The pick-up module 30 can transfer the substrate 100 to the substrate support member 253 of the substrate supporting mechanism 250. In other words, the substrate support member 253 can maintain the inner side surface 2511 of the protruding frame 251 so that the substrate support member 253 can receive the substrate 100. The substrate 100 can be supported on the substrate support member 253. The substrate supporting mechanism 250 carrying the substrate 100 is moved from the film casting area R3 to the laminating area R2, and the substrate 100 is placed between the upper laminating component 230 and the lower laminating component 240 of the laminating module 20. The method of moving the substrate supporting mechanism 250 is, for example but not limited to, manual transportation or mechanical automated transportation.

In step S6, a vacuum environment is formed to accommodate the upper pressure film 230, the lower pressure film 240 and the substrate supporting mechanism 250. As shown in Figures 6 and 7, the upper cavity 210 descends to fit closely with one side of the frame 251 of the substrate supporting mechanism 250, and the lower cavity 220 rises and approaches to fit closely with the other side of the frame 251. Then, the gas is exhausted through the gas channel (not shown) formed in the upper cavity 210 or the lower cavity 220, and a negative pressure vacuum atmosphere is provided in the cavity 200 between the upper cavity 210 and the lower cavity 220. In FIG. 7 , the pressure plate 231 and the film removal part 232 of the upper film pressing member 230 are located in the cavity 200, the pressure plate 241 and the film removal part 242 of the lower film pressing member 240 are located in the cavity 200, the driving member 252 and the substrate support member 253 of the substrate supporting mechanism 250 are located in the cavity 200, and the upper film material F1, the lower film material F2 and the substrate 100 are located in the cavity 200.

In step S7, the upper film material F1 and the lower film material F2 are pressed onto the opposite surfaces of the substrate 100. As shown in FIG7 and FIG8, the lower film pressing member 240 is driven to move closer to the lower surface 102 of the substrate 100. In addition, the substrate supporting mechanism 250 releases the substrate 100 so that the lower film pressing member 240 can receive the substrate 100. Further, the driving member 252 of the substrate supporting mechanism 250 can move the substrate supporting member 253 into the frame 251, for example, along the horizontal direction H in FIG8 into the frame 251. After the cavity 200 is evacuated, the substrate support member 253 moved into the frame 251 will no longer support the substrate 100, so that the substrate 100 can be transferred to the lower film member 240 and supported by the pressure plate 241 of the lower film member 240, and the substrate 100 contacts the lower film material F2 picked up by the lower film member 240. The lower film member 240 moves up to approach the substrate 100 and the substrate support member 253 moves into the frame 251. These two actions can be performed sequentially or simultaneously. In addition, the upper film member 230 is driven to move close to the upper surface 101 of the substrate 100 so that the upper film material F1 picked up by the upper film member 230 contacts the upper surface 101 of the substrate 100. The two actions of the lower pressure film 240 moving upward to approach the substrate 100 and the upper pressure film 230 moving downward to approach the substrate 100 can be performed sequentially or simultaneously.

Next, the upper pressing film 230 and the lower pressing film 240 are pressurized to press the upper film material F1 and the lower film material F2 onto the upper surface 101 and the lower surface 102 of the substrate 100, respectively. Specifically, the upper pressing film 230 continues to move downward and the lower pressing film 240 continues to move upward, so that the upper film material F1 and the lower film material F2 are pushed by the pressurizing plate 231 and the pressurizing plate 241, respectively, so that the upper film material F1 and the lower film material F2 are closely attached to the upper surface 101 and the lower surface 102 of the substrate 100, respectively. Subsequently, the upper pressure film component 230 moves upward and the lower pressure film component 240 moves downward after being received by the supporting mechanism 250, so that the upper film material F1 and the lower film material F2 are separated from the film removal part 232 and the film removal part 242 respectively.

In step S8, the substrate supporting mechanism 250 is removed from between the upper film pressing member 230 and the lower film pressing member 240. As shown in FIG9, after the double-sided vacuum lamination is completed, the driving member 252 of the substrate supporting mechanism 250 drives the substrate supporting member 253 to protrude out of the frame 251 again along the horizontal direction H. The substrate supporting member 253 protruding out of the frame 251 can support the substrate 100 with double-sided film (upper film material F1, lower film material F2). Then, the vacuum of the cavity 200 is broken. The upper cavity 210 moves up and the lower cavity 220 moves down and is separated from the frame 251 of the substrate supporting mechanism 250. Afterwards, the substrate supporting mechanism 250 carrying the substrate 100 is moved back from the lamination area R2 to the film casting area R3. The pickup module 30 can pick up the substrate 100 with double-sided film.

FIG. 4 to FIG. 9 exemplarily illustrate a double-sided vacuum lamination method involving the lamination module 20 being maintained in the lamination area R2, the film support 110 holding the film material moving between the film supply area R1 and the lamination area R2, and the substrate support mechanism 250 carrying the substrate moving between the lamination area R2 and the film injection area R3, but the present invention is not limited thereto. In some embodiments, the film support 110 can be maintained in the film supply area R1 and the substrate support mechanism 250 can be maintained in the film injection area R3, and the lamination module 20 can be moved to the film supply area R1 and the film injection area R3 in sequence to perform the operation. In some embodiments, the film support 110 can be maintained in the film supply area R1, and the film pressing module 20 is moved to the film supply area R1 to perform film removal and the substrate support mechanism 250 is moved to the film pressing area R2 to perform film pressing. In some embodiments, the substrate support mechanism 250 can be maintained in the film casting area R3, and the film support 110 is moved to the film pressing area R2 to perform film removal and the film pressing module 20 is moved to the film casting area R3 to perform film pressing.

In summary, according to the double-sided vacuum lamination device and double-sided vacuum lamination method disclosed in the present invention, the substrate is transported between two lamination parts by moving the substrate support mechanism. The upper cavity and the lower cavity can move relative to the substrate support mechanism to fit closely with the substrate support mechanism, and then perform lamination operations. During the lamination operation, since the substrate can be supported by the substrate support mechanism instead of being supported by a stage set in the lower cavity, the lamination operations can achieve vacuuming without the film material contacting the substrate and laminating the film material on two opposite surfaces of the substrate at the same time, thereby helping to improve the production yield. Since the film material will first contact the substrate to be pressed inside the chamber, and the film material will be placed on the substrate for pressing after the vacuum degree of the chamber has reached the appropriate conditions, the adhesion between the film material and the substrate can be reduced and the yield rate can be improved.

Although the embodiments of the present invention are disclosed as described above, they are not intended to limit the present invention. Anyone familiar with the relevant technology can make some changes to the shape, structure, features and spirit described in the scope of the application of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.

10: Film cutting module

200: Cavity

210: Upper cavity

220: Lower cavity

230: Upper pressure film

231: Pressure plate

232: Take the membrane part

240: Lower pressure film

241: Pressure plate

242: Take the membrane part

251:Frame

253: Baseboard support

30: Pickup module

100: Substrate

101: Upper surface

102: Lower surface

F1: Film material

F2: Film material

R1: Film supply area

R2: Film pressing area

R3: Investment area

Claims (9)

A double-sided vacuum lamination device comprises: an upper cavity; a lower cavity, arranged corresponding to the upper cavity; an upper lamination component, movably arranged in the upper cavity; a lower lamination component, movably arranged in the lower cavity; and a substrate supporting mechanism, arranged between the upper lamination component and the lower lamination component, and the upper cavity and the lower cavity can move relative to the substrate supporting mechanism to be closely fitted with the substrate supporting mechanism; wherein the upper lamination component and the lower lamination component each have a film taking portion. The double-sided vacuum lamination device as described in claim 1, wherein the substrate supporting mechanism comprises: a frame, the upper cavity and the lower cavity are respectively tightly fitted with opposite sides of the frame; and a substrate support member movably disposed on the frame. The double-sided vacuum lamination device as described in claim 2, wherein the substrate supporting mechanism further comprises: a driving member, which is disposed in the frame and connected to the substrate supporting member, and the driving member can drive the substrate supporting member to move relative to the frame. A double-sided vacuum lamination device as described in claim 2, wherein the upper cavity and the lower cavity can move relative to the frame to fit closely with the frame, and the substrate support can move relative to the frame to protrude from the frame. A double-sided vacuum lamination device as described in claim 4, wherein the substrate support protrudes from the inner side of the frame. A double-sided vacuum lamination method includes: picking up an upper film material with an upper lamination component and picking up a lower film material with a lower lamination component; providing a substrate supporting mechanism carrying a substrate between the upper lamination component and the lower lamination component; forming a vacuum environment for accommodating the upper lamination component, the lower lamination component and the substrate supporting mechanism; and respectively laminating the upper film material and the lower film material on two opposite surfaces of the substrate. The double-sided vacuum lamination method as described in claim 6, wherein an upper cavity, a lower cavity and the substrate supporting mechanism are tightly fitted to form the vacuum environment, the upper lamination component can be movably disposed in the upper cavity, and the lower lamination component can be movably disposed in the lower cavity. The double-sided vacuum lamination method as described in claim 6 further comprises: providing a film support seat on opposite sides respectively holding the upper film material and the lower film material; providing the film support seat between the upper lamination member and the lower lamination member; and after the upper lamination member picks up the upper film material and the lower lamination member picks up the lower film material, removing the film support seat from between the upper lamination member and the lower lamination member. The double-sided vacuum lamination method as described in claim 6, wherein the upper film material and the lower film material are respectively pressed onto two opposite surfaces of the substrate, comprising: moving the lower film pressing member close to the substrate; releasing the substrate with the substrate supporting mechanism so that the lower film pressing member receives the substrate; moving the upper film pressing member close to the substrate; and pressurizing the upper film pressing member and the lower film pressing member to press the upper film material and the lower film material onto two opposite surfaces of the substrate.

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