CN111403301B

CN111403301B - Automatic panel processing device and automatic panel processing method

Info

Publication number: CN111403301B
Application number: CN202010082278.3A
Authority: CN
Inventors: 森·阿姆兰
Original assignee: Pyxiscf Plc
Current assignee: Pyxiscf Plc
Priority date: 2020-02-07
Filing date: 2020-02-07
Publication date: 2025-02-25
Anticipated expiration: 2040-02-07
Also published as: CN111403301A

Abstract

The present disclosure relates to an automatic panel processing device and an automatic panel processing method, the device comprising: a release workstation capable of accommodating an intermediate panel assembly consisting of a plastic-sealed panel attached to a first carrier, wherein the first carrier is located on the top side of the intermediate panel assembly, the release workstation comprising: a release unit comprising a movable carrier receiving device for receiving the first carrier, the carrier receiving device comprising a heating sub-device for thermally contacting the first carrier, the carrier receiving device further comprising an attachment sub-device for attaching the first carrier to the carrier receiving device, wherein the carrier receiving device is configured to heat the intermediate panel assembly to the separation temperature of a thermal separation adhesive and separate the first carrier from the plastic-sealed panel.

Description

Panel automatic processing device and panel automatic processing method

Technical Field

The present application relates to an automated panel handling device (which may also be referred to as a production line or an automated production line) for releasing a plastic package panel attached to a first carrier plate via a thermal release adhesive and, in some cases, also transferring the released plastic package panel onto a second carrier plate. And more particularly, to an apparatus for releasing a plastic package panel attached to a first carrier via a thermal release adhesive during panel level semiconductor packaging and, in some cases, transferring the released plastic package panel to a second carrier. The application also relates to a method of automatically handling panels, in particular, automatically releasing a plastic encapsulated panel attached to a first carrier plate via a thermal release adhesive, and in some cases, transferring the released plastic encapsulated panel to a second carrier plate. And more particularly, to a method for automatically releasing a plastic package panel attached to a first carrier via a thermal release adhesive during panel-level semiconductor packaging, and in some cases, transferring the released plastic package panel to a second carrier.

Background

In a panel-level packaging process, electronic components such as a die, a wafer, a passive component, and/or a metal component are placed on a carrier, for example, in a manner of facing an active surface of the component to the carrier, a plastic layer for covering the component is formed on the carrier, that is, a plastic package panel is formed, and then the plastic package panel for covering the component is separated from the carrier, so as to expose the active surface of the component, so that a circuit is plated on the active surface of the component in a subsequent process.

Conventionally, in releasing a plastic cover board from a carrier board, the plastic cover board is typically released by means of heat or Ultraviolet (UV) light irradiation, which are two main methods of releasing the plastic cover board.

In order to release the plastic package panel using the ultraviolet light method, a glass carrier plate must be used. An ultraviolet separating adhesive layer is applied to the glass carrier plate. Then, arranging the components related to encapsulation, such as bare chips and/or silicon chips and/or passive components and/or metal components, on the glass carrier through the ultraviolet separation adhesive layer, and then forming a plastic layer on the glass carrier by a plastic encapsulation process to cover the components related to encapsulation on the glass carrier, thereby forming the plastic encapsulation panel. In order to release the plastic package panel, the back surface of the glass carrier plate is irradiated with ultraviolet rays, so that the plastic package panel adhered to the glass carrier plate is separated from the glass carrier plate. However, the ultraviolet light release method is not an ideal method because glass is expensive and fragile. Furthermore, the use of glass carrier plates will limit the size of the carrier plates, as large glass carriers cannot generally be used due to their fragile nature. Furthermore, the use of glass carriers during release and transfer requires some manual fine handling due to the fragile nature of the glass. For example, during manual peeling and removal of the uv separating adhesive layer, electrostatic discharge may be easily generated, which may cause significant product quality problems in the panel-level packaging process.

To release the plastic package panel using a heating method, a layer of heat release adhesive is typically laminated to a glass carrier plate. And then, arranging the elements related to encapsulation on the glass carrier plate through the thermal separation adhesive layer, and performing a plastic encapsulation process to form a plastic encapsulation layer on the glass carrier plate so as to encapsulate the elements related to encapsulation on the glass carrier plate, thereby forming the plastic encapsulation panel. To release the plastic panel, heat is applied to the glass carrier plate to separate the plastic panel from the glass carrier plate. But directly applying heat to the glass carrier plate may damage the glass carrier plate. And, heating may also cause uncontrolled warping of the plastic cover board. Furthermore, the use of glass carriers, like the uv separation method, will limit the size of the carrier plate and, due to the fragile nature of the glass, require some manual fine handling during release and transfer. For example, during manual peeling and removal of the uv separating adhesive layer, electrostatic discharge may be easily generated, which may cause significant product quality problems in the panel-level packaging process.

Accordingly, there is a need for a more efficient apparatus, system and method for release and transfer of panels that addresses the above-described problems.

Disclosure of Invention

According to various embodiments, there is provided an automated panel handling apparatus comprising a release workstation capable of receiving an intermediate panel assembly of plastic panels attached to a first carrier plate, wherein the first carrier plate is at a top side of the intermediate panel assembly, the release workstation comprising a release unit comprising a carrier plate receiving apparatus movable to receive the first carrier plate, the carrier plate receiving apparatus comprising a heating sub-apparatus to be in thermal contact with the first carrier plate, the carrier plate receiving apparatus further comprising an attachment sub-apparatus to attach the first carrier plate to the carrier plate receiving apparatus, wherein the carrier plate receiving apparatus is configured to heat the intermediate panel assembly to a separation temperature of a thermal separation adhesive and to separate the first carrier plate from the plastic panels.

According to various embodiments, an automatic panel handling method is provided, comprising heating an intermediate panel assembly of plastic cover boards attached to a first carrier board to a separation temperature of a thermal separation adhesive in a release unit of a release workstation with the first carrier board facing a top side, wherein a heating sub-device of a carrier board receiving device in the release unit is in thermal contact with the first carrier board of the intermediate panel assembly to heat the first carrier board, attaching the first carrier board to the carrier board receiving device by the attachment sub-device via the carrier board receiving device and moving the carrier board receiving device away from the plastic cover boards to separate the first carrier board from the plastic cover boards.

Drawings

In the drawings, like reference numerals generally refer to like parts. The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the disclosure. Various embodiments are described with reference to the following drawings:

FIG. 1 illustrates an apparatus for processing a plastic encapsulated panel according to various embodiments;

FIGS. 2A-2F are schematic diagrams illustrating a method of automatically processing plastic cover boards based on the apparatus of FIG. 1, according to various embodiments;

FIG. 3A illustrates an apparatus for processing a plastic encapsulated panel according to various embodiments;

FIG. 3B illustrates a schematic diagram of additional details shown with reference to the apparatus of FIG. 3A, in accordance with various embodiments;

FIGS. 4A-4D are schematic diagrams illustrating a method of removing a heat-separating adhesive sheet from a plastic cover board using an adhesive removal tool of the apparatus of FIG. 3A, according to various embodiments;

FIG. 5 illustrates an apparatus for processing a plastic encapsulated panel according to various embodiments;

FIG. 6 illustrates an apparatus for processing a plastic encapsulated panel according to various embodiments;

FIG. 7 illustrates an apparatus for processing a plastic encapsulated panel according to various embodiments;

FIG. 8 illustrates an apparatus for processing a plastic encapsulated panel according to various embodiments;

9A-9D illustrate additional step diagrams showing a method of automatically processing a plastic cover board with reference to FIGS. 2A-2F based on the apparatus of FIG. 8, according to various embodiments;

FIG. 10 illustrates an apparatus for processing a plastic encapsulated panel according to various embodiments;

fig. 11 shows a schematic perspective view of an apparatus according to various embodiments.

Detailed Description

In the following embodiments, the description of the device is similarly valid for the corresponding method and vice versa. Furthermore, it will be appreciated that the embodiments described below may be combined, for example, a portion of one embodiment may be combined with a portion of another embodiment.

It should be understood that the terms "above," "top," "bottom," "downward," "upward," "side," "left," "right," "front," "back," "upper," "lower," and the like, when used in the following description, are for convenience of description and aid in understanding the relative position or orientation, and are not intended to limit the orientation or configuration of any apparatus or any portion of any apparatus or configuration. In addition, the singular terms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Similarly, the word "or" is intended to include "and" unless the context clearly indicates otherwise.

The present application relates to an automatic panel handling device, in particular for releasing a plastic panel attached to a first carrier plate via a heat release adhesive, and in some cases also transferring the released plastic panel onto a second carrier plate. And more particularly, to an apparatus for releasing a plastic package panel attached to a first carrier via a thermal release adhesive during panel level semiconductor packaging and, in some cases, transferring the released plastic package panel to a second carrier. According to various embodiments, the apparatus may include an automated processing line or an automated assembly line or an automated process line or an automated machine that is engaged by a transport or conveying system to perform the steps of a predetermined procedure during processing, production, manufacturing or assembly or packaging. According to various embodiments, the apparatus may be configured for use in steps based on a predetermined sequence of panel-level semiconductor packaging processes. The panel-level packaging process is a technology for packaging integrated circuits, in which components involved in packaging, such as a bare chip and/or a silicon chip and/or a passive component and/or a metal component, typically a plurality of components, are arranged on a carrier board, and then the plurality of components are packaged into a plastic package panel at the same time, instead of the conventional single component packaging technology. Therefore, it is necessary to mold the plurality of elements into a panel form on the first carrier board. To facilitate the subsequent formation of functional layers on the active side of the component, such as a die, the plurality of dies are laid flat on a first carrier plate prior to forming the plastic cover plate. Then, in order to form a functional layer on the active surface of the die, the plastic cover plate must be first detached from the first carrier plate so as to expose the active surface of the die, and then, in order to facilitate the subsequent packaging process, in some cases, the plastic cover plate needs to be transferred onto the second carrier plate in such a way that the active surface of the die is exposed. The release of the plastic package panel from the first carrier plate and the transfer of the plastic package panel to the second carrier plate are also referred to as a "release and transfer" process. According to various embodiments, a system or line or method is provided for releasing a plastic package panel from a carrier and transferring it to another carrier while exposing an active side of a semiconductor die. According to various embodiments, the first carrier plate and the second carrier plate may be of any material, and according to preferred embodiments the first carrier plate and the second carrier plate may be made of steel or steel alloy materials. According to various embodiments, the shape of the first carrier plate and the second carrier plate may be any shape. According to a preferred embodiment, the first carrier plate and the second carrier plate may be quadrilateral in shape.

Various embodiments provide an apparatus or system or method developed to use low cost materials, such as low cost steel alloy materials, that is robust and widely adaptable to a variety of process conditions for use with thermal separation membranes, thereby providing the most economical and efficient solution for semiconductor large panel packaging processes. In various embodiments, the panel assembly is gradually heated to the separation temperature. In various embodiments, the plastic package panel is processed with precise and controlled motion so that the plastic package panel can be gently released from the carrier plate. In various embodiments, an effort is made to minimize or ensure that there is no electrostatic discharge during removal of the thermal separation membrane. In various embodiments, the released plastic cover board is transferred to another carrier board and the active face of the die is exposed without physically flipping the plastic cover board. In various embodiments, damage to the active side of the die is minimized or ensured during transfer. In various embodiments, the plastic cover board is ensured to be stress free or minimized by progressively heating and cooling the panel assembly.

Fig. 1 illustrates an apparatus for processing a plastic encapsulated panel 202 (see fig. 2A), according to some embodiments. According to various embodiments, processing the plastic cover board 202 may include releasing the plastic cover board 202, adhering the plastic cover board 202 to the first carrier board 204 (see fig. 2A) by a thermal release adhesive layer, and transferring the plastic cover board 202 to the second carrier board 206 (see fig. 2E). The plastic package panel 202 is molded with a plurality of bare chips, and the active surfaces of the bare chips are flatly abutted against the first carrier 204. According to some embodiments, the plastic cover board 202 and the first carrier board 204 may form the middle panel assembly 203 while the plastic cover board 202 is still adhered to the first carrier board 204. According to some embodiments, the apparatus 100 may include a release workstation 110 and a transfer workstation 130. According to various embodiments, the release workstation 110 may be configured to process the intermediate panel assembly 203, for example, to separate the plastic cover board 202 from the first carrier 204, in order to release the plastic cover board 202 from the first carrier 204. After the plastic cover board 202 is released, the plastic cover board 202 may be moved to the transfer station 130. According to various embodiments, the transfer station 130 may be configured to place the plastic cover board 202 onto the second carrier 206 in such a way that the active faces of the plurality of die molded in the plastic cover board 202 face upward and away from the second carrier 206, or so that the active faces of the die in the plastic cover board 202 are exposed.

According to some embodiments, the release workstation 110 may receive an intermediate panel assembly 203, the intermediate panel assembly 203 being an assembly of first carrier boards 204 adhered to the plastic package panel 202, wherein the intermediate panel assembly 203 is received with the orientation of the first carrier boards 204 on the top side. Thus, the intermediate panel assembly 203 may be delivered or transported into the release workstation 110 with the first carrier plate 204 positioned above the plastic cover plate 202. According to various embodiments, the release workstation 110 may be linked to a front end workstation that may deliver or transfer the intermediate panel assembly 203 to the release workstation 110 (see, e.g., fig. 8) via a transmission or transfer system, the release workstation 110 may also be the first workstation of a stand-alone device according to various embodiments. Thus, the intermediate panel assembly 203 may be fed into the release workstation 110 via an input system or via manual feed. Thus, the release workstation 110 may be configured to receive the intermediate panel assembly 203 based on the overall arrangement and how the device 100 is assembled throughout the production or manufacturing or assembly or packaging process.

According to various embodiments, the release workstation 110 in the device 100 includes a release unit 112. According to various embodiments, the release unit 112 includes a carrier plate receiving device 114 movable to receive a first carrier plate 204 in the intermediate panel assembly 203. Thus, when the intermediate panel assembly 203 is delivered or transported to the release unit 112 of the release workstation 110, the carrier plate inclusion device 114 is operable to move toward the intermediate panel assembly 203 and to include the first carrier plate 204 of the intermediate panel assembly 203. According to various embodiments, the release unit 112 may operate in a manner similar to a press unit, and the carrier plate accommodating device 114 may be moved in an up-down direction (or a vertical direction) so as to accommodate the intermediate panel assembly 203. The middle panel assembly 203 is placed under the carrier plate receiving device 114, and the carrier plate receiving device 114 moves downward to receive the middle panel assembly.

According to various embodiments, the carrier board receiving device 114 may include a heating sub-device 116 that contacts the first carrier board 204 surface of the intermediate panel assembly 203 in thermal contact. According to various embodiments, the heating subassembly 116 includes a heating plate. Accordingly, the heating subassembly 116 forms a bottom surface of the carrier plate receiving device 114, whereby the heating subassembly 116 is movable into contact with the first carrier plate 204 of the intermediate panel assembly 203. Thus, the heating subassembly 116 may conduct heat to the first carrier plate 204 of the intermediate panel assembly 203. According to various embodiments, the carrier plate inclusion device 114 includes an actuator (not shown) to control and move the carrier plate inclusion device 114 such that the heating sub-device 116 may be moved into contact with the first carrier plate 204 of the intermediate panel assembly 203.

According to various embodiments, the carrier board receiving device 114 includes an attachment sub-device 118 to attach the first carrier board 204 of the intermediate panel assembly 203 to the carrier board receiving device 114. Thus, the first carrier plate 204 of the intermediate panel assembly 203 is attached to the carrier plate receiving device 114 by the attachment sub-device 118, and the first carrier plate 204 of the intermediate panel assembly 203 may be held or held by the carrier plate receiving device 114 in the carrier plate receiving device 114. According to various embodiments, the attachment sub-device 118 of the carrier plate receiving device 114 includes a vacuum suction mechanism, such as a vacuum hole or vacuum cup, or a clamping mechanism, such as a gripper or clamp, or a magnetic mechanism, such as an electromagnet. According to various embodiments, the attachment sub-device 118 of the carrier plate inclusion device 114 may be configured to hold or retain the first carrier plate 204 to the carrier plate inclusion device 114. According to various embodiments, the attachment sub-device 118 of the carrier board inclusion device 114 may be directly attached only to the first carrier board 204 of the intermediate panel assembly 203. Thus, when the first carrier board 204 and the plastic package panel 202 are bonded to each other to form the intermediate panel assembly 203, the attachment sub-assembly 118 of the carrier board inclusion device 114 may hold or retain the entire intermediate panel assembly 203 to the carrier board inclusion device 114. However, when the adhesive strength of the adhesive between the first carrier plate 204 and the plastic cover plate 202 decreases or weakens, the attachment sub-device 118 of the carrier plate receiving device 114 directly attaching the first carrier plate 204 may simply hold or retain the first carrier plate 204 in the carrier plate receiving device 114. Thus, when the carrier-receiving device 114 moves in a direction away from the plastic panel 202, the carrier-receiving device 114 can move the first carrier 204 to separate the first carrier 204 from the plastic panel 202.

According to various embodiments, the carrier board inclusion device 114 may be used to heat the intermediate panel assembly 203 to a predetermined temperature such that the adhesive strength of the thermal release adhesive between the first carrier board 204 and the plastic cover board 202 is reduced. Thus, the predetermined temperature may be a separation temperature of the thermal separation adhesive. The carrier inclusion device 114 may then be used to separate the first carrier 204 from the plastic cover plate 202. Thus, the carrier plate receiving device 114 may be moved to receive the first carrier plate 204 of the intermediate panel assembly 203 such that the heating sub-device 116 may be in thermal contact with the first carrier plate 204 of the intermediate panel assembly 203. The attachment sub-assembly 118 may attach the first carrier plate 204 of the intermediate panel assembly 203 to the carrier plate receiving device 114. The heating sub-assembly 116 may heat the middle panel assembly 203 to a predetermined temperature, thereby reducing or lowering the adhesive strength of the heat release adhesive. At this time, the first carrier 204 is still kept in the carrier receiving device 114, and as the carrier receiving device 114 moves away from the plastic package panel 202, the first carrier 204 is separated from the plastic package panel 202, so as to release the plastic package panel 202.

According to various embodiments, the transfer station 130 is capable of receiving the separated plastic cover board 202 from the release station 110. Thus, the separated plastic package panel 202 may be delivered or transported into the transfer station 130. According to various embodiments, transfer station 130 is coupled to a front-end release station 110, which front-end release station 110 may deliver or transport separated plastic package panels 202 to transfer station 130 via conveyor 150. According to various embodiments, the conveyor 150 may include at least one conveyor element 152, the conveyor element 152 being movable to convey the separated plastic package panels 202 from the release station 110 to the transfer station 130. Thus, the at least one conveying element 152 may be actuated and moved between the release station 110 and the transfer station 130. According to various embodiments, at least one conveying element 152 of the conveying apparatus 150 comprises a mobile station or a conveying system. According to various embodiments, at least one conveying element 152 of the conveying device 150 includes a mobile heating stage 154, the mobile heating stage 154 translatable between the release station 110 and the transfer station 130. According to various embodiments, the mobile heating stage 154 as the at least one conveying element 152 includes a heating stage 156 capable of carrying an intermediate panel assembly. Thus, the intermediate panel assembly 203 may be placed on the heating table 156 of the mobile heating table 154. According to various embodiments, when the middle panel assembly 203 is sandwiched between the heating table 156 of the movable heating table 154 and the heating sub-device 116 of the carrier plate accommodating device 114 in the release unit 112, the heating table 156 may heat the middle panel assembly 203 in cooperation with the heating sub-device 116 of the carrier plate accommodating device 114. In various embodiments, the mobile heating stage 154 may be actuated to move between the release station 110 and the transfer station 130.

According to various embodiments, the mobile heating stage 154 in the at least one conveying element 152 of the conveying apparatus 150 includes an attachment sub-apparatus 158 to attach the plastic package panel 202 of the intermediate panel assembly 203 to the mobile heating stage 154 of the at least one conveying element 152. Thus, when the plastic panel 202 of the intermediate panel assembly 203 is attached to the mobile heating stage 154 of the at least one conveying element 152 by the attachment sub-assembly 158, the plastic panel 202 of the intermediate panel assembly 203 may be held or retained on the mobile heating stage 154 of the at least one conveying element 152. According to various embodiments, the attachment sub-means 158 of the mobile heating stage 154 of the at least one conveying element 152 comprises a vacuum suction mechanism, such as a vacuum hole or a vacuum cup, or a clamping mechanism, such as a gripper or a clamp. According to various embodiments, the attachment sub-assembly 158 of the mobile heating station 154 of the at least one conveying element 152 is configured to hold or retain the plastic cover board 202 to the at least one conveying element 152, the carrier board inclusion assembly 114 holds or retains the first carrier board 204 therein, and when the adhesive strength of the thermally-separating adhesive between the first carrier board 204 and the plastic cover board 202 decreases or decreases, the carrier board inclusion assembly 114 moves away from the mobile heating station 154 of the at least one conveying element 152, causing the first carrier board 204 to move synchronously, separating the first carrier board 204 from the plastic cover board 202.

According to various embodiments, the transfer station 130 of the apparatus 100 includes a transfer unit 132. According to various embodiments, the transfer unit 132 includes a plastic cover board receiving device 134, and the transfer unit 132 is movable to receive the separated plastic cover board 202. Thus, when the separated plastic panel 202 is delivered or transported into the transfer unit 132 of the transfer station 130, the plastic panel inclusion device 134 may be operable to move toward and to include the separated plastic panel 202. According to various embodiments, the transfer unit 132 may operate in a manner similar to a press unit, and the plastic cover board inclusion device 134 may be moved in an up-down direction (or a vertical direction) in order to include the separated plastic cover boards. As the plastic panel receiving device 134 moves downward, the plastic panel 202 is placed under the carrier receiving device 114.

According to various embodiments, the plastic cover board inclusion device 134 includes a step-down cooling sub-device 136 to thermally contact a separate plastic cover board 202. According to various embodiments, the step-down sub-assembly 136 includes a heating plate. Thus, the step-down cooling sub-assembly 136 forms a bottom surface of the plastic cover board receiving assembly 134 that is movable into contact with the separated plastic cover board 202. Thus, when the step-down sub-assembly 136 is in contact with the separated plastic cover board 202, there is heat transfer between the step-down sub-assembly 136 and the separated plastic cover board 202. According to various embodiments, the plastic cover board receiving device 134 includes an actuator (not shown) to control and move the plastic cover board receiving device 134 such that the split cooling sub-device 136 may be moved into contact with the split plastic cover board 202.

According to various embodiments, the plastic cover board receiving device 134 includes an attachment sub-device 138 to attach a separate plastic cover board 202 to the plastic cover board receiving device 134. Thus, when the separated plastic closure panel 202 is attached to the plastic closure panel receiving device 134 by the attachment sub-device 138, the separated plastic closure panel 202 may be held or retained on the plastic closure panel receiving device 134 by the plastic closure panel receiving device 134. According to various embodiments, the attachment sub-assembly 138 of the plastic cover board inclusion device 134 includes a vacuum suction mechanism, such as a vacuum hole or vacuum cup, or a clamping mechanism, such as a gripper or clamp. According to various embodiments, the attachment sub-assembly 138 of the plastic cover board inclusion assembly 134 is configured to be held or retained to the plastic cover board inclusion assembly 134 in such a manner that the separated plastic cover board 202 is in thermal contact with the step-and-cool sub-assembly 136.

According to various embodiments, the plastic cover board receiving device 134 of the transfer unit 132 of the transfer station 130 includes an integrated vacuum heating plate with built-in heating elements to serve as a step-down cooling sub-device 136 and with a plurality of vacuum holes to serve as an attachment sub-device 138. According to various embodiments, the built-in heating element may heat the entire integrated vacuum heating plate. According to various embodiments, the plurality of vacuum holes may attach the plastic cover board 202 to an integrated vacuum heating plate via a vacuum evacuation system.

According to various embodiments, when the separated plastic package panel 202 is attached to the plastic package panel receiving device 134, the plastic package panel receiving device 134 may move upward and downward, whereby the separated plastic package panel 202 may be lifted and lowered. Thus, the plastic cover board accommodating device 134 may move the separated plastic cover board 202 to lift the separated plastic cover board 202 to place the second carrier board 206 under the separated plastic cover board 202, and then, the plastic cover board accommodating device 134 may move the separated plastic cover board 202 to lower the separated plastic cover board 202 to place it on the second carrier board 206.

According to various embodiments, the plastic cover board inclusion device 134 is operable to regulate the temperature of the step-down sub-device 136 between the ambient temperature and a predetermined temperature in the release unit 112 for heating the intermediate panel assembly 203. When the separated plastic package panel 202 is delivered or transported into the transfer unit 132, the temperature of the separated plastic package panel 202 is equal to or close to the predetermined temperature set in the release unit 112. However, the temperature of the step-down sub-assembly 136 of the plastic cover board inclusion assembly 134 is controlled or regulated to be above ambient temperature but still below the temperature of the separated plastic cover board 202. Thus, when the step-down heat sub-assembly 136 is in thermal contact with the separated plastic cover board 202, the plastic cover board 202 may transfer heat to the step-down heat sub-assembly 136 because the temperature of the separated plastic cover board 202 is higher than the temperature of the step-down heat sub-assembly 136, such that the plastic cover board begins to cool. Because the temperature difference between the step-and-drop sub-assemblies 136 and the separated plastic cover plate 202 is less than the temperature difference between the ambient temperature and the separated plastic cover plate 202, the cooling rate of the separated plastic cover plate 202 and the step-and-drop sub-assemblies 136 when in thermal contact is slower. The moderate cooling rate may minimize or eliminate warpage of the separated plastic cover board 202.

According to various embodiments, the transfer station 130 in the apparatus 100 includes a transport unit 140. The transport unit 140 includes therein a transport tray 142 that can be moved in and out of the transfer unit 132 of the transfer station 130. In various embodiments, the transport unit 140 may be moved to carry and position the second carrier plate 206 under the separated plastic package panel 202 held or held by the plastic package panel intake 134, thereby placing the separated plastic package panel 202 on the second carrier plate 206. In various embodiments, the transport trays 142 in the transport unit 140 may be horizontally moved into and out of the transfer unit 132. According to various embodiments, the transport tray 142 may be actuated and moved to a position external to the transfer unit 132 in order to receive the second carrier plate 206 onto the transport tray 142. The transport tray 142 may be further actuated and moved into the transfer unit 132 and under the plastic cover board receiving device 134 so that a separate plastic cover board 202 may be placed on the second carrier plate 206. According to various embodiments, after placing the plastic cover board 202 on the second carrier board 206, the transport tray 142 is actuated and moved outside of the transfer unit 132 to eject the assembly of the plastic cover board 202 and the second carrier board 206 from the transfer unit 132.

Fig. 2A-2F are schematic diagrams of a method of automatically processing a plastic panel 202 based on the apparatus 100 shown in fig. 1, according to some embodiments. In some embodiments, a method of automatically processing the plastic package panel 202 may include automatically releasing the plastic package panel 202 attached to the first carrier 204 using a thermal release adhesive from the first carrier 204 and automatically transferring the automatically released plastic package panel 202 to the second carrier 206.

Referring to FIG. 2A, in accordance with various embodiments, the method includes heating an intermediate panel assembly 203 formed by the bonding of the first carrier board 204 and the plastic cover board 202 to a predetermined temperature in a release unit 112 of a release workstation 110 of the apparatus 100 to reduce or decrease the adhesive strength of the thermal release adhesive between the plastic cover board 202 and the first carrier board 204. The middle panel assembly 203 is placed in the release unit 112 with the first carrier 204 facing upward and the plastic package panel 202 facing downward. According to various embodiments, during heating, the heating sub-assembly 116 of the release unit 112 carrier inclusion device 114 may be in thermal contact with the first carrier 204 of the intermediate panel assembly 203 to heat the first carrier 204. According to various embodiments, during heating, the intermediate panel assembly 203 may be supported on and in thermal contact with the heating table 156 of the mobile heating table 154, and the heating table 156 may cooperatively heat the intermediate panel assembly 203 with the heating sub-assembly 116 of the carrier plate receiving device 114.

As shown in fig. 2B, according to various embodiments, the method includes separating the first carrier plate 204 from the plastic cover plate 202 by attaching the first carrier plate 204 to the carrier plate receiving device 114 via the attachment sub-device 118 of the carrier plate receiving device 114 and moving the carrier plate receiving device 114 away from the plastic cover plate 202. According to various embodiments of the present invention, the thermal release adhesive may be configured to separate the first carrier plate 204 from the plastic cover plate 202 at a predetermined temperature by simply lifting the first carrier plate 204 by the carrier plate receiving device 114. According to various embodiments, the attachment sub-device 158 of the mobile heating station 154 may attach the plastic cover board 202 to the mobile heating station 154. Thus, by attaching the first carrier plate 204 to the carrier plate receiving device 114 and attaching the plastic package panel 202 to the mobile heating station 154, the carrier plate receiving device 114 is moved away from the mobile heating station 154 when the adhesive strength of the thermal release adhesive is reduced or decreased, thereby separating the first carrier plate 204 from the plastic package panel 202 in a controlled and reliable manner.

As shown in fig. 2C, according to various embodiments, the method includes moving the separated plastic package panel 202 from the release station 110 to the transfer station 130 via at least one conveying element 152 of the conveying device 150. According to various embodiments, at least one conveying element 152 is a moving heating stage 154. According to various embodiments, during movement of the mobile heating stage 154, the separated plastic package panel 202 may be continuously attached to the mobile heating stage 154 by the attachment sub-assembly 158 of the mobile heating stage. According to various embodiments, during movement of the mobile heating stage 154, the separated plastic package panel 202 is maintained in thermal contact with the heating stage surface 156 of the mobile heating stage 154 such that the heating stage surface 156 may continue to heat or maintain the temperature of the separated plastic package panel 202 near or at a predetermined temperature.

As shown in fig. 2D, according to various embodiments, the method includes allowing the plastic cover board 202 in the transfer unit 132 of the transfer station 130 to be lifted by attaching the separated plastic cover board 202 to the plastic cover board intake device 134 via the attachment sub-device 138, thereby removing the plastic cover board intake device 134 from the at least one conveying element 152 of the conveying device 150. The temperature of the step-down sub-assembly 136 of the plastic cover board inclusion assembly 134 is adjusted between ambient temperature and a predetermined temperature. Accordingly, the attachment subassembly 138 may hold or retain the separated plastic cover boards 202 such that the movement of the plastic cover board intake 134 may bring the separated plastic cover boards 202 together and such that the step-down subassembly 136 may provide a step-down environment to cool the separated plastic cover boards 202 at a gentle cooling rate.

As shown in fig. 2E, according to various embodiments, the method includes moving the second carrier plate 206 via the transport tray 142 of the transport unit 140 of the transfer station 130 to position the second carrier plate 206 under the separated plastic molded panel 202 held or held by the plastic molded panel intake device 134. According to various embodiments, the second carrier plate 206 may be placed on the transport tray 142. As shown in fig. 2D, the shipping pallet 142 may move the second carrier plate 206 into position for placement of the singulated plastic package panels 202. As shown in fig. 2E, according to various embodiments, the method includes placing the separated plastic cover board 202 on the second carrier board 206 by moving the plastic cover board intake device 134 toward the transport tray 142. According to various embodiments, movement of the plastic cover board receiving device 134 and the shipping pallet 142 may be performed sequentially or simultaneously.

As shown in fig. 2F, according to various embodiments, the method includes removing the assembly formed by the second carrier plate 206 and the plastic encapsulated panel 202 thereon from the transfer unit 132 via the transport tray 142.

Fig. 3A illustrates an apparatus 300 for handling a plastic cover board 202, according to various embodiments, including releasing the plastic cover board 202 (see fig. 2A) attached to a first carrier board 204 (see fig. 2A) by a thermal release adhesive, and transferring the released plastic cover board 202 to a second carrier board 206 (see fig. 2E). According to various embodiments, the apparatus 300 illustrated in fig. 3A is different from the apparatus 100 illustrated in fig. 1, and the apparatus 300 illustrated in fig. 3A further includes the following.

According to various embodiments, the release workstation 110 of the apparatus 300 shown in fig. 3A further comprises an adhesive removal unit 360. An adhesive removal tool 362 is included in the adhesive removal unit 360 to engage and remove the thermal release adhesive from the plastic panel 202. According to various embodiments, the adhesive removal tool 362 may be moved from a first edge portion of the plastic panel 202 to a second edge portion of the plastic panel 202 opposite the first edge portion, thereby removing thermally separated adhesive that spans the first edge portion to the second edge portion of the plastic panel 202.

As shown, according to various embodiments, the thermal release adhesive between the plastic cover board 202 and the first carrier board 204 includes a thermal release adhesive sheet 305. According to various embodiments, the adhesive removal tool 362 includes a clamping mechanism 364 and/or a vacuum mechanism, the clamping mechanism 364 being operable to hold an edge portion of the thermal release adhesive sheet 305. According to various embodiments, the heat separation adhesive sheet 305 includes, but is not limited to, a heat separation adhesive film and a heat separation adhesive tape. According to various embodiments, the adhesive removal tool 362 is actuated or moved to completely remove the thermal release adhesive sheet 305 from the plastic cover board 202. For example, the adhesive removal tool 362 may be configured to move from a first edge portion of the plastic panel 202 to a second edge portion of the plastic panel 202. According to various embodiments, the adhesive removal tool 362 may be configured to move in any predetermined direction and/or sequence to completely remove the thermally separated adhesive sheet 305 on the plastic panel 202. According to various embodiments, the clamping mechanism 364 includes clamping members 364a and 364b, the clamping members 364a and 364b including, but not limited to, pliers, clamps, clips, or snaps. According to various embodiments, the clamping mechanism 364 may be actuated to clamp or grasp an edge portion of the thermal release adhesive sheet 305. According to various embodiments, the vacuum mechanism may be configured to hold the edge portion of the thermal release adhesive sheet 305.

According to various embodiments, the adhesive removing unit 360 includes an adhesive detector 366 to sense the presence of an edge portion of the thermally separated adhesive sheet 305 held within the adhesive removing tool 362. According to various embodiments, the adhesive detector 366 may include a sensor configured to sense the presence of the thermally separated adhesive sheet 305 clamped in the clamping mechanism 364 of the adhesive removal tool 362. According to various embodiments, the sensor may comprise any suitable type of sensor, such as a touch sensor, a proximity sensor, a tactile sensor, a light sensor. According to various embodiments, when the adhesive detector 366 senses that the edge portion of the thermally separated adhesive sheet 305 is no longer held within the adhesive removal tool 362 during peeling, the adhesive detector 366 may be configured to trigger an alarm to alert an operator.

The release station 110 of the apparatus 300 shown in fig. 3 also includes an electrostatic neutralizer 368. According to various embodiments, the static neutralizer 368 may work in conjunction with the adhesive removal tool 362, where the static neutralizer 368 releases ions at the interface 307 of the plastic cover board 202 and the thermal release adhesive sheet 305 as the adhesive removal tool 362 moves over the plastic cover board 202 to peel the thermal release adhesive sheet 305. According to various embodiments, the static neutralizer 368 is an air ionizer, and the static neutralizer 368 is cooperatively disposed with the adhesive removal tool 362 such that when the adhesive removal tool 362 peels the thermal release adhesive sheet 305 from the plastic cover board 202, the static neutralizer 368 can directly discharge an ionized air stream to the interface 307 between the plastic cover board 202 and the thermal release adhesive sheet 305.

Fig. 4A-4D illustrate a schematic diagram of a method of removing thermal release adhesive sheet 305 from plastic panel 202 using adhesive removal tool 362, according to various embodiments. As shown in fig. 4A, according to various embodiments, the method includes pushing an edge portion of the heat release adhesive sheet 305 between the clamping members 334A, 334 b of the clamping mechanism 364. According to various embodiments, the adhesive removing unit 360 includes a mechanical pushing member 363 pushing the edge portion of the heat separation adhesive sheet 305 into the space between the grip members 234 a, 234 b. Mechanical thrust component 363 includes, but is not limited to, a plunger, pushrod, or pusher plate.

As shown in fig. 4B, according to various embodiments, the method includes clamping an edge portion of the thermal release adhesive sheet 305 with clamping members 334 a, 334B of a clamping mechanism 364. According to various embodiments, when the adhesive detector 366 detects that the edge portion of the heat-separating adhesive sheet 305 is pushed into the holding mechanism 364, the holding members 234 a, 234 b of the holding mechanism 364 can be moved toward each other to hold the edge portion of the heat-separating adhesive sheet 305 therebetween, thereby holding and retaining the edge portion of the heat-separating adhesive sheet 305.

As shown in fig. 4C, according to various embodiments, the method includes an adhesive removal tool 362 extending laterally across the entire plastic cover board 202 to peel and remove the thermal release adhesive sheet 305. According to various embodiments, the static neutralizer 368 in an activated state maintains a synchronized movement with the movement of the adhesive removal tool 362 to neutralize static electricity that builds up during the peeling of the thermally separated adhesive sheet 305 from the plastic panel 202.

As shown in fig. 4D, according to various embodiments, the method includes moving the adhesive removal tool 362 with the peeled thermal release adhesive sheet 305 together to a processing area, opening the clamping members 334 a, 264 b of the clamping mechanism 364, and causing the peeled thermal release adhesive sheet 305 to fall into the processing area.

Fig. 3B shows a schematic diagram with more details than the device 300 in fig. 3A. As shown in fig. 3B, the release workstation 110 of the device 300 further includes an adhesive processing unit 370, according to various embodiments. The adhesive processing unit 370 is configured to discard the peeled heat-separation adhesive sheet 305. The adhesive processing unit 370 includes a fixed collecting tray 372, and the fixed collecting tray 372 is located within a range to which the adhesive removing tool 362 can move the peeled heat-separating adhesive sheet 305 to the adhesive processing unit 370, and discards the peeled heat-separating adhesive sheet 305 onto the fixed collecting tray 372.

As shown in fig. 3B, the release workstation 110 of the apparatus 300 further includes a carrier plate removal unit 374, according to various embodiments. The carrier plate removing unit 374 is configured to remove the first carrier plate 204 separated from the releasing unit 112 of the releasing workstation 110. According to various embodiments, carrier removal unit 374 includes a movable carrier receiving tray 376, movable carrier receiving tray 376 being movable into and out of release unit 112 of release workstation 110. Carrier receiving tray 376 may be actuated and moved under first carrier plate 204 held and held by carrier plate receiving device 114 of release unit 112. Carrier board receiving apparatus 114 then releases first carrier board 204 and places it on carrier board receiving tray 376. Subsequently, carrier receiving tray 376 carrying first carrier 204 is actuated and removed from release unit 112. According to various embodiments, first carrier plate 204 is removed from carrier plate receiving tray 376 for storage or reuse. According to various embodiments, not shown in the figures, the carrier receiving pans 376 of the carrier plate removal unit 374 may be moved along a plane of movement parallel (at different vertical heights) to the mobile heating station 154 of the conveyor 150 translating between the release workstations 110. According to various embodiments, not shown in the figures, the direction of motion of the carrier receiving pans 376 of the carrier plate removal unit 374 may be perpendicular to the direction of translational motion of the mobile heating stage 154 of the conveyor 150.

According to various embodiments, an electrostatic neutralizer 368 (serving as an electrostatic discharge unit) may be mounted to a carrier receiving pan 376 of a carrier removal unit 374. According to various embodiments, the static neutralizer 368 may be mounted to an edge of the carrier receiving pan 376. According to various embodiments, as the adhesive removal tool 362 moves to peel and remove the thermal release adhesive sheet 305, the carrier receiving tray 376 moves cooperatively with the movement of the adhesive removal tool 362 in the same direction (or along the same axis of movement) such that the static neutralizer 368 mounted to the edge of the carrier receiving tray 376 concentrates the ionization effect on the separating interface where the thermal release adhesive sheet 305 and the plastic cover sheet 202 are peeled. According to various embodiments, carrier receiving tray 376 is thereby positioned below first carrier plate 204 held by carrier receiving device 114 of release unit 112 as carrier receiving tray 376 moves in synchronization with adhesive removal tool 362 as adhesive removal tool fully peels thermal release sheet 305 from plastic package panel 202. Thus, when the peeling process is completed by the adhesive removal tool 362, the carrier receiving tray 376 may be in a predetermined position below the first carrier 204 such that the carrier receiving device 114 may be operated to release the first carrier 204 and place it on the carrier receiving tray 376. Carrier receiving tray 376 may be actuated to carry first carrier 204 out of release unit 112.

Fig. 5 illustrates an apparatus 500 for handling a plastic package panel 202 according to various embodiments, the apparatus 500 for releasing the plastic package panel 202 attached to a first carrier plate 204 by a thermal release adhesive and transferring the plastic package panel 202 to a second carrier plate 206 according to various embodiments. According to various embodiments, the apparatus 500 of FIG. 5 differs from the apparatus 100 of FIG. 1 in that the apparatus 500 of FIG. 5 further includes the following.

According to various embodiments, the transfer station 130 in the apparatus 500 is shown in fig. 5 to further comprise a protective film dispensing unit 580. The protective film dispensing unit 580 includes a protective film supply spool 582 located on a first side of the plastic cover board receiving device 134 in the transfer unit 132 and a protective film collection spool 584 located on a second side of the plastic cover board receiving device 134 in the transfer unit 132. The protective film supply reel 582 and the protective film collection reel 584 are respectively located on opposite sides of the plastic cover board receiving device 134 on the transfer unit 132. According to various embodiments, a protective film 586 is suspended between the protective film supply spool 582 and the protective film collection spool 584 and covers the thermal contact surface 137 of the step-down cooling sub-assembly 136 of the plastic cover board inclusion assembly 134 in the transfer unit 132. According to various embodiments, the protective film collection spool 584 may be actuated, the used portion of the protective film 586 is collected onto the protective film collection spool 584, and the protective film 586 newly provided by the protective film supply spool 582 may be unwound. According to various embodiments, protective film 586 may provide protection for components on plastic panel 202, such as the active side of a die. According to various embodiments, the attachment sub-device 138 of the plastic cover board inclusion device 134 in the transfer unit 132 is configured to apply a vacuum to attach the protective film 586 to the thermal contact surface 137 of the step-down sub-device 136 of the plastic cover board inclusion device 134 by suction. According to various embodiments, protective film 586 may include a plurality of holes. According to various embodiments, the protective film 586 has a plurality of holes thereon that may be aligned with some vacuum holes or vacuum cups on the attachment sub-assembly 138 of the plastic cover board inclusion assembly 134 in the transfer unit 132 so that these vacuum holes or vacuum cups may be used to attach the plastic cover board 202 to the step-down cooling sub-assembly 136 of the plastic cover board inclusion assembly 134 of the transfer unit 132.

According to various embodiments, the mobile heating stage 154 of the delivery device 150 further includes a protective film piercing device 588. The protective film piercing means 588 may be configured to form a plurality of holes in the protective film 586. In various embodiments, the protective film puncturing device 588 is disposed on one side of the heating table 156 of the movable heating table 154 of the conveyor 150. According to various embodiments, the protective film puncturing device 588 includes a plurality of spikes 589. The movable heating stage 154 may be actuated and moved laterally to a predetermined position relative to the plastic cover board receiving device 134 of the transfer unit 132. In addition, the plastic cover board inclusion device 134 may be actuated and moved toward the movable heating stage 154 in the transfer unit 132. Thus, the spike 589 on one side of the movable heating stage 154 may pierce the protective film 586 covering the plastic cover board receiving device 134 to pierce and form a plurality of holes in the protective film 586.

Fig. 6 illustrates an apparatus 600 for processing a plastic package panel 202 according to various embodiments, the apparatus 600 for releasing the plastic package panel 202 adhered to a first carrier plate 204 by a thermal release adhesive and transferring the plastic package panel 202 to a second carrier plate 206 according to various embodiments. According to various embodiments, the apparatus 600 shown in fig. 6 is different from the apparatus 100 shown in fig. 1. The difference is that the apparatus 600 shown in fig. 6 further includes the following.

According to various embodiments, the transfer station 130 in the apparatus 600 shown in fig. 6 further includes an alignment guide 644 to guide relative movement between the plastic cover board receiving device 134 of the transfer unit 132 and the transport tray 142 of the transport unit 140 for transporting the second carrier board 206 to align the plastic cover board 202 and the second carrier board 206 with each other during placement of the separated plastic cover board 202 on the second carrier board 206. The alignment guide 644 may measure and determine the relative positional offset between the separated plastic cover board 202 and the second carrier board 206, and based on the measurement, actuate and move the plastic cover board inclusion device 134 in the transfer unit 132 and the transport tray 142 of the transport unit 140 to align the separated plastic cover board 202 and the second carrier board 206 for placement. According to various embodiments, alignment guide 644 comprises a visual alignment guide having an image capture device 646. According to various embodiments, an image capture device 646 is provided on the shipping pallet 142 to provide visual feedback of relative offset information of the position between the separated plastic cover panel 202 and the second carrier plate 206 to control the relative movement of the shipping pallet 142 and the plastic cover panel inclusion device 134 to align the separated plastic cover panel 202 and the second carrier plate 206.

Fig. 7 illustrates an apparatus 700 for handling a plastic package panel 202, according to various embodiments, in some embodiments, the apparatus 700 is used to release the plastic package panel 202 adhered to a first carrier plate 204 by a thermal release adhesive, and transfer the plastic package panel 202 to a second carrier plate 206. According to various embodiments, the apparatus 700 shown in fig. 7 is different from the apparatus 100 shown in fig. 1. The difference is that the apparatus 700 shown in fig. 7 further includes the following.

According to various embodiments, when the plastic cover board receiving device 134 in the transfer unit 132 is lowered and brought into contact with the transport tray 142 in the transport unit 140, the plastic cover board receiving device 134 and the transport tray 142 cooperatively form a closed space in which a vacuum environment can be formed for placing the separated plastic cover board 202 onto the second carrier plate 206 without voids. In some embodiments, placing the plastic cover board 202 on the second carrier board 206 under a vacuum environment may ensure that the plastic cover board 202 is placed flat against the second carrier board 206 without any air gap between the plastic cover board 202 and the second carrier board 206.

According to various embodiments, the shipping pallet 142 includes a seal 743 around a peripheral portion of the shipping pallet 142. According to various embodiments, the seal 743 is a rubber seal or gasket around a peripheral portion of the shipping pallet 142. Thus, the seal 743 may form a continuous annular ring to encircle a peripheral portion of the shipping pallet 142. According to various embodiments, the shipping pallet 142 includes a vacuum mechanism to create a vacuum in the sealed space created by the plastic cover board receiving device 134 and the shipping pallet 142.

Fig. 8 illustrates an apparatus 800 for processing a plastic package panel 202, according to various embodiments, in some embodiments, the apparatus 800 is used to release the plastic package panel 202 that is adhered to a first carrier plate 204 by a thermal release adhesive, and transfer the plastic package panel 202 to a second carrier plate 206. According to various embodiments, the apparatus 800 shown in fig. 8 is different from the apparatus 100 shown in fig. 1. The difference is that the apparatus 800 shown in fig. 8 further includes the following.

According to various embodiments, the apparatus 800 of fig. 8 further includes a preheating station 890, which preheating station 890 is capable of receiving the intermediate panel assembly 203 with the first carrier plate 204 facing upward and the plastic package panel 202 facing downward. According to various embodiments, the preheating workstation 890 may be configured to preheat the intermediate panel assembly 203 housed in the preheating workstation 890 to an intermediate temperature that is less than the predetermined temperature in the release workstation 110. The intermediate panel assembly 203 may be delivered or transported into the preheating workstation 890 with the first carrier plate 204 on top of the plastic cover plate 202. According to various embodiments, the pre-heat station 890 may be coupled to a front-end station that may transport or convey the intermediate panel assembly 203 to the pre-heat station 890 via a transport or conveyance system. According to various embodiments, the pre-heat station 890 may also be the first station of a stand-alone device. Thus, the intermediate panel assembly 203 may be fed into the preheating workstation 890 via an input system (see, e.g., fig. 10) or via manual feed. Thus, the pre-heat workstation 890 may be configured to receive the intermediate panel assembly 203 based on the overall arrangement and how the apparatus 800 is assembled throughout the production or manufacturing or assembly or packaging process.

According to various embodiments, the preheating workstation 890 of the apparatus 800 includes a preheating unit 892. According to various embodiments, the preheating unit 892 may incorporate the intermediate panel assembly 203 by including a removable panel assembly incorporation device 890. Thus, the panel assembly inclusion device 894 is operable to move toward the intermediate panel assembly 203 and to include the intermediate panel assembly 203 as the intermediate panel assembly 203 is delivered or transported into the preheating unit 892 of the preheating workstation 890. According to various embodiments, the preheating unit 892 operates in a similar manner to a press unit, and the panel assembly receiving device 894 may be moved in an up-down direction (or a vertical direction) so as to receive the intermediate panel assembly 203. The middle panel assembly 203 is placed under the panel assembly receiving device 894 and the carrier receiving device 114 moves downward to receive the middle panel assembly.

According to various embodiments, the panel assembly inclusion device 894 includes a pre-heat sub-device 896 that is in thermal contact with the intermediate panel assembly 203. According to various embodiments, the pre-heat subassembly 896 includes a heating plate. Accordingly, the pre-heat sub-assembly 896 forms a bottom surface of the panel assembly engaging device 894, whereby the pre-heat sub-assembly 896 can be moved into contact with the first carrier plate 204 of the intermediate plate assembly 203. Accordingly, the pre-heat sub-assembly 896 may conduct heat to the first carrier plate 204 of the intermediate panel assembly 203. According to various embodiments, the panel assembly inclusion device includes an actuator (not shown) to control and move the panel assembly inclusion device 894 such that the pre-heat sub-device 896 may be moved into contact with the intermediate panel assembly 203.

According to various embodiments, the panel assembly receiving device 894 includes an attachment sub-device 898 to attach the intermediate panel assembly 203 to the panel assembly receiving device 894. Thus, the intermediate panel assembly 203 is attached to the panel assembly receiving device 894 by the attachment sub-device 898, and the intermediate panel assembly 203 may be held by the panel assembly receiving device 894 or held on the panel assembly receiving device 894. Thus, the actuation and movement panel assembly inclusion device 894 is movably attached to the intermediate panel assembly 203. According to various embodiments, the attachment sub-assembly 898 of the panel assembly inclusion device 894 includes a vacuum suction mechanism, such as a vacuum hole or vacuum cup, or a clamping mechanism, such as a gripper or clamp, or a magnetic mechanism, such as an electromagnet. According to various embodiments, the attachment sub-device 898 of the panel assembly inclusion device 894 may be configured to hold or retain the intermediate panel assembly 203 to the panel assembly inclusion device 894. According to various embodiments, the attachment sub-device 898 of the panel assembly inclusion device 894 may be directly attached only to the first carrier plate 204 of the intermediate panel assembly 203.

According to various embodiments, the panel assembly inclusion device 894 may be used to preheat the intermediate panel assembly 203 to an intermediate temperature below a predetermined temperature. According to various embodiments, the pre-heat sub-assembly 896 of the panel assembly inclusion device 894 may be configured to gradually heat the intermediate panel assembly 203 to an intermediate temperature. Accordingly, the preheating sub-device 896 may gradually increase the temperature of the middle panel assembly 203 for a predetermined period of time.

According to various embodiments, the conveyor 150 is configured to move the intermediate panel assembly 203 from the preheat station 890 to the release station 110 after the intermediate panel assembly 203 is heated to an intermediate temperature. According to various embodiments, the conveyor 150 includes a movable preheat stage 853 that is translatable laterally between the preheat station 890 and the release station 110. According to various embodiments, the mobile preheat stage 853 includes a preheat stage 855, the preheat stage 855 being capable of receiving the intermediate panel assembly 203. Thus, the intermediate panel assembly 203 may be placed on the preheat stage 855 of the mobile preheat stage 853. According to various embodiments, when the intermediate panel assembly 203 is sandwiched between the preheating table 855 of the mobile preheating table 853 and the preheating sub-device 896 of the panel assembly receiving device 894 in the preheating unit 892, the preheating table 855 may heat the intermediate panel assembly 203 in cooperation with the preheating sub-device 896 of the panel assembly receiving device 894. In various embodiments, the mobile preheat stage 853 may be actuated to move between the preheat station 890 and the release station 110.

According to various embodiments, the mobile preheat stage 853 of the conveyor 150 includes an attachment sub-device 857 to attach the intermediate panel assembly 203 to the mobile preheat stage 853. The intermediate panel assembly 203 is attached to the mobile preheat stage 853 by an attachment subassembly 858 to be held or retained on the mobile preheat stage 853. The attachment sub-means 857 of the mobile preheat stage 853 comprises a vacuum suction mechanism, such as a vacuum hole or vacuum cup, or a clamping mechanism, such as a gripper or clamp. According to various embodiments, the attachment subsystem 857 of the mobile preheat station 853 is configured such that the intermediate panel assembly 203 does not fall off the mobile preheat station 853 when the intermediate panel assembly 203 is held or held on the mobile preheat station 853 and moved from the preheat station 890 to the release station 110.

Fig. 9A-9D illustrate additional step diagrams based on the apparatus 800 of fig. 8, with reference to the method of automatically releasing and transferring the plastic encapsulated panel 202 of fig. 2A-2F.

As shown in fig. 9A, according to various embodiments, the method further includes the step of preheating the intermediate panel assembly 203 to an intermediate temperature that is below a predetermined temperature that weakens or reduces the adhesive strength of the thermal release adhesive between the plastic cover board 202 and the first carrier plate 204. According to various embodiments, the intermediate panel assembly 203 is placed in the preheating unit 892 of the preheating workstation 890 in the apparatus 800 in such a manner that the first carrier plate 20 faces the top side, thereby preheating the intermediate panel assembly 203 to an intermediate temperature lower than a predetermined temperature. According to various embodiments, during preheating, the preheating sub-assembly 896 of the panel assembly inclusion device 894 in the preheating unit 892 may be in thermal contact with the intermediate panel assembly 203 for preheating. According to various embodiments, during preheating, the intermediate panel assembly 203 may be supported on and in thermal contact with the preheating table 855 of the mobile preheating table 853, and the preheating table 855 may cooperate with the preheating sub-means 896 of the panel assembly receiving means 894 to heat the intermediate panel assembly 203.

As shown in fig. 9B, the method further includes moving the intermediate panel assembly 203 from the preheat station 890 to the release station 110 via a movable preheat station 853, according to various embodiments. According to various embodiments, during movement of the mobile preheat stage 853, the intermediate panel assembly 203 is held and held at the mobile preheat stage 853 by an attachment sub-device 857 of the preheat stage 855. According to various embodiments, the intermediate panel assembly 203 may also be maintained in thermal contact with the preheat stage 855 of the mobile preheat stage 853 during movement of the mobile preheat stage 853, such that the preheat stage 855 may continue to heat or insulate the intermediate panel assembly 203 from or at an intermediate temperature.

As shown in fig. 9C, according to various embodiments, the method further includes, in the release unit 112 in the release workstation 110, lifting the intermediate panel assembly 203 by attaching the intermediate panel assembly 203 into the carrier plate receiving device 114 via the attachment sub-device 118 of the carrier plate receiving device 114, such that the intermediate panel assembly 203 is removed from the mobile preheat station 853. The attachment sub-assembly 118 may hold or hold the intermediate panel assembly 203 such that the carrier-incorporating device 114 may lift the intermediate panel assembly 203 when moved. According to various embodiments, the mobile preheat stage 853 may be moved back to the preheat station 890 and the mobile heating stage 154 may be moved to the release station 110.

As shown in fig. 9D, according to various embodiments, the method further includes lowering the carrier plate receiving device 114 holding or holding the intermediate panel assembly 203 onto the mobile heating table 154 such that the intermediate panel assembly 203 is disposed between the carrier plate receiving device 114 and the mobile heating table 154. Thus, in such an arrangement, the method may proceed to the steps shown in fig. 2A-2E.

Fig. 10 illustrates an apparatus 1000 for processing a plastic cover board 202 according to various embodiments, which may include releasing the plastic cover board 202 attached to a first carrier board 204 by a heat-release adhesive and transferring the released plastic cover board 202 to a second carrier board 206. According to various embodiments, the apparatus 1000 illustrated in fig. 10 is different from the apparatus 800 illustrated in fig. 8, and the apparatus 1000 illustrated in fig. 10 further includes the following.

According to various embodiments, the apparatus 1000 shown in fig. 10 further includes a panel assembly feeder unit 1024 capable of conveying the intermediate panel assembly 203 into the preheating workstation 890. According to various embodiments, the panel assembly feeder unit 1024 may be configured to transport or transport the intermediate panel assembly 203. According to various embodiments, the panel assembly feeder unit 1024 includes a panel assembly feed tray 1026 that is movable into and out of a preheating unit 892 in the preheating workstation 890. In various embodiments, the panel assembly feed tray 1026 may be laterally movable to move in and out of the pre-heat unit 892. According to various embodiments, the intermediate panel assembly 203 may be placed on the panel assembly feed tray 1026, and then the panel assembly feed tray 1026 is actuated and moved into the preheating unit 892. In the preheating unit 892, the panel assembly intake device 894 may be actuated and moved to pick up the intermediate panel assembly 203 and place the intermediate panel assembly 203 on the mobile preheating stage 853. According to various embodiments, not shown in the figures, the panel assembly feed tray 1026 of the panel assembly feeder unit 1024 may move along a plane of movement parallel (at different vertical heights) to the movable preheat stage 853 of the conveyor device 150 that moves between the preheat station 890 and the release station 110. According to various embodiments, not shown in the figures, the feed motion direction of the panel assembly feed tray 1026 of the panel assembly feeder unit 1024 may be perpendicular to the translational motion direction of the movable preheat stage 853 of the conveyor device 150.

Fig. 11 illustrates a schematic perspective view of a device 1100, according to various embodiments. According to various embodiments, an apparatus 1100 (or an automated machine or machines) for release and transfer is provided. The apparatus 1100 includes a preheating station 1190 (or preheating station), the preheating station 1190 including a preheating unit (see 892 in fig. 8, for example) similar to a press unit having a hot plate (or preheating sub-apparatus see 896 in fig. 8, for example) on top for preheating the intermediate panel assembly 203 (or workpiece) composed of the first carrier plate 204 and the plastic package panel 202, a vacuum or clamp unit (or attaching sub-apparatus see 898 in fig. 8, for example) for fixing and holding the intermediate panel assembly 203, and a panel assembly feeder unit 1124 (or panel assembly input unit, for example). The apparatus 1100 further includes a release station 1110 (or release station) comprising a release unit (see e.g., 112 in fig. 1) similar to a press unit having a hot plate (or heating sub-device, see e.g., 116 in fig. 1) on top for heating the intermediate panel assembly 203 to a separation temperature of the thermal separation film (or thermal separation adhesive sheet) between the plastic cover sheet 202 and the first carrier sheet 204, a vacuum or clamp unit (or attachment sub-device, see e.g., 118 in fig. 1) for securing and holding the intermediate panel assembly 203, and a stripping unit 1160 (or adhesive removal unit, see e.g., 360 in fig. 3A) for stripping the thermal separation film after the thermal separation, an electrostatic removal unit (or electrostatic neutralizer, see e.g., 368 in fig. 3A) for eliminating accumulated during the stripping, a thermal separation film processing unit (or adhesive processing unit, see e.g., 370 in fig. 3B), a panel feed-out unit 1174 (or carrier sheet removal unit). The apparatus 1100 further includes a transfer station 1130 (or transfer station) that includes a transfer unit (see, e.g., 132 in fig. 1) similar to a press unit with a hot plate (or step-down sub-apparatus, see, e.g., 136 in fig. 1) on top that includes a vacuum pumping mechanism having a temperature below the separation temperature to slowly decrease the temperature of the separated plastic package panel 202 in sections, a vacuum or clamp unit (or attachment sub-apparatus, see, e.g., 138 in fig. 1) on top of the unit, and a reel apparatus 1180 (or protective film dispensing unit) for applying a protective film on the exposed surface of the plastic package panel 202 to protect the active surface of the die on the plastic package panel, and in accordance with various embodiments, the transfer process is performed in a high vacuum environment to ensure void-free transfer. According to various embodiments, the apparatus 1100 may further include an unloading station 1148 (or unloading station), the unloading station 1148 including a transport unit 1140 (see, e.g., 140 in fig. 1) for transporting the second carrier board 206 into the apparatus 1100 so that the plastic cover board 202 may be adhered thereto, and then the unloading station 1148 may remove the assembly of the second carrier board 206 and the plastic cover board 202 from the apparatus 1100. According to various embodiments, the apparatus 1100 may further include three movable bottom platens (or conveying apparatus, see e.g., 150 in fig. 1 and 8) having vacuum apparatus to transport or transfer components or panels between the four workstations described above.

According to various embodiments, a first carrier plate 204 carrying the plastic package panel 202 is transported into the apparatus 1100, the first carrier plate 204 having thereon a first bar code 1108 (or first machine readable code) that stores on a server information of the plastic package panel 202 carried on the first carrier plate 204. That is, the information of the plastic cover board 202 is pre-encoded into the first bar code 1108, and thus the first bar code 1108 contains the information of the plastic cover board 202. Thus, the intermediate panel assembly 203, which is comprised of the plastic cover board 202 and the first carrier board 204, is loaded into the preheat workstation 1190, the first bar code 1108 may be scanned and the information of the plastic cover board 202 may be retrieved from the server. According to various embodiments, the second carrier plate 206 (or transfer carrier) may have a second bar code 1109 (or a second machine readable code). When the second carrier plate 206 is loaded into the unloading workstation 1148, the second bar code 1109 may be scanned and the information of the plastic cover plate 202 may be associated with the second bar code 1109. In other words, the information of the plastic cover board 202 is encoded into the second bar code 1109, thereby storing the information of the plastic cover board 202 into the second bar code 1109. According to various embodiments, the preheat workstation 1190 may include a first bar code reader 1197 (or a first machine-readable code scanner) and the unload workstation 1148 may include a second bar code reader 1199 (or a second machine-readable code scanner).

According to various embodiments, a method of performing release and transfer using the apparatus 1100 is provided. According to various embodiments, the method may include a preheating step.

In the preheating step, the intermediate panel assembly 203 (or workpiece) is input into the preheating workstation 1190 through the panel assembly feeder unit 1124. According to various embodiments, the intermediate panel assembly 203 includes a plastic package panel 202 including a die and a first carrier plate 204, wherein the active face of the die is mounted on a thermal separation film (or thermal separation adhesive sheet) and the first carrier plate 204 may be made of steel or a steel alloy material. Further, during the preheating step, the preheating press (or panel assembly inclusion device, see e.g., 894 of fig. 8) of the preheating station 1190 receives the intermediate panel assembly 203 through mechanical means. After that, the panel assembly feeder unit 1124 is evacuated. Subsequently, the intermediate panel assembly 203 is lowered onto the bottom preheating stage (or the movable preheating stage, see, for example, 853 of fig. 8). The intermediate panel assembly 203 is then held between the two hot plates, i.e., the preheating press and the bottom preheating table, according to a predetermined time. According to various embodiments, the process preheats the intermediate panel assembly 203 before being subjected to the high temperatures required for the release process. According to various embodiments, this step minimizes the impact of thermal shock to the plastic cover board 202. According to various embodiments, once a predetermined time is reached, the preheating press is retracted, leaving the intermediate panel assembly 203 on the bottom preheating table. The plastic cover board side of the intermediate panel assembly 203 may be held to the bottom preheating stage by vacuum. The bottom preheat stage is then moved into the release station 1110 and positioned under the release press (or carrier plate take-in device, see, e.g., 114 of fig. 1) of the release station 1110.

According to various embodiments, the method may further comprise a release step. The release step begins when the middle panel assembly 203 is transported by the bottom preheat station into the release unit of the release workstation 1110. In the release step, the release press mechanically receives the intermediate panel assembly 203. Thereafter, the bottom preheat stage is withdrawn and the bottom release stage (or mobile heating stage, see, e.g., 154 of fig. 1) is moved in, and then the intermediate panel assembly 203 is placed on the bottom release stage. The intermediate panel assembly 203 is then held between the two platens for a predetermined time, i.e., between the release press and the bottom release station. During this time, both hot plates are heated to the separation temperature required to release the thermal separation membrane. According to various embodiments, the process is to heat the middle panel assembly 203 to release the plastic cover board 202 from the first carrier board 204. According to various embodiments, once a predetermined time is reached, the release press is retracted with the first carrier plate 204. The plastic cover board 202 is left with the thermal release film on the bottom release station. The plastic cover board 202 may be held to the bottom release station by vacuum. In this state, the thermal separation membrane may be ready for peeling.

According to various embodiments, the method may further comprise a stripping step. The peeling step begins when the plastic cover board 202 with the thermal release film is held on the bottom release station. In the peeling step, a peeling clamp (or adhesive removal tool, see, e.g., 362 of fig. 3A) is moved to the edge of the plastic panel 202, which mechanically (e.g., by pushing the edge of the film into the clamp through a push plate, or by vacuum suction, or otherwise) captures the thermal separation film. The clamp is then retracted at a predetermined speed and height to peel the thermal release film to expose the active face of the die on the plastic cover board 202, ensuring that there are no cracks or shifts on the plastic cover board 202 during this movement. The static neutralizer (see, e.g., 368 of fig. 3A) moves in synchronization with the direction of movement of the grippers to ensure that the ionization effect is concentrated and/or oriented at the interface of the thermal separation film and the plastic cover board 202. After the peeling is completed, the jig is continuously moved to a processing position, and the peeled waste heat separation membrane is collected at the processing position. The plastic cover board 202 is held on a bottom release station, with the active side of the die on the plastic cover board exposed and the bottom release station moves the plastic cover board 202 under a transfer press. In addition, the first carrier plate 204 on the release press is placed on another removal unit (or carrier plate removal unit, see e.g., 374 of fig. 3B) to remove and subsequently unload the first carrier plate 204 from the release workstation 1110. According to various embodiments, the first carrier plate may be recycled or reused.

According to various embodiments, the method further comprises a transferring step. But before the transfer step is performed, the method includes a transfer press preparation step. During the transfer step in the transfer press (or plastic cover board receiving device 134) in the transfer station 1130, the transfer station is equipped with a protective film unit (or protective film dispensing unit, see, e.g., 580 of fig. 5) that periodically provides fresh protective film in order to protect the exposed die active side in the plastic cover board. The protective film has a certain aperture therein so that the transfer press can hold or hold the plastic panel 202 by vacuum suction through the protective film. According to various embodiments, the transfer station 1130 may use standard low cost protective films according to the transfer press preparation steps below. The protective film dispenser is first rotated to supply fresh protective film and then the vacuum is turned on, the protective film being sucked into the vacuum tank, so that the contour of the vacuum tank appears on the other side of the protective film. Subsequently, holes are punched at specific positions of the protective film, the specific positions being positions connected to another vacuum source. According to various embodiments, the transfer press includes a vacuum mechanism (or attachment sub-device, see, e.g., 138 of fig. 1) that includes multiple rows of vacuum holes. For example, two or three or four or more rows of vacuum holes. The plurality of vacuum holes are arranged in a line for attracting the plastic cover plate 202 and the protective film. The vacuum holes may be arranged on a transfer platen in the upper part of the transfer press (or a step-down cooling sub-device, see for example 136 of fig. 1). In embodiments with three rows of vacuum holes, the leftmost row of vacuum holes and the rightmost row of vacuum holes may be configured to suction the plastic panel 202 to provide a greater suction force. The middle row of vacuum holes may be configured to draw a protective film. In order to enable the leftmost and rightmost rows of vacuum holes to aspirate the plastic cover board 202, the protective film at the location corresponding to the vacuum holes is pierced by a piercing device (e.g., a lancet, see 589 of fig. 5). According to various embodiments, the piercing means may be arranged on one side of the bottom release station. Thus, in a preparatory step of the transfer press, after the protective film supply reel is rotated to provide a new section of protective film onto the surface of the transfer platen, the bottom release platen moves the piercing device under the leftmost or rightmost row of vacuum holes. The protective film is then pierced with the spike of the piercing device. Next, the bottom release hotplate moves the piercing device under another row of vacuum holes and pierces the protective film again. According to various embodiments, the piercing device may comprise a plurality of piercing units. Each piercing unit may correspond to one vacuum hole of the leftmost or rightmost row. After the transfer press preparation step is completed, the transfer step is continued.

In the transfer step, the transfer press is lowered into contact with the plastic cover board 202 and receives the plastic cover board 202 by vacuum. Thereafter, the bottom release station is withdrawn. The transfer press has a lower temperature to lower the temperature of the plastic panel 202 and begin the cooling process. At the same time, the second carrier plate 206 laminated with the adhesive layer is transferred into the bottom transfer station (or transport tray, see e.g. 142 of fig. 1) by a feeding unit and/or clamping means. The bottom transfer table moves below the transfer press. The vision system (or alignment guide, such as 644 of fig. 6) determines the relative positional offset between the second carrier plate 206 and the plastic cover plate 202 and corrects the relative position based on the determined configuration. The plastic cover board 202 is then lowered onto the bottom transfer station and brought into contact with the rubber seals (or seals, see, e.g., 743 of fig. 7) around the bottom transfer station. According to various embodiments, the transfer press is suspended or stopped in the position of the rubber seal. When the vacuum is turned on, the transfer press moves downward and compresses the rubber seal, bringing the plastic panel 202 into precise contact with the second carrier 206. The plastic panel 202 is then held between the transfer press and the two plates of the bottom transfer station for a predetermined time under vacuum to ensure that there is no gap between the plastic panel 202 and the second carrier plate. For a predetermined time, the transfer press retracts, transferring the plastic cover board 202 to a second carrier plate 206 on the bottom transfer station. The bottom transfer station then transports the transferred panel assembly out of the apparatus 1100.

The following examples relate to various embodiments.

In some embodiments, an automated panel handling apparatus is shown comprising a release station capable of receiving an intermediate panel assembly of plastic cover boards attached to a first carrier board, wherein the first carrier board is at a top side of the intermediate panel assembly, the release station comprising a release unit comprising a carrier board receiving device movable to receive the first carrier board, the carrier board receiving device comprising a heating sub-device to be in thermal contact with the first carrier board, the carrier board receiving device further comprising an attachment sub-device to attach the first carrier board to the carrier board receiving device, wherein the carrier board receiving device is configured to heat the intermediate panel assembly to a separation temperature of a thermal separation adhesive and to separate the first carrier board from the plastic cover boards.

In other embodiments, the automated panel handling apparatus optionally further comprises a transfer station capable of receiving the separated plastic cover panels from the release station, the transfer station comprising a transfer unit comprising a plastic cover panel receiving device movable to receive the separated plastic cover panels, the plastic cover panel receiving device comprising a step-down sub-device to thermally contact the separated plastic cover panels, and an attachment sub-device for attaching the separated plastic cover panels to the plastic cover panel receiving device, wherein the step-down sub-device is adjustable to a temperature between ambient temperature and the separation temperature, a transport unit comprising a transport tray movable into and out of the transfer unit to transport a second carrier below the separated plastic cover panels held and held by the plastic cover panel receiving device to place the separated plastic cover panels on the second carrier, and a transport device comprising at least one transport element movable to transport the separated plastic cover panels from the release station.

In other embodiments, optionally further comprising, the release station may further comprise an adhesive removal unit comprising an adhesive removal tool to engage and remove the thermal release adhesive from the plastic package panel, and wherein the adhesive removal tool is movable from a first edge portion of the plastic package panel to an opposing second edge portion of the plastic package panel to remove the thermal release adhesive from the first edge portion to the second edge portion of the plastic package panel.

In other embodiments, optionally further comprising, the adhesive removal tool may include a clamping mechanism to clamp an edge portion of the thermally separated adhesive sheet of the thermally separated adhesive.

In other embodiments, optionally further comprising, the adhesive removal tool may include an adhesive detector to detect the presence of an edge portion of the thermally separated adhesive sheet held within the clamping mechanism of the adhesive removal tool.

In other embodiments, optionally further comprising, the adhesive removal unit may further comprise an electrostatic neutralizer associated with the adhesive removal tool to release ions at the interface of the plastic panel and the thermal release adhesive sheet as the adhesive removal tool is moved over the plastic panel to peel the thermal release adhesive sheet.

In other embodiments, optionally further comprising a carrier board receiving device and/or an attachment sub-device in the plastic cover board receiving device may include a vacuum suction mechanism.

In other embodiments, a heating sub-assembly of the carrier board accommodating device and/or a step-cooling sub-assembly of the plastic cover board accommodating device can optionally further comprise a heating plate.

In other embodiments, optionally further comprising, the plastic cover board inclusion device may comprise an integrated vacuum heating plate, wherein the built-in heating component acts as a step-down cooling sub-device and the plurality of vacuum holes act as attachment sub-devices.

In other embodiments, the transfer station may optionally further comprise a protective film dispensing unit comprising a protective film supply spool located on a first side of the plastic cover board receiving device in the transfer unit and a protective film collection spool located on a second side of the plastic cover board receiving device in the transfer unit, the protective film hanging between the protective film supply spool and the protective film collection spool and covering the thermal contact surface of the step-down cooling sub-device of the plastic cover board receiving device.

In other embodiments, optionally further comprising, the protective film may comprise a plurality of holes.

In other embodiments, the transport element of the transport device may optionally further comprise a movable heating stage translatable between the release station and the transfer station, the movable heating stage may comprise a heating stage capable of carrying the intermediate panel assembly and heating the intermediate panel assembly in cooperation with a heating sub-device of a carrier plate receiving device of the release unit, wherein the movable heating stage further comprises a protective film piercing device disposed on one side of the heating stage, having a plurality of spike needles.

In other embodiments, the transport element of the transport device may optionally further comprise a movable heating stage translatable between the release station and the transfer station, which may comprise a heating table capable of carrying the intermediate panel assembly and heating the intermediate panel assembly in cooperation with a heating sub-device of the carrier plate receiving device of the release unit.

In other embodiments, the transfer station optionally further comprises an alignment guide to guide relative movement between the plastic cover board receiving device of the transfer unit and a transport tray of the transport unit for transporting the second carrier board to align the plastic cover board and the second carrier board with each other during placement of the separated plastic cover board on the second carrier board.

In other embodiments, the alignment guide optionally further comprises a visual alignment guide comprising an image capture device disposed on the shipping tray to provide visual feedback of relative offset information of the position between the separated plastic package panel and the second carrier plate to control relative movement of the shipping tray and the plastic package panel inclusion device to align the separated plastic package panel and the second carrier plate.

In other embodiments, optionally further comprising the plastic cover board receiving device and the shipping pallet cooperatively forming a sealed space in which a vacuum environment can be created for void-free placement of the separated plastic cover board onto the second carrier board when the plastic cover board receiving device is lowered and in contact with the shipping pallet.

In other embodiments, optionally further comprising the shipping pallet including a seal around a peripheral portion of the shipping pallet.

In other embodiments, a preheating station is optionally further included that is capable of receiving the intermediate panel assembly with the first carrier plate facing upward. The preheating work station comprises:

a preheating unit including a movable panel assembly receiving device for receiving the intermediate panel assembly, the panel assembly receiving device including a preheating sub-device in thermal contact with the intermediate panel assembly, wherein the preheating sub-device is configured to preheat the intermediate panel assembly to an intermediate temperature below the separation temperature,

Wherein the conveyor is configured to move the intermediate panel assembly from the preheating station to the releasing station.

In other embodiments, optionally further comprising the conveyor comprising a mobile preheat stage translatable laterally between a preheat station and a release station, the mobile preheat stage comprising a preheat stage capable of receiving the intermediate panel assembly.

In other embodiments, a panel assembly feeder unit capable of transferring the intermediate panel assembly into the preheating workstation is optionally further included.

In other embodiments, optionally further comprising, the panel assembly intake device may comprise an attachment sub-device for holding or holding the intermediate panel assembly, wherein the panel assembly feeder unit may comprise a movable panel assembly feed tray, moving in and out of the preheating station to transport the intermediate panel assembly, the preheating unit being configured to lift the intermediate panel assembly on the panel assembly feed tray and place the intermediate panel assembly on a movable preheating stage using the panel assembly intake device, the movable preheating stage and the panel assembly intake device cooperating to preheat the intermediate panel assembly.

In some embodiments, an automatic panel handling method is shown comprising heating an intermediate panel assembly of plastic cover boards attached to a first carrier board to a separation temperature of a thermal separation adhesive in a release unit of a release workstation with the first carrier board facing a top side, wherein a heating sub-device of a carrier board receiving device in the release unit is in thermal contact with the first carrier board of the intermediate panel assembly to heat the first carrier board, attaching the first carrier board to the carrier board receiving device by the attachment sub-device via the carrier board receiving device and moving the carrier board receiving device away from the plastic cover boards to separate the first carrier board from the plastic cover boards.

In other embodiments, the method optionally further comprises transferring the separated plastic sealed panel from the release workstation to the transfer workstation via at least one conveying element of a conveying device, attaching the separated plastic sealed panel to the plastic sealed panel intake device via the attachment sub-device of the plastic sealed panel intake device and moving the plastic sealed panel intake device away from the at least one conveying element of the conveying device to lift the separated plastic sealed panel in a transfer unit of the transfer workstation, a transport tray of the transport unit of the transfer workstation transporting a second carrier plate below the separated plastic sealed panel held by the plastic sealed panel intake device, and placing the separated plastic sealed panel on the second carrier plate by moving the plastic sealed panel intake device toward the transport tray.

In other embodiments, the method optionally further comprises releasing an adhesive removal tool of an adhesive removal unit in the workstation to engage the thermal release adhesive and move from the first edge portion of the plastic enclosure panel across the plastic enclosure panel to the second edge portion of the plastic enclosure panel, thereby removing the thermal release adhesive from the plastic enclosure panel.

In other embodiments, the step of removing the heat release adhesive may optionally further comprise the clamping mechanism of the adhesive removal tool clamping an edge portion of the heat release adhesive sheet of the heat release adhesive and the adhesive removal tool moving the peel-away heat release adhesive sheet across the plastic cover board.

In other embodiments, optionally further comprising removing the heat release adhesive may further comprise releasing ions at the interface of the plastic package panel and the heat release adhesive sheet by the electrostatic neutralizer as the adhesive removal tool is moved to peel the heat release adhesive sheet.

In other embodiments, optionally further comprising dispensing and hanging the protective film between a protective film supply reel disposed on a first side of the plastic cover board receiving device in the transfer unit and a protective film collection reel disposed on an opposite second side of the plastic cover board receiving device in the transfer unit such that the protective film hangs over the thermal contact surface of the step-down cooling sub-device of the plastic cover board receiving device in the transfer unit.

In other embodiments, optionally further comprising moving the plastic cover board receiving device in the transfer unit into contact with a protective film piercing device having a plurality of lancets to pierce a plurality of holes in the protective film.

In other embodiments, optionally further comprising placing the separated plastic cover board on a second carrier board may comprise aligning the separated plastic cover board with the second carrier board using an alignment guide in the transfer station.

In other embodiments, optionally further comprising placing the separated plastic cover board on the second carrier board may comprise creating a vacuum environment to place the separated plastic cover board on the second carrier board without voids, wherein the plastic cover board receiving device contacts the shipping pallet when lowered and together form a sealed enclosure for creating the vacuum environment.

In other embodiments, optionally further comprising preheating the intermediate panel assembly to an intermediate temperature below the separation temperature in a state in which the first carrier plate is located on the top side in a preheating unit of the preheating station, wherein a preheating sub-means of the panel assembly receiving means in the preheating unit is in thermal contact with the intermediate panel assembly, and moving the preheated intermediate panel assembly from the preheating station to the release station.

In other embodiments, optionally further comprising transporting the intermediate panel assembly into the preheating workstation via the panel assembly feeder unit.

In other embodiments, the method optionally further comprises scanning a first machine-readable code marked on the first carrier plate to obtain information on the plastic package panel, and scanning a second machine-readable code marked on the second carrier plate to store information on the plastic package panel in the second machine-readable code.

Still other embodiments are methods of forming a plastic molded panel including a plurality of dies and exposing active sides of the plurality of dies for subsequent processing in a panel-level packaging process, the method comprising:

providing a first steel alloy carrier plate;

Providing a heat release adhesive layer on a first steel alloy carrier plate;

placing a plurality of dies on a predetermined location on the thermally-separable adhesive layer, and placing active faces of the plurality of dies flat on the thermally-separable adhesive layer;

Plastic packaging the plurality of bare chips on the first steel alloy carrier by using a plastic packaging material to form a plastic packaging panel on the first steel alloy carrier;

Heating the plastic packaging panel and the first steel alloy carrier plate to the separation temperature of the thermal separation adhesive layer;

releasing the plastic packaging panel from the first steel alloy carrier plate;

The plastic cover plate is transferred onto a second steel alloy carrier plate and oriented such that the active faces of the plurality of dies face away from the second steel alloy carrier.

Various embodiments provide an apparatus, system, and method for releasing a large plastic cover plate from a carrier plate to expose an active surface of a die, and then transferring the plastic cover plate to another carrier plate without flipping the plastic cover plate and still leave the active surface of the die exposed for use in a circuit manufacturing process. Various embodiments relate to preheating an intermediate panel assembly (or workpiece) consisting of a first carrier plate and a plastic cover plate thereon, and heating the intermediate panel assembly to a separation temperature, separating the plastic cover plate from the first carrier plate using a vacuum and a flat chuck and precisely controlling movement, peeling a thermal separation film on the plastic cover plate under a condition of preventing static electricity from accumulating, transferring the plastic cover plate to a second carrier plate (or another carrier) under a high vacuum condition, and simultaneously reducing the temperature of the plastic cover plate. Various embodiments provide for stripping the thermal release film without dislodging or damaging the plastic cover board while simultaneously performing an ionization process to prevent static buildup, protecting the active side of the plastic cover board with a protective film and holding the plastic cover board with a unique vacuum. Various embodiments have provided for precise positional control by camera guided alignment as the plastic cover board is transferred onto the second carrier plate, various embodiments have provided for transfer under high vacuum to eliminate air entrapment between the contact surfaces, various embodiments have provided step-wise relaxed temperature reduction to minimize stress and warpage of the plastic cover board, and various embodiments have reduced warpage by controlling the temperature during the preheating, releasing and transferring steps.

Various embodiments provide a multi-stage heating system and cooling system to gradually heat and cool a panel. Thus, minimal or no thermal shock, minimal or no cumulative internal stress, and minimal or no warpage are achieved. In various embodiments, the panel need not be flipped during release and transfer. Thus, there is no complex mechanical structure and little or no damage to the frangible panel. Various embodiments provide a precision vacuum system that combines controlled movement to provide a slow release of the plastic encapsulated panel from the steel carrier plate. Various embodiments have provided an alignment vision system in the transfer station that transfers the panels into the transfer carrier under aligned conditions. Thus, the vision system checks for a relative shift in position between the second steel carrier plate and the plastic cover plate, and the system corrects for the relative position. Various embodiments provide a film peeling unit that ensures minimal or no static discharge during film peeling by employing a static neutralization unit that is preferably mounted on a feeder that moves in synchronization with the peeling clamping mechanism to ensure that the ionization effect of the static neutralization unit is concentrated at the interface of the film and the plastic package panel. Various embodiments provide a protective film provided by a protective film dispenser to protect the active side of the die from damage. Various embodiments provide a sensor that is disposed in a clip and that is configured to check whether a thermal separation membrane is retained in the clip. Various embodiments provide a bar code on a carrier plate for storing information.

While the invention has been particularly shown and described with reference to a particular embodiment, it will be understood by those skilled in the art that various changes, modifications, and variations in form and detail may be made therein without departing from the scope of the invention. The invention as defined in the appended claims. The scope of the invention is therefore indicated by the appended claims, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims

1. A panel automatic processing device, characterized in that the device comprises:

A release workstation capable of accommodating an intermediate panel assembly consisting of a plastic-sealed panel attached to a first carrier, wherein the first carrier is located on the top side of the intermediate panel assembly, the release workstation comprising: a release unit, comprising a carrier receiving device movable to receive the first carrier, the carrier receiving device comprising a heating sub-device to be in thermal contact with the first carrier, the carrier receiving device further comprising an attaching sub-device to attach the first carrier to the carrier receiving device, wherein the carrier receiving device is configured to heat the intermediate panel assembly to a separation temperature of a thermal separation adhesive and to separate the first carrier from the plastic-sealed panel;

The device also includes:

A transfer workstation capable of receiving the separated plastic-wrapped panel from the release workstation, the transfer workstation comprising: a transfer unit, comprising a plastic-wrapped panel receiving device movable to receive the separated plastic-wrapped panel, the plastic-wrapped panel receiving device comprising a step-by-step cooling sub-device to make thermal contact with the separated plastic-wrapped panel, and also comprising an attachment sub-device for attaching the separated plastic-wrapped panel to the plastic-wrapped panel receiving device, wherein the step-by-step cooling sub-device can be adjusted to a temperature between the ambient temperature and the separation temperature; a transport unit, comprising a transport pallet, the transport pallet being movably moved into and out of the transfer unit to transport a second carrier to below the separated plastic-wrapped panel held and held by the plastic-wrapped panel receiving device to place the separated plastic-wrapped panel on the second carrier; and

A conveying device, comprising at least one conveying element, wherein the conveying element is movable to transport the separated plastic-wrapped panels from the releasing workstation to the transferring workstation;

Wherein, a plurality of bare chips are plastic-sealed in the plastic-sealed panel.

2. The device according to claim 1, wherein the release workstation further comprises an adhesive removal unit, the adhesive removal unit comprising an adhesive removal tool to engage and remove the thermal separation adhesive from the plastic cover panel, the adhesive removal tool being configured to be movable from a first edge portion of the plastic cover panel to a second edge portion of the plastic cover panel opposite to the first edge portion to remove the thermal separation adhesive from the first edge portion to the second edge portion.

3 . The apparatus of claim 2 , wherein the adhesive removal tool comprises an attachment mechanism to attach an edge portion of the thermally-detachable adhesive, the attachment mechanism comprising a clamping mechanism or a vacuum mechanism.

4. The apparatus of claim 3, wherein the adhesive removal tool further comprises an adhesive detector to detect the presence of an edge portion of the thermally-detachable adhesive retained on the attachment mechanism of the adhesive removal tool.

5. The device according to claim 4, wherein the adhesive removal unit further comprises an electrostatic neutralizer arranged in cooperation with the adhesive removal tool to release ions at the interface between the plastic-sealed panel and the thermal separation adhesive when the adhesive removal tool peels off the thermal separation adhesive.

6 . The device according to claim 1 , wherein the attachment sub-device in the carrier receiving device and/or the molded panel receiving device comprises a vacuum mechanism.

7. The device according to claim 1, wherein the heating sub-device of the carrier board incorporating device and/or the step-by-step cooling sub-device of the plastic-sealed panel incorporating device comprises a heating plate.

8. The device according to claim 1, wherein the transfer workstation further comprises a protective film dispensing unit, the protective film dispensing unit comprising a protective film supply reel located on a first side of the plastic panel receiving device and a protective film collecting reel located on a second side of the plastic panel receiving device, the protective film being suspended between the protective film supply reel and the protective film collecting reel and covering the thermal contact surface of the step-by-step cooling sub-device of the plastic panel receiving device.

9. The device of claim 8, wherein the protective film comprises a plurality of holes.

10. The device according to claim 9, wherein the conveying element of the conveying device includes a movable heating table that can be translated between the release workstation and the transfer workstation, the movable heating table includes a heating table surface, the heating table surface is configured to carry the intermediate panel assembly and cooperate with the heating sub-device of the carrier receiving device of the release unit to heat the intermediate panel assembly, and also includes a protective film piercing device with multiple needles arranged on one side of the heating table surface.

11. The device according to claim 1, wherein the transfer workstation further comprises an alignment guide device to guide the relative movement between the plastic-wrapped panel of the transfer unit and the transport pallet of the transport unit for transporting the second carrier, so that when the separated plastic-wrapped panel is placed on the second carrier, the plastic-wrapped panel and the second carrier are aligned.

12. The device according to claim 1, wherein, when the plastic-sealed panel receiving device descends and contacts the transport pallet, the plastic-sealed panel receiving device and the transport pallet cooperate to form a sealed space, and a vacuum environment can be formed in the sealed space to place the separated plastic-sealed panel onto the second carrier without gaps.

13. The apparatus of claim 12, wherein the shipping pallet includes a seal around a peripheral portion of the shipping pallet.

14. The device according to claim 1, wherein the device further comprises:

a preheating workstation capable of receiving the intermediate panel assembly with the first carrier plate facing the top side, the preheating workstation comprising: a preheating unit, the preheating unit comprising a movable panel assembly receiving device for receiving the intermediate panel assembly, the panel assembly receiving device comprising a preheating sub-device capable of contacting the intermediate panel assembly in a thermal contact manner, wherein the preheating sub-device is configured to preheat the intermediate panel assembly to an intermediate temperature lower than the separation temperature;

A conveying device is configured to move the intermediate panel assembly from the preheating workstation to the releasing workstation.

15. The device according to claim 14, wherein the conveying device further comprises a movable preheating table which is translatably movable between the preheating workstation and the releasing workstation, the movable preheating table comprising a preheating table surface, and the preheating table surface is capable of carrying the intermediate panel assembly.

16. The apparatus of claim 15, further comprising a panel assembly feeder unit capable of transferring the intermediate panel assembly into the preheating station.

17. The device according to claim 16, wherein the panel component receiving device includes an attachment sub-device for attaching the intermediate panel component; wherein the panel component feeder unit includes a movable panel component feeding tray capable of moving into and out of the preheating workstation to convey the intermediate panel component; the preheating unit is configured to utilize the panel component receiving device to lift the intermediate panel component on the panel component feeding tray and place the intermediate panel assembly on the movable preheating table, wherein the movable preheating table and the panel component receiving device cooperate to preheat the intermediate panel assembly.

18. A panel automatic processing method, characterized in that the method comprises:

In a release unit of a release workstation, a middle panel assembly consisting of a plastic-sealed panel attached to the first carrier is heated to a separation temperature of a thermal separation adhesive in a manner that the first carrier faces the top side, wherein a heating sub-device of a carrier receiving device in the release unit is in thermal contact with the first carrier of the middle panel assembly to heat the first carrier;

Separating the first carrier from the molding panel by attaching the first carrier to the carrier receiving device via the attaching sub-device of the carrier receiving device and moving the carrier receiving device away from the molding panel;

The separated plastic-wrapped panels are conveyed from the release workstation to the transfer workstation via at least one conveying element of the conveying device;

In the transfer unit of the transfer workstation, the separated plastic-wrapped panel is attached to the plastic-wrapped panel receiving device via the attaching sub-device of the plastic-wrapped panel receiving device of the transfer unit, so that the step-by-step cooling sub-device of the plastic-wrapped panel receiving device is in thermal contact with the separated plastic-wrapped panel, and the plastic-wrapped panel receiving device is moved away from at least one conveying element of the conveying device, thereby lifting the separated plastic-wrapped panel in the transfer unit of the transfer workstation, wherein the step-by-step cooling sub-device can be adjusted to a temperature between the ambient temperature and the separation temperature;

The transport tray of the transport unit of the transfer workstation transports the second carrier plate to the bottom of the separated plastic-sealed panel held by the plastic-sealed panel receiving device;

The separated plastic-sealed panels are placed on the second carrier plate by moving the plastic-sealed panel receiving device toward the transport tray.