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TWI863981B - Cutting device, cutting method and laminated tape - Google Patents

Cutting device, cutting method and laminated tape Download PDF

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Publication number
TWI863981B
TWI863981B TW109111090A TW109111090A TWI863981B TW I863981 B TWI863981 B TW I863981B TW 109111090 A TW109111090 A TW 109111090A TW 109111090 A TW109111090 A TW 109111090A TW I863981 B TWI863981 B TW I863981B
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TW
Taiwan
Prior art keywords
film
cutting
laminated
adhesive layer
cut
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TW109111090A
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Chinese (zh)
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TW202042994A (en
Inventor
玉野基
土井克浩
野田和彦
川井智永
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日商迪睿合股份有限公司
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Publication of TW202042994A publication Critical patent/TW202042994A/en
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Publication of TWI863981B publication Critical patent/TWI863981B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/22Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter coacting with a movable member, e.g. a roller
    • B26D1/225Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter coacting with a movable member, e.g. a roller for thin material, e.g. for sheets, strips or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Details Of Cutting Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

於以間距0.5 mm以下設置有複數條圓盤狀之切開刀11之帶刀輥10與砧輥20之間,使於基材膜31以可剝離方式積層有黏著層32之積層膜30與承載膜4以積層膜30位於帶刀輥10側之方式重疊通過,將積層膜30利用縱切(score cut)方式切開。將該切開刀11之刀角設為30°以下。藉此,將於基材膜以可剝離方式積層有黏著層之積層膜,以基材膜與黏著層不剝離且不產生黏著層之露出之方式,切開為帶寬0.5 mm以下。Between a knife roller 10 and an anvil roller 20 provided with a plurality of disc-shaped cutting knives 11 at intervals of 0.5 mm or less, a laminated film 30 having an adhesive layer 32 laminated on a substrate film 31 in a removable manner and a carrier film 4 are overlapped and passed in a manner such that the laminated film 30 is located on the side of the knife roller 10, and the laminated film 30 is cut by a longitudinal cutting (score cutting) method. The knife angle of the cutting knife 11 is set to be less than 30 degrees. In this way, the laminated film having an adhesive layer laminated on a substrate film in a removable manner is cut into a strip width of less than 0.5 mm in a manner such that the substrate film and the adhesive layer are not peeled off and the adhesive layer is not exposed.

Description

切開裝置、切開方法及積層帶Cutting device, cutting method and laminated tape

本發明係關於一種於基材膜以可剝離方式積層有黏著層之積層膜之切開裝置、切開方法及藉由積層膜之切開而獲得之積層帶。The present invention relates to a cutting device and a cutting method for a laminated film in which an adhesive layer is releasably laminated on a substrate film, and a laminated tape obtained by cutting the laminated film.

於基材膜以可剝離方式積層有黏著層之長條之積層帶被用作將圖形、文字等轉印至物品之轉印帶等(專利文獻1)。此種積層帶係藉由將於基材膜以可剝離方式積層有黏著層之積層膜切開而製造。A long laminated tape having an adhesive layer laminated on a substrate film in a releasable manner is used as a transfer tape for transferring graphics, text, etc. to an object (Patent Document 1). This laminated tape is produced by cutting a laminated film having an adhesive layer laminated on a substrate film in a releasable manner.

於基材膜以可剝離方式積層有黏著層之長條之積層帶亦被用作將電子零件安裝於基板時之接著材,近年來需要窄幅之積層帶。然而,若將於基材膜以可剝離方式積層有黏著層之積層膜切開成窄幅,則會產生基材膜與黏著層因切開而剝離之問題。對此,有如下大費周章之方法:利用罩(hood)覆蓋以使用圓盤狀之上刀與下刀之剪切方式將積層膜切開之裝置整體,抑制積層膜被切開後至被捲取為止之溫度變動(專利文獻2)。根據該方法,可將積層膜切開為帶寬0.5 mm〜4 mm之窄幅。A long laminated tape having an adhesive layer laminated on a base film in a removable manner is also used as a bonding material when mounting electronic components on a substrate, and a narrow laminated tape has been required in recent years. However, if the laminated film having an adhesive layer laminated on a base film in a removable manner is cut into a narrow width, the base film and the adhesive layer may be peeled off due to the cutting. In response to this, there is a complicated method as follows: a hood is used to cover the entire device that cuts the laminated film by a shearing method using a disc-shaped upper knife and a lower knife, so as to suppress the temperature change from the time the laminated film is cut to the time it is rolled up (Patent Document 2). According to this method, the laminated film can be cut into narrow strips with a width of 0.5 mm to 4 mm.

另一方面,於使用上刀與下刀之剪切方式中,有因上刀與下刀之接觸而產生之微細之刀的磨耗粉附著於切開後之帶之虞。對此,存在如下方法:作為不產生此種磨耗粉且可緩和獲得美觀之切斷面所需要之刀具之加工精度的切開方式,於使用帶刀輥與砧輥之縱切(score cut)方式中,將所要切開之膜與承載膜(墊材)一起切開(專利文獻3)。 先前技術文獻 專利文獻On the other hand, in the shearing method using the upper and lower knives, there is a risk that fine knife wear powder generated by the contact between the upper and lower knives will adhere to the tape after cutting. In response to this, there is a method as follows: as a cutting method that does not generate such wear powder and can relax the processing accuracy of the tool required to obtain an aesthetically pleasing cut surface, in the longitudinal cutting (score cutting) method using a knife roller and anvil roller, the film to be cut is cut together with the carrier film (pad material) (Patent Document 3). Prior Art Documents Patent Documents

專利文獻1:日本特開2012-232392號公報 專利文獻2:日本特開2007-90461號公報 專利文獻3:日本特開2003-285293號公報Patent document 1: Japanese Patent Publication No. 2012-232392 Patent document 2: Japanese Patent Publication No. 2007-90461 Patent document 3: Japanese Patent Publication No. 2003-285293

[發明所欲解決之課題][The problem that the invention wants to solve]

根據專利文獻2中記載之方法,可獲得將積層膜切開為寬度0.5 mm之窄幅之帶,但未詳細研究如何將長條以0.5 mm以下之窄幅切開。又,膜寬越窄,越容易產生專利文獻2中記載之基材與黏著層之剝離之問題。因此,關於寬度0.5 mm以下之窄幅之帶,擔心製品之良品率降低等。According to the method described in Patent Document 2, it is possible to cut the laminated film into a narrow strip with a width of 0.5 mm, but there is no detailed study on how to cut the long strip into a narrow strip with a width of less than 0.5 mm. In addition, the narrower the film width, the easier it is to produce the problem of separation of the substrate and the adhesive layer described in Patent Document 2. Therefore, there are concerns about the reduction of the yield rate of the product with a narrow strip with a width of less than 0.5 mm.

根據專利文獻3之記載,能夠使用刀角70°之帶刀輥,將聚酯膜切開為寬度2 mm。然而,根據專利文獻3中記載之方法,若將於基材膜以可剝離方式積層有黏著層之積層膜切開為帶寬0.5 mm以下,則由於帶刀輥中之刀之間距變窄,被切開之積層膜之刀之侵入側之面與其相反側之面相比,被朝切開寬度方向強烈地壓縮,產生黏著層之剝落或露出之問題。According to the description of Patent Document 3, a polyester film can be cut into a width of 2 mm using a knife roller with a blade angle of 70°. However, according to the method described in Patent Document 3, if a laminated film having an adhesive layer releasably laminated on a substrate film is cut into a width of 0.5 mm or less, the distance between the knives in the knife roller becomes narrower, and the surface of the laminated film being cut on the side where the knife enters is strongly compressed in the direction of the cut width compared to the surface on the opposite side, resulting in the problem of peeling or exposure of the adhesive layer.

對此,本發明之課題在於將於基材膜以可剝離方式積層有黏著層之積層膜以基材膜與黏著層不剝離且亦無黏著層之露出之美觀之切口切開為帶寬0.5 mm以下,尤其未達0.5 mm。 [解決課題之技術手段]In this regard, the subject of the present invention is to cut a laminated film in which an adhesive layer is releasably laminated on a base film into a strip having a width of less than 0.5 mm, and in particular less than 0.5 mm, with an aesthetically pleasing cut that does not peel off the base film and the adhesive layer and does not expose the adhesive layer. [Technical means for solving the subject]

本發明者想到,若於使用帶刀輥與砧輥之縱切方式之切開裝置中使用承載膜,且使帶刀輥之切開刀為特定之刀角,則即便帶刀輥之切開刀之間距為0.5 mm以下,尤其未達0.5 mm,亦可將於基材膜以可剝離方式積層有黏著層之積層膜以基材膜與黏著層不剝離之方式切開,亦可抑制黏著層自所切開之帶露出,從而完成了本發明。The inventor of the present invention conceived that if a carrier film is used in a cutting device using a longitudinal cutting method with a knife roller and an anvil roller, and the cutting blades of the knife roller are set to a specific blade angle, then even if the distance between the cutting blades of the knife roller is less than 0.5 mm, especially less than 0.5 mm, a laminated film having an adhesive layer laminated on a base film in a releasable manner can be cut in a manner that the base film and the adhesive layer are not peeled off, and exposure of the adhesive layer from the cut tape can be suppressed, thereby completing the present invention.

即,本發明提供一種切開裝置,其具備以既定間距設置有複數條圓盤狀之切開刀之帶刀輥與砧輥,將膜利用縱切方式切開,且該切開裝置具有使承載膜介置於所要切開之膜與砧輥之間之承載膜搬送機構; 切開刀之刀角為30°以下, 切開刀之間距為0.5 mm以下。That is, the present invention provides a cutting device, which has a knife roller and an anvil roller with a plurality of disc-shaped cutting knives arranged at a predetermined interval, and cuts the film in a longitudinal cutting manner, and the cutting device has a carrier film conveying mechanism that places the carrier film between the film to be cut and the anvil roller; the knife angle of the cutting knife is less than 30°, and the spacing between the cutting knives is less than 0.5 mm.

又,本發明提供一種切開方法,其係如下縱切方式之切開方法:於以既定間距設置有複數條圓盤狀之切開刀之帶刀輥與砧輥之間,使於基材膜以可剝離方式積層有黏著層之積層膜與承載膜以積層膜位於帶刀輥側之方式重疊通過,將積層膜切開;且 將切開刀之刀角設為30°以下, 將切開刀之間距設為0.5 mm以下。Furthermore, the present invention provides a cutting method, which is a longitudinal cutting method as follows: between a knife roller and an anvil roller provided with a plurality of disc-shaped cutting knives at a predetermined interval, a laminated film having an adhesive layer laminated on a substrate film in a releasable manner and a carrier film are made to overlap and pass through in a manner such that the laminated film is located on the side of the knife roller, and the laminated film is cut; and the knife angle of the cutting knife is set to be less than 30°, and the spacing of the cutting knives is set to be less than 0.5 mm.

進而,本發明提供一種積層帶,其係將於基材膜以可剝離方式積層有黏著層之積層膜利用上述切開方法切開而獲得。又,提供一種積層帶,其係於基材膜以可剝離方式積層有黏著層之積層帶,且帶寬為0.5 mm以下,於將長度1 m之該積層帶之一端固定,對另一端施加1 N之張力之情形時,基材膜與黏著層不剝離。 [發明之效果]Furthermore, the present invention provides a laminated tape, which is obtained by cutting a laminated film in which an adhesive layer is releasably laminated on a base film using the above-mentioned cutting method. Also, a laminated tape is provided, which is a laminated tape in which an adhesive layer is releasably laminated on a base film, and the tape width is less than 0.5 mm. When one end of the laminated tape with a length of 1 m is fixed and a tension of 1 N is applied to the other end, the base film and the adhesive layer are not peeled off. [Effect of the invention]

若使用本發明之切開裝置並根據本發明之切開方法,將於基材膜以可剝離方式積層有黏著層之積層膜切開,則可於基材膜與黏著層不剝離之情況下獲得寬度0.5 mm以下、尤其寬度未達0.5 mm之積層帶。即便自該積層帶任意切取長度1 m之帶,將該帶之一端固定並對另一端施加0.5 N、較佳為1 N、更佳為5 N之張力,基材膜與黏著層亦不會剝離。因此,即便將該積層帶捲繞於捲筒製成捲裝體,自捲裝體拉出而使用,亦不會因捲取時或拉出時之張力而導致基材膜與黏著層剝離。進而,於該積層帶之捲裝體中亦無黏著層之露出。因此,可防止於製成捲裝體時產生黏連(blocking)。由此,該積層帶作為將黏著層貼附於物品之窄幅之黏著材有用,若由硬化性樹脂組成物形成黏著層則作為接著材亦有用。If a laminated film in which an adhesive layer is releasably laminated on a base film is cut using the cutting device of the present invention and the cutting method of the present invention, a laminated tape having a width of less than 0.5 mm, especially a width of less than 0.5 mm, can be obtained without the base film and the adhesive layer being peeled off. Even if a tape having a length of 1 m is cut from the laminated tape at random, one end of the tape is fixed and a tension of 0.5 N, preferably 1 N, and more preferably 5 N is applied to the other end, the base film and the adhesive layer will not be peeled off. Therefore, even if the laminated tape is wound around a roll to form a roll body, and then pulled out from the roll body for use, the base film and the adhesive layer will not be separated due to the tension during winding or pulling out. Furthermore, the adhesive layer is not exposed in the roll body of the laminated tape. Therefore, blocking can be prevented when the roll body is formed. Therefore, the laminated tape is useful as a narrow adhesive material for attaching the adhesive layer to an article, and is also useful as a bonding material if the adhesive layer is formed from a curable resin composition.

以下,一面參照圖式一面對本發明詳細地進行說明。再者,於各圖中,相同符號表示相同或同等之構成要素。Hereinafter, the present invention will be described in detail with reference to the drawings. In each of the drawings, the same reference numerals represent the same or equivalent components.

<切開裝置之整體構成> 圖1係本發明之一實施例之切開裝置1之概略斜視圖,圖2係利用切開裝置1將膜3切開時之切開刀之排列區域附近之側視圖。<Overall structure of the cutting device> Figure 1 is a schematic oblique view of a cutting device 1 of an embodiment of the present invention, and Figure 2 is a side view of the vicinity of the arrangement area of the cutting blades when the film 3 is cut by the cutting device 1.

如圖2所示,該切開裝置1係具備帶刀輥10及圓筒狀之砧輥20,且將膜3利用縱切方式切開之裝置,該帶刀輥10具有將圓盤狀之切開刀11於圓筒狀之輥12以既定間距排列於該輥12之旋轉軸L1方向之區域13。於剪切方式中上刀與下刀接觸,相對於此,根據縱切方式,由於刀彼此不會接觸,故而可延長刀之壽命。As shown in FIG2 , the cutting device 1 is a device that has a knife roller 10 and a cylindrical anvil roller 20, and cuts the film 3 using a longitudinal cutting method. The knife roller 10 has a disc-shaped cutting knife 11 arranged at a predetermined interval on a cylindrical roller 12 in an area 13 in the direction of the rotation axis L1 of the roller 12. In the shearing method, the upper knife and the lower knife are in contact. In contrast, according to the longitudinal cutting method, since the knives do not contact each other, the life of the knives can be extended.

於切開裝置1,作為使所要切開之膜3通過帶刀輥10與砧輥20之間的搬送機構,設置有膜捲出裝置2與捲取裝置(未圖示)。作為捲取裝置,可分別具有捲取偶數行之帶3a之捲取裝置與捲取奇數行之帶3b之捲取裝置,以使切開膜而獲得之複數行之帶中鄰接之帶於互不相同之方向上被捲取。再者,於圖1中記載為將偶數行之帶3a於上方捲取,將奇數行之帶3b於下方捲取,但亦可將偶數行之帶於下方捲取,將奇數行之帶於上方捲取。The slitting device 1 is provided with a film unwinding device 2 and a winding device (not shown) as a conveying mechanism for passing the film 3 to be slit between the knife roller 10 and the anvil roller 20. The winding device may include a winding device for winding the tape 3a of the even-numbered rows and a winding device for winding the tape 3b of the odd-numbered rows, so that the adjacent tapes of the tapes of the plurality of rows obtained by slitting the film are wound in different directions. Furthermore, in FIG. 1 , it is described that the tapes 3a of the even-numbered rows are wound up at the top and the tapes 3b of the odd-numbered rows are wound up at the bottom, but the tapes of the even-numbered rows may be wound up at the bottom and the tapes of the odd-numbered rows may be wound up at the top.

於切開裝置1,作為使承載膜4介置於所要切開之膜3與砧輥20之間之承載膜搬送機構,設置有承載膜捲出裝置5、使承載膜4與膜3重疊之一對層壓輥(laminate roll)6、及將切開後之膜之端部(膜之邊緣)與承載膜4一起捲取之承載膜捲取部(未圖示)。The cutting device 1 is provided with a carrier film unwinding device 5 as a carrier film conveying mechanism for placing the carrier film 4 between the film 3 to be cut and the anvil roller 20, a pair of laminate rolls 6 for overlapping the carrier film 4 and the film 3, and a carrier film taking-up section (not shown) for taking up the end portion (edge of the film) of the cut film together with the carrier film 4.

該切開裝置1中,如下所述,所要切開之膜3不僅為單層之樹脂膜、或複數層之樹脂層接著或熔接成之積層膜,即便為於基材膜31以可剝離方式積層有黏著層32之積層膜30(圖4),亦能夠切開為寬度0.5 mm以下,尤其寬度未達0.5 mm。In the cutting device 1, as described below, the film 3 to be cut is not only a single-layer resin film or a laminated film formed by bonding or welding a plurality of resin layers, but even a laminated film 30 ( FIG. 4 ) in which an adhesive layer 32 is releasably laminated on a base film 31 can be cut to a width of less than 0.5 mm, especially a width of less than 0.5 mm.

<切開刀> 設置於帶刀輥10之切開刀11自使切開方向穩定之方面而言較佳為雙面刃。若使切開刀為單面刃(即,若使形成刀尖之2個刀面之一者為平坦面,使另一者為刀稜面),則切開時施加至切開刀之膜寬度方向之力於刀稜面較平坦面更大,膜向刀稜側方向彎曲並被搬送,故而必須擴大所要切開之膜之寬度方向之邊界,膜端部之廢棄量亦變多。相對於此,藉由設為雙面刃,切開時施加至切開刀之膜寬度方向之力於刀之兩側面相等,故而可防止膜之搬送方向彎曲,亦可減少膜端部之廢棄量。<Cutting knife> The cutting knife 11 provided on the knife roller 10 is preferably a double-edged blade in terms of stabilizing the cutting direction. If the cutting knife is a single-edged blade (i.e., if one of the two blade surfaces forming the blade tip is a flat surface and the other is a blade edge surface), the force applied to the cutting knife in the film width direction during cutting is greater on the blade edge surface than on the flat surface, and the film is conveyed while bending in the direction of the blade edge. Therefore, the width direction boundary of the film to be cut must be enlarged, and the amount of waste at the end of the film also increases. In contrast, by using a double-edged blade, the force applied to the cutting knife in the film width direction during cutting is equal on both sides of the knife, thereby preventing the film from bending in the conveying direction and reducing the amount of waste at the end of the film.

自「可將於基材膜以可剝離方式設置有黏著層之積層膜在基材膜與黏著層不剝離之情況下切開成寬度0.5 mm以下、尤其寬度未達0.5 mm之窄幅」之方面而言,切開刀11之刀角α較佳為設為30°以下,尤其設為25°以下。另一方面,自切開刀之耐久性之方面而言,刀角α較佳為設為10°以上。From the perspective of "being able to cut a laminated film having an adhesive layer releasably disposed on a substrate film into a narrow width of 0.5 mm or less, especially less than 0.5 mm without the substrate film and the adhesive layer being peeled off", the blade angle α of the cutting blade 11 is preferably set to 30° or less, especially 25° or less. On the other hand, from the perspective of the durability of the cutting blade, the blade angle α is preferably set to 10° or more.

切開刀11之間距p根據將膜3切開所獲得之帶所需之帶寬決定,但於本發明中,為了可應對窄幅之帶,上限設為0.5 mm以下,尤其未達0.5 mm,進而亦可設為0.4 mm以下。下限較佳為設為0.1 mm以上。The spacing p of the cutting blades 11 is determined by the required width of the tape obtained by cutting the film 3. However, in the present invention, in order to cope with narrow tapes, the upper limit is set to 0.5 mm or less, especially less than 0.5 mm, and further can be set to 0.4 mm or less. The lower limit is preferably set to 0.1 mm or more.

自使切開精度穩定之方面而言,切開刀11之切開刀之刀高h較高者較佳,下限較佳為0.05 mm以上,更佳為0.1 mm以上,進而較佳為0.24 mm以上。另一方面,自切開刀之耐久性之方面而言,切開刀之刀高h較低者較佳,上限較佳為0.8 mm以下,更佳為0.7 mm以下,進而較佳為0.5 mm以下。From the perspective of stabilizing the cutting accuracy, the higher the blade height h of the cutting blade 11, the better. The lower limit is preferably 0.05 mm or more, more preferably 0.1 mm or more, and further preferably 0.24 mm or more. On the other hand, from the perspective of the durability of the cutting blade, the lower the blade height h of the cutting blade is, the better. The upper limit is preferably 0.8 mm or less, more preferably 0.7 mm or less, and further preferably 0.5 mm or less.

若如專利文獻3所記載般將切開刀之刀角α設為70°,則於將間距設為0.5 mm以下之情形時,若將於基材膜上以可剝離方式積層有黏著層之積層膜切開,則如圖6所示,即便積層膜30係於基材膜31上依次設置有黏著層32及覆蓋膜33,且黏著層32不露出於膜表面者,積層膜30中之切開刀11之侵入側之面相比其相反側之面亦會於切開寬度方向受到較強的壓縮力F。因此,於切開後之帶中,產生如下等問題,即,基材膜31或覆蓋膜33自黏著層32剝離,或者黏著層32自帶之側面露出,將帶製成捲裝體時產生黏連。相對於此,於本發明中,由於使切開刀11之刀角小為30°以下,故而即便將切開刀11之間距設為0.5 mm以下,尤其0.1 mm以上0.4 mm以下,亦可減輕如圖4所示般施加至切開刀11之侵入側之面之壓縮力F,將於基材膜31上以可剝離方式積層有黏著層32之積層膜30在基材膜31與黏著層32不會剝離之情況下切開,又,可抑制黏著層32自帶之側面露出。於窄幅之帶中,與寬幅之帶相比,由於施加至平均帶橫剖面面積之切開寬度方向之力相對變大,故而容易產生黏著層之露出。因此,可謂若帶寬變窄則抑制黏著層32之露出之難易度變高。If the blade angle α of the cutting knife is set to 70° as described in Patent Document 3, then when the spacing is set to less than 0.5 mm, if a laminated film having an adhesive layer laminated on a base film in a removable manner is cut, as shown in FIG6 , even if the laminated film 30 is a laminated film 31 in which an adhesive layer 32 and a cover film 33 are sequentially provided on a base film 31, and the adhesive layer 32 is not exposed on the film surface, the surface of the intrusion side of the cutting knife 11 in the laminated film 30 will be subjected to a stronger compressive force F in the cutting width direction than the surface on the opposite side. Therefore, in the tape after being cut, there arises a problem that the base film 31 or the cover film 33 is peeled off from the adhesive layer 32, or the adhesive layer 32 is exposed from the side surface of the tape, and sticking occurs when the tape is made into a roll body. In contrast, in the present invention, since the blade angle of the cutting knife 11 is reduced to less than 30°, even if the spacing of the cutting knife 11 is set to less than 0.5 mm, especially between 0.1 mm and 0.4 mm, the compressive force F applied to the intruding side surface of the cutting knife 11 as shown in FIG. 4 can be reduced, and the laminated film 30 having the adhesive layer 32 releasably laminated on the base film 31 can be cut without the base film 31 and the adhesive layer 32 being peeled off, and the exposure of the side surface of the adhesive layer 32 can be suppressed. In a narrow tape, the force applied to the average tape cross-sectional area in the cutting width direction is relatively larger than that in a wide tape, so the adhesive layer is more likely to be exposed. Therefore, it can be said that the difficulty of suppressing the exposure of the adhesive layer 32 increases as the tape width becomes narrower.

作為具有以上述刀角α與間距p排列有切開刀11之區域13之帶刀輥10,可使用圖2所示般藉由金屬輥之切削加工而獲得之切削刀、或將刀角α之圓刀於旋轉軸方向重疊而成之組刀等。其中,圖2所示之切削刀可藉由於碳鋼等高強度且耐久性較高之輥12之表面設置易切削合金層,並將該易切削合金層利用使用金剛石工具之精密切削加工裝置等切削加工而獲得。又,組刀可藉由將各個切開刀11利用切削加工形成,並將切開刀以既定間距組合而獲得。切開刀之構成係將刀角設為30°以下,將間距設為0.5 mm以下,較佳為未達0.5 mm,更佳為0.4 mm以下,只要可獲得本發明之效果則並不特別限定。As the knife roller 10 having the area 13 where the cutting knives 11 are arranged at the above-mentioned knife angle α and spacing p, a cutting knife obtained by cutting a metal roller as shown in FIG2 or a knife set formed by overlapping round knives with a knife angle α in the direction of the rotation axis can be used. Among them, the cutting knife shown in FIG2 can be obtained by providing a free-cutting alloy layer on the surface of a high-strength and durable roller 12 such as carbon steel, and cutting the free-cutting alloy layer using a precision cutting processing device using a diamond tool. In addition, the knife set can be obtained by forming each cutting knife 11 by cutting and combining the cutting knives at a predetermined spacing. The structure of the cutting knife is to set the blade angle to be less than 30° and the spacing to be less than 0.5 mm, preferably less than 0.5 mm, and more preferably less than 0.4 mm. There is no particular limitation as long as the effect of the present invention can be obtained.

作為形成切開刀之易切削性合金(即,可切削性良好之合金),可使用鎳-磷合金、硬質銅合金、工具鋼、超硬合金等。自易切削性合金之耐久性之方面而言較佳為維氏硬度為475以上者,更佳為500以上,進而較佳為550以上,特佳為1400以上。As the free-cutting alloy (i.e., alloy with good machinability) for forming the cutter, nickel-phosphorus alloy, hard copper alloy, tool steel, superhard alloy, etc. can be used. From the aspect of durability of the free-cutting alloy, the Vickers hardness is preferably 475 or more, more preferably 500 or more, further preferably 550 or more, and particularly preferably 1400 or more.

<帶刀輥與砧輥之組裝> 於切開裝置1中,帶刀輥10與砧輥20如圖3A所示,分別由軸承15、25支持,且以旋轉軸L1、L2平行之方式配置。只要旋轉軸L1、L2平行,則旋轉軸L1、L2之方向既可為水平亦可為鉛直。自使積層膜30之移行穩定之方面而言,較佳為使旋轉軸L1、L2之方向為水平,且將帶刀輥10配置於砧輥20之上。另一方面,自異物不易附著於積層膜30之方面而言,較佳為使旋轉軸L1、L2之方向為鉛直方向。<Assembly of knife roller and anvil roller> In the cutting device 1, the knife roller 10 and the anvil roller 20 are supported by bearings 15 and 25, respectively, as shown in FIG3A, and are arranged in a manner that the rotation axes L1 and L2 are parallel. As long as the rotation axes L1 and L2 are parallel, the directions of the rotation axes L1 and L2 can be either horizontal or vertical. From the perspective of stabilizing the movement of the laminated film 30, it is preferred to make the directions of the rotation axes L1 and L2 horizontal and arrange the knife roller 10 on the anvil roller 20. On the other hand, from the perspective of preventing foreign matter from being easily attached to the laminated film 30, it is preferred to make the directions of the rotation axes L1 and L2 vertical.

帶刀輥10與砧輥20利用齒輪16、26連接,且設置有使該等向圖1之箭頭方向旋轉之驅動機構。另一方面,亦可設置使帶刀輥10與砧輥20個別地旋轉驅動之驅動機構。The knife roll 10 and the anvil roll 20 are connected by gears 16 and 26, and a driving mechanism for rotating them in the direction of the arrows in Fig. 1 is provided. On the other hand, a driving mechanism for rotating and driving the knife roll 10 and the anvil roll 20 separately can also be provided.

自連續穩定地進行切開之方面而言,切開刀11向承載膜4之切入量d2(圖2)之一例較佳為10〜100 μm,更佳為10〜50 μm,進而較佳為10〜20 μm。較佳為於切開裝置1設置使帶刀輥10之安裝位置相對於砧輥20移動之調整機構,以便能夠根據承載膜4之厚度調整切入量d2。作為該調整機構,可設置藉由調整螺絲18而使帶刀輥10沿著導件17移動之線性導引機構等。In terms of continuous and stable cutting, the cutting amount d2 (FIG. 2) of the cutting knife 11 into the carrier film 4 is preferably 10 to 100 μm, more preferably 10 to 50 μm, and further preferably 10 to 20 μm. It is preferred that the cutting device 1 is provided with an adjustment mechanism for moving the mounting position of the knife roller 10 relative to the anvil roller 20 so that the cutting amount d2 can be adjusted according to the thickness of the carrier film 4. As the adjustment mechanism, a linear guide mechanism or the like can be provided for moving the knife roller 10 along the guide 17 by adjusting the screw 18.

另一方面,於使用固定膜厚之承載膜之情形時,如圖3B所示,亦可於帶刀輥10設置較切開刀11之刀尖更向砧輥20側突出之大徑部分14,將該大徑部分14壓抵於砧輥20。將該大徑部分14壓抵於砧輥20之推力可設為800 N左右。若使該推力過大,則帶刀輥10產生撓曲之問題。又,如圖3C所示,亦可將工具鋼、超硬合金等切成圓形,進行切削、研磨而精加工成厚度0.5 mm以下之圓刀,將該圓刀組合並利用螺栓19固定,由此構成組刀,藉由組刀而形成切開刀之排列區域13。圖3C所示之態樣亦與圖3A所示之態樣相同,由於砧輥20與帶刀輥10之安裝位置由調整螺絲18調整,故而無需用以將帶刀輥10壓抵於砧輥20之推力。On the other hand, when a carrier film with a fixed film thickness is used, as shown in FIG3B , a large diameter portion 14 that protrudes further toward the anvil roller 20 than the tip of the cutting knife 11 can be provided on the knife roller 10, and the large diameter portion 14 is pressed against the anvil roller 20. The thrust for pressing the large diameter portion 14 against the anvil roller 20 can be set to about 800 N. If the thrust is too large, the knife roller 10 will be buckled. In addition, as shown in FIG3C , tool steel, superhard alloy, etc. can be cut into a circular shape, cut, ground, and finished into a circular knife with a thickness of less than 0.5 mm, and the circular knives can be assembled and fixed with bolts 19 to form a knife assembly, and the arrangement area 13 of the cutting knives is formed by the knife assembly. The state shown in FIG. 3C is also the same as the state shown in FIG. 3A . Since the mounting positions of the anvil roller 20 and the knife roller 10 are adjusted by the adjusting screw 18 , there is no need to apply a thrust force to press the knife roller 10 against the anvil roller 20 .

<切開方法> 本發明之切開方法係如下方法:使於基材膜31以可剝離方式積層有黏著層32之積層膜30通過上述帶刀輥10與砧輥20之間而將積層膜30切開,且藉由將積層膜30設為帶刀輥10側,將承載膜4設為砧輥20側,使積層膜30與承載膜4重疊通過,而將積層膜30利用縱切方式切開(圖1、圖4)。如下所述,於積層膜30由基材膜31、黏著層32、及覆蓋膜33構成之情形時,通常如圖4所示,將積層膜30之基材膜31設為帶刀輥10側,將覆蓋膜33設為承載膜4側。於該情形時,將覆蓋膜33與承載膜4接著並切開,切開後將覆蓋膜33與承載膜4一起自黏著層32剝離。另一方面,亦可將積層膜30之覆蓋膜33設為帶刀輥10側,將基材膜31設為承載膜4側進行切開。<Cutting method> The cutting method of the present invention is as follows: a laminated film 30 having an adhesive layer 32 laminated on a substrate film 31 in a removable manner is passed between the knife roller 10 and the anvil roller 20 to cut the laminated film 30, and the laminated film 30 is arranged on the knife roller 10 side and the carrier film 4 is arranged on the anvil roller 20 side, so that the laminated film 30 and the carrier film 4 are overlapped and passed, and the laminated film 30 is cut by longitudinal cutting (Figure 1, Figure 4). As described below, when the laminate film 30 is composed of a base film 31, an adhesive layer 32, and a cover film 33, the base film 31 of the laminate film 30 is usually set to the side with the knife roller 10, and the cover film 33 is set to the side of the carrier film 4 as shown in FIG. 4. In this case, the cover film 33 and the carrier film 4 are connected and cut, and after cutting, the cover film 33 and the carrier film 4 are peeled off from the adhesive layer 32. On the other hand, the cover film 33 of the laminate film 30 can also be set to the side with the knife roller 10 and the base film 31 is set to the side of the carrier film 4 for cutting.

利用該切開將承載膜4半切,但積層膜30以既定間距被貫通切割,故而以將積層膜30藉由貫通切割而獲得之複數行之帶中鄰接之帶於互不相同之方向捲取之方式,將偶數行之帶3a與奇數行之帶3b分別利用捲取裝置捲取。The carrier film 4 is cut in half by the cutting, but the laminate film 30 is cut through at a predetermined interval, so the tapes 3a of the even-numbered rows and the tapes 3b of the odd-numbered rows are respectively rolled up by a rolling device in such a manner that adjacent tapes of the plurality of rows of tapes obtained by the through-cutting of the laminate film 30 are rolled up in different directions.

再者,將切開後之積層膜30之端部(積層膜之邊緣)3c與被半切之承載膜4一起捲取。又,亦可將覆蓋膜33與承載膜4一起捲取。Furthermore, the end portion (edge of the laminate film) 3c of the cut laminate film 30 is rolled up together with the half-cut carrier film 4. Furthermore, the cover film 33 and the carrier film 4 may also be rolled up together.

切開刀11對承載膜4之切入量d2如上所述較佳為10 μm以上100 μm以下。又,相對於刀高h,被切開物(積層膜30與承載膜4)之合計厚度較佳為90%以下,例如,於刀高為300 μm時,被切開物之合計厚度較佳為270 μm以下(圖2)。更佳為,相對於刀高h使被切開物之合計厚度為70%以下,進而較佳為50%以下。As mentioned above, the cutting amount d2 of the cutting knife 11 into the carrier film 4 is preferably 10 μm or more and 100 μm or less. In addition, the total thickness of the cut object (laminated film 30 and carrier film 4) is preferably 90% or less relative to the knife height h. For example, when the knife height is 300 μm, the total thickness of the cut object is preferably 270 μm or less (Figure 2). More preferably, the total thickness of the cut object is 70% or less relative to the knife height h, and further preferably 50% or less.

再者,切開較佳為於無塵室進行,不需要為了抑制環境溫度之變動而設置覆蓋切開裝置整體之罩,但亦可設置。Furthermore, the cutting is preferably performed in a clean room, and there is no need to set a cover covering the entire cutting device in order to suppress changes in ambient temperature, but it can be set.

<積層膜> 作為利用本發明之切開方法切開之積層膜30,例如,可列舉如圖4所示,將基材膜31、黏著層32、覆蓋膜33依次以可剝離方式積層而成者,該基材膜31之厚度為12〜75 μm,尤其為25〜75 μm,該黏著層32之厚度為5〜40 μm,尤其為5〜25 μm,該覆蓋膜33之厚度較基材膜更薄或厚度為10〜50 μm。此處,所謂能夠剝離,係指於基材膜31或覆蓋膜33貼玻璃紙膠帶而剝離,或藉由將基材膜31或覆蓋膜33之端利用膜用鑷子(以下稱為鑷子)捏著剝離,可將基材膜31或覆蓋膜33自黏著層32容易地剝離。<Laminated film> As a laminated film 30 cut by the cutting method of the present invention, for example, as shown in FIG. 4, a base film 31, an adhesive layer 32, and a cover film 33 are sequentially laminated in a releasable manner, the base film 31 has a thickness of 12 to 75 μm, especially 25 to 75 μm, the adhesive layer 32 has a thickness of 5 to 40 μm, especially 5 to 25 μm, and the cover film 33 is thinner than the base film or has a thickness of 10 to 50 μm. Here, the term "peelable" means that the base film 31 or the cover film 33 can be peeled off by sticking a cellophane tape on the base film 31 or the cover film 33, or the base film 31 or the cover film 33 can be easily peeled off from the self-adhesive layer 32 by pinching and peeling the end of the base film 31 or the cover film 33 with film tweezers (hereinafter referred to as tweezers).

如圖4所示,於切開時亦可將基材膜31配置於切開刀11之侵入側,亦可將覆蓋膜33配置於切開刀11之侵入側。As shown in FIG. 4 , during cutting, the base film 31 may be disposed on the intrusion side of the cutting blade 11 , and the cover film 33 may be disposed on the intrusion side of the cutting blade 11 .

再者,根據將積層膜切開所獲得之積層帶之用途,亦可不於積層膜30設置覆蓋膜33。若將承載膜4重疊於積層膜30,則膜整體之剛性變高,故而即便無覆蓋膜33,亦可藉由於剛切開之後於切開刀11貼附黏著層32而不使黏著層32自基材膜31剝落。另一方面,自防止積層帶之污染之方面而言,較佳為有覆蓋膜33,尤其於獲得窄幅之積層帶之情形時較佳為有覆蓋膜33。至於作為最終用作接著材之形態之捲裝體,為了防止覆蓋膜污染,可存在覆蓋膜33,為了提高作業性,亦可無覆蓋膜33。Furthermore, depending on the use of the laminated tape obtained by cutting the laminated film, the cover film 33 may not be provided on the laminated film 30. If the carrier film 4 is superimposed on the laminated film 30, the rigidity of the entire film becomes higher, so even without the cover film 33, the adhesive layer 32 can be attached to the cutting blade 11 immediately after cutting to prevent the adhesive layer 32 from being peeled off from the base film 31. On the other hand, from the perspective of preventing contamination of the laminated tape, it is preferable to have the cover film 33, especially when a laminated tape of a narrow width is obtained. As for the final form of the wound body used as the bonding material, the covering film 33 may be present to prevent contamination of the covering film, or the covering film 33 may be absent to improve workability.

(基材膜、覆蓋膜) 基材膜31可列舉由聚乙烯、聚丙烯、PET等聚酯等熱塑性樹脂形成之膜。覆蓋膜33係為了防止黏著層32污染而設置,可由與基材膜31相同之材料形成。較佳為基材膜31或覆蓋膜33之表面經剝離處理。目的在於能夠與黏著層分離。為了於切開後首先將覆蓋膜剝離,較佳為使用較基材膜31於覆蓋膜33更容易剝離者。(Base film, covering film) Base film 31 may be formed of thermoplastic resins such as polyethylene, polypropylene, PET and other polyesters. Covering film 33 is provided to prevent contamination of adhesive layer 32 and may be formed of the same material as base film 31. It is preferred that the surface of base film 31 or covering film 33 is subjected to a peeling treatment. The purpose is to be able to separate from the adhesive layer. In order to peel off the covering film first after cutting, it is preferred to use a base film 31 that is easier to peel off than covering film 33.

於本發明中,將剛性相對較低之黏著層32與剛性相對較高之基材膜31同時切開,且於切開時使其等不分離,於切開後之積層帶之使用時能夠將黏著層32與基材膜31剝離。此處,由於聚乙烯、聚丙烯、PET等聚酯之拉伸彈性模數為大致1100〜4200 MPa,故而將由此種熱塑性樹脂形成之膜和剛性與膜不同之黏著層32同時切開成寬度0.5 mm以下之窄幅,且於切開時抑制膜與黏著層之分離或剝離係難易度較高之技術,但根據本發明,能夠進行此種切開。In the present invention, the adhesive layer 32 with relatively low rigidity and the base film 31 with relatively high rigidity are cut at the same time, and they are not separated during cutting, so that the adhesive layer 32 and the base film 31 can be peeled off when the laminated tape is used after cutting. Here, since the tensile elastic modulus of polyesters such as polyethylene, polypropylene, and PET is approximately 1100 to 4200 MPa, it is a relatively difficult technology to simultaneously cut the film formed by such thermoplastic resin and the adhesive layer 32 with different rigidity from the film into a narrow width of less than 0.5 mm, and to suppress the separation or peeling of the film and the adhesive layer during cutting, but according to the present invention, such cutting can be performed.

(黏著層) 作為黏著層32,既可積層黏著膜,亦可積層黏著劑之塗膜。根據將積層膜30切開所獲得之帶之用途,黏著層32既可由單一之樹脂層構成,亦可由複數層樹脂層之積層體或多層體構成。又,根據需要,亦可於黏著層32中含有填料。(Adhesive layer) The adhesive layer 32 may be a laminated adhesive film or a laminated adhesive coating. Depending on the use of the tape obtained by cutting the laminated film 30, the adhesive layer 32 may be composed of a single resin layer or a laminate or multilayer of multiple resin layers. Furthermore, the adhesive layer 32 may contain fillers as needed.

(黏著層之填料) 於使黏著層含有填料之情形時,該填料根據將積層膜30切開所獲得之帶之用途,自公知之無機系填料(金屬、金屬氧化物、金屬氮化物等)、有機系填料(樹脂、橡膠等)、有機系材料與無機系材料混合存在之填料等對應於用途而適當選擇。例如,於光學用途或消光之用途中,可使用氧化矽填料、氧化鈦填料、苯乙烯填料、丙烯酸填料、三聚氰胺填料或各種鈦酸鹽等。於電容器(condenser)用膜之用途中,可使用氧化鈦、鈦酸鎂、鈦酸鋅、鈦酸鉍、氧化鑭、鈦酸鈣、鈦酸鍶、鈦酸鋇、鈦酸鋯酸鋇、鈦酸鋯酸鉛及該等之混合物等。於作為接著材之用途中,可使其含有聚合物系之橡膠粒子、聚矽氧橡膠粒子等。於電子零件之安裝之用途中,填料既可具有導電性,亦可具有絕緣性。於填料具有絕緣性之情形時,例如可將填料用作間隔件。(Filler of adhesive layer) When the adhesive layer contains a filler, the filler is appropriately selected according to the use of the tape obtained by cutting the laminated film 30, from known inorganic fillers (metal, metal oxide, metal nitride, etc.), organic fillers (resins, rubbers, etc.), fillers mixed with organic materials and inorganic materials, etc. For example, in optical applications or matte applications, silicon oxide fillers, titanium oxide fillers, styrene fillers, acrylic fillers, melamine fillers, or various titanium salts, etc. can be used. In the use of capacitor films, titanium oxide, magnesium titanate, zinc titanate, bismuth titanate, titanium oxide, calcium titanate, strontium titanate, barium titanate, barium zirconate titanate, lead zirconate titanate, and mixtures thereof can be used. In the use as an adhesive, it can contain polymer rubber particles, polysilicone rubber particles, etc. In the use of electronic parts installation, the filler can have both conductivity and insulation. In the case where the filler has insulation, for example, the filler can be used as a spacer.

填料之粒徑可根據將積層膜30切開所獲得之帶之用途而決定。例如,於將該帶使用於電子零件之安裝之情形時,填料之粒徑較佳為1 µm以上,更佳為2.5 µm以上30 µm以下。 此處,粒徑係指平均粒徑。平均粒徑可根據積層膜30之黏著層32之平面圖像或剖面圖像求出。又,作為使積層膜30之黏著層32含有填料之前之原料粒子的填料之平均粒徑可使用濕式流式粒徑、形狀分析裝置FPIA-3000(Malvern Instruments Ltd)求出。N數為1000以上,較佳為2000以上,更佳為5000以上。另一方面,亦可於填料中包含粒徑未達1 μm者。作為粒徑未達1 μm之填料(所謂奈米填料),可列舉黏度調整用之填充劑等。該大小可藉由電子顯微鏡(TEM、SEM)之觀察而求出。N數較佳為200以上。The particle size of the filler can be determined according to the purpose of the tape obtained by cutting the laminated film 30. For example, when the tape is used for mounting electronic components, the particle size of the filler is preferably 1 µm or more, and more preferably 2.5 µm or more and 30 µm or less. Here, the particle size refers to the average particle size. The average particle size can be obtained based on the planar image or cross-sectional image of the adhesive layer 32 of the laminated film 30. In addition, the average particle size of the filler as the raw material particles before the adhesive layer 32 of the laminated film 30 contains the filler can be obtained using the wet flow particle size and shape analysis device FPIA-3000 (Malvern Instruments Ltd). The number N is 1000 or more, preferably 2000 or more, and more preferably 5000 or more. On the other hand, fillers with a particle size of less than 1 μm may also be included. Fillers with a particle size of less than 1 μm (so-called nanofillers) include fillers for viscosity adjustment, etc. The size can be determined by observation with an electron microscope (TEM, SEM). The number N is preferably 200 or more.

作為填料,亦可包含如量子點般具有功能性者。此種填料之大小並不特別限定,但較佳為2 nm以上,更佳為10 nm以上。該大小亦可藉由電子顯微鏡(TEM、SEM)之觀察而求出。N數較佳為200以上。As fillers, functional ones such as quantum dots may also be included. The size of such fillers is not particularly limited, but is preferably 2 nm or more, more preferably 10 nm or more. The size can also be obtained by observation with an electron microscope (TEM, SEM). The number N is preferably 200 or more.

於本發明中,以下所述之填料只要未特別說明,則係指上述粒徑1 µm以上之填料。即,將用作表面改質劑或填充劑之奈米填料除外。In the present invention, fillers described below refer to fillers with a particle size of 1 µm or more unless otherwise specified, excluding nanofillers used as surface modifiers or fillers.

於黏著層中,填料既可於樹脂中混練而無規則分散,亦可於俯視下各自不接觸,亦可為俯視下重複既定排列之規則配置。填料之個數密度於不影響膜之切開之範圍適當調整,於面視野中,例如可設為30〜100000個/mm2 。該個數密度較佳為於俯視下使用光學顯微鏡或金屬顯微鏡觀察黏著層中之填料,將10處以上之區域設為合計2 mm2 以上,以填料數合計成為200以上之方式計測。In the adhesive layer, the fillers may be mixed in the resin and dispersed irregularly, or may not touch each other when viewed from above, or may be arranged regularly with a predetermined arrangement repeated when viewed from above. The number density of the fillers is appropriately adjusted within a range that does not affect the cutting of the film, and may be set to, for example, 30 to 100,000/ mm2 in the plane view. The number density is preferably measured by observing the fillers in the adhesive layer using an optical microscope or a metal microscope in a top view, setting the total area of more than 10 places to more than 2 mm2 , and measuring the total number of fillers to more than 200.

(形成黏著層之樹脂組成物) 另一方面,形成黏著層32之樹脂組成物根據將積層膜30切開所獲得之帶之用途、填料之有無等而適當選擇顯示出黏著性或接著性者,可由熱塑性樹脂組成物、高黏度黏著性樹脂組成物、或硬化性樹脂組成物等形成。例如,於將帶作為用於電子零件之安裝等之接著材之情形時,與WO2018/074318A1公報中記載之形成絕緣性樹脂層之樹脂組成物同樣地,可將形成黏著層之樹脂組成物設為含有聚合性化合物與聚合起始劑之硬化性樹脂組成物。亦可為不含有硬化性樹脂組成物之所謂熱熔類型之接著材。(Resin composition forming the adhesive layer) On the other hand, the resin composition forming the adhesive layer 32 can be formed of a thermoplastic resin composition, a high-viscosity adhesive resin composition, or a curable resin composition, etc., by appropriately selecting a material showing adhesiveness or bonding according to the purpose of the tape obtained by cutting the laminate film 30, the presence or absence of fillers, etc. For example, when the tape is used as a bonding material for mounting electronic parts, the resin composition forming the adhesive layer can be set to a curable resin composition containing a polymerizable compound and a polymerization initiator, similar to the resin composition forming the insulating resin layer described in WO2018/074318A1. It can also be a so-called hot melt adhesive material that does not contain a hardening resin composition.

作為硬化性樹脂組成物之聚合起始劑,可使用熱聚合起始劑,亦可使用光聚合起始劑,亦可將其等一併使用。例如,作為熱聚合起始劑使用熱陽離子系聚合起始劑,作為熱聚合性化合物使用環氧樹脂,作為光聚合起始劑使用光自由基聚合起始劑,作為光聚合性化合物使用丙烯酸酯化合物。作為熱聚合起始劑,亦可使用熱陰離子系聚合起始劑。作為熱陰離子系聚合起始劑,較佳為使用將咪唑改質體設為核且將其表面利用聚胺酯(poly urethane)被覆而成之微膠囊型潛在性硬化劑。As the polymerization initiator of the curable resin composition, a thermal polymerization initiator or a photopolymerization initiator may be used, or both of them may be used. For example, a thermal cationic polymerization initiator may be used as the thermal polymerization initiator, an epoxy resin may be used as the thermal polymerizable compound, a photoradical polymerization initiator may be used as the photopolymerizable compound, and an acrylate compound may be used as the photopolymerizable compound. As the thermal polymerization initiator, a thermal anionic polymerization initiator may also be used. As the thermal anionic polymerization initiator, it is preferred to use a microcapsule type latent curing agent in which an imidazole modifier is used as the core and its surface is coated with polyurethane.

作為由此種絕緣性樹脂組成物形成之黏著層整體之最低熔融黏度,並無特別限制,但自膜形成之方面而言可設為100 Pa·s以上,為了抑制將黏著層32熱壓接於物品時之填料之無用之流動,較佳為1500 Pa·s以上。另一方面,關於最低熔融黏度之上限,並無特別限制,作為一例,較佳為15000 Pa·s以下,更佳為10000 Pa·s以下。該最低熔融黏度作為一例可使用旋轉式流變儀(TA instrument公司製造),以測定壓力5 g固定地保持,使用直徑8 mm之測定板而求出,更具體而言,可於溫度範圍30〜200℃中,藉由設為升溫速度10℃/分鐘、測定頻率10 Hz、相對於上述測定板之荷重變動5 g而求出。再者,最低熔融黏度之調整可根據作為熔融黏度調整劑含有之微小固形物之種類或摻合量、樹脂組成物之調整條件之變更等而進行。The minimum melt viscosity of the adhesive layer formed by such an insulating resin composition as a whole is not particularly limited, but can be set to 100 Pa·s or more from the perspective of film formation, and preferably 1500 Pa·s or more to suppress the useless flow of the filler when the adhesive layer 32 is hot-pressed to the article. On the other hand, there is no particular restriction on the upper limit of the minimum melt viscosity, but as an example, it is preferably 15000 Pa·s or less, and more preferably 10000 Pa·s or less. The minimum melt viscosity can be obtained, for example, by using a rotational rheometer (manufactured by TA Instruments) with a measuring pressure of 5 g fixedly maintained and a measuring plate of 8 mm in diameter. More specifically, it can be obtained in a temperature range of 30 to 200°C by setting a heating rate of 10°C/min, a measuring frequency of 10 Hz, and a load change of 5 g relative to the above-mentioned measuring plate. Furthermore, the minimum melt viscosity can be adjusted by changing the type or blending amount of the micro-solid contained as the melt viscosity modifier, the adjustment conditions of the resin composition, etc.

(黏著層之黏著力) ·可剝離性 黏著層32相對於基材膜31及覆蓋膜33之黏著力較將黏著層32針對該帶之各用途貼合於既定物品之情形時的黏著層32之黏著力更弱,基材膜31及覆蓋膜33能夠自黏著層32剝離。通常,於將覆蓋膜33剝離之後,將黏著層32貼附於物品而評價基材膜31之可剝離性。所謂基材膜31及覆蓋膜33能夠自黏著層32剝離,如上所述,係指藉由於基材膜31或覆蓋膜33貼玻璃紙膠帶並剝下,或藉由利用鑷子捏著基材膜31或覆蓋膜33之端剝下,可容易地將該等自黏著層32剝離,作為其具體指標,可列舉於將切開前之積層膜切割為寬度5 cm、長度15 cm,進行T型剝離試驗(JIS K 6854)作為剝離試驗之情形時,接著強度為0.005〜0.2 N。亦可根據基材膜31之材質或厚度等,藉由180°剝離試驗或90°剝離試驗而評價。一般而言,使用玻璃紙膠帶自基材膜31與黏著層32將覆蓋膜33先剝下,將黏著層32貼附於物品之後,將基材膜31利用鑷子剝下。(Adhesion of adhesive layer) ·Releasability The adhesion of the adhesive layer 32 to the base film 31 and the cover film 33 is weaker than the adhesion of the adhesive layer 32 when the adhesive layer 32 is attached to a predetermined article for each purpose of the tape, and the base film 31 and the cover film 33 can be peeled off from the adhesive layer 32. Usually, after peeling off the cover film 33, the adhesive layer 32 is attached to an article to evaluate the releasability of the base film 31. The so-called base film 31 and cover film 33 can be peeled off from the self-adhesive layer 32, as mentioned above, means that the self-adhesive layer 32 can be easily peeled off by sticking cellophane tape to the base film 31 or the cover film 33 and peeling it off, or by pinching the end of the base film 31 or the cover film 33 with tweezers and peeling it off. As a specific indicator, when the laminate film before cutting is cut into a width of 5 cm and a length of 15 cm and a T-type peeling test (JIS K 6854) is performed as a peeling test, the strength is 0.005 to 0.2 N. The evaluation can also be performed by a 180° peel test or a 90° peel test according to the material or thickness of the substrate film 31. Generally, the cover film 33 is first peeled off from the substrate film 31 and the adhesive layer 32 using a cellophane tape, and after the adhesive layer 32 is attached to the article, the substrate film 31 is peeled off using tweezers.

·穩定性 另一方面,於將積層膜30切開為帶,利用捲取裝置將帶捲取於捲筒而製成捲裝體時,或於將成為捲裝體之帶用作接著材時將捲裝體安裝於連接裝置自捲裝體拉出帶時,於帶之長度方向對帶施加張力(tension)。因此,於對帶施加此種張力之情形時,較佳為基材膜31與黏著層32不剝離。即,以往,於連接裝置中捲裝體所要求之帶長通常為5 m以上,較佳為10 m以上,自捲裝體拉出帶時於帶之長度方向施加之張力一般為1 N〜5 N左右。進而,於連接裝置之運轉中產生不良情況之情形時,存在捲筒卡住,對帶施加5〜6 N之張力之情形。因此,必須想定對帶施加5 N左右之負載。因此,較佳為,於該張力下維持基材膜與黏著層之貼合狀態或捲筒與基材膜之連接(自捲筒拉出之引線與基材膜之利用矽帶等接著膜之連接、或超音波熔接)。· Stability On the other hand, when the laminate film 30 is cut into strips and the strips are wound onto a reel by a winding device to form a roll body, or when the roll body is used as a bonding material and the roll body is mounted on a connecting device to pull out the strip from the roll body, tension is applied to the strip in the length direction of the strip. Therefore, when such tension is applied to the strip, it is preferred that the base film 31 and the adhesive layer 32 do not peel off. That is, in the past, the strip length required for the roll body in the connecting device was usually more than 5 m, preferably more than 10 m, and the tension applied in the length direction of the strip when the strip was pulled out from the roll body was generally about 1 N to 5 N. Furthermore, when a problem occurs during the operation of the connection device, the reel may get stuck and a tension of 5 to 6 N may be applied to the tape. Therefore, it is necessary to assume that a load of about 5 N is applied to the tape. Therefore, it is preferable to maintain the bonding state between the base film and the adhesive layer or the connection between the reel and the base film (the connection between the lead pulled out from the reel and the base film using a bonding film such as a silicon ribbon or ultrasonic welding) under the tension.

然而,於使帶為窄幅之情形時,若對帶施加先前之張力,則有時會擔心基材膜破斷,或者基材膜與黏著層剝離。因此,於儘量有效地利用既有設備進行窄幅之帶之捲取或拉出之情形時,於帶之長度方向施加之張力只要為0.5 N左右即可,較佳為未達1 N。關於上限,更佳為0.7 N以下,進而較佳為0.3 N以下。However, when the tape is made narrow, if the previous tension is applied to the tape, there is a concern that the base film may break or the base film may be separated from the adhesive layer. Therefore, when the existing equipment is used as effectively as possible to roll or pull out the narrow tape, the tension applied in the longitudinal direction of the tape only needs to be about 0.5 N, preferably less than 1 N. As for the upper limit, it is more preferably 0.7 N or less, and further preferably 0.3 N or less.

就能夠進行此種捲取或拉出之實用上之要求而言,對黏著層32要求穩定性,即,對利用本發明之方法切開為寬度0.1 mm以上0.5 mm以下之積層帶之長度1 m以上、較佳為5 m以上者,於長度方向施加0.5 N以上,較佳為1 N,更佳為5 N之張力之情形時,基材膜31及覆蓋膜33不會自黏著層32剝離。再者,上述可剝離性係與黏著層32相對於基材膜31及覆蓋膜33之黏著力之上限相關的性質,該穩定性係與黏著力之下限相關之性質。In order to be able to roll or pull out in this way, the adhesive layer 32 is required to have stability, that is, when a tension of 0.5 N or more, preferably 1 N, and more preferably 5 N is applied in the longitudinal direction to a laminated tape having a width of 0.1 mm or more and 0.5 mm or less and a length of 1 m or more, preferably 5 m or more, cut by the method of the present invention, the base film 31 and the cover film 33 will not be peeled off from the adhesive layer 32. In addition, the above-mentioned peelability is a property related to the upper limit of the adhesive force of the adhesive layer 32 relative to the base film 31 and the cover film 33, and the stability is a property related to the lower limit of the adhesive force.

穩定性之試驗較佳為簡易地進行。因此,作為試驗方法,可列舉如下之試驗:將積層帶之試驗長度度設為1 m,將裁剪為長度1 m之積層帶之一端固定,對另一端施加0.5 N、較佳為1 N、更佳為5 N之負載,觀察基材膜31與黏著層32有無剝離。又,作為更實用之試驗方法,可列舉如下試驗:自捲裝體將帶拉出1 m以上,對其端部施加0.3 N、0.5 N、1 N、或5 N之負載,觀察有無剝離。又,亦可自捲裝體拉出帶之全長,於任意之20處以上,較佳為50處以上觀察有無剝離。於此種試驗中,作為實用上需要之黏著力之指標之一例,可列舉:(i)將積層膜利用本發明之方法切開為寬度0.1 mm以上0.5 mm以下之積層帶,剝下覆蓋膜而製成黏著層與基材膜之帶之捲裝體,自捲裝體將帶拉出長度1 m並將捲筒之卷芯與帶之連接位置固定,藉由向帶端部之靜態負載之負載而將0.3 N,較佳為0.5 N,更佳為1 N,進而較佳為5 N之張力以連接位置角α(日本特開2017-137188號公報)為90°施加之情形時,基材膜不自黏著層剝離,又,不產生影響拉出之程度之露出;(ii)自利用本發明之方法將積層膜切開為寬度0.1 mm以上0.5 mm以下之積層帶任意切取試驗長度1 m之試驗片,於該試驗片中,當在該試驗片之長度方向施加0.5 N、較佳為1 N、更佳為5 N之張力之情形時,基材膜31不會自黏著層32剝離;(iii)將黏著層與基材膜之帶以0.5 N於卷芯捲繞5 m以上而製成捲裝體,自該捲裝體用手將帶全部拉出之情形時,遍及帶之全長未目視確認到黏著層與基材膜之剝離(詳細情況於下述實施例中記載)。自簡易地進行試驗之方面而言較佳為(iii)之方法。亦可於裁剪為試驗長度1 m左右,用手對兩端施加負載(大致1 N〜5 N左右)之情形時,確認基材膜與黏著層未產生剝離。The stability test is preferably simple to perform. Therefore, as a test method, the following test can be listed: the test length of the laminated tape is set to 1 m, one end of the laminated tape cut to a length of 1 m is fixed, and a load of 0.5 N, preferably 1 N, and more preferably 5 N is applied to the other end to observe whether the base film 31 and the adhesive layer 32 are peeled off. In addition, as a more practical test method, the following test can be listed: the tape is pulled out from the roll body for more than 1 m, and a load of 0.3 N, 0.5 N, 1 N, or 5 N is applied to its end to observe whether it is peeled off. Alternatively, the entire length of the tape may be pulled out from the roll body, and the presence or absence of peeling may be observed at any 20 or more locations, preferably at least 50 locations. In this test, as an example of an indicator of the adhesive force required for practical use, the following may be cited: (i) a laminate film is cut into laminate tapes having a width of 0.1 mm to 0.5 mm using the method of the present invention, the covering film is peeled off to form a roll body of the tape of the adhesive layer and the base film, the tape is pulled out from the roll body to a length of 1 m, and the connection position between the core of the roll and the tape is fixed, and a static load is applied to the end of the tape to increase the load to 0.3 N, preferably 0.5 N, more preferably 1 N, and further preferably 5 N. (i) when a tensile force of 0.5 N is applied at a connection position angle α (Japanese Patent Publication No. 2017-137188) of 90°, the base film does not peel off from the adhesive layer, and no exposure that affects the pull-out is produced; (ii) a test piece of 1 m in test length is randomly cut from a laminated film cut into a laminated tape with a width of 0.1 mm or more and 0.5 mm or less by the method of the present invention, and in the test piece, when a tensile force of 0.5 N, preferably 1 N, and more preferably 5 N is applied in the length direction of the test piece, the base film 31 does not peel off from the adhesive layer 32; (iii) the adhesive layer and the base film tape are wound around a core for 5 minutes at a tension of 0.5 N. m or more to form a roll body, and when the tape is pulled out from the roll body by hand, no peeling of the adhesive layer and the base film is visually confirmed over the entire length of the tape (details are described in the following examples). From the perspective of ease of testing, method (iii) is preferred. It is also possible to cut the tape into a test length of about 1 m and apply a load (approximately 1 N to 5 N) to both ends by hand to confirm that no peeling of the base film and the adhesive layer occurs.

若積層帶具有上述黏著力,則於將該積層帶捲繞成較佳為長度5 m以上、10 m以上、50 m以上、進而長度100 m以上之捲裝體,自該捲裝體將帶拉出較佳為1 m以上、更佳為5 m以上之情形時,拉出之帶中亦不會產生基材膜31自黏著層32之剝離,從而可將該帶提供給電子零件之安裝。If the laminated tape has the above-mentioned adhesion, when the laminated tape is wound into a roll-up body preferably having a length of more than 5 m, more than 10 m, more than 50 m, or further more than 100 m, and the tape is pulled out from the roll-up body preferably to a length of more than 1 m, more preferably to a length of more than 5 m, the base film 31 will not be peeled off from the adhesive layer 32 in the pulled-out tape, so that the tape can be provided for the installation of electronic components.

·對連接對象物之黏著力 另一方面,自對電子零件、基板等連接對象物之黏著力之觀點而言,作為黏著層被要求之黏著力之試驗方法,可列舉如下方法:將自積層帶任意採取之長度2 cm之小片(亦可為將上述(ii)之1 m之積層帶之試驗片裁剪而成的小片)自黏著層側暫時貼附於毛坯玻璃(blank glass)(例如以45℃貼附),進行利用鑷子僅捏著基材膜31(或覆蓋膜33)之端進行去除之剝離試驗,將「於該剝離試驗中可僅將基材膜31(或覆蓋膜33)去除,且黏著層能夠保持形狀不變地貼合於毛坯玻璃」之狀態設為成功。於該剝離試驗中,較佳為N數為20以上且75%以上之成功,更佳為80%以上之成功,進而較佳為90%以上之成功。· Adhesion to the object to be connected On the other hand, from the perspective of adhesion to the object to be connected such as electronic parts and substrates, the following method can be listed as a test method for the adhesion required of the adhesive layer: a small piece of 2 cm in length randomly taken from the laminated tape (or a small piece cut from the 1 m laminated tape test piece in (ii) above) is temporarily attached from the adhesive layer side to the blank glass (blank glass). glass) (for example, attached at 45°C), a peeling test is performed by pinching only the end of the base film 31 (or the cover film 33) with a tweezer to remove it, and the state of "only the base film 31 (or the cover film 33) can be removed in the peeling test, and the adhesive layer can be attached to the blank glass without changing its shape" is regarded as successful. In the peeling test, preferably, the number N is 20 or more and the success rate is 75% or more, more preferably, the success rate is 80% or more, and even more preferably, the success rate is 90% or more.

(連接帶之貼合) 為了於積層膜30安裝捲裝體之開始捲繞或捲出時之引線,或者為了將第1積層膜與第2積層膜貼合而長條化,亦可於積層膜30貼合連接帶。連接部位可規則或無規則地設為複數處。又,於積層膜與引線之安裝中,可將積層膜30之基材膜31與引線利用連接帶連接。積層膜安裝於引線亦可為超音波熔接等公知之方法。(Attachment of connecting tape) In order to attach the lead wire at the beginning of winding or unwinding of the package body to the laminate film 30, or to attach the first laminate film to the second laminate film and lengthen it, a connecting tape may be attached to the laminate film 30. The connection parts may be set regularly or irregularly at multiple locations. In addition, in attaching the laminate film to the lead wire, the base film 31 of the laminate film 30 and the lead wire may be connected by a connecting tape. The laminate film may be attached to the lead wire by a known method such as ultrasonic welding.

作為連接帶,可使用剝離性較高、總厚度相對較薄之附基材之黏著帶(例如,矽帶)。連接帶之厚度並無特別限制,作為一例可列舉5〜75 μm。As the connecting tape, an adhesive tape with a relatively thin total thickness and a high releasability can be used (for example, a silicon tape). The thickness of the connecting tape is not particularly limited, and as an example, it can be 5 to 75 μm.

於將在積層膜30貼合有連接帶之部分切開時,如圖5所示,切開刀11較深地進入至積層膜30及連接帶35之積層體。因此,根據以往之切開裝置,切開刀11之侵入側之積層體之面中,鄰接之刀彼此之間隔明顯變窄,相對於其相反側之面,自切開刀11之側面受到較強之壓縮力F,覆蓋膜33或基材膜31與黏著層32剝離,或者黏著層32容易自切開之積層體之側面露出。相對於此,根據本發明,即便於積層膜30貼合有連接帶35,亦可抑制產生此種剝離或露出。When the portion of the laminate film 30 to which the connecting tape is attached is cut, as shown in FIG5 , the cutting blade 11 penetrates deeper into the laminate body of the laminate film 30 and the connecting tape 35. Therefore, according to the conventional cutting device, the interval between adjacent blades becomes significantly narrower on the surface of the laminate body on the side where the cutting blade 11 penetrates, and a stronger compressive force F is applied from the side of the cutting blade 11 relative to the surface on the opposite side, so that the covering film 33 or the base film 31 is peeled off from the adhesive layer 32, or the adhesive layer 32 is easily exposed from the side of the laminate body to be cut. In contrast, according to the present invention, even when the laminate film 30 is bonded with the connecting tape 35, such peeling or exposure can be suppressed.

<積層帶> 本發明之積層帶係利用上述切開方法將積層膜30切開所獲得之帶。因此,該帶係於基材膜以可剝離方式積層有黏著層之積層帶,帶寬之上限為0.5 mm以下,尤其未達0.5 mm,更佳為0.4 mm以下,進而更佳為0.3 mm以下。下限為0.1 mm以上,較佳為0.15 mm以上,更佳為0.2 mm以上。<Laminated tape> The laminated tape of the present invention is a tape obtained by cutting the laminated film 30 using the above-mentioned cutting method. Therefore, the tape is a laminated tape in which an adhesive layer is releasably laminated on a base film, and the upper limit of the tape width is 0.5 mm or less, especially less than 0.5 mm, preferably 0.4 mm or less, and further preferably 0.3 mm or less. The lower limit is 0.1 mm or more, preferably 0.15 mm or more, and more preferably 0.2 mm or more.

該積層帶具有如下特徵:於以自該帶任意切取之試驗長度為1 m之方式將試驗片之一端固定,對另一端施加0.3 N、0.5 N或1 N之張力之情形時,基材膜與黏著層不剝離,又,於捲裝體中黏著層32不露出。又,該積層帶於將該帶切為長度2 cm之小片並將黏著層32貼附於毛坯玻璃,利用鑷子僅捏著基材膜31之端而去除之情形時,滿足黏著層不易自毛坯玻璃剝離之實用上之要求,能夠實現所謂之貼合或轉接著。The laminated tape has the following characteristics: when one end of a test piece cut from the tape is fixed in a manner of a test length of 1 m, and a tension of 0.3 N, 0.5 N or 1 N is applied to the other end, the base film and the adhesive layer are not separated, and the adhesive layer 32 is not exposed in the roll body. In addition, when the laminated tape is cut into small pieces of 2 cm in length and the adhesive layer 32 is attached to the blank glass, and removed by pinching only the end of the base film 31 with tweezers, the practical requirement that the adhesive layer is not easily separated from the blank glass is met, and the so-called bonding or transfer can be realized.

自操作性之方面而言,較佳為製成將該帶捲繞於捲筒之捲裝體。捲裝體中之帶長自實用上之方面而言較佳為5 m以上5000 m以下,更佳為50 m以上1000 m以下,進而較佳為500 m以下。一般而言,若帶寬為窄幅則於捲裝體中容易產生黏連,但根據本發明之積層帶,捲裝體不易產生黏連,即便自捲裝體將帶拉出5 m以上,所拉出之帶亦不會於基材膜31或覆蓋膜33與黏著層32之間產生剝離。From the perspective of operability, it is preferred to make a package in which the tape is wound around a reel. From the perspective of practicality, the tape length in the package is preferably 5 m to 5000 m, more preferably 50 m to 1000 m, and further preferably 500 m to 500 m. Generally speaking, if the tape width is narrow, it is easy to cause adhesion in the package, but according to the laminated tape of the present invention, the package is not easy to cause adhesion, and even if the tape is pulled out of the package for more than 5 m, the pulled out tape will not be separated between the base film 31 or the cover film 33 and the adhesive layer 32.

再者,一般而言,存在如下情形:於將積層膜切開所獲得之積層帶的成為切開之切口之端部,目視時產生隆起(變色部分)。若帶寬為0.5 mm以下之窄幅,則積層帶之兩端之隆起可能會導致基材膜與黏著層產生無用之剝離。然而,根據本發明,由於利用尖銳之兩刀將積層膜切開,故而即便利用目視觀察調查形成捲裝體之帶全長中任意20處以上、較佳為50處以上有無隆起,亦不易觀察到隆起。即便於沿著積層帶之切開之切口之端部觀察到隆起之情形時,隆起長度亦未達5 cm,寬度相對於帶寬為40%以下,尤其1/3以下,可抑制基材膜與黏著層之剝離。Furthermore, generally speaking, there is a situation where the ends of the laminated tape obtained by cutting the laminated film are visually bulged (discolored portions). If the tape width is a narrow width of 0.5 mm or less, the bulges at both ends of the laminated tape may cause unnecessary peeling of the base film and the adhesive layer. However, according to the present invention, since the laminated film is cut by two sharp knives, even if the presence or absence of bulges is checked by visual observation at any 20 or more locations, preferably at least 50 locations, in the entire length of the tape forming the roll body, it is difficult to observe the bulges. Even when a bulge is observed along the end of the cut of the laminated tape, the bulge length does not reach 5 cm, and the width is less than 40% of the tape width, especially less than 1/3, which can suppress the peeling of the base film and the adhesive layer.

如此,根據本發明之積層帶,由於基材膜與黏著層不易偏移,不易產生黏連或隆起,故而捲裝體之捲取、拉出之作業性良好,於將自捲裝體拉出並切取之帶貼附於對象構件時,貼附位置不易產生偏移。因此,本發明之積層帶作為窄幅之黏著材或接著材可使用於各種用途。於該情形時,構成黏著層32之樹脂組成物之種類等根據貼附帶之對象構件而適當選擇。 實施例Thus, according to the laminated tape of the present invention, since the base film and the adhesive layer are not easily offset, and it is not easy to produce adhesion or bulge, the workability of rolling and pulling out the roll body is good, and when the tape pulled out and cut from the roll body is attached to the target component, the attachment position is not easy to be offset. Therefore, the laminated tape of the present invention can be used for various purposes as a narrow-width adhesive or bonding material. In this case, the type of resin composition constituting the adhesive layer 32 is appropriately selected according to the target component to which the tape is attached. Example

實施例1 將基材膜由厚度38 μm之經剝離處理之PET膜形成、黏著層由厚度10 μm之丙烯酸系熱硬化性樹脂(接著性膜,Dexerials製造)形成、覆蓋膜由厚度12 μm之PET膜形成之積層膜,使用圖2所示之切削刀,1次切開為寬度0.3 mm、長度100 m之帶,剝下覆蓋膜,對基材膜與黏著層於90 mm之帶凸緣之卷芯(凸緣間距離0.4 mm)施加張力(捲取張力)0.3〜0.6 N並捲取,藉此製成捲裝體,進行以下之評價。Example 1 A laminated film was prepared by cutting a substrate film made of a 38 μm thick PET film subjected to peeling treatment, a bonding layer made of a 10 μm thick acrylic thermosetting resin (adhesive film, manufactured by Dexerials), and a covering film made of a 12 μm thick PET film. The cutting blade shown in FIG. 2 was used to cut the film into strips of 0.3 mm in width and 100 m in length. The covering film was then peeled off and the substrate film and the bonding layer were aligned at 100 μm. A 90 mm flanged core (flange spacing 0.4 mm) was rolled up with a tension (winding tension) of 0.3 to 0.6 N applied to it to produce a roll body, which was then evaluated as follows.

(1)隆起 將成為捲裝體之100 m之帶用手全部拉出,目視觀察所拉出之帶之任意位置之長度10 cm之試驗區域20處,基於與有無隆起相關之以下項目a、b、c,以如下基準進行評價。(1) Bumping Pull out the entire 100 m tape in a roll by hand, and visually inspect 20 test areas of 10 cm in length at random locations on the pulled tape. Evaluate the following criteria based on the following items a, b, and c regarding the presence or absence of bumping.

a:無長度5 cm以上之隆起 b:無寬度超過帶寬之1/3之隆起 c:長度未達5 cm之隆起或寬度為帶寬之1/3以下之隆起之存在部位為5處以下 評價A:滿足所有abc之情形時 評價B:同時滿足ab之情形時 評價C:上述評價A及評價B以外a: No bulges longer than 5 cm b: No bulges wider than 1/3 of the band width c: No bulges shorter than 5 cm or bulges less than 1/3 of the band width in 5 or fewer locations Evaluation A: When all conditions abc are met Evaluation B: When conditions ab are met at the same time Evaluation C: Other than the above evaluations A and B

該評價結果係評價A。再者,實用上只要滿足評價B則無問題,較佳為進而滿足c。The evaluation result is evaluation A. Furthermore, in practice, there is no problem as long as evaluation B is satisfied, and it is better to satisfy evaluation C.

(2)剝離 於上述試驗中,確認進行隆起之目視觀察之部位與除此以外之30處之合計50處未產生剝離。於試驗中一面將全長拉出一面進行目視觀察,大致無剝離。 又,不會產生妨礙作業性之黏著層之露出,亦未確認到黏著層附著於凸緣。(2) Peeling In the above test, it was confirmed that no peeling occurred in the 50 places where the bulge was visually observed and 30 other places. In the test, the entire length was pulled out and visually observed, and there was basically no peeling. In addition, there was no exposure of the adhesive layer that would hinder workability, and no adhesion of the adhesive layer to the ridge was confirmed.

再者,上述(1)、(2)之結果並不限定於利用切削刀之切開。Furthermore, the results of (1) and (2) above are not limited to cutting with a cutting knife.

1:切開裝置 2:膜捲出裝置 3:膜 4:承載膜 5:承載膜捲出裝置 6:層壓輥 10:帶刀輥 11:切開刀、圓刀 12:輥 13:區域 14:大徑部分 15:軸承 16:齒輪 17:導件 18:調整螺絲 19:螺栓 20:砧輥 25:軸承 26:齒輪 30:積層膜 31:基材膜 32:黏著層 33:覆蓋膜 35:連接帶 α:切開刀之刀角 d1:切開刀之刀尖與砧輥之間隙 d2:切開刀之向承載膜之切入量 F:壓縮力 h:切開刀之刀高 L1,L2:旋轉軸 p:切開刀之間距1: Cutting device 2: Film unwinding device 3: Film 4: Supporting film 5: Supporting film unwinding device 6: Laminating roller 10: Roller with knife 11: Cutting knife, circular knife 12: Roller 13: Area 14: Large diameter part 15: Bearing 16: Gear 17: Guide 18: Adjusting screw 19: Bolt 20: Anvil roller 25: Bearing 26: Gear 30: Laminated film 31: Base film 32: Adhesive layer 33: Cover film 35: Connector α: Cutting knife angle d1: Gap between cutting knife tip and anvil roller d2: Cutting knife penetration into carrier film F: Compression force h: Cutting knife height L1, L2: Rotating axis p: Cutting knife spacing

[圖1]係實施例之切開裝置之概略斜視圖。 [圖2]係將積層膜切開之切開裝置之切開刀(切削刀)之排列區域附近之側視圖。 [圖3A]係表示實施例之裝置之帶刀輥與砧輥之安裝構造的剖面圖。 [圖3B]係表示帶刀輥與砧輥之安裝構造之變形態樣的剖面圖。 [圖3C]係表示帶刀輥與砧輥之安裝構造之變形態樣的剖面圖。 [圖4]係利用實施例之裝置之切開刀將積層膜切開時之切開刀部分之放大剖面圖。 [圖5]係將利用連接帶將積層膜彼此於長邊方向黏接成之積層膜切開時之切開刀部分之放大剖面圖。 [圖6]係利用刀角70°之切開刀將積層膜切開時之切開刀部分之放大剖面圖。[Figure 1] is a schematic oblique view of the cutting device of the embodiment. [Figure 2] is a side view of the vicinity of the arrangement area of the cutting blade (cutting blade) of the cutting device for cutting a laminated film. [Figure 3A] is a cross-sectional view showing the mounting structure of the knife roller and the anvil roller of the device of the embodiment. [Figure 3B] is a cross-sectional view showing a modified form of the mounting structure of the knife roller and the anvil roller. [Figure 3C] is a cross-sectional view showing a modified form of the mounting structure of the knife roller and the anvil roller. [Figure 4] is an enlarged cross-sectional view of the cutting blade portion when the cutting blade of the device of the embodiment is used to cut the laminated film. [Figure 5] is an enlarged cross-sectional view of the cutting knife portion when cutting a laminated film bonded to each other in the long-side direction using a connecting tape. [Figure 6] is an enlarged cross-sectional view of the cutting knife portion when cutting a laminated film using a cutting knife with a blade angle of 70°.

3:膜 3: Membrane

4:承載膜 4: Carrier film

10:帶刀輥 10: With knife roller

11:切開刀、圓刀 11: Cutting knife, round knife

20:砧輥 20: Anvil Roller

30:積層膜 30: Laminated film

31:基材膜 31: Base film

32:黏著層 32: Adhesive layer

33:覆蓋膜 33: Covering film

α:切開刀之刀角 α: The angle of the cutting knife

F:壓縮力 F: Compression force

p:切開刀之間距 p: Distance between cutting knives

Claims (25)

一種切開裝置,其具備以既定間距設置有複數條圓盤狀之切開刀之帶刀輥與砧輥,且將膜利用縱切(score cut)方式切開,作為所要切開之膜的搬送機構設置有膜捲出裝置與捲取裝置,該切開裝置具有使承載膜介置於所要切開之膜與砧輥之間之承載膜搬送機構,該利用縱切方式切開之膜係於基材膜以可剝離方式積層有黏著層之積層膜,切開刀之刀角為30°以下,切開刀之間距為0.5mm以下。 A cutting device is provided with a knife roller and an anvil roller on which a plurality of disc-shaped cutting knives are arranged at a predetermined interval, and the film is cut by a score cut method. A film unwinding device and a film taking-up device are provided as a conveying mechanism for the film to be cut. The cutting device has a carrier film conveying mechanism for placing a carrier film between the film to be cut and the anvil roller. The film to be cut by the score cut method is a laminated film in which an adhesive layer is laminated on a base film in a releasable manner. The knife angle of the cutting knife is less than 30°, and the distance between the cutting knives is less than 0.5 mm. 如請求項1之切開裝置,其中,切開刀之刀角為10°以上。 As in claim 1, the cutting device, wherein the cutting knife has a blade angle of more than 10°. 如請求項1或2之切開裝置,其中,切開刀之間距為0.1mm以上0.4mm以下。 For example, the cutting device of claim 1 or 2, wherein the distance between the cutting blades is greater than 0.1 mm and less than 0.4 mm. 如請求項1或2之切開裝置,其中,切開刀之刀高為0.05mm以上0.8mm以下。 For example, the cutting device of claim 1 or 2, wherein the cutting blade height is greater than 0.05 mm and less than 0.8 mm. 如請求項1或2之切開裝置,其具有使帶刀輥之安裝位置相對於砧輥移動之調整機構。 A cutting device as claimed in claim 1 or 2, which has an adjustment mechanism for moving the mounting position of the knife roller relative to the anvil roller. 如請求項1或2之切開裝置,其中,構成切開對象即積層膜之基材膜之層厚為12~75μm,黏著層之層厚為5~40μm。 The cutting device of claim 1 or 2, wherein the thickness of the substrate film constituting the laminated film to be cut is 12 to 75 μm, and the thickness of the adhesive layer is 5 to 40 μm. 如請求項1之切開裝置,其中,於切開對象即積層膜之切開時,基材膜與黏著層以不會分離之方式構成。 As in claim 1, the cutting device, wherein when the cutting object, i.e. the laminated film, is cut, the base film and the adhesive layer are constructed in a manner that they will not separate. 如請求項1之切開裝置,其中,構成切開對象即積層膜之黏著層於將切開前之積層膜切割為寬度5cm、長度15cm,進行T型剝離試驗(JIS K 6854)作為剝離試驗之情形時,接著強度顯示出0.005~0.2N之黏著力,對切開為寬度 0.1mm以上0.5mm以下且長度1m之積層膜,於長度方向施加1N之張力之情形時,顯示出不會自基材膜剝離之黏著力。 For example, in the cutting device of claim 1, the adhesive layer constituting the laminated film to be cut, when the laminated film before cutting is cut into a width of 5 cm and a length of 15 cm, and a T-type peeling test (JIS K 6854) is performed as a peeling test, the strength then shows an adhesive force of 0.005~0.2N, and when a tension of 1N is applied in the longitudinal direction to the laminated film cut into a width of more than 0.1mm and less than 0.5mm and a length of 1m, it shows an adhesive force that does not peel off from the base film. 一種切開方法,其係如下縱切方式之切開方法:於以既定間距設置有複數條圓盤狀之切開刀之帶刀輥與砧輥之間,使於基材膜以可剝離方式積層有黏著層之積層膜與承載膜以積層膜位於帶刀輥側之方式重疊通過,將積層膜切開;且積層膜係藉由膜捲出裝置與捲取裝置來搬送,將切開刀之刀角設為30°以下,將切開刀之間距設為0.5mm以下。 A cutting method is a longitudinal cutting method as follows: between a knife roller and an anvil roller provided with a plurality of disc-shaped cutting knives at a predetermined interval, a laminated film having an adhesive layer laminated on a substrate film in a releasable manner and a carrier film are overlapped and passed in a manner such that the laminated film is located on the side of the knife roller, and the laminated film is cut; and the laminated film is transported by a film unwinding device and a winding device, and the knife angle of the cutting knife is set to less than 30°, and the distance between the cutting knives is set to less than 0.5 mm. 如請求項9之切開方法,其中,將積層膜切開成長度5m以上之積層帶。 As in claim 9, the cutting method, wherein the laminated film is cut into laminated strips with a length of more than 5 m. 如請求項9或10之切開方法,其中,將切開刀之刀角設為10°以上。 In the cutting method of claim 9 or 10, the cutting knife angle is set to be greater than 10°. 如請求項9或10之切開方法,其中,將切開刀之間距設為0.1mm以上0.4mm以下。 As in the cutting method of claim 9 or 10, the distance between the cutting blades is set to be greater than 0.1 mm and less than 0.4 mm. 如請求項9或10之切開方法,其中,積層膜係將覆蓋膜以可剝離方式積層於黏著層而成者。 The cutting method of claim 9 or 10, wherein the laminated film is formed by laminating the covering film on the adhesive layer in a releasable manner. 如請求項9或10之切開方法,其中,於積層膜貼合有連接帶。 The cutting method of claim 9 or 10, wherein a connecting tape is attached to the laminate film. 如請求項9或10之切開方法,其中,構成切開對象即積層膜之基材膜之層厚為12~75μm,黏著層之層厚為5~40μm。 In the cutting method of claim 9 or 10, the thickness of the substrate film constituting the laminated film to be cut is 12 to 75 μm, and the thickness of the adhesive layer is 5 to 40 μm. 如請求項9之切開方法,其中,於切開對象即積層膜之切開時,基材膜與黏著層以不會分離之方式構成。 As in claim 9, the cutting method, wherein when the cutting object, i.e., the laminated film, is cut, the base film and the adhesive layer are constructed in a manner that will not separate. 如請求項9之切開方法,其中,構成切開對象即積層膜之黏著層於將切開前之積層膜切割為寬度5cm、長度15cm,進行T型剝離試驗(JIS K 6854)作為剝離試驗之情形時,接著強度顯示出0.005~0.2N之黏著力,對切開為寬度0.1mm以上0.5mm以下且長度1m之積層膜,於長度方向施加1N之張力之情形時,顯示出不會自基材膜剝離之黏著力。 For example, in the cutting method of claim 9, the adhesive layer constituting the laminated film to be cut, when the laminated film before cutting is cut into a width of 5 cm and a length of 15 cm, and a T-type peeling test (JIS K 6854) is performed as a peeling test, the strength then shows an adhesive force of 0.005~0.2N, and when a tension of 1N is applied in the longitudinal direction to the laminated film cut into a width of 0.1mm to 0.5mm and a length of 1m, it shows an adhesive force that does not peel off from the base film. 一種積層帶,其係將於基材膜以可剝離方式積層有黏著層之積層膜利用請求項9至14中任一項之切開方法切開而獲得。 A laminated tape obtained by cutting a laminated film in which an adhesive layer is releasably laminated on a substrate film using a cutting method according to any one of claims 9 to 14. 如請求項18之積層帶,其係將積層膜切開成長度5m以上而獲得。 For example, the laminated tape in claim 18 is obtained by cutting the laminated film into pieces with a length of more than 5m. 一種藉由請求項1至8中任一項之切開裝置而製造之積層帶,其係於基材膜以可剝離方式積層有黏著層之積層帶,且帶寬為0.5mm以下,於將自上述積層帶任意切取之長度1m之積層帶之一端固定,對另一端施加1N之張力之情形時,基材膜與黏著層不剝離。 A laminated tape manufactured by a cutting device according to any one of claims 1 to 8, wherein an adhesive layer is laminated on a base film in a removable manner, and the tape width is less than 0.5 mm. When one end of a 1 m long laminated tape cut arbitrarily from the laminated tape is fixed and a tension of 1 N is applied to the other end, the base film and the adhesive layer are not peeled off. 如請求項20之積層帶,其長度為5m以上。 For example, the length of the layered belt in claim 20 is more than 5m. 如請求項20或21之積層帶,其帶寬為0.1mm以上0.4mm以下。 For the laminated tape in claim 20 or 21, the tape width is between 0.1mm and 0.4mm. 如請求項20或21之積層帶,其中,覆蓋膜以可剝離方式積層於黏著層。 A laminated tape as claimed in claim 20 or 21, wherein the cover film is laminated on the adhesive layer in a releasable manner. 如請求項20或21之積層帶,其貼合有連接帶。 For the laminated tape of claim 20 or 21, it is attached with a connecting tape. 如請求項18至21中任一項之積層帶,其中,基材膜之層厚為12~75μm,黏著層之層厚為5~40μm。The laminated tape of any one of claims 18 to 21, wherein the thickness of the substrate film is 12 to 75 μm, and the thickness of the adhesive layer is 5 to 40 μm.
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