TWI863775B - Bonding method of electronic device and method of mass transferring electronic devices - Google Patents

Abstract

The invention discloses a bonding method of electronic device, comprising the steps of: providing a first substrate having a first top surface and a first bottom surface opposite to each other, and the first top surface having a plurality of spaced electronic devices formed thereon and aligned as a column or a row; providing a second substrate below the first substrate, wherein the second substrate has a second top surface and a second bottom surface opposite to each other, and the first top surface faces the second top surface; and providing a laser device to generate a linear laser to make the electronic devices be emitted by the linear laser and be lifted from the first top surface of the first substrate and bonded on the second top surface of the second substrate thereafter.

Description

Method for bonding electronic components and method for mass transferring electronic components

The present invention discloses a method for bonding electronic components and a method for mass transferring electronic components.

LEDs have the advantages of active luminescence, high brightness, and energy saving, so they have been widely used in technical fields such as lighting, displays, and projectors. Micro LED displays have gradually become a new generation of display technology. However, a FHD (Full High Density) display has 1920 rows x 1080 columns, about 2 million pixels, and each pixel is further divided into three sub-pixels: red, green, and blue. Therefore, a FHD LED display has a total of about 6 million LED dies. To cut and paste these 6 million dies on the substrate of the display panel, the key technology lies in how to accurately transfer a large number of micro-LEDs to the substrate of the display panel and fix them together.

The conventional electronic component bonding method mainly utilizes reflow soldering, whereby electronic components are soldered to a target substrate by heating the solder paste and then reflowing. However, the disadvantages of reflow soldering are that during the reflow process, uneven heating may cause electronic components to drift, too much solder paste may cause electronic components to short-circuit, too little solder paste may cause empty soldering, or too low a reflow temperature may cause cold soldering.

In addition, the known methods for mass transfer of electronic components are mainly electrostatic transfer, magnetic transfer, micro-transfer printing and fluid assembly. However, the transfer rate and yield of these methods for mass transfer of electronic components still need to be further improved.

In view of this, a novel method for bonding electronic components and a method for mass transferring electronic components are eagerly anticipated by the industry.

The present invention discloses a method for bonding electronic components, the steps of which include: providing a first substrate, the first substrate having a first upper surface and a first lower surface opposite to each other, wherein the first upper surface of the first substrate has a plurality of electronic components, the electronic components are spaced from each other and arranged in a row or a line; providing a second substrate, and arranging the second substrate below the first substrate, the second substrate having a second upper surface and a second lower surface opposite to each other, and the first upper surface faces the second upper surface; and providing a laser device, the laser device can emit a linear laser light on the first substrate, and the linear laser light irradiates the electronic components located on the first upper surface of the first substrate and arranged in a row or a line, so that the electronic components are peeled off from the first upper surface of the first substrate and bonded to the second upper surface of the second substrate.

As described above, a method for bonding electronic components, wherein the electronic components are selected from one or more groups consisting of light-emitting diodes, laser diodes and semiconductor components.

In the aforementioned method for bonding electronic components, the semiconductor component is selected from a group consisting of a processor, a memory IC, a micro-component IC, a logic IC, and an analog IC.

In the aforementioned method for bonding electronic components, the second substrate is a semiconductor substrate, a ceramic substrate, a metal substrate, a glass substrate, a printed circuit board, or a flexible printed circuit board.

In the aforementioned electronic component bonding method, the laser device has a laser divergence angle θ, and the length of the linear laser light can be controlled by adjusting the angle of the laser divergence angle θ. The laser divergence angle θ is, for example but not limited to, greater than or equal to one degree.

In the aforementioned method for bonding electronic components, the laser device includes a laser light source and an optical component, and the laser light emitted by the laser light source is converted into a linear laser light by the optical component.

In the aforementioned method for bonding electronic components, the optical component is a diffraction optical component, and/or a refraction optical component, and/or a reflection optical component.

The present invention further discloses a method for mass transfer of electronic components, the steps of which include: providing a first substrate, the first substrate having a first upper surface and a first lower surface opposite to each other, wherein the first upper surface of the first substrate has a plurality of electronic components, and the electronic components are arranged along a first direction and a second direction respectively, forming a first electronic component array formed by M rows of electronic components multiplied by N columns of electronic components, wherein M and N are both natural numbers greater than 1; providing a second substrate, and arranging the second substrate below the first substrate, the second substrate having a second upper surface and a second lower surface opposite to each other, and the first upper surface faces the second upper surface; and providing a laser device, the laser device can emit light on the first substrate. A linear laser light is emitted, and the linear laser light is used to sequentially irradiate the electronic elements in the P-th row or the Q-th column in the first electronic element array, so that the electronic elements in the P-th row or the Q-th column are peeled off from the first upper surface of the first substrate and bonded to the second upper surface of the second substrate. When all the electronic elements in the first electronic element array are peeled off from the first upper surface of the first substrate and bonded to the second upper surface of the second substrate, a second electronic element array formed by arranging M rows of electronic elements by N columns of electronic elements can be formed on the second upper surface of the second substrate, wherein P and Q are natural numbers, and 1≤P≤M, 1≤Q≤N.

A method for mass transfer of electronic components as described above, wherein the electronic components are selected from one or more groups consisting of light emitting diodes, laser diodes and semiconductor components.

A method for mass transfer of electronic components as described above, wherein the semiconductor component is selected from a group consisting of a processor, a memory IC, a micro-component IC, a logic IC and an analog IC.

In the method for mass transferring electronic components as described above, the second substrate is a semiconductor substrate, a ceramic substrate, a metal substrate, a glass substrate, a printed circuit board, or a flexible printed circuit board.

In the method of mass transfer of electronic components as described above, the laser device has a laser divergence angle θ, and the length of the linear laser light can be controlled by adjusting the angle of the laser divergence angle θ. The angle of the laser divergence angle θ is, for example but not limited to, greater than or equal to one degree.

In the method for mass transfer of electronic components as described above, the laser device includes a laser light source and an optical element, and the laser light emitted by the laser light source is converted into a linear laser light by the optical element.

A method for mass transfer of electronic components as described above, wherein the optical component is a diffraction optical component, and/or a refraction optical component, and/or a reflection optical component.

In order to make the description of the disclosure of the present invention more detailed and complete, the following provides an illustrative description of the implementation and specific embodiments of the present invention; however, this is not the only form of implementing or using the specific embodiments of the present invention. The embodiments disclosed below can be combined or replaced with each other under beneficial circumstances, and other embodiments can be added to one embodiment without further recording or description.

In the following description, many specific details will be described in detail to enable the reader to fully understand the following embodiments. However, the embodiments of the present invention can be practiced without these specific details. In other cases, to simplify the drawings, well-known structures and devices are only schematically depicted in the drawings.

Embodiment

Embodiment 1

First, please refer to FIG. 1A. As shown in FIG. 1A, a first substrate 10 is provided. The first substrate 10 has a first upper surface 10A and a first lower surface 10B opposite to each other. The first upper surface 10A of the first substrate 10 has a plurality of electronic components 12, and the electronic components 12 are spaced from each other and arranged in a row or a line. The electronic components 12 are selected from, for example, but not limited to, one or more groups consisting of light-emitting diodes, laser diodes, and semiconductor components, and the semiconductor components are selected from, for example, but not limited to, a group consisting of processors, memory ICs, micro-component ICs, logic ICs, and analog ICs.

Next, please refer to FIG. 1B. As shown in FIG. 1B, a second substrate 20 is provided and disposed below the first substrate 10. The second substrate 20 has a second upper surface 20A and a second lower surface 20B opposite to each other, and the first upper surface 10A faces the second upper surface 20A. The second substrate 20 is, for example but not limited to, a semiconductor substrate, a ceramic substrate, a metal substrate, a glass substrate, a printed circuit board, or a flexible printed circuit board.

Next, please refer to Figure 1C and Figure 1D. As shown in Figure 1C, a laser device 30 is provided, and the laser device 30 can emit a linear laser light 35 on the first substrate 10, and the linear laser light 35 irradiates the electronic components 12 arranged in a row or a line on the first upper surface 10A of the first substrate 10, and the electronic components 12 are peeled off from the first upper surface 10A of the first substrate 10, and bonded to the second upper surface 20A of the second substrate 20 as shown in Figure 1D. The laser device 30 includes a laser light source 31 and an optical element 32, and the laser light emitted by the laser light source 31 is converted into a linear laser light 35 by the optical element 32. The optical element 32 is, for example but not limited to, a diffraction optical element, and/or a refraction optical element, and/or a reflection optical element. In addition, the laser device 30 has a laser divergence angle θ, and the length of the linear laser light 35 can be controlled by adjusting the angle of the laser divergence angle θ. The angle of the laser divergence angle θ is, for example but not limited to, greater than or equal to one degree.

Embodiment 2

First, please refer to FIG. 2A. As shown in FIG. 2A, a first substrate 100 is provided. The first substrate 100 has a first upper surface 100A and a first lower surface 100B opposite to each other. The first upper surface 100A has a plurality of electronic components 120, and the electronic components 120 are arranged along the first direction and the second direction respectively, forming a first electronic component array 150 formed by arranging M rows of electronic components by N columns of electronic components, wherein M and N are both natural numbers greater than 1. The electronic components 120 are selected from, for example, but not limited to, one or more groups consisting of light-emitting diodes, laser diodes, and semiconductor components, and the semiconductor components are selected from, for example, but not limited to, a group consisting of processors, memory ICs, micro-component ICs, logic ICs, and analog ICs.

As shown in FIG. 2A , the first electronic component array 150 of the second embodiment is formed by 8 rows of multiple electronic components 120 arranged along the X-axis direction and 5 columns of multiple electronic components 120 arranged along the Y-axis direction, that is, M=8, N=5, the first direction is the X-axis direction, and the second direction is the Y-axis direction. However, according to other embodiments of the present invention, M and N can also be other natural numbers greater than 1, and the first and second directions can also be changed to other set directions as needed.

Next, please refer to FIG. 2B. As shown in FIG. 2B, a second substrate 200 is provided and disposed below the first substrate 100. The second substrate 200 has a second upper surface 200A and a second lower surface 200B opposite to each other, and the first upper surface 100A faces the second upper surface 200A. The second substrate 200 is, for example but not limited to, a semiconductor substrate, a ceramic substrate, a metal substrate, a glass substrate, a printed circuit board, or a flexible printed circuit board.

Next, please refer to Figures 2C to 2E. As shown in Figures 2C to 2E, a laser device 300 is provided, and the laser device 300 can emit a linear laser light 350 on the first substrate 100, and the linear laser light 350 sequentially irradiates the electronic components of the Pth row or the Qth column 120 in the first electronic component array 150, and the electronic components of the Pth row or the Qth column 120 are peeled off from the first upper surface 100A of the first substrate 100 and bonded to the second upper surface 200A of the second substrate 200, wherein P and Q are natural numbers, and 1≤P≤M, 1≤Q≤N. The laser device 300 includes a laser light source 310 and an optical element 320, and the laser light emitted by the laser light source 310 is converted into a linear laser light 350 by the optical element 320. The optical element 320 is, for example but not limited to, a diffraction optical element, and/or a refraction optical element, and/or a reflection optical element. The laser device 300 has a laser divergence angle θ, and the length of the linear laser light 350 can be controlled by adjusting the angle of the laser divergence angle θ. The angle of the laser divergence angle θ is, for example but not limited to, greater than or equal to one degree.

As shown in FIGS. 2C to 2E , the second embodiment of the present invention is to irradiate the electronic components 120 in the 1st row, the 2nd row, … the 8th row in the first electronic component array 150 in sequence along the X-axis direction with the linear laser light 350, so that the electronic components 120 in the 1st row, the 2nd row, … the 8th row are sequentially peeled off from the first upper surface 100A of the first substrate 100 and bonded to the second upper surface 200A of the second substrate 200, that is, P=1, 2, …, 8. However, according to other embodiments of the present invention, the linear laser light 350 may also selectively irradiate the electronic components 120 in the 1st row, the 2nd row, ... the 5th row in the first electronic component array 150 in sequence along the Y-axis direction, so that the electronic components 120 in the 1st row, the 2nd row, ... the 5th row are sequentially peeled off from the first upper surface 100A of the first substrate 100 and bonded to the second upper surface 200A of the second substrate 200, that is, Q=1, 2, ..., 5.

Finally, please refer to Fig. 2F. As shown in Fig. 2F, after all the electronic components 120 in the first electronic component array 150 are peeled off from the first upper surface 100A of the first substrate 100 and bonded to the second upper surface 200A of the second substrate 200, a second electronic component array 250 formed by arranging 8 rows of electronic components by 5 columns of electronic components can be formed on the second upper surface 200A of the second substrate 200 as shown in Fig. 2F.

Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined in the attached patent application.

10, 100: first substrate

10A, 100A: first upper surface

10B, 100B: first lower surface

12, 120: Electronic components

20, 200: second substrate

20A, 200A: Second upper surface

20B, 200B: second lower surface

30, 300: Laser device

31, 310: Laser light source

32, 320: Optical components

150: first electronic component matrix

250: Second electronic component matrix

θ: Laser divergence angle

1A to 1D illustrate a method for bonding electronic components according to an embodiment of the present invention.

2A-2F are diagrams showing a method for mass transferring electronic components according to another embodiment of the present invention.

10: First substrate

10A: First upper surface

10B: first lower surface

12: Electronic components

20: Second substrate

20A: Second upper surface

20B: Second lower surface

30: Laser device

31: Laser light source

32: Optical components

θ: laser divergence angle

Claims (14)

A method for bonding electronic components, the steps of which include: providing a first substrate, the first substrate having a first upper surface and a first lower surface opposite to each other, wherein the first upper surface of the first substrate has a plurality of electronic components, the electronic components are spaced from each other and arranged in a row or a line; providing a second substrate, and arranging the second substrate below the first substrate, the second substrate having a second upper surface and a second lower surface opposite to each other, and the first upper surface faces the second upper surface; and providing A laser device is provided, the laser device has a laser divergence angle θ, and the laser device can emit a linear laser light on the first substrate, the length of the linear laser light can be controlled by adjusting the angle of the laser divergence angle θ, and the linear laser light irradiates the electronic components arranged in a row or a line on the first upper surface of the first substrate, and the electronic components are peeled off from the first upper surface of the first substrate and bonded to the second upper surface of the second substrate. A method for bonding electronic components as described in claim 1, wherein the electronic components are selected from one or more groups consisting of light-emitting diodes, laser diodes, and semiconductor components. The method for bonding electronic components as described in claim 2, wherein the semiconductor component is selected from a group consisting of a processor, a memory IC, a micro-component IC, a logic IC, and an analog IC. The method for bonding electronic components as described in claim 1, wherein the second substrate is a semiconductor substrate, a ceramic substrate, a metal substrate, a glass substrate, a printed circuit board, or a flexible printed circuit board. The method for bonding electronic components as described in claim 1, wherein the laser divergence angle θ is greater than or equal to one degree. A method for bonding electronic components as described in any one of claims 1 to 5, wherein the laser device includes a laser light source and an optical element, and the laser light emitted by the laser light source is converted into a linear laser light by the optical element. The method for bonding electronic components as described in claim 6, wherein the optical component is a diffraction optical component, and/or a refraction optical component, and/or a reflection optical component. A method for mass transfer of electronic components, the steps of which include: providing a first substrate, the first substrate having a first upper surface and a first lower surface opposite to each other, wherein the first upper surface of the first substrate has a plurality of electronic components, and the electronic components are arranged along a first direction and a second direction respectively, forming a first electronic component array formed by M rows of electronic components multiplied by N columns of electronic components, wherein M and N are both natural numbers greater than 1; providing a second substrate, and arranging the second substrate below the first substrate, the second substrate having a second upper surface and a second lower surface opposite to each other, and the first upper surface faces the second upper surface; and providing a laser device, the laser device having a laser divergence angle θ, and the laser device can emit a linear laser on the first substrate. The length of the linear laser light can be controlled by adjusting the angle of the laser divergence angle θ, and the linear laser light is used to sequentially irradiate the electronic elements in the P-th row or the Q-th column in the first electronic element array, so that the electronic elements in the P-th row or the Q-th column are peeled off from the first upper surface of the first substrate and bonded to the second upper surface of the second substrate. When all the electronic elements in the first electronic element array are peeled off from the first upper surface of the first substrate and bonded to the second upper surface of the second substrate, a second electronic element array formed by arranging M rows of electronic elements by N columns of electronic elements can be formed on the second upper surface of the second substrate, wherein P and Q are natural numbers, and 1

P

M, 1

Q

N. A method for mass transfer of electronic components as described in claim 8, wherein the electronic components are selected from one or more groups consisting of light-emitting diodes, laser diodes and semiconductor components. A method for mass transfer of electronic components as described in claim 9, wherein the semiconductor component is selected from a group consisting of a processor, a memory IC, a micro-component IC, a logic IC, and an analog IC. A method for mass transfer of electronic components as described in claim 8, wherein the second substrate is a semiconductor substrate, a ceramic substrate, a metal substrate, a glass substrate, a printed circuit board, or a flexible printed circuit board. A method for mass transfer of electronic components as described in claim 8, wherein the laser divergence angle θ is greater than or equal to one degree. A method for mass transfer of electronic components as described in any one of claims 8 to 12, wherein the laser device includes a laser light source and an optical element, and the laser light emitted by the laser light source is converted into a linear laser light by the optical element. A method for mass transfer of electronic components as described in claim 13, wherein the optical element is a diffraction optical element, and/or a refractive optical element, and/or a reflective optical element.

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