TWI863634B - Sturcture of good conductor and its manufacturing method - Google Patents

Abstract

The present invention is related to a structure of a good conductor and its manufacturing method. The structure primarily comprises a substrate with a rough surface combining a base layer at the rough surface thereof. A good conductor layer is combined with the base layer and then pressurized, thereby a thin and simple structure of the good conductor is obtained. Since the invention is small and does not occupy much space, it can be applied to various electronic products and offers high thermal conductivity and electrical conductivity. Therefore, it can achieve substantial benefits such as effectively improving the operating performance and prolong the using period of electronic products.

Description

Good conductor structure and manufacturing method thereof

The present invention relates to the technical field of heat-conducting and electrical-conducting components, and in particular to a good conductor structure and its manufacturing method.

According to the development of technology, electronic products are becoming increasingly smaller and more efficient, and the density of electronic components inside them is also increasing. When electronic products are in operation, a large amount of heat energy will be generated, which must be removed in time to avoid overheating and damage to electronic products.

Existing electronic products are equipped with heat conduction and heat dissipation structures to remove the heat generated when the electronic products are in operation. The higher the heat dissipation efficiency, the better the operating performance of the electronic products. Therefore, the heat dissipation efficiency is closely related to the operating performance of the electronic products. The common heat conduction and heat dissipation structures of electronic products on the market include heat sink fins and heat sink paste, etc. However, the heat sink fins and heat sink paste each have their own shortcomings in use. For example, the heat sink fins made of extruded aluminum are large in size and difficult to be used in thin and light electronic products. The heat sink paste will gradually harden after use and must be replaced regularly. In addition, the heat sink fins and heat sink paste only have a heat dissipation effect and lack good conductive properties, so there are still many limitations in terms of use.

Therefore, the inventor of the present invention has found that the heat conduction and heat dissipation structures of existing electronic products still have the above-mentioned deficiencies in their use and implementation. With the assistance of his many years of manufacturing and design experience and knowledge in related fields, and after many ingenuities, he has developed this invention.

The present invention is related to a good conductor structure and its manufacturing method. Its main purpose is to provide a thin good conductor structure that can be used in various electronic products to improve the operating performance of electronic products and its manufacturing method.

In order to achieve the above implementation purpose, the inventors have developed the following method for manufacturing a good conductor structure, which mainly includes preparing a substrate, printing a pattern on at least one side of the substrate at a preset position, forming a rough surface at the pattern, bonding a bottom layer on the rough surface of the substrate, bonding a good conductor layer on the bottom layer of the substrate, the good conductor layer includes carbon nanotubes or graphene, and applying pressure to the good conductor layer.

The method for manufacturing the good conductor structure as described above, wherein the good conductor layer further comprises indium tin oxide.

The method for manufacturing a good conductor structure as described above, wherein the good conductor layer further comprises iron, nickel or cobalt.

The manufacturing method of the good conductor structure as described above, wherein the good conductor layer is bonded to the base layer by sintering and curing.

The manufacturing method of the good conductor structure as described above, wherein the good conductor layer is bonded to the base layer by welding or fusion.

The manufacturing method of the good conductor structure as described above, wherein the substrate is formed with the rough surface on at least one side of the substrate by sandblasting, chemical etching or plasma etching.

The good conductor structure manufactured by the manufacturing method of the good conductor structure as described above comprises a substrate, and a pattern is printed on at least one side of the substrate at a preset position, and a rough surface is formed at the pattern, and a bottom layer is bonded to the rough surface of the substrate, and a good conductor layer is bonded to the bottom layer, and the good conductor layer comprises carbon nanotubes or graphene.

The good conductor structure as described above, wherein the substrate is in the form of a plate or foil.

The good conductor structure as described above, wherein the good conductor layer further comprises iron, nickel or cobalt.

Thus, the manufacturing method of the good conductor structure of the present invention can be used to easily manufacture a thin good conductor structure. Since it is small in size and does not occupy space, it can be applied to various electronic products and has high thermal conductivity and high electrical conductivity, so it can effectively improve the operating performance and service life of electronic products.

1: Base material

11: Rough surface

2: Bottom layer

3: Good guidance layer

4: Heat dissipation pattern

Figure 1: Flowchart of the present invention

Figure 2: Schematic diagram of the process of the present invention

Figure 3: Cross-sectional view of the present invention

Figure 4: Three-dimensional diagram of the present invention (I)

Figure 5: Three-dimensional diagram of the present invention (II)

In order to make the technical means of the present invention and the effects it can achieve more complete and clear disclosure, the following is a detailed description. Please also refer to the disclosed drawings and figure numbers:

First, please refer to the first and second figures, which are the manufacturing method of the good conductor structure of the present invention. The implementation steps mainly include: A. Prepare a substrate: prepare a plate or foil substrate (1) made of various materials such as metal, plastic or glass; B. Surface roughening: Then use sandblasting, chemical etching or plasma etching to shape at least one side of the surface of the substrate (1) The main embodiment of the present invention is to form the upper and lower surfaces of the substrate (1) into rough surfaces (11); C. Arrange a bottom layer: spray a bottom layer (2) of nano-scale indium tin oxide [ITO] on the rough surface (11) of the substrate (1); D. Drying: Then place the substrate (1) with the bottom layer (2) in a baking device to The bottom layer (2) is dried and solidified to be firmly bonded to the rough surface (11) of the substrate (1); E. Providing a good conductive layer: spraying a good conductive layer (3) on the bottom layer (2) of the substrate (1), the good conductive layer (3) being a mixture of carbon nanotubes or graphene, indium tin oxide [ITO], and a catalyst such as iron, nickel or cobalt; F. Sintering: Continuing to sinter the bottom layer (3) with the good conductive layer (3) ) is placed in a sintering device, and the good conductive layer (3) is sintered and solidified at a high temperature of 350℃~450℃ to stably bond to the bottom layer (2) of the substrate (1); G. Pressurization: The substrate (1) provided with the good conductive layer (3) is placed in a pressurization device to pressurize the good conductive layer (3) to increase the structural density of the good conductive layer (3).

According to this, a thin good conductor structure can be easily manufactured by using the above manufacturing method. Please refer to the third figure. The good conductor structure includes a substrate (1), and at least one side of the substrate (1) is formed into a rough surface (11). A bottom layer (2) is bonded to the rough surface (11) of the substrate (1), and a good conductor layer (3) is bonded to the bottom layer (2). The good conductor layer (3) includes carbon nanotubes or graphene, indium tin oxide [ITO], and iron, nickel or cobalt.

Thus, when the present invention is used and implemented, the thin good conductor structure is small in size and does not occupy space, so as to facilitate the use of various electronic products, and the good conductor structure has high thermal conductivity to quickly dissipate the heat energy generated when the electronic product is in operation, so as to effectively improve the operating performance and service life of the electronic product. In addition, the present invention forms a rough surface (11) on the surface of the substrate (1) to increase the stability of the good conductor layer (3) and the substrate (1) to prevent the good conductor layer (3) from peeling off from the substrate (1). In addition, the present invention applies pressure after the good conductor layer (3) is sintered and formed, thereby increasing the structural density of the good conductor layer (3) and further improving the thermal conductivity efficiency of the present invention.

In addition to being combined with the substrate (1) by sintering, the good conductive layer (3) of the present invention can also be combined with the bottom layer (2) of the substrate (1) by welding or fusion. Please refer to the fourth and fifth figures. The present invention can also be used in conjunction with screen printing to produce circuit boards, etc., where a pattern is printed on the substrate (1), and then sandblasting or plasma etching is performed along the pattern to make the surface of the substrate (1) at the pattern a rough surface (11), and then a bottom layer (2) of nano-scale indium tin oxide is sprayed on the rough surface (11), and the bottom layer (2) is dried. , then spraying a good conductive layer (3) made of carbon nanotubes or graphene, indium tin oxide, and a catalyst such as iron, nickel or cobalt on the bottom layer (2) of the substrate (1), and sintering the good conductive layer (3) at a high temperature and then pressurizing it. In this way, a pattern with heat dissipation effect can be formed on the substrate (1), and various heat dissipation patterns (4) can be easily made according to the design requirements of different electronic products.

In addition, the good conductive layer (3) of this case can omit the addition of catalysts such as iron, nickel or cobalt, thereby forming a good conductive structure with high conductivity. When used as a negative electrode foil of a solid capacitor, it can greatly improve the capacitor's conductivity, capacitance ratio, power density and service life.

The aforementioned embodiments or drawings do not limit the implementation of the manufacturing method of the present invention. Any appropriate changes or modifications made by a person with ordinary knowledge in the relevant technical field should be deemed to be within the patent scope of the present invention.

From the above structure and implementation method, it can be seen that the present invention has the following advantages:

1. The manufacturing method of the good conductor structure of the present invention can easily produce a thin good conductor structure, which is small in size and does not take up space, so it can be conveniently used in various electronic products, thereby improving the industrial competitiveness of this case.

2. The manufacturing method of the good conductor structure of the present invention is to make the surface of the substrate rough so that the good conductor layer can be firmly bonded to the substrate surface and is not easy to peel off, thereby improving the service life of the present invention.

3. The method for manufacturing the good conductor structure of the present invention further performs a pressurization step after the good conductor layer is formed to discharge the air in the good conductor layer and make the structure of the good conductor layer more compact to improve its conduction efficiency.

4. The method for manufacturing a good conductor structure of the present invention can be used to print the required pattern on the substrate by screen printing, and then arrange the good conductor layer along the pattern. In this way, different good conductor layer patterns can be made to match the required electronic product functions, thereby further improving the product applicability of this case.

5. The good conductor structure of the present invention uses carbon nanotubes or graphene to make a good conductor layer, which has high thermal conductivity and can quickly dissipate the heat generated when electronic products are in operation, thereby improving the operating performance and service life of electronic products.

6. The good conductor structure of the present invention uses carbon nanotubes or graphene to make a good conductive layer. In addition to high thermal conductivity, it also has good electrical conductivity. When used as a negative electrode foil of a solid capacitor, it can greatly improve the capacitor's electrical conductivity, capacitance ratio, power density and service life.

In summary, the embodiments of the present invention can achieve the expected effects, and the specific structure disclosed is not only not seen in similar products, but also has not been disclosed before the application. It fully complies with the provisions and requirements of the Patent Law. Therefore, an application for invention patent is filed in accordance with the law. I sincerely request your review and grant of patent. I would really appreciate the convenience.

1: Base material

11: Rough surface

2: Bottom layer

3: Good guidance layer

Claims (9)

A method for manufacturing a good conductor structure mainly comprises preparing a substrate, printing a pattern on at least one side of the substrate at a preset position, forming a rough surface at the pattern, bonding a bottom layer on the rough surface of the substrate, bonding a good conductor layer on the bottom layer of the substrate, the good conductor layer comprising carbon nanotubes or graphene, and applying pressure to the good conductor layer. A method for manufacturing a good conductor structure as described in claim 1, wherein the good conductor layer further comprises indium tin oxide. A method for manufacturing a good conductor structure as described in claim 1, wherein the good conductor layer further comprises iron, nickel or cobalt. A method for manufacturing a good conductor structure as described in claim 1, wherein the good conductor layer is bonded to the base layer by sintering and curing. A method for manufacturing a good conductor structure as described in claim 1, wherein the good conductor layer is bonded to the base layer by welding or fusion. A method for manufacturing a good conductor structure as described in claim 1, wherein the substrate is formed with the rough surface on at least one side of the substrate by sandblasting, chemical etching or plasma etching. A good conductor structure includes a substrate, and a pattern is printed on at least one side of the substrate at a preset position, and a rough surface is formed at the pattern, and a bottom layer is bonded to the rough surface of the substrate, and a good conductor layer is bonded to the bottom layer, and the good conductor layer includes carbon nanotubes or graphene. A good conductor structure as described in claim 7, wherein the substrate is in the form of a plate or foil. The good conductor structure as described in claim 7, wherein the good conductor layer further comprises iron, nickel or cobalt.

Images