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TWI861308B - 聚胺基甲酸酯、研磨層、研磨墊及研磨方法 - Google Patents

聚胺基甲酸酯、研磨層、研磨墊及研磨方法 Download PDF

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Publication number
TWI861308B
TWI861308B TW109143799A TW109143799A TWI861308B TW I861308 B TWI861308 B TW I861308B TW 109143799 A TW109143799 A TW 109143799A TW 109143799 A TW109143799 A TW 109143799A TW I861308 B TWI861308 B TW I861308B
Authority
TW
Taiwan
Prior art keywords
polishing
polyurethane
polishing layer
layer
polished
Prior art date
Application number
TW109143799A
Other languages
English (en)
Chinese (zh)
Other versions
TW202128807A (zh
Inventor
砂山梓紗
高岡信夫
服部和正
林浩一
加藤充
岡本知大
加藤晉哉
Original Assignee
日商可樂麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商可樂麗股份有限公司 filed Critical 日商可樂麗股份有限公司
Publication of TW202128807A publication Critical patent/TW202128807A/zh
Application granted granted Critical
Publication of TWI861308B publication Critical patent/TWI861308B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/34—Carboxylic acids; Esters thereof with monohydroxyl compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • H10P52/00—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW109143799A 2019-12-13 2020-12-11 聚胺基甲酸酯、研磨層、研磨墊及研磨方法 TWI861308B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019225695 2019-12-13
JP2019-225695 2019-12-13

Publications (2)

Publication Number Publication Date
TW202128807A TW202128807A (zh) 2021-08-01
TWI861308B true TWI861308B (zh) 2024-11-11

Family

ID=76329956

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109143799A TWI861308B (zh) 2019-12-13 2020-12-11 聚胺基甲酸酯、研磨層、研磨墊及研磨方法

Country Status (5)

Country Link
JP (1) JPWO2021117834A1 (ja)
KR (1) KR20220117220A (ja)
CN (1) CN114787225A (ja)
TW (1) TWI861308B (ja)
WO (1) WO2021117834A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023024268A (ja) * 2021-08-05 2023-02-16 株式会社フジミインコーポレーテッド 表面処理方法、その表面処理方法を含む半導体基板の製造方法、表面処理組成物、およびその表面処理組成物を含む半導体基板の製造システム
CN115558077A (zh) 2022-09-30 2023-01-03 世目特种防护用品科技（江苏）有限公司 一种水性聚氨酯乳液及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007287938A (ja) * 2006-04-17 2007-11-01 Adeka Corp 金属ｃｍｐ用研磨組成物
JP2017141393A (ja) * 2016-02-12 2017-08-17 ニッタ・ハース株式会社 高分子体、研磨パッド、および、高分子体の製造方法
KR20180024096A (ko) * 2016-08-26 2018-03-08 에스케이씨 주식회사 연마패드 제조용 우레탄계 프리폴리머, 연마패드 및 이의 제조방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03234475A (ja) 1990-02-08 1991-10-18 Kanebo Ltd 研磨布
JPH1199479A (ja) 1997-09-30 1999-04-13 Teijin Ltd 研磨パッド
JPH11322878A (ja) 1998-05-13 1999-11-26 Dainippon Ink & Chem Inc 泡含有ポリウレタン成形物の製造方法、泡含有成形物用ウレタン樹脂組成物及びそれを用いた研磨パッド
JP3516874B2 (ja) 1998-12-15 2004-04-05 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法及び研磨シート
JP2000248034A (ja) 1999-03-02 2000-09-12 Mitsubishi Chemicals Corp 研磨材用ポリウレタン系樹脂組成物及びその発泡体
JP3558273B2 (ja) 1999-09-22 2004-08-25 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法及び研磨シート
JP2005212055A (ja) 2004-01-30 2005-08-11 Kanebo Ltd 不織布ベースの研磨布及びその製造方法
JP4859110B2 (ja) * 2006-04-07 2012-01-25 東洋ゴム工業株式会社 研磨パッド
US20150375361A1 (en) * 2014-06-25 2015-12-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
IL303114A (en) * 2017-05-12 2023-07-01 Kuraray Co Polyurethane for the polishing layer, the polishing layer including polyurethane and a modification method for the polishing layer, the polishing pad and the polishing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007287938A (ja) * 2006-04-17 2007-11-01 Adeka Corp 金属ｃｍｐ用研磨組成物
JP2017141393A (ja) * 2016-02-12 2017-08-17 ニッタ・ハース株式会社 高分子体、研磨パッド、および、高分子体の製造方法
KR20180024096A (ko) * 2016-08-26 2018-03-08 에스케이씨 주식회사 연마패드 제조용 우레탄계 프리폴리머, 연마패드 및 이의 제조방법

Also Published As

Publication number Publication date
WO2021117834A1 (ja) 2021-06-17
CN114787225A (zh) 2022-07-22
KR20220117220A (ko) 2022-08-23
JPWO2021117834A1 (ja) 2021-06-17
TW202128807A (zh) 2021-08-01

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