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TWI859811B - Flexible multi-layered polysiloxane hard coating - Google Patents

Flexible multi-layered polysiloxane hard coating Download PDF

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TWI859811B
TWI859811B TW112113588A TW112113588A TWI859811B TW I859811 B TWI859811 B TW I859811B TW 112113588 A TW112113588 A TW 112113588A TW 112113588 A TW112113588 A TW 112113588A TW I859811 B TWI859811 B TW I859811B
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TW202348434A (en
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緹娜 亞拉海瓦拉
拉齊布 卡畢爾
阿里 卡爾凱能
莎恰 勒格蘭
緹娜 勒帕賈維
凱莎 馬洛
馬堤 佩森能
米亞 維爾庫能
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芬蘭商歐提騰有限公司
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • C09D183/08Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups

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Abstract

The present invention relates to a layered structure comprising a flexible or bendable substrate layer (A), a first polysiloxane based coating layer (B) and a second coating layer (C) comprising a fluoropolyether compound, a method for preparing said layered structure and the use of said layered structure for flexible electronics applications.

Description

柔性多層聚矽氧烷硬塗層Flexible multi-layer polysiloxane hardcoat

本發明係關於一種分層結構,其包含柔性或可彎曲基板層(A)、第一基於聚矽氧烷之塗層(B)及包含氟聚醚化合物之第二塗層(C)、關於一種用於製備該分層結構之方法,及關於一種該分層結構在柔性電子應用中之用途。The present invention relates to a layered structure comprising a flexible or bendable substrate layer (A), a first coating layer based on polysiloxane (B) and a second coating layer (C) comprising a fluoropolyether compound, a method for preparing the layered structure, and a use of the layered structure in flexible electronic applications.

透明塑膠已廣泛用作光學及透明顯示器行業中之核心材料。特定言之,透明塑膠(諸如PET(聚對苯二甲酸伸乙酯)、PI(聚醯亞胺)、PC(聚碳酸酯)或PMMA(聚甲基丙烯酸甲酯))由於其高透光率及適合折射率之特性,已應用於柔性電子應用中,包括顯示器、光學透鏡、透明板及汽車工業作為玻璃之輕質替代物。然而,此等塑膠具有低耐磨性之缺點,因為其具有比玻璃低的表面硬度。Transparent plastics have been widely used as core materials in the optical and transparent display industries. Specifically, transparent plastics such as PET (polyethylene terephthalate), PI (polyimide), PC (polycarbonate) or PMMA (polymethyl methacrylate) have been used in flexible electronic applications including displays, optical lenses, transparent panels and the automotive industry as a lightweight alternative to glass due to their high light transmittance and suitable refractive index properties. However, these plastics have the disadvantage of low wear resistance because they have a lower surface hardness than glass.

為增加耐磨性及可光圖案化性,經建議採用柔性的且可彎曲的硬塗層膜。適合柔性硬塗層為例如如WO 2019/193258中所揭示之基於聚矽氧烷之柔性硬塗層。In order to increase the wear resistance and photopatternability, it is suggested to use a flexible and bendable hard coating film. Suitable flexible hard coatings are, for example, polysiloxane-based flexible hard coatings as disclosed in WO 2019/193258.

硬塗層具有歸因於光反射之增加而降低例如顯示器之可視性的缺點。為了減少光反射,已提議抗反射塗層作為多層方法中硬塗層上的額外層。Hard coatings have the disadvantage of reducing the visibility of, for example, displays due to increased light reflection. In order to reduce light reflection, antireflective coatings have been proposed as an additional layer on top of the hard coating in a multi-layer approach.

舉例而言,WO 2006/082701A1揭示透明塑膠膜基板上之兩層塗層,其具有來自含有含(甲基)丙烯酸酯基之可固化化合物及含(甲基)丙烯酸酯基之反應性聚矽氧的材料的第一硬塗層,以及來自含有含矽氧烷組分之化合物的材料的第二抗反射(低折射)塗層。For example, WO 2006/082701A1 discloses a two-layer coating on a transparent plastic film substrate, which has a first hard coating layer from a material containing a curable compound containing a (meth)acrylate group and a reactive polysilicone containing a (meth)acrylate group, and a second anti-reflective (low-refractive) coating layer from a material containing a compound containing a siloxane component.

於例如US 11,046,827 B2及KR 2004-0076422A中建議硬塗層及低折射層的其他兩層方法。Other two-layer approaches of hard coating and low refractive layer are suggested in, for example, US 11,046,827 B2 and KR 2004-0076422A.

甚至已例如在JP 2001-293818A中建議硬塗層、高折射層及低折射層之三層塗層。Even a three-layer coating of a hard coating layer, a high-refractive layer and a low-refractive layer has been proposed, for example, in JP 2001-293818A.

此類多層方法具有降低之耐刮擦性及折射率不匹配之缺點,其導致如例如CN 206270519 U中所論述之濃重的彩虹圖案。較差耐刮擦性的原因可為用於改良耐刮擦性之硬塗層通常為與塑膠基板直接接觸的內層,且對低折射外層之黏附力相當弱。Such multi-layer methods have the disadvantages of reduced scratch resistance and refractive index mismatch, which results in a strong rainbow pattern as discussed in, for example, CN 206270519 U. The reason for the poor scratch resistance may be that the hard coating layer used to improve the scratch resistance is usually an inner layer in direct contact with the plastic substrate and has relatively weak adhesion to the low-refractive outer layer.

當如TW 2009-16818 A中所論述應用低折射層作為內層及硬塗層層作為外層時,塗層展示良好的耐刮擦性及較低的彩虹圖案,但並未解決高反射率問題。When a low refractive layer is applied as an inner layer and a hard coating layer as an outer layer as discussed in TW 2009-16818 A, the coating exhibits good scratch resistance and a low rainbow pattern, but the high reflectivity problem is not solved.

因此,在此項技術中需要透明塑膠基板上之柔性塗層,其為柔性的且在機械特性(諸如耐刮擦性)及光學特性(諸如低折射率)方面展示出改良的特性平衡以用於減少光反射。Therefore, there is a need in this art for flexible coatings on transparent plastic substrates that are flexible and exhibit an improved balance of properties in terms of mechanical properties (such as scratch resistance) and optical properties (such as low refractive index) for reducing light reflection.

在本發明中,提出一種多層塗層,其顯示此類改良之特性平衡。該多層塗層包含基於聚矽氧烷之塗層及包含氟聚醚化合物之塗層,而內層為基於聚矽氧烷之柔性硬塗層且第二層為抗反射層。In the present invention, a multi-layer coating is proposed which shows such an improved balance of properties. The multi-layer coating comprises a coating based on polysiloxane and a coating comprising a fluoropolyether compound, wherein the inner layer is a flexible hard coating based on polysiloxane and the second layer is an anti-reflective layer.

本發明係關於一種分層結構,其包含 (A)基板層; (B)塗佈於該基板層(A)之至少一個表面上的第一塗層,及 (C)塗佈於該第一塗層(B)之至少一個表面上的第二塗層,使得該第二塗層(C)與該第一塗層(B)之至少一個表面黏附接觸, 其中 該第一塗層(B)包含第一矽氧烷聚合物(B-1); 該第二塗層(C)包含氟聚醚化合物;及 該基板層(A)為柔性的、可彎曲的或兩者兼具。 The present invention relates to a layered structure, which comprises (A) a substrate layer; (B) a first coating layer coated on at least one surface of the substrate layer (A), and (C) a second coating layer coated on at least one surface of the first coating layer (B), so that the second coating layer (C) is in adhesive contact with at least one surface of the first coating layer (B), wherein the first coating layer (B) comprises a first siloxane polymer (B-1); the second coating layer (C) comprises a fluoropolyether compound; and the substrate layer (A) is flexible, bendable, or both.

此外,本發明係關於一種用於製造如上文或下文所描述之分層結構之方法,其包含以下步驟: ●   提供包含至少兩種不同矽烷單體之第一組成物,其中該等矽烷單體中之至少一者包括能夠達成與相鄰矽氧烷聚合物交聯之活性基團; ●   使該第一組成物經受該等單體之至少部分水解,以形成包含第一矽氧烷聚合物(B-1)之組成物; ●   提供包含氟聚醚化合物之第二組成物; ●   提供柔性的或可彎曲的或兩者兼具之基板; ●   將該第一組成物沉積至該基板之至少一個表面上以形成第一塗層(B); ●   交聯該第一塗層(B)之該等矽氧烷聚合物鏈以便獲得包含與該基板之該至少一個表面黏附接觸之交聯矽氧烷聚合物的第一塗層(B); ●   將該第二組成物沉積至該第一塗層(B)上以形成與該第一塗層(B)黏附接觸之第二塗層(C); ●   固化該第二塗層(C)之該第二組成物以便獲得與該第一塗層(B)黏附接觸之經固化的第二塗層(C)。 In addition, the present invention relates to a method for manufacturing a layered structure as described above or below, which comprises the following steps: ●   Providing a first composition comprising at least two different silane monomers, wherein at least one of the silane monomers comprises an active group capable of achieving crosslinking with an adjacent siloxane polymer; ●   Subjecting the first composition to at least partial hydrolysis of the monomers to form a composition comprising a first siloxane polymer (B-1); ●   Providing a second composition comprising a fluoropolyether compound; ●   Providing a flexible or bendable substrate or both; ●   Depositing the first composition onto at least one surface of the substrate to form a first coating (B); ●  Crosslinking the siloxane polymer chains of the first coating layer (B) to obtain a first coating layer (B) comprising a crosslinked siloxane polymer in adhesive contact with the at least one surface of the substrate; ●   Depositing the second component onto the first coating layer (B) to form a second coating layer (C) in adhesive contact with the first coating layer (B); ●   Curing the second component of the second coating layer (C) to obtain a cured second coating layer (C) in adhesive contact with the first coating layer (B).

本發明多層塗層展示良好層間黏附力,產生機械特性(尤其耐刮擦性)及光學特性(尤其低折射率)方面之改良的特性平衡。The multi-layer coating of the present invention exhibits good inter-layer adhesion, resulting in an improved balance of properties in terms of mechanical properties (especially scratch resistance) and optical properties (especially low refractive index).

在一個特定具體實例中,將其他第三塗層施加至第二塗層上,此進一步改良多層塗層之機械特性。In a specific embodiment, a further third coating layer is applied onto the second coating layer, which further improves the mechanical properties of the multi-layer coating.

在該具體實例中,本發明係關於一種分層結構,其包含: (A)基板層; (B)塗佈於該基板層(A)之至少一個表面上的第一塗層, (C)塗佈於該第一塗層(B)之至少一個表面上的第二塗層,使得該第二塗層(C)與該第一塗層(B)之至少一個表面黏附接觸,及 (D)塗佈於該第二塗層(C)之至少一個表面上的第三塗層(D),使得該第三塗層(D)與該第二塗層(C)之至少一個表面黏附接觸, 其中 該第一塗層(B)包含第一矽氧烷聚合物(B-1); 該第二塗層(C)包含氟聚醚化合物;及 該基板層(A)為柔性的、可彎曲的或兩者兼具。 In the specific example, the present invention relates to a layered structure, which comprises: (A) a substrate layer; (B) a first coating layer coated on at least one surface of the substrate layer (A); (C) a second coating layer coated on at least one surface of the first coating layer (B), such that the second coating layer (C) is in contact with at least one surface of the first coating layer (B); and (D) a third coating layer (D) coated on at least one surface of the second coating layer (C), such that the third coating layer (D) is in contact with at least one surface of the second coating layer (C), wherein the first coating layer (B) comprises a first siloxane polymer (B-1); The second coating layer (C) comprises a fluoropolyether compound; and the substrate layer (A) is flexible, bendable, or both.

此外,在該特定具體實例中,本發明係關於一種用於製造如上文或下文所描述之分層結構之方法,其包含以下步驟: ●   提供包含至少兩種不同矽烷單體之第一組成物,其中該等矽烷單體中之至少一者包括能夠達成與相鄰矽氧烷聚合物交聯之活性基團; ●   使該第一組成物經受該等單體之至少部分水解,以形成包含第一矽氧烷聚合物(B-1)之組成物; ●   提供包含氟聚醚化合物之第二組成物; ●   提供包含矽氧烷聚合物及視情況選用之氟聚醚化合物之第三組成物; ●   提供柔性的或可彎曲的或兩者兼具之基板; ●   將該第一組成物沉積至該基板之至少一個表面上以形成第一塗層(B); ●   交聯該第一塗層(B)之該等矽氧烷聚合物鏈以便獲得包含與該基板之該至少一個表面黏附接觸之交聯矽氧烷聚合物的第一塗層(B); ●   將該第二組成物沉積至該第一塗層(B)上以形成與該第一塗層(B)黏附接觸之第二塗層(C); ●   固化該第二塗層(C)之該第二組成物以便獲得與該第一塗層(B)黏附接觸之經固化的第二塗層(C); ●   將該第三組成物沉積至該第二塗層(C)上以形成與該第二塗層(C)黏附接觸之第三塗層(D); ●   交聯該第三塗層(D)之該等矽氧烷聚合物鏈以便獲得包含一或多個與該第二塗層(C)黏附接觸之交聯矽氧烷聚合物之第三塗層(D)。 Furthermore, in the specific embodiment, the present invention relates to a method for producing a layered structure as described above or below, comprising the following steps: ●   Providing a first composition comprising at least two different silane monomers, wherein at least one of the silane monomers comprises an active group capable of achieving crosslinking with an adjacent siloxane polymer; ●   Subjecting the first composition to at least partial hydrolysis of the monomers to form a composition comprising a first siloxane polymer (B-1); ●   Providing a second composition comprising a fluoropolyether compound; ●   Providing a third composition comprising a siloxane polymer and, if appropriate, a fluoropolyether compound; ●   Providing a flexible or bendable substrate or both; ●  Depositing the first component onto at least one surface of the substrate to form a first coating layer (B); ●   Crosslinking the siloxane polymer chains of the first coating layer (B) to obtain a first coating layer (B) comprising a crosslinked siloxane polymer in adhesive contact with the at least one surface of the substrate; ●   Depositing the second component onto the first coating layer (B) to form a second coating layer (C) in adhesive contact with the first coating layer (B); ●   Curing the second component of the second coating layer (C) to obtain a cured second coating layer (C) in adhesive contact with the first coating layer (B); ●  Depositing the third composition onto the second coating layer (C) to form a third coating layer (D) in adhesive contact with the second coating layer (C); ●   Crosslinking the siloxane polymer chains of the third coating layer (D) to obtain a third coating layer (D) comprising one or more crosslinked siloxane polymers in adhesive contact with the second coating layer (C).

最後,本發明係關於如上文或下文所描述之分層結構之用途,其用於柔性電子應用中,包括顯示器、光學透鏡、透明板及汽車工業,尤其作為玻璃之輕質替代物。Finally, the invention relates to the use of a layered structure as described above or below in flexible electronic applications, including displays, optical lenses, transparent panels and in the automotive industry, in particular as a lightweight alternative to glass.

關於構造及操作方法之各種例示性及非限制性具體實例連同其額外目標及優勢將在結合附圖研讀時自特定例示性具體實例之以下描述最佳地理解。Various illustrative and non-limiting embodiments both as to construction and methods of operation, together with additional objects and advantages thereof, will be best understood from the following description of specific illustrative embodiments when read in conjunction with the accompanying drawings.

動詞「包含」及「包括」在本文件中用作開放性限制,其既不排除亦不需要存在未敍述之特徵。在附屬項中敍述之特徵可彼此自由組合,除非另有明確陳述。The verbs "comprise" and "include" are used in this document as open limitations that neither exclude nor require the existence of unrecited features. The features recited in the appendices are freely combinable with each other unless expressly stated otherwise.

本發明技術提供分層結構,其中基板層(A)具有包含矽氧烷聚合物之至少兩個層。分層結構為「可彎曲的」,意為其能夠圍繞具有曲率半徑之心軸彎曲而不會斷裂。The present invention provides a layered structure, wherein the substrate layer (A) has at least two layers comprising a siloxane polymer. The layered structure is "bendable", meaning that it can bend around an axis having a radius of curvature without breaking.

如WO 2019/193258中所描述,可使用涉及分層結構圍繞心軸之內折或外折的試驗來測試彎曲性特性。As described in WO 2019/193258, the bending properties can be tested using a test involving folding the layered structure inward or outward about a central axis.

基板層(A) 基板層(A)可為任何種類之基板,諸如玻璃、石英、矽、氮化矽、聚合物、金屬及塑膠或其混合物。此外,基板層(A)亦可包括多個不同表面,諸如不同氧化物、經摻雜氧化物、半金屬及其類似物或其混合物。 Substrate layer (A) The substrate layer (A) may be any type of substrate, such as glass, quartz, silicon, silicon nitride, polymer, metal and plastic or mixtures thereof. In addition, the substrate layer (A) may also include a plurality of different surfaces, such as different oxides, doped oxides, semi-metals and the like or mixtures thereof.

適合聚合物為例如熱塑性聚合物,諸如聚烯烴、聚酯、聚醯胺、聚醯亞胺、聚碳酸酯、丙烯酸聚合物,諸如聚(甲基丙烯酸甲酯)及定製設計聚合物。Suitable polymers are, for example, thermoplastic polymers such as polyolefins, polyesters, polyamides, polyimides, polycarbonates, acrylic polymers such as poly(methyl methacrylate) and custom-designed polymers.

尤其較佳聚合物為聚甲基丙烯酸甲酯(PMMA)、聚對苯二甲酸伸乙酯(PET)及無色聚醯亞胺(CPI)。Particularly preferred polymers are polymethyl methacrylate (PMMA), polyethylene terephthalate (PET) and colorless polyimide (CPI).

基板層(A)可為裝置之最外層或單個堆疊之內部層。基板層(A)可塗佈在一側或兩側上。The substrate layer (A) can be the outermost layer of the device or an inner layer of a single stack. The substrate layer (A) can be coated on one side or both sides.

基板層(A)較佳地具有10至500 µm,更佳地為20至400 µm之厚度。The substrate layer (A) preferably has a thickness of 10 to 500 µm, more preferably 20 to 400 µm.

基板層(A)為柔性的、可彎曲的或兩者兼具,使得其能夠圍繞具有第一最小曲率半徑之心軸彎曲而不會斷裂。本發明之分層結構尤其能夠圍繞具有第二最小曲率半徑之心軸彎曲而不斷裂,該第一最小曲率半徑小於或等於第二最小曲率半徑。The substrate layer (A) is flexible, bendable or both, so that it can bend around a mandrel having a first minimum radius of curvature without breaking. The layered structure of the present invention is particularly capable of bending around a mandrel having a second minimum radius of curvature without breaking, the first minimum radius of curvature being less than or equal to the second minimum radius of curvature.

可在將第一組成物沉積於基板之至少一個表面上以形成第一塗層(B)之前改質基板層(A)之至少一個表面。At least one surface of the substrate layer (A) may be modified before depositing the first composition on at least one surface of the substrate to form the first coating layer (B).

基板層(A)之至少一個表面可經物理或化學改質。At least one surface of the substrate layer (A) may be physically or chemically modified.

適合物理改質為電漿處理或電暈處理或類似處理。Suitable for physical modification such as plasma treatment, corona treatment or similar treatment.

適合的化學改質可為用於清潔基板層(A)之至少一個表面的化學清潔製程。A suitable chemical modification may be a chemical cleaning process for cleaning at least one surface of the substrate layer (A).

藉助於物理或化學改質,較佳地活化至少一個表面以促進基板層(A)與第一塗層(B)之間的黏附。At least one surface is preferably activated by means of physical or chemical modification to promote adhesion between the substrate layer (A) and the first coating layer (B).

在一具體實例中,視情況選用之塗層組成物沉積於基板層(A)之至少一個表面上,因此視情況選用之額外塗層形成於基板層(A)之至少一個表面上。該視情況選用之額外塗層接著在一側上與基板層(A)之至少一個表面黏附接觸且在另一側上與第一塗層(B)黏附接觸。In one embodiment, the optional coating composition is deposited on at least one surface of the substrate layer (A), so that the optional additional coating is formed on at least one surface of the substrate layer (A). The optional additional coating is then in adhesive contact with at least one surface of the substrate layer (A) on one side and in adhesive contact with the first coating (B) on the other side.

就此而言,「黏附接觸」意謂在基板層(A)與視情況選用之額外塗層以及視情況選用之額外塗層與第一塗層(B)之至少一個表面之間不存在其他塗層或黏附層。In this context, "adhesive contact" means that there are no other coating layers or adhesive layers between the substrate layer (A) and the optional additional coating layer and between the optional additional coating layer and at least one surface of the first coating layer (B).

該視情況選用之額外塗層可具有5至300 nm之厚度或300 nm至5 µm之厚度。The optional additional coating may have a thickness of 5 to 300 nm or a thickness of 300 nm to 5 µm.

在特定情況下,通常施加該視情況選用之額外塗層,諸如促進基板層(A)與第一塗層(B)之間的黏附力、潤濕第一塗層(B)、促進分層結構之光學效能或促進分層結構之機械效能。In certain cases, the optional additional coating is typically applied, for example, to promote adhesion between the substrate layer (A) and the first coating layer (B), to wet the first coating layer (B), to promote the optical performance of the layered structure, or to promote the mechanical performance of the layered structure.

然而,較佳地,基板層與第一塗層(B)之間不施加視情況選用之額外塗層。However, preferably, no optional additional coating layer is applied between the substrate layer and the first coating layer (B).

第一塗層(B) 該第一塗層(B)塗佈在該基板層(A)之至少一個表面上以使得該第一塗層(B)。 First coating layer (B) The first coating layer (B) is coated on at least one surface of the substrate layer (A) so that the first coating layer (B)

較佳地,第一塗層(B)與基板層(A)之至少一個表面黏附接觸。因此,第一塗層(B)通常為具有與基板層(A)之至少一個表面之黏附接觸的多層塗層的內層。就此而言,「黏附接觸」意謂在基板層(A)與第一塗層(B)之至少一個表面之間不存在其他塗層或黏附層。Preferably, the first coating layer (B) is in adhesive contact with at least one surface of the substrate layer (A). Therefore, the first coating layer (B) is usually an inner layer of a multi-layer coating layer having adhesive contact with at least one surface of the substrate layer (A). In this context, "adhesive contact" means that there are no other coating layers or adhesive layers between the substrate layer (A) and at least one surface of the first coating layer (B).

第一塗層(B)較佳地具有1至50 µm、較佳地2至20 µm、更佳地3至10 µm之厚度。The first coating layer (B) preferably has a thickness of 1 to 50 µm, more preferably 2 to 20 µm, and more preferably 3 to 10 µm.

第一塗層(B)包含第一矽氧烷聚合物(B-1)。The first coating layer (B) includes a first siloxane polymer (B-1).

第一矽氧烷聚合物(B-1)包含選自至少兩種不同矽烷單體之單體單元,其中矽烷單體中之至少一者包括能夠達成與相鄰矽氧烷聚合物鏈交聯之活性基團,且其中相鄰矽氧烷聚合物鏈藉助於該活性基團交聯。The first siloxane polymer (B-1) comprises monomer units selected from at least two different silane monomers, wherein at least one of the silane monomers comprises a reactive group capable of achieving crosslinking with adjacent siloxane polymer chains, and wherein the adjacent siloxane polymer chains are crosslinked via the reactive group.

第一矽氧烷聚合物(B-1)可包含選自2至10,諸如2至6,較佳2至4種不同矽烷單體之單體單元。與此相關的「不同」意謂矽烷單體在至少一個化學部分上不同。The first siloxane polymer (B-1) may comprise monomer units selected from 2 to 10, such as 2 to 6, preferably 2 to 4 different silane monomers. "Different" in this context means that the silane monomers differ in at least one chemical moiety.

活性基團較佳為環氧基、脂環族環氧基(例如縮水甘油基)、乙烯基、烯丙基、丙烯酸酯、甲基丙烯酸酯及矽烷基及其組合。The reactive group is preferably an epoxy group, an alicyclic epoxy group (such as a glycidyl group), a vinyl group, an allyl group, an acrylate group, a methacrylate group, a silyl group, and a combination thereof.

由此,環氧基、脂環族環氧基(例如縮水甘油基)、乙烯基、烯丙基、丙烯酸酯、甲基丙烯酸酯基在熱或輻射引發時,較佳在適合引發劑(諸如熱或自由基引發劑)存在下能夠達成與相鄰矽氧烷聚合物鏈交聯。Thus, epoxy, alicyclic epoxy (e.g., glycidyl), vinyl, allyl, acrylate, methacrylate groups are capable of crosslinking with adjacent siloxane polymer chains when initiated thermally or by radiation, preferably in the presence of a suitable initiator (e.g., a thermal or free radical initiator).

適合的熱或自由基引發劑較佳選自過氧苯甲酸三級戊酯、4,4-偶氮雙(4-氰基戊酸)、1,1'-偶氮二(環己烷甲腈)、過氧化苯甲醯、2,2-雙(三級丁基過氧)丁烷、1,1-雙(三級丁基過氧)環己烷、2,2'-偶氮二異丁腈(AIBN)、2,5-雙(三級丁基過氧)-Z,S-二甲基己烷、2,5-雙(三級丁基過氧)-2,5-二甲基-3-己炔、雙(1-(三級丁基過氧)-1-甲基乙基)苯、1,1-雙(三級丁基過氧)-3,3,5-三甲基環己烷、氫過氧化三級丁基、過乙酸三級丁酯、過氧化三級丁基、過氧苯甲酸三級丁酯、三級丁基過氧化異丙基碳酸酯、氫過氧化異丙苯、過氧化環己酮、過氧化二異丙苯、過氧化月桂醯、過氧化2,4-戊二酮、過氧乙酸或過硫酸鉀。尤其較佳為2,2'-偶氮二異丁腈(AIBN)。Suitable thermal or free radical initiators are preferably selected from triamyl peroxybenzoate, 4,4-azobis(4-cyanovaleric acid), 1,1'-azobis(cyclohexanecarbonitrile), benzoyl peroxide, 2,2-bis(tertiary butylperoxy)butane, 1,1-bis(tertiary butylperoxy)cyclohexane, 2,2'-azobisisobutyronitrile (AIBN), 2,5-bis(tertiary butylperoxy)-Z,S-dimethylhexane, 2,5-bis(tertiary butylperoxy)-2,5- Dimethyl-3-hexyne, bis(1-(tert-butylperoxy)-1-methylethyl)benzene, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, tert-butyl hydroperoxide, tert-butyl peracetate, tert-butyl peroxide, tert-butyl peroxybenzoate, tert-butyl peroxyisopropyl carbonate, isopropyl hydroperoxide, cyclohexanone peroxide, diisopropyl peroxide, lauryl peroxide, 2,4-pentanedione peroxide, peracetic acid or potassium persulfate. Particularly preferred is 2,2'-azobisisobutyronitrile (AIBN).

矽烷基團能夠在矽氫化時,較佳在適合催化劑(諸如基於鉑(Pt)之催化劑,諸如Speier催化劑(H 2PtCl 6.H 2O)、Karstedt催化劑(Pt(0)-1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷複合物溶液)或基於銠(Rh)之催化劑,諸如三(三苯基膦)氯化銠(I))之存在下達成與相鄰矽氧烷聚合物鏈之碳-碳雙鍵(諸如乙烯基或烯丙基)交聯。 Silane groups are capable of crosslinking with carbon-carbon double bonds (such as vinyl or allyl) of adjacent siloxane polymer chains during hydrosilylation, preferably in the presence of a suitable catalyst (such as platinum (Pt)-based catalysts, such as Speier's catalyst (H2PtCl6.H2O ) , Karstedt's catalyst (Pt(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex solution) or rhodium (Rh)-based catalysts, such as tris(triphenylphosphine)rhodium(I) chloride).

在一個具體實例中,含有第一活性基團,例如選自環氧基、脂環族環氧基(例如縮水甘油基)及乙烯基及烯丙基之單體與含有第二活性基團,例如選自丙烯酸酯基及甲基丙烯酸酯基之單體之間的莫耳比在1:100至100:1,特定言之1:10至10:1,例如5:1至1:2或3:1至1:1範圍內變化。In a specific example, the molar ratio between the monomer containing the first reactive group, e.g., selected from epoxy, alicyclic epoxy (e.g., glycidyl), vinyl and allyl, and the monomer containing the second reactive group, e.g., selected from acrylate and methacrylate, ranges from 1:100 to 100:1, specifically 1:10 to 10:1, e.g., 5:1 to 1:2 or 3:1 to 1:1.

在一些具體實例中,含有第二活性基團之組分亦選自除矽烷單體以外的含有丙烯酸酯及甲基丙烯酸酯之化合物,諸如四乙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、新戊四醇三丙烯酸酯、雙三甲基丙烷四丙烯酸酯、二新戊四醇五丙烯酸酯及二新戊四醇六丙烯酸酯及其組合。In some specific examples, the component containing the second reactive group is also selected from compounds containing acrylates and methacrylates other than silane monomers, such as tetraethylene glycol diacrylate, trihydroxymethylpropane triacrylate, pentaerythritol triacrylate, ditrimethylpropane tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and combinations thereof.

在一些具體實例中,基於單體之莫耳部分,活性基團或活性基團將以約1至35%之濃度存在。In some embodiments, the reactive group or groups will be present at a concentration of about 1 to about 35% based on the molar fraction of the monomer.

適合矽烷單體較佳由式(I)表示 R 1 aSiX 4-a(I) 其中 R 1係選自氫及包含直鏈及分支鏈烷基、環烷基、烯基、炔基、(烷基)丙烯酸酯、環氧基、烯丙基、乙烯基及烷氧基以及具有1至6個環之芳基的基團,且其中該基團經取代或未經取代; X為可水解基團或烴殘基;且 a為整數1至3。 Suitable silane monomers are preferably represented by formula (I): R 1 a SiX 4-a (I) wherein R 1 is selected from hydrogen and a group comprising linear and branched alkyl, cycloalkyl, alkenyl, alkynyl, (alkyl)acrylate, epoxide, allyl, vinyl and alkoxy, and an aromatic group having 1 to 6 rings, and wherein the group is substituted or unsubstituted; X is a hydrolyzable group or a hydrocarbon residue; and a is an integer of 1 to 3.

可水解基團尤其為烷氧基(參見式II)。The hydrolyzable group is especially an alkoxy group (see formula II).

R 1及/或可水解基團X之烷氧基可相同或不同,且較佳選自具有下式之基團 -O-R 2(II) 其中 R 2代表具有1至10個,較佳1至6個碳原子之直鏈或分支鏈烷基,且視情況呈現一或兩個選自鹵素、羥基、乙烯基、環氧基及烯丙基之群的取代基。最佳為甲氧基及乙氧基。 R1 and/or the alkoxy group of the hydrolyzable group X may be the same or different and are preferably selected from the group having the following formula -OR2 (II) wherein R2 represents a linear or branched alkyl group having 1 to 10, preferably 1 to 6 carbon atoms and optionally presents one or two substituents selected from the group consisting of halogen, hydroxyl, vinyl, epoxy and allyl. The most preferred are methoxy and ethoxy.

尤佳為包含根據式(II)之烷氧基之二、三或四烷氧基矽烷。Particularly preferred are di-, tri- or tetraalkoxysilanes containing alkoxy groups according to formula (II).

特別合適的矽烷單體係選自以下之群:四乙氧基矽烷(TEOS)、四甲氧基矽烷(TMS)、甲基三乙氧基矽烷(MTEOS)、甲基三甲氧基矽烷(MTMS)、二甲基二乙氧基矽烷(DMDEOS)、二甲基二甲氧基矽烷(DMDMS)、二苯基二甲氧基矽烷(DPDMS)、3-(三甲氧基矽基)丙基甲基丙烯酸酯(MEMO)、3-(三乙氧基矽基)丙基甲基丙烯酸酯、5-(雙環庚烯基)三乙氧基矽烷(BCHTEOS)、(3-縮水甘油氧基丙基)三乙氧基矽烷、(3-縮水甘油氧基丙基)三甲氧基矽烷(GPTMS)、(十七氟-1,1,2,2-四氫癸基)三甲氧基矽烷(F17)、(十七氟-1,1,2,2-四氫癸基)三乙氧基矽烷、1H,1H,2H,2H-全氟十二烷基三乙氧基矽烷、1H,1H,2H,2H-全氟十二烷基三甲氧基矽烷、1H,1H,2H,2H-全氟辛基三乙氧基矽烷、1H,1H,2H,2H-全氟辛基三甲氧基矽烷(F13)、1H,1H,2H,2H-全氟戊基三乙氧基矽烷、1H,1H,2H,2H-全氟戊基三甲氧基矽烷、1H,1H,2H,2H-全氟十四烷基三乙氧基矽烷、1H,1H,2H,2H-全氟十四烷基三甲氧基矽烷、烯丙基三甲氧基矽烷(allylTMS)、烯丙基三乙氧基矽烷(allylTEOS)、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、(3-縮水甘油氧基丙基)二甲氧基甲基矽烷(Me-GPTMS)、甲基丙烯醯氧基丙基甲基二甲氧基矽烷(Me-MEMO)、苯基甲基二甲氧基矽烷(PMDMS)、雙[(2,2,3,3,4,4-六氟丁基)丙酸酯]-3-胺基丙基三甲氧基矽烷或其混合物。Particularly suitable silane monomers are selected from the group consisting of tetraethoxysilane (TEOS), tetramethoxysilane (TMS), methyltriethoxysilane (MTEOS), methyltrimethoxysilane (MTMS), dimethyldiethoxysilane (DMDEOS), dimethyldimethoxysilane (DMDMS), diphenyldimethoxysilane (DPDMS), 3-(trimethoxysilyl)propylmethacrylate (MEMO), 3-(triethoxysilyl)propylmethacrylate Ester, 5-(bicycloheptenyl)triethoxysilane (BCHTEOS), (3-glycidyloxypropyl)triethoxysilane, (3-glycidyloxypropyl)trimethoxysilane (GPTMS), (heptadecafluoro-1,1,2,2-tetrahydrodecyl)trimethoxysilane (F17), (heptadecafluoro-1,1,2,2-tetrahydrodecyl)triethoxysilane, 1H,1H,2H,2H-perfluorododecyltriethoxysilane, 1H,1H,2H,2H-perfluorododecyltriethoxysilane Alkyl trimethoxysilane, 1H,1H,2H,2H-perfluorooctyl triethoxysilane, 1H,1H,2H,2H-perfluorooctyl trimethoxysilane (F13), 1H,1H,2H,2H-perfluoropentyl triethoxysilane, 1H,1H,2H,2H-perfluoropentyl trimethoxysilane, 1H,1H,2H,2H-perfluorotetradecyl triethoxysilane, 1H,1H,2H,2H-perfluorotetradecyl trimethoxysilane, allyl trimethoxysilane (al lylTMS), allyl triethoxysilane (allylTEOS), vinyl trimethoxysilane, vinyl triethoxysilane, (3-glycidyloxypropyl) dimethoxymethyl silane (Me-GPTMS), methacryloxypropyl methyl dimethoxy silane (Me-MEMO), phenyl methyl dimethoxy silane (PMDMS), bis [(2,2,3,3,4,4-hexafluorobutyl) propionate] -3-aminopropyl trimethoxy silane or a mixture thereof.

矽烷單體較佳係選自苯基甲基二甲氧基矽烷(PMDMS)、3-(三甲氧基矽基)丙基甲基丙烯酸酯(MEMO)及(3-縮水甘油氧基丙基)三甲氧基矽烷(GPTMS)之群。The silane monomer is preferably selected from the group consisting of phenylmethyldimethoxysilane (PMDMS), 3-(trimethoxysilyl)propylmethacrylate (MEMO) and (3-glycidyloxypropyl)trimethoxysilane (GPTMS).

該等矽烷單體較佳以50至100 mol%、較佳50至99 mol%、再更佳65至97 mol%之莫耳量存在於矽氧烷聚合物中。The silane monomers are preferably present in the siloxane polymer in a molar amount of 50 to 100 mol %, preferably 50 to 99 mol %, and more preferably 65 to 97 mol %.

在一個具體實例中,第一矽氧烷聚合物(B-1)之至少兩種不同矽烷單體包含至少一種雙矽烷。In one embodiment, the at least two different silane monomers of the first siloxane polymer (B-1) include at least one bissilane.

適合之雙矽烷較佳由式(III)表示 (R 3) 3Si-Y-Si(R 4) 3,           (III) 其中 R 3及R 4獨立地選自氫及由直鏈或分支鏈烷基、環烷基、烯基、炔基、(烷基)丙烯酸酯、環氧基、烯丙基、乙烯基、烷氧基以及具有1至6個環之芳基組成之群的基團,且其中該基團經取代或未經取代;及 Y為選自二價未經取代或經取代之脂族及芳族基團的鍵聯基團,諸如伸烷基、伸芳基、-O-伸烷基-O-;-O-伸芳基-O-;伸烷基-O-伸烷基、伸芳基-O-伸芳基;伸烷基-Z 1C(=O)Z 2-伸烷基、伸芳基-Z 1C(=O)Z 2-伸芳基及-O-伸烷基-Z 1C(=O)Z 2-伸苯基-O-;-O-伸芳基-Z 1C(=O)Z 2-伸芳基-O-,其中Z 1及Z 2各自選自直接鍵或-O-。 Suitable bissilanes are preferably represented by the formula (III): (R 3 ) 3 Si-Y-Si(R 4 ) 3 , (III) wherein R 3 and R 4 are independently selected from hydrogen and a group consisting of a linear or branched alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, an (alkyl)acrylate group, an epoxide group, an allyl group, a vinyl group, an alkoxy group and an aryl group having 1 to 6 rings, and wherein the group is substituted or unsubstituted; and Y is a linking group selected from divalent unsubstituted or substituted aliphatic and aromatic groups, such as alkylene, arylene, -O-alkylene-O-; -O-arylene-O-; alkylene-O-alkylene, arylene-O-arylene; alkylene-Z 1 C(═O)Z 2 -alkylene, arylene-Z 1 C(=O)Z 2 -arylene and -O-alkylene-Z 1 C(=O)Z 2 -phenylene-O-; -O-arylene-Z 1 C(=O)Z 2 -arylene-O-, wherein Z 1 and Z 2 are independently selected from a direct bond or -O-.

在二價「伸烷基」基團及其他類似脂族基團中,烷基殘基(或衍生自烷基部分之殘基)代表1至10個、較佳1至8個、或1至6個或甚至1至4個碳原子,實例包括伸乙基及亞甲基及伸丙基。In divalent "alkylene" groups and other similar aliphatic groups, the alkyl residue (or the residue derived from the alkyl part) represents 1 to 10, preferably 1 to 8, or 1 to 6 or even 1 to 4 carbon atoms, examples include ethylene and methylene and propylene.

「伸芳基」代表典型地含有1至3個芳環及6至18個碳原子之芳族二價基團。此類基團藉由伸苯基(例如1,4-伸苯基及1,3-伸苯基)及伸聯苯基以及伸萘基或伸蒽基例示。"Arylene" represents an aromatic divalent radical typically containing 1 to 3 aromatic rings and 6 to 18 carbon atoms. Such radicals are exemplified by phenylene (e.g., 1,4-phenylene and 1,3-phenylene) and biphenylene as well as naphthylene or anthracenylene.

伸烷基及伸芳基可視情況經1至5個選自以下之取代基取代:羥基、鹵基、乙烯基、環氧基及烯丙基以及烷基、芳基及芳烷基。The alkylene group and the arylene group may be substituted with 1 to 5 substituents selected from the group consisting of a hydroxyl group, a halogen group, a vinyl group, an epoxy group and an allyl group as well as an alkyl group, an aryl group and an aralkyl group, as the case may be.

較佳烷氧基含有1至4個碳原子。實例為甲氧基及乙氧基。Preferred alkoxy groups contain 1 to 4 carbon atoms. Examples are methoxy and ethoxy.

術語「苯基」包括經取代的苯基,諸如苯基三烷氧基,尤其苯基三甲氧基或三乙氧基,以及全氟苯基。苯基以及其他芳族或脂環族基團可直接偶合至矽原子,或其可經由亞甲基或伸乙基橋偶合至矽原子。The term "phenyl" includes substituted phenyl groups, such as phenyltrialkoxy groups, especially phenyltrimethoxy or triethoxy groups, and perfluorophenyl groups. The phenyl group and other aromatic or alicyclic groups can be coupled directly to the silicon atom, or they can be coupled to the silicon atom via a methylene or ethylene bridge.

例示性雙矽烷包括1,2-雙(三乙氧基矽基)乙烷(BTESE)、1,2-雙(三甲氧基矽基)乙烷(MEOS)及其混合物。Exemplary bissilanes include 1,2-bis(triethoxysilyl)ethane (BTESE), 1,2-bis(trimethoxysilyl)ethane (MEOS), and mixtures thereof.

較佳具有以0至50 mol%、較佳1至50 mol%、再更佳3至35 mol%之莫耳量存在於矽氧烷聚合物中之雙矽烷。Preferably, the bissilane is present in the siloxane polymer in a molar amount of 0 to 50 mol %, preferably 1 to 50 mol %, and more preferably 3 to 35 mol %.

尤其較佳地,至少兩種矽烷單體係選自1,2-雙(三乙氧基矽基)乙烷(BTESE)、苯基甲基二甲氧基矽烷(PMDMS)、3-(三甲氧基矽基)丙基甲基丙烯酸酯(MEMO)及(3-縮水甘油氧基丙基)三甲氧基矽烷(GPTMS)之群中之兩者兼具或更多者的混合物。Particularly preferably, at least two silane monomers are selected from the group consisting of 1,2-bis(triethoxysilyl)ethane (BTESE), phenylmethyldimethoxysilane (PMDMS), 3-(trimethoxysilyl)propylmethacrylate (MEMO) and (3-glycidyloxypropyl)trimethoxysilane (GPTMS), or a mixture of two or more thereof.

包含矽氧烷聚合物(B-1)之第一組成物較佳藉由包含以下步驟之方法形成: ●   在第一溶劑中混合較佳如上文或下文所描述之至少兩種不同矽烷單體以形成混合物; ●   使該混合物在催化劑存在下經歷該等單體之至少部分水解,由此使該等水解單體至少部分聚合且交聯; ●   視情況將該第一溶劑更換為第二溶劑; ●   視情況藉由矽氫化、熱或輻射引發使該混合物進一步交聯。 The first composition comprising the siloxane polymer (B-1) is preferably formed by a method comprising the following steps: ●   Mixing at least two different silane monomers, preferably as described above or below, in a first solvent to form a mixture; ●   Subjecting the mixture to at least partial hydrolysis of the monomers in the presence of a catalyst, thereby causing the hydrolyzed monomers to at least partially polymerize and crosslink; ●   Optionally replacing the first solvent with a second solvent; ●   Optionally crosslinking the mixture by hydrosilylation, heat or radiation initiation.

第一溶劑較佳選自以下之群:丙酮、四氫呋喃(THF)、甲苯、1-丙醇、2-丙醇、甲醇、乙醇、水(H 2O)、環戊酮、乙腈、丙二醇丙醚、甲基-三級丁基醚(MTBE)、丙二醇單甲醚乙酸酯(PGMEA)、甲基乙基酮、甲基異丁基酮、丙二醇單甲醚(PGME)及丙二醇丙醚(PnP)。 The first solvent is preferably selected from the group consisting of acetone, tetrahydrofuran (THF), toluene, 1-propanol, 2-propanol, methanol, ethanol, water ( H2O ), cyclopentanone, acetonitrile, propylene glycol propyl ether, methyl tertiary butyl ether (MTBE), propylene glycol monomethyl ether acetate (PGMEA), methyl ethyl ketone, methyl isobutyl ketone, propylene glycol monomethyl ether (PGME) and propylene glycol propyl ether (PnP).

至少兩種不同矽烷單體可在任何適合之溫度下混合於第一溶劑中以溶解矽烷單體。通常情況下,室溫足夠。At least two different silane monomers may be mixed in a first solvent at any suitable temperature to dissolve the silane monomers. Typically, room temperature is sufficient.

在下一方法步驟中,使混合物在催化劑存在下經歷至少部分水解。In the next process step, the mixture undergoes at least partial hydrolysis in the presence of a catalyst.

適合催化劑為酸性催化劑、鹼性催化劑或其他催化劑。Suitable catalysts are acidic catalysts, alkaline catalysts or other catalysts.

酸性催化劑較佳選自硝酸(HNO 3)、硫酸(H 2SO 4)、甲酸(HCOOH)、鹽酸(HCl)、磺酸、氟化氫(HF)、乙酸(CH 3COOH)、三氟甲磺酸或對甲苯磺酸。尤其較佳的酸性催化劑為硝酸(HNO 3)、鹽酸(HCl)及甲酸(HCOOH)。 The acidic catalyst is preferably selected from nitric acid (HNO 3 ), sulfuric acid (H 2 SO 4 ), formic acid (HCOOH), hydrochloric acid (HCl), sulfonic acid, hydrogen fluoride (HF), acetic acid (CH 3 COOH), trifluoromethanesulfonic acid or p-toluenesulfonic acid. Particularly preferred acidic catalysts are nitric acid (HNO 3 ), hydrochloric acid (HCl) and formic acid (HCOOH).

鹼性催化劑較佳選自三乙胺(TEA)、氫氧化銨(NH 4OH)、氫氧化四乙銨(TEAH)、氫氧化四甲銨(TMEA)、1,4-二氮雜雙環[2.2.2]辛烷、咪唑及二伸乙基三胺。 The alkaline catalyst is preferably selected from triethylamine (TEA), ammonium hydroxide (NH 4 OH), tetraethylammonium hydroxide (TEAH), tetramethylammonium hydroxide (TMEA), 1,4-diazabicyclo[2.2.2]octane, imidazole and diethylenetriamine.

其他催化劑較佳選自2,2,3,3,4,4,5,5-八氟戊基丙烯酸酯、聚(乙二醇) 200、聚(乙二醇) 300及正丁基三聚氰胺甲醛樹脂。Other catalysts are preferably selected from 2,2,3,3,4,4,5,5-octafluoropentyl acrylate, poly(ethylene glycol) 200, poly(ethylene glycol) 300 and n-butyl melamine formaldehyde resin.

水解步驟較佳在20至80℃之溫度下進行1至24小時,諸如在室溫下進行隔夜。The hydrolysis step is preferably carried out at a temperature of 20 to 80°C for 1 to 24 hours, such as overnight at room temperature.

在水解步驟期間,矽烷單體至少部分水解。該至少部分水解之矽烷單體隨後至少部分聚合,較佳藉由縮合聚合且交聯形成矽氧烷聚合物。During the hydrolysis step, the silane monomers are at least partially hydrolyzed. The at least partially hydrolyzed silane monomers are then at least partially polymerized, preferably by condensation polymerization and crosslinking to form a siloxane polymer.

該聚矽氧烷通常具有在約500至2000 g/mol範圍內之相對較低分子量。The polysiloxanes typically have a relatively low molecular weight in the range of about 500 to 2000 g/mol.

根據一較佳具體實例,使混合物經受至少部分水解包括回流。典型回流時間為2小時。According to a preferred embodiment, subjecting the mixture to at least partial hydrolysis comprises refluxing. Typical reflux time is 2 hours.

在水解步驟之後,在視情況選用之另一方法步驟中,第一溶劑可更換為第二溶劑。視情況選用之溶劑更換係有利的,因為其有助於移除在水解矽烷單體期間形成的水及醇。另外,當用作基板上之塗層時,其改良了最終矽氧烷聚合物溶液之特性。After the hydrolysis step, in an optional further process step, the first solvent may be replaced with a second solvent. The optional solvent replacement is advantageous because it helps remove water and alcohol formed during the hydrolysis of the silane monomers. In addition, it improves the properties of the final siloxane polymer solution when used as a coating on a substrate.

第二溶劑較佳選自丙二醇甲基醚(PGME)、丙二醇甲基醚乙酸酯(PGMEA)、1-乙醇、2-乙醇(IPA)、丙烯腈二丙酮醇(DAA)或丙二醇正丙基醚(PnP)之群。The second solvent is preferably selected from the group consisting of propylene glycol methyl ether (PGME), propylene glycol methyl ether acetate (PGMEA), 1-ethanol, 2-ethanol (IPA), acrylonitrile diacetone alcohol (DAA) or propylene glycol n-propyl ether (PnP).

包含矽氧烷聚合物之混合物可在水解步驟之後進一步經歷交聯步驟。由此,矽氧烷聚合物較佳藉由矽氫化、熱或輻射引發至少部分交聯。The mixture comprising the siloxane polymer may be further subjected to a crosslinking step after the hydrolysis step. Thereby, the siloxane polymer is preferably at least partially crosslinked by hydrosilylation, heat or radiation.

在本上下文中,術語「部分交聯」意謂聚合物能夠在有利於交聯之條件下進一步交聯。實務上,在第一聚合步驟之後聚合物仍含有至少一些反應性交聯基團。下文將描述典型地在部分交聯之組成物沉積於基板上之後發生的進一步交聯。In this context, the term "partially crosslinked" means that the polymer is capable of further crosslinking under conditions that are favorable for crosslinking. In practice, the polymer still contains at least some reactive crosslinking groups after the first polymerization step. Further crosslinking that typically occurs after the partially crosslinked composition is deposited on a substrate will be described below.

矽氧烷聚合物較佳使用如上文所描述之催化劑藉由矽氫化、熱或輻射引發至少部分交聯。The siloxane polymers are preferably at least partially crosslinked by hydrosilylation, heat or radiation using a catalyst as described above.

由此,較佳在約30℃至200℃範圍內之溫度下進行熱交聯。Thus, thermal crosslinking is preferably performed at a temperature in the range of about 30°C to 200°C.

典型地交聯在溶劑之回流條件下進行。Typically the crosslinking is carried out under refluxing conditions of the solvent.

為了改良材料在應用於光微影時之解析度,矽氧烷聚合物可視情況在聚合期間,尤其在縮合聚合期間或緊接在縮合聚合之後部分交聯。各種方法可用於達成交聯。舉例而言,可採用交聯方法,其中兩個鏈經由不影響任何意欲用於UV光微影之活性基團的反應性基團接合。舉例而言,例如使用一個鏈上的質子與另一條鏈上的雙鍵反應之矽氫化將達成所需種類之交聯。另一實例為經由雙鍵或環氧基進行的交聯。In order to improve the resolution of the material when used in photolithography, the siloxane polymer can be partially crosslinked during polymerization, especially during or immediately after condensation polymerization, as appropriate. Various methods can be used to achieve the crosslinking. For example, a crosslinking method can be used in which two chains are joined via reactive groups that do not affect any active groups intended for UV photolithography. For example, hydrosilylation, such as using a proton on one chain to react with a double bond on another chain, will achieve the desired type of crosslinking. Another example is crosslinking via double bonds or epoxy groups.

不同活性基團較佳用於交聯及用於光微影。因此,矽氧烷聚合物之交聯可使用自由基引發劑及光酸產生劑用具有雙鍵或環氧基或兩者兼具之活性基團(諸如環氧基、乙烯基或烯丙基或甲基丙烯酸酯基)達成。Different reactive groups are preferred for crosslinking and for photolithography. Thus, crosslinking of siloxane polymers can be achieved using free radical initiators and photoacid generators with reactive groups having double bonds or epoxy groups or both, such as epoxy, vinyl or allyl or methacrylate groups.

環氧基可用於UV光微影,且反之亦然。交聯所需之活性基團比例通常小於UV光微影所需之活性基團比例,例如基於單體計約0.1至10 mol%以用於交聯及基於單體計約5至50 mol%以用於UV光微影。Epoxy groups can be used for UV lithography, and vice versa. The proportion of reactive groups required for crosslinking is generally less than that required for UV lithography, for example, about 0.1 to 10 mol % based on monomer for crosslinking and about 5 to 50 mol % based on monomer for UV lithography.

添加至反應混合物/溶液中之引發劑之量一般為約0.1至10 wt%,較佳約0.5至5 wt%,根據矽氧烷聚合物之總重量計算。The amount of initiator added to the reaction mixture/solution is generally about 0.1 to 10 wt %, preferably about 0.5 to 5 wt %, based on the total weight of the siloxane polymer.

由於部分交聯,分子量將典型地為2至10倍。因此,根據在約500至2000 g/mol範圍內之分子量,交聯將使其增加超過3000 g/mol,較佳增加至4000至20000 g/mol。Due to partial crosslinking, the molecular weight will typically be 2 to 10 times higher. Thus, with a molecular weight in the range of about 500 to 2000 g/mol, crosslinking will increase it to more than 3000 g/mol, preferably to 4000 to 20000 g/mol.

視情況,存在於矽氧烷聚合物之主鏈中之所得游離Si-OH基團可經封端來保護。為封端,使游離Si-OH基團與矽烷(諸如甲基二氯氟矽烷(Cl 2FSiCH 3、甲基氟二甲氧基矽烷((MeO) 2SiFCH 3)、3-氯丙基三甲氧基矽烷(Cl(CH 2) 3Si(OMe) 3)、乙基三甲氧基矽烷(ETMS)或三甲基氯矽烷(ClSiMe 3))在諸如三乙基鋁(TEA)或咪唑之催化劑存在下反應。催化劑之量在總固體之1.5至2 wt%範圍內變化。反應時間在40至45 min範圍內變化。 Optionally, the resulting free Si-OH groups present in the backbone of the siloxane polymer can be protected by end-capping. For end-capping, the free Si-OH groups are reacted with silanes such as methyldichlorofluorosilane ( Cl2FSiCH3 , methylfluorodimethoxysilane ((MeO) 2SiFCH3 ), 3 - chloropropyltrimethoxysilane (Cl( CH2 ) 3Si (OMe) 3 ), ethyltrimethoxysilane (ETMS) or trimethylchlorosilane ( ClSiMe3 ) in the presence of a catalyst such as triethylaluminum (TEA) or imidazole. The amount of catalyst varies in the range of 1.5 to 2 wt% of the total solids. The reaction time varies in the range of 40 to 45 min.

典型地引入至包含矽氧烷聚合物(B-1)之第一組成物中的其他添加劑包括可進一步改變經塗佈及固化之膜的最終表面特性或改良塗層(B)對基板層(A)或其他塗層(C)之潤濕性/黏附特性或改良沉積及乾燥期間之塗層乾燥及包裝行為以達到良好視覺品質之化學物質。Other additives typically incorporated into the first composition comprising the siloxane polymer (B-1) include chemicals that can further modify the final surface properties of the coated and cured film or improve the wetting/adhesion properties of the coating (B) to the substrate layer (A) or other coatings (C) or improve the coating drying and packaging behavior during deposition and drying to achieve good visual quality.

此等添加劑可為界面活性劑、消泡劑、防污劑、潤濕劑等。此類添加劑之實例包括:BYK-301、BYK-306、BYK-307、BYK-308、BYK-333、BYK-051、BYK-036、BYK-028、BYK-057A、BYK-011、BYK-055、BYK-036、BYK-067A、BYK-088、BYK-302、BYK-310、BYK-322、BYK-323、BYK-33l、BYK-333、BYK-341、BYK-345、BYK-348、BYK-370、BYK-377、BYK-378、BYK-381、BYK-390、BYK-3700,以上均可購自BYK。Such additives may be surfactants, defoamers, antifouling agents, wetting agents, etc. Examples of such additives include: BYK-301, BYK-306, BYK-307, BYK-308, BYK-333, BYK-051, BYK-036, BYK-028, BYK-057A, BYK-011, BYK-055, BYK-036, BYK-067A, BYK-088, BYK -302, BYK-310, BYK-322, BYK-323, BYK-33l, BYK-333, BYK-341, BYK-345, BYK-348, BYK-370, BYK-377, BYK-378, BYK-381, BYK-390, BYK-3700, all of the above can be purchased from BYK.

添加劑較佳以固體總重量之0.01至5 wt%、更佳0.1至1 wt%之量存在。The additive is preferably present in an amount of 0.01 to 5 wt %, more preferably 0.1 to 1 wt %, based on the total weight of the solids.

在進一步縮合之前,較佳地自材料移除過量水,且在此階段有可能視需要使溶劑更換為另一合成溶劑。此其他合成溶劑可充當矽氧烷聚合物之最終加工溶劑或最終加工溶劑中之一者。殘餘水及醇及其他副產物可在進一步縮合步驟完成之後移除。可在調配步驟期間添加額外加工溶劑以形成最終加工溶劑組合。可在矽氧烷聚合物之最終過濾之前添加添加劑,諸如熱引發劑、輻射敏感性引發劑、敏化劑、界面活性劑及其他添加劑。在調配組成物之後,聚合物準備好在例如輥對輥膜沉積中或在微影製程中進行加工。Before further condensation, excess water is preferably removed from the material, and it is possible at this stage to change the solvent to another synthesis solvent if necessary. This other synthesis solvent may serve as the final processing solvent or one of the final processing solvents for the siloxane polymer. Residual water and alcohol and other by-products may be removed after the further condensation steps are completed. Additional processing solvents may be added during the formulation steps to form the final processing solvent combination. Additives such as thermal initiators, radiation sensitive initiators, sensitizers, surfactants and other additives may be added before the final filtration of the siloxane polymer. After formulating the composition, the polymer is ready to be processed, for example in roll-to-roll film deposition or in a lithography process.

藉由調節水解及縮合條件,可控制能夠去質子化之基團(例如OH-基團)及來自矽氧烷聚合物組成物之矽烷前驅體之任何殘餘離去基團(例如烷氧基)的濃度/含量,且亦控制矽氧烷聚合物之最終分子量。此大大影響矽氧烷聚合物材料在基於水溶液之顯影劑溶液中的溶解度。此外,聚合物之分子量亦極大地影響矽氧烷聚合物在顯影溶液中之溶解度特性。By adjusting the hydrolysis and condensation conditions, the concentration/content of groups capable of deprotonation (e.g., OH-groups) and any residual groups left from the silane precursor of the siloxane polymer composition (e.g., alkoxy groups) can be controlled, and the final molecular weight of the siloxane polymer can also be controlled. This greatly affects the solubility of the siloxane polymer material in aqueous-based developer solutions. In addition, the molecular weight of the polymer also greatly affects the solubility characteristics of the siloxane polymer in the developer solution.

因此,舉例而言,已發現當最終矽氧烷聚合物具有高含量之剩餘羥基及低含量之烷氧基(例如乙氧基)基團時,最終矽氧烷聚合物可溶解於鹼-水顯影劑溶液(例如氫氧化四甲基銨;TMAH或氫氧化鉀;KOH)中。Thus, for example, it has been found that the final siloxane polymer is soluble in an alkaline-water developer solution (e.g., tetramethylammonium hydroxide; TMAH or potassium hydroxide; KOH) when the final siloxane polymer has a high content of residual hydroxyl groups and a low content of alkoxy (e.g., ethoxy) groups.

另一方面,若最終矽氧烷聚合物之剩餘烷氧基-基團含量較高,且其幾乎不含有任何OH-基團,則最終矽氧烷聚合物在以上種類之鹼-水顯影劑中具有極低溶解度。OH-基團或其他官能基,諸如胺基(NH 2)、硫醇(SH)、羧基、苯酚或類似的產生對鹼性顯影劑系統的溶解性的官能基可直接連接至矽氧烷聚合物主鏈之矽原子或視情況連接至與矽氧烷聚合物主鏈連接的有機官能基以進一步促進且控制鹼性顯影劑溶解性。 On the other hand, if the residual alkoxy-group content of the final siloxane polymer is high and it contains almost no OH-groups, the final siloxane polymer has very low solubility in the above-mentioned types of alkaline-water developers. OH-groups or other functional groups, such as amine ( NH2 ), thiol (SH), carboxyl, phenol or similar functional groups that impart solubility to alkaline developer systems can be directly attached to the silicon atoms of the siloxane polymer backbone or, as the case may be, to organic functional groups attached to the siloxane polymer backbone to further promote and control the alkaline developer solubility.

在合成之後,矽氧烷聚合物組成物可使用恰當溶劑或溶劑組合稀釋以得到固體含量,其在膜沉積中將產生預選膜厚度。Following synthesis, the siloxane polymer composition can be diluted using an appropriate solvent or combination of solvents to obtain a solids content that will produce a preselected film thickness during film deposition.

通常,在合成之後向矽氧烷組成物中添加另一量之引發劑分子化合物。引發劑可視情況與聚合期間所添加之引發劑類似,用於產生可引發UV固化步驟中之「活性」官能基之聚合的物質。因此,在環氧基之情況下,可使用陽離子或陰離子引發劑。在合成材料中具有雙鍵作為「活性」官能基之基團的情況下,可採用自由基引發劑。此外,熱引發劑(根據自由基、陽離子或陰離子機制工作)可用於促進「活性」官能基之交聯。光引發劑及敏化劑之恰當組合之選擇亦取決於所使用曝光源(波長)。此外,所使用敏化劑之選擇視所選擇之引發劑類型而定。Typically, a further amount of an initiator molecule compound is added to the siloxane composition after synthesis. The initiator may, as the case may be, be similar to the initiator added during the polymerization and is used to produce a substance that can initiate the polymerization of the "active" functional groups in the UV curing step. Thus, in the case of epoxy groups, cationic or anionic initiators can be used. In the case of groups with double bonds as "active" functional groups in the synthetic material, free radical initiators can be employed. Furthermore, thermal initiators (working according to a free radical, cationic or anionic mechanism) can be used to promote the crosslinking of the "active" functional groups. The choice of the appropriate combination of photoinitiators and sensitizers also depends on the exposure source (wavelength) used. Furthermore, the choice of sensitizer used depends on the type of initiator chosen.

組成物中熱或輻射引發劑及敏化劑之濃度一般為約0.1至10%,較佳約0.5至5%,其由矽氧烷聚合物之質量計算。The concentration of the thermal or radiation initiator and the sensitizer in the composition is generally about 0.1 to 10%, preferably about 0.5 to 5%, calculated on the mass of the siloxane polymer.

如上文所描述之組成物可包含呈組成物之1 wt%與50 wt%之間的量的固體奈米粒子或其他化合物。奈米粒子(或類似奈米或微尺度棒、晶體、球、點、芽等)尤其選自光散射、光吸收、光發射及/或導電顏料、染料、有機及無機磷光體、氧化物、量子點、聚合物或金屬之群。The composition as described above may comprise solid nanoparticles or other compounds in an amount between 1 wt% and 50 wt% of the composition. The nanoparticles (or similar nano- or micro-scale rods, crystals, balls, dots, buds, etc.) are particularly selected from the group of light scattering, light absorbing, light emitting and/or conductive pigments, dyes, organic and inorganic phosphors, oxides, quantum dots, polymers or metals.

隨後將包含矽氧烷聚合物(B-1)之第一組成物沉積於基板之至少一個表面上以形成第一塗層(B)。Then, a first composition including a siloxane polymer (B-1) is deposited on at least one surface of the substrate to form a first coating layer (B).

較佳地,第一塗層(B)與基板之至少一個表面黏附接觸。Preferably, the first coating layer (B) is in adhesive contact with at least one surface of the substrate.

適合沉積法包括旋塗、夾塗、噴霧、噴墨、輥對輥、凹版印刷、反向凹版印刷、刮棒塗佈、狹縫塗佈、柔版印刷、簾式塗佈、網板印刷塗佈法、擠壓塗佈、浸塗、淋塗或縫塗。Suitable deposition methods include spin coating, nip coating, spraying, ink jetting, roll-to-roll, gravure printing, reverse gravure printing, doctor bar coating, slot coating, flexographic printing, curtain coating, screen printing coating, extrusion coating, dip coating, shower coating or slot coating.

包含矽氧烷聚合物(B-1)之沉積第一組成物在基板(A)之表面上形成塗層(B)。典型地,在沉積之後或在沉積步驟期間,蒸發溶劑且較佳藉由熱乾燥或視情況藉由合併之真空及/或熱乾燥來乾燥膜塗層(B)。此步驟亦稱作預固化。The deposited first composition comprising the siloxane polymer (B-1) forms a coating (B) on the surface of the substrate (A). Typically, after deposition or during the deposition step, the solvent is evaporated and the film coating (B) is dried, preferably by thermal drying or, as the case may be, by combined vacuum and/or thermal drying. This step is also called pre-curing.

在第二後續步驟中,塗層(B)藉由在高溫下熱固化或藉由使用UV曝露隨後在高溫下進行熱固化而固化至最終硬度。In a second subsequent step, the coating (B) is cured to a final hardness by thermal curing at elevated temperature or by using UV exposure followed by thermal curing at elevated temperature.

在一個具體實例中,預固化及最終固化步驟藉由使用增加之加熱梯度進行加熱來組合。除僅熱固化製程以外,固化可在三個步驟中進行,該製程包含熱預固化及UV固化,之後為最終熱固化。亦可應用兩步固化製程,其中熱預固化之後為UV固化。在此情況下,在UV固化之後較佳不應用最終熱固化。In one specific example, the pre-cure and final cure steps are combined by heating using an increasing heating gradient. In addition to a heat-only curing process, curing can be performed in three steps, the process comprising a thermal pre-cure and a UV cure followed by a final thermal cure. A two-step curing process can also be applied, wherein a thermal pre-cure is followed by a UV cure. In this case, preferably no final thermal cure is applied after the UV cure.

根據一特定具體實例,該方法進一步包括使所沉積之膜顯影。在一個具體實例中,顯影包含使沉積之第一矽氧烷聚合物組成物曝露(全區域或使用光罩或十字線或雷射直接成像之選擇性曝露)於UV光。顯影步驟典型地在任何預固化步驟之後且在最終固化步驟之前進行。According to a specific embodiment, the method further comprises developing the deposited film. In one embodiment, developing comprises exposing the deposited first siloxane polymer composition (full area or selective exposure using a mask or crosshairs or laser direct imaging) to UV light. The developing step is typically performed after any pre-curing step and before the final curing step.

因此,在一個具體實例中,該方法包含以下步驟 -    預固化或乾燥沉積於基板(A)上之第一塗層(B); -    視情況曝露由此塗層(B); -    視情況使由此獲得之塗層(B)顯影;及 -    固化塗層(B)。 Thus, in a specific embodiment, the method comprises the following steps: -    pre-curing or drying a first coating layer (B) deposited on a substrate (A); -    exposing the coating layer (B) as appropriate; -    developing the coating layer (B) thus obtained as appropriate; and -    curing the coating layer (B).

例示性含有環氧官能基的單體包括(3-縮水甘油氧基丙基)三甲氧基矽烷、1-(2-(三甲氧基矽基)乙基)環己烷-3,4-環氧化物、(3-縮水甘油氧基丙基)三乙氧基矽烷、(3-縮水甘油氧基丙基)三丙氧基矽烷、3-縮水甘油氧基丙基三(2-甲氧基乙氧基)矽烷、2,3-環氧基丙基三乙氧基矽烷、3,4-環氧基丁基三乙氧基矽烷、4,5-環氧基戊基三乙氧基矽烷、5,6-環氧基己基三乙氧基矽烷、5,6-環氧基己基三甲氧基矽烷、2-(3,4-環氧基環己基)乙基三乙氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、4-(三甲氧基矽基)丁烷-1,2-環氧化物。Exemplary monomers containing epoxy functional groups include (3-glycidyloxypropyl)trimethoxysilane, 1-(2-(trimethoxysilyl)ethyl)cyclohexane-3,4-epoxide, (3-glycidyloxypropyl)triethoxysilane, (3-glycidyloxypropyl)tripropoxysilane, 3-glycidyloxypropyltri(2-methoxyethoxy)silane, 2,3-epoxypropyltriethyl triethoxysilane, 3,4-epoxybutyltriethoxysilane, 4,5-epoxypentyltriethoxysilane, 5,6-epoxyhexyltriethoxysilane, 5,6-epoxyhexyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 4-(trimethoxysilyl)butane-1,2-epoxide.

官能化化合物之其他實例為丙烯酸酯及甲基丙烯酸酯化合物,諸如四乙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、新戊四醇三丙烯酸酯、二(三羥甲基丙烷)四丙烯酸酯、二新戊四醇五丙烯酸酯、三環癸烷二甲醇二丙烯酸酯、三(2-羥乙基異氰脲酸酯)二/三丙烯酸酯及二新戊四醇六丙烯酸酯及其組合。此類市售丙烯酸酯,例如來自Miwon之Miramer丙烯酸酯。此類化合物可用作矽烷組成物之一部分。Other examples of functionalized compounds are acrylate and methacrylate compounds such as tetraethylene glycol diacrylate, trihydroxymethylpropane triacrylate, pentaerythritol triacrylate, di(trihydroxymethylpropane) tetraacrylate, dipentaerythritol pentaacrylate, tricyclodecane dimethanol diacrylate, tri(2-hydroxyethyl isocyanurate) di/triacrylate and dipentaerythritol hexaacrylate and combinations thereof. Such commercially available acrylates are, for example, Miramer acrylates from Miwon. Such compounds can be used as part of the silane composition.

根據一特定具體實例,該方法進一步包括固化包含矽氧烷聚合物(B-1)之第一組成物。According to a specific embodiment, the method further comprises curing the first composition comprising the siloxane polymer (B-1).

基板(A)上之第一塗層(B)的厚度(亦即,薄膜厚度)可介於1至50 µm,較佳地2至20 µm,更佳地3至10 µm。The thickness of the first coating layer (B) on the substrate (A) (ie, film thickness) may be in the range of 1 to 50 µm, preferably 2 to 20 µm, and more preferably 3 to 10 µm.

塗層(B)較佳地為柔性硬塗層。The coating layer (B) is preferably a flexible hard coating layer.

較佳地,經藉由ASTM D3363-00,Elcometer測試儀所測定,塗層(B)的硬度大於3H、大於4H、大於5H、大於6H或甚至大於7H。Preferably, the hardness of the coating (B) is greater than 3H, greater than 4H, greater than 5H, greater than 6H or even greater than 7H as measured by ASTM D3363-00, Elcometer tester.

較佳地,經藉由ASTM D3359-09,Crosshatch測試儀所測試,塗層(B)之黏附力為4B-5B。Preferably, the adhesion of the coating (B) is 4B-5B as tested by ASTM D3359-09, Crosshatch tester.

此外,塗層(B)經在Taber線性磨損試驗(使用來自Taber Industries的線性磨損機)中之無視覺刮痕所證明較佳地具有耐刮擦性,該試驗用BonStar鋼絲絨#0000,在500 g重量、2×2 cm頭大小、2.0吋行程長度、60個循環/分鐘下進行至多2000個線性循環。In addition, the coating (B) was better in scratch resistance as evidenced by no visual scratches in the Taber Linear Abrasion Test (using a Linear Abrasion Machine from Taber Industries) with BonStar steel wool #0000, 500 g weight, 2×2 cm head size, 2.0 inch stroke length, 60 cycles/minute up to 2000 linear cycles.

第二塗層(C) 塗佈於第一塗層(B)之至少一個表面上的第二塗層,使得第二塗層(C)與第一塗層(B)之至少一個表面黏附接觸。因此,第二塗層(C)通常為具有與第一塗層(B)之至少一個表面之黏附接觸的多層塗層之外層,因此第一塗層(B)包夾在基板層(A)與第二塗層(C)之間。就此而言,「黏附接觸」意謂第一塗層(B)與第二塗層(C)之至少一個表面之間不存在其他塗層或黏附層。 Second coating layer (C) A second coating layer applied on at least one surface of the first coating layer (B) such that the second coating layer (C) is in adhesive contact with at least one surface of the first coating layer (B). Therefore, the second coating layer (C) is typically an outer layer of a multi-layer coating layer having adhesive contact with at least one surface of the first coating layer (B), so that the first coating layer (B) is sandwiched between the substrate layer (A) and the second coating layer (C). In this context, "adhesive contact" means that there is no other coating layer or adhesive layer between the first coating layer (B) and at least one surface of the second coating layer (C).

第二塗層(C)較佳地具有10 nm至10 µm之厚度,較佳地為25 nm至8 µm之厚度,更佳地為50 nm至5 µm之厚度。The second coating layer (C) preferably has a thickness of 10 nm to 10 µm, more preferably 25 nm to 8 µm, and more preferably 50 nm to 5 µm.

第二塗層包含氟聚醚化合物。The second coating layer includes a fluoropolyether compound.

氟聚醚化合物可為單一氟聚醚化合物或兩種或更多種,諸如2至10種,較佳2至4種不同氟聚醚化合物之混合物。The fluoropolyether compound may be a single fluoropolyether compound or a mixture of two or more, such as 2 to 10, preferably 2 to 4 different fluoropolyether compounds.

氟聚醚化合物通常具有150至100,000 g/mol、更佳250至50,000 g/mol且最佳350至25,000 g/mol之分子量。The fluoropolyether compound generally has a molecular weight of 150 to 100,000 g/mol, more preferably 250 to 50,000 g/mol, and most preferably 350 to 25,000 g/mol.

在氟聚醚化合物中,並非所有氫原子皆可經氟置換。倘若氫原子存在於氟聚醚化合物中,氟/氫之分子比較佳為至少5,更佳至少10。氟聚醚化合物亦可為全氟聚醚化合物。In the fluoropolyether compound, not all hydrogen atoms may be replaced by fluorine. If hydrogen atoms are present in the fluoropolyether compound, the molecular ratio of fluorine/hydrogen is preferably at least 5, more preferably at least 10. The fluoropolyether compound may also be a perfluoropolyether compound.

氟聚醚化合物之氟聚醚基團可為直鏈或分支鏈基團,較佳為直鏈基團。The fluoropolyether group of the fluoropolyether compound may be a linear or branched chain group, preferably a linear chain group.

氟聚醚基團之重複單元較佳為C 1至C 6氟化二醇,更佳為C 1至C 4氟化二醇,且最佳為C 1至C 3氟化二醇。 The repeating units of the fluoropolyether group are preferably C1 to C6 fluorinated diols, more preferably C1 to C4 fluorinated diols, and most preferably C1 to C3 fluorinated diols.

氟聚醚基團之較佳單體為全氟-1,2-丙二醇、全氟-1,3-丙二醇、全氟-1,2-乙二醇及二氟-1,1-二羥基-甲烷,較佳全氟-1,3-丙二醇、全氟-1,2-乙二醇及二氟-甲二醇。Preferred monomers of the fluoropolyether group are perfluoro-1,2-propylene glycol, perfluoro-1,3-propylene glycol, perfluoro-1,2-ethylene glycol and difluoro-1,1-dihydroxy-methane, preferably perfluoro-1,3-propylene glycol, perfluoro-1,2-ethylene glycol and difluoro-methane glycol.

後一單體二氟-1,1-二羥基-甲烷可藉由氧化聚(四氟乙烯)獲得。The latter monomer, difluoro-1,1-dihydroxy-methane, can be obtained by oxidation of poly(tetrafluoroethylene).

二價全氟聚醚基團之較佳結構包括 -CF 2O(CF 2O) m(C 2F 4O) pCF 2-, 其中m及p之平均值為0至150,其限制條件為m及p不同時為零, -CF(CF 3)O(CF(CF 3)CF 2O) pCF(CF 3)-, -CF 2O(C 2F 4O) pCF 2-,及 -(CF 2) 3O(C 4F 8O) p(CF 2) 3-, 其中p之平均值為3至150。 Preferred structures of the divalent perfluoropolyether group include -CF2O ( CF2O ) m ( C2F4O ) pCF2- , wherein the average values of m and p are from 0 to 150 , with the proviso that m and p are not simultaneously zero, -CF( CF3 )O(CF( CF3 ) CF2O ) pCF ( CF3 )-, -CF2O (C2F4O)pCF2-, and -(CF2)3O(C4F8O)p(CF2)3- , wherein the average value of p is from 3 to 150.

其中,尤其較佳之結構為 -CF 2O(CF 2O) m(C 2F 4O) pCF 2-, -CF 2O(C 2F 4O) pCF 2-,及 -CF(CF 3)(OCF 2(CF 3)CF) pO(CF 2) mO(CF(CF 3)CF 2O) pCF(CF 3)-。 Among them, particularly preferred structures are -CF2O ( CF2O ) m ( C2F4O ) pCF2- , -CF2O ( C2F4O ) pCF2- , and -CF( CF3 )( OCF2 ( CF3 )CF )pO ( CF2 ) mO ( CF( CF3 ) CF2O ) pCF ( CF3 )-.

單價全氟聚醚基團之較佳結構包括 CF 3CF 2O(CF 2O) m(C 2F 4O) pCF 2-, CF 3CF 2O(C 2F 4O)pCF 2-, CF 3CF 2CF 2O(CF(CF 3)CF 2O) pCF(CF 3)-, 或其組合, 其中m及p之平均值為0至150且m及p不獨立地為0。 Preferred structures of the monovalent perfluoropolyether group include CF3CF2O (CF2O) m ( C2F4O ) pCF2- , CF3CF2O (C2F4O ) pCF2- , CF3CF2CF2O (CF( CF3 )CF2O) pCF ( CF3 )-, or combinations thereof, wherein the average values of m and p are 0 to 150 and m and p are not independently 0 .

氟聚醚化合物可包含官能基,諸如羧基、烷基酯基、羧基酯基、環氧基、胺基、矽烷基或其混合物。The fluoropolyether compound may contain functional groups such as carboxyl groups, alkyl ester groups, carboxyl ester groups, epoxy groups, amine groups, silane groups or mixtures thereof.

在一個具體實例中,氟聚醚化合物為氟聚醚矽烷,更佳為包含可水解基團之氟聚醚矽烷(PFS)。In one embodiment, the fluoropolyether compound is a fluoropolyether silane, more preferably a fluoropolyether silane (PFS) containing a hydrolyzable group.

包含可水解基團之氟聚醚矽烷(PFS)較佳選自根據下式(IV)之化合物 R 5-R F-Q-Si(OR 3) oR 4 p(IV) 其中 R F為氟聚醚基; Q   為二價連接基團; R 3各自獨立地選自C 1至C 10有機基或有機雜原子基; R 4各自獨立地選自C 1至C 20有機基或有機雜原子基; o    為1、2或3 p    為0、1或2 o+p      為3 R 5為H、C xF 2x+1,其中x為1至10或-Q-Si(OR 3) oR 4 p,其中Q、R 3、R 4、o及p依上文所定義,其中在各次出現時Q、R 3、R 4、o及p可相同或不同。 The fluoropolyether silane (PFS) containing a hydrolyzable group is preferably selected from a compound according to the following formula (IV): R5 - RF -Q-Si( OR3 ) oR4p ( IV ) wherein RF is a fluoropolyether group; Q is a divalent linking group; R3 is independently selected from a C1 to C10 organic group or an organic heteroatom group; R4 is independently selected from a C1 to C20 organic group or an organic heteroatom group; o is 1, 2 or 3 p is 0, 1 or 2 o+p is 3 R5 is H, CxF2x +1 , wherein x is 1 to 10 or -Q-Si( OR3 ) oR4p , wherein Q, R3 , R4 , o and p are as defined above, wherein Q, R3 , R4 at each occurrence is , o and p may be the same or different.

R 3各自獨立地選自C 1至C 10有機基或有機雜原子基。 R3 are each independently selected from a C1 to C10 organic group or an organic heteroatom group.

倘若雜原子存在於R 3之有機基中,其較佳地選自N、O、P、S或Si,更佳地選自N及O。 If a heteroatom is present in the organic group of R 3 , it is preferably selected from N, O, P, S or Si, more preferably selected from N and O.

較佳基團OR 3為烷氧基、醯氧基及芳氧基。 Preferred groups OR 3 are alkoxy, acyloxy and aryloxy.

連接至與M 1結合之氧原子的R 3之有機雜原子基的雜原子通常不同於O。 The heteroatom of the organic heteroatom group of R 3 connected to the oxygen atom bonded to M 1 is usually different from O.

存在於R 3之有機雜原子基中的雜原子較佳地選自N、O、P或S,更佳地選自N及O。 The heteroatom present in the organic heteroatom group of R 3 is preferably selected from N, O, P or S, more preferably selected from N and O.

R 3中之雜原子(若存在)之總數目通常不超過五,較佳不超過三。 The total number of heteroatoms (if present) in R 3 usually does not exceed five, preferably does not exceed three.

較佳地,R 3為含有不超過三個雜原子之C 1至C 10有機基,更佳地,R 3為C 1至C 10烴基,甚至更佳為C 1至C 10直鏈、分支鏈或環狀烷基。 Preferably, R 3 is a C 1 to C 10 organic group containing no more than three heteroatoms, more preferably, R 3 is a C 1 to C 10 alkyl group, and even more preferably a C 1 to C 10 linear, branched or cyclic alkyl group.

較佳地,根據上文變異體中之任一者之R 3中存在的碳原子之總數目為1至6,更佳為1至4。 Preferably, the total number of carbon atoms present in R 3 according to any of the above variations is 1 to 6, more preferably 1 to 4.

R 4各自獨立地選自C 1至C 20有機基或有機雜原子基。 R4 are each independently selected from a C1 to C20 organic group or an organic heteroatom group.

倘若雜原子存在於R 4之有機基中,其較佳選自N、O、P、S或Si,更佳選自N及O。 If a heteroatom is present in the organic group of R 4 , it is preferably selected from N, O, P, S or Si, more preferably selected from N and O.

連接至Si之R 4之有機雜原子基的雜原子通常不同於O。 The heteroatom of the organic heteroatom group of R 4 connected to Si is usually different from O.

存在於R 4之有機雜原子基中的雜原子較佳選自N、O、P或S,更佳選自N及O。 The heteroatom present in the organic heteroatom group of R 4 is preferably selected from N, O, P or S, more preferably selected from N and O.

R 4中之雜原子(若存在)之總數目通常不超過八,較佳不超過五,且最佳不超過三。 The total number of heteroatoms (if present) in R 4 usually does not exceed eight, preferably does not exceed five, and most preferably does not exceed three.

較佳地,R 4為含有不超過三個雜原子之C 1至C 20有機基,更佳地,R 4為C 1至C 20烴基,甚至更佳為C 1至C 20直鏈、分支鏈或環狀烷基。 Preferably, R 4 is a C 1 to C 20 organic group containing no more than three heteroatoms, more preferably, R 4 is a C 1 to C 20 alkyl group, and even more preferably, a C 1 to C 20 linear, branched or cyclic alkyl group.

較佳地,根據上文變異體中之任一者之R 4中存在的碳原子之總數目為1至15,更佳為1至10,且最佳為1至6。 Preferably, the total number of carbon atoms present in R 4 according to any of the above variations is 1 to 15, more preferably 1 to 10, and most preferably 1 to 6.

o較佳為1至3,更佳2或3,且最佳3。o Preferably 1 to 3, more preferably 2 or 3, and most preferably 3.

p較佳為0至2,更佳0或1且最佳0。p is preferably 0 to 2, more preferably 0 or 1 and most preferably 0.

o + p為3。o + p is 3.

氟聚醚基團R F通常具有150至10,000 g/mol、更佳250至5,000 g/mol且最佳350至2,500 g/mol之分子量。 The fluoropolyether group RF typically has a molecular weight of 150 to 10,000 g/mol, more preferably 250 to 5,000 g/mol and most preferably 350 to 2,500 g/mol.

在氟聚醚基R F中,並非所有氫原子皆可經氟置換。倘若氫原子存在於氟聚醚基團R F中,氟/氫之分子比較佳為至少5,更佳至少10。更佳地,氟聚醚基R F為全氟聚醚基。 In the fluoropolyether group RF , not all hydrogen atoms may be replaced by fluorine. If hydrogen atoms are present in the fluoropolyether group RF , the molecular ratio of fluorine/hydrogen is preferably at least 5, more preferably at least 10. More preferably, the fluoropolyether group RF is a perfluoropolyether group.

氟聚醚基團R F可為直鏈或分支鏈基團,較佳為直鏈基團。 The fluoropolyether group RF can be a linear or branched chain group, preferably a linear chain group.

氟聚醚基團R F之重複單元較佳為C 1至C 6氟化二醇,更佳為C 1至C 4氟化二醇,且最佳為C 1至C 3氟化二醇。 The repeating units of the fluoropolyether group RF are preferably C1 to C6 fluorinated diols, more preferably C1 to C4 fluorinated diols, and most preferably C1 to C3 fluorinated diols.

氟聚醚基團R F之較佳單體為全氟-1,2-丙二醇、全氟-1,3-丙二醇、全氟-1,2-乙二醇及二氟-1,1-二羥基-甲烷,較佳全氟-1,3-丙二醇、全氟-1,2-乙二醇及二氟-甲二醇。 Preferred monomers of the fluoropolyether group RF are perfluoro-1,2-propylene glycol, perfluoro-1,3-propylene glycol, perfluoro-1,2-ethylene glycol and difluoro-1,1-dihydroxy-methane, preferably perfluoro-1,3-propylene glycol, perfluoro-1,2-ethylene glycol and difluoro-methane glycol.

後一單體二氟-1,1-二羥基-甲烷可藉由氧化聚(四氟乙烯)獲得。The latter monomer, difluoro-1,1-dihydroxy-methane, can be obtained by oxidation of poly(tetrafluoroethylene).

二價全氟聚醚基團之較佳結構包括 -CF 2O(CF 2O) m(C 2F 4O) pCF 2-, 其中m及p之平均值為0至50,其限制條件為m及p不同時為零, -CF(CF 3)O(CF(CF 3)CF 2O) pCF(CF 3)-, -CF 2O(C 2F 4O) pCF 2-,及 -(CF 2) 3O(C 4F 8O) p(CF 2) 3-, 其中p之平均值為3至50。 Preferred structures of the divalent perfluoropolyether group include -CF2O ( CF2O ) m ( C2F4O ) pCF2- , wherein the average values of m and p are from 0 to 50 , with the proviso that m and p are not simultaneously zero, -CF( CF3 )O(CF( CF3 ) CF2O ) pCF ( CF3 )-, -CF2O (C2F4O)pCF2-, and -(CF2)3O(C4F8O)p(CF2)3- , wherein the average value of p is from 3 to 50.

其中,尤其較佳之結構為 -CF 2O(CF 2O) m(C 2F 4O) pCF 2-, -CF 2O(C 2F 4O) pCF 2-,及 -CF(CF 3)(OCF 2(CF 3)CF) pO(CF 2) mO(CF(CF 3)CF 2O) pCF(CF 3)-。 Among them, particularly preferred structures are -CF2O ( CF2O ) m ( C2F4O ) pCF2- , -CF2O ( C2F4O ) pCF2- , and -CF( CF3 )( OCF2 ( CF3 )CF )pO ( CF2 ) mO ( CF( CF3 ) CF2O ) pCF ( CF3 )-.

單價全氟聚醚基團之較佳結構包括 CF 3CF 2O(CF 2O) m(C 2F 4O) pCF 2-, CF 3CF 2O(C 2F 4O)pCF 2-, CF 3CF 2CF 2O(CF(CF 3)CF 2O) pCF(CF 3)-, 或其組合, 其中m及p之平均值為0至50且m及p不獨立地為0。 Preferred structures of the monovalent perfluoropolyether group include CF3CF2O (CF2O) m ( C2F4O ) pCF2- , CF3CF2O (C2F4O ) pCF2- , CF3CF2CF2O (CF( CF3 )CF2O) pCF ( CF3 )-, or combinations thereof, wherein the average values of m and p are 0 to 50 and m and p are not independently 0 .

尤其較佳為氟聚醚基團R F係選自 -CF 2O-[C 2F 4O] m-[CF 2O] n-,其中1 < n < 8且3 < m < 10 R-[C 3F 6O] n-,其中n = 2至10且R為直鏈或分支鏈,較佳直鏈全氟C 2或C 3醇,較佳C 3醇; Particularly preferred is a fluoropolyether group RF selected from -CF2O- [ C2F4O ] m- [ CF2O ] n- , wherein 1 < n < 8 and 3 < m < 10 R-[C3F6O ] n- , wherein n = 2 to 10 and R is a linear or branched chain, preferably a linear perfluoro C2 or C3 alcohol, preferably a C3 alcohol;

二價連接基團Q將全氟聚醚與含矽基團連接起來。The divalent linking group Q connects the perfluoropolyether to the silicon-containing group.

Q通常具有不超過500 g/mol,更佳不超過250 g/mol且最佳不超過150 g/mol之分子量。二價連接基團之實例為含醯胺基及伸烷基。Q usually has a molecular weight of no more than 500 g/mol, more preferably no more than 250 g/mol and most preferably no more than 150 g/mol. Examples of divalent linking groups are amide groups and alkylene groups.

氟聚醚化合物可在無其精確化學結構之公共知識下商購。Fluoropolyether compounds are commercially available without public knowledge of their precise chemical structures.

適合的市售包含氟聚醚化合物為例如Fluorolink S10(CAS編號223557-70-8,Solvay)、Optool TMDSX(Daikin Industries)、Shin-Etsu Subelyn TMKY-1900及KY-1901(Shin-Etsu Chemical)、Dow Corning ®2634(CAS編號870998-78-0)及SC-011及SC-019(Shin-Etsu Chemical)。 Suitable commercially available fluoropolyether compounds are, for example, Fluorolink S10 (CAS No. 223557-70-8, Solvay), Optool DSX (Daikin Industries), Shin-Etsu Subelyn KY-1900 and KY-1901 (Shin-Etsu Chemical), Dow Corning® 2634 (CAS No. 870998-78-0) and SC-011 and SC-019 (Shin-Etsu Chemical).

在第一具體實例中,第二塗層(C)較佳進一步包含一或多種,諸如一種、兩種、三種或四種,較佳一至三種,更佳一或兩種,最佳兩種第二矽氧烷聚合物(C-1))。在第二塗層(C)包含多於一種第二矽氧烷聚合物(C-1)之情況下,該等矽氧烷聚合物在至少一個特性方面不同。該至少一種特性可例如為矽烷單體之差異及/或分子量之差異。In the first specific example, the second coating layer (C) preferably further comprises one or more, such as one, two, three or four, preferably one to three, more preferably one or two, and most preferably two second siloxane polymers (C-1). In the case where the second coating layer (C) comprises more than one second siloxane polymer (C-1), the siloxane polymers differ in at least one property. The at least one property may be, for example, a difference in silane monomers and/or a difference in molecular weight.

以下論述可應用於第二矽氧烷聚合物(C-1)中之各者:The following discussion can be applied to each of the second siloxane polymer (C-1):

第二矽氧烷聚合物(C-1)較佳包含選自一或多種矽烷單體之單體單元。The second siloxane polymer (C-1) preferably comprises monomer units selected from one or more silane monomers.

由此,矽烷單體中之至少一者可包括能夠達成交聯至相鄰矽氧烷聚合物鏈之活性基團。Thus, at least one of the silane monomers may include a reactive group capable of achieving cross-linking to adjacent siloxane polymer chains.

接著,相鄰矽氧烷聚合物鏈通常藉助於該等活性基團交聯。Adjacent siloxane polymer chains are then usually cross-linked via these reactive groups.

第二矽氧烷聚合物(C-1)可包含選自1至10,諸如1至6,較佳1至4,更佳1或2種不同矽烷單體之單體單元。與此相關的「不同」意謂矽烷單體在至少一個化學部分上不同。The second siloxane polymer (C-1) may comprise monomer units selected from 1 to 10, such as 1 to 6, preferably 1 to 4, more preferably 1 or 2 different silane monomers. "Different" in this context means that the silane monomers differ in at least one chemical moiety.

活性基團(若存在)較佳為環氧基、脂環族環氧基(例如縮水甘油基)、乙烯基、烯丙基、丙烯酸酯、甲基丙烯酸酯及矽烷基及其組合。Preferred reactive groups, if present, are epoxide, alicyclic epoxide (e.g., glycidyl), vinyl, allyl, acrylate, methacrylate, and silane, and combinations thereof.

由此,環氧基、脂環族環氧基(例如縮水甘油基)、乙烯基、烯丙基、丙烯酸酯、甲基丙烯酸酯基在熱或輻射引發時,較佳在適合引發劑(諸如熱或自由基引發劑)存在下能夠達成與相鄰矽氧烷聚合物鏈交聯。Thus, epoxy, alicyclic epoxy (e.g., glycidyl), vinyl, allyl, acrylate, methacrylate groups are capable of crosslinking with adjacent siloxane polymer chains when initiated thermally or by radiation, preferably in the presence of a suitable initiator (e.g., a thermal or free radical initiator).

適合的熱或自由基引發劑較佳選自過氧苯甲酸三級戊酯、4,4-偶氮雙(4-氰基戊酸)、1,1'-偶氮二(環己烷甲腈)、過氧化苯甲醯、2,2-雙(三級丁基過氧)丁烷、1,1-雙(三級丁基過氧)環己烷、2,2'-偶氮二異丁腈(AIBN)、2,5-雙(三級丁基過氧)-Z,S-二甲基己烷、2,5-雙(三級丁基過氧)-2,5-二甲基-3-己炔、雙(1-(三級丁基過氧)-1-甲基乙基)苯、1,1-雙(三級丁基過氧)-3,3,5-三甲基環己烷、氫過氧化三級丁基、過乙酸三級丁酯、過氧化三級丁基、過氧苯甲酸三級丁酯、三級丁基過氧化異丙基碳酸酯、氫過氧化異丙苯、過氧化環己酮、過氧化二異丙苯、過氧化月桂醯、過氧化2,4-戊二酮、過氧乙酸或過硫酸鉀。尤其較佳為2,2'-偶氮二異丁腈(AIBN)。Suitable thermal or free radical initiators are preferably selected from triamyl peroxybenzoate, 4,4-azobis(4-cyanovaleric acid), 1,1'-azobis(cyclohexanecarbonitrile), benzoyl peroxide, 2,2-bis(tertiary butylperoxy)butane, 1,1-bis(tertiary butylperoxy)cyclohexane, 2,2'-azobisisobutyronitrile (AIBN), 2,5-bis(tertiary butylperoxy)-Z,S-dimethylhexane, 2,5-bis(tertiary butylperoxy)-2,5- Dimethyl-3-hexyne, bis(1-(tert-butylperoxy)-1-methylethyl)benzene, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, tert-butyl hydroperoxide, tert-butyl peracetate, tert-butyl peroxide, tert-butyl peroxybenzoate, tert-butyl peroxyisopropyl carbonate, isopropyl hydroperoxide, cyclohexanone peroxide, diisopropyl peroxide, lauryl peroxide, 2,4-pentanedione peroxide, peracetic acid or potassium persulfate. Particularly preferred is 2,2'-azobisisobutyronitrile (AIBN).

矽烷基團能夠在矽氫化時,較佳在適合催化劑(諸如基於鉑(Pt)之催化劑,諸如Speier催化劑(H 2PtCl 6.H 2O)、Karstedt催化劑(Pt(0)-1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷複合物溶液)或基於銠(Rh)之催化劑,諸如三(三苯基膦)氯化銠(I))之存在下達成與相鄰矽氧烷聚合物鏈之碳-碳雙鍵(諸如乙烯基或烯丙基)交聯。 Silane groups are capable of crosslinking with carbon-carbon double bonds (such as vinyl or allyl) of adjacent siloxane polymer chains during hydrosilylation, preferably in the presence of a suitable catalyst (such as platinum (Pt)-based catalysts, such as Speier's catalyst ( H2PtCl6.H2O ), Karstedt's catalyst (Pt(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex solution) or rhodium (Rh)-based catalysts, such as tris(triphenylphosphine)rhodium(I) chloride).

在一個具體實例中,含有第一活性基團,例如選自環氧基、脂環族環氧基(例如縮水甘油基)及乙烯基及烯丙基之單體與含有第二活性基團,例如選自丙烯酸酯基及甲基丙烯酸酯基之單體之間的莫耳比在1:100至100:1,特定言之1:10至10:1,例如5:1至1:2或3:1至1:1範圍內變化。In a specific example, the molar ratio between the monomer containing the first reactive group, e.g., selected from epoxy, alicyclic epoxy (e.g., glycidyl), vinyl and allyl, and the monomer containing the second reactive group, e.g., selected from acrylate and methacrylate, ranges from 1:100 to 100:1, specifically 1:10 to 10:1, e.g., 5:1 to 1:2 or 3:1 to 1:1.

在一些具體實例中,含有第二活性基團之組分亦選自除矽烷單體以外的含有丙烯酸酯及甲基丙烯酸酯之化合物,諸如四乙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、新戊四醇三丙烯酸酯、雙三甲基丙烷四丙烯酸酯、二新戊四醇五丙烯酸酯及二新戊四醇六丙烯酸酯及其組合。In some specific examples, the component containing the second reactive group is also selected from compounds containing acrylates and methacrylates other than silane monomers, such as tetraethylene glycol diacrylate, trihydroxymethylpropane triacrylate, pentaerythritol triacrylate, ditrimethylpropane tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and combinations thereof.

在一些具體實例中,基於單體之莫耳部分,活性基團或活性基團將以約1至35%之濃度存在。In some embodiments, the reactive group or groups will be present at a concentration of about 1 to about 35% based on the molar fraction of the monomer.

適合矽烷單體較佳由式(I)表示 R 1 aSiX 4-a(I) 其中 R 1係選自氫及包含直鏈及分支鏈烷基、環烷基、烯基、炔基、(烷基)丙烯酸酯、環氧基、烯丙基、乙烯基及烷氧基以及具有1至6個環之芳基的基團,且其中該基團經取代或未經取代; X為可水解基團或烴殘基;且 a為整數1至3。 Suitable silane monomers are preferably represented by formula (I): R 1 a SiX 4-a (I) wherein R 1 is selected from hydrogen and a group comprising linear and branched alkyl, cycloalkyl, alkenyl, alkynyl, (alkyl)acrylate, epoxide, allyl, vinyl and alkoxy, and an aromatic group having 1 to 6 rings, and wherein the group is substituted or unsubstituted; X is a hydrolyzable group or a hydrocarbon residue; and a is an integer of 1 to 3.

可水解基團尤其為烷氧基(參見式II)。The hydrolyzable group is especially an alkoxy group (see formula II).

R 1及/或可水解基團X之烷氧基可相同或不同,且較佳選自具有下式之基團 -O-R 2(II) 其中 R 2代表具有1至10個,較佳1至6個碳原子之直鏈或分支鏈烷基,且視情況呈現一或兩個選自鹵素、羥基、乙烯基、環氧基及烯丙基之群的取代基。最佳為甲氧基及乙氧基。 R1 and/or the alkoxy group of the hydrolyzable group X may be the same or different and are preferably selected from the group -OR2 (II) having the following formula: wherein R2 represents a linear or branched alkyl group having 1 to 10, preferably 1 to 6 carbon atoms and optionally presents one or two substituents selected from the group consisting of halogen, hydroxyl, vinyl, epoxy and allyl. The most preferred are methoxy and ethoxy.

尤佳為包含根據式(II)之烷氧基之二、三或四烷氧基矽烷。Particularly preferred are di-, tri- or tetraalkoxysilanes containing alkoxy groups according to formula (II).

特別合適的矽烷單體係選自以下之群:四乙氧基矽烷(TEOS)、四甲氧基矽烷(TMS)、甲基三乙氧基矽烷(MTEOS)、甲基三甲氧基矽烷(MTMS)、二甲基二乙氧基矽烷(DMDEOS)、二甲基二甲氧基矽烷(DMDMS)、二苯基二甲氧基矽烷(DPDMS)、3-(三甲氧基矽基)丙基甲基丙烯酸酯(MEMO)、3-(三乙氧基矽基)丙基甲基丙烯酸酯、5-(雙環庚烯基)三乙氧基矽烷(BCHTEOS)、(3-縮水甘油氧基丙基)三乙氧基矽烷、(3-縮水甘油氧基丙基)三甲氧基矽烷(GPTMS)、(十七氟-1,1,2,2-四氫癸基)三甲氧基矽烷、(十七氟-1,1,2,2-四氫癸基)三乙氧基矽烷(F17)、1H,1H,2H,2H-全氟十二烷基三乙氧基矽烷、1H,1H,2H,2H-全氟十二烷基三甲氧基矽烷、1H,1H,2H,2H-全氟辛基三乙氧基矽烷、1H,1H,2H,2H-全氟辛基三甲氧基矽烷、1H,1H,2H,2H-全氟戊基三乙氧基矽烷、1H,1H,2H,2H-全氟戊基三甲氧基矽烷、1H,1H,2H,2H-全氟十四烷基三乙氧基矽烷、1H,1H,2H,2H-全氟十四烷基三甲氧基矽烷、烯丙基三甲氧基矽烷(allylTMS)、烯丙基三乙氧基矽烷(allylTEOS)、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、(3-縮水甘油氧基丙基)二甲氧基甲基矽烷(Me-GPTMS)、甲基丙烯醯氧基丙基甲基二甲氧基矽烷(Me-MEMO)、苯基甲基二甲氧基矽烷(PMDMS)、雙[(2,2,3,3,4,4-六氟丁基)丙酸酯]-3-胺基丙基三甲氧基矽烷或其混合物。Particularly suitable silane monomers are selected from the group consisting of tetraethoxysilane (TEOS), tetramethoxysilane (TMS), methyltriethoxysilane (MTEOS), methyltrimethoxysilane (MTMS), dimethyldiethoxysilane (DMDEOS), dimethyldimethoxysilane (DMDMS), diphenyldimethoxysilane (DPDMS), 3-(trimethoxysilyl)propylmethacrylate (MEMO), 3-(triethoxysilyl)propylmethacrylate Ester, 5-(bicycloheptenyl)triethoxysilane (BCHTEOS), (3-glycidyloxypropyl)triethoxysilane, (3-glycidyloxypropyl)trimethoxysilane (GPTMS), (heptadecafluoro-1,1,2,2-tetrahydrodecyl)trimethoxysilane, (heptadecafluoro-1,1,2,2-tetrahydrodecyl)triethoxysilane (F17), 1H,1H,2H,2H-perfluorododecyltriethoxysilane, 1H,1H,2H,2H-perfluoro Dodecyltrimethoxysilane, 1H,1H,2H,2H-perfluorooctyltriethoxysilane, 1H,1H,2H,2H-perfluorooctyltrimethoxysilane, 1H,1H,2H,2H-perfluoropentyltriethoxysilane, 1H,1H,2H,2H-perfluoropentyltrimethoxysilane, 1H,1H,2H,2H-perfluorotetradecyltriethoxysilane, 1H,1H,2H,2H-perfluorotetradecyltrimethoxysilane, allyltrimethoxysilane (all ylTMS), allyl triethoxysilane (allylTEOS), vinyl trimethoxysilane, vinyl triethoxysilane, (3-glycidyloxypropyl) dimethoxymethyl silane (Me-GPTMS), methacryloxypropyl methyl dimethoxy silane (Me-MEMO), phenyl methyl dimethoxy silane (PMDMS), bis [(2,2,3,3,4,4-hexafluorobutyl) propionate] -3-aminopropyl trimethoxy silane or a mixture thereof.

矽烷單體較佳係選自四乙氧基矽烷(TEOS)及甲基三甲氧基矽烷(MTMS)之群。The silane monomer is preferably selected from the group consisting of tetraethoxysilane (TEOS) and methyltrimethoxysilane (MTMS).

該等矽烷單體較佳以50至100 mol%、較佳50至99 mol%、再更佳65至97 mol%之莫耳量存在於矽氧烷聚合物中。The silane monomers are preferably present in the siloxane polymer in a molar amount of 50 to 100 mol %, preferably 50 to 99 mol %, and more preferably 65 to 97 mol %.

在一個具體實例中,第一矽氧烷聚合物(B-1)之至少兩種不同矽烷單體包含至少一種雙矽烷。In one embodiment, the at least two different silane monomers of the first siloxane polymer (B-1) include at least one bissilane.

適合之雙矽烷較佳由式(III)表示 (R 3) 3Si-Y-Si(R 4) 3,           (III) 其中 R 3及R 4獨立地選自氫及由直鏈或分支鏈烷基、環烷基、烯基、炔基、(烷基)丙烯酸酯、環氧基、烯丙基、乙烯基、烷氧基以及具有1至6個環之芳基組成之群的基團,且其中該基團經取代或未經取代;及 Y為選自二價未經取代或經取代之脂族及芳族基團的鍵聯基團,諸如伸烷基、伸芳基、-O-伸烷基-O-;-O-伸芳基-O-;伸烷基-O-伸烷基、伸芳基-O-伸芳基;伸烷基-Z 1C(=O)Z 2-伸烷基、伸芳基-Z 1C(=O)Z 2-伸芳基及-O-伸烷基-Z 1C(=O)Z 2-伸苯基-O-;-O-伸芳基-Z 1C(=O)Z 2-伸芳基-O-,其中Z 1及Z 2各自選自直接鍵或-O-。 Suitable bissilanes are preferably represented by the formula (III): (R 3 ) 3 Si—Y—Si(R 4 ) 3 , (III) wherein R 3 and R 4 are independently selected from hydrogen and a group consisting of a linear or branched alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, an (alkyl)acrylate group, an epoxide group, an allyl group, a vinyl group, an alkoxy group and an aryl group having 1 to 6 rings, and wherein the group is substituted or unsubstituted; and Y is a linking group selected from divalent unsubstituted or substituted aliphatic and aromatic groups, such as alkylene, arylene, —O-alkylene-O—; —O-arylene-O—; alkylene-O-alkylene, arylene-O-arylene; alkylene-Z 1 C(═O)Z 2 -alkylene, arylene-Z 1 C(═O)Z 2 -arylene and -O-alkylene-Z 1 C(═O)Z 2 -phenylene-O—; -O-arylene-Z 1 C(═O)Z 2 -arylene-O—, wherein Z 1 and Z 2 are independently selected from a direct bond or —O—.

在二價「伸烷基」基團及其他類似脂族基團中,烷基殘基(或衍生自烷基部分之殘基)代表1至10個、較佳1至8個、或1至6個或甚至1至4個碳原子,實例包括伸乙基及亞甲基及伸丙基。In divalent "alkylene" groups and other similar aliphatic groups, the alkyl residue (or the residue derived from the alkyl part) represents 1 to 10, preferably 1 to 8, or 1 to 6 or even 1 to 4 carbon atoms, examples include ethylene and methylene and propylene.

「伸芳基」代表典型地含有1至3個芳環及6至18個碳原子之芳族二價基團。此類基團藉由伸苯基(例如1,4-伸苯基及1,3-伸苯基)及伸聯苯基以及伸萘基或伸蒽基例示。"Arylene" represents an aromatic divalent radical typically containing 1 to 3 aromatic rings and 6 to 18 carbon atoms. Such radicals are exemplified by phenylene (e.g., 1,4-phenylene and 1,3-phenylene) and biphenylene as well as naphthylene or anthracenylene.

伸烷基及伸芳基可視情況經1至5個選自以下之取代基取代:羥基、鹵基、乙烯基、環氧基及烯丙基以及烷基、芳基及芳烷基。The alkylene group and the arylene group may be substituted with 1 to 5 substituents selected from the group consisting of a hydroxyl group, a halogen group, a vinyl group, an epoxy group and an allyl group as well as an alkyl group, an aryl group and an aralkyl group, as the case may be.

較佳烷氧基含有1至4個碳原子。實例為甲氧基及乙氧基。Preferred alkoxy groups contain 1 to 4 carbon atoms. Examples are methoxy and ethoxy.

術語「苯基」包括經取代的苯基,諸如苯基三烷氧基,尤其苯基三甲氧基或三乙氧基,以及全氟苯基。苯基以及其他芳族或脂環族基團可直接偶合至矽原子,或其可經由亞甲基或伸乙基橋偶合至矽原子。The term "phenyl" includes substituted phenyl groups, such as phenyltrialkoxy groups, especially phenyltrimethoxy or triethoxy groups, and perfluorophenyl groups. The phenyl group and other aromatic or alicyclic groups can be coupled directly to the silicon atom, or they can be coupled to the silicon atom via a methylene or ethylene bridge.

例示性雙矽烷包括1,2-雙(三乙氧基矽基)乙烷(BTESE)、1,2-雙(三甲氧基矽基)乙烷(MEOS)及其混合物。Exemplary bissilanes include 1,2-bis(triethoxysilyl)ethane (BTESE), 1,2-bis(trimethoxysilyl)ethane (MEOS), and mixtures thereof.

較佳具有以0至50 mol%、較佳1至50 mol%、再更佳3至35 mol%之莫耳量存在於矽氧烷聚合物中之雙矽烷。Preferably, the bissilane is present in the siloxane polymer in a molar amount of 0 to 50 mol %, preferably 1 to 50 mol %, and more preferably 3 to 35 mol %.

尤其較佳地,至少一種矽烷單體係選自四乙氧基矽烷(TEOS)及甲基三甲氧基矽烷(MTMS)之群。Particularly preferably, at least one silane monomer is selected from the group consisting of tetraethoxysilane (TEOS) and methyltrimethoxysilane (MTMS).

包含至少一種第二矽氧烷聚合物(C-1)之第二組成物較佳藉由包含以下步驟之方法形成: ●   在第一溶劑中混合較佳如上文或下文所描述之至少兩種不同矽烷單體以形成混合物; ●   使該混合物在催化劑存在下經歷該等單體之至少部分水解,由此使該等水解單體至少部分聚合且交聯; ●   視情況將該第一溶劑更換為第二溶劑; ●   視情況藉由矽氫化、熱或輻射引發使該混合物進一步交聯。 The second composition comprising at least one second siloxane polymer (C-1) is preferably formed by a method comprising the following steps: ●   Mixing at least two different silane monomers, preferably as described above or below, in a first solvent to form a mixture; ●   Subjecting the mixture to at least partial hydrolysis of the monomers in the presence of a catalyst, thereby causing the hydrolyzed monomers to at least partially polymerize and crosslink; ●   Optionally replacing the first solvent with a second solvent; ●   Optionally crosslinking the mixture by hydrosilylation, heat or radiation initiation.

在第二組成物包含多於一種第二矽氧烷聚合物(C-1)之情況下,對於第二矽氧烷聚合物(C-1)中之各者重複以上步驟。In case the second composition comprises more than one second siloxane polymer (C-1), the above steps are repeated for each of the second siloxane polymers (C-1).

第一溶劑較佳選自以下之群:丙酮、四氫呋喃(THF)、甲苯、1-丙醇、2-丙醇、甲醇、乙醇、水(H 2O)、環戊酮、乙腈、丙二醇丙醚、甲基-三級丁基醚(MTBE)、丙二醇單甲醚乙酸酯(PGMEA)、甲基乙基酮、甲基異丁基酮、丙二醇單甲醚(PGME)及丙二醇丙醚(PnP)。 The first solvent is preferably selected from the group consisting of acetone, tetrahydrofuran (THF), toluene, 1-propanol, 2-propanol, methanol, ethanol, water ( H2O ), cyclopentanone, acetonitrile, propylene glycol propyl ether, methyl tertiary butyl ether (MTBE), propylene glycol monomethyl ether acetate (PGMEA), methyl ethyl ketone, methyl isobutyl ketone, propylene glycol monomethyl ether (PGME) and propylene glycol propyl ether (PnP).

至少兩種不同矽烷單體可在任何適合之溫度下混合於第一溶劑中以溶解矽烷單體。通常情況下,室溫足夠。At least two different silane monomers may be mixed in a first solvent at any suitable temperature to dissolve the silane monomers. Typically, room temperature is sufficient.

在下一方法步驟中,使混合物在催化劑存在下經歷至少部分水解。In the next process step, the mixture undergoes at least partial hydrolysis in the presence of a catalyst.

適合之催化劑為酸性催化劑、鹼性催化劑或其他催化劑。Suitable catalysts are acidic catalysts, alkaline catalysts or other catalysts.

酸性催化劑較佳選自硝酸(HNO 3)、硫酸(H 2SO 4)、甲酸(HCOOH)、鹽酸(HCl)、磺酸、氟化氫(HF)、乙酸(CH 3COOH)、三氟甲磺酸或對甲苯磺酸。尤其較佳的酸性催化劑為硝酸(HNO 3)、甲酸(HCOOH)及鹽酸(HCl)。 The acidic catalyst is preferably selected from nitric acid (HNO 3 ), sulfuric acid (H 2 SO 4 ), formic acid (HCOOH), hydrochloric acid (HCl), sulfonic acid, hydrogen fluoride (HF), acetic acid (CH 3 COOH), trifluoromethanesulfonic acid or p-toluenesulfonic acid. Particularly preferred acidic catalysts are nitric acid (HNO 3 ), formic acid (HCOOH) and hydrochloric acid (HCl).

鹼性催化劑較佳選自三乙胺(TEA)、氫氧化銨(NH 4OH)、氫氧化四乙銨(TEAH)、氫氧化四甲銨(TMEA)、1,4-二氮雜雙環[2.2.2]辛烷、咪唑及二伸乙基三胺。 The alkaline catalyst is preferably selected from triethylamine (TEA), ammonium hydroxide (NH 4 OH), tetraethylammonium hydroxide (TEAH), tetramethylammonium hydroxide (TMEA), 1,4-diazabicyclo[2.2.2]octane, imidazole and diethylenetriamine.

其他催化劑較佳選自2,2,3,3,4,4,5,5-八氟戊基丙烯酸酯、聚(乙二醇) 200、聚(乙二醇) 300及正丁基三聚氰胺甲醛樹脂。Other catalysts are preferably selected from 2,2,3,3,4,4,5,5-octafluoropentyl acrylate, poly(ethylene glycol) 200, poly(ethylene glycol) 300 and n-butyl melamine formaldehyde resin.

水解步驟較佳在20至80℃之溫度下進行1至24小時,諸如在室溫下進行隔夜。The hydrolysis step is preferably carried out at a temperature of 20 to 80°C for 1 to 24 hours, such as overnight at room temperature.

在水解步驟期間,矽烷單體至少部分水解。該至少部分水解之矽烷單體隨後至少部分聚合,較佳藉由縮合聚合且交聯形成矽氧烷聚合物。During the hydrolysis step, the silane monomers are at least partially hydrolyzed. The at least partially hydrolyzed silane monomers are then at least partially polymerized, preferably by condensation polymerization and crosslinking to form a siloxane polymer.

該聚矽氧烷通常具有在約500至2000 g/mol範圍內之相對較低分子量。The polysiloxanes typically have a relatively low molecular weight in the range of about 500 to 2000 g/mol.

根據一較佳具體實例,使混合物經受至少部分水解包括回流。典型回流時間為2小時。According to a preferred embodiment, subjecting the mixture to at least partial hydrolysis comprises refluxing. Typical reflux time is 2 hours.

在水解步驟之後,在視情況選用之另一方法步驟中,第一溶劑可更換為第二溶劑。視情況選用之溶劑更換係有利的,因為其有助於移除在水解矽烷單體期間形成的水及醇。另外,當用作基板上之塗層時,其改良了最終矽氧烷聚合物溶液之特性。After the hydrolysis step, in an optional further process step, the first solvent may be replaced with a second solvent. The optional solvent replacement is advantageous because it helps remove water and alcohol formed during the hydrolysis of the silane monomers. In addition, it improves the properties of the final siloxane polymer solution when used as a coating on a substrate.

第二溶劑較佳選自丙二醇甲基醚(PGME)、丙二醇甲基醚乙酸酯(PGMEA)、1-乙醇、2-乙醇(IPA)、丙烯腈二丙酮醇(DAA)或丙二醇正丙基醚(PnP)之群。The second solvent is preferably selected from the group consisting of propylene glycol methyl ether (PGME), propylene glycol methyl ether acetate (PGMEA), 1-ethanol, 2-ethanol (IPA), acrylonitrile diacetone alcohol (DAA) or propylene glycol n-propyl ether (PnP).

包含矽氧烷聚合物之混合物可在水解步驟之後進一步經歷交聯步驟。由此,矽氧烷聚合物較佳藉由矽氫化、熱或輻射引發至少部分交聯。The mixture comprising the siloxane polymer may be further subjected to a crosslinking step after the hydrolysis step. Thereby, the siloxane polymer is preferably at least partially crosslinked by hydrosilylation, heat or radiation.

在本上下文中,術語「部分交聯」意謂聚合物能夠在有利於交聯之條件下進一步交聯。實務上,在第一聚合步驟之後聚合物仍含有至少一些反應性交聯基團。下文將描述典型地在部分交聯之組成物沉積於基板上之後發生的進一步交聯。In this context, the term "partially crosslinked" means that the polymer is capable of further crosslinking under conditions that are favorable for crosslinking. In practice, the polymer still contains at least some reactive crosslinking groups after the first polymerization step. Further crosslinking that typically occurs after the partially crosslinked composition is deposited on a substrate will be described below.

矽氧烷聚合物較佳使用如上文所描述之催化劑藉由矽氫化、熱或輻射引發至少部分交聯。The siloxane polymers are preferably at least partially crosslinked by hydrosilylation, heat or radiation using a catalyst as described above.

由此,較佳在約30℃至200℃範圍內之溫度下進行熱交聯。Thus, thermal crosslinking is preferably performed at a temperature in the range of about 30°C to 200°C.

典型地交聯在溶劑之回流條件下進行。Typically the crosslinking is carried out under refluxing conditions of the solvent.

為了改良材料在應用於光微影時之解析度,矽氧烷聚合物可視情況在聚合期間,尤其在縮合聚合期間或緊接在縮合聚合之後部分交聯。各種方法可用於達成交聯。舉例而言,可採用交聯方法,其中兩個鏈經由不影響任何意欲用於UV光微影之活性基團的反應性基團接合。舉例而言,例如使用一個鏈上的質子與另一條鏈上的雙鍵反應之矽氫化將達成所需種類之交聯。另一實例為經由雙鍵或環氧基進行的交聯。In order to improve the resolution of the material when used in photolithography, the siloxane polymer can be partially crosslinked during polymerization, especially during or immediately after condensation polymerization, as appropriate. Various methods can be used to achieve the crosslinking. For example, a crosslinking method can be used in which two chains are joined via reactive groups that do not affect any active groups intended for UV photolithography. For example, hydrosilylation, such as using a proton on one chain to react with a double bond on another chain, will achieve the desired type of crosslinking. Another example is crosslinking via double bonds or epoxy groups.

不同活性基團較佳用於交聯及用於光微影。因此,矽氧烷聚合物之交聯可使用自由基引發劑及光酸產生劑用具有雙鍵或環氧基或兩者兼具之活性基團(諸如環氧基、乙烯基或烯丙基或甲基丙烯酸酯基)達成。Different reactive groups are preferred for crosslinking and for photolithography. Thus, crosslinking of siloxane polymers can be achieved using free radical initiators and photoacid generators with reactive groups having double bonds or epoxy groups or both, such as epoxy, vinyl or allyl or methacrylate groups.

環氧基可用於UV光微影,且反之亦然。交聯所需之活性基團比例通常小於UV光微影所需之活性基團比例,例如基於單體計約0.1至10 mol%以用於交聯及基於單體計約5至50 mol%以用於UV光微影。Epoxy groups can be used for UV lithography, and vice versa. The proportion of reactive groups required for crosslinking is generally less than that required for UV lithography, for example, about 0.1 to 10 mol % based on monomer for crosslinking and about 5 to 50 mol % based on monomer for UV lithography.

添加至反應混合物/溶液中之引發劑之量一般為約0.1至10 wt%,較佳約0.5至5 wt%,根據矽氧烷聚合物之總重量計算。The amount of initiator added to the reaction mixture/solution is generally about 0.1 to 10 wt %, preferably about 0.5 to 5 wt %, based on the total weight of the siloxane polymer.

由於部分交聯,分子量將典型地為2至10倍。因此,根據在約500至2000 g/mol範圍內之分子量,交聯將使其增加超過3000 g/mol,較佳增加至4000至20000 g/mol。Due to partial crosslinking, the molecular weight will typically be 2 to 10 times higher. Thus, with a molecular weight in the range of about 500 to 2000 g/mol, crosslinking will increase it to more than 3000 g/mol, preferably to 4000 to 20000 g/mol.

視情況,存在於矽氧烷聚合物之主鏈中之所得游離Si-OH基團可經封端來保護。為封端,使游離Si-OH基團與矽烷(諸如甲基二氯氟矽烷(Cl 2FSiCH 3、甲基氟二甲氧基矽烷((MeO) 2SiFCH 3)、3-氯丙基三甲氧基矽烷(Cl(CH 2) 3Si(OMe) 3)、乙基三甲氧基矽烷(ETMS)或三甲基氯矽烷(ClSiMe 3))在諸如三乙基鋁(TEA)或咪唑之催化劑存在下反應。催化劑之量在總固體之1.5至2 wt%範圍內變化。反應時間在40至45 min範圍內變化。 Optionally, the resulting free Si-OH groups present in the backbone of the siloxane polymer can be protected by end-capping. For end-capping, the free Si-OH groups are reacted with silanes such as methyldichlorofluorosilane ( Cl2FSiCH3 , methylfluorodimethoxysilane ((MeO) 2SiFCH3 ), 3 - chloropropyltrimethoxysilane (Cl( CH2 ) 3Si (OMe) 3 ), ethyltrimethoxysilane (ETMS) or trimethylchlorosilane ( ClSiMe3 ) in the presence of a catalyst such as triethylaluminum (TEA) or imidazole. The amount of catalyst varies in the range of 1.5 to 2 wt% of the total solids. The reaction time varies in the range of 40 to 45 min.

典型地引入至包含氟聚醚化合物及至少一種第二矽氧烷聚合物(C-1)之第二組成物中的其他添加劑包括可進一步改變經塗佈及固化之膜的最終表面特性或改良塗層(B)對基板層(A)或其他塗層(C)之潤濕性/黏附特性或改良沉積及乾燥期間之塗層乾燥及包裝行為以達到良好視覺品質之化學物質。Other additives typically introduced into the second composition comprising the fluoropolyether compound and at least one second siloxane polymer (C-1) include chemicals that can further modify the final surface properties of the coated and cured film or improve the wetting/adhesion properties of the coating (B) to the substrate layer (A) or other coatings (C) or improve the coating drying and packaging behavior during deposition and drying to achieve good visual quality.

此等添加劑可為界面活性劑、消泡劑、防污劑、潤濕劑等。此類添加劑之實例包括:BYK-301、BYK-306、BYK-307、BYK-308、BYK-333、BYK-051、BYK-036、BYK-028、BYK-057A、BYK-011、BYK-055、BYK-036、BYK-067A、BYK-088、BYK-302、BYK-310、BYK-322、BYK-323、BYK-33l、BYK-333、BYK-341、BYK-345、BYK-348、BYK-370、BYK-377、BYK-378、BYK-381、BYK-390、BYK-3700。Such additives may be surfactants, defoamers, antifouling agents, wetting agents, etc. Examples of such additives include: BYK-301, BYK-306, BYK-307, BYK-308, BYK-333, BYK-051, BYK-036, BYK-028, BYK-057A, BYK-011, BYK-055, BYK-036, BYK-067A, BYK-08 8. BYK-302, BYK-310, BYK-322, BYK-323, BYK-33l, BYK-333, BYK-341, BYK-345, BYK-348, BYK-370, BYK-377, BYK-378, BYK-381, BYK-390, BYK-3700.

添加劑較佳以固體總重量之0.01至5 wt%、更佳0.1至1 wt%之量存在。The additive is preferably present in an amount of 0.01 to 5 wt %, more preferably 0.1 to 1 wt %, based on the total weight of the solids.

在進一步縮合之前,較佳地自材料移除過量水,且在此階段有可能視需要使溶劑更換為另一合成溶劑。此其他合成溶劑可充當矽氧烷聚合物之最終加工溶劑或最終加工溶劑中之一者。殘餘水及醇及其他副產物可在進一步縮合步驟完成之後移除。可在調配步驟期間添加額外加工溶劑以形成最終加工溶劑組合。可在矽氧烷聚合物之最終過濾之前添加添加劑,諸如熱引發劑、輻射敏感性引發劑、敏化劑、界面活性劑及其他添加劑。在調配組成物之後,聚合物準備好在例如輥對輥膜沉積中或在微影製程中進行加工。Before further condensation, excess water is preferably removed from the material, and it is possible at this stage to change the solvent to another synthesis solvent if necessary. This other synthesis solvent may serve as the final processing solvent or one of the final processing solvents for the siloxane polymer. Residual water and alcohol and other by-products may be removed after the further condensation steps are completed. Additional processing solvents may be added during the formulation steps to form the final processing solvent combination. Additives such as thermal initiators, radiation sensitive initiators, sensitizers, surfactants and other additives may be added before the final filtration of the siloxane polymer. After formulating the composition, the polymer is ready to be processed, for example in roll-to-roll film deposition or in a lithography process.

藉由調節水解及縮合條件,可控制能夠去質子化之基團(例如OH-基團)及來自矽氧烷聚合物組成物之矽烷前驅體之任何殘餘離去基團(例如烷氧基)的濃度/含量,且亦控制矽氧烷聚合物之最終分子量。此大大影響矽氧烷聚合物材料在基於水溶液之顯影劑溶液中的溶解度。此外,聚合物之分子量亦極大地影響矽氧烷聚合物在顯影溶液中之溶解度特性。By adjusting the hydrolysis and condensation conditions, the concentration/content of groups capable of deprotonation (e.g., OH-groups) and any residual groups left from the silane precursor of the siloxane polymer composition (e.g., alkoxy groups) can be controlled, and the final molecular weight of the siloxane polymer can also be controlled. This greatly affects the solubility of the siloxane polymer material in aqueous-based developer solutions. In addition, the molecular weight of the polymer also greatly affects the solubility characteristics of the siloxane polymer in the developer solution.

因此,舉例而言,已發現當最終矽氧烷聚合物具有高含量之剩餘羥基及低含量之烷氧基(例如乙氧基)基團時,最終矽氧烷聚合物可溶解於鹼-水顯影劑溶液(例如氫氧化四甲基銨;TMAH或氫氧化鉀;KOH)中。Thus, for example, it has been found that the final siloxane polymer is soluble in an alkaline-water developer solution (e.g., tetramethylammonium hydroxide; TMAH or potassium hydroxide; KOH) when the final siloxane polymer has a high content of residual hydroxyl groups and a low content of alkoxy (e.g., ethoxy) groups.

另一方面,若最終矽氧烷聚合物之剩餘烷氧基-基團含量較高,且其幾乎不含有任何OH-基團,則最終矽氧烷聚合物在以上種類之鹼-水顯影劑中具有極低溶解度。OH-基團或其他官能基,諸如胺基(NH 2)、硫醇(SH)、羧基、苯酚或類似的產生對鹼性顯影劑系統的溶解性的官能基可直接連接至矽氧烷聚合物主鏈之矽原子或視情況連接至與矽氧烷聚合物主鏈連接的有機官能基以進一步促進且控制鹼性顯影劑溶解性。 On the other hand, if the residual alkoxy-group content of the final siloxane polymer is high and it contains almost no OH-groups, the final siloxane polymer has very low solubility in the above-mentioned types of alkaline-water developers. OH-groups or other functional groups, such as amine ( NH2 ), thiol (SH), carboxyl, phenol or similar functional groups that impart solubility to alkaline developer systems can be directly attached to the silicon atoms of the siloxane polymer backbone or, as the case may be, to organic functional groups attached to the siloxane polymer backbone to further promote and control the alkaline developer solubility.

如上文所提及,對於第二矽氧烷聚合物(C-1)中之各者重複製備第二矽氧烷聚合物(C-1)之方法。As mentioned above, the method of preparing the second siloxane polymer (C-1) is repeated for each of the second siloxane polymers (C-1).

第二矽氧烷聚合物(C-1)可使用恰當溶劑或溶劑組合稀釋,得到固體含量,其在膜沉積中將產生預選膜厚度。The second siloxane polymer (C-1) can be diluted using an appropriate solvent or combination of solvents to obtain a solids content that will produce a preselected film thickness during film deposition.

溶劑或溶劑組合較佳包含氟化溶劑,諸如甲氧基-九氟丁烷或1,1,2,2-四氟乙基-2,2,2-三氟乙基醚。The solvent or solvent combination preferably comprises a fluorinated solvent, such as methoxy-nonafluorobutane or 1,1,2,2-tetrafluoroethyl-2,2,2-trifluoroethyl ether.

通常,在合成之後向矽氧烷組成物中添加另一量之引發劑分子化合物。引發劑可視情況與聚合期間所添加之引發劑類似,用於產生可引發UV固化步驟中之「活性」官能基之聚合的物質。因此,在環氧基之情況下,可使用陽離子或陰離子引發劑。在合成材料中具有雙鍵作為「活性」官能基之基團的情況下,可採用自由基引發劑。此外,熱引發劑(根據自由基、陽離子或陰離子機制工作)可用於促進「活性」官能基之交聯。光引發劑及敏化劑之恰當組合之選擇亦取決於所使用曝光源(波長)。此外,所使用敏化劑之選擇視所選擇之引發劑類型而定。Typically, a further amount of an initiator molecule compound is added to the siloxane composition after synthesis. The initiator may, as the case may be, be similar to the initiator added during the polymerization and is used to produce a substance that can initiate the polymerization of the "active" functional groups in the UV curing step. Thus, in the case of epoxy groups, cationic or anionic initiators can be used. In the case of groups with double bonds as "active" functional groups in the synthetic material, free radical initiators can be employed. Furthermore, thermal initiators (working according to a free radical, cationic or anionic mechanism) can be used to promote the crosslinking of the "active" functional groups. The choice of the appropriate combination of photoinitiators and sensitizers also depends on the exposure source (wavelength) used. Furthermore, the choice of sensitizer used depends on the type of initiator chosen.

組成物中熱或輻射引發劑及敏化劑之濃度一般為約0.1至10%,較佳約0.5至5%,其由矽氧烷聚合物之質量計算。The concentration of the thermal or radiation initiator and the sensitizer in the composition is generally about 0.1 to 10%, preferably about 0.5 to 5%, calculated on the mass of the siloxane polymer.

在第二具體實例中,第二組成物不包括一或多種第二矽氧烷聚合物(C-1)。在該第二具體實例中,較佳將氟聚醚化合物溶解於溶劑中以形成第二組成物。In a second embodiment, the second composition does not include one or more second siloxane polymers (C-1). In the second embodiment, the fluoropolyether compound is preferably dissolved in a solvent to form the second composition.

在該具體實例中,氟聚醚化合物較佳為包含可水解基團之氟聚醚矽烷(PFS)。In this embodiment, the fluoropolyether compound is preferably a fluoropolyether silane (PFS) containing a hydrolyzable group.

溶劑較佳包含,更佳為氟化溶劑,諸如甲氧基-九氟丁烷或1,1,2,2-四氟乙基-2,2,2-三氟乙基醚,較佳1,1,2,2-四氟乙基-2,2,2-三氟乙基醚。The solvent preferably comprises, more preferably is a fluorinated solvent, such as methoxy-nonafluorobutane or 1,1,2,2-tetrafluoroethyl-2,2,2-trifluoroethyl ether, preferably 1,1,2,2-tetrafluoroethyl-2,2,2-trifluoroethyl ether.

在該具體實例中,第二組成物較佳由氟聚醚化合物及溶劑組成。In this embodiment, the second component preferably consists of a fluoropolyether compound and a solvent.

以下程序適用於第二塗層(C)之所有具體實例:The following procedure applies to all specific instances of the second coating (C):

將包含氟聚醚化合物之第二組成物沉積於基板之至少一個表面上以形成與第一塗層(B)之至少一個表面黏附接觸之第二塗層(C)。A second composition comprising a fluoropolyether compound is deposited on at least one surface of the substrate to form a second coating layer (C) that is in adhesive contact with at least one surface of the first coating layer (B).

適合沉積法包括旋塗、夾塗、噴霧、噴墨、輥對輥、凹版印刷、反向凹版印刷、刮棒塗佈、狹縫塗佈、柔版印刷、簾式塗佈、網板印刷塗佈法、擠壓塗佈、浸塗、淋塗或縫塗。Suitable deposition methods include spin coating, nip coating, spraying, ink jetting, roll-to-roll, gravure printing, reverse gravure printing, doctor bar coating, slot coating, flexographic printing, curtain coating, screen printing coating, extrusion coating, dip coating, shower coating or slot coating.

包含氟聚醚化合物之經沉積的第二組成物在第一塗層(B)之表面上形成第二塗層(C)。典型地,在沉積之後或在沉積步驟期間,蒸發溶劑且較佳藉由熱乾燥或視情況藉由合併之真空及/或熱乾燥來乾燥第二塗層(C)。此步驟亦稱作預固化。The deposited second composition comprising a fluoropolyether compound forms a second coating layer (C) on the surface of the first coating layer (B). Typically, after deposition or during the deposition step, the solvent is evaporated and the second coating layer (C) is dried, preferably by thermal drying or, as the case may be, by combined vacuum and/or thermal drying. This step is also called pre-curing.

在第二後續步驟中,第二塗層(C)藉由在高溫下熱固化或藉由使用UV曝露隨後在高溫下進行熱固化而固化至最終硬度。In a second subsequent step, the second coating layer (C) is cured to a final hardness by thermal curing at elevated temperature or by using UV exposure followed by thermal curing at elevated temperature.

在一個具體實例中,預固化及最終固化步驟藉由使用增加之加熱梯度進行加熱來組合。除僅熱固化製程以外,固化可在三個步驟中進行,該製程包含熱預固化及UV固化,之後為最終熱固化。亦可應用兩步固化製程,其中熱預固化之後為UV固化。在此情況下,在UV固化之後較佳不應用最終熱固化。In one specific example, the pre-cure and final cure steps are combined by heating using an increasing heating gradient. In addition to a heat-only curing process, curing can be performed in three steps, the process comprising a thermal pre-cure and a UV cure followed by a final thermal cure. A two-step curing process can also be applied, wherein a thermal pre-cure is followed by a UV cure. In this case, preferably no final thermal cure is applied after the UV cure.

根據一特定具體實例,該方法進一步包括使所沉積之膜顯影。在一個具體實例中,顯影包含使沉積之第一矽氧烷聚合物組成物曝露(全區域或使用光罩或十字線或雷射直接成像之選擇性曝露)於UV光。顯影步驟典型地在任何預固化步驟之後且在最終固化步驟之前進行。According to a specific embodiment, the method further comprises developing the deposited film. In one embodiment, developing comprises exposing the deposited first siloxane polymer composition (full area or selective exposure using a mask or crosshairs or laser direct imaging) to UV light. The developing step is typically performed after any pre-curing step and before the final curing step.

因此,在一個具體實例中,該方法包含以下步驟 -    預固化或乾燥沉積於第一塗層(A)上之第二塗層(C); -    視情況曝露由此獲得第二塗層(C); -    視情況使由此獲得之第二塗層(C)顯影;及 -    固化第二塗層(C)。 Therefore, in a specific example, the method comprises the following steps: -    pre-curing or drying the second coating layer (C) deposited on the first coating layer (A); -    exposing the second coating layer (C) obtained thereby as appropriate; -    developing the second coating layer (C) obtained thereby as appropriate; and -    curing the second coating layer (C).

例示性含有環氧官能基的單體包括(3-縮水甘油氧基丙基)三甲氧基矽烷、1-(2-(三甲氧基矽基)乙基)環己烷-3,4-環氧化物、(3-縮水甘油氧基丙基)三乙氧基矽烷、(3-縮水甘油氧基丙基)三丙氧基矽烷、3-縮水甘油氧基丙基三(2-甲氧基乙氧基)矽烷、2,3-環氧基丙基三乙氧基矽烷、3,4-環氧基丁基三乙氧基矽烷、4,5-環氧基戊基三乙氧基矽烷、5,6-環氧基己基三乙氧基矽烷、5,6-環氧基己基三甲氧基矽烷、2-(3,4-環氧基環己基)乙基三乙氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、4-(三甲氧基矽基)丁烷-1,2-環氧化物。Exemplary monomers containing epoxy functional groups include (3-glycidyloxypropyl)trimethoxysilane, 1-(2-(trimethoxysilyl)ethyl)cyclohexane-3,4-epoxide, (3-glycidyloxypropyl)triethoxysilane, (3-glycidyloxypropyl)tripropoxysilane, 3-glycidyloxypropyltri(2-methoxyethoxy)silane, 2,3-epoxypropyltriethyl triethoxysilane, 3,4-epoxybutyltriethoxysilane, 4,5-epoxypentyltriethoxysilane, 5,6-epoxyhexyltriethoxysilane, 5,6-epoxyhexyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 4-(trimethoxysilyl)butane-1,2-epoxide.

官能化化合物之其他實例為丙烯酸酯及甲基丙烯酸酯化合物,諸如四乙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、新戊四醇三丙烯酸酯、二(三羥甲基丙烷)四丙烯酸酯、二新戊四醇五丙烯酸酯及二新戊四醇六丙烯酸酯及其組合。此類化合物可用作矽烷組成物之一部分。Other examples of functionalized compounds are acrylate and methacrylate compounds such as tetraethylene glycol diacrylate, trihydroxymethylpropane triacrylate, pentaerythritol triacrylate, di(trihydroxymethylpropane) tetraacrylate, dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate and combinations thereof. Such compounds can be used as part of the silane composition.

根據一特定具體實例,該方法進一步包括固化包含氟聚醚化合物之第二組成物。According to a specific embodiment, the method further comprises curing the second composition comprising the fluoropolyether compound.

第一塗層(B)上之第二塗層(C)的厚度(亦即,膜厚度)可在10 nm至10 µm,較佳地為25 nm至8 µm,更佳地為50 nm至5 µm之範圍內。The thickness (ie, film thickness) of the second coating layer (C) on the first coating layer (B) may be in the range of 10 nm to 10 µm, preferably 25 nm to 8 µm, and more preferably 50 nm to 5 µm.

第二塗層(C)較佳地為抗反射層。The second coating layer (C) is preferably an anti-reflection layer.

較佳地,第二塗層(C)之折射率不大於1.30,諸如在1.26至1.30範圍內。Preferably, the refractive index of the second coating layer (C) is not greater than 1.30, such as in the range of 1.26 to 1.30.

視情況選用之第三塗層(D) 在一些具體實例中,分層結構可包含塗佈在第二塗層(C)之至少一個表面上的額外第三塗層(D),使得第三塗層(D)與第二塗層(C)之至少一個表面黏附接觸。就此而言,「黏附接觸」意謂在第三基板層(D)及第二塗層(C)之至少一個表面之間不存在其他塗層或黏附層。 Optionally optional third coating layer (D) In some specific examples, the layered structure may include an additional third coating layer (D) coated on at least one surface of the second coating layer (C), so that the third coating layer (D) is in adhesive contact with at least one surface of the second coating layer (C). In this regard, "adhesive contact" means that there is no other coating layer or adhesive layer between the third substrate layer (D) and at least one surface of the second coating layer (C).

第三塗層(D)較佳地具有10 nm至10 µm之厚度,較佳地15 nm至8 µm之厚度,更佳地20 nm至5 µm之厚度。The third coating layer (D) preferably has a thickness of 10 nm to 10 µm, more preferably 15 nm to 8 µm, and more preferably 20 nm to 5 µm.

較佳地,第三塗層(D)包含矽氧烷聚合物及視情況選用之氟聚醚化合物。Preferably, the third coating layer (D) comprises a silicone polymer and, if appropriate, a fluoropolyether compound.

在一個具體實例中,第三塗層(D)較佳為包含如WO 2016/146895或WO 2020/099290中所描述之矽氧烷聚合物之易清潔塗層。兩個文件之揭示內容以全文引用之方式附於本文中。In one specific example, the third coating (D) is preferably an easy-to-clean coating comprising a siloxane polymer as described in WO 2016/146895 or WO 2020/099290. The disclosures of both documents are hereby incorporated by reference in their entirety.

在另一具體實例中,第三塗層(D)包含第三矽氧烷聚合物(D-1),其包含有包含一或多個氟化碳基團之側鏈。In another embodiment, the third coating layer (D) comprises a third siloxane polymer (D-1) comprising side chains comprising one or more fluorinated carbon groups.

第三矽氧烷聚合物(D-1)包含選自至少一種矽烷單體之單體單元。The third siloxane polymer (D-1) comprises monomer units selected from at least one silane monomer.

第三矽氧烷聚合物(D-1)可包含選自1至10,諸如1至6,較佳1至4種不同矽烷單體之單體單元。與此相關的「不同」意謂矽烷單體在至少一個化學部分上不同。The third siloxane polymer (D-1) may comprise monomer units selected from 1 to 10, such as 1 to 6, preferably 1 to 4 different silane monomers. "Different" in this context means that the silane monomers differ in at least one chemical moiety.

在一個具體實例中,矽烷單體中之至少一者包括能夠達成與相鄰矽氧烷聚合物鏈交聯之活性基團,且其中相鄰矽氧烷聚合物鏈藉助於該活性基團交聯。In one embodiment, at least one of the silane monomers includes a reactive group capable of achieving crosslinking with adjacent siloxane polymer chains, and wherein the adjacent siloxane polymer chains are crosslinked via the reactive group.

活性基團較佳為環氧基、脂環族環氧基(例如縮水甘油基)、乙烯基、烯丙基、丙烯酸酯、甲基丙烯酸酯及矽烷基及其組合。The reactive group is preferably an epoxy group, an alicyclic epoxy group (such as a glycidyl group), a vinyl group, an allyl group, an acrylate group, a methacrylate group, a silyl group, and a combination thereof.

由此,環氧基、脂環族環氧基(例如縮水甘油基)、乙烯基、烯丙基、丙烯酸酯、甲基丙烯酸酯基在熱或輻射引發時,較佳在適合引發劑(諸如熱或自由基引發劑)存在下能夠達成與相鄰矽氧烷聚合物鏈交聯。Thus, epoxy, alicyclic epoxy (e.g., glycidyl), vinyl, allyl, acrylate, methacrylate groups are capable of crosslinking with adjacent siloxane polymer chains when initiated thermally or by radiation, preferably in the presence of a suitable initiator (e.g., a thermal or free radical initiator).

適合的熱或自由基引發劑較佳選自過氧苯甲酸三級戊酯、4,4-偶氮雙(4-氰基戊酸)、1,1'-偶氮二(環己烷甲腈)、過氧化苯甲醯、2,2-雙(三級丁基過氧)丁烷、1,1-雙(三級丁基過氧)環己烷、2,2'-偶氮二異丁腈(AIBN)、2,5-雙(三級丁基過氧)-Z,S-二甲基己烷、2,5-雙(三級丁基過氧)-2,5-二甲基-3-己炔、雙(1-(三級丁基過氧)-1-甲基乙基)苯、1,1-雙(三級丁基過氧)-3,3,5-三甲基環己烷、氫過氧化三級丁基、過乙酸三級丁酯、過氧化三級丁基、過氧苯甲酸三級丁酯、三級丁基過氧化異丙基碳酸酯、氫過氧化異丙苯、過氧化環己酮、過氧化二異丙苯、過氧化月桂醯、過氧化2,4-戊二酮、過氧乙酸或過硫酸鉀。尤其較佳為2,2'-偶氮二異丁腈(AIBN)。Suitable thermal or free radical initiators are preferably selected from triamyl peroxybenzoate, 4,4-azobis(4-cyanovaleric acid), 1,1'-azobis(cyclohexanecarbonitrile), benzoyl peroxide, 2,2-bis(tertiary butylperoxy)butane, 1,1-bis(tertiary butylperoxy)cyclohexane, 2,2'-azobisisobutyronitrile (AIBN), 2,5-bis(tertiary butylperoxy)-Z,S-dimethylhexane, 2,5-bis(tertiary butylperoxy)-2,5- Dimethyl-3-hexyne, bis(1-(tert-butylperoxy)-1-methylethyl)benzene, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, tert-butyl hydroperoxide, tert-butyl peracetate, tert-butyl peroxide, tert-butyl peroxybenzoate, tert-butyl peroxyisopropyl carbonate, isopropyl hydroperoxide, cyclohexanone peroxide, diisopropyl peroxide, lauryl peroxide, 2,4-pentanedione peroxide, peracetic acid or potassium persulfate. Particularly preferred is 2,2'-azobisisobutyronitrile (AIBN).

矽烷基團能夠在矽氫化時,較佳在適合催化劑(諸如基於鉑(Pt)之催化劑,諸如Speier催化劑(H 2PtCl 6.H 2O)、Karstedt催化劑(Pt(0)-1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷複合物溶液)或基於銠(Rh)之催化劑,諸如三(三苯基膦)氯化銠(I))之存在下達成與相鄰矽氧烷聚合物鏈之碳-碳雙鍵(諸如乙烯基或烯丙基)交聯。 Silane groups are capable of crosslinking with carbon-carbon double bonds (such as vinyl or allyl) of adjacent siloxane polymer chains during hydrosilylation, preferably in the presence of a suitable catalyst (such as platinum (Pt)-based catalysts, such as Speier's catalyst ( H2PtCl6.H2O ), Karstedt's catalyst (Pt(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex solution) or rhodium (Rh)-based catalysts, such as tris(triphenylphosphine)rhodium(I) chloride).

在一個具體實例中,含有第一活性基團,例如選自環氧基、脂環族環氧基(例如縮水甘油基)及乙烯基及烯丙基之單體與含有第二活性基團,例如選自丙烯酸酯基及甲基丙烯酸酯基之單體之間的莫耳比在1:100至100:1,特定言之1:10至10:1,例如5:1至1:2或3:1至1:1範圍內變化。In a specific example, the molar ratio between the monomer containing the first reactive group, e.g., selected from epoxy, alicyclic epoxy (e.g., glycidyl), vinyl and allyl, and the monomer containing the second reactive group, e.g., selected from acrylate and methacrylate, ranges from 1:100 to 100:1, specifically 1:10 to 10:1, e.g., 5:1 to 1:2 or 3:1 to 1:1.

在一些具體實例中,含有第二活性基團之組分亦選自除矽烷單體以外的含有丙烯酸酯及甲基丙烯酸酯之化合物,諸如四乙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、新戊四醇三丙烯酸酯、雙三甲基丙烷四丙烯酸酯、二新戊四醇五丙烯酸酯及二新戊四醇六丙烯酸酯及其組合。In some specific examples, the component containing the second reactive group is also selected from compounds containing acrylates and methacrylates other than silane monomers, such as tetraethylene glycol diacrylate, trihydroxymethylpropane triacrylate, pentaerythritol triacrylate, ditrimethylpropane tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and combinations thereof.

在一些具體實例中,基於單體之莫耳部分,活性基團或活性基團將以約1至35%之濃度存在。In some embodiments, the reactive group or groups will be present at a concentration of about 1 to about 35% based on the molar fraction of the monomer.

適合矽烷單體較佳由式(I)表示 R 1 aSiX 4-a(I) 其中 R 1係選自氫及包含直鏈及分支鏈烷基、環烷基、烯基、炔基、(烷基)丙烯酸酯、環氧基、烯丙基、乙烯基及烷氧基以及具有1至6個環之芳基的基團,且其中該基團經取代或未經取代; X為可水解基團或烴殘基;且 a為整數1至3。 Suitable silane monomers are preferably represented by formula (I): R 1 a SiX 4-a (I) wherein R 1 is selected from hydrogen and a group comprising linear and branched alkyl, cycloalkyl, alkenyl, alkynyl, (alkyl)acrylate, epoxide, allyl, vinyl and alkoxy, and an aromatic group having 1 to 6 rings, and wherein the group is substituted or unsubstituted; X is a hydrolyzable group or a hydrocarbon residue; and a is an integer of 1 to 3.

可水解基團尤其為烷氧基(參見式II)。The hydrolyzable group is especially an alkoxy group (see formula II).

R 1及/或可水解基團X之烷氧基可相同或不同,且較佳選自具有下式之基團 -O-R 2(II) 其中 R 2代表具有1至10個,較佳1至6個碳原子之直鏈或分支鏈烷基,且視情況呈現一或兩個選自鹵素、羥基、乙烯基、環氧基及烯丙基之群的取代基。最佳為甲氧基及乙氧基。 R1 and/or the alkoxy group of the hydrolyzable group X may be the same or different and are preferably selected from the group having the following formula -OR2 (II) wherein R2 represents a linear or branched alkyl group having 1 to 10, preferably 1 to 6 carbon atoms and optionally presents one or two substituents selected from the group consisting of halogen, hydroxyl, vinyl, epoxy and allyl. The most preferred are methoxy and ethoxy.

尤佳為包含根據式(II)之烷氧基之二、三或四烷氧基矽烷。Particularly preferred are di-, tri- or tetraalkoxysilanes containing alkoxy groups according to formula (II).

特別合適的矽烷單體係選自以下之群:四乙氧基矽烷(TEOS)、四甲氧基矽烷(TMS)、甲基三乙氧基矽烷(MTEOS)、甲基三甲氧基矽烷(MTMS)、二甲基二乙氧基矽烷(DMDEOS)、二甲基二甲氧基矽烷(DMDMS)、二苯基二甲氧基矽烷(DPDMS)、3-(三甲氧基矽基)丙基甲基丙烯酸酯(MEMO)、3-(三乙氧基矽基)丙基甲基丙烯酸酯、5-(雙環庚烯基)三乙氧基矽烷(BCHTEOS)、(3-縮水甘油氧基丙基)三乙氧基矽烷、(3-縮水甘油氧基丙基)三甲氧基矽烷(GPTMS)、烯丙基三甲氧基矽烷(allylTMS)、烯丙基三乙氧基矽烷(allylTEOS)、乙烯基三甲氧基矽烷(VTMS)、乙烯基三乙氧基矽烷、(3-縮水甘油氧基丙基)二甲氧基甲基矽烷(Me-GPTMS)、甲基丙烯醯氧基丙基甲基二甲氧基矽烷(Me-MEMO)、苯基甲基二甲氧基矽烷(PMDMS)、雙[(2,2,3,3,4,4-六氟丁基)丙酸酯]-3-胺基丙基三甲氧基矽烷或其混合物。Particularly suitable silane monomers are selected from the group consisting of tetraethoxysilane (TEOS), tetramethoxysilane (TMS), methyltriethoxysilane (MTEOS), methyltrimethoxysilane (MTMS), dimethyldiethoxysilane (DMDEOS), dimethyldimethoxysilane (DMDMS), diphenyldimethoxysilane (DPDMS), 3-(trimethoxysilyl)propyl methacrylate (MEMO), 3-(triethoxysilyl)propyl methacrylate, 5-(bicycloheptenyl)triethoxysilane (BCHTEOS), (3-glycidyloxypropyl)triethoxysilane , (3-glycidyloxypropyl)trimethoxysilane (GPTMS), allyltrimethoxysilane (allylTMS), allyltriethoxysilane (allylTEOS), vinyltrimethoxysilane (VTMS), vinyltriethoxysilane, (3-glycidyloxypropyl)dimethoxymethylsilane (Me-GPTMS), methacryloxypropylmethyldimethoxysilane (Me-MEMO), phenylmethyldimethoxysilane (PMDMS), bis[(2,2,3,3,4,4-hexafluorobutyl)propionate]-3-aminopropyltrimethoxysilane or a mixture thereof.

矽烷單體較佳係選自以下之群:四乙氧基矽烷(TEOS)、苯基甲基二甲氧基矽烷(PMDMS)、3-(三甲氧基矽基)丙基甲基丙烯酸酯(MEMO)、甲基三甲氧基矽烷(MTMS)、乙烯基三甲氧基矽烷(VTMS)及(3-縮水甘油氧基丙基)三甲氧基矽烷(GPTMS)。The silane monomer is preferably selected from the group consisting of tetraethoxysilane (TEOS), phenylmethyldimethoxysilane (PMDMS), 3-(trimethoxysilyl)propylmethacrylate (MEMO), methyltrimethoxysilane (MTMS), vinyltrimethoxysilane (VTMS) and (3-glycidyloxypropyl)trimethoxysilane (GPTMS).

該等矽烷單體較佳以50至100 mol%、較佳50至99 mol%、再更佳65至97 mol%之莫耳量存在於矽氧烷聚合物中。The silane monomers are preferably present in the siloxane polymer in a molar amount of 50 to 100 mol %, preferably 50 to 99 mol %, and more preferably 65 to 97 mol %.

在一個具體實例中,第三矽氧烷聚合物(D-1)之至少一種不同矽烷單體包含至少一種雙矽烷。In one embodiment, the at least one different silane monomer of the third siloxane polymer (D-1) comprises at least one bissilane.

適合之雙矽烷較佳由式(III)表示 (R 3) 3Si-Y-Si(R 4) 3,           (III) 其中 R 3及R 4獨立地選自氫及由直鏈或分支鏈烷基、環烷基、烯基、炔基、(烷基)丙烯酸酯、環氧基、烯丙基、乙烯基、烷氧基以及具有1至6個環之芳基組成之群的基團,且其中該基團經取代或未經取代;及 Y為選自二價未經取代或經取代之脂族及芳族基團的鍵聯基團,諸如伸烷基、伸芳基、-O-伸烷基-O-;-O-伸芳基-O-;伸烷基-O-伸烷基、伸芳基-O-伸芳基;伸烷基-Z 1C(=O)Z 2-伸烷基、伸芳基-Z 1C(=O)Z 2-伸芳基及-O-伸烷基-Z 1C(=O)Z 2-伸苯基-O-;-O-伸芳基-Z 1C(=O)Z 2-伸芳基-O-,其中Z 1及Z 2各自選自直接鍵或-O-。 Suitable bissilanes are preferably represented by the formula (III): (R 3 ) 3 Si-Y-Si(R 4 ) 3 , (III) wherein R 3 and R 4 are independently selected from hydrogen and a group consisting of a linear or branched alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, an (alkyl)acrylate group, an epoxide group, an allyl group, a vinyl group, an alkoxy group and an aryl group having 1 to 6 rings, and wherein the group is substituted or unsubstituted; and Y is a linking group selected from divalent unsubstituted or substituted aliphatic and aromatic groups, such as alkylene, arylene, -O-alkylene-O-; -O-arylene-O-; alkylene-O-alkylene, arylene-O-arylene; alkylene-Z 1 C(═O)Z 2 -alkylene, arylene-Z 1 C(=O)Z 2 -arylene and -O-alkylene-Z 1 C(=O)Z 2 -phenylene-O-; -O-arylene-Z 1 C(=O)Z 2 -arylene-O-, wherein Z 1 and Z 2 are independently selected from a direct bond or -O-.

在二價「伸烷基」基團及其他類似脂族基團中,烷基殘基(或衍生自烷基部分之殘基)代表1至10個、較佳1至8個、或1至6個或甚至1至4個碳原子,實例包括伸乙基及亞甲基及伸丙基。In divalent "alkylene" groups and other similar aliphatic groups, the alkyl residue (or the residue derived from the alkyl part) represents 1 to 10, preferably 1 to 8, or 1 to 6 or even 1 to 4 carbon atoms, examples include ethylene and methylene and propylene.

「伸芳基」代表典型地含有1至3個芳環及6至18個碳原子之芳族二價基團。此類基團藉由伸苯基(例如1,4-伸苯基及1,3-伸苯基)及伸聯苯基以及伸萘基或伸蒽基例示。"Arylene" represents an aromatic divalent radical typically containing 1 to 3 aromatic rings and 6 to 18 carbon atoms. Such radicals are exemplified by phenylene (e.g., 1,4-phenylene and 1,3-phenylene) and biphenylene as well as naphthylene or anthracenylene.

伸烷基及伸芳基可視情況經1至5個選自以下之取代基取代:羥基、鹵基、乙烯基、環氧基及烯丙基以及烷基、芳基及芳烷基。The alkylene group and the arylene group may be substituted with 1 to 5 substituents selected from the group consisting of a hydroxyl group, a halogen group, a vinyl group, an epoxy group and an allyl group as well as an alkyl group, an aryl group and an aralkyl group, as the case may be.

較佳烷氧基含有1至4個碳原子。實例為甲氧基及乙氧基。Preferred alkoxy groups contain 1 to 4 carbon atoms. Examples are methoxy and ethoxy.

術語「苯基」包括經取代的苯基,諸如苯基三烷氧基,尤其苯基三甲氧基或三乙氧基,以及全氟苯基。苯基以及其他芳族或脂環族基團可直接偶合至矽原子,或其可經由亞甲基或伸乙基橋偶合至矽原子。The term "phenyl" includes substituted phenyl groups, such as phenyltrialkoxy groups, especially phenyltrimethoxy or triethoxy groups, and perfluorophenyl groups. The phenyl group and other aromatic or alicyclic groups can be coupled directly to the silicon atom, or they can be coupled to the silicon atom via a methylene or ethylene bridge.

例示性雙矽烷包括1,2-雙(三乙氧基矽基)乙烷(BTESE)、1,2-雙(三甲氧基矽基)乙烷(MEOS)及其混合物。Exemplary bissilanes include 1,2-bis(triethoxysilyl)ethane (BTESE), 1,2-bis(trimethoxysilyl)ethane (MEOS), and mixtures thereof.

較佳具有以0至45 mol%、較佳1至45 mol%、再更佳3至30 mol%之莫耳量存在於矽氧烷聚合物中之雙矽烷。Preferably, the bissilane is present in the siloxane polymer in a molar amount of 0 to 45 mol %, preferably 1 to 45 mol %, and more preferably 3 to 30 mol %.

另外,第三矽氧烷聚合物(D-1)包含能夠形成包含一或多個氟化碳基團之側鏈的至少一種、諸如1至10種、較佳1至6種、更佳1或2種、最佳一種氟化單體。In addition, the third siloxane polymer (D-1) comprises at least one, for example 1 to 10, preferably 1 to 6, more preferably 1 or 2, and most preferably one fluorinated monomer capable of forming a side chain comprising one or more fluorinated carbon groups.

此類氟化單體可為氟化矽烷單體,其較佳由式(I)表示 R 1 aSiX 4-a(I) 其中 R 1係選自包含以下各者之基團:直鏈及分支鏈烷基、環烷基、烯基、炔基、(烷基)丙烯酸酯、環氧基、烯丙基、乙烯基及烷氧基及具有1至6個環之芳基,較佳直鏈或分支鏈烷基,且其中該基團經一或多個氟原子取代; X為可水解基團或烴殘基;且 a為整數1至3。 Such fluorinated monomers may be fluorinated silane monomers, which are preferably represented by formula (I): R 1 a SiX 4-a (I) wherein R 1 is a group selected from the group consisting of linear and branched alkyl groups, cycloalkyl groups, alkenyl groups, alkynyl groups, (alkyl)acrylates, epoxide groups, allyl groups, vinyl groups and alkoxy groups and aryl groups having 1 to 6 rings, preferably linear or branched alkyl groups, and wherein the group is substituted with one or more fluorine atoms; X is a hydrolyzable group or a hydrocarbon residue; and a is an integer from 1 to 3.

可水解基團尤其為烷氧基(參見式II)。The hydrolyzable group is especially an alkoxy group (see formula II).

此類矽烷單體之實例為例如(十七氟-1,1,2,2-四氫癸基)三甲氧基矽烷、(十七氟-1,1,2,2-四氫癸基)三乙氧基矽烷(F17)、1H,1H,2H,2H-全氟十二烷基三乙氧基矽烷、1H,1H,2H,2H-全氟十二烷基三甲氧基矽烷、1H,1H,2H,2H-全氟辛基三乙氧基矽烷、1H,1H,2H,2H-全氟辛基三甲氧基矽烷、1H,1H,2H,2H-全氟戊基三乙氧基矽烷、1H,1H,2H,2H-全氟戊基三甲氧基矽烷、1H,1H,2H,2H-全氟十四烷基三乙氧基矽烷或1H,1H,2H,2H-全氟十四烷基三甲氧基矽烷。Examples of such silane monomers are (heptadecafluoro-1,1,2,2-tetrahydrodecyl)trimethoxysilane, (heptadecafluoro-1,1,2,2-tetrahydrodecyl)triethoxysilane (F17), 1H,1H,2H,2H-perfluorododecyltriethoxysilane, 1H,1H,2H,2H-perfluorododecyltrimethoxysilane, 1H,1H,2H,2H- Perfluorooctyltriethoxysilane, 1H,1H,2H,2H-perfluorooctyltrimethoxysilane, 1H,1H,2H,2H-perfluoropentyltriethoxysilane, 1H,1H,2H,2H-perfluoropentyltrimethoxysilane, 1H,1H,2H,2H-perfluorotetradecyltriethoxysilane or 1H,1H,2H,2H-perfluorotetradecyltrimethoxysilane.

氟化單體亦可為包含氟化聚合物基團之單體。包含氟化聚合物基團之該單體較佳選自氟化聚矽氧烷、改質全氟聚醚。The fluorinated monomer may also be a monomer containing a fluorinated polymer group. The monomer containing a fluorinated polymer group is preferably selected from fluorinated polysiloxane and modified perfluoropolyether.

改質全氟聚醚較佳地選自矽烷改質之全氟聚醚、羧基酯改質之全氟聚醚,諸如丙烯酸酯改質之全氟聚醚及甲基丙烯酸酯改質之全氟聚醚、基於環氧之全氟聚醚及其混合物。The modified perfluoropolyether is preferably selected from silane-modified perfluoropolyether, carboxyl ester-modified perfluoropolyether, such as acrylate-modified perfluoropolyether and methacrylate-modified perfluoropolyether, epoxy-based perfluoropolyether and mixtures thereof.

此類氟化聚矽氧烷及改質全氟聚醚可以商業方式購自Shin-Etsu Subelyn®的KY-100系列的氟化防污塗層組分,諸如KY-1900及KY-1901,Shin-Etsu Subelyn®的KY-1200系列的氟化防污添加劑,諸如KY-1271,或OPTOOL系列的Daikin氟化防污塗層組分,OPTOOL UD-509、OPTOOL UD-120及OPTOOL DSX。Such fluorinated polysiloxanes and modified perfluoropolyethers are commercially available from Shin-Etsu Subelyn® in the KY-100 series of fluorinated antifouling coating components, such as KY-1900 and KY-1901, Shin-Etsu Subelyn® in the KY-1200 series of fluorinated antifouling additives, such as KY-1271, or the OPTOOL series of Daikin fluorinated antifouling coating components, OPTOOL UD-509, OPTOOL UD-120, and OPTOOL DSX.

其他適合的氟化聚矽氧烷為例如分子量在1500至20000 g/mol、較佳2000至15000 g/mol範圍內之聚(甲基-3,3,3-三氟丙基)矽氧烷。Other suitable fluorinated polysiloxanes are, for example, poly(methyl-3,3,3-trifluoropropyl)siloxane having a molecular weight in the range of 1500 to 20000 g/mol, preferably 2000 to 15000 g/mol.

至少一種氟化單體較佳以0.1至45 wt%、較佳0.5至45 wt%、再更佳1至40 wt%之重量量存在於矽氧烷聚合物中。The at least one fluorinated monomer is preferably present in the siloxane polymer in an amount of 0.1 to 45 wt %, more preferably 0.5 to 45 wt %, and even more preferably 1 to 40 wt %.

尤其較佳的是,單體係選自以下基團中之兩者兼具或更多者之混合物:1,2-雙(三乙氧基矽基)乙烷(BTESE)、四乙氧基矽烷(TEOS)苯基甲基二甲氧基矽烷(PMDMS)、3-(三甲氧基矽基)丙基甲基丙烯酸酯(MEMO)、甲基三甲氧基矽烷(MTMS)、乙烯基三甲氧基矽烷(VTMS)及(3-縮水甘油氧基丙基)三甲氧基矽烷(GPTMS)及另外一種選自KY-1900、KY-1901及KY-1271的氟化單體。Particularly preferably, the monomer is a mixture of two or more selected from the following groups: 1,2-bis(triethoxysilyl)ethane (BTESE), tetraethoxysilane (TEOS) phenylmethyldimethoxysilane (PMDMS), 3-(trimethoxysilyl)propylmethacrylate (MEMO), methyltrimethoxysilane (MTMS), vinyltrimethoxysilane (VTMS) and (3-glycidyloxypropyl)trimethoxysilane (GPTMS) and another fluorinated monomer selected from KY-1900, KY-1901 and KY-1271.

包含第三矽氧烷聚合物(D-1)之第三組成物較佳藉由包含以下步驟之方法形成: ●   在第一溶劑中,混合至少一種矽烷單體及至少一種氟化單體(較佳如上文或下文所描述)以形成混合物; ●   使該混合物在催化劑存在下經歷該等單體之至少部分水解,由此使該等水解單體至少部分聚合且交聯; ●   視情況將該第一溶劑更換為第二溶劑; ●   視情況藉由矽氫化、熱或輻射引發使該混合物進一步交聯。 The third composition comprising the third siloxane polymer (D-1) is preferably formed by a method comprising the following steps: ●   In a first solvent, at least one silane monomer and at least one fluorinated monomer (preferably as described above or below) are mixed to form a mixture; ●   Subjecting the mixture to at least partial hydrolysis of the monomers in the presence of a catalyst, thereby causing the hydrolyzed monomers to at least partially polymerize and crosslink; ●   Optionally replacing the first solvent with a second solvent; ●   Optionally crosslinking the mixture by hydrosilylation, heat or radiation.

第一溶劑較佳選自以下之群:丙酮、四氫呋喃(THF)、甲苯、1-丙醇、2-丙醇、甲醇、乙醇、水(H 2O)、環戊酮、乙腈、丙二醇丙醚、甲基-三級丁基醚(MTBE)、丙二醇單甲醚乙酸酯(PGMEA)、甲基乙基酮、甲基異丁基酮、丙二醇單甲醚(PGME)及丙二醇丙醚(PnP)。 The first solvent is preferably selected from the group consisting of acetone, tetrahydrofuran (THF), toluene, 1-propanol, 2-propanol, methanol, ethanol, water ( H2O ), cyclopentanone, acetonitrile, propylene glycol propyl ether, methyl tertiary butyl ether (MTBE), propylene glycol monomethyl ether acetate (PGMEA), methyl ethyl ketone, methyl isobutyl ketone, propylene glycol monomethyl ether (PGME) and propylene glycol propyl ether (PnP).

單體可在任何適合之溫度下混合於第一溶劑中以溶解單體。通常情況下,室溫足夠。The monomers may be mixed in the first solvent at any suitable temperature to dissolve the monomers. Typically, room temperature is sufficient.

在下一方法步驟中,使混合物在催化劑存在下經歷至少部分水解。In the next process step, the mixture undergoes at least partial hydrolysis in the presence of a catalyst.

適合之催化劑為酸性催化劑、鹼性催化劑或其他催化劑。Suitable catalysts are acidic catalysts, alkaline catalysts or other catalysts.

酸性催化劑較佳選自硝酸(HNO 3)、硫酸(H 2SO 4)、甲酸(HCOOH)、鹽酸(HCl)、磺酸、氟化氫(HF)、乙酸(CH 3COOH)、三氟甲磺酸或對甲苯磺酸。尤其較佳的酸性催化劑為硝酸(HNO 3)、甲酸(HCOOH)及鹽酸(HCl)。 The acidic catalyst is preferably selected from nitric acid (HNO 3 ), sulfuric acid (H 2 SO 4 ), formic acid (HCOOH), hydrochloric acid (HCl), sulfonic acid, hydrogen fluoride (HF), acetic acid (CH 3 COOH), trifluoromethanesulfonic acid or p-toluenesulfonic acid. Particularly preferred acidic catalysts are nitric acid (HNO 3 ), formic acid (HCOOH) and hydrochloric acid (HCl).

鹼性催化劑較佳選自三乙胺(TEA)、氫氧化銨(NH 4OH)、氫氧化四乙銨(TEAH)、氫氧化四甲銨(TMEA)、1,4-二氮雜雙環[2.2.2]辛烷、咪唑及二伸乙基三胺。 The alkaline catalyst is preferably selected from triethylamine (TEA), ammonium hydroxide (NH 4 OH), tetraethylammonium hydroxide (TEAH), tetramethylammonium hydroxide (TMEA), 1,4-diazabicyclo[2.2.2]octane, imidazole and diethylenetriamine.

其他催化劑較佳選自2,2,3,3,4,4,5,5-八氟戊基丙烯酸酯、聚(乙二醇) 200、聚(乙二醇) 300及正丁基三聚氰胺甲醛樹脂。Other catalysts are preferably selected from 2,2,3,3,4,4,5,5-octafluoropentyl acrylate, poly(ethylene glycol) 200, poly(ethylene glycol) 300 and n-butyl melamine formaldehyde resin.

水解步驟較佳在20至80℃之溫度下進行1至24小時,諸如在室溫下進行隔夜。The hydrolysis step is preferably carried out at a temperature of 20 to 80°C for 1 to 24 hours, such as overnight at room temperature.

在水解步驟期間,單體至少部分水解。該至少部分水解之單體隨後至少部分聚合,較佳藉由縮合聚合且交聯形成矽氧烷聚合物,其包含有包含一或多個氟化碳基之側鏈。During the hydrolysis step, the monomer is at least partially hydrolyzed. The at least partially hydrolyzed monomer is then at least partially polymerized, preferably by condensation polymerization and crosslinking to form a siloxane polymer comprising side chains comprising one or more fluorinated carbon groups.

該矽氧烷聚合物通常具有在約500至2000 g/mol範圍內之相對較低分子量。The siloxane polymers typically have a relatively low molecular weight in the range of about 500 to 2000 g/mol.

根據一較佳具體實例,使混合物經受至少部分水解包括回流。典型回流時間為2小時。According to a preferred embodiment, subjecting the mixture to at least partial hydrolysis comprises refluxing. Typical reflux time is 2 hours.

在水解步驟之後,在視情況選用之另一方法步驟中,第一溶劑可更換為第二溶劑。視情況選用之溶劑更換係有利的,因為其有助於移除在水解單體期間形成之水及醇。另外,當用作基板上之塗層時,其改良了最終矽氧烷聚合物溶液之特性。After the hydrolysis step, in an optional further process step, the first solvent may be replaced with a second solvent. Optional solvent replacement is advantageous because it helps remove water and alcohol formed during the hydrolysis of the monomers. In addition, it improves the properties of the final siloxane polymer solution when used as a coating on a substrate.

第二溶劑較佳選自丙二醇甲基醚(PGME)、丙二醇甲基醚乙酸酯(PGMEA)、1-乙醇、2-乙醇(IPA)、丙烯腈二丙酮醇(DAA)或丙二醇正丙基醚(PnP)之群。The second solvent is preferably selected from the group consisting of propylene glycol methyl ether (PGME), propylene glycol methyl ether acetate (PGMEA), 1-ethanol, 2-ethanol (IPA), acrylonitrile diacetone alcohol (DAA) or propylene glycol n-propyl ether (PnP).

包含矽氧烷聚合物之混合物可在水解步驟之後進一步經歷交聯步驟。由此,矽氧烷聚合物較佳藉由矽氫化、熱或輻射引發至少部分交聯。The mixture comprising the siloxane polymer may be further subjected to a crosslinking step after the hydrolysis step. Thereby, the siloxane polymer is preferably at least partially crosslinked by hydrosilylation, heat or radiation.

在本上下文中,術語「部分交聯」意謂聚合物能夠在有利於交聯之條件下進一步交聯。實務上,在第一聚合步驟之後聚合物仍含有至少一些反應性交聯基團。下文將描述典型地在部分交聯之組成物沉積於基板上之後發生的進一步交聯。In this context, the term "partially crosslinked" means that the polymer is capable of further crosslinking under conditions that are favorable for crosslinking. In practice, the polymer still contains at least some reactive crosslinking groups after the first polymerization step. Further crosslinking that typically occurs after the partially crosslinked composition is deposited on a substrate will be described below.

矽氧烷聚合物較佳使用如上文所描述之催化劑藉由矽氫化、熱或輻射引發至少部分交聯。The siloxane polymers are preferably at least partially crosslinked by hydrosilylation, heat or radiation using a catalyst as described above.

由此,較佳在約30℃至200℃範圍內之溫度下進行熱交聯。Thus, thermal crosslinking is preferably performed at a temperature in the range of about 30°C to 200°C.

典型地交聯在溶劑之回流條件下進行。Typically the crosslinking is carried out under refluxing conditions of the solvent.

為了改良材料在應用於光微影時之解析度,矽氧烷聚合物可視情況在聚合期間,尤其在縮合聚合期間或緊接在縮合聚合之後部分交聯。各種方法可用於達成交聯。舉例而言,可採用交聯方法,其中兩個鏈經由不影響任何意欲用於UV光微影之活性基團的反應性基團接合。舉例而言,例如使用一個鏈上的質子與另一條鏈上的雙鍵反應之矽氫化將達成所需種類之交聯。另一實例為經由雙鍵或環氧基進行的交聯。In order to improve the resolution of the material when used in photolithography, the siloxane polymer can be partially crosslinked during polymerization, especially during or immediately after condensation polymerization, as appropriate. Various methods can be used to achieve the crosslinking. For example, a crosslinking method can be used in which two chains are joined via reactive groups that do not affect any active groups intended for UV photolithography. For example, hydrosilylation, such as using a proton on one chain to react with a double bond on another chain, will achieve the desired type of crosslinking. Another example is crosslinking via double bonds or epoxy groups.

不同活性基團較佳用於交聯及用於光微影。因此,矽氧烷聚合物之交聯可使用自由基引發劑及光酸產生劑用具有雙鍵或環氧基或兩者兼具之活性基團(諸如環氧基、乙烯基或烯丙基或甲基丙烯酸酯基)達成。Different reactive groups are preferred for crosslinking and for photolithography. Thus, crosslinking of siloxane polymers can be achieved using free radical initiators and photoacid generators with reactive groups having double bonds or epoxy groups or both, such as epoxy, vinyl or allyl or methacrylate groups.

環氧基可用於UV光微影,且反之亦然。交聯所需之活性基團比例通常小於UV光微影所需之活性基團比例,例如基於單體計約0.1至10 mol%以用於交聯及基於單體計約5至50 mol%以用於UV光微影。Epoxy groups can be used for UV lithography, and vice versa. The proportion of reactive groups required for crosslinking is generally less than that required for UV lithography, for example, about 0.1 to 10 mol % based on monomer for crosslinking and about 5 to 50 mol % based on monomer for UV lithography.

添加至反應混合物/溶液中之引發劑之量一般為約0.1至10 wt%,較佳約0.5至5 wt%,根據矽氧烷聚合物之總重量計算。The amount of initiator added to the reaction mixture/solution is generally about 0.1 to 10 wt %, preferably about 0.5 to 5 wt %, based on the total weight of the siloxane polymer.

由於部分交聯,分子量將典型地為2至10倍。因此,根據在約500至2000 g/mol範圍內之分子量,交聯將使其增加超過3000 g/mol,較佳增加至4000至20000 g/mol。Due to partial crosslinking, the molecular weight will typically be 2 to 10 times higher. Thus, with a molecular weight in the range of about 500 to 2000 g/mol, crosslinking will increase it to more than 3000 g/mol, preferably to 4000 to 20000 g/mol.

視情況,存在於矽氧烷聚合物之主鏈中之所得游離Si-OH基團可經封端來保護。為封端,使游離Si-OH基團與矽烷(諸如甲基二氯氟矽烷(Cl 2FSiCH 3、甲基氟二甲氧基矽烷((MeO) 2SiFCH 3)、3-氯丙基三甲氧基矽烷(Cl(CH 2) 3Si(OMe) 3)、乙基三甲氧基矽烷(ETMS)或三甲基氯矽烷(ClSiMe 3))在諸如三乙基鋁(TEA)或咪唑之催化劑存在下反應。催化劑之量在總固體之1.5至2 wt%範圍內變化。反應時間在40至45 min範圍內變化。 Optionally, the resulting free Si-OH groups present in the backbone of the siloxane polymer can be protected by end-capping. For end-capping, the free Si-OH groups are reacted with silanes such as methyldichlorofluorosilane ( Cl2FSiCH3 , methylfluorodimethoxysilane ((MeO) 2SiFCH3 ), 3 - chloropropyltrimethoxysilane (Cl( CH2 ) 3Si (OMe) 3 ), ethyltrimethoxysilane (ETMS) or trimethylchlorosilane ( ClSiMe3 ) in the presence of a catalyst such as triethylaluminum (TEA) or imidazole. The amount of catalyst varies in the range of 1.5 to 2 wt% of the total solids. The reaction time varies in the range of 40 to 45 min.

典型地引入至包含第三矽氧烷聚合物(D-1)之第一組成物中的其他添加劑包括可進一步改變經塗佈及固化之膜的最終表面特性或改良塗層(B)對基板層(A)或其他塗層(C)之潤濕性/黏附特性或改良沉積及乾燥期間之塗層乾燥及包裝行為以達到良好視覺品質之化學物質。Other additives typically incorporated into the first composition comprising the third siloxane polymer (D-1) include chemicals that can further modify the final surface properties of the coated and cured film or improve the wetting/adhesion properties of the coating (B) to the substrate layer (A) or other coatings (C) or improve the coating drying and packaging behavior during deposition and drying to achieve good visual quality.

此等添加劑可為界面活性劑、消泡劑、防污劑、潤濕劑等。此類添加劑之實例包括:BYK-301、BYK-306、BYK-307、BYK-308、BYK-333、BYK-051、BYK-036、BYK-028、BYK-057A、BYK-011、BYK-055、BYK-036、BYK-067A、BYK-088、BYK-302、BYK-310、BYK-322、BYK-323、BYK-33l、BYK-333、BYK-341、BYK-345、BYK-348、BYK-377、BYK-378、BYK-381、BYK-390、BYK-3700。Such additives may be surfactants, defoamers, antifouling agents, wetting agents, etc. Examples of such additives include: BYK-301, BYK-306, BYK-307, BYK-308, BYK-333, BYK-051, BYK-036, BYK-028, BYK-057A, BYK-011, BYK-055, BYK-036, BYK-067A, BYK-088, BYK-302, BYK-310, K-322, BYK-323, BYK-33l, BYK-333, BYK-341, BYK-345, BYK-348, BYK-377, BYK-378, BYK-381, BYK-390, BYK-3700.

添加劑較佳以固體總重量之0.01至5 wt%、更佳0.1至1 wt%之量存在。The additive is preferably present in an amount of 0.01 to 5 wt %, more preferably 0.1 to 1 wt %, based on the total weight of the solid.

在進一步縮合之前,較佳地自材料移除過量水,且在此階段有可能視需要使溶劑更換為另一合成溶劑。此其他合成溶劑可充當矽氧烷聚合物之最終加工溶劑或最終加工溶劑中之一者。殘餘水及醇及其他副產物可在進一步縮合步驟完成之後移除。可在調配步驟期間添加額外加工溶劑以形成最終加工溶劑組合。可在矽氧烷聚合物之最終過濾之前添加添加劑,諸如熱引發劑、輻射敏感性引發劑、敏化劑、界面活性劑及其他添加劑。在調配組成物之後,聚合物準備好在例如輥對輥膜沉積中或在微影製程中進行加工。Before further condensation, excess water is preferably removed from the material, and it is possible at this stage to change the solvent to another synthesis solvent if necessary. This other synthesis solvent may serve as the final processing solvent or one of the final processing solvents for the siloxane polymer. Residual water and alcohol and other by-products may be removed after the further condensation steps are completed. Additional processing solvents may be added during the formulation steps to form the final processing solvent combination. Additives such as thermal initiators, radiation sensitive initiators, sensitizers, surfactants and other additives may be added before the final filtration of the siloxane polymer. After formulating the composition, the polymer is ready to be processed, for example in roll-to-roll film deposition or in a lithography process.

藉由調節水解及縮合條件,可控制能夠去質子化之基團(例如OH-基團)及來自矽氧烷聚合物組成物之矽烷前驅體之任何殘餘離去基團(例如烷氧基)的濃度/含量,且亦控制矽氧烷聚合物之最終分子量。此大大影響矽氧烷聚合物材料在基於水溶液之顯影劑溶液中的溶解度。此外,聚合物之分子量亦極大地影響矽氧烷聚合物在顯影溶液中之溶解度特性。By adjusting the hydrolysis and condensation conditions, the concentration/content of groups capable of deprotonation (e.g., OH-groups) and any residual groups left from the silane precursor of the siloxane polymer composition (e.g., alkoxy groups) can be controlled, and the final molecular weight of the siloxane polymer can also be controlled. This greatly affects the solubility of the siloxane polymer material in aqueous-based developer solutions. In addition, the molecular weight of the polymer also greatly affects the solubility characteristics of the siloxane polymer in the developer solution.

因此,舉例而言,已發現當最終矽氧烷聚合物具有高含量之剩餘羥基及低含量之烷氧基(例如乙氧基)基團時,最終矽氧烷聚合物可溶解於鹼-水顯影劑溶液(例如氫氧化四甲基銨;TMAH或氫氧化鉀;KOH)中。Thus, for example, it has been found that the final siloxane polymer is soluble in an alkaline-water developer solution (e.g., tetramethylammonium hydroxide; TMAH or potassium hydroxide; KOH) when the final siloxane polymer has a high content of residual hydroxyl groups and a low content of alkoxy (e.g., ethoxy) groups.

另一方面,若最終矽氧烷聚合物之剩餘烷氧基-基團含量較高,且其幾乎不含有任何OH-基團,則最終矽氧烷聚合物在以上種類之鹼-水顯影劑中具有極低溶解度。OH-基團或其他官能基,諸如胺基(NH 2)、硫醇(SH)、羧基、苯酚或類似的產生對鹼性顯影劑系統的溶解性的官能基可直接連接至矽氧烷聚合物主鏈之矽原子或視情況連接至與矽氧烷聚合物主鏈連接的有機官能基以進一步促進且控制鹼性顯影劑溶解性。 On the other hand, if the residual alkoxy-group content of the final siloxane polymer is high and it contains almost no OH-groups, the final siloxane polymer has very low solubility in the above-mentioned types of alkaline-water developers. OH-groups or other functional groups, such as amine ( NH2 ), thiol (SH), carboxyl, phenol or similar functional groups that impart solubility to alkaline developer systems can be directly attached to the silicon atoms of the siloxane polymer backbone or, as the case may be, to organic functional groups attached to the siloxane polymer backbone to further promote and control the alkaline developer solubility.

在合成之後,矽氧烷聚合物組成物可使用恰當溶劑或溶劑組合稀釋以得到固體含量,其在膜沉積中將產生預選膜厚度。Following synthesis, the siloxane polymer composition can be diluted using an appropriate solvent or combination of solvents to obtain a solids content that will produce a preselected film thickness during film deposition.

通常,在合成之後向矽氧烷組成物中添加另一量之引發劑分子化合物。引發劑可視情況與聚合期間所添加之引發劑類似,用於產生可引發UV固化步驟中之「活性」官能基之聚合的物質。因此,在環氧基之情況下,可使用陽離子或陰離子引發劑。在合成材料中具有雙鍵作為「活性」官能基之基團的情況下,可採用自由基引發劑。此外,熱引發劑(根據自由基、陽離子或陰離子機制工作)可用於促進「活性」官能基之交聯。光引發劑及敏化劑之恰當組合之選擇亦取決於所使用曝光源(波長)。此外,所使用敏化劑之選擇視所選擇之引發劑類型而定。Typically, a further amount of an initiator molecule compound is added to the siloxane composition after synthesis. The initiator may, as the case may be, be similar to the initiator added during the polymerization and is used to produce a substance that can initiate the polymerization of the "active" functional groups in the UV curing step. Thus, in the case of epoxy groups, cationic or anionic initiators can be used. In the case of groups with double bonds as "active" functional groups in the synthetic material, free radical initiators can be employed. Furthermore, thermal initiators (working according to a free radical, cationic or anionic mechanism) can be used to promote the crosslinking of the "active" functional groups. The choice of the appropriate combination of photoinitiators and sensitizers also depends on the exposure source (wavelength) used. Furthermore, the choice of sensitizer used depends on the type of initiator chosen.

組成物中熱或輻射引發劑及敏化劑之濃度一般為約0.1至10%,較佳約0.5至5%,其由矽氧烷聚合物之質量計算。The concentration of the thermal or radiation initiator and the sensitizer in the composition is generally about 0.1 to 10%, preferably about 0.5 to 5%, calculated on the mass of the siloxane polymer.

如上文所描述之組成物可包含呈組成物之1 wt%與50 wt%之間的量的固體奈米粒子或其他化合物。奈米粒子(或類似奈米或微尺度棒、晶體、球、點、芽等)尤其選自光散射、光吸收、光發射及/或導電顏料、染料、有機及無機磷光體、氧化物、量子點、聚合物或金屬之群。The composition as described above may comprise solid nanoparticles or other compounds in an amount between 1 wt% and 50 wt% of the composition. The nanoparticles (or similar nano- or micro-scale rods, crystals, balls, dots, buds, etc.) are particularly selected from the group of light scattering, light absorbing, light emitting and/or conductive pigments, dyes, organic and inorganic phosphors, oxides, quantum dots, polymers or metals.

在第三具體實例中,第三組成物包含第四矽氧烷聚合物(D-2)。In a third embodiment, the third composition comprises a fourth siloxane polymer (D-2).

該第四矽氧烷聚合物(D-2)較佳不包含有包含一或多個氟化碳基之側鏈。The fourth siloxane polymer (D-2) preferably does not contain side chains containing one or more fluorinated carbon groups.

第三矽氧烷聚合物(D-2)包含選自至少一種矽烷單體之單體單元。The third siloxane polymer (D-2) comprises monomer units selected from at least one silane monomer.

較佳地,第四矽氧烷聚合物(D-2)之矽烷單體單元及製備第四矽氧烷聚合物(D-2)之製備方法如上文針對第三矽氧烷聚合物(D-1)所描述,較佳除了無如上文針對第三矽氧烷聚合物(D-1)所描述之氟化單體存在於第四矽氧烷聚合物(D-2)中。Preferably, the silane monomer units of the fourth siloxane polymer (D-2) and the method for preparing the fourth siloxane polymer (D-2) are as described above for the third siloxane polymer (D-1), preferably except that no fluorinated monomer as described above for the third siloxane polymer (D-1) is present in the fourth siloxane polymer (D-2).

以下程序適用於第三塗層(D)之所有具體實例:The following procedures apply to all specific instances of the third coating (D):

第三組成物較佳包含如上文或下文針對第二塗層(C)之第二組成物所描述的氟聚醚化合物。The third component preferably comprises a fluoropolyether compound as described above or below with respect to the second component of the second coating layer (C).

將第三組成物沉積至第二塗層(C)之至少一個表面上以形成與第二塗層(C)之至少一個表面黏附接觸之第三塗層(D)。The third composition is deposited onto at least one surface of the second coating layer (C) to form a third coating layer (D) that is in adhesive contact with at least one surface of the second coating layer (C).

適合沉積法包括旋塗、夾塗、噴霧、噴墨、輥對輥、凹版印刷、反向凹版印刷、刮棒塗佈、狹縫塗佈、柔版印刷、簾式塗佈、網板印刷塗佈法、擠壓塗佈、浸塗、淋塗或縫塗。Suitable deposition methods include spin coating, nip coating, spraying, ink jetting, roll-to-roll, gravure printing, reverse gravure printing, doctor bar coating, slot coating, flexographic printing, curtain coating, screen printing coating, extrusion coating, dip coating, shower coating or slot coating.

沉積之第三組成物在第二塗層(C)之表面上形成第三塗層(D)。典型地,在沉積之後或在沉積步驟期間,蒸發溶劑且較佳藉由熱乾燥或視情況藉由合併之真空及/或熱乾燥來乾燥第三塗層(D)。此步驟亦稱作預固化。The deposited third composition forms a third coating layer (D) on the surface of the second coating layer (C). Typically, after deposition or during the deposition step, the solvent is evaporated and the third coating layer (D) is dried, preferably by thermal drying or, as the case may be, by combined vacuum and/or thermal drying. This step is also called pre-curing.

在第二後續步驟中,第三塗層(D)藉由在高溫下熱固化或藉由使用UV曝露隨後在高溫下進行熱固化而固化至最終硬度。In a second subsequent step, the third coating layer (D) is cured to a final hardness by thermal curing at elevated temperature or by using UV exposure followed by thermal curing at elevated temperature.

在一個具體實例中,預固化及最終固化步驟藉由使用增加之加熱梯度進行加熱來組合。除僅熱固化製程以外,固化可在三個步驟中進行,該製程包含熱預固化及UV固化,之後為最終熱固化。亦可應用兩步固化製程,其中熱預固化之後為UV固化。在此情況下,在UV固化之後較佳不應用最終熱固化。In one specific example, the pre-cure and final cure steps are combined by heating using an increasing heating gradient. In addition to a heat-only curing process, curing can be performed in three steps, the process comprising a thermal pre-cure and a UV cure followed by a final thermal cure. A two-step curing process can also be applied, wherein a thermal pre-cure is followed by a UV cure. In this case, preferably no final thermal cure is applied after the UV cure.

根據一特定具體實例,該方法進一步包括使所沉積之膜顯影。在一個具體實例中,顯影包含使沉積之第一矽氧烷聚合物組成物曝露(全區域或使用光罩或十字線或雷射直接成像之選擇性曝露)於UV光。顯影步驟典型地在任何預固化步驟之後且在最終固化步驟之前進行。According to a specific embodiment, the method further comprises developing the deposited film. In one embodiment, developing comprises exposing the deposited first siloxane polymer composition (full area or selective exposure using a mask or crosshairs or laser direct imaging) to UV light. The developing step is typically performed after any pre-curing step and before the final curing step.

因此,在一個具體實例中,該方法包含以下步驟 -    預固化或乾燥沉積於第二塗層(C)上之第三塗層(D); -    視情況曝露由此獲得第三塗層(D); -    視情況使由此獲得之第三塗層(D)顯影;及 -    固化第三塗層(D)。 Therefore, in a specific example, the method comprises the following steps: -    pre-curing or drying the third coating layer (D) deposited on the second coating layer (C); -    exposing the third coating layer (D) obtained as appropriate; -    developing the third coating layer (D) obtained as appropriate; and -    curing the third coating layer (D).

例示性含有環氧官能基的單體包括(3-縮水甘油氧基丙基)三甲氧基矽烷、l-(2-(三甲氧基矽基)乙基)環己烷-3,4-環氧化物、(3-縮水甘油氧基丙基)三乙氧基矽烷、(3-縮水甘油氧基丙基)三丙氧基矽烷、3-縮水甘油氧基丙基三(2-甲氧基乙氧基)矽烷、2,3-環氧基丙基三乙氧基矽烷、3,4-環氧基丁基三乙氧基矽烷、4,5-環氧基戊基三乙氧基矽烷、5,6-環氧基己基三乙氧基矽烷、5,6-環氧基己基三甲氧基矽烷、2-(3,4-環氧基環己基)乙基三乙氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、4-(三甲氧基矽基)丁烷-1,2-環氧化物。Exemplary monomers containing epoxy functional groups include (3-glycidyloxypropyl)trimethoxysilane, 1-(2-(trimethoxysilyl)ethyl)cyclohexane-3,4-epoxide, (3-glycidyloxypropyl)triethoxysilane, (3-glycidyloxypropyl)tripropoxysilane, 3-glycidyloxypropyltri(2-methoxyethoxy)silane, 2,3-epoxypropyltriethyl triethoxysilane, 3,4-epoxybutyltriethoxysilane, 4,5-epoxypentyltriethoxysilane, 5,6-epoxyhexyltriethoxysilane, 5,6-epoxyhexyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 4-(trimethoxysilyl)butane-1,2-epoxide.

官能化化合物之其他實例為丙烯酸酯及甲基丙烯酸酯化合物,諸如四乙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、新戊四醇三丙烯酸酯、二(三羥甲基丙烷)四丙烯酸酯、二新戊四醇五丙烯酸酯及二新戊四醇六丙烯酸酯及其組合。此類化合物可用作矽烷組成物之一部分。Other examples of functionalized compounds are acrylate and methacrylate compounds such as tetraethylene glycol diacrylate, trihydroxymethylpropane triacrylate, pentaerythritol triacrylate, di(trihydroxymethylpropane) tetraacrylate, dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate and combinations thereof. Such compounds can be used as part of the silane composition.

根據一特定具體實例,該方法進一步包括固化第三組成物。According to a specific embodiment, the method further comprises curing the third component.

第二塗層(C)上之第三塗層(D)的厚度(亦即,薄膜厚度)可在10 nm至10 µm,較佳15 nm至8 µm,更佳20 nm至5 µm之範圍內。The thickness of the third coating layer (D) on the second coating layer (C) (ie, film thickness) may be in the range of 10 nm to 10 µm, preferably 15 nm to 8 µm, and more preferably 20 nm to 5 µm.

在一個具體實例中,第三塗層(D)較佳為包含如WO 2016/146895或WO 2020/099290中所描述之矽氧烷聚合物之易清潔塗層。In one specific example, the third coating (D) is preferably an easy-to-clean coating comprising a siloxane polymer as described in WO 2016/146895 or WO 2020/099290.

在另一具體實例中,第三塗層(D)較佳為柔性硬塗層,其包含第三矽氧烷聚合物(D-1),其包含有包含一或多個氟化碳基團之側鏈。In another embodiment, the third coating layer (D) is preferably a flexible hard coating layer, which comprises a third siloxane polymer (D-1) comprising a side chain comprising one or more fluorinated carbon groups.

在又一具體實例中,第三塗層(D)較佳為包含第四矽氧烷聚合物(D-2)之柔性硬塗層。In another embodiment, the third coating layer (D) is preferably a flexible hard coating layer comprising a fourth siloxane polymer (D-2).

較佳地,經藉由ASTM D3363-00、Elcometer測試儀所測定,第三塗層(D)的硬度大於3H、大於4H、大於5H、大於6H或甚至大於7H。Preferably, the hardness of the third coating layer (D) is greater than 3H, greater than 4H, greater than 5H, greater than 6H or even greater than 7H as measured by ASTM D3363-00, Elcometer tester.

較佳地,經藉由ASTM D3359-09,Cross-Hatch測試儀所測試,第三塗層(D)之黏附力為4B-5B。Preferably, the adhesion of the third coating (D) is 4B-5B as tested by ASTM D3359-09, Cross-Hatch tester.

此外,第三塗層(D)經在Taber線性磨損試驗(使用來自Taber Industries的線性磨損機)中之無視覺刮痕所證明較佳地具有耐刮擦性,該試驗用BonStar鋼絲絨#0000,在500 g重量、2×2 cm頭大小、2.0吋行程長度、60個循環/分鐘下進行至多2000個線性循環。In addition, the third coating (D) had better scratch resistance as evidenced by no visual scratches in the Taber Linear Abrasion Test (using a Linear Abrasion Machine from Taber Industries) with BonStar steel wool #0000, 500 g weight, 2×2 cm head size, 2.0 inch stroke length, 60 cycles/minute up to 2000 linear cycles.

分層結構 在一個具體實例中,根據本發明之分層結構包含基板層(A)、第一塗層(B)及第二塗層(C)。在該具體實例中,第二塗層(C)為分層結構之最外層且與第一塗層(B)、基板層(A)包夾在一起。此意謂較佳無其他塗層或塗層塗覆於基板層(A)之至少一個表面上。 Layered structure In a specific example, the layered structure according to the present invention includes a substrate layer (A), a first coating layer (B) and a second coating layer (C). In the specific example, the second coating layer (C) is the outermost layer of the layered structure and is sandwiched with the first coating layer (B) and the substrate layer (A). This means that preferably no other coating layer or coating layer is coated on at least one surface of the substrate layer (A).

在另一具體實例中,分層結構另外包含第三塗層(D)。在該具體實例中,根據本發明之分層結構包含基板層(A)、第一塗層(B)、第二塗層(C)及第三塗層(D)。在該具體實例中,第三塗層(D)為分層結構之最外層且與基板層(A)、第二塗層(C)及第一塗層(B)包夾在一起,其中第一塗層(B)較佳地為與基板層之表面黏附接觸之最內層。此意謂較佳無其他塗層或塗層塗覆於基板層(A)之至少一個表面上。In another specific example, the layered structure further includes a third coating layer (D). In this specific example, the layered structure according to the present invention includes a substrate layer (A), a first coating layer (B), a second coating layer (C) and a third coating layer (D). In this specific example, the third coating layer (D) is the outermost layer of the layered structure and is sandwiched with the substrate layer (A), the second coating layer (C) and the first coating layer (B), wherein the first coating layer (B) is preferably the innermost layer that is in contact with the surface of the substrate layer. This means that preferably no other coating layer or coating layer is coated on at least one surface of the substrate layer (A).

分層結構展示不同層彼此之間的黏附、高耐刮擦性及低反射率之良好特性平衡。The layered structure exhibits a good balance of properties including good adhesion of the different layers to each other, high scratch resistance and low reflectivity.

分層結構較佳顯示第一塗層(B)對4-5B之基板層(A)的黏附力。The layered structure better shows the adhesion of the first coating layer (B) to the substrate layer (A) of 4-5B.

此外,分層結構較佳顯示第二塗層(C)對3-5B之第一塗層(B)的黏附力。In addition, the layered structure better shows the adhesion of the second coating layer (C) to the first coating layer (B) of 3-5B.

此外,分層結構較佳展示至少75°、較佳至少90°之初始水接觸角。Furthermore, the layered structure preferably exhibits an initial water contact angle of at least 75°, preferably at least 90°.

此外,分層結構較佳地顯示對應於Taber線性磨損試驗(使用來自Taber Industries的線性磨損機)中視覺品質為0至2的耐刮擦性,該試驗用BonStar鋼絲絨#0000,在500 g重量、2×2 cm頭大小、2.0吋行程長度、60個循環/分鐘下進行至多500個線性循環。In addition, the layered structure preferably exhibits a scratch resistance corresponding to a visual quality of 0 to 2 in the Taber Linear Abrasion Test (using a Linear Abrasion Machine from Taber Industries) with BonStar steel wool #0000, 500 g weight, 2×2 cm head size, 2.0 inch stroke length, 60 cycles/minute for up to 500 linear cycles.

此外,分層結構在Taber線性磨損試驗(使用來自Taber Industries的線性磨損機)中較佳地顯示至少80°的接觸角,該試驗用BonStar鋼絲絨#0000,在500 g重量、2×2 cm頭大小、2.0吋行程長度、60個循環/分鐘下進行至多500個線性循環。In addition, the layered structure preferably exhibits a contact angle of at least 80° in the Taber Linear Abrasion Test (using a Linear Abrasion Machine from Taber Industries) with BonStar steel wool #0000, 500 g weight, 2×2 cm head size, 2.0 inch stroke length, 60 cycles/minute for up to 500 linear cycles.

再者,分層結構較佳地展示當在經塗佈之PMMA基板上量測時在550 nm下的反射率不超過4.0%、較佳地不超過3.5%,或當在經塗佈之PET或CPI基板上量測時在550 nm下的反射率不超過6.0%、較佳地不超過5.5%。Furthermore, the layered structure preferably exhibits a reflectivity at 550 nm of no more than 4.0%, preferably no more than 3.5%, when measured on a coated PMMA substrate, or a reflectivity at 550 nm of no more than 6.0%, preferably no more than 5.5%, when measured on a coated PET or CPI substrate.

另外,分層結構較佳地展示在經塗佈之PMMA基板上量測時在550 nm下的透射率至少為93.0%、較佳地至少為93.5%,或在經塗佈之PET或CPI基板上量測時在550 nm下的透射率至少為89.5%、較佳地至少為90.0%。Additionally, the layered structure preferably exhibits a transmittance at 550 nm of at least 93.0%, preferably at least 93.5%, when measured on a coated PMMA substrate, or a transmittance at 550 nm of at least 89.5%, preferably at least 90.0%, when measured on a coated PET or CPI substrate.

根據本發明之分層結構適用於柔性電子應用中,包括顯示器、光學透鏡、透明板及汽車工業,尤其作為玻璃之輕質替代物。The layered structure according to the present invention is suitable for use in flexible electronic applications including displays, optical lenses, transparent panels and the automotive industry, especially as a lightweight substitute for glass.

本發明之特徵進一步在於以下非限制性實施例:The present invention is further characterized by the following non-limiting embodiments:

實施例 1. 測定方法 分子量 聚合物藉由凝膠滲透層析法來表徵。層析系統由配備有等度HPLC泵及折射率偵測器之GPC設備組成。將聚矽氧烷(0.20 g;50%固體含量)溶解於THF(HPLC等級;2.30 g)中。分析物注入體積為100 µL,流速為0.70 mL/min,且管柱溫度設定為40℃。使用四種基於聚苯乙烯排阻之管柱。移動相為THF(HPLC等級)。使用內標測定聚合物之數目平均分子量( M n )及重量平均分子量( M w ),例如,兩個系列之聚苯乙烯(系列A:5種聚苯乙烯,其中 M w = 120.000 g/mol、42.400 g/mol、10.700 g/mol、2.640 g/mol、474 g/mol及系列B:4種聚合物,其中 M w = 193.000 g/mol、16.700 g/mol、6.540 g/mol、890 g/mol)。 Example 1. Determination Methods Molecular weight : The polymers were characterized by gel permeation chromatography. The chromatography system consisted of a GPC apparatus equipped with an isocratic HPLC pump and a refractive index detector. Polysiloxane (0.20 g; 50% solid content) was dissolved in THF (HPLC grade; 2.30 g). The analyte injection volume was 100 µL, the flow rate was 0.70 mL/min, and the column temperature was set to 40 °C. Four polystyrene exclusion-based columns were used. The mobile phase was THF (HPLC grade). Internal standards were used to determine the number average molecular weight ( Mn ) and weight average molecular weight ( Mw ) of polymers, for example, two series of polystyrenes (Series A: 5 polystyrenes with Mw = 120.000 g/mol, 42.400 g/mol, 10.700 g/mol, 2.640 g/mol, 474 g/mol and Series B: 4 polymers with Mw = 193.000 g/mol, 16.700 g/mol, 6.540 g/mol, 890 g/mol).

固體含量:使用Mettler Toledo HB43儀器測定聚合物之固體含量。在鋁盤/杯上對樣品進行稱重,且使用約1 g材料執行量測。 Solids Content : The solids content of the polymers was determined using a Mettler Toledo HB43 instrument. The samples were weighed on an aluminum pan/cup and the measurement was performed using approximately 1 g of material.

黏度 所用工具為Grabner儀器黏度計MINIVIS-II。所使用之方法係「落球黏度量測」。在T=20℃下藉由使用具有3.175 mm直徑之鋼珠來量測樣品。 Viscosity : The instrument used was a Grabner Instruments viscometer MINIVIS-II. The method used was "falling ball viscosity measurement". The sample was measured at T = 20°C using a steel ball with a diameter of 3.175 mm.

膜厚度及折射率 RI ):使用橢圓偏光儀UVISEL-VASE Horiba Jobin-Yvon量測膜厚度及折射率。使用Gorilla Glass 4或矽晶圓(直徑:150 mm,類型/摻雜劑:P/Bor,定向:<1-0-0>,電阻率:1-30 Ω. cm,厚度:675+/-25 μm,TTV:<5 μm,粒子:< 20 @ 0,2 μm,前表面:經拋光;後表面:經蝕刻;Flat 1 SEMI標準)或其他合適基板進行量測。可在使用噴霧工具(典型噴霧方法:掃描速度:300 mm/s;間距:50 mm;間隙:100 mm;流動速率:5-6 ml/min;霧化氣壓:5 kg/cm 2)之預先處理(電漿)玻璃基板上製備材料膜,繼之以例如在T=150℃下熱固化60 min。 Film thickness and refractive index ( RI ): Film thickness and refractive index are measured using an elliptical polarizer UVISEL-VASE Horiba Jobin-Yvon. Gorilla Glass 4 or silicon wafer (diameter: 150 mm, type/doping: P/Bor, orientation: <1-0-0>, resistivity: 1-30 Ω. cm, thickness: 675+/-25 μm, TTV: <5 μm, particles: < 20 @ 0,2 μm, front surface: polished; back surface: etched; Flat 1 SEMI standard) or other suitable substrates are used for measurement. The material film can be prepared on a pre-treated (plasma) glass substrate using a spray tool (typical spraying method: scanning speed: 300 mm/s; spacing: 50 mm; gap: 100 mm; flow rate: 5-6 ml/min; atomization gas pressure: 5 kg/cm 2 ) followed by thermal curing, e.g. at T=150°C for 60 min.

透射率 T% 及反射 R% :使用Konica Minolta分光光度計CM-3700A(Specta Magic NX軟體)量測透射率及反射率。 Transmittance ( T% ) and reflectance ( R% ) : The transmittance and reflectance were measured using a Konica Minolta spectrophotometer CM-3700A (Specta Magic NX software).

顏色及混濁度量測 L*(D 65)、a*(D 65)及b*(D 65)及混濁度藉由使用Konica Minolta分光光度計CM-3700A(Specta Magic NX軟體)測定 Color and turbidity measurements : L*(D 65), a*(D 65), b*(D 65) and turbidity were measured using a Konica Minolta spectrophotometer CM-3700A (Specta Magic NX software).

鉛筆硬度 PEHA ):鉛筆硬度根據ASTM標準D3363-00使用Elcometer鉛筆硬度測試儀測定。 Pencil Hardness ( PEHA ): Pencil hardness is measured according to ASTM Standard D3363-00 using an Elcometer Pencil Hardness Tester.

水接觸角 WCA ):靜態接觸角量測藉由光學張力計使用蒸餾水(4 µL小液滴大小)進行,三個量測點的平均值記錄為量測結果值且使用楊-拉普拉斯方程(Young-Laplace equation)作為描述液滴輪廓的數值方法(工具:attention theta光學張力計)。 Water Contact Angle ( WCA ): Static contact angle measurements were performed by an optical tensiometer using distilled water (4 µL droplet size). The average of three measurement points was recorded as the measurement result and the Young-Laplace equation was used as a numerical method to describe the droplet profile (tool: attention theta optical tensiometer).

磨蝕:對於第2層及第3層結構,使用Bon star鋼絲絨#0000,500 g負載,2×2 cm頭,2吋行程,60個循環/分鐘,500個循環,使用taber線性摩擦器5750進行磨蝕測試。 Erosion: For the second and third layers, the erosion test was conducted using a taber linear abrader 5750 with Bon star steel wool #0000, 500 g load, 2×2 cm head, 2 inch travel, 60 cycles/min, 500 cycles.

視覺品質 VQ ):可用肉眼進行視覺檢驗,在顯微鏡下使用綠或紅光品質燈檢測觀測。視覺品質可在0(最佳)至3(較差)之間評分。 Visual Quality ( VQ ): Visual inspection can be performed with the naked eye and under a microscope using a green or red quality light. Visual quality can be rated from 0 (best) to 3 (poor).

黏附力:黏附力根據ASTM標準D3359-D9使用Elcometer cross-hatch測試儀及Elcometer膠帶測試測定。Adhesion: Adhesion was measured according to ASTM Standard D3359-D9 using the Elcometer cross-hatch tester and the Elcometer tape tester.

2. 實施例中所使用之組分的清單:a)   矽烷單體: GPTMS = (3-縮水甘油氧基丙基)三甲氧基矽烷,Sigma-Aldrich PMDMS =苯基甲基二甲氧基矽烷,Sigma-Aldrich MEMO = 3-(三甲氧基矽基)丙基甲基丙烯酸酯ABCR BTESE = 1,2-雙(三乙氧基矽基)乙烷,Momentive Performance Materials MTMS =甲基三甲氧基矽烷,ABCR TEOS =四乙氧基矽烷,Ultra Pure Solutions Inc. DPDMS =二苯基二甲氧基矽烷,Sigma-Aldrich PTMS =苯基三甲氧基矽烷,Sigma-Aldrich Me-GPTMS = (3-縮水甘油氧基丙基)甲基二甲氧基矽烷,ABCR 三甲氧基(辛基)矽烷,Sigma-Aldrich 4-三氟甲基-四氟苯基三乙氧基矽烷,ABCR F13 = 1H,1H,2H,2H-全氟辛基三甲氧基矽烷,Sigma-Aldrich 1H,1H,2H,2H-全氟辛基三乙氧基矽烷,Sigma-Aldrich F17 = 1H,1H,2H,2H-全氟癸基三甲氧基矽烷,VWR labscan 1H,1H,2H,2H-全氟十二烷基三乙氧基矽烷,Sigma-Aldrich (十七氟-1,1,2,2-四氫癸基)三乙氧基矽烷,Sigma-Aldrich 無氟己基三乙氧基矽烷,Sigma-Aldrich 雙[(2,2,3,3,4,4-六氟丁基)丙酸酯]-3-胺基丙基三甲氧基矽烷。其藉由胺基丙基三甲氧基矽烷(APTMES,Sigma-Aldrich)與2,2,3,3,4,4-六氟丁基丙烯酸酯(OFPA,Sigma-Aldrich)之間的反應製備。製備描述於下文: 在100 mL 3頸圓底燒瓶中,APTMES(10 g)冷卻至T=0℃。OFPA(33.51 g)在T=0℃下逐滴添加。使反應混合物達到室溫且接著在T=60℃下攪拌18小時。藉由TLC監測反應(溶離劑:環己烷/EtOAc=3/1)。低壓下移除過量OFPA。 2. List of components used in the examples: a) Silane monomers: GPTMS = (3-glycidyloxypropyl)trimethoxysilane, Sigma-Aldrich PMDMS = phenylmethyldimethoxysilane, Sigma-Aldrich MEMO = 3-(trimethoxysilyl)propyl methacrylate ABCR BTESE = 1,2-bis(triethoxysilyl)ethane, Momentive Performance Materials MTMS = methyltrimethoxysilane, ABCR TEOS = tetraethoxysilane, Ultra Pure Solutions Inc. DPDMS = diphenyldimethoxysilane, Sigma-Aldrich PTMS = phenyltrimethoxysilane, Sigma-Aldrich Me-GPTMS = (3-glycidyloxypropyl)methyldimethoxysilane, ABCR trimethoxy(octyl)silane, Sigma-Aldrich 4-Trifluoromethyl-tetrafluorophenyltriethoxysilane, ABCR F13 = 1H,1H,2H,2H-perfluorooctyltrimethoxysilane, Sigma-Aldrich 1H,1H,2H,2H-perfluorooctyltriethoxysilane, Sigma-Aldrich F17 = 1H,1H,2H,2H-perfluorodecyltrimethoxysilane, VWR labscan 1H,1H,2H,2H-perfluorododecyltriethoxysilane, Sigma-Aldrich (heptadecafluoro-1,1,2,2-tetrahydrodecyl)triethoxysilane, Sigma-Aldrich Fluoride-free hexyltriethoxysilane, Sigma-Aldrich Bis[(2,2,3,3,4,4-hexafluorobutyl)propionate]-3-aminopropyltrimethoxysilane. It is prepared by reaction between aminopropyltrimethoxysilane (APTMES, Sigma-Aldrich) and 2,2,3,3,4,4-hexafluorobutylacrylate (OFPA, Sigma-Aldrich). The preparation is described below: In a 100 mL 3-neck round-bottom flask, APTMES (10 g) was cooled to T = 0 °C. OFPA (33.51 g) was added dropwise at T = 0 °C. The reaction mixture was allowed to reach room temperature and then stirred at T = 60 °C for 18 hours. The reaction was monitored by TLC (solvent: cyclohexane/EtOAc = 3/1). Excess OFPA was removed under reduced pressure.

b)  聚矽氧烷 聚(甲基-3,3,3-三氟丙基矽氧烷),Mw = 2500 D,ABCR 聚(甲基-3,3,3-三氟丙基矽氧烷),Mw 14000 D,ABCR 基於TEOS之聚合物/100%-TEOS聚合物: 在500 mL圓底燒瓶中,將TEOS(43.46 g)與丙酮(136.08 g)混合。經10-15分鐘逐滴添加HNO 3(0.1 M;29.98 g)。使反應混合物回流2小時。冷卻至室溫後,添加PGME(115 g)。在真空下進行來自EtOH/H 2O/丙酮至PGME之溶劑交換程序。藉由添加更多PGME將混合物之最終固體含量調節至10%。 b) Polysiloxanes Poly(methyl-3,3,3-trifluoropropylsiloxane), Mw = 2500 D, ABCR Poly(methyl-3,3,3-trifluoropropylsiloxane), Mw 14000 D, ABCR TEOS-based polymers/100%-TEOS polymers: In a 500 mL round-bottom flask, TEOS (43.46 g) and acetone (136.08 g) were mixed. HNO 3 (0.1 M; 29.98 g) was added dropwise over 10-15 min. The reaction mixture was refluxed for 2 h. After cooling to room temperature, PGME (115 g) was added. A solvent exchange procedure from EtOH/H 2 O/acetone to PGME was performed under vacuum. The final solids content of the mixture was adjusted to 10% by adding more PGME.

c)   溶劑: DAA =二丙酮醇,Merck EtOH =乙醇,Altia VWR PGME = 1-甲氧基-2-丙醇,Ultra Pure Solutions Inc. MeOH =甲醇,Merck IPA = 2-丙醇,Merck PGMEA =丙二醇單乙醚乙酸酯,Ultra Pure Solutions Inc. MTBE =甲基三級丁基醚,Sigma-Aldrich EG =乙二醇,Sigma-Aldrich DiPG =二丙二醇,Sigma-Aldrich 丙酮,Brenntag c)   Solvents: DAA = diacetone alcohol, Merck EtOH = ethanol, Altia VWR PGME = 1-methoxy-2-propanol, Ultra Pure Solutions Inc. MeOH = methanol, Merck IPA = 2-propanol, Merck PGMEA = propylene glycol monoethyl ether acetate, Ultra Pure Solutions Inc. MTBE = methyl tert-butyl ether, Sigma-Aldrich EG = ethylene glycol, Sigma-Aldrich DiPG = dipropylene glycol, Sigma-Aldrich Acetone, Brenntag

d)  催化劑: HNO 3=硝酸,Merck HCl =鹽酸,Merck 甲酸,Sigma-Aldrich TEA =三乙胺,Sigma-Aldrich d) Catalyst: HNO 3 = nitric acid, Merck HCl = hydrochloric acid, Merck Formic acid, Sigma-Aldrich TEA = triethylamine, Sigma-Aldrich

e)   氟化添加劑 KY 1900 =具有反應性矽基之全氟聚醚,Shin-Etsu KY 1901 =具有反應性矽基之全氟聚醚,Shin-Etsu KY 1271 =氟化防污添加劑,Shin-Etsu DSX = OPTOOL DSX E(氟聚醚矽烷),Daikin SC 019 =氟聚醚化合物,Shin-Etsu SC 011 =氟聚醚化合物,Shin-Etsu Novec 7100 =甲氧基-九氟丁烷之異構物混合物,3M AE 3000 = 1,1,2,2-四氟乙基-2,2,2-三氟乙基醚,Daikin e)   Fluorinated additives KY 1900 = Perfluoropolyether with reactive silyl groups, Shin-Etsu KY 1901 = Perfluoropolyether with reactive silyl groups, Shin-Etsu KY 1271 = Fluorinated antifouling additive, Shin-Etsu DSX = OPTOOL DSX E (fluoropolyether silane), Daikin SC 019 = Fluoropolyether compounds, Shin-Etsu SC 011 = Fluoropolyether compounds, Shin-Etsu Novec 7100 = Mixture of isomers of methoxy-nonafluorobutane, 3M AE 3000 = 1,1,2,2-tetrafluoroethyl-2,2,2-trifluoroethyl ether, Daikin

f)   其他化學物質: AIBN =偶氮二異丁腈,Sigma Aldrich UVI Speed Cure 976 = (硫化二苯-4,1-二基)雙(二苯基鋶),Lambson BYK 333 =聚醚改質的聚二甲基矽氧烷,BYK BYK 345 =聚醚改質的矽氧烷,BYK BYK 370 =聚酯改質,羥基官能性聚二甲基矽氧烷,BYK BYK 067A =消泡劑,BYK M262 =三環癸烷二甲醇二丙烯酸酯,Miwon M2372 =三(2-羥乙基異氰脲酸酯)二/三丙烯酸酯,Miwon M270 =四乙二醇二丙烯酸酯,Miwon ClSiMe 3=氯三甲基矽烷,Sigma-Aldrich f) Other chemicals: AIBN = azobisisobutyronitrile, Sigma Aldrich UVI Speed Cure 976 = (diphenyl-4,1-diyl)bis(diphenylstennium sulfide), Lambson BYK 333 = polyether-modified polydimethylsiloxane, BYK BYK 345 = polyether-modified siloxane, BYK BYK 370 = polyester-modified, hydroxy-functional polydimethylsiloxane, BYK BYK 067A = defoamer, BYK M262 = tricyclodecane dimethanol diacrylate, Miwon M2372 = tris(2-hydroxyethyl isocyanurate) di/triacrylate, Miwon M270 = tetraethylene glycol diacrylate, Miwon ClSiMe 3 = chlorotrimethylsilane, Sigma-Aldrich

3. 製備實施例 a) 第一塗層( B )之製備實施例用於第一塗層之組成物特別在固化及烘烤條件方面與基板相適應。由此,組成物30尤其適用作PMMA基板之第一塗層,且組成物31尤其適用作PET或CPI之第一塗層。 3. Preparation Examples a) Preparation Example of the First Coating ( B ) The composition used for the first coating is particularly adapted to the substrate in terms of curing and baking conditions. Thus, composition 30 is particularly suitable for the first coating of a PMMA substrate, and composition 31 is particularly suitable for the first coating of a PET or CPI substrate.

組成物 B-1在2 L圓底燒瓶中,將GPTMS(900 g;3,804 mol)、PMDMS(99,06 g;0,27 mol)及MEMO(301,32 g;0,54 mol)混合。歷經15分鐘逐滴添加HNO 3(0,1 M;212,4 g)。隨後在室溫下攪拌反應混合物隔夜。隨後添加二丙酮醇(DAA;600 g)且在低壓下進行MeOH/EtOH/H 2O至DAA之溶劑交換。藉由添加額外DAA將最終固體含量調節至50%。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)、M270(15%固體材料)及BYK 067A(1%固體材料)。 Composition B-1 In a 2 L round bottom flask, GPTMS (900 g; 3,804 mol), PMDMS (99,06 g; 0,27 mol) and MEMO (301,32 g; 0,54 mol) were mixed. HNO 3 (0,1 M; 212,4 g) was added dropwise over 15 minutes. The reaction mixture was then stirred at room temperature overnight. Diacetone alcohol (DAA; 600 g) was then added and a solvent exchange from MeOH/EtOH/H 2 O to DAA was performed under low pressure. The final solid content was adjusted to 50% by adding additional DAA. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material), M270 (15% solid material) and BYK 067A (1% solid material) were added.

組成物 B-2在500 mL圓底燒瓶中,將BTESE(21,15 g;0,06 mol)、GPTMS(91 g;0,3875 mol)、MEMO(37 g;0,149 mol)及雙[(2,2,3,3,4,4-六氟丁基)丙酸酯]-3-胺基丙基三甲氧基矽烷(2,76 g;0,00043 mol)混合於丙酮(112,4 g)中。歷經15分鐘逐滴添加HNO 3(0,1 M;35,47 g)且在室溫下攪拌反應混合物隔夜。添加PGME(90 g)且進行自丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-2 In a 500 mL round-bottom flask, BTESE (21.15 g; 0.06 mol), GPTMS (91 g; 0.3875 mol), MEMO (37 g; 0.149 mol) and bis[(2,2,3,3,4,4-hexafluorobutyl)propionate]-3-aminopropyltrimethoxysilane (2.76 g; 0.00043 mol) were mixed in acetone (112.4 g). HNO 3 (0.1 M; 35.47 g) was added dropwise over 15 minutes and the reaction mixture was stirred at room temperature overnight. PGME (90 g) was added and a solvent exchange procedure from acetone to PGME was performed. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-3在500 mL圓底燒瓶中,將BTESE(21,15 g;0,06 mol)、GPTMS(91 g;0,3875 mol)、MEMO(37 g;0,149 mol)及4-三氟甲基-四氟苯基三乙氧基矽烷(0,05 g;0,00131 mol)混合於丙酮(112,4 g)中。歷經15分鐘逐滴添加HNO 3(0,1 M;35,47 g)且在室溫下攪拌反應混合物隔夜。添加PGME(90 g)且進行自丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-3 In a 500 mL round-bottom flask, BTESE (21.15 g; 0.06 mol), GPTMS (91 g; 0.3875 mol), MEMO (37 g; 0.149 mol) and 4-trifluoromethyl-tetrafluorophenyltriethoxysilane (0.05 g; 0.00131 mol) were mixed in acetone (112.4 g). HNO 3 (0.1 M; 35.47 g) was added dropwise over 15 minutes and the reaction mixture was stirred at room temperature overnight. PGME (90 g) was added and a solvent exchange procedure from acetone to PGME was performed. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-4在500 mL圓底燒瓶中,將BTESE(21,15 g;0,06 mol)、GPTMS(91 g;0,3875 mol)、MEMO(37 g;0,149 mol)及1H,1H,2H,2H-全氟辛基三乙氧基矽烷(2,05 g;0,0040 mol)混合於丙酮(112,4 g)中。歷經15分鐘逐滴添加HNO 3(0,1 M;35,47 g)且在室溫下攪拌反應混合物隔夜。添加PGME(90 g)且進行自丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-4 In a 500 mL round-bottom flask, BTESE (21.15 g; 0.06 mol), GPTMS (91 g; 0.3875 mol), MEMO (37 g; 0.149 mol) and 1H,1H,2H,2H-perfluorooctyltriethoxysilane (2.05 g; 0.0040 mol) were mixed in acetone (112.4 g). HNO 3 (0.1 M; 35.47 g) was added dropwise over 15 minutes and the reaction mixture was stirred at room temperature overnight. PGME (90 g) was added and a solvent exchange procedure from acetone to PGME was performed. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-5在500 mL圓底燒瓶中,將BTESE(21,15 g;0,06 mol)、GPTMS(91 g;0,3875 mol)、MEMO(37 g;0,149 mol)及聚(甲基-3,3,3-三氟丙基矽氧烷)(2 g;Mw=2500 D)混合於丙酮(112,4 g)中。歷經15分鐘逐滴添加HNO 3(0,1 M;35,47 g)且在室溫下攪拌反應混合物隔夜。添加PGME(90 g)且進行自丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-5 In a 500 mL round-bottom flask, BTESE (21.15 g; 0.06 mol), GPTMS (91 g; 0.3875 mol), MEMO (37 g; 0.149 mol) and poly(methyl-3,3,3-trifluoropropylsiloxane) (2 g; Mw=2500 D) were mixed in acetone (112.4 g). HNO 3 (0.1 M; 35.47 g) was added dropwise over 15 minutes and the reaction mixture was stirred at room temperature overnight. PGME (90 g) was added and a solvent exchange procedure from acetone to PGME was performed. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-6在500 mL圓底燒瓶中,將BTESE(21,15 g;0,06 mol)、GPTMS(91 g;0,3875 mol)、MEMO(37 g;0,149 mol)及聚(甲基-3,3,3-三氟丙基矽氧烷)(2,3 g;Mw=14000 D)混合於丙酮(112,4 g)中。歷經15分鐘逐滴添加HNO 3(0,1 M;35,47 g)且在室溫下攪拌反應混合物隔夜。添加PGME(90 g)且進行自丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-6 In a 500 mL round-bottom flask, BTESE (21.15 g; 0.06 mol), GPTMS (91 g; 0.3875 mol), MEMO (37 g; 0.149 mol) and poly(methyl-3,3,3-trifluoropropylsiloxane) (2.3 g; Mw=14000 D) were mixed in acetone (112.4 g). HNO 3 (0.1 M; 35.47 g) was added dropwise over 15 minutes and the reaction mixture was stirred at room temperature overnight. PGME (90 g) was added and a solvent exchange procedure from acetone to PGME was performed. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-7在500 mL圓底燒瓶中,將BTESE(21,15 g;0,06 mol)、GPTMS(91 g;0,3875 mol)、MEMO(37 g;0,149 mol)及1H,1H,2H,2H-全氟十二烷基三乙氧基矽烷(0,73 g)混合於丙酮(112,4 g)中。歷經15分鐘逐滴添加HNO 3(0,1 M;35,47 g)且在室溫下攪拌反應混合物隔夜。添加PGME(90 g)且進行自丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-7 In a 500 mL round-bottom flask, BTESE (21.15 g; 0.06 mol), GPTMS (91 g; 0.3875 mol), MEMO (37 g; 0.149 mol) and 1H,1H,2H,2H-perfluorododecyltriethoxysilane (0.73 g) were mixed in acetone (112.4 g). HNO 3 (0.1 M; 35.47 g) was added dropwise over 15 minutes and the reaction mixture was stirred at room temperature overnight. PGME (90 g) was added and a solvent exchange procedure from acetone to PGME was performed. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-8在500 mL圓底燒瓶中,將BTESE(21,15 g;0,06 mol)、GPTMS(91 g;0,3875 mol)、MEMO(37 g;0,149 mol)及(十七氟-1,1,2,2-四氫癸基)三乙氧基矽烷(0,5 g)混合於丙酮(112,4 g)中。歷經15分鐘逐滴添加HNO 3(0,1 M;35,47 g)且在室溫下攪拌反應混合物隔夜。添加PGME(90 g)且進行自丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-8 In a 500 mL round-bottom flask, BTESE (21.15 g; 0.06 mol), GPTMS (91 g; 0.3875 mol), MEMO (37 g; 0.149 mol) and (heptadecafluoro-1,1,2,2-tetrahydrodecyl)triethoxysilane (0.5 g) were mixed in acetone (112.4 g). HNO 3 (0.1 M; 35.47 g) was added dropwise over 15 minutes and the reaction mixture was stirred at room temperature overnight. PGME (90 g) was added and a solvent exchange procedure from acetone to PGME was performed. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-9在500 mL圓底燒瓶中,將BTESE(21,15 g;0,06 mol)、GPTMS(91 g;0,3875 mol)、MEMO(37 g;0,149 mol)及無氟己基三乙氧基矽烷(2 g)混合於丙酮(112,4 g)中。歷經15分鐘逐滴添加HNO 3(0,1 M;35,47 g)且在室溫下攪拌反應混合物隔夜。添加PGME(90 g)且進行自丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-9 In a 500 mL round-bottom flask, BTESE (21.15 g; 0.06 mol), GPTMS (91 g; 0.3875 mol), MEMO (37 g; 0.149 mol) and fluorine-free hexyltriethoxysilane (2 g) were mixed in acetone (112.4 g). HNO 3 (0.1 M; 35.47 g) was added dropwise over 15 minutes and the reaction mixture was stirred at room temperature overnight. PGME (90 g) was added and a solvent exchange procedure from acetone to PGME was performed. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-10在500 mL圓底燒瓶中,將BTESE(21,15 g;0,06 mol)、GPTMS(91 g;0,3875 mol)、MEMO(37 g;0,149 mol)混合於丙酮(112,4 g)中。歷經15分鐘逐滴添加HNO 3(0,1 M;35,47 g)且在室溫下攪拌反應混合物隔夜。添加PGME(90 g)且進行自丙酮至PGME之溶劑交換程序。添加額外PGME以具有41.85%固體含量之聚合物。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至30%固體含量且添加添加劑Speed Cure 976(1.2%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-10 In a 500 mL round bottom flask, BTESE (21.15 g; 0.06 mol), GPTMS (91 g; 0.3875 mol), MEMO (37 g; 0.149 mol) were mixed in acetone (112.4 g). HNO 3 (0.1 M; 35.47 g) was added dropwise over 15 minutes and the reaction mixture was stirred at room temperature overnight. PGME (90 g) was added and a solvent exchange procedure from acetone to PGME was performed. Additional PGME was added to give a polymer with a solid content of 41.85%. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 30% solid content with IPA and the additives Speed Cure 976 (1.2% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-11在1 L圓底燒瓶中,將MTMS(78,46 g;0,576 mol)、TEOS(20 g;0,096 mol)、GPTMS(22,69 g;0,096 mol)混合於EtOH(121,15 g)中。經15分鐘逐滴添加甲酸(0.1 M;86,40 g)。在添加完成之後,使反應混合物回流2小時。隨後將反應混合物冷卻至室溫且添加PGME(100 g)。在低壓下進行來自EtOH至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-11 MTMS (78.46 g; 0.576 mol), TEOS (20 g; 0.096 mol), GPTMS (22.69 g; 0.096 mol) were mixed in EtOH (121.15 g) in a 1 L round-bottom flask. Formic acid (0.1 M; 86.40 g) was added dropwise over 15 minutes. After the addition was complete, the reaction mixture was refluxed for 2 hours. The reaction mixture was then cooled to room temperature and PGME (100 g) was added. The solvent exchange procedure from EtOH to PGME was performed under low pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-12在1 L圓底燒瓶中,將BTESE(63,83 g;0,18 mol)、MEMO(14,90 g;0,06 mol)、GPTMS(226,9 g;0,96 mol)混合於丙酮(229,21 g)中。經15分鐘逐滴添加HNO 3(0.1 M;74,59 g)。完成添加後,在室溫下攪拌反應混合物隔夜。隨後將反應混合物轉移至2 L圓底燒瓶且添加PGME(150 g)。在低壓下進行丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-12 In a 1 L round-bottom flask, BTESE (63.83 g; 0.18 mol), MEMO (14.90 g; 0.06 mol), GPTMS (226.9 g; 0.96 mol) were mixed in acetone (229.21 g). HNO 3 (0.1 M; 74.59 g) was added dropwise over 15 minutes. After the addition was complete, the reaction mixture was stirred at room temperature overnight. The reaction mixture was then transferred to a 2 L round-bottom flask and PGME (150 g) was added. A solvent exchange procedure from acetone to PGME was performed under low pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-13在1 L圓底燒瓶中,將BTESE(63,83 g;0,18 mol)、MEMO(14,90 g;0,06 mol)、GPTMS(218,38 g;0,924 mol)、F17(20,46 g;0,036 mol)混合於丙酮(238,18 g)中。經15分鐘逐滴添加HNO 3(0.1 M;74,59 g)。完成添加後,在室溫下攪拌反應混合物隔夜。隨後將反應混合物轉移至2 L圓底燒瓶且添加PGME(150 g)。在低壓下進行丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-13 In a 1 L round-bottom flask, BTESE (63.83 g; 0.18 mol), MEMO (14.90 g; 0.06 mol), GPTMS (218.38 g; 0.924 mol), F17 (20.46 g; 0.036 mol) were mixed in acetone (238.18 g). HNO 3 (0.1 M; 74.59 g) was added dropwise over 15 minutes. After the addition was completed, the reaction mixture was stirred at room temperature overnight. The reaction mixture was then transferred to a 2 L round-bottom flask and PGME (150 g) was added. The solvent exchange procedure from acetone to PGME was performed under low pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-14在1 L圓底燒瓶中,將BTESE(63,83 g;0,18 mol)、MEMO(14,90 g;0,06 mol)、GPTMS(218,38 g;0,924 mol)、F13(18,36 g;0,036 mol)混合於丙酮(238,60 g)中。經15分鐘逐滴添加HNO 3(0.1 M;74,59 g)。完成添加後,在室溫下攪拌反應混合物隔夜。隨後將反應混合物轉移至2 L圓底燒瓶且添加PGME(150 g)。在低壓下進行丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-14 In a 1 L round-bottom flask, BTESE (63,83 g; 0,18 mol), MEMO (14,90 g; 0,06 mol), GPTMS (218,38 g; 0,924 mol), F13 (18,36 g; 0,036 mol) were mixed in acetone (238,60 g). HNO 3 (0.1 M; 74,59 g) was added dropwise over 15 minutes. After the addition was complete, the reaction mixture was stirred at room temperature overnight. The reaction mixture was then transferred to a 2 L round-bottom flask and PGME (150 g) was added. The solvent exchange procedure from acetone to PGME was performed under low pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-15在1 L圓底燒瓶中,將BTESE(14,51 g;0,0409 mol)、MEMO(20,33 g;0,0818 mol)、GPTMS(62,87 g;0,266 mol)、DPDMS(5,06 g;0,020 mol)混合於丙酮(77,03 g)中。經15分鐘逐滴添加HNO 3(0.1 M;23,96 g)。完成添加後,在室溫下攪拌反應混合物隔夜。隨後將反應混合物轉移至新的1 L圓底燒瓶且添加PGME(60 g)。在低壓下進行丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-15 In a 1 L round-bottom flask, BTESE (14.51 g; 0.0409 mol), MEMO (20.33 g; 0.0818 mol), GPTMS (62.87 g; 0.266 mol), DPDMS (5.06 g; 0.020 mol) were mixed in acetone (77.03 g). HNO 3 (0.1 M; 23.96 g) was added dropwise over 15 minutes. After the addition was complete, the reaction mixture was stirred at room temperature overnight. The reaction mixture was then transferred to a new 1 L round-bottom flask and PGME (60 g) was added. The solvent exchange procedure from acetone to PGME was performed under low pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-16在1 L圓底燒瓶中,將PTMS(10,00 g;0,050 mol)、MEMO(18,79 g;0,076 mol)、GPTMS(77,47 g;0,327 mol)、BTESE(17,88 g;0,050 mol)混合於丙酮(93,11 g)中。經15分鐘逐滴添加HNO 3(0.1 M;29,98 g)。完成添加後,在室溫下攪拌反應混合物隔夜。隨後將反應混合物轉移至新的1 L圓底燒瓶且添加PGME(75 g)。在低壓下進行丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-16 PTMS (10,00 g; 0,050 mol), MEMO (18,79 g; 0,076 mol), GPTMS (77,47 g; 0,327 mol), BTESE (17,88 g; 0,050 mol) were mixed in acetone (93,11 g) in a 1 L round-bottom flask. HNO 3 (0.1 M; 29,98 g) was added dropwise over 15 minutes. After the addition was complete, the reaction mixture was stirred at room temperature overnight. The reaction mixture was then transferred to a new 1 L round-bottom flask and PGME (75 g) was added. The solvent exchange procedure from acetone to PGME was performed under low pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-17在1 L圓底燒瓶中,將BTESE(31,91 g;0,18 mol)、MEMO(22,35 g;0,18 mol)、GPTMS(99,26 g;0,84 mol)混合於丙酮(15 g)中。經15分鐘逐滴添加HNO 3(0.1 M;37,26 g)。完成添加後,在室溫下攪拌反應混合物隔夜。隨後將反應混合物轉移至新的1 L圓底燒瓶且添加PGME(92 g)。在低壓下進行丙酮至PGME之溶劑交換程序。將先前溶液之一部分(50 g,PGME中之50%固體含量)與AIBN(0.1 g)混合且在T=105℃下攪拌反應混合物5分鐘。在冷卻至室溫之後,準備好最終產物以供加工。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-17 In a 1 L round-bottom flask, BTESE (31.91 g; 0.18 mol), MEMO (22.35 g; 0.18 mol), GPTMS (99.26 g; 0.84 mol) were mixed in acetone (15 g). HNO 3 (0.1 M; 37.26 g) was added dropwise over 15 minutes. After the addition was complete, the reaction mixture was stirred at room temperature overnight. The reaction mixture was then transferred to a new 1 L round-bottom flask and PGME (92 g) was added. A solvent exchange procedure from acetone to PGME was performed under low pressure. A portion of the previous solution (50 g, 50% solid content in PGME) was mixed with AIBN (0.1 g) and the reaction mixture was stirred at T = 105 ° C for 5 minutes. After cooling to room temperature, the final product was ready for processing. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-18在1 L圓底燒瓶中,將BTESE(25,00 g;0,070 mol)、Me-GPTMS(36,25 g;0,164 mol)、GPTMS(38,88 g;0,164 mol)、MEMO(17,51 g;0,070 mol)混合於丙酮(88,23 g)中。經15分鐘逐滴添加HNO 3(0.1 M;26,25 g)。完成添加後,在室溫下攪拌反應混合物隔夜。隨後將反應混合物轉移至新的1 L圓底燒瓶且添加PGME(70,58 g)。在低壓下進行丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-18 In a 1 L round-bottom flask, BTESE (25,00 g; 0,070 mol), Me-GPTMS (36,25 g; 0,164 mol), GPTMS (38,88 g; 0,164 mol), MEMO (17,51 g; 0,070 mol) were mixed in acetone (88,23 g). HNO 3 (0.1 M; 26,25 g) was added dropwise over 15 minutes. After the addition was complete, the reaction mixture was stirred at room temperature overnight. The reaction mixture was then transferred to a new 1 L round-bottom flask and PGME (70,58 g) was added. The solvent exchange procedure from acetone to PGME was performed under low pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-19在1 L圓底燒瓶中,將MEMO(35,02 g;0,141 mol)、GPTMS(86,85 g;0,366 mol)、BTESE(20,00 g;0,056 mol)混合於IPA(106,25 g)中。經15分鐘逐滴添加HNO 3(0.1 M;33,53 g)。完成添加後,在室溫下攪拌反應混合物隔夜。隨後將反應混合物轉移至新的1 L圓底燒瓶且添加IPA(75 g)。在低壓下進行IPA至IPA之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-19 In a 1 L round-bottom flask, MEMO (35.02 g; 0.141 mol), GPTMS (86.85 g; 0.366 mol), BTESE (20.00 g; 0.056 mol) were mixed in IPA (106.25 g). HNO 3 (0.1 M; 33.53 g) was added dropwise over 15 minutes. After the addition was complete, the reaction mixture was stirred at room temperature overnight. The reaction mixture was then transferred to a new 1 L round-bottom flask and IPA (75 g) was added. The solvent exchange procedure from IPA to IPA was performed under low pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-20在500 mL圓底燒瓶中,將MTMS(90,00 g;0,660 mol)、GPTMS(22,31 g;0,094 mol)混合於EtOH(112,31 g)中。經15分鐘逐滴添加甲酸(0.1 M;122,32 g)。完成添加後,在室溫下攪拌反應混合物隔夜。隨後將反應混合物轉移至新的500 mL圓底燒瓶且添加PGMEA(100 g)。在低壓下進行來自EtOH至PGMEA之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-20 MTMS (90,00 g; 0,660 mol), GPTMS (22,31 g; 0,094 mol) were mixed in EtOH (112,31 g) in a 500 mL round-bottom flask. Formic acid (0.1 M; 122,32 g) was added dropwise over 15 minutes. After the addition was complete, the reaction mixture was stirred at room temperature overnight. The reaction mixture was then transferred to a new 500 mL round-bottom flask and PGMEA (100 g) was added. The solvent exchange procedure from EtOH to PGMEA was performed under low pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-21在250 mL圓底燒瓶中,將TEOS(14,00 g;0,048 mol)、MTMS(1,00 g;0,0074 mol)、F17(7,34 g;0,0129 mol)、GPTMS(1,31 g;0,006 mol)混合。經15分鐘逐滴添加HCl(0.1 M;4,88 g)。完成添加後,在室溫下攪拌反應混合物隔夜。隨後將反應混合物轉移至新的250 mL圓底燒瓶且添加IPA(14,3 g)。在低壓下進行EtOH/MeOH/H 2O至IPA之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-21 In a 250 mL round-bottom flask, TEOS (14,00 g; 0,048 mol), MTMS (1,00 g; 0,0074 mol), F17 (7,34 g; 0,0129 mol), GPTMS (1,31 g; 0,006 mol) were mixed. HCl (0.1 M; 4,88 g) was added dropwise over 15 minutes. After the addition was complete, the reaction mixture was stirred at room temperature overnight. The reaction mixture was then transferred to a new 250 mL round-bottom flask and IPA (14,3 g) was added. A solvent exchange procedure from EtOH/MeOH/H 2 O to IPA was performed under low pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-22在250 mL圓底燒瓶中,將TEOS(14,00 g;0,067 mol)、MTMS(1,91 g;0,014 mol)、F17(11,4 g;0,0196 mol)、GPTMS(2,65 g;0,0112 mol)混合。經15分鐘逐滴添加甲酸(0.1 M;7,26 g)。完成添加後,在室溫下攪拌反應混合物隔夜。隨後將反應混合物轉移至新的250 mL圓底燒瓶且添加IPA(18,48 g)。在低壓下進行EtOH/MeOH/H 2O至IPA之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-22 In a 250 mL round-bottom flask, TEOS (14,00 g; 0,067 mol), MTMS (1,91 g; 0,014 mol), F17 (11,4 g; 0,0196 mol), GPTMS (2,65 g; 0,0112 mol) were mixed. Formic acid (0.1 M; 7,26 g) was added dropwise over 15 minutes. After the addition was complete, the reaction mixture was stirred at room temperature overnight. The reaction mixture was then transferred to a new 250 mL round-bottom flask and IPA (18,48 g) was added. A solvent exchange procedure from EtOH/MeOH/H 2 O to IPA was performed under low pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-23在1 L圓底燒瓶中,將BTESE(31,91 g;0,18 mol)、GPTMS(99,26 g;0,84 mol)、MEMO(22,25 g;0,18 mol)混合於丙酮(115 g)中。歷經15分鐘逐滴添加HNO 3(0,1 M;36,26 g)且在室溫下攪拌反應混合物隔夜。添加PGME(92 g),且在低壓下進行丙酮至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-23 In a 1 L round-bottom flask, BTESE (31.91 g; 0.18 mol), GPTMS (99.26 g; 0.84 mol), MEMO (22.25 g; 0.18 mol) were mixed in acetone (115 g). HNO 3 (0.1 M; 36.26 g) was added dropwise over 15 minutes and the reaction mixture was stirred at room temperature overnight. PGME (92 g) was added and a solvent exchange procedure from acetone to PGME was performed under low pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-24在1 L圓底燒瓶中,將MTMS(58,02 g;0,42 mol)、TEOS(19,57 g;0,090 mol)、MEMO(7,00 g;0,028 mol)、GPTMS(18,50 g;0,078 mol)混合於EtOH(103,09 g)中。逐滴添加甲酸(0.1 M;71,04 g)且使反應混合物在T=105℃下回流2小時。冷卻反應混合物至室溫。添加PGME(90 g),且在低壓下進行來自EtOH至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-24 MTMS (58.02 g; 0.42 mol), TEOS (19.57 g; 0.090 mol), MEMO (7.00 g; 0.028 mol), GPTMS (18.50 g; 0.078 mol) were mixed in EtOH (103.09 g) in a 1 L round-bottom flask. Formic acid (0.1 M; 71.04 g) was added dropwise and the reaction mixture was refluxed at T = 105 °C for 2 hours. The reaction mixture was cooled to room temperature. PGME (90 g) was added and a solvent exchange procedure from EtOH to PGME was performed under reduced pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-25在1 L圓底燒瓶中,將MTMS(98,73 g;0.724mol)、MEMO(15,00 g;0,060 mol)、TEOS(12,58 g;0,060 mol)、GPTMS(28,55 g;0,12 mol)混合於EtOH(154,86 g)中。逐滴添加甲酸(0.1 M;106,54 g)且使反應混合物在T=105℃下回流2小時。冷卻反應混合物至室溫。添加PGME(100 g),且在低壓下進行來自EtOH至PGME之溶劑交換程序。隨後在室溫下添加AIBN(1.11 g),且在T=95℃下攪拌反應混合物5分鐘。在冷卻至室溫之後,準備好最終產物以供加工。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-25 MTMS (98,73 g; 0.724 mol), MEMO (15,00 g; 0,060 mol), TEOS (12,58 g; 0,060 mol), GPTMS (28,55 g; 0,12 mol) were mixed in EtOH (154,86 g) in a 1 L round-bottom flask. Formic acid (0.1 M; 106,54 g) was added dropwise and the reaction mixture was refluxed at T = 105 °C for 2 hours. The reaction mixture was cooled to room temperature. PGME (100 g) was added and a solvent exchange procedure from EtOH to PGME was performed under reduced pressure. AIBN (1.11 g) was then added at room temperature and the reaction mixture was stirred at T = 95 °C for 5 minutes. After cooling to room temperature, the final product was ready for processing. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-27在1 L圓底燒瓶中,將GPTMS(450 g;1,902 mol)、MEMO(150,00 g;0,54 mol)、PMDMS(49,53 g;0,27 mol)混合。逐滴添加HNO 3(0,1 M;106,2 g)且在室溫下攪拌反應混合物隔夜。添加DAA(300 g)且在低壓下進行MeOH/H 2O至DAA之溶劑交換程序。最終調配物之固體含量仍為50%。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-27 In a 1 L round bottom flask, GPTMS (450 g; 1,902 mol), MEMO (150,00 g; 0,54 mol), PMDMS (49,53 g; 0,27 mol) were mixed. HNO 3 (0,1 M; 106,2 g) was added dropwise and the reaction mixture was stirred at room temperature overnight. DAA (300 g) was added and a solvent exchange procedure from MeOH/H 2 O to DAA was performed under low pressure. The solid content of the final formulation was still 50%. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-28在500 ml圓底燒瓶中,將MTMS(40 g;0,2936 mol)、TEOS(61,17 g;0,29364 mol)、EtOH(101.17 g;2,2075 mol)混合。逐滴添加甲酸(0.1 M;74 g)且使反應混合物在T=105℃下回流2小時。冷卻反應混合物至室溫。添加PGME(100 g),且在低壓下進行來自EtOH至PGME之溶劑交換程序。藉由添加PGME將固體含量調節至41.85%。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-28 In a 500 ml round-bottom flask, MTMS (40 g; 0,2936 mol), TEOS (61,17 g; 0,29364 mol), EtOH (101.17 g; 2,2075 mol) were mixed. Formic acid (0.1 M; 74 g) was added dropwise and the reaction mixture was refluxed at T = 105 ° C for 2 hours. The reaction mixture was cooled to room temperature. PGME (100 g) was added and a solvent exchange procedure from EtOH to PGME was performed under low pressure. The solid content was adjusted to 41.85% by adding PGME. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-29在500 ml圓底燒瓶中,將MTMS(40 g;0,2936 mol)、TEOS(61,17 g;0,29364 mol)、EtOH(101.17 g;2,2075 mol)混合。逐滴添加甲酸(0.1 M;33 g)且使反應混合物在T=105℃下回流2小時。冷卻反應混合物至室溫。添加PGME(33g),且在低壓下進行來自EtOH至PGME之溶劑交換程序。現向溶液中添加三甲氧基(辛基)矽烷(5 g,0,0213 mol)。逐滴添加甲酸(0.1 M;3,46 g)且使反應混合物在T=105℃下回流2小時。冷卻反應混合物至室溫。添加PGME(100 g),且在低壓下進行來自EtOH至PGME之溶劑交換程序。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-29 In a 500 ml round-bottom flask, MTMS (40 g; 0,2936 mol), TEOS (61,17 g; 0,29364 mol), EtOH (101.17 g; 2,2075 mol) were mixed. Formic acid (0.1 M; 33 g) was added dropwise and the reaction mixture was refluxed at T = 105 ° C for 2 hours. The reaction mixture was cooled to room temperature. PGME (33 g) was added and a solvent exchange procedure from EtOH to PGME was performed under low pressure. Trimethoxy(octyl)silane (5 g, 0,0213 mol) was now added to the solution. Formic acid (0.1 M; 3,46 g) was added dropwise and the reaction mixture was refluxed at T = 105 ° C for 2 hours. The reaction mixture was cooled to room temperature. PGME (100 g) was added and a solvent exchange procedure from EtOH to PGME was performed under low pressure. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material) and BYK 067A (1% solid material) were added.

組成物 B-30在1 L圓底燒瓶中,將GPTMS(900 g)、MEMO(301,32 g)、PMDMS(99,09 g)混合。歷經10-15分鐘緩慢添加HNO 3(0,1 M;212.4 g)。隨後在室溫下攪拌反應混合物隔夜。添加DAA(600 g)且在真空下進行MeOH/H 2O至DAA之溶劑交換。藉由添加DAA將反應混合物之最終固體含量調節至50%。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至33%固體含量且添加添加劑Speed Cure 976(1.5%固體材料)、BYK 333(1%固體材料)、M270(15%固體含量)及BYK 067A(1%固體材料)。 Composition B-30 In a 1 L round bottom flask, GPTMS (900 g), MEMO (301.32 g), PMDMS (99.09 g) were mixed. HNO 3 (0.1 M; 212.4 g) was added slowly over 10-15 minutes. The reaction mixture was then stirred at room temperature overnight. DAA (600 g) was added and a solvent exchange of MeOH/H 2 O to DAA was performed under vacuum. The final solid content of the reaction mixture was adjusted to 50% by adding DAA. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 33% solid content with IPA and the additives Speed Cure 976 (1.5% solid material), BYK 333 (1% solid material), M270 (15% solid content) and BYK 067A (1% solid material) were added.

組成物 B-31在500 mL圓底燒瓶中,將BTESE(21,15 g;0,06 mol)、GPTMS(91 g;0,3875 mol)、MEMO(37 g;0,149 mol)混合於丙酮(112,4 g)中。歷經15分鐘逐滴添加HNO 3(0,1 M;35,47 g)且在室溫下攪拌反應混合物隔夜。添加PGME(90 g)且進行自丙酮至PGME之溶劑交換程序。添加額外PGME以具有41.85%固體含量之聚合物。接著如下調配產物以進行隨後的效能評估:用IPA將材料進一步稀釋至30%固體含量且添加添加劑Speed Cure 976(1.2%固體材料)、BYK 370(1%固體材料)及BYK 067A(1%固體材料)。 Composition B-31 In a 500 mL round bottom flask, BTESE (21.15 g; 0.06 mol), GPTMS (91 g; 0.3875 mol), MEMO (37 g; 0.149 mol) were mixed in acetone (112.4 g). HNO 3 (0.1 M; 35.47 g) was added dropwise over 15 minutes and the reaction mixture was stirred at room temperature overnight. PGME (90 g) was added and a solvent exchange procedure from acetone to PGME was performed. Additional PGME was added to give a polymer with a solid content of 41.85%. The product was then formulated for subsequent performance evaluation as follows: the material was further diluted to 30% solid content with IPA and the additives Speed Cure 976 (1.2% solid material), BYK 370 (1% solid material) and BYK 067A (1% solid material) were added.

b) 第二塗層( C )之製備實施例 組成物 C-1在500 ml圓底燒瓶中,將MTMS(10,5 g;0,0771 mol)、TEOS(30,0 g;0,1440 mol)、EtOH(163 g;3,52 mol)混合。逐滴添加HCl(1,0 M;33,9 g)且在室溫下攪拌反應混合物3,5小時。有機相用混合物H 2O/MTBE(0,9:1,05)洗滌5次。添加EtOH(183.43 g)且在真空下進行至EtOH之溶劑交換程序。藉由添加EtOH(25.44 g)將反應混合物之固體含量調節至4%。隨後在室溫下添加TEA(0,130 g)且反應混合物在T=70℃下攪拌45分鐘。在冷卻至室溫之後,有機相用H 2O/MTBE混合物(0,9:1,05)洗滌5次。收集有機相,添加EtOH(89.04 g)及PGME(190 g)且在真空下進行至PGME之溶劑交換。在室溫下添加ClSiMe 3(0,041 g)且在T=105℃下攪拌反應混合物30分鐘。聚合物的一部分(11.47 g,PGME中之5.23%固體含量)與KY 1901(0.4%在Novec 7100中;6,25 g)、Novec 7100(17.85 g)、IPA(12.83 g)、EG(1.24 g)及基於TEOS之聚合物(0.36 g,PGME中之10%固體含量)混合。 b) Preparation of the second coating ( C ) Example Composition C-1 In a 500 ml round-bottom flask, MTMS (10.5 g; 0.0771 mol), TEOS (30.0 g; 0.1440 mol), EtOH (163 g; 3.52 mol) were mixed. HCl (1.0 M; 33.9 g) was added dropwise and the reaction mixture was stirred at room temperature for 3.5 hours. The organic phase was washed 5 times with a mixture H 2 O/MTBE (0.9:1.05). EtOH (183.43 g) was added and a solvent exchange procedure was carried out to EtOH under vacuum. The solid content of the reaction mixture was adjusted to 4% by adding EtOH (25.44 g). TEA (0.130 g) is then added at room temperature and the reaction mixture is stirred at T = 70 ° C for 45 minutes. After cooling to room temperature, the organic phase is washed 5 times with a H 2 O/MTBE mixture (0.9:1.05). The organic phases are collected, EtOH (89.04 g) and PGME (190 g) are added and a solvent exchange to PGME is carried out under vacuum. ClSiMe 3 (0.041 g) is added at room temperature and the reaction mixture is stirred at T = 105 ° C for 30 minutes. A portion of the polymer (11.47 g, 5.23% solids in PGME) was mixed with KY 1901 (0.4% in Novec 7100; 6,25 g), Novec 7100 (17.85 g), IPA (12.83 g), EG (1.24 g) and TEOS based polymer (0.36 g, 10% solids in PGME).

組成物 C-2在10 L圓底燒瓶中,混合HNO 3(3 M,804 g)及IPA(3771 g),隨後使用分液漏斗經20分鐘混合TEOS(570 g,2,736 mol)及MTMS(373 g,2,7382 mol)。添加之後,將反應混合物在室溫下攪拌3,5小時。 用H 2O/MTBE之混合物(0,9:1,05)進行若干次洗滌步驟持續4天。聚合物的一部分(11.47 g,PGMEA中之5.23%固體含量)與KY 1901(0.4%在Novec 7100中;6,25 g)、Novec 7100(17.85 g)、IPA(12.83 g)、EG(1.24 g)及基於TEOS之聚合物(0.36 g,PGME中之10%固體含量)混合。 Composition C-2 In a 10 L round-bottom flask, HNO 3 (3 M, 804 g) and IPA (3771 g) were mixed, followed by TEOS (570 g, 2,736 mol) and MTMS (373 g, 2,7382 mol) using a separatory funnel over 20 minutes. After addition, the reaction mixture was stirred at room temperature for 3.5 hours. Several washing steps with a mixture of H 2 O/MTBE (0.9:1.05) were performed for 4 days. A portion of the polymer (11.47 g, 5.23% solids in PGMEA) was mixed with KY 1901 (0.4% in Novec 7100; 6,25 g), Novec 7100 (17.85 g), IPA (12.83 g), EG (1.24 g) and TEOS based polymer (0.36 g, 10% solids in PGME).

組成物 C-3在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。聚合物的一部分(11.47 g,PGMEA中之5.23%固體含量)與KY 1901(0.4%在Novec 7100中;6,25 g)、Novec 7100(17.85 g)、IPA(12.83 g)、EG(1.24 g)及基於TEOS之聚合物(0.36 g,PGME中之10%固體含量)混合。 Composition C-3 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T = 60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T=105° C. for 1,5 h. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (11.47 g, 5.23% solids in PGMEA) was mixed with KY 1901 (0.4% in Novec 7100; 6,25 g), Novec 7100 (17.85 g), IPA (12.83 g), EG (1.24 g) and TEOS based polymer (0.36 g, 10% solids in PGME).

組成物 C-4在250 L反應器中,將TEOS(43,436 g)與丙酮(136 g)混合。歷經10-20分鐘將HNO 3(0.01 M;2,978 g)緩慢添加至反應混合物中。隨後將反應混合物回流1小時。冷卻至室溫後,添加PGME(115 kg)且在真空下進行丙酮/H 2O/EtOH至PGME之溶劑交換。藉由添加更多PGME將混合物之固體含量調節至10%。聚合物的一部分(6 g,PGME中之10%固體含量)與DSX(0.4%在AE 3000中;18,75 g)、AE 3000(56,125 g)、PGME(65,68 g)及DiPG(3,72 g)混合。 Composition C-4 In a 250 L reactor, TEOS (43,436 g) and acetone (136 g) were mixed. HNO 3 (0.01 M; 2,978 g) was slowly added to the reaction mixture over 10-20 minutes. The reaction mixture was then refluxed for 1 hour. After cooling to room temperature, PGME (115 kg) was added and a solvent exchange of acetone/H 2 O/EtOH to PGME was performed under vacuum. The solid content of the mixture was adjusted to 10% by adding more PGME. A portion of the polymer (6 g, 10% solid content in PGME) was mixed with DSX (0.4% in AE 3000; 18,75 g), AE 3000 (56,125 g), PGME (65,68 g) and DiPG (3,72 g).

組成物 C-5在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。將聚合物的一部分(30.59 g,PGMEA中之5.23%固體含量)與IPA(69.40 g)及BYK 333(0.064 g)混合。 Composition C-5 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T = 60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T = 105°C for 1,5 hours. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (30.59 g, 5.23% solid content in PGMEA) is mixed with IPA (69.40 g) and BYK 333 (0.064 g).

組成物 C-6在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。聚合物的一部分(5.73 g,PGMEA中之5.23%固體含量)與Novec 7100(7.19 g)、IPA(18.29 g)、EG(1.24 g)、基於TEOS之聚合物(PGME中之10%固體含量;0.09 g)及BYK 333(0.018 g)混合。 Composition C-6 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T=60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T=105° C. for 1,5 h. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (5.73 g, 5.23% solids in PGMEA) was mixed with Novec 7100 (7.19 g), IPA (18.29 g), EG (1.24 g), TEOS-based polymer (10% solids in PGME; 0.09 g), and BYK 333 (0.018 g).

組成物 C-7在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。聚合物的一部分(9.56 g,PGMEA中之5.23%固體含量)與Novec 7100(6.93 g)、IPA(14.65 g)、EG(1.24 g)、基於TEOS之聚合物(PGME中之10%固體含量;9.56 g)及BYK 333(0.014 g)混合。 Composition C-7 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T = 60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T=105° C. for 1,5 h. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (9.56 g, 5.23% solids in PGMEA) was mixed with Novec 7100 (6.93 g), IPA (14.65 g), EG (1.24 g), TEOS-based polymer (10% solids in PGME; 9.56 g), and BYK 333 (0.014 g).

組成物 C-8在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。聚合物的一部分(4.78 g,PGMEA中之5.23%固體含量)與Novec 7100(3.35 g)、IPA(3.09 g)、PGME(6.11 g)、基於TEOS之聚合物(PGME中之10%固體含量;1.00 g)及BYK 333(0.010 g)混合。 Composition C-8 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T = 60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T=105° C. for 1,5 h. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (4.78 g, 5.23% solids in PGMEA) was mixed with Novec 7100 (3.35 g), IPA (3.09 g), PGME (6.11 g), a TEOS-based polymer (10% solids in PGME; 1.00 g), and BYK 333 (0.010 g).

組成物 C-9在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。將聚合物的一部分(11.47 g,PGMEA中之5.23%固體含量)與IPA(69.40 g)及BYK 333(0.064 g)混合。 Composition C-9 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T = 60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T = 105°C for 1,5 hours. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (11.47 g, 5.23% solid content in PGMEA) is mixed with IPA (69.40 g) and BYK 333 (0.064 g).

組成物 C-10在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。將聚合物的一部分(22.94 g,PGMEA中之5.23%固體含量)與IPA(69.40 g)及BYK 333(0.064 g)混合。 Composition C-10 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T=60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T = 105°C for 1,5 hours. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (22.94 g, 5.23% solid content in PGMEA) is mixed with IPA (69.40 g) and BYK 333 (0.064 g).

組成物 C-11在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。將聚合物的一部分(19.12 g,PGMEA中之5.23%固體含量)與IPA(69.40 g)及BYK 333(0.064 g)混合。 Composition C-11 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T=60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T = 105°C for 1,5 hours. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (19.12 g, 5.23% solid content in PGMEA) is mixed with IPA (69.40 g) and BYK 333 (0.064 g).

組成物 C-12在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。將聚合物的一部分(17.20 g,PGMEA中之5.23%固體含量)與IPA(69.40 g)及BYK 333(0.064 g)混合。 Composition C-12 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T = 60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T = 105°C for 1,5 hours. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (17.20 g, 5.23% solid content in PGMEA) is mixed with IPA (69.40 g) and BYK 333 (0.064 g).

組成物 C-13在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。聚合物的一部分(5.73 g,PGMEA中之5.23%固體含量)與EG(0.62 g)、IPA(3,41 g)、Novec 7100(8.78 g)、KY 1901(0.4%在Novec 7100中;3.12 g)及100%-TEOS聚合物(PGME中之10%固體含量,3 g)混合。 Composition C-13 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T=60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T=105° C. for 1,5 h. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (5.73 g, 5.23% solids in PGMEA) was mixed with EG (0.62 g), IPA (3,41 g), Novec 7100 (8.78 g), KY 1901 (0.4% in Novec 7100; 3.12 g) and 100%-TEOS polymer (10% solids in PGME, 3 g).

組成物 C-14在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。聚合物的一部分(428.3 g,PGMEA中之5.23%固體含量)與PGME(732.98 g)、EtOH(345.8 g)、M262(4.29 g)、M2372(4.29 g)及BYK 345(0.896 g)混合。 Composition C-14 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T = 60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T=105° C. for 1,5 h. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (428.3 g, 5.23% solids in PGMEA) was mixed with PGME (732.98 g), EtOH (345.8 g), M262 (4.29 g), M2372 (4.29 g), and BYK 345 (0.896 g).

組成物 C-15在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。聚合物的一部分(7.17 g,PGMEA中之5.23%固體含量)與KY1901(0.4%在Novec 7100中;3.12 g)、Novec 7100(7.62 g)、IPA(4.67 g)、EG(0.62 g)及基於TEOS之聚合物(PGME中之10%固體含量;1.12 g)混合。 Composition C-15 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T = 60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T=105° C. for 1,5 h. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (7.17 g, 5.23% solids in PGMEA) was mixed with KY1901 (0.4% in Novec 7100; 3.12 g), Novec 7100 (7.62 g), IPA (4.67 g), EG (0.62 g) and TEOS-based polymer (10% solids in PGME; 1.12 g).

組成物 C-16在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。聚合物的一部分(7.17 g,PGMEA中之5.23%固體含量)與SC 011(0.4%在Novec 7100中;3.12 g)、Novec 7100(7.62 g)、IPA(4.67 g)、EG(0.62 g)及基於TEOS之聚合物(PGME中之10%固體含量;1.12 g)混合。 Composition C-16 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T = 60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T=105° C. for 1,5 h. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (7.17 g, 5.23% solids in PGMEA) was mixed with SC 011 (0.4% in Novec 7100; 3.12 g), Novec 7100 (7.62 g), IPA (4.67 g), EG (0.62 g) and TEOS-based polymer (10% solids in PGME; 1.12 g).

組成物 C-17在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。聚合物的一部分(7.17 g,PGMEA中之5.23%固體含量)與SC 019(0.4%在Novec 7100中;3.12 g)、Novec 7100(7.62 g)、IPA(4.67 g)、EG(0.62 g)及基於TEOS之聚合物(PGME中之10%固體含量;1.12 g)混合。 Composition C-17 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T=60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T=105° C. for 1,5 h. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (7.17 g, 5.23% solids in PGMEA) was mixed with SC 019 (0.4% in Novec 7100; 3.12 g), Novec 7100 (7.62 g), IPA (4.67 g), EG (0.62 g) and TEOS-based polymer (10% solids in PGME; 1.12 g).

組成物 C-18在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。聚合物的一部分(7.17 g,PGMEA中之5.23%固體含量)與KY1901(0.4%在Novec 7100中;6.24 g)、Novec 7100(7.62 g)、IPA(4.67 g)、EG(0.62 g)及基於TEOS之聚合物(PGME中之10%固體含量;1.12 g)混合。 Composition C-18 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T = 60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T=105° C. for 1,5 h. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (7.17 g, 5.23% solids in PGMEA) was mixed with KY1901 (0.4% in Novec 7100; 6.24 g), Novec 7100 (7.62 g), IPA (4.67 g), EG (0.62 g), and TEOS-based polymer (10% solids in PGME; 1.12 g).

組成物 C-19在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。聚合物的一部分(7.17 g,PGMEA中之5.23%固體含量)與SC 011(0.4%在Novec 7100中;3.12 g)、Novec 7100(5.26 g)、IPA(4.67 g)、EG(0.62 g)及基於TEOS之聚合物(PGME中之10%固體含量;3.75 g)混合。 Composition C-19 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T = 60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T=105° C. for 1,5 h. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (7.17 g, 5.23% solids in PGMEA) was mixed with SC 011 (0.4% in Novec 7100; 3.12 g), Novec 7100 (5.26 g), IPA (4.67 g), EG (0.62 g) and TEOS-based polymer (10% solids in PGME; 3.75 g).

組成物 C-20在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。聚合物的一部分(7.17 g,PGMEA中之5.23%固體含量)與SC 019(0.4%在Novec 7100中;3.12 g)、Novec 7100(5.26 g)、IPA(4.67 g)、EG(0.62 g)及基於TEOS之聚合物(PGME中之10%固體含量;3.75 g)混合。 Composition C-20 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T=60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T=105° C. for 1,5 h. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (7.17 g, 5.23% solids in PGMEA) was mixed with SC 019 (0.4% in Novec 7100; 3.12 g), Novec 7100 (5.26 g), IPA (4.67 g), EG (0.62 g) and TEOS-based polymer (10% solids in PGME; 3.75 g).

組成物 C-21在250 L反應器中,混合HNO 3(3 M;14,445 kg)及IPA(54,72 kg)。添加MTMS(5,368 kg)及TEOS(8,196 kg)。將反應混合物在室溫下攪拌3,5小時。有機相用H 2O/MTBE混合物(1:1)洗滌五次。添加IPA(70 kg)且在低壓下進行H 2O/IPA/EtOH/MeOH至IPA之溶劑交換。藉由添加IPA(31 kg)將反應混合物之固體含量調節至4%。在室溫下添加TEA(0.3417 kg)且將反應混合物在T=60℃下進一步攪拌36分鐘。在冷卻至室溫之後,有機層用H 2O/MTBE混合物洗滌6次。添加PGMEA(87 kg)且在低壓下進行自IPA/MTBE至PGMEA之溶劑交換。藉由添加PGMEA(20 kg)將反應混合物之固體含量調節至4%。將ClSiMe 3(0,041 g)添加至反應混合物中,其在T=105℃下進一步攪拌1,5小時。冷卻至室溫後,藉由蒸餾移除約21 kg溶劑,得到5.23%之最終固體含量。聚合物的一部分(7.17 g,PGMEA中之5.23%固體含量)與KY 1901(0.4%在Novec 7100中;3.12 g)、Novec 7100(5.26 g)、IPA(4.67 g)、EG(0.62 g)及基於TEOS之聚合物(PGME中之10%固體含量;3.75 g)混合。 Composition C-21 In a 250 L reactor, HNO 3 (3 M; 14,445 kg) and IPA (54,72 kg) were mixed. MTMS (5,368 kg) and TEOS (8,196 kg) were added. The reaction mixture was stirred at room temperature for 3,5 hours. The organic phase was washed five times with a H 2 O/MTBE mixture (1:1). IPA (70 kg) was added and a solvent exchange of H 2 O/IPA/EtOH/MeOH to IPA was performed under low pressure. The solid content of the reaction mixture was adjusted to 4% by adding IPA (31 kg). TEA (0.3417 kg) was added at room temperature and the reaction mixture was further stirred at T=60°C for 36 minutes. After cooling to room temperature, the organic layer is washed 6 times with a H 2 O/MTBE mixture. PGMEA (87 kg) is added and a solvent exchange from IPA/MTBE to PGMEA is performed under reduced pressure. The solid content of the reaction mixture is adjusted to 4% by adding PGMEA (20 kg). ClSiMe 3 (0,041 g) is added to the reaction mixture, which is further stirred at T=105° C. for 1,5 h. After cooling to room temperature, about 21 kg of solvent are removed by distillation, giving a final solid content of 5.23%. A portion of the polymer (7.17 g, 5.23% solids in PGMEA) was mixed with KY 1901 (0.4% in Novec 7100; 3.12 g), Novec 7100 (5.26 g), IPA (4.67 g), EG (0.62 g) and TEOS-based polymer (10% solids in PGME; 3.75 g).

組成物 C-22將AE 3000(80 g)及KY 1900(0.1 g)混合於IPA(20 g)中。 Composition C-22 : AE 3000 (80 g) and KY 1900 (0.1 g) were mixed in IPA (20 g).

組成物 C-23將AE 3000(80 g)及KY 1901(0.1 g)混合於IPA(20 g)中。 Composition C-23 : AE 3000 (80 g) and KY 1901 (0.1 g) were mixed in IPA (20 g).

c) 第三塗層( D )之製備實施例 組成物 D-1在250 L反應器中,將TEOS(43,436 g)與丙酮(136 g)混合。歷經10-20分鐘將HNO 3(0.01 M;2,978 g)緩慢添加至反應混合物中。隨後將反應混合物回流1小時。冷卻至室溫後,添加PGME(115 kg)且在真空下進行丙酮/H 2O/EtOH至PGME之溶劑交換。藉由添加更多PGME將混合物之固體含量調節至10%。聚合物的一部分(40 g,PGMEA中之10%固體含量)與DSX(0.4%在Novec 7100中;125 g)、Novec 7100(375.3 g)、IPA(439 g)及EG(24.8 g)混合。 c) Preparation of the third coating ( D ) Example Composition D-1 In a 250 L reactor, TEOS (43,436 g) and acetone (136 g) were mixed. HNO 3 (0.01 M; 2,978 g) was slowly added to the reaction mixture over 10-20 minutes. The reaction mixture was then refluxed for 1 hour. After cooling to room temperature, PGME (115 kg) was added and a solvent exchange of acetone/H 2 O/EtOH to PGME was performed under vacuum. The solid content of the mixture was adjusted to 10% by adding more PGME. A portion of the polymer (40 g, 10% solids in PGMEA) was mixed with DSX (0.4% in Novec 7100; 125 g), Novec 7100 (375.3 g), IPA (439 g) and EG (24.8 g).

組成物 D-2在250 L反應器中,將TEOS(43,436 g)與丙酮(136 g)混合。歷經10-20分鐘將HNO 3(0.01 M;2,978 g)緩慢添加至反應混合物中。隨後將反應混合物回流1小時。冷卻至室溫後,添加PGME(115 kg)且在真空下進行丙酮/H 2O/EtOH至PGME之溶劑交換。藉由添加更多PGME將混合物之固體含量調節至10%。聚合物的一部分(10,874 g,PGME中之10%固體含量)與DSX(0.4%在Novec 7100中;18,125 g)、Novec 7100(54,07 g)、PGME(58,74 g)及EG(3,59 g)混合。 Composition D-2 In a 250 L reactor, TEOS (43,436 g) and acetone (136 g) were mixed. HNO 3 (0.01 M; 2,978 g) was slowly added to the reaction mixture over 10-20 minutes. The reaction mixture was then refluxed for 1 hour. After cooling to room temperature, PGME (115 kg) was added and a solvent exchange of acetone/H 2 O/EtOH to PGME was performed under vacuum. The solid content of the mixture was adjusted to 10% by adding more PGME. A portion of the polymer (10,874 g, 10% solids in PGME) was mixed with DSX (0.4% in Novec 7100; 18,125 g), Novec 7100 (54,07 g), PGME (58,74 g) and EG (3,59 g).

組成物 D-3在1 L圓底燒瓶中,將TEOS(86 g;0,412 mol)溶解於丙酮(272 g)中。添加KY 1271(0.4 g)。逐滴添加HNO 3(0.1 M;59.36 g)且使所得反應混合物回流2小時。隨後將反應混合物冷卻至室溫。添加PGME(125.12 kg)且在真空下進行丙酮/EtOH/H 2O至PGME之溶劑交換程序。藉由添加更多PGME將混合物之固體含量調節至10%。聚合物的一部分(8 g,PGME中之10%固體含量)與KY1901(0.4%在Novec 7100中;35 g)、SC019(0.4%在Novec 7100中;15 g)、Novec 7100(119,2 g)、PGME(67,04 g)及EG(4,96 g)混合。 Composition D-3 In a 1 L round-bottom flask, TEOS (86 g; 0,412 mol) was dissolved in acetone (272 g). KY 1271 (0.4 g) was added. HNO 3 (0.1 M; 59.36 g) was added dropwise and the resulting reaction mixture was refluxed for 2 hours. The reaction mixture was then cooled to room temperature. PGME (125.12 kg) was added and a solvent exchange procedure of acetone/EtOH/H 2 O to PGME was performed under vacuum. The solid content of the mixture was adjusted to 10% by adding more PGME. A portion of the polymer (8 g, 10% solids in PGME) was mixed with KY1901 (0.4% in Novec 7100; 35 g), SC019 (0.4% in Novec 7100; 15 g), Novec 7100 (119,2 g), PGME (67,04 g) and EG (4,96 g).

組成物 D-4在250 L反應器中,將TEOS(43,436 g)與丙酮(136 g)混合。歷經10-20分鐘將HNO 3(0.01 M;2,978 g)緩慢添加至反應混合物中。隨後將反應混合物回流1小時。冷卻至室溫後,添加PGME(115 kg)且在真空下進行丙酮/H 2O/EtOH至PGME之溶劑交換。藉由添加更多PGME將混合物之固體含量調節至10%。聚合物的一部分(6 g,PGME中之10%固體含量)與溶解於Novec 7100(32,55 g)中之KY 1901(0,675 g)及SC 019(0,525 g)、PGME(65,68 g)、EG(3,72 g)及額外Novec 7100(41,01 g)混合。 Composition D-4 In a 250 L reactor, TEOS (43,436 g) and acetone (136 g) were mixed. HNO 3 (0.01 M; 2,978 g) was slowly added to the reaction mixture over 10-20 minutes. The reaction mixture was then refluxed for 1 hour. After cooling to room temperature, PGME (115 kg) was added and a solvent exchange of acetone/H 2 O/EtOH to PGME was performed under vacuum. The solid content of the mixture was adjusted to 10% by adding more PGME. A portion of the polymer (6 g, 10% solids in PGME) was mixed with KY 1901 (0.675 g) and SC 019 (0.525 g), PGME (65.68 g), EG (3.72 g) and additional Novec 7100 (41.01 g) dissolved in Novec 7100 (32.55 g).

組成物 D-5在500 ml圓底燒瓶中,將MTMS(40 g;0,2936 mol)、TEOS(61,17 g;0,29364 mol)、EtOH(101.17 g;2,2075 mol)混合。逐滴添加甲酸(0.1 M;74 g)且使反應混合物在T=105℃下回流2小時。冷卻反應混合物至室溫。添加PGME(100 g),且低壓下進行來自EtOH至PGME之溶劑交換程序。藉由添加PGME將固體含量調節至41.85%。接著如下調配前述材料的一部分以進行隨後的效能評估:用IPA(34.52 g)、KY 1901(0.4%在Novec 7100中,2.5 g)及Novec 7100(14.96 g)進一步稀釋材料(0.47 g)。 Composition D-5 In a 500 ml round-bottom flask, MTMS (40 g; 0,2936 mol), TEOS (61,17 g; 0,29364 mol), EtOH (101.17 g; 2,2075 mol) were mixed. Formic acid (0.1 M; 74 g) was added dropwise and the reaction mixture was refluxed at T = 105 ° C for 2 hours. The reaction mixture was cooled to room temperature. PGME (100 g) was added and a solvent exchange procedure from EtOH to PGME was performed under low pressure. The solid content was adjusted to 41.85% by adding PGME. A portion of the above material was then formulated for subsequent performance evaluation as follows: the material (0.47 g) was further diluted with IPA (34.52 g), KY 1901 (0.4% in Novec 7100, 2.5 g), and Novec 7100 (14.96 g).

組成物 D-6在500 ml圓底燒瓶中,將MTMS(40 g;0,2936 mol)、TEOS(61,17 g;0,29364 mol)、EtOH(101.17 g;2,2075 mol)混合。逐滴添加甲酸(0.1 M;74 g)且使反應混合物在T=105℃下回流2小時。冷卻反應混合物至室溫。添加PGME(100 g),且低壓下進行來自EtOH至PGME之溶劑交換程序。藉由添加PGME將固體含量調節至41.85%。接著如下調配前述材料的一部分以進行隨後的效能評估:用IPA(46.76 g)、EG(2.48 g)、KY 1901(0.4%在Novec 7100中,22.5 g)及Novec 7100(27.39 g)進一步稀釋材料(0.955 g)。 Composition D-6 In a 500 ml round-bottom flask, MTMS (40 g; 0,2936 mol), TEOS (61,17 g; 0,29364 mol), EtOH (101.17 g; 2,2075 mol) were mixed. Formic acid (0.1 M; 74 g) was added dropwise and the reaction mixture was refluxed at T = 105 ° C for 2 hours. The reaction mixture was cooled to room temperature. PGME (100 g) was added and a solvent exchange procedure from EtOH to PGME was performed under low pressure. The solid content was adjusted to 41.85% by adding PGME. A portion of the above material was then formulated for subsequent performance evaluation as follows: the material (0.955 g) was further diluted with IPA (46.76 g), EG (2.48 g), KY 1901 (0.4% in Novec 7100, 22.5 g), and Novec 7100 (27.39 g).

組成物 D-7在500 ml圓底燒瓶中,將MTMS(40 g;0,2936 mol)、TEOS(61,17 g;0,29364 mol)、EtOH(101.17 g;2,2075 mol)混合。逐滴添加甲酸(0.1 M;74 g)且使反應混合物在T=105℃下回流2小時。冷卻反應混合物至室溫。添加PGME(100 g),且低壓下進行來自EtOH至PGME之溶劑交換程序。藉由添加PGME將固體含量調節至41.85%。接著如下調配前述材料的一部分以進行隨後的效能評估:用IPA(46.10 g)、EG(2.48 g)、KY 1901(0.4%在Novec 7100中,22.5 g)及Novec 7100(27.21 g)進一步稀釋材料(1.79 g)。 Composition D-7 In a 500 ml round-bottom flask, MTMS (40 g; 0,2936 mol), TEOS (61,17 g; 0,29364 mol), EtOH (101.17 g; 2,2075 mol) were mixed. Formic acid (0.1 M; 74 g) was added dropwise and the reaction mixture was refluxed at T = 105 ° C for 2 hours. The reaction mixture was cooled to room temperature. PGME (100 g) was added and a solvent exchange procedure from EtOH to PGME was performed under low pressure. The solid content was adjusted to 41.85% by adding PGME. A portion of the above material was then formulated for subsequent performance evaluation as follows: the material (1.79 g) was further diluted with IPA (46.10 g), EG (2.48 g), KY 1901 (0.4% in Novec 7100, 22.5 g), and Novec 7100 (27.21 g).

組成物 D-8在500 ml圓底燒瓶中,將MTMS(60 g;0.44 mol)、TEOS(91,76 g;0,44 mol)、EtOH(151.76 g)混合。逐滴添加甲酸(0.1 M;110.99 g)且使反應混合物在T=105℃下回流2小時。冷卻反應混合物至室溫。添加PGME(100 g),且低壓下進行來自EtOH至PGME之溶劑交換程序。藉由添加PGME將固體含量調節至41.85%。接著如下調配前述材料的一部分以進行隨後的效能評估:用IPA(22.86 g)、EG(1.24 g)、KY 1901(0.4%在Novec 7100中,11.25 g)SC 019(0.4%在Novec 7100中,6.25 g)及Novec 7100(7.14 g)進一步稀釋材料(0.89 g)。 Composition D-8 In a 500 ml round-bottom flask, MTMS (60 g; 0.44 mol), TEOS (91.76 g; 0.44 mol), EtOH (151.76 g) were mixed. Formic acid (0.1 M; 110.99 g) was added dropwise and the reaction mixture was refluxed at T = 105 ° C for 2 hours. The reaction mixture was cooled to room temperature. PGME (100 g) was added and a solvent exchange procedure from EtOH to PGME was performed under low pressure. The solid content was adjusted to 41.85% by adding PGME. A portion of the above material was then formulated for subsequent performance evaluation as follows: the material (0.89 g) was further diluted with IPA (22.86 g), EG (1.24 g), KY 1901 (0.4% in Novec 7100, 11.25 g), SC 019 (0.4% in Novec 7100, 6.25 g), and Novec 7100 (7.14 g).

組成物 D-9在500 ml圓底燒瓶中,將MTMS(60 g;0.44 mol)、TEOS(91,76 g;0,44 mol)、EtOH(151.76 g)混合。逐滴添加甲酸(0.1 M;110.99 g)且使反應混合物在T=105℃下回流2小時。冷卻反應混合物至室溫。添加PGME(100 g),且低壓下進行來自EtOH至PGME之溶劑交換程序。藉由添加PGME將固體含量調節至41.85%。接著如下調配前述材料的一部分以進行隨後的效能評估:用EG(3.72 g)、KY 1901(0.4%在Novec 7100中,18.75 g)、PGME(69.34 g)及Novec 7100(55.95 g)進一步稀釋材料(2.69 g)。 Composition D-9 In a 500 ml round-bottom flask, MTMS (60 g; 0.44 mol), TEOS (91.76 g; 0.44 mol), EtOH (151.76 g) were mixed. Formic acid (0.1 M; 110.99 g) was added dropwise and the reaction mixture was refluxed at T = 105 ° C for 2 hours. The reaction mixture was cooled to room temperature. PGME (100 g) was added and a solvent exchange procedure from EtOH to PGME was performed under low pressure. The solid content was adjusted to 41.85% by adding PGME. A portion of the above material was then formulated for subsequent performance evaluation as follows: the material (2.69 g) was further diluted with EG (3.72 g), KY 1901 (0.4% in Novec 7100, 18.75 g), PGME (69.34 g) and Novec 7100 (55.95 g).

4. 塗層之製備及特性 a)  PMMA 基板上之兩層塗層或三層塗層 第一層( B 第一層塗佈使用具有組成物30之輥對輥先導設備在PMMA(375 μm)上進行。卷材速度為5 m/min且槽模速度為650 rpm。在T=75℃下藉由預烘烤使塗層固化3分鐘,隨後在1000 W下UV曝露30秒,且隨後如所陳述在T=75℃下最終烘烤。 4. Preparation and properties of the coatings a) Two- or three-layer coatings on PMMA substrates First layer ( B ) The first layer coating was carried out on PMMA (375 μm) using a roll-to-roll pilot plant with composition 30. The web speed was 5 m/min and the slot die speed was 650 rpm. The coatings were cured by pre-baking at T=75°C for 3 minutes, followed by UV exposure at 1000 W for 30 seconds and then final baking at T=75°C as described.

表1中所描述之10個不同點上的3個不同經塗佈之輥對輥之厚度。塗層之平均厚度大約為5 µm。 1 3個不同經塗佈之輥對輥之厚度以µm為單位 點1 點2 點3 點4 點5 點6 點7 點8 點9 點10 PMMA塗佈之輥對輥1 5,4 5,3 5,6 5,3 5,7 5,5 5,6 5,6 5,1 5,3 PMMA塗佈之輥對輥2 5,3 5,6 5,6 5,8 5,6 5,6 5,6 5,5 5,8 5,3 PMMA塗佈之輥對輥3 5,1 5,5 5,6 5,8 5,6 5,7 5,7 5,7 5,6 5,6 Thickness of the roll-to-roll coating for 3 different coatings at 10 different points as described in Table 1. The average coating thickness is approximately 5 µm. Table 1 : Thickness of the roll-to-roll coating for 3 different coatings in µm Point 1 Point 2 Point 3 Point 4 Point 5 Point 6 Point 7 Point 8 Point 9 Point 10 PMMA coating roller to roller 1 5,4 5,3 5,6 5,3 5,7 5,5 5,6 5,6 5,1 5,3 PMMA coating roller to roller 2 5,3 5,6 5,6 5,8 5,6 5,6 5,6 5,5 5,8 5,3 PMMA coating roller to roller 3 5,1 5,5 5,6 5,8 5,6 5,7 5,7 5,7 5,6 5,6

第二層 C 雙層的目的為減小反射率。視材料之固體含量及添加劑之量及性質而定,反射特性亦有所不同。使用刮棒塗佈方法將第2層添加至PMMA基板,該PMMA基板塗佈有第1層。根據目標厚度的不同,刮棒塗佈機可具有不同性質,例如#1、#2、#3、#4。當使用#1刮棒塗佈機時,塗層厚度約為1-2 µm;當使用#2刮棒塗佈機時,塗層厚度約為2-3 µm;當使用#3刮棒塗佈機時,塗層厚度約為5 µm;當使用#4刮棒塗佈機時,塗層厚度約為7-8 µm。在塗佈之後可能需要電漿處理。在烘箱中在T=80℃下固化塗層1小時。 The purpose of the second layer ( C ) double layer is to reduce the reflectivity. Depending on the solid content of the material and the amount and nature of the additives, the reflective properties vary. The second layer is added to the PMMA substrate coated with the first layer using a bar coater. Depending on the target thickness, bar coaters can have different properties, such as #1, #2, #3, #4. When using bar coater #1, the coating thickness is about 1-2 µm; when using bar coater #2, the coating thickness is about 2-3 µm; when using bar coater #3, the coating thickness is about 5 µm; when using bar coater #4, the coating thickness is about 7-8 µm. Plasma treatment may be required after coating. Cure the coating in an oven at T = 80 ° C for 1 hour.

在PMMA基板上塗覆了如表2中所列之兩層塗層的以下塗層。 2 PMMA基板上之兩層塗層 實施例 組成物層(B) 組成物層(C) 刮棒塗佈機 電漿處理 1 B-30 C-2 2 2 B-30 C-2 3 3 B-30 C-4 2 4 B-30 C-5 1 5 B-30 C-5 2 6 B-30 C-7 1 7 B-30 C-7 2 8 B-30 C-8 2 9 B-30 C-9 4 10 B-30 C-13 2 11 B-30 C-14 3 12 B-30 C-15 1 13 B-30 C-16 1 14 B-30 C-17 1 15 B-30 C-18 1 16 B-30 C-19 1 17 B-30 C-20 1 18 B-30 C-21 1 The following coatings were applied on the PMMA substrates as listed in Table 2. Table 2 : Two-layer coatings on PMMA substrates Embodiment Composition layer (B) Composition layer (C) Scraper coating machine Plasma treatment 1 B-30 C-2 2 without 2 B-30 C-2 3 without 3 B-30 C-4 2 without 4 B-30 C-5 1 without 5 B-30 C-5 2 without 6 B-30 C-7 1 without 7 B-30 C-7 2 without 8 B-30 C-8 2 without 9 B-30 C-9 4 without 10 B-30 C-13 2 without 11 B-30 C-14 3 without 12 B-30 C-15 1 without 13 B-30 C-16 1 without 14 B-30 C-17 1 without 15 B-30 C-18 1 without 16 B-30 C-19 1 without 17 B-30 C-20 1 without 18 B-30 C-21 1 without

b)  PET CPI 基板上之兩層塗層 第一層( B 基板藉由電漿預處理(6分鐘,300 W)且接著使用刮棒塗佈機(#3)及組成物B-31塗佈第一層。塗層在T=120℃下預固化90秒(PET)或在T=140℃下預固化3分鐘(CPI),然後進行UV固化(30秒,500 W),且最後烘烤在T=120℃下持續10分鐘(PET)或在T=140℃下持續15分鐘(CPI)。 b) Two-layer coating on PET or CPI substrates First layer ( B ) The substrate was pre-treated by plasma (6 min, 300 W) and then coated with the first layer using a bar coater (#3) with composition B-31. The coating was pre-cured at T=120°C for 90 sec (PET) or at T=140°C for 3 min (CPI), then UV cured (30 sec, 500 W) and finally baked at T=120°C for 10 min (PET) or at T=140°C for 15 min (CPI).

第二層 C 在電漿處理(1分鐘,300 W)之後,使用刮棒塗佈機(#2)及組成物C-22塗佈前述層以用於第二層。塗層在T=120℃下固化0.5小時(PET)或在T=140℃下固化0.5小時(CIP)。 Second layer ( C ) After plasma treatment (1 min, 300 W), the previous layer was applied using a bar coater (#2) and composition C-22 for the second layer. The coating was cured at T = 120 °C for 0.5 h (PET) or at T = 140 °C for 0.5 h (CIP).

在PET及CPI基板上塗覆了如表3中所列之兩層塗層的以下塗層。 3 PET或CPI基板上之兩層塗層 實施例 基板 組成物層(B) 組成物層(C) 刮棒塗佈機 35 CPI 50 µm          36 CPI 80 µm          37 PET          38 CPI 50 µm B-31 C-22 2 39 CPI 80 µm B-31 C-22 2 40 PET B-31 C-22 2 The following coatings were applied on PET and CPI substrates with two layers of coating as listed in Table 3. Table 3 : Two layers of coating on PET or CPI substrates Embodiment Substrate Composition layer (B) Composition layer (C) Scraper coating machine 35 CPI 50 µm 36 CPI 80 µm 37 PET 38 CPI 50 µm B-31 C-22 2 39 CPI 80 µm B-31 C-22 2 40 PET B-31 C-22 2

5. 實施例之特性 a)  PMMA 基板上之兩層塗層之光學特性量測實施例1、2、3、4、5、7及8之反射率及透射率。 5. Properties of Examples a) Optical Properties of Two Coatings on PMMA Substrates The reflectivity and transmittance of Examples 1, 2, 3, 4, 5, 7 and 8 were measured.

此等兩層塗層在360 nm至740 nm波長範圍內的之反射率示於圖1中。The reflectivity of these two coatings in the wavelength range of 360 nm to 740 nm is shown in Figure 1.

此等兩層塗層在360 nm至740 nm波長範圍內之透射率示於圖2中。The transmittance of these two coatings in the wavelength range of 360 nm to 740 nm is shown in Figure 2.

表4示出實施例在550 nm波長下的反射率(R%)及透射率(T%)。 4 PMMA上之兩層塗層在550 nm波長下的反射率(R%)及透射率(T%) 實施例 R%(在550 nm下) T%(在550 nm下) 1 3.39 93.97 2 2.09 94.82 3 4.0 93.15 5 0.72 95.66 7 2.23 94.62 8 2.75 94.38 Table 4 shows the reflectivity (R%) and transmittance (T%) of the embodiment at 550 nm. Table 4 : Reflectivity (R%) and transmittance (T%) of two coating layers on PMMA at 550 nm Embodiment R% (at 550 nm) T% (at 550 nm) 1 3.39 93.97 2 2.09 94.82 3 4.0 93.15 5 0.72 95.66 7 2.23 94.62 8 2.75 94.38

表5顯示光學特性視第二層(C)之組成物及第二層(C)之厚度(參見表2)而變化——所使用的刮棒塗佈機中所指示。Table 5 shows the variation of the optical properties depending on the composition of the second layer (C) and the thickness of the second layer (C) (see Table 2) as indicated in the bar coater used.

裸露的PMMA展示92.98%之透射率。Bare PMMA exhibited a transmittance of 92.98%.

因此,所有實施例展示改良之光學特性。實施例5獲得最佳光學特性。自實施例1及2可見第二層(C)之厚度的增加改良了光學特性。Therefore, all examples show improved optical properties. Example 5 obtains the best optical properties. It can be seen from Examples 1 and 2 that the increase in the thickness of the second layer (C) improves the optical properties.

b)  PMMA 基板上之兩層塗層之機械特性實施例5、6、9、10、11、12、13、14、15、16、17及18之機械特性經量測且列於表5中。 5:PMMA上之兩層塗層之機械特性          磨損試驗500個循環,500 g    實施例 膜VQ WCA VQ CA 黏附力 5    84 全部消失    0B 6    82 全部消失    0B 9    83 幾乎消失    0B 10 膜可以 103 3(全部消失)       11 膜可以 81 幾乎消失    0B 12    76 幾乎消失    0B 13 膜可以 93 3 83    14 膜可以 96 (2)-3 81    15 膜可以 97 2-(3) 84    16 膜可以,但邊緣處混濁 103 3 83    17 混濁 108 3 82    18 相當混濁 101 1-2 83    b) Mechanical properties of two coatings on PMMA substrates The mechanical properties of Examples 5, 6, 9, 10, 11, 12, 13, 14, 15, 16, 17 and 18 were measured and listed in Table 5. Table 5 : Mechanical properties of two coatings on PMMA Abrasion test 500 cycles, 500 g Embodiment Film VQ WCA VQ CA Adhesion 5 84 All gone 0B 6 82 All gone 0B 9 83 Almost disappeared 0B 10 The membrane can 103 3 (all disappeared) 11 The membrane can 81 Almost disappeared 0B 12 76 Almost disappeared 0B 13 The membrane can 93 3 83 14 The membrane can 96 (2)-3 81 15 The membrane can 97 2-(3) 84 16 The membrane is OK, but the edges are cloudy 103 3 83 17 Turbid 108 3 82 18 Quite cloudy 101 1-2 83

與實施例5、6、9、10、11及12相比,實施例13、14、15、16、17及18展示尤其在耐磨性方面更佳的機械特性。Compared with Examples 5, 6, 9, 10, 11 and 12, Examples 13, 14, 15, 16, 17 and 18 show better mechanical properties, especially in terms of wear resistance.

c)   CPI PET 基板上之兩層塗層之光學特性量測實施例35、36、37、38、39及40之反射率及透射率。 c) Optical properties of two coating layers on CPI and PET substrates. The reflectivity and transmittance of Examples 35, 36, 37, 38, 39 and 40 were measured.

此等兩層塗層在360 nm至740 nm之波長範圍內的反射率於圖3中示出。The reflectivity of these two coatings in the wavelength range of 360 nm to 740 nm is shown in FIG. 3 .

相比於裸基板(實施例35至37),所有經塗佈基板(實施例38至40)之反射率降低。在550 nm波長(亦即人眼最敏感的波長範圍)下,50 µm CPI的ΔR%下降了約2.13%點(實施例38),80 µm CPI的下降了1.68%點(實施例39)及PET的下降了1.89%點(實施例40)。Compared to the bare substrate (Examples 35 to 37), the reflectivity of all coated substrates (Examples 38 to 40) decreased. At 550 nm wavelength (i.e., the wavelength range where the human eye is most sensitive), the ΔR% of 50 μm CPI decreased by about 2.13% points (Example 38), 80 μm CPI decreased by 1.68% points (Example 39), and PET decreased by 1.89% points (Example 40).

此等兩層塗層在360 nm至740 nm之波長範圍內的透射率於圖4中示出。The transmittance of these two coatings in the wavelength range of 360 nm to 740 nm is shown in FIG. 4 .

相比於裸基板(實施例35至37),所有經塗佈基板(實施例38至40)之透射率增加。在550 nm波長(亦即人眼最敏感的波長範圍)下,50 µm CPI的ΔT%增加了約1.25%點(實施例38),80 µm CPI的增加了1.22%點(實施例39)及PET的增加了1.04%點(實施例40)。Compared to the bare substrate (Examples 35 to 37), the transmittance of all coated substrates (Examples 38 to 40) increased. At 550 nm wavelength (i.e., the wavelength range where the human eye is most sensitive), the ΔT% of 50 μm CPI increased by about 1.25% points (Example 38), 80 μm CPI increased by 1.22% points (Example 39), and PET increased by 1.04% points (Example 40).

d)  CPI PET 基板上之兩層塗層之機械特性實施例38至40之機械特性經量測且列於表6中。 表6:CPI及PET基板上之兩層塗層之機械特性          初始 400c 800c 1200c 1600c 2000c 實施例 PEHA 黏附力 WCA初始 VQ CA VQ CA VQ CA VQ CA VQ CA 38 H 5B 113 0 112 0 112 0 112 0 111 0-1 110 39 3H 5B 115 0 114 0 110 0 111 0 114 0-1 113 40 3H 5B 114 0 114 0 112 0 113 0 114 0-1 111 d) Mechanical properties of two-layer coatings on CPI and PET substrates The mechanical properties of Examples 38 to 40 were measured and listed in Table 6. Table 6: Mechanical properties of two-layer coatings on CPI and PET substrates initial 400c 800c 1200c 1600c 2000c Embodiment PEHA Adhesion WCA Initial VQ CA VQ CA VQ CA VQ CA VQ CA 38 H 5B 113 0 112 0 112 0 112 0 111 0-1 110 39 3H 5B 115 0 114 0 110 0 111 0 114 0-1 113 40 3H 5B 114 0 114 0 112 0 113 0 114 0-1 111

在2000個循環之橡皮擦之後,所有經塗佈之基板均未展示刮痕跡象且維持超過100°的水接觸角。因此,經塗佈樣品展示極佳耐磨性及極佳疏水性。裸基板具有極差的磨損,因為其在數百個循環之橡皮擦之後便充滿刮痕,及初始水接觸角為約75°。After 2000 cycles of eraser, all coated substrates showed no signs of scratches and maintained a water contact angle of more than 100°. Therefore, the coated samples showed excellent wear resistance and excellent hydrophobicity. The bare substrate had very poor wear because it was full of scratches after hundreds of cycles of eraser, and the initial water contact angle was about 75°.

without

[圖1]展示具有不同材料/調配物之2層系統的反射率。 [圖2]展示具有不同材料/調配物之2層系統之透射率。 [圖3]展示2層塗層之反射率。 [圖4]展示2層塗層之透射率。 [Figure 1] shows the reflectivity of a 2-layer system with different materials/formulations. [Figure 2] shows the transmittance of a 2-layer system with different materials/formulations. [Figure 3] shows the reflectivity of a 2-layer coating. [Figure 4] shows the transmittance of a 2-layer coating.

Claims (15)

一種分層結構,其包含(A)基板層;(B)塗佈於該基板層(A)之至少一個表面上的第一塗層,及(C)塗佈於該第一塗層(B)之至少一個表面上的第二塗層,使得該第二塗層(C)與該第一塗層(B)之至少一個表面黏附接觸,其中該第一塗層(B)包含第一矽氧烷聚合物(B-1),且具有1至50μm之厚度;該第二塗層(C)包含氟聚醚化合物,且具有10nm至10μm之厚度;及該基板層(A)為柔性的、可彎曲的或兩者兼具,且具有10至500μm之厚度。 A layered structure comprising (A) a substrate layer; (B) a first coating layer coated on at least one surface of the substrate layer (A); and (C) a second coating layer coated on at least one surface of the first coating layer (B), so that the second coating layer (C) is in adhesive contact with at least one surface of the first coating layer (B), wherein the first coating layer (B) comprises a first siloxane polymer (B-1) and has a thickness of 1 to 50 μm; the second coating layer (C) comprises a fluoropolyether compound and has a thickness of 10 nm to 10 μm; and the substrate layer (A) is flexible, bendable, or both, and has a thickness of 10 to 500 μm. 如請求項1之分層結構,其中該第一矽氧烷聚合物(B-1)包含選自至少兩種不同矽烷單體之單體單元,其中該等矽烷單體中之至少一者包括能夠達成與相鄰矽氧烷聚合物鏈交聯的活性基團,且其中該等相鄰矽氧烷聚合物鏈藉助於該活性基團交聯。 The layered structure of claim 1, wherein the first siloxane polymer (B-1) comprises monomer units selected from at least two different silane monomers, wherein at least one of the silane monomers comprises an active group capable of achieving crosslinking with adjacent siloxane polymer chains, and wherein the adjacent siloxane polymer chains are crosslinked with the aid of the active group. 如請求項1之分層結構,其中該第二塗層(C)進一步包含一或多種第二矽氧烷聚合物(C-1)。 A layered structure as claimed in claim 1, wherein the second coating layer (C) further comprises one or more second siloxane polymers (C-1). 如請求項1之分層結構,其中該第一塗層(B)具有2至20μm之厚度,及/或該第二塗層(C)具有25nm至8μm之厚度。 A layered structure as claimed in claim 1, wherein the first coating layer (B) has a thickness of 2 to 20 μm, and/or the second coating layer (C) has a thickness of 25 nm to 8 μm. 如請求項1之分層結構,其中該基板層(A)之材料係選自玻璃、石英、矽、氮化矽、聚合物、金屬及塑膠及其組合之群。 A layered structure as claimed in claim 1, wherein the material of the substrate layer (A) is selected from the group consisting of glass, quartz, silicon, silicon nitride, polymer, metal and plastic and combinations thereof. 如請求項5之分層結構,其中該等塑膠係選自熱塑性聚合物、聚酯、聚醯胺、聚醯亞胺、丙烯酸聚合物及定製設計聚合物。 A layered structure as claimed in claim 5, wherein the plastics are selected from thermoplastic polymers, polyesters, polyamides, polyimides, acrylic polymers and custom designed polymers. 如請求項1之分層結構,其中該基板層(A)之厚度為20至400μm。 A layered structure as claimed in claim 1, wherein the thickness of the substrate layer (A) is 20 to 400 μm. 如請求項1之分層結構,其進一步包含塗佈在該第二塗層(C)之至少一個表面上的第三塗層(D),以使得該第三塗層(D)與該第二塗層(C)之至少一個表面黏附接觸。 The layered structure of claim 1 further comprises a third coating layer (D) coated on at least one surface of the second coating layer (C), so that the third coating layer (D) is in adhesive contact with at least one surface of the second coating layer (C). 如請求項8之分層結構,其中該第三塗層(D)包含矽氧烷聚合物及視情況選用之氟聚醚化合物。 The layered structure of claim 8, wherein the third coating layer (D) comprises a silicone polymer and a fluoropolyether compound selected as appropriate. 如請求項8之分層結構,其中該第三塗層(D)具有10nm至10μm之厚度。 A layered structure as claimed in claim 8, wherein the third coating layer (D) has a thickness of 10 nm to 10 μm. 一種用於生產如請求項1至10中任一項之分層結構之方法,其包含以下步驟:提供包含至少兩種不同矽烷單體之第一組成物,其中該等矽烷單體中之至少一者包括能夠達成與相鄰矽氧烷聚合物交聯之活性基團;使該第一組成物經受該等單體之至少部分水解,以形成包含第一矽氧烷聚合物(B-1)之組成物;提供包含氟聚醚化合物之第二組成物;提供柔性的或可彎曲的或兩者兼具之基板;將該第一組成物沉積至該基板之至少一個表面上以形成與該基板之該至少一個表面黏附接觸的第一塗層(B);交聯該第一塗層(B)之該等矽氧烷聚合物鏈以便獲得包含與該基板之該至少一個表面黏附接觸之交聯矽氧烷聚合物的第一塗層(B);將該第二組成物沉積至該第一塗層(B)上以形成與該第一塗層(B)黏附接觸之第二塗層(C);固化該第二塗層(C)之該第二組成物。 A method for producing a layered structure as claimed in any one of claims 1 to 10, comprising the following steps: providing a first composition comprising at least two different silane monomers, wherein at least one of the silane monomers comprises an active group capable of achieving crosslinking with an adjacent siloxane polymer; subjecting the first composition to at least partial hydrolysis of the monomers to form a composition comprising a first siloxane polymer (B-1); providing a second composition comprising a fluoropolyether compound; providing a flexible or bendable substrate or both; ; depositing the first component onto at least one surface of the substrate to form a first coating layer (B) in adhesive contact with the at least one surface of the substrate; cross-linking the siloxane polymer chains of the first coating layer (B) to obtain a first coating layer (B) comprising cross-linked siloxane polymers in adhesive contact with the at least one surface of the substrate; depositing the second component onto the first coating layer (B) to form a second coating layer (C) in adhesive contact with the first coating layer (B); curing the second component of the second coating layer (C). 如請求項11之方法,其中包含矽氧烷聚合物(B-1)之該第一組成物藉由包含以下步驟之方法形成: 在第一溶劑中混合該至少兩種不同矽烷單體以形成混合物;使該混合物在催化劑存在下經歷該等單體之至少部分水解,由此使該等水解單體至少部分聚合且交聯;視情況將該第一溶劑更換為第二溶劑;視情況藉由矽氫化、熱或輻射引發使該混合物進一步交聯。 The method of claim 11, wherein the first component comprising a siloxane polymer (B-1) is formed by a method comprising the following steps: Mix the at least two different silane monomers in a first solvent to form a mixture; subject the mixture to at least partial hydrolysis of the monomers in the presence of a catalyst, thereby causing the hydrolyzed monomers to at least partially polymerize and crosslink; optionally replacing the first solvent with a second solvent; optionally further crosslinking the mixture by hydrosilylation, heat or radiation. 如請求項11之方法,其中該第一組成物及/或該第二組成物藉由旋塗、夾塗、噴霧、噴墨、輥對輥、凹版印刷、反向凹版印刷、刮棒塗佈、狹縫塗佈、柔版印刷、簾式塗佈、網板印刷塗佈法、擠壓塗佈、浸塗、淋塗或縫塗進行沉積。 The method of claim 11, wherein the first component and/or the second component is deposited by spin coating, nip coating, spraying, ink jetting, roll-to-roll, gravure printing, reverse gravure printing, doctor bar coating, slot coating, flexographic printing, curtain coating, screen printing coating, extrusion coating, dip coating, shower coating or slot coating. 如請求項11之方法,其進一步包含以下步驟提供包含矽氧烷聚合物及視情況選用之氟聚醚化合物之第三組成物;將該第三組成物沉積至該第二塗層(C)上以形成與該第二塗層(C)黏附接觸之第三塗層(D);交聯該第三塗層(D)之該等矽氧烷聚合物鏈以便獲得包含一或多個與該第二塗層(C)黏附接觸之交聯矽氧烷聚合物之第三塗層(D)。 The method of claim 11 further comprises the steps of providing a third composition comprising a siloxane polymer and, if appropriate, a fluoropolyether compound; depositing the third composition onto the second coating layer (C) to form a third coating layer (D) in adhesive contact with the second coating layer (C); cross-linking the siloxane polymer chains of the third coating layer (D) to obtain a third coating layer (D) comprising one or more cross-linked siloxane polymers in adhesive contact with the second coating layer (C). 一種如請求項1至10中任一項之分層結構之用途,其用於柔性電子應用中,其選自顯示器、光學透鏡、透明板及汽車工業。 A use of a layered structure as claimed in any one of claims 1 to 10 in flexible electronic applications selected from displays, optical lenses, transparent panels and the automotive industry.
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