TWI858935B - Composite heat sink - Google Patents

Abstract

A composite heat dissipation device includes a water-cooled heat dissipation module, a heat sink module, and a fan module. The water-cooled heat dissipation module includes a base unit in contact with a high-heat electronic unit, and a water-cooled heat dissipation unit. The heat sink module includes a heat sink unit located above the water-cooled heat dissipation unit, and a heat pipe unit. The heat sink unit has a plurality of polygonal heat sinks. Each polygonal heat sink has a plurality of cut edges. The water-cooled heat dissipation module is designed to perform water cooling on the high-heat electronic unit, and the heat pipe unit is used to conduct the heat energy of the base unit and the high-heat electronic unit to the polygonal heat sink. The airflow of the fan module is used to blow through the polygonal heat sink, thereby effectively achieving a composite heat dissipation method that combines water cooling and air cooling. Furthermore, by utilizing the design that each polygonal heat sink has the cut edge, the flow resistance of the heat sink unit as a whole is reduced, thereby effectively increasing the efficiency of air cooling and heat dissipation.

Description

Composite heat sink

The present invention relates to a heat sink, and more particularly to a composite heat sink.

As the demand for heat dissipation in electronic devices such as computers and servers continues to increase, water-cooled radiators are now often installed on electronic components that generate high temperatures during operation. Cold water flows into the water-cooled radiator from a cold water pipe and dissipates the heat of the electronic components that generate high temperatures. After flowing through the water-cooled radiator, the cold water is heated up to become hot water and flows out of the water-cooled heat dissipation module to the heat sink to cool down to become cold water. The cold water then flows back to the water-cooled radiator in a continuous circulation manner to perform water-cooled heat dissipation operations. However, the existing water-cooled radiator simply exchanges heat by passing cold water through the radiator, and then the heated water flows out to the heat sink to cool down into cold water. The heat dissipation part completely relies on the heat sink to dissipate heat quickly. If the temperature generated by the high-heat electronic components is very high, the water-cooled radiator may not be able to cool down effectively in time, which may cause internal heat accumulation. This is indeed worthy of careful study and discussion by practitioners for improvement.

Therefore, the purpose of the present invention is to provide a composite heat dissipation device with good heat dissipation efficiency.

Therefore, the composite heat dissipation device of the present invention includes a water-cooled heat dissipation module, a cooling monitoring module connected to the water-cooled heat dissipation module, a heat dissipation frame module, and a fan module.

The water cooling and heat dissipation module includes a base unit in contact with a high-heat electronic unit, and a water cooling and heat dissipation unit arranged on the base unit. The water cooling and heat dissipation unit is used to dissipate heat from the base unit and the high-heat electronic unit. Cold water flows into the water cooling and heat dissipation unit and the water cooling and heat dissipation unit dissipates heat from the base unit and the high-heat electronic unit, and the cold water is heated to hot water after flowing through the water cooling and heat dissipation unit and flows out of the water cooling and heat dissipation unit.

The cooling monitoring module includes a heat sink unit. The hot water generated by the water cooling unit flowing through the water cooling unit will flow into the heat sink unit of the cooling monitoring module to be cooled into cold water and then flow into the water cooling unit.

The heat sink module includes a heat sink unit located above the water cooling unit of the water cooling module, and a heat pipe unit extending upward from the base unit and passing through the heat sink unit. The heat sink unit has a plurality of polygonal heat sinks spaced parallel to each other. The heat pipe unit passes through the polygonal heat sinks. The polygonal heat sinks cooperate to define a plurality of heat dissipation channels parallel to the base unit. Each polygonal heat sink has a plurality of cut edges. The angle between any two adjacent cut edges of each polygonal heat sink is a blunt angle.

The heat pipe unit of the heat sink module conducts the heat energy of the base unit and the high-heat electronic unit to the heat sink unit. The airflow generated by the fan module blows through the polygonal heat sink of the heat sink unit and enables the heat sink unit to dissipate heat.

The effect of the present invention is that the water-cooling heat dissipation unit of the water-cooling heat dissipation module is used to dissipate heat between the base unit and the high-heat electronic unit, and the heat energy generated by the high-heat electronic unit can be heat-exchanged by water-cooling heat dissipation, and the heat pipe unit of the heat dissipation frame module can be used to synchronously conduct the heat energy of the base unit and the high-heat electronic unit to the heat dissipation frame unit, so that the heat energy generated by the high-heat electronic unit can be directly transferred to the polygonal heat sink of the heat dissipation frame unit through the heat pipe unit in a rapid heat conduction manner, and the airflow generated by the fan module is used to blow through the polygonal heat sink, so that the heat dissipation action can be synchronously performed by air-cooling heat dissipation, effectively achieving the composite heat dissipation method of the composite heat dissipation device with both water-cooling heat dissipation and air-cooling heat dissipation, thereby greatly increasing the heat dissipation efficiency. Furthermore, by utilizing the ingenious idea that each polygonal heat sink has the cut edge design and the angle between any two adjacent cut edges is blunt, the overall flow resistance of the heat sink unit is reduced, effectively increasing the efficiency of air cooling and heat dissipation.

Before the present invention is described in detail, it should be noted that similar components are represented by the same reference numerals in the following description.

Referring to FIG. 1, FIG. 2, FIG. 3, FIG. 4 and FIG. 5, the composite heat dissipation device of the present invention comprises a water-cooling heat dissipation module 1, a heat dissipation frame module 2, and a fan module 4. The water-cooling heat dissipation module 1 comprises a base unit 11 in contact with a high-heat electronic unit (not shown), and a water-cooling heat dissipation unit 12 disposed on the base unit 11. The water-cooling heat dissipation unit 12 is used to dissipate heat from the base unit 11 and the high-heat electronic unit.

Cold water flows into the water cooling and heat dissipation unit 12 and the water cooling and heat dissipation unit 12 dissipates heat from the base unit 11 and the high-temperature electronic unit. After the cold water flows through the water cooling and heat dissipation unit 12 , it is heated up to become hot water and flows out of the water cooling and heat dissipation unit 12 .

The heat sink module 2 includes a heat sink unit 21 located above the water cooling unit 12 of the water cooling module 1, and a heat pipe unit 22 extending upward from the base unit 11 and penetrating the heat sink unit 21. The heat sink unit 21 has a plurality of polygonal heat sinks 211 spaced parallel to each other up and down. The heat pipe unit 22 penetrates the polygonal heat sink 211. The polygonal heat sink 211 cooperates to define a plurality of heat dissipation channels 214 parallel to the base unit 11. Each polygonal heat sink 211 has a plurality of cut edges 212. The angle between any two adjacent cut edges 212 of each polygonal heat sink 211 is a blunt angle. In this embodiment, each polygonal heat sink 211 is an octagonal planar heat sink, but the present invention is not limited thereto. In this embodiment, the number of sides of each polygon is at least five, so each polygonal heat sink 211 can also be a pentagon, a hexagon, or the like.

The heat pipe unit 22 of the heat sink module 2 conducts the heat energy of the base unit 11 and the high-heat electronic unit to the heat sink unit 21. The airflow generated by the fan module 4 blows through the polygonal heat sink 211 of the heat sink unit 21 and causes the heat sink unit 21 to dissipate heat.

When in use, the base unit 11 of the water-cooled heat dissipation module 1 contacts the high-temperature electronic unit, so the heat energy generated by the high-temperature electronic unit is thermally transferred to the base unit 11, and the water-cooled heat dissipation unit 12 is used for water-cooled heat dissipation. At the same time, the heat pipe unit 22 of the heat dissipation frame module 2 also conducts the heat energy of the base unit 11 and the high-temperature electronic unit to the polygonal heat sink 211 of the heat dissipation frame unit 21, so as to achieve the high-temperature electronic unit thermal conductivity by heat conduction. The high-temperature heat energy generated by the operation of the unit is quickly transferred to the polygonal heat sink 211, and the airflow generated by the fan module 4 blows through the polygonal heat sink 211 of the heat sink unit 21, and the heat dissipation channel 214 and the heat pipe unit 22 to exchange heat, so that the flowing airflow takes away the heat energy, and the heat sink module 2 is effectively cooled as a whole, effectively achieving a composite heat dissipation method that combines water cooling and air cooling to simultaneously dissipate heat for the high-heat electronic unit, thereby greatly increasing the heat dissipation efficiency. In particular, the polygonal heat sink 211 cooperates with each other to define the heat dissipation channel 214 as a plane channel as shown in FIG. 2 , and each polygonal heat sink 211 has the design of the cut edge 212 as shown in FIG. 3 , and the angle between any two adjacent cut edges 212 is blunt, thereby forming an octagonal heat dissipation plane feature, which can reduce the overall flow resistance of the heat sink unit 21, thereby greatly increasing the gas flow through the heat sink unit 21, and effectively increasing the efficiency of air cooling.

Here, it is particularly noted that, in this embodiment, the base unit 11 of the water-cooled heat dissipation module 1 includes a substrate 111 in contact with the high-temperature electronic unit. The heat pipe unit 22 of the heat dissipation frame module 2 has a plurality of heat pipes 221 extending upward from the substrate 111 of the base unit 11 and penetrating the polygonal heat sink 211 of the heat dissipation frame unit 21. The heat pipes 221 of the heat pipe unit 22 conduct heat energy from the substrate 111 and the high-temperature electronic unit to the polygonal heat sink 211. In short, the design of multiple heat pipes 221 can quickly transfer the heat energy of the substrate 111 and the high-temperature electronic unit to the polygonal heat sink 211 of the heat sink unit 21, so as to quickly transfer the high-temperature heat energy generated by the operation of the high-temperature electronic unit to the polygonal heat sink 211 for heat dissipation. In this embodiment, the number of the heat pipes 221 is three, but it is not limited to this. The embodiment using only one heat pipe 221, two heat pipes 221, or more than four heat pipes 221 can be designed according to actual use requirements. Furthermore, the heat dissipation channel 214 is a plane channel as shown in FIG. 2 and each polygonal heat sink 211 has the design of the cut edge 212 as shown in FIG. 3, and the polygonal heat sink 211 and the heat pipe 221 are combined as shown in FIG. 3, so that the gas passing through the cross section of the polygonal heat sink 211 can be dissipated in all directions without passing through each complete polygonal heat sink 211, effectively improving the air cooling heat dissipation efficiency. In this embodiment, the high-heat electronic unit is an electronic chip (CPU) that generates high heat temperature, but it is not limited to this.

In addition, it should be noted that, in this embodiment, the substrate 111 of the base unit 11 has a first side 112 that contacts the high-temperature electronic unit. The base unit 11 also includes a plurality of mounting grooves (not shown) recessed on the first side 112 of the substrate 111. Each mounting groove can be used for each heat pipe 221 of the heat pipe unit 22 to be embedded and combined. Each heat pipe 221 has a horizontal tube body 222 that is laterally embedded in each mounting groove and contacts the high-temperature electronic unit, and two vertical tube bodies 223 that extend upward from two opposite ends of the horizontal tube body 222 and penetrate the polygonal heat sink 211 of the heat sink unit 21. In short, the horizontal tube body 222 of the heat pipe 221 is embedded in the first side 112 of the substrate 111 and contacts the high-temperature electronic unit as shown in FIG. 4, but the present invention is not limited thereto. In this embodiment, the horizontal tube body 222 of each heat pipe 221 of the heat pipe unit 22 of the heat sink module 2 cooperates with the vertical tube body 223 to present a U-shape, and each heat pipe 221 is in the form of a metal hollow heat conducting pipe. Metal has advantages such as fast heat transfer speed, but the present invention is not limited thereto.

It is particularly mentioned that in this embodiment, the upright tube body 223 of each heat pipe 221 of the heat pipe unit 22 penetrates the polygonal heat sink 211 of the heat sink unit 21 and the upright tube body 223 of each heat pipe 221 corresponds to one of the cut edges 212 close to the polygonal heat sink 211, and each upright tube body 223 is located in the middle position close to the corresponding cut edge 212 (see the distribution method of Figure 3), but it is not limited to this. Particularly, in the present embodiment, the upright tube bodies 223 of the heat pipes 221 are arranged to surround a polygonal region (not numbered in the figure) close to the cut edge 212 of the polygonal heat sink 211, and the cut edges 212 of the polygonal heat sink 211 corresponding to the upright tube bodies 223 of each heat pipe 221 face each other, that is, the cut edges 212 corresponding to the upright tube bodies 223 of each heat pipe 221 are arranged in a manner of being opposite to each other as shown in FIG. 3 , but the present invention is not limited thereto. In short, the vertical tube 223 of each heat pipe 221 is arranged through the polygonal heat sink 211 as shown in FIG. 2 and is located at a position of the cut edges 212 that are opposite to each other (see FIG. 3 ). That is, the vertical tube 223 of the heat pipe 221 is close to the outer periphery of the polygonal heat sink 211 as shown in FIG. 3 and each vertical tube 223 is located near the middle position of the corresponding cut edge 212. When the vertical tube 223 of the heat pipe 221 is heat-transferred to the polygonal heat sink 211, a good heat dissipation distribution can be formed, and the heat dissipation efficiency of the uniform distribution is optimized, and the effective area of the plane feature of the polygonal heat sink 211 when dissipating heat is increased, thereby achieving an optimized air-cooling heat dissipation effect. In this embodiment, each polygonal heat sink 211 of the heat sink unit 21 further has a plurality of coupling holes 213 for the vertical tube bodies 223 of the heat pipes 221 to pass through, but the present invention is not limited thereto.

The water cooling unit 12 of the water cooling module 1 is used to heat the base unit 11 and the high-heat electronic unit, so that the heat energy generated by the high-heat electronic unit can be heat exchanged by water cooling, and the heat pipe unit 22 of the heat sink module 2 can be used to transfer the heat energy of the base unit 11 and the high-heat electronic unit to the heat sink unit 21, so that the heat energy generated by the high-heat electronic unit can be heat exchanged by water cooling. The heat energy is directly transferred to the polygonal heat sink 211 of the heat sink unit 21 through the heat pipe unit 22 in a fast heat conduction manner, and the airflow generated by the fan module 4 blows through the polygonal heat sink 211, and the heat dissipation action can be performed simultaneously through air cooling, effectively achieving a composite heat dissipation method of the composite heat sink device with both water cooling and air cooling, thereby greatly increasing the heat dissipation efficiency. Furthermore, by utilizing the ingenious design that each polygonal heat sink 211 has the cut edge 212 and the angle between any two adjacent cut edges 212 is blunt, the overall flow resistance of the heat sink unit 21 is reduced, effectively increasing the efficiency of air cooling.

Furthermore, in this embodiment, a cooling monitoring module 3 connected to the water cooling heat dissipation module 1 is also included, and the cooling monitoring module 3 includes a heat sink unit 31. The hot water generated by the water cooling heat dissipation unit 12 flowing through the water cooling heat dissipation module 1 will flow into the heat sink unit 31 of the cooling monitoring module 3 to be cooled into cold water and then flow into the water cooling heat dissipation unit 12. In this embodiment, the cooling monitoring module 3 further includes a cold water pipe 32 connecting the heat sink unit 31 and the water-cooled heat sink unit 12, and a hot water pipe 33 connecting the heat sink unit 31 and the water-cooled heat sink unit 12. The hot water generated by flowing through the water-cooled heat sink unit 12 will flow from the hot water pipe 33 of the cooling monitoring module 3 into the heat sink unit 31 to be cooled into cold water, and the cold water will flow from the cold water pipe 32 of the cooling monitoring module 3 into the water-cooled heat sink unit 12. That is to say, since the substrate 111 of the water-cooling heat dissipation module 1 contacts the high-temperature electronic unit, the cold water pipe 32 of the cooling and monitoring module 3 flows into the water-cooling heat dissipation unit 12 of the water-cooling heat dissipation module 1 for water-cooling heat dissipation and absorbs the heat energy of the substrate 111 and the high-temperature electronic unit, so that the cold water is heated up to become hot water after flowing through the water-cooling heat dissipation unit 12, and flows out from the water-cooling heat dissipation unit 12 to the hot water pipe 33 of the cooling and monitoring module 3 and flows into the heat dissipation unit 31 to be cooled to become cold water, and then the cold water flows back to the water-cooling heat dissipation unit 12 from the cold water pipe 32 of the cooling and monitoring module 3.

In addition, in this embodiment, the water cooling unit 12 of the water cooling module 1 has a water cooling radiator 121 disposed on a side of the substrate 111 away from the high-temperature electronic unit and extending upward from the substrate 111, a water inlet pipe 122 connecting the water cooling radiator 121 and the cold water pipe 32 of the cooling monitoring module 3, and a water outlet pipe 122 connecting the water cooling radiator 121 and the hot water pipe 33 of the cooling monitoring module 3. The hot water generated by the water outlet pipe 123 flowing from the water inlet pipe 122 of the water cooling heat dissipation unit 12 into the water cooling heat dissipator 121 will flow out from the water outlet pipe 123 to the hot water pipe 33 of the cooling monitoring module 3, and flow into the heat dissipation unit 31 of the cooling monitoring module 3 to be cooled into cold water, so that the cold water flows back from the cold water pipe 32 of the cooling monitoring module 3 to the water inlet pipe 122 of the water cooling heat dissipation unit 12, but not limited thereto. The polygonal heat sink 211 of the heat dissipation frame unit 21 of the heat dissipation frame module 2 is located above the water cooling heat dissipator 121, but not limited thereto.

In summary, the composite heat dissipation device of the present invention is designed to dissipate heat between the base unit 11 and the high-heat electronic unit by means of the water-cooling heat dissipation unit 12 of the water-cooling heat dissipation module 1, so that the heat energy generated by the high-heat electronic unit can be heat exchanged by means of water-cooling heat dissipation, and the heat pipe unit 22 of the heat dissipation frame module 2 can simultaneously conduct the heat energy of the base unit 11 and the high-heat electronic unit to the heat dissipation frame unit 21, so that the heat ... The heat energy generated by the high-heat electronic unit is directly transferred to the polygonal heat sink 211 of the heat sink unit 21 through the heat pipe unit 22 in a fast heat conduction manner, and the airflow generated by the fan module 4 blows through the polygonal heat sink 211, and the heat dissipation action can be performed simultaneously through the air cooling method, effectively achieving a composite heat dissipation method of the composite heat dissipation device with both water cooling and air cooling, thereby greatly increasing the heat dissipation efficiency. This dual-phase heat dissipation method not only has better heat dissipation efficiency, but also has a mutual backup effect, so that the system has a higher fault tolerance and improves the reliability of the system. Furthermore, by utilizing the ingenious design that each polygonal heat sink 211 has the cut edges 212 and the angle between any two adjacent cut edges 212 is blunt, the overall flow resistance of the heat sink unit 21 is reduced, effectively increasing the efficiency of air cooling.

However, the above is only an example of the implementation of the present invention, and it should not be used to limit the scope of the implementation of the present invention. All simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification are still within the scope of the patent of the present invention.

1: Water cooling module

213: Binding hole

11: Base unit

214: Heat dissipation channel

111: Substrate

22: Heat pipe unit

112: First side

221: Heat pipe

12: Water cooling unit

222: Horizontal tube

121: Water Cooling Radiator

223: Vertical tube

122: Water inlet pipe

3: Cooling monitoring module

123: Water outlet pipe

31: Heat sink unit

2: Heat sink module

32: Cold water pipe

21: Heat sink unit

33: Hot water pipe

211: Polygonal heat sink

4: Fan module

212: Cutting edge

Other features and effects of the present invention will be clearly presented in the implementation method of the reference drawings, in which: Figure 1 is a three-dimensional diagram illustrating an embodiment of the composite heat dissipation device of the present invention; Figure 2 is a side view schematic diagram illustrating the connection relationship between a water-cooled heat dissipation module and a heat sink module in the embodiment; Figure 3 is a top view schematic diagram illustrating the connection relationship between a polygonal heat sink of a heat sink unit of the heat sink module and a heat pipe unit of the heat sink module in the embodiment; and Figure 4 is a bottom view schematic diagram illustrating that in the embodiment, multiple heat pipes of the heat pipe unit of the heat sink module are combined on a substrate of a base unit of the water-cooled heat dissipation module; and FIG5 is a side cross-sectional view illustrating the connection relationship between a horizontal tube body and two vertical tube bodies of one of the heat pipes of the heat pipe unit in the embodiment.

1: Water cooling module

11: Base unit

111: Substrate

12: Water cooling unit

121: Water cooling radiator

122: Water inlet pipe

123: Water outlet pipe

2: Heat sink module

21: Heat sink unit

211: Polygonal heat sink

212: Cutting edge

214: Heat dissipation channel

22: Heat pipe unit

221: Heat pipe

223: Vertical tube

3: Cooling monitoring module

31: Heat sink unit

32: Cold water pipe

33: Hot water pipe

4: Fan module

Claims (7)

A composite heat dissipation device comprises: a water-cooling heat dissipation module, including a base unit in contact with a high-heat electronic unit, and a water-cooling heat dissipation unit arranged on the base unit, the water-cooling heat dissipation unit is used to dissipate heat from the base unit and the high-heat electronic unit, wherein cold water flows into the water-cooling heat dissipation unit and the water-cooling heat dissipation unit dissipates heat from the base unit and the high-heat electronic unit, and the cold water is heated to become hot water after flowing through the water-cooling heat dissipation unit and flows out of the water-cooling heat dissipation unit, the base unit includes a substrate in contact with the high-heat electronic unit; a cooling monitoring module connected to the water-cooling heat dissipation module, including a heat dissipation unit, flowing through the water The hot water generated by the water-cooled heat dissipation unit of the cold heat dissipation module will flow into the heat dissipation row unit of the cooling monitoring module to be cooled into cold water and then flow into the water-cooled heat dissipation unit; a heat dissipation frame module, including a heat dissipation frame unit located above the water-cooled heat dissipation unit of the water-cooled heat dissipation module, and a heat pipe unit extending upward from the base unit and passing through the heat dissipation frame unit, the heat dissipation frame unit has a plurality of polygonal heat sinks spaced parallel to each other up and down, the heat pipe unit passes through the polygonal heat sinks, the polygonal heat sinks cooperate to define a plurality of heat dissipation channels parallel to the base unit, each polygonal heat sink has a plurality of cut edges, and any two adjacent polygonal heat sinks The cutting edge of the heat pipe unit has a blunt angle, the heat pipe unit has a plurality of heat pipes extending upward from the substrate of the base unit and penetrating the polygonal heat sink of the heat sink unit, the heat pipes of the heat pipe unit conduct heat energy of the substrate and the high-heat electronic unit to the polygonal heat sink, wherein the substrate of the base unit has a first side in contact with the high-heat electronic unit, the base unit further includes a plurality of mounting grooves recessed on the first side of the substrate, each mounting groove can be embedded and combined with each heat pipe of the heat pipe unit, each heat pipe has a horizontal tube body transversely embedded in each mounting groove and in contact with the high-heat electronic unit, and two The two opposite ends of the heat pipe unit extend upward and penetrate the vertical tube body of the polygonal heat sink of the heat sink unit, wherein the vertical tube body of each heat pipe of the heat pipe unit penetrates the polygonal heat sink of the heat sink unit and the vertical tube body of each heat pipe corresponds to one of the cut edges close to the polygonal heat sink, and each vertical tube body is located in the middle position close to the corresponding cut edge; and a fan module, the heat pipe unit of the heat sink module conducts the heat energy of the base unit and the high-heat electronic unit to the heat sink unit, and the airflow generated by the fan module blows through the polygonal heat sink of the heat sink unit and causes the heat sink unit to dissipate heat. The composite heat dissipation device as described in claim 1, wherein the cooling monitoring module further includes a cold water pipe connecting the heat sink unit and the water-cooled heat sink unit, and a hot water pipe connecting the heat sink unit and the water-cooled heat sink unit, and the hot water generated by flowing through the water-cooled heat sink unit will flow from the hot water pipe of the cooling monitoring module into the heat sink unit to be cooled into cold water, and the cold water will flow from the cold water pipe of the cooling monitoring module into the water-cooled heat sink unit. The composite heat dissipation device as described in claim 1, wherein the water cooling unit of the water cooling module comprises a water cooling radiator disposed on a side of the substrate away from the high-heat electronic unit and extending upward from the substrate, a water inlet pipe connecting the water cooling radiator and the cold water pipe of the cooling monitoring module, and a water outlet pipe connecting the water cooling radiator and the hot water pipe of the cooling monitoring module, The hot water generated by the water inlet pipe of the heat dissipation unit flowing into the water-cooled radiator will flow out from the water outlet pipe to the hot water pipe of the cooling monitoring module, and flow into the heat dissipation unit of the cooling monitoring module to be cooled into cold water, so that the cold water flows back from the cold water pipe of the cooling monitoring module to the water inlet pipe of the water-cooled heat dissipation unit. The polygonal heat sink of the heat dissipation rack unit of the heat dissipation rack module is located above the water-cooled radiator. The composite heat dissipation device as described in claim 1, wherein the upright tubes of the heat pipes are arranged to surround a polygonal area close to the cut edge of the polygonal heat sink, and the cut edges corresponding to the upright tubes of each heat pipe face each other. As described in claim 1, the composite heat sink of each polygonal heat sink of the heat sink unit also has a plurality of coupling holes for the vertical tube body of the heat pipe to pass through. As described in claim 1, the composite heat dissipation device, wherein the horizontal tube body of each heat pipe of the heat pipe unit of the heat dissipation frame module cooperates with the vertical tube body to present a U shape, and each heat pipe is a metal hollow heat conducting tube. The composite heat sink as described in claim 1, wherein the polygonal heat sink of the heat sink unit of the heat sink module is an octagonal heat sink.

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