CN222826405U - A dislocated special-shaped radiator - Google Patents

Abstract

The utility model provides a dislocation special-shaped radiator which comprises a base plate, a plurality of heat conducting plates and a fin group. The substrate is provided with a bonding surface and a radiating surface, and a plurality of through grooves are formed in the substrate, are arrayed along the y-axis direction and are staggered in the x-axis direction. The number of the heat conducting plates is the same as that of the through grooves, and the plurality of heat conducting plates are respectively accommodated in the plurality of through grooves. The fin group is arranged on the radiating surface of the substrate, the fin group forms a plurality of air flow channels, and the extending direction of the air flow channels is the y-axis direction. The dislocation dysmorphism radiator can evenly dispel the heat to a plurality of electronic chip products, avoids appearing the uneven phenomenon of heat dissipation, improves radiating efficiency simultaneously to realize quick heat dissipation.

Description

Dislocation dysmorphism radiator

Technical Field

The utility model relates to the technical field of radiators, in particular to a staggered special-shaped radiator.

Background

Along with the development of technology, the functions of the electronic chip product are more and more powerful, and similarly, the power consumption of the electronic chip product is correspondingly large. Therefore, during the operation of the electronic chip product, the heat generated by the electronic chip product is usually dissipated by using a heat sink, so that the working temperature is kept within a normal range.

The conventional heat sink includes a heat conductive plate and a plurality of fins disposed on the heat conductive plate, and the heat conductive plate is attached to the electronic chip product. In the operation process, the heat of the electronic chip product is firstly transferred to the heat conducting plate and then transferred to the fins by the heat conducting plate, and the air flow passes through the gaps between the fins, so that the heat on the fins is taken away, and the heat exchange is realized.

However, the conventional radiator has a disadvantage in that air is generally blown from one side of the fin to the other side when air-cooled, i.e., the direction of the air is fixed. When the radiator is required to radiate heat for two or more electronic chip products, the electronic chip products are arranged side by side, so that part of the electronic chip products are positioned at the upper air opening, and part of the electronic chip products are positioned at the lower air opening. Therefore, the radiator has poor radiating effect on the electronic chip products at the air outlet, and the working temperature of the radiator is easily overhigh, so that the normal operation is influenced.

Therefore, how to design a dislocation dysmorphism radiator makes it can evenly dispel the heat to a plurality of electronic chip products, avoids appearing the uneven phenomenon of heat dissipation, improves radiating efficiency simultaneously, realizes quick heat dissipation.

Disclosure of utility model

Aiming at the defects of the prior art, the utility model provides the dislocation special-shaped radiator, which can uniformly radiate a plurality of electronic chip products, avoid the phenomenon of uneven radiation, improve the radiation efficiency and realize rapid radiation.

The aim of the utility model is realized by the following technical scheme:

A dislocated profiled radiator, comprising:

the substrate is provided with a bonding surface and a radiating surface, a plurality of through grooves are formed in the substrate, and the through grooves are arranged along the y-axis direction and are mutually staggered in the x-axis direction;

the heat conducting plates are the same in number as the through grooves, and are respectively accommodated in the through grooves;

The fin group is arranged on the radiating surface of the substrate, the fin group forms a plurality of air flow channels, and the extending direction of the air flow channels is the y-axis direction.

In one embodiment, each of the heat transfer plates spans multiple airflow channels, and the airflow channels spanned by different heat transfer plates are also different.

In one embodiment, the number of the through grooves and the number of the heat conducting plates are two, and the two through grooves are staggered with each other in the x-axis direction, that is, the two heat conducting plates are not side by side in the y-axis direction.

In one embodiment, a copper pipe net group is arranged between the substrate and the fin group, a containing groove is formed in the radiating surface of the substrate, the copper pipe net group is contained in the containing groove, the copper pipe net group is in contact fit with the heat conducting plate, and the copper pipe net group is in contact fit with the fin group.

In one embodiment, the copper piping network comprises a plurality of copper pipes, and the copper pipes are welded with each other.

In one embodiment, the copper tubes and the fin groups are welded by solder, and each copper tube is simultaneously attached to a plurality of heat conducting plates.

In one embodiment, the copper tube is of a hollow structure, the internal air pressure of the copper tube is negative pressure, cooling liquid is filled in the copper tube, and a capillary tube is arranged on the inner wall of the copper tube.

In one embodiment, the fin group comprises a plurality of fins, the plurality of fins are arranged side by side, and the air flow channel is formed between two adjacent fins.

In one embodiment, each fin comprises a top plate, a bottom plate and a side plate connecting the top plate and the bottom plate, wherein the cross section of each fin is concave, when the top plate and the bottom plate of the latter fin are abutted against the side plate of the former fin, and the air flow channel is formed between the two fins.

In one embodiment, the heat-conducting plate is provided with heat-conducting silica gel on the side facing the bonding surface.

In conclusion, the dislocated special-shaped radiator can uniformly radiate a plurality of electronic chip products, avoid the phenomenon of uneven radiation, improve the radiation efficiency and realize rapid radiation.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present utility model, the drawings that are required to be used in the embodiments will be briefly described.

FIG. 1 is a schematic diagram of a staggered profiled heat sink of the present utility model;

FIG. 2 is an exploded view of the offset profiled heat sink shown in FIG. 1;

FIG. 3 is a schematic plan view of the substrate shown in FIG. 2;

FIG. 4 is a schematic view of the staggered profiled heat sink shown in FIG. 1;

FIG. 5 is a schematic diagram showing the copper piping network set and the substrate in a mated state;

Fig. 6 is a partial schematic view of the fin set shown in fig. 2.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Other advantages and effects of the present utility model will be readily apparent to those skilled in the art from the present disclosure. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the utility model to the extent that it can be practiced, since modifications, changes in the proportions, or adjustments of the sizes, which are otherwise, used in the practice of the utility model, are included in the spirit and scope of the utility model which is otherwise, without departing from the spirit or scope thereof. Meanwhile, the terms such as "upper", "lower", "left", "right" and "middle" are also used in the present specification for convenience of description, and are not intended to limit the scope of the present utility model, which is to be construed as being limited to the relative changes or modifications thereof. Without substantial modification to the technical context, it is considered to be within the scope of the utility model as it may be practiced.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The utility model provides a dislocation special-shaped radiator 10, which aims to solve the problem that the existing radiator is uneven in heat dissipation of a plurality of electronic chip products. As shown in fig. 1 and 2, the offset special-shaped heat sink 10 includes a substrate 100, a plurality of heat conductive plates 200, and a fin group 300.

The substrate 100 has a bonding surface 101 and a heat dissipating surface 102 (as shown in fig. 2 and 4), and as shown in fig. 3, a plurality of through grooves 110 are formed in the substrate 100 (the through grooves 110 penetrate the bonding surface 101 and the heat dissipating surface 102 of the substrate 100), and at the same time, the plurality of through grooves 100 are arranged along the y-axis direction and are offset from each other along the x-axis direction. The number of the heat conductive plates 200 is the same as that of the through grooves 110, and the plurality of heat conductive plates 200 are respectively accommodated in the plurality of through grooves 110.

The fin set 300 is disposed on the heat dissipation surface 102 of the substrate 100, the fin set 300 forms a plurality of air flow channels 301, and an extending direction of the air flow channels 301 is a y-axis direction. That is, in the air cooling, the air flow is blown in from one side of the air flow path 301 and blown out from the other side, and the flow direction thereof is the y-axis direction.

The main design idea of the staggered special-shaped radiator 10 is to stagger the heat conducting plates 200 in the x-axis direction, so that the heat conducting plates 200 are prevented from being continuously crossed in the same straight line in the y-axis direction as far as possible, namely, the heat conducting plates 200 are prevented from being arranged side by side in the y-axis direction. Thus, when the air flow flows in the y-axis direction, the positional relationship between the upper and lower air ports does not occur between the plurality of heat conductive plates 200, thereby achieving uniform heat dissipation.

Preferably, each heat-conducting plate 200 spans multiple airflow channels 301, and the airflow channels 301 spanned by different heat-conducting plates 200 are also different. In this way, one heat-conducting plate 200 will dissipate heat corresponding to a plurality of air flow channels 301, and different heat-conducting plates 200 corresponding to different air flow channels 301 also means that the heat-conducting plates 200 will not be blocked from each other in the y-axis direction.

In this embodiment, as shown in fig. 3 and 4, the number of through grooves 110 and the number of heat conductive plates 200 are two, and the two through grooves 110 are offset from each other in the x-axis direction, that is, the two heat conductive plates 200 are not aligned in the y-axis direction.

When the heat dissipation works, the joint surface 101 of the staggered special-shaped heat radiator 10 is attached to the electronic chip products, the two heat-conducting plates 200 are respectively attached to the two electronic chip products, heat generated by the electronic chip products is transferred to the heat-conducting plates 200, the heat-conducting plates 200 transfer the heat to the fin group 300, and then when air flows through the air flow channel 301, the heat of the fin group 300 is taken away, so that heat exchange is realized. Since the two heat conductive plates 200 are not arranged side by side in the y-axis direction, the air flow temperature equivalent to cooling the two heat conductive plates 200 is uniform, thereby achieving the same heat dissipation effect and achieving uniform heat dissipation.

As shown in fig. 2, a copper pipe net set 400 is disposed between the substrate 100 and the fin set 300, the heat dissipation surface 102 of the substrate 100 is provided with a receiving groove 120 (as shown in fig. 3), and the copper pipe net set 400 is received in the receiving groove 120. And, copper tube net set 400 is in contact with both heat conductive plate 200 and fin set 300.

The copper mesh 400 is used as a heat transfer medium, and the heat of the heat conducting plate 200 is preferentially transferred to the copper mesh 400 and then transferred to the fin group 300 by the copper mesh 400, so that the design is because the heat exchanging rate of the heat conducting plate 200 is improved and the heat radiating area of the heat conducting plate 200 is enlarged by means of the characteristic that the copper mesh 400 can be soaked, so that the heat of the heat conducting plate 200 can be uniformly and efficiently transferred to the fin group 300. If the copper pipe net group 400 is not arranged, the heat conducting plate 200 is directly contacted with the fin group 300, the heat conducting plate 200 can intensively heat the part of the fin group 300 in the heat conducting process, the heat conducting effect is poor, after the copper pipe net group 400 is arranged, the heat conducting plate 200 transfers heat to the copper pipe net group 400 in the heat conducting process, the whole temperature of the copper pipe net group 400 is uniformly increased, and then the heat is transferred to the fin group 300 by utilizing the larger area of the copper pipe net group 400, so that the heat is more dispersed, and the fin group 300 has the defect of local heat dissipation.

Preferably, as shown in fig. 2 and 5, the copper tubing string 400 includes a plurality of copper tubing 410, and the plurality of copper tubing 410 are welded to each other. Further, the copper tubes 410 and the fin groups 300 are soldered by solder, and each copper tube 410 is simultaneously attached to a plurality of heat conductive plates 200.

Preferably, the copper tube 410 is of a hollow structure, the internal air pressure of the copper tube 410 is negative pressure and is filled with cooling liquid, and a capillary tube (not shown) is further provided on the inner wall of the copper tube 410. During the heat conduction process, the temperature of the area where the copper pipe 410 contacts with the heat conduction plate 200 rises fast, the cooling liquid in the copper pipe evaporates to form vapor and diffuses to other areas which are not in contact with the heat conduction plate 200, and after the other areas are cooled, the vapor is condensed again to be liquid and flows back to the area in contact with the heat conduction plate 200 by capillary absorption, so that the internal circulation of the cooling liquid is realized. The circulation process can quickly and efficiently absorb the heat of the heat conducting plate 200 to the copper pipe network group 400 and uniformly transfer the heat to the whole copper pipe network group 400, and the effective heat dissipation area is obviously enlarged. Of course, the specific structure of the copper tube 410 can also refer to other prior art.

In this embodiment, as shown in fig. 6, the fin set 300 includes a plurality of fins 310, the plurality of fins 310 are arranged side by side, and an airflow channel 301 is formed between two adjacent fins 310.

Preferably, as shown in fig. 6, each fin 310 includes a top plate 311, a bottom plate 312, and a side plate 313 connecting the top plate 311 and the bottom plate 312, and the fin 310 has a concave cross section. When side by side, the top plate 311 and the bottom plate 312 of the next fin 310 abut against the side plate 313 of the previous fin 310, and an air flow channel 301 is formed between the two fins 310. When conducting heat, the copper pipe net group 400 transfers heat to the bottom plate 312, and then the bottom plate 312 transfers heat to the side plate 313 and the top plate 311 in turn, the side plate 313 has a larger area, and when the air flow passes through the air flow channel 301, the larger area side plate 313 can exchange heat more efficiently, thereby improving the heat dissipation performance.

Compared with the existing heat radiation fins, the fin 310 of the present utility model has the following advantages:

Firstly, the cross section of the existing radiating fin is generally in an I-shaped or inverted T-shaped structure, so that the existing radiating fin is generally required to be welded and formed, the welding processing method is time-consuming and labor-consuming and high in cost, and the heat transfer effect at the joint is poor. The cross section of the fin 310 is in a concave shape, the fin 310 can be directly obtained through a bending and stamping process, the production cost is low, the production efficiency is higher, and the heat transfer effect of the integrally formed structure at the joint is better;

Secondly, as the fins 310 do not transfer heat, the fins 310 of the fin group 300 can be spliced by glue without adopting a welding connection mode like the prior art, so that the fins can be spliced more quickly and the production cost is lower.

In one embodiment, as shown in fig. 4, the heat conducting plate 200 is provided with a heat conducting silica gel 210 on a side facing the bonding surface 101, and the heat conducting silica gel 210 helps the electronic chip product transfer heat to the heat conducting plate 200 more efficiently, thereby improving heat dissipation performance.

In summary, the dislocated special-shaped radiator 10 of the present utility model can uniformly radiate heat for a plurality of electronic chip products, avoid uneven heat radiation, improve heat radiation efficiency, and realize rapid heat radiation.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. A staggered profiled radiator, comprising:

the substrate is provided with a bonding surface and a radiating surface, a plurality of through grooves are formed in the substrate, and the through grooves are arranged along the y-axis direction and are mutually staggered in the x-axis direction;

the heat conducting plates are the same in number as the through grooves, and are respectively accommodated in the through grooves;

The fin group is arranged on the radiating surface of the substrate, the fin group forms a plurality of air flow channels, and the extending direction of the air flow channels is the y-axis direction.

2. The offset heat sink of claim 1, wherein each of the heat transfer plates spans multiple airflow channels and different ones of the heat transfer plates also span different ones of the airflow channels.

3. The staggered profiled radiator as claimed in claim 1, wherein the number of the through slots and the number of the heat conductive plates are two, and the two through slots are staggered from each other in the x-axis direction, that is, the two heat conductive plates are not juxtaposed in the y-axis direction.

4. The dislocated special-shaped radiator of claim 1, wherein a copper pipe net group is arranged between the base plate and the fin group, a containing groove is formed in the radiating surface of the base plate, the copper pipe net group is contained in the containing groove, the copper pipe net group is in contact fit with the heat conducting plate, and the copper pipe net group is in contact fit with the fin group.

5. The staggered profiled radiator as claimed in claim 4, wherein the copper tube net group includes a plurality of copper tubes, and a plurality of copper tubes are welded to each other.

6. The staggered special-shaped radiator according to claim 5, wherein the copper tubes and the fin groups are welded by solder, and each copper tube is simultaneously attached with a plurality of heat conducting plates.

7. The staggered special-shaped radiator according to claim 5, wherein the copper tube is of a hollow structure, the internal air pressure of the copper tube is negative pressure and is filled with cooling liquid, and capillary tubes are arranged on the inner wall of the copper tube.

8. The offset heat sink of claim 1, wherein the set of fins comprises a plurality of fins, the plurality of fins being side-by-side, and the airflow channel being formed between two adjacent fins.

9. The staggered profiled heat sink as claimed in claim 8, wherein,

Each fin comprises a top plate, a bottom plate and side plates connecting the top plate and the bottom plate, wherein the cross sections of the fins are concave, when the fins are arranged side by side, the top plate and the bottom plate of the latter fin are propped against the side plates of the former fin, and the air flow channel is formed between the two fins.

10. The dislocated profiled radiator of claim 1, wherein the thermally conductive plate is provided with thermally conductive silicone on a side facing the bonding face.