TWI858791B - An electronic device with triple liquid cooling cycle - Google Patents

Abstract

An electronic device with triple liquid cooling cycle comprises a first sealed case, a circuit motherboard and a liquid cooling module. The first sealed case comprises a first heat exchange cavity, a first liquid inlet, a first liquid outlet, a second liquid inlet and a second liquid outlet. The circuit motherboard is arranged inside the first sealed case and electrically connected to a first heat source. The liquid cooling module is coupled to the first heat source and comprises a first vapor chamber and a second sealed case having a second heat exchange cavity, a third liquid inlet and a third liquid outlet. Wherein, the first heat exchange cavity, the first liquid inlet and the first liquid outlet are formed to a first flow channel which is used to a circulation of the first cooling liquid, and the second heat exchange cavity, the second liquid inlet, the third liquid inlet, the second liquid outlet and the third liquid outlet are formed to a second flow channel which is used to a circulation of the second cooling liquid; and the third cooling liquid inside the first vapor chamber is formed a third flow channel with two phase flow circulation.

Description

An electronic device with triple liquid cooling cycle

The present invention relates to an electronic device, and more particularly to an electronic device with a triple liquid cooling cycle. The device integrates the functions of a two-phase flow cycle of a vapor chamber, a cold plate type cooling liquid cycle, and an immersion type cooling liquid cycle. When the liquid inlet and liquid outlet of the electronic device are connected to two external cooling liquid circulation systems, the heat generated by various electronic components in the electronic device can be effectively transferred to the outside of the electronic device.

The server liquid cooling technologies in the data center mainly include cold plate liquid cooling technology and immersion liquid cooling technology.

Cold plate liquid cooling is to install a cold plate cooling module on the high computing power chips (such as the central processing unit (CPU), graphics processing unit (GPU) and artificial intelligence (AI) chips) on the circuit motherboard in the server, and then connect the circulating cooling liquid to the water inlet and outlet of the cold plate cooling module. The microchannel in the water cooling plate is used to exchange heat with the chip, and then the heated hot water is taken away from the water cooling plate to achieve the purpose of lowering the chip temperature. However, this cold plate liquid cooling technology has some problems. First, the water cooling plate liquid cooling module using microchannels as heat dissipation has an upper limit on the heat dissipation power, which can no longer meet the increasing thermal design power (TDP) trend demand of high computing power chips. According to current knowledge and technology, when the power of a single chip reaches more than 500W, the general water cooling plate faces the limit of heat dissipation function. Second, in addition to using heat dissipation modules to dissipate the heat generated by high-computing chips, there are other electronic heating components in the server. However, these electronic heating components are currently only cooled by fans. But the heat discharged by the fans will be discharged into the computer room of the data center, causing the room temperature in the computer room to rise. Therefore, air conditioning is also needed to reduce the indoor temperature in the computer room, which reduces the overall PUE (Power Usage Effectiveness, PUE) value of the data center and faces a bottleneck.

Immersion liquid cooling technology is to immerse the entire circuit motherboard and electronic heating components of the server directly in a non-conductive liquid, and directly transfer the heat energy generated by the server during operation to the cooling liquid. It is known that immersion liquid cooling technology can be divided into the following two types according to different operating principles. First, the operation mode of single-phase immersion liquid cooling technology: immerse the heat source into a heat-conductive dielectric liquid tank. The non-conductive liquid can be synthesized by hydrocarbons with high boiling point and low viscosity. A circulation pump must be installed in the liquid tank to promote the circulation of the fluid in the liquid tank; second, the operation mode of two-phase immersion liquid cooling technology: immerse the heat source in low-viscosity, non-conductive cooling liquid, and take away the heat generated by the heat source through direct contact between the cooling liquid and the heat source and liquid circulation; at the same time, due to the low-temperature boiling process of the liquid, the heat is transferred from the liquid pool to the space outside the pool. Through heat exchange, such as condensation tubes, the steam is cooled and condensed again and flows back to the cooling liquid pool. Through continuous circulation, the purpose of heat dissipation is achieved. However, it is known that the cooling liquid (i.e., fluorocarbon) used in the two-phase immersion liquid cooling system is a man-made hazardous chemical substance. During the heat dissipation process of the system, if the vapor of fluorocarbons evaporates, it may be dispersed through the air, which may further cause corrosion and pollution to personnel, the environment or equipment.

Furthermore, with the development of technology and consumer demand, the performance requirements of electronic products' chips are getting higher and higher. For example, the power of a single chip in a data center server has reached 500W or 700W, and there will even be a demand for high-computing chip product design with a power of more than 1,000W in the future. In general, it is common to use power usage effectiveness (PUE) as a standard to measure energy saving in computing data centers. The lower the PUE value, the less power is consumed. The ideal PUE value is 1 (that is, 100% of the power can be converted into computer computing). However, in actual applications, it is common to know that during the operation (computing) of the server, the chip and the operation process will directly generate a lot of heat energy. If there is no good heat dissipation system, it will cause the chip to overheat or even burn. Therefore, in view of the shortcomings of existing technologies and the development of more high-power high-computing chips in the future, it is necessary to design a cooling system with higher heat dissipation efficiency, so that the PUE value approaches 1, thereby reducing electricity costs and meeting environmental protection requirements.

In view of this, the present invention provides an electronic device with triple liquid cooling circulation, which can make the server itself into an independent electronic device with both cold plate and immersion liquid cooling heat dissipation effects. When the liquid inlet and outlet of the server are connected to the external circulating cooling liquid, the heat generated by all electronic components in the server can be efficiently transferred and discharged outside the server cabinet, or even transferred and discharged to the outdoor of the data center for centralized processing and effective application, thereby effectively improving the heat dissipation efficiency of the entire server and reducing the PUE value of the entire data center, thereby solving the above-mentioned known problems.

The present invention provides an electronic device with a triple liquid cooling cycle, comprising a first closed housing, a circuit motherboard and a liquid cooling heat dissipation module. The first closed housing has a first heat exchange cavity, a first liquid inlet, a first liquid outlet, a second liquid inlet and a second liquid outlet, and the first liquid inlet and the first liquid outlet are respectively connected to the first heat exchange cavity. The circuit motherboard is arranged in the first closed housing and located in the first heat exchange cavity, and the circuit motherboard is electrically connected to a first heating element. The liquid cooling heat dissipation module is coupled to the first heat generating element and includes a second closed shell and a first vapor chamber element. The second closed shell has a second heat exchange chamber, a third liquid inlet and a third liquid outlet. The third liquid inlet and the third liquid outlet are respectively interconnected with the second liquid inlet and the second liquid outlet. The first vapor chamber element is arranged in the second heat exchange chamber, and the first vapor chamber element has a heat absorption end and a condensation end. The first heat exchange chamber, the first liquid inlet and the first liquid outlet form a first flow channel for a first cooling liquid to circulate, the second heat exchange chamber, the second liquid inlet, the third liquid inlet, the second liquid outlet and the third liquid outlet form a second flow channel for a second cooling liquid to circulate, a third flow channel is formed inside the first vapor chamber element for a third cooling liquid to flow in a two-phase circulation form, the heat absorption end of the first vapor chamber element is closely attached to the first heating element, and the condensation end of the first vapor chamber element is immersed in the second cooling liquid.

The first closed housing is a closed housing that meets the 1U size specification, the electronic device can be placed in a modular cabinet, and the electronic device can be a server or a communication device.

It also includes a circuit board electrically connected to the circuit motherboard, the first heating element is arranged on the circuit board, and the circuit board, the first heating element and the liquid cooling heat dissipation module form an electronic component with heat dissipation function.

Among them, a second heating element is also provided on the circuit board, and the liquid cooling heat dissipation module includes a copper upper cover and a copper lower cover, the copper lower cover has a first area and a second area relative to the copper upper cover, the first area has a first lower surface, and the second area has a second lower surface and a second upper surface. When the copper upper cover is connected to the first area of the copper lower cover, a first vapor chamber element is formed, the first lower surface of the first area is used to contact the first heating element, and the second lower surface of the second area is used to contact the second heating element.

The electronic component further includes a half-open shell connected to the copper lower cover to form a second closed shell and a second heat exchange chamber. The second heat exchange chamber is used to accommodate the copper upper cover and the second upper surface of the second area, and the third liquid inlet and the third liquid outlet are arranged on the half-open shell.

The electronic component further includes a two-dimensional temperature averaging plate element, which is formed in the second area of the copper lower cover and has a second vapor chamber and a temperature averaging plate lower surface, and the temperature averaging plate lower surface is used to contact the second heating element.

The two-dimensional temperature equalizing plate element includes a flat plate, which has a lower cover cavity relative to the second area of the copper lower cover. When the flat plate is connected to the second area of the copper lower cover, the lower cover cavity forms a second vapor cavity.

The copper upper cover includes a substrate and a tube body, the substrate has a substrate cavity, an opening and an upper outer surface, the tube body has a tube body cavity, the tube body is arranged on the upper outer surface and above the opening and protrudes outward from the upper outer surface, when the copper upper cover is connected to the first area of the copper lower cover, the tube body cavity and the substrate cavity form the air cavity of the first vapor chamber element.

The first coolant is a non-conductive single-phase coolant or a non-conductive two-phase coolant, the second coolant is water or a mixture of water and alcohol, and the third coolant is pure water.

The first flow channel is formed by a first connecting pipe connecting the first liquid inlet, the first heat exchange chamber and the first liquid outlet, and the second flow channel is formed by a second connecting pipe connecting the second liquid inlet, the third liquid inlet, the second heat exchange chamber, the third liquid outlet and the second liquid outlet. The third flow channel is formed by the two-phase flow circulation inside the first vapor chamber element.

In summary, the present invention provides an electronic device with a triple liquid cooling cycle, which performs heat exchange and heat transfer at different levels through the triple liquid cooling cycle contained in the electronic device itself to achieve better heat dissipation and power saving effects. Compared with the prior art, the present invention has the following advantages: First, the present invention simultaneously sets up triple liquid cooling cycles in the electronic device, wherein one set of two-phase flow liquid cooling cycles corresponds to the vapor chamber, and can directly perform heat exchange and heat transfer with the first heating element (primary heat source), and quickly transfer the heat energy at the heat absorption end to the condensation end through phase change; another set corresponds to the second closed shell, and performs heat exchange and heat transfer with the cooling liquid in the vapor chamber and the second heat exchange chamber; another set corresponds to the first closed shell and is set on the entire circuit motherboard, and performs heat exchange and heat transfer with the heating element (secondary heat source) on the circuit motherboard. Therefore, when the present invention is applied to electronic devices, the triple liquid cooling cycle is equivalent to providing three additional heat exchange systems at the same time. From the inside out, the layered liquid cooling cycle dissipates heat, so the heat transfer and heat dissipation efficiency of the electronic device itself can be greatly improved. In summary, the electronic device with a triple liquid cooling cycle of the present invention effectively exchanges and transfers the heat generated by the primary heat source and the secondary heat source through the application of three-layer liquid cooling cycles to achieve a better heat dissipation effect. In addition to greatly increasing the heat dissipation efficiency of the electronic device to make the PUE value close to 1, it can also save the cost of using cooling liquid.

1, 2: Electronic devices with triple liquid cooling cycle

10: First closed shell

101: First heat exchange chamber

1011: First liquid inlet

1012: First liquid outlet

1013: Second liquid inlet

1014: Second liquid outlet

111: First flow channel

1110: First connecting pipe

112, 112': Second flow channel

1120: Second connecting pipe

113: The third flow channel

114: Base plate

20: Circuit motherboard

201: First heating element

21: Circuit board

211: Second heating element

212: The third heating element

30: Liquid cooling module

301: Second closed shell

3011, 3011': Second heat exchange chamber

3012: The third liquid inlet

3013: The third liquid outlet

3014: Fourth liquid inlet

3015: Fourth liquid outlet

302: First steam chamber element

311: Copper cover

3110: Substrate

3111: Tube body

3112: Substrate cavity

3113: Tube cavity

3114: Top

3115: Injection port sealing structure

312: Copper bottom cover

313: First lower surface

314: Air cavity of the first steam cavity

315: Second lower surface

316: Second upper surface

317: Groove

320: Semi-open shell

330: Two-dimensional temperature balancing plate element

3301: Lower surface of the temperature equalizer

3302: Tablet

3303: Bottom cover cavity

3304: Second steam chamber

3305: Lower surface of the plate

401: Pump

402: Heat exchanger

50: Electronic components

60: Heat absorbing end

70: Condensation end

A: Area 1

B: Second area

FIG1 is a cross-sectional view of an electronic device with a triple liquid cooling cycle according to a specific embodiment of the present invention.

Figure 2 is a top view based on Figure 1.

FIG3 is a schematic diagram showing an electronic device with a triple liquid cooling cycle according to another specific embodiment of the present invention.

FIG4 is a cross-sectional view of an electronic component of another specific embodiment of the present invention.

FIG5 is a cross-sectional view of the first vapor chamber element according to FIG4.

Figure 6 is an enlarged view of area B according to Figure 5.

FIG. 7 is a cross-sectional view of the first vapor chamber element according to another specific embodiment of the present invention.

Figure 8 is an enlarged view of area B according to Figure 7.

FIG. 9 is a cross-sectional view of the first vapor chamber element according to FIG. 1 .

In order to make the advantages, spirit and features of the present invention easier and clearer to understand, the following will be described and discussed in detail with reference to the attached drawings using specific embodiments. It should be noted that these specific embodiments are only representative specific embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. cited therein are not used to limit the present invention or the corresponding specific embodiments. In addition, the components in the figure are only used to express their relative positions and are not drawn according to their actual proportions. The step numbers of the present invention are only used to separate different steps and do not represent the order of the steps, which should be explained first.

Please refer to FIG. 1, which is a cross-sectional view of an electronic device with a triple liquid cooling cycle according to a specific embodiment of the present invention. As shown in FIG. 1, the present invention provides an electronic device 1 with a triple liquid cooling cycle, comprising a first closed housing 10, a circuit motherboard 20, and a liquid cooling heat dissipation module 30. The first closed housing 10 has a first heat exchange cavity 101, a first liquid inlet 1011, a first liquid outlet 1012, a second liquid inlet 1013, and a second liquid outlet 1014, and the first liquid inlet 1011 and the first liquid outlet 1012 are respectively connected to the first heat exchange cavity 101. The circuit motherboard 20 is disposed in the first closed housing 10 and is located in the first heat exchange cavity 101, and the circuit motherboard 20 is electrically connected to the first heating element 201. The liquid cooling heat dissipation module 30 is coupled to the first heat generating element 201 and includes a second closed shell 301 and a first vapor chamber element 302. The second closed shell 301 has a second heat exchange chamber 3011, a third liquid inlet 3012 and a third liquid outlet 3013. The third liquid inlet 3012 and the third liquid outlet 3013 are respectively connected to the second liquid inlet 1013 and the second liquid outlet 1014. The first vapor chamber element 302 is arranged in the second closed shell 301 and can be in contact with the cooling liquid in the second heat exchange chamber 3011 for heat exchange. The first heat exchange chamber 101, the first liquid inlet 1011 and the first liquid outlet 1012 form a first flow channel 111 for the first cooling liquid to circulate. The second heat exchange chamber 3011, the second liquid inlet 1013, the third liquid inlet 3012, the second liquid outlet 1014 and the third liquid outlet 3013 form a second flow channel 112 for the second cooling liquid to circulate. The third flow channel 113 is formed inside the first vapor chamber element 302 for the third cooling liquid to flow in a two-phase circulation form. In addition, the heat absorption end 60 of the first vapor chamber element 302 is closely attached to the first heating element 201, and the condensation end 70 of the first vapor chamber element 302 is immersed in the second cooling liquid.

The operating principle of the third flow channel 113 will be described in detail below. Please refer to Figure 1 again. As shown in Figure 1, the cooling liquid in the third flow channel 113 flows in the capillary structure inside the first vapor chamber element 302. In practice, when the heat absorption end of the first vapor chamber element 302 receives heat energy from the first heating element 201, the cooling liquid in the third flow channel 113 absorbs heat energy and turns into gaseous state, and flows toward the upward arrow inside the first vapor chamber element 302 in Figure 1. Then, the cooling liquid changes from gas phase to liquid phase at the condensation end 70, and then flows along the downward arrow inside the first vapor chamber element 302 in Figure 1, and the working fluid flows back to the heat absorption end 60 through the capillary phenomenon of the capillary structure to form a two-phase flow cycle.

Please refer to FIG. 1 and FIG. 2 together. FIG. 2 is a top view of FIG. 1. As shown in FIG. 2, the first liquid inlet 1011 and the first liquid outlet 1012 form a first flow channel 111; the second liquid inlet 1013, the third liquid inlet 3012, the second liquid outlet 1014, and the third liquid outlet 3013 form a second flow channel 112. From the top view, it can be clearly seen that the first flow channel 111 and the second flow channel 112 are respectively provided with a pump 401 to flow the cooling liquid in the first flow channel 111 and the second flow channel 112 into the liquid inlet and out of the liquid inlet, so that the first heat exchange chamber 101 and the second heat exchange chamber 3011 have better heat exchange efficiency. Please note that the cooling liquid in the third flow channel 113 circulates in a liquid-gas two-phase manner between the heat absorption end 60 and the condensation end 70 in the first vapor chamber element 302 (as shown in FIG. 1 ). In practice, the first flow channel 111 is formed by connecting the first liquid inlet 1011, the first heat exchange chamber 101 and the first liquid outlet 1012 through the first connecting pipe 1110, and the second flow channel 112 is formed by connecting the second liquid inlet 1013, the third liquid inlet 3012, the second heat exchange chamber 3011, the third liquid outlet 3013 and the second liquid outlet 1014 through the second connecting pipe 1120.

The positions of the first liquid inlet 1011, the first liquid outlet 1012, the second liquid inlet 1013, the third liquid inlet 3012, the second liquid outlet 1014 and the third liquid outlet 3013 shown in FIG. 2 are not limited thereto and can be designed according to actual server requirements. In addition, in practice, the size of the first closed housing 10 of the electronic device 1 with triple liquid cooling cycle of the present invention meets the 1u size specification of the closed housing in the server and can be set in the modular cabinet of the server, but the size specification is not limited thereto, and can also be a 2u size specification of the closed housing or a cabinet size of the server designed for individual requirements. At the same time, it is not limited to the application in the server, and any electronic device, communication device and vehicle device can be used as it.

In addition to being applicable to the common specifications currently on the market (i.e., a circuit motherboard with only one main heat source), the electronic device 1 with triple liquid cooling cycle of the present invention can also be applied when two main heat sources (or more) are provided on the circuit motherboard. Please refer to FIG3, which is a schematic diagram of an electronic device with triple liquid cooling cycle of another specific embodiment of the present invention. As shown in FIG. 3 , when two sets of main heat sources (not shown) are provided, second heat exchange chambers 3011 and 3011' can be provided on the two sets of main heat sources, and a second flow channel 112' is formed through the second liquid inlet 1013, the third liquid inlet 3012, the second heat exchange chamber 3011, the third liquid outlet 3013, the fourth liquid inlet 3014, the second heat exchange chamber 3011', the fourth liquid outlet 3015 and the second liquid outlet 1014 for the circulation of the second cooling liquid.

In practice, the first coolant is a non-conductive single-phase coolant or a non-conductive two-phase coolant, the second coolant is water or a mixture of water and alcohol, and the third coolant is pure water, but the coolant material is not limited thereto. It is worth noting that water is selected as the third coolant because water has a higher vaporization latent heat and can quickly and efficiently take away the heat generated by the first heating element 201, and the first heat exchange chamber 101 and the second heat exchange chambers 3011, 3011' are respectively filled with the first coolant and the second coolant, and can take away the absorbed heat through circulation. The first closed shell 10 can be welded to the bottom plate 114 by welding, so that the first heat exchange chamber 101 has better sealing performance and can also prevent the first cooling liquid from leaking, but the joining process method is not limited to this.

In addition to being directly disposed on the circuit motherboard, the first heating element of the present invention can also be mounted on the circuit motherboard by means of a slot connection. Please refer to FIG. 4, which is a cross-sectional view of an electronic component of another specific embodiment of the present invention. As shown in FIG. 4, an electronic device with a triple liquid cooling cycle of another specific embodiment of the present invention further includes a circuit board 21, which is electrically connected to the circuit motherboard (not shown), and the first heating element 201 is disposed on the circuit board 21, and the circuit board 21, the first heating element 201 and the liquid cooling heat dissipation module 30 form an electronic component 50 with a heat dissipation function. In practice, the circuit board 21 can be designed as a plate-shaped device that can be disposed on the circuit motherboard (not shown) by means of a slot.

In addition to the main heat source with a larger power, a secondary heat source with a lower power is sometimes provided near the main heat source. The first vapor chamber element 302 which can be used for both the main heat source and the secondary heat source to dissipate heat will be described in detail below. Please continue to refer to FIG. 4. A second heat generating element 211 is provided on the circuit board 21. The liquid cooling heat dissipation module 30 includes a copper upper cover 311 and a copper lower cover 312. The copper lower cover 312 has a first area A and a second area B relative to the copper upper cover 311. The first area A has a first lower surface 313, and the second area B has a second lower surface 315 and a second upper surface 316. When the copper upper cover 311 is bonded to the copper lower cover 312, the first vapor chamber element 302 is formed, wherein the first lower surface 313 of the first region A is used to contact the first heating element 201, and the second lower surface 315 of the second region B is used to contact the second heating element 211. In a specific embodiment, the first vapor chamber element 302 is a three-dimensional structure, and can also be a two-dimensional structure.

The electronic assembly 50 further includes a half-open housing 320 connected to the copper lower cover 312 to form a second closed housing 301 and a second heat exchange chamber 3011. The second heat exchange chamber 3011 is used to accommodate the copper upper cover 311 and the second upper surface 316 of the second region B, and the third liquid inlet 3012 and the third liquid outlet 3013 are disposed on the half-open housing 320. In practice, the first heating element 201 is a primary heat source (such as a high-power CPU chip, a graphics chip, an AI chip, an IGBT chip); the second heating element 211 is a secondary heat source with lower power (such as a passive element, a memory). Among them, the electronic component 50 in FIG. 4 can also be installed in FIG. 1 to form an electronic device with a triple liquid cooling cycle. Please refer to FIG. 4 and FIG. 1 together. Considering that the temperature caused by the actual heating of the secondary heat source is lower than the main heat source, if the first area A is set next to the third liquid inlet 3012, when the temperature raised by the heat taken away by the second cooling liquid from the first heating element 201 of the first area A is much higher than the temperature of the second heating element 211, the second area B is not only unable to dissipate heat effectively, but is also likely to cause the temperature of the second heating element 211 to rise. Therefore, the second area B in the first vapor chamber element 302 of the present invention will be set close to the third liquid inlet 3012, but in practice, the flow direction of the second cooling liquid is not limited to this.

Among them, the electronic component 50 of an electronic device with a triple liquid cooling cycle of the present invention further includes a two-dimensional temperature averaging plate element 330, and this two-dimensional temperature averaging plate element 330 can simultaneously dissipate heat for some relatively high-power secondary heat sources. The setting method of the two-dimensional temperature averaging plate element 330 will be further described below.

Please refer to FIG. 4, FIG. 5 and FIG. 6. FIG. 5 is a cross-sectional view of the first vapor chamber element according to FIG. 4. FIG. 6 is an enlarged view of region B according to FIG. 5. As shown in FIG. 4 and FIG. 5, the two-dimensional temperature averaging plate element 330 is formed in the second region B of the copper lower cover 312. The second region B can dissipate heat for the second heating element 211. Please further refer to FIG. 5 and FIG. 6. As shown in FIG. 6, the two-dimensional temperature averaging plate element 330 includes a flat plate 3302. Relative to the second region B of the copper lower cover 312, the second region B has a lower cover cavity 3303. When the flat plate 3302 is connected to the second region B of the copper lower cover 312, the lower cover cavity 3303 forms a second vapor chamber 3304. Furthermore, in this specific embodiment, the lower surface 3305 of the flat plate 3302 is used to contact the second heating element 211. Therefore, the lower surface 3305 of the flat plate 3302 and the second lower surface 315 of the copper lower cover 312 in this specific embodiment are coplanar.

In addition to the above-mentioned method of setting the flat plate 3302 in the copper lower cover 312, another method of setting the flat plate 3302 in the copper lower cover 312 will be described below. Please refer to Figures 7 and 8 together. Figure 7 is a cross-sectional view of the first steam chamber element according to another specific embodiment of the present invention. Figure 8 is an enlarged view of area B according to Figure 7. As shown in Figures 7 and 8, when the flat plate 3302 is connected to the second area B, the lower cover cavity 3303 forms a second steam chamber 3304 and the flat plate 3302 is connected to the second upper surface 316. At this time, the lower surface 3301 of the temperature averaging plate is used to contact the second heating element 211.

Please refer to FIG. 9, which is a cross-sectional view of the first steam chamber element according to FIG. 1. As shown in FIG. 9, a groove 317 can be milled by a computer numerical control (CNC) processing machine. The plurality of grooves 317 are located in the first area A and the second area B of the copper lower cover 312. The grooves 317 can be processed separately for the number and height of the first heating element (not shown) and the second heating element (not shown), so that the depth of the groove 317 can better match the height of the first heating element (not shown) and the second heating element, so as to conduct heat more efficiently. Please note that the flat plate 3302 of the two-dimensional temperature averaging plate element 330 in FIG. 9 is also disposed in the second upper surface 316, wherein the arrangement of the flat plate 3302 is substantially the same as before, and will not be repeated here.

Please refer to FIG. 9 again. As shown in FIG. 9 , the copper upper cover 311 includes a substrate 3110 and a tube 3111. The substrate 3110 has a substrate cavity 3112, an opening (not labeled) and an upper outer surface (not labeled). The tube 3111 has a tube cavity 3113. The tube 3111 is disposed on the upper outer surface of the substrate 3110 and is located above the opening and protrudes outward from the upper outer surface (i.e., the shape shown in FIG. 9 ). When the copper upper cover 311 is bonded to the first region A of the copper lower cover 312, the tube cavity 3113 and the substrate cavity 3112 form the air cavity 314 of the first vapor chamber element 302. In practice, the tube body 3111 can be formed by continuously stamping and stretching the copper cover 311 from a metal plate to form an integrally formed tube body 3111, and the shape of the tube body 3111 can be a cylinder, a rectangular prism, an elliptical cylinder and a cone, but is not limited thereto.

Next, the tube body 3111 has a top end 3114, and the top end 3114 has a nozzle sealing structure 3115. The nozzle sealing structure 3115 is formed by injecting the third cooling liquid into the first vapor chamber element 302 through the liquid nozzle pre-set at the top end 3114, and then sealing the liquid nozzle. In practical applications, the liquid nozzle can be sealed by welding or other methods. In addition, the nozzle sealing structure 3115 and the liquid nozzle in this specific embodiment are both located at the top end 3114 of the tube body 3111, but the actual application is not limited to this. The nozzle sealing structure 3115 and the liquid nozzle can also be set at any position on the tube body 3111. In addition, the manufacturing process of the first vapor chamber element 302 (i.e., FIG. 5 and FIG. 7 ) in other embodiments of the present invention is the same as that described above and will not be described in detail here.

In summary, the present invention provides an electronic device with triple liquid cooling circulation, which firstly uses the phase change of the two-phase flow circulation of the third flow channel of the vapor chamber to make the third cooling liquid in the capillary structure of the heat absorption zone in the vapor chamber undergo phase change and transfer the heat energy efficiently, and then uses the second cooling liquid flowing in the second heat exchange cavity of the second flow channel to exchange heat with it. The heat generated by the lower power secondary heat sources on other circuit motherboards and the residual heat that the liquid cooling heat dissipation module cannot take away are all taken away by the non-conductive first cooling liquid in the first heat exchange cavity through the first flow channel circulation, so that the electronic device has a better heat dissipation effect. Compared with the prior art, the electronic device with triple liquid cooling cycle of the present invention integrates a circuit motherboard and all heat generating components with a heat dissipation system to form an electronic device with its own liquid cooling function. This device can be a server or a communication switch. In practical applications, this device can be directly stacked and inserted into a cabinet, and then connected to an external cooling liquid circulation system to achieve the function of self-heat dissipation of the electronic device. The present invention provides an electronic device with triple liquid cooling cycle that can save the cost of using cooling liquid and greatly increase the heat dissipation efficiency of the electronic device.

The above detailed description of the preferred specific embodiments is intended to more clearly describe the features and spirit of the present invention, rather than to limit the scope of the present invention by the preferred specific embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent application for the present invention. Therefore, the scope of the patent application for the present invention should be interpreted in the broadest sense based on the above description, so as to cover all possible changes and arrangements with equivalents.

1: Electronic devices with triple liquid cooling cycle

10: First closed shell

101: First heat exchange chamber

1011: First liquid inlet

1012: First liquid outlet

1013: Second liquid inlet

1014: Second liquid outlet

111: First flow channel

112: Second flow channel

113: The third flow channel

114: Base plate

20: Circuit motherboard

201: First heating element

21: Circuit board

211: Second heating element

212: The third heating element

30: Liquid cooling module

301: Second closed shell

3011: Second heat exchange chamber

3012: The third liquid inlet

3013: The third liquid outlet

302: First steam chamber element

60: Heat absorbing end

70: Condensation end

Claims (10)

An electronic device with a triple liquid cooling cycle includes: a first closed housing having a first heat exchange cavity, a first liquid inlet, a first liquid outlet, a second liquid inlet and a second liquid outlet, wherein the first liquid inlet and the first liquid outlet are respectively connected to the first heat exchange cavity; a circuit motherboard is arranged in the first closed housing and located in the first heat exchange cavity, and the circuit motherboard is electrically connected to a first heating element; and a liquid cooling heat dissipation module is coupled to the first heating element and includes a second closed housing and a first vapor cavity element, wherein the second closed housing has a second heat exchange cavity, a third liquid inlet and a third liquid outlet, wherein the third liquid inlet and the third liquid outlet are respectively connected to the second liquid inlet and The second liquid outlet is interconnected, and the first vapor chamber element is arranged in the second heat exchange chamber, and the first vapor chamber element has a heat absorption end and a condensation end; wherein the first heat exchange chamber, the first liquid inlet and the first liquid outlet form a first flow channel for a first cooling liquid to circulate, the second heat exchange chamber, the second liquid inlet, the third liquid inlet, the second liquid outlet and the third liquid outlet form a second flow channel for a second cooling liquid to circulate, a third flow channel is formed inside the first vapor chamber element for a third cooling liquid to flow in a two-phase flow circulation form, the heat absorption end of the first vapor chamber element is closely attached to the first heat generating element, and the condensation end of the first vapor chamber element is immersed in the second cooling liquid. As described in item 1 of the patent application scope, the electronic device with triple liquid cooling cycle, wherein the first closed housing is a closed housing that meets the 1U size specification, the electronic device can be placed in a modular cabinet, and the electronic device can be a server or a communication device. The electronic device with triple liquid cooling cycle as described in Item 1 of the patent application scope further includes a circuit board electrically connected to the circuit motherboard, the first heating element is arranged on the circuit board, and the circuit board, the first heating element and the liquid cooling heat dissipation module form an electronic component with heat dissipation function. As described in item 3 of the patent application scope, an electronic device with triple liquid cooling cycle, wherein a second heating element is further provided on the circuit board, and the liquid cooling heat dissipation module includes a copper upper cover and a copper lower cover, the copper lower cover has a first area and a second area relative to the copper upper cover, the first area has a first lower surface, the second area has a second lower surface and a second upper surface, when the copper upper cover is joined to the first area of the copper lower cover, the first vapor chamber element is formed, the first lower surface of the first area is used to contact the first heating element, and the second lower surface of the second area is used to contact the second heating element. As described in item 4 of the patent application scope, the electronic device with triple liquid cooling cycle, wherein the electronic component further includes a half-open shell, connected to the copper lower cover to form the second closed shell and the second heat exchange chamber, the second heat exchange chamber is used to accommodate the copper upper cover and the second upper surface of the second area, and the third liquid inlet and the third liquid outlet are arranged on the half-open shell. As described in item 5 of the patent application scope, the electronic device with triple liquid cooling cycle, wherein the electronic component further includes a two-dimensional temperature averaging element formed in the second area of the copper lower cover and having a second vapor chamber and a temperature averaging lower surface, the temperature averaging lower surface is used to contact the second heating element. As described in item 6 of the patent application scope, the electronic device with triple liquid cooling cycle, wherein the two-dimensional temperature plate element includes a flat plate, and relative to the second area of the copper lower cover, the second area has a lower cover cavity, and when the flat plate is connected to the second area of the copper lower cover, the lower cover cavity forms the second vapor chamber. As described in item 4 of the patent application scope, the electronic device with triple liquid cooling cycle, wherein the copper upper cover includes a substrate and a tube body, the substrate has a substrate cavity, an opening and an upper outer surface, the tube body has a tube body cavity, the tube body is arranged on the upper outer surface and located above the opening and protrudes outward from the upper outer surface, when the copper upper cover is connected to the first area of the copper lower cover, the tube body cavity and the substrate cavity form an air cavity of the first vapor chamber element. An electronic device with a triple liquid cooling cycle as described in Item 1 of the patent application, wherein the first cooling liquid is a non-conductive single-phase cooling liquid or a non-conductive two-phase cooling liquid, and the second cooling liquid is water or a mixture of water and alcohol, and the third cooling liquid is pure water. As described in item 1 of the patent application, the electronic device with triple liquid cooling circulation, wherein the first flow channel is formed by a first connecting pipe connecting the first liquid inlet, the first heat exchange chamber and the first liquid outlet, and the second flow channel is formed by a second connecting pipe connecting the second liquid inlet, the third liquid inlet, the second heat exchange chamber, the third liquid outlet and the second liquid outlet, and the third flow channel is formed by the two-phase flow circulation inside the first vapor chamber element.

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