TWI857292B - Resin molding device and method for manufacturing resin molded product - Google Patents

Abstract

The problem to be solved by the present invention is to provide a resin molding device and a method for manufacturing a resin molded product, wherein the resin molding device can detect the occurrence of thickness deviation in the resin molded product. In order to solve this problem, the resin molding device of the present invention comprises: a workbench, at least a part of which is light-transmissive; an illumination unit, which can illuminate from below the workbench; a resin material supply unit, which supplies the resin material to the workbench; a camera unit, which can photograph the resin material supplied to the workbench from above; and a resin molding unit, which uses the resin material supplied to the workbench to perform resin molding.

Description

Resin molding device and method for manufacturing resin molded product

The present invention relates to a resin molding device and a method for manufacturing a resin molded product.

In recent years, it is desired to reduce the thickness of semiconductor packages, and the in-plane uniformity of the resin supply amount is sought in the resin supply so as to eliminate the deviation of the package thickness in a wide area and make the package thickness uniform. Therefore, for example, Patent Document 1 discloses a technology in which a release film is arranged on a workbench, a liquid resin is supplied to the release film, and a camera is used to photograph it (see FIG. 3 of Patent Document 1, etc.). In addition, Patent Document 2 discloses a technology in which a release film is arranged on a moving table, a granular resin is supplied to the release film, and the film is observed (see paragraphs [0048], [0049], FIG. 1, etc. of the specification of Patent Document 2). In the technology of any patent document, the resin material layered on the release film is observed to identify the in-plane uniformity of the resin material.

[Prior technical literature] (Patent literature) Patent literature 1: Japanese Patent Publication No. 6218891 Patent literature 2: Japanese Patent Publication No. 2020-82534

[Problem to be solved by the invention] However, although it is not clearly stated in the above-mentioned publications, in the prior art, the camera is arranged above the resin material, and the lighting is also arranged above. Therefore, the lighting direction of the lighting is inclined relative to the shooting direction. As a result, shadows may appear on the resin material and light and dark may be generated, which becomes the main reason for misrecognition of in-plane uniformity.

The present invention is made to solve this problem, and its purpose is to provide a resin molding device and a method for manufacturing a resin molded product, wherein the resin molding device can detect the occurrence of thickness deviation in a resin molded product.

[Technical means for solving the problem] The resin molding device of the present invention comprises: a workbench, at least a part of which is light-transmissive; an illumination unit that can illuminate from below the workbench; a resin material supply unit that supplies the resin material to the workbench; a camera unit that can photograph the resin material supplied to the workbench from above; and a resin molding unit that performs resin molding using the resin material supplied to the workbench.

The method for manufacturing a resin molded product of the present invention comprises: a step of supplying a resin material to a workbench at least a portion of which is light-transmissive; a step of photographing the supplied resin material from above while lighting is performed from below the workbench; and a step of performing resin molding using the resin material supplied to the workbench.

[Effect of the invention] According to the present invention, it is possible to detect the occurrence of thickness deviation in a resin molded product.

Hereinafter, an embodiment of the resin molding device of the present invention will be described in detail using drawings. In order to facilitate understanding, appropriate objects are omitted or exaggerated in each drawing and are schematically depicted.

<1. Structure of resin molding device> Figure 1 is a schematic plan view of a resin molding device 100 of the present embodiment. The resin molding device 100 is configured to apply a resin seal on a substrate W to which electronic components such as semiconductor chips, resistors, capacitors, etc. are connected to manufacture a resin molded product. In the resin molding device 100, a resin seal is applied to a component mounting surface of the substrate W on which electronic components are mounted.

As an example of the substrate W used here, there can be cited semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, ceramic substrates, etc. The substrate W may also be a carrier used in FOWLP (Fan Out Wafer Level Packaging) and FOPLP (Fan Out Panel Level Packaging). The substrate W may or may not be wired in advance.

As shown in FIG. 1 , the resin forming device 100 includes a substrate supply and storage module A (hereinafter also referred to as "module A"), two resin forming modules B (hereinafter also referred to as "module B"), a resin material supply module C (hereinafter also referred to as "module C"), and a first control unit 14. As the first control unit, for example, a PLC (Programmable Logic Controller), a PC (Personal Computer), etc. can be used. The first control unit 14 is configured to include a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory), etc., to implement the control of each module A to C corresponding to information processing. The following is a detailed description of each module A to C. In addition, each module A to C can be attached to or detached from another module and can be exchanged. In the resin molding device 100, each module A to C can be increased or decreased.

<1-1. Module A> Module A is a module for supplying substrates W before sealing and storing substrates W after sealing, and comprises a substrate supply section 1, a substrate storage section 2, a substrate placement section 3, and a substrate conveying mechanism 4. The substrate supply section 1 is configured to supply substrates W before sealing to the substrate placement section 3. The substrate storage section 2 is configured to store substrates W (resin molded products) after sealing. The substrate placement section 3 is configured to move in the arrow Y direction between the corresponding position of the substrate supply section 1 and the corresponding position of the substrate storage section 2. The substrate conveying mechanism 4 is configured to move in the arrow X direction and the arrow Y direction across module A and module B, for example, to hold and convey the substrate W before sealing on the substrate placement section 3 in module A to module B. Alternatively, the sealed substrate W manufactured in module B is placed on the substrate placement part 3 of module A.

<1-2. Module B> Each module B is a module for performing molding of a resin material, and has a compression molding section 5 for manufacturing a sealed substrate W (resin molded product) by compression molding. In this compression molding, for example, a black granular resin material P is used. The compression molding section 5 has an upper mold 52, a lower mold 51 opposite to the upper mold 52, and a mold fastening mechanism 53. The upper mold 52 is configured to hold the substrate W on its bottom surface. On the other hand, the lower mold 51 has a bottom member and a side member for forming a concave cavity 51C. That is, the bottom surface of the cavity 51C is formed by the bottom member, and the side surface of the cavity 51C is formed by the side member. As described later, the resin material P prepared by the module C is arranged in the cavity 51C. Furthermore, the mold tightening mechanism 53 is configured to mold tighten the upper mold 52 and the lower mold 51 where the resin material P is arranged.

<1-3. Module C> Module C is a module for supplying resin material. As shown in FIG. 1, module C has a moving platform 6, a resin material storage section 7, a resin material supply section 8, a demolding film supply section 9, a camera section 300, and a resin material conveying mechanism 90. Furthermore, in this module C, a HDD (Hard Disc Drive) 200 and a second control section 150 are provided. This second control section 150 is equivalent to the control section of the present invention. The following describes each structure in detail.

<1-3-1. Moving stage> Figure 2 is a plan view of the moving stage, and Figure 3 is a cross-sectional view of Figure 2. As shown in Figure 1, the moving stage 6 is configured to move in the arrow X direction and the arrow Y direction in the module C. As shown in Figures 2 and 3, a recess 61 is formed on the top surface of the moving stage 6, and a light guide plate 62 is arranged in this recess 61. In addition, an LED module 63 is arranged on the side surface of the light guide plate 62 as a lighting unit. The light emitted from this LED module 63 is incident on the light guide plate 62 and diffused in the light guide plate 62, thereby making the top surface of the light guide plate 62 glow. The light guide plate 62 can be appropriately made of a known plate formed of acrylic resin or the like, and a reflective film and a diffusion film can also be provided as needed.

On the top surface of the moving stage 6, an adsorption port (not shown) is formed around the light guide plate 62, and is configured to hold a release film 73 described below by adsorption.

<1-3-2. Release film supply unit> Figure 4 is a side view illustrating the operation of the release film supply unit. As shown in Figure 4 (a), a release film supply unit 9 is provided on one end side of the moving table 6 to arrange the release film 73 on the top surface of the moving table 6. The release film supply unit 9 has a roller 91 on which the release film 73 is wound, a roll-out unit 92 for rolling the release film 73 from the roller 91 and arranging it on the moving table 6, and a cutting unit 93 for cutting the release film 73.

As shown in FIG. 4(b), the unwinding portion 92 is configured to hold the end of the release film 73 wound on the roller 91 and unwind the release film 73 by moving away from the roller 91. At this time, the unwinding portion 92 moves from one end of the movable table 6 to the other end above the movable table 6. Thereby, the release film 73 is arranged on the movable table 6. The release film 73 on the movable table 6 is attracted by the above-mentioned suction port and is held on the movable table 6. Furthermore, as shown in FIG. 4(c), the end of the release film 73 on the side of the roller 91 is cut by the cutting portion 93. Thereby, the sheet-like release film 73 is arranged on the movable table 6.

<1-3-3. Resin material storage section> Next, the resin material storage section 7 is described. As shown in FIG. 5 (a), the resin material storage section 7 has a frame-shaped member 72 and a moving mechanism (not shown) for moving the frame-shaped member 72. The frame-shaped member 72 is formed in a rectangular shape and is arranged on the moving table 6 on which a mold release film 73 is arranged by the moving mechanism. A recess 71 is thereby formed, in which a resin material is supplied. That is, the bottom surface of the recess 71 is formed by the mold release film 73, and the side surface of the recess 71 is formed by the frame-shaped member 72. In addition, the recess 71 has a space corresponding to the size of the cavity 51C of the lower mold 51 of the module B.

<1-3-4. Resin material supply section> Next, the resin material supply section 8 will be described. FIG. 6 is a cross-sectional view schematically showing the resin material supply section. The resin material supply section 8 is configured to supply a resin material P of a preset weight to the recess 71 of the frame-shaped member 72, and has a storage section 11, a conveying path 12, a vibrating section 13, and a measuring section 16. The storage section 11 temporarily stores the granular resin material P and supplies the resin material P to the conveying path 12. The resin material supplied to the conveying path 12 is discharged from the discharge port 121 at the end of the conveying path 12 and supplied to the recess 71 of the frame-shaped member 72. At this time, the vibrating part 13 is configured to vibrate the conveying path 12, thereby conveying the resin material P to the discharge port side.

The weighing unit 16 is configured to measure the weight of the resin material P in the resin material supply unit 8. The first control unit 14 controls the vibration unit 13 based on the weighing result obtained by the weighing unit 16 so that the supply amount of the resin material P to the resin material storage unit 7 becomes a target value.

The resin material P dropped from the discharge port 121 of the resin material supply unit 8 is completely and completely spread in the concave portion 71 due to the relative movement of the moving table 6 with respect to the discharge port of the resin material supply unit 8 .

<1-3-5. Imaging section> FIG. 7 is a diagram for explaining the imaging state obtained by the imaging section. As shown in FIG. 7, the imaging section 300 is configured to capture the resin material P in the recess 71 supplied to the frame-shaped member 72 from above and generate image data. The imaging section 300 captures the resin material P in the recess 71 when the moving stage 6 is located below the imaging section 300, for example. The imaging section 300 is configured, for example, by a camera module including an image sensor such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor. When this photography is performed, light is irradiated from below the resin material P through the release film 73 by the light guide plate 62.

The HDD 200 is configured to store image data generated by the imaging unit 300. In addition, the HDD 200 may be replaced with other storage media such as a solid state drive.

The second control unit 150 includes a CPU, a RAM, a ROM, etc., and is configured to perform control of the imaging unit 300, etc. in accordance with information processing. Various controls performed by the first control unit 14 and the second control unit 150 will be described in detail below.

<1-3-6. Resin material conveying mechanism> As shown in FIG. 1, the resin material conveying mechanism 90 is configured to move in the arrow X direction and the arrow Y direction in the module B and the module C. As shown in FIG. 5 (b), the resin material conveying mechanism 90 causes the frame member 72 and the mold release film 73 containing the resin material P to leave the moving table 6. Furthermore, it is configured to convey these to the lower mold 51 of the module B so as to supply the resin material P to the cavity 51C of the lower mold 51.

<2. Suppressing Thickness Deviation of Resin Molded Products> Next, a method for suppressing the thickness of the resin molded products in the module C having the above configuration will be described.

In recent years, semiconductor packages (an example of resin molded products) have been thinning, and for example, products with a thickness of 0.38mm or 0.43mm are sought in the market. On the other hand, depending on the quality of the molding process, thickness deviation may occur within a single resin molded product. In thin resin molded products, a small thickness deviation will have a great impact on the quality of the resin molded product. The thickness deviation within a single resin molded product is the thickness deviation within the surface of a single resin molded product, and refers to the thickness deviation in multiple parts within the resin molded product, rather than the thickness deviation when comparing the thickness of multiple resin molded products.

For example, this problem becomes significant when the resin material P is not completely supplied to the recessed portion 71 of the frame member 72. That is, if the resin molding is performed in a state where the resin material P is insufficient in a part of the recessed portion 71, the thickness of the completed resin molded product will vary in each area.

FIG. 8 is a diagram showing an example of the recess 71 in a state where the resin material P is supplied. As shown in FIG. 8, the recess 71 includes a region T30 and a region T40. The resin material P is sufficiently supplied to the region T30, but the resin material P is insufficient in the region T40. In the region where the resin material P is insufficient, the bottom surface of the recess 71 is exposed. The color of the bottom surface of the recess 71 is closer to white than the resin material P.

In the resin molding apparatus 100, before the resin molding is performed, the imaging unit 300 captures the resin material P supplied to the frame member 72. The second control unit 150 analyzes the image data generated by the imaging unit 300 and controls the resin material supply unit 8 based on the analysis result. In the resin molding apparatus 100, the resin material supply unit 8 is controlled based on the analysis result of the supply state of the resin material P in the recess 71, so that the supply state of the resin material P in the recess 71 can be improved. As a result, according to the resin molding apparatus 100, it is possible to suppress the occurrence of a deviation in the thickness of the manufactured resin molded product within one resin molded product. The operation of the resin molding device 100 will be described in detail below.

<3. Example of operation of resin molding device> Figure 9 is a flowchart showing a part of the operation procedure in the resin molding device 100. The processing shown in this flowchart is implemented when the recess 71 of the frame member 72 is located below the discharge port 121 of the resin material supply unit 8. The processing shown in the flowchart on the left is implemented by the first control unit 14, and the processing shown in the flowchart on the right is implemented by the second control unit 150.

Referring to the left side of FIG. 9 , the first control unit 14 controls the resin material supply unit 8 to discharge the resin material P toward the recess 71 (step S100). The first control unit 14 determines whether the discharge of the resin material P is completed (step S110). When it is determined that the discharge of the resin material P is not completed (No in step S110), the first control unit 14 continues to perform the necessary processing in the discharge of the resin material P. For example, the first control unit 14 moves the moving table 6 so that the resin material P is supplied to the recess 71 without omission.

On the other hand, when it is determined that the discharging of the resin material P is completed (Yes in step S110), the first control unit 14 transmits a signal (imaging instruction signal) instructing the imaging unit 300 to perform imaging to the second control unit 150 (step S120).

9, the second control unit 150 determines whether the imaging instruction signal from the first control unit 14 is received (step S200). When it is determined that the imaging instruction signal has not been received (No in step S200), the second control unit 150 waits until the imaging instruction signal is received.

On the other hand, when it is determined that the imaging instruction signal is received (Yes in step S200), the second control unit 150 controls the imaging unit 300 to image the resin material P in the concave portion 71 from above and generate image data (step S210). The second control unit 150 controls the imaging unit 300 to store the image data generated by the imaging unit 300 in the HDD 200 (step S220). The second control unit 150 performs an analysis process of the image data (step S230).

Fig. 10 is a flowchart showing the procedure of the analysis process performed in step S230 of Fig. 9. Referring to Fig. 10, the second control unit 150 reads the image data stored in the HDD 200 (step S300). The second control unit 150 performs grayscale processing and binarization processing on the read image data (step S310).

In grayscale processing, each pixel of image data is classified into 256 levels [0 (dark) - 255 (bright)]. For example, "255" is assigned to white pixels and "0" is assigned to black pixels. In binary processing, each pixel of image data is classified as "white" or "black". For example, pixels whose values assigned by grayscale processing are above the threshold value X1 (for example, 200) are classified as "white", and pixels whose values assigned by grayscale processing are less than the threshold value X1 are classified as "black".

Fig. 11 is a diagram for explaining the region included in the image data representing the concave portion 71. As shown in Fig. 11, the image data includes regions T1-T18.

Referring again to FIG. 10, the second control unit 150 calculates numerical data corresponding to each region T1-T18 included in the image data (step S320). In the present embodiment, the numerical data is the number of pixels classified as "white" in each region. That is, the number of pixels classified as "white" in each region T1-T18 is calculated in step S320. The greater the number of pixels classified as "white", the wider the range of the surface of the concave portion 71 is exposed due to the resin material P not being supplied completely.

The second control unit 150 compares the numerical data calculated in step S320 with the valve value X2 (for example, 10) to determine whether a problem occurs in each area T1-T18 (step S330). The second control unit 150, for example, determines an area where the numerical data exceeds the valve value X2 as "NG" and determines an area where the numerical data is below the valve value X2 as "OK". That is, in step S330, it is determined whether there is a shortage of the resin material P in each area of the recess 71 corresponding to each area T1-T18 (whether the number of "white" is greater than the valve value X2). The second control unit 150 generates analytical data based on the comparison result in step S330 (step S340).

Fig. 12 is a diagram showing an example of analysis data. As shown in Fig. 12, analysis data D1 includes the result of OK/NG determination in each area of image data and the number of pixels classified as "white" in each area of image data.

Referring again to the right side of FIG. 9 , after the image analysis in step S230 is completed, the second control unit 150 transmits the analysis data D1 to the first control unit 14 (step S240 ).

9, the first control unit 14 determines whether the analysis data D1 is received from the second control unit 150 (step S130). If it is determined that the analysis data D1 has not been received (No in step S130), the first control unit 14 waits until the analysis data D1 is received.

On the other hand, when it is determined that the analysis data D1 is received (Yes in step S130), the first control unit 14 determines whether there is a problem with the state of the resin material P of the recessed portion 71 based on the analysis data D1 (step S140). For example, when any of the regions T1-T18 is determined to be "NG", the first control unit 14 determines that there is a problem (NG) with the state of the resin material P of the recessed portion 71; when none of the regions T1-T18 is determined to be "NG", the first control unit 14 determines that there is no problem (OK) with the state of the resin material P of the recessed portion 71.

If the state of the resin material P in the concave portion 71 is determined to be OK (OK in step S140), the first control unit 14 controls each component to transfer to the step of performing resin forming (step S150). That is, even when the resin material supply unit 8 is to be controlled next time, the first control unit 14 does not need to particularly change the operation state of the resin material supply unit 8 and maintains the operation state of the resin material supply unit 8.

On the other hand, if the state of the resin material P in the concave portion 71 is determined to be problematic (NG in step S140), the first control unit 14 performs processing for the case determined to be NG (step S160). That is, the first control unit 14 changes the control content when the resin material supply unit 8 is controlled next time and memorizes the changed content, and stops the resin molding device 100. For example, when the resin material supply unit 8 is controlled next time, the first control unit 14 controls the resin material supply unit 8 to eliminate the shortage of the resin material P in the area (T1-T18) where the resin material P is determined to be insufficient. More specifically, the first control unit 14 reduces the amount of the resin material P supplied to the region where there is no shortage of the resin material P, and increases the amount of the resin material P supplied to the region where there is a shortage of the resin material P. Thus, the resin material P is supplied to the recessed portion 71 without any shortage.

<4. Features> According to the resin molding device 100 of this embodiment, the following effects can be obtained.

In module C, the resin material P is irradiated with light from the bottom of the moving stage 6 as described above, and the resin material P is photographed from the top by the camera unit 300. Therefore, as shown in FIG. 13, for example, the light from the light guide plate 62 passes through the part where the resin material P is not densely layered and a gap is generated (a thin part that cannot be formed to a predetermined thickness), and this part can be photographed by the camera unit 300. FIG. 14 is an example of a photographed image, and the white part is the part where the light is transmitted (the thickness of the resin material P is approximately 1.0 mm). That is, it is considered that in this white part, the resin material P is not densely layered and a gap is generated inside.

In contrast, for example, when light is irradiated obliquely from above the moving stage 6 and an image is taken by the imaging unit 300, an image such as FIG. 15 is obtained. FIG. 14 and FIG. 15 are images of the same resin material P. In FIG. 15, the central portion (dashed line portion) of the resin material is seen as a dense layer, but in FIG. 14, a white portion is generated in this portion and a gap is formed inside. For example, even in a thinly overlapped portion of the granular resin material P, if light is irradiated obliquely from above, the resin material P is seen as a dense layer due to the shadow of the resin material P. Therefore, if the image is taken by irradiation from above, even if the resin material P is not densely layered, it may be mistaken for being densely layered. In contrast, by irradiating light from below the moving stage 6 as in the present embodiment, the part where the resin material P is not densely layered can be accurately detected, thereby preventing misidentification.

In addition, there is an advantage that if such light irradiation is performed from the lower side of the resin material P, not only inspection with a camera but also visual observation is easy.

<5. Variations> The above describes an embodiment of the present invention, but the present invention is not limited to the above embodiment, and various modifications can be made as long as they do not deviate from the outline. For example, the following modifications can be made. In addition, the gist of the following variations can be appropriately combined.

(1) The structure of the moving platform 6 is not particularly limited, and various forms are possible as long as it is possible to irradiate light from below the resin material P. For example, in the above-mentioned embodiment, the light is irradiated using the light guide plate 62, but as long as a light-transmitting material is arranged on the moving platform 6 and a light source (illumination unit) is arranged on the lower side thereof, it is also possible to irradiate light from below the resin material P. The type of light source in this case is not particularly limited, and in addition to LEDs, for example, organic EL (Electro-Luminescence), inorganic EL, etc. can also be used. In addition, the range of the arrangement of the light-transmitting material on the moving platform 6 can be appropriately changed corresponding to the size of the recess 71 of the frame-shaped component 72 or the shooting range.

Furthermore, the wavelength of light from the light source can be changed according to the type of resin material used. That is, the type of resin material absorbs light accordingly, so the wavelength of light can be selected in accordance with the type of resin material so that light can fully penetrate the loose parts in the resin material.

(2) In the above-mentioned embodiment, a granular resin material P is used, but the present invention can also be applied to a liquid resin such as a paste. Even in such a resin material, light can pass through the part where there is no dense layer, so the part can be identified.

(3) The resin molding section of the present invention corresponds to the module B shown in the above-mentioned embodiment, but the structure of the module B is an example and can be made into various forms. That is, as long as the resin material supplied to the moving table 6 can be used to perform resin molding, its structure is not particularly limited.

(4) In the above-mentioned embodiment, the imaging unit 300 performs imaging only after the discharge of the resin material P is completed. However, the timing for the imaging unit 300 to perform imaging is not limited to this. For example, the imaging unit 300 may be arranged near the discharge port of the resin material supply unit 8, and the imaging unit 300 may perform constant imaging to obtain an animation of the recess 71 while the resin material supply unit 8 is supplying the resin material P. At this time, the second control unit 150 may also determine whether there is a problem with the state of the resin material P in the recess 71 in real time based on the animation data in the imaging, and change the control content of the resin material supply unit 8 in real time.

(5) In the above-mentioned embodiment, the image analysis is performed by grayscale processing and binarization processing. However, the technology used in the image analysis is not limited to this. For example, the area where the resin material P is insufficient in the concave portion 71 can be detected based on the result of the concave-convex measurement of the 3D image of the concave portion 71, or the area where the resin material P is insufficient in the concave portion 71 can be detected using pattern matching, statistical techniques, or AI (Artificial Intelligence).

(6) In the above-described embodiment, if the state of the resin material P in the recess 71 is determined to be problematic (NG in step S140 of FIG. 9 ), the first control unit 14 reduces the amount of the resin material P supplied to the region where the resin material P is not insufficient, and increases the amount of the resin material P supplied to the region where the resin material P is insufficient, starting from the next time. However, the content of the control performed by the first control unit 14 starting from the next time is not limited to this. For example, the first control unit 14 may refer to the analysis data D1 and more significantly reduce the amount of the resin material P supplied to the region where the number of pixels classified as "white" is small, and more significantly increase the amount of the resin material P supplied to the region where the number of pixels classified as "white" is large.

(7) In the above-mentioned embodiment, the control of the resin molding device 100 is performed by the first control unit 14 and the second control unit 150. However, the control performed by the first control unit 14 and the second control unit 150 may be configured by a common control unit, or may be performed by one computer or three or more computers.

(8) In the above embodiment, the resin molding apparatus 100 includes the HDD 200. However, the resin molding apparatus 100 does not necessarily need to include the HDD 200. The HDD 200 may also be stored in the cloud server. In this case, the second control unit 150 accesses the cloud server via a communication unit (not shown).

1: Substrate supply unit 2: Substrate storage unit 3: Substrate placement unit 4: Substrate transport mechanism 5: Compression molding unit 6: Moving table (workbench) 7: Resin material storage unit 8: Resin material supply unit 9: Release film supply unit 11: Storage unit 12: Transport path 13: Vibration unit 16: Measuring unit 14: First control unit 51: Lower mold 51C: Chamber 52: Upper mold 53: Mold tightening mechanism 61: Recess 62: Light guide plate 63: LED module (lighting unit) 71: Recess 72: Frame member 73: Release film 90: Resin material transport mechanism 91: Drum 92: Rolling unit 93: Cutting unit 100: Resin forming device 121: Discharge port 150: Second control unit 200: HDD (hard disk drive) 300: Camera unit A: Substrate supply and storage module B: Resin forming module C: Resin material supply module P: Resin material T1-T18, T30, T40: Area W: Packaged substrate

FIG. 1 is a plan view schematically showing a resin molding device. FIG. 2 is a plan view of a moving stage. FIG. 3 is a cross-sectional view of the moving stage. FIG. 4 is a view for explaining the operation of a mold release film supply unit. FIG. 5 is a cross-sectional view for explaining a resin material storage unit. FIG. 6 is a cross-sectional view schematically showing a resin material supply unit. FIG. 7 is a view for explaining an image state obtained by an image pickup unit. FIG. 8 is a view showing an example of a concave portion in a state where a resin material is supplied. FIG. 9 is a flow chart showing a part of an operation procedure in a resin molding device. FIG. 10 is a flow chart showing a procedure for an analysis process performed in step S230 of FIG. 9. FIG. 11 is a view for explaining an area included in image data showing a concave portion. FIG. 12 is a diagram showing an example of analysis data. FIG. 13 is a cross-sectional view illustrating light irradiation on a resin material. FIG. 14 is a photograph of a resin material obtained by imaging in a resin molding device to which the present invention is applied. FIG. 15 is a photograph of a resin material obtained by imaging in a conventional resin molding device.

Domestic storage information (please note the order of storage institution, date, and number) None

Overseas storage information (please note the storage country, institution, date, and number in order) None

1: Substrate supply unit

2: Substrate storage section

3: Substrate mounting section

4: Substrate transport mechanism

5: Compression forming section

6: Mobile table (workbench)

7: Resin material storage area

8: Resin material supply department

14: First control unit

51: Lower mold

52: Upper mold

53: Mold fastening mechanism

53C: Chamber

71: Concave part

90: Resin material transport mechanism

100: Resin forming device

150: Second control unit

200:HDD(Hard Disk Drive)

300: Photography Department

A: Substrate supply and storage module

B: Resin forming module

C: Resin material supply module

P: Resin material

T: Region

W: Packaged substrate

Claims (6)

A resin molding device comprises: a workbench, at least a portion of which is light-transmissive; an illumination unit capable of illuminating from below the workbench; a mold release film supply unit capable of supplying a mold release film onto the workbench; a resin material supply unit capable of supplying a granular resin material onto the mold release film disposed on the workbench; a camera capable of photographing the resin material supplied to the workbench from above; and a resin material conveying mechanism capable of conveying the resin material to the workbench. The aforementioned mold release film leaves the aforementioned workbench, and the aforementioned mold release film carrying the aforementioned resin material is transported; and, a resin forming section, which uses the aforementioned resin material carried on the aforementioned mold release film transported by the aforementioned resin material transporting mechanism to perform resin molding; the aforementioned resin forming section, uses an upper mold and a lower mold to perform mold tightening; the aforementioned resin material transporting mechanism transports the aforementioned mold release film carrying the aforementioned resin material to the aforementioned lower mold to perform compression molding. The resin molding device as described in claim 1, wherein a light-transmitting light guide plate is provided in the aforementioned workbench; and the aforementioned lighting unit is configured to irradiate light from the side end surface of the aforementioned light guide plate. The resin molding device as described in claim 1 or 2 further comprises a control unit configured to analyze the image data generated by the imaging unit and control the resin material supply unit based on the analysis result. The resin molding device as described in claim 3, wherein the control unit is configured to perform grayscale processing and binarization processing on the image data, thereby analyzing the image data. A method for manufacturing a resin molded product comprises: supplying a mold release film to a workbench at least a portion of which is light-transmissive; supplying a granular resin material to the mold release film disposed on the workbench; photographing the supplied resin material from above while lighting the workbench from below; and placing the mold release film carrying the resin material on the workbench. The step of leaving the aforementioned workbench and conveying the aforementioned mold release film carrying the aforementioned resin material; and the step of performing resin molding using the aforementioned resin material carried on the conveyed aforementioned mold release film; in the aforementioned resin molding, the molds are tightened using the upper mold and the lower mold, and the aforementioned mold release film carrying the aforementioned resin material is conveyed to the aforementioned lower mold to perform compression molding. The method for manufacturing a resin molded product as described in claim 5 further comprises: analyzing the image data generated by the aforementioned photography, and controlling the supply of the aforementioned resin material based on the analysis result.