TWI853495B - Electronic package module and method for fabrication of the same - Google Patents

Abstract

An electronic package module and a method for fabrication of the same are provided. The method includes forming a carrier circuit board. After that, a part of the carrier circuit board is removed and then an opening connecting two opposite surfaces of the carrier circuit board is formed. An adhesive object overlapping with the opening is disposed on the carrier circuit board while a first electronic component is disposed on one surface of the carrier circuit board. A second electronic component is disposed on the adhesive object so that the second electronic component is through the opening. The second electronic component is electrically connected to the carrier circuit board and an encapsulation surrounding the first electronic component and the second electronic component is formed on the carrier circuit board. Therefore, the distance between the top sides of the first electronic component and the second electronic components is reduced, thereby reducing the thickness of the electronic package module.

Description

Electronic packaging module and manufacturing method thereof

The present invention relates to an electronic packaging module, in particular to a component embedded packaging module and a manufacturing method thereof.

Surface mount technology (SMT) is a process that places electronic components on the surface of a circuit substrate through solder on the surface of the circuit substrate. SMT allows the size of electronic components to be smaller, rather than limited by the minimum size of traditional solder pins, thereby greatly improving the lightness and thinness of electronic products. However, even though the size of electronic components has been reduced due to the development of SMT, there are still bottlenecks that are difficult to break through in actual applications.

The package module contains relatively small active elements and relatively large passive elements. When electronic components of different sizes are placed on the surface of the same circuit substrate, the height of the top of each component will be inconsistent. In order to allow the plastic encapsulation layer to cover the taller electronic components, the overall size (thickness) of the package module will be limited by the height of the larger electronic components and is not easy to shrink.

On the other hand, if the passive components and active components are separately placed on different planes, for example, the passive components are placed on the mainboard, and the active components are placed on the circuit substrate on the mainboard. In this case, in order to completely electromagnetically shield these electronic components, the electromagnetic shielding layer must not only cover the circuit substrate, but also cover part of the mainboard. This not only increases the volume of the package module, but also increases the difficulty of making the electromagnetic shielding layer.

Therefore, the present invention provides an electronic packaging module and a manufacturing method thereof, so as to reduce the thickness of the electronic packaging module.

The present invention provides a manufacturing method of an electronic packaging module, comprising forming a carrier circuit board, the carrier circuit board comprising a first surface and a second surface, wherein the first surface and the second surface are respectively located on two sides of the carrier circuit board; removing a portion of the carrier circuit board to form an opening, wherein the opening extends along the normal direction of the carrier circuit board and connects the first surface and the second surface; arranging a fixture on the carrier circuit board, wherein the fixture overlaps with the opening; arranging a first electronic component on the first surface of the carrier circuit board; arranging a second electronic component on the fixture, so that the second electronic component passes through the opening; electrically connecting the second electronic component to the carrier circuit board; and after electrically connecting the second electronic component and the carrier circuit board, forming a first sealing layer on the carrier circuit board, wherein the first sealing layer covers the first electronic component and the second electronic component.

The present invention also provides an electronic packaging module, comprising a supporting circuit board, the supporting circuit board comprising an opening, a first surface and a second surface opposite to the first surface, and the opening connects the first surface and the second surface of the supporting circuit board. The electronic packaging module also comprises a first electronic component and a second electronic component, the first electronic component is located on the first surface of the supporting circuit board, the second electronic component is located in the opening, and is electrically connected to the supporting circuit board. The electronic packaging module also comprises a first sealing layer, covering the first electronic component and the second electronic component, wherein the thickness of the first electronic component is less than the thickness of the second electronic component.

Based on the above, the present invention places thicker electronic components in the opening of the supporting circuit board and electrically connects to the supporting circuit board, while other thinner electronic components are placed on the surface of the supporting circuit board. In this way, the gap between the top surfaces of the two electronic components can be reduced, thereby reducing the thickness of the sealing layer and achieving the effect of thinning the electronic packaging module.

At least one embodiment of the present invention discloses a method for manufacturing an electronic package module, and at least one embodiment of the present invention is illustrated by a series of steps in FIG. 1A to FIG. 1G. Referring to FIG. 1A, first, a circuit substrate 100 is provided, and the circuit substrate 100 has a surface 100f and a surface 100s opposite to the surface 100f. Then, as shown in FIG. 1B, an electronic component 102 and an intermediate substrate 103 are arranged on the circuit substrate 100. The electronic component 102 and the intermediate substrate 103 are both located on the surface 100s, and in the drawings of the present embodiment, two electronic components 102 are drawn for illustration. However, the present invention is not limited thereto, and the number of electronic components 102 can be more than one, for example, one or three.

In some embodiments, the circuit substrate 100 may also include at least one layer of solder mask (not shown), which may cover the surface 100s of the circuit substrate 100 and expose a plurality of pads (not shown) on the surface 100s. The electronic component 102 is soldered to the circuit substrate 100 through these pads with a plurality of solder joints 104, so that the electronic component 102 is electrically connected to the circuit substrate 100. These solder joints 104 may be solder balls, copper pillars, or various connection structures suitable for electrical connection. In addition, in other embodiments, the electronic component 102 may be electrically connected to the circuit substrate 100 by wire-bonding. The electronic component 102 may be a packaged chip or an unpackaged die.

Please continue to refer to FIG. 1B . Similar to the way in which the electronic component 102 is connected to the circuit substrate 100 , the intermediate substrate 103 is also electrically connected to the circuit substrate 100 through a plurality of solder joints 104 exposed on the circuit substrate 100 . The intermediate substrate 103 includes a junction 103i , which faces away from the surface 100s of the circuit substrate 100 . In this embodiment, the number of the intermediate substrate 103 is one, and it includes an opening 103o , and the electronic component 102 is disposed in the opening 103o . In other embodiments of the present invention, the number of the intermediate substrate 103 is not limited to one, and each intermediate substrate 103 may include more than one (e.g., one) opening 103o .

Referring to FIG. 1C , after the electronic component 102 and the intermediate substrate 103 are arranged on the circuit substrate 100, a sealing layer 106 is formed on the surface 100s. The sealing layer 106 covers the electronic component 102 and the intermediate substrate 103, and has a surface 106s away from the circuit substrate 100. The material of this sealing layer 106 may include an insulating material such as an organic resin (such as epoxy resin) or the like. Thus, a supporting circuit board 10 including the circuit substrate 100, the electronic component 102, the intermediate substrate 103 and the sealing layer 106 is formed. As shown in FIG. 1C , the surface 100f and the surface 106s are respectively located on the two sides of the supporting circuit board 10. In other words, the supporting circuit board 10 includes the surface 100f and the surface 106s facing each other.

Referring to FIG. 1D , a portion of the carrier circuit board 10 may be removed by, for example, mechanical cutting, laser cutting, or ion beam cutting to form an opening 120. The opening 120 extends along the normal direction N1 of the carrier circuit board 10 and connects the surface 100f and the surface 106s. Specifically, a portion of the circuit substrate 100 and a portion of the sealing layer 106 are removed, and the removed two portions overlap each other in the normal direction N1 to form an opening 120 that completely penetrates the carrier circuit board 10.

As shown in the top view of the carrier circuit board 10 in FIG2 , in this embodiment, the number of openings 120 is one, and the boundary 120d where the opening 120 intersects with the surface 100f (and the surface 106s) can be surrounded by a rectangle. However, in the present invention, the number of openings 120 in the carrier circuit board 10 is not limited to one, and can be more than one, and the boundary 120d intersecting with the surface 100f (and the surface 106s) can be any shape, such as surrounded by a circle or a square. In addition, in other embodiments, the opening 120 can also be in the shape of an open strip.

Please refer to FIG. 1E . After the opening 120 is formed, a fixing 140 is disposed on the carrier circuit board 10 , and the fixing 140 overlaps the opening 120 . For example, in this embodiment, a tape (i.e., the fixing 140 in FIG. 1E ) is attached to the surface 106s of the carrier circuit board 10 , and the tape covers the opening 120 . In order to be attached to the surface 106s , the tape in this embodiment completely covers the opening 120 and exceeds the boundary 120d . It is worth mentioning that in other embodiments of the present invention, the fixing 140 is not limited to the tape, and can also be other devices with a fixing function.

Next, as shown in FIG. 1F , an electronic component 160a is disposed on the surface 100f of the supporting circuit board 10. In addition, the step of FIG. 1F further includes disposing an electronic component 160b on the fixing object 140 and passing the electronic component 160b through the opening 120. The electronic component 160b may directly contact the fixing object 140. For example, the electronic component 160b is attached to the tape (i.e., the fixing object 140 of FIG. 1E ) and is fixed by the tape.

In this embodiment, the thickness of the electronic component 160b is greater than the thickness of the supporting circuit board 10. Therefore, when the electronic component 160b is disposed on the fixture 140, the top of the electronic component 160b protrudes from the surface 100f. However, the present invention is not limited thereto, and the thickness of the electronic component 160b may also be less than or equal to the thickness of the supporting circuit board 10. It should be particularly noted that the number of the electronic components 160a and the electronic components 160b is not limited to the number shown in this embodiment (e.g., FIG. 1F ).

In some embodiments of the present invention, the electronic component 160a is smaller than the electronic component 160b. For example, the volume of an active component is usually smaller than the volume of a passive component. The electronic component 160a can be an active component such as a transistor, while the electronic component 160b can be a passive component such as an inductor or a capacitor. However, in other embodiments of the present invention, the types of the electronic components 160a and 160b are not limited thereto.

Please continue to refer to FIG. 1F. Similar to the way in which the electronic component 102 is connected to the circuit substrate 100, the electronic component 160a is also electrically connected to the circuit substrate 100 through multiple solder joints 104, through multiple pads (not shown) exposed on the circuit substrate 100, and these pads are located on the surface 100f of the circuit substrate 100. In other embodiments, the electronic component 160a can also be electrically connected to the circuit substrate 100 by wire-bonding.

On the other hand, the electronic component 160b is electrically connected to the carrier circuit board 10 by soldering. Specifically, in the present embodiment, the electronic component 160b and the pad 108 on the carrier circuit board 10 are connected by soldering material 170 by soldering (solder jetting), wherein the soldering material 170 may include solder such as copper paste, silver paste, etc. However, the method of connecting the electronic component 160b on the carrier circuit board 10 of the present invention is not limited to soldering, and other soldering methods may also be used.

After the electronic component 160b and the supporting circuit board 10 are electrically connected, a sealing layer 180 is formed on the surface 100f of the supporting circuit board 10. Referring to FIG. 1G , the sealing layer 180 covers the electronic component 160a and the electronic component 160b. In the present embodiment, the sealing layer 180 completely covers the electronic component 160a except for the connection between the electronic component 160a and the solder joint 104. However, in other embodiments of the present invention, other parts of the electronic component 160a, such as the upper surface of the electronic component 160a in FIG. 1F , may also be exposed outside the sealing layer 180.

On the other hand, since the bottom of the electronic component 160b directly contacts the fixture 140, the sealing layer 180 covers the other parts except the bottom of the electronic component 160b and the connection with the welding material 170. In other embodiments of the present invention, other parts of the electronic component 160b may also be exposed outside the sealing layer 180. The material of the sealing layer 180 may include an insulating material such as an organic resin (such as epoxy resin) or the like, and may be the same as the material of the sealing layer 106.

Referring to FIG. 3A , after the sealing layer 180 is formed, the fixing 140 (i.e., the tape in this embodiment) is removed. However, the present invention is not limited thereto, and the fixing 140 may not be removed, so that the fixing 140 remains on the surface 106s. Then, the circuit substrate 100, the sealing layer 106, the sealing layer 180, and the intermediate substrate 103 may be cut by, for example, mechanical cutting, laser cutting, or ion beam cutting to form the electronic package unit 30' as shown in FIG. 3A .

After the cutting step is completed, as shown in FIG3B , a conductive layer 190 is deposited on the sealing layer 180. In order to achieve the effect of electromagnetic shielding, the conductive layer 190 must cover the electronic component 160a and the electronic component 160b. Specifically, in this embodiment, the conductive layer 190 completely covers the sealing layer 180, and further completely covers the electronic component 160a and the electronic component 160b. In addition, the conductive layer 190 also completely covers the side wall 30w of the electronic package unit 30', so that the side surfaces of the electronic component 160a and the electronic component 160b can also be shielded. The material of the conductive layer 190 may include metal (such as copper, nickel or alloy), conductive paste or other materials, and may be deposited by spraying, sputtering, chemical plating or the like.

At this point, the present invention also discloses an electronic package module, and the structure of at least one embodiment thereof is shown in FIG. 3B . The electronic package module 30 of this embodiment includes a supporting circuit board 10, an electronic component 160a, an electronic component 160b, and a sealing layer 180. The supporting circuit board 10 includes a circuit substrate 100, an electronic component 102, an intermediate substrate 103, and a sealing layer 106, wherein the circuit substrate 100 has a surface 100f and a surface 100s opposite to the surface 100f, and the electronic component 102 and the intermediate substrate 103 are both located on the surface 100s of the circuit substrate 100. The sealing layer 106 is also located on the surface 100s of the circuit substrate 100 and covers the electronic component 102.

Continuing to refer to FIG. 3B , the carrier circuit board 10 further includes an opening 120, a surface 100f, and a surface 106s opposite to the surface 100f, and the opening 120 connects the surface 100f and the surface 106s of the carrier circuit board 10. The electronic component 160a is located on the surface 100f of the carrier circuit board 10, wherein the electronic component 160a, the electronic component 102, and the intermediate substrate 103 are all electrically connected to the circuit board 100 through the solder joint 104. On the other hand, the electronic component 160b is located in the opening 120 of the carrier circuit board 10, and is connected to the pad 108 on the circuit board 100 through the solder material 170 to electrically connect to the carrier circuit board 10.

Although in the embodiment shown in FIG. 3B , the electronic package module 30 includes the sealing layer 180 and the sealing layer 106, wherein the sealing layer 180 covers the electronic components 160a and the electronic components 160b, and the sealing layer 106 covers the electronic component 102. However, in practice, since the sealing layer 180 and the sealing layer 106 usually include the same material, the boundary between the two can be ignored and the two can be regarded as a sealing structure 320.

It should be particularly noted that in each embodiment of the present invention, the thickness T1 of the electronic component 160a is less than the thickness T2 of the electronic component 160b. In addition, when other embodiments of the present invention include the electronic component 102, the thickness T3 of the electronic component 102 is also less than the thickness T2 of the electronic component 160b. It is worth mentioning that the electronic package module 30 of another embodiment of the present invention further includes a fixing 140, which is located at one end of the opening 120 and overlaps the opening 120. The fixing 140 is connected to the electronic component 160b, and the fixing 140 can directly contact the electronic component 160b.

Please return to FIG. 3B , the electronic package module 30 further includes a conductive layer 190, which is located on the sealing layer 180 and completely covers the electronic components 160a and 160b. However, in other embodiments of the present invention, the electronic package module may not include the conductive layer. Therefore, the electronic package module 30 is not limited to include the conductive layer 190.

Please refer to FIG. 4 . In another embodiment of the present invention, the electronic package module 40 further includes a mainboard 401, and the mainboard 401 is electrically connected to the circuit board 10 through a plurality of solder joints 404. These solder joints 404 are similar to the solder joints 104 and can be solder balls, copper pillars, or various connection structures suitable for electrical connection. In more detail, the solder joints 404 are connected to the junctions 103i of the intermediate substrate 103, and the intermediate substrate 103 is electrically connected to the mainboard 401 through pads (not shown) exposed on the mainboard 401, wherein the junctions 103i of the intermediate substrate 103 face the mainboard 401. In addition, the electronic package module 40 in this embodiment may also include a fixing 140.

Although in the above-mentioned embodiment of FIG. 1A to FIG. 1C, the steps of forming the carrier circuit board 10 include setting the electronic components 102 and the intermediate substrate 103 on the circuit substrate 100, and also include forming the sealing layer 106 on the circuit substrate 100. However, in another embodiment of the present invention, these steps can be omitted. In other words, the carrier circuit board 10 can only include the circuit substrate 100, and the subsequent steps of FIG. 1D to FIG. 1G and FIG. 3A are directly performed on the circuit substrate 100. After these steps, the electronic package module 50 shown in FIG. 5 is formed.

The main difference between the electronic package module 50 and the electronic package module 30 is that the electronic package module 30 is a double side encapsulation module, while the electronic package module 50 is a single side encapsulation module. That is, in the electronic package module 30 of FIG. 3B , both sides (surface 100f and surface 100s) of the circuit substrate 100 are provided with electronic components (electronic component 160a and electronic component 102), while the electronic package module 50 of FIG. 5 only has the electronic component 160a on one side (surface 100f) of the circuit substrate 100. In addition, the electronic package module 50 may also include a conductive layer 190 as in the electronic package module 30 to electromagnetically shield the electronic components 160a and the electronic components 160b.

The electronic package module 50 may also include a main board 401 as shown in FIG4 . It should be particularly noted that, since the supporting circuit board 10 of this embodiment only includes the circuit substrate 100, the surfaces on the opposite sides of the supporting circuit board 10 in FIG1C are equivalent to the surfaces 100f and 100s on the opposite sides of the circuit substrate 100 in FIG5 . Therefore, the supporting circuit board 10 is electrically connected to the main board 401 through a plurality of solder joints 404, and these solder joints 404 are disposed on the surface 100s of the circuit substrate 100. In addition, the electronic package module 50 may also include a fixing 140, and the fixing 140 must be disposed on the surface 100s of the circuit substrate 100.

In summary, in the present invention, the electronic components located on the surface of the circuit substrate are thinner, while the electronic components located in the opening of the circuit board are thicker. With such a configuration, the top surface of the thicker electronic components will not protrude too much from the top surface of the thinner electronic components, and can even be flush with or lower than the top surface of the thinner electronic components. When the gap between the top surfaces of the electronic components is reduced, it is no longer necessary to increase the thickness of the sealing layer in order to cover the protruding electronic components. Accordingly, the thickness of the electronic packaging module can be reduced, thereby achieving the effect of making the electronic device lighter and thinner, and helping to save the material cost of the sealing layer.

Although the present invention has been disclosed as above by way of embodiments, they are not intended to limit the present invention. A person having ordinary knowledge in the technical field to which the present invention belongs may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the attached patent application.

10: Carrier circuit board 100: Circuit substrate 100f, 100s, 106s: Surface 102, 160a, 160b: Electronic components 103: Intermediate substrate 103i: Junction 103o, 120: Opening 104, 404: Solder joint 106, 180: Sealing layer 108: Pad 120d: Boundary 140: Fixing 170: Welding material 190: Conductive layer 30, 40, 50: Electronic packaging module 30w: Side wall 30’: Electronic packaging unit 320: Sealing structure 401: Mainboard N1: Normal direction T1, T2, T3: Thickness

Figures 1A to 1G are cross-sectional views of a method for manufacturing an electronic package module according to an embodiment of the present invention. Figure 2 is a top view of Figure 1D. Figures 3A to 3B are cross-sectional views of a method for manufacturing an electronic package module according to an embodiment of the present invention. Figure 4 is a cross-sectional view of an electronic package module according to another embodiment of the present invention. Figure 5 is a cross-sectional view of an electronic package module according to another embodiment of the present invention.

Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

10: Carrier circuit board 100: Circuit substrate 100f, 100s, 106s: Surface 102, 160a, 160b: Electronic components 103: Intermediate substrate 104: Solder joint 106, 180: Sealing layer 108: Pad 120: Opening 170: Welding material 190: Conductive layer 30: Electronic packaging module 30w: Sidewall 320: Sealing structure T1, T2, T3: Thickness

Claims (11)

A method for manufacturing an electronic packaging module, comprising: forming a carrier circuit board, comprising a first surface and a second surface, wherein the first surface and the second surface are respectively located on two sides of the carrier circuit board; removing a portion of the carrier circuit board to form an opening, wherein the opening extends along the normal direction of the carrier circuit board and connects the first surface and the second surface; setting a fixture on the carrier circuit board, wherein the fixture overlaps with the opening; setting a first electronic component on the first surface of the carrier circuit board; setting a second electronic component on the fixture, so that the second electronic component passes through the opening; electrically connecting the second electronic component to the carrier circuit board; and After electrically connecting the second electronic component and the supporting circuit board, a first sealing layer is formed on the supporting circuit board, wherein the first sealing layer covers the first electronic component and the second electronic component. As described in claim 1, the step of forming the carrier circuit board includes: Disposing a third electronic component on a circuit substrate, wherein the circuit substrate has the first surface and a third surface opposite to the first surface, and the third electronic component is located on the third surface; and Forming a second sealing layer on the third surface to cover the third electronic component, wherein the second sealing layer has the second surface. The method of claim 1, wherein the step of providing the fixing includes: Attaching a tape to the second surface, wherein the tape covers the opening. As described in claim 1, the step of electrically connecting the second electronic component to the carrier circuit board includes: Connecting a pad on the carrier circuit board and the second electronic component with a solder material by spraying solder. A method as described in claim 1, wherein the fixing material is removed after forming the first sealing layer. The method as described in claim 1 further comprises: Depositing a conductive layer on the first sealing layer, and the conductive layer covers the first electronic element and the second electronic element. An electronic packaging module comprises: A carrier circuit board comprising an opening, a first surface and a second surface opposite to the first surface, wherein the opening connects the first surface and the second surface of the carrier circuit board; A first electronic component located on the first surface of the carrier circuit board; A second electronic component located in the opening and electrically connected to the carrier circuit board; and A first sealing layer covering the first electronic component and the second electronic component; wherein the thickness of the first electronic component is less than the thickness of the second electronic component. The electronic packaging module as described in claim 7 further comprises: A fixing located at one end of the opening and overlapping the opening, wherein the fixing is connected to the second electronic component. The electronic package module as described in claim 7, wherein the carrier circuit board further comprises: a circuit substrate having the first surface and a third surface opposite to the first surface; a third electronic component located on the third surface of the circuit substrate; and a second sealing layer located on the third surface of the circuit substrate and covering the third electronic component. The electronic packaging module as described in claim 7 further comprises: A carrier board electrically connected to the supporting circuit board. The electronic packaging module as described in claim 7 further comprises: A conductive layer located on the first sealing layer and completely covering the first electronic component and the second electronic component.

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